JP2014093533A - Board inspection apparatus system and board inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for inspecting a board, capable of establishing an effective inspection condition.SOLUTION: A board inspection apparatus system comprises: an SPI device; an electronic component mounting device; an AIO device; and an information transfer section. The SPI device acquires first three-dimensional information of a solder paste applied on a board, and inspects whether the solder paste is formed good by a preset first tolerance on the basis of the information. The electronic component mounting device mounts an electronic component on the board, on which the solder paste has been applied, to join the electronic component and the solder paste each other. The AOI device acquires second three-dimensional information of a solder joint where the electronic component and the solder paste are joined and inspects whether the electronic component is mounted good by a preset second tolerance on the basis of the second three-dimensional information. The information transfer section transfers the first three-dimensional information of the solder paste to the AOI device, or transfers the second three-dimensional information to the SPI device. Thus, an effective inspection condition can be established, and a rate of defect for each apparatus can be greatly reduced.

Description

  The present invention relates to a system for a substrate inspection apparatus, and more particularly to a substrate inspection apparatus and a substrate inspection method capable of setting effective inspection conditions.

  In general, at least one printed circuit board (PCB) is provided in an electronic device, and a circuit pattern, a connection pad portion, and the connection pad portion are electrically connected to the printed circuit board. Various circuit elements such as connected driving chips are mounted.

  In general, a mounting board in which electronic components are mounted on a printed circuit board is used in various electronic products. Such a mounting substrate is manufactured by applying lead to the pad region of the bare substrate and then bonding the terminals of the electronic component to the lead application region.

  Before the electronic component is mounted on the printed circuit board, a solder paste inspection (SPI) process for inspecting whether or not lead is properly applied to the pad area of the printed circuit board is performed. In addition, after the electronic component is mounted on the printed circuit board, there is an automated optical inspection (AOI) process for detecting various types of defects with respect to whether the electronic component is properly soldered to the printed circuit board. Carried out.

  Conventionally, the SPI process is performed through three-dimensional shape measurement, the AOI process is performed mainly through two-dimensional shape measurement, and both inspection methods have been performed independently of each other.

  Accordingly, conventionally, the SPI process has been mainly performed through three-dimensional shape measurement, and the AOI process has been mainly performed through two-dimensional shape measurement. Therefore, the result of any one inspection is applied to another inspection. There was a difficult problem. However, it may be advantageous to set a more effective inspection condition than when any one inspection result is used for other inspections.

  Therefore, the problem to be solved by the present invention is to provide a substrate inspection apparatus system and a substrate inspection method capable of setting effective inspection conditions.

  A substrate inspection apparatus system according to an exemplary embodiment of the present invention includes a first apparatus, a second apparatus, a third apparatus, and an information transmission unit. The first apparatus acquires first three-dimensional information of a solder paste applied on a substrate, and the solder paste is defective according to a first tolerance set based on the first three-dimensional information. Check availability. The second device mounts the electronic component on a substrate coated with the solder paste so that the electronic component and the solder paste are bonded to each other. The third device acquires second three-dimensional information of a solder joint where the electronic component and the solder paste are joined, and the electronic device is set in accordance with a second allowable range set based on the second three-dimensional information. Inspect for possible component mounting defects. The information transmission unit transmits first three-dimensional information of the solder paste to the third device, or transmits second three-dimensional information of the solder joint to the first device.

  As an example, the second 3D information of the solder joint may include shape information of the solder joint, and the first device uses the shape information of the solder joint transmitted from the information transmission unit. The first allowable range may be corrected. For example, when the curvature information extracted from the shape of the solder joint is not included in the second allowable range as the case where the bulk information of the solder paste is included in the first allowable range, the first allowable range is already set. It may be corrected more narrowly by the set value. For example, when the curvature extracted from the shape of the solder joint is included in the second allowable range, the first allowable range may be modified more widely by a preset value.

  In one embodiment, the first three-dimensional information of the solder paste includes bulk information of the solder paste, and the third device uses the bulk information of the solder paste transmitted from the information transmission unit. The allowable range may be corrected.

  The information transmission unit may be formed in at least one of the first device and the third device.

  A substrate inspection apparatus system according to another exemplary embodiment of the present invention includes a first apparatus, a second apparatus, a third apparatus, and an information transmission unit. The first device acquires first three-dimensional information of the solder paste applied on the substrate, and determines whether the solder paste is defective according to a first tolerance set based on the first three-dimensional information. inspect. The second device mounts the electronic component on a substrate coated with the solder paste so that the electronic component and the solder paste are bonded to each other. The third device acquires second three-dimensional information of a solder joint where the electronic component and the solder paste are joined, and the electronic device is set in accordance with a second allowable range set based on the second three-dimensional information. Inspect for possible component mounting defects. The information transmission unit transmits first three-dimensional information of the solder paste to the third device, or transmits second three-dimensional information of the solder joint to the first device. The first device corrects the first allowable range using the second three-dimensional information transmitted from the information transmission unit, or the third device transmits the first information transmitted from the information transmission unit. The second allowable range is corrected using three-dimensional information.

  In order to inspect a substrate according to another exemplary embodiment of the present invention, first, first 3D information of a solder paste applied on the substrate is obtained, and based on the first 3D information. The solder paste is inspected for defects according to a preset first allowable range. Subsequently, the electronic component is mounted on the substrate coated with the solder paste so that the electronic component and the solder paste are bonded to each other. Next, the second three-dimensional information of a solder joint where the electronic component and the solder paste are joined is acquired, and the electronic component mounting is performed according to a second allowable range set based on the second three-dimensional information. Inspect for defects. Subsequently, at least one of the first allowable range and the second allowable range is corrected based on the first three-dimensional information of the solder paste and the second three-dimensional information of the solder joint.

