JP6118353B2 - Component mounting board inspection method and board manufacturing system employing the inspection method - Google Patents

Component mounting board inspection method and board manufacturing system employing the inspection method Download PDF

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Publication number
JP6118353B2
JP6118353B2 JP2014559469A JP2014559469A JP6118353B2 JP 6118353 B2 JP6118353 B2 JP 6118353B2 JP 2014559469 A JP2014559469 A JP 2014559469A JP 2014559469 A JP2014559469 A JP 2014559469A JP 6118353 B2 JP6118353 B2 JP 6118353B2
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cream solder
reflow
electronic component
height
printed circuit
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JPWO2014118982A1 (en
Inventor
健史 新井
健史 新井
毅久 廣安
毅久 廣安
典生 渡部
典生 渡部
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名古屋電機工業株式会社
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Priority to PCT/JP2013/052426 priority Critical patent/WO2014118982A1/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns, inspection means or identification means
    • H05K1/0269Marks, test patterns, inspection means or identification means for visual or optical inspection
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815Controlling of component placement on the substrate during or after manufacturing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817Monitoring of soldering processes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95661Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
    • G01N2021/95669Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature for solder coating, coverage
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10674Flip chip
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10734Ball grid array [BGA]; Bump grid array
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0465Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder paste, particles or preforms; Transferring prefabricated solder patterns

Description

  The present invention relates to a component mounting board inspection method and a board manufacturing system that employs the inspection method, and in particular, a component mounting board for a printed board on which an electronic component is mounted without directly viewing the appearance of printed solder after mounting the electronic component. The present invention relates to an inspection method and a substrate manufacturing system that employs the inspection method.

  The board appearance inspection device for printed circuit boards on which electronic components are mounted is used to achieve stable quality assurance of the component mounting board. There are inspections for misalignment, etc., and inspections for the presence / absence / displacement / floating of parts.

  By the way, the components mounted on the surface of the printed circuit board, that is, the surface mounting components, are roughly classified into a surface mounting component with leads and a leadless surface mounting component. A surface mount component with leads is a surface mount component that is connected to the substrate with leads on the periphery or underside of the package, and a leadless surface mount component is a surface that is connected to the substrate with electrodes formed on the surface of the component body. It is a mounting component. In recent years, with the increase in the density of components on a printed circuit board, the number of filletless and leadless surface mount components is increasing.

  Here, in the surface-mounted component with leads, the joint portion between the component portion and the lead portion and the substrate can be observed and measured. Therefore, the joint state can be inspected by measuring the appearance. However, in a leadless surface-mounted component, it is impossible to observe and measure the bonding state between the electrode and the substrate only by examining the appearance. Therefore, in order to inspect the solder state of such leadless surface-mounted components by the board appearance inspection device, a transmission type inspection device having a mechanism for transmitting components such as X-rays has become necessary.

  For example, Patent Document 1 discloses that in an inspection method using X-rays, a fillet can be inspected by a matching method using an X-ray image. Patent Document 2 discloses that a filletless type mounting component can be inspected in an inspection apparatus using X-rays. Further, Patent Document 3 discloses that it is possible to inspect the floating of the lead of the electronic component by an inspection device using slit light.

JP 2002-296203 A JP 2010-271165 A JP-A-6-300538

  However, such a transmission type inspection apparatus using X-rays generally has a problem that it is difficult to handle and expensive compared to a non-transmission type inspection apparatus. Thus, these problems can be solved if a means for providing stable quality assurance can be provided without using an X-ray transmission type inspection apparatus.

  The present invention has been made in view of the problems as described above, and the object thereof is to perform a visual inspection on a printed circuit board on which an electronic component is mounted without using an X-ray transmission type inspection apparatus. It is an object of the present invention to provide a component mounting board inspection method that can guarantee good connectivity of electronic components and a board manufacturing system that employs the inspection method.

  In order to achieve the above object, the component mounting board inspection method of the present invention inspects the appearance of the cream solder on the printed board coated with cream solder, and the printed board coated with the cream solder. A component mounting board inspection method for mounting an electronic component and performing an inspection before or after reflow on the printed circuit board on which the electronic component is mounted, using the result of the inspection of the appearance of the cream solder, The gist is to inspect a printed circuit board on which the electronic component is mounted before or after the reflow.

  Preferably, in the inspection of the cream solder, the height thereof is inspected, in the inspection of the printed circuit board on which the electronic component is mounted, the height of the electronic component is inspected, and based on those heights. Whether or not the electronic component is in good contact with the cream solder is determined without looking at the appearance of the cream solder.

  More preferably, it is further determined whether or not the electronic component is in good contact with the cream solder, based on an allowable value with which the cream solder can be crushed without hindrance.

  Further, preferably, in the inspection of the cream solder, the height is inspected at a plurality of locations, and in the inspection of the printed circuit board on which the electronic component is mounted, the height of the electronic components is inspected at a plurality of locations. The inclination of the electronic component with respect to the printed circuit board, the partial non-contact of the electronic component with the cream solder, or the partial collapse of the cream solder is determined.

  In order to achieve the above object, the board manufacturing system of the present invention includes a cream solder appearance inspection apparatus for judging the appearance of the cream solder on a printed board coated with cream solder, and the cream solder. An electronic component mounting apparatus for mounting an electronic component on a printed circuit board coated with a resin, a reflow apparatus for performing a reflow process on the printed circuit board on which the electronic component is mounted, and the electronic component on which the reflow process has been performed And a post-reflow visual inspection device that inspects the appearance of a printed circuit board on which the printed circuit board is mounted. The post-reflow visual inspection device is directly or indirectly connected to the cream solder visual inspection device. The electronic component is mounted using the result of the appearance inspection of the cream solder by the cream solder appearance inspection device. And summarized in that inspect the appearance for printed circuit board that is.

  In order to achieve the above object, the board manufacturing system of the present invention includes a cream solder appearance inspection apparatus for judging the appearance of the cream solder on a printed board coated with cream solder, and the cream solder. An electronic component mounting apparatus that mounts electronic components on a printed circuit board coated with a coating, and a pre-reflow appearance inspection apparatus that inspects the appearance of the printed circuit board on which the electronic components are mounted before reflow processing. The pre-reflow appearance inspection apparatus is directly or indirectly connected to the cream solder appearance inspection apparatus, and uses the result of the appearance inspection of the cream solder by the cream solder appearance inspection apparatus. Then, the gist is to inspect the appearance of the printed circuit board on which the electronic component is mounted.

