TW201923964A - Manufacturing apparatus of semiconductor and manufacturing method of semiconductor device including a collet confirmation inspection unit capable of confirming the shape and installation state of a collet - Google Patents

Abstract

An object of the present invention is to provide a semiconductor manufacturing apparatus including a collet confirmation inspection unit capable of confirming the shape and installation state of a collet. A semiconductor manufacturing apparatus includes a head that sucks and picks a die with a collet, a collet inspection unit that confirms and inspects the collet, and a control device that controls the head and the collet inspection unit. The collet inspection unit includes a shape detection sensor. The control device reads the shape of the collet by the shape detection sensor.

Description

Semiconductor manufacturing device and method for manufacturing semiconductor device

The present disclosure relates to a semiconductor manufacturing apparatus, and can be applied to, for example, a die bonder including, for example, a collet inspection unit.

A part of the manufacturing process of a semiconductor device includes a process of assembling a package by mounting a semiconductor wafer (hereinafter, simply referred to as a die) on a wiring board or a lead frame (hereinafter, simply referred to as a substrate), and a part of the process of assembling the package. A process of dicing a die from a semiconductor wafer (hereinafter, simply referred to as a wafer) (dicing process), and a bonding process of mounting the separated die on a substrate. The semiconductor manufacturing device used in the bonding process is a die bonder.

The die bonder is a device that uses solder, gold plating, and resin as bonding materials to bond (attach and mount) the die to the substrate or the bonded die. The die is repeatedly picked up in a die bonder bonded to the surface of a substrate, for example, by using a suction nozzle called a chuck to pick up the die from the wafer, and to transfer the die to the substrate to apply a pressing force. The joining operation (operation) is performed by heating the joining material. The chuck is a holder having an adsorption hole for attracting gas and adsorbing and holding the crystal grains, and has the same size as the crystal grains.
In such a die bonder, the chuck must be replaced in accordance with the variety (grain size, etc.), or in order to prevent damage or contamination of the surface of the die, the chuck in contact with the surface of the die must be replaced every time. After the chuck is replaced, it is necessary to set the chuck in an appropriate position at an appropriate position (for example, Patent Document 1).
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2016-139629

[Problems to be Solved by the Invention]

In Patent Document 1, protrusions that are contacted at a plurality of positions of the chuck are provided in a movement path of a die moving means (pickup head or bonding head) provided with the chuck, and the chuck is determined based on the height of the chuck when it contacts. tilt. However, although the tilt can be discriminated, the shape of the chuck is not known to be abnormal.
An object of the present disclosure is to provide a semiconductor manufacturing apparatus including a chuck confirmation inspection unit capable of confirming the shape and mounting state of the chuck.
Other problems and novel features are apparent from the description of this specification and the drawings of the attachments.

[Means to solve the problem]

A brief description of the representative contents of this disclosure is as follows.
That is, the semiconductor manufacturing apparatus includes a head that sucks and picks up a die with a chuck, a chuck inspection section that confirms and inspects the chuck, and a control device that controls the head and the chuck inspection section. The chuck inspection unit includes a shape detection sensor. The control device reads the shape of the chuck through the shape detection sensor.

[Inventive effect]

When using the above semiconductor manufacturing apparatus, the shape and mounting state of the chuck can be checked.

Hereinafter, examples and modifications will be described using drawings. However, in the following description, the same reference numerals are given to the same constituent elements, and repeated explanations are omitted. In addition, in order to make the description clearer, although the drawing has a schematic representation of the width, thickness, shape, and the like of each part compared to the actual state, this is only an example and is not intended to limit the explanation of the present invention.

[Example]

FIG. 1 is a schematic top view of a die bonder related to the embodiment. FIG. 2 is a diagram illustrating the actions of the pickup head and the bonding head when viewed from the direction of arrow A in FIG. 1.

The die bonder 10 generally includes a supply unit 1, a pick-up unit 2, and a supply unit 2 for supplying a die D mounted on a printed board region (hereinafter, referred to as a package region P) mounted in one or a plurality of final packages. The intermediate stage part 3, the joint part 4, the conveyance part 5, the substrate supply part 6, the substrate carry-out part 7, and the control part 8 which monitors and controls the operation of each part. The Y-axis direction is the front-back direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply section 1 is arranged on the front side of the die bonder 10, and the joint section 4 is arranged on the deep side.

