JP4672313B2 - Printed solder inspection equipment - Google Patents
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- JP4672313B2 JP4672313B2 JP2004254315A JP2004254315A JP4672313B2 JP 4672313 B2 JP4672313 B2 JP 4672313B2 JP 2004254315 A JP2004254315 A JP 2004254315A JP 2004254315 A JP2004254315 A JP 2004254315A JP 4672313 B2 JP4672313 B2 JP 4672313B2
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Description
本発明は、電子部品等を表面実装するためのプリント板上に、はんだ印刷装置等でクリーム状はんだが印刷されたときの印刷はんだ形成状態を測定し、検査するはんだ検査装置に関する。 The present invention relates to a solder inspection apparatus that measures and inspects a printed solder formation state when cream-like solder is printed on a printed board for surface mounting electronic components or the like by a solder printing apparatus or the like.
特に、基板（以下、プリント板を単に「基板」と言う。）を光学的に測定した結果として得られた測定値、例えば、基板上の印刷はんだ箇所の変位（高さを含む）或いは輝度（基板から反射した光の量、受光量（光の強さ）を含む。）等の測定値から、印刷はんだされたときの印刷はんだ量を表す要素となるデータ（高さ、面積、或いは体積等のデータ：以下、これらの一部又は全部を「判定用データ」という。）に変換して、その判定用データを判定の基準となる基準データ（例えば、設計値上の高さ、面積、体積等）と比較して判定する検査装置（方法）においては、基板の印刷はんだ箇所のパターン形状、印刷はんだ状態、測定条件、雑音、上記のデータを変換する条件等及びそれらの組み合わせからして高度の判定が要求されるため、上記判定による判定結果、特に否と判定された結果については、印刷はんだされた状態を、視覚的に確認し、印刷はんだ検査装置等の再調整をすることがしばしば行われている。本発明は、その印刷はんだされた状態が基準データ（設計値）に対して、どのような結果であるかを容易に視覚認識ができるようにした技術に係る。 In particular, a measurement value obtained as a result of optical measurement of a substrate (hereinafter, the printed board is simply referred to as “substrate”), for example, displacement (including height) or luminance (including height) of printed solder on the substrate. Data (height, area, volume, etc.) representing the amount of printed solder when printed and soldered from measured values such as the amount of light reflected from the substrate and the amount of light received (including the intensity of light) Data: hereinafter, a part or all of these are converted into “determination data”, and the determination data is used as reference data for determination criteria (for example, height, area, volume on the design value) In the inspection device (method) that is compared with the above, the pattern shape of the printed solder spot on the board, the printed solder state, measurement conditions, noise, conditions for converting the above data, etc. Because the judgment of The determination by the determination result, in particular the results it is determined not, the printed solder state, visually verify, that the readjustment of such printing solder inspection apparatus is often performed. The present invention relates to a technique that enables easy visual recognition of the result of the printed soldered state with respect to reference data (design value).
従来、基板上のはんだ等の状態を光学的に測定する方法としては、レーザ光を走査しながら照射して三角測量する方法（特許文献１）、や照射光を照射して撮影（撮像）する方法（特許文献２）があるが、いずれの印刷はんだ検査装置においても、測定値をデジタル化して判定用データを形成して、基準のデータと比較して印刷はんだ状態の良否を判定していた。例えば、特許文献１では、３次元の判定用データを生成して体積、面積を判定している。しかし、実際に測定値から判定用データに変換するときは、基板の測定条件、雑音、データを変換する条件等の数々の条件を反映して、例えば、フィルタ条件等でフィルタリングして雑音を除去し、はんだを識別するためのしきい値で２値データに変換するなどの処理をした上で、面積や体積等の印刷はんだ量を表す判定用データを作るという加工処理をしている。したがって、その処理の仕方によっては、本来、良品のものも否と判定される（虚報）可能性もあり、この可能性を全く無くすことは困難である。このため、虚報の恐れのある判定結果について、現物の印刷はんだ箇所を確認し、調整する作業が発生する。また、本当に否と判定された箇所についてその原因を調査するために現物の印刷はんだ箇所を確認することが行われる。 Conventionally, as a method of optically measuring the state of solder or the like on a substrate, a method of performing triangulation by irradiating laser light while scanning (Patent Document 1), or irradiating with irradiation light (photographing). Although there is a method (Patent Document 2), in any of the printed solder inspection apparatuses, the measurement values are digitized to form determination data, and compared with the reference data, the quality of the printed solder state is determined. . For example, in Patent Document 1, three-dimensional determination data is generated to determine volume and area. However, when actually converting measurement values to judgment data, the noise is removed by filtering, for example, with filter conditions, reflecting a number of conditions such as board measurement conditions, noise, and data conversion conditions. Then, after performing processing such as conversion to binary data with a threshold value for identifying solder, processing is performed for creating determination data representing the amount of printed solder such as area and volume. Therefore, depending on the method of processing, there is a possibility that a non-defective product is originally determined to be unacceptable (false information), and it is difficult to completely eliminate this possibility. For this reason, the work which checks and adjusts the actual printed solder location about the determination result with the possibility of a false report generate | occur | produces. In addition, in order to investigate the cause of the location that is determined to be really not, the actual printed solder location is checked.
現物の印刷はんだ箇所を確認するにあたっては、直接確認するより、机上の表示画面で容易に現物に近い確認ができることが望ましい。そこで、今までは、図５に示すように基板の印刷はんだ箇所を記載したレイアウト上に、例えば、否（ＮＧ）と判定された箇所を赤（図５では、濃い黒）で、良（ＯＫ）と判定された箇所を青（図５で灰色）で識別して表示していた。さらに、図５の右側に示すように、レイアウト上でマーカによって印刷はんだ箇所を選択すると、その箇所における判定用データと基準データとの差を％表示していた。 When confirming the actual printed solder location, it is desirable to be able to easily confirm the actual solder on the display screen on the desk, rather than confirming directly. Therefore, up to now, as shown in FIG. 5, on the layout describing the printed solder locations on the board, for example, a location determined as No (NG) is red (dark black in FIG. 5) and good (OK). ) Is identified and displayed in blue (gray in FIG. 5). Furthermore, as shown on the right side of FIG. 5, when a printed solder location is selected by a marker on the layout, the difference between the determination data and the reference data at that location is displayed in%.
一般に、印刷はんだ状態の不良が発生する原因には、印刷はんだ過程において基板の部分的領域に生ずることがある。例えば、印刷はんだ後にシルクスクリーンを基板の端部から剥がすときに、その端部で印刷ズレが生じてしまう。或いは基板の検査時において、基板と検査装置との間に一部ズレが生じた状態で知らずに検査されてしまったというようなことがしばしば発生する。このような原因の場合、印刷はんだ箇所と言う「点」というより、「点の集合」或いは部分領域的な「面」で発生する。 In general, a cause of a defective printed solder state may occur in a partial region of the substrate during the printed solder process. For example, when the silk screen is peeled off from the end portion of the substrate after the printing solder, printing deviation occurs at the end portion. Alternatively, when the substrate is inspected, it often occurs that the substrate has been inspected without knowing that there is a partial deviation between the substrate and the inspection apparatus. In the case of such a cause, it occurs in “a set of points” or a “surface” in a partial area rather than “a point” as a printed solder point.
