JP2004355521A - Inspection method and device of circuit board appearance - Google Patents

Inspection method and device of circuit board appearance Download PDF

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Publication number
JP2004355521A
JP2004355521A JP2003155187A JP2003155187A JP2004355521A JP 2004355521 A JP2004355521 A JP 2004355521A JP 2003155187 A JP2003155187 A JP 2003155187A JP 2003155187 A JP2003155187 A JP 2003155187A JP 2004355521 A JP2004355521 A JP 2004355521A
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circuit board
dimensional measurement
result information
dimensional
measurement result
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JP4249543B2 (en
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Kazuhiko Tomoyasu
和彦 友保
Daisuke Nagai
大介 永井
Yasushi Mizuoka
靖司 水岡
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method of a circuit board appearance capable of improving production efficiency and quality by appropriately setting each mounting process. <P>SOLUTION: The inspection method has a first measurement step for generating three-dimensional measurement result information by measuring a printing shape of solder printed on the circuit board after a first production step for attaching solder to the circuit board, a second measuring step for generating three-dimensional measuring result information by measuring mounting posture of an electronic part after a second production step for mounting the electronic part on the circuit board, a third measuring step for generating three-dimensional measuring result information by measuring a solder shape and/or posture of the electronic part after a third production step for fixing the electronic part on the circuit board with solder and a display step for displaying a plurality of three-dimensional measuring result information of a same circuit board on a same screen. In this regard, the plurality of three dimensional measuring result information respectively include the three-dimensional information and the three dimensional information is an oblique perspective view from a view point of a same position. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、回路基板の外観検査方法及び回路基板の外観検査装置に関する。
【０００２】
【従来の技術】
回路基板（プリント回路基板）のパターンの微細化が進み、これに伴って回路基板に電子部品を実装する製造工程において、回路基板の外観検査が重要になってきた。これに伴い、種々の回路基板の外観検査方法及び回路基板の外観検査装置が開発されている。
【０００３】
特開平５−００７１００号公報に従来例の電子部品実装装置が記載されている。以下、従来例の電子部品実装装置について、図７を用いて説明する。図７は従来例の電子部品実装装置の構成を示すブロック図である。
図７において、バーコードプリンタ７０１は、回路基板にバーコードを印刷する。クリーム半田印刷機７０２は、回路基板にクリーム半田を印刷する。バーコードリーダ７０３は、バーコードプリンタ７０１により回路基板に印刷された回路基板の識別子を読み出す。印刷検査機７０４は、印刷状態を検査する。印刷データ処理装置７０７は、回路基板の識別子及び検査データ（ランド位置と実際の印刷位置との誤差等）を記憶する。また、その誤差に応じてクリーム半田印刷機７０２に印刷条件の補正信号を出力し、且つ誤差が許容値以上のときには分岐装置７０５に不良品分岐信号を出力する。分岐装置７０５は、不良品分岐信号を入力すると、その回路基板を不良品ストッカ７０６に蓄える。印刷データ処理装置７０７は、回路基板の識別子とその検査データを適宜にデータ管理部７２０に伝送する。
【０００４】
部品実装機７０８が回路基板に電子部品を実装する。バーコードリーダ７０９は、回路基板の識別子を読み出す。実装検査機７１０は、実装状態を検査する。実装データ処理装置７１３は、回路基板の識別子及び検査データ（ランド位置と電子部品の実装位置との誤差等）を記憶する。誤差が許容値以上のときには分岐装置７１１に不良品分岐信号を出力する。分岐装置７１１は、不良品分岐信号を入力すると、その回路基板を不良品ストッカ７１２に蓄える。実装データ処理装置７１３は、回路基板の識別子とその検査データを適宜にデータ管理部７２０に伝送する。
【０００５】
リフロー装置７１４が回路基板をリフローし、電子部品を定着させる。バーコードリーダ７１５は、回路基板の識別子を読み出す。半田付検査機７１０は、半田付状態を検査する。半田付データ処理装置７１９は、回路基板の識別子及び検査データ（半田ブリッジ等）を記憶する。半田ブリッジ等の不良が発見されたならば分岐装置７１７に不良品分岐信号を出力する。分岐装置７１７は、不良品分岐信号を入力すると、その回路基板を不良品ストッカ７１８に蓄える。半田付データ処理装置７１９は、回路基板の識別子とその検査データを適宜にデータ管理部７２０に伝送する。
【０００６】
データ管理部７２０は、印刷データ処理装置７０７、実装データ処理装置７１３、半田付けデータ処理装置７１９から入力した回路基板の識別子と対応付けられたデータに基づいて、生産実績、稼働実績、誤差や不良発生の動向と月日をデータベースとして記憶し、誤差や不良発生の原因の分析、誤差や不良発生が回路基板側のミスによるのか処理側のミスによるのかの分析を行い、必要に応じて各データ処理装置７０７、７１３、７１９にフィードバックを行う。
【０００７】
【特許文献１】
特開平５−００７１００号公報
【０００８】
【発明が解決しようとする課題】
しかしながら、従来の回路基板の外観検査方法においては、各製造工程（クリーム半田印刷工程、電子部品実装工程、リフロー工程）における良否の判定データをばらばらにしか出力できなかった。多くの回路基板の外観検査装置では、各製造工程において不良品を修理した後では、後の製造工程においてそれが実際にどのような不良であったのかを画像としては再確認できなかった。後の製造工程において、製造担当者が先の製造工程における画像情報を見ることが出来る回路基板の外観検査装置においても、平面画像のみ、又は各製造工程毎に別個の視点から見た３次元画像しか見ることが出来なかった。各製造工程の検査データ（特に画像情報）を同一の視点から立体的に比較することができなかった。そのため、製造工程を推移する過程で、回路基板の表面の立体的な形状の変化が実装不良を引き起こす影響を具体的に把握できなかった。各製造工程が後の製造工程に与える影響度を予測しても、それを実際に確認できないという問題があった。それ故に、製造担当者が各製造工程の条件、各製造工程における良否判定検査の判定基準値を適切に設定することを困難であった。
【０００９】
本発明は、製造担当者が複数の製造工程における検査データである３次元画像を、同一の視点からひとつの画面上で見ること出来る回路基板の外観検査方法及び回路基板の外観検査装置を提供することを目的とする。
本発明は、後の製造工程における検査データに基づいて、先の製造工程の設計値（例えば動作条件設定値）及び／又は検査条件（例えば良否の判定基準値）を適切に自動的に補正する回路基板の外観検査方法及び回路基板の外観検査装置を提供することを目的とする。
【００１０】
【課題を解決するための手段】
本発明によれば、回路基板に電子部品を実装して半田付する製造工程において、印刷後の半田形状、半田上の装着された電子部品の姿勢、半田付け後の半田及び部品の状態等を３次元図形情報（立体形状データやベクトルデータ等の数値情報を含んでも良い。）として表示できる。製造担当者は、これらの３次元画像情報を比較して見て、その推移状態を把握することが出来る。
【００１１】
本発明の請求項１に記載の発明は、設計値に基づいて半田を回路基板に付着させる第１の製造工程の後に、前記回路基板に印刷された半田の印刷形状を３次元測定し、３次元測定結果情報を生成する第１の３次元測定工程と、前記第１の製造工程により半田を付着された前記回路基板に対し、設計値に基づいて電子部品を配置する第２の製造工程の後に、前記電子部品の配置姿勢を３次元測定し、３次元測定結果情報を生成する第２の３次元測定工程と、前記第２の製造工程により前記電子部品を配置された前記回路基板に設計値に基づいて熱を加えて前記電子部品を半田で定着させる第３の製造工程の後に、半田の形状及び／又は前記電子部品の姿勢を３次元測定し、３次元測定結果情報を生成する第３の３次元測定工程と、のうち少なくとも２つ以上の３次元測定工程と、２つ以上の前記３次元測定工程で生成された、同一の前記回路基板の複数の前記３次元測定結果情報を同一画面上に表示する表示工程と、を有し、複数の前記３次元測定結果情報はそれぞれ３次元画像情報を含み、前記３次元画像情報は同一位置の視点による斜視図であることを特徴とする回路基板の外観検査方法である。
【００１２】
本発明は、製造担当者が複数の製造工程における検査データである３次元画像を、同一の視点からひとつの画面上で見ること出来る回路基板の外観検査方法及び回路基板の外観検査装置を実現できるという作用を有する。
同一位置の視点は、無限遠点の視点（消失点のない斜視図）を含む。
【００１３】
本発明の請求項２に記載の発明は、前記３次元測定結果情報は、更に前記３次元画像情報から導出された半田及び／又は前記電子部品の立体形状データを含むことを特徴とする請求項１に記載の回路基板の外観検査方法である。
立体形状データは、例えば体積データ、表面積データ、位置データ、面積データ、高さデータである。
【００１４】
本発明の請求項３に記載の発明は、前記回路基板は固有識別情報を有し、前記表示工程において、前記固有識別情報を認識し、同一の前記回路基板の複数の前記３次元測定結果情報を選択して、同一画面上に表示することを特徴とする請求項１又は請求項２に記載の回路基板の外観検査方法である。
例えば製造工程途中で不良品の回路基板を抜くことによって、前の製造工程と後の製造工程で回路基板枚数のカウント値がずれても、ユーザが指定した特定の回路基板についての各製造工程の３次元測定結果情報を適切に選択して表示できる。これにより、特定の回路基板の製造工程間の遷移情報を得ることが出来る。
【００１５】
本発明の請求項４に記載の発明は、前記表示工程において、ユーザの指示に従って複数の前記３次元画像情報を座標変換し、新たに定められた同一位置の視点による複数の斜視図を表示することを特徴とする請求項１から請求項３のいずれかの請求項に記載の回路基板の外観検査方法である。製造担当者は、任意の視点から、各製造工程の３次元画像情報を比較して見て、その遷移状態を知ることが出来る。
【００１６】
本発明の請求項５に記載の発明は、前記表示工程において、同一の前記回路基板についての、ユーザにより指定された任意の前記電子部品が配置される位置の近傍の複数の前記３次元測定結果情報を表示することを特徴とする請求項１から請求項４のいずれかの請求項に記載の回路基板の外観検査方法である。製造担当者は、１つの電子部品について、各製造工程の３次元画像情報を比較して見て、その遷移状態を知ることが出来る。
【００１７】
本発明の請求項６に記載の発明は、前記第１の３次元測定工程及び／又は前記第２の３次元測定工程と、前記第３の３次元測定工程とにおいて、前記３次元測定結果情報と検査条件設定値とに基づいて前記回路基板の良否を判定し、前記第３の３次元測定工程が出力する前記回路基板の良否判定結果と、前記第１の３次元測定工程及び／又は前記第２の３次元測定工程における前記検査条件設定値と、の因果関係を解析し、その解析結果を出力する解析工程を更に有することを特徴とする請求項１から請求項５のいずれかの請求項に記載の回路基板の外観検査方法である。
