JP2004058298A - Printing inspection apparatus and printing inspection method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printing inspection apparatus and a printing inspection method, which can realize an optimum inspection form with a favorable balance between an improvement in production efficiency and the securement of printing accuracy. <P>SOLUTION: In a printing inspection for inspecting the printed state of cream solder of a substrate after screen printing, unit shape/position data for representing the shape and position of an element solder printing part to be printed on an electric pole for joining an electronic component, which is provided on the circuit forming surface of the substrate, are divided into data groups in according with a grouping condition to be selected according to the inspection form, so that data for the inspection can be generated. A failure/no-failure judgement at the inspection is made data group by data group, and judgement results are displayed data group by data group. Thus, the optimum inspection form corresponding to the substrate to be inspected can be flexibly selected. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a print inspection device and a print inspection method for inspecting a print state of cream solder printed on a substrate.
[0002]
[Prior art]
In mounting an electronic component, cream solder is applied to the surface of the substrate before mounting the electronic component on the substrate. As a method of applying the cream solder, a screen printing method is widely used. After the printing process, a printing inspection for inspecting a printing state of the cream solder is performed. In this print inspection, the board after screen printing is imaged by a camera, and the imaged result is subjected to image processing to determine whether or not cream solder is correctly printed on a printed portion.
[0003]
By the way, the characteristics of the electronic components mounted on the substrate are various, and even in the above-described solder printing process, the inspection accuracy differs depending on the electronic components mounted after printing. In other words, it is necessary to perform an inspection on a printing portion on which electronic parts requiring high printing accuracy and high printing accuracy are required at high cost and high reliability, so that the printing accuracy is reliably guaranteed. On the other hand, it is necessary to complete the inspection in as short a time as possible with respect to a printed portion on which electronic components are mounted such that soldering is easy and printing accuracy is not so important. For this reason, it is desirable that the print inspection apparatus that performs the inspection can perform a flexible inspection form according to the characteristics of the electronic components mounted on the target substrate.
[0004]
[Problems to be solved by the invention]
However, the electrodes for joining electronic components are usually formed on a single substrate in the order of thousands to tens of thousands. Therefore, in order to select a flexible inspection mode as described above, it is necessary to input the inspection data and the inspection target range each time the board type is changed. Particularly, in recent years, since the ratio of high-mix low-volume types in the production form at electronic device manufacturing sites has increased, it is necessary to perform such data processing work on many types at high frequency. In short, this was a factor that hindered productivity improvement. As described above, it is difficult for the conventional print inspection apparatus to realize an optimum inspection mode that balances improvement of production efficiency and securing of printing accuracy.
[0005]
Therefore, an object of the present invention is to provide a print inspection apparatus and a print inspection method capable of realizing an optimal inspection mode that balances improvement of production efficiency and securing of printing accuracy.
[0006]
[Means for Solving the Problems]
The print inspection device according to claim 1, wherein the print inspection device inspects a printed state of the cream solder on the substrate after screen printing, wherein the imaging unit captures an image of the substrate, and the imaging result of the substrate by the imaging unit. A print determination unit that determines the quality of the printing state based on inspection data necessary for performing a print inspection, and a display unit that displays a determination result, wherein the inspection data is provided on a circuit forming surface of the substrate. The display means is formed by grouping element shape and position data indicating the shape and position of an element solder printing portion formed by printing on the provided electrodes for bonding electronic components according to grouping conditions, and classifying them into data groups. Displays the determination result in association with the data group.
[0007]
The print inspection apparatus according to claim 2, wherein the grouping condition is determined based on a geometric range on a print surface of the substrate, and Determines the printing state using only the data group grouped as the inspection execution range.
[0008]
The print inspection apparatus according to claim 3 is the print inspection apparatus according to claim 1, wherein the grouping condition is determined based on an attribute of the electronic component, and the print determination unit determines an inspection execution target. The print state is determined using only a data group grouped as electronic components having the following attributes.
[0009]
The print inspection apparatus according to claim 4, wherein the grouping condition is determined so that each of the electronic components corresponds to one data group. Displays the determination result for each data group.
[0010]
The print inspection method according to claim 5, wherein the print inspection method for inspecting the printed state of the cream solder on the substrate after screen printing is performed by printing on an electrode for joining electronic components provided on a circuit forming surface of the substrate. Based on the inspection data created by classifying the unit shape and position data indicating the shape and position of the formed element solder printing part into data groups by grouping according to the grouping condition and the imaging result of the board by the imaging means. A print determination step of determining whether the print state is good or not; and a display step of displaying a determination result in association with the data group.
