JP2004058296A - Apparatus and method for simulation of printing inspection - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for simulation of printing inspections, which can properly estimate a required time for the printing inspections for being carried out in diverse inspection forms. <P>SOLUTION: In the simulation of the printing inspections for performing a simulation operation for estimating the required time for carrying out the printing inspections before the execution of the printing inspections for inspecting the printed state of a cream solder, element shape/position data, which represent the shape and position of an element printing part for being printed on an electrode for joining an electronic component, provided on a circuit forming surface of a substrate, are divided into respective imaging fields for the inspections; and inspection data with priorities, which are created by setting the priorities according to inspection priority conditions, are prestored. The simulation operation for cumulatively adding the required time in each of the imaging fields is performed according to the inspection data with the priorities and operating time data. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a printing inspection simulation apparatus and a simulation method for performing a simulation operation for estimating a required time before performing a printing inspection for inspecting a printing state of cream solder printed on a substrate.
[0002]
[Prior art]
In mounting an electronic component, cream solder is applied to the surface of the substrate before mounting the electronic component on the substrate. As a method of applying the cream solder, a screen printing method is widely used. After the printing process, a printing inspection for inspecting a printing state of the cream solder is performed. In this print inspection, the board after screen printing is imaged by a camera, and the imaged result is subjected to image processing to determine whether or not cream solder is correctly printed on a printed portion.
[0003]
By the way, the characteristics of the electronic components mounted on the substrate are various, and even in the above-described solder printing process, the inspection accuracy differs depending on the electronic components mounted after printing. In other words, it is necessary to perform an inspection on a printing portion on which electronic parts requiring high printing accuracy and high printing accuracy are required at high cost and high reliability, so that the printing accuracy is reliably guaranteed.
[0004]
On the other hand, it is necessary to complete the inspection in as short a time as possible with respect to a printed portion on which electronic components are mounted such that soldering is easy and printing accuracy is not so important. For this reason, in the print inspection, it is desirable that a flexible inspection form is possible according to the characteristics of the electronic component mounted on the target board and the inspection time allowed in the solder printing process.
[0005]
[Problems to be solved by the invention]
However, in the conventional solder printing, it is difficult to accurately predict the time required for the print inspection at the site where the printing operation is performed, and the range of the print inspection required to secure the printing accuracy is limited to the allowable inspection. I couldn't make a balanced decision in relation to time. If the estimated time is shorter than the actual required time, the print inspection may take more time than planned to reduce productivity, and conversely, if the predicted time is longer than the actual required time, The accuracy level was unnecessarily reduced by excluding the inspectable range from the inspection target.
[0006]
Therefore, an object of the present invention is to provide a print inspection simulation apparatus and a simulation method that can appropriately predict the required time of a print inspection performed in various inspection modes.
[0007]
[Means for Solving the Problems]
The print inspection simulation apparatus according to claim 1, wherein a simulation operation for estimating a required time for the execution of the print inspection is performed prior to the execution of the print inspection for inspecting the print state of the cream solder printed on the substrate. An apparatus, wherein element shape and position data indicating a shape and a position of an element solder printing portion printed on an electrode for electronic component bonding provided on a circuit forming surface of the substrate are grouped for each inspection imaging visual field and inspected. Test data storage means for storing test data with priorities created by prioritizing according to priority conditions, an operation time library for storing operation time data required for the simulation calculation, Calculating means for performing the simulation calculation based on the application data and the operation time data; And display means for displaying the Interview configuration operation result.
[0008]
The print inspection simulation apparatus according to claim 2 is the print inspection simulation apparatus according to claim 1, wherein the inspection priority condition is determined based on a specified geometric range on a print surface of the substrate. Is done.
[0009]
A print inspection simulation apparatus according to a third aspect is the print inspection simulation apparatus according to the first aspect, wherein the inspection priority condition is determined based on an attribute of the electronic component.