  A substrate inspection apparatus system according to another exemplary embodiment of the present invention includes a first apparatus, a second apparatus, a database, and an alarm generation apparatus. The first device acquires first three-dimensional information of the solder paste applied on the substrate, and determines whether the solder paste is defective according to a first tolerance set based on the first three-dimensional information. inspect. The second apparatus acquires second three-dimensional information for inspecting whether or not an electronic component mounted on the substrate coated with the solder paste is defective, and based on the second three-dimensional information. Whether or not the electronic component is mounted is inspected according to a preset second allowable range. The database stores first three-dimensional information of the first device and second three-dimensional information of the second device. The alarm generating device receives the first three-dimensional information and the second three-dimensional information from the database, and the first allowable range when the second three-dimensional information leaves the second allowable range. Raise the alarm message to correct.

  As an example, the first three-dimensional information includes bulk information of the solder paste, and the second three-dimensional information includes a solder joint obtained by quantifying the degree of bonding between the solder paste and the electronic component. Score information may be included. In this case, the alarm generation device receives the solder paste bulk information and the solder joint score information from the database, and the solder joint score information leaves the second allowable range. The alarm message is generated to correct the error.

  As an example, the solder paste may be applied at at least two points corresponding to the electronic component. In this case, the first three-dimensional information includes volume difference information that is a difference between the volumes of the solder paste with respect to each of the two points, and the second three-dimensional information includes the electronic component. Co-planarity information indicating the degree of inclination with respect to the horizontal may be included. At this time, the alarm generation device receives the difference information and the same flatness information from the database, and corrects the first allowable range when the same flatness information leaves the second allowable range. The alarm message is generated.

  In one embodiment, the second device acquires third three-dimensional information for checking whether the electronic component is defective after the electronic component is placed on the substrate and before a reflow process. The electronic component is checked for defects according to a third tolerance set based on the third three-dimensional information, the database stores the third three-dimensional information, and the previous alarm generator is And receiving the second three-dimensional information and the third three-dimensional information from the database, and correcting the third allowable range when the second three-dimensional information leaves the second allowable range. Alarm message.

  A substrate inspection apparatus system according to still another embodiment of the present invention includes an SPI apparatus, a first AOI apparatus, a second AOI apparatus, a database, and an alarm generation apparatus. The SPI device acquires first three-dimensional information of the solder paste applied on the substrate, and inspects whether or not the solder paste is defective according to a first allowable range set based on the first three-dimensional information. To do. After the reflow process, the first AOI device acquires second three-dimensional information on the mounting state of the electronic component, and the electronic component of the electronic component is set according to a second allowable range set based on the second three-dimensional information. Inspect for possible mounting failure. The second AOI device acquires third three-dimensional information on the mounting state of the electronic component before the reflow process, and the electronic component of the electronic component is set according to a third allowable range set based on the third three-dimensional information. Inspect for possible mounting failure. The database stores first three-dimensional information of the SPI device and second and third three-dimensional information of the AOI device. The alarm generator receives the first three-dimensional information, the second three-dimensional information, and the third three-dimensional information from the database, and receives the first, second, and third three-dimensional information. If any one of the information leaves the preset allowable range, an alarm message is generated so as to correct at least one of the remaining information.

  As an example, the alarm generation device receives the transmission of the first three-dimensional information and the third three-dimensional information from the database, and the third three-dimensional information leaves the third allowable range. An alarm message is generated to correct the first tolerance.

  In one embodiment, the alarm generating device receives the second three-dimensional information and the third three-dimensional information from the database, and the second three-dimensional information leaves the second allowable range. An alarm message is generated to correct the third tolerance.

  As an example, the first three-dimensional information includes solder paste offset information indicating a degree away from a position where the solder paste is to be formed, and the third three-dimensional information includes the electronic component. Prior to performing the reflow process, pre-offset information of an electronic component representing information away from a position where the electronic component is to be mounted may be included. At this time, the alarm generation device receives the information on the solder paste offset and the previous-offset information from the database, and if the previous-offset information leaves the third allowable range, the first allowable range is set. An alarm message may be generated to correct.

  As an example, the second three-dimensional information includes post-offset information of an electronic component representing a degree away from a position where the electronic component is to be mounted after the electronic component is mounted and a reflow process is performed. The third three-dimensional information may include pre-offset information of an electronic component representing a degree away from a position where the electronic component is to be mounted before the electronic component is mounted and the reflow process is performed. . At this time, the alarm generation device receives the transmission of the front-offset information and the rear-offset information from the database, and corrects the third allowable range when the rear-offset information leaves the second allowable range. An alarm message may be generated as described.

  According to the present invention, the inspection result can be shared between the SPI device and the AOI device by acquiring the three-dimensional information by the SPI device and the AOI device and exchanging the acquired three-dimensional information with each other. .

  Specifically, 3D information of solder paste and 3D information of solder joint are respectively acquired by the SPI device and the AOI device, and the acquired 3D information is exchanged with each other, and any one inspection result is used for another inspection. By utilizing it, the inspection conditions of both apparatuses can be applied as more effective inspection conditions.

  Also, the three-dimensional measurement results of the SPI device and the AOI device are stored in a database, and when one of the inspection results leaves the allowable range when the alarm generation device receives the transmission of the three-dimensional information from the database, an alarm is given to another inspection. By generating a message, the inspection condition can be corrected more effectively automatically or passively.

  In other words, by exchanging the inspection result information acquired from each device through the linkage between the SPI device and the AOI device, it is possible to flexibly reduce or widen the allowable defect tolerance range set in each device. There is an advantage that various false errors that occur during the SPI and AOI tests can be dramatically reduced by performing the adjustment.

It is a block diagram which shows the board | substrate inspection apparatus system by one Example of this invention. It is a block diagram which shows the board | substrate inspection apparatus system by the other Example of this invention. It is a block diagram which shows the board | substrate inspection apparatus system by the other Example of this invention. 4 is a graph showing an example in which the board inspection apparatus system of FIG. 3 generates an alarm message. 4 is a graph showing an example in which the board inspection apparatus system of FIG. 3 generates an alarm message. It is a graph which shows the other Example in which the board | substrate inspection apparatus system of FIG. 3 generates an alarm message. It is a graph which shows the other Example in which the board | substrate inspection apparatus system of FIG. 3 generates an alarm message. It is a block diagram which shows the board | substrate inspection apparatus system by further another Example of this invention. FIG. 9 is a conceptual diagram illustrating an embodiment in which the board inspection apparatus system of FIG. 8 generates an alarm message.