[0011]
The print inspection method according to claim 6 is the print inspection method according to claim 5, wherein the grouping condition is determined based on a geometric range on a printed surface of the substrate, and the grouping condition is determined as an inspection execution range. The printing state is determined using only the grouped data group.
[0012]
The print inspection method according to claim 7, wherein the grouping condition is determined based on an attribute of the electronic component, and the grouping condition has an attribute to be inspected. The printing state is determined using only the data group grouped as components.
[0013]
The print inspection method according to claim 8, wherein the grouping condition is determined by associating each of the electronic components with one data group, and the determination result Is displayed for each of the data groups.
[0014]
According to the present invention, inspection data created by grouping unit shape and position data indicating the shape and position of a unit print portion printed on an electrode according to grouping conditions into a data group and a substrate formed by an imaging unit By judging the printing state by comparing the imaging results, and displaying the judgment result in association with the data group, it is possible to execute the inspection in accordance with the importance and priority of the inspection set according to the board type. it can.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a front view of a screen printing apparatus according to one embodiment of the present invention, FIG. 2 is a side view of the screen printing apparatus according to one embodiment of the present invention, and FIG. 3 is a screen printing apparatus according to one embodiment of the present invention. FIG. 4 is a plan view of a substrate printing surface by a screen printing apparatus according to an embodiment of the present invention. FIG. 5 is a block diagram showing a configuration of a control system of the screen printing apparatus according to an embodiment of the present invention. FIG. 6 is a diagram showing storage contents of a program storage unit and a data storage unit of the screen printing apparatus according to one embodiment of the present invention. FIG. 7 is an element of a solder printing unit of the screen printing apparatus according to one embodiment of the present invention. FIG. 8 is an explanatory view of shape / position data, FIG. 8 is an explanatory view of mounting data and a mask opening pattern of the screen printing apparatus according to one embodiment of the present invention, and FIG. 9 is an inspection of the screen printing apparatus of one embodiment of the present invention. Threshold FIG. 10 is a flowchart of a print inspection data creation process according to an embodiment of the present invention, and FIGS. 11, 12, 13, and 14 are diagrams of a print inspection apparatus according to an embodiment of the present invention. It is a figure showing a display screen.
[0016]
First, the structure of the screen printing apparatus will be described with reference to FIGS. This screen printing apparatus is used not only as a printing mechanism for printing cream solder on a substrate on which electronic components are mounted, but also as a print inspection apparatus for determining the quality of a printed state and used in this print inspection, as described later. The configuration also has a function as a print inspection data creation device that creates print inspection data.
[0017]
1 and 2, the substrate positioning unit 1 stacks a θ-axis table 4 on a moving table including an X-axis table 2 and a Y-axis table 3 and further arranges a Z-axis table 5 thereon. The Z-axis table 5 is provided with a substrate holder 7 for holding the substrate 6 sandwiched by the clampers 8 from below. The substrate 6 to be printed is carried into the substrate positioning unit 1 by the carry-in conveyor 14 shown in FIGS. By driving the substrate positioning unit 1, the substrate 6 moves in the X and Y directions, and is positioned at a printing position and a substrate recognition position described later. The printed substrate 6 is carried out by the carry-out conveyor 15.
[0018]
A screen mask 10 is provided above the substrate positioning unit 1, and the screen mask 10 is configured by mounting a mask plate 12 on a holder 11. The substrate 6 is positioned with respect to the mask plate 12 by the substrate positioning unit 1 and abuts from below. As shown in FIG. 4A, electrodes 6b, 6c, 6d, and 6e for joining different types of electronic components P1, P2, P3, and P4 are formed in the solder printing area 6a on the circuit forming surface of the substrate 6. Is provided.
[0019]
On the screen mask 10, a squeegee head 13 is disposed so as to be able to reciprocate in the horizontal direction. While the substrate 6 is in contact with the lower surface of the mask plate 12, the cream solder 9 is supplied onto the mask plate 12, and the squeegee 13a of the squeegee head 13 is brought into contact with the surface of the mask plate 12 to slide. The cream solder 9 is printed on the printing surface of the substrate 6 through the pattern holes 16 provided in the mask plate 12. As a result, as shown in FIG. 4B, element solder printed portions S1, S2, S3, and S4 are formed on the electrodes 6b, 6c, 6d, and 6e, respectively.
