JP3189440B2 - Teaching method of mounted component inspection device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounted on, for example, a printed circuit board (hereinafter simply referred to as a "substrate").
The present invention relates to a mounted component inspection apparatus used for inspecting the quality of soldering after soldering, and more particularly, the present invention relates to a plurality of components mounted on a board, and (Hereinafter referred to as “mounting quality”).

[0002]

2. Description of the Related Art Conventionally, visual inspection has been performed to inspect the mounting quality of mounted components on a substrate to be inspected (the components before soldering and those after soldering are collectively referred to as “mounting”). Have been done. However, in this kind of visual inspection, occurrence of an inspection error is unavoidable, the inspection result varies depending on the inspected person, and the inspection processing capacity is limited.

[0003] In recent years, a mounted component inspection apparatus has been put to practical use for automatically inspecting the mounting quality of a board on which a large number of components are mounted using image processing technology. When using this mounting component inspection device, prior to inspection, teach the mounting component inspection device for each type of board, such as what position on the board to be inspected, what components are mounted, and how. There is a need to. This teaching operation is generally called "teaching".

[0004] Information relating to inspection of component mounting quality (hereinafter referred to as "inspection data") includes information (such as shape, length, and width) on lands on a board to which each component is to be soldered, and an inspection area. In addition to information on the window to be set (shape, size, etc.), information on feature parameters (hue, brightness, etc.) indicating the soldering state on the land, etc., judgment criteria for judging pass / fail of the feature parameters, etc. Information on the position of the inspection visual field, such as how to allocate the inspection visual field to the target area, and information on the inspection order, in which order each component in the inspection target area is inspected, are also included.

FIG. 11 shows a conventional method for teaching information on the position of the inspection visual field and the inspection order. In the figure, reference numeral 35 denotes an inspection target area on a reference board for teaching,
Many parts 31 exist in this area.

First, the relative position of the image pickup device with respect to the reference substrate is determined so that the inspection visual field 30 by the image pickup device is located at the lower left origin position (indicated by a dotted line in the figure). Scan relative to the inspection field of view. The relative position of the imaging device with respect to the reference substrate can be freely set by appropriately driving the X-axis table for moving the imaging device in the X-axis direction and the Y-axis table for moving the reference substrate in the Y-axis direction.

The image in the inspection visual field 30 is displayed on a monitor, and the operator scans the inspection visual field 30 while watching the monitor image until the target component 31 enters the inspection visual field 30. When the parts 31 enter the inspection field of view 30, the operator can as many parts 31 as possible within the inspection field of view 30.
Finely adjust the position of the inspection visual field so that is included. Thereafter, when a setting operation is performed by the operator, the position of the inspection visual field, that is, the position data of the X-axis table unit and the Y-axis table unit and the inspection order (in this case, the inspection order is “1”) are displayed on the mounting component inspection apparatus. Taught.

Next, the operator searches for the nearest component 31 on the monitor image, scans the inspection field 30 until the component 31 enters the inspection field 30, and executes the same procedure. In this way, an inspection field of view for inspecting all components is allocated, and an inspection order is determined for each component.

[0009]

However, in such a teaching method, the operator sets the inspection field of view and the inspection position so that the moving distance of the inspection field does not become long and that the inspection field contains a large number of components efficiently. Since it is necessary to determine the order by itself, not only skill is required for the teaching operation, but also the efficiency of the teaching operation is low, and the work load on the operator becomes extremely large.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problem, and a teaching method of a mounted component inspection apparatus capable of efficiently performing a teaching operation on a position of an inspection field of view and an inspection order without a skilled person. Therefore, it is an object of the present invention to significantly reduce an operator's work load associated with this kind of teaching work.

[0011]

According to the present invention, there is provided a teaching method for instructing a mounted component inspection apparatus on a position of an inspection visual field and an inspection order for all components in an inspection target area on a substrate. A circumscribed rectangle including all the components in the area is obtained, and the inspection visual field is scanned from any corner point of the circumscribed rectangle in a direction along one side of the circumscribed rectangle to search for a component. When the inspection is performed, the inspection field including the part and its peripheral parts is determined and the position and the inspection order are taught. A circumscribed rectangle including all parts except for the part is newly obtained, and scanning along one side of the circumscribed rectangle is continued from a corner point of the next circumscribed rectangle close to the scan completion position.

