JP4034325B2 - Three-dimensional measuring device and inspection device - Google Patents

Description

  The present invention relates to a three-dimensional measuring apparatus and an inspection apparatus, and more specifically, a three-dimensional measuring apparatus for measuring a measurement target such as cream solder disposed on a printed circuit board, and an inspection apparatus including the measuring apparatus. It is about.

  In the process of manufacturing a printed circuit board, there is a process of mounting electronic components on the board as a main process. When mounting an electronic component, cream solder is first printed on a predetermined electrode pattern disposed on a printed circuit board. Next, the electronic component is temporarily fixed on the printed circuit board based on the viscosity of the cream solder. Thereafter, the printed circuit board is guided to a reflow furnace, and soldering is performed through a predetermined reflow process. It is necessary to inspect the printed state of the cream solder in the previous stage of being guided to the reflow furnace, and an inspection device including a three-dimensional measuring device may be used for such inspection.

  In the inspection of the cream solder printing state as described above, a predetermined reference height is calculated and set, and the height and volume of the cream solder are calculated based on the set reference height. And when the height and volume satisfy | fill predetermined conditions, it determines with a non-defective product, and when not satisfy | filling, it determines with inferior goods.

As a method for setting the reference height, a solder image is obtained by irradiating a solder to be inspected with laser light to obtain a brightness image, and the brightness print range based on a brightness condition specified in advance for the brightness image. There is one that detects (boundary position), and further sets a level value at the boundary position as a reference height (see, for example, Patent Document 1). Moreover, when inspecting a land as an inspection object, there is one in which a solder film thickness is measured based on a measurement reference portion provided for each land (see, for example, Patent Document 2).
Japanese Patent No. 3203397 JP-A-8-64958

  However, in the case of the soldering state inspection device described in Patent Document 1, since the boundary position is detected and the height measurement reference level is obtained for the high and low level image of the boundary position, the measurement becomes complicated and many inspections are performed. There was a problem of taking time.

  In the case of the solder film thickness measuring method described in Patent Document 2, the solder film thickness is measured based on a measurement reference portion provided for each land to be inspected. For this reason, when the number of lands increases, the number of measurement reference portions also increases, and there is a problem that a lot of time is required for measurement.

  The main object of the present invention is to provide a three-dimensional measurement apparatus and an inspection apparatus capable of speedily performing three-dimensional measurement and inspection while maintaining high measurement accuracy, and capable of acquiring pattern data relatively easily. One of the purposes.

  Characteristic means capable of achieving the above object will be described below. For each means, characteristic actions and effects are described as necessary.

Means 1. A three-dimensional measurement device that performs three-dimensional measurement of the measurement target based on obtaining the height of the measurement target disposed on the substrate,
Pattern data acquisition means for acquiring pattern data of the substrate;
Based on the acquired pattern data, comprising a reference part setting means for setting a plurality of reference parts,
Set by the reference part setting means,
A three-dimensional measuring apparatus configured to perform three-dimensional measurement of a measurement target based on an optimum reference portion that is close to the measurement target selected from the plurality of reference portions.

  According to the means 1, the three-dimensional measurement of the measurement object is performed based on the fact that the height of the measurement object arranged on the substrate is obtained. In this case, the pattern data acquisition unit acquires the pattern data of the substrate, and the reference unit setting unit sets a plurality of reference units based on the acquired pattern data. Then, the three-dimensional measurement of the measurement target is performed based on the optimum reference portion that is close to the measurement target selected from the plurality of reference portions. Therefore, three-dimensional measurement can be performed speedily while maintaining a relatively high measurement accuracy. “Pattern data” is data including a circuit pattern on a substrate, and mainly includes plane data and imaged data as specific examples. The “reference portion” refers to a position or region on the substrate, and may be a point or a predetermined area. In addition, “based on the optimum reference portion” means “based on the height of the optimum reference portion” or “based on the height of the optimum reference portion” or “based on the height of the optimum reference portion”. The height may be based on the reference height ”(hereinafter the same for each means).

  Regarding the means 1, the substrate may be a printed circuit board and the measurement target may be cream solder. In this case, it becomes a structure like the means 2.

Mean 2. Based on obtaining the height of the cream solder disposed on the copper foil of the printed circuit board, a three-dimensional measuring device for performing three-dimensional measurement of the cream solder,
Pattern data acquisition means for acquiring pattern data of the substrate;
Based on the acquired pattern data, comprising a reference part setting means for setting a plurality of reference parts,
Set by the reference part setting means,
A three-dimensional measuring apparatus configured to perform three-dimensional measurement of the cream solder on the basis of an optimum reference portion close to the cream solder selected from the plurality of reference portions.