  In order to achieve the above object, the component mounting board inspection method of the present invention inspects the appearance of the cream solder on the printed board coated with the cream solder, and applies the cream solder to the printed board. On the other hand, a component mounting board inspection method for mounting an electronic component and inspecting a printed circuit board on which the electronic component is mounted before or after reflowing, using a judgment criterion for the appearance inspection of the cream solder Then, the gist is to inspect the printed circuit board on which the electronic component is mounted before or after the reflow.

  In order to achieve the above object, the board manufacturing system of the present invention includes a cream solder appearance inspection apparatus for judging the appearance of the cream solder on a printed board coated with cream solder, and the cream solder. An electronic component mounting apparatus that mounts electronic components on a printed circuit board coated with a coating, a reflow apparatus that performs reflow processing on the printed circuit board on which the electronic components are mounted, and the electronic component that has undergone the reflow processing And a post-reflow visual inspection device for inspecting the appearance of a printed circuit board on which the solder paste is mounted, the post-reflow visual inspection device comprising Preliminary inspection inspection criteria are stored in advance, and the electronic components are mounted on the printed circuit board using the determination criteria. And summarized in that to inspect the appearance.

  In order to achieve the above object, the board manufacturing system of the present invention includes a cream solder appearance inspection apparatus for judging the appearance of the cream solder on a printed board coated with cream solder, and the cream solder. An electronic component mounting apparatus that mounts electronic components on a printed circuit board coated with a coating, and a pre-reflow appearance inspection apparatus that inspects the appearance of the printed circuit board on which the electronic components are mounted before reflow processing. The pre-reflow appearance inspection apparatus stores in advance a criterion for inspection of the appearance of the cream solder in the cream solder appearance inspection apparatus, and the electronic component is used by using the criterion. The gist is to inspect the appearance of a mounted printed circuit board.

  According to the component mounting board inspection method and the board manufacturing system employing the inspection method of the present invention, in the appearance inspection for the printed board on which the electronic component is mounted, the printed circuit board can be used without using an X-ray transmission type inspection apparatus. And good connectivity of electronic components can be guaranteed. In addition, since a transmission type inspection apparatus using X-rays is not required, the cost can be reduced, and since it is not necessary to arrange a dedicated engineer, the entire system can be handled easily.

It is a schematic block diagram of 1st embodiment in the board | substrate manufacturing system which employ | adopts the component mounting board inspection method of this invention. It is a figure for demonstrating various height. It is a figure for demonstrating the various positional relationship of the electronic component with respect to a printed circuit board according to the state of various solder. It is a schematic block diagram of 2nd embodiment in the board | substrate manufacturing system which employ | adopts the component mounting board inspection method of this invention. It is a figure for demonstrating various height. It is a figure for demonstrating the various positional relationship of the electronic component with respect to a printed circuit board according to the state of various solder. It is a schematic block diagram of 3rd embodiment in the board | substrate manufacturing system which employ | adopts the component mounting board inspection method of this invention. It is a figure for demonstrating various height. It is a schematic block diagram of 4th embodiment in the board | substrate manufacturing system which employ | adopts the component mounting board inspection method of this invention. It is a figure for demonstrating various height. It is a flowchart which shows the process which mounts an electronic component on the surface of a printed circuit board. It is a figure for demonstrating the external appearance inspection item of printed cream solder.

  Embodiments of the present invention will be described with reference to the drawings. The embodiments described below do not limit the invention according to the claims, and all the combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. Absent.

  First, FIG. 11 is a flowchart showing a process for mounting electronic components on the surface of a printed circuit board. In the process shown in the figure, first, cream solder is applied to a printed circuit board by a cream solder application device (step S1). Next, the appearance of the printed cream solder is inspected by the cream solder appearance inspection device on the printed circuit board to which the cream solder is applied (step S2). The inspection items performed in this inspection include the position of the printed cream solder and the shapes such as the bottom area a1, the protrusion area a2, the cross-sectional area a3, the average height h1, the peak height h2, and the volume v shown in FIG. Information. As will be described later, the average height h1 is adopted as the height of the printing cream solder 93. This is because if the peak height h2 is adopted as the height of the printed cream solder 93, there is a possibility that the component cannot be normally installed in the case of the sharp solder as shown in FIG. . Further, the average height h1 here is not obtained from all the two-dimensional distribution height data of the printed cream solder 93 (the height h1 ′ in FIGS. 12A and 12B is The value obtained by dividing the height integral value for N% from the higher one of the printed solder height data by the area value corresponding to N% (N is arbitrary) is adopted. This is to eliminate the effects of subtle irregularities and sharp parts on the solder surface.

  Next, an electronic component is mounted on the printed circuit board coated with cream solder by the electronic component mounting device (step S3). Here, the printed circuit board on which electronic components are mounted in this way but before reflow processing is inspected by the pre-reflow appearance inspection device (step S4). Next, a reflow process is performed by the reflow apparatus (step S5). Here, the electronic component mounting printed circuit board after such reflow processing is inspected by the post-reflow appearance inspection apparatus (step S6). Thereafter, the process proceeds to a subsequent process (step S7).

  Therefore, conventionally, as described above, for leadless and filletless components using, for example, a BGA (Ball Grid Array), in the inspection of the state of solder after component mounting, for example, a transmission type inspection device using X-rays Was necessary. However, it can be said that such a transmission type inspection device is necessary if quality assurance can be ensured only with the appearance inspection device after component mounting, but from the viewpoint of quality assurance in the entire production line, Thus, it can be said that the quality of the solder state is guaranteed when the inspection is performed by the cream solder appearance inspection apparatus before the mounting and the solder state is determined to be normal. As described above, in the appearance inspection of the component mounted on the solder whose quality is already guaranteed by the cream solder appearance inspection apparatus, it is not necessary to perform inspection including solder verification.

