JP3998642B2 - Printed solder inspection service method and printed solder inspection apparatus - Google Patents

Description

  The present invention relates to a printed solder inspection service method for measuring and inspecting a printed solder formation state when a cream-like solder is printed on a printed circuit board for surface mounting an electronic component or the like by a solder printer or the like. And a printed solder inspection apparatus used therefor.

  In particular, the displacement (including height) and brightness (substrate) of the printed solder on the substrate obtained as a result of irradiating the substrate (hereinafter referred to simply as “substrate”) with light. Image data (height, area, volume, etc.) representing the amount of printed solder when solder printing is performed from the measurement data of the amount of light reflected from the light and the amount of light received (including the intensity of light). Data: Hereinafter, a part or all of these are converted into “image data”), and the image data is compared with reference data (hereinafter referred to as “reference”) as a criterion for determination. In the inspection apparatus and method for determining, the image data is accurately generated from the pattern shape of the printed solder portion of the substrate, the printed solder state, the measurement conditions, the noise, the conditions for converting the above data, and the combination thereof. In difficulty Ri, a determination means for determining the image data, and outputs the result of judgment incorrectly printed solder forming state of good and defective (hereinafter, an erroneous determination result referred to as "false alarm".) Is sometimes. However, it is difficult to analyze whether the determination means makes an incorrect determination, and to analyze what value the image parameter should have when an incorrect determination is made. The present invention makes it possible for another expert (hereinafter referred to as a “serviceman”), who is different from the operator of the printed solder inspection apparatus, to easily perform such analysis using an external analysis device. The present invention relates to a technique for reducing the occurrence of false alarms by inspecting using the obtained image parameter values.

  Conventionally, in the printed solder inspection apparatus as described above, measurement data, which is an analog amount from the measurement means, is processed with image parameter values including predetermined threshold values, filter conditions, and the like. For example, processing such as filtering by filter conditions to remove noise, converting to binary data with a threshold value, and creating image data representing the amount of printed solder such as area and volume (See Patent Documents 1, 2, and 3. The method for generating image data is described in detail in Patent Document 3.) This processing is generated on a substrate basis. That is, when generating image data, if there are a plurality of solder locations on the same substrate, they are processed with image parameter values such as a threshold value common to the solder locations on the substrate. Therefore, when a false alarm is generated at any one printed solder location on the board, the false alarm is generated at another printed solder location even if the image parameter value is changed to correct the false error. The possibility was high.

  On the other hand, the quality of printed solder is judged in units of solder locations, and the inspection results are managed (see Patent Document 4), but in the process leading to the judgment, it is managed in units of solder locations. It wasn't.

  Up to this point, it has been explained that a judgment error occurs in the printed solder inspection apparatus, but it is judged whether there is an error in this judgment or whether the solder printing on the board is defective. Setting appropriate image parameter values in some cases also required a fairly high degree of professional experience and knowledge. In general, when such a problem of analysis and setting of image parameter values occurs, a professional service person takes a business trip to take measures.

JP 2002-22412 A (paragraphs [0030]-[0034], FIG. 4) JP 2002-176254 A (paragraphs [0028]-[0031], FIG. 4, FIG. 4) JP 2002-228597 A (paragraphs [0040]-[0050], FIG. 2, FIG. 5) JP 2000-65552 A ([Claim 1], [Claim 2])

  In the technology for generating image data by the same parameter value in the unit of substrate, that is, common to the printed solder locations as in the above prior art, in order to prevent false reports of some printed solder locations, It is necessary to consider the influence on the soldered part, and there is a difficulty that it must be carried out after trial and error. As one countermeasure against the occurrence of such false information, it is conceivable to provide the image parameter value for generating image data in units of printed solder locations and deal with each solder location individually. However, at the start of the inspection, it is impossible to confirm where the false information is generated, so the same image parameter value must be applied to each of many printed solder locations. Memory is also increased. In addition, the time for reading and processing image parameter values for each of many printed solder locations is delayed. Furthermore, it takes time to set the input of image parameter values.

  Also, when analyzing the printed solder location, instead of a serviceman traveling on a business trip, the data required for the analysis is sent from the print soldering device to the serviceman, the serviceman analyzes it, and the result is reflected in the printed soldering device. However, since the measurement is performed image-wise and the data is converted into image data and processed, the data on the entire board becomes enormous and often cannot fit into the FD, etc. It was also difficult to send by e-mail. In other words, it was difficult to send analysis data to a service person for analysis. As a countermeasure, the operator may send only the data of the problem part, but since the processing is performed on the entire board, it is difficult for the operator to extract the data of the problem part.

  The present invention improves the above-mentioned drawbacks of the prior art. In general, image data is generated and inspected using image parameter values common to the board set at the initial stage of inspection, and only for specific printed solder portions. Image data can be generated using individual image parameter values so that they can be inspected. Furthermore, when analyzing the printed solder spot in question, a service person receives and analyzes the analysis data for that spot only. It is an object of the present invention to provide an inspection service method capable of providing appropriate individual image parameter values and an inspection apparatus used therefor.