[0010]
A print inspection simulation device according to claim 4, wherein the simulation result is obtained by repeatedly executing the simulation operation in accordance with an inspection priority. Is compared with the inspection execution permissible time, thereby providing optimum inspection data creating means for creating optimal execution data in actual print inspection.
[0011]
6. The print inspection simulation method according to claim 5, wherein a simulation operation for estimating a required time for the execution of the print inspection is performed prior to the execution of the print inspection for inspecting the printing state of the cream solder printed on the substrate. A method, wherein element shape and position data indicating the shape and position of an element solder printed portion printed on an electrode for bonding electronic components provided on a circuit forming surface of the substrate are grouped for each inspection imaging visual field and inspected. An inspection data storing step of storing inspection data with priorities created by prioritizing according to the priority condition; and a simulation operation stored in the inspection data with priorities and the operation time library. And an operation step of performing the simulation operation based on the operation time data.
[0012]
A print inspection simulation method according to claim 6, wherein the inspection priority condition is determined based on a specified geometric range on a print surface of the substrate. Is done.
[0013]
A print inspection simulation method according to a seventh aspect is the print inspection simulation apparatus according to the fifth aspect, wherein the inspection priority condition is determined based on an attribute of the electronic component.
[0014]
The print inspection simulation method according to claim 8, wherein the print inspection simulation method according to any one of claims 5 to 7, wherein the simulation result is obtained by repeatedly executing the simulation operation in accordance with an inspection priority. Is compared with the inspection execution allowable time to create optimal execution data in the actual print inspection.
[0015]
According to the present invention, a priority created by grouping element shape and position data indicating the shape and position of an element solder printed portion printed on an electrode for electronic component bonding for each inspection imaging visual field according to inspection priority order conditions Inspection data is stored, and based on the inspection data with priority and the operation time data stored in the operation time library, a simulation operation for estimating the required time of the print inspection is performed. The time required for the print inspection can be properly predicted in various inspection modes.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a screen printing apparatus according to one embodiment of the present invention, FIG. 2 is a side view of the screen printing apparatus according to one embodiment of the present invention, and FIG. 3 is a screen printing apparatus according to one embodiment of the present invention. FIG. 4 is a plan view of a substrate printing surface by a screen printing apparatus according to an embodiment of the present invention. FIG. 5 is a block diagram showing a configuration of a control system of the screen printing apparatus according to an embodiment of the present invention. FIG. 6 is a diagram showing storage contents of a program storage unit and a data storage unit of the screen printing apparatus according to one embodiment of the present invention. FIG. 7 is an element of a solder printing unit of the screen printing apparatus according to one embodiment of the present invention. FIG. 8 is an explanatory diagram of shape / position data, FIG. 8 is an explanatory diagram of mounting data and a mask opening pattern of a screen printing apparatus according to an embodiment of the present invention, and FIG. 9 is a print inspection data creating process according to an embodiment of the present invention. Flow of FIG. 10, FIG. 11, FIG. 12, FIG. 14, FIG. 15 are diagrams showing display screens of a print inspection simulation apparatus according to an embodiment of the present invention, and FIG. It is a flowchart which shows a simulation method.
[0017]
First, the structure of the screen printing apparatus will be described with reference to FIGS. This screen printing apparatus is used not only as a printing mechanism for printing cream solder on a substrate on which electronic components are mounted, but also as a print inspection apparatus for determining the quality of a printed state and used in this print inspection, as described later. The configuration also has a function as a print inspection simulation device that creates print inspection data and performs a simulation operation for estimating the time required for execution of the print inspection.
[0018]
1 and 2, the substrate positioning unit 1 stacks a θ-axis table 4 on a moving table including an X-axis table 2 and a Y-axis table 3 and further arranges a Z-axis table 5 thereon. The Z-axis table 5 is provided with a substrate holder 7 for holding the substrate 6 sandwiched by the clampers 8 from below. The substrate 6 to be printed is carried into the substrate positioning unit 1 by the carry-in conveyor 14 shown in FIGS. By driving the substrate positioning unit 1, the substrate 6 moves in the X and Y directions, and is positioned at a printing position and a substrate recognition position described later. The printed substrate 6 is carried out by the carry-out conveyor 15.
