JP2000004079A - Solder inspection equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a solder inspection equipment in which an operator can confirm the conditions at a defective print part quickly and accurately by displaying the image at a defective print part along with the content of defect on an image display means based on the inspection results at a plurality of solder print parts. SOLUTION: The solder inspection equipment comprises a section 28 for storing an inspection result data from an inspecting section 26 when inspected. The inspection result data includes GO/NO-GO data of solder print conditions at each land, a data concerning to the content of defect, and the like. Inspection results stored at the inspection result memory section 28 is presented on a display 32 when an operator operates a keyboard 31. Print condition at a defective print part is displayed in units of part or land and the content of defect is displayed in detail by characters. Consequently, the operator can confirm the content of defect quickly and accurately.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder inspection apparatus for inspecting the printing condition of creamy solder printed on a printed circuit board for surface mounting electronic parts and the like, and more particularly to a solder inspection apparatus for detecting a defective printing position. The present invention relates to a solder inspection apparatus capable of displaying a state in detail.

[0002]

2. Description of the Related Art Conventionally, surface mounting is performed by printing creamy solder on a predetermined position of a printed circuit board, temporarily fixing electronic components and the like thereon, passing the printed circuit board through a reflow furnace, and soldering the electronic components and the like. The method was used.

[0003] In this case, each printed portion of creamy solder printed on a printed circuit board by a cream solder printing machine is inspected by an image processing technique by a solder inspection device incorporated in a production line, and printing misregistration and printing bleeding are performed. In addition, defective printing such as blurred printing is detected.

[0004]

Conventionally, when the solder inspection apparatus detects a defective printing portion, the operator stops the solder printing process line and checks the printing quality of the solder on the inspection target board determined to be defective. The adjustment of the cream solder printing machine was being made. At this time, the operator visually inspected the defective portion of the substrate to be inspected, which is instructed by the solder inspection device, to confirm the details of the defect.

[0005] However, with the miniaturization and high density of the board mounted parts, the area of the printed portion of the creamy solder has become smaller, and it is quite difficult to identify the defective portion visually and confirm the content of the defect. However, there is an inconvenience that it takes time and labor, and in some cases, it is difficult to accurately specify the defective portion.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and displays the printing state and the details of a defective print portion in detail from the inspection result of a printed circuit board on which creamy solder is printed. It is an object of the present invention to provide a solder inspection apparatus capable of performing the above.

[0007]

According to a first aspect of the present invention, there is provided a solder inspection apparatus for inspecting a printed state of solder printed on a printed circuit board based on image data obtained by imaging the printed circuit board. And an image display means for displaying an image of a printing state and a content of a failure at a printing failure location designated based on an inspection result of a plurality of solder printing locations.

According to a second aspect of the present invention, there is provided a solder inspection apparatus, comprising: an image pickup unit for picking up an image of a printed circuit board on which solder is printed; and an image processing unit for generating inspection data from an image of the printed circuit board picked up by the image pickup unit. Inspection means for inspecting the solder printing state of each solder print location by comparing the inspected data with pre-input reference determination data; and an inspection result storage means for storing inspection result data inspected by the inspection means. Image display means for displaying an image of a print state of a print failure location designated based on the test result data stored in the test result storage means and the content of the failure.

According to a third aspect of the present invention, there is provided a solder inspection apparatus according to the first or second aspect, wherein the image display means determines the designated defective printing location in units of land for each solder printing location or in a plurality of locations. Displays the solder print locations in parts.

According to the present invention, the printing state of the creamy solder printed on the printed circuit board is displayed as an image in component units or land units, and the details of the defect contents are displayed in characters, so that the operator can determine the defective printing position. Can be quickly and accurately checked.

[0011]

FIG. 1 is a block diagram showing an embodiment of a solder inspection apparatus according to the present invention. In this solder inspection apparatus, parameters (judgment data) of an inspection area obtained by imaging a model substrate P1 serving as a reference at the time of inspection, and parameters (inspection data) of an inspection area obtained by imaging a substrate P2 to be inspected. To check whether the creamy solder is correctly printed on each land of the inspected substrate P2.

