JP3264020B2 - Inspection data creation method and mounted component inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounted on, for example, a printed circuit board (hereinafter simply referred to as a "substrate").
After soldering, the quality of soldering (hereinafter referred to as “mounting quality”) is checked individually.
Inspection equipment for mounting components and the inspection data required for this inspection
A method for creating data.

[0002]

2. Description of the Related Art Conventionally, visual inspection has been performed to inspect the mounting quality of mounted components on a substrate to be inspected (the components before soldering and those after soldering are collectively referred to as “mounting”). Have been done. However, in this kind of visual inspection, occurrence of an inspection error is unavoidable, the inspection result varies depending on the inspected person, and the inspection processing capacity is limited.

[0003] In recent years, a mounted component inspection apparatus has been put to practical use for automatically inspecting the mounting quality of a board on which a large number of components are mounted using image processing technology. When using this mounted component inspection apparatus, prior to the inspection, the mounted component inspection apparatus is instructed on which position on the board to be inspected, what components are mounted, and how, on a board type basis. There is a need. This teaching operation is called "teaching". The inspection data of the mounted component includes, in addition to the position and the type of the component mounted on the substrate to be inspected, information relating to an image required for the automatic inspection and its criterion.

[0004] The information on the image and the criterion include information on the land on the board to which each component is to be soldered (shape, length, width, etc.) and information on the window set as the inspection area (shape, size, etc.). Etc.), information (hue, brightness, etc.) on the characteristic parameters representing the soldering state on the lands, etc., and judgment criteria for judging the quality of the characteristic parameters.

In the teaching of these inspection data, a reference board on which each component is properly mounted is supplied to a mounted component inspection apparatus, and for each mounted component, an image of the component and its surroundings is sequentially generated, and After extracting characteristic parameters and the like and determining the criterion, the teaching is manually made to the mounted component inspection apparatus for each type of board.

[0006] A judgment data file is generated from the inspection data for each component taught as described above and stored in the mounted component inspection apparatus. At the time of inspection, the inspection data is read out from the judgment data file and mounted on each component. Quality is inspected.

[0007]

However, in the above teaching method, since the inspection data is taught one by one for each part, not only a great amount of labor and time are required for the teaching operation, but also the same part is required. Since the same inspection data is taught to a product of a different type, it is difficult to perform a detailed and highly accurate inspection on a substrate on which a plurality of components of the same component type are mounted under different mounting conditions.

On the other hand, for a board on which a plurality of components of the same component type are mounted under the same mounting conditions, it is necessary to repeatedly teach the same inspection data, which is troublesome.
When it is necessary to modify the taught inspection data, it is necessary to modify the inspection data of all the corresponding parts in the same manner, and there is a problem that the amount of work increases significantly in proportion to the number of parts.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems. Among components of the same component type, components mounted under mounting conditions different from other components are determined according to the mounting conditions.
Inspection with unique inspection data
For parts mounted under conditions, teach inspection data
And a modification operation can be greatly simplified .

[0010]

SUMMARY OF THE INVENTION According to the present invention, there is provided an apparatus for producing inspection data necessary for inspecting the mounting quality of a plurality of components mounted on a substrate from an image obtained by imaging the substrate. In the method, inspection data corresponding to each mounting condition is created for each different mounting condition , and identification data indicating inspection data necessary for inspection of the component is set for each component.

In the invention according to claim 2, when a board on which a plurality of components of the same component type are mounted is to be inspected,
Individual inspection data is created for each of the inspection areas having the same mounting conditions among the inspection areas set for each component. On the other hand, in the invention according to claim 3, individual inspection data is created for each component having a common mounting condition .

[0012] A fourth aspect of the present invention, the image obtained by imaging the upper substrate, a mounted component inspection device for inspecting the mounting quality of a plurality of components mounted on a substrate, different implementations
And test data created respectively for each condition according to the mounting conditions, a memory and the identification data is registered that indicates the test data necessary for inspection of the part, respectively per part, each part on the substrate And determining means for reading out inspection data necessary for inspecting the component based on the identification data and determining whether or not the mounted state of the component is appropriate.

