JP4735593B2 - Printing inspection apparatus and printing inspection method - Google Patents

Description

  The present invention relates to a printing inspection apparatus and a printing inspection method for inspecting the printing state of cream solder printed on a substrate.

  In mounting electronic components, cream solder is applied to the surface of the substrate prior to mounting the electronic components on the substrate. As a method for applying the cream solder, a screen printing method is widely used, and after the printing process, a printing inspection for inspecting the printing state of the cream solder is performed. In this print inspection, the substrate after screen printing is imaged by a camera, and the imaged result is subjected to image processing to determine whether or not the cream solder is correctly printed on the print site.

  By the way, there are various characteristics of electronic components mounted on the board, and the inspection accuracy varies depending on the electronic components mounted after printing in the solder printing process. In other words, it is necessary to inspect a printing part on which an electronic component requiring high printing reliability and high cost and having good printing accuracy is mounted by a method in which the printing accuracy is reliably guaranteed. On the other hand, it is necessary to complete the inspection in a short time as much as possible for a printed part on which an electronic component on which solder joining is easy and printing accuracy is not regarded as important is mounted. For this reason, it is desirable that a printing inspection apparatus that performs inspection can be inspected flexibly according to the characteristics of the electronic component mounted on the target substrate.

  However, electrodes for joining electronic parts are usually formed on the order of several thousand to several tens of thousands on one substrate. For this reason, if it is desired to select a flexible inspection form as described above, it is necessary to input inspection data and an inspection target range each time the board type is changed. In particular, since the proportion of high-mix, low-volume types in the production form of electronic equipment manufacturing sites has increased in recent years, it is necessary to perform such data processing operations frequently for a large number of products, which requires a lot of work. In short, productivity was hindered. As described above, it is difficult for the conventional print inspection apparatus to realize an optimum inspection form in which the balance between improvement of production efficiency and ensuring of printing accuracy is achieved.

  SUMMARY An advantage of some aspects of the invention is that it provides a print inspection apparatus and a print inspection method capable of realizing an optimal inspection form in which a balance between improvement in production efficiency and ensuring of printing accuracy is achieved.

The print inspection apparatus according to claim 1 is a print inspection apparatus that inspects a printed state of cream solder on a substrate after screen printing using a mask plate, and an imaging unit that images the substrate, and the imaging unit that uses the imaging unit. A printing determination unit configured to determine pass / fail of the print state based on an imaging result of the substrate and inspection data necessary for performing a print inspection; and a display unit configured to display the determination result, wherein the inspection data is the substrate Element shape / position data indicating the shape and position of the element solder print portion corresponding to the pattern holes provided on the mask plate and printed on the electrodes for joining the electronic components provided on the circuit forming surface of the group The data is classified into data groups by enclosing according to the grouping condition, and the grouping condition is a geometric range on the printed surface of the substrate or the grouping condition. It is determined based on either the attribute of the child part or the one corresponding to each of the electronic parts to one data group, and the print determination means prints using only the data group grouped as the inspection execution range. The state is determined, and the display means displays the determination result in association with the data group, and the grouping condition is selected by a group condition selection wizard on the operation screen of the display means. When the geometric range is selected as the grouping condition, an operation for setting a grouping frame that surrounds only the pattern holes to be grouped is performed by a pointing device, so that these pattern holes can be handled. Element shape / position data is data that is bundled based on the geometric range determined by the frame setting operation. Is a group, enclosed data groups is inspected executed.

The printing inspection method according to claim 2 is a printing inspection method for inspecting a printed state of cream solder on a substrate after screen printing using a mask plate, for joining electronic components provided on a circuit forming surface of the substrate. The unit shape / position data indicating the shape and position of the element solder print portion corresponding to the pattern hole provided in the mask plate and being formed by printing on the electrodes of the mask plate are grouped according to the grouping condition to be classified into a data group A printing determination step for determining pass / fail of the print state based on the created inspection data and an imaging result of the substrate by the imaging means, and a display step for displaying the determination result in association with the data group, the group The conversion condition includes one geometric range on the printed surface of the substrate, one attribute of the electronic component, or one electronic component. The print determination means determines the print state using only the data group grouped as the inspection execution range, and the grouping is determined based on any one corresponding to the data group. The condition is selected by a group condition selection wizard on the operation screen of the display means, and when the geometric range is selected as the grouping condition, only the pattern holes to be grouped by the pointing device are selected. by performing the operation of setting the grouping frame surrounding the element shape and position data corresponding to these pattern holes is the data group enclosed based on geometrical range determined by the frame setting manipulation , The grouped data group becomes the inspection execution target.