このような場合、印刷はんだ過程での対策、印刷はんだ基板を検査するときの環境設定、及び印刷はんだ検査装置等の設定、又はそれらの調整は、各印刷はんだ箇所毎に行うだけでは現実的ではなく、レイアウトの各部分領域的に行われる。 In such a case, it is not practical to perform measures in the printing solder process, environment settings when inspecting the printed solder substrate, settings of the printed solder inspection apparatus, etc., or adjustments thereof for each printed solder location. Instead, it is performed for each partial area of the layout.
このような状況において、従来の図５の様な表示では、次の欠点があった。つまり、図５のような表示形態では、印刷はんだ箇所全体の印刷はんだ状態と基準データとの差が一瞥できなかった。つまり、基準データとの差がどの部分でどのくらいズレているというような、レイアウト上での分布或いは傾向が、量的に、認識しにくかった。 Under such circumstances, the conventional display as shown in FIG. 5 has the following drawbacks. That is, in the display form as shown in FIG. 5, the difference between the printed solder state of the entire printed solder portion and the reference data cannot be glanced. In other words, it is difficult to quantitatively recognize the distribution or tendency on the layout, such as how much the difference from the reference data is shifted in which part.
したがって、各印刷はんだ箇所間における傾向、或いは部分領域毎の傾向が一瞥でき、かつおおよそ定量的に、かつ視覚的に把握できるものが望まれていた。 Therefore, it has been desired that the tendency between the printed solder portions or the tendency of each partial region can be glanced and can be grasped approximately quantitatively and visually.
本発明の目的は、上記従来技術の欠点を改良するものであって、表示されたレイアウト上で印刷はんだされた状態が基準のデータに対してどの程度差があるか定量的に一瞥して分布或いは傾向が認識できる印刷はんだ検査装置の提供である。 An object of the present invention is to improve the above-mentioned drawbacks of the prior art, and quantitatively glance at how much the printed soldered state on the displayed layout differs from the reference data. Or it is provision of the printed solder inspection apparatus which can recognize a tendency.
上記課題を達成するため、本発明は、測定された印刷はんだ状態と基準との差（偏差値）を階調で表現し、各印刷はんだ箇所毎に階調表示することで分布状態が認識できる構成にし、かつ階調表示がどの程度の偏差値かの目安となる階調スケールを表示する構成にした。さらに、より大きな目で全体の傾向が認識できるように複数の領域毎に偏差値の平均をとり、その平均値を階調表示する構成にした。 In order to achieve the above object, according to the present invention, the distribution state can be recognized by expressing the difference (deviation value) between the measured printed solder state and the reference in gradation and displaying the gradation for each printed solder location. The configuration is such that a gradation scale is displayed as an indication of the deviation value of the gradation display. Furthermore, the deviation values are averaged for each of the plurality of areas so that the overall tendency can be recognized with larger eyes, and the average value is displayed in gradation.
なお、本発明における「階調」は、表示上の輝度の濃淡が徐々に変化する形態であっても良いし、色種間、例えば赤と青の間の色を徐々に変化する形態であってもよい。又、測定された印刷はんだ状態を測定した測定値を基に加工された判定用データと基準データとの「差を表す偏差値」と表現するが、偏差値としては、％表示であっても倍率表示でも、基準データと判定用データとの差を相対的差が表現できるものであれば良い。例えば、代表的なものとしては、判定用データと基準データとの差を基準データに対して％表示（以下の説明では、この表示形式で説明する。）したもの、或いは判定用データを基準データに対する％表示したもの等の、他の統計処理したものが考えられる。また、「差を表す値」も差を表す偏差値と同じ相対表示の意味合いである。なお、「所定幅の階調の下限近傍又は上限近傍の特定階調に対する偏差値」とは、例えば、所定幅の階調が、下限の輝度１から上限の輝度１００まであり、演算して得られた偏差値が最小２．５％から最大４２％（偏差値として、）であったとし、それを輝度１から輝度１００に割り振ったとき、「下限近傍の又は上限近傍の特定階調」が輝度１又は輝度１００であって、それに「対する偏差値」が２．５％又は４２％であっても良いし、或いは階調スケールを区切り良く表示したいため、例えば、偏差値が５％、４０％に相当する階調を下限近傍、上限近傍の特定階調（階調を割り振ったときに知りうる）として、その各特定階調を５％、４０％と表示しても良い。 Note that the “gradation” in the present invention may be a form in which the brightness gradation on the display gradually changes, or a form in which the color between the color types, for example, between red and blue is gradually changed. May be. In addition, it is expressed as “deviation value indicating difference” between the judgment data processed based on the measured value of the measured printed solder state and the reference data. Any magnification display may be used as long as a relative difference can be expressed between the reference data and the determination data. For example, as a typical example, the difference between the determination data and the reference data is displayed as a percentage of the reference data (in the following description, this display format will be used), or the determination data is used as the reference data. Other statistically processed items are possible, such as those displayed in% relative to. The “value indicating the difference” also has the same relative display meaning as the deviation value indicating the difference. The “deviation value with respect to a specific gradation near the lower limit or near the upper limit of the gradation of the predetermined width” is obtained by calculating, for example, the gradation of the predetermined width from the lower limit luminance 1 to the upper limit luminance 100. When the obtained deviation value is from a minimum of 2.5% to a maximum of 42% (as a deviation value) and is assigned from luminance 1 to luminance 100, the “specific gradation near the lower limit or near the upper limit” is The brightness 1 or the brightness 100 and the “deviation value” may be 2.5% or 42%, or the gradation scale is displayed with good separation. For example, the deviation value is 5%, 40 As gradations corresponding to%, specific gradations near the lower limit and near the upper limit (which can be known when gradations are assigned) may be displayed as 5% and 40%.
基準データは、例えば、設計値（或いは予測値、工程上の規定値）であって、印刷はんだ箇所に特定の設計値を共通の基準データとしても良いし、印刷はんだ箇所毎の設計値（或いは予測値、規定値）であっても良い。特に前者は、高さ基準データの場合、後者は、面積、体積等の基準データの場合に、適用される得るが、これに限らない。また、基準データは、測定値或いは測定値を基に加工した判定用データの一つを基準データとしたものであっても良い。 The reference data is, for example, a design value (or a predicted value, a specified value in the process), and a specific design value may be used as a common reference data for a printed solder location, or a design value for each printed solder location (or (Predicted value, specified value). In particular, the former can be applied in the case of height reference data, and the latter can be applied in the case of reference data such as area and volume, but is not limited thereto. In addition, the reference data may be obtained by using the measurement data or one of the determination data processed based on the measurement values as the reference data.