  That is, in the aforementioned process, in order to evaluate the proper component mounting state by inspecting the appearance, the appearance inspection device before or after the reflow process receives the solder status determined by the cream solder appearance inspection device, Alternatively, it is only necessary that the judgment standard in the cream solder appearance inspection apparatus is shared by the appearance inspection apparatus before or after the reflow process, and can be provided when properly mounted based on the information.

Specifically, the following two methods are used.
In other words, the appearance inspection device before or after the reflow processing after mounting the component acquires the inspection result such as the solder height and position immediately after printing from the cream solder appearance inspection device, while the height and inclination of the component. Measure. If the inspection result such as the height and position of the solder immediately after printing can be acquired from the cream solder appearance inspection apparatus, the desired position, height and inclination when the component is correctly mounted can be limited from the information. That is, in the appearance inspection apparatus before or after the reflow process, the height and inclination of the component are measured, and if it is lower than the desired height of the mounted component, it can be determined that the solder is crushed, If it is higher than the desired height of the component to be mounted, it can be determined that it is in a floating state. Become.

  Alternatively, the appearance inspection device before or after the reflow process after mounting the component shares the judgment standard such as the height and position of the solder immediately after printing in the cream solder appearance inspection device, while the height of the component, Measure the slope. In the cream solder appearance inspection device, if the judgment criteria such as the solder height, position, etc. immediately after printing are known in advance, the information on the board for the pass judgment is obtained from those information when the component is correctly mounted. The position, height, and tilt can be limited. In other words, in this case as well, it is possible to determine the state in which the solder is crushed and the state in which the component is floating from these data, and the state of the solder after mounting the component can be estimated without obtaining information on the appearance of the solder directly It becomes.

Next, a system that specifically realizes the above-described component mounting board inspection method of the present invention will be described by way of example.
<First Embodiment of Substrate Manufacturing System>
FIG. 1 is a schematic configuration diagram of a first embodiment in a board manufacturing system employing the component mounting board inspection method of the present invention.

  The substrate manufacturing system shown in the figure includes a cream solder application device (not shown), a cream solder appearance inspection device 20, an electronic component mounting device 30, a reflow device 50, a reflow appearance inspection device 60, and data storage. And a personal computer 70 for use. A pre-reflow appearance inspection apparatus may be included.

  The cream solder appearance inspection apparatus 20 includes a cream solder appearance inspection optical unit 22 and a cream solder appearance inspection apparatus control personal computer 21 for controlling the movement and processing of the unit 22. Here, the personal computer 21 for controlling the cream solder appearance inspection apparatus includes a storage unit 211 for storing inspection data. The post-reflow visual inspection device 60 includes a post-reflow visual inspection optical unit 62 and a post-reflow visual inspection device control personal computer 61 for controlling the movement and processing of the unit 62. Here, the post-reflow appearance inspection apparatus control personal computer 61 includes a storage unit 611 for storing inspection data.

  The data storage personal computer 70 and the cream solder appearance inspection apparatus control personal computer 21 in the cream solder appearance inspection apparatus 20 are connected by a cable 81. A data storage personal computer 70 and a post-reflow visual inspection apparatus control personal computer 61 in the post-reflow visual inspection apparatus 60 are connected by a cable 82.

Next, processing operations in the substrate manufacturing system shown in FIG. 1 will be described.
The printed circuit board on which the cream solder is applied by the cream solder application apparatus is inspected for the appearance of the printed cream solder 93 by the cream solder appearance inspection apparatus 20 in order to evaluate the application state of the cream solder. Specifically, the cream solder appearance inspection optical unit 22 is controlled by the personal computer 21 for controlling the cream solder appearance inspection apparatus, and the printed cream solder 93 is optically imaged to inspect the appearance three-dimensionally. The inspection items performed in this inspection include the position of the printed cream solder 93, the bottom area a1, the protrusion area a2, the cross-sectional area a3, the average height h1, the peak height h2, the volume v, and the like as described above. Shape information (see FIGS. 12 and 2A). The inspection data is stored in the storage unit 211 in the cream solder appearance inspection apparatus control personal computer 21, and is sent to the data storage personal computer 70 via the cable 81 and stored in the internal storage unit 71. Is done. Here, the cream solder appearance inspection device 20 stores in advance the quality judgment criteria for the cream solder appearance inspection, and the cream solder appearance inspection device 20 applies the cream solder 93 by comparing the inspection results with them. The quality of each printed circuit board 91 is determined.

  The printed circuit board 91 on which the printed cream solder 93 determined to be non-defective by the cream solder appearance inspection apparatus 20 is sent to the electronic component mounting apparatus 30, and the electronic component 92 is mounted on the printed cream solder 93. FIG. 2B is a diagram illustrating a state in which the electronic component 92 is mounted. In the drawing, the symbol h3 represents the height of the electronic component 92 including the ball bump 94. This height h3 is a value obtained in advance from the design value.

  Next, the printed circuit board 91 on which the electronic component 92 is mounted is sent to the reflow apparatus 50, and reflow processing is performed. The printed circuit board 91 that has been subjected to the reflow process by the reflow apparatus 50 is sent to the post-reflow appearance inspection apparatus 60. On the other hand, the post-reflow visual inspection apparatus 60 receives the inspection data stored in the storage unit 71 of the data storage personal computer 70 in advance via the cable 82, and the internal computer 61 for controlling the post-reflow visual inspection apparatus 61 Stored in the storage unit 611. The data received from the data storage personal computer 70 is at least the average height h1 of the printed cream solder 93.

  Therefore, the post-reflow visual inspection device 60 performs visual inspection on the printed circuit board 91 on which the electronic component 92 is mounted and reflow processing is performed. Specifically, the post-reflow visual inspection optical unit 62 is controlled by the post-reflow visual inspection device control personal computer 61 to optically image and inspect the appearance three-dimensionally. The inspection item performed in this inspection is at least the height h4 of the electronic component 92 on the printed circuit board 91 after reflow (including the height of solder after reflow) shown in FIG. Further, the position of the electronic component 92 may be inspected.

  Therefore, if the allowable value that can crush the print cream solder 93 that is arbitrarily set in advance is h5, it is considered that the electronic component 92 on the printed circuit board 91 after reflow is satisfactorily placed as described above. The range of the height h4 is determined by the relationship between the average height h1, the height h3, and the height h5.

