CN114417626B - Method and device for detecting assemblability, method and medium for checking bill of materials - Google Patents
Method and device for detecting assemblability, method and medium for checking bill of materials Download PDFInfo
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Abstract
The application provides a detection method for detecting the assembly performance of components, which detects the assembly performance of the components based on a circuit board model and a component model in a simulation scene; the circuit board model comprises a soldering assistant layer with a plurality of soldering assistant surfaces, the component model comprises a contact layer with a plurality of contact surfaces, the plurality of soldering assistant surfaces correspond to the plurality of contact surfaces one by one, and the contact surfaces of the component model are arranged to the soldering assistant surfaces corresponding to the contact surfaces along the assembling direction; the detection method comprises the following steps: obtaining a matching result of the contact surface and the welding-assisted surface in an assembling direction; and generating an assembly result of the component model according to the matching result, wherein the assembly effect of the component model on the circuit board model is observed in advance by applying an analog simulation technology, so that the problems of design and assembly are found in advance, and the error rate of a finished product is reduced.
Description
Technical Field
The application relates to the field of detection, in particular to a detection method and device for detecting the assembly performance of components, a component bill of material inspection method and a storage medium.
Background
Circuit boards are a vital electronic component model in modern electronic products. With the gradual upgrade of the electronic industry, the circuit board has been rapidly developed towards the directions of high precision, high density, small volume and multiple layers, and in order to ensure the quality of electronic products, the circuit board is used for carrying out assemblability inspection on component models, so that the circuit board has important significance for production enterprises;
however, in the existing method, the circuit board and the component model are detected after being mounted, so that the risk that the component model and the circuit board have assembly defects cannot be avoided in advance, and the production efficiency is reduced.
Disclosure of Invention
In view of this, the present application provides a method and an apparatus for detecting the assemblability of components, a method for checking a bill of materials of components, and a storage medium, which apply an analog simulation technique to observe the assembly effect of a component model on a circuit board model in advance, find design and assembly problems in advance, and reduce the error rate of finished products.
According to one aspect of the application, the application provides a detection method for detecting the assembly performance of a component, wherein the assembly performance of a component model is detected based on a circuit board model in a simulation scene; the circuit board model comprises a soldering layer with a plurality of soldering surfaces, the component model comprises a contact layer with a plurality of contact surfaces, the soldering surfaces correspond to the contact surfaces one by one, and the contact surfaces of the component model are mounted to the soldering surfaces corresponding to the contact surfaces along the assembly direction; the detection method comprises the following steps: obtaining a matching result of the contact surface and the welding-assisted surface in the assembling direction; and generating an assembly result of the component model according to the matching result.
In a possible implementation manner, the obtaining a matching result of the contact surface and the welding-assistant surface in the assembling direction includes: creating a plurality of inspection lines around the contact surface, the plurality of inspection lines each being directed from the contact surface toward the weld aid surface in the assembly direction; and performing collision check on the detection lines and the welding assistant surfaces to generate a matching result of the contact surfaces and the welding assistant surfaces in the assembling direction.
In one possible implementation manner, the matching result includes a first matching result and a second matching result, the performing collision check on the plurality of detection lines and the soldering assistant surface to generate a matching result of the contact surface and the soldering assistant surface in the assembling direction includes: when any one of the detection lines does not collide with the welding assistant surface, generating a first matching result, wherein the first matching result is used for prompting that the contact surface is not matched with the welding assistant surface or the matching degree is low; and when the detection lines collide with the welding assistant surfaces, generating a second matching result, wherein the second matching result is used for prompting that the contact surfaces are matched with the welding assistant surfaces or the matching degree is high.
In one possible implementation, after performing the generating of the second matching result when each of the plurality of detection lines collides with the soldering assistant face, the performing of the collision check on the plurality of detection lines and the soldering assistant face to generate the matching result of the contact face and the soldering assistant face in the assembling direction further includes: and acquiring the welding stability between the contact surface and the welding-assistant surface according to the relation between the distance between the side line of the contact surface and the side line of the welding-assistant surface and a preset distance value, wherein the second matching result comprises the welding stability.
In one possible implementation manner, when the contact surface is a polygon, the detection lines respectively pass through vertices of the polygon.
In one possible implementation, the detection line is configured as a ray; said creating a plurality of detection lines around said contact surface, each of said plurality of detection lines directed from said contact surface toward said fluxing surface in said assembly direction, comprising: acquiring contact surface data of the contact surface, wherein the contact surface data comprises model parameters of the contact surface and position parameters of the contact surface in a scene coordinate system; generating starting point coordinates of the detection lines in the scene coordinate system according to the contact surface data and a preset detection line starting point extraction algorithm; acquiring directional data of the detection lines; determining detection line data of the plurality of detection lines according to the starting point coordinates and the directivity data of the plurality of detection lines; and generating the plurality of detection lines in the simulated scene according to the detection line data.
In one possible implementation manner, the performing collision check on the detection lines and the welding assistant surfaces to generate matching results of the contact surfaces and the welding assistant surfaces in the assembling direction includes:
acquiring welding-assistant surface data of the welding-assistant surface, wherein the welding-assistant surface data comprises model parameters of the welding-assistant surface and position parameters of the welding-assistant surface in the scene coordinate system; and performing data collision inspection on the detection line data and the welding assistant surface data, and determining the matching result of the contact surface and the welding assistant surface in the assembling direction according to the inspection result.