具体的には、請求項１に記載の発明は、プリント板の表面に光を照射させ、その反射光から得られるプリント板表面の各位置（Ｘ、Ｙ）における高さ方向の変位（Ｚ）を示す測定値を取得する測定手段（１００）と、該測定値を記憶する測定値記憶手段（６）と、前記プリント板上の印刷はんだ箇所の配置情報を記憶する設計情報記憶手段（１３）と、前記測定値を基に、設計情報記憶手段（１３）に記憶されている前記印刷はんだ箇所の各位置におけるはんだの印刷状態を表す少なくとも高さ、面積、体積又は印刷はんだズレの一つを含む複数の項目に対応する判定用データを生成するデータ生成手段（７）とを有し、該測定値記憶手段の測定値に基づいてはんだの印刷状態を識別可能に表示手段（１２）に表示する印刷はんだ検査装置において、前記印刷はんだ箇所の各位置における前記項目毎に判定用データと所定の基準データとの差を表す偏差値を求めて出力する差演算手段（９）と、表示上の濃淡の変化範囲或いは色種の変化範囲である階調の所定幅に前記差演算手段で求められた前記項目毎の偏差値の最小値から最大値までの範囲を割り振る階調割振手段（１０）と、前記表示手段に、前記プリント板の印刷はんだ箇所を示す複数のレイアウトを前記複数の項目に対応させて同時に表示させ、該階調割振手段で割り振られた階調に基づいて、当該表示された各レイアウト上の前記印刷はんだ箇所の位置に、前記項目毎の偏差値に対応する階調表示を行わせると共に、前記所定幅に亘る階調と、該所定幅の上限及び下限に相当する前記項目毎の偏差値の最大値及び最小値または前記所定幅の途中の特定階調に相当する前記項目毎の偏差値とを、階調スケールとして表示させる表示制御手段（１１）とを備えたことを特徴とする印刷はんだ検査装置。 Specifically, the invention according to claim 1 irradiates the surface of the printed board with light, and the displacement (Z) in the height direction at each position (X, Y) on the printed board surface obtained from the reflected light. A measurement means (100) for obtaining a measurement value indicating the measurement value, a measurement value storage means (6) for storing the measurement value, and a design information storage means (13) for storing arrangement information of the printed solder location on the printed board And at least one of height, area, volume or printed solder misalignment representing the printed state of the solder at each position of the printed solder location stored in the design information storage means (13) based on the measured value. Data generation means (7) for generating data for determination corresponding to a plurality of items including the display, and display on the display means (12) so that the print state of the solder can be identified based on the measurement value of the measurement value storage means To printed solder inspection equipment Difference calculating means (9) for obtaining and outputting a deviation value representing a difference between the determination data and predetermined reference data for each item at each position of the printed solder location, and a change range of shading on the display or Gradation assigning means (10) for allocating a range from a minimum value to a maximum value of deviation values for each item obtained by the difference calculating means within a predetermined gradation range which is a color type change range; and the display means And simultaneously displaying a plurality of layouts indicating printed solder locations on the printed circuit board corresponding to the plurality of items, and on each displayed layout based on the gradation allocated by the gradation allocating means. A gradation display corresponding to a deviation value for each item is performed at the position of the printed solder location, and a gradation over the predetermined width and a deviation value for each item corresponding to an upper limit and a lower limit of the predetermined width. Maximum and minimum values Others a deviation of each of the items corresponding to a specific gray level of the middle of the predetermined width, the display control means (11) to be displayed as the tone scale and the printing solder inspection apparatus characterized by comprising a.
請求項２に記載の発明は、プリント板の表面に光を照射させ、その反射光から得られるプリント板表面の各位置（Ｘ、Ｙ）における高さ方向の変位（Ｚ）を示す測定値を取得する測定手段（１００）と、該測定値を記憶する測定値記憶手段（６）と、前記プリント板上の印刷はんだ箇所の配置情報を記憶する設計情報記憶手段（１３）と、前記測定値を基に、設計情報記憶手段（１３）に記憶されている前記印刷はんだ箇所の各位置におけるはんだの印刷状態を表す少なくとも高さ、面積、体積又は印刷はんだズレの一つを含む複数の項目に対応する判定用データを生成するデータ生成手段（７）とを有し、該測定値記憶手段の測定値に基づいてはんだの印刷状態を識別可能に表示手段（１２）に表示する印刷はんだ検査装置において、前記印刷はんだ箇所の各位置における前記項目毎に前記判定用データと所定の基準データとの差を表す値を求めて、かつ前記プリント板表面を複数の領域（Ｌ）に分けて該複数領域のそれぞれにおける該差を表す値の平均値を求め、各領域の偏差値として出力する差演算手段（９）と、表示上の濃淡の変化範囲或いは色種の変化範囲である階調の所定幅に前記差演算手段で求められた前記項目毎の偏差値の変化の範囲を割り振る階調割振手段（１０）と、前記表示手段に、前記プリント板表面を前記複数の領域に分けたことを示す複数のレイアウトを前記複数の項目に対応させて同時に表示させ、該階調割振手段で割り振られた階調に基づいて、該各領域に当該領域の前記項目毎の偏差値に対応する階調表示を行わせると共に、前記所定幅に亘る階調と、該所定幅の上限及び下限に相当する前記項目毎の偏差値の最大値及び最小値または前記所定幅の途中の特定階調に相当する前記項目毎の偏差値とを、階調スケールとして表示させる表示制御手段（１１）とを備えた。 The invention according to claim 2 irradiates the surface of the printed board with light, and measures the measured value indicating the displacement (Z) in the height direction at each position (X, Y) on the printed board surface obtained from the reflected light. Measurement means (100) to be acquired, measurement value storage means (6) for storing the measurement values, design information storage means (13) for storing arrangement information of printed solder locations on the printed board, and the measurement values Based on the above, a plurality of items including at least one of height, area, volume or printed solder misalignment representing the printed state of the solder at each position of the printed solder location stored in the design information storage means (13) A printed solder inspection apparatus which has data generation means (7) for generating corresponding determination data, and displays on the display means (12) the print state of the solder so as to be identifiable based on the measurement value of the measurement value storage means In the above A value representing a difference between the determination data and predetermined reference data is obtained for each item at each position of the printed solder spot, and the surface of the printed board is divided into a plurality of regions (L). A difference calculating means (9) for obtaining an average value of the values representing the difference in the area and outputting the difference value as a deviation value of each area; A gradation allocating means (10) for allocating a range of change of the deviation value for each item obtained by the difference calculating means, and a plurality of display means indicating that the printed board surface is divided into the plurality of areas. A layout is displayed simultaneously corresponding to the plurality of items, and gradation display corresponding to the deviation value for each item of the area is performed on each area based on the gradation allocated by the gradation allocating means. And over the predetermined width A gradation scale, and a deviation value for each item corresponding to a specific gradation in the middle of the predetermined width or a maximum value and a minimum value of the deviation value for each item corresponding to an upper limit and a lower limit of the predetermined width, Display control means (11) for displaying as
請求項３に記載の発明は、請求項２に記載の発明において、前記差演算手段は、前記プリント板表面を複数（Ｎ）の列及び複数（Ｍ）の行で分けた各領域における列平均値と行平均値を求めて、さらに該列平均値と行平均値を重ねた平均値を求めて、前記複数（Ｌ＝Ｎ×Ｍ）の領域それぞれの平均値とする構成とした。 According to a third aspect of the present invention, in the invention according to the second aspect, the difference calculating means includes a column average in each region in which the printed board surface is divided into a plurality of (N) columns and a plurality of (M) rows. seeking value and line average value, seeking further mean value of repeated said column average and row mean were constructed to the respective average area of the plurality (L = N × M).
