JP2001116528A - Method and device for acquiring three-dimensional data - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device which can efficiently obtain three- dimensional data. SOLUTION: A slit light source 280 and a two-dimensional image pickup device 282 are held by a holder, which is moved to move the light source 280 and image pickup device 282 along a linear path which is parallel to the surface 49 of a printed wiring board 12 and parallel to the length of cream solder 280 while holding the light source 28 and image pickup device 282 in fixed relative position relation. An image is picked up more than one during the movement; when the cream solder 380 is printed neither too much nor too little, an image of a part of the cream solder 280 irradiated with slit light is formed at nearly the same position of an image pickup surface each time the image is picked up and even when the cream solder 380 is too much or too little, deviation in the image formation position is small and the image processing range of the image pickup surface is limited, so that the times of data transfer and image processing may be short. Three-dimensional image data are obtained through operation from pieces of two-dimensional image data obtained by picking up an image more than one and the mean value of height, the volume, the plain-view shape, etc., of the cream solder 280 are found to detect a defect in printing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for acquiring three-dimensional data of an imaging object having a three-dimensional shape, and more particularly to an improvement in acquisition efficiency.

[0002]

2. Description of the Related Art Acquisition of three-dimensional data is performed, for example, in a mask printing apparatus for printing cream solder on a printed wiring board in order to detect a printing defect. In this mask printing apparatus, a mask having a through hole is overlapped on a printed wiring board, and cream solder is moved along the mask and pushed into the through hole to adhere to the printed wiring board. Printing defects such as misalignment may occur. Therefore, three-dimensional data of the cream solder printed on the printed wiring board is obtained, and a printing failure such as an insufficient amount of the printing medium is detected.

[0003] The three-dimensional data is obtained, for example, by irradiating the cream solder with a flat slit light from a slit light source and imaging a portion of the cream solder illuminated by the slit light with a two-dimensional imaging device. . Imaging is performed a plurality of times during the movement by moving the slit light source with respect to the two-dimensional imaging device and the cream solder. Since the irradiated light is the flat slit light, an image corresponding to the outline of the cut surface when the target is cut by the cutting plane corresponding to the slit light is obtained by each imaging. That is, the image of the part illuminated by the slit light on the surface of the printed wiring board and the image of the part illuminated by the slit light of the cream solder are formed at different positions on the imaging surface, and the difference between the two positions is The swell amount (height) of the cream solder can be obtained. Then, based on data of a plurality of two-dimensional images obtained by a plurality of imagings, three-dimensional image data, three-dimensional data such as an average value of cream solder height and volume are obtained.
A printing failure is detected based on the dimensional data.

[0004]

However, if the slit light source is moved with respect to the two-dimensional image pickup device and the cream solder and the image is picked up, the image forming position on the image pickup surface changes for each image pickup. Since it is uncertain on which part of the imaging surface an image is formed, it is necessary to perform image processing on the entire imaging surface, which takes time. This problem similarly occurs when an image of an imaging target other than cream solder printed on a printed wiring board is imaged using a slit light source and a two-dimensional imaging device.

An object of the present invention is to provide a method and an apparatus for acquiring three-dimensional data which can efficiently acquire three-dimensional data with the above circumstances as background. And a three-dimensional data acquisition apparatus. As in the case of the claims, each aspect is divided into sections, each section is numbered, and if necessary, the other sections are cited in a form in which the numbers are cited. This is to facilitate understanding of the present invention,
The technical features and combinations thereof described herein should not be construed as limited to those set forth in the following sections. Further, when a plurality of items are described in one section, it is not always necessary to adopt the plurality of items together, and it is also possible to take out and adopt only some of the items. (1) A slit light source that emits a plate-like slit light toward an imaging target having a three-dimensional shape, and a two-dimensional imaging that captures a two-dimensional image of a portion of the surface of the imaging target illuminated by the slit light. With the device, while maintaining a constant relative positional relationship, the slit light source and the two-dimensional imaging device, relative to the imaging target object along a predetermined relative movement path, during the relative movement, A three-dimensional data acquisition method, wherein a two-dimensional image of a portion illuminated by slit light is captured a plurality of times, and three-dimensional data of the imaging target is obtained based on the results of the plurality of times of capturing. 1). The imaging target includes, for example, a printing material such as cream solder or an adhesive printed on a surface of a printing target material such as a printed wiring board by a mask, a BGA (Ball Glid Ar
ray) and CSP (Chip Size Package). The printing material may be applied to the printing material in a spot shape using a coating device such as a dispenser device in addition to mask printing. The object to be imaged is also an electric component,
The invention is not limited to the one related to the printed wiring board, and may be another one. The imaging may be performed with the relative movement between the slit light source and the two-dimensional imaging device and the imaging target stopped, or may be performed without stopping the movement. The relative movement path may be, for example, a path along the surface of the imaging target or, as described in (2), a path along a surface on which the imaging target is provided. In the former case, if there is a predetermined irregularity on the surface of the imaging target, the path may be curved or bent exactly along the predetermined irregularity, or may be a straight path taking the average of the predetermined irregularities. Good. If the slit light source and the two-dimensional imaging device are maintained in a constant relative positional relationship, a change in the image forming position of the imaging target due to a change in the relative position is eliminated. In the relative movement path, an image of a target portion among the portions illuminated by the slit light of the imaging target is formed at substantially the same position on the imaging surface of the two-dimensional imaging device in a plurality of imagings. If you decide
Image processing may be performed on a limited area of the imaging surface, and processing time can be reduced. However,
When performing image processing only on the image data of the pixel most likely to be the portion illuminated by the slit light described in (9) and the pixel adjacent thereto,
In a plurality of times of imaging, it is not essential to determine such that the image of the portion illuminated by the slit light is formed at substantially the same position on the imaging surface of the two-dimensional imaging device. (2) The imaging object is an imaging object having at least one of a convex portion raised from one plane and a concave portion depressed from one plane, and the predetermined relative movement path is parallel to the one plane. The three-dimensional data acquisition method according to item (1) (claim 2). The height of the protrusion and the depth of the recess may be substantially the same over the entirety, or may vary in the direction of relative movement. If the height of the convex portion and the depth of the concave portion are respectively equal in the entire object to be imaged, the images of the surface of the convex portion and the bottom surface of the concave portion are formed at substantially the same position on the imaging surface in each of a plurality of imagings. Thus, the effect of reducing the image processing time can be obtained. Even when the height of the convex portion and the depth of the concave portion are changed, in each of the plurality of imagings, an image of one plane is formed at the same position on the imaging surface, and accordingly, the image of the imaging surface The part to be processed is limited, and the processing time can be reduced. (3) The method for acquiring three-dimensional data according to the above mode (1) or (2), wherein the object to be imaged is a printing material having a mask printed on a surface of a printed circuit board. Since the printing material subjected to mask printing is essentially the same height over substantially the entire area, the height of the two-dimensional image of the portion illuminated by the slit light is substantially constant, and the effect of the present invention is particularly effectively achieved. You can enjoy. (4) The method for acquiring three-dimensional data according to item (3), wherein the printing material is to be originally printed in a rectangular shape. (5) The three-dimensional data acquisition method according to the above mode (4), wherein the relative movement path is parallel to a longitudinal direction of the rectangular printing material. If the relative movement path is selected in the longitudinal direction of the rectangular printing material, the obtained two-dimensional image has a relatively small width and the position in the width direction is substantially constant, so that the image processing time is reduced. Can be shortened. In addition, since a printing material having a longitudinal shape usually requires accuracy particularly in a width and a position in a width direction, it is important to select a relative movement path in a longitudinal direction of a printing material having a rectangular shape. Is also advantageous. This is because it is difficult to obtain the width dimension and the position in the width direction with high accuracy when a two-dimensional image is obtained by setting the movement path in a direction perpendicular to the longitudinal direction. (6) a part of an imaging region of the two-dimensional imaging device,
The image processing of the image data of the predetermined area is performed as there is a possibility that the image of the portion illuminated by the slit light may exist, and the image processing of the image data of the other areas is not performed. The three-dimensional data acquisition method according to any one of the above aspects (5) (claim 4). By processing the image data of the limited imaging region in this way, but not processing the image data of the other imaging regions, the processing time corresponding to the image data that does not need to be processed can be saved. , Image processing time can be reduced. (7) The image data is processed by an image processing apparatus, and the image data of the predetermined area is transferred from the two-dimensional imaging apparatus to the image processing apparatus. Not transfer The three-dimensional data acquisition method according to the above (6). If image data of a predetermined area is transferred from the two-dimensional imaging device to the image processing device, not only the processing time of the image data but also the data transfer time can be reduced. (8) In the image captured by the two-dimensional imaging device, the slit light is included in the pixels arranged along each of a plurality of straight lines extending in a direction intersecting the longitudinal direction of the image of the portion illuminated by the slit light. The three-dimensional data acquisition method according to any one of (1) to (7), including a step of specifying a pixel most likely to be a portion illuminated by (3). For example, when the image data is data representing the brightness of each pixel, the “pixel most likely to be the portion illuminated by the slit light” is a pixel corresponding to the brightest portion of the image. It is reasonable that the set of pixels most likely to be the part illuminated by the slit light is close to the set of points located at the center in the width direction of the image of the part illuminated by the slit light. Yes, it is also possible to obtain three-dimensional data as a set of this data. However, if the processing described in the following section is performed, more accurate three-dimensional data can be obtained. When the features of this section are adopted in combination with the features of section (6), the process of identifying the pixel most likely to be the portion illuminated by the slit light is performed only for a predetermined area. As a result, the image processing time can be particularly reduced. On the other hand,
If the features described in (6) are not adopted together, the process of specifying the pixel most likely to be the portion illuminated by the slit light is performed for the entire imaging region of the two-dimensional imaging device. Become. Nevertheless, the processing time can be reduced as compared with the conventional image processing. (9) On each of the plurality of straight lines, an image of image data of a predetermined number of pixels arranged on both sides of a pixel specified as a pixel most likely to be a portion illuminated by the slit light The three-dimensional data acquisition method according to the above mode (8), wherein the image data of the other pixels is processed without performing image processing. By adopting the features of this section, accurate three-dimensional data can be obtained in a short image processing time. It should be noted that, although it is not mentioned one by one, it is possible to adopt the features described below with respect to the device invention also in the method invention, and also to the device invention, the features described above with respect to the method invention. It is possible to adopt. (10) A slit light source that emits a flat slit light toward an imaging target having a three-dimensional shape, and two-dimensional imaging that captures a two-dimensional image of a portion of the surface of the imaging target illuminated by the slit light. Device, a holding device that holds the slit light source and the two-dimensional imaging device in a fixed relative positional relationship, and a relative movement that relatively moves the holding device and the imaging object along a predetermined relative movement path. Three-dimensional data including a device and a control device for causing the two-dimensional imaging device to perform a plurality of times of imaging while moving by the relative moving device, and acquiring three-dimensional data of the imaging target based on the imaging results Acquisition device (Claim 7). According to this aspect, for example, the three-dimensional data acquisition method described in (1) can be favorably performed. (11) An image pickup object 3 having at least one of a convex portion raised from one plane and a concave portion recessed from one plane.
An apparatus for acquiring dimensional data, comprising: a slit light source that emits a flat slit light toward the imaging target; and a two-dimensional image of a portion of the surface of the imaging target illuminated by the slit light. A two-dimensional imaging device, a holding device that holds the slit light source and the two-dimensional imaging device in a fixed relative positional relationship, and a relative movement that relatively moves the holding device and the imaging target in a direction parallel to the one plane. A three-dimensional apparatus including: a moving device; and a control device that causes the two-dimensional imaging device to perform a plurality of times of imaging while moving by the relative moving device, and acquires three-dimensional data of the imaging target based on the imaging results. Data acquisition device. According to this aspect, for example, the three-dimensional data acquisition method described in (2) can be favorably performed. (12) The holding device holds the slit light source and the two-dimensional imaging device at relative positions where their optical axes make different angles with respect to a perpendicular to the one plane and cross each other. The three-dimensional data acquisition apparatus according to the above mode (11). According to the features of the present aspect, it is possible to prevent specularly reflected light from a portion illuminated by slit light from being incident on the two-dimensional imaging device. it can. If the optical axes of the slit light source and the two-dimensional imaging device are orthogonal to each other, the entire portion illuminated by the slit light will be located on a plane perpendicular to the optical axis of the two-dimensional imaging device. Advantageously, the two-dimensional imaging device can be focused on its entire illuminated part. (13) The three-dimensional data according to (11) or (12), wherein one of the two-dimensional imaging device and the slit light source is disposed so that an optical axis thereof is orthogonal to the one plane. Acquisition device. If the optical axis of the two-dimensional imaging device is perpendicular to the one plane, the two-dimensional imaging device, which is often relatively long, extends in the vertical direction. It becomes easy. Further, when the optical axis of the slit light source is set to be orthogonal to the one plane, the slit light is incident on the one plane and the surface of the imaging target from a perpendicular direction. , The width of the part illuminated by the slit light becomes narrower,
Accordingly, it is easy to obtain a sharp image. (14) The three-dimensional data acquisition apparatus according to any one of (10) to (13), wherein the control device obtains three-dimensional image data of the imaging target as the three-dimensional data. If there is three-dimensional image data, for example, three-dimensional data such as the volume of the object to be imaged can be obtained.
Dimensional data is also obtained. (15) The control device may include an image processing device, and the two-dimensional imaging device may include an image of a part of the imaging region of the two-dimensional imaging device, which is illuminated by the slit light. A limited data transfer unit that transfers image data of an area determined in advance as being to the image processing apparatus, but does not transfer image data of other areas (1).
The three-dimensional data acquisition apparatus according to any one of paragraphs (0) to (14). The three-dimensional data acquisition device according to this section,
It is suitable for carrying out the method described in (7). (16) The control device includes an image processing device, and the two-dimensional imaging device extends in a direction intersecting a longitudinal direction of an image of a portion illuminated by the slit light in an image captured by the two-dimensional imaging device. Among the pixels arranged along each of the plurality of straight lines, a pixel specifying unit that specifies a pixel most likely to be a portion illuminated by the slit light is provided. The three-dimensional data acquisition device according to one of the above. The three-dimensional data acquisition device described in this section is suitable for implementing the method described in the above (8). (17) The two-dimensional imaging apparatus is configured such that, on each of the plurality of straight lines, a predetermined number of pixels arranged on both sides of a pixel identified as a pixel most likely to be a portion illuminated by the slit light The three-dimensional data acquisition device according to (16), further including a limited data transfer unit that transfers image data of pixels to the image processing device and does not transfer image data of other pixels to the image processing device. In the three-dimensional data acquisition device described in this section, the amount of image data to be transferred from the two-dimensional imaging device to the image processing device can be small, the transfer time can be reduced, and image processing should be performed in the image processing device. The amount of image data is small, and the processing time can be reduced. (18) The two-dimensional imaging apparatus is configured such that, on each of the plurality of straight lines, a predetermined number of pixels arranged on both sides of a pixel identified as a pixel most likely to be a portion illuminated by the slit light By processing the image data of the pixels, a center line specifying unit that specifies the center line in the width direction of the portion illuminated by the slit light, and a center line image data obtaining unit that obtains image data on the center line, A center data transfer unit for transferring the center line data specified by the center line specifying unit and the center line image data acquired by the center line image data acquisition unit to the image processing apparatus, 3D data acquisition device. In the three-dimensional data acquisition device according to this section, the amount of image data to be transferred from the two-dimensional imaging device to the image processing device, and the amount of image processing in the image processing device are the three-dimensional data described in (17). Even less in the acquisition device.