  The present invention can be variously modified and can have various forms. Here, specific embodiments are illustrated in the drawings and described in detail in the text. However, this should not be construed as limiting the invention to the specific forms disclosed, but includes all modifications, equivalents or alternatives that fall within the spirit and scope of the invention.

  Terms such as first and second may be used to describe various components, but the components are not limited to the terms. The terms are used only for the purpose of distinguishing one component from another. For example, the first component can be referred to as the second component without departing from the scope of rights of the present invention, and similarly, the second component can also be referred to as the first component.

  The terms used in the present application are merely used to describe particular embodiments, and are not intended to limit the present invention. The singular form includes the plural form unless the context clearly indicates otherwise. In this application, terms such as “comprising” or “having” mean that there are features, numbers, steps, steps, actions, components, parts or combinations thereof described in the specification. It should be understood as not excluding in advance the presence or applicability of one or more other features or numbers, steps, steps, actions, components, parts or combinations thereof.

  Unless defined otherwise, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Have.

  The same terms as those defined in commonly used dictionaries should be construed to have meanings that are consistent with those in the context of the related art and are ideal or not defined unless explicitly defined in this application. Is not overly interpreted in a formal sense.

  Hereinafter, a preferred embodiment of the present invention will be described in more detail with reference to the drawings.

  FIG. 1 is a block diagram showing a substrate inspection apparatus system according to an embodiment of the present invention.

  Referring to FIG. 1, a substrate inspection apparatus system 100 according to an embodiment of the present invention includes a solder paste inspection (SPI) apparatus 110, an electronic component mounting apparatus 120, and a reflow (not shown). In addition, an automatic optical inspection (AOI) 130, an information transmission unit 140, and the like may be included.

  The board inspection apparatus system 100 receives a board such as a printed circuit board (PCB) and inspects whether or not the board is defective. After receiving the transmission of the substrate, the substrate inspection apparatus system 100 inspects whether the solder paste is properly applied by using the SPI apparatus 110 and first inspects whether there is a defect. Subsequently, after mounting the electronic component on the substrate on which the solder paste has been applied using the electronic component mounting apparatus 120, for example, the solder paste applied on the substrate is melted through a reflow process using reflow equipment. Thus, the electronic component can be mounted on the substrate. Next, using the AOI device 130, the electronic component formed on the substrate is inspected as to whether the electronic component is mounted on the substrate or not, and secondarily inspected for defects.

  As described above, the AOI device 130 is basically disposed after the reflow process and inspects whether or not the electronic component mounted on the board is defective. Therefore, the AOI device 130 is disposed between the electronic component mounting device 120 and the reflow. Or you may arrange | position at the reflow process front end and back end, respectively.

  The block arrows shown in FIG. 1 indicate the flow of the substrate through the SPI device 110, the electronic component mounting device 120, and the AOI device 130.

  Hereinafter, the substrate inspection apparatus system 100 will be described in more detail.

  The SPI device 110 obtains first three-dimensional information of the solder paste applied on the substrate, and inspects whether or not the solder paste is defective according to a first allowable range set based on the first three-dimensional information. To do.

  As an example, the SPI device 110 obtains the first three-dimensional information by measuring a three-dimensional shape of a solder paste formed to mount an external electronic component on a pad of a substrate. The first three-dimensional information includes, for example, a three-dimensional shape, a bulk, a height, a width, a weight center, an eccentric amount, and the like of the solder paste, and the first three-dimensional information includes 2 of the substrate and the solder paste. Dimensional information may also be included.

  For example, the first allowable range may be a bulk range of the solder paste for determining an insufficient error lead, an excessive error lead, and a cold-solder joint of the solder paste. In contrast, the first allowable range may include a position range for determining a position defect of the solder paste, a bridge shape range for determining a bridge defect, and the like.

  The electronic component mounting apparatus 120 mounts the electronic component on the substrate coated with the solder paste so that the electronic component and the solder paste are bonded to each other.

  The AOI device 130 acquires second three-dimensional information of a solder joint where the electronic component and the solder paste are joined, and the electronic device according to a second allowable range set based on the second three-dimensional information. Inspect for possible component mounting defects.

  Although the AOI device 130 checks whether or not electronic component mounting is defective, the three-dimensional information acquired after acquiring three-dimensional information is used to check whether or not electronic component mounting is defective. As an example, the AOI apparatus 130 acquires the second three-dimensional information by measuring a three-dimensional shape of an electronic component and a solder joint mounted on a substrate. The second three-dimensional information includes, for example, three-dimensional offset information of the electronic component, curvature information based on the three-dimensional shape and position of the solder joint, and the second three-dimensional information is two-dimensional information on the substrate and the electronic component. May also be included.

  For example, the second allowable range includes an offset range for determining a mounting position defect of an electronic component, and a solder joint shape range for determining lead misalignment, a solder fillet defect, and the like from the solder joint shape. It may be. The second allowable range may include a curvature range depending on a position of the solder joint.

  The information transmission unit 140 may transmit the first three-dimensional information of the solder paste to the AOI device 130 or may transmit the second three-dimensional information of the solder joint to the SPI device 110.

  The SPI device 110 may correct the first allowable range using the second three-dimensional information transmitted from the information transmission unit 140.

  As an example, the second 3D information of the solder joint includes shape information of the solder joint, and the SPI device 110 uses the solder joint shape information transmitted from the information transmission unit 140 to perform the first information. The tolerance can be modified. At this time, the first allowable range can be corrected according to curvature information extracted from the shape of the solder joint. For example, when the first allowable range is set to the bulk range of the solder paste, when the solder joint forms a desired curvature, it is likely that the solder paste is normal even if the bulk of the solder paste is small. The range of the bulk that is the first allowable range may be modified more widely.