請求項４に記載の発明は、請求項１〜３のいずれかに記載の発明において、前記データ生成手段は、前記印刷はんだ箇所の各位置におけるはんだの印刷状態を表す高さ、面積、体積及び印刷はんだズレの各項目毎の判定用データを生成し、前記差演算手段は、各位置における前記各判定用データとそれに対応する前記所定の基準データとの差を表す、高さ、面積、体積及び印刷はんだズレに対応する各項目毎の偏差値を求めて出力し、前記階調割振手段は同一のプリント板に対して、高さ、面積、体積及び印刷はんだズレの各項目毎に対応するそれぞれの偏差値の最小値から最大値までの範囲を前記諧調の所定幅に割り付けし、前記表示制御手段は、同一のプリント板に対して、高さ、面積、体積及び印刷はんだズレの各項目毎に対応して、前記印刷はんだ箇所の各位置を示すレイアウトを表示させ、該階調割振手段の出力を受けて、前記各位置に当該位置の偏差値に対応する階調表示を行わせ、及びそれぞれの階調スケールの表示を行わせる構成とした。 According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the data generating means includes a height, an area, a volume, and a volume representing a printed state of solder at each position of the printed solder location. Data for determination for each item of printed solder misalignment is generated, and the difference calculation means represents a difference between the data for determination at each position and the predetermined reference data corresponding thereto, height, area, volume and to output a deviation value for each item corresponding to the printed solder misalignment, the gradation allocation unit for the same printed circuit board, height, area, corresponding to each item of the volume and printed solder deviation The range from the minimum value to the maximum value of each deviation value is allocated to the predetermined width of the gradation, and the display control means is each item of height, area, volume and printed solder misalignment for the same printed board. in response to each, Display a layout showing each position of the printed solder location, receive the output of the gradation allocating means, cause each position to perform gradation display corresponding to the deviation value of the position, and each gradation scale The display is made to be performed.
請求項１に記載の発明は、印刷はんだ状態の基準データに対する偏差値についての、各印刷はんだ箇所間における傾向、分布が一瞥して観測でき、かつ階調スケールによりおおよそ定量的に視覚的に認識できる。 According to the first aspect of the present invention, it is possible to observe the tendency and distribution among the printed solder locations at a glance with respect to the deviation value with respect to the reference data of the printed solder state, and visually recognize it approximately quantitatively by the gradation scale. it can.
請求項２又は３に記載の発明は、印刷はんだ状態の基準データに対する偏差値についての、印刷はんだの領域間の傾向が把握できる、この場合、印刷はんだ箇所毎の表示がされないので、細かい印刷はんだ箇所にとらわれることなく大きな傾向を把握できる。 The invention according to claim 2 or 3 can grasp the tendency between the areas of the printed solder with respect to the deviation value with respect to the reference data of the printed solder state. In this case, since each printed solder location is not displayed, the fine printed solder A big tendency can be grasped without being caught by a part.
請求項３に記載の発明は、一つの領域の偏差値の平均を得るのに、列平均及び行平均を計算して、それらを基に、平均値を求めているので、領域間をよりスムースな階調表示できる。 In the third aspect of the invention, in order to obtain the average of the deviation values of one region, the column average and the row average are calculated, and the average value is obtained based on them. Gradation display.
請求項４に記載の発明は、印刷はんだされた状態の判定対象となる項目、つまり、印刷はんだの高さ、面積、体積及びズレを同時に、それぞれ偏差値の分布を表示するので、トラブル解析にあたって、印刷はんだ状態の構造要素（高さ、面積、体積、ズレ）が比較解析しやすい。 The invention according to claim 4 displays the distribution of deviation values at the same time for the items to be judged of the printed soldered state, that is, the height, area, volume and deviation of the printed solder. The structural elements (height, area, volume, deviation) in the printed solder state are easy to compare and analyze.
本発明の実施形態を図１〜図４を用いて説明する。図１は、本発明の構成を示す機能ブロック図である。図２、３、４は、図１の実施形態における画面の表示の仕方を説明するための図である。 An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a functional block diagram showing the configuration of the present invention. 2, 3 and 4 are diagrams for explaining how to display a screen in the embodiment of FIG.
図１において、センサ３、移動台２及びセンサ３をプリント板１（以下。基板１と言う。）に対して相対的に移動走査させる移動機構部５及び移動機構部５に対して基板１のレイアウトを基に、基板１の上を、移動制御部４ａを介して走査させる測定制御手段４は、測定手段１００を構成している。 In FIG. 1, the sensor 3, the movable table 2, and the sensor 3 are moved and scanned relative to the printed board 1 (hereinafter referred to as the substrate 1). The measurement control means 4 that scans the substrate 1 via the movement control unit 4a based on the layout constitutes the measurement means 100.
図１における上記、測定手段１００は、いわば、レーザ変位計の例であって、センサ３は、基板１に対して走査してＸ軸、Ｙ軸の各方向にレーザを照射可能なレーザ光源と、基板１からの反射光を受光する受光手段からなり、特に印刷はんだされたはんだ箇所の変位、つまり高さ（Ｚ軸方向）を位置と対応づけて測定する。そのとき印刷はんだ面からは、位置に対応した受光量（輝度）も得られる。レーザ変位計としての詳細の動作説明は省くが、原理としては、同一出願人が出願している特開平３−２９１５１２号公報のものがあり、その第４図及び第７図とそれらの説明のものと同様である。 The measuring means 100 in FIG. 1 is an example of a laser displacement meter, and the sensor 3 is a laser light source capable of scanning the substrate 1 and irradiating a laser in each of the X axis and Y axis directions. It comprises light receiving means for receiving the reflected light from the substrate 1, and in particular, the displacement, that is, the height (Z-axis direction) of the printed solder is measured in association with the position. At that time, the received light amount (luminance) corresponding to the position is also obtained from the printed solder surface. Although detailed explanation of the operation as a laser displacement meter is omitted, as a principle, there is one disclosed in Japanese Patent Laid-Open No. 3-291512 filed by the same applicant, and FIG. 4 and FIG. It is the same as that.
測定制御手段４は、検査対象である基板１を設計したときの印刷はんだ箇所或いはレジスト箇所等のレイアウト（図２に模式的に示したものを示す。）が後記する設計情報記憶手段１３に記憶されているので、そのレイアウトを受けて、そのレイアウトに沿って相対的にセンサ３に対して走査測定を行わせ、印刷はんだ箇所の位置に対応して、検出した上記の変位量及び／又は受光量を測定値として出力し、測定値記憶手段６に記憶させる。上記相対的な走査は、例えば、移動制御部４ａが、レイアウトのＸ軸方向にセンサ３を移動させることにより主走査し、Ｙ軸方向に沿って移動台２を移動させて副走査させることにより行っている。したがって、測定値は、レイアウト上のＸ、Ｙの位置におけるＺ軸（高さ）方向のデータ（変位量）を得ることになる。 The measurement control means 4 stores in the design information storage means 13 which will be described later the layout of printed solder locations or resist locations (shown schematically in FIG. 2) when the substrate 1 to be inspected is designed. Therefore, in response to the layout, the sensor 3 performs scanning measurement relative to the layout, and the detected displacement amount and / or light reception corresponding to the position of the printed solder location. The quantity is output as a measured value and stored in the measured value storage means 6. In the relative scanning, for example, the movement control unit 4a performs main scanning by moving the sensor 3 in the X-axis direction of the layout, and moves the moving table 2 along the Y-axis direction to perform sub-scanning. Is going. Therefore, the measurement value obtains data (displacement amount) in the Z-axis (height) direction at the X and Y positions on the layout.