  In the present invention for solving the above-described problems, image parameters common to each printed solder location (hereinafter referred to as “image parameters” include items and values. Parameter value ”), and the position of a specific printed solder location and individual image parameters at that location, and based on the location information, the image data of the printed solder location at each location has a common image parameter value. The image data at a specific position is generated using the individual image parameter values, and only the data of the problem soldering part is extracted from the analysis data necessary for analysis such as error judgment. It is characterized in that it is configured to receive a new individual image parameter value that has been corrected only for the printed solder portion. In other words, the configuration is such that it can be easily solved by processing only the necessary data at the problematic location.

Specifically, the invention described in claim 1 is a step of storing a predetermined image parameter value common to a printed solder location previously provided on the printed solder substrate in a parameter storage means; Irradiating, measuring the amount of reflected light and / or displacement at the position with a measuring means and outputting it as measurement data; receiving the measurement data, and processing the image processing means with the image parameter value; The step of generating image data serving as an element representing the amount of solder in the solder location, the step of determining pass / fail by comparing the image data with reference data stored in advance, and the pass / fail determination are performed. After receiving the position information specifying the position of a specific printed solder location, as information that can analyze the determination result by the determination means, Based on the measurement data at the position of the specific printed solder location based on the position information, generates image information that can be viewed in a map when displayed, and the image information and the image parameter value at the specific printed solder location Outputting analysis data including
Upon receipt of the analysis data, the image information is displayed so that it can be visually analyzed, and when there is an error in the determination result, a new individual image parameter value at the specific printed solder location is generated and output. A step of receiving the new individual image parameter value at the specific printed solder location and storing it in the individual parameter storage means corresponding to the position information of the specific printed solder location; In the inspection, the image processing means, based on the position information of the printed solder location, the printed solder location of the measurement data to be processed is a printed solder location other than the specific printed solder location. In this case, the common image parameter value stored in the parameter storage unit is used. Using the image parameter value stored in the meter storage means.

  According to a second aspect of the present invention, in the second aspect of the invention, the step of generating and outputting the analysis data receives the position information and specifies at least the position information for the measuring means. The printed solder location is measured to obtain measurement data, and based on the measurement data, analysis data including the image information and the image parameter value is generated and output.

According to the third aspect of the present invention, the display means, the operation means, and the printed solder board having a plurality of printed solder locations are irradiated with light, and the amount of reflected light and / or the amount of displacement at that position is measured as measurement data. A measurement means for outputting; a parameter storage means for storing image parameter values including a threshold value for the measurement data, which is set in common to the printed solder locations; and receiving the measurement data from the measurement means and receiving the image parameters A pass / fail judgment is performed by comparing image processing means for generating image data that is an element representing the amount of solder in the printed solder location, and processing the image with a value, and the reference data stored in advance. A printed solder inspection apparatus comprising a determination means,
As information that can analyze the determination result by the determination means, based on the measurement data at the position of a specific printed solder location on the printed solder substrate, image information that can be viewed in a map form when displayed is generated, and the image information And analysis data output means for outputting analysis data including image parameter values at the specific printed solder location to the outside,
Another receiving new image parameter values pieces, and the individual parameter storage means for storing together with the position information of the printed solder point,
When the layout of the printed solder location on the printed solder substrate is received and displayed on the display means, and the specific printed solder location is designated on the image displayed on the display means by the operation means, the measurement means On the other hand, at least the measurement at the specific printed solder location is executed, the measurement data is sent to the analysis data output means to generate the analysis data, and a new individual at the specific print solder location is externally generated. Parameter control means for storing the image parameter value in the individual parameter storage means when received ,
The image processing means, based on the position information, when the print solder location of the measurement data to be processed is a print solder location other than the specific print solder location, the parameter storage means Parameter reading means for using a new image parameter value stored in the individual parameter storage means when the specific printed solder location is used.

  The inventions according to claims 1 and 3 are configured such that only a specific printed solder location in question can be specified, analysis data can be generated and sent to a serviceman for analysis, and the specific printed solder location from the serviceman. Therefore, the image processing means is configured to generate image data with specific image parameter values for specific printed solder locations and other image parameter values for the other printed solder locations. There is an effect that only the image parameter value at the wrong place needs to be dealt with, and there is an effect that it can be dealt with without enormous memory load. In addition, since the analysis data and the individual parameter values of only the printed solder portion whose question is questionable can be output, the analysis can be easily commissioned and the expert's knowledge can be used. In addition, if the result of analyzing the determination is false information as a result of the analysis, only the printed solder location that caused the error is extracted (the surrounding area can also be included) and no false information is generated individually. In this way, individual parameter values can be received and set from a service person, so that parameter values can be easily set.

  Since the invention according to claim 2 is configured to measure only a specific printed solder spot and output analysis data, and to generate and determine image data with individual image parameter values, as an apparatus, The analysis data volume can be extracted only as much as necessary, and it is easy to receive services from external service personnel.

Furthermore, the invention according to claim 3 provides an arrangement diagram of printed solder locations and image parameter items to the operator through the display means, and operates on the displayed screen by the operation means. It becomes easy to output the analysis data only about the position of the printed solder spot where the judging means becomes a problem, and it is easy to receive service by an external service person.