[0020]
Above the screen mask 10, a camera 20, which is an imaging unit, is provided. As shown in FIG. 3, the camera 20 is horizontally moved in the XY directions by the X-axis table 21 and the Y-axis table 22. The X-axis table 21 and the Y-axis table 22 are camera moving means for moving the camera 20. The camera 20 captures an arbitrary position on the mask plate 12 by moving the camera 20 with respect to the mask plate 12 by the camera moving unit.
[0021]
As shown in FIG. 2, the substrate positioning unit 1 can move the held substrate 6 from below the screen mask 10 in the Y direction by the Y-axis table 3 to the substrate recognition position. By moving the camera 20 to the substrate 6 on the substrate positioning section 1 in this state, an arbitrary position on the substrate 6 can be imaged by the camera 20.
[0022]
Next, a configuration of a control system of the screen printing apparatus will be described with reference to FIG. In FIG. 5, a calculation unit 25 is a CPU, and executes various programs stored in a program storage unit 26 to perform various calculations and processes described later. In these calculations and processes, various data stored in the data storage unit 27 are used.
[0023]
The operation / input unit 28 is input means such as a keyboard and a mouse, and inputs various control commands and data. The communication unit 29 exchanges data with other devices constituting an electronic component mounting line together with the screen printing device. The image processing unit 30 performs image processing of the image data obtained by the camera 20 to thereby recognize a solder printing unit for print inspection and detect a mask opening for creating print inspection data, as described later.
[0024]
The mechanism control unit 31 controls a camera moving unit that moves the camera 20 and a squeegee moving unit that moves the squeegee head 13. The display unit 32 is a display device, and serves as a display unit for displaying an image acquired by the camera 20, an operation screen in a print inspection data creation process described later, a print inspection determination result, and the like.
[0025]
Next, a program and data stored in the program storage unit 26 and the data storage unit 27 will be described with reference to FIG. The program storage unit 26 stores a printing operation program 26a, an image processing program 26b, a printing quality determination program 26c, a grouping processing program 26d, and an inspection threshold value providing processing program 26e.
[0026]
The printing operation program 26a is a program for a printing operation for printing the cream solder 9 on the substrate 6 by controlling the operations of the substrate positioning unit 1 and the squeegee head 13. The image processing program 26b is a program for the image processing unit 30 to perform the following two types of processing based on the imaging result of the camera 20.
[0027]
First, by performing recognition processing on an imaging result obtained by imaging the substrate 6 after printing, element solder printing portions (see FIG. 4B) formed on each electrode of the substrate 6 are detected, and each element solder printing portion is detected. Calculate the area. In addition, by performing a recognition process on an imaging result obtained by imaging the mask plate 12, a process of obtaining mask opening data indicating the position and shape of each pattern hole 16 provided in the mask plate 12 is performed. This mask opening data is used as inspection data for print inspection.
[0028]
The print quality determination program 26c compares the area of the element solder printing part calculated by the image processing unit 30 with an inspection threshold value (described later) to determine the quality of the printing state for each element solder printing part. That is, the function realized by the image processing unit 30 and the arithmetic unit 25 executing the print quality determination program 26c is a function of determining the quality of the print state based on the imaging result of the board and the inspection data necessary for performing the print inspection. And a print determination unit for performing the determination.
[0029]
The grouping processing program 26d performs a process of grouping individual element position / shape data indicating the position and shape of each element solder printing unit in accordance with a specific grouping condition when creating inspection data used for print inspection. It is a program to do. That is, the function realized by the execution of the grouping processing program 26d by the arithmetic unit 25 is a grouping unit that classifies the element shape / position data according to the grouping condition and classifies them into data groups to specify each data group. It has become.
[0030]
The inspection threshold value assignment processing program 26e is a program for performing a process of assigning an inspection threshold value to a data group in which element position / shape data is grouped. The function realized by the calculation unit 25 executing the grouping processing program 26d is an inspection threshold value assigning unit that assigns an inspection threshold value that is unique inspection data.
[0031]
The data storage unit 27 stores mounting data 27a, component data library 27b, mask opening data library 27c, inspection threshold library 27d, and execution data 27e. Among these data, the mounting data 27a, the component data library 27b, the mask opening data library 27c, and the inspection threshold library 27d are transferred from another device such as a data management computer via the communication unit 29 and stored. .