In one possible implementation, the acquiring the directional data of the detection lines includes: acquiring the directivity data of the plurality of detection lines according to the position parameters of the welding assistant surfaces and the position parameters of the contact surfaces so that the plurality of detection lines are parallel to the assembling direction.
In one possible implementation, the preset detection line starting point extraction algorithm is configured to extract a set of starting points of the detection line according to an edge line of the contact surface, where the set of starting points is used for representing the shape of the contact surface.
In a possible implementation manner, the acquiring the contact surface data of the contact surface includes: acquiring a contact layer model of the component model, and acquiring model parameters of the contact surface according to the contact layer model; acquiring the position parameters of the contact surface in the scene coordinate system according to the position parameters of the contact layer model in the scene coordinate system; acquiring contact surface data of the contact surface according to the model parameters of the contact surface and the position parameters of the contact surface in the scene coordinate system; the obtaining of the welding-assistant surface data of the welding-assistant surface comprises: acquiring a Gerber file, and analyzing the Gerber file according to a grammar rule of the Gerber file to obtain the circuit board model; obtaining the soldering layer model according to the circuit board model; according to the welding-assistant layer model, obtaining model parameters of the welding-assistant surface and position parameters of the welding-assistant surface in the scene coordinate system; and generating the welding-assistant surface data according to the model parameters of the welding-assistant surface and the position parameters of the welding-assistant surface in the scene coordinate system.
In a possible implementation manner, the matching result includes a first matching result and a second matching result, where the first matching result is used to prompt that the contact surface is not matched with the soldering assistant surface or the matching degree is low, and the second matching result is used to prompt that the contact surface is matched with the soldering assistant surface or the matching degree is high; the obtaining of the matching result of the contact surface and the soldering assistant surface in the assembling direction includes: traversing contact surface data of the contact surfaces of the component model, and generating a plurality of matching results according to the matching relationship between the contact surfaces and the soldering assistant surfaces corresponding to the contact surfaces; generating an assemblability result of the component model according to the matching result, wherein the generating the assemblability result comprises: generating the assembly matching degree of the component model relative to the circuit board model according to the proportion of the number of the first matching results or the second matching results in the plurality of matching results to the total number of the matching results; and generating the assemblability result according to the assembly matching degree.
In a possible implementation manner, the obtaining a matching result of the contact surface and the welding-assistant surface in the assembling direction includes: calculating the ratio of the projection of the contact surface on the welding-assistant surface along the assembling direction to the total area of the welding-assistant surface; and generating the matching result according to the relation between the ratio and a ratio preset value.
As a second aspect of the present application, the present application provides a detection apparatus for detecting assemblability of a component, the detection apparatus detecting assemblability of a model of the component based on a model of the circuit board in a simulation scene; the circuit board model comprises a soldering assistant layer with a plurality of soldering assistant surfaces, the component model comprises a contact layer with a plurality of contact surfaces, the plurality of soldering assistant surfaces correspond to the plurality of contact surfaces one by one, and the contact surfaces of the component model are arranged to the soldering assistant surfaces corresponding to the contact surfaces along the assembling direction; the detection device includes: the acquisition unit is used for acquiring a matching result of the contact surface and the welding-assistant surface in the assembling direction; and the generating unit is used for generating an assembly result of the component model according to the matching result.
As a third aspect of the present application, the present application provides a method for checking a component bill of material, where the method checks assemblability of multiple component models in the component bill of material based on a circuit board model to generate a check result of the component bill of material; the circuit board model comprises a soldering assistant surface, and the component model comprises a contact surface; the inspection method includes: respectively extracting model parameters of the contact surfaces of the component models from a component model database according to the component bill of materials; analyzing the Gerber file to obtain model parameters of the welding-aid surface corresponding to the contact surface; obtaining a matching result of the contact surface and the welding-assistant surface in a simulation scene according to the model parameters of the contact surface and the model parameters of the welding-assistant surface; respectively generating assemblability results of the plurality of component models according to the matching results; and generating an inspection result of the component bill of materials according to the assemblability result of the plurality of component models.
As a fourth aspect of the present application, there is provided a computer-readable storage medium characterized in that the storage medium stores a computer program for executing the above-described detection method or the above-described inspection method.
The matching result of the contact surface and the soldering-assisting surface in the assembly direction in the simulation scene is obtained, the assembly performance result of the component model is generated according to the matching result, the detection of the assembly performance of the component is realized, the simulation technology is applied to the application, the assembly effect of the component model on the circuit board model is observed in advance, the problems of design and assembly are found in advance, and the error rate of finished products is reduced.