  According to the present invention, the inspection data generated by classifying the unit shape / position data indicating the shape and position of the unit printing portion printed on the electrode according to the grouping condition into the data group and the substrate by the imaging means It is possible to determine the printing state by comparing the imaging results, and display the determination result in association with the data group, thereby executing the inspection according to the importance or priority of the inspection set according to the board type. it can.

Next, embodiments of the present invention will be described with reference to the drawings. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the screen printing apparatus according to an embodiment of the present invention, and FIG. 3 is a screen printing apparatus according to an embodiment of the present invention. FIG. 4 is a plan view of the substrate printing surface of the screen printing apparatus according to the embodiment of the present invention, and FIG. 5 is a block diagram showing the configuration of the control system of the screen printing apparatus according to the embodiment of the present invention. FIG. 6 is a diagram showing the contents stored in the program storage unit and the data storage unit of the screen printing apparatus according to the embodiment of the present invention. FIG. 7 is an element of the element solder printing unit of the screen printing apparatus according to the embodiment of the present invention. FIG. 8 is an explanatory diagram of shape / position data, FIG. 8 is an explanatory diagram of mounting data and a mask opening pattern of the screen printing apparatus according to the embodiment of the present invention, and FIG. 9 is an inspection of the screen printing apparatus of the embodiment of the present invention. Threshold FIG. 10 is a flowchart of print inspection data creation processing according to an embodiment of the present invention. FIGS. 11, 12, 13, and 14 are diagrams of the print inspection apparatus according to the embodiment of the present invention. It is a figure which shows a display screen.

  First, the structure of the screen printing apparatus will be described with reference to FIG. 1, FIG. 2, and FIG. This screen printing apparatus is used not only in a printing mechanism that prints cream solder on a substrate on which electronic components are mounted, but also in a function as a printing inspection apparatus that determines the quality of a printing state, as will be described later, and in this printing inspection. This configuration also has a function as a print inspection data creation apparatus for creating print inspection data.

  1 and 2, the substrate positioning unit 1 includes a θ-axis table 4 stacked on a moving table including an X-axis table 2 and a Y-axis table 3, and a Z-axis table 5 disposed thereon. A substrate holding unit 7 is provided on the Z-axis table 5 to hold the substrate 6 sandwiched by the clamper 8 from below. The substrate 6 to be printed is carried into the substrate positioning unit 1 by the carry-in conveyor 14 shown in FIGS. By driving the substrate positioning unit 1, the substrate 6 moves in the XY directions and is positioned at a printing position and a substrate recognition position described later. The printed circuit board 6 is unloaded by the unloading conveyor 15.

  A screen mask 10 is disposed above the substrate positioning unit 1, and the screen mask 10 is configured by attaching a mask plate 12 to a holder 11. The substrate 6 is aligned with the mask plate 12 by the substrate positioning unit 1 and abuts from below. Within the solder printing range 6a on the circuit forming surface of the substrate 6, electrodes 6b, 6c, 6d and 6e for joining different types of electronic components P1, P2, P3 and P4 as shown in FIG. Is provided.

  On the screen mask 10, a squeegee head 13 is disposed so as to be able to reciprocate in the horizontal direction. With the substrate 6 in contact with the lower surface of the mask plate 12, the cream solder 9 is supplied onto the mask plate 12, and the squeegee 13a of the squeegee head 13 is brought into contact with the surface of the mask plate 12 to slide. Cream solder 9 is printed on the printing surface of the substrate 6 through the pattern holes 16 provided in the mask plate 12. As a result, as shown in FIG. 4B, element solder printing portions S1, S2, S3, and S4 are formed on the electrodes 6b, 6c, 6d, and 6e, respectively.

