JP3998641B2 - Printed solder inspection apparatus and printed solder inspection method - Google Patents

Description

  The present invention relates to a solder inspection apparatus and an inspection method for measuring and inspecting a printed solder formation state when a cream-like solder is printed on a printed circuit board for surface mounting an electronic component or the like by a solder printing apparatus or the like.

  In particular, the displacement (including height) and brightness (substrate) of the printed solder on the substrate obtained as a result of irradiating the substrate (hereinafter referred to simply as “substrate”) with light. Image data (height, area, volume, etc.) representing the amount of printed solder when solder printing is performed from the measurement data of the amount of light reflected from the light and the amount of light received (including the intensity of light). Data: Hereinafter, a part or all of these are converted into “image data”), and the image data is compared with reference data (hereinafter referred to as “reference”) as a criterion for determination. In the inspection apparatus (method) for judging, the above image data is accurately generated from the pattern shape of the printed solder portion of the substrate, the printed solder state, the measurement condition, the noise, the condition for converting the above data, and the combination thereof. Is difficult Ri, a determination means for determining the image data, and outputs the result of judgment incorrectly printed solder forming state of good and defective (hereinafter, an erroneous determination result referred to as "false alarm".) Is sometimes. The present invention relates to a technique for reducing the occurrence of such false information.

  Conventionally, in the printed solder inspection apparatus as described above, measurement data, which is an analog amount from the measurement means, is processed with image parameter values including predetermined threshold values, filter conditions, and the like. For example, processing such as filtering by filter conditions to remove noise, converting to binary data with a threshold value, and creating image data representing the amount of printed solder such as area and volume (See Patent Documents 1, 2, and 3. The method for generating image data is described in detail in Patent Document 3.) This processing is generated on a substrate basis. That is, when generating image data, if there are a plurality of solder locations on the same substrate, they are processed with image parameter values such as a threshold value common to the solder locations on the substrate. Therefore, when a false alarm is generated at any one printed solder location on the board, the false alarm is generated at another printed solder location even if the image parameter value is changed to correct the false error. The possibility was high.

  On the other hand, the quality of printed solder is judged in units of solder locations, and the inspection results are managed (see Patent Document 4), but in the process leading to the judgment, it is managed in units of solder locations. It wasn't.

JP 2002-22412 A (paragraphs [0030]-[0034], FIG. 4) JP 2002-176254 A (paragraphs [0028]-[0031], FIG. 4, FIG. 4) JP 2002-228597 A (paragraphs [0040]-[0050], FIG. 2, FIG. 5) JP 2000-65552 A ([Claim 1], [Claim 2])

  In the technology for generating image data by the same parameter value in the unit of substrate, that is, common to the printed solder locations as in the above prior art, in order to prevent false reports of some printed solder locations, It is necessary to consider the influence on the soldered part, and there is a difficulty that it must be carried out after trial and error. As one countermeasure against the occurrence of such false information, it is conceivable to provide the image parameter value for generating image data in units of printed solder locations and deal with each solder location individually. However, at the start of the inspection, it is impossible to confirm where the false information is generated, so the same image parameter value must be applied to each of many printed solder locations. Memory is also increased. In addition, the time for reading and processing image parameter values for each of many printed solder locations is delayed. Furthermore, it takes time to set the input of image parameter values.

  An object of the present invention is to improve the above-mentioned drawbacks of the prior art. In general, image data is generated and inspected using image parameter values common to the board set at the initial stage of inspection, and a specific printed solder location is obtained. It is an object to provide a technique capable of generating and inspecting image data using individual image parameter values only for.

  At the same time, it is intended to make it easy to set image parameters dedicated to a specific printed solder location and to output analysis data for analysis that can determine whether it is false information.

  In the present invention for solving the above-described problems, image parameters common to each printed solder location (hereinafter referred to as “image parameters” include items and values. Parameter value ”), and the position of a specific printed solder location and individual image parameters at that location, and based on the location information, the image data of the printed solder location at each location uses a common image parameter. Thus, image data at a specific position is generated using the individual image parameters.