This solder inspection apparatus is provided with an image data input unit 1
And an image data input unit 1
Captures an image of the cream solder printed on the substrates P1 and P2, and inputs the captured image signal to the image data processing unit 2. The image data processing unit 2 converts the input imaging signal into image data, creates judgment data and inspection data based on the image data, compares the two data, and compares the data with the inspection substrate P2.
Inspect the printed state of the creamy solder above.

(Image Data Input Unit) Image Data Input Unit 1
Is a conveyor 11 on which the model substrate P1 and the substrate to be inspected P2 are placed, a Y-axis table section 12 for moving the conveyor 11 in the Y direction (frontward in the drawing), and the substrates P1 and P2 placed on the conveyor 11 The light emitting unit 13 includes an illuminating unit 13 for irradiating, and an imaging unit 14 for imaging the substrates P1 and P2.

The light projecting section 13 includes ring-shaped light emitting bodies 13R, 13G, and 13B for irradiating the substrates P1 and P2 with red light, green light, and blue light at different incident angles. The imaging unit 14 includes a color television camera 15 and an X-axis table 16 for moving the color television camera 15 in the X direction (horizontal direction in the drawing).

Each of the Y-axis table section 12 and the X-axis table section 16 includes a motor (not shown) that operates based on a control signal from the image data processing section 2, and the Y-axis table section 12 is driven by driving these motors. Is a conveyor 11
Is moved in the Y direction, the X-axis table 16 moves the color television camera 15 in the X direction, and the entire surface of the substrates P1 and P2 can be imaged by the color television camera 15. .

(Image Data Processing Unit) Image Data Processing Unit 2
Is an A / D conversion unit 21, a memory unit 22, an imaging controller 23, an image processing unit 24, an XY table controller 2.
5, an inspection unit 26, a teaching unit 27, and an inspection result storage unit 28. These units are connected to a control unit (CPU) 30 via a bus line 29. The control unit 30
Are connected to a keyboard 31, a display device 32, a printer 33, a communication unit 34, and a floppy disk device 35.

The A / D converter 21 converts the color signals R, G, and B supplied from the imaging unit 14 from analog to digital, and outputs the converted data to the controller 30 as image data. The memory unit 22 includes a RAM (random access memory),
Used as a work area of the control unit 30.

The imaging controller 23 includes an interface for connecting the control unit 30 to the light projecting unit 13 and the image sensing unit 14, and the like.
3, the light amount of each of the light emitters 13R, 13G, and 13B is adjusted, and the mutual balance of the hue light outputs of the color television camera 15 of the imaging unit 14 is controlled.

The image processing section 24 processes the image data supplied via the control section 30 to generate judgment data for the model substrate P1 and data for inspection on the substrate P2 to be inspected and supply them to the control section 30 and the inspection section 26. I do.

The XY table controller 25 controls the control unit 3
An interface is provided for connecting 0 to the X-axis table section 16 and the Y-axis table section 12, and controls the X-axis table section 16 and the Y-axis table section 12 based on an instruction from the control section 30.

The inspection unit 26 compares the judgment data supplied from the control unit 30 in the inspection mode with the inspection data transferred from the image processing unit 24, and determines whether the printing condition of the creamy solder on the inspection substrate P2 is good or bad. And outputs the result to the control unit 30.

The teaching section 27 stores the judgment data when supplied from the control section 30 in the teaching mode. Further, when a transfer request is received from the control unit 30 in the inspection mode, the determination data is supplied to the control unit 30 and the inspection unit 26 in response to the request.

The inspection result storage unit 28 stores the inspection unit 26 at the time of inspection.
The inspection result data includes the position data of the lands corresponding to each solder print location, the position data of each component, the data on the quality of the solder print on each land, the data on the content of defects, etc. is there.