  Above the screen mask 10, a camera 20 that is an imaging means is provided. As shown in FIG. 3, the camera 20 is horizontally moved in the XY directions by the X-axis table 21 and the Y-axis table 22. The X-axis table 21 and the Y-axis table 22 are camera moving means for moving the camera 20. By moving the camera 20 with respect to the mask plate 12 by the camera moving means, the camera 20 images an arbitrary position of the mask plate 12.

  As shown in FIG. 2, the substrate positioning unit 1 can move the substrate 6 held in the Y direction from below the screen mask 10 by the Y-axis table 3 and move it to the substrate recognition position. By moving the camera 20 to the substrate 6 on the substrate positioning unit 1 in the state, an arbitrary position of the substrate 6 can be imaged by the camera 20.

  Next, the configuration of the control system of the screen printing apparatus will be described with reference to FIG. In FIG. 5, a calculation unit 25 is a CPU, and performs various calculations and processing described later by executing various programs stored in the program storage unit 26. In these calculations / processes, various data stored in the data storage unit 27 are used.

The operation / input unit 28 is input means such as a keyboard and a mouse, and inputs various control commands and data. The communication unit 29 exchanges data with other devices constituting the electronic component mounting line together with the screen printing device. As will be described later, the image processing unit 30 performs image processing on image data captured by the camera 20 to recognize a solder printing unit for print inspection and to detect a mask opening for creating print inspection data.

  The mechanism control unit 31 controls camera moving means for moving the camera 20 and squeegee moving means for moving the squeegee head 13. The display unit 32 is a display device, and serves as a display unit that displays an image acquired by the camera 20 as well as an operation screen in a print inspection data creation process, which will be described later, and a determination result of the print inspection.

  Next, programs and data stored in the program storage unit 26 and the data storage unit 27 will be described with reference to FIG. The program storage unit 26 stores a printing operation program 26a, an image processing program 26b, a printing quality determination program 26c, a grouping processing program 26d, and an inspection threshold value applying processing program 26e.

  The printing operation program 26 a is a program for a printing operation that controls the operations of the substrate positioning unit 1 and the squeegee head 13 to print the cream solder 9 on the substrate 6. The image processing program 26b is a program for the image processing unit 30 to perform the following two types of processing based on the imaging result of the camera 20.

  First, by recognizing the imaging result obtained by imaging the substrate 6 after printing, the element solder printing portion (see FIG. 4B) formed on each electrode of the substrate 6 is detected. Calculate the area. Further, by performing recognition processing on the imaging result obtained by imaging the mask plate 12, processing for obtaining mask opening data indicating the position and shape of each pattern hole 16 provided in the mask plate 12 is performed. This mask opening data is used as inspection data for print inspection.

  The print quality determination program 26c compares the area of the element solder printing unit calculated by the image processing unit 30 with an inspection threshold (described later), thereby determining the quality of the print state for each element solder printing unit. That is, the function realized when the image processing unit 30 and the calculation unit 25 execute the print quality determination program 26c is based on the imaging result of the board and the inspection data necessary for execution of the print inspection. The print determination means for performing the above is configured.

  The grouping processing program 26d performs processing for grouping individual element position / shape data indicating the position and shape of each element solder printing portion according to a specific grouping condition in creating inspection data used for print inspection. It is a program to do. That is, the function realized by the arithmetic unit 25 executing the grouping processing program 26d is a grouping means for classifying element shape / position data according to grouping conditions into data groups and specifying each data group. It has become.

  The inspection threshold value assigning processing program 26e is a program for performing processing for assigning an inspection threshold value to a data group in which element position / shape data is grouped. The function realized by the calculation unit 25 executing the grouping processing program 26d is an inspection threshold value assigning means for assigning an inspection threshold value that is unique inspection data.

  The data storage unit 27 stores mounting data 27a, a component data library 27b, a mask opening data library 27c, an inspection threshold library 27d, and execution data 27e. Among these data, the mounting data 27a, the component data library 27b, the mask opening data library 27c, and the inspection threshold value library 27d are transferred and stored from other devices such as a data management computer via the communication unit 29. .