First, the die supply unit 1 supplies the die D mounted on the package region P of the substrate S. The die supply unit 1 includes a wafer holding table 12 that holds the wafer 11 and a push-up unit 13 indicated by a broken line that pushes the die D from the wafer 11. The die supply unit 1 moves in the XY direction by a driving means (not shown) to move the picked-up die D to the position of the push-up unit 13.

The picking section 2 includes a picking head 21 for picking up the die D, a Y driving section 23 for moving the picking head 21 to the Y direction, and various driving sections (not shown) for lifting, rotating, and moving the chuck 22 in the X direction. . The pick-up head 21 includes a chuck 22 (see also FIG. 2) that sucks and holds the pushed-up crystal grains D at the front end, picks up the crystal grains D from the crystal grain supply unit 1, and places them on the intermediate stage 31. The pick-up head 21 includes drive units (not shown) that raise, lower, rotate, and move the chuck 22 in the X direction.

The intermediate platform section 3 includes an intermediate platform 31 on which the die D is temporarily placed, a platform identification camera 32 for identifying the die D on the intermediate platform 31, and a chuck inspection section 90.

The bonding portion 4 is used to pick up the die D from the intermediate platform 31, and is bonded to the packaging area P of the substrate S carried to the bonding platform BS, or is laminated on the packaging area P that has been bonded to the substrate S. Bonding in the form on the grain. The bonding portion 4 includes a bonding head 41 (see FIG. 2) of the chuck 42 (see also FIG. 2) for holding and holding the crystal grain D on the front end, a Y driving portion 43 that moves the bonding head 41 to the Y direction, and a photographing substrate S, as in the pickup head 21. A position identification mark (not shown) in the package area P, and a substrate identification camera 44 for identifying a bonding position.
With this configuration, the bonding head 41 corrects the pickup position and posture based on the photographic data of the platform recognition camera 32, picks up the die D from the intermediate platform 31, and bonds the die D to the substrate S based on the photographic data of the substrate recognition camera 44. .

The conveyance unit 5 includes a substrate conveyance claw 51 that grasps and conveys the substrate S, and a conveyance path 52 that moves the substrate S. The substrate S is moved in the X direction by driving a nut (not shown) of the substrate transfer claw 51 provided in the transfer channel 52 with a ball screw (not shown) provided along the transfer channel 52.
With this configuration, the substrate S is moved from the substrate supply section 6 to the bonding position along the conveyance path 52, and after the bonding, the substrate S is moved to the substrate carrying-out section 7 and the substrate S is handed over to the substrate carrying-out section 7.

The control unit 8 includes a memory that stores a program (software) that monitors and controls the operation of each part of the die bonder 10, and a central processing unit (CPU) that executes the program stored in the memory.

Next, the structure of the crystal grain supply part 1 is demonstrated using FIG. 3 and FIG. 4. FIG. FIG. 3 is a diagram showing an external perspective view of a die supply section. FIG. 4 is a schematic cross-sectional view showing a main part of a crystal grain supply unit.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction), and a push-up unit 13 that moves in the vertical direction. The wafer holding table 12 includes an expansion ring 15 that holds a wafer ring 14, and a support ring 17 that is held on the wafer ring 14 and positions a dicing tape 16 that joins a plurality of dies D to a horizontal level. The push-up unit 13 is disposed inside the support ring 17.

When the die supply unit 1 is pushed on the die D, the expansion ring 15 holding the wafer ring 14 is lowered. As a result, the dicing tape 16 held on the wafer ring 14 is stretched, and the interval between the crystal grains D is widened. The crystal grain D is pushed up from below the crystal grain D by the push-up unit 13 to improve the picking property of the crystal grain D . In addition, as the thickness is reduced, the bonding agent for bonding the crystal grains to the substrate changes from a liquid state to a thin film state, and a thin film state called a die bonding film (DAF) 18 is bonded between the wafer 11 and the dicing tape 16. Bonding material. In the wafer 11 having the die-bonding film 18, dicing is performed on the wafer 11 and the die-bonding film 18. Therefore, in the peeling process, the wafer 11 and the die-bonding film 18 are peeled from the dicing tape 16. The die-bonding film 18 is hardened by heating.