なお、センサ３の代わりに、カメラ（例えば、ＣＣＤカメラ。不図示）により、撮影のための光を照射して撮影し、撮影したデータから上記のような位置に対応した輝度を測定値として取得し、測定値記憶手段６に記憶する構成としてもよい。以下の例は、センサ３を用いた例で説明する。 Note that instead of the sensor 3, a camera (for example, a CCD camera, not shown) is used to irradiate light for photographing, and the brightness corresponding to the position as described above is obtained as a measurement value from the photographed data. Alternatively, the measurement value storage unit 6 may store the measurement value. The following example will be described using an example in which the sensor 3 is used.
設計情報記憶手段１３は、設計した基板１のはんだ箇所、やレジスト箇所を示すレイアウトと、判定手段８によってはんだ状態の良否を判定するときの基準となる判定用基準データと、後記する差演算手段９が測定結果とての印刷はんだ状態との差をとるための基準データとを予め記憶している。レイアウトは、検査対象とする基板１の設計されたときの配置図であって、例えば図２に模式的に示すように、印刷はんだ箇所、印刷はんだののらないレジスト箇所及び位置の基準となる認識マーク（不図示）等の基板上の配置情報を記憶している。このレイアウトそのものを画像として（レイアウト画面として）、表示制御手段１１を介して表示手段１２に表示することができる。また、基板１を検査して良否判定を行うための判定用基準データとして、検査対象とする基板１に対応して記憶している。判定用基準データは、具体的には、例えば印刷はんだ箇所の高さ、面積、体積、印刷はんだズレ及びはんだの欠損等の値をはんだ箇所毎に準備され、データ生成手段７が生成する判定用データに対応して準備されている。また、これらの判定用基準データは、はんだ箇所の印刷はんだを量的（画像的）に認識しやすい情報である。 The design information storage means 13 includes a layout indicating the solder location or resist location of the designed substrate 1, determination reference data used as a reference when the determination means 8 determines the quality of the solder state, and difference calculation means described later. Reference numeral 9 stores in advance reference data for taking a difference between the measurement result and the printed solder state. The layout is a layout diagram when the board 1 to be inspected is designed, for example, as schematically shown in FIG. 2, and serves as a reference for a printed solder location, a resist location without printed solder, and a position. Arrangement information on a substrate such as a recognition mark (not shown) is stored. The layout itself can be displayed as an image (as a layout screen) on the display unit 12 via the display control unit 11. In addition, it is stored as reference data for determination for inspecting the substrate 1 and determining pass / fail in correspondence with the substrate 1 to be inspected. Specifically, the determination reference data is prepared by the data generation means 7 with the values such as the height, area, volume, printed solder misalignment, and solder defect of the printed solder location being prepared for each solder location. Prepared for the data. The reference data for determination is information that can easily recognize the printed solder at the solder location quantitatively (imagewise).
なお、検査対象の基板１の種類が多い場合は、それらの基板情報を設計情報記憶手段１３に識別情報を付して記憶しておき、識別情報のリスト及び／又はレイアウト画面を表示手段１２に表示して操作手段１４で画面上でマーカ等により指定することによって選択できるようにしている。 If there are many types of substrates 1 to be inspected, the substrate information is stored in the design information storage means 13 with identification information, and a list of identification information and / or a layout screen is stored in the display means 12. The information is displayed and designated by a marker or the like on the screen by the operating means 14 so that it can be selected.
データ生成手段７は、測定値記憶手段６に記憶されている基板１のはんだ箇所の位置とその位置における変位データ（変位量）又は輝度データ（受光量）等を受けて、上記したフィルタ、はんだブリッジやはんだパターンエッジ等の繊細パターンを識別する感度を示す数々の所定の画像パラメータ値を基に、測定データを各はんだ箇所の印刷はんだ量を表す判定用データに加工処理する。また、データ生成手段７は、測定値（２値化されたデータ）を用いて印刷はんだ箇所における高さ、面積、体積及び／又は印刷はんだズレ等の演算を行う演算する手段等を有している。 The data generation means 7 receives the position of the solder location of the substrate 1 stored in the measured value storage means 6 and displacement data (displacement amount) or luminance data (light reception amount) at the position, and the above-described filter, solder Based on a number of predetermined image parameter values indicating sensitivity for identifying delicate patterns such as bridges and solder pattern edges, the measurement data is processed into determination data representing the amount of printed solder at each solder location. Further, the data generation means 7 includes means for calculating the height, area, volume, and / or printed solder misalignment, etc. at the printed solder location using the measured value (binarized data). Yes.
そして、判定用データとしては、印刷はんだ箇所におけるはんだ量を表す要素となるデータであって、上記判定用基準データと同様に、それぞれのはんだ箇所の高さ、面積、体積、印刷はんだズレ（印刷はんだをした箇所の設計値の位置に対する位置ズレである。）及び欠損（存在すべきはんだ量が無い状態）等がある。これら高さ、面積、体積等のデータは３次元画像情報ともなりうる情報である。なお、基板１を判定するには上記の判定用データの全てを必要とするとは限らないが、高さ、面積、体積、印刷はんだズレ、又は欠損の内、少なくともいずれか１つは不可欠である。判定にあたって、検査しようとする基板１の判定用データとして何を用いるか、或いはどの判定用データの組み合わせで判定するかは、基板１の種類、内容によって異なることがある。 The determination data is data that represents the amount of solder at the printed solder location, and, similar to the above-described determination reference data, the height, area, volume, printed solder misalignment (printing) of each solder location This is a positional shift with respect to the position of the design value of the soldered portion.) And a deficiency (a state in which there is no amount of solder to be present). These data such as height, area, and volume are information that can also serve as three-dimensional image information. Note that not all of the above-described determination data is required to determine the substrate 1, but at least one of height, area, volume, printed solder misalignment, or defect is indispensable. . In the determination, what is used as the determination data of the substrate 1 to be inspected or which combination of determination data is determined may differ depending on the type and content of the substrate 1.
判定手段８は、上記データ生成手段７が出力する判定用データと、設計情報記憶素段１３が記憶している対応する判定用基準データ（図１で符号ａ）とを比較し、判定用画像データが判定用基準データに対して許容値以内であれば、良と判定し、それ以外は否と判定する。そのとき、判定手段８は、印刷はんだ箇所毎に判定するので、否と判定された箇所の位置情報も検知できる。 The determination unit 8 compares the determination data output from the data generation unit 7 with the corresponding determination reference data (reference symbol a in FIG. 1) stored in the design information storage element stage 13 to determine the determination image. If the data is within the allowable value with respect to the reference data for determination, it is determined to be good, and otherwise it is determined to be no. At that time, since the determination means 8 determines for each printed solder location, the position information of the location determined as NO can also be detected.
差演算手段９は、上記、印刷はんだ箇所毎に、データ生成手段７が生成した判定用データと、設計情報記憶手段に記憶されている、対応する基準データ（図１で符号ｃ）とを比較し、差を求めて偏差値として出力する。なお、上記したように、偏差値としては、判定用データと基準データとの差を基準データに対して％表示したものや、測定用データを基準データに対する％表示したもの等が考えられる。以下の例では、偏差値は、｛［基準データ］―［判定用データ］｝×１００／基準データとして、差の値が基準データに占める割合（％）で表示する。ここで、例えば、各印刷はんだ箇所毎に印刷はんだの体積について、偏差値を求めてみると最小値２．５％〜最大値４２％だったとする。 The difference calculation means 9 compares the determination data generated by the data generation means 7 with the corresponding reference data (symbol c in FIG. 1) stored in the design information storage means for each printed solder location. The difference is obtained and output as a deviation value. As described above, as the deviation value, a difference between the determination data and the reference data displayed in% relative to the reference data, a measurement data displayed in% relative to the reference data, or the like can be considered. In the following example, the deviation value is displayed as {[reference data] − [determination data]} × 100 / reference data in the ratio (%) of the difference value to the reference data. Here, for example, when the deviation value is calculated for the volume of the printed solder for each printed solder location, it is assumed that the minimum value is 2.5% and the maximum value is 42%.
