JP2005093462A - Inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the inspection data of entire surface inspection system mounted substrate inspection device cannot be utilized as quality control data because the component number and coordinate corresponding to a failure point are not attached to the inspection data. <P>SOLUTION: In the inspection device of a mounted substrate for comparing/inspecting the entire surface of the substrate, different points between a reference substrate and a substrate to be inspected detected by automatic inspection and the component region based on computer design data are displayed simultaneously on a substrate image while being superposed, failure points are selected among different points by reinspection, failure points hitting to the component region are attached with component ID data and reported as mounting failure points or component failure points whereas other failure points are attached with substrate coordinate data and reported as surface failure points thus realizing a report of quality information inspection data. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an inspection apparatus that performs mounting quality inspection and soldering quality inspection of components on a printed circuit board in an electronics factory or the like.

With regard to the automation of assembly quality inspection of substrates on which electronic components are mounted, many types of inspection devices have been developed and are already used at the electronics manufacturing site.
The conventional board mounting inspection machine cannot be used only by the user turning on the power. The user must tell the inspection apparatus all board information necessary for the inspection. This is because, for example, in the case of a television or a mobile phone, the size of the board, the circuit, the types and the number of parts used are very different depending on the product.
The user teaches the “inspection area”, which is the position and range to be inspected for each board type, applies the pass / fail judgment program for each type of component to the inspection area, and further applies the pass / fail judgment level (strict judgment) It was necessary to adjust whether or not to make a loose judgment.
Often, the number of inspection areas that must be taught on a single substrate can reach hundreds to thousands. Chip parts such as resistors and capacitors usually require 2 areas for solder inspection and 1 area for component mounting inspection, and a total of 3 areas are required. For multi-electrode parts such as connectors and ICs, several areas are required for each part. It was necessary to set.

  The teaching time depends on the number of parts and the difficulty of determination, but usually takes several hours to several tens of hours. Furthermore, the adjustment of the judgment standard requires a high level of skill, and unless it was handled by a full-time engineer with a sophisticated technique, the effect of inspection automation could not be exhibited. Therefore, the conventional inspection machine can hardly be operated by small and medium-sized users who often perform work by the part timer.

  In order to solve the problem of teaching in a board mounting inspection machine, the present applicant has devised a technique that does not require teaching of an inspection area, application of a pass / fail judgment program, and adjustment of a level, and has already filed a patent application ( Japanese Patent Application Nos. 2002-196844, 2003-84161, and 2003-153620).

  The technology that forms the basis of these applications acquires the entire image of the reference board and the inspection board and performs comparison image processing on both, so there is no need to teach the inspection area as described above, nor to apply and adjust the pass / fail judgment program. Became.

  However, since this technique only detects a defective portion by comparing the entire surface of the board, even if the detected defective portion is a component mounting failure, there is no ID data for the component, and thus the board mounting quality data cannot be obtained. It was. If there is part ID data, the cause is investigated from failure analysis, and the problem is narrowed down to whether it is a problem at the cream solder printing stage, a problem at the part mounting stage, or a problem at the reflow soldering stage. This makes it possible to take general measures against the occurrence. As described above, the mounting quality data accompanying the part ID data is extremely important information in terms of production technology in terms of quality improvement and quality tracking (traceability) after commercialization. The inability to obtain this data was a major problem in quality control.

In view of this, the present invention, in a full inspection method inspection apparatus that does not require inspection area setting, distinguishes and reports component mounting defects and board surface defects by associating the detected defective portions with the ID data of the mounted components. Attach component mounting data and attach board coordinates to defective board surface areas to acquire board quality data and solve the problem of enabling reports useful for quality improvement and quality tracking.
Now that the responsibility of the manufacturer has become more urgent, it is natural that manufacturers should have inspection data with quality information in order to understand product quality, and the present invention is the most convenient, fastest, We are trying to solve the problem that was the problem of the low-cost full-scale inspection system.

In order to achieve the above object, an inspection apparatus according to claim 1 of the present invention is an inspection apparatus that eliminates the need to set an inspection region by performing comparative image processing on the entire surface of a component mounting board.
Teaching means for teaching a board type / number (ID), computer design (CAD) data, and component area setting method;
An imaging unit having a one-dimensional image sensor whose pixel arrangement is along the X-axis direction and a Y table orthogonal to the X-axis, and moving the substrate or the sensor relative to the Y-axis to obtain an image of the entire surface of the substrate;
Data storage means for storing the acquired image of the entire substrate surface;
An image processing means comprising an algorithm for extracting a difference between the specimen substrate image acquired by the imaging means and the stored reference substrate image by performing comparison image processing;
Display means for simultaneously superimposing and displaying the component area and the difference on the board image;
Re-inspection means for visually judging the difference and selecting only the defective part;
In the parts area where the defective part is hit, the part ID data that has been taught is actualized and attached to make the part mounting defective part, and the board coordinate value is attached to the other defective part to make the substrate surface defective part It consists of data quality information means.