The above-described method and apparatus for acquiring three-dimensional data can be favorably used for inspection of a printing material in the following mask printing method and mask printing apparatus. (1) A method of printing a printing material on a printing target material through a mask, wherein a printing step of mask-printing the printing material on the printing target material and an inspection for inspecting the printing material printed in the printing process. Mask printing including a process and, in the inspection process, when it is discovered that the amount of the printing medium is insufficient, at least in a portion where the insufficiency is found, and a correction printing process for performing a correction printing to compensate for the insufficiency. Method. Examples of the printing material include cream solder and adhesive. Also,
The printing target material includes, for example, a printed wiring board, a base material exposed to the outside of a leadless electric component having no lead wire, which is a packaged electric component in which a chip component is held by a container. The mask may be a screen mask made of fibers, a combination mask in which the screen mask is reinforced by metal, or a stencil mask made of metal. Insufficient print volume may be compensated for by performing mask printing again on the entire print target material, as described in the next section, or partially printing on the print target material without using a mask. The printing agent may be supplemented by printing the printing agent only on the print spot where the print amount is insufficient using a device capable of printing the agent. The inspection may be performed on all the printing materials printed on the printing target material, or may be performed on only a part thereof. In the latter case, for example, an inspection is performed on a portion where the amount of the printing medium is likely to be insufficient, or on a portion extracted at random for each printing target material. If correction printing is performed to compensate for the shortage of the printing agent, the shortage of the printing agent can be resolved, and the printing target material having the shortage of the printing agent does not need to be regarded as a defective product. Thus, for example, when the material to be printed is a printed wiring board and printing of the printing material is performed as one step of manufacturing a printed circuit board, the number of printed wiring boards excluded from the manufacturing line can be reduced. (2) The mask printing method according to (1), wherein the correction printing step is a reprinting step of performing mask printing again on the entire printing target material. Correction printing can be easily performed by repeating the same printing operation as mask printing. (3) The reprinting step is performed by loosening the conditions for pressing the printing material into the mask through-holes from the printing step.
The mask printing method according to the above mode (2). The pushing conditions are, for example, pushing pressure, pushing time, and the like. Although the amount of the printing material is insufficient, printing has already been performed to some extent, and if the normal printing process is performed again as a reprinting process, the printing amount tends to be excessive. On the other hand, according to this aspect, it is possible to satisfactorily avoid an excessive print amount. (4) The inspection step is a step of imaging the surface of the printing target material after the printing step with an imaging device and finding a shortage of the amount of the printing agent based on the acquired image. Or a mask printing method according to any one of the above (3).
Insufficient amounts of printing agent manifest in various ways. For example,
The height is insufficient, or at least a part of the portion where the printing material is to be printed has a chipped portion where the printing material is not printed. The imaging device may be, for example, a two-dimensional imaging device used in combination with a slit light source, as described in connection with the three-dimensional data acquisition device in section (6). The operation and effect described in the item (6) can be obtained. An imaging device is disclosed in, for example,
As described in JP-A-50578, a laser displacement sensor may be used. Laser displacement sensors
The apparatus includes a laser beam generator, an optical system, a reflected light condensing device, etc., irradiates a printing material with a laser beam, and acquires an image of the printing material based on the reflected light. At the time of imaging, the laser displacement sensor and the printing material are relatively moved by the relative movement device. The imaging device may be an imaging device that images the printing material in a plan view. Even with such an image pickup apparatus, it is possible to discover the lack of the printing material. The imaging device and the printing material are relatively moved by a relative movement device if necessary at the time of imaging. (5) The inspection step separates the print target material and the mask in a direction perpendicular to their plate surface, but does not move the print target material and the mask in a direction parallel to the plate surface. The mask printing method according to the above mode (4), which is performed by allowing the image pickup device to enter the space therebetween. According to this aspect, the inspection can be performed quickly without changing the positions of the printing target material and the mask in the direction parallel to the plate surface. (6) The inspection step is performed in a state where the printing target material and the mask are relatively moved in a direction parallel to a plate surface of the printing target material and the mask is not present above the printing target material. The mask printing method described in the above. According to this aspect, since the inspection can be performed in a state where the mask does not exist above the printing target material, the degree of freedom of the configuration and arrangement of the inspection apparatus is high. (7) The modified printing step is a reprinting step of performing mask printing again on the entire printing target material, and before the reprinting step, a direction of the printing target material and the mask parallel to their plate surfaces. The mask printing method according to the above mode (6), wherein a repositioning step of adjusting the relative positions of the masks is performed. During mask printing,
The material to be printed and the mask are aligned in a direction parallel to the plate surface, but if both are relatively moved in a direction parallel to the plate surface for inspection, the mask printing is performed again. Even if the print position is returned to the printing position, the relative position may be shifted. Therefore, it is desirable that the printing target material and the mask are aligned before the reprinting by the mask printing so that the printing material is reprinted with high accuracy on the printing spot of the printing target material. (8) The mask according to any one of (1) to (7), including a cleaning step of cleaning the mask when at least a shortage of the printing medium is found in the inspection step. Printing method. It is considered that one of the causes of the shortage of the printing medium is adhesion of the printing medium to the through-hole surface of the mask.
Therefore, if the mask is cleaned, it is possible to remove the adhered printing medium and eliminate the cause of the shortage of the printing amount. The cleaning of the mask may be performed at times other than when the amount of the printing material is insufficient. (9) The inspection step is a step of inspecting at least one other printing defect other than the shortage of the printing medium and identifying the type of the printing defect. The mask printing method according to any one of the above. If the type of printing failure is specified, countermeasures can be taken according to the type. (10) The mask printing method according to the above mode (9), wherein the another printing failure includes at least one of an excessive amount of the printing medium and a printing position shift of the printing medium. In addition, it is not mentioned one by one, but it is possible to adopt the features described below with respect to the device invention also in the method invention,
As for the device invention, it is possible to adopt the above-mentioned features described in relation to the method invention. (11) A target material supporting device that supports a printing target material, a printing device that prints a printing material through a mask on a printing target material supported by the target material supporting device, and a printing material that is printed by the printing device And a correction printing device that, when it is discovered by the inspection device that the amount of the printing medium is insufficient, performs correction printing to compensate for the lack at least in the portion where the shortage is found. And a mask printing apparatus. According to this aspect, for example, the mask printing method described in (1) can be favorably performed. (12) The mask printing apparatus according to (11), wherein the inspection device includes an imaging device that captures an image of the printing material printed by the printing device, and performs inspection by processing an image obtained by imaging. The imaging device is configured, for example, as described in relation to the three-dimensional data acquisition device in (6). (13) The apparatus according to the above mode (11) or (12), further including a relative positioning device that relatively moves the target material supporting device and the mask in a direction parallel to their plate surfaces and automatically performs a relative positioning thereof. 3. The mask printing apparatus according to claim 1. As described in the section of the embodiments of the invention, when the inspection is performed at a position different from the position where the mask printing is performed, the alignment may be performed before the reprint, and the inspection is performed by the mask printing. When the printing is performed at the position where the printing is performed, the positioning may be performed before the reprinting. By performing alignment between the target material support device and the mask, the printing material is printed with high accuracy on the print spot of the print target material. (14) The relative positioning device is based on an imaging device that captures a reference mark provided on each of the printing target material supported by the target material support device and the mask, and an image obtained by the imaging device. And a positional deviation acquiring device for acquiring a relative positional deviation between the printing target material and the mask.
The mask printing apparatus according to item (13). The imaging device for imaging the reference mark may be the same as the imaging device for imaging the printing material, or may be another device. In addition, the reference mark of the printing target material and the reference mark of the mask may be respectively imaged by different imaging devices, or may be imaged by a common imaging device. In the latter case, for example, the direction of the common imaging device may be inverted, or two optical systems may be provided for the common imaging device so that the two optical systems are selectively used. It is. (15) The modified printing device according to any one of (11) to (14), further including a reprint command device that causes the printing device to perform mask printing again on the entire printing target material. Mask printing equipment. According to this embodiment, for example, (2)
The mask printing method described in the section can be favorably performed. (16) In the case where the printing apparatus is instructed to reprint by the reprint instructing apparatus, the printing apparatus includes a printing condition alleviating apparatus for relaxing a condition for pushing the printing material into the through holes of the mask.
The mask printing apparatus according to the item 5). According to this aspect, for example, the mask printing method described in (3) can be favorably performed. (17) Including a cleaning device for automatically cleaning the mask
The mask printing apparatus according to any one of the above modes (11) to (16). There are various types of cleaning devices. As described in the description of the embodiments of the present invention, cleaning is performed in a state where the mask is positioned at a position used for printing without relatively moving the print target material and the mask in a direction parallel to their plate surfaces. The cleaning device may be provided at a position deviating from the position where the mask printing is performed, and may be a device cleaning the mask at a position deviating from the printing position. In the latter case, the cleaned mask may be used again for printing, or another mask may be used for printing, and cleaning may be performed in parallel with printing. According to this aspect,
For example, the mask printing method described in (8) can be favorably performed. (18) The mask printing apparatus according to (17), further including a cleaning instruction device that activates the cleaning device when at least the shortage of the printing medium is found by the inspection device. (19) The inspection device is provided at a position separated from the printing device in a direction parallel to a plate surface of the mask,
In addition, the mask printing apparatus includes a printing target material return device that returns a printing target material in which a shortage of the printing medium is found by inspection of the inspection device to the printing device. (11) Any of (11) to (18) A mask printing apparatus according to one of the preceding claims. The printing target material return device is, as described in the embodiment of the invention,
It may be constituted by a transport device for loading and unloading the printing target material to a position where printing is performed, or may be provided separately from the transport device. According to this aspect, for example, the mask printing method described in (6) can be favorably performed.
If a relative positioning device is provided, reprinting is performed with high accuracy.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 schematically shows a mask printing machine as a mask printing device provided with a three-dimensional data acquisition device according to an embodiment of the present invention.
Is the base. On the base 10, a wiring board conveyor 14, which is a transfer device for transferring a printed wiring board 12, which is a printed circuit board as a material to be printed, and an object for supporting and ascending and descending the printed wiring board 12 conveyed by the wiring board conveyor 14. A wiring board support elevating device 16 serving as a target material supporting elevating device, which is a kind of material supporting device, a wiring board holding device (not shown) for holding the printed wiring board 12 when the wiring board is supported by the wiring board supporting elevating device 16, and a mask plate 18. A mask positioning and supporting device 20 for supporting (see FIG. 3), a printing device 22 for printing cream solder, which is a kind of printing material, on the printed wiring board 12, a mask cleaning device 24 for cleaning the mask of the mask plate 18, and a printing device 22 Printed wiring board 12
Inspection device 26 for inspecting cream solder printed on
(See FIG. 8), a wiring board reference mark image pickup device 28 (FIG. 8) for picking up an image of a reference mark provided on the printed wiring board 12.
), And a mask reference mark imaging device 29 (see FIG. 8) for imaging a reference mark provided on the mask.

