CN113012154A - PCB pad size inspection method and device, computer equipment and storage medium - Google Patents
PCB pad size inspection method and device, computer equipment and storage medium Download PDFInfo
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- CN113012154A CN113012154A CN202110484011.1A CN202110484011A CN113012154A CN 113012154 A CN113012154 A CN 113012154A CN 202110484011 A CN202110484011 A CN 202110484011A CN 113012154 A CN113012154 A CN 113012154A
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- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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Abstract
The application relates to the technical field of electronic automation, and provides a PCB pad size inspection method and device, computer equipment and a storage medium. The method comprises the following steps: determining a PCB packaging diagram contained in the PCB to be detected; determining a bonding pad corresponding to each PCB packaging diagram; obtaining the size of each bonding pad, and judging whether the size of each bonding pad meets the preset size requirement; and when the size of the bonding pad does not meet the preset size requirement, recording the bonding pad information corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad information. The size of the PCB bonding pad can be automatically checked, and the related information of the bonding pad which does not accord with the size requirement is automatically recorded, so that the accuracy rate is high and the efficiency is high.
Description
Technical Field
The present application relates to the field of electronic automation technologies, and in particular, to a method and an apparatus for checking a size of a PCB pad, a computer device, and a storage medium.
Background
With the increasing complexity of PCB (Printed Circuit Board) design, more and more devices are Mounted on the PCB, the size of the devices is smaller, and the requirements for SMT (Surface mount Technology) processes are higher and higher. For chip packaging of the PCB, certain requirements are made on the size of a bonding pad, and if the size of the bonding pad is smaller than the required size, the device is subjected to cold joint, so that the reliability of the product is influenced.
In the prior art, each bonding pad needs to be manually selected to measure the size of the bonding pad, whether the size of the bonding pad meets the requirement is judged, when the bonding pad which does not meet the size requirement is checked, manual recording is needed, the workload is large, the efficiency is low, and missing detection and missing registration are easily caused by manual negligence.
Disclosure of Invention
In view of the above problems, embodiments of the present application are proposed to provide a PCB pad size inspection method, apparatus, computer device and storage medium that overcome or at least partially solve the above problems.
In order to solve the above problem, an embodiment of the present application discloses a method for inspecting a size of a PCB pad, the method including:
determining a PCB packaging diagram contained in the PCB to be detected;
determining a bonding pad corresponding to each PCB packaging diagram;
obtaining the size of each bonding pad, and judging whether the size of each bonding pad meets the requirement of a preset size;
and when the size of the bonding pad does not meet the preset size requirement, recording the information of the bonding pad corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad.
In one embodiment, the pad size includes a pad length and a pad width, and the obtaining the pad size of each pad includes:
acquiring a minimum abscissa and a maximum abscissa of the bonding pad;
determining the length of the bonding pad according to the minimum abscissa and the maximum abscissa;
acquiring a minimum vertical coordinate and a maximum vertical coordinate of the bonding pad;
and determining the width of the bonding pad according to the minimum ordinate and the maximum ordinate.
In one embodiment, the determining whether the pad size meets a preset size requirement includes:
for each bonding pad, respectively judging whether the length of the bonding pad is smaller than a preset length threshold value or not, and whether the width of the bonding pad is smaller than a preset width threshold value or not;
and if the length of the bonding pad is smaller than the preset length threshold value and the width of the bonding pad is smaller than the preset width threshold value, determining that the size of the bonding pad does not meet the preset size requirement.
In one embodiment, the recording information of the pad corresponding to the pad size and the PCB package diagram corresponding to the pad size includes:
and recording the pad identification of the pad corresponding to the pad size and the package identification of the PCB package drawing corresponding to the pad size to an inspection result report according to a preset specification.
In one embodiment, the method further comprises:
and displaying the inspection result report.
In one embodiment, the method further comprises:
saving the inspection result report;
receiving a display instruction; the display instruction comprises a target PCB identification;
acquiring a target inspection result report corresponding to the target PCB from a plurality of inspection result reports;
and displaying the target inspection result report.
