JP2000200355A - Production of check program for cream solder print checking machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely prevent an artificial error from occurring on the check data which are previously recorded on a checking machine when a solder shape is checked by the checking machine and also to easily and quickly produce a check program. SOLUTION: A cream solder print checking machine A has a decision processing means 7 which measures the area value of outline shape and the center position of the cream solder from a color image of a cream solder print substrate and decides the quality of the cream solder based on these image measurement results. A substrate 1 having a completely normal print state is sent to the machine A and photographed to measure the area value and the center position of the cream solder. Then a genuine cream solder part of a cream solder candidate part is extracted and registered based on those measurement results of the cream solder and the information on the parts packaging positions and parts sizes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for preparing an inspection program for a cream solder printing inspection machine in the field of component mounting technology.

[0002]

2. Description of the Related Art Conventionally, in the field of component mounting technology such as a printed circuit board, an inspection machine is used to check whether or not various components connected and fixed on the printed circuit board are adhered and fixed by cream solder.

A conventional technique relating to this cream solder solder printing inspection machine will be described with reference to FIGS. 4 and 5. FIG.

FIG. 4 shows the structure of a cream solder print inspection machine A.

[0005] This cream solder printing inspection machine A comprises a base 2 into which a substrate 1 on which cream solder is printed is fed,
A color image processing means 5 as an irradiation means 3 for the substrate 1, a color line sensor camera 4, and a processing section for a captured image;
It comprises an image measuring means 6 and a judgment processing means 7.

[0006] The cream solder printing inspection machine A
When the substrate 1 on which the cream solder is printed is fed into the base 2 of the device, the illuminating means 3 irradiates the substrate 1 and the reflected light is received by the color line sensor camera 4 to capture a color image. From the color image thus obtained, only the color of the cream solder is extracted by the color image processing unit 5 to obtain a binarized image of the cream solder. The inspection result was obtained by measuring the area value and the center position of the solder paste, and determining whether the printing state of the cream solder was appropriate from the image measurement result by the determination processing means 7.

Conventionally, an inspection program for such a cream solder printing inspection apparatus has been created according to the procedure shown in FIG.

First, information on the solder shape of the object to be inspected in process 11 and the inspection determination conditions, for example, information such as the overall dimensions A and B of the soldered portion and the individual solder area S shown in dark colors in FIG. , Calculate and list from the design drawings etc.
Create a library of the information.

Next, in process 12, the actual component mounting position information with respect to the board is represented, for example, by distances X, Y and an angle θ from a reference point P on the board with reference to design drawings and the like. Then, a corresponding solder shape is assigned from the solder shape library collected and accumulated in the library, and a mounting position information library is created.

Finally, as a process 13, an inspection program is generated by separating the graphics for each component in the mounting position information library obtained in the above-mentioned process 12 into individual group shapes V1 to V4 according to the inspection purpose and distributing them for each inspection screen. In this case, the procedure of inspecting the quality of the cream solder was checked.

[0011]

However, in the conventional method, solder shape information is manually created, assigned to component mounting positions, and further developed into individual solder shapes to create an inspection program. There is a problem that it takes a long time to create an inspection program because it is created according to a specific procedure.

Furthermore, since the initial solder shape information is manually created, there is room for artificial error in the determination and input of the shape information, so that the final check requires a long time, and the error occurs. If it is found, it takes time to correct it, and this correction has the disadvantage that it may introduce human error.

SUMMARY OF THE INVENTION In view of the above problems, it is an object of the present invention to provide a method for inspecting a solder shape with an inspection machine, to surely prevent the inspection data from being artificially erroneous, and to easily and quickly create an inspection program. And

[0014]

According to the present invention, to solve the above-mentioned problems, a substrate having a normal printing state or a substrate equivalent thereto is sent to an inspection apparatus, and a surface image of the substrate is read. Inspection data was registered by analysis and storage.

Therefore, since the step of manually creating the solder shape information as in the prior art can be completely omitted, there is no room for input errors or the like.

[0016]

According to a first aspect of the present invention, there is provided an inspection program creating method for measuring an area value and a center position of a contour shape of the cream solder from a color image of a cream solder printed board,
A board whose printing state is all normal is sent to a cream solder print inspection machine having a judgment processing means for judging the suitability of the cream solder from the image measurement result, and the area value and the center position of the cream solder are determined by imaging. Measurement is performed, and then, the true cream solder portion of the cream solder candidate portion is extracted and registered from the measurement result, the component mounting position, and the component size information.

According to this method, in order to collect the inspection information on the actual product, the assignment of the solder shape information and the component mounting position, and the inspection items developed into the individual solder shapes included in one board can be performed once. Everything is possible with image collection,
Moreover, there is no room for confusion between the related information, and the solder shape information can be automatically and quickly generated.

According to a second aspect of the present invention, there is provided an inspection program creating method comprising:
In the above-described method for creating an inspection program of a cream solder printing inspection machine, after extracting the true cream solder portion of the cream solder candidate portion from the measurement result and the component mounting position and the component dimensional information, the extracted true cream solder portion is used for each component. , And register this.

According to this method, since the cream solder printing information can be appropriately derived from the registered information and used for the same component, the printing process and the inspection process for different substrates can be performed quickly.

According to a third aspect of the present invention, there is provided a method for preparing an inspection program for a cream solder printing inspection machine, wherein the substrate in the method for generating an inspection program for a cream solder printing inspection machine uses a printed circuit board having only solder lands.

