JP2019075446A - Semiconductor manufacturing device and method of manufacturing semiconductor device - Google Patents

Abstract

To provide a semiconductor manufacturing device that comprises a collet confirmation and inspection part capable of confirming a shape and an attachment state of a collet.SOLUTION: A semiconductor manufacturing device comprises: a head that adsorbs a die to pick it up by using a collet; a collet inspection part that confirms and inspects the collet; and a control device that controls the head and the collet inspection part. The collet inspection part comprises a shape detection sensor. The control device reads out a shape of the collet by means of the shape detection sensor.SELECTED DRAWING: Figure 8

Description

  The present disclosure relates to a semiconductor manufacturing apparatus, and is applicable to, for example, a die bonder including a collet inspection unit.

  In the process of assembling a package, there is a process of mounting a semiconductor chip (hereinafter, simply referred to as a die) on a wiring substrate, lead frame or the like (hereinafter, simply referred to as a substrate) Partly, there are a step of dividing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) (dicing step) and a bonding step of mounting the divided die on a substrate. The semiconductor manufacturing apparatus used in the bonding process is a die bonder.

The die bonder is a device for bonding (mounting and bonding) a die on a substrate or an already bonded die using solder, gold plating, and a resin as a bonding material. In a die bonder for bonding a die to, for example, the surface of a substrate, the die is adsorbed and picked up from the wafer using a suction nozzle called a collet, transported onto the substrate, applied with a pressing force, and heating the bonding material. As a result, the operation (work) of bonding is performed repeatedly. The collet is a holder that has suction holes, sucks air, and holds the die by suction, and has the same size as the die.
In such a die bonder, it is necessary to replace the collet depending on the kind (die size etc.) or to replace the collet in contact with the surface of the die for each constant use in order to prevent scratches and contamination on the surface of the die. There is. After exchanging the collet, it is necessary to install the collet in an appropriate position and in an appropriate position (e.g., Patent Document 1).

JP, 2016-139629, A

In Patent Document 1, a projection with which a plurality of locations of the collet come in contact is provided in the movement path of a die moving means (pickup head or bonding head) provided with the collet, and the inclination of the collet is determined based on the height . However, although the inclination can be determined, the shape abnormality of the collet is not known.
An object of the present disclosure is to provide a semiconductor manufacturing apparatus including a collet confirmation inspection unit capable of confirming the shape and mounting state of a collet.
Other problems and novel features will be apparent from the description of the present specification and the accompanying drawings.

The outline of typical ones of the present disclosure will be briefly described as follows.
That is, the semiconductor manufacturing apparatus includes a head that sucks and picks up a die with a collet, a collet inspection unit that checks and inspects the collet, and a control device that controls the head and the collet inspection unit. The collet inspection unit includes a shape detection sensor. The control device reads the shape of the collet by the shape detection sensor.

  According to the above-described semiconductor manufacturing apparatus, the shape and mounting state of the collet can be confirmed.

Diagram to explain the configuration example of the die bonder A diagram for explaining the configuration of the die bonder of FIG. A diagram for explaining the configuration of the die supply unit of FIG. The figure explaining the principal part of the die supply part of FIG. 3 The figure explaining the structure of the collet holder used with the die bonder of FIG. The figure explaining the structure of the collet holder of FIG. 5 Diagram illustrating the collet of FIG. 5 A diagram for explaining the collet inspection unit of FIG. 2 A diagram for explaining the fingerprint sensor of FIG. A diagram for explaining the detection of the tilt of the collet by the fingerprint sensor of FIG. The figure explaining an example of the bonding method in the die bonder of FIG. The figure explaining an example of the bonding method in the die bonder of FIG. A flow chart showing a method of manufacturing a semiconductor device using the die bonder of FIG. The figure explaining the collet inspection part concerning a modification A diagram for explaining the detection of the tilt of the collet by the fingerprint sensor of FIG. The figure explaining the other example of the bonding method in the die bonder of FIG. The figure explaining the other example of the bonding method in the die bonder of FIG.