Specifically, the invention described in claim 1 irradiates light onto a display solder , an operation tool, and a printed solder board having a plurality of printed solder locations, and measures the amount of reflected light and / or displacement at that position. Receiving the measurement data from the measurement means, the parameter storage means for storing the image parameter value including the threshold value for the measurement data, which is set in common to the printed solder locations. By comparing the image data with reference data stored in advance, image processing means for processing the image parameter value to generate image data that is an element representing the amount of solder in the printed solder location A printed solder inspection apparatus comprising: a determination unit configured to perform pass / fail determination; and an image pattern of a specific printed solder location among the plurality of printed solder locations. And the individual parameter storage means for storing a meter value together with the position information of the printed solder portion, the is displayed on the display unit receives layout of printed solder locations in the printed solder substrate, receiving the designation information from the operation means When displaying the specific printed solder location designated on the image displayed on the display means in an identifiable manner, the image parameter item corresponding to the specific printed solder location is displayed on the display means, and then A parameter control unit that stores the image parameter value in the individual parameter storage unit when the image parameter value is received from the operation unit; and the image processing unit performs the processing based on the position information When the printed solder location of the measurement data is a printed solder location other than the specific printed solder location The use a common image parameter values stored in the parameter storage unit, when the a particular print solder portion is provided with a parameter reading means for using an image parameter values stored in the individual parameter storage means.

According to a second aspect of the invention, as information that can be analyzed by the operator of the determination result by the determining means in the invention according to the first aspect, the measurement data at the position of the printed solder locations in the printed solder substrate, when viewing Analysis data output means for generating image information that can be viewed in a map form is provided, and the layout of the print locations is image information output by the analysis data output means.

According to a third aspect of the present invention, a step of storing a predetermined image parameter value common to a plurality of printed solder locations previously provided on the same printed solder substrate in a parameter storage means, and irradiating the printed solder substrate with light The step of measuring the amount of reflected light and / or the amount of displacement at the position with the measuring means and outputting it as measurement data, and receiving the measurement data and processing the image parameter means with the image parameter value, A printed solder inspection method comprising a step of generating image data serving as an element representing the amount of solder and a step of determining pass / fail by a determination means comparing the image data with reference data stored in advance. Te, after the quality determination is performed, on the diagram the arrangement of the printed solder locations in the printed solder substrate that is displayed on the display means, the operating means Receiving the information from the operation means as the position information when the printed solder location is specified, and displaying the image parameter item at the specific printed solder location on the display means, and then the operation When receiving the image parameter value from the means, the step of storing the parameter information in the individual parameter storage means corresponding to the position information, and the next and subsequent inspection, the image processing means is based on the position information of the printed solder location When the print solder location of the measurement data to be processed is a print solder location other than the specific print solder location, the common image parameter value stored in the parameter storage means is used. In the case of the specific printed solder location, the image parameter value stored in the individual parameter storage means is used. And the.

According to the first and third aspects of the present invention, the image parameter values common to the printed solder locations of the entire substrate and the individual image parameter values only for the specific printed solder locations are stored, and the image processing means is configured to store the specific printed solder locations. Is the individual image parameter value, and the other part is configured to generate image data with the common image parameter value. Measures can be taken by setting individual parameter values so that false alarms do not occur individually only for printed solder locations. Further, since the image parameter value is provided separately only for the printed solder portion where the false information is generated, there is an effect that the setting of the parameter is not complicated and the burden of the memory capacity is not increased.

Also, through the display means for the operator, the layout of the printed solder location and the image parameter items are provided, and the judgment means outputs the false information while operating with the operation means on the displayed screen. There is an effect that an individual parameter value can be easily set with respect to the position of the printed solder location that caused the cause.

The invention according to claim 2 includes analysis data including a displacement amount indicating the height of the printed solder and / or a reflection amount (light reception amount) of light from the printed solder location on the arrangement of the printed solder location. Is displayed on the display means, so that there is an effect that it is easy to visually analyze the determination result of the determination means or the state of the false alarm occurrence location.