  Embodiments of the present invention will be described with reference to FIGS. FIG. 1A is a functional block diagram showing the configuration of the printed solder inspection apparatus of the present invention. FIG. 1B is a diagram showing functional blocks of an analysis apparatus for receiving and analyzing analysis data from a printed solder inspection apparatus. FIG. 2 is a diagram showing an overall schematic flow of the printed solder inspection method. 3A, 3B, and 3C are diagrams showing a detailed flow. FIG. 3 is a diagram showing an operation flow in the present invention. FIG. 4 is an arrangement view showing an example of a printed solder location on the board. FIG. 5 is a diagram showing an example of analysis data and correction information of analysis conditions after analysis or new image parameters.

  In FIG. 1, the measuring means 2 is a laser displacement meter, for example, and comprises a sensor unit 2a and a measurement processing unit 2b. The sensor unit 2a includes a laser light source capable of irradiating a laser in each direction of the X axis and the Y axis by scanning the substrate 1, and a light receiving unit that receives reflected light from the substrate 1, and is particularly printed soldered. The displacement of the printed solder portion, that is, the height (Z-axis direction) is measured in correspondence with the position. At that time, the received light amount (luminance) corresponding to the position is also obtained from the solder surface. Although detailed explanation of the operation as a laser displacement meter is omitted, as a principle, there is one disclosed in Japanese Patent Laid-Open No. 3-291512 filed by the same applicant, and FIGS. 4 and 7 and their explanations. It is the same as that.

  In the measurement processing unit 2b, layout information including a layout diagram of printed solder locations or resist locations when the substrate 1 to be inspected is designed is stored in the substrate information storage means 3 to be described later. The sensor unit 2a performs scanning measurement according to the layout information, and the sensor unit 2a outputs the detected displacement amount and / or received light amount as measurement data corresponding to the position of the printed solder location. .

  The board information storage unit 3 stores at least layout information and a reference as board information to be inspected. The layout information is a layout diagram when the board 1 to be inspected is designed. For example, as shown in FIG. 4, a printed solder spot, a resist spot without printed solder, and a recognition mark serving as a reference for the position Arrangement information on the substrate such as (not shown) is stored. This layout information itself can be displayed on the display means 8 as an image (as a layout screen). In addition, a reference for inspecting the substrate 1 and determining pass / fail is stored as data corresponding to the substrate 1 to be inspected. These references are prepared for each solder location such as the height, area, volume, and solder defect of the printed solder location. In other words, these references are information that makes it easy to quantitatively (image-wise) recognize the printed solder at the solder location, and are data that serve as a criterion for pass / fail judgment.

  When there are many types of substrates 1 to be inspected, the substrate information is stored in the substrate information storage means 3 with identification information, and a list of identification information and / or a layout screen is displayed on the display means 8. The information can be selected by being displayed and designated by a marker or the like on the screen by the operation means 4.

  The image processing means 5 receives the position of the solder portion of the substrate 1 measured by the measuring means 2 and the displacement data (displacement amount), luminance data (light reception amount), etc. at the position, and receives an image from the parameter storage means 9 described later. The parameter value is read out, and based on the image parameter value, the measurement data is processed into image data representing the amount of printed solder at each solder location. The image data is data that represents the amount of solder at the printed solder location, and, similar to the above reference, the height, area, volume, and defect of each solder location (there is no amount of solder to be present) Detection). These data such as height, area, and volume are three-dimensional image information or information that can be elements thereof. Note that not all of the above images are required to determine the substrate 1, but at least one of height, area, and volume is indispensable. In the determination, what is determined as the image data of the substrate 1 to be inspected or which combination of image data is determined may differ depending on the type and content of the substrate 1.

  The image processing means 5 mainly adjusts the sensitivity for identifying fine patterns such as solder bridges and solder pattern edges with a predetermined parameter value for filtering measurement data to remove noise under a predetermined filter condition. Means for binarizing at a predetermined threshold value, converting to digital data and binarizing, and using the binarized data, such as height, area and / or volume at the printed solder Means for performing calculations and the like are included. Details of these arithmetic processes and the like are described in Patent Document 3 by the same applicant. The predetermined filter condition, the predetermined parameter value for adjusting the sensitivity, and the predetermined threshold value are those stored in the parameter storage unit 9 (details will be described later) as the image parameter value.

  The image parameter values used for the data processing are commonly applied to each printed solder location on the same substrate 1 at the initial stage of inspection, and are used to generate image data.

  The determination means 7 receives the image data output from the image processing means 5 and compares it with the reference from the board information storage means 3 to determine the quality of each solder location.

The parameter storage unit 9 stores image parameter values used by the image processing unit 5 to process measurement data into image data as described above. The image parameter value is an important factor in the inspection as in the reference because the image data generated by conversion using the image parameter value is compared by the determination means 7 to be judged pass / fail.