  Hereinafter, examples and modifications will be described using the drawings. However, in the following description, the same components may be assigned the same reference numerals and repeated descriptions may be omitted. Note that the drawings may be schematically represented as to the width, thickness, shape, etc. of each portion in comparison with the actual embodiment in order to clarify the description, but this is merely an example, and the interpretation of the present invention is not limited. It is not limited.

  FIG. 1 is a top view schematically showing a die bonder according to an embodiment. FIG. 2 is a view for explaining the operation of the pickup head and the bonding head when viewed from the direction of arrow A in FIG.

  The die bonder 10 is roughly divided into a supply unit 1 for supplying a die D to be mounted on a substrate S on which a product area (hereinafter referred to as a package area P) to be one or a plurality of final one packages is printed. The intermediate stage unit 3, the bonding unit 4, the transport unit 5, the substrate supply unit 6, the substrate output unit 7, and the control unit 8 that monitors and controls the operation of each unit. The Y-axis direction is the front-rear direction of the die bonder 10, and the X-axis direction is the left-right direction. The die supply unit 1 is disposed on the front side of the die bonder 10, and the bonding unit 4 is disposed on the back side.

  First, the die supply unit 1 supplies a die D to be mounted on the package area P of the substrate S. The die supply unit 1 has a wafer holder 12 for holding the wafer 11 and a push-up unit 13 shown by a dotted line for pushing up the die D from the wafer 11. The die supply unit 1 is moved in the X and Y directions by drive means (not shown) to move the die D to be picked up to the position of the push-up unit 13.

  The pickup unit 2 includes a pickup head 21 for picking up the die D, a Y driving unit 23 for the pickup head for moving the pickup head 21 in the Y direction, and driving units (not shown) for moving the collet 22 up and down and rotating it in the X direction. And. The pickup head 21 has a collet 22 (see also FIG. 2) for attracting and holding the pushed up die D at its tip, picks up the die D from the die supply unit 1 and places it on the intermediate stage 31. The pickup head 21 has respective driving units (not shown) for moving the collet 22 up and down, rotating and moving in the X direction.

  The intermediate stage unit 3 has an intermediate stage 31 for temporarily placing the die D, a stage recognition camera 32 for recognizing the die D on the intermediate stage 31, and a collet inspection unit 90.

The bonding unit 4 picks up the die D from the intermediate stage 31 and bonds it onto the package area P of the substrate S transported onto the bonding stage BS or a die already bonded onto the package area P of the substrate S. Bonding in the form of laminating on top of the The bonding unit 4 includes a bonding head 41 having a collet 42 (see also FIG. 2) that holds the die D by suction like the pickup head 21, a Y drive unit 43 that moves the bonding head 41 in the Y direction, and a substrate A position recognition mark (not shown) of the package area P of S is imaged, and a substrate recognition camera 44 which recognizes a bonding position is provided.
With such a configuration, the bonding head 41 corrects the pickup position and attitude based on the imaging data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, and the substrate based on the imaging data of the substrate recognition camera 44. Bond a die D to S.

The transport unit 5 includes a substrate transport claw 51 that grips and transports the substrate S, and a transport lane 52 in which the substrate S moves. The substrate S is moved in the X direction by driving a nut (not shown) of the substrate conveyance claw 51 provided in the conveyance lane 52 with a ball screw (not shown) provided along the conveyance lane 52.
With such a configuration, the substrate S moves from the substrate supply unit 6 to the bonding position along the transport lane 52, moves to the substrate unloading unit 7 after bonding, and delivers the substrate S to the substrate unloading unit 7.

  The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each unit of the die bonder 10, and a central processing unit (CPU) for executing the program stored in the memory.

  Next, the configuration of the die supply unit 1 will be described using FIGS. 3 and 4. FIG. 3 is an external perspective view of the die supply unit. FIG. 4 is a schematic cross-sectional view showing the main part of the die supply unit.