In one embodiment, the method further comprises:
and responding to the setting operation aiming at the preset size, and determining a preset length threshold value and a preset width threshold value of the preset size.
The embodiment of the application provides a PCB pad size inspection device, the device includes:
the first determining module is used for determining a PCB packaging diagram contained in the PCB to be detected;
the second determining module is used for determining the bonding pads corresponding to the PCB packaging diagrams;
the acquisition and judgment module is used for acquiring the size of each bonding pad and judging whether the size of each bonding pad meets the requirement of a preset size;
and the information recording module is used for recording the information of the bonding pad corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad when the size of the bonding pad does not meet the preset size requirement.
In one embodiment, the pad size includes a pad length and a pad width, and the obtaining and determining module includes:
the abscissa acquisition module is used for acquiring the minimum abscissa and the maximum abscissa of the bonding pad;
a length determination module for determining the pad length according to the minimum abscissa and the maximum abscissa;
the vertical coordinate acquisition module is used for acquiring the minimum vertical coordinate and the maximum vertical coordinate of the bonding pad;
and the width determining module is used for determining the width of the bonding pad according to the minimum ordinate and the maximum ordinate.
In one embodiment, the obtaining determining module includes:
the size judging module is used for respectively judging whether the length of each bonding pad is smaller than a preset length threshold value or not and whether the width of each bonding pad is smaller than a preset width threshold value or not;
and the result determining module is used for determining that the size of the bonding pad does not meet the requirement of the preset size if the length of the bonding pad is smaller than the preset length threshold and the width of the bonding pad is smaller than the preset width threshold.
In one embodiment, the information recording module is specifically configured to:
and recording the pad identification of the pad corresponding to the pad size and the package identification of the PCB package drawing corresponding to the pad size to an inspection result report according to a preset specification.
In one embodiment, the apparatus further comprises:
and the display module is used for displaying the inspection result report.
In one embodiment, the apparatus further comprises:
the information storage module is used for storing the inspection result report;
the command receiving module is used for receiving a display instruction; the display instruction comprises a target PCB identification;
the target determination module is used for acquiring a target inspection result report corresponding to the target PCB from a plurality of inspection result reports;
and the target display module is used for displaying the target inspection result report.
In one embodiment, the apparatus further comprises:
a threshold determination module, configured to determine a preset length threshold and a preset width threshold of the preset size in response to a setting operation for the preset size.
The embodiment of the application provides computer equipment, which comprises a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to realize the steps of the PCB pad size inspection method provided by any embodiment of the application.
The embodiment of the application provides a computer-readable storage medium, on which a computer program is stored, and the computer program is executed by a processor to realize the steps of the PCB pad size inspection method provided by any embodiment of the application.
Compared with the background art, the embodiment of the application has the following advantages:
in the embodiment of the application, a PCB packaging diagram contained in a PCB to be detected is determined; determining a bonding pad corresponding to each PCB packaging diagram; obtaining the size of each bonding pad, and judging whether the size of each bonding pad meets the preset size requirement; and when the size of the bonding pad does not meet the preset size requirement, recording the bonding pad information corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad information. The size of the PCB bonding pad can be automatically checked, and the related information of the bonding pad which does not accord with the size requirement is automatically recorded, so that the accuracy rate is high and the efficiency is high.
Drawings
FIG. 1 is a flow chart illustrating steps of a PCB pad size inspection method according to one embodiment;
FIG. 2 is a diagram of a PCB package in one embodiment;
FIG. 3 is a flow chart illustrating steps of a PCB pad size inspection method according to one embodiment;
FIG. 4 is a diagram illustrating an inspection result report in one embodiment;
FIG. 5 is a block diagram showing the structure of a PCB pad size inspection apparatus according to an embodiment;
FIG. 6 is a diagram illustrating an internal structure of a computer device according to an embodiment.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
First, the terms are defined and explained:
PCB: printed Circuit Board, Printed Circuit Board; the electronic component is an important electronic component support and a carrier for electrically interconnecting electronic components.