[0012]

The circumscribed rectangle including all the parts except for the already-taught parts is obtained, and the position of the inspection visual field and the inspection order are taught while scanning the inspection visual field in accordance with the circumscribed rectangle. Can be efficiently performed.

[0013]

FIG. 1 shows the overall configuration of a mounted component inspection apparatus. This mounted component inspection apparatus includes a feature parameter of an inspection area of each component 2S on the reference board 1S obtained by imaging the reference board 1S having good mounting quality,
The X-axis table unit 3 is used to inspect the mounting quality of each component 2T by comparing the characteristic parameter of the inspection area of each component 2T on the substrate 1T to be inspected obtained by imaging the T. , A Y-axis table unit 4, a light projecting unit 5, an imaging unit 6, a control processing unit 7, and the like.

Each of the X-axis table section 3 and the Y-axis table section 4 includes a motor (not shown) that operates based on a control signal from a control processing section 7, and the X-axis table section is driven by driving these motors. The unit 3 moves the imaging unit 6 in the X-axis direction, and the Y-axis table unit 4 controls the substrates 1S and 1T.
Is moved in the Y-axis direction.

The light projecting unit 5 includes three annular light sources 9, 10, and 11 having different diameters and simultaneously irradiating red light, green light and blue light based on a control signal from the control processing unit 7. The light sources 9, 10, 11 are centered on the position directly above the observation position and are positioned in directions corresponding to different elevation angles as viewed from the observation position.

In this embodiment, each of the light sources 9, 10, and 11 has a structure in which a red, green, and blue colored transparent plate is covered with a white light source.
Three annular color fluorescent lamps or neon tubes that respectively generate green light and blue light may be used.

The image pickup section 6 is a color television camera, and is positioned downward just above the observation position. As a result, the reflected light from the surfaces of the substrates 1S and 1T to be observed is imaged by the imaging unit 6, converted into three primary color signals R, G, and B and supplied to the control processing unit 7.

The control processing unit 7 includes an A / D conversion unit 12,
Memory 13, teaching table 14, image processing unit 1
5, a determination unit 16, an XY table controller 17, an imaging controller 18, a control unit 19, a display unit 20, a printer 21, a keyboard 22, a floppy disk device 23, and the like. , And detects characteristic parameters such as hue and lightness in the inspection area of each component 2S in a good mounting state to create a judgment data file.

In the inspection mode, the control processing unit 7 processes the color signals R, G, and B for the substrate 1T to be inspected, and outputs red, green, and blue for the inspection area of each component 2T on the substrate 1T to be inspected. Each hue pattern is detected, feature parameters are generated, and an inspection data file is created. Then, the inspection data file is compared with the determination data file, and from the comparison result, the mounting quality such as the quality of soldering of each component 2T on the inspection substrate 1T is automatically determined.

FIG. 2 shows the cross-sectional form of the solder 25 when the soldering is good, when the component is missing, and when the solder is insufficient, the imaging pattern by the imaging unit 6 and the red pattern in each case. , A green pattern, and a blue pattern in a list, and a clear difference appears between any of the hue patterns, so that it is possible to determine the presence or absence of components and the quality of soldering.

Returning to FIG. 1, the A / D converter 12 converts the color signals R, G, B from the imaging unit 6 into digital signals and outputs them to the control unit 19. The memory 13 includes a RAM and the like, and is used as a work area of the control unit 19.
The image processing unit 15 performs image processing on the image data supplied via the control unit 19 to create the inspection data file and the determination data file.
Supply to 6.

The teaching table 14 stores the judgment data file supplied from the control unit 19 during teaching, and stores the judgment data file in response to the request when the control unit 19 outputs a transfer request during inspection. This is read and supplied to the control unit 19, the determination unit 16, and the like.

The judging section 16 compares the judgment data file supplied from the control section 19 at the time of inspection with the data file to be inspected transferred from the image processing section 15, and determines each part 2T of the substrate 1T to be inspected. The quality of the soldering state is determined, and the determination result is output to the control unit 19.

The image pickup controller 18 has an interface for connecting the control section 19 to the light projecting section 5 and the image pickup section 6, and adjusts the light amounts of the light sources 9 to 11 of the light projecting section 5 based on the output of the control section 19. And controls to maintain the mutual balance of each hue light output of the imaging unit 6.

The XY table controller 17 controls the controller 1
An interface for connecting the X-axis table unit 9 to the X-axis table unit 3 and the Y-axis table unit 4 is provided, and the driving of the X-axis table unit 3 and the Y-axis table unit 4 is controlled based on the output of the control unit 19.