[0019]
A screen mask 10 is provided above the substrate positioning unit 1, and the screen mask 10 is configured by mounting a mask plate 12 on a holder 11. The substrate 6 is positioned with respect to the mask plate 12 by the substrate positioning unit 1 and abuts from below. As shown in FIG. 4A, electrodes 6b, 6c, 6d, and 6e for joining different types of electronic components P1, P2, P3, and P4 are formed in the solder printing area 6a on the circuit forming surface of the substrate 6. Is provided.
[0020]
On the screen mask 10, a squeegee head 13 is disposed so as to be able to reciprocate in the horizontal direction. While the substrate 6 is in contact with the lower surface of the mask plate 12, the cream solder 9 is supplied onto the mask plate 12, and the squeegee 13a of the squeegee head 13 is brought into contact with the surface of the mask plate 12 to slide. The cream solder 9 is printed on the printing surface of the substrate 6 through the pattern holes 16 provided in the mask plate 12. As a result, as shown in FIG. 4B, element solder printed portions S1, S2, S3, and S4 are formed on the electrodes 6b, 6c, 6d, and 6e, respectively.
[0021]
Above the screen mask 10, a camera 20, which is an imaging unit, is provided. As shown in FIG. 3, the camera 20 is horizontally moved in the XY directions by the X-axis table 21 and the Y-axis table 22. The X-axis table 21 and the Y-axis table 22 are camera moving means for moving the camera 20. The camera 20 captures an arbitrary position on the mask plate 12 by moving the camera 20 with respect to the mask plate 12 by the camera moving unit.
[0022]
As shown in FIG. 2, the substrate positioning unit 1 can move the held substrate 6 from below the screen mask 10 in the Y direction by the Y-axis table 3 to the substrate recognition position. By moving the camera 20 to the substrate 6 on the substrate positioning section 1 in this state, an arbitrary position on the substrate 6 can be imaged by the camera 20.
[0023]
Next, a configuration of a control system of the screen printing apparatus will be described with reference to FIG. In FIG. 5, a calculation unit 25 is a CPU, and executes various programs stored in a program storage unit 26 to perform various calculations and processes described later. In these calculations and processes, various data stored in the data storage unit 27 are used.
[0024]
The operation / input unit 28 is input means such as a keyboard and a mouse, and inputs various control commands and data. The communication unit 29 exchanges data with other devices constituting an electronic component mounting line together with the screen printing device. The image processing unit 30 performs image processing of the image data obtained by the camera 20 to thereby recognize a solder printing unit for print inspection and detect a mask opening for creating print inspection data, as described later.
[0025]
The mechanism control unit 31 controls a camera moving unit that moves the camera 20 and a squeegee moving unit that moves the squeegee head 13. The display unit 32 is a display device that displays an image acquired by the camera 20, an operation screen in a print inspection data creation process described later, a determination result of the print inspection, a simulation calculation result described later, and the like. It has become.
[0026]
Next, a program and data stored in the program storage unit 26 and the data storage unit 27 will be described with reference to FIG. The program storage unit 26 stores a printing operation program 26a, an image processing program 26b, a printing quality determination program 26c, a grouping processing program 26d, a simulation execution program 26e, and an optimization calculation program 26f.
[0027]
The printing operation program 26a is a program for a printing operation for printing the cream solder 9 on the substrate 6 by controlling the operations of the substrate positioning unit 1 and the squeegee head 13. The image processing program 26b is a program for the image processing unit 30 to perform the following two types of processing based on the imaging result of the camera 20.
[0028]
First, by performing recognition processing on an imaging result obtained by imaging the substrate 6 after printing, element solder printing portions (see FIG. 4B) formed on each electrode of the substrate 6 are detected, and each element solder printing portion is detected. Calculate the area. In addition, by performing a recognition process on an imaging result obtained by imaging the mask plate 12, a process of obtaining mask opening data indicating the position and shape of each pattern hole 16 provided in the mask plate 12 is performed. This mask opening data is used as inspection data for print inspection.