As shown in FIG. 3, the wiring board conveyor 14 includes a fixed rail 30 provided at a fixed position, and a movable rail 32 provided in parallel with the fixed rail 30 and capable of approaching and separating. Have. An endless belt (not shown) as a wrapping member is attached to each of the fixed rail 30 and the movable rail 32 along the longitudinal direction, and the printed wiring board 12 is placed on these belts.
The belt is conveyed by being circulated by a belt driving device (not shown). The distance between the fixed rail 30 and the movable rail 32 is adjusted according to the dimensions of the printed wiring board 12. The printed wiring board 12 is stopped at a printing position where the cream solder is printed in the transport direction by a stopper device (not shown). The stopper device has an operation position for stopping the movement of the printed wiring board 12,
The printed wiring board 12 includes a stopper member that can be moved to a non-operation position that allows the printed wiring board 12 to be transported.
Is stopped at a position directly above a wiring board support 40 to be described later.

At the upstream side of the wiring board conveyor 14 in the direction in which the printed wiring board 12 is transported, a carry-in conveyor 34 (FIG. 1) for carrying the printed wiring board 12 into the wiring board conveyor 14 is provided.
0, and an unloading conveyor 36 (see FIG. 10) for unloading the printed wiring board 12 from the wiring board conveyor 14 is provided on the downstream side. These conveyors 14,3
Reference numerals 4 and 36 designate a transport device for transporting the printed wiring board 12, and transport the printed wiring board 12 in the horizontal direction.

As shown in FIGS. 1 and 2, the wiring board supporting elevating device 16 is provided below the printing device 22 and is provided so as to be able to move up and down between a fixed rail 30 and a movable rail 32. It has a wiring board support 40 as a material support. In the present embodiment, the wiring board support table 40 sucks the printed wiring board 12 by negative pressure and horizontally supports the printed wiring board 12. The printed wiring board 12 is lifted from the belt of the wiring board conveyor 14 and the mask plate 18 is lifted.
Is moved up and down to the rising end position where it comes into contact with the lower surface of the mask.

The lifting device 42 includes a screw shaft 44 fixed to the wiring board support 40, a nut 46 provided on the base 10 so as to be rotatable and immovable in the axial direction, and a servomotor (not shown) for rotating the nut 46. ). The servomotor is an electric rotary motor as an electric motor which is a kind of a driving source, and is a motor capable of controlling the rotation angle and the rotation speed with high accuracy. A step motor may be used instead of the servo motor. The same applies to other servomotors used in the present mask printing machine, although not described one by one. The rotation of the servomotor is transmitted to a nut 46 by a rotation transmission device (not shown), and the screw 46 is moved up and down by rotating the nut 46, and the wiring board support 40 is raised and lowered. The dimension of the wiring board support table 40 in the direction perpendicular to the wiring board transport direction in the horizontal plane can be adjusted according to the width of the printed wiring board 12.

A portion of the wiring board conveyor 14 where the movement of the printed wiring board 12 is stopped by the stopper device is provided with a positioning device for positioning the printed wiring board 12, and the printing device stopped by the stopper device is provided. The wiring board 12 is accurately positioned by the positioning device. The positioning device has positioning pins as positioning members provided at two positions separated in a direction parallel to the plate surface of the printed wiring board 12 so as to be vertically movable, and fits into positioning holes provided in the printed wiring board 12. Thereby, the printed wiring board 12 is positioned. The positioning pin is always at the lower end position, and
Is raised by the urging device, for example, the urging force of a spring, and is fitted into the positioning hole of the printed wiring board 12 for positioning. When the wiring board support 40 is located at the lower end position, the positioning pins are also at the lower end position, and do not hinder the conveyance of the printed wiring board 12 by the wiring board conveyor 14.

The wiring board holding device (not shown) is provided between the wiring board conveyor 14 and the mask positioning and supporting device 20, and has a plate-like wiring board holding member.
The wiring board pressing member is moved to a pressing position located on the printed wiring board 12 and a retracted position retracted from the printed wiring board 12. The wiring board support table 40 is moved up and down by an elevating device 42 in addition to a rising end position and a falling end position.
The printed wiring board 12 is pressed against the wiring board pressing member, moved to a suction position where the printed wiring board is sucked, and stopped. When the wiring board support 40 is lifted and the printed wiring board 12 is picked up from the belt of the wiring board conveyor 14, the positioning pins are simultaneously fitted into the positioning holes of the printed wiring board 12, and the printed wiring board 12 is moved to the wiring board support 40. Position accurately with respect to. After this positioning, the wiring board support 40
Further rises to reach the suction position, and the printed wiring board 12
Is pressed against the wiring board holding member and is attracted by the negative pressure. At this time, the positioning pins are still fitted in the positioning holes, and the printed wiring board 12 is supported by the wiring board support base 40 in a state of being positioned by the positioning pins. If the wiring board support 40 is further raised,
The positioning pin is detached from the positioning hole. When the printed wiring board 12 is brought into contact with the mask of the mask plate 18 and cream solder is printed, the positioning pins are separated from the positioning holes.

The mask plate 18 is, as shown in FIG.
The periphery of the mask 48 is fixed to the lower surface of the mask frame 50. The mask 48 is a stencil mask in the present embodiment, and is made of a nickel alloy, stainless steel, or the like. The mask 48 has a plurality of through holes 51 penetrating in the thickness direction. In the present embodiment, each of the plurality of through holes 51 has a rectangular (including square) cross section parallel to the plate surface of the mask 48. A plurality of printing spots to which cream solder is applied are provided on one plane surface 49 (see FIG. 5) of the printed wiring board 12. Is formed. Through hole 51
In this embodiment, is formed such that one side of the rectangle having the above-mentioned cross-sectional shape is parallel to the X-axis direction and the other side is parallel to the Y-axis direction.

As shown in FIGS. 4 and 5, the mask positioning and supporting device 20 includes a mask support 52 for supporting a mask frame 50. The mask support 52 has a plate shape and is fixed on four columns 54 erected on the base 10. An opening 56 penetrating in the thickness direction is formed in the mask support 52 as shown in FIG.

As shown in FIG. 4, ball units 60 are provided at positions corresponding to the four corners of the mask frame 50 of the mask support 52, respectively. Ball unit 60
Has not yet been disclosed, but has been filed in Japanese Patent Application No.
It has the same construction as the ball unit described in the specification of US Pat. No. 3,359,044 and will be briefly shown and described.

The ball unit 60 includes a unit case 6
2 (see FIG. 5) includes a ball 64 rotatably housed therein and a spring (not shown) as an elastic member which is a kind of biasing means. In a state where the mask plate 18 is not fixed to the mask support 52, the ball 64 is located at a protruding position protruding upward from the unit case 62, and the mask plate 1
When the mask plate 18 is fixed to the mask support base 52, the mask plate 18 moves to the retracted position where the mask plate 18 is retracted into the case against the urging force of the spring, and the mask frame 50 is indirectly connected via the mask 48. Is allowed to come into contact with the mask support 52.

As shown in FIGS. 4 and 5, the mask support 52 is provided with a position adjusting device 70 with a pressing device and a fixing device 72. The position adjusting device 70 with the pressing device and the fixing device 72 are described in Japanese Patent Application No.
It has the same configuration as the position adjusting device with a pressing device and the fixing device described in the specification of Japanese Patent No. 59044, and is simply shown and described.

The position adjusting device 70 with a pressing device adjusts the position of the mask plate 18 with respect to the mask support 52 in the X-axis direction (a direction parallel to the transport direction of the printed wiring board 12).
A position adjusting device 74 with a pressing device for the axial direction and a position adjusting device 76 with a pressing device for the Y-axis direction that adjusts the position in the Y-axis direction perpendicular to the X-axis direction in the horizontal plane are included. The position adjusting device 74 with the X-axis direction pressing device includes an X-axis direction position adjusting device 78 and an X-axis direction pressing device 80. The X-axis direction position adjusting device 78 includes a position adjusting cylinder 82 constituted by an electric cylinder driven by a servomotor, and a head 86 serving as a positioning member.
6 and is positioned. The head 86 is moved in the X-axis direction by the position adjusting cylinder 82, so that the X
The position in the axial direction is automatically adjusted.

The X-axis direction pressing device 80 is provided to face the X-axis direction position adjusting device 78 in the X-axis direction, and includes a pressing cylinder 90 constituted by an air cylinder and a head 94 as a positioning member. ing. The air cylinder is a hydraulic actuator serving as a driving source, and is a type of a hydraulic cylinder. Other air cylinders provided in this mask printing machine will not be described one by one,
Is the same. The mask frame 18 is pressed against the head 86 by moving the head 94 by the pressing cylinder 90. Position adjusting device 76 with pressing device for Y-axis direction
Is provided with two sets of the Y-axis direction position adjusting device 96 and the Y-axis direction pressing device 98 each configured similarly to the X-axis direction position adjusting device 78 and the X-axis direction pressing device 80. In addition,
In FIG. 5, the illustration of the Y-axis direction pressing device 98 is omitted.

The fixing device 72 is, as shown in FIG.
It is provided with four sets of clamp units 102 (in FIG. 5, two sets of clamp units 102 are shown). These clamp units 102 are provided at positions substantially corresponding to the four corners of the mask frame 50 of the mask support table 52, and are a type of hydraulic actuator serving as a driving source, and are air cylinders 104 which are hydraulic cylinders. Not including the cam device and the clamp arm 106. The clamp arm 106 is moved by the air cylinder 104 and the cam device in a vertical direction, which is a direction perpendicular to the mask support 52, and the arm shaft 108
And a clamp position for positioning the mask frame 50 on the mask support table 52 by pressing the mask frame 50 against the mask support table 52, and separating from the mask frame 50 and retracting from the mask frame 50. Moved to a position. The mask support 52, the position adjusting device with a pressing device 70, and the fixing device 72 are used for the mask 4.
8, a mask positioning support device 20 capable of adjusting the position with respect to the printed wiring board 12 is formed. When the clamp arm 106 is vertically separated from the mask frame 50 in the vertical direction, the clamp arm 106 is disengaged from the mask frame 50 around the axis of the arm shaft 108, but in FIG. Clamp arm 10 in a state where 50 clamps are released
In order to clarify the vertical positional relationship between the mask arm 6 and the mask frame 50, a state where the clamp arm 106 is separated upward from the mask frame 50 and positioned above the mask frame 50 is shown.

The printing device 22 will be described. This printing device 2
2 has the same configuration as the mask printing apparatus described in Japanese Patent Application Laid-Open No. 9-39214, and will be briefly shown and described. As shown in FIG. 2, a pair of guide rails 120 are provided on the mask support table 52 at right angles to the wiring board transfer direction, which is the board transfer direction, and a slide 122 is movably fitted thereto. The slide 122 is fixed to the ball screw 124 and the slide 122 supported by the mask support 52 so as to be rotatable and immovable in the axial direction.
4 is guided by a guide rail 120 by a driving device 130 including a nut 126 screwed into the nut 4 and a printhead moving servomotor (not shown), and is perpendicular to the wiring board conveyance direction.
It is moved in the printing direction which is the axial direction. Slide 12
2. The driving device 130 constitutes the print head moving device 132, and the pair of guide rails 120 constitute the guide device.

On the slide 122, a print head 134
Are mounted so as to be able to move up and down and to be rotatable around an axis parallel to the wiring board transport direction. Print head 134
Is moved up and down by a print head elevating air cylinder 136 constituting a print head elevating device provided on the slide 122. As shown in FIG. 6, the print head 134 includes a contact load adjusting air cylinder 138, a rotating plate 140, and two load sensors 144 that constitute a contact load adjusting device.
And a print head elevating / lowering air cylinder 136 via a mounting member 146. The contact load adjusting air cylinder 138 is controlled based on the detection value of the load sensor 144, and the print head 134 is set to a predetermined load. Is brought into contact with the mask 48.

The print head 134 includes a solder container 150 serving as a printing material container. In the present embodiment, the container main body 152 of the solder container 150 is formed by assembling a plurality of members with each other.
It functions as 52. The container main body 152 includes a first plate member 154, a second plate member 156, and a closing plate 1 fixed to both end surfaces in the longitudinal direction of the first plate member 154.
58 (only the closing plate 158 fixed to one end face is shown in FIG. 6). These first and second plate-like members 154 and 156 are long in a direction perpendicular to the printing direction in a horizontal plane (a direction parallel to the width direction of the mask positioned and supported by the mask positioning and supporting device). The cream solder is accommodated in the solder accommodating chamber 160 which is constituted by the two plate members 154, 156 and the closing plate 158 and is long in the mask width direction. A discharge port forming member 162 made of rubber is detachably fixed to the first and second plate members 152 and 154, respectively.
Each of the discharge port forming members 162 has a plate shape, is long in the mask width direction, and forms a solder discharge port 164 as a printing agent discharge port in which lower edges of the pair of discharge port forming members 162 communicate with the solder storage chamber 160. ing.