In this case, the inspection results can be output in units of lands for each solder printing location as required, or a plurality of solder printing locations can be output in units of one component. The position data of the land and the position data of each component are stored in association with each other.

The keyboard 31 is used for operating information and the model board P.
Various keys necessary for inputting data related to the data on the land 1 and the data on the land and the parts on the model board P1 are provided. The data input from the keyboard 31 is supplied to the control unit 30. The keyboard 31 gives an instruction to display the test result data stored in the test result storage unit 28 on the display device 32.

The display device 32 is an image display means such as a CRT (CRT) or an LCD (liquid crystal display device).
Display key input data on the screen. In addition, based on the inspection result data stored in the inspection result storage unit 28, a board image indicating the quality of each solder printed portion of the inspected board P2, an individual image indicating a specific defective printing portion in an enlarged manner, and a defect content are displayed. Display on the screen.

(Teaching Mode) Next, the control unit 30
The operation for inspecting the print state of the creamy solder printed on the printed circuit board under the above control will be described. When inspecting a new substrate to be inspected P2, the control unit 3
0 executes the teaching mode in order to create determination data serving as a reference at the time of inspection using the model substrate P1.
The model board P1 is a board serving as a reference on which creamy solder is correctly printed on each land.

First, the respective parts of the apparatus are controlled to turn on the light projecting unit 13 and the image pickup unit 14, and the image pickup conditions and data processing conditions are adjusted. Next, the model substrate P1 is set on the Y-axis table section 12, and the X-axis table section 16 and the Y-axis table section 12 are set.
Is controlled, and the image pickup unit 14 takes an image of the model substrate P1 at each predetermined position on the model substrate P1.

The model substrate P1 is picked up by the color television camera 15 of the image pickup unit 14 while receiving irradiation light from the light projecting unit 13. That is, the light projecting unit 13 irradiates red light, green light, and blue light at different incident angles based on a control signal from the imaging controller 23, and projects the model substrate P1 with mixed light of three primary color lights. The imaging unit 14 captures the reflected light image with a color television camera 15 and converts it into an electric signal.

The light projecting section 13 is provided with light-emitting bodies 13R, 13G, and 13B in order to detect the printing state of the creamy solder on the model board P1 under the illumination.
Is controlled by the imaging controller 23 so that when the lights of the respective hues emitted by the color mixing are mixed, a complete white light is obtained.

That is, the luminous bodies 13R, 13G, 13B
Is composed of red light, green light, and blue light spectrum light emitters having a wavelength-emission energy distribution such that white light is generated by color mixing, and red light and green light emitted from each light emitter. The light amount of each hue light is adjusted so that blue light is mixed to become white light.

The image pickup unit 14 converts the reflected light from the model substrate P1 into color signals R, G, and B of three primary colors by a color television camera 15 arranged above the light projecting unit 13, and converts the reflected light into image data processing unit 2. Supply to

The color signals R, G, and B of the three primary colors obtained by this imaging operation are converted into image data by the A / D converter 21 and stored in the memory 22 in real time. Next, the control unit 30 transfers the image data corresponding to each hue from the memory unit 22 to the image processing unit 24. Image processing unit 24
Then, red, green, and blue patterns are extracted by binarizing image data of each hue with an appropriate threshold value for each hue.

The control unit 30 controls the image processing unit 24 to identify the position of each land by checking the brightness of the imaging pattern of each land. After this,
The control unit 30 creates determination data necessary for inspecting the substrate P2 to be inspected based on each hue pattern and land position data, stores the determination data in the teaching unit 27, and ends the teaching mode.

(Inspection Mode) Next, the operation of inspecting the quality of the printed state of the cream solder printed on the substrate P2 to be inspected will be described with reference to the flowchart shown in FIG.

When the mode is shifted to the inspection mode, the control unit 30 fetches the date data of the day and the ID number (identification number) of the substrate P2 to be inspected from the teaching unit 27 and the keyboard 31, and reads the judgment data from the teaching unit 27. This is supplied to the inspection unit 26 (step S
1).