PCB packaging diagram: the PCB-Package represents a graph of various parameters (such as length and width, size of a pad, pitch, etc.) of a component, and is used for calling when drawing the PCB.
Surface mounting: SMT, Surface mount Technology, a circuit assembly technique in which Surface mount components without leads or short leads are Mounted on the Surface of a PCB or other substrate and soldered or assembled by reflow or dip soldering.
A Paste layer: pasteur mask, welding-assistant layer, corresponding to the bonding pads of all the paster devices, and the factory is used for manufacturing steel mesh.
Steel mesh: the carrier is a steel plate which is manufactured according to Paste layer data, and tin leaks to a PCB bonding pad when tin Paste is brushed.
Script: the method is an extension of batch files and is a pure text saving program.
In one embodiment, as shown in fig. 1, a PCB pad size inspection method is provided. The method can be applied to the PCB design stage, and the size of the bonding pad in the PCB design drawing is checked so as to find out the bonding pad which does not meet the size requirement and the specific position of the bonding pad. Specifically, since the size of the pad is related to the open steel mesh and the SMT process, and the open steel mesh requires a Paste layer according to the pad, in the embodiment of the present application, checking the size of the PCB pad may be understood as checking the size of the Paste layer of the pad. The method can be executed by a PCB pad size checking device, the device can be realized in a software and/or hardware mode, and the device can be integrated in a PCB design device or a third-party electronic device.
In this embodiment, the method may specifically include the following steps:
And 102, determining the bonding pads corresponding to the PCB packaging diagrams.
The PCB to be detected refers to the PCB with the size of the bonding pad to be detected. The PCB comprises a plurality of PCB packaging drawings, and each PCB packaging drawing comprises a plurality of welding pads. As shown in fig. 2, which is a schematic diagram of a PCB package diagram in an embodiment of the present invention, it can be seen that the PCB package diagram corresponds to a package name U49, the PCB package diagram corresponds to 50 pads, each pad corresponds to one Pin of U49, and the pad names thereof are Pin1 to Pin 50.
It should be noted that, in the PCB design, multiple PCB package diagrams in the same PCB have unique corresponding package identifiers; and the bonding pads in the same PCB packaging diagram have unique corresponding bonding pad identification. However, the same pad identification may exist within different PCB package views. The package identifier can be a name or a serial number of the PCB package diagram, and can be a mark with a unique identification function; the pad identifier may be a name or serial number of the pad, and may be a mark capable of serving as a unique identifier in a corresponding PCB package diagram.
In the prior art, the method for manually checking the size of a pad is to determine the pad through the name of the pad, then check the size of the pad, judge whether the size of the pad meets the preset size requirement, and when the size of the pad does not meet the preset size requirement, the PCB packaging diagram corresponding to the pad cannot be positioned; the subsequent process of reprocessing the pads that do not meet the predetermined size requirement is extremely inconvenient.
In this embodiment, by determining a PCB package diagram included in a PCB to be inspected, and recording a package identifier of each PCB package diagram, for each PCB package diagram, a pad corresponding to the PCB package diagram, that is, a pad included in the PCB package diagram, is further determined, and a pad identifier of each pad is recorded, and meanwhile, a corresponding relationship between the pad identifier and the package identifier may be established, so that in a subsequent process of checking and judging the size of the pad, when it is judged that the size of the pad does not meet a preset size requirement, a PCB package diagram corresponding to a pad that does not meet the size requirement may be determined according to the corresponding relationship; and then can position to the concrete position of the pad fast when not meeting the pad that presets the dimensional requirement to reprocess subsequently, facilitate the subsequent processing, and raise the efficiency of the subsequent processing.
And 103, acquiring the size of each bonding pad, and judging whether the size of each bonding pad meets the preset size requirement.
In this embodiment, the pad sizes of the pads may be sequentially obtained in a traversal manner.
The process of obtaining the size of the pad may specifically include:
acquiring a minimum abscissa and a maximum abscissa of the bonding pad;
determining the length of the bonding pad according to the minimum abscissa and the maximum abscissa;
acquiring a minimum vertical coordinate and a maximum vertical coordinate of the bonding pad;
the pad width is determined from the minimum and maximum ordinates.