  The mounting data 27a is data used in a mounting operation for mounting an electronic component on a substrate after cream solder printing, that is, data in which the type of electronic component to be mounted is associated with mounting position coordinates on the substrate. The component data library 27b is data relating to individual electronic components mounted on the board. The component data library 27b includes component data of the electronic component, attribute data indicating required accuracy in mounting operation, difficulty in solder printing for solder bonding, and the like. It includes numerical data that numerically expresses the shape and size and the opening pattern for each component (see 33A, 33B, 33C, and 33D shown in FIG. 8) indicating the arrangement of the element solder printing portion during solder joining.

  By using the mounting data 27a and the component data library 27b, the individual pattern holes 16 of the mask plate 12 and the electronic components corresponding to the solder printing portions printed through these pattern holes can be associated on the data, which will be described later. As described above, in creating print inspection data, it is possible to link data of many types with each other to improve the efficiency of data creation processing.

  The mask opening data library 27c stores numerical data indicating the opening positions and sizes of the pattern holes 16 of the mask plate 12 used for printing for various types, and mask opening data associated with individual mask plates. As given in advance. That is, in the example of the mask plate 12 shown in FIG. 7, data on the patterns 16a to 16d is given. For example, for the pattern hole 16c, the dimensions a and b indicating the pattern hole size, and the pattern holes 16c with respect to the reference origin. , Y1, y2,... Are given in the form of numerical data. The same applies to the other pattern holes.

  As will be described later, this mask opening data is used as element position / shape data indicating the position / shape of the element solder printing portions (S1 to S4) shown in FIG. Therefore, the data storage unit 27 including the mask opening data library 27c serves as data providing means for providing element shape / position data indicating the shape and position of the element solder printing unit.

  As described above, since the data indicating the opening position and the opening size of the pattern hole can also be acquired by imaging the mask plate 12 with the camera 20, the required mask opening data is stored in the mask opening data library 27c. If it is not included, the same data as shown in FIG. 7 can be obtained using the actual mask plate 12. In this case, the camera 20 and the image processing unit 30 serve as data providing means for providing element shape / position data acquired based on the mask opening data detected from the mask plate 12 used for screen printing.

  Furthermore, as a method for obtaining the element shape / position data, a method of combining the data included in the mounting data 27a and the component data library 27b may be employed. That is, as shown in FIG. 8, mounting points M1, M2A, M2B, M3, and M4 indicating mounting positions of the electronic components P1, P2, P3, and P4 are obtained from the mounting data 27a. By superimposing the component-specific opening patterns 33A, 33B, 33C, and 33D of the library 27b, numerical data equivalent to the mask opening data can be obtained.

  The inspection threshold library 27d is a data library that provides data for calculating an inspection threshold used in the print inspection. In this embodiment, as shown in FIG. 9, two types of inspection threshold libraries are prepared: a library associated with the pattern hole opening type and a library associated with the electronic component type.

In the library associated with the opening type of the pattern hole, threshold value data for threshold calculation is set in advance for each prepared opening type. A plurality of types of pattern hole opening types are set depending on the combination of the pattern hole shape (square, rectangle, circle, etc.) and size classification. That is, by determining which opening type the target opening corresponds to, an inspection threshold value based on the solder printing area can be calculated.

  Further, in the library associated with the pattern hole opening type, the same threshold data can be directly obtained by specifying the type of electronic component (P1, P2,...). Therefore, it is not necessary to determine the type of the opening type. In any example, the threshold data includes the normal range ((−) OK to (+) OK), warning range ((−) Warning to (+) Warning), and failure of each element solder printing portion. The lower limit and the lower limit ((−) NG, (+) NG) are defined as a percentage of the area of the regular-shaped element solder printing portion.

  The execution data 27e is inspection data that is actually used in the post-printing inspection that is executed following the solder printing. As described later, the board type to be printed is specified, and the range to be inspected on the board. Is specified, inspection data corresponding to these inspection ranges is created and stored in the data storage unit 27 as execution data 27e.

  This screen printing apparatus is configured as described above. Next, print inspection data creation processing will be described with reference to the drawings along the flow of FIG. This data creation process is used in a print inspection apparatus that inspects the printed state of cream solder on a substrate after screen printing, and shows the shape and position of a solder printing portion formed by printing cream solder on the printing surface -It creates inspection data including at least position data.