Next, the control unit 30 starts the inspection after setting the imaging conditions and the data processing conditions (step S2). If the substrate to be inspected P2 is supplied (Step S
3) The substrate P2 to be inspected is set on the Y-axis table section 12 (step S4), and each hue pattern is detected by the image processing section 24 in the same manner as in the teaching mode, and each hue pattern, land position data and Inspection data is created based on the data (steps S5 and S6).

Next, the control unit 30 transfers the data to be inspected to the inspection unit 26, compares the data to be inspected with the determination data, and determines the quality of the solder printing state for each land on the substrate to be inspected P2 ( Step S7).

If the judgment result is good, the inspection result storage unit 2
The inspection result is stored in step S8 (step S8), and the inspection target substrate P2 is unloaded (step S9). If the judgment result is bad, the judgment result is supplied to the display device 32 or the printer 33 to be displayed and printed out (Steps S10 and S10).
11) After that, the inspection result is stored in the inspection result storage unit 28 (Step S8), and the inspection target substrate P2 is unloaded (Step S9). The contents to be displayed and printed out include the position of a defective portion on the substrate to be inspected P2, the component name,
The content is defective.

This series of processing (steps S3 to S11)
Is repeated as long as the supply of the substrate to be inspected P2 continues. If the supply of the substrate to be inspected P2 is interrupted, it is determined whether or not the inspection of the substrate to be inspected P2 has been completed (Step S12). repeat. If it has been completed, the inspection mode ends.

(Display of Inspection Results) The inspection results thus stored in the inspection result storage unit 28 can be displayed on the display device 32 by operating the keyboard 31 by the operator. FIG. 3 is a diagram illustrating an example of a case where the inspection result stored in the inspection result storage unit 28 is displayed on the display device 32 in units of parts.

FIG. 3A shows a substrate P2 to be inspected.
(B) is a component image diagram showing the quality of a solder printed portion of a certain component in the printed portion, and FIG. (C) is displayed in FIG. (B). FIG. 7 is a display diagram for explaining a component name and a defect content of a selected component.

The substrate image shown in FIG.
This indicates that the printing state of the cream-like solder printed on A is poor, and that the printing state of the cream-like solder printed on the land LA, which is not indicated by oblique lines, is good.

A plurality of lands LA are indicated by broken lines in units of parts, and a square chip system component including two lands LA, a transistor system component including three lands LA, and an IC system including eight lands LA. Each part is shown.

By the way, in the board image shown in FIG. 3A, a defective portion can be specified, but the content of the defect cannot be specified.
Then, when the operator operates the keyboard 31 to specify a desired part, for example, a transistor on the screen, as shown in FIG. 3B, the images of the three lands LA1 to LA3 of the specified transistor are enlarged and displayed. You.

This example shows that the printed state of the creamy solder on the land LA1 of the pad 1 and the land LA3 of the pad 3 is poor, and the printed state of the creamy solder on the land LA2 of the pad 2 is good. I have. That is, the creamy solder SD1 of the land LA1
Is shifted to the upper left, which indicates that the creamy solder SD3 on the land LA3 is running short.

The component name of this transistor "TR10
"0" and the defect content "pad 1-shift, pad 3-low solder" are displayed by characters as shown in FIG. The display in FIG. (C) may be displayed on the same screen as the display in FIG.

FIG. 4 is a diagram showing an example of a case where the inspection results stored in the inspection result storage section 28 are displayed on the display device 32 in units of lands (masks). In the same figure, FIG. 7A is a board image diagram showing a position of a defective portion in the inspected board P2, and FIG. 7B is a land image diagram showing the quality of a solder printed portion of a certain land therein. And (c) is a display diagram for explaining the defect content of the land displayed in (b).

Similarly to FIG. 4, the board image shown in FIG. 4A indicates that the cream solder printed on the lands LA indicated by diagonal lines has a bad printing state, and the land L not indicated by diagonal lines indicates
The printed state of the cream solder printed on A is good.