The die bonder 10 includes a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, a platform recognition camera 32 that recognizes the attitude of the die D placed on the intermediate platform 31, and a bonding platform BS. The camera 44 at the mounting position. It is necessary to correct the posture deviation between the recognition cameras, which are related to the platform recognition camera 32 according to the pickup of the bonding head 41 and the substrate recognition camera 44 related to the bonding by the bonding head 41 toward the mounting position.

Next, the chuck and the chuck holder holding the chuck will be described using FIGS. 5 to 7. 5 to 7 are diagrams for explaining a collet and a collet holder used in the die bonder of FIG. 1. 5 is a cross-sectional view of a pickup head, a chuck holder, and a chuck. Figure 6 is a top view of the collet holder. Figure 7 is a bottom view of the chuck. Hereinafter, although the chuck 22 of the pickup head 21 is described, the chuck 42 of the joint head 41 is the same.

The chuck holder 25 includes a suction hole 25 a which is communicated with the suction hole 21 a of the pickup head 21 at the center, and a magnet 25 b holding the chuck 22. The chuck holder 25 has notches (claw retreating portions) 251c near the centers of the four sides, and can be used to hold the chuck as a chuck replacement jig. The chuck 22 is attached by attracting the chuck 22 by the magnet 25b, and the opening portion of the chuck holder 25 becomes a push-out shape that becomes wider as it moves downward.

The chuck 22 can be fixed by a magnet, and stainless steel (SUS (magnetic)) 22b is welded to the back of an elastic body 22a such as silicone rubber, and the four sides are held on the chuck holder 25. Is provided with a plurality of suction holes 221 communicating with the suction holes 251a. The surface of the elastic body 22a includes a holding portion 22c that is in contact with and holds the crystal grain D. The holding portion 22c is integrally formed with the elastic body 22a, and has the same size as that of the crystal grain D.

When the chuck 22 picks up the die D from the wafer 11, it lands on the surface of the die D, and at this time, it receives pressure. Thereafter, by the movement of the pickup head 21, the crystal grains D adsorbed by the chuck 22 are transferred to the intermediate platform 31. The transferred crystal grains D land on the intermediate platform 31. The chuck 42 picks up the die D from the intermediate platform 31 and transfers the die D adsorbed by the chuck 42 to the substrate S by the movement of the bonding head 41. The transferred crystal grains D are landed on the substrate S, and are subjected to bonding (load number N to several tens N) for bonding in the vertical direction from the bonding head 41. That is, the die bonder repeats this process and mass-produces products.

Therefore, the elastic body 22a and the like of the collet 22 formed of silicone rubber and the like are gradually deformed (so-called crushed) by repeating the above-mentioned processes, and need to be replaced when a certain amount of production is reached. At the time of replacement, although the chuck is used alone or integrated with the chuck holder, at this time, an error occurs between the newly replaced chuck and the chuck joint, or the chuck and the retainer joint. So-called "shake").

In die bonders, the chuck must be replaced every time it is used. Furthermore, after the chuck is replaced, the chuck must be set in an appropriate position in an appropriate state.

Next, before or after replacement, the chuck inspection section for confirming and inspecting the chuck will be described using FIGS. 8 to 10. FIG. 8 is a diagram illustrating a chuck inspection section, FIG. 8 (A) is a schematic side view of the chuck and the chuck inspection section, and FIG. 8 (B) is a schematic perspective view of a fingerprint sensor. FIG. 9 is a diagram illustrating the fingerprint sensor of FIG. 8. FIG. 10 is a diagram illustrating the inclination detection of a chuck according to the fingerprint sensor of FIG. 8. Hereinafter, although the chuck 22 of the pickup head 21 is described, the chuck 42 of the joint head 41 is the same.

The chuck inspection unit 90 includes a fingerprint sensor 91 which is a shape detection detector, a support plate 92, and a detection circuit 93. The detection circuit 93 is connected to the fingerprint sensor 91 via a cable 94.

In general, the fine unevenness of the portion where the fingerprint sensor is in contact can be detected by optical methods, electrostatic capacitance methods, electric field strength methods, and the like. The fingerprint is established by the unevenness on the surface of the finger. The convex part is called the ridge line, and the concave part is called the valley line. The average fingerprint bump height is about 50 μm, the interval between ridges is about 400 μm, the fingerprint is detected at about 50 μm intervals, and converted into a signal. For example, in the electrostatic capacitance method, in accordance with the bumps and valleys of the fingerprint, the distance between the finger and the sensor changes, and the capacitance also changes.