[0013]

According to the inspection data creating method of the present invention, the actual
Independent inspection data is created for each different mounting condition, and identification data indicating the inspection data necessary for the inspection of each component is stored for each component. It is not necessary to teach each time, and the teaching operation can be simplified. Further, even when the inspection data needs to be corrected, the correction work for the components mounted under the same mounting conditions can be completed at once. Furthermore, even for components of the same component type, for components mounted under different mounting conditions, it is possible to individually teach inspection data suitable for the mounting conditions.

[0014] In the present invention of claim 2, since the individual inspection data for each inspection area mounting conditions in common is set, for the component is a part of the same component type to be mounted in different mounting conditions, other Mounted under the same mounting conditions as the parts
For the inspection area corresponding to the part , the common inspection data was used and mounted under different mounting conditions than other parts .
It is possible to deal with only the inspection area corresponding to the part by creating individual inspection data. In the invention of claim 3, since the individual data file for each component mounting condition common is set, when a plurality of the same type of components are mounted in the same mounting condition respectively, the teachings for these components Work can be greatly simplified.

According to a fourth aspect of the present invention, there is provided a mounting component inspection apparatus.
Now, the inspection data and identification data created by the above method
Data is registered in the memory, and identification data for each part is
Reads and implements inspection data required for inspection based on data
Since the appropriateness of the state is determined, if the parts are of the same part type
For components with different mounting conditions,
Inspection using the inspection data of
And conduct detailed and high-precision inspection according to the mounting state
be able to.

[0016]

FIG. 1 shows the overall configuration of a mounted component inspection apparatus. The mounting component inspection apparatus includes a feature parameter of an inspection area of each component 2S on the reference board 1S obtained by imaging the reference board 1S and the inspection target base obtained by imaging the board 1T. The X-axis table section 3, the Y-axis table section 4, the light projecting section 5, It includes an imaging unit 6, a control processing unit 7, and the like as its configuration.

The X-axis table unit 3 and the Y-axis table unit 4 each include a motor (not shown) that operates based on a control signal from the control processing unit 7, and the X-axis table unit is driven by driving these motors. The unit 3 moves the imaging unit 6 in the X direction, and the Y-axis table unit 4 moves the conveyor 8 supporting the substrates 1S and 1T in the Y direction.

The light projecting section 5 is formed by three annular light sources 9, 10, and 11 having different diameters and simultaneously irradiating red light, green light and blue light based on a control signal from the control processing section 7. The light sources 9, 10, 11 are centered on the position directly above the observation position and are positioned in directions corresponding to different elevation angles as viewed from the observation position.

In this embodiment, each of the light sources 9, 10, and 11 has a structure in which a white light source is covered with red, green, and blue colored transparent plates.
Three annular color fluorescent lamps or neon tubes that respectively generate green light and blue light may be used.

The image pickup unit 6 uses a color television camera, and is positioned downward just above the observation position. As a result, the reflected light from the surfaces of the substrates 1S and 1T to be observed is imaged by the imaging unit 6, converted into three primary color signals R, G, and B and supplied to the control processing unit 7.

The control processing unit 7 includes an A / D conversion unit 12,
Memory 13, teaching table 14, image processing unit 1
5, a determination unit 16, an XY table controller 17, an imaging controller 18, a control unit 19, a display unit 20, a printer 21, a keyboard 22, a floppy disk device 23, and the like. The color signals R, G, and B are processed, and characteristic parameters such as hue and lightness are detected for an inspection area of each component having good mounting quality, and a determination data file is created.