  This inspection device saves the entire image of the reference substrate, finds the difference between the two substrates from the comparison image with the entire sample substrate image, re-inspects the difference and selects the defective part, Is attached with component ID data, and substrate coordinates are attached to other defective portions of the substrate surface to report the inspection result data, thereby realizing the quality information inspection data report of the substrate.

The inspection apparatus according to claim 2 is an inspection apparatus that eliminates the need for an inspection region setting by performing comparative image processing on the entire surface of the component mounting board.
Teaching means for teaching a board type / number (ID), computer design (CAD) data, and component area setting method;
An imaging means comprising a two-dimensional image sensor and an XY table, and acquiring an image of the entire surface of the substrate by moving the substrate or the sensor relative to the XY;
Data storage means for storing the acquired image of the entire substrate surface;
An image processing means comprising an algorithm for performing a comparative image processing of an individual visual field image of the specimen substrate acquired by the imaging means and a stored image of the corresponding visual field on the reference substrate, and extracting a difference between them;
Display means for simultaneously superimposing and displaying the component area and the difference on the board image;
Re-inspection means for visually judging the difference and selecting only the defective part;
In the parts area where the defective part is hit, the part ID data that has been taught is actualized and attached to make the part mounting defective part, and the board coordinate value is attached to the other defective part to make the substrate surface defective part It consists of data quality information means.

  This inspection device saves the entire image of the reference substrate, finds the difference between the two substrates from the comparison image with the entire sample substrate image, re-inspects the difference and selects the defective part, Is attached with component ID data, and substrate coordinates are attached to other defective portions of the substrate surface to report the inspection result data, thereby realizing the quality information inspection data report of the substrate.

  According to the inspection apparatus of the first aspect of the present invention, in the inspection apparatus that images and inspects the entire surface of the component mounting board using a one-dimensional image sensor, the result report shows the quality such as the component ID data of the defective component. Since the problem that was not accompanied by any information has been solved, it becomes possible for the first time to analyze the mounting failure, improve the mounting quality, and track the quality (traceability) after commercialization.

  According to the inspection apparatus of the second aspect of the present invention, in the inspection apparatus that images and inspects the entire surface of the component mounting board using the two-dimensional image sensor, the result report is the component ID data of the defective component, etc. Since the problem that was not accompanied by quality information at all has been solved, it becomes possible for the first time to analyze mounting defects, improve the mounting quality, and track the quality (traceability) after commercialization.

  In an inspection apparatus that images and inspects the entire surface of a component-mounted board, the detected defect location is added to the computer design (CAD) data of the board for the purpose of attaching quality information such as part ID data of the defective part to the result report. This is realized by setting a location where the component area set based on the location is hit as a defective mounting location with component ID data.

  FIG. 1 is an overall configuration diagram of a first embodiment of the apparatus of the present invention.

  In FIG. 1, an electronic component 2 is mounted on a substrate 1, and the substrate 1 is held on a Y table 3.

  A one-dimensional image sensor camera 4 is disposed above the substrate 1. The one-dimensional image sensor camera 4 is a line CCD camera, and is installed so that the pixel array is along the X axis of the substrate 1. Therefore, the entire view of the substrate 1 is imaged by moving the substrate 1 in the Y direction. On the contrary, it goes without saying that the same image can be obtained even if the one-dimensional image sensor camera 4 is moved in the Y direction and the substrate 1 is fixed.

  The one-dimensional image sensor camera 4 is connected to a control device 5, which includes a one-dimensional sensor imaging unit 6, an image storage unit 7, an image processing arithmetic unit 8, an integrated system control unit 9 that controls the entire system, and teaching. Each unit 6, 7, 8, 9, 10, and 11 exchanges data through a bus 16.

  In addition, an input unit 12, an output unit 13, a communication unit 14, and a display unit 15 are connected to the control device 5.

