JPS61243303A - Visual inspection system for mounted substrate - Google Patents
Visual inspection system for mounted substrateInfo
- Publication number
- JPS61243303A JPS61243303A JP8448585A JP8448585A JPS61243303A JP S61243303 A JPS61243303 A JP S61243303A JP 8448585 A JP8448585 A JP 8448585A JP 8448585 A JP8448585 A JP 8448585A JP S61243303 A JPS61243303 A JP S61243303A
- Authority
- JP
- Japan
- Prior art keywords
- board
- substrate
- component
- mounting
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
Abstract
Description
【発明の詳細な説明】 (技術分野) 本発明はプリント基板上に実装された電子部品。[Detailed description of the invention] (Technical field) The present invention relates to an electronic component mounted on a printed circuit board.
特に角形チップ部品やフラットパックICなどの面付部
品の実装位置精度を検査する外観検査装置の改良に関す
るものである。In particular, the present invention relates to improvements in visual inspection equipment for inspecting the mounting position accuracy of surface-mounted components such as square chip components and flat pack ICs.
(従来技術とその問題点)
プリント基板への部品実装は最近ますます高密度化I一
つつあり、実装形態も従来のリード付き部品を用(・た
リード挿入形態から、チップ部品やクラットパック形I
Cなどを用いた面付形態に移行する傾向が強い。ところ
で、一般にリード部品の自動挿入機は部品挿入時に9挿
入ミスがあったか否かを容易に検出できるのに対し9面
付部品の自動搭載機は部品搭載直後に、その搭載位置の
ずれ。(Conventional technology and its problems) The density of component mounting on printed circuit boards has recently become higher and higher, and the mounting format has changed from the conventional lead insertion format to chip components and crack pack type. I
There is a strong tendency to shift to an imposition format using C or the like. By the way, in general, an automatic lead component insertion machine can easily detect whether or not there is a 9-sided insertion error when inserting a component, whereas an automatic 9-sided component mounting machine can detect a shift in the mounting position immediately after mounting the component.
あるいは搭載姿勢に異常が生じた事を検出するのは困難
である。このため9面付部品の搭載後は通常、目視等を
用いた実装位置の外観検査が行われており、基板の高密
度化と共にその必要性はより強くなっている。Alternatively, it is difficult to detect that an abnormality has occurred in the mounting position. For this reason, after mounting a nine-sided component, an external appearance inspection of the mounting position is usually performed using visual inspection or the like, and the need for this is becoming stronger as boards become more densely packed.
このように目視検査は作業者に極度の疲労を与えるだけ
でなく9作業ミスも多発する傾向にあるため、これを機
械化する努力も行われて来た。その一つの例として、第
2図に示したビデオコンパレータ式のチップ部品実装基
板外観検査装置がある。この装置は2組の照明器23お
よびTVカメラ2工を用い、このうちの一方21−aで
良品基板1−aの映像を入力し、他方21−bで被検査
基板1−すの同位置の映像を入力した上で、コンバレー
タ25でこれら二つの映像の差異を調べるものである。As described above, visual inspection not only causes extreme fatigue to workers, but also tends to lead to frequent operational errors, so efforts have been made to mechanize this inspection. One example is a video comparator-type chip component mounting board appearance inspection apparatus shown in FIG. This device uses two sets of illuminators 23 and two TV cameras, one of which 21-a inputs the image of the good board 1-a, and the other 21-b inputs the image of the board 1-a to be inspected at the same position. After inputting the two images, the comparator 25 examines the difference between these two images.
この結果、もし被検査基板に部品実装ミスがあれば、そ
の部分に関する映像レベルの差異が顕著となり、これを
TVモニタ(図示せず)上に表示することによって外観
検査を容易に行え、あるいは信号処理回路(図示せず)
等を介して外部に出力する事により、外観検査を自動化
することができる。またTVカメラの視野が狭い場合は
xyテーブル30等によって基板を一定値づつ移動しな
がら検査を続行すればよ(・oしかし、この装置には以
下の欠点があった。As a result, if there is a component mounting error on the board to be inspected, the difference in the image level for that part will become noticeable, and by displaying this on a TV monitor (not shown), visual inspection can be easily performed, or signal Processing circuit (not shown)
Visual inspection can be automated by outputting to the outside via etc. In addition, if the field of view of the TV camera is narrow, the inspection can be continued while moving the board by a constant value using an xy table 30 or the like (・oHowever, this device had the following drawbacks.