In the inspection mode, the control processing unit 7 processes the color signals R, G, and B for the substrate 1T to be inspected, and outputs red, green, and blue for the inspection area of each component 2T on the substrate 1T to be inspected. Each hue pattern is detected, feature parameters are generated, and an inspection data file is created. Then, the inspection data file is compared with the determination data file, and from the comparison result, the mounting quality such as the quality of soldering of each component 2T on the inspection substrate 1T is automatically determined.

FIG. 2 shows the cross-sectional form of the solder 25 when the soldering is good, when the component is missing, or when the solder is insufficient, the imaging pattern by the imaging unit 6 and the red pattern in each case. , A green pattern, and a blue pattern in a list, and a clear difference appears between any of the hue patterns, so that it is possible to determine the presence or absence of components and the quality of soldering.

Returning to FIG. 1, the A / D converter 12 converts the color signals R, G, B from the image pickup unit 6 into digital signals and outputs the digital signals to the control unit 19. The memory 13 includes a RAM and the like, and is used as a work area of the control unit 19.
The image processing unit 15 performs image processing on the image data supplied via the control unit 19 to create the inspection data file and the determination data file.
Supply to 6.

The teaching table 14 stores the judgment data file supplied from the control unit 19 at the time of teaching, and stores the judgment data file in response to the request when the control unit 19 outputs a transfer request at the time of inspection. This is read and supplied to the control unit 19, the determination unit 16, and the like.

The judging section 16 compares the judgment data file supplied from the control section 19 at the time of inspection with the data file to be inspected transferred from the image processing section 15 and determines each part 2T of the substrate 1T to be inspected. The quality of the soldering state is determined, and the determination result is output to the control unit 19.

The imaging controller 18 includes an interface for connecting the control unit 19 to the light projecting unit 5 and the imaging unit 6, and adjusts the light amounts of the light sources 9 to 11 of the light projecting unit 5 based on the output of the control unit 19. And controls to maintain the mutual balance of each hue light output of the imaging unit 6.

The XY table controller 17 controls the control unit 1
An interface for connecting the X-axis table unit 9 to the X-axis table unit 3 and the Y-axis table unit 4 is provided, and the X-axis table unit 3 and the Y-axis table unit 4 are controlled based on the output of the control unit 19.

When the display unit 20 receives image data, inspection results, key input data, and the like from the control unit 19,
This is displayed on the display screen, and when the inspection result or the like is supplied from the control unit 19, the printer 21 prints this out in a predetermined format.

The keyboard 22 is used for operating information and the reference board 1.
There are provided various keys necessary for inputting data relating to S and the substrate 1T to be inspected, and key input data is supplied to the control unit 19. The control unit 19 includes a microprocessor or the like, and controls the operation of the mounted component inspection apparatus in teaching, correction teaching, and inspection according to a control procedure described later.

FIG. 3 shows the structure of the judgment data file,
In particular, this figure shows the configuration of a judgment data file 40 for a board on which a plurality of components of the same component type are mounted under different mounting conditions, respectively.
Or more (two in the illustrated example) reference data files 42
a, 42b.

The basic data file 41 contains basic inspection data (hereinafter referred to as "basic data") for each component on the board, specifically, component type name, mounting position,
In addition to the mounting direction, component size, inspection order, window setting position, and the like, a reference data file name to be referred to for each window is stored.

Each of the reference data files 42a, 42
2b is specific inspection data common to a plurality of windows (hereinafter, referred to as “specific data”), specifically,
Any one or a combination of information on land (shape, length, width, etc.), information on window (shape, size, etc.), information on feature parameters (hue, brightness, etc.), judgment criteria, etc. It is for storing in units.

In the illustrated example, of the lands 28a, 29a and the lands 28b, 29b of the two components 27a, 27b belonging to the same component type, only the mounting condition of one land 29b of the second component 27b is the other. In this case, the windows W1a, W2a, and W2 are set on the lands 28a and 29a of the first component 27a and the one land 28b of the second component 27b.
The specific data for 1b is a reference data file 4
2a, and the specific data for the window W2b on the other land 29b of the second component 27b is stored as another reference data file 42b.