  Specifically, as a condition that the printed cream solder 93 and the ball bump 94 on the electronic component 92 side are at least in contact with each other, there is a formula (1).

h4 <h1 + h3 (1)
Further, as a condition that the printing cream solder 93 is not crushed so as to cause trouble, there is an expression (2).

h1 + h3-h4 <h5 (2)
Therefore, if the height h4 of the electronic component 92 on the printed circuit board 91 after reflow obtained by the inspection by the post-reflow visual inspection apparatus 60 satisfies the above formulas (1) and (2), this board manufacturing is performed. In the system, it can be determined that the electronic component 92 is correctly placed while guaranteeing the quality of the cream solder.

  In addition, since the solder exists two-dimensionally on the printed circuit board 91 and the electronic component 92, if the above formulas (1) and (2) are verified not only at one point but also at each of the multiple points, The various positional relationships of the electronic component 92 with respect to the printed circuit board 91 and the state of solder at that time can be determined. FIG. 3 is a diagram showing examples of these various modes.

  FIG. 3A shows a mode in which a certain row of electronic components 92 is entirely lifted with respect to the printed circuit board 91. That is, it is a state that does not satisfy the above formula (1). Moreover, FIG.3 (b) has shown the aspect that the printing cream solder 93 is crushed entirely so that trouble may arise. That is, it is a state where the above formula (2) is not satisfied. FIG. 3C shows a state in which a part of the solder is not in contact and the electronic component 92 is inclined with respect to the printed circuit board 91. That is, in some points, the above formula (1) is not satisfied. On the other hand, if all of the solder points satisfy Expressions (1) and (2), it is determined that the electronic component 92 is non-defective even if the electronic component 92 is inclined with respect to the printed circuit board 91. FIG. 3D is a diagram showing such an embodiment. This includes not only the case where the electronic component 92 is tilted and attached to a plurality of printing cream solders 93 having the same height (to satisfy Equation (2)), but also the height of the plurality of printing cream solders 93. In some cases, the electronic component 92 is attached at a position where the inclination is allowed.

  If necessary, the determination result thus determined is displayed on a display device (not shown) included in the post-reflow visual inspection apparatus control personal computer 61 provided in the post-reflow visual inspection apparatus 60. .

  As described above, in the board manufacturing system of the first embodiment, the inspection result by the cream solder appearance inspection apparatus 20 is used in the inspection by the post-reflow appearance inspection apparatus 60 through the data storage personal computer 70. Can determine whether the electronic component 92 is placed and whether the solder is good at that time without using a transmission inspection apparatus using X-rays or the like.

<Second Embodiment of Substrate Manufacturing System>
FIG. 4 is a schematic configuration diagram of a second embodiment in a board manufacturing system employing the component mounting board inspection method of the present invention.

  In this second embodiment, the final guarantee after solder reflow is not possible, but at least by assuring that the electronic component 92 is correctly placed by the electronic component mounting apparatus 30 (guaranteed so far) This realizes the case where a component mounting board inspection method is adopted in a system for judging defects in advance.

  The substrate manufacturing system shown in the figure includes a cream solder application device (not shown), a cream solder appearance inspection device 20, an electronic component mounting device 30, a pre-reflow appearance inspection device 40, and a reflow device (not shown). And a data storage personal computer 70. A post-reflow visual inspection device may be included.

  The cream solder appearance inspection apparatus 20 includes a cream solder appearance inspection optical unit 22 and a cream solder appearance inspection apparatus control personal computer 21 for controlling the movement and processing of the unit 22. Here, the personal computer 21 for controlling the cream solder appearance inspection apparatus includes a storage unit 211 for storing inspection data. The pre-reflow appearance inspection apparatus 40 includes a pre-reflow appearance inspection optical unit 42 and a pre-reflow appearance inspection apparatus control personal computer 41 for controlling the movement and processing of the unit 42. Here, the pre-reflow appearance inspection apparatus control personal computer 41 includes a storage unit 411 that stores inspection data.

  The data storage personal computer 70 and the cream solder appearance inspection apparatus control personal computer 21 in the cream solder appearance inspection apparatus 20 are connected by a cable 81. The data storage personal computer 70 and the pre-reflow appearance inspection apparatus control personal computer 41 in the pre-reflow appearance inspection apparatus 40 are connected by a cable 83.

Next, processing operations in the substrate manufacturing system shown in FIG. 4 will be described.
The printed circuit board on which the cream solder is applied by the cream solder application apparatus is inspected for the appearance of the printed cream solder 93 by the cream solder appearance inspection apparatus 20 in order to evaluate the application state of the cream solder. Specifically, the cream solder appearance inspection optical unit 22 is controlled by the personal computer 21 for controlling the cream solder appearance inspection apparatus, and the printed cream solder 93 is optically imaged to inspect the appearance three-dimensionally. The inspection items performed in this inspection include the position of the printed cream solder 93, the bottom area a1, the protrusion area a2, the cross-sectional area a3, the average height h1, the peak height h2, the volume v, and the like as described above. Shape information (see FIGS. 12 and 5A). The inspection data is stored in the storage unit 211 in the cream solder appearance inspection apparatus control personal computer 21, and is sent to the data storage personal computer 70 via the cable 81 and stored in the internal storage unit 71. Is done. Here, the cream solder appearance inspection device 20 stores in advance the quality judgment criteria for the cream solder appearance inspection, and the cream solder appearance inspection device 20 applies the cream solder 93 by comparing the inspection results with them. The quality of each printed circuit board 91 is determined.

  The printed circuit board 91 on which the printed cream solder 93 determined to be non-defective by the cream solder appearance inspection apparatus 20 is sent to the electronic component mounting apparatus 30, and the electronic component 92 is mounted on the printed cream solder 93. FIG. 5B is a diagram illustrating a state where the electronic component 92 is mounted. In the drawing, the symbol h3 represents the height of the electronic component 92 including the ball bump 94. This height h3 is a value obtained in advance from the design value.

  Next, the printed circuit board 91 on which the electronic component 92 is mounted is sent to the pre-reflow appearance inspection apparatus 40. On the other hand, the pre-reflow appearance inspection apparatus 40 receives in advance inspection data stored in the storage unit 71 of the data storage personal computer 70 via the cable 83, and the pre-reflow appearance inspection apparatus control personal computer 41 in the personal computer 41 for control. Stored in the storage unit 411. The data received from the data storage personal computer 70 is at least the average height h1 of the printed cream solder 93.