(1)チップ部品の種類によっては背景となる基板とチ
ップ部品の映像的なコントラストが得られず9位置ずれ
検出が困難である。(1) Depending on the type of chip component, it may not be possible to obtain a visual contrast between the background substrate and the chip component, making it difficult to detect positional deviation.
(2)実装位置ずれの基準があくまでも良品基板であり
、これに完全性を要求することが困難であるため9位置
ずれ検出精度に限界がある。(2) The standard for mounting positional deviation is a good board, and it is difficult to require perfection from this, so there is a limit to the accuracy of detecting positional deviation.
(3)2台のTVカメラの視野の大きさや相対的な位置
、姿勢関係を正確に合わせる必要があり。(3) It is necessary to accurately match the field of view size, relative position, and posture of the two TV cameras.
調整がわずられしい。Adjustment is difficult.
(目的)
本発明はこれらの欠点を除去し、基板の状態にかかわら
ず9面付部品の実装位置を正確に検出することが可能な
認識方式を提供するものである。(Objective) The present invention eliminates these drawbacks and provides a recognition method capable of accurately detecting the mounting position of a nine-sided component regardless of the state of the board.
同時に本発明の他の目的は9面付部品の実装位置ずれ検
出の基準を基板実装設計パターン自体から与える事によ
り1位置ずれ検出精度を向上する事にある。At the same time, another object of the present invention is to improve the accuracy of detecting deviation in one position by providing a standard for detecting deviation in mounting position of a nine-sided component from the board mounting design pattern itself.
(実施例)
本発明の基本原理を説明する前に、まず前記の方式は条
件によって面付部品の位置認識が困難である理由を第3
図、第4図および第5図を用いて説明する。第3図は撮
像部分のモデルを示したものであり、lは基板、10は
基板上に実装された面付部品、21はTVカメラ、22
はカメラ用拡大レンズ、また23は照明器たとえばリン
グ状ライトを示す。一方、第4図は面付部品の一例であ
る角形チップ部品をモデル的に示したものであり、(a
)は上面、(b)は側面、また(c)は裏面を示して(
・る。図において11はセラミックの基材であり、12
は本体部。(Example) Before explaining the basic principle of the present invention, let us first explain the third reason why it is difficult to recognize the position of surface-mounted parts in the above method depending on the conditions.
This will be explained using FIGS. 4 and 5. FIG. 3 shows a model of the imaging part, where l is a board, 10 is a surface-mounted component mounted on the board, 21 is a TV camera, and 22
Reference numeral 23 indicates a magnifying lens for a camera, and 23 indicates an illuminator, such as a ring-shaped light. On the other hand, FIG. 4 shows a model of a square chip component, which is an example of a surface-mounted component.
) shows the top surface, (b) shows the side surface, and (c) shows the back surface (
・Ru. In the figure, 11 is a ceramic base material, and 12
is the main body.
また13は金属性の電極部である。このようなチップ部
品は条件によって上面(a)または裏面(C)のいずれ
かが上側になるように基板上に実装される。次にこのよ
うなチップ部品あるいは基板自体を第3図のような状態
でTVカメラで撮像した時の映倫信号レベルを示すと第
5図のようになる。第5図の横軸はレンズの絞り、言い
換えればTVカメラから見た対象の明るさを示している
。第5図においてCで示したのはチップ部品である。C
1はセラミック部分であり白色であるため映像信号レベ
ルが非常に高(・。しかしチップ部品の本体部は部品に
よって種々の色彩のものがあり、たとえばうす茶の場合
はC2,黒色の場合はC1とレベルに大きな相異がある
。また電極部分は斜線部C8で示したようにレベルのば
らつきが非常に太き(・。これは電極部がやや鏡面的な
反射特性を有すると同時に。Further, 13 is a metallic electrode portion. Such chip components are mounted on a substrate with either the top surface (a) or the back surface (C) facing upward depending on the conditions. Next, FIG. 5 shows the video signal level when such a chip component or the board itself is imaged with a TV camera in the state shown in FIG. 3. The horizontal axis in FIG. 5 represents the aperture of the lens, or in other words, the brightness of the object as seen from the TV camera. In FIG. 5, C indicates a chip component. C
1 is a ceramic part and is white, so the video signal level is very high (... However, the main body of the chip part comes in various colors depending on the part, for example, light brown is C2, black is C1. There is a large difference in level.Also, as shown by the shaded area C8, the level variation in the electrode part is very wide (.This is because the electrode part has a somewhat specular reflection characteristic.