基準データは、上記判定用基準データと、同じ性質のデータを有し、少なくとも、高さ、面積、体積、又は印刷はんだズレの内、少なくともいずれかである。ただし、基準データは、上記判定用基準データと値は、異なっても良い。というのは、例えば、判定用基準データは、良否を判定するものであるから、目標値に対して所定の範囲内であれば、良、以外であれば否とするものであるのに対して、基準データは、その目標値に相当する値を選定することが望ましいデータである。例えば、体積の基準データに対する基準データとはん偏差値が２．５％〜４２％とすれば、判定用基準データは、基準データに対して１０％以内とすることができる。 The reference data has data having the same properties as the determination reference data, and is at least one of height, area, volume, and printed solder misalignment. However, the reference data may be different in value from the reference data for determination. This is because, for example, the determination reference data is for determining pass / fail, so if it is within a predetermined range with respect to the target value, it is determined that it is not good if it is not good. The reference data is data for which it is desirable to select a value corresponding to the target value. For example, if the standard deviation value with respect to the reference data for the volume is 2.5% to 42%, the reference data for determination can be within 10% with respect to the reference data.
また、判定が印刷はんだされた高さだけで行うとすれば、データ生成手段７は、測定値を加工することなく、測定値記憶手段６の値を判定用データとして出力してもよい。 Further, if the determination is made only with the printed soldering height, the data generation means 7 may output the value of the measurement value storage means 6 as determination data without processing the measurement value.
階調割振手段１０は、予め所定範囲の表示上の階調を生成する階調生成手段（不図示）を備えている。例えば、階調生成手段は、白から黒までの濃淡の階調、或いは一色で明から暗までの階調（輝度の階調）、或いは所定のＲ（赤）Ｇ（緑）Ｂ（青）の一部又は全部の合成による色調による階調等、のいずれでも良いが、望ましくは、色調を用いた階調が視覚的に認識しやすい。階調の生成は、一般的に行われている方法でよいが、この例では、図が白黒で表しやすいという説明上から、明から暗まで所定幅に亘り、輝度１から輝度１００までの輝度段階を有する階調（つまり１００階調とする。）を生成できるものとする。 The gradation allocating means 10 includes gradation generation means (not shown) that generates gradations on the display in a predetermined range in advance. For example, the gradation generation means is a gradation of gradation from white to black, a gradation from one color to light (darkness gradation), or a predetermined R (red) G (green) B (blue). However, it is desirable that the gradation using the color tone is visually recognizable. The generation of gradations may be performed by a generally performed method, but in this example, the luminance from luminance 1 to luminance 100 over a predetermined width from light to dark from the description that the figure is easily expressed in black and white. It is assumed that a gradation having stages (that is, 100 gradations) can be generated.
階調割振手段１０は、差演算手段９から体積の偏差値として、２．５％〜４２％の範囲にある各偏差値を受けた場合、先ず、２．５％を輝度１として、４２％を輝度１００に割り振り、その間をリニアに補間した階調スケールを生成し、表示制御手段１１を介して表示手段１２へ表示させる。図２のレイアウトの右サイドに表示した階調スケールの例を示す。図２で偏差値は、上限，下限だけ示したが、途中の１０％、２０％、３０％、４０％を表示してもよい（図４（ｂ）の階調スケールを参照）。また、階調スケールは、階調の下限近傍、或いは上限近傍の特定階調を区切りのよい偏差値、例えば、５％、４０％を用いて該当特定階調の位置に表示してもよい（図４（ｂ）の階調スケールの偏差値５％、４０％の位置を参照）。次に、各印刷はんだ箇所の偏差値を、階調スケールを参照して輝度１〜輝度１００のいずれかに割り当てる。その模擬的な表示例が図２のレイアウトである。図２は、基板１のレイアウト上にはんだ箇所毎に輝度表示した例であり、その右サイドにその階調スケールを示す。 When the gradation allocation unit 10 receives each deviation value in the range of 2.5% to 42% as the volume deviation value from the difference calculation unit 9, first, the luminance allocation unit 10 sets the luminance as 1 to 42%. Is assigned to the luminance 100, and a gradation scale obtained by linearly interpolating between them is generated and displayed on the display means 12 via the display control means 11. The example of the gradation scale displayed on the right side of the layout of FIG. 2 is shown. Although only the upper limit and the lower limit of the deviation value are shown in FIG. 2, 10%, 20%, 30%, and 40% in the middle may be displayed (see the gradation scale in FIG. 4B). Also, the gradation scale may be displayed at the position of the specific gradation using a deviation value such as 5% or 40% with a good separation between the specific gradations near the lower limit or near the upper limit of the gradation (for example, 5% or 40%). (Refer to the positions of the gradation scale deviation values of 5% and 40% in FIG. 4B). Next, the deviation value of each printed solder location is assigned to one of luminance 1 to luminance 100 with reference to the gradation scale. The simulated display example is the layout of FIG. FIG. 2 is an example in which the luminance is displayed for each solder location on the layout of the substrate 1, and the gradation scale is shown on the right side.
表示制御手段１１は、設計情報記憶手段１３からレイアウトを受けて表示するともに、階調割振手段１０からの階調スケールと、各印刷はんだ箇所ごとの階調（この例では、輝度）を受けて、図２のように表示する。なお、判定手段８から高さ、面積、体積等の判定項目毎のトータルの判定結果を受けて、表示しても良い。なお、図２又は図４のような表示フォーマットは予め保有している。 The display control means 11 receives and displays the layout from the design information storage means 13 and receives the gradation scale from the gradation allocating means 10 and the gradation (luminance in this example) for each printed solder location. The display is as shown in FIG. In addition, you may receive and display the total determination result for every determination items, such as height, an area, and a volume, from the determination means 8. FIG. The display format as shown in FIG. 2 or FIG. 4 is held in advance.
また、表示制御手段１１は、後記する操作手段１４からの指示により、図４（ａ）に示すように、印刷はんだの判定項目である高さ、面積、体積、印刷はんだズレの４つについて同時表示することもできる。このように同時表示することにより、操作者は、要素間を定量的に、かつ分布上に視覚認識できることから、印刷はんだのトラブル解析に有効である。なお、図４（ａ）では、各判定項目毎に異なった階調スケールを表示しているが、図４（ｂ）に示すように共通階調スケールを判定項目のうち偏差値の最小値と最大値を抽出して、その最小値と最大値に対して、例えば、輝度１から輝度２００を割り当てて共通の階調スケールを決定し、各判定項目の階調スケールを共通階調スケールに合わせるとともに、各判定項目のレイアウト上の印刷はんだ箇所又は領域における階調表示を当該共通階調スケールに合わせた表示とすることにより、一つのスケールで視覚上の比較認識がしやすくすることもできる。 Further, the display control means 11 is configured to simultaneously determine four items, namely, the height, area, volume, and print solder misalignment, as shown in FIG. 4A, in accordance with an instruction from the operation means 14 described later. It can also be displayed. By simultaneously displaying in this way, the operator can visually recognize the elements quantitatively and on the distribution, which is effective for trouble analysis of the printed solder. In FIG. 4A, a different gradation scale is displayed for each determination item. However, as shown in FIG. 4B, the common gradation scale is set to the minimum deviation value among the determination items. The maximum value is extracted, and for example, luminance 1 to luminance 200 are assigned to the minimum value and the maximum value to determine a common gradation scale, and the gradation scale of each determination item is matched with the common gradation scale. At the same time, by making the gradation display in the printed solder location or region on the layout of each judgment item a display that matches the common gradation scale, it is possible to facilitate visual comparison and recognition on one scale.