【００１８】
先の製造工程における検査条件設定値と、後の製造工程の検査結果との間がどのような関連を有するかという有用な情報が得られる。
例えば、第１の３次元測定工程において、ある回路基板の３次元測定結果情報を不良と判定しても、後工程である第３の３次元測定工程において、その回路基板の３次元測定結果情報を良品と判定したならば、第１の３次元測定工程の検査条件設定値（例えば判定基準値）は、第３の３次元測定工程における回路基板の良否結果と適切な因果関係を有しない（第１の３次元測定工程において、その検査条件設定値に基づいて回路基板を不良と判定したならば、そのことに起因して、第３の３次元測定工程において、その回路基板は不良と判定されるという結果が生じるという因果関係がない）という解析結果を出力する。好ましくは、この場合、第１の３次元測定工程の検査条件設定値を、第３の３次元測定工程における回路基板の良否結果とより高い相関関係を有する値に自動的に補正する。
【００１９】
本発明の請求項７に記載の発明は、前記表示工程において、前記因果関係の解析結果を表示することを特徴とする請求項６に記載の回路基板の外観検査方法である。製造担当者は、解析結果を視覚的に知ることが出来る。
【００２０】
本発明の請求項８に記載の発明は、前記解析結果に基づいて、前記第１の３次元測定工程及び／又は前記第２の３次元測定工程の前記検査条件設定値を、前記第３の３次元測定工程における前記回路基板の良否結果とより高い相関関係を有する値に自動的に補正する補正工程を更に有することを特徴とする請求項６に記載の回路基板の外観検査方法である。
先の製造工程における検査条件設定値を、後の製造工程の検査結果に基づいて、適切な値に設定できる。
【００２１】
本発明の請求項９に記載の発明は、前記第１から第３の３次元測定工程のいずれかの３次元測定工程において、前記３次元測定結果情報に基づいて前記回路基板の良否を判定し、その良否判定結果と、その３次元測定工程に対応する前記製造工程より前の前記製造工程における前記設計値と、の因果関係を解析し、その解析結果を出力する解析工程を更に有することを特徴とする請求項１から請求項５のいずれかの請求項に記載の回路基板の外観検査方法である。
先の製造工程における設計値（例えば半田印刷部等の動作設定条件）と、後の製造工程の検査結果との間がどのような関連を有するかという有用な情報が得られる。
【００２２】
本発明の請求項１０に記載の発明は、前記解析結果に基づいて、より高い確率で前記回路基板が良品と判定されるように、前記設計値を自動的に補正する補正工程を更に有することを特徴とする請求項９に記載の回路基板の外観検査方法である。先の製造工程における設計値を、後の製造工程の検査結果に基づいて、適切な値に設定できる。
【００２３】
本発明の請求項１１に記載の発明は、前記表示工程において、前記３次元測定結果情報と、その３次元測定結果情報を生成した前記３次元測定工程に対応する前記製造工程の設計値と、を同一画面上に表示することを特徴とする請求項１から請求項１０のいずれかの請求項に記載の回路基板の外観検査方法である。製造担当者は、視覚的に、３次元測定結果情報と設計値とを比較検討できる。
【００２４】
本発明の請求項１２に記載の発明は、前記表示工程において、予め任意に指定された前記電子部品の近傍の前記回路基板の前記３次元測定結果情報を、その良否に関係なく表示することを特徴とする請求項１から請求項１１のいずれかの請求項に記載の回路基板の外観検査方法である。連続的に同一回路基板を製造する製造工程において、特定の電子部品の実装及び半田付の状態を常に監視することが出来る。
【００２５】
本発明の請求項１３に記載の発明は、予め任意に指定された前記電子部品の近傍の前記回路基板の前記３次元測定結果情報を、その良否に関係なく全て保持する工程を更に有することを特徴とする請求項１から請求項１２のいずれかの請求項に記載の回路基板の外観検査方法である。連続的に同一回路基板を製造する製造工程において、特定の電子部品の実装及び半田付の状態を常に監視することが出来る。
【００２６】
本発明の請求項１４に記載の発明は、前記表示工程において、いずれかの前記３次元測定工程で生成された検査対象である前記回路基板の前記３次元測定結果情報と、その３次元測定工程と同一の前記３次元測定工程で過去に生成され且つ良品と判定された前記３次元測定結果情報と、を同一画面上に表示することを特徴とする請求項１から請求項１３のいずれかの請求項に記載の回路基板の外観検査方法である。製造担当者が、良品と判定された３次元測定結果情報と、検査対象である回路基板とを比較して見ることが出来るので、視覚判断による検査対象である回路基板の良否判定が容易になり、間違った判定を下す確率が低くなる。
【００２７】
本発明の請求項１５に記載の発明は、過去に生成され且つ良品と判定された前記３次元測定結果情報が、その３次元測定工程において、過去に生成され且つ良品と判定された前記３次元測定結果情報の平均値からなることを特徴とする請求項１４に記載の回路基板の外観検査方法である。良品と判定された３次元測定結果情報が平均的な良品の画像（特別優れた良品ではない。）である故、製造担当者は、視覚判断による検査対象である回路基板の良否判定を更に適切に行うことが出来る。
【００２８】
本発明の請求項１６に記載の発明は、請求項１から請求項１５のいずれかの請求項に記載の回路基板の外観検査方法を実行することを特徴とする回路基板の外観検査装置である。本発明は、上記と同様の効果を奏する回路基板の外観検査装置を実現できるという作用を有する。
【００２９】
【発明の実施の形態】
以下本発明の実施をするための最良の形態を具体的に示した実施の形態について図面とともに記載する。
【００３０】
《実施の形態１》
図１及び図２を用いて、本発明の実施の形態１の回路基板の外観検査装置及び回路基板の外観検査方法を説明する。図１は、本発明の実施の形態１の回路基板の外観検査装置の構成を示すブロック図である。
実施の形態１の回路基板の外観検査装置は、半田印刷装置（実施の形態１においてはクリーム半田印刷装置）１０１、電子部品配置装置（実施の形態１においては電子部品実装装置）１０２、半田付け装置（実施の形態１においてはリフロー装置）１０３、データ管理部１０４（実施の形態１においてはコンピュータ）、表示部１０５（実施の形態１においては液晶ディスプレイ）を有する。
半田印刷装置１０１は、半田印刷部１１１及び半田印刷検査部１１２を有する。
電子部品配置装置１０２は、電子部品配置部１１３及び電子部品配置検査部１１４を有する。半田付け装置１０３は、半田付け部１１５及び半田付け検査部１１６を有する。
【００３１】
最初にバーコードプリンタ（図示しない。）が各回路基板の所定の位置にバーコード（回路基板の固有識別子）を印刷する。
半田印刷部１１１は、設計値（動作条件設計値）に基づいて回路基板の必要な箇所にクリーム半田を印刷する（第１の製造工程）。回路基板に半田を付着させる方法は任意である。例えば、インクジェットプリンタで判断を射出印刷しても良い。
半田印刷検査部１１２は、バーコードリーダを有する。半田印刷検査部１１２はバーコードを読み取り、クリーム半田を印刷された回路基板を検査する。半田印刷検査部１１２は、半田印刷部１１１によりクリーム半田が印刷された回路基板の特定の範囲を選択して、選択した範囲を３次元測定方式によりスキャンし、選択した範囲の３次元立体形状データを生成する。３次元立体形状データとは、クリーム半田の高さ、面積、体積などの数値情報である。これを繰り返し、半田印刷検査部１１２は、クリーム半田が印刷された回路基板全体の３次元立体形状データを生成する。
【００３２】
半田印刷検査部１１２は、３次元立体形状データから、クリーム半田を印刷した回路基板の３次元画像情報を生成する。半田印刷検査部１１２は、３次元立体形状データ及び所定の検査条件設定値（例えば良否判定基準値）に基づいて（典型的には３次元立体形状データと良否判定基準値とを比較して）、クリーム半田印刷の良否判定結果である印刷検査結果データを生成する（第１の３次元測定工程）。半田印刷検査部１１２が生成する情報の全体を第１の３次元測定結果情報１２１と呼ぶ。
半田印刷検査部１１２は第１の３次元測定結果情報１２１をその回路基板の固有識別子と対応付けてデータ管理部１０４に送付する。
【００３３】
電子部品配置部１１３は、設計値（動作条件設計値）に基づいて、クリーム半田が印刷された回路基板に電子部品を配置（実装）する（第２の製造工程）。
電子部品配置検査部１１４は、バーコードリーダを有する。電子部品配置検査部１１４はバーコードを読み取り、電子部品を実装した回路基板を検査する。
電子部品配置検査部１１４は、電子部品配置部１１３により電子部品が配置（実装）された回路基板の特定の範囲を選択して、選択した範囲を３次元測定方式によりスキャンし、選択した範囲の３次元立体形状データを生成する。３次元立体形状データとは、実装された電子部品の位置、その配置姿勢などの数値情報である。これを繰り返し、電子部品配置検査部１１４は、電子部品が配置（実装）された回路基板全体の３次元立体形状データを生成する。
【００３４】
電子部品配置検査部１１４は、３次元立体形状データから、電子部品を実装した回路基板の３次元画像情報を生成する。電子部品配置検査部１１４は、３次元立体形状データ及び所定の検査条件設定値（例えば良否判定基準値）に基づいて（典型的には３次元立体形状データと良否判定基準値とを比較して）、電子部品実装の良否判定結果である実装検査結果データを生成する（第２の３次元測定工程）。電子部品配置検査部１１４が生成する情報の全体を第２の３次元測定結果情報１２２と呼ぶ。
電子部品配置検査部１１４は第２の３次元測定結果情報１２２をその回路基板の固有識別子と対応付けてデータ管理部１０４に送付する。
【００３５】
半田付部１１５（リフロー装置）は、設計値（動作条件設計値）に基づいて電子部品を実装した回路基板をリフローする（半田付けする。）（第３の製造工程）。
半田付検査部１１６は、バーコードリーダを有する。半田付検査部１１６はバーコードを読み取り、半田付された回路基板を検査する。
半田付検査部１１６は、半田付部１１５により半田付された回路基板の特定の範囲を選択して、選択した範囲を３次元測定方式によりスキャンし、選択した範囲の３次元立体形状データを生成する。３次元立体形状データとは、半田の高さ、面積、体積などの数値情報、及び電子部品の位置、固定された姿勢などの数値情報である。これを繰り返し、半田付検査部１１６は、半田付された回路基板全体の３次元立体形状データを生成する。
【００３６】
半田付検査部１１６は、３次元立体形状データから、半田付された回路基板の３次元画像情報を生成する。半田付検査部１１６は、３次元立体形状データ及び所定の検査条件設定値（例えば良否判定基準値）に基づいて（典型的には３次元立体形状データと良否判定基準値とを比較して）、半田付の良否判定結果である半田付検査結果データを生成する（第３の３次元測定工程）。半田付検査部１１６が生成する情報の全体を第３の３次元測定結果情報１２３と呼ぶ。
半田付検査部１１６は第３の３次元測定結果情報１２３をその回路基板の固有識別子と対応付けてデータ管理部１０４に送付する。
【００３７】
データ管理部１０４は、第１の３次元測定結果情報１２１、第２の３次元測定結果情報１２２、第３の３次元測定結果情報１２３を入力し、固有識別子に基づいて個々の回路基板毎に第１〜第３の３次元測定結果情報を集計する。固有識別子を用いて集計することにより、製造工程の途中で不良回路基板を取り除いたとしても、回路基板の枚数のカウントずれにより異なる回路基板の３次元測定結果情報を誤って対応付ける恐れは無い。
【００３８】
データ管理部１０４は、第１の３次元測定結果情報１２１、第２の３次元測定結果情報１２２、第３の３次元測定結果情報１２３のそれぞれに含まれる３次元画像情報から基準マークを検出し、且つ回路基板の表面を検出する。データ管理部１０４は、これらの情報に基づいて、第１の３次元測定結果情報１２１、第２の３次元測定結果情報１２２、第３の３次元測定結果情報１２３のそれぞれに含まれる３次元画像情報（いずれか２つの３次元画像情報であっても良い。）を位置合わせし、座標回転させ、所定の位置（同一位置）の視点による３枚の斜視図を生成する。好ましくは、３枚の斜視図は同一の大きさにされる（拡大率が同一）。データ管理部１０４は、同一の回路基板の３枚の斜視図２１１〜２１３と、設計イメージ図２０１とを同一画面上に表示した画像を生成し、出力する。表示部１０５は、その画像を表示する。
【００３９】
図２は、データ管理部１０４が生成する画像の一例である。図２において、斜視図２１１は、クリーム半田を印刷された回路基板の斜視図、斜視図２１２は、電子部品を実装した回路基板の斜視図、斜視図２１３は、半田付された回路基板の斜視図である。設計イメージ図２０１は、理想的な（良品の）クリーム半田を印刷された回路基板の斜視図、電子部品を実装した回路基板の斜視図、又は半田付された回路基板の斜視図である。表示される設計イメージ図２０１は、製造担当者が、クリーム半田を印刷された回路基板の斜視図、電子部品を実装した回路基板の斜視図、及び半田付された回路基板の斜視図の中から、任意に選択することができる。各製造工程における３枚の設計イメージ図を同時に表示しても良い。好ましくは、設計イメージ図２０１は、斜視図２１１〜２１３と同一位置の視点による斜視図である。
【００４０】
データ管理部１０４は、製造担当者の指示に従い、３枚の斜視図２１１〜２１３を更に座標回転させ、新たに定められた同一位置の視点による複数の斜視図を表示することが出来る。好ましくは、設計イメージ図２０１も同時に座標回転させ、同一位置の視点による斜視図として表示する。
データ管理部１０４は、製造担当者が電子部品を指定すると、３枚の斜視図２１１〜２１３の、その電子部品が配置される位置の近傍を同一比率で拡大し、表示する。好ましくは、設計イメージ図２０１も同時にその電子部品が配置される位置の近傍を同一比率で拡大し、表示する。