表面がフラットでないためである。さらに背景となる基
板についてもBで示したように場所により種々のレベル
を示す。たとえばB、は暗緑色のレジストされた基材部
であり、レベルは低いがB2ははんだメッキされたラン
ド部IB、はレジストされた銅パターン部、またB4は
銅メッキされたランド部でありかなりレベルが高くなる
。This is because the surface is not flat. Furthermore, as shown in B, the background substrate also shows various levels depending on the location. For example, B is a dark green resisted base material, B2 is a solder plated land part IB, which is a resisted copper pattern part, and B4 is a copper plated land part, although the level is low. The level becomes higher.
このように検出対象であるチップ部品と背景となる基板
部分が映像レベル的にオーバラップして(・るため、白
黒画像による識別が困難な場合が生じる。たとえばチッ
プ部品のセラミック部が上側になるように実装されてい
る場合は、その有無や位置ずれが容易に認識できるのに
対し、銅メツキランドにうす茶色のチップ部品が実装さ
れている場合は両者の映像レベルの差が小さいため9位
置ずれの認識は困難となる。このような問題点を解決す
るためには、チップ部品自体と基板部分の映像に何らか
の形での差異が生じるようにし、チップ部品の位置が明
確に認識できるようにしなければならない。In this way, the chip component that is the detection target and the board part that is the background overlap at the video level (・), so it may be difficult to identify them using a black and white image.For example, the ceramic part of the chip component may be on the upper side. When mounted like this, the presence or absence and positional deviation can be easily recognized, whereas when a light brown chip component is mounted on a copper-plated land, the difference in the image level between the two is small, so the presence or absence and positional deviation can be easily recognized. In order to solve this problem, it is necessary to create some kind of difference between the image of the chip component itself and the board part, so that the position of the chip component can be clearly recognized. Must be.
これを可能とするための本発明の原理を第6図。FIG. 6 shows the principle of the present invention to make this possible.
第7図および第8図により説明する。第6図は撮をとり
、かつ基板を上から見た場合の照明方向が特定方向に極
力限定している点である。このような照明方式を採用す
ることにより、第7図に状態図を示す如く、チップ部品
10のエツジ部分を照射した光束のみがTVカメラに入
力される。この結果、第8図に太い黒線で示した部分の
みの輝度レベルが高い映像でTVカメラから出力される
。第8図において、照明の方向がX方向のみの場合は黒
の太い実線部の輝度レベルが高く、さらにX方向に照明
器を設定すれば黒の太い破線部分の輝度レベルも高くな
る。この輝度レベルは第5図のC0のばらつき範囲の上
限付近に相当するので基板背景部分と明確に区別できる
。なお第8図(b)のように、チップ部品10xy軸に
対し傾斜している場合。This will be explained with reference to FIGS. 7 and 8. FIG. 6 shows that the illumination direction when taking pictures and viewing the board from above is limited to a specific direction as much as possible. By adopting such an illumination method, only the light beam that illuminates the edge portion of the chip component 10 is input to the TV camera, as shown in the state diagram in FIG. As a result, the TV camera outputs an image with a high luminance level only in the portion indicated by the thick black line in FIG. In FIG. 8, when the illumination direction is only in the X direction, the brightness level of the thick solid black line is high, and if the illuminator is further set in the X direction, the brightness level of the thick black broken line is also high. This brightness level corresponds to the vicinity of the upper limit of the variation range of C0 in FIG. 5, so it can be clearly distinguished from the background portion of the substrate. In addition, as shown in FIG. 8(b), when the chip component 10 is inclined with respect to the xy axis.