The image parameter value is, for example, a threshold value for distinguishing (recognizing) whether the measurement data is a printed solder portion or a resist portion, a filter condition for distinguishing from noise, Alternatively, including parameter values for sensitivity adjustment, for example, there are the following. In either case, each image parameter item can be displayed on the screen of the display means 8 (image parameter setting screen mode), and the image parameter value can be set by the operation means 4 while being visually recognized by the operator.
(1) Solder luminance: a threshold value for identifying whether or not the measurement data is solder.
(2) Resist surface brightness: threshold value for identifying whether measurement data is a resist surface (3) Pad surface brightness: threshold value for identifying whether measurement data is a pad surface (4) Filter condition (intensity): This is an image parameter for filtering the measurement data. In this example, the smaller the value, the more noise components included in the measurement data can be removed. Data is easily lost. When the judgment means 7 gives a false judgment result on the assumption that the printing solder spot which is normally normal is bridged (two soldering spots are mistakenly connected), this image parameter value is mainly used. It is preferable to make it small.
(5) Bridge sensitivity: For example, when two solder locations are normally connected, it may be erroneously determined as a defective bridge, so parameters (6 for adjusting and setting the width of the bridge) ) Pattern edge sensitivity: Since the wiring pattern may be recognized as a solder location, parameters for adjusting and setting (7) Parameters related to the recognition mark: The recognition mark is a mark used for alignment provided on the substrate 1 ing. This is the reference position for various data, and is a parameter for adjusting and setting this position so that it does not deviate.

Since any of the above image parameter values are measured in an analog manner by irradiating light, the printed solder is processed based on this measurement data so that it can be clearly evaluated quantitatively (as image data). belongs to.

  The image parameter value described above is a parameter value that is applied to image data generation in common at all printed solder locations on the substrate 1 (the other resist surfaces and the like are all the same) at the initial point of inspection of the substrate 1. .

However, according to the present invention, an individual parameter storage area that can hold individual image parameter values generated in units of printed solder locations on the board 1 (or modify common image parameter values) in correspondence with position information for identifying printed solder locations. (Means) 9a is provided. The individual image parameter values for each printed solder location stored in the individual parameter storage area (means) 9a are partly the same as the common image parameter values in the items and value ranges described above. It can be set on the parameter setting screen. That is, the items can be set in the same manner as the above (1) to (3), (5), and (6). However, the individual image parameter needs to be stored corresponding to the position information for specifying the target printed solder location. Note that the individual image parameters may be different items from the common image parameters. For example, the following items (8) to (9) are useful items that are not included in the common image parameters but are added as individual image parameters. Moreover, it is not restricted to these.
(8) Reference height position offset: When the image processing means 5 calculates the area, the area of the solder amount at a predetermined height position (referred to as “reference plane”) from the substrate is calculated. The height offset is a parameter for adjusting the reference plane in units of 4 μm.
(9) Apparent light quantity adjustment parameter: For example, when processing by recognizing a solder surface as a dark surface, some of the solder includes a bright part, and if the measurement is performed as it is, that part is used as the solder part. There are cases where it does not recognize. Therefore, it is a parameter for processing the measured data as if it were measured with the light amount reduced.

  The image processing means 5 has a parameter reading means 5a. When the substrate 1 is inspected (re-inspected) after the individual image parameter values are set as described above, the parameter reading means 5a causes the parameter reading means 5a to Image data values related to the measurement data are read out in order of the positions of the printed solder, and image data is generated. In that case, the position of the printed solder is inquired with the position information stored in the individual parameter storage area 9a, and if it does not match, the common image parameter value stored in the parameter storage means 9 is read out and used. If they match, the image parameter values stored in the individual parameter storage area 9a are read out and used. Although the individual parameter storage area 9a is provided as an area in the parameter storage means 9 that is distinguished from the common image parameter value storage area, it may be a separate storage means.

  In this way, the image parameter value common to all the printed solder locations and the individual image parameter values for only the specific solder locations are given, and the image processing means 5 uses the individual image parameter values for the specific printed solder locations, and other locations. Is configured to process with a common image parameter value, so that when the determination means 7 outputs false information erroneously determined, the determination means 7 does not output the false information only to the solder location that caused the false information. It has the effect that it can use individual image parameter values that have been adjusted and set.

  In other words, common image parameter values may be set from the beginning, but since there are so many solder locations, a large amount of work is required and a large memory capacity is required. Setting a value solves those problems. However, changing common image parameter values for some solder locations can cause other false alarms. The present invention solves these problems as described above.

  The analysis data output means 6 receives the measurement data such as the amount of displacement and the amount of received light corresponding to the position of the printed solder location on the substrate 1 output from the measuring means 2 and displays the layout of the specific printed solder location in the layout information. In addition, when displayed as an image, the height of the solder is converted into analysis data that can be observed and analyzed in contour lines. In the above description, it is described that it can be observed in the form of contour lines. However, not only the contour lines but also the analysis data is displayed on the display means 8 as an image, so that the solder surface can be easily identified and recognized according to the height and brightness of the solder surface If so, it may be expressed by any of color change, shading, pattern, and the like according to the displacement amount and luminance (the above expression is referred to as “map shape” here).

The analysis data output means 6 will be described in the description of the parameter control means 10a to be described later as a method for obtaining analysis data of a specific individual printed solder location, but any of the following methods may be used.
(A) A method for specifying a position of a specific printed solder location from layout information, already measured measurement data, image processed image data, etc., and extracting only the data at that position, or
(B) For the measurement means 2 and the analysis data output means 6 (and the image processing means 5 and the determination means 7 may be included), the position of a specific printed solder location is designated and remeasured at that position. (Re-inspection) to obtain analysis data.
However, if the configuration is such that the re-measurement can be performed only at individual points as in the latter, the same resources as those for measuring and inspecting the entire substrate 1 can be obtained without preparing a new means for extracting data as in the former. Can be used, so the process is simple and reliable.