【００４１】
《実施の形態２》
図３を用いて、本発明の実施の形態２の回路基板の外観検査装置及び回路基板の外観検査方法を説明する。図３は、本発明の実施の形態２の回路基板の外観検査装置の構成を示すブロック図である。
実施の形態２の回路基板の外観検査装置は、実施の形態１と類似する構成を有する。図３において、図１と同一のブロックには同一の符号を付している。実施の形態２の回路基板の外観検査装置は、実施の形態１（図１）における半田印刷装置１０１、電子部品配置装置１０２、半田付け装置１０３、データ管理部１０４、半田印刷検査部１１２、電子部品配置検査部１１４、半田付け検査部１１６に代えて、半田印刷装置３０１、電子部品配置装置３０２、半田付け装置３０３、データ管理部３０４、半田印刷検査部３１２、電子部品配置検査部３１４、半田付け検査部３１６を有する。実施の形態２の各ブロックの機能は、実施の形態１における同一名称の回路ブロックの機能と基本的に同一である。以下、実施の形態２において、実施の形態１と異なる点のみを説明する。
【００４２】
データ管理部３０４は、実施の形態１に記載の機能に加えて、第１の３次元測定結果情報１２１、第２の３次元測定結果情報１２２、第３の３次元測定結果情報１２３を入力し、固有識別子に基づいて個々の回路基板毎に第１〜第３の３次元測定結果情報を集計する。固有識別子を用いて集計することにより、製造工程の途中で不良回路基板を取り除いたとしても、回路基板の枚数のカウントずれにより異なる回路基板の３次元測定結果情報を誤って対応付ける恐れは無い。
【００４３】
実施の形態１と同様に、データ管理部３０４は、図２の画像を生成し、出力する。表示部１０５は、その画像を表示する。
【００４４】
データ管理部３０４は、更に、半田付の良否判定結果である半田付検査結果データ（第３の３次元測定工程における回路基板の良否判定結果）と、その前の工程である、第１の３次元測定工程（半田印刷検査部３１２が測定する工程）及び／又は第２の３次元測定工程（電子部品配置検査部３１４が測定する工程）における検査条件設定値（例えば良否判定基準値）と、の因果関係を解析し、その解析結果を出力する（解析工程）。
データ管理部３０４が解析結果を画像信号として出力し、表示部１０５がその画像を表示しても良い。
【００４５】
データ管理部３０４は、解析結果に基づいて、第１の３次元測定工程（半田印刷検査部３１２が測定する工程）及び／又は第２の３次元測定工程（電子部品配置検査部３１４が測定する工程）の検査条件設定値を、第３の３次元測定工程（半田付検査部３１６が測定する工程）における回路基板の良否結果とより高い相関関係を有する値に自動的に補正する（補正工程）。
半田印刷検査部３１２及び／又は電子部品配置検査部３１４は、補正された新たな検査条件設定値で検査を行う。
【００４６】
例えば、第１の３次元測定工程（半田印刷検査部３１２が測定する工程）において、ある回路基板の３次元測定結果情報を不良と判定しても、後工程である第３の３次元測定工程（半田付検査部３１６が測定する工程）において、その回路基板の３次元測定結果情報を良品と判定したならば、第１の３次元測定工程の検査条件設定値（例えば判定基準値）は、第３の３次元測定工程における回路基板の良否結果と適切な因果関係を有しないことになる。
【００４７】
データ管理部３０４は、解析結果に基づいて補正された検査条件設定値である第１の判定基準値３３１を生成し、第１の判定基準値３３１を半田印刷検査部３１２に送る。半田印刷検査部３１２は、入力した第１の判定基準値３３１に、検査条件設定値を置き換える。補正された検査条件設定値は、第１の３次元測定工程（半田印刷検査部３１２が測定する工程）において、その新たな検査条件設定値に基づいて回路基板の良否を判定したならば、補正前の検査条件設定値に基づいて回路基板の良否を判定するよりも、その判定結果と、第３の３次元測定工程（半田付検査部３１６が測定する工程）における回路基板の良否の判定結果との相関が高くなるような値である。即ち、第１の３次元測定工程における判定結果が良品であれば、第３の３次元測定工程において良品と判定される確率が高くなり、第３の３次元測定工程における判定結果が不良品であれば、第３の３次元測定工程において不良品と判定される確率が高くなる。
【００４８】
同様に、データ管理部３０４は、解析結果に基づいて補正された検査条件設定値である第２の判定基準値３３２を生成し、第２の判定基準値３３２を電子部品配置検査部３１４に送る。電子部品配置検査部３１４は、入力した第２の判定基準値３３２に、検査条件設定値を置き換える。補正された検査条件設定値は、第２の３次元測定工程（電子部品配置検査部３１４が測定する工程）において、その新たな検査条件設定値に基づいて回路基板の良否を判定したならば、補正前の検査条件設定値に基づいて回路基板の良否を判定するよりも、その判定結果と、第３の３次元測定工程（半田付検査部３１６が測定する工程）における回路基板の良否の判定結果との相関が高くなるような値である。
更に、データ管理部３０４は、解析結果に基づいて補正された検査条件設定値である第３の判定基準値３３３を生成し、第３の判定基準値３３３を半田付検査部３１６に送る。
【００４９】
《実施の形態３》
図４を用いて、本発明の実施の形態３の回路基板の外観検査装置及び回路基板の外観検査方法を説明する。図４は、本発明の実施の形態３の回路基板の外観検査装置の構成を示すブロック図である。
実施の形態３の回路基板の外観検査装置は、実施の形態２と類似する構成を有する。図４において、図３と同一のブロックには同一の符号を付している。実施の形態３の回路基板の外観検査装置は、実施の形態２（図３）における半田印刷装置３０１、電子部品配置装置３０２、半田付け装置３０３、データ管理部３０４、半田印刷部１１１、電子部品配置部１１３、半田付部１１５に代えて、半田印刷装置４０１、電子部品配置装置４０２、半田付け装置４０３、データ管理部４０４、半田印刷部４１１、電子部品配置部４１３、半田付部４１５を有する。実施の形態３の各ブロックの機能は、実施の形態２における同一名称の回路ブロックの機能と基本的に同一である。以下、実施の形態３において、実施の形態２と異なる点のみを説明する。
【００５０】
データ管理部４０４は、第１の３次元測定結果情報１２１、第２の３次元測定結果情報１２２、第３の３次元測定結果情報１２３を入力し、固有識別子に基づいて個々の回路基板毎に第１〜第３の３次元測定結果情報を集計する。固有識別子を用いて集計することにより、製造工程の途中で不良回路基板を取り除いたとしても、回路基板の枚数のカウントずれにより異なる回路基板の３次元測定結果情報を誤って対応付ける恐れは無い。
【００５１】
実施の形態１及び２と同様に、データ管理部４０４は、図２の画像を生成し、出力する。表示部１０５は、その画像を表示する。実施の形態２と同様に、データ管理部４０４は、第１〜第３の判定基準値３３１〜３３３を生成し、それぞれ半田印刷検査部３１２、電子部品配置検査部３１４、半田付検査部３１６に送る。
【００５２】
データ管理部４０４は、更に、半田付の良否判定結果である半田付検査結果データ（第３の３次元測定工程における回路基板の良否判定結果）と、その前の工程である、第１の製造工程（半田印刷部４１１が実行する工程）及び／又は第２の製造工程（電子部品配置部４１３が実行する工程）における設計値（例えば動作条件設定値）と、の因果関係を解析し、その解析結果を出力する（解析工程）。
データ管理部４０４が解析結果を画像信号として出力し、表示部１０５がその画像を表示しても良い。
【００５３】
データ管理部４０４は、解析結果に基づいて、半田付検査結果データにおいて、より高い確率で回路基板が良品と判定されるように、第１の製造工程（半田印刷部４１１が実行する工程）及び／又は第２の製造工程（電子部品配置部４１３が実行する工程）における設計値（例えば動作条件設定値）を自動的に補正する（補正工程）。
データ管理部４０４は、補正された第１の設計値４４１を半田印刷部４１１に送り、補正された第２の設計値４４２を電子部品配置部４１３に送る。
データ管理部４０４は、補正された第３の設計値４４３を半田付部４１５に送る。
半田印刷部４１１は補正された第１の設計値４４１で処理を実行する。電子部品配置部４１３は補正された第２の設計値４４２で処理を実行する。半田付部４１５は、補正された第３の設計値４４３をで処理を実行する。
【００５４】
《実施の形態４》
図５を用いて、本発明の実施の形態４の回路基板の外観検査装置及び回路基板の外観検査方法を説明する。図１は、本発明の実施の形態４の回路基板の外観検査装置の構成を示すブロック図である。実施の形態４の回路基板の外観検査装置は、実施の形態１と同一の構成（図１）を有する。図１は既に説明した。
実施の形態４において、データ管理部１０４が生成する画像（図５）が実施の形態１の画像（図２）と異なる。それ以外の点において、実施の形態４は実施の形態１と同一である。
【００５５】
図５は、実施の形態４のデータ管理部１０４が生成する画像の一例である。図５に示すように、データ管理部１０４は、同一の回路基板の３枚の斜視図２１１〜２１３と、設計イメージ図２０１と、それぞれの斜視図に対応した立体形状データと、回路基板の良否の判定結果（良又は不良の表示）とを同一画面上に表示した画像を生成し、出力する。表示部１０５は、その画像を表示する。
クリーム半田を印刷された回路基板の斜視図２１１に対応させて、回路基板の特定の電子部品の実装位置に印刷されたクリーム半田の高さ、面積、体積（立体形状データ）が表示される。
電子部品を実装した回路基板の斜視図２１２に対応させて、回路基板に実装された特定の電子部品の高さ（このデータに基づき、回路基板から浮いて取り付けられているか否かを判断できる。）、目標位置からのずれ（立体形状データ）が表示される。
半田付された回路基板の斜視図２１３に対応させて、回路基板の半田の高さ、面積、体積（立体形状データ）が表示される。
【００５６】
立体形状データを画面上に表示する電子部品の特定は、製造担当者によって入力される。
連続して同一の回路基板に電子部品を実装して半田付する場合、予め任意に指定された電子部品の近傍の回路基板の３次元測定結果情報（その電子部品の近傍の拡大された斜視図及びその部分の立体形状データ）を、その良否に関係なく表示しても良い。その場合、各回路基板の、予め任意に指定された電子部品の近傍の３次元測定結果情報を、その良否に関係なく全て保持する。
好ましくは、３次元測定結果情報と、その３次元測定結果情報を生成した３次元測定工程の検査条件設定値及び／又はその３次元測定結果情報を生成した３次元測定工程に対応する製造工程の設計値と、を同一画面上に表示する。このことは、実施の形態２又は実施の形態３において、特に有用である。
製造担当者は、表示されたデータに基づいて、適切な設計値及び／又は検査条件設定値を設定することも出来る。
【００５７】
《実施の形態５》
図６を用いて、本発明の実施の形態５の回路基板の外観検査装置及び回路基板の外観検査方法を説明する。図１は、本発明の実施の形態５の回路基板の外観検査装置の構成を示すブロック図である。実施の形態５の回路基板の外観検査装置は、実施の形態１と同一の構成（図１）を有する。図１は既に説明した。
実施の形態５において、データ管理部１０４が生成する画像（図６）が実施の形態１の画像（図２）と異なる。それ以外の点において、実施の形態５は実施の形態１と同一である。
【００５８】
図６は、実施の形態５のデータ管理部１０４が生成する画像の一例である。図６に示すように、データ管理部１０４は、検査対象である同一の回路基板の各３次元測定工程において生成された３枚の斜視図２１１〜２１３と、その３次元測定工程と同一の３次元測定工程において、過去に生成され且つ良品と判定された回路基板の３枚の斜視図（良品半田印刷回路基板、良品部品実装回路基板、良品半田付回路基板）６０１〜６０３とを同一画面上に表示した画像を生成し、出力する。表示部１０５は、その画像を表示する。
実施の形態５において、過去に生成され且つ良品と判定された回路基板の斜視図は、その３次元測定工程において、過去に生成され且つ良品と判定された３次元測定結果情報の平均値から生成された３次元画像情報である。
好ましくは、過去に生成され且つ良品と判定された回路基板の斜視図６０１〜６０３は、斜視図２１１〜２１３と同一位置の視点による斜視図である。
【００５９】
データ管理部１０４は、製造担当者の指示に従い、３枚の斜視図２１１〜２１３を更に座標回転させ、新たに定められた同一位置の視点による複数の斜視図を表示することが出来る。好ましくは、過去に生成され且つ良品と判定された回路基板の斜視図６０１〜６０３も同時に座標回転させ、同一位置の視点による斜視図として表示する。
データ管理部１０４は、製造担当者が電子部品を指定すると、３枚の斜視図２１１〜２１３の、その電子部品が配置される位置の近傍を同一比率で拡大し、表示する。好ましくは、過去に生成され且つ良品と判定された回路基板の斜視図６０１〜６０３も同時にその電子部品が配置される位置の近傍を同一比率で拡大し、表示する。
【００６０】
【発明の効果】
本発明によれば、製造担当者が複数の製造工程における検査データである３次元画像を、同一の視点からひとつの画面上で見ること出来る回路基板の外観検査方法及び回路基板の外観検査装置を実現できるという有利な効果が得られる。印刷後の半田形状、半田上の装着された電子部品の姿勢および半田付け後の半田および部品の状態への遷移を、３次元情報として把握することが可能となる。また、同一部品の工程間の形状変化を視覚的に捉えることが可能となり、検査結果の解析が容易となる。さらに、実装工程の各部及び各検査装置に適切な設定を容易に与えることが可能であり、生産効率、品質の向上の効果を得ることができる。
本発明によれば、後の製造工程における検査データに基づいて、先の製造工程の設計値（例えば動作条件設定値）及び／又は検査条件（例えば良否の判定基準値）を適切に自動的に補正する回路基板の外観検査方法及び回路基板の外観検査装置を実現できるという有利な効果が得られる。
【図面の簡単な説明】
【図１】本発明の実施の形態１の回路基板の外観検査装置の構成を示すブロック図