  First, in FIG. 10, mask opening data is read (ST1). Thus, an opening pattern indicating the arrangement of the openings in the print range 12a is displayed on the operation screen 40 for data creation processing displayed on the display unit 32. These openings correspond to element shape / position data indicating the shape and position of the element solder printing portion formed on each electrode on the circuit forming surface.

  Here, as the mask opening data, when the mask opening data corresponding to the target mask plate 12 is stored in the mask opening data library 27c of the data storage unit 27, this library data is used. . If this library data is not yet available, processing for creating equivalent mask data from the mounting data 27a and the component data library 27b is performed. Further, if the mounting data 27a and the component data library 27b are not yet obtained, the opening is detected from the image data obtained by imaging the mask plate 12 as described above, and is used as element shape / position data. Data generation processing is performed.

  Next, the element shape / position data corresponding to each displayed pattern hole is grouped according to the grouping condition to be classified into a data group, and a grouping process for specifying each data group is performed (ST2). This grouping process ties individual element shape / position data into a data group by associating openings displayed on the operation screen 40 in accordance with a predetermined grouping condition. Done automatically.

  Here, the group condition selection wizard 41 displayed on the operation screen 40 shown in FIG. 12 selects any of the three grouping conditions, that is, the grouping conditions based on the component unit 42a, the attribute designation 42b, and the range designation 42c. Be able to. This selection is performed by a check frame 43 provided for each option.

  When the component unit 42a is selected, the grouping condition is determined so that each of the electronic components mounted on the board 6 is made into one group. That is, as shown in FIG. 13A, pattern holes 16a, 16b, 16c, respectively corresponding to electrodes (see FIG. 4) provided for soldering the four electronic components P1, P2, P3, and P4. 16d is surrounded by grouping frames 45a, 45b, 45c, and 45d, so that element shape / position data corresponding to individual pattern holes are grouped into individual electronic component units and classified into data groups. A data group is specified by each electronic component (P1, P2,...).

  When the attribute designation 42b is selected, the grouping condition is determined based on the attribute of the electronic component. In other words, among all the electronic components to be mounted, only the electronic components having the attribute specified by being input to the designated input frame 44 are targeted for grouping. For example, when the electronic component type “QFP” is designated as the attribute, only the pattern hole 16d corresponding to the electronic component P4 corresponding to the type is surrounded by the grouping frame 45d as shown in FIG. 13B. As a result, the element shape / position data corresponding to the pattern hole 16d is classified into a data group enclosed by the inputted attribute and other data groups, and the bundled data group is specified by the attribute “QFP”. Is done.

  When the range designation 42c is selected, the grouping condition is determined based on the geometric range on the printed surface of the substrate. In this case, as shown in FIG. 13C, on the operation screen, a grouping frame 45e that surrounds only pattern holes (here, pattern holes 16c and 16d) to be grouped by a pointing device such as a mouse. Perform the operation to set. As a result, the element shape / position data corresponding to these pattern holes are classified into a data group bundled based on the geometric range determined by the frame setting operation and a data group other than that, and bundled. The specified data group is specified by the characteristics of a specified range (for example, “same inspection threshold application range”, “print inspection target range”, etc.).

  When the grouping process is completed in this way, the inspection execution target is designated (ST3). Here, it is specified whether or not the data group classified by the grouping process is the target of the print inspection after the screen printing. In this embodiment, the range surrounded by the grouping frame by the grouping process is in principle an inspection execution target. That is, in the case of the attribute designation 42b and the range designation 42c, the grouped range becomes the inspection execution target as it is. The above-described print determination unit determines the print state using only the data group belonging to the range grouped as the inspection execution target.

  When the component unit 42a is selected, the pattern holes corresponding to all the electronic components are to be grouped. In this case, if it is determined that the print inspection is unnecessary for any of the electronic components, An operation for canceling the grouping is performed on the operation screen 40. Thereby, the process which excludes from the test object about the pattern hole by which grouping was cancelled | released is performed.