In the PCB design process, the PCB design drawing can be placed in a plane rectangular coordinate system, and the PCB design drawing is positioned in a first quadrant of the plane rectangular coordinate system for calculation convenience. And the pads are displayed on the PCB in a patterned manner. The size of the bonding pad comprises the length and the width of the bonding pad, and the minimum abscissa and the maximum abscissa of the bonding pad can be obtained according to a plane direct coordinate system and a bonding pad graph; the pad length of the pad may be determined by the difference between the maximum abscissa and the minimum abscissa. According to the rectangular plane coordinate system and the pad graph, the minimum vertical coordinate and the maximum vertical coordinate of the pad can be obtained; the pad width of the pad may be determined by the difference between the maximum ordinate and the minimum ordinate.
And after the size of each bonding pad is determined, further judging whether the size of each bonding pad meets the preset size requirement or not so as to mark the bonding pads which do not meet the preset size requirement subsequently.
Specifically, the preset size includes a preset length threshold and a preset width threshold. The embodiment is mainly directed to an application scenario that the size of the bonding pad is smaller than a preset size requirement, which may cause that less tin is applied to the bonding pad in the SMT tin applying process, so that the device is in a cold joint state. Therefore, the process of determining whether the size of the pad meets the preset size requirement includes:
judging whether the length of the bonding pad is smaller than a preset length threshold value or not and whether the width of the bonding pad is smaller than a preset width threshold value or not;
and if the length of the bonding pad is smaller than the preset length threshold value and the width of the bonding pad is smaller than the preset width threshold value, determining that the size of the bonding pad does not meet the preset size requirement.
It can be understood that, in the present embodiment, only when the pad length and the pad width of the pad are both smaller than the corresponding preset length threshold and preset width threshold, it is determined that the pad size of the pad does not meet the preset size requirement. In other words, when at least one of the pad length or the pad width of the pad is greater than the corresponding preset length threshold or preset width threshold, the pad size of the pad is determined to meet the preset size requirement.
Further, since the preset sizes corresponding to different scenes may be different, in this embodiment, before the step of determining whether the size of the pad meets the preset size requirement, the method may further include:
in response to a setting operation for a preset size, a preset length threshold and a preset width threshold for the preset size are determined.
In this embodiment, the user may set the preset length threshold and the preset width threshold of the preset size through the corresponding preset size setting interface according to the actual requirement.
It should be noted that, if the setting operation of the user for the preset size is not received, the previous preset size may be used as the preset size in the current PCB pad size inspection process, or the default preset size may be used as the preset size in the current PCB pad size inspection process. In an actual application scenario, the pad length and/or pad width of the pad are generally required to be greater than or equal to 0.2mm, so that the default preset size is 0.2mm in preset length threshold, and 0.2mm in preset width threshold.
It should be noted that, in other embodiments, for an application scenario where the size of the pad is larger than the preset size requirement, which causes excessive tin on the pad during the tin applying process by the SMT, so that an unnecessary connection is generated between adjacent devices, the above process of determining whether the size of the pad meets the preset size requirement may include:
judging whether the length of the bonding pad is smaller than a preset length threshold value or not and whether the width of the bonding pad is smaller than a preset width threshold value or not;
and if the length of the bonding pad is larger than the preset length threshold value and/or the width of the bonding pad is larger than the preset width threshold value, determining that the size of the bonding pad does not meet the preset size requirement.
And 104, recording the information of the bonding pad corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad when the size of the bonding pad does not meet the preset size requirement.
In this embodiment, it is necessary to record the pads that do not meet the preset size requirement, so as to perform a subsequent re-processing, such as a correction processing, on the pads that do not meet the preset size requirement. In order to facilitate subsequent searching and use, the pad information which does not meet the preset size requirement and the corresponding PCB packaging diagram information need to be recorded according to a certain specification. The pad information may be a pad identifier of the pad, and the PCB package diagram information may be a package identifier of the PCB package diagram; therefore, the process of recording the information of the pad and the information of the PCB package diagram corresponding to the pad may specifically be:
and recording the pad identification of the pad corresponding to the pad size and the package identification of the PCB package drawing corresponding to the pad size to an inspection result report according to a preset specification.