【図２】本発明の実施の形態１において、データ管理部が生成する画像の一例
【図３】本発明の実施の形態２の回路基板の外観検査装置の構成を示すブロック図
【図４】本発明の実施の形態３の回路基板の外観検査装置の構成を示すブロック図
【図５】本発明の実施の形態４において、データ管理部が生成する画像の一例
【図６】本発明の実施の形態５において、データ管理部が生成する画像の一例
【図７】従来例の電子部品実装装置の構成を示すブロック図
【符号の説明】
１０１、３０１、４０１ 半田印刷装置
１０２、３０２、４０２ 電子部品配置装置
１０３、３０３、４０３ 半田付装置
１０４、３０４、４０４ データ管理部
１０５ 表示部
１１１、４１１ 半田印刷部
１１２、３１２ 半田印刷検査部
１１３、４１３ 電子部品配置部
１１４、３１４ 電子部品配置検査部
１１５、４１５ 半田付部
１１６、３１６ 半田付検査部[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a circuit board appearance inspection method and a circuit board appearance inspection apparatus.
[0002]
[Prior art]
With the miniaturization of the pattern of the circuit board (printed circuit board), the appearance inspection of the circuit board has become important in the manufacturing process of mounting electronic components on the circuit board. Accordingly, various circuit board appearance inspection methods and circuit board appearance inspection apparatuses have been developed.
[0003]
JP-A-5-007100 describes a conventional electronic component mounting apparatus. Hereinafter, a conventional electronic component mounting apparatus will be described with reference to FIG. FIG. 7 is a block diagram showing a configuration of a conventional electronic component mounting apparatus.
7, a bar code printer 701 prints a bar code on a circuit board. The cream solder printing machine 702 prints cream solder on a circuit board. The barcode reader 703 reads the circuit board identifier printed on the circuit board by the barcode printer 701. The print inspection machine 704 inspects a printing state. The print data processing device 707 stores an identifier of the circuit board and inspection data (such as an error between a land position and an actual print position). In addition, a correction signal of the printing condition is output to the cream solder printing machine 702 in accordance with the error, and when the error is equal to or larger than the allowable value, a defective product branch signal is output to the branching device 705. Upon receiving the defective branch signal, the branching device 705 stores the circuit board in the defective stocker 706. The print data processing device 707 appropriately transmits the identifier of the circuit board and the inspection data thereof to the data management unit 720.
[0004]
A component mounter 708 mounts electronic components on a circuit board. The barcode reader 709 reads the identifier of the circuit board. The mounting inspection machine 710 inspects a mounting state. The mounting data processing device 713 stores the identifier of the circuit board and the inspection data (such as an error between the land position and the mounting position of the electronic component). When the error is equal to or larger than the allowable value, a defective product branch signal is output to the branch device 711. Upon receiving the defective branch signal, the branching device 711 stores the circuit board in the defective stocker 712. The mounting data processing device 713 transmits the identifier of the circuit board and its inspection data to the data management unit 720 as appropriate.
[0005]
A reflow device 714 reflows the circuit board and fixes the electronic components. The barcode reader 715 reads the identifier of the circuit board. The soldering inspection machine 710 inspects a soldering state. The soldering data processing device 719 stores an identifier of the circuit board and inspection data (such as a solder bridge). If a defect such as a solder bridge is found, a defective branch signal is output to the branch device 717. Upon receiving the defective branch signal, the branching device 717 stores the circuit board in the defective stocker 718. The soldering data processing device 719 transmits the identifier of the circuit board and its inspection data to the data management unit 720 as appropriate.
[0006]
The data management unit 720 determines the production results, operation results, errors and defects based on the data associated with the circuit board identifier input from the print data processing device 707, the mounting data processing device 713, and the soldering data processing device 719. Stores the trends and dates of occurrence as a database, analyzes the causes of errors and defects, analyzes whether errors and defects are caused by circuit board side errors or processing side errors, and as necessary, each data Feedback is provided to the processing devices 707, 713, and 719.
[0007]
[Patent Document 1]
JP-A-5-007100
[0008]
[Problems to be solved by the invention]
However, in the conventional method for inspecting the appearance of a circuit board, the quality data in each manufacturing process (the cream solder printing process, the electronic component mounting process, and the reflow process) can only be output separately. In many circuit board appearance inspection apparatuses, after repairing a defective product in each manufacturing process, it was not possible to reconfirm as a picture what kind of defect was actually defective in a later manufacturing process. Even in a circuit board appearance inspection device in which a person in charge of manufacturing can view image information in the previous manufacturing process in a later manufacturing process, only a planar image or a three-dimensional image viewed from a different viewpoint for each manufacturing process I could only see it. Inspection data (especially image information) of each manufacturing process could not be three-dimensionally compared from the same viewpoint. For this reason, during the transition of the manufacturing process, it has not been possible to specifically grasp the influence of a change in the three-dimensional shape of the surface of the circuit board causing a mounting failure. Even if the degree of influence of each manufacturing process on the subsequent manufacturing process is predicted, there is a problem that it cannot be actually confirmed. For this reason, it has been difficult for a person in charge of manufacturing to appropriately set the conditions of each manufacturing process and the criteria for the pass / fail judgment in each manufacturing process.