FIG. 4 shows another example of the configuration of the judgment data file, particularly a judgment data file 40 for a board on which a plurality of components of the same component type are mounted under the same mounting conditions.
Similarly, it comprises one basic data file 41 and one or more (one in the illustrated example) reference data file 42c.

In the case of this embodiment, the reference data file 42c contains one piece of information or a combination of a plurality of pieces of information (for example, component type name, mounting position,
Each piece of information except for the mounting direction or a combination thereof) is stored as specific data for each component. The basic data file 41 stores, as basic data, the component type name, mounting position and mounting direction of each component, and each component. A reference data file name to be referred to is stored.

The illustrated example is an example in which the mounting conditions of the three components 27a to 27c are the same. In this case, the specific data for each of the components 27a to 27c is stored as the reference data file 42c. .

FIG. 5 shows a teaching procedure when the reference data file 42 of the configuration example shown in FIG. 3 is generated. First, in step 1 of the figure, the operator operates the keyboard 22 to register the name of a board to be taught, and inputs a board size by key. In step 2, the reference board 1S is stored in the Y-axis table section. 4. Set on top and press the start key. Next, in step 3, the origin of the reference substrate 1S and the upper right and lower left corners are taken by the imaging unit 6
After inputting the actual size of the reference substrate 1S according to the position of each point, the control unit 19 controls the X-axis table unit 3 and the Y-axis table unit 4 based on the input data to initialize the reference substrate 1S. Position to position.

The reference substrate 1S has a good mounting quality in which a predetermined component 2S is properly soldered to a component mounting position. When the reference substrate 1S is positioned at an initial position, the following process is performed. In step 4, the imaging unit 6 causes the component 2S on the reference board 1S to be imaged.

In the next step 5, it is determined whether to teach the specific data of the component 2S in window units or in component units. If the determination in step 5 is "YES", the process proceeds to step 7. Then, an image of the mounting position of the component 2S is captured, and the basic data of the component is taught.

In the next step 8, it is determined whether or not there is an available reference data file, that is, specific data that has been taught, for the window of this component set in step 7, and this determination is "YES". Then, in the next step 9, the corresponding reference data file 42 is designated, and its file name is stored in the basic data file 41 as basic data.

If the determination in step 8 is "NO", that is, if there is no usable reference data file, in step 10, the characteristic parameters are extracted from the captured image in this window, and the like. The specific data including the parameters is stored in a new reference data file 42.
To be stored.

In the next step 11, it is determined whether or not the teaching procedure of the specific data has been completed for all the windows of the component 2S. If this determination is "NO", the process returns to the step 8, and the process returns to the next window. The procedure of step 9 or 10 is executed again.

On the other hand, when step 5 is "NO",
That is, when teaching is performed on a component-by-component basis, the position, orientation, characteristic parameters, and the like of the component are extracted from the captured image of the component 2S, and all the inspection data are stored in the basic data file 41.

Similarly, when the teaching operation for all the components of the reference board 1S is completed, the determination in step 12 becomes "YES" and the process proceeds to step 13, where the taught basic data file 41 and the reference data After the determination data file 40 including the file 42 is stored in the teaching table 14, the teaching ends.

FIG. 6 shows the procedure of the correction teaching for correcting the taught inspection data, and FIG. 7 shows the procedure of FIG. 6. Each procedure will be described below with reference to the actual example shown in FIG.

First, in step 1, the name of the board to be corrected is input, and in step 2 the reference board 1S is loaded onto the Y-axis table 4 and positioned.
Next, a window to be modified, for example, FIG.
When the specific data is to be corrected for one window W2b set in one of the components 27b shown in FIG. Is determined. If the judgment is "NO"
If so, as shown in FIG. 7B, the modified specific data is stored as a new reference data file 42b, and the file name in the basic data is changed to a new file name (step 4).