In the embodiment, the fingerprint sensor 91 detects the shape of the chuck (outer dimensions, layout of the vacuum suction hole and / or vacuum suction groove, abrasion, and foreign matter adhesion) to replace the fingerprint. When the fingerprint sensor 91 uses, for example, an electrostatic capacitance method, the electrostatic capacitance between the surface of the holding portion 22c of the chuck 22 and the electrode 91b in the flat plate 91a of the fingerprint sensor 91 is detected as shown in FIG. The shape of the chuck is pictured. Needless to say, the fingerprint sensor 91 may use a fingerprint sensor other than the electrostatic capacitance method.

The detection circuit 93 amplifies a signal input from the cable 94 with an amplifier (not shown), converts it into a digital signal with an A / D converter (not shown), and processes it with a signal processing circuit (not shown).

The surface of the holding portion 22c of the chuck 22 is worn and foreign matter is attached, and it is detected that the shape of the chuck is different.

In addition to the shape of the chuck, the fingerprint sensor 91 can confirm the installation state (tilt). For example, as shown in FIG. 10, when the chuck 22 is inclined, only a part of the holding portion 22c of the chuck 22 contacts the fingerprint sensor 91, so the shape of the chuck is detected to be different.

The speed immediately before the chuck 22 contacts the fingerprint sensor 91 can be moved slowly compared to the speed when the chuck 22 moves away from the fingerprint sensor 91 sufficiently. According to this, in addition to the chuck 22 immediately before it contacts the fingerprint sensor 91, there are damages to the chuck 22 caused by the conflict when the chucks 22 contact the fingerprint sensor 91, damage to the fingerprint sensor 91, In addition to the advantage of the burden over the Z drive section, when the chuck 22 is moved from a position where the fingerprint sensor 91 is sufficiently separated, it can be faster than when the chuck 22 is about to contact the fingerprint sensor 91. The speed of movement can be quickly measured, so that the position of the chuck 22 can be quickly measured.

Furthermore, when the chuck 22 is in contact with the fingerprint sensor 91, the contact can be detected with a certain force, for example, a force of 1N or less. It is only necessary to accurately and accurately detect the contact between the chuck 22 and the fingerprint sensor 91. However, since the contact force is not so strong, it can be constructed so as not to damage the chuck 22 or the fingerprint sensor 91.

Although the chuck inspection section 90 is disposed on the intermediate platform section 3 (near the intermediate platform 31), it may be disposed on the intermediate platform 31, and even outside the intermediate platform section 3, it is provided between the joint head 41 and the pickup head 21. Both sides can go in and out. That is, it may be arranged at a position where both of the chucks of the inspection head 41 and the pickup head 21 can be checked. Furthermore, even if the chuck inspection unit 90 is movably provided at a position where both the joining head 41 and the pickup head 21 can enter and exit, it can be confirmed that both the joining head 41 and the pickup head 21 can be inspected.

Next, the joining operation will be described using FIGS. 11 and 12. 11 and 12 are flowcharts showing an example of the joining method of the adapter in FIG. 1. Terminal A of the flowchart of FIG. 11 is connected to terminal A of the flowchart of FIG. 12, and terminal B of the flowchart of FIG. 12 is connected to terminal B of the flowchart of FIG. 11. Hereinafter, although the chuck 22 of the pickup head 21 is described, the chuck 42 of the joint head 41 is the same.

First, the control unit 8 initializes the joining (step S1). Here, the control unit 8 reads the shape of the chuck 22 registered at the correct position as the initialization of the positions of the pickup head 21 and the bonding head 41, the wafer identification camera 24, the platform identification camera 32, and the substrate identification camera 44. One of the initializing processes such as initializing the position. Specifically, the control unit 8 moves the chuck 22 to the chuck inspection unit 90 so that the shape of the holding portion 22c of the chuck 22 is read by contacting the fingerprint sensor 91 and stored in the memory of the control unit 8. Body memory (not shown).