However, in the board image shown in FIG. 5A, a defective portion can be specified, but the content of the defect cannot be specified. Therefore, when the operator operates the keyboard 31 to specify a desired land on the screen, the image of the specified land LA is enlarged and displayed as shown in FIG.

This example shows that the cream solder SD of the land LA is displaced to the upper left. FIG. 9C shows that the defect content of the designated land is “shift”. The display of FIG. (B) and the display of FIG. (C) may be displayed on the same screen.

As described above, in the present embodiment,
The three primary color signals for the model substrate P1 are processed by the image processing unit 24, and red, green, and blue hue patterns are detected for each solder printed portion having a good printing state, and determination data is created.

Next, the three primary color signals for the substrate to be inspected P2 are processed by the image processing section 24, and
The same hue pattern is detected for the upper solder print portion to create inspection data.

Then, the inspection data and the judgment data are compared in the inspection section 26, and based on the comparison result, the inspection target substrate P
The quality of the printed state is determined for each solder printed portion of No. 2 and the inspection result data is stored in the inspection result storage unit 28.

The operator reads out the inspection result data stored in the inspection result storage unit 28 and displays the image of the printing state of the solder printing portion determined to be defective and the details of the defect on the display device 32, so that the details of the defect can be promptly determined. And it can be confirmed accurately.

[0056]

According to the present invention, the printing state of the creamy solder printed on the printed circuit board is displayed as an image in component units or land units, and the details of the defect contents are displayed in characters, so that the operator can use it. The advantageous effect that the status of the defective portion can be easily and accurately confirmed, and the accurate information of the defective portion can be fed back to the cream solder printing machine can be obtained.

[Brief description of the drawings]

FIG. 1 is a block diagram showing one embodiment of a solder inspection apparatus according to the present invention.

FIG. 2 is a flowchart showing an inspection procedure of the solder inspection apparatus according to the present invention.

FIG. 3 is a diagram illustrating an example of a case where an inspection result is displayed in units of parts;

FIG. 4 is a diagram illustrating an example of a case where an inspection result is displayed in units of lands.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Image data input part 2 Image data processing part 11 Conveyor 12 Y-axis table part 13 Light emitting part 13R, 13G, 13B Light-emitting body 14 Imaging part 15 Color television camera 16 X-axis table part 21 A / D conversion part 22 Memory part 23 Imaging controller 24 Image processing unit 25 XY table controller 26 Inspection unit 27 Teaching unit 28 Inspection result storage unit 29 Bus line 30 Control unit (CPU) 31 Keyboard 32 Display device 33 Printer 34 Communication unit 35 Floppy disk device LA, LA1 to LA3 Land P1 Model board P2 Inspection board SD, SD1-SD3 Solder

Claims (3)

[Claims] 1. A solder inspection apparatus for inspecting a printing state of solder printed on a printed circuit board based on image data obtained by imaging a printed circuit board, wherein the solder inspection apparatus is configured to specify a designated state based on an inspection result of a plurality of solder printing locations. A solder inspection apparatus, comprising: an image display unit that displays an image of a printing state of a printing failure location and details of the failure. 2. An image pickup means for picking up an image of a printed circuit board on which solder is printed, an image processing means for creating data to be inspected from an image of the printed circuit board picked up by the image pickup means, and inputting the data to be inspected in advance. Inspection means for comparing the printed state of the solder at each solder print location by comparing with reference determination data, inspection result storage means for storing inspection result data inspected by the inspection means, and the inspection result storage means A solder inspection apparatus, comprising: an image display unit that displays an image of a printing state of a printing failure point designated based on the stored inspection result data and details of the failure. 3. The image display means according to claim 1, wherein the designated defective printing portion is displayed in units of lands for each solder printing portion, or in units of components in which a plurality of solder printing portions are put together. 2. The solder inspection device according to 2.