Means 3. A three-dimensional measurement device that performs three-dimensional measurement of the measurement target based on obtaining the height of the measurement target disposed on the substrate,
Pattern data acquisition means for acquiring pattern data of the substrate;
Based on the acquired pattern data, comprising a reference part setting means for setting a reference part,
The pattern data acquisition means acquires pattern data from the composite data necessary for substrate creation,
A three-dimensional measuring apparatus configured to perform three-dimensional measurement of the measurement target based on an optimum reference portion set by the reference unit setting means and in proximity to the measurement target.

  According to the means 3, the three-dimensional measurement of the measurement target is performed based on the fact that the height of the measurement target disposed on the substrate is obtained. In this case, the pattern data acquisition unit acquires the pattern data of the substrate, and the reference unit is set by the reference unit setting unit based on the acquired pattern data. Here, in the pattern data acquisition means, pattern data is acquired from the composite data necessary for substrate production. Then, the three-dimensional measurement of the measurement target is performed based on the optimum reference unit set by the reference unit setting unit and in proximity to the measurement target. Accordingly, since the pattern data is input from the composite data necessary for creating the substrate, the pattern data can be acquired relatively easily without going through the acquisition work for the pattern data. In addition, three-dimensional measurement can be performed speedily while maintaining a relatively high measurement accuracy.

  Regarding the means 3, the substrate may be a printed circuit board, and the measurement target may be cream solder. In this case, it becomes a structure like the means 4.

Means 4. Based on obtaining the height of the cream solder disposed on the copper foil of the printed circuit board, a three-dimensional measuring device for performing three-dimensional measurement of the cream solder,
Pattern data acquisition means for acquiring pattern data of the substrate;
Based on the acquired pattern data, comprising a reference part setting means for setting a reference part,
The pattern data acquisition means acquires pattern data from the composite data necessary for substrate creation,
A three-dimensional measuring apparatus configured to perform three-dimensional measurement of the cream solder based on an optimum reference portion that is set by the reference portion setting means and is close to the cream solder.

  Further, the following means 5 to 7 are listed as the composite data necessary for creating the substrate.

  Means 5. The three-dimensional measurement apparatus according to means 3 or 4, wherein the composite data includes at least Gerber data.

  Means 6. The three-dimensional measurement apparatus according to any one of means 3 to 5, wherein the composite data includes at least mount data.

  Means 7. The three-dimensional measurement apparatus according to any one of means 3 to 6, wherein the composite data includes at least part shape data.

  Further, as the pattern data, the following means 8 to 11 are listed.

  Means 8. The three-dimensional measuring apparatus according to any one of means 3 to 7, wherein the pattern data includes at least pattern data relating to a printed circuit board.

  Means 9. The three-dimensional measurement apparatus according to any one of means 3 to 8, wherein the pattern data includes at least arrangement data of each cream solder to be measured.

  Means 10. The three-dimensional measuring apparatus according to any one of means 3 to 9, wherein the pattern data includes at least size data of each cream solder to be measured.

  Means 11. The three-dimensional measuring apparatus according to any one of means 3 to 10, wherein the pattern data includes at least shape data of each cream solder to be measured.

  Means 12. An inspection apparatus comprising the three-dimensional measurement apparatus according to any one of means 1 to 11, and configured to perform pass / fail determination regarding the measurement object based on a measurement result of the three-dimensional measurement apparatus.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

  FIG. 1 is a schematic configuration diagram schematically showing a three-dimensional measurement apparatus 1 according to the present embodiment. In the present embodiment, the three-dimensional measuring device 1 is embodied as a printing state inspection device for inspecting the printing state of cream solder printed on a circuit pattern (for example, made of copper foil) of the printed circuit board K. It has become.

  As shown in FIG. 1, the three-dimensional measuring apparatus 1 includes a base 2, and an X-axis moving mechanism 3 and a Y-axis moving mechanism 4 are provided on the base 2. A rail 10 is disposed on the Y-axis moving mechanism 4, and a printed board K as a board is placed on the rail 10. The printed circuit board K is moved in the X-axis direction and the Y-axis direction by operating the X-axis moving mechanism 3 and the Y-axis moving mechanism 4.