  An example of analysis data is shown in FIG. FIGS. 5 (A) and 5 (B) are both image information of a specific printed solder location and its surroundings, and FIG. 5 (A) is image information in which the amount of displacement is represented as a map image. FIG. 5B shows image information in which the amount of received light is represented as a map image. A small square in FIG. 5B is a marker indicating a specific location, and a large square frame is a marker indicating the periphery thereof. FIG. 5C is an enlarged view of the small square frame of FIG. Open circles are standard values indicating the solder range. This is easy to determine whether the printed solder is within the standard range.

The analysis data output means 6 generates and outputs the analysis data of the specific printed solder location where the result determined by the determination means 7 is doubtful as described above. , Position information at the time of design, measurement conditions, measurement result (each data including position, height of printed solder, area of printed solder, etc., including processing result of image processing means 5), tolerance value for measurement result (determination means 7 And the setting value of the image parameter value is output as a part of the analysis data. FIG. 5D shows an example of information such as setting values. The data shown in Design, Measurement Condition, Measurement, and Setting Param in FIG. Note that the Setting Param in FIG. 5D includes the above-described image parameters (1) to (3), (5), (6), (8), and (9).

  As described above, the analysis data including the image information based on the measurement data, the position information, the measurement result, and the like is output to the outside through the output interface 11 to be analyzed by the service person. The output interface 11 has communication means and outputs it to an external serviceman computer (analysis apparatus to be described later) directly or via a network, but has writing means to be stored in a medium such as an FD. It may be output. In the latter case, the operator sends the medium to the service person.

  The parameter control means 10a is in the display control means 10 related to the entire operation / display, and selects the inspection target board between the operator and the printed solder inspection apparatus through the operation of the operation means 4 and the display means 8. It administers an interface including setting of common image parameter values, confirmation of determination results of the determination means 7, analysis of false reports, setting of individual parameter values, and other operations / displays associated therewith. That is, control is performed between the operator and the printed solder inspection apparatus in the operation flow shown in FIGS. 3 (A) and 3 (C).

  Since the details of the operation flow of FIG. 3 will be described later, the main control configuration performed by the parameter control means 10a will be described here.

  The parameter control means 10a displays image parameter items (see (1) to (7) above) in order to allow the operator to set common image parameter values for the substrate 1 at the initial stage of inspection of the substrate 1. 8 to guide the input. Next, when the operator sets the image parameter value for each item by the operation means 4 and sets the confirmation key, the set value is stored in the parameter storage means 9. The parameter control unit 10a and the display control unit 10 have a format required for display, for example, a display format such as an image parameter item, an input image parameter value, and operation guide information. Further, it has access means for other blocks including the parameter storage means 9.

  When the measurement (inspection) is performed next time, the parameter control means 10a displays information necessary for the measurement operation / observation on the measurement screen, and the measurement data and the parameter storage means 9 or the individual parameter storage area 9a. The image data generated by the image processing means 5 based on the image parameter values stored in the image data, and the items and results determined by the determination means 7 are displayed. Then, in order to confirm whether or not the determination result is correct, the operator can receive the layout (placement diagram) from the board information storage means 3 and the analysis data from the analysis data output means 6 and display them. .

  Further, when the operator determines that the determination result is false information, the parameter control unit 10a receives layout information (placement diagram) of the printed solder location on the substrate 1 from the substrate information storage unit 3 according to a request from the operator. It is displayed on the display means 8 (this is the same as described above), and the operator operates the operation means 4 while visually observing (observing) the layout of the screen of the display means 8 to move, for example, a marker. However, it is placed on a specific printed solder location on the image (corresponds to designation of a specific printed solder location. Information from the operation means 4 at that time becomes position information indicating the position of the specific printed solder location. ) Perform the confirmation operation. In order for the operator to set individual image parameter values for the printed solder locations in the position information from the operation means 4 at that time, image parameter items are displayed on the display means 8. Thereafter, when the operator inputs the individual image parameter value with the operation means 4, the individual image parameter value is received and stored in the individual parameter storage area (means) 9a. As described above, since the location where the false alarm is generated can be specified on the screen, it is easy for the operator to work.

  The above describes the case where the operator sets individual image parameter values when the operator determines that the determination result at a specific printed solder location is false information. Even if it is difficult to set a new image parameter value in order to prevent the false alarm, send the analysis data to the service person as described above to have it analyzed, and the presence or absence of the false alarm and the false alarm If there is, it is possible to request setting of a new image parameter value for preventing it.