[0009]
SUMMARY OF THE INVENTION The present invention provides a circuit board appearance inspection method and a circuit board appearance inspection apparatus that enable a manufacturing staff to view a three-dimensional image, which is inspection data in a plurality of manufacturing processes, on one screen from the same viewpoint. The purpose is to:
The present invention appropriately and automatically corrects a design value (for example, an operation condition set value) and / or an inspection condition (for example, a pass / fail judgment reference value) of a previous manufacturing process based on inspection data in a later manufacturing process. An object of the present invention is to provide a circuit board appearance inspection method and a circuit board appearance inspection apparatus.
[0010]
[Means for Solving the Problems]
According to the present invention, in a manufacturing process of mounting and soldering an electronic component on a circuit board, the shape of the solder after printing, the posture of the mounted electronic component on the solder, the state of the solder and the component after soldering, and the like are described. It can be displayed as three-dimensional graphic information (may include numerical information such as three-dimensional shape data and vector data). The person in charge of manufacturing can compare these three-dimensional image information and grasp the transition state.
[0011]
The invention according to claim 1 of the present invention is characterized in that after a first manufacturing step of attaching solder to a circuit board based on a design value, the printed shape of the solder printed on the circuit board is measured three-dimensionally. A first three-dimensional measuring step of generating dimension measurement result information; and a second manufacturing step of arranging electronic components based on design values on the circuit board to which solder has been attached in the first manufacturing step. After that, a second three-dimensional measuring step of three-dimensionally measuring the arrangement posture of the electronic component and generating three-dimensional measurement result information, and designing the electronic component on the circuit board on which the electronic component is arranged by the second manufacturing process After a third manufacturing step of applying heat based on the value to fix the electronic component with solder, the shape of the solder and / or the attitude of the electronic component is three-dimensionally measured to generate three-dimensional measurement result information. 3 three-dimensional measurement process Two or more three-dimensional measurement steps, a display step of displaying a plurality of the three-dimensional measurement result information of the same circuit board generated in the two or more three-dimensional measurement steps on the same screen, Wherein the plurality of pieces of three-dimensional measurement result information each include three-dimensional image information, and the three-dimensional image information is a perspective view from a viewpoint at the same position.
[0012]
The present invention can realize a circuit board appearance inspection method and a circuit board appearance inspection apparatus that enable a manufacturing staff to view a three-dimensional image, which is inspection data in a plurality of manufacturing processes, on one screen from the same viewpoint. It has the action of:
The viewpoint at the same position includes a viewpoint at an infinite point (a perspective view without a vanishing point).
[0013]
The invention according to claim 2 of the present invention is characterized in that the three-dimensional measurement result information further includes three-dimensional shape data of the solder and / or the electronic component derived from the three-dimensional image information. 1 is a circuit board appearance inspection method according to 1.
The three-dimensional shape data is, for example, volume data, surface area data, position data, area data, and height data.
[0014]
The invention according to claim 3 of the present invention is characterized in that the circuit board has unique identification information, and in the display step, the unique identification information is recognized, and a plurality of the three-dimensional measurement result information of the same circuit board is provided. 3. The method for inspecting the appearance of a circuit board according to claim 1, wherein said method is selected and displayed on the same screen.
For example, by removing a defective circuit board during the manufacturing process, even if the count value of the number of circuit boards is shifted between the previous manufacturing process and the subsequent manufacturing process, even if the count value of the number of circuit boards is shifted, each manufacturing process for the specific circuit board specified by the user is performed. The three-dimensional measurement result information can be appropriately selected and displayed. Thereby, transition information between manufacturing steps of a specific circuit board can be obtained.
[0015]
According to a fourth aspect of the present invention, in the display step, a plurality of the three-dimensional image information are coordinate-transformed in accordance with a user's instruction, and a plurality of perspective views from a newly determined viewpoint at the same position are displayed. A circuit board appearance inspection method according to any one of claims 1 to 3, characterized in that: From a given viewpoint, the person in charge of manufacturing can compare the three-dimensional image information of each manufacturing process and see the transition state.
[0016]
The invention according to claim 5 of the present invention, in the display step, a plurality of the three-dimensional measurement results of the same circuit board near a position where an arbitrary electronic component specified by a user is arranged. The method for inspecting the appearance of a circuit board according to any one of claims 1 to 4, wherein information is displayed. The person in charge of manufacturing can know the transition state of one electronic component by comparing the three-dimensional image information of each manufacturing process.
[0017]
According to a sixth aspect of the present invention, in the first three-dimensional measurement step and / or the second three-dimensional measurement step, and in the third three-dimensional measurement step, the three-dimensional measurement result information Determining whether the circuit board is good or bad based on the inspection condition setting value, and determining whether the circuit board is good or bad, which is output by the third three-dimensional measurement step, and the first three-dimensional measurement step and / or The method according to any one of claims 1 to 5, further comprising an analysis step of analyzing a causal relationship between the inspection condition set value in the second three-dimensional measurement step and outputting the analysis result. It is an appearance inspection method of the circuit board described in the paragraph.
[0018]
Useful information is obtained as to how the inspection condition set value in the previous manufacturing process is related to the inspection result in the later manufacturing process.
For example, even if the three-dimensional measurement result information of a certain circuit board is determined to be defective in the first three-dimensional measurement step, the three-dimensional measurement result information of the circuit board is determined in the subsequent third three-dimensional measurement step. Is determined as a non-defective product, the inspection condition setting value (for example, the criterion value) in the first three-dimensional measurement process does not have an appropriate causal relationship with the quality result of the circuit board in the third three-dimensional measurement process ( If it is determined in the first three-dimensional measurement step that the circuit board is defective based on the inspection condition setting value, the circuit board is determined to be defective in the third three-dimensional measurement step. (There is no causal relationship that the result of the execution is generated). Preferably, in this case, the inspection condition set value in the first three-dimensional measurement process is automatically corrected to a value having a higher correlation with the result of the quality of the circuit board in the third three-dimensional measurement process.
[0019]
The invention according to claim 7 of the present invention is the circuit board appearance inspection method according to claim 6, wherein, in the display step, the result of the analysis of the causal relationship is displayed. The manufacturing staff can visually know the analysis result.
[0020]
According to an eighth aspect of the present invention, the inspection condition set value in the first three-dimensional measurement step and / or the second three-dimensional measurement step is determined based on the analysis result. 7. The circuit board appearance inspection method according to claim 6, further comprising a correction step of automatically correcting the circuit board to a value having a higher correlation with a quality result of the circuit board in a three-dimensional measurement step.
The inspection condition set value in the previous manufacturing process can be set to an appropriate value based on the inspection result in the later manufacturing process.
[0021]
According to a ninth aspect of the present invention, in any one of the first to third three-dimensional measurement steps, the quality of the circuit board is determined based on the three-dimensional measurement result information. Further comprising an analysis step of analyzing a causal relationship between the result of the pass / fail judgment and the design value in the manufacturing step before the manufacturing step corresponding to the three-dimensional measurement step, and outputting the analysis result. An appearance inspection method for a circuit board according to any one of claims 1 to 5, characterized by:
Useful information is obtained as to how the design values in the previous manufacturing process (for example, the operation setting conditions of the solder printing unit or the like) and the inspection results in the later manufacturing process are related.
[0022]
The invention according to claim 10 of the present invention further includes a correction step of automatically correcting the design value based on the analysis result so that the circuit board is determined as a non-defective product with a higher probability. The method for inspecting the appearance of a circuit board according to claim 9, wherein: The design value in the previous manufacturing process can be set to an appropriate value based on the inspection result in the later manufacturing process.
[0023]
The invention according to claim 11 of the present invention is characterized in that, in the displaying step, the three-dimensional measurement result information and a design value of the manufacturing process corresponding to the three-dimensional measurement step that generated the three-dimensional measurement result information; Is displayed on the same screen. The method for inspecting the appearance of a circuit board according to any one of claims 1 to 10, wherein The manufacturing staff can visually compare the three-dimensional measurement result information with the design value.
[0024]
According to a twelfth aspect of the present invention, in the display step, the three-dimensional measurement result information of the circuit board near the electronic component arbitrarily designated in advance is displayed irrespective of its quality. A circuit board appearance inspection method according to any one of claims 1 to 11, characterized by: In a manufacturing process of continuously manufacturing the same circuit board, the mounting and soldering state of a specific electronic component can be constantly monitored.
[0025]
The invention according to claim 13 of the present invention further comprises a step of retaining all the three-dimensional measurement result information of the circuit board in the vicinity of the electronic component arbitrarily designated in advance, irrespective of its quality. A circuit board appearance inspection method according to any one of claims 1 to 12, characterized by: In a manufacturing process of continuously manufacturing the same circuit board, the mounting and soldering state of a specific electronic component can be constantly monitored.
[0026]
The invention according to claim 14 of the present invention is characterized in that, in the display step, the three-dimensional measurement result information of the circuit board to be inspected generated in any one of the three-dimensional measurement steps, and the three-dimensional measurement step 14. The three-dimensional measurement result information generated in the past in the same three-dimensional measurement step and determined as a non-defective product is displayed on the same screen. It is a circuit board appearance inspection method according to the claims. Since the manufacturing staff can compare the three-dimensional measurement result information determined to be non-defective with the circuit board to be inspected, it is easy to visually judge the quality of the circuit board to be inspected. , The probability of making a wrong decision is reduced.
[0027]
The invention according to claim 15 of the present invention is characterized in that the three-dimensional measurement result information generated in the past and determined to be non-defective is used in the three-dimensional measurement step in the past in the three-dimensional measurement process. The circuit board appearance inspection method according to claim 14, comprising an average value of the measurement result information. Since the three-dimensional measurement result information determined to be non-defective is an image of an average non-defective product (not a particularly excellent non-defective product), the manufacturing staff can more appropriately determine the quality of the circuit board to be inspected by visual judgment. Can be performed.
[0028]
According to a sixteenth aspect of the present invention, there is provided a circuit board appearance inspection apparatus that executes the circuit board appearance inspection method according to any one of the first to fifteenth aspects. . The present invention has the effect of realizing a circuit board appearance inspection apparatus having the same effects as described above.
[0029]
BEST MODE FOR CARRYING OUT THE INVENTION
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments that specifically illustrate the best mode for carrying out the present invention will be described below with reference to the drawings.
[0030]
<< Embodiment 1 >>
First Embodiment A circuit board appearance inspection apparatus and a circuit board appearance inspection method according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a block diagram showing a configuration of a circuit board appearance inspection apparatus according to Embodiment 1 of the present invention.
The circuit board appearance inspection apparatus according to the first embodiment includes a solder printing apparatus (a cream solder printing apparatus in the first embodiment) 101, an electronic component placement apparatus (an electronic component mounting apparatus in the first embodiment) 102, and soldering. The apparatus includes a device (reflow device in Embodiment 1) 103, a data management unit 104 (computer in Embodiment 1), and a display unit 105 (liquid crystal display in Embodiment 1).
The solder printing apparatus 101 has a solder printing unit 111 and a solder printing inspection unit 112.