When image data, inspection results, key input data, and the like are supplied from the control unit 19, the display unit 20
This is displayed on the display screen, and when the inspection result or the like is supplied from the control unit 19, the printer 21 prints this out in a predetermined format.

The keyboard 22 is used for operating information and the reference board 1.
There are provided various keys necessary for inputting data relating to S and the substrate 1T to be inspected, and key input data is supplied to the control unit 19. The control unit 19 includes a microprocessor and the like, and is described later with reference to FIGS.
The operation of the mounted component inspection apparatus in teaching and inspection is controlled according to the control procedure shown in FIG.

FIG. 3 shows a control procedure by the control unit 19 for teaching information other than the information on the position of the observation field of view and the inspection order in the inspection data from step 1 (indicated by "ST1" in the figure) to Indicated by ST7. First, in step 1 of the figure, the operator operates the keyboard 22 to register the name of the board to be taught, and inputs the board size by key, and then in step 2 the mounting quality of each component is good. The reference substrate 1S is set on the Y-axis table 4 and the start key is pressed.

Next, in Step 3, the origin and the upper right and lower left corners of the reference substrate 1S are imaged by the imaging unit 6 and the actual size of the reference substrate 1S is input according to the position of each point. X-axis table unit 3 based on input data
Then, the reference substrate 1S is positioned at the initial position by controlling the Y-axis table unit 4.

When the reference board 1S is positioned at the initial position, the imaging unit 6 takes an image of the area on the reference board 1S in the next step 4 and teaches the mounting position of the first component 2S. Inspection data is generated from the image of the component 2S and taught. Note that the inspection data may be stored in advance in a table for each component type, and at the time of teaching, the inspection data of the corresponding component may be read from the table and used.

When the same procedure is repeatedly executed for all the components on the reference board 1S, the determination in step 6 becomes "YES" and the process proceeds to step 7, and
A judgment data file necessary for inspecting the substrate to be inspected 1T is created from the teaching data created in step 5 and stored in the teaching table 14.

After the above teaching procedure is completed, the process proceeds to a teaching operation for teaching information on the position of the inspection visual field and the inspection order to the mounted component inspection apparatus. FIG. 4 shows an outline of a control procedure of the control unit 19 in the teaching operation, and FIG. 5 shows details of step 3 in FIG.

First, in steps 1 and 2 in FIG. 4, the name of the board to be taught is input and the reference board 1S is loaded onto the Y-axis table section 4. In step 3, the inspection field of view by the imaging device is performed. Of the position and the inspection order are taught. This teaching data is stored in the teaching table 1
4 is stored. When the assignment of the inspection visual fields has been completed for all components on the reference substrate 1S, the determination in step 4 becomes "YES", and the reference substrate 1S is
Then, the teaching is completed (step 5).

In step 3 of FIG. 4, first, in FIG.
In step 3-1 of FIG. 6, the control unit 19
After setting a circumscribed rectangle 36 including all the components 37 in the inspection target area 35 on the reference board 1S as shown in (3), scanning of the lower left corner of the circumscribed rectangle 36 is started in the next step 3-2. An inspection field 30 is set as a point.

Next, the X-axis table unit 3 is driven to move the imaging unit 6 in the positive direction of the X-axis, thereby moving the inspection visual field 30 along the lower side of the circumscribed rectangle 36 in the rightward direction in FIG. To search for any part 37 (step 3
-3, 3-4). When the part 37 enters the inspection visual field 30 as shown in FIG. 6 (2), the determination in step 3-4 becomes "YES", and the control unit 19 proceeds to the next step 3-5.
Then, the X-axis table unit 3 and the Y-axis table unit 4 are driven to finely adjust the position of the inspection visual field 30.

FIG. 6C shows a specific method of the fine adjustment by the control unit 19. First, when the part 37 enters the inspection visual field 30 (FIG. 6 (3) a), the inspection visual field 30 is moved rightward so that the part 37 is located at the left end in the inspection visual field 30. By moving the inspection visual field 30, FIG.
(3) As shown in (b), when the whole of the nearby component 38 and a part of the other nearby component 39 enter the inspection visual field 30, the inspection is performed so that the component 39 is completely in the inspection visual field 30. The visual field 30 is moved upward (FIG. 6C).