Drawings
FIG. 1 is a schematic diagram of a component model and a circuit board model;
FIG. 2 is a schematic diagram of a structure of a solder mask of the circuit board model shown in FIG. 1;
FIG. 3 is a schematic diagram of the present application illustrating a detection line for detecting a matching relationship between a contact surface of the component model shown in FIG. 1 or FIG. 2 and a fluxing surface of a circuit board model;
fig. 4 is a schematic flow chart illustrating a method for detecting the assemblability of components according to the present disclosure;
FIG. 5 is a schematic flowchart of step S111 in FIG. 4;
FIG. 6 is a schematic flowchart of step S121 in FIG. 4;
fig. 7 is a schematic flowchart illustrating a method for detecting the assemblability of components according to the present application;
fig. 8 is a schematic flowchart illustrating a method for detecting the assemblability of components according to the present disclosure;
fig. 9 is a schematic flow chart illustrating a method for detecting the assemblability of components according to the present disclosure;
fig. 10 is a block diagram illustrating a structure of a device for detecting the assembly of a component according to the present invention;
fig. 11 is a schematic flow chart illustrating a method for checking a component bill of material according to the present application;
fig. 12 is a schematic structural diagram of an electronic device provided in the present application.
Detailed Description
In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise. In the embodiment of the present application, all directional indicators (such as up, down, left, right, front, rear, top, bottom \8230;) are used only to explain the relative positional relationship between the components, the motion, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
According to a first aspect of the present application, a method for testing the assembly capability of a component model 200 is provided.
Specifically, fig. 4 is a schematic flow chart of a detection method for detecting the assemblability of the component model 200 according to one possible implementation manner of the present disclosure;
specifically, referring to fig. 1, fig. 2, and fig. 3, the detection method in this implementation is to detect the assemblability of the component 200 based on the circuit board model 100 and the component model 200 in a simulation scene, that is, by applying an analog simulation technique, the assembly effect of the component model 200 on the circuit board model 100 is observed in advance, so as to find the design and assembly problems in advance and reduce the error rate of the finished product.
Specifically, the circuit board model 100 includes a solder mask 101 having a plurality of solder mask surfaces 1011, the component model 200 includes a plurality of solder pins 201 and a plurality of contact surfaces 202 formed on bottom surfaces of the plurality of solder pins 201, the component model 200 further includes a contact layer (not shown) having a plurality of contact surfaces 202, the plurality of solder mask surfaces 1011 are in one-to-one correspondence with the plurality of contact surfaces 202, and the contact surfaces 202 of the component model 200 are mounted to the solder mask surfaces 1011 corresponding to the contact surfaces 202 in the mounting direction.
The detection method comprises the following steps:
step S1: obtaining a matching result of the contact surface 202 and the welding assisting surface 1011 in the assembling direction; and step S2: based on the matching result, the assemblability result of the component model 200 is generated.
In the present implementation, whether the component model 200 is adapted to the circuit board model 200 is determined by detecting whether the contact surface 202 matches the soldering assistant surface 1011 corresponding thereto in the assembly direction.
Alternatively, the matching result may be related information of whether to match; the matching result may also be related information of the matching degree, for example, the matching result is quantized or graded according to a preset rule.
In one possible implementation, step S1 includes the following steps:
step S11: creating a plurality of inspection lines 300 around the contact surface 202, the plurality of inspection lines 300 each projecting from the contact surface 202 in the assembly direction towards the fluxing surface 1011; and
step S12: the collision inspection of the detection lines 300 and the welding assistant surfaces 1011 is performed, and the matching result of the contact surfaces 202 and the welding assistant surfaces 1011 in the assembling direction is generated.
In this implementation, a plurality of detection lines 300 are created to detect whether the contact surface 202 matches the soldering assistant surface 1011 corresponding thereto in the assembly direction, which is relatively simple and helps to obtain the detection result quickly and accurately.
In one possible implementation, step S12 includes the following steps:
step S121: and acquiring the welding assistant surface data of the welding assistant surface 1011, wherein the welding assistant surface data comprises model parameters of the welding assistant surface 1011 and position parameters of the welding assistant surface 1011 in a scene coordinate system (X-Y-Z rectangular coordinate system).
In specific implementation, the circuit board model 100 is loaded to the scene coordinate system, and the plate surface of the circuit board model 100 is parallel to the X-O-Y plane; the coordinate systems referred to below are all the scene coordinate systems.
Step S122: and performing data collision inspection on the detection line data and the welding assistant surface data, and determining a matching result of the contact surface 202 and the welding assistant surface 1011 in the assembling direction according to an inspection result.
This implementation describes in detail the collision check process of the detection line 300 and the welding assistant surface 1011.
In a possible implementation manner, the matching result includes a first matching result and a second matching result, and the step S122 includes the following steps:
step S1221: when any detection line 300 in the multiple detection lines 300 does not collide with the welding assistant surface 1011, generating a first matching result, wherein the first matching result is used for prompting relevant information that the contact surface 202 is not matched with the welding assistant surface 1011 or the matching degree is low; and
step S1222: when the detection lines 300 all collide with the welding assisting surface 1011, a second matching result is generated, and the second matching result is used for prompting the relevant information that the contact surface 202 is matched with the welding assisting surface 1011 or the matching degree is high.
Specifically, the matching degree can be determined by calculating the ratio of the number of the detection lines 300 colliding with the welding assistant surface 1011 to the total number of the detection lines 300.
In one possible implementation, after step S1222 is executed, step S122 further includes step S1223: and acquiring the welding stability between the contact surface 202 and the soldering assistant surface 1011 according to the relation between the distance L between the side line 2021 of the contact surface 202 and the side line 10111 of the soldering assistant surface 1011 and a preset distance value (determined according to the requirements of an actual application scene), wherein the second matching result comprises the welding stability.