[0032]
The mounting data 27a is data used in a mounting operation of mounting the electronic component on the board after the cream solder printing, that is, data relating the type of the mounted electronic component to the mounting position coordinates on the board. The component data library 27b is data on individual electronic components mounted on the board. The component data library 27b includes attribute codes indicating the component codes of the electronic components, the required precision in the mounting operation, the difficulty in solder printing for soldering, and the like. The numerical data includes numerical data representing the shape / size and the component-specific opening patterns (see 33A, 33B, 33C, and 33D shown in FIG. 8) indicating the arrangement of the element solder printing portions at the time of soldering.
[0033]
By the mounting data 27a and the component data library 27b, the individual pattern holes 16 of the mask plate 12 and the electronic components corresponding to the solder printing portions printed via these pattern holes can be associated on data, which will be described later. As described above, in the creation of print inspection data, various types of data are linked to each other to make the data creation process more efficient.
[0034]
The mask opening data library 27c stores numerical data indicating the opening position and size of the pattern holes 16 of the mask plate 12 used for printing for various types of mask opening data, and mask opening data associated with each mask plate. Is given in advance. That is, in the example of the mask plate 12 shown in FIG. 7, data on each of the patterns 16a to 16d is given. For example, for the pattern hole 16c, dimensions a and b indicating the size of the pattern hole and each pattern hole 16c with respect to the reference origin are provided. , Y1, y2,... Are given in the form of numerical data. The same applies to other pattern holes.
[0035]
As will be described later, this mask opening data is used as element position / shape data indicating the position / shape of the element solder printing portions (S1 to S4) shown in FIG. Therefore, the data storage unit 27 including the mask opening data library 27c is a data providing unit that provides element shape / position data indicating the shape and position of the element solder printing unit.
[0036]
As described above, since the data indicating the opening position and the opening size of the pattern hole can also be obtained by imaging the mask plate 12 with the camera 20, the required mask opening data is stored in the mask opening data library 27c. If not included, data similar to the data shown in FIG. 7 can be obtained using the actual mask plate 12. In this case, the camera 20 and the image processing unit 30 serve as data providing means for providing element shape / position data acquired based on mask opening data detected from the mask plate 12 used for screen printing.
[0037]
Further, as a method of obtaining the element shape / position data, a method of combining the mounting data 27a and the data included in the component data library 27b may be adopted. That is, as shown in FIG. 8, mounting points M1, M2A, M2B, M3, and M4 indicating mounting positions of the electronic components P1, P2, P3, and P4 are obtained from the mounting data 27a. By overlaying the component-specific opening patterns 33A, 33B, 33C, and 33D of the library 27b, numerical data equivalent to mask opening data can be obtained.
[0038]
The inspection threshold library 27d is a data library that provides data for calculating an inspection threshold used in print inspection. In the present embodiment, as shown in FIG. 9, two types of inspection threshold value libraries are prepared: a library associated with the pattern hole opening type and a library associated with the type of electronic component.
[0039]
In the library associated with the opening type of the pattern hole, threshold data for calculating the threshold is set in advance for each of the prepared opening types. A plurality of types of opening types of the pattern holes are set according to a combination of the shape (square, rectangular, circular, etc.) of the pattern holes and the size division. That is, by judging which opening type the target opening corresponds to, an inspection threshold value based on the solder printing area can be calculated.
[0040]
In the library associated with the opening type of the pattern hole, the same threshold data is directly obtained by specifying the type of electronic component (P1, P2,...). Does not need to determine the type of the opening type. In any of the examples, the threshold data includes the normal range ((−) OK to (+) OK), the warning range ((−) Warning to (+) Warning), and the rejection of the area of each element solder printed portion. And the lower limits ((-) NG, (+) NG) are defined as percentages with respect to the area of the normal-shaped element solder printing portion.
[0041]
The execution data 27e is inspection data that is actually used in a post-print inspection that is performed subsequent to the solder printing, and specifies a substrate type of a printing target as described later, and furthermore, a range of the inspection target on the substrate. Is specified, inspection data corresponding to these inspection ranges is created and stored in the data storage unit 27 as execution data 27e.