通常は実装ミスの状態であり、高輝度レベル部分が生じ
ない事により容易に認識できる。言うまでもなく、基板
レイアウト設計上このようなチップ実装状態が含まれる
場合は、これを検出する方向にさらに照明器を設置すれ
ばよい。This is usually a mounting error and can be easily recognized because the high brightness level portion does not occur. Needless to say, if such a chip mounting state is included in the board layout design, an additional illuminator may be installed in the direction to detect this state.
以上の原理を利用すれば第1図に示したように。If you use the above principle, as shown in Figure 1.
標準となる良品基板を用いることなく、1個のWカメラ
21を用(・るだけの外観検査装置を実現することがで
きる。第1図にお(・て28は映像の記憶と変換処理が
できる画像処理装置、また29は部品の実装位置や種類
の記憶ができる信号処理装置である。むろん実際の装置
においては、さらにxyテーブル30の移動制御、基板
のロードアンロード。It is possible to realize an external appearance inspection device using just one W camera 21 without using a standard non-defective board. 29 is a signal processing device that can store the mounting position and type of components.Of course, in the actual device, it also controls the movement of the xy table 30 and loads/unloads the board.
あるいは検査の前作業である部品搭載機との連け(・な
どがシステム的に複合されるが1本発明の範囲外の事項
であり説明を省略する。Alternatively, the pre-inspection work, such as linking with a component mounting machine, may be systemically complex, but this is outside the scope of the present invention and will not be described here.
このような構成の検査装置において、チップ部品の実装
状態の認識は9種々の手法によって可能とする事ができ
る。たとえば第9図は探索的なアルゴリズムを利用する
方法である。(a)においてP。In the inspection apparatus having such a configuration, the mounting state of the chip components can be recognized using nine different techniques. For example, FIG. 9 shows a method using an exploratory algorithm. In (a) P.
は部品の実装中心位置であり、この場合部品の外形位置
は破線41の状態であるべきことを示して(・る。is the mounting center position of the component, and in this case, the outline position of the component should be in the state shown by the broken line 41.
また破線42は部品の外形位置がこれを越えてはならな
い限界位置を示す。これらの情報は第1図の信号処理装
置29にあらかじめ記憶されており、検査の過程に応じ
て順次画像処理装置28に伝送される。この場合、実際
にチップ部品のエッヂ部が太(・黒線15で示した位置
であったとすれば、その位置認識は第9図(b)から(
d)に示す手順で行うことができる。まず(b)に示す
ように、限界位置42の左端に対応した場所にスリット
形ウィンドウ40を設定する。このウィンドウ40内に
高輝度部分が検出されない限り、ウィンドウを図の右に
順次移動する。Further, a broken line 42 indicates a limit position beyond which the external position of the component must not be exceeded. These pieces of information are stored in advance in the signal processing device 29 in FIG. 1, and are sequentially transmitted to the image processing device 28 in accordance with the inspection process. In this case, if the edge of the chip component is actually at the position indicated by the thick black line 15, then the position can be recognized from FIG. 9(b) (
This can be done by following the procedure shown in d). First, as shown in (b), a slit-shaped window 40 is set at a location corresponding to the left end of the limit position 42. Unless a high brightness portion is detected within this window 40, the window is sequentially moved to the right in the figure.
この移動が高輝度部の検出がないまま限界位置の右端に
達すればチップ部品は異常な実装状態であると判定する
。しかし第9図の場合は(c)の状態で検出が行われ、
チップ部品のX方向の実装位置は許容範囲であることが
認識される。この段階でウィンドウなX方向に移動また
は1図のように上下方向に拡大する。この移動または拡
大はウィンドウ内の高輝度部分の増加が認められなくな
るまで行われ、(d)の状態で終了する。この結果、チ
ップ部品のX+Y方向位置が認識され、これが許容範囲
内であるか否かが判定される。場合によってはこのウィ
ンドウは1個でもよ(・。If this movement reaches the right end of the limit position without detecting a high-brightness portion, it is determined that the chip component is in an abnormal mounting state. However, in the case of Figure 9, detection is performed in state (c),
It is recognized that the mounting position of the chip component in the X direction is within the permissible range. At this stage, the window is moved in the X direction or enlarged in the vertical direction as shown in Figure 1. This movement or enlargement is performed until no increase in the high brightness portion within the window is recognized, and ends in the state of (d). As a result, the position of the chip component in the X+Y direction is recognized, and it is determined whether this is within the allowable range. Depending on the case, there may be only one window (・.