In an actual application scenario, if the distance L between the side line 2021 of the contact surface 202 and the side line 10111 of the soldering assistant surface 1011 is too small, a space may not be provided for solder, so that the soldering between the contact surface 202 and the soldering assistant surface 1011 is unstable; taking the contact surface 202 as a rectangle as an example, if the distances L between the four side lines 2021 of the contact surface 202 and the four side lines 10111 of the soldering assistant surface 1011 all meet the requirement, the component model 200 not only matches the circuit board model 100, but also has high soldering stability.
Therefore, in the detection method provided by this implementation manner, the welding stability between the contact surface 202 and the soldering assistant surface 1011 is determined by further detecting whether the distance L between the side line 2021 of the contact surface 202 and the side line 10111 of the soldering assistant surface 1011 is greater than, smaller than, or equal to a preset distance value, and the welding stability information is generated as one reference information in the matching result of the contact surface 202 and the soldering assistant surface 1011 in the assembling direction, which is helpful for improving the accuracy of the matching result.
Alternatively, theoretically, the greater the number of the detection lines 300, the more accurate the matching result detected from the plurality of detection lines 300; in an extreme case, an infinite number of detection lines 300 are radiated from the side line 2021 of the contact surface 202 to the soldering assistant surface 1011, that is, a detection line bundle (not shown) consisting of an infinite number of detection lines 300 passing through the side line 2021, and theoretically, the matching result measured in this case is the most accurate; the number of the detection lines 300 in this implementation is not particularly limited, and is determined by the user of the detection method according to the accuracy requirement of the actual field application.
Alternatively, when the contact surface 202 is a polygon (triangle, quadrangle, pentagon, etc.), the plurality of detection lines 300 pass through a plurality of vertices (a, B, C, D) of the polygon, respectively.
In one possible implementation, the detection line 300 is configured as a ray; step S11 includes the steps of:
step S111: acquiring contact surface data of the contact surface 202, wherein the contact surface data comprises model parameters of the contact surface 202 and position parameters of the contact surface 202 in a scene coordinate system (X-Y-Z rectangular coordinate system);
step S112: generating starting point coordinates of the detection lines 300 in a scene coordinate system according to the contact surface data and a preset detection line starting point extraction algorithm;
in specific implementation, the preset detection line extraction algorithm is configured to extract a plurality of points from the edge of the contact surface 202 as a starting point set of the plurality of detection lines 300, where the starting point set is used to represent the shape of the contact surface 202:
alternatively, when the contact surface 202 is configured as a rectangle or a quasi-rectangle, the starting points of the detection lines 300 are four vertices (a, B, C, D) of the contact surface 202; correspondingly, the preset detection line starting point extraction algorithm can be set as a bounding box algorithm, specifically, an AABB (Axis-aligned bounding box) bounding box; in specific implementation, the circuit board model is parallel to an X-O-Y plane, and four points on the X-O-Y plane of an AABB bounding box are taken as a starting point set;
alternatively, when the contact surface 202 is configured to be circular or quasi-circular, points are sequentially taken at a specific angle on the arc-shaped edge line of the contact surface 202 to serve as a starting point set of the plurality of detection lines 300.
Step S113: directivity data of the plurality of detection lines 300 is acquired.
Step S114: the detection line data of the plurality of detection lines 300 is determined according to the start point coordinates and the directivity data of the plurality of detection lines 300.
Step S115: from the detection line data, a plurality of detection lines 300 are generated in the simulated scene.
In this implementation, the detection line 300 is configured as a ray as an example, and a creation process of the detection line 300 in a simulation scene is specifically described, and of course, in other implementations, the detection line 300 may be a straight line or a curve.
In one possible implementation, as shown in fig. 5, step S111 includes the following steps:
step S1111: obtaining a contact layer model of the component model 200, and obtaining model parameters of the contact surface 202 according to the contact layer model;
specifically, a component model and a contact layer model are obtained from a component model database.
Step S1112: acquiring the position parameters of the contact surface 202 in a scene coordinate system (X-Y-Z rectangular coordinate system) according to the position parameters of the contact layer model in the scene coordinate system (X-Y-Z rectangular coordinate system); and
step S1113: the contact surface data of the contact surface 202 is obtained based on the model parameters of the contact surface 202 and the position parameters of the contact surface 202 in the scene coordinate system (X-Y-Z rectangular coordinate system).
The above steps S1111 to S1113 specifically describe the manner of acquiring the contact surface data. The manner in which the weld aid surface data is obtained is set forth below:
that is, as shown in fig. 6, step S121 includes the steps of:
step S1211: acquiring a Gerber file, and analyzing the Gerber file according to the grammar rule of the Gerber file to obtain a model of a circuit board model 100;
step S1212 obtains a solder mask model according to the model of the circuit board model 100;
step S1213, according to the welding assistant layer model, obtaining a model parameter of the welding assistant surface 1011 and a position parameter of the welding assistant surface 1011 in a scene coordinate system (X-Y-Z rectangular coordinate system); and
step S1214: and generating welding assistant surface data according to the model parameters of the welding assistant surface 1011 and the position parameters of the welding assistant surface 1011 in a scene coordinate system (X-Y-Z rectangular coordinate system).