  Therefore, the pre-reflow appearance inspection apparatus 40 performs an appearance inspection on the printed circuit board 91 on which the electronic component 92 is mounted. Specifically, the pre-reflow appearance inspection optical unit 42 is controlled by the pre-reflow appearance inspection apparatus control personal computer 41 to optically image and inspect three-dimensionally. The inspection item performed in this inspection is at least the height h6 of the electronic component 92 on the printed circuit board 91 before reflow (including the height of solder before reflow) shown in FIG. Further, the position of the electronic component 92 may be inspected.

  Therefore, if the allowable value that can crush the print cream solder 93 that is arbitrarily set in advance is h5, it is considered that the electronic component 92 on the printed board 91 before reflowing is normally placed as described above. The range of the height h6 is determined by the relationship between the average height h1, the height h3, and the height h5.

  Specifically, as a condition that the printing cream solder 93 and the ball bump 94 on the electronic component 92 side are in contact with each other, there is an expression (3).

h6 <h1 + h3 (3)
Moreover, there exists Formula (4) as conditions which have not crushed the printing cream solder 93 so that trouble may arise.

h1 + h3-h6 <h5 (4)
Therefore, if the height h6 of the electronic component 92 on the printed circuit board 91 before reflow obtained by the inspection by the pre-reflow appearance inspection apparatus 40 satisfies the above formulas (3) and (4), this board manufacturing is performed. In the system, it can be determined that the electronic component 92 is correctly placed while guaranteeing the quality of the cream solder.

  In addition, since the solder exists two-dimensionally on the printed circuit board 91 and the electronic component 92, if the above equations (3) and (4) are verified not only at one point but also at each of the multiple points, The various positional relationships of the electronic component 92 with respect to the printed circuit board 91 and the state of solder at that time can be determined. FIG. 6 is a diagram showing examples of these various modes.

  FIG. 6A shows a mode in which a certain row of electronic components 92 is entirely lifted with respect to the printed circuit board 91. That is, it is a state where the above formula (3) is not satisfied. Moreover, FIG.6 (b) has shown the aspect that the printing cream solder 93 has been crushed so that trouble may arise. That is, it is a state that does not satisfy the above formula (4). FIG. 6C shows a state in which some of the solder is not in contact and the electronic component 92 is inclined with respect to the printed circuit board 91. That is, in some points, the above formula (3) is not satisfied. On the other hand, if all of the solder points satisfy Expressions (3) and (4), it is determined that the electronic component 92 is non-defective even if the electronic component 92 is inclined with respect to the printed circuit board 91. FIG. 6D is a diagram showing such an embodiment. In addition to the case where the electronic component 92 is tilted and attached to the plurality of printing cream solders 93 having the same height (satisfying the expression (4)), the heights of the plurality of printing cream solders 93 are also included. In some cases, the electronic component 92 is attached at a position where the inclination is allowed.

  If necessary, the determination result thus determined is displayed on a display device (not shown) included in the post-reflow appearance inspection apparatus control personal computer 41 provided in the pre-reflow appearance inspection apparatus 40. .

  As described above, in the board manufacturing system of the second embodiment, the inspection result by the cream solder appearance inspection apparatus 20 is used in the inspection by the pre-reflow appearance inspection apparatus 40 via the data storage personal computer 70. Can determine the mounting state of the electronic component 92 at least at that stage without using a transmission inspection apparatus using X-rays or the like.

  In the first embodiment and the second embodiment, as shown in FIG. 1 or FIG. 4, the cream solder appearance inspection device 20 and the post-reflow appearance inspection device 60 or before the reflow are performed via the data storage personal computer 70. Although the appearance inspection apparatus 40 is connected, data may be exchanged by connecting them to a network (for example, a local area network). On the other hand, the cream solder appearance inspection apparatus 20 and the post-reflow appearance inspection apparatus 60 or the pre-reflow appearance inspection apparatus 40 may be directly connected without using the personal computer 70 for data storage.

  By the way, in the above-mentioned first and second embodiments, the cream solder appearance inspection device 20 and the post-reflow appearance inspection device 60 or the pre-reflow appearance inspection device 40 are connected by the various methods described above, and the cream solder appearance inspection is performed. Each inspection result (at least the height of the solder) in the apparatus 20 is passed to the post-reflow appearance inspection apparatus 60 or the pre-reflow appearance inspection apparatus 40, and based on the result, the measurement height when the component is placed is If the condition that can be regarded as a good solder state is satisfied, the solder state after component placement is estimated to be good, but the post-reflow appearance inspection device 60 or the pre-reflow appearance inspection device is as follows. If 40 has the judgment standard (pass / fail judgment parameter) in cream solder appearance inspection device 20 in common, cream solder appearance inspection device 20 and the appearance after reflow The post-reflow visual inspection device 60 or the pre-reflow visual inspection device 40 is a component as in the first and second embodiments without directly or indirectly connecting the inspection device 60 or the pre-reflow visual inspection device 40. The solder state after placement can be estimated.

<Third embodiment of substrate manufacturing system>
FIG. 7 is a schematic configuration diagram of a third embodiment in a board manufacturing system employing the component mounting board inspection method of the present invention.

  The board manufacturing system shown in the figure includes at least a cream solder application device (not shown), a cream solder appearance inspection device 20, an electronic component mounting device 30, a reflow device 50, and a post-reflow appearance inspection device 60. ing. A pre-reflow appearance inspection apparatus may be included.

  The cream solder appearance inspection apparatus 20 includes a cream solder appearance inspection optical unit 22 and a cream solder appearance inspection apparatus control personal computer 21 for controlling the movement and processing of the unit 22. Here, the personal computer 21 for controlling the cream solder appearance inspection apparatus includes a storage unit 211 for storing inspection data. The post-reflow visual inspection device 60 includes a post-reflow visual inspection optical unit 62 and a post-reflow visual inspection device control personal computer 61 for controlling the movement and processing of the unit 62. Here, the post-reflow appearance inspection apparatus control personal computer 61 includes a storage unit 611 for storing inspection data.