In practical application, the preset specification can be represented by an inspection result report template, and by obtaining the inspection result report template, after the bonding pad which does not meet the preset size requirement is determined, the bonding pad identifier of the bonding pad and the package identifier of the PCB package drawing corresponding to the bonding pad are filled in the corresponding position of the inspection result report template, so that an inspection result report is obtained. And for the bonding pads which are detected subsequently and do not meet the preset size requirement, only the bonding pad marks and the corresponding packaging marks of the PCB packaging diagram are filled in the obtained detection result report.
Generally, one PCB corresponds to one inspection result report, that is, one inspection result report records related information of pads which do not meet the preset size requirement in the corresponding PCB; or, one PCB package diagram corresponds to one inspection result report, that is, one inspection result report records the related information of the pads which do not meet the preset size requirement in the corresponding PCB package diagram.
Further, the method may further include:
and displaying the inspection result report.
In this embodiment, when an inspection result report is generated or new information about a pad that does not meet the preset size requirement is added to the inspection result report, the inspection result report is displayed on a corresponding display interface. Optionally, after the inspection result report is completely inspected on the corresponding PCB or all the pads in the PCB package diagram, the inspection result report is displayed on the corresponding display interface.
Further, the method may further include:
saving the report of the inspection result;
receiving a display instruction; the display instruction comprises a target PCB identification;
acquiring a target inspection result report corresponding to the target PCB from the plurality of inspection result reports;
and displaying a target inspection result report.
In this embodiment, the pad sizes of the PCBs and the pad sizes of the PCB package diagrams may be checked to obtain a plurality of inspection result reports, and the inspection result reports may be stored. When a user needs to check the pad size inspection result of a certain PCB or the pad inspection result of a certain PCB packaging diagram, a related display instruction can be sent, and when the display instruction is received, a target inspection result report can be determined according to a target PCB identifier in the display instruction or a target packaging identifier of the target PCB packaging diagram, and the target inspection result report is displayed on a display interface.
The method includes the steps that a PCB packaging diagram contained in a PCB to be detected is determined; determining a bonding pad corresponding to each PCB packaging diagram; obtaining the size of each bonding pad, and judging whether the size of each bonding pad meets the preset size requirement; and when the size of the bonding pad does not meet the preset size requirement, recording the bonding pad information corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad information. The size of the PCB bonding pad can be automatically checked, and the related information of the bonding pad which does not accord with the size requirement is automatically recorded, so that the accuracy rate is high and the efficiency is high.
For the convenience of understanding of those skilled in the art, the PCB pad size inspection method provided in the embodiments of the present application will be described in detail below with reference to specific examples.
The method for checking the size of the PCB bonding pad provided by the embodiment of the application can be written by adopting SKILL language, a script file is created and loaded in Electronic Design Automation (EDA) software, and meanwhile, a corresponding checking control is generated and loaded in an Allegro PCB Editor module toolbar of Cadence software, for example. When the method is used, a user can automatically load and operate the script file corresponding to the PCB pad size inspection method by triggering the inspection control, and the script file is operated to realize one-by-one inspection of PCB packaging diagrams in the PCB, and the inspection flow shown in the figure 3 is executed:
in step 309, the examination is finished and the examination result is output.
The PCB packaging diagrams in the PCB are inspected one by one, the welding pads in the PCB packaging diagrams are inspected one by one aiming at each PCB packaging diagram, and after the inspection of one PCB packaging diagram is finished, the next PCB packaging diagram is continuously inspected until the inspection of all the PCB packaging diagrams of the PCB is finished. After the inspection is completed, an inspection result report is output in a corresponding interface, where the inspection result report may be a log file, and as shown in fig. 4, the inspection result report includes a plurality of pads, and the location of a pad corresponding to one of the pads can be skipped by clicking related information of the pad, so as to modify the pad size of the pad. For example, clicking on the coordinates under Location x-y in FIG. 4 may jump to the corresponding pad Location.