The first plate member 154 and the second plate member 156
An extruding plate 170 serving as an extruding member is vertically sandwiched between them, that is, so as to be able to approach and separate from the solder discharge port 164. The pushing plate 170 is a kind of a fluid pressure actuator as a driving source held by the mounting member 146, and is detachably held by a piston rod 174 of an extrusion air cylinder 172 constituting a pushing member driving device. It is raised and lowered by the expansion and contraction of the rod 174. The pushing air cylinder 172 is a double-acting air cylinder. As shown in FIG. 6, two air chambers are connected to an air source 178 and the other to the atmosphere by switching an electromagnetic directional switching valve 176. A released state, a state in which one is open to the atmosphere and the other is in communication with an air source 178,
The individual air chambers are not communicated with either the air source 178 or the atmosphere, and the state is switched to a state where the pressure in the air chambers is maintained. The pressure of the air supplied to the air chamber on the upper side that moves the extrusion plate 170 toward the solder discharge port 164 is detected by the extrusion pressure sensor 180, and based on the detection result of the extrusion pressure sensor 180, the controller 182 ( FIG. 10) controls the switching of the electromagnetic directional switching valve 176. Thereby, the air pressure of the air chamber on the extrusion side is controlled to a height at which the extrusion plate 170 extrudes the cream solder in the solder storage chamber 160 at a preset extrusion pressure, and the cream solder is It is pushed in at a predetermined pushing pressure. The extruding plate 170, the extruding air cylinder 172, and the like constitute a solder extruding device 184 as a printing material extruding device. The push-out plate 170 and the push-out air cylinder 172 are push-in plates for pushing the cream solder into the through-holes 51 and are push-in air cylinders, and constitute a solder push-in device.

The mask cleaning device 24 will be described. The mask cleaning device 24 is configured in the same manner as the mask cleaning device described in Japanese Patent Application Laid-Open No. 9-39214, and will be simply illustrated and described. As shown in FIGS. 1 and 7, the mask cleaning device 24 includes a cleaning device 204 having a cleaning head 202 disposed on the lower surface of the mask 48, that is, on the wiring board contact surface 200 side with which the printed wiring board 12 is brought into contact. And a wiping device 210 having a wiping head 208 provided on the upper surface of the mask 48, that is, on the solder pressing surface 206 side which is the printing material pressing surface into which the cream solder is pressed into the through hole 51.

The cleaning device 204 has a pallet 212 which has a shallow container shape and is long in the mask width direction. Pallet 2
As shown in FIG. 2, two guide blocks 214 are provided at both ends in the longitudinal direction, and a pair of guide rails 216 provided on the lower surface of the mask support 52 in parallel with the printing direction. It is slidably fitted. The cleaning device 204 is movably provided below the mask support 52 (the mask 48), and the guide rail 2
Reference numeral 16 denotes a guide device. The mask support 52
A gap having a size that allows the cleaning head 202 to enter is provided in the vertical direction between the cleaning head 202 and the wiring board holding device, and the cleaning head 202 moves in this gap.

The cleaning head 202 is provided on the pallet 212 so as to be able to move up and down, and is moved up and down by an elevating device 218. The head body 222 of the cleaning head 202 includes:
As shown in FIG. 7, an ultrasonic vibrator 224, cleaning agent supply members 226, 228, and an air ejection member 232 of the cleaning sheet side drying device 230 are provided. Cleaning agent supply member 2
Reference numerals 26 and 228 form a longitudinal shape and are disposed in parallel with the mask width direction, and eject a cleaning agent supplied from a cleaning agent supply source (not shown) from a plurality of supply ports 234 and 236, respectively. The air injection member 232 has a cylindrical shape,
It is arranged in parallel with the mask width direction, is connected to an air supply source (not shown), and jets air upward, that is, toward the mask 48 from a slit (not shown).

On the ultrasonic vibrator 224 and the cleaning agent supply member 228, a cleaning sheet 244 is provided. The cleaning sheet 244 has the width of the mask 48 (more precisely,
It is formed of a porous and hygroscopic paper and has a width substantially equal to the width of the inner peripheral surface of the mask frame 50, and is wound around the supply shaft 246. The cleaning sheet 244 is pulled out from the supply shaft 246, passes under the cleaning agent supply member 226, and is placed on the ultrasonic vibrator 224 and the cleaning agent supply member 228. It is wound up by a winding shaft 248 passing between the members 232. The portion of the cleaning sheet 244 located at the cleaning position on the ultrasonic vibrator 224 and the cleaning agent supply member 228 is a cleaning surface for cleaning the wiring board contact surface 200.

The cleaning sheet 244 is brought into contact with and separated from the wiring board contact surface 200 of the mask 28 by moving the cleaning head 202 up and down by the elevating device 218. The lifting / lowering device 218 constitutes a contact / separation device. Further, the cleaning sheet 244 is provided on the head body 22.
The sheet is fed at a constant pitch by a cleaning sheet feeder (not shown) provided in the printer 2. These supply shaft 246 and winding shaft 2
48, ultrasonic vibrator 224, cleaning agent supply member 226,2
The cleaning head 202 includes the air jetting member 232, the cleaning sheet feeder, and the like.

The wiping device 210 will be described. Printing device 22
The slide 122 is provided with a lift 250 that can be raised and lowered, and is moved up and down by a lift (not shown). A supply shaft 252 is provided on the elevating table 250 so as to be rotatable around an axis parallel to the mask width direction, and a wiping sheet 254 is wound thereon. The wipe sheet 254 is the width of the mask 48 (more precisely, the width of the inner peripheral surface of the mask frame 50).
It is formed of a porous and hygroscopic paper having a width substantially equal to that of the paper, and is wound by the winding shaft 256. The wiping sheet 254 is fed at a constant pitch by a wiping sheet feeder (not shown). Wipe sheet 254
Further, the wiping sheet is pressed by the wiping sheet pressing member 258, and a wiping surface parallel to the mask 48 is formed on a part of the wiping sheet 254.

The elevating table 250 is also provided with a rubber scraping member 260 and an air jetting member 264 of the wiping sheet side drying device 262. The scraping member 260 and the air ejecting member 264 have a long shape, and are disposed in parallel with the mask width direction.

As described above, the lifting shaft 250 is provided with the supply shaft 25.
2, winding shaft 256, wiping sheet feeder, wiping sheet pressing member 258, scraping member 260, air jetting member 264
Are provided, and these constitute the wiping head 208. The wiping head 208 is provided on the slide 122,
It is arranged above the mask 48, and is moved in the same direction as the printing direction by the movement of the slide 122. Further, the wiping head 208 is moved up and down by elevating the elevating table 250, and the wiping sheet 254 is brought into contact with and separated from the mask 48. The elevating table 250 and the elevating table elevating device are wiping head elevating devices, and constitute a contact / separation device for a wiping sheet or the like.

The cleaning head 202 and the wiping head 20
8, etc., by the connecting device 270 schematically shown in FIG.
They are connected via the slide 122 and are moved integrally. The coupling device 270 is configured to couple the cleaning head 202 to the slide 122 and release the engagement with the mask support 52, release the connection with the slide 122, and engage the mask support 52. I have. The connection, engagement, and release are performed at a retracted position, which is a position of the mask support 52 that is separated from the mask 48.

The inspection device 26 will be described. Inspection device 26
Includes a slit light source 280 and a two-dimensional imaging device 282, as shown in FIG.
The cream solder printed on the printed wiring board 12 is inspected by moving to an arbitrary position in a direction parallel to the surface 49, which is the plate surface, and parallel to the horizontal plane. Therefore, as shown in FIG. 8, a pair of guide rails 21 for guiding the movement of the cleaning head 202 of the mask cleaning device 24 are provided.
6, the Y-axis slide 284 includes a plurality of guide blocks 28.
6 movably fitted. Guide rail 2
16 is shared by the mask cleaning device 24 and the inspection device 26.

A nut 288 is fixed to the Y-axis slide 284, and is screwed to a ball screw 290 provided on the mask support base 52 so as to be rotatable and immovable in the axial direction. When rotated by the Y-axis servo motor 292 (see FIG. 10), the Y-axis slide 284 is guided and moved by the guide rail 216. The guide rail 216 and the guide block 286 constitute a guide device, and the nut 28
8, the ball screw 290 and the Y-axis servo motor 292 constitute a Y-axis slide moving device 294.

On a vertical side surface of the Y-axis slide 284, a pair of guide rails 298 is provided in parallel with the X-axis direction, and the X-axis slide 300 is movably fitted. A nut (not shown) is fixed to the X-axis slide 300 and is screwed to a ball screw 302 provided on the Y-axis slide 284 so as to be rotatable around an axis parallel to the X-axis direction and immovable in the axial direction. When the ball screw 302 is rotated by the X-axis servo motor 304, the X-axis slide 300
8 to be moved in the X-axis direction. The guide rail 298 constitutes a guide device, and the nut, the ball screw 302, the X-axis servomotor 304, etc., which are not shown, constitute an X-axis slide moving device 306.

On the X-axis slide 300, a swinging air cylinder 310 as a rotating device is provided. The oscillating air cylinder 310 is provided in a vertical direction which is a direction perpendicular to the surface 49 of the printed wiring board 12, and the oscillating shaft 312 has a rotational position defined by a stopper (not shown). Rotated in degrees. The swing shaft 312 extends downward from the X-axis slide 300, and a holding body 314 is provided at an extending end thereof.
The holding body 314 includes a Y-axis slide moving device 294 and an X
The pivoting air cylinder 310 is moved to an arbitrary position in the horizontal plane by the shaft slide moving device 306.
By about 90 degrees around the vertical axis.

As shown in FIG. 9, the holder 314 is provided with the slit light source 280 and the two-dimensional image pickup device 282. In the present embodiment, the slit light source 280 is
Semiconductor laser device 322 and its semiconductor laser device 32
A beam expander 32 for expanding the diameter of a light beam emitted from the light source 2 and converting the light beam into a parallel light beam having a generally circular cross section.
4 and a slit plate 326 for converting the parallel light beam converted by the beam expander 324 into a flat slit light.
And emits a flat slit light. By exchanging the slit plate 326, various slit lights having different slit widths can be emitted. Another device that can emit slit light (a device constituted by one or a combination thereof such as a cylindrical lens or an aspherical lens is an example thereof) may be used.

In the present embodiment, the two-dimensional image pickup device 282 is constituted by a CCD camera for picking up an image on a plane. The CCD camera includes a CCD (charge-coupled device), which is a type of solid-state image sensor, and a lens system including an imaging lens. The CCD has a large number of minute light receiving elements arranged on one plane, and generates an electric signal according to the light receiving state of each light receiving element. An imaging surface 328 (see FIG. 14) is formed by the arrangement of a large number of light receiving elements. Imaging surface 3
28 is decomposed into pixels corresponding to a large number of light receiving elements, and image data is created for each pixel.

The holder 314 tilts the slit light source 280 and the two-dimensional imaging device 282 so that the optical axis of the slit light source 280 is inclined at an angle of, for example, 45 degrees with respect to a perpendicular to the horizontal surface 49 of the printed wiring board 12. And the two-dimensional imaging device 2
The optical axis 82 is held in a direction perpendicular to the surface 49, that is, in a direction parallel to a perpendicular to the surface 49, and at a relative position where the optical axes intersect with each other. The optical axis of the two-dimensional imaging device 282 is perpendicular to the surface 49, and the angle between the optical axis and the normal to the surface 49 is 0.
Degrees, the slit light source 280 and the two-dimensional imaging device 282
Are held by the holder 314 with their optical axes at different angles to the normal to the surface 49. Further, in the present embodiment, the holding body 314 is configured such that each optical axis of the slit light source 280 and the two-dimensional imaging device 282 is attached to the surface 49 of the printed wiring board 12 that is sucked by the wiring board support 40 located at the suction position. Is provided so as to intersect in the middle of the cut plane obtained by cutting the cream solder printed on the surface 49 at a cutting plane inclined at 45 degrees with respect to the front surface 49. The gaps in the height direction provided between the mask support 52 and the wiring board holding device are slit light sources 280 and 2
The slit light source 280 and the two-dimensional imaging device 282 have a size that allows the three-dimensional imaging device 282 to enter, and the printed wiring board 12 and the mask that are sucked by the wiring board support 40 located at the suction position for imaging. An image of the cream solder printed on the surface 49 of the printed wiring board 12 sucked by the wiring board support 40 located at the suction position is entered between the support board 52 and the suction board.