The electronic component placement device 102 includes an electronic component placement unit 113 and an electronic component placement inspection unit 114. The soldering device 103 includes a soldering unit 115 and a soldering inspection unit 116.
[0031]
First, a barcode printer (not shown) prints a barcode (a unique identifier of the circuit board) at a predetermined position on each circuit board.
The solder printing unit 111 prints cream solder on necessary portions of the circuit board based on the design values (operating condition design values) (first manufacturing process). The method of attaching the solder to the circuit board is arbitrary. For example, the determination may be performed by injection printing using an ink jet printer.
The solder print inspection unit 112 has a barcode reader. The solder print inspection unit 112 reads the bar code and inspects the circuit board on which the cream solder is printed. The solder print inspection unit 112 selects a specific range of the circuit board on which the cream solder is printed by the solder print unit 111, scans the selected range by a three-dimensional measurement method, and outputs three-dimensional three-dimensional shape data of the selected range. Generate The three-dimensional three-dimensional shape data is numerical information such as the height, area, and volume of the cream solder. By repeating this, the solder print inspection unit 112 generates three-dimensional three-dimensional shape data of the entire circuit board on which the cream solder is printed.
[0032]
The solder print inspection unit 112 generates three-dimensional image information of the circuit board on which the cream solder is printed from the three-dimensional three-dimensional shape data. The solder printing inspection unit 112 is based on the three-dimensional three-dimensional shape data and a predetermined inspection condition set value (for example, a quality determination reference value) (typically, by comparing the three-dimensional three-dimensional shape data with the quality determination reference value). Then, print inspection result data, which is the result of the quality judgment of the cream solder printing, is generated (first three-dimensional measurement step). The entire information generated by the solder print inspection unit 112 is referred to as first three-dimensional measurement result information 121.
The solder print inspection unit 112 sends the first three-dimensional measurement result information 121 to the data management unit 104 in association with the unique identifier of the circuit board.
[0033]
The electronic component placement unit 113 places (mounts) the electronic component on the circuit board on which the cream solder is printed, based on the design value (operating condition design value) (second manufacturing process).
The electronic component arrangement inspection unit 114 has a barcode reader. The electronic component placement inspection unit 114 reads the barcode and inspects the circuit board on which the electronic components are mounted.
The electronic component placement inspection unit 114 selects a specific range of the circuit board on which the electronic component is placed (mounted) by the electronic component placement unit 113, scans the selected range by a three-dimensional measurement method, and scans the selected range. Generate three-dimensional solid shape data. The three-dimensional three-dimensional shape data is numerical information such as the position of the mounted electronic component and its arrangement posture. By repeating this, the electronic component placement inspection unit 114 generates three-dimensional three-dimensional shape data of the entire circuit board on which the electronic components are placed (mounted).
[0034]
The electronic component placement inspection unit 114 generates three-dimensional image information of a circuit board on which electronic components are mounted, from the three-dimensional three-dimensional shape data. The electronic component arrangement inspection unit 114 compares the three-dimensional three-dimensional shape data with the quality determination reference value based on the three-dimensional shape data and a predetermined inspection condition setting value (for example, a quality determination reference value). ), Mounting inspection result data which is a result of the quality judgment of the electronic component mounting is generated (second three-dimensional measuring step). The entire information generated by the electronic component placement inspection unit 114 is referred to as second three-dimensional measurement result information 122.
The electronic component arrangement inspection unit 114 sends the second three-dimensional measurement result information 122 to the data management unit 104 in association with the unique identifier of the circuit board.
[0035]
The soldering section 115 (reflow device) reflows (solders) the circuit board on which the electronic component is mounted based on the design value (operating condition design value) (third manufacturing process).
The soldering inspection unit 116 has a barcode reader. The soldering inspection unit 116 reads the barcode and inspects the soldered circuit board.
The soldering inspection unit 116 selects a specific range of the circuit board soldered by the soldering unit 115, scans the selected range by a three-dimensional measurement method, and generates three-dimensional three-dimensional shape data of the selected range. I do. The three-dimensional three-dimensional shape data is numerical information such as the height, area, and volume of the solder, and numerical information such as the position and fixed posture of the electronic component. By repeating this, the soldering inspection unit 116 generates three-dimensional three-dimensional shape data of the entire soldered circuit board.
[0036]
The soldering inspection unit 116 generates three-dimensional image information of the soldered circuit board from the three-dimensional shape data. The soldering inspection unit 116 is based on the three-dimensional solid shape data and a predetermined inspection condition setting value (for example, a pass / fail judgment reference value) (typically, by comparing the three-dimensional solid shape data with the pass / fail judgment reference value). Then, soldering inspection result data, which is a result of soldering quality determination, is generated (third three-dimensional measurement step). The entire information generated by the soldering inspection unit 116 is referred to as third three-dimensional measurement result information 123.
The soldering inspection unit 116 sends the third three-dimensional measurement result information 123 to the data management unit 104 in association with the unique identifier of the circuit board.
[0037]
The data management unit 104 inputs the first three-dimensional measurement result information 121, the second three-dimensional measurement result information 122, and the third three-dimensional measurement result information 123, and for each circuit board based on the unique identifier. The first to third three-dimensional measurement result information is totaled. By counting using the unique identifier, even if a defective circuit board is removed during the manufacturing process, there is no possibility that three-dimensional measurement result information of a different circuit board is erroneously associated due to a count deviation of the number of circuit boards.
[0038]
The data management unit 104 detects a fiducial mark from the three-dimensional image information included in each of the first three-dimensional measurement result information 121, the second three-dimensional measurement result information 122, and the third three-dimensional measurement result information 123. And the surface of the circuit board is detected. Based on the information, the data management unit 104 determines the three-dimensional image included in each of the first three-dimensional measurement result information 121, the second three-dimensional measurement result information 122, and the third three-dimensional measurement result information 123. The information (which may be any two pieces of three-dimensional image information) is aligned, the coordinates are rotated, and three perspective views are generated from a viewpoint at a predetermined position (the same position). Preferably, the three perspective views have the same size (same magnification). The data management unit 104 generates and outputs an image in which three perspective views 211 to 213 of the same circuit board and the design image diagram 201 are displayed on the same screen. The display unit 105 displays the image.
[0039]
FIG. 2 is an example of an image generated by the data management unit 104. 2, a perspective view 211 is a perspective view of a circuit board on which cream solder is printed, a perspective view 212 is a perspective view of a circuit board on which electronic components are mounted, and a perspective view 213 is a perspective view of a soldered circuit board. FIG. The design image diagram 201 is a perspective view of a circuit board on which an ideal (non-defective) cream solder is printed, a perspective view of a circuit board on which electronic components are mounted, or a perspective view of a soldered circuit board. The displayed design image diagram 201 is, from among a perspective view of a circuit board on which cream solder is printed, a perspective view of a circuit board on which electronic components are mounted, and a perspective view of a soldered circuit board, It can be arbitrarily selected. Three design image diagrams in each manufacturing process may be displayed simultaneously. Preferably, the design image diagram 201 is a perspective view from the viewpoint at the same position as the perspective views 211 to 213.
[0040]
The data management unit 104 can further rotate the coordinates of the three perspective views 211 to 213 in accordance with the instruction of the manufacturer and display a plurality of perspective views from the viewpoint of the newly defined same position. Preferably, the design image diagram 201 is also rotated at the same time as the coordinates and displayed as a perspective view from the viewpoint at the same position.
When the person in charge of manufacturing specifies the electronic component, the data management unit 104 enlarges and displays the vicinity of the position where the electronic component is arranged in the three perspective views 211 to 213 at the same ratio and displays the same. Preferably, the design image 201 is also enlarged and displayed at the same ratio in the vicinity of the position where the electronic component is arranged.
[0041]
<< Embodiment 2 >>
Second Embodiment A circuit board appearance inspection apparatus and a circuit board appearance inspection method according to a second embodiment of the present invention will be described with reference to FIG. FIG. 3 is a block diagram showing a configuration of a circuit board appearance inspection apparatus according to Embodiment 2 of the present invention.
The appearance inspection apparatus for a circuit board according to the second embodiment has a configuration similar to that of the first embodiment. 3, the same blocks as those in FIG. 1 are denoted by the same reference numerals. The circuit board appearance inspection apparatus according to the second embodiment includes the solder printing apparatus 101, the electronic component placement apparatus 102, the soldering apparatus 103, the data management unit 104, the solder printing inspection unit 112, and the electronic device according to the first embodiment (FIG. 1). Instead of the component placement inspection unit 114 and the soldering inspection unit 116, a solder printing device 301, an electronic component placement device 302, a soldering device 303, a data management unit 304, a solder print inspection unit 312, an electronic component placement inspection unit 314, a solder An attachment inspection unit 316 is provided. The function of each block of the second embodiment is basically the same as that of the circuit block having the same name in the first embodiment. Hereinafter, only the differences between the second embodiment and the first embodiment will be described.
[0042]
The data management unit 304 receives the first three-dimensional measurement result information 121, the second three-dimensional measurement result information 122, and the third three-dimensional measurement result information 123, in addition to the functions described in the first embodiment. The first to third three-dimensional measurement result information is totalized for each circuit board based on the unique identifier. By counting using the unique identifier, even if a defective circuit board is removed during the manufacturing process, there is no possibility that three-dimensional measurement result information of a different circuit board is erroneously associated due to a count deviation of the number of circuit boards.
[0043]
As in the first embodiment, the data management unit 304 generates and outputs the image of FIG. The display unit 105 displays the image.
[0044]
The data management unit 304 further includes a soldering inspection result data (result of quality determination of the circuit board in the third three-dimensional measurement process) as a result of the quality determination of soldering, and a first three-dimensional process as a preceding process. An inspection condition set value (for example, a pass / fail judgment reference value) in a dimension measurement step (a step measured by the solder print inspection unit 312) and / or a second three-dimensional measurement step (a step measured by the electronic component placement inspection unit 314); Is analyzed, and the result of the analysis is output (analysis step).
The data management unit 304 may output the analysis result as an image signal, and the display unit 105 may display the image.
[0045]
The data management unit 304 measures the first three-dimensional measurement step (the step performed by the solder printing inspection unit 312) and / or the second three-dimensional measurement step (the electronic component placement inspection unit 314) based on the analysis result. The inspection condition set value in the step (3) is automatically corrected to a value having a higher correlation with the result of the quality of the circuit board in the third three-dimensional measurement step (the step measured by the soldering inspection unit 316) (the correction step). ).
The solder printing inspection unit 312 and / or the electronic component arrangement inspection unit 314 performs an inspection using the corrected new inspection condition setting value.
[0046]
For example, in the first three-dimensional measurement process (the process performed by the solder print inspection unit 312), even if the three-dimensional measurement result information of a certain circuit board is determined to be defective, the third three-dimensional measurement process, which is a post-process, is performed. In the (process performed by the soldering inspection unit 316), if the three-dimensional measurement result information of the circuit board is determined to be non-defective, the inspection condition set value (for example, a determination reference value) in the first three-dimensional measurement process is: It does not have a proper causal relationship with the quality result of the circuit board in the third three-dimensional measurement process.