In one possible implementation manner, the directional data of the detection lines 300 are acquired according to the position parameters of the welding assistant surfaces 1011 and the position parameters of the contact surfaces 202, that is, step S1131 is executed: the directivity data of the plurality of detection lines 300 is acquired based on the position parameters of the fluxing surfaces 1011 and the position parameters of the contact surfaces 202 so that the plurality of detection lines 300 are parallel to the assembling direction.
Specifically, referring to fig. 1 to 3, in a scene coordinate system (X-Y-Z rectangular coordinate system), the contact layer model and the welding assistant layer model are both parallel to an X-O-Y plane (horizontal plane), i.e. the assembly direction is parallel to a Z-axis direction (vertical direction); the position parameters of the contact layer model include an x value, a y value, a z value and a rotation angle value, wherein the x value and the y value are obtained according to a coordinate file, and the z value is obtained according to the z value of the outermost layer of the assembly surface of the circuit board model 100. It will be readily appreciated that the z-value of the contact surface 202 within the contact layer is equal to the z-value of the contact layer model.
Also, it is easily understood that the z value of the fluxing surface 1011 is equal to the z value of the fluxing layer model, and the z value of the fluxing layer model can be obtained from the model file corresponding to the fluxing layer model.
Optionally, directional data of the detection lines 300 are acquired according to the z value of the welding assistant surface 1011\ the welding assistant layer 101 and the z value of the contact surface 202\ the contact layer:
specifically, when the z value of the fluxing surface 1011\ of the fluxing layer 101 is greater than the z value of the contact surface 202\ of the contact layer, the directional data of the detection line 300 is configured as a vector { x:0, y.
Since the component model 200 includes a plurality of contact surfaces 202, each time whether one contact surface 202 matches the soldering assistant surface 1011 corresponding thereto is detected, one matching result is generated, so that at least one matching result is generated correspondingly for one component model 200, and how to obtain the assemblability result of the component model 200 according to the at least one matching result is provided.
In one possible implementation, as shown in fig. 7, step S1 includes step S011: acquiring contact surface data and sequence information of a plurality of contact surfaces 202 of the component model 200, and sequentially acquiring matching relations between the plurality of contact surfaces 202 and soldering assistant surfaces 1011 corresponding to the contact surfaces according to the sequence information to generate at least one matching result;
step S2 includes step S021: when the current matching result is that the contact surface 202 is not matched with the soldering assistant surface 1011 corresponding to the contact surface or the matching degree does not meet the requirement, stopping the detection of the assembly performance of the component model 200; and step S022: the assemblability result of the component model 200 is generated based on the current matching result.
In this implementation, if the first contact surface 202 detected in sequence does not match the corresponding soldering assistant surface 1011 or the matching degree is low and does not meet the requirement, the matching relationship between the subsequent contact surface 202 and the corresponding soldering assistant surface 1011 is not detected, and the assemblability result of the component model 200 is generated directly according to the matching result corresponding to the first contact surface 202.
The assemblability result in this implementation is related information that the assemblability is good or poor, and in other implementations, the assemblability result may also be related information of the assembly matching degree.
In another possible implementation manner, as shown in fig. 8, the matching result includes a first matching result and a second matching result, where the first matching result is used to indicate that the contact surface 202 is not matched with the soldering assistant surface 1011 or has a low matching degree, and the second matching result is used to indicate that the contact surface 202 is matched with the soldering assistant surface 1011 or has a high matching degree; step S1 includes step S0011: traversing the contact surface data of the contact surfaces 202 of the component model 200, and respectively judging whether the contact surfaces 202 match the soldering assistant surfaces 1011 corresponding to the contact surfaces to generate a plurality of matching results;
step S2 includes step S0021: generating the assembly matching degree of the component model 200 relative to the circuit board model 100 according to the proportion of the number of the first matching results or the second matching results in the plurality of matching results to the total number of the matching results; and step S0022: and generating an assembly result according to the assembly matching degree.
In other implementation manners, the assemblability result may also be related information that is good in assemblability or poor in assemblability.
In the above description related to obtaining the matching relationship between the contact surface 202 and the soldering assistant surface 1011 through the detection line 300, in other possible implementations, as shown in fig. 9, the matching result is generated by calculating the ratio of the projection of the contact surface 202 on the soldering assistant surface 1011 in the assembling direction to the total area of the soldering assistant surface 1011, that is, step S1 includes step S00011: calculating the ratio of the projection of the contact surface 202 on the welding assistant surface 1011 along the assembling direction to the total area of the welding assistant surface 1011; and step S00012: and generating a matching result according to the relation between the ratio and the ratio preset value.
According to a second aspect of the present application, as shown in fig. 10, there is provided a testing apparatus 10 for testing the assemblability of a component part model 200.
Specifically, the detection apparatus 10 provided in one possible implementation manner of the present application is used for detecting the assemblability of the component 200 based on the circuit board model 100 and the component model 200 in a simulation scene;
the circuit board model 100 comprises a soldering flux layer with a plurality of soldering flux surfaces 1011, the component model 200 comprises a contact layer with a plurality of contact surfaces 202, the plurality of soldering flux surfaces 1011 correspond to the plurality of contact surfaces 202 one by one, and the contact surfaces 202 of the component model 200 are mounted to the soldering flux surfaces 1011 corresponding to the contact surfaces 202 along the assembly direction;
specifically, the detection apparatus 10 includes an acquisition unit 11 and a generation unit 12. The obtaining unit 11 is used for obtaining a matching result of the contact surface 202 and the welding assisting surface 1011 in the assembling direction; the generating unit 12 is configured to generate an assemblability result of the component model 200 according to the matching result.