In the slit light source 280 and the two-dimensional imaging device 282, the holder 314
6, by being moved by the Y-axis slide moving device 294, it is moved to an arbitrary position in the horizontal plane,
The holding body 314 is rotated around the vertical axis by the swinging air cylinder 310, so that the holding body 314 is turned in a range of 90 degrees. The slit light source 280 and the two-dimensional imaging device 282 are both held by the holder 314, and are moved and rotated integrally by the movement and rotation of the holder 314. It does not change even in the turning position. Further, the slit light source 280 and the two-dimensional imaging device 282
Rotate, the vertical plane perpendicular to the surface 49 of the printed wiring board 12, which is a plane including those optical axes,
It is selectively located at two positions that are respectively parallel to the axial direction. The holding body 314 forms a holding device, and the X-axis slide 300, the X-axis slide moving device 306, the Y-axis slide 284, and the Y-axis slide moving device 294 form a holding body moving device 330 as a holding device moving device.

As described above, the movement of the Y-axis slide 284 is guided by the guide rail 216 for guiding the movement of the cleaning head 202, and
The 0 and two-dimensional imaging device 282 moves in the gap between the mask support base 52 and the wiring board holding device as in the case of the cleaning head 202. The cleaning head 202, the slit light source 280, and the two-dimensional imaging device 2
82 do not interfere with the imaging and cleaning of each other.

The reference mark image pickup device 28 for a wiring board and the reference mark image pickup device 29 for a mask (see FIG. 9) will be described. In the present embodiment, each of the imaging devices 28 and 29 is a CCD camera that obtains an image on a plane, and although not shown, an illumination device is provided together with each of the imaging devices 28 and 29. Reference mark imaging device 29 for mask
Is provided upward on the X-axis slide 300 toward the mask 48, and the wiring board reference mark imaging device 28 is provided downward on the printed wiring board 12.
The printed wiring board 12 and the mask 48 are each provided with a plurality of, in this embodiment, two, reference marks on a diagonal line. Is moved to the position of
The reference marks provided on the printed wiring board 12 and the mask 48 are respectively imaged. The holder moving device 330 also functions as the fiducial mark imaging device moving device. These fiducial mark imaging devices 28 and 29 are retracted to the retracted position together with the slit light source 280 and the two-dimensional imaging device 282. Further, the movement of the reference mark imaging devices 28 and 29
Similarly to the slit light source 280 and the two-dimensional imaging device 282, it is allowed by the gap between the mask support 52 and the wiring board pressing device. Note that the imaging devices 28 and 29
It may have a line sensor that obtains a line-shaped image every time it moves a certain distance.

The present mask printing machine is controlled by the control device 182. As shown in FIG. 10, the control device 182 has a PU (processing unit) 340, a ROM 3
42, RAM 344 and a bus 346 connecting them.
The main component is a computer 348 having
An input interface 350 is connected to the bus 346,
Various sensors such as the load sensor 144 and various imaging devices such as the two-dimensional imaging device 282 are connected. Bus 34
An output interface 356 is also connected to the controller 6 to control actuators constituting various devices such as the wiring board conveyor 14 via a drive circuit 358, as well as an alarm device 360 and a display device 362. ROM 34
2 stores various routines such as an inspection routine represented by a flowchart in FIG. Furthermore, RAM3
12, a two-dimensional image data memory 366, a three-dimensional image data memory 368, and an inspection result memory 370 are provided together with a working memory, as shown in FIG.

Next, the operation will be described. Printed wiring board 12
Prior to the start of cream solder printing, mask plate 1
8 is fixed to the mask support 52. At this time, the mask 4
The relative positions of the masks 8 with respect to the mask support 52 in the direction parallel to the plate surface are adjusted, whereby the position of the mask 48 with respect to the wiring board support elevating device 16 and, consequently, the printed wiring board 12 is adjusted. The relative position between the mask 48 and the wiring board supporting elevating device 16 is adjusted. This adjustment is performed by changing the reference marks provided on the printed wiring board 12 and the mask 48 to the reference mark imaging devices 28 and 2.
9 to obtain the relative displacement between the mask 48 and the printed wiring board 12, and move the mask plate 18 relative to the mask support 52 in a direction parallel to the plate surface of the mask 48 in order to eliminate the displacement. It is performed by moving. In the present embodiment, in principle, the position adjustment of the mask plate 18 is performed once for one mask plate 18, and the cream solder is applied to a plurality of printed wiring boards 12 using one mask plate 18. The application is performed on the first printed wiring board 12. The positioning holes provided in the printed wiring board 12 and the positioning pins to be fitted into the positioning holes are provided with an accuracy that enables a high positioning reproduction accuracy of the printed wiring board 12 to be obtained. For each of the printed wiring boards 12 to which the cream solder is applied, the reference mark provided on the printed wiring board 12 and the mask 48 is imaged, and the position of the mask 48 with respect to the printed wiring board 12 is determined for each printed wiring board 12. May be adjusted so that the relative positions of the two are adjusted. In this case, the accuracy of forming the positioning holes and the positioning pins may be lower than that in the case where the position of the mask 48 is adjusted for one of the plurality of printed wiring boards 12.

The relative positioning between the mask support 52 and the mask plate 18 is performed in the same manner as in the mask printing apparatus described in the specification of Japanese Patent Application No. 10-359044, and will be briefly described. At the time of alignment, the printed wiring board 12 is supported by the wiring board supporting elevating device 16 and is located at a position away from the mask plate 18. The printed wiring board 12 is positioned and sucked by the wiring board support 40, and the wiring board support 40 is at the suction position, and the printed wiring board 12 is lifted from the wiring board conveyor 14 and separated from the mask plate 18. -ing Then, the mask support table 5 is
The mask plate 18 placed on the ball unit 2 via the balls 64 of the ball unit 60 has been released from being fixed by the fixing device 72, but is pressed by the X-axis direction pressing device 80 and the Y-axis direction pressing device 98, It is located at the position determined by the axial position adjusting device 78 and the Y-axis position adjusting device 96.

In this state, the reference mark image pickup devices 28 and 29
Is moved by the holder moving device 330 and is caused to enter between the printed wiring board 12 and the mask plate 18, and the reference mark provided on the printed wiring board 12 and the reference mark provided on the mask 48, respectively. Is imaged. Then, the amount of misalignment of the mask plate 18 with respect to the printed wiring board 12 is calculated based on the imaging data, and the amount of misalignment of the mask plate 18 with respect to the printed wiring board 12 is calculated.
Positions for fixing to the mask support 52, that is, an X-axis position adjusting device 78 and a Y-axis position adjusting device 96
Is used to calculate the positioning position of the mask plate 18.

Then, the head 86 of the X-axis direction position adjusting device 78 and the Y-axis direction position adjusting device 96 positions the mask plate 18 with respect to the wiring board supporting elevating device 16 without displacement with respect to the printed wiring board 12. Moved to position. X-axis pressing device 80 and Y-axis pressing device 9
8, the mask plate 18 is kept pressed, and the mask plate 18 is moved by the position adjustment by the X-axis direction position adjusting device 78 and the Y-axis direction position adjusting device 96, and the relative position of the mask plate 18 with respect to the mask support 52 is adjusted. Is done. When the position of the mask plate 18 is adjusted, the fixing of the mask plate 18 by the fixing device is released, and the mask plate 18 rests on the ball 64, and can be moved lightly. After the position adjustment, the mask plate 18 is fixed to the mask support 52 by a fixing device. At this time, the ball 64 is attached to the unit case 60.
And allows the mask plate 18 to be fixed to the mask support 52.

At the time of mask printing, the cleaning head 202 of the mask cleaning device 24 is disconnected from the wiping head 208 and is locked on the mask support 52. Cleaning head 2
02 is in the retracted position. Also, the cleaning head 20
2 is at the lower end position, the wiping head 208 is at the upper end position, and the cleaning sheet 244 and the wiping sheet 254 are separated from the mask 48, respectively, and do not hinder printing. Further, the wiring board reference mark imaging device 28, the mask reference mark imaging device 29, the slit light source 280, and the two-dimensional imaging device 282 are retracted to the retracted positions, and do not hinder printing.

At the time of mask printing, the printed wiring board 12 conveyed by the wiring board conveyor 14 is stopped on the wiring board support table 40 by the stopper device. Next, after the wiring board holding member of the wiring board holding device is moved above the printed wiring board 12,
Is raised, the printed wiring board 12 is positioned by the positioning device, and is lifted from the fixed rail 30, the movable rail 32, and the belt of the wiring board conveyor 14. When the wiring board support 40 presses the printed wiring board 12 against the wiring board holding member, a negative pressure is supplied to the wiring board support 40 to attract the printed wiring board 12.

After the wiring board support 40 has sucked the printed wiring board 12, the wiring board support 40 is lowered a small distance to be separated from the wiring board holding member, and after the wiring board holding member is retracted, The printed wiring board 12 is further raised by the wiring board support 40 and is brought into contact with the wiring board contact surface 200 of the mask 48. Next, the print head 13
4 is lowered by the air cylinder 136 for raising and lowering the print head, and after moving to the lower end position, further lowered by the air cylinder 138 for adjusting the contact load. Contacted.

When lowering the print head 134 so that the discharge port forming member 162 contacts the mask 48, the control device 182 controls the contact load adjusting air cylinder 138 based on the contact load of the discharge port forming member 162 to the mask 48. Then, the discharge port forming member 162 is brought into contact with the mask 48 with a set load. After the contact, the extrusion plate 170 is lowered, and an extrusion pressure is applied to the cream solder. However, since the solder discharge port 164 of the solder container 150 is closed by the mask 48, the cream solder is not discharged and is appropriately pressed. When the print head 134 is moved along the mask 48 by the print head moving device 132 in this state, the cream solder in the solder storage chamber 160 is discharged by the discharge port forming member 162 located downstream in the printing direction. The solder outlet 160 is prevented from flowing out, and is scraped off from the upper surface of the mask 48 by the discharge port forming member 162 located on the upstream side. To move. Then, the solder discharge port 164 is connected to the through hole 5 of the mask 48.
1, the corresponding cream solder is pushed into the through hole 51, and the excess cream solder is scraped off by the discharge port forming member 162 located on the upstream side, and
Fill one full. The print head 134 is a pressurized print head or a pressurized coating head that presses the contained cream solder to fill the through-holes 51, adheres it to the printing target material, and applies it.
The step of mask printing cream solder is a printing step.

The extrusion plate 170 is lowered as the cream solder is extruded, and the pressure of the air chamber on the extrusion side of the extrusion air cylinder 172 is detected by an extrusion pressure sensor 180.
The air pressure is controlled so that the cream solder is extruded at a preset pressure, so that even when the cream solder decreases, the cream solder is always extruded at the set extrusion pressure, and the set indentation pressure is applied. As a result, the cream solder is pushed into the through-hole 51 and the surface 4 of the printed wiring board 12 is pressed.
9 print spots. After printing of one printed wiring board 12 is completed, the print head 134 is once raised to separate the ejection port forming member 162 from the mask 48. In addition, the inspection routine shown in the flowchart of FIG. 11 is executed, and the inspection device 26 inspects the cream solder printed on the printed wiring board 12.

In step 1 of the inspection routine (hereinafter abbreviated as S1; the same applies to other steps), the wiring board support 40 is lowered, and the printed wiring board 12 is lowered to be separated from the mask 48. Let me do.
The wiring board support 40 is lowered to a position where the printed wiring board 12 is pressed against and sucked by the wiring board holding member, and a slit light source 280 and a two-dimensional imaging device 282 are provided between the printed wiring board 12 and the mask support 52. Is provided. The wiring board support 40 is the printed wiring board 1
2 remains adsorbed. When the wiring board support 40 is lowered to the suction position, the positioning pins of the positioning device fit into the positioning holes of the printed wiring board 12.
Or, if not, the printed wiring board 12 pushes down against the urging force of the urging device.

After the printed wiring board 12 is separated from the mask 48, S2 is executed, and the inspection is performed by the inspection device 26. Therefore, the holding body 314 is moved by the holding body moving device 330, and the slit light source 280 and the two-dimensional imaging device 282 enter between the printed wiring board 12 and the mask 48, so that one plane of the printed wiring board 12 is formed. Of the cream solder 380 (see FIG. 9) printed on the surface 49 of FIG. The inspection is performed by separating the printed wiring board 12 and the mask 48 in a direction perpendicular to the board surface, but without relatively moving the printed wiring board 12 in a direction parallel to the board surface. At this time, the cleaning head 202 is at the retracted position and does not hinder the inspection.

As described above, in the present embodiment, the through-hole 51 provided in the mask 48 has a rectangular cross section parallel to the plate surface of the mask 48, and the cream solder 380 printed on the front surface 49 is shown in FIG. As shown in FIG. 13, the convex portion protrudes from the surface 49 and has a three-dimensional shape of a rectangular parallelepiped (including a cubic shape). Are parallel to the Y-axis direction.