  The three-dimensional measurement apparatus 1 also includes a three-dimensional measurement irradiation unit 5, a CCD camera (color camera) 6 as an imaging unit, and a main control unit 7 electrically connected to the CCD camera 6. . The three-dimensional measurement irradiating means 5 is configured to irradiate the surface of the printed circuit board K with a predetermined light pattern obliquely from above. The CCD camera 6 is arranged right above the printed circuit board K, and can image the portion of the printed circuit board K irradiated with the light pattern. Then, the main control means 7 performs image processing based on the image data picked up by the CCD camera 6 by a predetermined three-dimensional measurement method, and the cream solder located on the predetermined inspection pad PD (see FIG. 3 etc.). 3D measurement (mainly height measurement and volume measurement) is performed. That is, the main control means 7 includes inspection means 8 for inspecting the printing state based on the height (volume) of the cream solder located on the predetermined inspection pad PD. In the three-dimensional measurement in the present embodiment, an arbitrary measurement method such as a phase shift method, a light cutting method, a space code method, or a focusing method is appropriately employed.

  The three-dimensional measuring apparatus 1 according to the present embodiment includes means for extracting a region in which cream solder located on a predetermined inspection pad PD is disposed at the time of the three-dimensional measurement. The means includes a solder extraction irradiation means 11. The solder extraction irradiating unit 11 irradiates the printed circuit board K with predetermined light prior to the irradiation of the light pattern by the three-dimensional measurement irradiating unit 5.

  More specifically, the solder extraction irradiation means 11 includes a pair of upper and lower ring lights (not shown). The upper ring light is configured to irradiate light at a small incident angle and to be able to irradiate red or green light. The lower ring light is configured to irradiate light at a large incident angle and to selectively irradiate blue or green light. Usually, the printed circuit board K is provided with a red copper foil for forming lands and circuit patterns, and a blue cream solder is printed on the copper foil. Is reflected only darkly, and blue light is reflected only darkly from the copper foil portion. As a result, the copper foil portion is darker for the blue image and the cream solder portion is darker for the red image, so that the difference in brightness between each color image is large. Therefore, in the present embodiment, prior to the three-dimensional measurement, in order to extract the area of the cream solder to be measured, red and blue light is irradiated by both ring lights, and the irradiated surface is imaged by the CCD camera 6. On the basis of the image data obtained from the image pick-up 6, the main control means 7 performs an operation of specifying (extracting) the cream solder placement region.

  In addition, when a green resist is applied on the printed circuit board K, the lower ring light emits green light regardless of whether a circuit pattern is formed between the printed circuit board K and the applied resist. When irradiated, green light as reflected light is reflected brightly from the resist. In this case, when the upper ring light emits green light, the green light is reflected brightly from the resist on the circuit pattern, whereas it is reflected only darkly from the resist without the circuit pattern. Thereby, when green light is irradiated by both ring lights and the irradiated surface is imaged by the CCD camera 6, the location where the resist is applied in the main control means 7 based on the image data obtained from the imaging by the CCD camera 6. The operation of specifying (extracting) and the operation of specifying (extracting) the circuit pattern between the printed circuit board K and the resist are performed.

  Next, the electrical configuration of the three-dimensional measuring apparatus 1 centering on the main control means 7 will be described.

  As shown in FIG. 2, the CCD camera 6 is electrically connected to the main control means 7. The main control means 7 includes the inspection means 8 as described above. At the same time, the main control means 7 is connected to pattern data input means 17 for inputting the size and arrangement data of the printed cream solder, pattern data relating to the printed circuit board K, and the like.

  The main control means 7 is connected to the irradiation control means 21. The irradiation control means 21 is connected to the three-dimensional measurement irradiation means 5 and the solder extraction irradiation means 11 (a pair of upper and lower ring lights). Based on a control signal from the main control means 7, each irradiation means 5, 11 execution control and irradiation light switching control of each color.

  The main control means 7 is also connected to the X-axis movement control means 22 and the Y-axis movement control means 23. These X-axis movement control means 22 and Y-axis movement control means 23 appropriately drive and control the X-axis movement mechanism 3 and the Y-axis movement mechanism 4 based on a control signal from the main control means 7. As a result, the printed circuit board K is appropriately moved in the X-axis direction and the Y-axis direction.

  Next, operations and effects in the three-dimensional measuring apparatus 1 configured as described above will be described with a focus on the contents of control performed by the main control means 7.