Next, the control unit 8 picks up the die D from the wafer 11 with the pick-up head 21 and places it on the intermediate platform 31, picks up the die D from the intermediate platform 31 with the bonding head 41, and performs mounting operations such as mounting on the substrate S (step S2). Next, the control unit 8 determines whether or not the mounting operation is performed a specific number of times (step S3). The control unit 8 ends the process when it executes a specific number of times. When the control unit 8 executes a predetermined number of times, it determines whether the execution action exceeds the number or time required for the confirmation of the confirmation chuck 22, that is, confirms the set value (the number of device production or the device operating time is a specific value) (step S4). Here, the confirmation setting value of the chuck 22 and the confirmation setting value of the chuck 42 may be different. If it exceeds the confirmation setting value, the process returns to step S2 to perform the installation operation. When the confirmation value is exceeded, the control unit 8 compares the chucks because it knows the consumption degree of the holding portion 22c of the chuck 22 and the like. That is, the control section 8 moves the chuck 22 to the chuck inspection section 90 by the pickup head 21 and the joint head 41 (step S5), and reads the holding section 22c of the chuck 22 by the chuck inspection section 90. Shape (step S6). The control unit 8 determines whether the shape of the holding portion 22c of the chuck 22 is a shape registered in advance in the initial stage of step S1 (step S7). In the case of YES, the process returns to step S2 to perform the mounting operation. In the case of NO, the chuck 22 is replaced (step S8).

The replacement of the chuck 22 can be performed manually even by an operator, and it can be replaced even by the automatic chuck replacement technology.

Next, the control unit 8 moves the chuck 22 to contact the chuck inspection unit 90 by the pickup 21 (step S9), and reads the shape of the chuck 22 by the chuck inspection unit 90 (step SA). It is determined whether the shape of the chuck 22 is a shape registered in advance in the initial stage of step S1 (step SB). In the case of YES, the process returns to step S2 to perform the mounting operation. In the case of NO, the control unit 8 notifies an abnormality (step SC). In this case, for example, when the control unit 8 displays a chuck image and the pattern is in the shape of a beautiful chuck, the operator judges that the types of the chucks are different, and replaces them with a correct chuck by means or automatically. When the pattern is not the shape of the chuck, the operator judges that the chuck is inclined to be installed badly, and reinstalls the chuck 22 to the chuck holder 25 manually or automatically.

Next, a method for manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIG. 13. FIG. 13 is a flowchart showing a method of manufacturing a semiconductor device.

Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is stored is stored in a wafer cassette (not shown), and is transferred to the die bonder 10. The control unit 8 supplies the wafer ring 14 from the wafer cassette filled with the wafer ring 14 to the die supply unit 1. The substrate S is prepared and carried into the die bonder 10. The control unit 8 places the substrate S on the conveyance path 52 with the substrate supply unit 6.

Step S12: The control unit 8 picks up the die D from the dicing tape 16 held by the wafer ring 14.

Step S13: The control unit 8 mounts the picked-up die D on the package area P of the substrate S or stacks it on the bonded die. More specifically, the control unit 8 places the die D picked up from the dicing tape 16 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and joins the transferred substrate S Package area P.

Step S14: The control part 8 moves the board | substrate S to the board | substrate carrying-out part 7 by the board | substrate conveying claw 51, passes the board | substrate S to the board | substrate carrying part 7, and carries out the board | substrate S from the die bonder 10 (substrate unloading).

In the embodiment, by using a fingerprint sensor such as an optical fingerprint sensor or an electrostatic capacitance type fingerprint sensor, it is possible to detect the fine unevenness of the contacted portion and to detect the shape of the chuck (wear, Foreign matter adhesion) or installation state (tilted). Furthermore, the shape of the chuck can be easily registered in the same manner as the fingerprint registration. The plural types of chucks used in automatic chuck replacement are registered with fingerprint recognition, and can be easily confirmed after automatic replacement. Can prevent the product caused by the abnormality of the chuck.

(Modification)
In the following, a few typical modifications are exemplified. In the following description of the modified example, it is assumed that parts having the same configuration and functions as those described in the above-mentioned embodiment can use the same symbols as those in the above-mentioned embodiment. It should be noted that the description of such a part can be appropriately applied to those described in the above-mentioned embodiment within a range that is not technically contradictory. In addition, all or a part of the above-mentioned embodiments and a plurality of modified examples can be appropriately and compositely applied within a technically non-contradictory range.

FIG. 14 is a diagram illustrating a chuck inspection section related to a modification, FIG. 14 (A) is a schematic side view of the chuck and the chuck inspection section, and FIG. 14 (B) is a schematic oblique view of a fingerprint sensor Illustration. FIG. 15 is a diagram illustrating the inclination of a chuck detected by the fingerprint sensor of FIG. 14. Hereinafter, although the chuck 22 of the pickup head 21 is described, the chuck 42 of the joint head 41 is the same.