It should be understood that, although the steps in the flowchart of fig. 1 are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a portion of the steps in fig. 1 may include multiple sub-steps or multiple stages that are not necessarily performed at the same time, but may be performed at different times, and the order of performance of the sub-steps or stages is not necessarily sequential, but may be performed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
In one embodiment, as shown in fig. 5, there is provided a PCB pad size inspection apparatus, which may specifically include the following modules:
a first determining module 501, configured to determine a PCB package diagram included in a PCB to be detected;
a second determining module 502, configured to determine pads corresponding to the PCB package diagrams;
an obtaining and judging module 503, configured to obtain a pad size of each pad, and judge whether the pad size meets a preset size requirement;
the information recording module 504 is configured to record information of a pad corresponding to the pad size and information of a PCB package diagram corresponding to the pad size when the pad size does not meet a preset size requirement.
In one embodiment, the pad size includes a pad length and a pad width, and the obtaining determination module 503 includes:
the abscissa acquisition module is used for acquiring the minimum abscissa and the maximum abscissa of the bonding pad;
the length determining module is used for determining the length of the bonding pad according to the minimum horizontal coordinate and the maximum horizontal coordinate;
the vertical coordinate acquisition module is used for acquiring the minimum vertical coordinate and the maximum vertical coordinate of the bonding pad;
and the width determining module is used for determining the width of the bonding pad according to the minimum ordinate and the maximum ordinate.
In one embodiment, the obtaining determination module 503 includes:
the size judging module is used for respectively judging whether the length of each bonding pad is smaller than a preset length threshold value and whether the width of each bonding pad is smaller than a preset width threshold value;
and the result determining module is used for determining that the size of the bonding pad does not meet the requirement of the preset size if the length of the bonding pad is less than the preset length threshold and the width of the bonding pad is less than the preset width threshold.
In one embodiment, the information recording module 504 is specifically configured to:
and recording the pad identification of the pad corresponding to the pad size and the package identification of the PCB package drawing corresponding to the pad size to an inspection result report according to a preset specification.
In one embodiment, the apparatus further comprises:
and the display module is used for displaying the inspection result report.
In one embodiment, the apparatus further comprises:
the information storage module is used for storing the inspection result report;
the command receiving module is used for receiving a display instruction; the display instruction comprises a target PCB identification;
the target determination module is used for acquiring a target inspection result report corresponding to the target PCB from the plurality of inspection result reports;
and the target display module is used for displaying the target inspection result report.
In one embodiment, the apparatus further comprises:
and the threshold value determining module is used for responding to the setting operation aiming at the preset size and determining the preset length threshold value and the preset width threshold value of the preset size.
For the specific definition of the PCB pad size inspection apparatus, reference may be made to the above definition of the PCB pad size inspection method, which is not described herein again. The modules in the PCB pad size inspection apparatus may be wholly or partially implemented by software, hardware, and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 6. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The communication interface of the computer device is used for carrying out wired or wireless communication with an external terminal, and the wireless communication can be realized through WIFI, an operator network, Near Field Communication (NFC) or other technologies. The computer program is executed by a processor to implement a PCB pad size inspection method. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
Those skilled in the art will appreciate that the architecture shown in fig. 6 is merely a block diagram of some of the structures associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, the PCB pad size inspection apparatus provided herein may be implemented in the form of a computer program that is executable on a computer device such as that shown in fig. 6. The memory of the computer device may store various program modules constituting the PCB pad size inspection apparatus, such as a first determination module 501, a second determination module 502, an acquisition judgment module 503, and an information recording module 504 shown in fig. 5. The computer program constituted by the respective program modules causes the processor to execute the steps in the PCB pad size inspection method of the various embodiments of the present application described in the present specification.