If the determination in step 3 is "YES", that is, if the reference data file storing the specific data to be corrected already exists, the file name in the basic data is changed to the name of the corresponding reference data file. The inspection data is corrected by changing the file name (step 5).

For example, if two parts 2 shown in FIG.
7a, 27b, three windows W1a, W2a, W1
Assuming that the inspection data for b is changed to inspection data for the remaining window W2b, in this case, three windows W1a, W1a,
The file names of W2a and W1b are converted from the file names of the reference data file 42a to the reference data file 4
It is only necessary to change the file name to 2b.

When all the windows on the reference substrate 1S have been corrected in this way, the result of step 6 is "YES", the substrate is carried out, and the correction teaching ends (step 7).

FIG. 8 shows a teaching procedure when the reference data file 42 of the configuration example shown in FIG. 4 is generated. Also in this case, after the same procedure as in steps 1 to 4 of FIG. 5 is executed in steps 1 to 4, teaching of basic data is performed in step 5.

At the next step 6, it is determined whether or not there is a usable reference data file 42. If the determination is "YES", the corresponding reference data file 42 is designated at step 7. Are stored in the basic data file 41. If the determination in step 6 is "NO", the characteristic data including the characteristic parameters is stored as a new reference data file 42 by, for example, extracting characteristic parameters from the captured image of the component 2S in step 8.

When the teaching operation is completed for all the parts 2S on the reference board 1S, step 9 becomes "YES" and the routine goes to step 10, where the created judgment data file 40 is stored in the teaching table 14. ,
End teaching.

The procedure of the correction teaching in the second embodiment is the same as that of FIG. 7 described above for each part, and the description thereof is omitted here.

FIG. 9 shows the procedure of the automatic inspection. In steps 1 and 2 in FIG. 9, the name of the substrate to be inspected is selected and the operation of starting the substrate inspection is performed. In the next step 3, the supply of the board 1T to be inspected to the mounted component inspection apparatus is checked, and if the determination is "YES", the conveyor 8 operates and the board 1T to be inspected is carried into the Y-axis table 4. (Step 4).

In the next step 5, the control unit 19 controls the X-axis table unit 3 and the Y-axis table unit 4,
After positioning the field of view of the imaging unit 6 with respect to the first component 2T on the substrate 1T to be inspected and performing imaging, the basic data relating to the component 2T is read from the basic data file 41 and read in each window of the inspection component 2T. Area is automatically extracted, and it is determined whether or not the specific data for this window is stored with reference to any of the reference data files 42 (step 6).

When the determination in step 6 is "YES", the control section 19 reads the file name of the reference data file 42 stored for this window from the basic data file 41, and then reads the reference data file corresponding to this file name. The data file 42 is read. Further, the control unit 19
An inspection is executed by calculating the characteristic parameters from the captured image and transferring the calculated characteristic parameters to the determination unit 16 and comparing the inspected data file with the specific data stored in the reference data file (step 7).

On the other hand, if the determination in step 6 is "NO", it means that all the inspection data is stored in the basic data file 41, and the determination unit 16 determines each characteristic parameter obtained from the captured image with each characteristic parameter. Basic data file 41
The inspection is executed by comparing the data with the inspection data inside (step 8).

When either of the steps 7 and 8 is performed for all windows set for the component 2T to be inspected, step 9 becomes "YES" and the process goes to step 10, where each window of the component 2T is set. Along with the inspection result, the quality of the mounting quality of the entire component 2T such as the mounting position and the mounting direction of the component is determined.

The procedure of steps 6 to 10 is repeatedly executed for all components 2T on the substrate 1T to be inspected. As a result, if any component has a defect, step 1 is executed.
2 becomes "YES", and the defective component and the content of the defect are displayed on the display unit 20 or printed on the printer 21, and then the inspection target board 1T is carried out from the observation position (steps 13 and 14). Thus, when the same inspection procedure is performed for all the substrates to be inspected 1T, the determination in step 15 becomes “YES”, and the inspection is completed.