The chuck inspection unit 90A includes pressure sensors 95a, 95b, and 95c in addition to the fingerprint sensor 91, the support plate 92, and the detection circuit 93 of the chuck inspection unit 90 of the embodiment. In addition to the detection circuit 93A being connected to the fingerprint sensor 91 via a cable 94, pressure sensors 95a, 95b, and 95c are also connected via cables 97a, 97b, and 97c and output units 96a, 96b, and 96c. The pressure sensors 95a, 95b, and 95c support the fingerprint sensor 91 at three points.

The detection circuit 93A amplifies the signal input from the cable 94 for signal processing in the same way as the detection circuit 93 of the embodiment, and also amplifies the signal input from the cables 97a, 97b, and 97c with an amplifier (not shown). A / D converter (not shown) is used to convert digital signals into signals and processed in a signal processing circuit (not shown).

The pressure sensors 95a, 95b, and 95c are each composed of, for example, a pressure-sensitive element, that is, a piezoelectric element.

That is, when the chuck inspection unit 90A having the above-mentioned configuration is used, if the chuck 22 is tilted for some reason, an imbalance is generated from the outputs of the three pressure sensors 95a, 95b, and 95c. Then, by outputting from the three pressure sensors 95a, 95b, and 95c, for example, to find the center of gravity point, and to find the distance (distance) from the original point (in the case of no tilt) of the center of gravity point, it is possible to The inclination of the collet 22 can be easily determined.

Next, the joining operation will be described using FIGS. 16 and 17. 16 and 17 are flowcharts showing another example of the joining method of the adapter of FIG. Terminal A of the flowchart of FIG. 16 is connected to terminal A of the flowchart of FIG. 17, and terminal B of the flowchart of FIG. 17 is connected to terminal B of the flowchart of FIG. 16. Hereinafter, although the chuck 22 of the pickup head 21 is described, the chuck 42 of the joint head 41 is the same.

Steps S1 to S5 are the same as the embodiment of FIG. 11.

The control unit 8 compares the chucks by grasping the degree of consumption of the chucks 22 and the like. That is, the control unit 8 moves the chuck 22 to the chuck inspection unit 90 by the pickup head 21 and the joint head 41 (step S5), and reads the height and shape of the chuck 22 by the chuck inspection unit 90. (Step S6A).

The control unit 8 determines whether the chuck height or the deviation of the height of the holding portion 22c of the chuck 22 exceeds a specific value (step S7A). In the case of NO, the process proceeds to step S7, and in the case of YES, the process proceeds to step S8.

In step S7, the control unit 8 determines whether the shape of the holding portion 22c of the chuck 22 is a shape registered in advance in the initial stage of step S1. In the case of YES, the process returns to step S2 to perform the mounting operation. In the case of NO, the process proceeds to step S8.

In step S8, the chuck 22 is replaced. The replacement of the chuck 22 can be performed manually even by an operator, and it can be replaced even by the automatic chuck replacement technology.

Next, the control unit 8 moves the chuck 22 to contact the chuck inspection unit 90 by the pickup head 21 (step S9), and reads the height and shape of the holding portion 22c of the chuck 22 by the chuck inspection unit 90 ( Step SAA).

The control unit 8 determines whether the chuck height or the height deviation of the holding portion 22c of the chuck 22 exceeds a specific value (step SBA). If it is below the first specific value, move to step SB. If it exceeds the first specific value but is below the second specific value, move to step SD. If it exceeds the second specific value, return to step S8. Then install the chuck 22.

In step SD, the control unit 8 adjusts the inclination of the chuck 22 by moving the pickup head 21 according to the difference in height.

In step SB, the control unit 8 determines whether the shape of the chuck 22 is a shape registered in advance in the initial stage of step S1 (step SB). In the case of YES, the process returns to step S2 to perform the mounting operation. In the case of NO, the control unit 8 judges that the types of the chucks are different, and returns to step S8 to replace the chuck with a correct one.