In one embodiment, there is provided a computer device comprising a memory storing a computer program and a processor, the computer device being connected to an auxiliary device, the processor implementing the following steps when executing the computer program:
determining a PCB packaging diagram contained in the PCB to be detected;
determining a bonding pad corresponding to each PCB packaging diagram;
obtaining the size of each bonding pad, and judging whether the size of each bonding pad meets the preset size requirement;
and when the size of the bonding pad does not meet the preset size requirement, recording the information of the bonding pad corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad.
In one embodiment, the pad size includes a pad length and a pad width, and obtaining the pad size of each pad includes:
acquiring a minimum abscissa and a maximum abscissa of the bonding pad;
determining the length of the bonding pad according to the minimum abscissa and the maximum abscissa;
acquiring a minimum vertical coordinate and a maximum vertical coordinate of the bonding pad;
the pad width is determined from the minimum and maximum ordinates.
In one embodiment, determining whether the pad size meets a predetermined size requirement includes:
for each bonding pad, respectively judging whether the length of the bonding pad is smaller than a preset length threshold value or not and whether the width of the bonding pad is smaller than a preset width threshold value or not;
and if the length of the bonding pad is smaller than the preset length threshold value and the width of the bonding pad is smaller than the preset width threshold value, determining that the size of the bonding pad does not meet the preset size requirement.
In one embodiment, recording information of a pad corresponding to the pad size and information of a PCB package diagram corresponding to the pad size includes:
and recording the pad identification of the pad corresponding to the pad size and the package identification of the PCB package drawing corresponding to the pad size to an inspection result report according to a preset specification.
In one embodiment, the method further comprises:
and displaying the inspection result report.
In one embodiment, the method further comprises:
saving the report of the inspection result;
receiving a display instruction; the display instruction comprises a target PCB identification;
acquiring a target inspection result report corresponding to the target PCB from the plurality of inspection result reports;
and displaying a target inspection result report.
In one embodiment, the method further comprises:
in response to a setting operation for a preset size, a preset length threshold and a preset width threshold for the preset size are determined.
In one embodiment, a computer-readable storage medium is provided, having a computer program stored thereon, the computer-readable storage medium being connected to an auxiliary device, the computer program, when executed by a processor, performing the steps of:
determining a PCB packaging diagram contained in the PCB to be detected;
determining a bonding pad corresponding to each PCB packaging diagram;
obtaining the size of each bonding pad, and judging whether the size of each bonding pad meets the preset size requirement;
and when the size of the bonding pad does not meet the preset size requirement, recording the information of the bonding pad corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad.
In one embodiment, the pad size includes a pad length and a pad width, and obtaining the pad size of each pad includes:
acquiring a minimum abscissa and a maximum abscissa of the bonding pad;
determining the length of the bonding pad according to the minimum abscissa and the maximum abscissa;
acquiring a minimum vertical coordinate and a maximum vertical coordinate of the bonding pad;
the pad width is determined from the minimum and maximum ordinates.
In one embodiment, determining whether the pad size meets a predetermined size requirement includes:
for each bonding pad, respectively judging whether the length of the bonding pad is smaller than a preset length threshold value or not and whether the width of the bonding pad is smaller than a preset width threshold value or not;
and if the length of the bonding pad is smaller than the preset length threshold value and the width of the bonding pad is smaller than the preset width threshold value, determining that the size of the bonding pad does not meet the preset size requirement.
In one embodiment, recording information of a pad corresponding to the pad size and information of a PCB package diagram corresponding to the pad size includes:
and recording the pad identification of the pad corresponding to the pad size and the package identification of the PCB package drawing corresponding to the pad size to an inspection result report according to a preset specification.
In one embodiment, the method further comprises:
and displaying the inspection result report.
In one embodiment, the method further comprises:
saving the report of the inspection result;
receiving a display instruction; the display instruction comprises a target PCB identification;
acquiring a target inspection result report corresponding to the target PCB from the plurality of inspection result reports;
and displaying a target inspection result report.