When the position of the inspection field 30 is determined in this way, the position of the inspection field 30 and the inspection order for the three parts 37, 38, and 39 are taught, and then these parts 37, 38, and 39 are set. It is excluded from the subsequent teaching targets as being taught (steps 3-6, 3-7). FIG. 7A shows a state immediately after the teaching, and the parts excluded from the teaching target are deleted from the drawing as not existing in the inspection target area 35.

In the next step 3-8, the inspection visual field 30
Has been determined whether the rightward scanning of the right has not reached the right side of the circumscribed rectangle 36, and if the determination is "YES",
Returning to step 3-3, the scanning is further continued. When the position of the inspection visual field 30 reaches the position shown in FIG. 7 (2), a new part 40 enters the inspection visual field 30, and step 3─4 becomes “YES”, and is exemplified in FIG. 7 (3). The position of the inspection visual field 30 is finely adjusted in such a manner as to perform the above.

First, when the component 40 enters the inspection visual field 30 (FIG. 7 (3) a), the inspection visual field 30 is moved rightward so that the component 40 is located at the left end of the inspection visual field 30. As a result of the movement of the inspection field 30, as shown in FIG. 7 (3) b, when a part of the nearby component 41 enters the inspection field 30, the inspection field 30 is then moved to the lower left of the inspection field 30. Is moved upward, and the part 41 is moved upward.
Is completely taken into the inspection visual field 30 (FIG. 7C).
Next, the inspection visual field 30 is slightly moved downward so that the two components 40 and 41 are well-balanced in the inspection visual field 30 (FIG. 7D).

When the next set position of the inspection visual field 30 is determined in this way, the position of the inspection visual field 30 and the inspection order for the two components 40 and 41 are taught, and then,
These parts 40 and 41 are excluded from the subsequent teaching targets as being taught (steps 3-6 and 3-7).

Thereafter, as a result of the same procedure being repeatedly executed, when the scanning of the inspection visual field 30 reaches the right side of the circumscribed rectangle 36, step 3-8 becomes "NO", and the control unit 19 proceeds to the next step 3-9. It is determined whether or not an untaught component remains in the inspection target area 35. This judgment is "YE
If "S", the process proceeds to step 3-10, where the control unit 19
As shown in FIG. 8, after newly setting a circumscribed rectangle 36 including all the parts except for the taught parts, the lower right corner point of the circumscribed rectangle 36 is scanned in the next step 3-11. The inspection visual field 30 is set as a continuation start point.

Next, the X-axis table unit 3 is driven to move the imaging unit 6 in the negative direction of the X-axis direction, thereby moving the inspection visual field 30 to the left in FIG. 8 along the lower side of the new circumscribed rectangle 36. Scan to search for any part (step 3-1)
2, 3-13). If any part enters the inspection visual field 30, the determination in step 3-13 becomes "YES", and the control unit 19 determines in step 3-14 that the X-axis table unit 3
Then, the Y-axis table unit 4 is driven to finely adjust the position of the inspection visual field 30 in the same manner as described above.

When the set position of the inspection visual field 30 is determined by the fine adjustment, the position of the inspection visual field 30 and the inspection order for the components in the inspection visual field 30 are taught, and the part is excluded from the teaching target as being taught. (Step 3-1
5, 3-16).

In the next step 3-17, the inspection visual field 3
It is determined whether the left scanning position of 0 has not reached the left side of the circumscribed rectangle 36. If the determination is "YES", the process returns to step 3-12 to continue the scanning.

Thereafter, as a result of the similar procedure being repeatedly executed, when the scanning of the inspection visual field 30 reaches the left side of the circumscribed rectangle 36, step 3-17 becomes "NO", and the control section 19 proceeds to the next step 3-18. It is determined whether or not an untaught component remains in the inspection target area 35. This judgment is "Y
If "ES", the process proceeds to step 3-19, where the control unit 19
Is the circumscribed rectangle 3 including all parts except the taught parts.
After newly setting 6, the process returns to the step 3-2, and
The scanning along the lower side of the circumscribed rectangle 36 is continuously started from the lower left corner point of the circumscribed rectangle 36.

Thereafter, the same procedure is repeatedly executed. As a result, step 3 # 9 or step 3 # 18 returns “NO”.
Then, the teaching operation of the information on the position of the inspection visual field 30 and the inspection order is completed. FIG. 9 shows the set positions of the inspection visual field 30 assigned to all the parts obtained by executing the above teaching procedure.