  The die supply unit 1 includes a wafer holder 12 which moves in the horizontal direction (XY direction), and a push-up unit 13 which moves in the vertical direction. The wafer holder 12 has an expand ring 15 for holding the wafer ring 14 and a support ring 17 for horizontally positioning the dicing tape 16 held by the wafer ring 14 and to which a plurality of dies D are bonded. The push-up unit 13 is disposed inside the support ring 17.

  The die supply unit 1 lowers the expand ring 15 holding the wafer ring 14 when the die D is pushed up. As a result, the dicing tape 16 held by the wafer ring 14 is stretched and the distance between the dies D increases, and the push-up unit 13 pushes up the die D from below the die D to improve the pick-up performance of the die D. The adhesive that bonds the die to the substrate changes from liquid to film, and a film-like adhesive material called die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. There is. In a wafer 11 having a die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16. The die attach film 18 is cured by heating.

  The die bonder 10 includes a wafer recognition camera 24 for recognizing the attitude of the die D on the wafer 11, a stage recognition camera 32 for recognizing the attitude of the die D mounted on the intermediate stage 31, and a mounting position on the bonding stage BS. And a substrate recognition camera 44 for recognition. It is the stage recognition camera 32 involved in picking up by the bonding head 41 and the substrate recognition camera 44 involved in bonding to the mounting position by the bonding head 41 that must be corrected for posture deviation between recognition cameras.

  Next, the collet and the collet holder for holding the collet will be described with reference to FIGS. 5-7 is a figure for demonstrating the collet and collet holder which are used by the die bonder of FIG. FIG. 5 is a cross-sectional view of the pickup head, the collet holder and the collet. FIG. 6 is a top view of the collet holder. FIG. 7 is a bottom view of the collet. Hereinafter, although the collet 22 of the pickup head 21 will be described, the collet 42 of the bonding head 41 is the same.

  The collet holder 25 includes a suction hole 25 a communicating with the suction hole 21 a of the pickup head 21 and a magnet 25 b fixing the collet 22 at the center. The collet holder 25 has notches (claw escapes) 251c near the centers of the four sides so that the collet replacement jig can grip the collet. The opening of the collet holder 25 tapers wider toward the bottom so that the collet 22 can be attached by suctioning the collet 22 by the magnet 25 b.

  The collet 22 has stainless steel (SUS (magnetic)) 22b welded to the back surface of an elastic body 22a such as silicone rubber so that it can be fixed by a magnet, and its four sides are held by the collet holder 25 to adsorb the die D. A plurality of suction holes 221 communicating with the suction holes 251a are provided. On the surface of the elastic body 22a, there is provided a holding portion 22c which is held in contact with the die D. The holding portion 22c is integrally formed with the elastic body 22a, and has the same size as the die D.

  When picking up the die D from the wafer 11, the collet 22 lands on the surface of the die D, but at that time, receives pressure. Thereafter, the die D attracted by the collet 22 is transported onto the intermediate stage 31 by the movement of the pickup head 21. The transported die D lands on the intermediate stage 31. The collet 42 picks up the die D from the intermediate stage 31 and transports the die D absorbed by the collet 42 onto the substrate S by the movement of the bonding head 41. The transported die D lands on the substrate S, and receives a load (several N to several dozen N) for bonding in the vertical direction from the bonding head 41. That is, the die bonder mass-produces the product by repeating this process.

  Therefore, the elastic body 22a and the like of the collet 22 formed of silicone rubber etc. gradually deform (so-called collapse) by repeating the above-mentioned steps, and it is necessary to replace it when the production amount reaches a certain level. Become. At the time of the replacement, the collet is carried out alone or integrally with the collet holder. In this case, errors (so-called, in the joint portion between the newly exchanged collet and the collet or the joint portion between the head and the holder) "Guttering") occurs.

  In the die bonder, the collet needs to be replaced after every constant use. In addition, after replacing the collet, it is necessary to install the collet in an appropriate position and in an appropriate position.