  Embodiments of the present invention will be described with reference to FIGS. FIG. 1 is a functional block diagram showing the configuration of the present invention. FIG. 2 is a diagram for explaining an operation flow of the present invention according to the configuration of FIG. FIG. 3 is a diagram showing an operation flow in the present invention. FIG. 4 is a layout view showing the printed part of the substrate.

  In FIG. 1, the measuring means 2 is a laser displacement meter, for example, and comprises a sensor unit 2a and a measurement processing unit 2b. The sensor unit 2a includes a laser light source capable of scanning the substrate 1 and irradiating a laser in each of the X axis and Y axis directions, and a light receiving unit that receives reflected light from the substrate 1, and is particularly printed soldered. The displacement of the solder location, that is, the height (Z-axis direction) is measured in correspondence with the position. At that time, the received light amount (luminance) corresponding to the position is also obtained from the solder surface. Although detailed explanation of the operation as a laser displacement meter is omitted, as a principle, there is one disclosed in Japanese Patent Laid-Open No. 3-291512 filed by the same applicant, and FIGS. 4 and 7 and their explanations. It is the same as that.

  In the measurement processing unit 2b, layout information such as a printed solder location or a resist location when the substrate 1 to be inspected is designed is stored in the substrate information storage means 3 to be described later. The sensor unit 2a performs scanning measurement, and the sensor unit 2a outputs the detected displacement amount and / or received light amount as measurement data corresponding to the position of the printed solder.

  The board information storage unit 3 stores at least layout information and a reference as board information to be inspected. The layout information is a layout diagram when the board 1 to be inspected is designed. For example, as shown in FIG. 4, a printed solder spot, a resist spot without printed solder, and a recognition mark serving as a reference for the position Arrangement information on the substrate such as (not shown) is stored. This layout information itself can be displayed on the display means 8 as an image (as a layout screen). In addition, a reference for inspecting the substrate 1 and determining pass / fail is stored as data corresponding to the substrate 1 to be inspected. These references are prepared for each solder location such as the height, area, volume, and solder defect of the printed solder location. In other words, these references are information that makes it easy to quantitatively (image-wise) recognize the printed solder at the solder location, and are data that serve as a criterion for pass / fail judgment.

  When there are many types of substrates 1 to be inspected, the substrate information is stored in the substrate information storage means 3 with identification information, and a list of identification information and / or a layout screen is displayed on the display means 8. The information can be selected by being displayed and designated by a marker or the like on the screen by the operation means 4.

  The image processing means 5 receives the position of the solder portion of the substrate 1 measured by the measuring means 2 and the displacement data (displacement amount), luminance data (light reception amount), etc. at the position, and receives an image from the parameter storage means 9 described later. The parameter value is read out, and based on the image parameter value, the measurement data is processed into image data representing the amount of printed solder at each solder location. The image data is data that represents the amount of solder at the printed solder location, and, similar to the above reference, the height, area, volume, and defect of each solder location (there is no amount of solder to be present) Detection). These data such as height, area, and volume are three-dimensional image information or information that can be elements thereof. Note that not all of the above images are required to determine the substrate 1, but at least one of height, area, and volume is indispensable. In the determination, what is determined as the image data of the substrate 1 to be inspected or which combination of image data is determined may differ depending on the type and content of the substrate 1.

  The image processing means 5 mainly adjusts the sensitivity for identifying fine patterns such as solder bridges and solder pattern edges with a predetermined parameter value for filtering measurement data to remove noise under a predetermined filter condition. Means for binarizing at a predetermined threshold value, converting to digital data and binarizing, and using the binarized data, such as height, area and / or volume at the printed solder Means for performing calculations and the like are included. Details of these arithmetic processes and the like are described in Patent Document 3 by the same applicant. The predetermined filter condition, the predetermined parameter for adjusting the sensitivity, and the predetermined threshold value are those stored in the parameter storage unit 9 (details will be described later) as image parameter values.

  The image parameter values used for the data processing are commonly applied to each printed solder location on the same substrate 1 at the initial stage of inspection, and are used to generate image data.

  The determination means 7 receives the image data output from the image processing means 5 and compares it with the reference from the board information storage means 3 to determine the quality of each solder location.