In the modified example, a plurality of pressure sensors are assembled under the fingerprint sensor 91, and the shape of the chuck (outer dimensions, layout of the vacuum suction hole and / or vacuum suction groove, wear, and foreign matter adhesion) are also confirmed, and the clip Head installation state (tilt angle, height). According to this, all the elements related to the abnormality of the chuck (installation position, tilt, abrasion, foreign matter adhesion) and the like can be detected at one time. When the inclination angle is below a certain value, adjust the inclination of the chuck with the head. When the inclination angle exceeds a certain value, install the chuck. According to this, the chuck can be replaced and confirmed automatically. By automatically grasping the consumption of the chuck and adding the automatic chuck replacement function, a series of actions are all automatic, which can reduce personnel costs and reduce human errors to improve quality.

As mentioned above, although the invention invented by the present inventors has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and of course, various changes can be made.

For example, although the example in which the chuck 22 is comprised by the elastic body 22a, the stainless steel 22b, and the holding | maintenance part 22c was demonstrated in the Example, it is not limited to this, For example, even if it consists only of an elastomer. In the embodiment, an example in which a suction hole is provided in the chuck is described, but the invention is not limited to this, and may be, for example, a suction groove.

Furthermore, in the embodiment, although a fingerprint sensor is used as an example of the shape detection sensor, it will be described, but it is necessary to use a plurality of sensors to check the shape of the surface of the chuck, for example. The distance between the two-dimensional panel-shaped or sheet-shaped sensors can be set in a grid or sawtooth shape.

Moreover, in the modification, although a pressure sensor is used, it may be a pressure-sensitive sheet or a displacement sensor. In the modified example, an example in which three pressure sensors are provided is described, but it is not limited to this, and may be, for example, four or more.

Moreover, even if it is set to clean the surface of a fingerprint sensor (plate shape) automatically.

Furthermore, it is also possible to use a die bonder having a mounting section including a pick-up section, an alignment section, and a bonding section, and a transport channel, and even a mounting section having a pick-up section, an alignment section, and a bonding section, and It is also possible to have one carrying path.

In addition, although the example using the die-bonding film was demonstrated in the Example, it is good also if it is provided in the preform part of a board | substrate coating adhesive, without using a die-bonding film.

Furthermore, in the embodiment, the die bonder that picks up the die from the die supply section with the pick-up head and places it on the intermediate stage, and uses the bonding head to bond the die placed on the intermediate stage to the substrate. The description is not limited to this, and it can be applied to a semiconductor manufacturing apparatus that picks up a die from a die supply unit.
For example, the present invention can also be applied to a die bonder that does not have an intermediate stage and a pick-up head, and uses a bonding head to bond the die of the die supply section to the substrate.
Furthermore, the present invention can be applied to a flip chip bonder that has no intermediate stage, picks up a die from a die supply unit, rotates the die picking head upward, receives the die to a bonding head, and bonds the bonding head to a substrate.
Furthermore, the present invention can also be applied to a grain sorter that does not have an intermediate platform and a bonding head, and places the grains picked up by the pick-up head from the grain supply section on a tray or the like.

10‧‧‧ Die Bonder

1‧‧‧Crystal Supply Department

2‧‧‧Pick up department

21‧‧‧Pickup head

22‧‧‧ chuck

25‧‧‧ Collet holder

3‧‧‧Middle Platform Department

31‧‧‧ intermediate platform

4‧‧‧ Junction

41‧‧‧Joint head

42‧‧‧Chuck

5‧‧‧Transportation Department

51‧‧‧ substrate handling claw

8‧‧‧Control Department

90‧‧‧ Collet Inspection Department

91‧‧‧Fingerprint sensor

92‧‧‧ support board

93‧‧‧Detection circuit

94‧‧‧cable

D‧‧‧ Grain

S‧‧‧ substrate

P‧‧‧Packing area

FIG. 1 is a diagram illustrating a configuration example of a die bonder.

FIG. 2 is a diagram illustrating the configuration of the die bonder of FIG. 1. FIG.

FIG. 3 is a diagram illustrating the configuration of the crystal grain supply section of FIG. 1. FIG.

FIG. 4 is a diagram illustrating a main part of the crystal grain supply section of FIG. 3.

FIG. 5 is a diagram illustrating a configuration of a collet adapter used with the die bonder of FIG. 1. FIG.

FIG. 6 is a diagram illustrating the configuration of the collet holder of FIG. 5. FIG.

FIG. 7 is a diagram illustrating the chuck of FIG. 5.

FIG. 8 is a diagram illustrating the chuck inspection section of FIG. 2.

FIG. 9 is a diagram illustrating the fingerprint sensor of FIG. 8.