第10図は他の認識方式の例であり、限界位置の各頂点
に対応して複数のメツシュを持つウィンドウ部40a〜
40dを設定し、各々のウィンドウ内の高輝度部15の
位置計測、または各々のウィンドウ内の高輝度部パター
ンの相関度から、チップ部品の位置ずれを認識する。た
だし、ウィンドウは2個あるいは1個で良い場合もある
一第11図はさらに他の認識方式の例であり、テップ部
品の外形エッヂ部が4方向とも高輝度15で得られる場
合を対象としている。すなわちx+y方向の限界位置に
対応して設定された4個のスリッ目0内における高輝度
部分の位置を調べ、チップ部品のXあるいはX方向の位
置を認識する。この場合、スリット形ウィンドウはたと
えば40−aおよび40−cの2個でも良い。FIG. 10 is an example of another recognition method, in which window portions 40a to 40 have a plurality of meshes corresponding to each vertex of the limit position.
40d, and the positional deviation of the chip component is recognized by measuring the position of the high brightness portion 15 within each window or from the degree of correlation of the high brightness portion patterns within each window. However, there may be cases where two or one windows are sufficient. Figure 11 is an example of yet another recognition method, and is intended for the case where the outer edge of the tip part can be obtained with a high brightness of 15 in all four directions. . That is, the position of the high-brightness portion within the four slits 0 set corresponding to the limit position in the x+y direction is checked, and the position of the chip component in the X or X direction is recognized. In this case, there may be two slit windows, for example 40-a and 40-c.
以上、角形チップ部品を対象として本発明の詳細な説明
したが、その考え方自体は他の種類の面付部品にも適用
可能である。また本発明は照明器の種類の如何を問わず
実施可能であり、また高輝度部分と他の部分との識別を
容易にするため、光学的なフィルタを利用する等の工夫
は本発明の範曲内に含まれろ。さらに、TV画像の視野
内に常に1個の対象部品のみが視野内に含まれる方式。Although the present invention has been described above in detail with respect to square chip components, the concept itself can be applied to other types of surface-mounted components. Furthermore, the present invention can be implemented regardless of the type of illuminator, and it is within the scope of the present invention to use optical filters to easily distinguish high-brightness areas from other areas. Include it in the song. Furthermore, this method always includes only one target part within the field of view of the TV image.
ある(・は視野を拡大して、一つの視野内に複数個の対
象部品が含まれる方式のいずれについても。Yes (・ means any method in which the field of view is expanded to include multiple target parts within one field of view.
本発明を適用することが可能である。むろん第2図に示
したビデオコンパレータ式の検査装置に本発明の原理を
適用しても良(・。It is possible to apply the present invention. Of course, the principles of the present invention may also be applied to the video comparator type inspection device shown in Fig. 2.
(効果)
以上に述べたように本発明によれば、基板内での対象部
品の位置が極めて明確に識別でき、実装基板の外観検査
装置の性能向丘の上で極めて効果が太き(・。(Effects) As described above, according to the present invention, the position of the target component within the board can be identified very clearly, which is extremely effective in improving the performance of the visual inspection apparatus for mounted boards.