[0042]
This screen printing apparatus is configured as described above. Next, the print inspection data creation processing will be described with reference to the drawings according to the flow of FIG. This data creation process is used in a print inspection apparatus that inspects the printed state of the cream solder on the board after screen printing, and the shape indicating the shape and position of the solder printed portion formed by printing the cream solder on the printing surface・ Create inspection data including at least position data.
[0043]
First, in FIG. 10, mask aperture data is read (ST1). As a result, an opening pattern indicating the arrangement of the openings in the print range 12a is displayed on the operation screen 40 for data creation processing displayed on the display unit 32. These openings correspond to element shape / position data indicating the shape and position of the element solder printing portion formed on each electrode on the circuit formation surface.
[0044]
Here, as the mask opening data, if mask opening data corresponding to the target mask plate 12 is stored in the mask opening data library 27c of the data storage unit 27, this library data is used. . If the library data has not been obtained, a process of creating equivalent mask data from the mounting data 27a and the component data library 27b is performed. Further, if the mounting data 27a and the component data library 27b are not yet obtained, the opening is detected from the image data obtained by imaging the mask plate 12 as described above, and is used as the element shape / position data. Data generation processing is performed.
[0045]
Next, the element shape / position data corresponding to each of the displayed pattern holes is classified into data groups by grouping according to grouping conditions, and a grouping process for specifying each data group is performed (ST2). In this grouping process, individual element shape / position data is grouped into a data group by associating the openings displayed on the operation screen 40 in accordance with a predetermined grouping condition. It is done automatically.
[0046]
Here, the group condition selection wizard 41 displayed on the operation screen 40 shown in FIG. 12 selects one of the three grouping conditions, that is, one of the grouping conditions by the component unit 42a, the attribute designation 42b, and the range designation 42c. You can do it. This selection is performed by a check frame 43 provided for each option.
[0047]
When the component unit 42a is selected, the grouping condition is determined so that each of the electronic components mounted on the board 6 is included in one group. That is, as shown in FIG. 13A, pattern holes 16a, 16b, 16c corresponding to electrodes (see FIG. 4) provided for soldering the four electronic components P1, P2, P3, P4, respectively. 16d is surrounded by grouping frames 45a, 45b, 45c, and 45d, whereby element shape and position data corresponding to individual pattern holes are classified into data groups in units of electronic components. The data group is specified by each electronic component (P1, P2,...).
[0048]
When the attribute designation 42b is selected, the grouping condition is determined based on the attribute of the electronic component. That is, of all the electronic components to be mounted, only the electronic components having the attribute specified by being input to the designated input frame 44 are to be grouped. For example, when the type of the electronic component “QFP” is specified as the attribute, as shown in FIG. 13B, only the pattern hole 16d corresponding to the electronic component P4 corresponding to the type is surrounded by the grouping frame 45d. As a result, the element shape / position data corresponding to the pattern hole 16d is classified into a data group grouped by the input attribute and another data group, and the grouped data group is specified by the attribute “QFP”. Is done.
[0049]
When the range designation 42c is selected, the grouping condition is determined based on the geometric range on the printed surface of the substrate. In this case, as shown in FIG. 13C, on the operation screen, a grouping frame 45e surrounding only the pattern holes (here, pattern holes 16c and 16d) to be grouped by a pointing device such as a mouse. Perform the operation to set. As a result, the element shape / position data corresponding to these pattern holes is classified into a group of data based on the geometric range determined by the frame setting operation, and a group of other data. The specified data group is specified by the characteristics of the designated range (for example, “the same inspection threshold value providing range”, “print inspection target range”, etc.).
[0050]
In this way, when the grouping process is completed, an inspection execution target is specified (ST3). Here, it is specified whether or not the data group classified by the grouping process is to be subjected to print inspection after screen printing. In the present embodiment, the range surrounded by the grouping frame by the grouping process is an inspection target in principle. That is, in the case of the attribute specification 42b and the range specification 42c, the grouped ranges are directly subjected to the inspection. Then, the above-described print determination unit determines the print state using only the data group belonging to the range grouped as the inspection execution target.
[0051]
When the component unit 42a is selected, the pattern holes corresponding to all the electronic components are to be grouped. In this case, if it is determined that the print inspection is unnecessary for any of the electronic components, An operation for canceling grouping is performed on the operation screen 40. As a result, a process of excluding the pattern holes from which the grouping has been released from the inspection target is performed.
[0052]
In print inspection, it is not always necessary to target the entire surface of the substrate, and it is necessary to finely set the range to be inspected each time in consideration of required inspection time and required inspection quality, as described above. In this embodiment, a simple and flexible setting operation method is realized by adopting a simple method.