FIG. 10 is a diagram illustrating the inclination of the chuck detected by the fingerprint sensor of FIG. 8.

FIG. 11 is a diagram illustrating an example of a bonding method of the die bonder of FIG. 1. FIG.

FIG. 12 is a diagram illustrating an example of a bonding method of the die bonder of FIG. 1. FIG.

FIG. 13 is a flowchart showing a method of manufacturing a semiconductor device using the adapter of FIG. 1. FIG.

FIG. 14 is a diagram illustrating a chuck inspection section related to a modification.

FIG. 15 is a diagram illustrating the inclination of the chuck detected by the fingerprint sensor of FIG. 14.

FIG. 16 is a diagram illustrating another example of the bonding method of the die bonder of FIG. 1. FIG.

FIG. 17 is a diagram illustrating another example of the bonding method of the die bonder of FIG. 1. FIG.

Claims (13)

A semiconductor manufacturing apparatus including: Head, which uses a chuck to attract and pick up crystal grains; A chuck inspection unit that confirms and inspects the chucks; and A control device for controlling the head and the chuck inspection section, The chuck inspection section includes a shape detection sensor, The control device reads the shape of the chuck through the shape detection sensor. The semiconductor manufacturing apparatus according to claim 1, wherein The control device compares the data in which the shape of the chuck at a specific position is read and memorized in advance by the shape detection sensor, and the data in which the shape of the chuck is read by the shape detection sensor during inspection. , The abnormality of the chuck is detected. The semiconductor manufacturing apparatus according to claim 2, wherein The abnormality of the above-mentioned chuck is the abrasion of the chuck, the adhesion of foreign matter, the tilt or the difference between the varieties. The semiconductor manufacturing apparatus according to claim 3, wherein When the control device detects an abnormality of the chuck, the chuck is replaced. The semiconductor manufacturing apparatus according to claim 2, wherein The chuck inspection section further includes at least three sensors below the shape detection sensor that detect a height or a deviation in height of the chuck. The semiconductor manufacturing apparatus according to claim 5, wherein The control device is a case where the height deviation of the chuck is below the first specific value, it is judged that the installation of the chuck is normal, and the height deviation of the chuck is greater than the first specific value and below the second specific value. In some cases, it is judged that the inclination of the chuck needs to be adjusted. In the case where the deviation of the height of the chuck is greater than the second specific value, it is judged that the installation of the chuck is abnormal. The semiconductor manufacturing apparatus according to claim 6, wherein The sensor is a pressure sensor, a pressure-sensitive sheet, or a displacement sensor. The semiconductor manufacturing apparatus according to claim 1, wherein The shape detection sensor is a fingerprint sensor. The semiconductor manufacturing apparatus according to claim 1, wherein Further: A die supply unit, which is a wafer ring having a dicing tape for holding a die; A picking head, which picks up the crystal grains adhered to the cutting tape; An intermediate platform on which the dies picked up by the pick-up head are placed; and The bonding head is used for bonding the crystal grains picked up from the intermediate platform to the substrate or the bonded crystal grains. The head is at least one of the pickup head and the bonding head. The semiconductor manufacturing apparatus according to claim 9, wherein The chuck inspection section is located within a movement range of both the pickup head and the bonding head, The control device moves the pickup head and the bonding head to the chuck inspection section, and inspects the chuck of the pickup head and the chuck of the bonding head. A method for manufacturing a semiconductor device includes: (a) preparation of a semiconductor manufacturing apparatus as claimed in any one of claims 1 to 10; (b) the process of moving into a wafer ring holding a dicing tape with die attached; (c) preparations for moving into the substrate; (d) the process of picking up grains; and (e) A process of bonding the picked-up crystal grains to the substrate or the crystal grains that have already been bonded. The method for manufacturing a semiconductor device according to claim 11, wherein The above (d) process is to pick up the crystal grains adhered to the dicing tape with the bonding head, In the above (e) process, the picked-up die is bonded to the substrate or the bonded die with the bonding head. The method for manufacturing a semiconductor device according to claim 11, wherein The above (d) project has: (d1) a process of picking up the crystal grains adhered to the dicing tape by a pick-up head; and (d2) the process of placing the grains picked up by the picking head on the intermediate platform, The above (e) project has: (e1) a process of picking up a die loaded on the intermediate platform with a bonding head; and (e2) A process of placing the crystal grain picked up by the bonding head on the substrate.