  In other words, the first permissible range correction method can be corrected widely or narrowly in stages by a preset value, which can be automatically controlled by the SPI device 100 or the correction range information can be sent to the operator. By displaying it, the operator can also control it directly.

  In addition, the AOI device 130 may correct the second allowable range using the first three-dimensional information transmitted from the information transmission unit 140.

  As one example, the first three-dimensional information of the solder paste includes bulk information of the solder paste, and the AOI device 130 uses the bulk information of the solder paste transmitted from the information transmission unit 140 to perform the first information. 2 The tolerance can be modified. For example, in a state where a bulk range that is recognized as desirable for the solder paste is set in advance and the bulk information of the first three-dimensional information corresponds to the preset bulk range, and no deviation occurs, Since it is highly possible that the shape of the solder joint is normal even if it is slightly different from the normal shape, the second allowable range may be modified more widely.

  In other words, the second permissible range correction method can be corrected widely or narrowly in stages by the set value, which can be automatically controlled from the AOI device 130 or the correction range information can be displayed to the operator. By doing so, the operator can also directly control.

  As an example, the information transmission unit 140 may be formed in at least one of the SPI device 110 and the AOI device 130. For example, the information transmission unit 140 may include a first information transmission unit 142 and a second information transmission unit 144. The first information transfer unit 142 may be formed in the SPI device 110, and the second information transfer unit 144 may be formed in the AOI device 130. At this time, the first information transfer unit 142 is included in a central process unit (CPU) or a control unit for driving the SPI device 110, and the second information transfer unit 144 is connected to the AOI device 130. It may be included in a central processing unit or control unit for driving.

  A solid arrow shown in FIG. 1 indicates an information transmission signal for mutually transmitting the first three-dimensional information of the solder paste and the second three-dimensional information of the solder joint between the SPI device 110 and the AOI device 140. Shows the flow.

  In contrast, the information transmission unit 140 may be formed by a device separate from the SPI device 110 and the AOI device 130.

  On the other hand, the electronic component mounting device 120 may also include an information transmission unit (not shown) included in the SPI device 110 and the AOI device 130. The information transmission unit of the electronic component mounting device 120 includes component-specific movement control information for mounting each electronic component, which may be included in the central processing unit or control unit for driving the electronic component mounting device 120. Good.

  In addition, the AOI apparatus 130 can receive the board information transferred from the electronic component mounting apparatus 120 through the information transmission unit of the electronic component mounting apparatus 120 and the movement control information for each part when the board is transferred. That is, the AOI device 130 can confirm whether or not any part is moved by a predetermined distance and mounted at each position in the board through the movement control information for each part. As a case where a position twist failure occurs based on the component offset information, if the component movement control of the electronic component mounting apparatus 120 is necessary as a result of the determination, the electronic component mounting apparatus 120 includes a component movement control request message (including a movement control command). Can be sent).

  FIG. 2 is a block diagram showing a substrate inspection apparatus system according to another embodiment of the present invention.

  Referring to FIG. 2, a board inspection apparatus system 102 according to another embodiment of the present invention includes an SPI apparatus 112, an electronic component mounting apparatus 120, an AOI apparatus 132, and an information transmission unit 150. The board inspection apparatus system 102 includes the information inspection apparatus 102. Except that 150 is formed separately from the SPI device, the electronic component mounting device, and the AOI device, it is substantially the same as the substrate inspection device system 100 shown in FIG. Description is omitted.

  The information transmission unit 150 may be formed by a device separate from the SPI device 112, the electronic component mounting device 120, and the AOI device 132. In this case, the information transmission unit 150 may include a central processing unit or a control unit that is separate from the SPI device 112, the electronic component mounting device 120, and the AOI device 132, and the SPI device 112, the electronic component mounting. The device 120 and the AOI device 132 may be separable and connectable.

  The information transmission unit 150 includes first and second permissible range information and component movement control information for each equipment (for example, the SPI device 112, the electronic component mounting device 120, and the AOI device 132). After the component movement control information is corrected for each preset stage, the corrected information can be transmitted to each equipment, thereby permitting the defect detection condition of each equipment from the information transmission unit 150 without control for each equipment. The range can be integrated and controlled.

  On the other hand, a solid line arrow shown in FIG. 2 indicates that the first three-dimensional information of the solder paste and the second three-dimensional information of the solder joint are transmitted between the SPI device 112 and the AOI device 132. The signal flow is shown.

  FIG. 3 is a block diagram showing a substrate inspection apparatus system according to another embodiment of the present invention.

  Referring to FIG. 3, a substrate inspection apparatus system 200 according to another embodiment of the present invention may include an SPI apparatus 210, an AOI apparatus 220, a database 230, an alarm generation apparatus 240, and the like.

  For example, the substrate inspection apparatus system 200 receives a substrate such as a printed circuit board and inspects whether the substrate is defective. After receiving the transmission of the substrate, the substrate inspection apparatus system 200 inspects whether or not the solder paste is properly applied by using the SPI apparatus 210 and first inspects whether there is a defect. Subsequently, after mounting the electronic component on the substrate coated with the solder paste, for example, the solder paste is melted on the substrate through a reflow process using a reflow equipment, and the electronic component is mounted on the substrate. Can do. Next, the electronic component formed on the substrate is inspected to determine whether the electronic component is properly mounted on the substrate by using the AOI apparatus 220, and secondly, the defect is inspected.

  As described above, the AOI apparatus 220 can be inspected for defects of electronic components that are basically disposed after the reflow process and mounted on the board.

  The block arrows shown in FIG. 3 indicate the flow of the substrate through the SPI device 210 and the AOI device 220.

  Hereinafter, the substrate inspection apparatus system 200 will be described in more detail.