[0029]
The print quality determination program 26c compares the area of the element solder printing part calculated by the image processing unit 30 with a previously stored inspection threshold value to determine the quality of the printing state for each element solder printing part. That is, the function realized by the image processing unit 30 and the arithmetic unit 25 executing the print quality determination program 26c is a function of determining the quality of the print state based on the imaging result of the board and the inspection data necessary for performing the print inspection. And a print determination unit for performing the determination.
[0030]
The grouping processing program 26d performs a process of grouping individual element position / shape data indicating the position and shape of each element solder printing unit in accordance with a specific grouping condition when creating inspection data used for print inspection. It is a program to do. That is, the function realized by the execution of the grouping processing program 26d by the arithmetic unit 25 is a grouping unit that classifies the element shape / position data according to the grouping condition and classifies them into data groups to specify each data group. It has become.
[0031]
The simulation execution program 26e is a program that performs a simulation operation for estimating a required time for executing the print inspection before executing the print inspection for inspecting the printing state of the cream solder 9 printed on the substrate 6. The function realized by the calculation unit 25 executing the simulation execution program 26e is a calculation unit that performs a simulation calculation.
[0032]
The optimization operation program 26f compares an operation result obtained by repeatedly executing the above-described simulation operation in accordance with the inspection priority with a given inspection execution allowable time, thereby executing an optimal execution in an actual print inspection. This is a program for creating data. The function realized by the execution of the optimization calculation program 26f by the calculation unit 25 constitutes an optimum inspection data creation unit.
[0033]
The data storage unit 27 stores mounting data 27a, component data library 27b, mask opening data library 27c, operating time library 27d, inspection data 27e with priority, and execution data 27f. Among these data, the mounting data 27a, the component data library 27b, the mask opening data library 27c, and the operating time library 27d are transferred from another device such as a data management computer via the communication unit 29 and stored.
[0034]
The mounting data 27a is data used in a mounting operation of mounting the electronic component on the board after the cream solder printing, that is, data relating the type of the mounted electronic component to the mounting position coordinates on the board. The component data library 27b is data on individual electronic components mounted on the board. The component data library 27b includes attribute codes indicating the component codes of the electronic components, the required precision in the mounting operation, the difficulty in solder printing for soldering, and the like. The numerical data includes numerical data representing the shape / size and the component-specific opening patterns (see 33A, 33B, 33C, and 33D shown in FIG. 8) indicating the arrangement of the element solder printing portions at the time of soldering.
[0035]
By the mounting data 27a and the component data library 27b, the individual pattern holes 16 of the mask plate 12 and the electronic components corresponding to the solder printing portions printed via these pattern holes can be associated on data, which will be described later. As described above, in the creation of print inspection data, various types of data are linked to each other to make the data creation process more efficient.
[0036]
The mask opening data library 27c stores numerical data indicating the opening position and size of the pattern holes 16 of the mask plate 12 used for printing for various types of mask opening data, and mask opening data associated with each mask plate. Is given in advance. That is, in the example of the mask plate 12 shown in FIG. 7, data on each of the pattern holes 16a to 16d is given. For example, for the pattern hole 16c, dimensions a and b indicating the pattern hole size and each pattern hole with respect to the reference origin are provided. The position coordinate values x1, x2, x3, ..., y1, y2, ... of 16c are given in the form of numerical data. The same applies to other pattern holes.
[0037]
As will be described later, this mask opening data is used as element position / shape data indicating the position / shape of the element solder printing portions (S1 to S4) shown in FIG. Therefore, the data storage unit 27 including the mask opening data library 27c is a data providing unit that provides element shape / position data indicating the shape and position of the element solder printing unit.
[0038]
As described above, since the data indicating the opening position and the opening size of the pattern hole can also be obtained by imaging the mask plate 12 with the camera 20, the required mask opening data is stored in the mask opening data library 27c. If not included, data similar to the data shown in FIG. 7 can be obtained using the actual mask plate 12. In this case, the camera 20 and the image processing unit 30 serve as data providing means for providing element shape / position data acquired based on mask opening data detected from the mask plate 12 used for screen printing.