  Next, a collet inspection unit that confirms and inspects the collet before and after replacement will be described using FIGS. FIG. 8 is a view for explaining the collet inspection unit, FIG. 8 (A) is a schematic side view of the collet and the collet inspection unit, and FIG. 8 (B) is a schematic perspective view of the fingerprint sensor. FIG. 9 is a diagram for explaining the fingerprint sensor of FIG. FIG. 10 is a diagram for explaining the detection of the inclination of the collet by the fingerprint sensor of FIG. Hereinafter, although the collet 22 of the pickup head 21 will be described, the collet 42 of the bonding head 41 is the same.

  The collet inspection unit 90 includes a fingerprint sensor 91 which is a shape detection sensor, a support plate 92, and a detection circuit 93. The detection circuit 93 connects the fingerprint sensor 91 via the cable 94.

  In general, the fingerprint sensor can detect even fine bumps and dips of the contacting portion, and there are an optical method, a capacitance method, an electric field strength method, and the like. The fingerprint is composed of irregularities on the surface of the finger, and the convex part is called a ridge and the concave part is called a valley. The average fingerprint unevenness is about 50 μm in height and about 400 μm between ridges, and the fingerprint is detected at about 50 μm intervals and converted into an electrical signal. For example, in the capacitance method, the characteristic is used that the distance between the finger and the sensor changes in accordance with the unevenness of the ridges and valleys of the fingerprint and the capacitance also changes.

  In the embodiment, the fingerprint sensor 91 detects the shape of the collet (outer size, layout of vacuum suction holes and / or vacuum suction grooves, wear, adhesion of foreign matter) instead of fingerprints. When using, for example, a capacitance method for the fingerprint sensor 91, as shown in FIG. 9, the capacitance between the surface of the holding portion 22c of the collet 22 and the electrode 91b in the plate 91a of the fingerprint sensor 91 is detected. Image the shape of the collet. It goes without saying that the fingerprint sensor 91 can use a fingerprint sensor other than the capacitive type.

  The detection circuit 93 amplifies the signal input from the cable 94 by an amplifier (not shown), converts it into a digital signal by an A / D converter (not shown), and processes the digital signal by a signal processing circuit (not shown).

  When the surface of the holding portion 22c of the collet 22 is worn or attached with foreign matter, the shape of the collet is detected as being different.

  The fingerprint sensor 91 can check the attachment state (tilt) in addition to the shape of the collet. For example, as shown in FIG. 10, when the collet 22 is inclined, only a part of the holding portion 22c of the collet 22 contacts the fingerprint sensor 91, so that the shape of the collet is detected as being different.

  The speed immediately before the collet 22 contacts the fingerprint sensor 91 allows a slower movement compared to the speed at which the collet 22 moves at a position sufficiently away from the fingerprint sensor 91. Thereby, immediately before the collet 22 contacts the fingerprint sensor 91, there is a merit that damage to the collet 22 due to a collision when the collet 22 contacts the fingerprint sensor 91, damage to the fingerprint sensor 91, and a load on the Z driving unit In addition to the above, when the collet 22 moves at a position sufficiently away from the fingerprint sensor 91, the collet 22 can move at a speed faster than the speed immediately before contacting the fingerprint sensor 91, thereby measuring the position of the present collet 22. There is an advantage that can be implemented quickly.

  Further, when the collet 22 contacts the fingerprint sensor 91, the contact can be detected with a constant force, for example, a force of 1 N or less. This is only required to detect contact between the collet 22 and the fingerprint sensor 91 accurately and with high accuracy. However, when the contact force is not too strong, the collet 22 or the fingerprint sensor 91 can be configured not to be broken.