According to a third aspect of the present application, there is provided a method for inspecting a component bill of material, which inspects assemblability of a plurality of components 200 in the component bill of material based on a circuit board model 100 and a component model 200 to generate inspection results of the component bill of material;
specifically, referring to fig. 1 to 3, the circuit board model 100 includes a soldering assistant surface 1011, and the component model 200 includes a contact surface 202.
Specifically, fig. 11 shows an inspection method provided in one possible implementation manner of the present application, where the inspection method includes the following steps:
step B1: respectively extracting model parameters of the contact surfaces 202 of the multiple component models 200 from a component model database according to the component bill of materials;
and step B2: analyzing the Gerber file to obtain model parameters of the welding assisting surface 1011 corresponding to the contact surface 202;
and step B3: according to the model parameters of the contact surface 202 and the model parameters of the welding-assistant surface 1011, obtaining the matching result of the contact surface 202 and the welding-assistant surface 1011 in the simulation scene;
and step B4: respectively generating assemblability results of the plurality of component models 200 according to the matching results; and
and step B5: and generating a component bill of material inspection result according to the assemblability result of the plurality of component models.
In this implementation, the matching information between the contact surface 202 of the component model 200 and the soldering assistant surface 1011 of the circuit board model 100 is detected by using a simulation technology, so as to check whether the component bill of materials of the customer has errors.
An electronic device according to an embodiment of the application is described with reference to fig. 12. Fig. 12 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
As shown in fig. 12, the electronic device 600 includes one or more processors 601 and memory 602.
Processor 601 may be a Central Processing Unit (CPU) or other form of processing unit having data processing and/or information execution capabilities and may control other components in electronic device 600 to perform desired functions.
Memory 601 may include one or more computer program products that may include various forms of computer-readable storage media, such as volatile memory and/or nonvolatile memory. Volatile memory can include, for example, random Access Memory (RAM), and/or cache memory (cache), among others. The non-volatile memory may include, for example, read Only Memory (ROM), hard disk, flash memory, etc. One or more computer program information may be stored on the computer readable storage medium, and the processor 601 may execute the program information to implement the above detection method, the inspection method, or other desired functions of the various embodiments of the present application.
In one example, the electronic device 600 may further include: an input device 603 and an output device 604, which are interconnected by a bus system and/or other form of connection mechanism (not shown).
The input device 603 may include, for example, a keyboard, mouse, etc.
The output device 604 can output various information to the outside. The output means 604 may comprise, for example, a display, a communication network, a remote output device connected thereto, and the like.
Of course, for simplicity, only some of the components of the electronic device 600 relevant to the present application are shown in fig. 12, and components such as buses, input/output interfaces, and the like are omitted. In addition, electronic device 600 may include any other suitable components depending on the particular application.
In addition to the above-described methods and apparatuses, embodiments of the present application may also be a computer program product comprising computer program information which, when executed by a processor, causes the processor to perform the steps in the detection methods, the examination methods according to the various embodiments of the present application described in the present specification.
The computer program product may be used to write program code for performing the operations of embodiments of the present application in any combination of one or more programming languages, including an object oriented programming language such as Java, C + + or the like and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code may execute entirely on the user's computing device, partly on the user's device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device, or entirely on the remote computing device or server.
Furthermore, as a fourth aspect of the present application, embodiments of the present application may also be a computer-readable storage medium having stored thereon computer program information, which, when executed by a processor, causes the processor to execute the steps in the detection method, the inspection method according to various embodiments of the present application.
A computer-readable storage medium may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may include, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the foregoing. More specific examples (a non-exhaustive list) of the readable storage medium include: an electrical connection having one or more wires, a portable disk, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.
The block diagrams of devices, apparatuses, devices, systems referred to in this application are only used as illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".
It should also be noted that in the devices, apparatuses, and methods of the present application, each element or step can be decomposed and/or recombined. These decompositions and/or recombinations should be considered equivalents of the present application.
The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The above-mentioned embodiments are merely preferred embodiments of the present invention, which should not be construed as limiting the scope of the present invention, and any modifications, equivalents and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (13)
1. A detection method for detecting the assembly performance of a component is characterized in that the assembly performance of the component is detected based on a circuit board model and a component model in a simulation scene; the circuit board model comprises a soldering layer with a plurality of soldering surfaces, the component model comprises a contact layer with a plurality of contact surfaces, the soldering surfaces correspond to the contact surfaces one by one, and the contact surfaces of the component model are mounted to the soldering surfaces corresponding to the contact surfaces along the assembly direction; the detection method comprises the following steps:
acquiring a matching result of the contact surface and the soldering assistant surface in the assembling direction comprises:
creating a plurality of inspection lines around the contact surface, the plurality of inspection lines each being directed from the contact surface toward the weld aid surface in the assembly direction;
performing collision check on the detection lines and the welding-assistant surfaces to generate matching results of the contact surfaces and the welding-assistant surfaces in the assembling direction; wherein the matching result includes a first matching result and a second matching result, the performing collision inspection on the plurality of detection lines and the soldering assistant surface, and generating the matching result of the contact surface and the soldering assistant surface in the assembling direction includes:
when any one of the detection lines does not collide with the welding assistant surface, generating a first matching result, wherein the first matching result is used for prompting that the contact surface is not matched with the welding assistant surface or the matching degree is low; and
when the detection lines collide with the welding-assistant surfaces, generating a second matching result, wherein the second matching result is used for prompting that the contact surfaces are matched with the welding-assistant surfaces or the matching degree is high; and
and generating an assembly result of the component model according to the matching result.