  The SPI device 210 obtains first three-dimensional information of the solder paste applied on the substrate, and determines whether the solder paste is defective according to a first allowable range set based on the first three-dimensional information. inspect. Since the SPI device 210 is substantially the same as the SPI device 110 shown in FIGS. 1 and 2, a detailed description thereof is omitted.

  On the other hand, the solder paste is applied at at least two points corresponding to the electronic component, and in this case, the first three-dimensional information is a difference in volume between the bulks of the solder paste at the two points. (Volume difference) information may be included.

  After inspecting whether or not the solder paste is defective using the SPI device 210, the solder paste is applied onto the substrate on which the solder paste is applied using equipment such as the electronic component mounting device 120 described in FIGS. The electronic component is mounted so that the electronic component and the solder paste are bonded to each other.

  The AOI apparatus 220 obtains second 3D information for inspecting whether or not the electronic component mounted on the substrate coated with the solder paste is defective, and based on the second 3D information Whether or not the electronic component is mounted is inspected according to a preset second allowable range. Since the AOI device 220 is substantially the same as the AOI device 130 shown in FIGS. 1 and 2, a detailed description thereof is omitted.

  Meanwhile, the second three-dimensional information may include solder joint score information obtained by quantifying the degree of bonding between the solder paste and the electronic component. Here, the degree of bonding between the solder paste and the electronic component refers to how much leads of the electronic component are bonded to the solder paste when the electronic component is mounted on a substrate coated with the solder paste. It is possible to set the score of the solder joint by quantifying this.

  In addition, the solder paste is applied at at least two points corresponding to the electronic component, and in this case, the second three-dimensional information indicates the same planarity (co− planarity) information. The coplanarity information includes, for example, information on the height difference between both ends of the electronic component, tilt information on the top surface of the electronic component, and the like, and comparison of the same tilt information for each electronic component can be performed.

  The database 230 stores the first three-dimensional information of the SPI device 210 and the second three-dimensional information of the AOI device 220.

  The alarm generator 240 receives the first three-dimensional information and the second three-dimensional information from the database 230, and when the second three-dimensional information leaves the second allowable range, the first Generate an alarm message to correct the tolerance. For example, even when the first three-dimensional information is within the first allowable range and the solder paste applied on the substrate is determined to be good, the second three-dimensional information is not within the second allowable range. If the solder joint after the electronic component is mounted and the arrangement form of the component is determined to be defective, the alarm message is generated and transmitted to the SPI device 210. Can do.

  The central processing unit or the control unit of the SPI device 210 that has received the alarm message can correct the first allowable range widely or narrowly by the set value, which is automatically controlled by the SPI device 210. Alternatively, the operator can directly control the correction range information by displaying it to the operator.

  For example, the alarm generator 240 receives the solder paste bulk information and the solder joint score information from the database 230, and the solder joint score information leaves the second allowable range. An alarm message can be generated to correct the tolerance.

  The generated alarm message is transmitted to the SPI device 210, and the SPI device 210 can set the first allowable range to a narrow range below one step at a preset stage.

  4 and 5 are graphs showing an embodiment for generating an alarm message in the substrate inspection apparatus system of FIG.

  4, the vertical axis of the graph represents the solder paste bulk information V corresponding to the first three-dimensional information, and the vertical axis of the graph of FIG. 5 represents the solder joint score information corresponding to the second three-dimensional information. S is shown. The horizontal axis of FIG.4 and FIG.5 shows various examples. Specifically, the above example shows a result of inspection on a plurality of substrates with respect to any one of the solder paste or joint of the electronic component, and the plurality of substrates attached to the solder paste or joint of the electronic component. It can also show the results of inspection, and can also indicate the results of inspection on multiple substrates for solder paste or joint average.

  Referring to FIGS. 4 and 5, the solder paste as a result of inspecting the substrate by the SPI device 210 is present within the first allowable range TL1, but the solder joint score as a result of inspecting the substrate by the AOI device 220 is as follows. Leave the second allowable range TL2. Therefore, it can be seen that even the board determined to be good by the SPI apparatus 210 can be determined as defective by the AOI apparatus 220. That is, even when the solder paste application amount is appropriate and the solder paste application is determined to be good, the solder joint form after the electronic component is actually mounted on the board is improperly mounted. Can be judged as bad.

  In this case, the alarm generator 240 receives the solder paste volume information and the solder joint score information from the database 230, and the alarm information is output when the solder joint score information leaves the second allowable range TL2. By generating the first allowable range TL1, the first allowable range TL1 can be corrected to a narrower range-the first allowable range TL1 '.

  In this way, the first piece TL1 is corrected—the first allowable range TL1 ′ is corrected, and then the SPI device 210 is corrected—the first allowable range TL1 ′ is used as a reference to transfer the solder paste without any defects. Since the score information of the solder joint is included in the second allowable range TL2 by the AOI apparatus 220 with respect to the solder paste substrate thus formed, it is possible to prevent a defective substrate in advance.

  6 and 7 are graphs showing another embodiment in which the substrate inspection apparatus system of FIG. 3 generates an alarm message.

  The vertical axis of the graph shown in FIG. 6 indicates the bulk difference information VD of the solder paste corresponding to the first three-dimensional information when the solder paste is applied at at least two points corresponding to the electronic component. The vertical axis of the graph of FIG. 7 shows the same plane information C of the electronic component corresponding to the second three-dimensional information. The horizontal axis of FIGS. 6 and 7 shows various cases.

  Specifically, the example shows an imaging substrate that has been inspected against a plurality of substrates for any one of an electronic component solder paste or an electronic component, and the electronic component solder paste or electronic component On the other hand, it is possible to show the results of inspection on a plurality of substrates, and it is also possible to show the results of inspection on a plurality of substrates against the average of solder paste or electronic components.

  Referring to FIGS. 6 and 7, as a result of inspecting the substrate by the SPI device 210, a solder paste bulk difference between at least two points exists within the first allowable range TL1, but the substrate is removed by the AOI device 220. As a result of the inspection, the same planarity of the electronic component leaves the second allowable range TL2. Therefore, it can be seen that even the board determined to be good by the SPI apparatus 210 can be determined as defective by the AOI apparatus 220. That is, even when the solder paste applied to the at least two points is appropriate and the solder paste is determined to be good, the same flatness after mounting electronic components on the board is not good. Appropriately, the mounting state of the electronic component can be determined as defective.