[0053]
Next, an inspection threshold is given (ST4). That is, an inspection threshold as unique inspection data is assigned to a data group designated as an inspection execution target, and an inspection threshold is assigned to a plurality of pattern holes belonging to each data group at once. Is done. Accordingly, even when a substrate having a huge number of pattern holes is targeted, data processing for providing an inspection threshold can be facilitated.
[0054]
Inspection data to which an inspection threshold value is assigned for each data group is stored in the data storage unit 27 as execution data 27e. In the above flow, the grouping process (ST2), the designation of the test execution target (ST3), and the assignment of the test threshold value (ST3) are not necessarily performed in the order described above, and the order of the individual data groups is not necessarily determined. May be performed.
[0055]
Thereafter, the screen printing operation is started. First, the cream solder 9 is supplied onto the mask plate 12, and the substrate 6 is brought into contact with the lower surface of the mask plate 12. Next, the squeegee head 13 is moved to print the cream solder 9 on the electrodes 6b to 6d of the substrate 6 via the pattern holes 16a to 16c. Thereafter, by lowering the Z-axis table 5 and separating the plate, element solder printing portions S1 to S4 (see FIG. 4) are formed on the electrodes of the substrate 6.
[0056]
Thereafter, a print inspection is performed. In this printing inspection, the board positioning unit 1 is moved again from below the screen mask 10 to the board recognition position (see FIG. 2), and the camera 20 captures an image of the upper surface of the printed board 6 and prints the element solder printing units S1 to S1. This is performed by detecting the area of S4. Then, by comparing this area detection result with the inspection threshold value obtained based on the inspection threshold value library 27d, the quality of the printing state is determined (print determination step).
[0057]
Here, the final determination of the printing state is determined in association with the data group grouped according to the grouping condition, and the display of the determination result is similarly performed for each data group in association with the data group. For example, when grouping is performed for each component, the determination and the display of the determination result are performed for each component. That is, if all of the element solder printing sections corresponding to each electronic component are good, it is determined that the solder printing for that electronic component is good. Is determined that the printing condition of the electronic component is defective.
[0058]
Then, these determination results are displayed on the operation screen 40 (display step). FIG. 14 shows a display example of the judgment result. The judgment result is displayed in association with the grouped data group. Here, the judgment result is displayed by using both the electronic component unit and the element solder printing unit unit. An example is shown. For example, as described above, all the printed solder portions corresponding to one electronic component are good, and no special display is made on the screen for an electronic component determined to be good in solder printing for that electronic component. The defect display is performed for the element solder printing portion where the printing state defect is detected and the electronic component corresponding to the element solder printing portion.
[0059]
The example of FIG. 14 illustrates an example in which a defect is detected in the solder print portion printed corresponding to the electronic component P4 by the pattern hole 16d. The location can be easily confirmed for each electronic component. In addition, the pattern holes 16d * corresponding to the element solder printed portions where the defect is detected are displayed in reverse video, and a display column 46 indicating the content of the defect is displayed for each of the pattern holes.
[0060]
As described above, in the print inspection shown in the present embodiment, element shape / position data indicating the shape and position of the element solder printing portion formed by printing on the electrode is selected according to the target board. The print inspection data created by grouping according to the grouping conditions to be performed is used. Thus, even when print inspection data is created for a substrate having a huge number of electronic components, data processing can be efficiently performed.
[0061]
Therefore, a flexible inspection mode according to the characteristics of the substrate and the electronic components mounted on the substrate becomes possible, and an optimal inspection mode that balances improvement of production efficiency and securing of printing accuracy can be realized. Further, since the judgment result of the print inspection can be displayed in a desired division such as an electronic component unit or a component type unit, a defective portion can be easily specified, and useful quality control data can be obtained.
[0062]
Note that, in the present embodiment, an example is shown in which inspection after printing is performed by a screen printing device having a print inspection function. However, in a case where a dedicated print inspection device is provided independently and separately from the screen printing device. Even in this case, the structure described in this embodiment can be applied.
[0063]
【The invention's effect】
According to the present invention, inspection data created by grouping unit shape and position data indicating the shape and position of a unit print portion printed on an electrode according to grouping conditions into a data group and a substrate formed by an imaging unit The print state is determined by comparing the imaging results of the above and the determination result is displayed in association with the data group, so that the inspection is executed in accordance with the importance and priority of the inspection set according to the type of the board. As a result, it is possible to realize an optimal inspection mode that balances improvement of production efficiency and securing of printing accuracy.