[0039]
Further, as a method of obtaining the element shape / position data, a method of combining the mounting data 27a and the data included in the component data library 27b may be adopted. That is, as shown in FIG. 8, mounting points M1, M2A, M2B, M3, and M4 indicating mounting positions of the electronic components P1, P2, P3, and P4 are obtained from the mounting data 27a. By overlaying the component-specific opening patterns 33A, 33B, 33C, and 33D of the library 27b, numerical data equivalent to mask opening data can be obtained.
[0040]
The operation time library 27d provides data on the element operation time on which the simulation operation is based. That is, library data for calculating the time required for imaging and image recognition in one imaging visual field (recognition required time) and the time required for moving from one imaging visual field to the next imaging visual field (moving time) are stored. In the simulation calculation, the time required for executing the print inspection is calculated by adding the element operation times for each of the imaging visual fields.
[0041]
The prioritized inspection data 27e is created by grouping element shape / position data indicating the shape and position of the element solder printing unit shown in FIG. 4 for each inspection imaging visual field and prioritizing according to inspection priority conditions. Inspection data. When the print inspection is performed, the inspection is performed according to the priority shown in the inspection data 27e with priority in principle. The data storage unit 27 is an inspection data storage unit that stores inspection data with priority.
[0042]
The execution data 27f is inspection data that is actually used in a post-print inspection that is performed subsequent to the solder printing, and is performed by specifying a range to be inspected based on a result of a simulation operation as described later. The inspection data corresponding to the inspection range is stored in the data storage unit 27 as the execution data 27f.
[0043]
This screen printing apparatus is configured as described above. Next, a print inspection data creation process will be described with reference to the drawings according to the flow of FIG. This data creation process is used in a print inspection apparatus that inspects the printed state of the cream solder on the board after screen printing, and the shape indicating the shape and position of the solder printed portion formed by printing the cream solder on the printing surface・ Create inspection data including position data.
[0044]
First, in FIG. 9, mask aperture data is read (ST1). As a result, on the operation screen 40 for data creation processing displayed on the display unit 32, an opening pattern indicating the arrangement of the openings in the printing range 12a of the mask plate 12 is displayed. These openings correspond to element shape / position data indicating the shape and position of the element solder printing portion formed on each electrode on the circuit formation surface.
[0045]
Here, as the mask opening data, when the mask opening data corresponding to the target mask plate 12 is stored in the mask opening data library 27c of the data storage unit 27, this library data is used. If the library data has not been obtained, a process of creating equivalent mask opening data from the mounting data 27a and the component data library 27b is performed. Further, if the mounting data 27a and the component data library 27b are not yet obtained, the opening is detected from the image data obtained by imaging the mask plate 12 as described above, and is used as the element shape / position data. Data generation processing is performed.
[0046]
Next, the element shape / position data corresponding to each of the displayed pattern holes is classified into data groups by grouping according to grouping conditions, and a grouping process for specifying each data group is performed (ST2). In this grouping process, individual element shape / position data is grouped into a data group by associating the openings displayed on the operation screen 40 in accordance with a predetermined grouping condition. It is done automatically.
[0047]
Here, a group condition selection wizard 41 displayed on the operation screen 40 shown in FIG. 11 selects one of the three grouping conditions, that is, one of the grouping conditions by the component unit 42a, the attribute designation 42b, and the range designation 42c. You can do it. This selection is performed by a check frame 43 provided for each option.
[0048]
When the component unit 42a is selected, the grouping condition is determined so that each of the electronic components mounted on the board 6 is included in one group. That is, as shown in FIG. 12A, pattern holes 16a, 16b, 16c corresponding to electrodes (see FIG. 4) provided for soldering the four electronic components P1, P2, P3, P4, respectively. 16d is surrounded by grouping frames 45a, 45b, 45c, and 45d, whereby element shape and position data corresponding to individual pattern holes are classified into data groups in units of electronic components. The data group is specified by each electronic component (P1, P2,...).