  The collet inspection unit 90 is disposed on the intermediate stage unit 3 (in the vicinity of the intermediate stage 31), but may be installed on the intermediate stage 31 or even outside the intermediate stage unit 3 with the bonding head 41 You may install in the position which both sides of the pickup head 21 can access. That is, it may be disposed at a position where both the bonding head 41 and the collet of the pickup head 21 can be checked and inspected. Further, the collet inspection unit 90 is movably installed at a position where both the bonding head 41 and the pickup head 21 can access so that both the bonding head 41 and the collet of the pickup head 21 can be checked and inspected. Good.

  Next, the bonding operation will be described with reference to FIGS. 11 and 12 are flowcharts showing an example of a bonding method in the die bonder of FIG. Terminal A of the flowchart of FIG. 11 is connected to terminal A of the flowchart of FIG. 12, and terminal B of the flowchart of FIG. 12 is connected to terminal B of the flowchart of FIG. Hereinafter, although the collet 22 of the pickup head 21 will be described, the collet 42 of the bonding head 41 is the same.

  First, the control unit 8 initializes bonding (step S1). Here, the control unit 8 performs initialization of the positions of the pickup head 21 and the bonding head 41, initialization of the positions of the wafer recognition camera 24, the stage recognition camera 32, and the substrate recognition camera 44, and so on. The shape of the collet 22 at the correct position is read and registered. Specifically, the control unit 8 moves the collet 22 onto the collet inspection unit 90, contacts the fingerprint sensor 91, reads the shape of the holding unit 22c of the collet 22, and stores the memory in the control unit 8 (Not shown).

  Next, the controller 8 picks up the die D from the wafer 11 with the pickup head 21 and places it on the intermediate stage 31, picks up the die D from the intermediate stage 31 with the bonding head 41, and mounts it on the substrate S etc. The operation is performed (step S2). Next, the control unit 8 determines whether a predetermined number of mounting operations have been performed (step S3). The control unit 8 ends the process if it is performed a predetermined number. If the control unit 8 has not performed a predetermined number of times, the control unit 8 determines whether a confirmation set value (device production number or device operation time) which is the number or time required for confirmation of the collet 22 is exceeded. (Step S4). Here, the confirmation setting value of the collet 22 and the confirmation setting value of the collet 42 may be different. If it does not exceed the confirmation set value, the process returns to step S2 and the mounting operation is performed. If it exceeds the confirmation set value, the control unit 8 collates the collet in order to grasp the degree of wear and the like of the holding unit 22 c of the collet 22. That is, the control unit 8 moves the collet 22 to the collet inspection unit 90 by the pickup head 21 and the bonding head 41 (step S5), and reads the shape of the holding unit 22c of the collet 22 by the collet inspection unit 90 (step S6) . The control unit 8 determines whether the shape of the holding portion 22c of the collet 22 is a shape registered in advance in the initialization of step S1 (step S7). If YES, the process returns to step S2 and the mounting operation is performed. In the case of NO, the collet 22 is replaced (step S8).

  The collet 22 may be replaced manually by an operator, or may be replaced by an automatic collet replacement technique.

  Next, the control unit 8 causes the pickup head 21 to move the collet 22 onto the collet inspection unit 90 to bring it into contact (step S9), and the collet inspection unit 90 reads the shape of the collet 22 (step SA). It is determined whether the shape of the collet 22 is the shape registered in advance in the initialization of step S1 (step SB). If YES, the process returns to step S2 and the mounting operation is performed. In the case of NO, the control unit 8 notifies of an abnormality (step SC). In this case, for example, the control unit 8 displays a collet image, and in the case of a collet shape with a beautiful pattern, the operator determines that the collet is a wrong type and manually or automatically changes it to a correct collet. If the pattern does not have the shape of the collet, the operator determines that the mounting is improper, such as collet inclination, and the collet 22 is remounted manually or automatically on the collet holder 25.

  Next, a method of manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIG. FIG. 13 is a flowchart showing a method of manufacturing a semiconductor device.