  The main control means 7 goes through various processes according to a predetermined program. More specifically, (1) an input process for pattern data, (2) a division process for dividing pattern data into divided areas of a predetermined size, and (3) a reference for each divided area based on the divided pattern data. A setting process for setting a reference area candidate for setting a part, (4) an inspection process for inspecting cream solder based on a reference area candidate close to an inspection pad PD on which cream solder to be measured is placed . Then, when the inspection in all the inspection areas is completed, the inspection by the main control means 7 is completed.

  (1) In the pattern data input process, the pattern data is input to the main control means 7 via the pattern data input means 17. More specifically, when inputting pattern data, so-called Gerber data, mount data, component shape data, and other complex data necessary for board production are used. Then, the main control means 7 inputs basic data such as the arrangement, size and shape of each cream solder and pattern data related to the printed circuit board K via the pattern data input means 17.

  Specifically, the pattern data has a rectangular shape corresponding to the size of the substrate as shown in FIG. 3 in the image data. In the rectangular shape, there are test pad PD on which cream solder is placed and data of a plurality of circuit patterns continuous to the test pad PD. In this case, the pattern data may be acquired based on image data obtained from imaging by the CCD camera 6.

  (2) Next, the pattern data is divided into divided regions arranged vertically and horizontally at predetermined lengths. In this case, the rectangular pattern data is divided into N equal parts in the vertical direction and divided into M parts in the horizontal direction to form a matrix by the main control means 7 as the dividing means. More specifically, as shown in FIG. 4, the pattern data is equally divided in the vertical direction and the horizontal direction (for example, divided into four equal parts) to form a total of 16 divided regions C1 to C16. The divided areas C1 to C16 divided in this way are also rectangular, and the size of each of the divided areas C1 to C16 is the inspection pad PD on which the cream solder to be inspected is placed and a part of the pattern At least.

  (3) Next, a reference area candidate for setting a reference portion is set for each divided area divided equally. In this case, the center of the divided area divided equally is searched first. After that, a reference area candidate for setting a reference portion is set in the pattern data located closest to the center. Specifically, as shown in FIG. 5, the main control unit 7 as the reference unit setting unit applies the reference unit to the pattern data located closest to the center of the divided areas C1 to C16 divided equally. Reference area candidates A1 to A16 for setting are set.

  (4) Next, based on the reference area candidates A1 to A16 for setting the reference portion close to the cream solder to be measured, an inspection process for inspecting the cream solder is performed. In the inspection process, the main control means 7 as the measurement target specifying means specifies the test pad PD1 on which the cream solder to be measured in the divided areas C1 to C16 is placed, and the test pad PD1 The reference area candidates A1 to A16 (in this case, the reference area candidate A7) are allocated and associated (see FIG. 6).

  When the cream solder placed on the inspection pad PD1 is inspected, the associated reference area candidate A7 is used. Then, image processing is performed based on image data captured by the CCD camera 6 by a predetermined three-dimensional measurement method, and cream solder three-dimensional measurement is performed. At this time, the main control means 7 calculates the height of the cream solder, and hence the volume, using the associated reference area candidate A7 as the reference height. That is, in this embodiment, in principle, any one of the reference area candidates A1 to A16 is adopted as the optimum reference portion.

  The main control means 7 confirms whether or not the inspection pad PD on which all the cream solders to be inspected are placed has been specified. When it is confirmed that the inspection pad PD on which all the cream solder is placed is specified, the inspection of each cream solder is executed. Next, the main control means 7 appropriately drives and controls the X-axis movement mechanism 3 and the Y-axis movement mechanism 4 via the X-axis movement control means 22 and the Y-axis movement control means 23, and the printed circuit board K is controlled as necessary. Move as appropriate.

  Note that the setting method of the optimum reference portion for each of the regions C1 to C16 described in (3) above is not necessarily limited to the above method, and another setting method may be adopted. In other words, the main control means 7 sets the test pad PD on which the cream solder is placed even if the reference area candidates A1 to A16 are set on the circuit pattern located closest to the center of the divided regions C1 to C16. If the distance from the reference area candidates A1 to A16 is greater than or equal to a predetermined value, the reference area candidates A1 to A16 are not adopted as inappropriate. By determining whether or not the reference area candidates A1 to A16 are appropriate by the main control means 7 functioning as such a determination means, an inappropriate reference portion is excluded. In that case, three (4 or more) reference area candidates A1 to A16 closest to the test pad PD1 on which the cream solder is placed are selected from the 16 reference area candidates A1 to A16. It is. Then, after forming a reference plane based on the selected one, the optimum reference portion is specified, and the optimum reference portion is assigned and associated with the inspection pad PD1. Then, three-dimensional measurement of the cream solder is performed after the height of the optimum reference portion is set as the reference height. In this case, the optimum reference part is set with higher accuracy.