第1図は本発明の実施例のハードウェア構成図。
第2図は従来の外観検査装置の構成図、第3図。
第4図および第5図は従来装置の性能の限界を説明する
図、第6図、第7図および第8図は本発明の詳細な説明
する図、第9図、第10図および第11図は本発明の原
理を利用した認識方式の説明図である。
l:基板、 2] :TVカメラ、23 :照明器、2
8:画像処理装置、29:信号処理装置。
第2図
を
第3図 第4図
第5図
第6図
第7図
第8図FIG. 1 is a hardware configuration diagram of an embodiment of the present invention. FIG. 2 is a configuration diagram of a conventional appearance inspection device, and FIG. 3 is a diagram. 4 and 5 are diagrams explaining the limits of the performance of the conventional device; FIGS. 6, 7, and 8 are diagrams explaining the details of the present invention; FIGS. 9, 10, and 11. The figure is an explanatory diagram of a recognition method using the principle of the present invention. l: Board, 2]: TV camera, 23: Illuminator, 2
8: Image processing device, 29: Signal processing device. Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8
Claims (1)
て高輝度で映像化されるような照明手段を採用し、この
高輝度部分の位置を検出することにより、前記部品の前
記基板上の実装位置または姿勢を認識することを特徴と
する実装基板の外観検査方式。By employing illumination means that images the contour part of a component mounted on a board with higher brightness than other parts, and by detecting the position of this high-brightness part, An external appearance inspection method for a mounted board, which is characterized by recognizing the mounting position or orientation of the board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8448585A JPS61243303A (en) | 1985-04-22 | 1985-04-22 | Visual inspection system for mounted substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8448585A JPS61243303A (en) | 1985-04-22 | 1985-04-22 | Visual inspection system for mounted substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61243303A true JPS61243303A (en) | 1986-10-29 |
Family
ID=13831950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8448585A Pending JPS61243303A (en) | 1985-04-22 | 1985-04-22 | Visual inspection system for mounted substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61243303A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62239040A (en) * | 1986-04-11 | 1987-10-19 | Tokyo Electron Ltd | Inspection system for fitting state of electronic component |
JPS63173489A (en) * | 1987-01-13 | 1988-07-18 | Omron Tateisi Electronics Co | Packaged substrate inspection instrument |
JPS6457106A (en) * | 1987-08-28 | 1989-03-03 | Tdk Corp | Optical method for inspecting appearance of chip component and automatic appearance sorter |
JPH0221247A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Ind Co Ltd | Detection of inside-out inversion for electronic component |
JPH0221249A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Ind Co Ltd | Appearance inspection for electronic component |
JPH0221246A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Ind Co Ltd | Appearance inspection for electronic component |
JPH0244236A (en) * | 1988-08-03 | 1990-02-14 | Matsushita Electric Ind Co Ltd | Appearance inspection for electronic component with lead |
JPH02243914A (en) * | 1989-03-16 | 1990-09-28 | Yorozu Jidosha Kogyo Kk | Three-dimensional coordinate measuring instrument |
JP2008298489A (en) * | 2007-05-29 | 2008-12-11 | Saki Corp:Kk | Inspection system of inspection object |
JP2012169575A (en) * | 2011-02-17 | 2012-09-06 | Panasonic Corp | Electronic component and manufacturing method of the same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5999205A (en) * | 1983-06-16 | 1984-06-07 | Sumitomo Electric Ind Ltd | Apparatus for measuring deviation of composite metallic tape |
-
1985
- 1985-04-22 JP JP8448585A patent/JPS61243303A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5999205A (en) * | 1983-06-16 | 1984-06-07 | Sumitomo Electric Ind Ltd | Apparatus for measuring deviation of composite metallic tape |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62239040A (en) * | 1986-04-11 | 1987-10-19 | Tokyo Electron Ltd | Inspection system for fitting state of electronic component |
JPS63173489A (en) * | 1987-01-13 | 1988-07-18 | Omron Tateisi Electronics Co | Packaged substrate inspection instrument |
JPS6457106A (en) * | 1987-08-28 | 1989-03-03 | Tdk Corp | Optical method for inspecting appearance of chip component and automatic appearance sorter |
JPH0221247A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Ind Co Ltd | Detection of inside-out inversion for electronic component |
JPH0221249A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Ind Co Ltd | Appearance inspection for electronic component |
JPH0221246A (en) * | 1988-07-08 | 1990-01-24 | Matsushita Electric Ind Co Ltd | Appearance inspection for electronic component |
JPH0244236A (en) * | 1988-08-03 | 1990-02-14 | Matsushita Electric Ind Co Ltd | Appearance inspection for electronic component with lead |
JPH02243914A (en) * | 1989-03-16 | 1990-09-28 | Yorozu Jidosha Kogyo Kk | Three-dimensional coordinate measuring instrument |
JP2008298489A (en) * | 2007-05-29 | 2008-12-11 | Saki Corp:Kk | Inspection system of inspection object |
JP2012169575A (en) * | 2011-02-17 | 2012-09-06 | Panasonic Corp | Electronic component and manufacturing method of the same |
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