2. The inspection method according to claim 1, wherein after performing the generating of the second matching result when each of the plurality of inspection lines collides with the soldering assistant face, the performing of the collision check of the plurality of inspection lines with the soldering assistant face, the generating of the matching result of the contact face with the soldering assistant face in the fitting direction, further comprises:
and acquiring the welding stability between the contact surface and the welding-assistant surface according to the relation between the distance between the sideline of the contact surface and the sideline of the welding-assistant surface and a preset distance value, wherein the second matching result comprises the welding stability.
3. The detection method according to claim 1, wherein when the contact surface is a polygon, the detection lines respectively pass through vertices of the polygon.
4. The inspection method of claim 1, wherein the inspection line is configured as a ray; the creating a plurality of inspection lines around the contact surface, the plurality of inspection lines each being directed from the contact surface toward the weld aid surface in the assembly direction, including:
acquiring contact surface data of the contact surface, wherein the contact surface data comprises model parameters of the contact surface and position parameters of the contact surface in a scene coordinate system;
generating starting point coordinates of the detection lines in the scene coordinate system according to the contact surface data and a preset detection line starting point extraction algorithm;
acquiring directional data of the detection lines;
determining detection line data of the plurality of detection lines according to the starting point coordinates and the directivity data of the plurality of detection lines; and
generating the plurality of detection lines in the simulation scene according to the detection line data.
5. The inspection method according to claim 4, wherein the performing of the collision inspection on the plurality of inspection lines and the soldering assistant surfaces to generate a matching result of the contact surfaces and the soldering assistant surfaces in the assembling direction includes:
acquiring welding-assistant surface data of the welding-assistant surface, wherein the welding-assistant surface data comprises model parameters of the welding-assistant surface and position parameters of the welding-assistant surface in the scene coordinate system; and
and performing data collision inspection on the detection line data and the welding assistant surface data, and determining the matching result of the contact surface and the welding assistant surface in the assembling direction according to the inspection result.
6. The detection method according to claim 5, wherein the obtaining of directionality data for the plurality of detection lines comprises:
acquiring the directivity data of the plurality of detection lines according to the position parameters of the soldering surfaces and the position parameters of the contact surfaces so that the plurality of detection lines are parallel to the assembling direction.
7. The detection method according to claim 4, wherein the preset detection line start extraction algorithm is configured to extract a set of start points of the detection line according to an edge of the contact surface, wherein the set of start points is used for representing the shape of the contact surface.
8. The inspection method of claim 5, wherein said obtaining contact surface data of the contact surface comprises:
acquiring a contact layer model of the component model, and acquiring model parameters of the contact surface according to the contact layer model;
acquiring the position parameters of the contact surface in the scene coordinate system according to the position parameters of the contact layer model in the scene coordinate system; and
acquiring contact surface data of the contact surface according to the model parameters of the contact surface and the position parameters of the contact surface in the scene coordinate system;
the obtaining of the welding-assistant surface data of the welding-assistant surface comprises:
acquiring a Gerber file, and analyzing the Gerber file according to a grammar rule of the Gerber file to obtain the circuit board model;
obtaining a welding-assistant layer model according to the circuit board model;
according to the welding-assistant layer model, obtaining model parameters of the welding-assistant surface and position parameters of the welding-assistant surface in the scene coordinate system; and
and generating the welding-assistant surface data according to the model parameters of the welding-assistant surface and the position parameters of the welding-assistant surface in the scene coordinate system.
9. The detection method according to claim 1, wherein the matching result comprises a first matching result and a second matching result, wherein the first matching result is used for prompting that the contact surface is not matched with or has a low matching degree with the soldering assistant surface, and the second matching result is used for prompting that the contact surface is matched with or has a high matching degree with the soldering assistant surface; the obtaining of the matching result of the contact surface and the soldering assistant surface in the assembling direction further includes:
traversing contact surface data of the contact surfaces of the component model, and generating a plurality of matching results according to the matching relationship between the contact surfaces and the soldering assistant surfaces corresponding to the contact surfaces;
generating an assemblability result of the component model according to the matching result, wherein the generating the assemblability result comprises:
generating the assembly matching degree of the component model relative to the circuit board model according to the proportion of the number of first matching results or second matching results in the matching results to the total number of the matching results; and
and generating the assemblability result according to the assembly matching degree.
10. The inspection method according to claim 1, wherein the obtaining of the matching result of the contact surface and the soldering-assist surface in the fitting direction further comprises:
calculating the ratio of the projection of the contact surface on the welding-assistant surface along the assembling direction to the total area of the welding-assistant surface; and
and generating the matching result according to the relation between the ratio and a ratio preset value.