  Next, the teaching steps of the inspection apparatus according to this embodiment will be described with reference to the flowchart of FIG. First, a substrate 1 as a reference is loaded on a table (ST1), computer design (CAD) data including a substrate ID and a component library, and a component area setting method used for image coordinate conversion are taught (ST2), and then a reference is made. The substrate is moved in the Y axis, and the entire surface of the substrate is imaged by the one-dimensional image sensor camera 4 (ST3). This entire image is stored in the image storage unit 7 (ST4).

  Next, operations of automatic inspection, re-inspection, and quality information conversion in the inspection apparatus of this embodiment will be described with reference to the flowchart of FIG.

  First, in FIG. 1, the sample substrate 1 is loaded on the Y table 3 (ST11), and when the ID data of the sample substrate type is input or read (ST12), the sample substrate 1 is moved in the Y-axis by a command from the control device 5. The one-dimensional image sensor camera 4 images the entire surface of the sample substrate 1 under the control of the one-dimensional sensor imaging unit 6 (ST13).

  Accordingly, the image processing arithmetic unit 8 performs comparative image processing of the reference substrate image and the sample substrate image stored in the image storage unit 7 (ST14).

  In other embodiments, this comparison image processing can be performed between the corresponding component regions of the reference substrate and the sample substrate. In this case, since the number of target pixels to be subjected to the comparison image processing is remarkably smaller than that of the entire image comparison, there is an advantage that the processing speed is improved. However, there is a demerit that even if an abnormal part occurs in a part other than the part area, it is not detected.

  Next, for example, a specific hole (hole) image is detected from the acquired image, the reference point of the board is determined from the center position thereof, and the quality information conversion unit 11 is obtained by using the CAD data including the component library taught in ST2. Converts the board coordinates into image coordinates, positions each component area at the image coordinates, and attaches component ID data (ST15).

  The parts area is set according to the taught setting method. In this embodiment, an enlargement ratio is taught, and an area that is slightly larger than the part outline area is set, such as the thick line frame shown in the schematic diagram of FIG. This is to cover the soldering pattern (land) of the substrate and the range of mounting displacement.

  The difference between the reference substrate and the sample substrate detected by the comparison image processing in ST14 is displayed on the substrate image as schematically shown in FIG. 8C (the substrate image is not shown). The inspector can perform re-inspection work with reference to the superimposed component image, but the information on which component is defective is missing because the mounted component and the difference are not related in information. Therefore, it cannot be stored as quality data for board mounting. That is, since quality improvement and quality recording cannot be performed, quality assurance after commercialization cannot be performed.

  Therefore, in the inspection apparatus according to this embodiment, the substrate image with the difference image is displayed on the display unit 15 using the image coordinate conversion data of the substrate created in ST15, and the component area is overlaid on the display. (ST16) (FIG. 8B).

  The automatic inspection is completed by the above steps, and the process proceeds to the re-inspection step. In the re-inspection step, the inspector visually identifies the substrate image in which the difference displayed in the previous step and the component area are superimposed, or by visually observing the portion of the specimen substrate, thereby selecting a true defective portion ( ST17). This selection is performed because the difference detected by the comparison image processing includes some overdetection of non-defective products.

  If the inspector clicks the difference image, the difference image is sequentially enlarged and displayed on the display unit 15 (not shown), so that detailed image reexamination is possible. FIG. 8B schematically shows a substrate image after selecting a defective portion. Among the differences, a black portion is indicated as a defective portion, and the spot-filled portion is an overdetection point unrelated to quality. is there. The over-detection point is erased at this point.

  When the inspector completes the re-inspection of all the differences, the inspection data is confirmed and a substrate image on which the defective portion is superimposed is displayed. At this time, the part area image in which the defective part is hit is marked and displayed by coloring or the like (FIG. 8A), and the part ID data potentially attached by the introduction of the CAD data is revealed, and any part has a defect. The occurrence is saved as data. Since this data is board quality data, it can be used for automatic mounting, improvement of soldering, or reexamination of adopted parts. In addition, a defective portion other than the component region is attached with a substrate coordinate as a defective surface portion and can be used for improving the manufacturing of the substrate.

  Finally, the final result is displayed and reported (ST18), and the sample substrate is removed from the Y stage 3 (ST19).

  If the inspection apparatus according to this embodiment is used, the board image data is converted into quality information as described above, the component ID data is attached to the mounting failure portion, and the coordinates are attached to the surface failure portion. For the first time in a production line using a full-scale inspection device, inspection data can be used for analysis of causes of defects or quality improvement work, and for quality tracking (traceability) after shipment.