[0049]
When the attribute designation 42b is selected, the grouping condition is determined based on the attribute of the electronic component. That is, of all the electronic components to be mounted, only the electronic components having the attribute specified by being input to the designated input frame 44 are to be grouped. When the range specification 42c is selected, the grouping condition is determined based on the geometric range on the printing surface of the board specified on the operation screen. The attribute specification and range specification will be described later.
[0050]
In this way, when the grouping processing is completed, the inspection imaging visual field is set (ST3). Here, a description will be given of the setting of the imaging field of view for inspection when the components are classified in units of parts by the grouping process. That is, on the screen in which the pattern holes are grouped for each of the electronic components (P1, P2,...), As shown in FIG. 12B, the holes are located at positions surrounding the grouping frames 45a, 45b, 45c, and 45d, respectively. The inspection imaging visual fields 46a, 46b, 46c, 46d are set. At this time, depending on the size of the grouping frame, a plurality of grouping frames may be surrounded by one imaging field of view for inspection.
[0051]
Next, prioritization in inspection execution is performed (ST4). That is, the priority of inspection execution is determined for each of the set imaging visual fields for inspection in consideration of the characteristics of the electronic components, and the relative order is set. Then, as shown in FIG. 12C, priority is given to the grouping frames 45a, 45b, 45c, and 45d. Here, an example is shown in which priorities [1], [2], [3], and [4] are assigned in the order of the grouping frames 45d-45c-45a-45b. The inspection data 27e with priority thus created is stored in the data storage unit 27 (inspection data storage step).
[0052]
Next, based on the inspection data 27e with priority and the operation time library 27d, a simulation operation for calculating the time required for the execution of the inspection is performed (calculation step). The calculation contents of the simulation will be described with reference to the flow of FIG. First, the inspection execution allowable time is input (ST11). As a result, in the electronic component mounting line, the time allowed for inspection per printed board is determined.
[0053]
Next, the inspection data 27e with priority is read from the data storage unit 27 (ST12). Thereafter, the required time for recognition of the imaging field of view of the first priority is calculated (ST13). In the example shown in FIG. 12, first, the recognition required time is calculated with reference to the operation time library 27d for the inspection imaging visual field 46d, and then whether the accumulated time of the calculated time does not exceed the allowable time is determined. Is determined (ST14).
[0054]
Here, if the accumulated time does not exceed the allowable time, the required recognition time for the next priority order imaging field of view and the movement time from the previous imaging field of view are calculated (ST15) and added to the accumulated time (ST16). . Thereafter, returning to (ST14), it is determined whether or not the accumulated time has exceeded the allowable time, and the same calculation is repeated thereafter. If it is determined in (ST14) that the accumulated time has exceeded the allowable time, the simulation result is displayed (ST17).
[0055]
That is, as shown in FIG. 14, the operation screen 40 displays a screen in which pattern holes are grouped for each electronic component. On this display screen, as a result of the simulation, only the groups (groups corresponding to the electronic components P1, P3, and P4) for which it is determined that the inspection can be performed within the permissible time are highlighted as the inspection execution targets and are not highlighted. The group (the group corresponding to the electronic component P2) indicates that the group has been excluded from the inspection execution target due to the restriction of the allowable time. Along with the display regarding the inspection target range, the predicted tact time obtained by the simulation is displayed in the display column 47.
[0056]
Then, the result of the simulation is confirmed, and if there is no problem, the confirmation switch 48 is operated. As a result, a data group belonging to the group to be inspected is determined as execution data, transferred to the data storage unit 27, and stored as execution data 27f. That is, in the above-described simulation processing, a form in which the optimum execution data in the actual print inspection is created by comparing the operation result obtained by repeatedly executing the simulation operation in accordance with the inspection priority and the inspection execution allowable time. It has become.