11. A detection device for detecting the assembly performance of a component is characterized in that the assembly performance of a component model is detected based on a circuit board model in a simulation scene; the circuit board model comprises a soldering layer with a plurality of soldering surfaces, the component model comprises a contact layer with a plurality of contact surfaces, the soldering surfaces correspond to the contact surfaces one by one, and the contact surfaces of the component model are mounted to the soldering surfaces corresponding to the contact surfaces along the assembly direction; the detection device includes:
the obtaining unit is used for obtaining the matching result of the contact surface and the welding-assistant surface in the assembling direction and comprises the following steps:
creating a plurality of detection lines around the contact surface, the plurality of detection lines each being directed from the contact surface toward the fluxing surface in an assembly direction;
performing collision check on the detection lines and the welding-assistant surfaces to generate matching results of the contact surfaces and the welding-assistant surfaces in the assembling direction; wherein the matching result includes a first matching result and a second matching result, the performing collision inspection on the plurality of detection lines and the soldering assistant surface, and generating the matching result of the contact surface and the soldering assistant surface in the assembling direction includes:
when any one of the detection lines does not collide with the welding assistant surface, generating a first matching result, wherein the first matching result is used for prompting that the contact surface is not matched with the welding assistant surface or the matching degree is low; and
when the detection lines collide with the welding-assistant surfaces, generating a second matching result, wherein the second matching result is used for prompting that the contact surfaces are matched with the welding-assistant surfaces or the matching degree is high; and
and the generating unit is used for generating an assembly result of the component model according to the matching result.
12. The method for checking the component bill of material is characterized in that the assemblability of a plurality of components in the component bill of material is checked based on a circuit board model and a component model so as to generate a checking result of the component bill of material; the circuit board model comprises a soldering assistant surface, and the component model comprises a contact surface; the inspection method includes:
respectively extracting model parameters of contact surfaces of a plurality of component models from a component model database according to the component bill of materials;
analyzing the Gerber file to obtain model parameters of the welding-aid surface corresponding to the contact surface;
according to the model parameters of the contact surface and the model parameters of the welding-assistant surface, acquiring the matching result of the contact surface and the welding-assistant surface in a simulation scene comprises the following steps:
creating a plurality of inspection lines around the contact surface, the plurality of inspection lines each projecting from the contact surface in a mounting direction toward the weld aid surface;
performing collision check on the detection lines and the welding-assistant surfaces to generate matching results of the contact surfaces and the welding-assistant surfaces in the simulation scene; wherein the matching result comprises a first matching result and a second matching result, the performing collision check on the plurality of detection lines and the welding assistant surface, and the generating of the matching result of the contact surface and the welding assistant surface in the simulation scene comprises:
when any one of the detection lines does not collide with the welding assistant surface, generating a first matching result, wherein the first matching result is used for prompting that the contact surface is not matched with the welding assistant surface or the matching degree is low; and
when the detection lines collide with the welding assisting surface, generating a second matching result, wherein the second matching result is used for prompting that the contact surface is matched with the welding assisting surface or the matching degree is high;
respectively generating assemblability results of the plurality of component models according to the matching results; and
and generating an inspection result of the component bill of materials according to the assemblability result of the plurality of component models.
13. A computer-readable storage medium, characterized in that the storage medium stores a computer program for executing the method for detecting the assemblability of the component according to any one of claims 1 to 10, or for executing the method for checking the bill of materials of the component according to claim 12.
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| EP0942382A3 (en) * | 1998-03-10 | 2004-05-12 | Matsushita Electric Industrial Co., Ltd. | Design evaluating method and apparatus for assisting circuit-board assembly |
| CN100541502C (en) * | 2007-12-13 | 2009-09-16 | 来新泉 | A kind of PCB analogue system and its implementation with error detection function |
| CN102930114B (en) * | 2012-11-14 | 2015-12-16 | 常州奥施特信息科技有限公司 | Electronic product EDA designs the visible detection method of manufacturability |
| CN108362220A (en) * | 2018-01-19 | 2018-08-03 | 中国科学技术大学 | The method of measuring three-dimensional morphology and defects detection for printed wiring board |
| CN110132960B (en) * | 2018-02-09 | 2021-12-14 | 飞旭电子(苏州)有限公司 | Detection method of circuit board assembly |
| CN109241681B (en) * | 2018-10-30 | 2020-09-08 | 上海望友信息科技有限公司 | Reflow soldering simulation optimization method and system, computer storage medium and equipment |
| CN111428367B (en) * | 2020-03-25 | 2023-08-15 | 无锡先导智能装备股份有限公司 | Workpiece mounting position detection method, device, computer equipment and storage medium |
| CN111583216A (en) * | 2020-04-30 | 2020-08-25 | 深圳比特微电子科技有限公司 | Defect detection method for PCBA |
| CN113804704A (en) * | 2020-06-11 | 2021-12-17 | 广东美的白色家电技术创新中心有限公司 | Circuit board detection method, visual detection equipment and device with storage function |
| CN113627852B (en) * | 2021-08-16 | 2024-01-19 | 深圳市云采网络科技有限公司 | Method and system for generating bill of materials, storage medium and electronic equipment thereof |
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