  In this case, the alarm generator 240 receives the difference information and the same flatness information from the database 230, and generates an alarm message when the same flatness information leaves the second allowable range TL2. Thus, the first allowable range TL1 can be corrected to a correction-first allowable range (TL1 ′) which is a narrower range.

  On the other hand, the correction work is performed step by step by the amount already set. The correction operation can be automatically controlled by the SPI device 210 or can be directly controlled by the user by providing information to the user.

  As described above, when the first allowable range TL1 is corrected to the first allowable range TL1 ′, the SPI device 210 thereafter corrects the transfer without causing a defect with respect to the solder paste bulk difference based on the first allowable range TL1 ′. Since the same planarity information is included in the second allowable range TL2 by the AOI apparatus 220 with respect to the solder paste substrate thus formed, the defect rate can be reduced.

  FIG. 8 is a block diagram showing a substrate inspection apparatus system according to still another embodiment of the present invention.

  Referring to FIG. 8, a substrate inspection apparatus system 202 according to still another embodiment of the present invention may include an SPI apparatus 210, a first AOI apparatus 222, a second AOI apparatus 224, a display 230, an alarm generation apparatus 240, and the like.

  The board inspection apparatus system 202 shown in FIG. 8 may further include a second AOI apparatus 224 capable of additionally inspecting whether or not there is a defect after performing an electronic component and before performing a reflow process.

  Specifically, the board inspection system 202 inspects whether or not the board is defective by receiving a board such as a printed circuit board PCB. After receiving the transmission of the substrate, the substrate inspection apparatus system 202 inspects whether the solder paste is properly applied by using the SPI apparatus 210 and first inspects whether there is a defect. Subsequently, after the electronic component is mounted on the substrate on which the solder paste is applied, for example, through an electronic component mounting device, the second AOI device 224 is used to check whether the electronic component is properly positioned on the solder paste. Secondly, it is inspected for defects.

  Next, for example, after the solder paste applied on the substrate is melted through a reflow process using a reflow equipment and the electronic component is mounted on the substrate, the electronic component formed on the substrate is attached to the first AOI device 222. Is used to inspect whether or not the electronic component is properly mounted on the substrate, and thirdly, it is inspected for defects.

  As described above, the second AOI device 224 is disposed at the front end of the reflow process and can inspect the substrate. Meanwhile, the first and second AOI devices 222 and 224 may be used by disposing substantially the same devices at the front end and the rear end of the reflow process, respectively. It can also be used before and after.

  The block arrows shown in FIG. 8 indicate the flow of the substrate through the SPI 210, the first AOI device 222, and the second AOI device 224.

  Hereinafter, the substrate inspection apparatus system 202 will be described in more detail.

  The SPI device 210 obtains first three-dimensional information of the solder paste applied on the substrate, and determines whether the solder paste is defective according to a first allowable range set based on the first three-dimensional information. inspect. Since the SPI device 210 is substantially the same as the SPI device 110 shown in FIGS. 1 and 2, a detailed description thereof is omitted.

  On the other hand, the first three-dimensional information may include solder paste offset information indicating a degree away from a position where the solder paste is to be formed. Unlike this, the first three-dimensional information may simply be the position information of the solder paste on which the solder paste is formed. The solder paste offset information and the solder paste position information may be obtained from the shape information of the solder paste.

  The first AOI device 222 acquires three-dimensional information for inspecting whether or not the electronic component mounted on the substrate coated with the solder paste is defective, but the second AOI device 222 is measured after performing the reflow process. 3D information is acquired, and whether or not the electronic component is defective is inspected according to a second allowable range set based on the second 3D information. Since the AOI device 222 is substantially the same as the AOI device 220 shown in FIG. 3, a detailed description thereof is omitted.

  On the other hand, the second three-dimensional information includes post-offset information of the electronic component indicating a degree away from a position where the electronic component is to be mounted after the electronic component is mounted and the reflow process is performed. Also good. In contrast to this, the second three-dimensional information may simply be rear-position information of the electronic component on which the electronic component is mounted. The post-offset information of the electronic component and the post-position information of the electronic component are obtained from the shape information of the electronic component (for example, cad data already received or electronic component mounting information received from the electronic component mounting device) May be.

  The second AOI device 224 obtains third dimension information measured before performing the reflow process in a state where an electronic component is mounted on a substrate on which a solder paste is applied, and the third three-dimensional information is obtained. In accordance with the already set third dimension information based on the above, whether or not the electronic component is mounted is inspected. The second AOI device 224 may be substantially the same device as the first AOI 222 device.

  On the other hand, the third three-dimensional information includes pre-offset information of the electronic component indicating a degree away from a position where the electronic component is to be mounted before the electronic component is mounted and the reflow process is performed. Also good. Unlike this, the third three-dimensional information may simply be front-position information of an electronic component on which the electronic component is mounted. The electronic component front-offset information and the electronic component front-position information are obtained from the shape information of the electronic component (for example, CAD data already received or electronic component mounting information transmitted from the electronic component mounting device). May be.

  The database 230 stores the first three-dimensional information of the SPI device 210, the second three-dimensional information of the first AOI device 222, and the third three-dimensional information of the second AOI device 224.

  The alarm generator 240 receives the first three-dimensional information, the second three-dimensional information, and the third three-dimensional information from the database 230, and receives the first, second, and third 3 When any one of the dimension information leaves the preset allowable range, an alarm message is generated so as to correct at least one allowable range of the remaining information.

  As an example, when the third three-dimensional information leaves the third allowable range, the alarm generating device 240 generates an alarm message so as to correct the first allowable range and transmits the alarm message to the SPI device 210. it can.