  FIG. 4 is an overall configuration diagram of a second embodiment of the apparatus of the present invention.

  In FIG. 4, an electronic component 2 is mounted on a substrate 1, and the substrate 1 is first loaded on an XY table 3.

  A two-dimensional image sensor camera 4 is disposed above the substrate 1. The two-dimensional image sensor camera 4 is an area CCD camera.

  The two-dimensional image sensor camera 4 is connected to a control device 5. The control device 5 includes a two-dimensional sensor imaging unit 6, an image storage unit 7, an image processing arithmetic unit 8, and an integrated system control unit 9 that controls the entire system. The unit 6, the quality information unit 11, and the units 6, 7, 8, 9, 10, and 11 exchange data through the bus 16.

  In addition, an input unit 12, an output unit 13, a communication unit 14, and a display unit 15 are connected to the control device 5.

  Next, the teaching steps of the inspection apparatus according to the second embodiment will be described with reference to the flowchart of FIG. First, the reference board 1 is loaded on the XY table 3 (ST21), and the computer ID (CAD) data including the board ID and the parts library and the component area setting method used for image coordinate conversion are taught (ST22). Thereafter, the reference substrate is moved XY to capture the taught field of view with the two-dimensional image sensor camera 4 (ST23). The acquired image of the entire field of view of the reference substrate is stored in the image storage unit 7 (ST24).

  Next, operations of automatic inspection, re-inspection, and quality information conversion in the inspection apparatus of this embodiment will be described with reference to the flowchart of FIG.

  First, in FIG. 4, the sample substrate 1 is loaded on the XY table 3 (ST31), and when ID data of the sample substrate type is input or read (ST32), the sample substrate 1 is moved XY by the command of the control device 5, Under the control of the two-dimensional sensor imaging unit 6, the two-dimensional image sensor camera 4 images the teaching visual field of the sample substrate 1 (ST33).

  Therefore, the image processing arithmetic unit 8 performs comparative image processing of the reference substrate image and the sample substrate image stored in the image storage unit 7 (ST34).

  In other embodiments, this comparison image processing can be performed between the corresponding component regions of the reference substrate and the sample substrate. In this case, since the number of target pixels to be subjected to the comparison image processing is remarkably smaller than that of the entire image comparison, there is an advantage that the processing speed is improved. However, there is a demerit that even if an abnormal part occurs in a part other than the part area, it is not detected.

  Next, for example, a specific hole (hole) image is detected from the acquired image, the reference point of the board is determined from the center position thereof, and the quality information conversion unit 11 is obtained by using the CAD data including the component library taught in ST2. Converts the board coordinates into image coordinates, positions each component area at the image coordinates, and attaches component ID data (ST35).

  The parts area is set according to the taught setting method. In this embodiment, an enlargement ratio is taught, and an area that is slightly larger than the part outline area is set, such as the thick line frame shown in the schematic diagram of FIG. This is to cover the soldering pattern (land) of the board and the range of mounting displacement.

  The difference between the reference substrate and the sample substrate detected by the comparison image processing in ST34 is displayed on the substrate image (part image is not shown) as schematically shown in FIG. The inspector can perform re-inspection work with reference to the superimposed component image, but the information on which component is defective is missing because the mounted component and the difference are not related in information. Therefore, it cannot be stored as quality data for board mounting. That is, since quality improvement and quality recording cannot be performed, quality assurance after commercialization cannot be performed.

  Therefore, in the inspection apparatus according to this embodiment, the substrate image with the difference image is displayed on the display unit 15 using the image coordinate conversion data of the substrate created in ST35, and the component area is overlaid on the display. (ST36) (FIG. 8B).

  The automatic inspection is completed by the above steps, and the process proceeds to the reinspection step. In the re-inspection step, the inspector visually identifies the substrate image in which the difference displayed in the previous step and the component area are superimposed, or by visually observing the portion of the specimen substrate, thereby selecting a true defective portion ( ST37). This selection is performed because the difference detected by the comparison image processing includes some overdetection of non-defective products.

  If the inspector clicks the difference image, the difference image is sequentially enlarged and displayed on the display unit 15 (not shown), so that detailed image reexamination is possible. FIG. 8B schematically shows a substrate image after selecting a defective portion. Among the differences, a black portion is indicated as a defective portion, and the spot filled point is an overdetection point that is not related to quality. is there. Unrelated points are erased at this point.