[0047]
The data management unit 304 generates a first determination criterion value 331 that is a test condition setting value corrected based on the analysis result, and sends the first determination criterion value 331 to the solder print inspection unit 312. The solder print inspection unit 312 replaces the inspection condition setting value with the input first determination reference value 331. In the first three-dimensional measurement step (the step performed by the solder print inspection unit 312), the corrected inspection condition set value is corrected if the pass / fail of the circuit board is determined based on the new inspection condition set value. Rather than determining the quality of the circuit board based on the previous inspection condition set value, the determination result and the determination result of the quality of the circuit board in the third three-dimensional measurement step (the step measured by the soldering inspection unit 316) are compared. Is a value that increases the correlation with That is, if the determination result in the first three-dimensional measurement process is a non-defective product, the probability of being determined as a non-defective product in the third three-dimensional measurement process increases, and the determination result in the third three-dimensional measurement process is a defective product. If so, the probability of being determined to be defective in the third three-dimensional measurement process increases.
[0048]
Similarly, the data management unit 304 generates a second determination criterion value 332 that is the inspection condition setting value corrected based on the analysis result, and sends the second determination criterion value 332 to the electronic component placement inspection unit 314. . The electronic component arrangement inspection unit 314 replaces the inspection condition setting value with the input second determination reference value 332. In the second three-dimensional measurement step (the step of measuring by the electronic component arrangement inspection unit 314), the corrected inspection condition setting value is determined based on the new inspection condition setting value based on the new inspection condition setting value. Rather than determining the quality of the circuit board based on the inspection condition setting value before correction, the determination result and the determination of the quality of the circuit board in the third three-dimensional measurement step (the step measured by the soldering inspection unit 316) are performed. The value is such that the correlation with the result is high.
Further, the data management unit 304 generates a third determination criterion value 333, which is an inspection condition setting value corrected based on the analysis result, and sends the third determination criterion value 333 to the soldering inspection unit 316.
[0049]
<< Embodiment 3 >>
Third Embodiment A circuit board appearance inspection apparatus and a circuit board appearance inspection method according to a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a block diagram showing a configuration of a circuit board appearance inspection apparatus according to Embodiment 3 of the present invention.
The appearance inspection apparatus for a circuit board according to the third embodiment has a configuration similar to that of the second embodiment. 4, the same blocks as those in FIG. 3 are denoted by the same reference numerals. The circuit board appearance inspection apparatus according to the third embodiment includes a solder printing apparatus 301, an electronic component placement apparatus 302, a soldering apparatus 303, a data management unit 304, a solder printing unit 111, and an electronic component according to the second embodiment (FIG. 3). In place of the placement unit 113 and the soldering unit 115, a solder printing device 401, an electronic component placement device 402, a soldering device 403, a data management unit 404, a solder printing unit 411, an electronic component placement unit 413, and a soldering unit 415 are provided. . The function of each block of the third embodiment is basically the same as that of the circuit block having the same name in the second embodiment. Hereinafter, only the differences between the third embodiment and the second embodiment will be described.
[0050]
The data management unit 404 inputs the first three-dimensional measurement result information 121, the second three-dimensional measurement result information 122, and the third three-dimensional measurement result information 123, and for each circuit board based on the unique identifier. The first to third three-dimensional measurement result information is totaled. By counting using the unique identifier, even if a defective circuit board is removed during the manufacturing process, there is no possibility that three-dimensional measurement result information of a different circuit board is erroneously associated due to a count deviation of the number of circuit boards.
[0051]
As in the first and second embodiments, the data management unit 404 generates and outputs the image of FIG. The display unit 105 displays the image. As in the second embodiment, the data management unit 404 generates the first to third determination reference values 331 to 333 and sends them to the solder print inspection unit 312, the electronic component arrangement inspection unit 314, and the soldering inspection unit 316, respectively. send.
[0052]
The data management unit 404 further includes a soldering inspection result data (a result of the circuit board quality determination in the third three-dimensional measurement process) as a result of the soldering quality determination, and a first manufacturing process, which is a preceding process. A causal relationship between a design value (for example, an operation condition setting value) in a process (a process executed by the solder printing unit 411) and / or a second manufacturing process (a process executed by the electronic component placement unit 413) is analyzed. Output the analysis result (analysis step).
The data management unit 404 may output the analysis result as an image signal, and the display unit 105 may display the image.
[0053]
The data management unit 404 performs a first manufacturing process (a process performed by the solder printing unit 411) and a process so that the circuit board is determined as a non-defective product with a higher probability in the soldering inspection result data based on the analysis result. And / or automatically correct design values (for example, operating condition set values) in the second manufacturing process (the process executed by the electronic component placement unit 413) (correction process).
The data management unit 404 sends the corrected first design value 441 to the solder printing unit 411 and sends the corrected second design value 442 to the electronic component placement unit 413.
The data management unit 404 sends the corrected third design value 443 to the soldering unit 415.
The solder printing unit 411 executes the process with the corrected first design value 441. The electronic component placement unit 413 executes a process using the corrected second design value 442. The soldering unit 415 performs a process using the corrected third design value 443.
[0054]
<< Embodiment 4 >>
Fourth Embodiment A circuit board appearance inspection apparatus and a circuit board appearance inspection method according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 1 is a block diagram showing a configuration of a circuit board appearance inspection apparatus according to Embodiment 4 of the present invention. The appearance inspection apparatus for a circuit board according to the fourth embodiment has the same configuration as that of the first embodiment (FIG. 1). FIG. 1 has already been described.
In the fourth embodiment, the image (FIG. 5) generated by the data management unit 104 is different from the image (FIG. 2) of the first embodiment. Otherwise, Embodiment 4 is the same as Embodiment 1.
[0055]
FIG. 5 is an example of an image generated by the data management unit 104 according to the fourth embodiment. As shown in FIG. 5, the data management unit 104 includes three perspective views 211 to 213 of the same circuit board, a design image diagram 201, three-dimensional shape data corresponding to each perspective view, and the quality of the circuit board. An image in which the determination result (display of good or bad) is displayed on the same screen is generated and output. The display unit 105 displays the image.
Corresponding to the perspective view 211 of the circuit board on which the cream solder is printed, the height, area, and volume (three-dimensional shape data) of the cream solder printed on the specific electronic component mounting position on the circuit board are displayed.
Corresponding to the perspective view 212 of the circuit board on which the electronic component is mounted, the height of the specific electronic component mounted on the circuit board (based on this data, it can be determined whether or not the electronic component is mounted floating from the circuit board. ), A deviation from the target position (solid shape data) is displayed.
The height, area, and volume (three-dimensional shape data) of the solder on the circuit board are displayed corresponding to the perspective view 213 of the soldered circuit board.
[0056]
The electronic component for displaying the three-dimensional shape data on the screen is specified by a person in charge of manufacturing.
When electronic components are successively mounted on the same circuit board and soldered, three-dimensional measurement result information of the circuit board near an electronic component arbitrarily designated in advance (an enlarged perspective view of the vicinity of the electronic component) And the three-dimensional shape data of the portion) may be displayed regardless of the quality. In this case, all the three-dimensional measurement result information in the vicinity of an electronic component arbitrarily designated in advance on each circuit board is held irrespective of its quality.
Preferably, the three-dimensional measurement result information, the inspection condition set value of the three-dimensional measurement process that generated the three-dimensional measurement result information, and / or the manufacturing process corresponding to the three-dimensional measurement process that generated the three-dimensional measurement result information And the design value are displayed on the same screen. This is particularly useful in the second embodiment or the third embodiment.
The manufacturer can also set appropriate design values and / or inspection condition setting values based on the displayed data.
[0057]
<< Embodiment 5 >>
Embodiment 5 A circuit board appearance inspection apparatus and a circuit board appearance inspection method according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 1 is a block diagram showing a configuration of a circuit board appearance inspection apparatus according to Embodiment 5 of the present invention. The appearance inspection apparatus for a circuit board according to the fifth embodiment has the same configuration as that of the first embodiment (FIG. 1). FIG. 1 has already been described.
In the fifth embodiment, the image (FIG. 6) generated by the data management unit 104 is different from the image (FIG. 2) of the first embodiment. Otherwise, Embodiment 5 is the same as Embodiment 1.
[0058]
FIG. 6 is an example of an image generated by the data management unit 104 according to the fifth embodiment. As shown in FIG. 6, the data management unit 104 includes three perspective views 211 to 213 generated in each of the three-dimensional measurement processes on the same circuit board to be inspected, and the same three-dimensional measurement process as the three-dimensional measurement process. In the dimension measurement step, three perspective views (good solder printed circuit board, good component mounting circuit board, good soldered circuit board) 601 to 603 of the circuit board generated in the past and determined to be good are on the same screen. Generate and output the image displayed in. The display unit 105 displays the image.
In the fifth embodiment, the perspective view of the circuit board generated in the past and determined to be non-defective is generated from the average value of the three-dimensional measurement result information generated in the past and determined to be non-defective in the three-dimensional measurement process. 3D image information.
Preferably, the perspective views 601 to 603 of the circuit boards generated in the past and determined to be non-defective are perspective views at the same positions as the perspective views 211 to 213.
[0059]
The data management unit 104 can further rotate the coordinates of the three perspective views 211 to 213 in accordance with the instruction of the manufacturer and display a plurality of perspective views from the viewpoint of the newly defined same position. Preferably, the perspective views 601 to 603 of the circuit boards generated in the past and determined to be non-defective are also rotated at the same time, and displayed as perspective views from the viewpoint of the same position.
When the person in charge of manufacturing specifies the electronic component, the data management unit 104 enlarges and displays the vicinity of the position where the electronic component is arranged in the three perspective views 211 to 213 at the same ratio and displays the same. Preferably, perspective views 601 to 603 of the circuit boards generated in the past and determined to be non-defective are also enlarged and displayed at the same ratio in the vicinity of the position where the electronic component is arranged.
[0060]
【The invention's effect】
According to the present invention, there is provided a circuit board appearance inspection method and a circuit board appearance inspection apparatus that enable a manufacturing staff to view a three-dimensional image, which is inspection data in a plurality of manufacturing processes, on one screen from the same viewpoint. The advantageous effect that it can be realized is obtained. The shape of the solder after printing, the attitude of the mounted electronic component on the solder, and the transition to the state of the solder and component after soldering can be grasped as three-dimensional information. In addition, it is possible to visually grasp a change in shape between processes of the same part, and analysis of inspection results is facilitated. Furthermore, it is possible to easily give appropriate settings to each part of the mounting process and each inspection device, and it is possible to obtain effects of improving production efficiency and quality.
According to the present invention, based on inspection data in a later manufacturing process, a design value (for example, an operation condition set value) and / or an inspection condition (for example, a pass / fail judgment reference value) of a previous manufacturing process are automatically and appropriately set. An advantageous effect is obtained that a circuit board appearance inspection method and a circuit board appearance inspection device to be corrected can be realized.
[Brief description of the drawings]
FIG. 1 is a block diagram illustrating a configuration of a circuit board appearance inspection apparatus according to a first embodiment of the present invention.