  In print inspection, it is not always necessary to inspect the entire surface of the board, and it is necessary to set the inspection execution range in detail each time in consideration of the required inspection time and the required inspection quality. By adopting this method, a simple and flexible setting operation method is realized in the present embodiment.

  Next, an inspection threshold value is assigned (ST4). That is, an inspection threshold value is assigned as specific inspection data to a data group designated as an inspection execution target, and an inspection threshold value is collectively assigned to a plurality of pattern holes belonging to each data group. Is done. As a result, even when a substrate having an enormous number of pattern holes is targeted, data processing for providing an inspection threshold value can be facilitated.

  The inspection data to which the inspection threshold is assigned for each data group is stored in the data storage unit 27 as execution data 27e. In the above flow, the grouping process (ST2), the designation of the inspection execution target (ST3), and the provision of the inspection threshold value (ST3) do not necessarily have to be performed in the order described above, and the individual data groups are not in any order. You may go on.

  Thereafter, the screen printing operation is started. First, the cream solder 9 is supplied onto the mask plate 12, and the substrate 6 is brought into contact with the lower surface of the mask plate 12. Next, the squeegee head 13 is moved to print the cream solder 9 on the electrodes 6b to 6d of the substrate 6 through the pattern holes 16a to 16c. Thereafter, the Z-axis table 5 is lowered to release the plate, whereby element solder printing portions S1 to S4 (see FIG. 4) are formed on the electrodes of the substrate 6.

  Thereafter, a print inspection is performed. In this print inspection, the board positioning unit 1 is moved again from below the screen mask 10 to the board recognition position (see FIG. 2), and the upper surface of the printed board 6 is imaged by the camera 20, and the element solder printing units S1 to S1 are picked up. This is done by detecting the area of S4. Then, the quality of the printing state is determined by comparing the area detection result with the inspection threshold obtained based on the inspection threshold library 27d (print determination process).

  Here, the final determination of the print state is determined in association with the data group grouped according to the grouping condition, and the display of the determination result is similarly performed for each data group in association with the data group. For example, when grouping is performed on a component basis, determination and display of the determination result are performed on a component basis. That is, if all the element solder printing portions corresponding to each electronic component are good, it is determined that the solder printing for the electronic component is good, and there is at least one element solder printing portion with a poor print state. The electronic component is determined to have a poor printing state.

  These determination results are displayed on the operation screen 40 (display process). FIG. 14 shows a display example of the determination result, and the determination result is displayed in association with the grouped data group. Here, the determination result is displayed using both the electronic component unit and the element solder printing unit unit. An example is shown. For example, as described above, no special display is made on the screen for an electronic component that is determined to have a good solder printing portion corresponding to one electronic component and that the solder printing for the electronic component is good. The defect display is performed on the element solder printing unit in which the printing state defect is detected and the electronic component corresponding to the element solder printing unit.

  In the example of FIG. 14, an example in which a defect is detected in the solder print portion printed corresponding to the electronic component P4 by the pattern hole 16d is shown. The location can be easily confirmed for each electronic component. In addition, the pattern hole 16d * corresponding to the element solder printing portion where the defect is detected is displayed in reverse video, and a display column 46 indicating the content of the defect is displayed corresponding to each pattern hole.

  As described above, in the print inspection shown in the present embodiment, the element shape / position data indicating the shape and position of the element solder printing portion formed by printing on the electrode is selected according to the target substrate. The print inspection data created by grouping according to the grouping condition to be used is used. As a result, data processing can be efficiently performed even when printing inspection data is created for a substrate having a huge number of electronic components.

Therefore, a flexible inspection mode according to the characteristics of the substrate and the electronic components mounted on the substrate is possible, and an optimal inspection mode that balances improvement in production efficiency and ensuring printing accuracy can be realized. In addition, since the determination result of the print inspection can be displayed in a desired category such as an electronic component unit or a component type unit, a defective portion can be easily identified and useful quality control data can be obtained.

  In this embodiment, the screen printing apparatus having a printing inspection function is used to perform inspection after printing. However, when a dedicated printing inspection apparatus is provided independently of the screen printing apparatus. Even if it exists, the structure shown in this Embodiment is applicable.