  The storage unit 211 of the cream solder appearance inspection apparatus control personal computer 21 and the storage unit 611 of the post-reflow appearance inspection apparatus control personal computer 61 store the respective inspection results, and in common the cream solder appearance inspection. The apparatus 20 has a solder condition determination criterion (for example, at least a height upper limit value h7 and a height lower limit value h8 (FIG. 8A) at which solder is determined to be good).

Next, processing operations in the substrate manufacturing system shown in FIG. 7 will be described.
The printed circuit board on which the cream solder is applied by the cream solder application apparatus is inspected for the appearance of the printed cream solder 93 by the cream solder appearance inspection apparatus 20 in order to evaluate the application state of the cream solder. Specifically, the cream solder appearance inspection optical unit 22 is controlled by the personal computer 21 for controlling the cream solder appearance inspection apparatus, and the printed cream solder 93 is optically imaged to inspect the appearance three-dimensionally. The inspection items performed in this inspection include the position of the printed cream solder 93, the bottom area a1, the protrusion area a2, the cross-sectional area a3, the average height h1, the peak height h2, the volume v, and the like as described above. Shape information (see FIG. 12). These inspection data are stored in the storage unit 211 in the personal computer 21 for controlling the cream solder appearance inspection apparatus. Here, as described above, the cream solder appearance inspection apparatus 20 has the determination criteria for determining that the solder is good, that is, the height upper limit value h7 and the height lower limit value h8 (see FIG. 8A). Therefore, the cream solder appearance inspection device 20 compares the inspection results with those to determine pass / fail of each printed circuit board 91 to which the cream solder 93 is applied.

  The printed circuit board 91 on which the printed cream solder 93 determined to be non-defective by the cream solder appearance inspection apparatus 20 is sent to the electronic component mounting apparatus 30, and the electronic component 92 is mounted on the printed cream solder 93. FIG. 8B is a diagram illustrating a state where the electronic component 92 is mounted. In the drawing, the symbol h3 represents the height of the electronic component 92 including the ball bump 94. This height h3 is a value obtained in advance from the design value.

  Next, the printed circuit board 91 on which the electronic component 92 is mounted is sent to the reflow apparatus 50, and reflow processing is performed. The printed circuit board 91 that has been subjected to the reflow process by the reflow apparatus 50 is sent to the post-reflow appearance inspection apparatus 60.

  The post-reflow appearance inspection apparatus 60 performs an appearance inspection on the printed circuit board 91 on which the electronic component 92 is mounted and reflow processing is performed. Specifically, the post-reflow visual inspection optical unit 62 is controlled by the post-reflow visual inspection device control personal computer 61 to optically image and inspect the appearance three-dimensionally. The inspection item performed in this inspection is at least the height h4 of the electronic component 92 on the printed circuit board 91 after reflow (including the height of solder after reflow) shown in FIG. Further, the position of the electronic component 92 may be inspected.

  Therefore, if the allowable value that can crush the print cream solder 93 that is arbitrarily set in advance is h5, it is considered that the electronic component 92 on the printed circuit board 91 after reflow is satisfactorily placed as described above. The range of the height h4 is determined by the relationship between the height upper limit value h7, the height lower limit value h8, the height h3, and the height h5.

  Specifically, as a condition that the printed cream solder 93 and the ball bump 94 on the electronic component 92 side are in contact with each other, there is a formula (5).

h4 <h8 + h3 (5)
Further, as a condition that the printed cream solder 93 is not crushed so as to cause trouble, there is an expression (6).

h7 + h3-h4 <h5 (6)
Therefore, if the height h4 of the electronic component 92 on the printed circuit board 91 after reflow obtained by the inspection by the post-reflow visual inspection apparatus 60 satisfies at least the above formulas (5) and (6), this board. In the manufacturing system, it can be determined that the electronic component 92 is correctly placed while guaranteeing the quality of the cream solder.

  Since the solder exists two-dimensionally on the printed circuit board 91 and the electronic component 92, if the above equations (5) and (6) are verified not only at one point but also at each of the multiple points, The various positional relationships of the electronic component 92 with respect to the printed circuit board 91 and the state of solder at that time can be determined.

  If necessary, the determination result thus determined is displayed on a display device (not shown) included in the post-reflow visual inspection apparatus control personal computer 61 provided in the post-reflow visual inspection apparatus 60. .

  As described above, in the board manufacturing system according to the third embodiment, the post-reflow visual inspection device 60 shares the determination standard of the cream solder visual inspection device 20, and therefore, in the inspection by the post-reflow visual inspection device 60, X Without using a transmission type inspection apparatus using lines or the like, it is possible to determine whether the electronic component 92 is placed or whether the solder is good.

<Fourth Embodiment of Substrate Manufacturing System>
FIG. 9 is a schematic configuration diagram of a fourth embodiment in a board manufacturing system employing the component mounting board inspection method of the present invention.

  In the fourth embodiment, as in the second embodiment, the final guarantee after the solder reflow is not possible, but at least the electronic component mounting apparatus 30 guarantees that the electronic component 92 is correctly placed (guaranteed so far). This realizes the case where the component mounting board inspection method is adopted in a system for judging defects in advance.

  The substrate manufacturing system shown in the figure includes a cream solder application device (not shown), a cream solder appearance inspection device 20, an electronic component mounting device 30, a pre-reflow appearance inspection device 40, and a reflow device (not shown). At least. A post-reflow visual inspection device may be included.

  The cream solder appearance inspection apparatus 20 includes a cream solder appearance inspection optical unit 22 and a cream solder appearance inspection apparatus control personal computer 21 for controlling the movement and processing of the unit 22. Here, the personal computer 21 for controlling the cream solder appearance inspection apparatus includes a storage unit 211 for storing inspection data. The pre-reflow appearance inspection apparatus 40 includes a pre-reflow appearance inspection optical unit 42 and a pre-reflow appearance inspection apparatus control personal computer 41 for controlling the movement and processing of the unit 42. Here, the pre-reflow appearance inspection apparatus control personal computer 41 includes a storage unit 411 that stores inspection data.

  The storage unit 211 of the personal computer 21 for controlling the cream solder appearance inspection apparatus and the storage unit 411 of the personal computer 41 for controlling the appearance inspection apparatus before reflow store the respective inspection results, and commonly use the cream solder appearance inspection. The apparatus 20 has criteria for determining the solder state (for example, at least a height upper limit h7 and a height lower limit h8 (FIG. 10A) at which solder is determined to be good).