According to the present invention, a printed circuit board on which solder printing has not been performed can be used as a substrate on which solder shape information is based, so that the implementation is further facilitated.

Next, a method of preparing an inspection program for a cream solder printing inspection machine as an embodiment of the present invention will be described with reference to the drawings. (Embodiment 1) FIG. 1 is a process block diagram of an inspection program creating method for a cream solder print inspection machine according to Embodiment 1 of the present invention.

A single printed circuit board having a normal printing state is formed on the basis of a design drawing or the like, and the printed circuit board 1 is sent to a base 2 of a printing inspection machine A as shown in FIG.

As shown in step 1-1 in FIG. 1, the printed circuit board 1 (see FIG. 5, the same applies hereinafter) illuminated by the illumination device 3 and the cream solder printed substrate The color image means 5 and the image measuring means 6 of the printing inspection machine A are used to measure all the area values and the center positions of the cream solder candidate portions of the printed circuit board from the captured color image. Then, the image information 8 is collected.

Next, in step 1-2, the group shapes V1 to V1 of the candidate portions of the individual cream solders according to the inspection purpose.
Inspection programs are generated for each of the inspection screens separated to V4.

Based on this information, the quality of the cream solder on the substrate to be newly inspected is determined.

Therefore, according to the above method, when an inspection program for a cream solder printing inspection machine is created, an actual conforming product is sent to the inspection device without having to create the inspection program in a stepwise manner as in the prior art. An inspection program is created simply by inputting the information, and since all information is collected from the actual product, there is no mistake and error input, and the inspection program can be created safely and reliably. (Embodiment 2) In the above-described Embodiment 1, a case is described in which an inspection program for a printed circuit board having a single pattern is created. However, when an inspection program for an printed circuit board having various patterns is created, the following is performed.

That is, in FIG. 2, step 2-1 is the same as step 1-1 of the first embodiment,
-2, the information 8 collected is applied to the existing information of the component mounting position and the component dimensional information, and the information 8 collected by this reference defines which solder portion of which component, and as a result, Information such as a preset range 9 of the same component, for example, mutual distances C and D, is grouped for each group.

By repeating this operation for all the mounted components, the cream solder portions are grouped for each component.

Next, in step 2-3, the above grouping is stored together with the widths A and B of the solder portions and the area S of each solder portion, and recorded as the solder shape library 5.

Next, in step 2-4, an inspection program is generated by separating the data into individual group shapes V1 to V4 according to the inspection purpose and distributing them to each inspection screen.

Based on this information, the quality of the cream solder on the substrate to be newly inspected is determined.

Therefore, according to the above-described method, even if there are various kinds of printed circuit boards, a plurality of inspection programs corresponding to the various kinds of actually applicable products are created only by sending them to the inspection apparatus. Since all information is collected from actual products, there is no mistake and error input, and an inspection program can be created safely and reliably. (Embodiment 3) The printed circuit boards 1 used in Embodiments 1 and 2 are all actually printed with cream solder. However, as shown in FIG. When the printing position and the area range of 1b are all the same, a printed circuit board on which cream solder is not printed may be used.

In this case, since the printing range of the cream solder matches the range of the land surface, the land surface 1a can be replaced with the printing range of the cream solder as it is.

[0035]

As described above, according to the method for creating an inspection program for a cream solder print inspection machine of the present invention, an inspection program can be created with almost no manual operation, and therefore, an input program and an information processing step can be performed. There is hardly any room for error, and an effect that an inspection program can be created reliably and quickly is obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a procedure for creating an inspection program according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an inspection program creation procedure according to a second embodiment of the present invention.

3A and 3B are explanatory diagrams of a printed circuit board having another configuration example, and FIG.
2 is a plan view, and FIG. 2B is a sectional view taken along line aa of FIG.

FIG. 4 is a diagram showing a configuration of a cream solder print inspection machine.

FIG. 5 is a diagram showing a conventional inspection program creation procedure.

[Explanation of symbols]

 A cream solder print inspection machine 1 printed circuit board 2 base of cream solder print inspection machine 3 lighting means 4 line sensor camera 5 color image processing means 6 image measurement means 7 judgment processing means

Continuation of front page (72) Inventor Masayuki Kajiyama 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term (reference) in Matsushita Electric Industrial Co., Ltd. DB02 DB06 DC04 DC06 DC39 5E319 BB05 CD29 CD51 GG15

Claims (3)

[Claims] 1. A cream solder having a judgment processing means for measuring an area value and a center position of a contour shape of the cream solder from a color image of a cream solder printed board, and judging whether or not the cream solder is appropriate based on the image measurement result. The board with all normal printing conditions is sent to the print inspection machine, and the area value and center position of the cream solder are measured by imaging,
Next, an inspection program creation method for a cream solder printing inspection machine, characterized in that a true cream solder portion of a cream solder candidate portion is extracted and registered from the measurement result, component mounting position, and component dimension information. 2. A method for creating an inspection program for a cream solder printing inspection machine according to claim 1, wherein a true cream solder portion of a cream solder candidate portion is extracted from a measurement result, component mounting position and component dimension information, and then the extracted true solder portion is extracted. A method for creating an inspection program for a cream solder printing inspection machine, wherein the cream solder parts are grouped into parts and registered. 3. A method for preparing an inspection program for a cream solder printing inspection machine according to claim 1, wherein the substrate is a printed circuit board having only a solder land portion.