[0057]
If there is any doubt about the simulation result and it is desired to change the conditions and execute again, the re-execution switch 49 is operated. At the time of this re-execution, an allowable time change 50 and a priority change 51 can be selected. That is, if there is a data group that is excluded from the inspection execution target by slightly exceeding the allowable time input in advance, the re-simulation is performed under the condition that the allowable time is extended by the excess. When it is determined that a more preferable inspection mode can be realized by partially changing the priority, the simulation is performed after the priority is partially replaced.
[0058]
In the inspection data creation of FIG. 9, if the type of electronic component to be inspected with priority is specified in advance, or if it is desired to execute inspection only for a specific range in the board, grouping is performed. In the process (ST2), an attribute designation 42b and a range designation 42c are selected. Since the purpose of the simulation in this case is to find the predicted tact time, the inspection execution allowable time is merely a reference time, and a time that allows a margin is input in the simulation.
[0059]
FIG. 15A shows an example of the attribute designation 42b. Here, “QFP” is previously selected as the type of electronic component whose inspection is to be preferentially performed, and the type “QFP” of the electronic component is designated as an attribute. Thus, only the pattern hole 16d corresponding to the electronic component P4 corresponding to the type is surrounded by the grouping frame 45d. When there are a plurality of corresponding electronic components P4, a plurality of grouping frames 45d are set.
[0060]
Then, an inspection field of view surrounding this grouping frame 45d is set, and the same priority [1] is given to all of these inspection field of view. That is, in this example, the inspection priority order condition is determined based on the attribute of the electronic component. Then, by executing a simulation using the inspection data with priority created under these conditions, it is possible to obtain an estimated tact time when a print inspection is performed only for a specific type.
[0061]
FIG. 15B shows an example in which the range designation 42c is selected. Here, the range in which the inspection is to be performed is specified in advance on the board, and as shown in FIG. 13C, a grouping frame that surrounds only the range in which the inspection is to be performed by a pointing device such as a mouse on the operation screen. 45e is set. Then, a plurality of imaging fields of view for inspection are set in the grouping frame 45e, and all the imaging fields of view for inspection are given the same priority [1].
[0062]
That is, in this example, the inspection priority condition is determined based on the specified geometric range on the printed surface of the board. Then, by performing a simulation using the inspection data with priority created under these conditions, it is possible to obtain an estimated tact time when the print inspection is performed only for a specific range in the substrate.
[0063]
As described above, in the print inspection simulation according to the present embodiment, prioritized inspection data created by grouping unit shape / position data for each inspection imaging visual field in accordance with the inspection priority condition is created in advance. It is intended to be. This makes it possible to accurately predict the time required for print inspection in various inspection modes at the production site where the printing operation is performed. Therefore, it is possible to appropriately predict the time required for the print inspection performed in various inspection modes, and to determine the execution range of the print inspection necessary for securing the printing accuracy in relation to the allowable inspection time. Can be determined in a well-balanced manner.
[0064]
In this embodiment, the simulation is performed by a screen printing apparatus having a print inspection simulation function. However, a dedicated print inspection simulation apparatus is provided independently of the screen printing apparatus. Even in such a case, the structure described in this embodiment can be applied.
[0065]
【The invention's effect】
According to the present invention, a priority created by grouping element shape and position data indicating a shape and a position of an element solder printed portion printed on an electrode for electronic component bonding for each inspection imaging visual field according to an inspection priority order condition Inspection data with attached data is stored, and a simulation operation for estimating the required time for print inspection is performed based on the inspection data with priority and the operation time data stored in the operation time library. Therefore, the time required for the print inspection can be properly predicted in various inspection modes.
[Brief description of the drawings]
FIG. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention.
FIG. 2 is a side view of the screen printing apparatus according to the embodiment of the present invention.
FIG. 3 is a plan view of the screen printing apparatus according to the embodiment of the present invention;
FIG. 4 is a plan view of a substrate printing surface by the screen printing apparatus according to the embodiment of the present invention.
FIG. 5 is a block diagram illustrating a configuration of a control system of the screen printing apparatus according to the embodiment of the present invention.