The cream solder is printed on a plurality of printing spots on the front surface 49. In the present embodiment, a part of all the printed cream solder 380 is inspected. For example, the cream solder 380 that may cause trouble if any printing failure occurs, for example, the cream solder 38 applied at a very small pitch, where the lead wire of the flat package type electric component is joined.
All zeros are checked. The cream solder 380 printed on the other printing spots, which is applied to the pad to which the lead solderless lead-free electrical component having no lead wire is not hindered even if some printing failure occurs. With respect to the cream solder 380, a different cream solder 380 is sampled and inspected for each printed wiring board 12. If a part of the cream solder 380 is inspected in this way, it is possible to effectively prevent the occurrence of a defective printed circuit board due to a printing defect while keeping the inspection time short. If the inspection time can be extended, all the printed cream solder 380 can be used.
May be inspected, or the inspection may be performed on all of the cream solder 380 that does not hinder even if some printing failure occurs. Alternatively, the inspection does not have to be performed on all of the cream solder 380 that does not hinder even if some printing failure occurs.

A part of these cream solders 380 is irradiated with slit light by a slit light source 280 and is imaged by a two-dimensional image pickup device 282. At the time of imaging, the holder 3
8 is moved by the holder moving device 330 shown in FIG. 8, so that the slit light source 280 and the two-dimensional
The printed cream solder 380 as an imaging target is moved along a predetermined movement path.
In the present embodiment, the movement path is parallel to the surface 49 of the printed wiring board 12 and has a rectangular parallelepiped cream solder 38.
0 is a straight path parallel to the longitudinal direction. At this time, the holding body 314 is rotated by the swinging air cylinder 310, and the slit light source 280 and the two-dimensional imaging device 282
As shown in FIG. 13, the plane including the respective optical axes is parallel to the longitudinal direction and the movement path of the cream solder 380.

As described above, the slit light sources 280 and 2
When the two-dimensional imaging device 282 is moved with respect to the cream solder 380, the two-dimensional imaging device 282 captures an image of the cream solder 380 illuminated by the slit light without stopping the movement. Imaging is performed a plurality of times at fixed time intervals to obtain a plurality of two-dimensional images. By imaging, 2
On the imaging surface 328 of the two-dimensional imaging device 282, as shown by a solid line in FIG. 14, respective images 382 and 384 of the surface 49 of the printed wiring board 12 and the portion of the cream solder 380 irradiated with the slit light are formed. Due to the rise from the surface 49 of the cream solder 380, the image 382 of the portion of the surface 49 irradiated with the slit light is different from the image 384 of the portion of the upper surface of the cream solder 380 irradiated with the slit light on the imaging surface 328. Further, the slit light source 280 and the two-dimensional imaging device 282 irradiate the cream solder 380 with slit light in a state where the plane including the optical axis thereof is parallel to the longitudinal direction of the cream solder 380 to capture an image. Therefore, the cut surface obtained by cutting the cream solder 380 at a right angle to the longitudinal direction thereof and at a cut surface inclined at 45 degrees to the surface 49 of the printed wiring board 12 is viewed from a direction inclined at 45 degrees to the cut surface. A two-dimensional image (strictly speaking, only the image of the cream solder 380 and the upper surface of the printed wiring board 12 of the two-dimensional image) is obtained.

The slit light source 280 and the two-dimensional imaging device 28
2 is constant, and their movement paths are parallel to the surface 49 of the printed wiring board 12, so that the image 38 of the printed wiring board 12
2 is formed at substantially the same position on the imaging surface 328. Also,
The cream solder 380 is supposed to be originally printed in a rectangular parallelepiped shape, and if printed normally, the height is uniform. The image 384 of the cream solder 380 is also located at substantially the same position on the imaging surface 328, and It is formed at substantially the same relative position to the image 382 of the wiring board 12. Even if the height of the cream solder 380 is not uniform, an image 384 is formed near the image forming position when printing is normally performed as shown by a dashed line and a two-dot chain line in FIG. Never. Therefore, a portion of the imaging surface 328 that needs to be processed is limited, and there is no need to perform data transfer and image processing on the entire imaging surface 328. Therefore, the data transfer amount and the image processing amount are reduced, and the data transfer and image processing are reduced. The time required for image processing can be reduced.

This point will be described in more detail. First, the outline of the image processing will be described. Two-dimensional imaging device 282
FIG. 15 is a functional block diagram showing a part of the image processing apparatus which performs image processing of the control device 182 and a part of processing image data from the two-dimensional imaging device 282.
It is. In this figure, an inspection camera 402, which is a camera of the two-dimensional imaging device 282, has a printed wiring board 1
2 is shown together with a reference mark camera 404 which is a camera of the reference mark image pickup device 28 that images the second reference mark. These cameras 402 and 404 are connected to the image capturing unit 40.
6 are shared. The image capturing unit 406 includes a computer configured separately from the computer 348 provided on the main unit side of the mask printing machine.
4 is transferred to a main image processing unit 410, which is an image processing unit of the computer 348. The image capturing unit 406 includes a light cutting processing unit 408 that performs light cutting processing of the two-dimensional imaging device 282, and includes a main image processing unit 410.
Information on the number of scans (number of times of imaging) and scan pitch (moving distance for each image) supplied from the computer, and a trigger signal of a capture timing supplied from the drive circuit 358 of the Y-axis servomotor 292 and the X-axis servomotor 304 Based on the above, image data is captured from the inspection camera 402 and stored in the image capturing memory 414.

The image capturing section 406 is a part of the main image processing section 4 of the image data stored in the image capturing memory 414.
It has a function of determining image data to be transferred to. As shown in FIG. 16, when the cream solder 380 applied to the printed wiring board 12 is irradiated with the slit light from the slit light source 280, the portion illuminated by the slit light becomes bright, and the other portions become dark. This bright and dark image is captured by the inspection camera 402,
As described above, the image of the portion illuminated by the slit light is formed in a limited area of the imaging area of the inspection camera 402. Therefore, the image capturing unit 406 determines a region that is predetermined as a region where an image of a portion illuminated by the slit light is likely to be formed, such as a region between two dashed lines in FIG. Only the following processing is performed. Therefore, the processing amount is about a fraction of the processing amount in the case where the processing is performed for the entire area, and the time required for the processing is reduced.

As shown in FIG. 16, when a plurality of cream solders 380 are irradiated with slit light, as shown in FIG.
A plurality of images 382, 384 of the portion illuminated by the slit light of 0 are obtained, and a portion corresponding to one cream solder 380 is taken out of FIG.
Is shown conceptually. In FIG. 18, a large number of small squares are areas corresponding to one light receiving element in the CCD of the inspection camera 402, and are called pixels. Assuming that image data is represented by data of 256 levels of brightness,
As described above, the image data of the pixel illuminated by the slit light has a large value, and the other image data has a small value. Therefore, in FIG. 18, in each pixel row vertically arranged which is a direction orthogonal to the longitudinal direction of the portion illuminated by the slit light, position data indicating the position of the pixel with the largest image data (CCD is 102
In the case of having a 4 × 1024 light receiving element,
4 bytes of data, and a fixed number (10 pixels in the illustrated example) of image data (10 pixels in the illustrated example) continuously arranged in the vertical direction with the pixel as the center. ) Is transferred from the image capturing unit 406 to the main image processing unit 410 for each pixel column. In FIG. 18, image data in an area described as a transfer area is transferred. The total amount of data transferred in this manner is 1024 times 14 bytes, which is about 14 kilobytes. When transferring 1-byte image data obtained by all of the 1024 × 1024 light receiving elements, about 1 megabyte of data needs to be transferred, so that the transfer data amount is about 1/70. Become.

The data acquired as described above is for one imaging, and the imaging is performed by the main image processing unit 41 as described above.
Based on the information supplied from 0, imaging is performed repeatedly at a specified scan pitch for a specified number of scans, and the resulting data is transferred to the main image processing unit 410. The main image processing unit 410 stores the transferred image data in the image processing memory 416. Image processing memory 4
Numeral 16 is configured as a part of the above-described RAM 344 (see FIG. 12) and includes a two-dimensional image data memory 366, a three-dimensional image data memory 368, an inspection result memory 370, and the like. Store it. Then, the main image processing unit 410 performs image processing based on the image data stored in the two-dimensional image data memory 366, and the volume, the applied area, and the average of the cream solder 380 applied to the surface 49 of the printed wiring board 12. Obtain information such as the height and the presence or absence of a bridge.

In a part of the image represented by the data obtained by one imaging as exemplified in FIG. 18, the edge of the bright area represents the outline of the image of the part illuminated by the slit light. However, in the present embodiment, this edge acquisition is performed in units of sub-pixels each having a length of 1/8 of one side of one pixel as one side. For example, in FIG. 18, the upper and lower edges e2 and e1 of the image 382 of the portion of the printed wiring board 12 illuminated by the slit light
Is obtained, the edge is determined by a method in which the peak of the differential value of the image data of each pixel row arranged in the vertical direction is set as the edge, and the position of the edge is determined in sub-pixel units. Since this process is a general process, a detailed description is omitted.

If the upper and lower edges e2 and e1 of the images 382 and 384 of the portion illuminated by the slit light are obtained as described above, the center positions of the upper and lower edges are determined by the portions illuminated by the slit light. 18 are obtained as the positions of the images 382 and 384, and the data at that position is associated with the data at the position of the pixel in the horizontal direction in FIG. 18 and the three-dimensional image data memory 368 ( FIG. 12). For example, as conceptually shown in FIG. 19, if the center positions of the upper and lower edges of the images 382 and 384 of the portion illuminated by the slit light are represented by thick solid lines (in FIG. 19, For ease of illustration, both the vertical position and the horizontal position are shown in units of pixels, but in practice, the vertical position is obtained in units of sub-pixels as described above), As shown in FIG. 20, each position in the vertical direction is associated with each position in the horizontal direction expressed in pixel units, and data obtained by one imaging is stored in the image processing memory 410 as one-line numerical data. It is stored. Considering a state in which data obtained by a predetermined number of times of imaging are arranged vertically, as shown in FIG.
It becomes data of a dimensional matrix. As is clear from the figure, the region with a small numerical value represents the image 382 of the portion of the printed wiring board 16 illuminated by the slit light, and the region with a large numerical value represents the image 384 of the portion illuminated by the slit light of the cream solder 380. Represent. Here, the position of the image of the printed wiring board 12 in the vertical direction and the cream solder 3
The difference from the vertical position of the image 80 is the distance in the direction parallel to the surface 49 of the printed wiring board 12 in both portions.
9, the distance in the direction parallel to the surface 49 of the printed wiring board 12 is equal to the distance in the direction perpendicular to the surface 49, that is, the height of the cream solder 380. equal.

The main image processing section 410 performs the following calculation based on the matrix data of FIG. 21 obtained as described above. (1) Cream Solder Application Area A value larger than a numerical value of an area representing the image 382 of the printed wiring board 16 by a predetermined constant value is set as a reference value, and a unit area having a value larger than the reference value (one side of a pixel) It is considered that the cream solder is applied to one side (a rectangular area equal to one side in the horizontal direction and the other side is equal to the scan pitch), and the number of such unit areas is multiplied by the area of the unit area to obtain cream solder 380. Get the application area. (2) Height of cream solder The difference between each value in the unit area considered to be applied with the cream solder and the average value smaller than the reference value is acquired as the height of the cream solder in each unit area. I do. Since the unit of the value obtained in this way is a sub-pixel, the actual height of the cream solder 380 for each unit area is obtained by multiplying the size of one side of the sub-pixel (one side in the vertical direction). (3) Volume of cream solder The sum of the heights of the cream solder in each unit area obtained as described above is obtained, and the sum is multiplied by the area of one unit area to obtain the volume of the cream solder. (4) Bridge The data of the two-dimensional matrix is regarded as two-dimensional image data, the data of the height of each unit area is regarded as gray data of brightness, and normal image processing is performed. 380 contour lines are obtained.

Various data on the cream solder 380 obtained as described above are stored in the three-dimensional image data memory 368 of the image processing memory 416. Then, these various three-dimensional data and regular data, that is, the application area and volume of the cream solder 380 when the solder is printed without excess or shortage, and the cream solder 380 in each unit area.
The value related to the amount of application, such as the height of the solder, is compared with a standard value to determine whether the amount of application is excessive or insufficient. Thus, it is determined whether the application position is appropriate or inappropriate and whether or not a bridge exists. Insufficient amount of cream solder
Although there is no defect in the print shape in a plan view of 80, there is a shortage due to a lack of at least a part of the height and a shortage due to a lack of at least a part of the print shape in a plan view. The inspection result, that is, the presence / absence of the defect and the type of the defect are stored in the inspection result memory 370 of the image processing memory 416.
Is stored in The inspection process is a process in which the printed wiring board 12 is separated from the mask 48 and the printed cream solder 380 is inspected in the printing process.

If the inspection has been performed, S3 is executed next to determine whether there is a printing failure. If there is no printing failure, the determination result in S3 is NO, and S11 is executed, and the normal printing information is output. Based on this output, the printed wiring board 12 on which the cream solder has been printed is carried out, and then the printed wiring board 1 on which the cream solder is printed.
2 are carried in, printed, and the like. When the printed wiring board 12 is carried out, the suction of the printed wiring board 12 is released by the wiring board support table 40 in a state where the wiring board support table 40 is located at the suction position. The printed wiring board 12 is lowered and the wiring board conveyor 1
4 and carried out by the wiring board conveyor 14.