  For example, even when the first three-dimensional information exists within the first allowable range and the formation of the solder paste is determined to be good, the third three-dimensional information seems to exist outside the third allowable range. When the mounting state of the electronic component before the reflow process is determined as defective, the SPI device 210 and the SPI device 210 and the first allowable range are corrected to be narrower by generating the alarm message. Information can be provided to an operator of the SPI device 210.

  In one embodiment, the alarm generator 240 receives the solder paste offset information and the pre-offset information of the electronic component before the reflow process from the database 230, and the electronic component pre-offset information is the third information. An alarm message can be generated to correct the first tolerance range when leaving the tolerance range.

  On the other hand, the alarm generator 240 may generate an alarm message so as to correct the third allowable range when the second three-dimensional information leaves the second allowable range.

  For example, even if it is determined that the state of the electronic component mounted on the substrate before the reflow process is good because the third three-dimensional information exists within the third tolerance, the second three-dimensional If the information is present outside the second tolerance range and the electronic component is not properly mounted after the reflow process, the alarm message is generated to set the third tolerance range. Information can be provided to the operator of the second SOI device 224 and the second AOI device 224 so as to correct to a narrower range.

  In one embodiment, the alarm generator 240 receives from the database 230 the pre-offset information of the electronic component before the reflow process and the post-offset information of the electronic component after the reflow process. If the post-offset information leaves the second tolerance range, an alarm message can be generated to modify the third tolerance range.

  FIG. 9 is a conceptual diagram showing an embodiment in which the substrate inspection apparatus system of FIG. 8 generates an alarm message.

  In FIG. 9, an XY coordinate meter indicates an offset, and a circle indicates a case where the solder paste or the electronic component is not twisted at all. In FIG. 9, as an example, the first allowable range TL1, the second allowable range TL2, and the third allowable range TL3 are all the same.

Referring to FIG. 9, as a result of inspecting the substrate by the SPI device 210 and the second AOI device 224, the offset OS _{sp of the} solder paste and the offset OS _PRE of the electronic component are the first allowable range TL1 and the third allowable range TL3, respectively. The post-offset OS _Post of the electronic component leaves the second allowable range TL2 as a result of inspecting the substrate by the first AOI device 222.

  Therefore, it can be seen that even the board determined to be good by the SPI device 210 and the second AOI device 224 is determined to be defective by the first AOI device 222. That is, even if it is determined that the solder paste application position and the electronic component mounting position are appropriate and the solder paste application and the electronic component mounting before the reflow process are good, the electronic component after the reflow process is actually mounted. It can be determined that the form is appropriate and the electronic component is not properly mounted.

In this case, the alarm generator 240 receives the electronic component front-offset OS _PRE information and the electronic component rear-offset OS _Post information from the database 230, and the electronic component rear-offset OS _Post information. When the user leaves the second allowable range TL2, an alarm message is generated and transmitted to the second AOI device 224 so that the third allowable range TL3 is corrected to a narrower range-a third allowable range TL3 '. Can be.

  On the other hand, the correction operation is performed step by step by the set value. In addition, the correction operation can be controlled automatically by the second AOI device 224 or directly by the user by providing information to the user.

  As described above, when the third allowable range TL3 is corrected to the third corrected allowable range TL3 ', the defective substrate generation rate in the first AOI device 222 can be prevented in advance.

  According to the substrate inspection apparatus system as described above, the inspection result is obtained between the SPI apparatus and the AOI apparatus by acquiring the three-dimensional information by the SPI apparatus and the AOI apparatus and exchanging the acquired three-dimensional information with each other. Can be shared.

  Specifically, 3D information of solder paste and 3D information of solder joint are respectively acquired by the SPI device and the AOI device, and the acquired 3D information is exchanged with each other, and any one inspection result is used for another inspection. By utilizing, the inspection conditions of the quantity device can be corrected to more effective inspection conditions.

  In addition, the 3D information result of the SPI device and the AOI device is stored in a database, and when the alarm generating device receives the 3D information from the database and any one test result leaves the allowable range, an alarm is given to another test. By generating a message, the inspection condition can be corrected more effectively automatically or passively.

  In other words, by exchanging the inspection result information acquired from each device through the linkage between the SPI device and the AOI device, flexible adjustment such as narrowing or widening the tolerance range set for each device is possible. There is an advantage that various pseudo errors that can occur during the SPI and AOI inspections can be dramatically reduced.

  As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited thereto, and those who have ordinary knowledge in the technical field to which the present invention belongs can be used without departing from the spirit and spirit of the present invention. The present invention can be modified or changed.

100, 102, 200, 202: Board inspection system 110, 112, 210: SPI device 120: Electronic component mounting device 130, 132, 220: AOI device 140, 150: Information transmission unit 222: First AOI device 224: Second AOI Device 230: Database 240: Alarm generator

Claims (14)