The parameter storage means 9 stores image parameter values used by the image processing means 5 to process the measurement data into image data as described above. The image parameter value is an important factor in the inspection as in the reference because the image data generated by conversion using the image parameter value is compared by the determination means 7 to be judged pass / fail.

The image parameter value is, for example, a threshold value for distinguishing (recognizing) whether the measurement data is a printed solder portion or a resist portion, a filter condition for distinguishing from noise, Alternatively, including parameter values for sensitivity adjustment, for example, there are the following. In either case, each image parameter item can be displayed on the screen of the display means 8 (image parameter setting screen mode), and the image parameter value can be set by the operation means 4 while being visually recognized by the operator.
(1) Solder luminance: a threshold value for identifying whether or not the measurement data is solder.
(2) Resist surface brightness: threshold value for identifying whether measurement data is a resist surface (3) Pad surface brightness: threshold value for identifying whether measurement data is a pad surface (4) Filter condition (intensity): This is an image parameter for filtering the measurement data. In this example, the smaller the value, the more noise components included in the measurement data can be removed. Data is easily lost. When the judgment means 7 gives a false alarm judgment result that the normal solder location is bridged (two solder locations are mistakenly connected), this image parameter value is mainly reduced. It is preferable to do.
(5) Bridge sensitivity: For example, when two solder locations are normally connected, it may be erroneously determined as a defective bridge, so parameters (6 for adjusting and setting the width of the bridge) ) Pattern edge sensitivity: Since the wiring pattern may be recognized as a solder location, parameters for adjusting and setting (7) Parameters related to the recognition mark: The recognition mark is a mark used for alignment provided on the substrate 1 ing. This is the reference position for various data, and is a parameter for adjusting and setting this position so that it does not deviate.

Since any of the above image parameter values are measured in an analog manner by irradiating light, the printed solder is processed based on this measurement data so that it can be clearly evaluated quantitatively (as image data). belongs to.

  The image parameter values described above are parameters that are applied to image data generation in common at all printed solder locations on the substrate 1 (all other resist surfaces and the like are the same as well) at the initial point of inspection of the substrate 1.

However, according to the present invention, an individual parameter storage area (means) that can hold individual image parameter values generated in units of printed solder locations on the substrate 1 (or modify common image parameters) in correspondence with position information for identifying printed solder locations. ) 9a was provided. The individual image parameter values for each printed solder location stored in the individual parameter storage area (means) 9a are partly the same as the common image parameter values in the items and value ranges described above. It can be set on the parameter setting screen. That is, the items can be set in the same manner as the above (1) to (3), (5), and (6). However, the individual image parameter needs to be stored corresponding to the position information for specifying the target printed solder location. Note that the individual image parameters may be different items from the common image parameters. For example, the following items (8) to (9) are useful items that are not included in the common image parameters but are added as individual image parameters. Moreover, it is not restricted to these.
(8) Reference height position offset: When the image processing means 5 calculates the area, the area of the solder amount at a predetermined height position (referred to as “reference plane”) from the substrate is calculated. The height offset is a parameter for adjusting the reference plane in units of 4 μm.
(9) Apparent light quantity adjustment parameter: For example, when processing by recognizing a solder surface as a dark surface, some of the solder includes a bright part, and if the measurement is performed as it is, that part is used as the solder part. There are cases where it does not recognize. Therefore, it is a parameter for processing the measured data as if it were measured with the light amount reduced.

  The image processing means 5 has a parameter reading means 5a, and when the substrate 1 is inspected (re-inspected) after the individual image parameters are set as described above, the parameter reading means 5a prints the substrate 1 by the parameter reading means 5a. Image data is generated by reading out image parameter values related to the measurement data in the order of the solder locations. At that time, the position information stored in the individual parameter storage area 9a is inquired for the position of the printed solder, and if it does not match, the common image parameter value stored in the parameter storage means 9 is read and used. If they match, the image parameter values stored in the individual parameter storage area 9a are read out and used. Although the individual parameter storage area 9a is provided as an area in the parameter storage means 9 that is distinguished from the common image parameter value storage area, it may be a separate storage means.