  When sending analysis data to a service person, the parameter control means 10a receives the layout information (placement diagram) of the printed solder location from the board information storage means 3 and displays it on the display means 8 in the same manner as when the false information is generated. . When a specific printed solder location is designated on the layout screen displayed on the display means by the operation means 4, the measurement means 2 is caused to execute measurement at least at the specific printed solder location, and the measurement data Is sent to the analysis data output unit 6 to generate image information, and the image processing unit 5 generates image data and the determination unit 7 determines. The re-measurement / inspection results including these results are output as analysis data via the output interface 11 and sent to the serviceman's analysis device. Therefore, the operator can easily acquire and output analysis data relating to a portion to be analyzed by designating on the screen. In this case, the analysis data may be sent by connecting the output interface 11 and the analysis device via a network, or may be e-mail. Further, it may be stored in a medium such as an FD and sent via the medium. This is because the analysis data described above is only data for a specific printed solder portion that is likely to be falsely reported, so the amount of data is smaller than before, and it is easy to send it by e-mail or medium.

  When a new image parameter value set by the serviceman is sent after analysis by the serviceman via the input interface 12, the parameter control means 10a receives this and stores it in the individual parameter storage area 9a. The parameter control means 10a may update the past data for the printed solder corresponding to the individual parameter storage area 9a if it already exists, or it may be stored in another area for the next inspection. The image parameter value of the new area is used. Further, the input interface 12 may receive a new image parameter value from a serviceman analysis device (computer) directly or via a network or e-mail, or has a means for reading from a medium, such as an FD. You may receive via a medium.

It should be noted that the parameters as shown in (9) above described in the description of the individual parameters may be implemented by the measuring unit 2 without being implemented by the image processing unit 5. In this case, as the image parameters handled by the image processing means 5 are divided into common image parameters and individual image parameters, the conditions handled by the measuring means 2, for example, the conditions for handling a laser displacement meter (for example, the laser light quantity (intensity) ), The light receiving sensitivity of the light receiving means, the position, etc.) as measurement parameters, and means for storing them separately into common measurement parameters for measuring under common conditions at measurement locations and individual measurement parameters for specific locations where false alarms occur It may be provided (not shown), and the measurement processing unit 2b may read and measure individual measurement parameters only at specific locations from the storage means, and read and measure common measurement parameters at other locations (not shown).

  Furthermore, the combination of the individual image parameter by the image processing means 5 and the individual measurement parameter by the measurement means 2 may be used.

  In the above configuration, the measurement processing unit 2b, the image processing unit 5, the analysis data output unit 6, the determination unit 7, and the display control unit 10 (including the parameter control unit 10a) include a CPU, a memory (ROM, RAM), and the above-described configuration. The program consists of a program or the like stored in a memory for causing the CPU to execute the operation (or the operation of the printed solder inspection apparatus shown in FIGS. 3A, 3C, and 3D described later).

  An example of an analysis device used by a service person will be described with reference to FIG. Generally speaking, the analysis data is received from the printed solder inspection apparatus, analyzed and simulated to generate new individual image parameter values for the location where there was a false report, and send it to the printed solder inspection apparatus.

  1B, the same reference numerals as those in FIG. 1A indicate the same functions. However, the operation of each part only needs to operate at a specific printed solder location (may be a plurality of locations including the periphery thereof), and does not need to operate for the entire substrate 1. A new code block will be described.

  The input / output interface 14 is a combination of the input interface 12 and the output interface 11 shown in FIG. 1A. The input / output interface 14 communicates with the input interface 12 and the output interface 11 or exchanges analysis data by FD. Exchange.

  The test data storage means 13 stores analysis data received by the input / output interface 14, and stores, for example, each data shown in FIGS. 5A to 5D described above. Other blocks are the same as those in FIG.

  In such an analyzing apparatus, the display control means 10 operated for analysis by the service person, and the display control means 10 receiving the operation, displays image information representing the displacement amount from the test data storage means 13 in the map form of FIG. Image information representing the map-like luminance in FIG. 5B is read and displayed. Further, the analysis data in FIG. 5D can be applied to the image processing means 5, the parameter storage means 9, and the determination means 7 in the analysis apparatus, and the simulation and inspection can be performed while changing the image parameter values and the like. Also, test whether the measurement conditions are appropriate.

In this way, the service man operates the analysis device and outputs a new individual image parameter value for a specific printed solder location, which is a printed solder location that is a problem in the pass / fail judgment in the printed solder inspection device. To do. FIG. 5F is an output example of the new individual image parameter value, and is data for updating the Setting Param of FIG. 5D transmitted as analysis data. The image parameter values arranged in order from the top in FIG. 5F correspond to the image parameter values arranged in order from the top of the Setting Param item in FIG. In addition, correction information for measurement conditions and the like as shown in FIG. The new individual image parameter value of FIG. 5 (F) output from the analysis apparatus is sent to the printed solder inspection apparatus together with the correction information of FIG. 5 (E) and stored in the individual parameter storage area 9a. The specific printed solder location is subjected to image processing by using the new image parameter value stored in the individual parameter storage area 9 a by the image processing means 5, image data is generated, and further determined by the determination means 7. It will be. As a result, the problem of the previous determination is solved here.

  Next, based on FIG.2 and FIG.3, the operation | movement flow of the part which concerns on this invention is demonstrated. FIG. 2 is an outline and FIG. 3 is for detailed explanation. FIG. 3 is described in two series so that the subject to be executed can be distinguished from an operator (or serviceman) or a printed solder inspection apparatus (or serviceman analysis apparatus). Arrows indicate the time-series flow (or information direction). Further, the S number in the figure indicates the number of the operation step of the printed solder inspection apparatus. Hereinafter, step numbers (printed solder inspection apparatus, analysis apparatus) will be described in order.