A first apparatus for acquiring first three-dimensional information of a solder paste applied on a substrate and inspecting whether or not the solder paste is defective according to a first allowable range set based on the first three-dimensional information; ,
A second device for mounting the electronic component on the substrate coated with the solder paste so that the electronic component and the solder paste are bonded to each other;
Obtaining second three-dimensional information of a solder joint where the electronic component and the solder paste are joined, and determining whether or not the electronic component is defective according to a second allowable range set based on the second three-dimensional information A third device for inspecting
Transmitting the first three-dimensional information of the solder paste to the third device, or transmitting the second three-dimensional information of the solder joint to the first device;
A substrate inspection apparatus system comprising: The second three-dimensional information of the solder joint includes shape information of the solder joint,
The substrate inspection apparatus system according to claim 1, wherein the first apparatus corrects the first allowable range by using shape information of the solder joint transmitted from the information transmission unit.   When the curvature information extracted from the shape of the solder joint is not included in the second allowable range, the first allowable range is already set as the bulk information of the solder paste is included in the first allowable range. The substrate inspection apparatus system according to claim 2, wherein the correction is performed more narrowly by a value.   3. The method according to claim 2, wherein when the curvature extracted from the shape of the solder joint is included in the second allowable range, the first allowable range is further broadened by a preset value. Board inspection system. The first three-dimensional information of the solder paste includes bulk information of the solder paste,
The substrate inspection apparatus system according to claim 1, wherein the third apparatus corrects the second allowable range using bulk information of the solder paste transmitted from the information transmission unit. A first apparatus for acquiring first three-dimensional information of a solder paste applied on a substrate and inspecting whether or not the solder paste is defective according to a preset first allowable range based on the first three-dimensional information When,
A second device for mounting the electronic component on the substrate coated with the solder paste so that the electronic component and the solder paste are bonded to each other;
Obtaining second three-dimensional information of a solder joint where the electronic component and the solder paste are joined, and determining whether or not the electronic component is defective according to a second allowable range set based on the second three-dimensional information A third device for inspecting
Transmitting the first three-dimensional information of the solder paste to the third device, or transmitting the second three-dimensional information of the solder joint to the first device;
Including
The first device corrects the first allowable range using the second three-dimensional information transmitted from the information transmission unit, or the third device transmits the first information transmitted from the information transmission unit. A substrate inspection apparatus system, wherein the second allowable range is corrected using three-dimensional information. Obtaining first three-dimensional information of the solder paste applied on the substrate, and inspecting whether the solder paste is defective according to a first allowable range set based on the first three-dimensional information;
Mounting the electronic component such that the electronic component and the solder paste are bonded to each other on a substrate coated with the solder paste;
Obtaining second three-dimensional information of a solder joint where the electronic component and the solder paste are joined, and determining whether or not the electronic component is defective according to a second allowable range set based on the second three-dimensional information Inspecting, and
Modifying at least one of the first tolerance range and the second tolerance range based on the first three-dimensional information of the solder paste and the second three-dimensional information of the solder joint;
A substrate inspection method comprising: A first apparatus for acquiring first three-dimensional information of a solder paste applied on a substrate and inspecting whether or not the solder paste is defective according to a preset first allowable range based on the first three-dimensional information When,
Second 3D information for inspecting whether or not an electronic component to be mounted on the substrate to which the solder paste is applied is inspected is acquired, and a second preset is set based on the second 3D information. A second device for inspecting whether or not the electronic component is defective according to two tolerances;
A database storing first three-dimensional information of the first device and second three-dimensional information of the second device;
In response to the transmission of the first three-dimensional information and the second three-dimensional information from the database, the first allowable range is modified when the second three-dimensional information leaves the second allowable range. An alarm generating device for generating an alarm message;
A substrate inspection apparatus system comprising: The first three-dimensional information includes bulk information of the solder paste, and the second three-dimensional information includes score information of a solder joint obtained by quantifying the degree of bonding between the solder paste and the electronic component,
The alarm device receives the volume information of the solder paste and the score information of the solder joint from the database, and corrects the first allowable range when the score information of the solder joint leaves the second allowable range. 9. The substrate inspection apparatus system according to claim 8, wherein the alarm message is generated at a time. The solder paste is applied at at least two points corresponding to the electronic component,
The first three-dimensional information includes bulk difference information that is a difference between the bulks of the solder paste with respect to each of the two points, and the second three-dimensional information includes a degree to which the electronic component is inclined with respect to the horizontal. Including coplanarity information indicating
The alarm generator receives the difference information and the coplanarity information from the database, and corrects the first permissible range when the coplanarity information leaves the second permissible range. 9. A substrate inspection apparatus system for a substrate according to claim 8, wherein a message is generated. The second device acquires third three-dimensional information for checking whether or not the electronic component is defective before the reflow process after the electronic component is placed on the substrate, and the third three-dimensional information. Inspecting whether or not the electronic component is defective according to the third tolerance set based on
The database stores the third three-dimensional information;
The previous alarm generation device receives the second three-dimensional information and the third three-dimensional information from the database, and when the second three-dimensional information leaves the second allowable range, 9. The substrate inspection system according to claim 8, wherein an alarm message is generated so as to correct the range. An SPI device for acquiring first three-dimensional information of a solder paste applied on a substrate and inspecting whether or not the solder paste is defective according to a first allowable range set based on the first three-dimensional information; ,
After the reflow process, second 3D information on the mounting state of the electronic component is obtained, and whether or not the electronic component is defective is inspected according to a second allowable range set based on the second 3D information. A first AOI device;
Before the reflow process, the third three-dimensional information about the mounting state of the electronic component is acquired, and the electronic component is checked for mounting failure according to a third allowable range set based on the third three-dimensional information. A second AOI device,
A database for storing first three-dimensional information of the SPI device and second and third three-dimensional information of the AOI device;
One of the first, second, and third three-dimensional information is received in response to the transmission of the first three-dimensional information, the second three-dimensional information, and the third three-dimensional information from the database. An alarm generating device for generating an alarm message so as to correct at least one of the remaining information when one information leaves a set allowable range; and
A substrate inspection apparatus system comprising: The first three-dimensional information includes solder paste offset information indicating a degree away from a position where the solder paste is to be formed, and the third three-dimensional information mounts the electronic component and performs a reflow process. Before, including electronic component front-offset information representing a degree away from a position where the electronic component is to be mounted;
The alarm generation device receives the transmission of the offset information of the solder paste and the previous-offset information from the database, and corrects the first allowable range when the previous-offset information leaves the third allowable range. The board inspection apparatus system according to claim 12, wherein an alarm message is generated. The second three-dimensional information includes post-offset information of the electronic component indicating a degree away from a position where the electronic component is to be mounted after the electronic component is mounted and a reflow process is performed. The dimension information includes pre-offset information of the electronic component representing a degree away from a position where the electronic component is to be mounted before the electronic component is mounted and the reflow process is performed.
The alarm generation device receives the transmission of the front-offset information and the rear-offset information from the database, and corrects the third allowable range when the rear-offset information leaves the second allowable range. The substrate inspection apparatus system according to claim 12, wherein an alarm message is generated.

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