Next, processing operations in the substrate manufacturing system shown in FIG. 9 will be described.
The printed circuit board on which the cream solder is applied by the cream solder application apparatus is inspected for the appearance of the printed cream solder 93 by the cream solder appearance inspection apparatus 20 in order to evaluate the application state of the cream solder. Specifically, the cream solder appearance inspection optical unit 22 is controlled by the personal computer 21 for controlling the cream solder appearance inspection apparatus, and the printed cream solder 93 is optically imaged to inspect the appearance three-dimensionally. The inspection items performed in this inspection include the position of the printed cream solder 93, the bottom area a1, the protrusion area a2, the cross-sectional area a3, the average height h1, the peak height h2, the volume v, and the like as described above. Shape information (see FIG. 12). These inspection data are stored in the storage unit 211 in the personal computer 21 for controlling the cream solder appearance inspection apparatus. Here, as described above, the cream solder appearance inspection apparatus 20 has a criterion for determining that solder is good, that is, a height upper limit h7 and a height lower limit h8 (see FIG. 10A). Therefore, the cream solder appearance inspection device 20 compares the inspection results with those to determine pass / fail of each printed circuit board 91 to which the cream solder 93 is applied.

  The printed circuit board 91 on which the printed cream solder 93 determined to be non-defective by the cream solder appearance inspection apparatus 20 is sent to the electronic component mounting apparatus 30, and the electronic component 92 is mounted on the printed cream solder 93. FIG. 10B is a diagram illustrating a state where the electronic component 92 is mounted. In the drawing, the symbol h3 represents the height of the electronic component 92 including the ball bump 94. This height h3 is a value obtained in advance from the design value.

  Next, the printed circuit board 91 on which the electronic component 92 is mounted is sent to the pre-reflow appearance inspection apparatus 40.

  The pre-reflow appearance inspection apparatus 40 performs an appearance inspection on the printed circuit board 91 on which the electronic component 92 is mounted. Specifically, the pre-reflow appearance inspection optical unit 42 is controlled by the pre-reflow appearance inspection apparatus control personal computer 41 to optically image and inspect three-dimensionally. The inspection item performed in this inspection is at least the height h6 of the electronic component 92 on the printed circuit board 91 before reflow (including the height of solder before reflow) shown in FIG. Further, the position of the electronic component 92 may be inspected.

  Therefore, if the allowable value that can crush the print cream solder 93 that is arbitrarily set in advance is h5, it is considered that the electronic component 92 on the printed circuit board 91 after reflow is satisfactorily placed as described above. The range of the height h6 is determined by the relationship between the height upper limit value h7, the height lower limit value h8, the height h3, and the height h5.

  Specifically, as a condition that the printing cream solder 93 and the ball bump 94 on the electronic component 92 side are in contact with each other, there is a formula (7).

h6 <h8 + h3 (7)
Further, as a condition that the printed cream solder 93 is not crushed so as to cause trouble, there is an equation (8).

h7 + h3-h6 <h5 (8)
Therefore, if the height h6 of the electronic component 92 on the printed circuit board 91 before reflow obtained by the inspection by the pre-reflow appearance inspection apparatus 40 satisfies at least the above formulas (7) and (8), this board is used. In the manufacturing system, it can be determined that the electronic component 92 is correctly placed while guaranteeing the quality of the cream solder.

  In addition, since the solder exists two-dimensionally on the printed circuit board 91 and the electronic component 92, if the above equations (7) and (8) are verified not only at one point but also at each of the multiple points, The various positional relationships of the electronic component 92 with respect to the printed circuit board 91 and the state of solder at that time can be determined.

  If necessary, the determination result thus determined is displayed on a display device (not shown) included in the post-reflow appearance inspection apparatus control personal computer 41 provided in the pre-reflow appearance inspection apparatus 40. .

  As described above, in the board manufacturing system according to the fourth embodiment, the pre-reflow appearance inspection apparatus 40 shares the determination criteria of the cream solder appearance inspection apparatus 20, and therefore, in the inspection by the pre-reflow appearance inspection apparatus 40, X Without using a transmission type inspection apparatus using lines or the like, it is possible to determine whether the electronic component 92 is placed or whether the solder is good.

  In the third and fourth embodiments described above, the determination conditions are severe because the actual measurement results from the cream solder appearance inspection apparatus 20 are received and not determined based on the results as in the first and second embodiments. On the other hand, there is an advantage that a relatively simple configuration is obtained because the post-reflow visual inspection device 60 or the pre-reflow visual inspection device 40 is not indirectly or directly connected to the cream solder visual inspection device 20.

<Modification of the above embodiment>
As an intermediate form between the first and second embodiments and the third and fourth embodiments, as in the first and second embodiments, the cream solder appearance inspection device 20 and the post-reflow appearance inspection device 60 or before reflow A configuration is also conceivable in which the appearance inspection apparatus 40 is connected and the determination criteria in the cream solder appearance inspection apparatus 20 are transmitted as in the third and fourth embodiments.

  In each of the above-described embodiments, the post-reflow visual inspection device 60 or the pre-reflow visual inspection device 40 is determined using the height inspection result or the determination standard in the cream solder visual inspection device 20, Further, if the solder volume inspection result or determination standard in the cream solder appearance inspection apparatus 20 is used, a more reliable determination can be made.