操作手段１４は、表示制御手段１１及び表示手段１２とともに、ユーザインタフェースを構成している。操作手段１４からは、予め設計情報記憶手段１３に記憶している複数の基板の設計情報のうち検査対象とする基板の指定、及び判定項目（検査項目）のうち表示したい項目を指定する。操作手段１４からの指示は、操作手段１４から直接或いは表示制御手段１１を介して各部に伝えられる。差演算手段９や階調割振手段１０は、例えば、高さ、面積、体積等のうち操作手段１４によって指定され項目についてだけ実施しても良いし、すべての判定項目について実施して、表示制御手段１１が、操作手段１４によって指定された項目だけ表示しても良い。図２は、判定項目、体積についての表示例である。図４は、高さ、面積、体積、及び印刷はんだズレの判定項目について同時表示した例である。 The operation means 14 constitutes a user interface together with the display control means 11 and the display means 12. From the operation means 14, designation of a board to be inspected among design information of a plurality of boards stored in advance in the design information storage means 13 and an item to be displayed among judgment items (inspection items) are designated. An instruction from the operation unit 14 is transmitted to each unit directly from the operation unit 14 or via the display control unit 11. The difference calculation means 9 and the gradation allocation means 10 may be executed only for items specified by the operation means 14 among, for example, height, area, volume, etc., or may be executed for all the determination items for display control. The means 11 may display only items specified by the operation means 14. FIG. 2 is a display example of determination items and volumes. FIG. 4 is an example in which determination items for height, area, volume, and printed solder misalignment are simultaneously displayed.
[差演算及び階調表示の他の例]
上記、差演算手段９及び階調割振手段１０は、基準データに対する印刷はんだ状態を各印刷はんだ箇所毎の階調表示して、全体として一瞥できるようにしたが、次に示す例は、基板１を領域に分けて、階調表示することにより、面的に傾向を把握できるようにしたものである。
[Other examples of difference calculation and gradation display]
The difference calculating means 9 and the gradation allocating means 10 can display the printed solder state with respect to the reference data by gradation for each printed solder location so that they can be glanced as a whole. Is divided into areas and displayed in grayscale so that the trend can be grasped in a plane.
差演算手段９は、前記各位置における判定用データと基準データとの差の値を求め、かつ前記プリント板表面を複数の領域Ｌに分けて該複数領域のそれぞれにおける該差の値の平均値を求め、各領域の偏差値（平均の偏差値）として出力する。そして階調割振手段１０が、輝度１〜輝度１００の表示上の階調に各該偏差値を割り振り、各該偏差値に対応する階調を求めて、表示手段１２に表示させる。 The difference calculation means 9 obtains a difference value between the determination data and the reference data at each position, and divides the printed board surface into a plurality of regions L and averages the difference values in each of the plurality of regions. Is output as a deviation value (average deviation value) of each region. The gradation allocating means 10 assigns each deviation value to the gradation on the display of luminance 1 to luminance 100, obtains the gradation corresponding to each deviation value, and causes the display means 12 to display it.
そのとき、各領域の平均の偏差値を求める手法として、一般的な方法としては、レイアウトをＮ列、Ｍ行領域に分け、各領域Ｌｎ＋ｍ（ｎ：１以上Ｎ以下、ｍ：１以上Ｍ以下）毎に平均してもよい。又、領域間の階調を滑らかににするため、次のような平均を行っても良い。例えば、差演算手段９は、基板１の表面を列方向にＮ列領域に分けて各領域における列平均値を求める。さらに、基板１表面を行方向にＭ行領域に分けて各領域における行平均値を求めて、さらに該列平均と行平均を重ねて得た平均値を基に、前記複数Ｌ＝Ｎ×Ｍ個の各領域の平均値の偏差値を求める。階調割振手段１０は、上記したように階調スケールを生成して、各領域毎の階調を求める。その表示例を図３に示す。図３は、判定項目が面積について、基板１をＬ＝９列×９行＝８１個の領域に分けて、演算して偏差値を求めて表示した例であり、偏差値（階調）は１％（輝度１）から４２％（輝度１００）である。 At that time, as a method for obtaining an average deviation value of each region, as a general method, a layout is divided into N columns and M row regions, and each region Ln + m (n: 1 to N, m: 1 to M). ) May be averaged every time. Further, the following averaging may be performed in order to make the gradation between regions smooth. For example, the difference calculation means 9 divides the surface of the substrate 1 into N column regions in the column direction and obtains a column average value in each region. Further, the surface of the substrate 1 is divided into M row regions in the row direction to obtain row average values in each region, and based on the average value obtained by overlapping the column average and row average, the plurality of L = N × M The deviation value of the average value of each area is obtained. The gradation allocating unit 10 generates a gradation scale as described above, and obtains a gradation for each region. An example of the display is shown in FIG. FIG. 3 shows an example in which the substrate 1 is divided into L = 9 columns × 9 rows = 81 regions with respect to the area to be determined, and the deviation value is calculated and displayed. It is 1% (luminance 1) to 42% (luminance 100).
上記構成における、測定制御手段４、データ生成手段７、判定手段８、差演算手段９、階調割振手段１０及び表示制御手段１１は、ＣＰＵ及びそのＣＰＵに上記説明の機能動作させるためのプログラムを記憶したメモリ（ＲOＭ）、及び上記機能動作過程でデータを貯えるメモリ（ＲＡＭ）等で構成される。測定値記憶手段６及び設計情報記憶手段１３はメモリで構成され、上記ＣＰＵで管理される。 In the above configuration, the measurement control unit 4, the data generation unit 7, the determination unit 8, the difference calculation unit 9, the gradation allocation unit 10 and the display control unit 11 are a CPU and a program for causing the CPU to perform the function operation described above. It comprises a memory (ROM) that is stored and a memory (RAM) that stores data in the functional operation process. The measured value storage means 6 and the design information storage means 13 are constituted by a memory and are managed by the CPU.