  More specifically, when the test pad PD1 to be measured is located in the divided region C7, for example, as shown in FIG. 7, the reference area candidates for the divided regions C7 and C6 and the divided regions C3 and C6 adjacent to the divided region C7. Three points A7, A3, and A6 are selected, and a reference plane including a triangle PH1 having the three points as vertices is formed. After forming such a reference plane, the optimum reference portion is specified, the optimum reference portion is assigned and associated with the test pad PD1, and the height of the reference reference portion is set as the reference height, thereby making it possible to obtain the three-dimensional cream solder. Measurement is performed.

  Furthermore, another determination method may be employed. That is, three points of reference area candidates A3, A6 and A7 of the divided areas C3, C6 and C7 shown in FIG. 7 are selected, and whether or not the triangle PH1 having the three points as vertices is close to an equilateral triangle, for example. It is determined (the logic at this time can be arbitrarily set). When it is determined that the triangle PH1 having three vertices as a vertex is close to a regular triangle to some extent, the reference plane including the triangle PH1 is determined to be appropriate, the reference plane is adopted, and the optimum reference portion is specified. On the other hand, when it is determined that the triangle PH1 having three vertices is not close to a regular triangle, the reference plane including the triangle PH1 is determined to be inappropriate, and the reference plane is not adopted. If the reference plane including the triangle PH1 is determined to be inappropriate, as shown in FIG. 8, for example, reference area candidates A2, A3, and A7 of the divided areas C2, C3, and C7 (as described above) are displayed. Are selected, and it is determined again whether or not the triangle PH2 having the three points as vertices is close to an equilateral triangle. When it is determined that the triangle PH2 having three vertices is close to a regular triangle to some extent, the reference plane including the triangle PH2 is determined to be appropriate, and the reference plane is adopted to identify the optimum reference portion. . Thereafter, the same processing is repeated.

  Furthermore, as another aspect, even when the determined triangle PH1 is not close to the inspection pad PD1 compared to a certain distance, it is determined again whether or not the determined triangle PH1 is close to an equilateral triangle. Also good. When the determined triangle PH1 is close to a regular triangle to some extent, the reference plane including the triangle PH1 may be determined to be appropriate.

  As described above in detail, in the present embodiment, pattern data corresponding to the size of the printed circuit board K1 is acquired, and the acquired pattern data is an area having a predetermined size arranged vertically and horizontally for each predetermined length. Reference area candidates A1 to A16 as reference parts are set for each of the divided areas C1 to C16. And based on the reference area candidate (A7) among the reference area candidates A1 to A16 close to the inspection pad (PD1) on which the cream solder to be measured is placed (one reference area candidate is the optimum reference portion and The three-dimensional measurement of the cream solder to be measured is performed after the height of the optimum reference portion is set to the reference height. For this reason, even if a height difference occurs in the printed circuit board K1 due to warpage or the like, the influence of the height difference can be eliminated, and accurate three-dimensional measurement and inspection can be performed.

  Further, since the reference area candidates A1 to A16 are set for each of the divided regions C1 to C16, the type of the reference portion to be set is compared with the case where the reference portion is set for each cream solder to be measured. (Number) is small. That is, if a reference part is set for each cream solder to be measured, if there are 200 measurement objects, for example, 200 reference parts are required. On the other hand, according to the present embodiment, even if there are 200 measurement objects, for example, the number of divided areas C1 to C16, that is, 16 reference portions are sufficient. Therefore, three-dimensional measurement and inspection can be performed relatively speedily. Further, since the pattern data is divided into regions of a predetermined size arranged vertically and horizontally for each predetermined length, the arrangement of the divided regions C1 to C16 and the reference area candidates A1 to A16 is orderly, and the measurement accuracy is high. become. In addition, since the reference area candidates A1 to A16 set in the divided areas C1 to C16 and the measurement objects existing in the divided areas C1 to C16 are more reliably matched, the measurement accuracy is reliably improved. be able to.

  Further, since the reference area candidates A1 to A16 are set in a pattern near the center of the divided areas C1 to C16, the inspection area PD placed on the cream solder to be measured and the selected reference area candidate A1 To A16 are close to each other, and the accuracy of the three-dimensional measurement is high.