  20 Cream solder appearance inspection device, 21 Cream solder appearance inspection device control personal computer, 22 Cream solder appearance inspection optical unit, 30 Electronic component mounting device, 40 Pre-reflow appearance inspection device, 41 Pre-reflow appearance inspection device control personal computer , 42 Optical unit for visual inspection before reflow, 50 reflow device, 60 visual inspection device after reflow, 61 personal computer for visual inspection device after reflow, 62 optical unit for visual inspection after reflow, 70 personal computer for data storage, 91 prints Board, 92 Electronic components, 93 Print cream solder, 94 Ball bump

Claims (3)

  1. The printed circuit board to which the cream solder is applied is inspected for the appearance of the cream solder, the electronic component is mounted on the printed circuit board to which the cream solder is applied, and the printed circuit board on which the electronic component is mounted. A component mounting board inspection method for performing inspection before or after reflowing,
    The inspection before reflow is non-use of the result of the inspection of the appearance of the cream solder,
    The inspection after the reflow is not using the result of the appearance inspection of the cream solder,
    Using the judgment criteria for the inspection of the appearance of the cream solder, inspect the printed circuit board on which the electronic component is mounted before or after the reflow,
    The electronic component is a BGA (Ball Grid Array) component, a leadless component, or a filletless component,
    In the inspection after the reflow, the following expressions (1) and (2) are satisfied,
    h4 <h8 + h3 (1)
    here,
    h3: Height of the electronic component including the electrode
    h4; height of the electronic component on the printed circuit board after the reflow
    h8: Height lower limit value at which the cream solder is determined to be good (the determination criterion)
    h7 + h3-h4 <h5 (2)
    here,
    h3: Height of the electronic component including the electrode
    h4; height of the electronic component on the printed circuit board after the reflow
    h5: Allowable value to crush the cream solder without hindrance
    h7: Upper limit of height at which the cream solder is judged to be good (the determination criterion)
    In the inspection before the reflow, the following expressions (3) and (4) are satisfied. H6 <h8 + h3 (3)
    here,
    h3: Height of the electronic component including the electrode
    h6; height of the electronic component on the printed circuit board before the reflow
    h8: Height lower limit value at which the cream solder is determined to be good (the determination criterion)
    h7 + h3-h6 <h5 (4)
    here,
    h3: Height of the electronic component including the electrode
    h5: Allowable value to crush the cream solder without hindrance
    h6; height of the electronic component on the printed circuit board before the reflow
    h7: Upper limit of height at which the cream solder is judged to be good (the determination criterion)
    A component mounting board inspection method characterized by the above.
  2. A cream solder appearance inspection device for inspecting and judging the appearance of the cream solder on the printed circuit board coated with the cream solder;
    An electronic component mounting apparatus for mounting electronic components on the printed circuit board coated with the cream solder;
    A reflow apparatus for performing a reflow process on a printed circuit board on which the electronic component is mounted;
    A post-reflow visual inspection device that inspects the appearance of a printed circuit board on which the electronic component subjected to the reflow processing is mounted;
    A board manufacturing system comprising:
    The cream solder appearance inspection apparatus and the post-reflow appearance inspection apparatus are disconnected.
    The post-reflow visual inspection apparatus stores in advance a criterion for inspection of the appearance of the cream solder in the cream solder visual inspection apparatus, and uses the determination criterion to determine the appearance of the printed circuit board on which the electronic component is mounted. Do the inspection,
    The electronic component is a BGA (Ball Grid Array) component, a leadless component, or a filletless component,
    In the inspection after the reflow process, the following expressions (1) and (2) are satisfied. H4 <h8 + h3 (1)
    here,
    h3: Height of the electronic component including the electrode
    h4; height of the electronic component on the printed circuit board after the reflow process
    h8: Height lower limit value at which the cream solder is determined to be good (the determination criterion)
    h7 + h3-h4 <h5 (2)
    here,
    h3: Height of the electronic component including the electrode
    h4; height of the electronic component on the printed circuit board after the reflow process
    h5: Allowable value to crush the cream solder without hindrance
    h7: Upper limit of height at which the cream solder is judged to be good (the determination criterion)
    A board manufacturing system characterized by that.
  3. A cream solder appearance inspection device for inspecting and judging the appearance of the cream solder on the printed circuit board coated with the cream solder;
    An electronic component mounting apparatus for mounting electronic components on the printed circuit board coated with the cream solder;
    A pre-reflow appearance inspection apparatus for inspecting the appearance of a printed circuit board on which the electronic component is mounted before reflow processing;
    A board manufacturing system comprising:
    The cream solder appearance inspection device and the pre-reflow appearance inspection device are disconnected.
    The pre-reflow appearance inspection apparatus stores in advance a judgment standard for the appearance inspection of the cream solder in the cream solder appearance inspection apparatus, and uses the judgment standard to determine the appearance of the printed circuit board on which the electronic component is mounted. Do the inspection,
    The electronic component is a BGA (Ball Grid Array) component, a leadless component, or a filletless component,
    In the inspection before the reflow process, the following expressions (1) and (2) are satisfied. H6 <h8 + h3 (1)
    here,
    h3: Height of the electronic component including the electrode
    h6; height of the electronic component on the printed circuit board before the reflow treatment
    h8: Height lower limit value at which the cream solder is determined to be good (the determination criterion)
    h7 + h3-h6 <h5 (2)
    here,
    h3: Height of the electronic component including the electrode
    h5: Allowable value to crush the cream solder without hindrance
    h6; height of the electronic component on the printed circuit board before the reflow treatment
    h7: Upper limit of height at which the cream solder is judged to be good (the determination criterion)
    A board manufacturing system characterized by that.
JP2014559469A 2013-02-03 2013-02-03 Component mounting board inspection method and board manufacturing system employing the inspection method Active JP6118353B2 (en)

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US20050209822A1 (en) * 2004-03-01 2005-09-22 Masato Ishiba Inspection method and system and production method of mounted substrate
JP4493421B2 (en) * 2004-06-30 2010-06-30 株式会社リコー Printed circuit board inspection apparatus, printed circuit board assembly inspection line system, and program
JP4450223B2 (en) * 2005-09-14 2010-04-14 オムロン株式会社 Board inspection method
JP4692268B2 (en) * 2005-12-22 2011-06-01 パナソニック株式会社 Electronic component mounting system and electronic component mounting method
JP4816194B2 (en) * 2006-03-29 2011-11-16 パナソニック株式会社 Electronic component mounting system, electronic component mounting apparatus, and electronic component mounting method
JP5223876B2 (en) * 2010-03-12 2013-06-26 オムロン株式会社 X-ray inspection apparatus, X-ray inspection method, X-ray inspection program, and X-ray inspection system
JP2012124269A (en) * 2010-12-07 2012-06-28 Hitachi Ltd System and method for manufacturing printed circuit board
JP5365643B2 (en) * 2011-01-13 2013-12-11 オムロン株式会社 Soldering inspection method, board inspection system, and soldering inspection machine
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