FIG. 6 is a diagram illustrating storage contents of a program storage unit and a data storage unit of the screen printing apparatus according to the embodiment of the present invention;
FIG. 7 is an explanatory diagram of element shape / position data of an element solder printing unit of the screen printing apparatus according to the embodiment of the present invention;
FIG. 8 is an explanatory diagram of mounting data and a mask opening pattern of the screen printing apparatus according to the embodiment of the present invention;
FIG. 9 is a flowchart of print inspection data creation processing according to an embodiment of the present invention;
FIG. 10 is a flowchart of print inspection data creation processing according to an embodiment of the present invention;
FIG. 11 is a diagram showing a display screen of the print inspection simulation apparatus according to the embodiment of the present invention;
FIG. 12 is a diagram showing a display screen of the print inspection simulation apparatus according to the embodiment of the present invention;
FIG. 13 is a flowchart showing a print inspection simulation method according to an embodiment of the present invention.
FIG. 14 is a diagram showing a display screen of the print inspection simulation apparatus according to the embodiment of the present invention;
FIG. 15 is a diagram showing a display screen of the print inspection simulation apparatus according to the embodiment of the present invention;
[Explanation of symbols]
1 Board positioning section
6 substrate
6b, 6c, 6d, 6e electrodes
9 cream solder
12 Mask plate
13 Squeegee head
16, 16a, 16b, 16c, 16d Pattern hole
20 cameras
25 Arithmetic unit
26 Program storage
26b Image processing program
26c Print quality judgment program
26d Grouping processing program
26e Simulation execution program
26f optimization operation program
27 Data storage unit
27c Mask Aperture Data Library
27d operating time library
27e Prioritized inspection data
27f Execution data
30 Image processing unit

Claims (8)

A print inspection simulation apparatus for performing a simulation operation for estimating a required time of the print inspection execution prior to the execution of the print inspection for inspecting the print state of the cream solder printed on the substrate, wherein the simulation operation is performed on a circuit forming surface of the substrate. Element shape and position data indicating the shape and position of the element solder printed portion to be printed on the provided electrodes for joining electronic components are created for each inspection imaging field of view and prioritized according to inspection priority conditions. An inspection data storage unit for storing inspection data with priority, an operation time library for storing operation time data required for the simulation operation, and the inspection data based on the inspection data with priority and the operation time data. Computing means for performing a simulation computation, and display means for displaying a simulation computation result Simulation device for a printing inspection, characterized in that. The print inspection simulation apparatus according to claim 1, wherein the inspection priority condition is determined based on a geometric range specified on a printing surface of the substrate. The print inspection simulation apparatus according to claim 1, wherein the inspection priority condition is determined based on an attribute of the electronic component. An optimal inspection data creating unit that creates optimal execution data in an actual print inspection by comparing an operation result obtained by repeatedly executing the simulation operation according to the inspection priority with an inspection execution allowable time. 4. The printing inspection simulation apparatus according to claim 1, wherein: A printing inspection simulation method for performing a simulation calculation for estimating a required time of the printing inspection prior to the execution of the printing inspection for inspecting a printing state of the cream solder printed on the substrate, the method comprising: Element shape and position data indicating the shape and position of the element solder printed part printed on the provided electrodes for joining electronic components are created for each inspection imaging field of view and prioritized according to inspection priority conditions An inspection data storing step of storing the assigned inspection data with priority, and the simulation calculation based on the operation data required for the simulation calculation stored in the inspection data with priority and the operation time library. And a calculation step for performing the simulation. 6. The print inspection simulation method according to claim 5, wherein the inspection priority condition is determined based on a specified geometric range on a printing surface of the substrate. The print inspection simulation method according to claim 5, wherein the inspection priority condition is determined based on an attribute of the electronic component. 6. An optimum execution data in an actual print inspection is created by comparing an operation result obtained by repeatedly executing the simulation operation according to an inspection priority with an inspection execution allowable time. 8. The print inspection simulation method according to any one of claims 1 to 7.

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