  Further, according to the above-described method for setting the optimum reference portion, the instability when one reference area candidate A1 to A16 is set as the optimum reference portion can be eliminated, and more stable and accurate. 3D measurement and inspection can be realized.

  Moreover, since the pattern data regarding the printed circuit board K is input via the pattern data input means 17, the pattern data regarding the printed circuit board K can be easily acquired.

  In addition, you may implement as follows, for example, without being limited to the content of description of embodiment mentioned above.

  (A) In the above embodiment, the invention is embodied in an inspection apparatus for inspecting the printing state of cream solder. However, the above-described configuration may be embodied in another three-dimensional measurement apparatus and inspection apparatus. Is possible. For example, the height of a solder bump provided on the substrate may be measured.

  (B) In addition to the CCD camera that can capture an area as in the above embodiment, the imaging unit may be a camera that can capture an area or line, such as a CMOS camera. It is not limited to cameras.

  (C) The light source constituting each of the irradiating means 5 and 11 may be a halogen lamp or an LED. Moreover, you may employ | adopt the irradiation means which can irradiate a laser beam.

  (D) In the above embodiment, the pattern data is divided into four equal parts in the vertical and horizontal directions. In this case, it is desirable to increase the number of divisions in order to eliminate the influence of the height difference due to the warp of the printed circuit board K1. Further, the vertical and horizontal directions of the pattern data are not necessarily divided equally.

  (E) In the above embodiment, the printed circuit board K is configured to move in the XY axis direction. However, it is sufficient that the printed circuit board K and the CCD camera 6 can move relative to each other. It may be movable in the direction.

  (F) The board imaged by the imaging means may be a master printed board or a printed board to be measured.

It is a schematic perspective view which shows typically the measuring device in one Embodiment. It is a block diagram for demonstrating electrical structures, such as a main control means. It is a schematic diagram for demonstrating the three-dimensional measurement in this Embodiment, Comprising: The acquired pattern data are shown. It is a schematic diagram for demonstrating the three-dimensional measurement in this Embodiment, Comprising: The divided | segmented pattern data are shown. It is a schematic diagram for demonstrating the three-dimensional measurement in this Embodiment, Comprising: The allocation state of the reference area candidate in the divided | segmented pattern data is shown. It is a schematic diagram for demonstrating the three-dimensional measurement in this Embodiment, Comprising: The allocation of the reference area candidate in the divided | segmented pattern data and the specification of inspection object are shown. It is a schematic diagram for demonstrating the three-dimensional measurement in this Embodiment, Comprising: The allocation of the other reference | standard part in the divided | segmented pattern data, and specification of the test object are shown. It is a schematic diagram for demonstrating the three-dimensional measurement in the example of a change of this Embodiment, Comprising: The allocation of the other reference | standard part in the divided | segmented pattern data, and specification of the test object are shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Three-dimensional measuring apparatus, 3 ... X-axis movement mechanism, 4 ... Y-axis movement mechanism, 5 ... Three-dimensional measurement irradiation means, 6 ... CCD camera as an imaging means, 7 ... Pattern data acquisition means, Reference | standard part setting means , Division means, measurement target specifying means, main control means as judgment means, 8 ... inspection means, 17 ... pattern data input means, K ... printed circuit board, C1 to C16 ... divided regions, A1 to A16 ... reference as a reference part Candidate area, A7: Reference area candidate as optimum reference portion, PD: Inspection pad, PD1: Inspection pad with cream solder as measurement object, PH1: Triangle, PD2: Triangle.

Claims (2)

Based on obtaining the height of the cream solder disposed on the copper foil of the printed circuit board, a three-dimensional measuring device for performing three-dimensional measurement of the cream solder,
Pattern data acquisition means for acquiring pattern data of the substrate including at least pattern data relating to a printed circuit board, arrangement data of cream solder, and size or shape data of cream solder ;
Based on the acquired pattern data, comprising a reference part setting means for setting a plurality of reference parts,
The pattern data acquisition means
at least
Gerber data,
Or
Mount data and part shape data
Pattern data is obtained from the composite data necessary for board creation including
Among a plurality of reference parts set by the reference part setting means,
Based on the optimum reference part close to the cream solder,
A three-dimensional measuring apparatus configured to perform three-dimensional measurement of the cream solder. An inspection apparatus comprising the three-dimensional measurement apparatus according to claim 1 and configured to perform pass / fail determination regarding the cream solder based on a measurement result of the three-dimensional measurement apparatus.

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