[0061]

As described above, according to the present invention, individual inspection data is created for each different mounting condition , and identification data indicating inspection data necessary for inspection of the component is set for each component. So that it is mounted under the same mounting conditions
It is not necessary to individually teach or correct the inspection data for the component thus performed, and the teaching operation can be simplified. On the other hand, for components mounted under different mounting conditions, it is possible to individually teach inspection data suitable for the inspection, and it is possible to set an environment in which a detailed and highly accurate inspection can be performed.

[0062] In the present invention of claim 2, since the individual inspection data for each inspection area mounting conditions in common is set, for the component is a part of the same component type to be mounted in different mounting conditions, other Mounted under the same mounting conditions as the parts
For the inspection area corresponding to the part , the common inspection data was used and mounted under different mounting conditions than other parts .
It is only necessary to create individual inspection data only for the inspection area corresponding to the part, so that efficient and highly accurate teaching can be performed. The invention of claim 3, the real
Since an individual inspection area is set for each component having the same mounting condition, the teaching operation can be greatly simplified when a plurality of components of the same component type are mounted under the same mounting conditions.

Further, according to a fourth aspect of the present invention, there is provided a component inspection system.
The inspection device has the inspection data created by the above method and
The memory in which the identification data is registered, and the reference data
Reads the inspection data required for inspection for each part based on
Determining means for determining whether the mounting state is appropriate
From each component to the detailed and high
Inspection of accuracy can be performed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of a mounted component inspection device.

FIG. 2 is an explanatory diagram showing the relationship between the quality of a soldering state and a pattern.

FIG. 3 is an explanatory diagram illustrating a data configuration of a determination data file.

FIG. 4 is an explanatory diagram showing another data configuration of a determination data file.

FIG. 5 is a flowchart showing a teaching procedure.

FIG. 6 is a flowchart illustrating a procedure of a correction teaching.

FIG. 7 is an explanatory diagram showing a change in the relationship between a window and a reference data file due to correction teaching.

FIG. 8 is a flowchart showing a teaching procedure in the second embodiment.

FIG. 9 is a flowchart showing a procedure of an automatic inspection.

[Explanation of symbols]

 1S Reference board 1T Inspection board 7 Control processing unit 14 Teaching table 19 Control unit 40 Judgment data file 42 Reference data file W1a, W2a, W1b, W2b Window

Continuation of front page (72) Inventor Norihito Yamamoto 24th Yamanouchi Yamanoshitamachi, Ukyo-ku, Kyoto City Omron Life Science Research Institute, Inc. (56) References JP-A-6-34561 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) G01N 21/84-21/958

Claims (4)

(57) [Claims] 1. A method for making a test data required by the image obtained substrate was captured for inspecting the mounting quality of a plurality of components mounted on the substrate, for different mounting conditions An inspection data creation method, wherein inspection data is created in accordance with each mounting condition , and identification data indicating inspection data necessary for inspection of each component is set for each component. 2. The board is a board on which a plurality of components of the same component type are mounted, and among inspection areas set for each component, individual inspection data is provided for each inspection area having a common mounting condition. The inspection data creating method according to claim 1, wherein the inspection data creating method is created. 3. The inspection according to claim 1, wherein the substrate is a substrate on which a plurality of components of the same component type are mounted, and individual inspection data is created for each component having a common mounting condition. Data creation method. 4. An image obtained by imaging the substrate,
The mounting component inspection apparatus for inspecting the mounting quality of a plurality of components mounted on a substrate, and the inspection data created in accordance with the mounting condition respectively for different mounting conditions, the components respectively for each component A memory in which identification data indicating inspection data necessary for inspection is registered; and for each component on the board, read out inspection data required for inspection of the component based on the identification data, and mount the component. A mounted component inspection apparatus comprising: a determination unit configured to determine whether a state is appropriate.