１ 基板（プリント板）、 ２ 移動台、 ３ センサ、 ４ 測定制御手段
４ａ 移動制御部、 ５ 移動機構部、 ６ 測定値記憶手段、 ７ データ生成手段
８ 判定手段、 ９ 差演算手段、 １０ 階調割振手段、 １１ 表示制御手段
１２ 表示手段、 １３ 設計情報記憶手段、 １４ 操作手段
DESCRIPTION OF SYMBOLS 1 Board | substrate (printed board), 2 Moving stand, 3 Sensor, 4 Measurement control means 4a Movement control part, 5 Movement mechanism part, 6 Measurement value storage means, 7 Data generation means 8 Judgment means, 9 Difference calculation means, 10 Gradation Allocation unit, 11 Display control unit, 12 Display unit, 13 Design information storage unit, 14 Operation unit
Claims (4)
前記印刷はんだ箇所の各位置における前記項目毎に判定用データと所定の基準データとの差を表す偏差値を求めて出力する差演算手段（９）と、表示上の濃淡の変化範囲或いは色種の変化範囲である階調の所定幅に前記差演算手段で求められた前記項目毎の偏差値の最小値から最大値までの範囲を割り振る階調割振手段（１０）と、
前記表示手段に、前記プリント板の印刷はんだ箇所を示す複数のレイアウトを前記複数の項目に対応させて同時に表示させ、該階調割振手段で割り振られた階調に基づいて、当該表示された各レイアウト上の前記印刷はんだ箇所の位置に、前記項目毎の偏差値に対応する階調表示を行わせると共に、前記所定幅に亘る階調と、該所定幅の上限及び下限に相当する前記項目毎の偏差値の最大値及び最小値または前記所定幅の途中の特定階調に相当する前記項目毎の偏差値とを、階調スケールとして表示させる表示制御手段（１１）とを備えたことを特徴とする印刷はんだ検査装置。 A measuring means (100) for irradiating light on the surface of the printed board and obtaining a measured value indicating displacement (Z) in the height direction at each position (X, Y) of the printed board surface obtained from the reflected light; A measurement value storage means (6) for storing the measurement value, a design information storage means (13) for storing arrangement information of printed solder locations on the printed board, and a design information storage means ( 13) Data for generating determination data corresponding to a plurality of items including at least one of height, area, volume, or printed solder misalignment indicating the printed state of solder at each position of the printed solder location stored in 13) A printed solder inspection apparatus that has a generating means (7) and displays the printed state of the solder on the display means (12) based on the measured value of the measured value storage means,
Difference calculation means (9) for obtaining and outputting a deviation value representing a difference between the determination data and predetermined reference data for each item at each position of the printed solder location, and a change range or color type of the shade on the display Gradation allocation means (10) for allocating a range from the minimum value to the maximum value of the deviation value for each item obtained by the difference calculation means to a predetermined width of gradation that is a change range of
The display means simultaneously displays a plurality of layouts indicating printed solder locations of the printed board in correspondence with the plurality of items, and each of the displayed items is displayed based on the gradation assigned by the gradation allocation means. A gradation display corresponding to the deviation value for each item is performed at the position of the printed solder location on the layout, and the gradation over the predetermined width and each item corresponding to the upper limit and the lower limit of the predetermined width are displayed. Display control means (11) for displaying, as a gradation scale, a maximum value and a minimum value of the deviation values of each item or a deviation value for each item corresponding to a specific gradation in the middle of the predetermined width. Printing solder inspection equipment.
前記印刷はんだ箇所の各位置における前記項目毎に前記判定用データと所定の基準データとの差を表す値を求めて、かつ前記プリント板表面を複数の領域（Ｌ）に分けて該複数領域のそれぞれにおける該差を表す値の平均値を求め、各領域の偏差値として出力する差演算手段（９）と、表示上の濃淡の変化範囲或いは色種の変化範囲である階調の所定幅に前記差演算手段で求められた前記項目毎の偏差値の変化の範囲を割り振る階調割振手段（１０）と、
前記表示手段に、前記プリント板表面を前記複数の領域に分けたことを示す複数のレイアウトを前記複数の項目に対応させて同時に表示させ、該階調割振手段で割り振られた階調に基づいて、該各領域に当該領域の前記項目毎の偏差値に対応する階調表示を行わせると共に、前記所定幅に亘る階調と、該所定幅の上限及び下限に相当する前記項目毎の偏差値の最大値及び最小値または前記所定幅の途中の特定階調に相当する前記項目毎の偏差値とを、階調スケールとして表示させる表示制御手段（１１）とを備えたことを特徴とする印刷はんだ検査装置。 A measuring means (100) for irradiating light on the surface of the printed board and obtaining a measured value indicating displacement (Z) in the height direction at each position (X, Y) of the printed board surface obtained from the reflected light; A measurement value storage means (6) for storing the measurement value, a design information storage means (13) for storing arrangement information of printed solder locations on the printed board, and a design information storage means ( 13) Data for generating determination data corresponding to a plurality of items including at least one of height, area, volume, or printed solder misalignment indicating the printed state of solder at each position of the printed solder location stored in 13) A printed solder inspection apparatus that has a generating means (7) and displays the printed state of the solder on the display means (12) based on the measured value of the measured value storage means,
A value representing a difference between the determination data and predetermined reference data is obtained for each item at each position of the printed solder location, and the surface of the printed board is divided into a plurality of regions (L). A difference calculating means (9) for obtaining an average value of the values representing the difference in each area and outputting the difference as a deviation value of each area; and a predetermined gradation range which is a change range of light and shade or a change type of color type on the display Gradation allocation means (10) for allocating a range of variation of the deviation value for each item obtained by the difference calculation means;
The display means displays a plurality of layouts indicating that the printed board surface is divided into the plurality of regions at the same time, corresponding to the plurality of items, and based on the gradation assigned by the gradation allocating means. , Causing each region to perform gradation display corresponding to the deviation value for each item of the region, and the gradation over the predetermined width and the deviation value for each item corresponding to the upper limit and the lower limit of the predetermined width And a display control means (11) for displaying a deviation value for each item corresponding to a specific gradation in the middle of the predetermined width as a gradation scale. Solder inspection device.
前記差演算手段は、各位置における前記各判定用データとそれに対応する前記所定の基準データとの差を表す、高さ、面積、体積及び印刷はんだズレに対応する各項目毎の偏差値を求めて出力し、
前記階調割振手段は同一のプリント板に対して、高さ、面積、体積及び印刷はんだズレの各項目毎に対応するそれぞれの偏差値の最小値から最大値までの範囲を前記諧調の所定幅に割り付けし、
前記表示制御手段は、同一のプリント板に対して、高さ、面積、体積及び印刷はんだズレの各項目毎に対応して、前記印刷はんだ箇所の各位置を示すレイアウトを表示させ、該階調割振手段の出力を受けて、前記各位置に当該位置の偏差値に対応する階調表示を行わせ、及びそれぞれの階調スケールの表示を行わせることを特徴とする請求項１〜３のいずれかに記載の印刷はんだ検査装置。 The data generating means generates determination data for each item of height, area, volume, and printed solder misalignment representing the printed state of solder at each position of the printed solder location,
The difference calculating means obtains a deviation value for each item corresponding to height, area, volume, and printed solder misalignment, which represents a difference between the determination data at each position and the predetermined reference data corresponding thereto. Output,
The gradation allocating means has a predetermined width of the gradation in a range from a minimum value to a maximum value of each deviation value corresponding to each item of height, area, volume and printed solder misalignment with respect to the same printed board. Assigned to
The display control means displays, on the same printed board, a layout indicating each position of the printed solder portion corresponding to each item of height, area, volume and printed solder misalignment, and the gradation 4. The output of the allocating means is received, and each of the positions is displayed with gradation corresponding to the deviation value of the position, and each gradation scale is displayed. The printed solder inspection apparatus according to crab.
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