  As shown in FIG. 2, the inspection method according to the present invention is roughly divided into a false alarm generation stage (step S10) performed on the printed solder inspection apparatus side, a false alarm analysis stage (step S20) process performed on the serviceman side, and It consists of three stages of processing of the false alarm correction stage (step S30) performed on the printed solder inspection apparatus side. The outline will be described below.

Step S10: Using the printed solder inspection apparatus, measure the printed solder 1 and perform image processing, and determine the image data subjected to the image processing by the determining means 7, and whether the determination result is false or not. Alternatively, if it is a false report but it is difficult to set the image parameter value, the analysis data output means 6 at the corresponding printed solder location generates an analysis data file and transmits it to the service side.

Step S20: The service person uses the analysis device (computer) to analyze the presence / absence of false information and an appropriate image parameter value using the analysis device (computer). Image parameter values are generated and transmitted as electronic data (or files) to the printed solder inspection apparatus.

Step 30: The parameter control means 10a of the printed solder inspection apparatus receives a new individual image parameter value at the location where there was a false report from the service person, and obtains the individual image parameter value at the corresponding location in the individual parameter storage area 9a. Update (or own separately). In the subsequent board inspection, the image processing means 5 uses the updated (separately owned) image parameter values in the individual parameter storage area 9a when generating the image data at the corresponding location.

  Next, these details will be described with reference to FIG. FIGS. 3A, 3B, 3C, and 3D are detailed diagrams of steps S10, S20, and S30 of FIG. 2, respectively.

In FIG. 3 (A),
Step S11: At the start, the operator selects a library screen with a substrate list from the menu screen displayed on the display means 8. The display control means 10 displays a board list and a list of image parameter files related to the board list (when a past file is already included).

Step S12: While observing the display, the name of the substrate 1 to be inspected and the name of the image parameter file are selected by operating the operating means 4 with the marker and clicking (determining). On the other hand, the display control means 10 displays the corresponding image parameter items and values (or common image parameter values if already used in the past).

  Step S13: When the common image parameter value is adjusted (input setting if no value is displayed) and confirmed, the adjusted image parameter value is stored in the parameter storage means 9.

  Step S14: The measuring means 2 performs measurement. The image processing means 5 processes the measurement data into image data based on a common image parameter value. The determination means 7 determines the image data based on the reference. During this time, the display control means 10 displays a screen and determination results necessary for measurement.

  Steps S15 and S16: The operator determines whether there is a possibility of false information based on the determination result, and if there is a possibility of false information, issues an instruction to display a layout (arrangement drawing). The operator designates a corresponding printed solder location by setting a marker by the operation means 4 on the layout screen (S15) displayed as shown in FIG. The display control means 10 extracts the analysis data based on the measurement data previously measured by designating the designated printed solder location to the analysis data output means 6 and outputs it to the display means 8 in response thereto. indicate. In this case, instead of extracting from the analysis data based on the previously measured data, only the designated printed solder location may be measured again, and the analysis data may be generated and output based on the measurement data. . (S16).

  Step S17: The output interface 11 transmits the analysis data from the analysis data output means 6.

In FIG. 3B,
Steps S21 and S22: Upon receiving the analysis data file, the service person starts up with an analysis device (computer) and displays the analysis data and the like.

  Step S23: The service person analyzes based on the analysis data, confirms the false information, and if it is the false information, displays the image parameter item of the printed solder location.

  Steps S24 and 25: The service person sets a new individual image parameter value while viewing the display screen by the operation means, generates an image parameter file (S24), and transmits it to the printed solder inspection apparatus (S25).

In FIG. 3C,
Steps S31, S32, S33: The parameter file is received by the input interface 12 (S31), and the display control means 10 corresponding to the image parameter value stored in the parameter file together with the position information to the individual parameter storage area 9a. Store (S32). Further, when the operator instructs the inspection of the next substrate 1 (the same substrate 1 as the previous inspection or the same type of substrate), the inspection is executed. The image processing means 5 at that time stores the individual parameter storage. With reference to the area 9a, for the printed solder location stored in the individual parameter storage area 9a, image data is generated using the image parameter value stored in the individual parameter storage area 9a. The details are shown in FIG. 3D (S33).

In FIG. 3D,
Steps S33-1 to S4-4: The operator starts inspecting the next substrate 1. The printed solder inspection apparatus performs inspection. The image processing means 5 and the parameter reading means 5a access the individual parameter storage area 9a, inquire the position information of the printed solder portion of the image data to be generated (S33-1), and in the individual parameter storage area 9a. When it is determined that it is a printed solder location at a position other than the stored position (S33-2, NO), image data is generated based on the common image parameter value in the parameter storage means 9 (S33-3). When it is determined that it is a printed solder location at the position stored in the individual parameter storage area 9a (S33-2, YES), image data is generated based on the individual image parameter values in the individual parameter storage area 9a. (S33-4). The determination means 7 determines these image data by comparing with the reference.