[Brief description of the drawings]
FIG. 1 is a front view of a screen printing apparatus according to an embodiment of the present invention. FIG. 2 is a side view of the screen printing apparatus according to an embodiment of the present invention. FIG. 3 is screen printing according to an embodiment of the present invention. FIG. 4 is a plan view of a substrate printing surface by a screen printing apparatus according to an embodiment of the present invention. FIG. 5 is a block diagram showing a configuration of a control system of the screen printing apparatus according to an embodiment of the present invention. FIG. 6 is a diagram showing storage contents of a program storage unit and a data storage unit of the screen printing apparatus according to one embodiment of the present invention. FIG. 7 is a diagram showing element solder printing units of the screen printing apparatus according to one embodiment of the present invention. FIG. 8 is an explanatory diagram of element shape / position data. FIG. 8 is an explanatory diagram of mounting data and a mask opening pattern of the screen printing apparatus according to one embodiment of the present invention. FIG. 9 is an inspection of the screen printing apparatus according to one embodiment of the present invention. Threshold FIG. 10 is an explanatory diagram of a library. FIG. 10 is a flowchart of print inspection data creation processing according to an embodiment of the present invention. FIG. 11 is a diagram showing a display screen of a print inspection apparatus according to an embodiment of the present invention. FIG. 13 is a diagram showing a display screen of a print inspection device according to one embodiment of the present invention. FIG. 13 is a diagram showing a display screen of a print inspection device according to one embodiment of the present invention. Diagram showing the display screen of the print inspection device [Explanation of reference numerals]
Reference Signs List 1 substrate positioning unit 6 substrate 6b, 6c, 6d, 6e electrode 9 cream solder 12 mask plate 13 squeegee head 16, 16a, 16b, 16c, 16d pattern hole 20 camera 25 arithmetic unit 26 program storage unit 26b image processing program 26c Determination program 26d Grouping processing program 26e Inspection threshold value assignment program 27 Data storage unit 27c Mask opening data library 27d Inspection threshold library 30 Image processing unit

Claims (8)

What is claimed is: 1. A print inspection apparatus for inspecting a printed state of cream solder on a board after screen printing, comprising: an image pickup unit for picking up an image of the board; an image pickup result of the board by the image pickup unit; And a display means for displaying a result of the determination, wherein the inspection data is applied to an electrode for electronic component bonding provided on a circuit forming surface of the substrate. Element shape and position data indicating the shape and position of the element solder printed portion formed by printing are created by classifying them into data groups by grouping according to grouping conditions, and the display unit associates the determination result with the data group. A print inspection apparatus characterized in that the print inspection is performed. The grouping condition is determined based on a geometric range on a printing surface of the substrate, and the print determination unit determines a print state using only a data group grouped as an inspection execution range. The print inspection apparatus according to claim 1, wherein: The grouping condition is determined based on an attribute of the electronic component, and the print determination unit determines a print state using only a data group that is grouped as an electronic component having an attribute to be inspected. The printing inspection apparatus according to claim 1, wherein the printing inspection is performed. 2. The grouping condition according to claim 1, wherein each of the electronic components is determined so as to correspond to one data group, and the display unit displays the determination result for each data group. Printing inspection equipment. A printing inspection method for inspecting a printed state of cream solder on a board after screen printing, wherein a shape of an element solder printing portion formed by printing on an electrode for joining electronic components provided on a circuit forming surface of the board and Print determination for determining the quality of the printing state based on inspection data created by classifying the unit shape / position data indicating the position according to the grouping condition into a data group and an imaging result of the substrate by an imaging unit. And a display step of displaying a determination result in association with the data group. The grouping condition is determined based on a geometric range on a printing surface of the substrate, and a printing state is determined using only a group of data grouped as an inspection execution range. Item 6. The print inspection method according to Item 5. The grouping condition is determined based on an attribute of the electronic component, and a print state is determined using only a data group that is grouped as an electronic component having an attribute to be inspected. The print inspection method according to claim 5, wherein 6. The print inspection method according to claim 5, wherein the grouping condition is determined so that each of the electronic components corresponds to one data group, and the determination result is displayed for each data group.

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