FIG. 2 is an example of an image generated by a data management unit according to the first embodiment of the present invention.
FIG. 3 is a block diagram illustrating a configuration of a circuit board appearance inspection apparatus according to a second embodiment of the present invention;
FIG. 4 is a block diagram showing a configuration of a circuit board appearance inspection apparatus according to a third embodiment of the present invention;
FIG. 5 is an example of an image generated by a data management unit according to the fourth embodiment of the present invention.
FIG. 6 is an example of an image generated by a data management unit according to the fifth embodiment of the present invention.
FIG. 7 is a block diagram showing a configuration of a conventional electronic component mounting apparatus.
[Explanation of symbols]
101, 301, 401 Solder printing device
102, 302, 402 Electronic component placement device
103, 303, 403 Soldering equipment
104, 304, 404 Data management unit
105 Display
111, 411 Solder printing section
112, 312 Solder print inspection section
113, 413 Electronic component placement unit
114, 314 Electronic component placement inspection unit
115, 415 Soldering part
116, 316 Soldering inspection section

Claims (16)

設計値に基づいて半田を回路基板に付着させる第１の製造工程の後に、前記回路基板に印刷された半田の印刷形状を３次元測定し、３次元測定結果情報を生成する第１の３次元測定工程と、
前記第１の製造工程により半田を付着された前記回路基板に対し、設計値に基づいて電子部品を配置する第２の製造工程の後に、前記電子部品の配置姿勢を３次元測定し、３次元測定結果情報を生成する第２の３次元測定工程と、
前記第２の製造工程により前記電子部品を配置された前記回路基板に設計値に基づいて熱を加えて前記電子部品を半田で定着させる第３の製造工程の後に、半田の形状及び／又は前記電子部品の姿勢を３次元測定し、３次元測定結果情報を生成する第３の３次元測定工程と、
のうち少なくとも２つ以上の３次元測定工程と、
２つ以上の前記３次元測定工程で生成された、同一の前記回路基板の複数の前記３次元測定結果情報を同一画面上に表示する表示工程と、
を有し、複数の前記３次元測定結果情報はそれぞれ３次元画像情報を含み、前記３次元画像情報は同一位置の視点による斜視図であることを特徴とする回路基板の外観検査方法。After a first manufacturing process of attaching solder to a circuit board based on a design value, a first three-dimensional measurement of three-dimensionally measuring a printed shape of the solder printed on the circuit board and generating three-dimensional measurement result information The measuring process,
After a second manufacturing step of arranging electronic components based on design values on the circuit board to which solder has been attached in the first manufacturing step, the arrangement orientation of the electronic components is three-dimensionally measured. A second three-dimensional measurement step of generating measurement result information;
After a third manufacturing step of applying heat to the circuit board on which the electronic component is disposed by the second manufacturing step based on a design value to fix the electronic component with solder, the shape of the solder and / or A third three-dimensional measurement step of three-dimensionally measuring the attitude of the electronic component and generating three-dimensional measurement result information;
At least two or more three-dimensional measurement steps;
A display step of displaying, on the same screen, a plurality of the three-dimensional measurement result information of the same circuit board generated in two or more of the three-dimensional measurement steps;
Wherein the plurality of pieces of three-dimensional measurement result information each include three-dimensional image information, and the three-dimensional image information is a perspective view from the viewpoint of the same position. 前記３次元測定結果情報は、更に前記３次元画像情報から導出された半田及び／又は前記電子部品の立体形状データを含むことを特徴とする請求項１に記載の回路基板の外観検査方法。The method of claim 1, wherein the three-dimensional measurement result information further includes three-dimensional shape data of the solder and / or the electronic component derived from the three-dimensional image information. 前記回路基板は固有識別情報を有し、前記表示工程において、前記固有識別情報を認識し、同一の前記回路基板の複数の前記３次元測定結果情報を選択して、同一画面上に表示することを特徴とする請求項１又は請求項２に記載の回路基板の外観検査方法。The circuit board has unique identification information, and in the display step, the unique identification information is recognized, and a plurality of the three-dimensional measurement result information of the same circuit board is selected and displayed on the same screen. The circuit board appearance inspection method according to claim 1 or 2, wherein: 前記表示工程において、ユーザの指示に従って複数の前記３次元画像情報を座標変換し、新たに定められた同一位置の視点による複数の斜視図を表示することを特徴とする請求項１から請求項３のいずれかの請求項に記載の回路基板の外観検査方法。4. The display step, wherein a plurality of the three-dimensional image information are coordinate-transformed in accordance with a user's instruction, and a plurality of perspective views from a newly determined viewpoint at the same position are displayed. 5. The circuit board appearance inspection method according to claim 1. 前記表示工程において、同一の前記回路基板についての、ユーザにより指定された任意の前記電子部品が配置される位置の近傍の複数の前記３次元測定結果情報を表示することを特徴とする請求項１から請求項４のいずれかの請求項に記載の回路基板の外観検査方法。The display step displays a plurality of pieces of the three-dimensional measurement result information in the vicinity of a position where an arbitrary electronic component specified by a user is arranged on the same circuit board. The circuit board appearance inspection method according to any one of claims 1 to 4. 前記第１の３次元測定工程及び／又は前記第２の３次元測定工程と、前記第３の３次元測定工程とにおいて、前記３次元測定結果情報と検査条件設定値とに基づいて前記回路基板の良否を判定し、
前記第３の３次元測定工程が出力する前記回路基板の良否判定結果と、前記第１の３次元測定工程及び／又は前記第２の３次元測定工程における前記検査条件設定値と、の因果関係を解析し、その解析結果を出力する解析工程を更に有することを特徴とする請求項１から請求項５のいずれかの請求項に記載の回路基板の外観検査方法。In the first three-dimensional measurement step and / or the second three-dimensional measurement step and the third three-dimensional measurement step, the circuit board is formed based on the three-dimensional measurement result information and an inspection condition setting value. Judge the quality of
Causal relationship between the quality judgment result of the circuit board output by the third three-dimensional measurement step and the inspection condition set value in the first three-dimensional measurement step and / or the second three-dimensional measurement step 6. The method for inspecting the appearance of a circuit board according to claim 1, further comprising an analysis step of analyzing the data and outputting the analysis result. 前記表示工程において、前記因果関係の解析結果を表示することを特徴とする請求項６に記載の回路基板の外観検査方法。7. The method according to claim 6, wherein in the displaying step, a result of the analysis of the causal relationship is displayed. 前記解析結果に基づいて、前記第１の３次元測定工程及び／又は前記第２の３次元測定工程の前記検査条件設定値を、前記第３の３次元測定工程における前記回路基板の良否結果とより高い相関関係を有する値に自動的に補正する補正工程を更に有することを特徴とする請求項６に記載の回路基板の外観検査方法。Based on the analysis result, the inspection condition set value in the first three-dimensional measurement step and / or the second three-dimensional measurement step is determined by comparing the pass / fail result of the circuit board in the third three-dimensional measurement step. The method according to claim 6, further comprising a correction step of automatically correcting the value to a value having a higher correlation. 前記第１から第３の３次元測定工程のいずれかの３次元測定工程において、前記３次元測定結果情報に基づいて前記回路基板の良否を判定し、
その良否判定結果と、その３次元測定工程に対応する前記製造工程より前の前記製造工程における前記設計値と、の因果関係を解析し、その解析結果を出力する解析工程を更に有することを特徴とする請求項１から請求項５のいずれかの請求項に記載の回路基板の外観検査方法。In any one of the first to third three-dimensional measurement steps, the quality of the circuit board is determined based on the three-dimensional measurement result information,
An analysis step of analyzing a causal relationship between the result of the pass / fail judgment and the design value in the manufacturing step prior to the manufacturing step corresponding to the three-dimensional measurement step, and outputting the analysis result. The circuit board appearance inspection method according to any one of claims 1 to 5, wherein: 前記解析結果に基づいて、より高い確率で前記回路基板が良品と判定されるように、前記設計値を自動的に補正する補正工程を更に有することを特徴とする請求項９に記載の回路基板の外観検査方法。The circuit board according to claim 9, further comprising a correction step of automatically correcting the design value so that the circuit board is determined to be non-defective with a higher probability based on the analysis result. Appearance inspection method. 前記表示工程において、前記３次元測定結果情報と、その３次元測定結果情報を生成した前記３次元測定工程に対応する前記製造工程の設計値と、を同一画面上に表示することを特徴とする請求項１から請求項１０のいずれかの請求項に記載の回路基板の外観検査方法。In the display step, the three-dimensional measurement result information and a design value of the manufacturing process corresponding to the three-dimensional measurement step that generated the three-dimensional measurement result information are displayed on the same screen. The circuit board appearance inspection method according to any one of claims 1 to 10. 前記表示工程において、予め任意に指定された前記電子部品の近傍の前記回路基板の前記３次元測定結果情報を、その良否に関係なく表示することを特徴とする請求項１から請求項１１のいずれかの請求項に記載の回路基板の外観検査方法。12. The display step according to claim 1, wherein the three-dimensional measurement result information of the circuit board near the electronic component arbitrarily designated in advance is displayed irrespective of its quality. A method for inspecting the appearance of a circuit board according to claim 1. 予め任意に指定された前記電子部品の近傍の前記回路基板の前記３次元測定結果情報を、その良否に関係なく全て保持する工程を更に有することを特徴とする請求項１から請求項１２のいずれかの請求項に記載の回路基板の外観検査方法。13. The method according to claim 1, further comprising a step of retaining all the three-dimensional measurement result information of the circuit board near the electronic component arbitrarily designated in advance, irrespective of the quality. A method for inspecting the appearance of a circuit board according to claim 1. 前記表示工程において、いずれかの前記３次元測定工程で生成された検査対象である前記回路基板の前記３次元測定結果情報と、その３次元測定工程と同一の前記３次元測定工程で過去に生成され且つ良品と判定された前記３次元測定結果情報と、を同一画面上に表示することを特徴とする請求項１から請求項１３のいずれかの請求項に記載の回路基板の外観検査方法。In the display step, the three-dimensional measurement result information of the circuit board to be inspected generated in any one of the three-dimensional measurement steps, and the three-dimensional measurement result information generated in the past in the same three-dimensional measurement step as the three-dimensional measurement step 14. The circuit board appearance inspection method according to claim 1, wherein the three-dimensional measurement result information determined as non-defective is displayed on the same screen. 過去に生成され且つ良品と判定された前記３次元測定結果情報が、その３次元測定工程において、過去に生成され且つ良品と判定された前記３次元測定結果情報の平均値からなることを特徴とする請求項１４に記載の回路基板の外観検査方法。The three-dimensional measurement result information generated in the past and determined to be non-defective is composed of an average value of the three-dimensional measurement result information generated in the past and determined to be non-defective in the three-dimensional measurement process. The method for inspecting the appearance of a circuit board according to claim 14. 請求項１から請求項１５のいずれかの請求項に記載の回路基板の外観検査方法を実行することを特徴とする回路基板の外観検査装置。A circuit board appearance inspection apparatus that performs the circuit board appearance inspection method according to any one of claims 1 to 15.
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