In this embodiment, the scanning of the inspection visual field 30 is first continued in the positive direction of the X-axis direction, and then in the negative direction of the X-axis direction. However, the present invention is not limited to this. The scanning may be continued in the negative direction of the Y-axis direction. Further, the scanning of the inspection visual field 30 can be continued in the positive direction of the X-axis direction, then in the positive direction of the Y-axis direction, then in the negative direction of the X-axis direction, and then in the negative direction of the Y-axis direction.

FIG. 10 shows a control procedure of the automatic inspection by the control unit 19. In steps 1 and 2 of the drawing, a board name to be inspected is selected and a board inspection start operation is performed. In the next step 3, the supply of the board to be inspected 1T to the mounted component inspection apparatus is checked. If the determination is "YES", the conveyor 8 is operated, the substrate 1T to be inspected is carried into the Y-axis table 4, and automatic inspection is started (steps 4 and 5).

In step 5, the control unit 19 controls the X-axis table unit 3 and the Y-axis table unit 4 to position the field of view of the imaging unit 6 with respect to the first component 2T on the board 1T to be inspected, and perform imaging. Is performed, and each land area in the inspection area is automatically extracted, and a characteristic parameter of each land area is calculated to create an inspection data file. Next, the control unit 19 compares the inspected data file with the determination data file to determine the mounting quality of the first component 2T, such as the quality of soldering.

Such an inspection is repeatedly executed for all the components 2T on the substrate 1T to be inspected. As a result, if there is a soldering failure or the like, the determination in step 6 becomes “YES”, and the defective component and the content of the failure are determined. Is displayed on the display unit 20 or printed on the printer 21, and then the substrate 1T
Is carried out from the Y-axis table unit 4 (step 7,
8). Thus, the same inspection procedure is performed for all the inspected substrates 1T.
Is executed, the determination in step 9 becomes “YES”, and the inspection is completed.

[0051]

As described above, according to the present invention, a circumscribed rectangle including all parts except for the taught parts is obtained, and the set position of the inspection visual field and the inspection order are taught while scanning the inspection visual field according to the circumscribed rectangle. Even if you are not an expert,
This type of teaching work can be performed efficiently, and there is an effect that the work load on the operator can be greatly reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an overall configuration of a mounted component inspection device.

FIG. 2 is an explanatory diagram showing the relationship between the quality of a soldering state and a pattern.

FIG. 3 is a flowchart showing a procedure for teaching information other than information relating to the position of the inspection visual field and the inspection order.

FIG. 4 is a flowchart showing a teaching procedure of information on a position of an inspection field and an inspection order.

FIG. 5 is a flowchart showing a detailed procedure of step 3 in FIG. 4;

FIG. 6 is an explanatory diagram for explaining the teaching procedure of FIG. 5 step by step;

FIG. 7 is an explanatory diagram for explaining the teaching procedure of FIG. 5 step by step;

FIG. 8 is an explanatory diagram for explaining the teaching procedure of FIG. 5;

FIG. 9 is an explanatory diagram showing a setting result of an inspection visual field.

FIG. 10 is a flowchart showing an inspection procedure.

FIG. 11 is an explanatory view showing a conventional method of teaching the position of the inspection field and the inspection order.

[Explanation of symbols]

 1S reference board 3 imaging unit 7 control processing unit 14 teaching table 19 control unit 30 inspection field of view 35 inspection target area 36 circumscribed rectangle

────────────────────────────────────────────────── (5) References JP-A-3-210411 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01B 11/00-11/30 102 G01N 21 / 84-21/958 H01L 21/64-21/66 H05K 3/32-3/34 512 H05K 13/08

Claims (1)

(57) [Claims] 1. A teaching method for instructing a mounted component inspection apparatus on a position of an inspection field and an inspection order for all components in an inspection target area on a substrate, the method including all components in the inspection target area. Obtain a circumscribed rectangle, scan the inspection field of view from any corner of the circumscribed rectangle in a direction along one side of the circumscribed rectangle, search for a part, and when any part is searched, the part and its When the inspection field including the peripheral components is determined, the position and the inspection order are taught, and when scanning in the same direction is completed while performing the same teaching procedure, all components except the taught components are included. A method for teaching a mounted component inspection apparatus, wherein a circumscribed rectangle is newly obtained, and scanning along one side of the circumscribed rectangle is continued from a corner point of the next circumscribed rectangle close to the scan completion position.