On the other hand, if there is a printing failure, the determination result in S3 becomes YES and S4 is executed to determine whether or not the type of failure is insufficient in quantity. If the type of defect is misalignment or an excessive amount, the determination result of S4 is N
In S, S10 is executed, the operation of the mask printing machine is stopped, and the alarm device 360 and the display device 362 notify the operator of the occurrence of printing failure. The operator investigates the cause of the defect based on the notification and eliminates the cause.

If the type of the defect is insufficient, the result of the determination in S4 is YES, the step S5 is executed, and the mask 48 is automatically cleaned by the mask cleaning device 24. One of the causes of the shortage is considered to be clogging of the through-hole 51. Therefore, the mask 48 is cleaned to remove cream solder attached to the through-hole 51. This step is a cleaning step. is there.

When cleaning the mask 48, the cleaning head 20
In the retracted position where the slide 2 is retracted, the cleaning head 202 is disconnected from the mask support 52 and slide 1 is moved.
22 and the wiping head 2 in the mask cleaning direction.
08 and move integrally. The reference mark imaging devices 28 and 29, the slit light source 280, and the two-dimensional imaging device 282 are at the retracted positions and do not hinder cleaning. Further, the printed wiring board 12 is separated from the mask 48, allows the cleaning head 202 to enter the space between the mask 48, and does not hinder the cleaning. Next, the cleaning sheet 244 and the wiping sheet 254 are fed, the dirty surface is wound up by the previous cleaning, and the clean surface is positioned at the cleaning position and the wiping position. The cleaning head 202
In, the cleaning agent is supplied to the cleaning agent supply member 226 at the time of feeding, and is absorbed into the cleaning sheet 244.

After the feeding, the cleaning head 202 is raised and the wiping head 208 is lowered, and the cleaning sheet 244 and the wiping sheet 254 are brought into contact with the wiring board contact surface 200 and the solder pushing surface 206 of the mask 48, respectively. Then, the mask 48 is sandwiched. After the contact, the cleaning agent supply member 22
6, 228 is supplied with the cleaning agent, the entire cleaning sheet 244 is kept in a state of holding the sufficient cleaning agent, and air is supplied to the air ejecting member 264, and the ultrasonic vibrator 224 is vibrated. In this state, the slide 122 is moved by the driving device 130, and the cleaning head 202,
The wiping head 208 is moved integrally along the mask 48. The print head moving device 132 also serves as a cleaning head / wiping head moving device. Note that the cleaning agent that has been absorbed and lost by the cleaning sheet 244 has been dropped by the pallet 212.

The cleaning sheet 244 is brought into contact with the wiring board contact surface 200, and is moved while being vibrated by the ultrasonic vibrator 224. Wiring board contact surface 200
And is separated from the inner peripheral surface of the through-hole and diffused into the cleaning agent, and is absorbed and removed by bubbles and fibers inside the cleaning sheet 244.

The cleaning agent held on the cleaning sheet 244 is
The kinetic energy is given by the vibration, and the kinetic energy is moved to the inside of the through hole of the mask 48 or the side of the mask 48 opposite to the side where the cleaning sheet 244 is brought into contact. Therefore, the cream solder adhered to the solder pressing surface 206 is scraped off by the scraping member 260 before being wiped by the wiping sheet 254, and the mask 48 is
4 causes the solder pushing surface 20 to be vibrated.
6 and spread into the cleaning agent and wipe sheet 2
Wipe off by 54. It is absorbed into the air bubbles and fibers inside the wiping sheet 254. Further, the cream solder attached to the inner peripheral surface of the through hole 51 of the mask 48 also diffuses into the cleaning agent and is wiped off by the wiping sheet 254. The solder pressing surface 206 is wetted by the cleaning agent, but is dried by the air jetted from the air jetting member 264 of the wiping head 208.

Cleaning head 202 and wiping head 208
Is moved to the other end of the mask 48, the supply of the cleaning agent to the cleaning agent supply members 226, 228 is stopped, the vibration of the ultrasonic vibrator 224 is stopped, and the air supply member 264 is stopped. After the supply of air is shut off and the cleaning sheet 244 and the wiping sheet 254 are separated from the mask 48, the cleaning head 202 and the wiping head 208
Is returned to the cleaning start position, that is, the retracted position that was retracted before the cleaning. During this time, air is jetted from the air jetting member 232 of the cleaning head 202, and the wiring board contact surface 200 is dried. After returning to the cleaning start position, the connection between the cleaning head 202 and the wiping head 208 is released, and the cleaning head 202 is locked to the mask support 52 so as to be located at the retracted position during mask printing. You.

After the cleaning of the mask 48 is completed, S6 is executed, and the printed wiring board 12 on which the printing failure has been detected is again applied.
Cream solder is printed. Therefore, the wiring board support 4
0 is raised and the printed wiring board 12 is brought into contact with the mask 48, and then the print head 134 is moved along the mask 48 to remove the cream solder from the printed wiring board 12.
Print on The mask 48 is a mask positioning support device 20
The printed wiring board 12 is lowered for inspection and separated from the mask 48 after printing, but is still adsorbed by the wiring board support table 40, The positions of the printed wiring board 12 and the mask 48 in the direction parallel to their plate surfaces are not shifted, and after the inspection, the printed wiring board 12 and the mask 48 are raised and the mask 4
8 when contacting the wiring board contact surface 200
The cream solder 380 printed on 9 enters the through hole 51 of the mask 48 without displacement.

Reprinting is performed in the same manner as the first printing.
Mask printing is performed on the entire printed wiring board 18.
It is made smaller than at the time of the first printing, and the pressing pressure is made smaller than at the time of the first printing. Since the cream solder 380 has already been printed on the printed wiring board 12, the amount of the cream solder pushed into the through-holes 51 is likely to be excessive unless the extrusion pressure is reduced, and the cream solder printed on the printed wiring board 12 is likely to be excessive. This is because the amount of 380 tends to be excessive. The process of loosening the conditions for pushing the mask 48 of the cream solder into the through-holes 51 and performing mask printing again on the entire printed wiring board 18 is a reprinting process as a correction printing process. After printing is completed, S7 is executed, and the printed wiring board 12 is lowered to be separated from the mask 48. The printed wiring board 12 is mounted on the wiring board support 40 as in S1.
Is lowered to a position where the printed wiring board 12 is sucked. The printed wiring board 12 is still attracted to the wiring board support 40. After the separation, S8 is executed, and the cream solder reprinted on the printed wiring board 12 is inspected.
This inspection is performed as in S2.

After the inspection is completed, S9 is executed to determine whether or not there is a printing failure. If there is printing failure, S
The result of the determination in step 9 is YES, the step S10 is executed, the operation of the mask printing machine is stopped, and the occurrence of a printing failure is reported to the operator. If there is no printing failure, S9
Is NO, and S11 is executed.

As is clear from the above description, in the present embodiment, the printed wiring board 12 and the printed wiring board 12 are based on the imaging data of the wiring board reference mark imaging device 28 and the mask reference mark imaging device 29 of the control device 182. Mask 48
The portion for calculating the relative position shift with respect to the image forming device constitutes a position shift obtaining device, and the imaging devices 28 and 29 together with the position adjusting device with a pressing device 70 form a relative position adjusting device.
The part of the control device 182 that executes S6 constitutes a reprint command device, and constitutes a modified printing device together with the printing device 22. Further, the portion of the control device 182 that executes S5 constitutes a cleaning command device, and the portion that makes the extrusion pressure of the cream solder by the extruding plate 170 smaller during reprinting of the control device 182 than in the first printing and the solder extrusion device 184. Constitute a printing condition relaxing apparatus.

In the above embodiment, the inspection device 26
Although provided at the same location as the printing device 22 in a direction parallel to the plate surface of the mask 48, it may be provided at a different location. An example will be described with reference to FIG. In the present embodiment, the inspection device is provided on the downstream side of the printing device in the wiring board transport direction and above the carry-out conveyor. The inspection device is provided at a position separated from the printing device in a direction parallel to the plate surface of the mask, and although not shown, the movement of the printed wiring board by the unloading conveyor is inspected by the inspection device. A stopper device for stopping at the inspection position is provided. The stopper device has a stopper member that moves to an operation position for stopping the movement of the printed wiring board and a non-operation position for allowing the movement. Although not shown, the inspection device is configured in the same manner as the inspection device 26. When the holder is moved by the holder moving device, the slit light source and the two-dimensional imaging device are placed on the surface of the printed wiring board. It is moved to an arbitrary position in a horizontal plane which is a parallel plane. Slit light source and 2
The two-dimensional imaging device is held by a holding body similarly to the slit light source 280 and the two-dimensional imaging device 282. In the present embodiment, each optical axis is printed on the surface of a printed wiring board supported by a wiring board conveyor. The held cream solder is held so as to intersect in the middle of the cut plane obtained by cutting the cut solder at a cut plane inclined at 45 degrees to the surface. The wiring board reference mark image pickup device and the mask reference mark image pickup device are provided in the same place as the printing device as in the above embodiment. It is provided separately from the inspection device, and is moved to an arbitrary position in the horizontal plane in the gap between the printed wiring board and the mask by the reference mark imaging device moving device different from the holder moving device. , The reference mark is imaged. The configuration of the reference mark imaging device moving device is the same as that of the holder moving device 330.

The transfer device includes a wiring board conveyor, a carry-in conveyor, and a carry-out conveyor similar to the wiring board conveyor 14, the carry-in conveyor 34, and the carry-out conveyor 36, and is a belt conveyor, and the printed wiring board is placed on a belt. And is conveyed by the rotation of the belt. for that reason,
The belt driving device moves each belt in both forward and reverse directions, so that each printed circuit board conveyor, carry-in conveyor and carry-out conveyor moves the printed circuit board in the original carrying direction, that is, the direction opposite to the direction from the carry-in conveyor to the carry-out conveyor. Can be transported. The transport board conveyor is provided with a stopper device for stopping the printed wiring board that has been transported in the original transport direction, and the printed wiring board that has been transported in the opposite direction is fixed to the wiring board support base. A stopper device for stopping above is provided.
The stopper device has a stopper member that moves to an operation position where the movement of the printed wiring board 12 is stopped and a non-operation position where the movement is allowed.

The inspection of the cream solder printed on the printed wiring board will be described with reference to the inspection routine shown in the flowchart of FIG. The inspection routine is executed after printing is completed. First, the printed wiring board is lowered by execution of S21 and separated from the mask. The printed wiring board is lowered by the wiring board support elevating device, separated from the mask, and after the suction by the wiring board support at the suction position is released, the wiring board support is lowered to the lower end position. Is placed on the belt of the wiring board conveyor. Next, S22 is executed, the wiring board conveyor and the unloading conveyor are operated, and the printed wiring board is transported to the inspection position.

If the printed wiring board has been transported to the inspection position and stopped by the stopper, S23 to S2
6 is executed in the same manner as S2 to S5. Inspection, the printed wiring board, two-dimensional imaging device and slit light source,
The printed wiring board is relatively moved in a direction parallel to the surface of the printed wiring board, and is performed in a state where no mask exists above the printed wiring board. This step is an inspection step.
The printed wiring board is stopped at the inspection position by the stopper. After the stop, the reference mark provided on the printed wiring board is imaged before the inspection. This imaging is performed by a two-dimensional imaging device that images the cream solder. The fiducial mark is illuminated by the slit light emitted from the slit light source, the slit light source and the two-dimensional imaging device are moved with respect to the fiducial mark, and each of the two fiducial marks is imaged. The displacement of the printed wiring board is calculated based on the image data, and the slit light source for imaging the cream solder and the moving distance in the X-axis direction and the Y-axis direction of the two-dimensional imaging device are set in advance based on the calculated position. It is corrected so that an image can be taken along the traveled path.

If there is no printing failure as a result of the inspection, S36
Is executed, and the normal printing is output, whereby the printed wiring board is carried out of the inspection position. On the other hand, if there is a printing failure and the amount of printed cream solder is insufficient, the mask is cleaned (S26), and after the cleaning is completed, S2 is performed.
Step 7 is executed, and the printed wiring board is returned to the printing apparatus.
The belts of the carry-out conveyor and the wiring board conveyor are rotated around in the opposite direction to the time when the printed wiring board is carried out, and the printed wiring board is returned to the printing position where the cream solder is printed by the printing device. The printed wiring board is stopped by the stopper device at a printing position, that is, a position just above the wiring board support. After the return, S28 is executed, the printed wiring board is positioned by the positioning device, and is lifted from the wiring board conveyor by the wiring board support and is sucked.

Then, step S29 is executed, and the mask and the printed wiring board are repositioned. At the time of this repositioning, the wiring board support is in the suction position, and as described in the above embodiment, first, the printed wiring board and the mask are moved by the wiring board reference mark imaging device and the mask reference mark imaging device. Are taken, and the positional deviation between the two is acquired.
Then, the fixing of the mask by the fixing device is released, and the respective positions of the mask in the X-axis direction and the Y-axis direction are adjusted by the position adjusting device with the pressing device.
The mask is fixed to the mask support by the fixing device.