In one embodiment, the method further comprises:
in response to a setting operation for a preset size, a preset length threshold and a preset width threshold for the preset size are determined.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware related to instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the embodiments provided herein may include at least one of non-volatile and volatile memory. Non-volatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical storage, or the like. Volatile Memory can include Random Access Memory (RAM) or external cache Memory. By way of illustration and not limitation, RAM is available in many forms, such as Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), and the like.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A PCB pad size inspection method, the method comprising:
determining a PCB packaging diagram contained in the PCB to be detected;
determining a bonding pad corresponding to each PCB packaging diagram;
obtaining the size of each bonding pad, and judging whether the size of each bonding pad meets the requirement of a preset size;
and when the size of the bonding pad does not meet the preset size requirement, recording the information of the bonding pad corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad.
2. The PCB pad size inspection method of claim 1, wherein the pad size includes a pad length and a pad width, and the obtaining the pad size of each pad includes:
acquiring a minimum abscissa and a maximum abscissa of the bonding pad;
determining the length of the bonding pad according to the minimum abscissa and the maximum abscissa;
acquiring a minimum vertical coordinate and a maximum vertical coordinate of the bonding pad;
and determining the width of the bonding pad according to the minimum ordinate and the maximum ordinate.
3. The PCB pad size inspection method of claim 2, wherein the determining whether the pad size meets a preset size requirement comprises:
for each bonding pad, respectively judging whether the length of the bonding pad is smaller than a preset length threshold value or not, and whether the width of the bonding pad is smaller than a preset width threshold value or not;
and if the length of the bonding pad is smaller than the preset length threshold value and the width of the bonding pad is smaller than the preset width threshold value, determining that the size of the bonding pad does not meet the preset size requirement.
4. The PCB pad size inspection method of claim 3, wherein the recording of the information of the pad corresponding to the pad size and the information of the PCB package diagram corresponding thereto comprises:
and recording the pad identification of the pad corresponding to the pad size and the package identification of the PCB package drawing corresponding to the pad size to an inspection result report according to a preset specification.
5. The PCB pad size inspection method of claim 4, further comprising:
saving the inspection result report;
receiving a display instruction; the display instruction comprises a target PCB identification;
acquiring a target inspection result report corresponding to the target PCB from a plurality of inspection result reports;
and displaying the target inspection result report.
6. The PCB pad size inspection method of any of claims 1-5, wherein the method further comprises:
and responding to the setting operation aiming at the preset size, and determining a preset length threshold value and a preset width threshold value of the preset size.
7. A PCB pad size inspection apparatus, the apparatus comprising:
the first determining module is used for determining a PCB packaging diagram contained in the PCB to be detected;
the second determining module is used for determining the bonding pads corresponding to the PCB packaging diagrams;
the acquisition and judgment module is used for acquiring the size of each bonding pad and judging whether the size of each bonding pad meets the requirement of a preset size;
and the information recording module is used for recording the information of the bonding pad corresponding to the size of the bonding pad and the information of the PCB packaging diagram corresponding to the bonding pad when the size of the bonding pad does not meet the preset size requirement.
8. The PCB pad size inspection device of claim 7, further comprising:
a threshold determination module, configured to determine a preset length threshold and a preset width threshold of the preset size in response to a setting operation for the preset size.
9. A computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor when executing the computer program implements the steps of the PCB pad size inspection method of any of claims 1-6.
10. A computer readable storage medium having stored thereon a computer program, wherein the computer program, when executed by a processor, implements the steps of the PCB pad size inspection method of any of claims 1-6.
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| CN202110484011.1A CN113012154A (en) | 2021-04-30 | 2021-04-30 | PCB pad size inspection method and device, computer equipment and storage medium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113487567A (en) * | 2021-07-05 | 2021-10-08 | 广东奥普特科技股份有限公司 | Method and device for detecting dimensional accuracy, electronic device, and storage medium |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113487567A (en) * | 2021-07-05 | 2021-10-08 | 广东奥普特科技股份有限公司 | Method and device for detecting dimensional accuracy, electronic device, and storage medium |
| CN113487567B (en) * | 2021-07-05 | 2023-07-07 | 广东奥普特科技股份有限公司 | Method and device for detecting dimensional accuracy, electronic equipment and storage medium |
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