  The printing inspection apparatus and the printing inspection method of the present invention have an effect that it is possible to realize an optimal inspection form that balances improvement in production efficiency and ensuring printing accuracy, and is printed on a substrate in the field of electronic component mounting. It can be used for the purpose of inspecting the printed state of cream solder.

1 is a front view of a screen printing apparatus according to an embodiment of the present invention. The side view of the screen printing apparatus of one embodiment of this invention The top view of the screen printing apparatus of one embodiment of this invention The top view of the substrate printing surface by the screen printing apparatus of one embodiment of this invention The block diagram which shows the structure of the control system of the screen printing apparatus of one embodiment of this invention The figure which shows the memory content of the program storage part and data storage part of the screen printing apparatus of one embodiment of this invention Explanatory drawing of the element shape and position data of the element solder printing part of the screen printing apparatus of one embodiment of this invention Explanatory drawing of the mounting data and mask opening pattern of the screen printing apparatus of one embodiment of this invention Explanatory drawing of the inspection threshold value library of the screen printing apparatus of one embodiment of this invention Flow chart of print inspection data creation processing of one embodiment of the present invention The figure which shows the display screen of the printing inspection apparatus of one embodiment of this invention The figure which shows the display screen of the printing inspection apparatus of one embodiment of this invention The figure which shows the display screen of the printing inspection apparatus of one embodiment of this invention The figure which shows the display screen of the printing inspection apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate positioning part 6 Board | substrate 6b, 6c, 6d, 6e Electrode 9 Cream solder 12 Mask plate 13 Squeegee head 16, 16a, 16b, 16c, 16d Pattern hole 20 Camera 25 Calculation part 26 Program storage part 26b Image processing program 26c Print quality Judgment program 26d Grouping processing program 26e Inspection threshold value assigning program 27 Data storage unit 27c Mask aperture data library 27d Inspection threshold value library 30 Image processing unit

Claims (2)

A printing inspection apparatus for inspecting a printed state of cream solder on a substrate after screen printing using a mask plate, which is necessary for imaging an image of the substrate, an imaging result of the substrate by the imaging unit, and execution of a printing inspection An electronic component provided on a circuit forming surface of the substrate, the print determining unit performing a pass / fail determination of the print state based on the test data, and a display unit displaying the determination result. The element shape / position data indicating the shape and position of the element solder printing portion corresponding to the pattern hole provided on the mask plate and formed on the bonding electrode by printing is classified according to the grouping condition to be classified into a data group. Created
The grouping condition is determined based on any one of a geometric range on the printed surface of the substrate, an attribute of the electronic component, or one in which each electronic component is associated with one data group. The determination means determines the print state using only the data group grouped as the inspection execution range,
The display means displays a determination result in association with the data group,
The grouping condition is selected by a group condition selection wizard on the operation screen of the display means, and when the geometric range is selected as the grouping condition, it is a grouping target by a pointing device. By performing an operation to set a grouping frame that encloses only pattern holes, the element shape / position data corresponding to these pattern holes is a group of data bundled based on the geometric range determined by the frame setting operation. A print inspection apparatus characterized in that a bundled data group is an inspection execution target. A printing inspection method for inspecting a cream solder printing state of the substrate after screen printing using a mask plate, wherein together is formed by printing on the electrode of the electronic component bonding provided on the circuit forming surface of said substrate By inspection data and imaging means created by classifying unit shape / position data indicating the shape and position of the element solder printing portion corresponding to the pattern hole provided in the mask plate according to the grouping condition into a data group A printing determination step for determining pass / fail of the printing state based on an imaging result of the substrate, and a display step for displaying the determination result in association with the data group,
The grouping condition is determined based on any one of a geometric range on the printed surface of the substrate, an attribute of the electronic component, or one in which each electronic component is associated with one data group. The judging means judges the printing state using only the data group grouped as the inspection execution range,
Further, the grouping condition is selected by a group condition selection wizard on the operation screen of the display means, and when the geometric range is selected as the grouping condition, the grouping condition is selected by a pointing device. The element shape / position data corresponding to these pattern holes is data based on the geometric range determined by the frame setting operation. It is a group, the print inspection method enclosed data group is characterized by comprising a test executed.

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