After the re-positioning, S30 and S31 are replaced with S
6, S7, and the cream solder is printed again on the entire printed wiring board. This step is a reprinting step, and the step of adjusting the relative positions of the printed wiring board and the mask in a direction parallel to their plate surfaces before the reprinting step is the repositioning step. After the cream solder is reprinted on the printed wiring board, the wiring board support is lowered to the suction position, and if the printed wiring board is separated from the mask, S32 is executed in the same manner as S22, and the printed wiring board is executed. Is transported to the inspection position, and the inspection is performed again in S33. If there is a printing failure, the operator is notified (S35), and if not, a printing normal command is output (S36).

As is apparent from the above description, in the present embodiment, when a printing failure is found by inspection of the wiring board conveyor, the carry-out conveyor and the control device, the wiring board conveyor and the carry-out conveyor are replaced with the original wiring board. The portion that is operated in the direction opposite to the transport direction and returns the printed wiring board from the inspection device to the printing device constitutes a printed wiring board return device.

In the embodiment described above, a part of the image data obtained by imaging the cream solder 380 in the inspection process is transferred from the image capturing unit 406 of the two-dimensional imaging device 282 to the image processing of the control device 182. Transferred to the device, and in the main image processing unit 410 of the image processing device,
Although the edges of the images 382 and 384 of the portion illuminated by the slit light are detected and the center position between the edges is determined, these image processing is performed by the two-dimensional imaging device 2.
The processing may be performed in the image capturing unit 406 on the 82 side. In this case, the data to be transferred from the image capturing unit 406 to the image processing device on the control device 182 side includes four bytes of data representing the position of the pixel whose center position has been determined and one byte representing the center position itself. A total of 5 with the data of
The data may be 1024 pixel columns of byte data, that is, about 5 kilobytes of data, and the transfer time can be further reduced than in the above embodiment.

Further, in the above-described embodiment, the image capturing unit 406 actually determines the image of the portion illuminated by the slit light only on the basis of the image data of the predetermined area as having a high possibility of being present. An area illuminated by the slit light is searched for, and only image data in the vicinity of the area is transferred to the image processing apparatus. By doing so, the time required for image processing can be significantly reduced, but performing image processing only on image data of a predetermined area as a high possibility that an image of a portion illuminated by slit light exists, Transferring only the image data in the vicinity of the area actually illuminated by the slit light to the image processing apparatus can be employed independently of each other.

When imaging the reference mark on the printed wiring board conveyed to the inspection position, the slit light source emits not the slit light but light that simultaneously illuminates the entire reference mark.
The two-dimensional imaging device may be configured to image the reference mark at a time. For example, in a slit light source, a slit plate is provided so as to be movable between a working position for converting a parallel light beam into slit light and a non-working position where no conversion is performed. The emitted parallel light beam is emitted. With this configuration, the reference mark can be imaged without relatively moving the reference light and the slit light source and the two-dimensional imaging device. In addition, a dedicated imaging device for imaging the reference mark may be provided separately from the slit light source and the two-dimensional imaging device. Further, instead of, or together with, stopping the printed wiring board at the inspection position by the stopper device, for example, a positioning device having a plurality of positioning pins and a wiring board support table that adsorbs the printed wiring board by negative pressure and moves up and down. May be provided, and the printed wiring board may be positioned so that the image is picked up in the sucked state. Alternatively, the printed wiring board stopped by the stopper device may be simply positioned by the positioning device. In these cases as well, the reference mark on the printed wiring board is imaged, and the positional shift is calculated.

In each of the above embodiments, the mask cleaning device 24 is provided at the same place as the mask positioning and supporting device 20 and the printing device 22, and the mask 48 is cleaned while being supported by the mask positioning and supporting device. However, the mask cleaning device may be provided in a different place from the mask positioning support device and the like. In this case, there is provided a mask transport device for transporting the mask between the mask cleaning device and the mask positioning and supporting device. If the mask needs to be cleaned, the mask is released from the positioning support by the mask positioning and supporting device to clean the mask. It is transported to the device and cleaned. After cleaning, the mask is returned to the mask positioning and supporting device, positioned and fixed to the mask support. At this time, the reference marks provided on the printed wiring board and the mask are respectively imaged, and the alignment between the printed wiring board and the mask is performed again.

Further, the through hole 51 is not limited to a rectangle, but may have another shape, for example, a circle or an ellipse. The inspection may be performed on all or a part of the cream solder filled and printed in the through-holes other than the rectangle.

In the embodiment shown in FIGS. 1 to 21, the holder moving device 330 of the inspection device 26 includes the cleaning head 202 of the mask cleaning device 24 and the guide rail 216.
, But a dedicated guide rail may be provided for each. The movement of the holding body 314 and the movement of the cleaning head 202 are guided by dedicated guide devices.

Further, in the embodiment shown in FIGS. 1 to 21, the holder 314 of the inspection device 26 may be moved by the print head moving device 132. The print head moving device 132 also serves as a holder moving device.

Further, the reference mark provided on each of the mask and the printed wiring board may be imaged by one imaging device. For example, the imaging device is provided rotatably about an axis parallel to the planes of the mask and the printed wiring board, and is rotated between a position facing the mask and a position facing the printed wiring board to image each reference mark. is there.

Further, the wiring board reference mark imaging device and the mask reference mark imaging device may be provided separately from the slit light source and the two-dimensional imaging device, and may be moved by a dedicated moving device. These two reference mark imaging devices may be moved by dedicated moving devices.

The cleaning head 202 and the wiping head 20
8 may be moved by a dedicated moving device different from the print head moving device 132, or the cleaning head 202 and the wiping head 208 may be moved by a common moving device different from the print head moving device 132. May be.

Further, the cream solder 3 described in detail above
A method and an apparatus for acquiring a three-dimensional shape include a mask printing apparatus that prints a printing medium other than cream solder, such as an adhesive, and an inspection of a printing medium in a mask printing method, and a three-dimensional imaging object other than a printing medium. The present invention can be applied to an apparatus and a method for obtaining the three-dimensional data. An example is shown in FIG. The imaging target shown in FIG. 23 is a protrusion 392 that protrudes upward from a horizontal plane 390. This projection 392
Has a rectangular shape when viewed vertically downward (from a direction perpendicular to the plane 390) from above (see FIG. 23A), but has predetermined irregularities on the surface 394. In this case, protrusion 3
At the time of the inspection at 92, the relative movement path of the slit light source and the two-dimensional imaging device with respect to the plane 390 is predetermined so as to substantially follow the shape of the surface 394 of the projection 392, as shown by the two-dot chain line in FIG. Route.

In the present projection inspection method (or apparatus), three-dimensional image data is obtained by processing only the image of the surface 394 of the projection 392. This is because the distance between the slit light source and the two-dimensional imaging device and the plane 390 during the relative movement is known in advance, and three-dimensional image data can be obtained by calculation without processing the image of the plane 390. A plurality of images of a portion of the surface 394 illuminated by the slit light are formed at substantially the same position on the imaging surface, and even if the height of the protrusion 392 is excessive or insufficient, the range of the imaging surface on which the image processing is to be performed is limited. Processing time is short. If the height of the projection 392 on the imaging surface is within the allowable range, the height of the projection
Alternatively, whether or not the height of the projection 392 is excessive or insufficient may be detected based on whether or not the image of No. 4 is formed.

In each of the above embodiments, the cream solder 38
Although the 0, projection 392 was imaged while moving without stopping the two-dimensional imaging device, the two-dimensional imaging device may be stopped to perform imaging.

Although some embodiments of the present invention have been described in detail above, these are merely examples, and the present invention is not limited to the above-mentioned [Problems to be Solved by the Invention, Means for Solving Problems and Effects]. The present invention can be implemented in various modified and improved forms based on the knowledge of those skilled in the art, including the described embodiment.

[Brief description of the drawings]

FIG. 1 is a side view showing a mask printing machine provided with a three-dimensional data acquisition device according to an embodiment of the present invention.

FIG. 2 is a front view showing the mask printing machine.

FIG. 3 is a plan view showing the mask printing machine.

FIG. 4 is a plan view showing a mask positioning and supporting device constituting the mask printing machine.

FIG. 5 is a side view showing the mask positioning and supporting device.

FIG. 6 is a side view showing a main part of a printing apparatus constituting the mask printing machine.

FIG. 7 is a side view schematically showing a mask cleaning device provided in the mask printing machine.

FIG. 8 is a front view showing an inspection device provided in the mask printing machine.

FIG. 9 is a front view showing a slit light source and a two-dimensional imaging device of the inspection device.

FIG. 10 is a block diagram schematically showing a configuration of a control device for controlling the mask printing machine.

FIG. 11 is an RO of a computer constituting the control device.
5 is a flowchart illustrating an inspection routine stored in M.

FIG. 12 is a diagram showing a portion of the RAM of the computer that is closely related to the present invention.

FIG. 13 is a diagram illustrating inspection of cream solder by the inspection device.

FIG. 14 is a diagram showing an image formed on an imaging surface of a two-dimensional imaging device of the inspection device.

15 is a functional block diagram of a part related to cream solder inspection between the two-dimensional imaging device and the control device in FIG. 10;

FIG. 16 is a diagram for explaining cream solder inspection in more detail;

FIG. 17 is a diagram for explaining cream solder inspection in more detail;

FIG. 18 is a diagram for describing cream solder inspection in more detail.

FIG. 19 is a diagram for describing cream solder inspection in further detail.

FIG. 20 is a diagram for describing cream solder inspection in further detail.

FIG. 21 is a diagram for describing cream solder inspection in more detail.

FIG. 22 is a flowchart illustrating an inspection routine stored in a ROM of a computer constituting a control device of another mask printing machine including a three-dimensional data acquisition device according to an embodiment of the present invention.

FIG. 23 is a diagram illustrating inspection of a projection height in a projection inspection method as another embodiment of acquiring three-dimensional data of an imaging target.

[Explanation of symbols]

12: Printed wiring board 18: Mask plate 20: Mask positioning and supporting device 22: Printing device 24: Mask cleaning device 26: Inspection device 70: Position adjusting device with pressing device 72: Fixing device 134: Print head 150: Solder container 182 ： Control device 184 ： Solder extrusion device 2
04: cleaning device 210: wiping device 280: slit light source 282: two-dimensional imaging device 314: holder 328: imaging surface 330: holder moving device 380: cream solder 390: flat surface 392: protrusion 394: surface 402: inspection camera 406: Image capturing unit 410: Main image processing unit 414: Image capturing memory 416: Image processing memory

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G01B 11/24 A

Claims (7)

[Claims] 1. A slit light source that emits a flat slit light toward an imaging target having a three-dimensional shape, and a two-dimensional image of a portion of the surface of the imaging target illuminated by the slit light. The two-dimensional imaging device and the two-dimensional imaging device, while maintaining a certain relative positional relationship, relative movement of the slit light source and the two-dimensional imaging device and the imaging object along a predetermined relative movement path, during the relative movement A plurality of two-dimensional images of a portion illuminated by the slit light are obtained, and three-dimensional data of the object is obtained based on a result of the plurality of times of imaging. 2. The imaging object having at least one of a convex portion raised from one plane and a concave portion recessed from one plane, wherein the predetermined relative movement path is the one plane. The three-dimensional data acquisition method according to claim 1, wherein the three-dimensional data acquisition method is a straight line parallel to. 3. The method according to claim 1, wherein the object to be imaged is a printing material on which a mask is printed on a surface of a printed circuit board. 4. An image processing of image data of an area which is a part of an imaging area of the two-dimensional imaging apparatus and which is predetermined as an area possibly illuminated by the slit light may be present. 4. The three-dimensional data acquisition method according to claim 1, wherein the three-dimensional data acquisition is performed without performing image processing on the image data of the other area. 5. In an image captured by the two-dimensional imaging device, among pixels arranged along each of a plurality of straight lines extending in a direction intersecting a longitudinal direction of an image of a part illuminated by the slit light, The three-dimensional data acquisition method according to claim 1, further comprising a step of specifying a pixel most likely to be a portion illuminated by slit light. 6. A predetermined number of pixels of image data arranged on both sides of a pixel specified as a pixel most likely to be a portion illuminated by the slit light on each of the plurality of straight lines The three-dimensional data acquisition method according to claim 5, wherein image processing is performed, and image processing of image data of other pixels is not performed. 7. A slit light source that emits a flat slit light toward an imaging target having a three-dimensional shape, and a two-dimensional image of a portion of the surface of the imaging target illuminated by the slit light. -Dimensional imaging device, a holding device that holds the slit light source and the two-dimensional imaging device in a fixed relative positional relationship, and relatively moves the holding device and the imaging object along a predetermined relative movement path. A relative movement device; and a control device that causes the two-dimensional imaging device to perform a plurality of times of imaging while moving by the relative movement device, and acquires three-dimensional data of the imaging target based on the imaging results. A three-dimensional data acquisition device characterized by the above-mentioned.