  When the inspector completes the reinspection of all the differences, the inspection data is confirmed and a board image on which the defective portion is superimposed is displayed. At this time, the part area image in which the defective part is hit is marked by coloring or the like (FIG. 8A), and the part ID data potentially attached by the introduction of the CAD data is revealed, and any part has a defect. The occurrence is saved as data. Since this data is board quality data, it can be used for automatic mounting, improvement of soldering, or reexamination of adopted parts. In addition, a defective portion other than the component region is attached with a substrate coordinate as a defective surface portion and can be used for improving the manufacturing of the substrate.

  Finally, the final result is displayed and reported (ST38), and the sample substrate is removed from the Y stage 3 (ST39).

  If the inspection apparatus according to this embodiment is used, the board image data is converted into quality information as described above, the component ID data is attached to the mounting failure portion, and the coordinates are attached to the surface failure portion. For the first time in a production line using a full-scale inspection device, inspection data can be used for analysis of causes of defects or quality improvement work, and for quality tracking (traceability) after shipment.

  Mounting quality data that has been missing until now is attached to the inspection data of the mounting board full-surface inspection equipment that is the most convenient and fastest to handle. It can also be used for essential manufacturers.

It is a figure which shows the whole structure and board | substrate of an inspection apparatus. (Example 1) It is a flowchart which shows the teaching operation | movement in an inspection apparatus. (Example 1) It is a flowchart which shows the operation | movement of the automatic test | inspection in a test | inspection apparatus, re-examination, and a result display. (Example 1) It is a figure which shows the whole structure and board | substrate of an inspection apparatus. (Example 2) It is a flowchart which shows the teaching operation | movement in an inspection apparatus. (Example 2) It is a flowchart which shows the operation | movement of the automatic test | inspection in a test | inspection apparatus, re-examination, and a result display. (Example 2) It is a figure which shows typically the expansion component area | region in an inspection apparatus. (Example 1 and Example 2) It is a figure which shows typically the superimposed display of the whole surface inspection defect point and component area | region in an inspection apparatus. (Example 1 and Example 2)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Electronic component 3 Y table 4 One-dimensional image sensor camera 5 Control apparatus 6 One-dimensional sensor imaging unit 7 Image storage unit 8 Image processing arithmetic unit 9 Integrated system control unit 10 Teaching unit 11 Quality information unit 12 Input unit 13 Output Unit 14 Communication unit 15 Display unit 16 Data bus

Claims (2)

An inspection apparatus that eliminates the need for inspection area setting by performing comparative image processing on the entire surface of the component mounting board,
Teaching means for teaching a board type / number (ID), computer design (CAD) data, and component area setting method;
An imaging unit having a one-dimensional image sensor whose pixel arrangement is along the X-axis direction and a Y table orthogonal to the X-axis, and moving the substrate or the sensor relative to the Y-axis to obtain an image of the entire surface of the substrate;
Data storage means for storing the acquired image of the entire substrate surface;
An image processing means comprising an algorithm for extracting a difference between the specimen substrate image acquired by the imaging means and the stored reference substrate image by performing comparison image processing;
Display means for simultaneously superimposing and displaying the component area and the difference on the board image;
Re-inspection means for visually judging the difference and selecting only the defective part;
In the parts area where the defective part is hit, the part ID data that has been taught is actualized and attached to make the part mounting defective part, and the board coordinate value is attached to the other defective part to make the substrate surface defective part An inspection apparatus comprising data quality information means. An inspection apparatus that eliminates the need for inspection area setting by performing comparative image processing on the entire surface of the component mounting board,
Teaching means for teaching a board type / number (ID), computer design (CAD) data, and component area setting method;
An imaging means comprising a two-dimensional image sensor and an XY table, and acquiring an image of the entire surface of the substrate by moving the substrate or the sensor relative to the XY;
Data storage means for storing the acquired image of the entire substrate surface;
An image processing means comprising an algorithm for performing a comparative image processing of an individual visual field image of the specimen substrate acquired by the imaging means and a stored image of the corresponding visual field on the reference substrate, and extracting a difference between them;
Display means for simultaneously superimposing and displaying the component area and the difference on the board image;
Re-inspection means for visually judging the difference and selecting only the defective part;
In the parts area where the defective part is hit, the part ID data that has been taught is actualized and attached to make the part mounting defective part, and the board coordinate value is attached to the other defective part to make the substrate surface defective part An inspection apparatus comprising data quality information means.

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