  In this way, the image parameter value common to all the solder locations and the individual image parameter values for only the specific solder locations are provided, and the image processing means 5 uses the individual image parameter values for the specific solder locations and the other locations are common. Therefore, when the determination means 7 outputs false information that is erroneously determined, adjustment is made so that the determination means 7 does not output the false information only to the solder location that caused the false information. The set individual image parameter values are retained and can be used.

  In other words, common image parameter values may be set from the beginning, but since there are so many solder locations, a large amount of work is required and a large memory capacity is required. Setting a value solves those problems. However, changing common image parameter values for some solder locations can cause other false alarms. The present invention solves these problems as described above.

  The analysis data output means 6 receives the measurement data such as the displacement corresponding to the position of the printed solder location on the substrate 1 output from the measuring means 2, and displays it as an image on the layout diagram of the printed solder location in the layout information. When displayed, the height of the solder is converted into analysis data that can be observed and analyzed in contour lines. The analysis data output means 6 receives the measurement data of the received light amount corresponding to the position of the printed solder location, and displays the brightness of the solder surface when displayed as an image on the layout diagram of the printed solder location in the layout information. Convert to data that can be observed and analyzed in contour lines. In the above description, it is described that the contour line can be observed. However, not only the contour line but also the analysis data is displayed on the display unit 8 as an image. If so, it may be expressed by any of color change, shading, pattern, etc. (the above expression is referred to herein as “map shape”).

  The analysis data output by the analysis data output means 6 is mainly used to confirm whether the determination result of the determination means 7 is normal or to analyze the cause when the determination means 7 erroneously outputs a false alarm. Useful information. Since the determination means 7 determines the image data obtained by processing the measurement data by the image processing means 5, the analysis data is as close as possible to the measurement data itself and is on the screen. Those that are easy to analyze are preferred. In this example, analysis data can be generated after the filter of (1) is applied to the measurement data. This is because it is necessary to reduce noise.

  The analysis data can be used as a layout including measurement data (analysis data) instead of the layout information as the layout stored in the board information storage unit 3 described above.

  The parameter control means 10a is in the display control means 10 related to the entire operation / display, and selects the inspection target board between the operator and the printed solder inspection apparatus through the operation of the operation means 4 and the display means 8. It administers an interface including setting of common image parameter values, confirmation of determination results of the determination means 7, analysis of false reports, setting of individual parameter values, and other operations / displays associated therewith. That is, control is performed between the operator and the printed solder inspection apparatus in the operation flow shown in FIG.

  Since the details of the operation flow of FIG. 2 will be described later, the main control configuration performed by the parameter control means 10a will be described here.

  The parameter control means 10a displays an image parameter item on the display means 8 and guides input in order to allow the operator to set a common image parameter value for the board 1 at the initial stage of the inspection of the board 1. Next, when the operator sets the image parameter value for each item by the operation means 4 and sets the confirmation key, the set value is stored in the parameter storage means 9. The parameter control unit 10a and the display control unit 10 have a format required for display, for example, a display format such as an image parameter item, an input image parameter value, and operation guide information. Further, it has access means for other blocks including the parameter storage means 9.

  The next time the measurement (inspection) is performed, the parameter control means 10a displays information necessary for the measurement operation / observation on the measurement screen and is stored in the measurement data and the parameter storage means 9 or the individual parameter storage area 9a. Image data is generated by the image processing means 5 based on the image parameter values being displayed, and the items and results determined by the determination means 7 are displayed. Then, in order to confirm whether the determination result is correct, the operator receives the layout (placement diagram) from the board information storage means 3 and the analysis data from the analysis data output means 6 and displays them.

  Further, when the operator determines that the determination result is false information, the parameter control unit 10a receives the layout of the printed solder locations on the substrate 1 from the substrate information storage unit 3 and displays it on the display unit 8 according to a request from the operator. Display (this is the same as described above), and the operator operates the operation unit 4 while visually observing (observing) the layout of the screen of the display unit 8, for example, on the image while moving the marker It is placed on a specific printed solder location (corresponding to the designation of a specific printed solder location. Information from the operation means 4 at that time becomes position information indicating the location of the specific solder location) and a confirmation operation is performed. In order for the operator to set individual image parameter values for the printed solder locations in the position information from the operation means 4 at that time, image parameter items are displayed on the display means 8. Thereafter, when the operator inputs the individual image parameter value with the operation means 4, the individual image parameter value is received and stored in the individual parameter storage area (means) 9a.