  Therefore, from the next inspection, it is possible to easily prevent the occurrence of false information for the same type of substrate 1 by effectively using a professional service person.

It is a figure for demonstrating the functional block of this invention. It is a figure for demonstrating the functional block of the analyzer which concerns on this invention and a serviceman uses. It is a figure for demonstrating the outline operation | movement flow of this invention. It is a figure for demonstrating the operation | movement flow of the false alarm generation | occurrence | production stage based on this invention. It is a figure for demonstrating the operation | movement flow of the false alarm analysis stage which concerns on this invention. It is a figure for demonstrating the operation | movement flow of the false information correction stage which concerns on this invention. It is a figure for demonstrating the detailed step of step S33 in FIG.3 (C). It is a figure for demonstrating the layout (layout) of the board | substrate displayed on the display means 8 which concerns on this invention. It is a figure which shows the example of the map-form image information which shows the displacement amount as analysis data. It is a figure which shows the example of the map-like image information which shows a brightness | luminance as analysis data. It is a figure which shows the example of the image information which concerns on the expansion brightness | luminance of the specific location as analysis data. It is a figure which shows examples, such as a design value, measurement conditions, a measurement result, an allowable value, an image parameter, as analysis data. It is a figure which shows the example of correction information, such as measurement conditions after an analysis. It is a figure which shows the example of the new image parameter value of the specific printed solder location newly produced | generated after the analysis.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Measurement means 2a Sensor part 2b Measurement processing part 3 Board | substrate information storage means 4 Operation means 5 Image processing means 5a Parameter reading means 6 Analysis data output means 7 Judgment means 8 Display means 9 Parameter storage means 9a Individual parameter storage area 10 Display Control means 10a Parameter control means 11 Output interface 12 Input interface 13 Input / output interface 14 Test data storage means

Claims (3)

Storing in a parameter storage means a predetermined image parameter value common to a printed solder location previously provided on the printed solder substrate;
Irradiating the printed solder substrate with light, measuring the amount of reflected light and / or displacement at the position with a measuring means, and outputting as measurement data;
Receiving the measurement data, and processing the image parameter means with the image parameter value to generate image data serving as an element representing the amount of solder in the printed solder location;
A step of determining pass / fail by a determination means comparing the image data with reference data stored in advance;
Receiving the position information specifying the position of a specific printed solder location after the pass / fail determination is performed;
As information that can analyze the determination result by the determination means, based on the measurement data at the position of the specific printed solder location based on the position information, and generating image information that can be viewed as a map when displayed, Outputting analysis data including image information and image parameter values at the specific printed solder location,
Upon receipt of the analysis data, the image information is displayed so that it can be visually analyzed, and when there is an error in the determination result, a new individual image parameter value at the specific printed solder location is generated and output. A stage, and
Receiving the new individual image parameter value at the specific printed solder location and storing it in the individual parameter storage means corresponding to the position information of the specific printed solder location;
In the next and subsequent inspections, the image processing means, based on the position information of the printed solder location, the printed solder location of the measurement data to be processed is another printed solder other than the specific printed solder location. A common image parameter value stored in the parameter storage means if it is a location, and a step of using the image parameter value stored in the individual parameter storage means if it is the specific printed solder location And a printed solder inspection service method.   The step of generating and outputting the analysis data receives the position information, causes the measurement means to measure at least a specific printed solder location in the position information, obtain measurement data, and obtain the measurement data. The printed solder inspection service method according to claim 1, wherein analysis data including the image information and the image parameter value is generated and output based on the generated data. Measurement that irradiates light onto a display solder (8), operation means (4), and a printed solder board having a plurality of printed solder locations, measures the amount of reflected light and / or displacement at that position, and outputs the measurement data Receiving the measurement data from the means (2), the parameter storage means (9) for storing the image parameter value including the threshold value for the measurement data, which is set in common to the printed solder location; The image processing means (5) for processing the image parameter value to generate image data that is an element representing the amount of solder at the printed solder location, and comparing the image data with prestored reference data A printed solder inspection apparatus comprising a determination means (7) for determining pass / fail by
As information that can analyze the determination result by the determination means, based on the measurement data at the position of a specific printed solder location on the printed solder substrate, image information that can be viewed in a map form when displayed is generated, and the image information And analysis data output means (6) for outputting analysis data including image parameter values at the specific printed solder location to the outside,
Another receiving new image parameter values pieces, individual parameter storage means for storing together with the position information of the printed solder portion and (9a),
When the layout of the printed solder location on the printed solder substrate is received and displayed on the display means, and the specific printed solder location is designated on the image displayed on the display means by the operation means, the measurement means On the other hand, at least the measurement at the specific printed solder location is executed, the measurement data is sent to the analysis data output means to generate the analysis data, and a new individual at the specific print solder location is externally generated. Parameter control means (10a) for storing the image parameter values in the individual parameter storage means when received ,
The image processing means, based on the position information, when the print solder location of the measurement data to be processed is a print solder location other than the specific print solder location, the parameter storage means Parameter reading means (5a) that uses a new image parameter value stored in the individual parameter storage means in the case where the specific printed solder location is used. A printed solder inspection apparatus characterized by that.

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