In the above configuration, the measurement processing unit 2b, the image processing unit 5, the analysis data output unit 6, the determination unit 7, and the display control unit 10 (including the parameter control unit 10a) include a CPU, a memory (ROM, RAM), and the above-described configuration. The program is stored in a memory for causing the CPU to execute the operation.

  Next, based on FIG. 2, the operation | movement flow of the part which concerns on this invention is demonstrated. FIG. 2 is described in two series so as to distinguish whether the subject to be executed is an operator or a printed solder inspection apparatus. Arrows indicate the time-series flow (or information direction). Further, the S number in the figure indicates the number of the operation step of the printed solder inspection apparatus. Hereinafter, step numbers (printed solder inspection apparatus) will be mainly described.

  Step S1: At the start, the operator selects a library screen with a substrate list from the menu screen displayed on the display means 8. The display control means 10 displays a board list and a list of image parameter files related to the board list (when a past file is already included).

Step S2: While observing the display, the name of the substrate 1 to be inspected and the name of the image parameter file are selected by operating the operation means 4 with a marker and clicking (determining). On the other hand, the display control means 10 displays the corresponding image parameter items and values (or common image parameter values if already used in the past).

  Step S3: When the common image parameter value is adjusted (input setting if no value is displayed) and confirmed, the adjusted image parameter value is stored in the parameter storage means 9.

  Step S4: The measuring means 2 performs measurement. The image processing means 5 processes the measurement data into image data based on a common image parameter value. The determination unit 7 determines based on the image data and the reference. During this time, the display control means 10 displays a screen and determination results necessary for measurement.

  Steps S5 and S6: The operator determines whether there is a possibility of false information based on the determination result. If there is a possibility of false information, the operator gives an instruction to display a layout (arrangement drawing). The operator designates a corresponding printed solder location by setting a marker by the operation means 4 on the layout screen (step S5) displayed as shown in FIG. The display control unit 10 causes the analysis data output unit 6 to specify the print solder location, output the analysis data, and display it on the display unit 8 (step S6).

  Step S7: The operator confirms the false information based on the analysis data, and if it is the false information, selects the printed solder location on the display layout (if it is the same as the previously selected one, only the confirmation process is performed. .) The display control means 10 displays individual image parameter setting items.

  Step S8: The operator sets individual image parameter values while viewing the display screen by the operation means 4 (if a common image parameter value is displayed as an individual image parameter value, adjustment is set) . The display control means 10 stores the image parameter value set by the operation means 4 in the individual parameter storage area 9a in association with the position information.

Step S9: The operator starts inspection of the next substrate 1 (re-inspection if it is the same as the previous substrate). The printed solder inspection apparatus executes the inspection, and FIG. 3 shows detailed processing performed by the image processing means 5 and the parameter reading means 5a in step S9. The image processing means 5 and the parameter reading means 5a access the individual parameter storage area 9a, inquire about the position information of the printed solder portion of the image data to be generated (S9-1), and in the individual parameter storage area 9a. When it is determined that it is a printed solder location at a position other than the stored position (S9-2, NO), image data is generated based on the common image parameter value in the parameter storage means 9 (S9-3). When it is determined that it is a printed solder location at the position stored in the individual parameter storage area 9a (S9-2, YES), image data is generated based on the individual image parameter values in the individual parameter storage area 9a. (S9-4). The determination means 7 determines these image data by comparing with the reference.

  Therefore, from the next inspection, it is possible to prevent the occurrence of false information for the same type of substrate 1.

It should be noted that the parameters as shown in (9) above described in the description of the individual parameters may be implemented by the measuring unit 2 without being implemented by the image processing unit 5. In this case, as the image parameters handled by the image processing means 5 are divided into common image parameters and individual image parameters, the conditions handled by the measuring means 2, for example, the conditions for handling a laser displacement meter (for example, the laser light quantity (intensity) ), The light receiving sensitivity of the light receiving means, the position, etc.) as measurement parameters, and means for storing them separately into common measurement parameters for measuring under common conditions at measurement locations and individual measurement parameters for specific locations where false alarms occur It may be provided (not shown), and the measurement processing unit 2b may read and measure individual measurement parameters only at specific locations from the storage means, and read and measure common measurement parameters at other locations (not shown).

  Furthermore, the combination of the individual image parameter by the image processing means 5 and the individual measurement parameter by the measurement means 2 may be used.

It is a figure for demonstrating the functional block of this invention. It is a figure for demonstrating the operation | movement flow of this invention. It is a figure for demonstrating the detailed step of step S9 in FIG. It is a figure for demonstrating the layout (layout) of the board | substrate displayed on the display means 8 which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Measurement means 2a Sensor part 2b Measurement processing part 3 Board | substrate information storage means 4 Operation means 5 Image processing means 5a Parameter reading means 6 Analysis data output means 7 Judgment means 8 Display means 9 Parameter storage means 9a Individual parameter storage area 10 Display Control means 10a Parameter control means

Claims (3)

Measurement that irradiates light onto a display solder (8), operation means (4), and a printed solder board having a plurality of printed solder locations, measures the amount of reflected light and / or displacement at that position, and outputs the measurement data Receiving the measurement data from the means (2), the parameter storage means (9) for storing the image parameter value including the threshold value for the measurement data, which is set in common to the printed solder location; The image processing means (5) for processing the image parameter value to generate image data that is an element representing the amount of solder at the printed solder location, and comparing the image data with prestored reference data A printed solder inspection apparatus comprising a determination means (7) for determining pass / fail by
An individual parameter storage means (9a) for storing an image parameter value of a specific printed solder location of the plurality of printed solder locations together with position information of the printed solder location, and an arrangement diagram of the printed solder locations on the printed solder substrate When the specified information is received from the operation means, the specific printed solder location specified on the image displayed on the display means is displayed in an identifiable manner, and the specific information is displayed. Parameter control means (10a) for displaying image parameter items corresponding to printed solder locations on the display means and then storing the image parameter values in the individual parameter storage means when receiving image parameter values from the operation means And
The image processing means, based on the position information, when the print solder location of the measurement data to be processed is a print solder location other than the specific print solder location, the parameter storage means And a parameter reading means (5a) that uses the image parameter value stored in the individual parameter storage means when the specific printed solder location is used. Printed solder inspection equipment. Analysis data output means for generating, as information that allows the operator to analyze the determination result by the determination means, as image information that can be viewed as a map when the measurement data at the position of the printed solder location on the printed solder board is displayed ( 6)
The layout of the print position is printed solder inspection apparatus according to claim 1, wherein the analysis data output means is image information to be output. Storing a predetermined image parameter value common to a plurality of printed solder locations provided in advance on the same printed solder substrate in the parameter storage means;
Irradiating the printed solder substrate with light, measuring the amount of reflected light and / or displacement at the position with a measuring means, and outputting as measurement data;
Receiving the measurement data, and processing the image parameter means with the image parameter value to generate image data serving as an element representing the amount of solder in the printed solder location;
A printed solder inspection method comprising a step of determining pass / fail by a determination unit comparing the image data with reference data stored in advance,
After the pass / fail judgment is made , when the printed solder location is specified by the operating means on the layout diagram of the printed solder location on the printed solder substrate displayed on the display means, the information from the operating means is Receiving as position information, and displaying the image parameter item at the specific printed solder location on the display means, and then receiving the image parameter value from the operation means, the individual parameter corresponding to the position information Storing in the storage means;
In the next and subsequent inspections, the image processing means, based on the position information of the printed solder location, the printed solder location of the measurement data to be processed is another printed solder other than the specific printed solder location. If it is a location, use the common image parameter value stored in the parameter storage means, and if it is the specific printed solder location, use the image parameter value stored in the individual parameter storage means Printed solder inspection method characterized by.

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