  Step S11: The wafer ring 14 holding the dicing tape 16 to which the die D divided from the wafer 11 is attached is stored in a wafer cassette (not shown) and carried into the die bonder 10. The controller 8 supplies the wafer ring 14 to the die supply unit 1 from the wafer cassette in which the wafer ring 14 is filled. Also, the substrate S is prepared and carried into the die bonder 10. The control unit 8 places the substrate S on the transport lane 52 by the substrate supply unit 6.

  Step S12: The controller 8 picks up the die D from the dicing tape 16 held by the wafer ring 14.

  Step S13: The controller 8 stacks the picked up die D on the package area P of the substrate S or on the already bonded die. More specifically, the control unit 8 places the die D picked up from the dicing tape 16 on the intermediate stage 31, picks up the die D again from the intermediate stage 31 with the bonding head 41, and packages the substrate S transported. Bond to area P.

  Step S14: The control unit 8 moves the substrate S to the substrate unloading unit 7 by the substrate conveyance claw 51, delivers the substrate S to the substrate unloading unit 7, and unloads the substrate S from the die bonder 10 (substrate unloading).

  In the embodiment, by using a fingerprint sensor such as an optical fingerprint sensor or a capacitive fingerprint sensor, it is possible to detect even the fine irregularities of the contacting portion and the shape of the collet (abrasion, foreign matter adhesion) and the attachment state (highly accurate) Slope) can be detected. Also, the shape of the collet can be easily registered as in fingerprint registration. A plurality of types of collets used in automatic collet exchange can be registered by fingerprint recognition, and confirmation after automatic exchange can be easily performed. It is possible to prevent in advance product defects due to collet abnormalities.

<Modification>
Hereinafter, some representative modifications will be illustrated. In the following description of the modified example, the same reference numerals as those in the above-described embodiment may be used for portions having the same configurations and functions as those described in the above-described embodiments. And about description of this part, the description in the above-mentioned example shall be suitably used in the range which is not technically contradictory. In addition, part of the above-described embodiment and all or part of the plurality of modified examples may be applied in combination as appropriate as long as there is no technical contradiction.

  FIG. 14 is a view for explaining a collet inspection unit according to a modification, FIG. 14 (A) is a schematic side view of the collet and the collet inspection unit, and FIG. 14 (B) is a schematic perspective view of a fingerprint sensor. is there. FIG. 15 is a diagram for explaining the detection of the inclination of the collet by the fingerprint sensor of FIG. Hereinafter, although the collet 22 of the pickup head 21 will be described, the collet 42 of the bonding head 41 is the same.

  The collet inspection unit 90A includes pressure sensors 95a, 95b, and 95c in addition to the fingerprint sensor 91, the support plate 92, and the detection circuit 93 of the collet inspection unit 90 of the embodiment. The detection circuit 93A is connected to the fingerprint sensor 91 via the cable 94, and also connected to the pressure sensors 95a, 95b and 95c via the cables 97a, 97b and 97c and the output parts 96a, 96b and 96c. The pressure sensors 95a, 95b, 95c support the fingerprint sensor 91 at three points.

  The detection circuit 93A amplifies the signal input from the cable 94 and processes the signal in the same manner as the detection circuit 93 of the embodiment, and amplifies the signals input from the cables 97a, 97b and 97c with an amplifier (not shown). Then, they are converted into digital signals by an A / D converter (not shown) and processed by a signal processing circuit (not shown).

  Each of the pressure sensors 95a, 95b, 95c is, for example, formed of a piezo element which is a pressure sensitive element.

  That is, according to the collet inspection unit 90A configured as described above, when the collet 22 is inclined due to any cause, an imbalance occurs in the outputs from the three pressure sensors 95a, 95b, 95c. Therefore, the output of these three pressure sensors 95a, 95b, 95c, for example, determines its center of gravity, and determines the distance (degree of deviation) deviated from the original (if not inclined) center of gravity. Thus, the inclination of the collet 22 can be easily detected.

  Next, the bonding operation will be described with reference to FIGS. 16 and 17 are flow charts showing another example of the bonding method in the die bonder of FIG. The terminal A of the flowchart of FIG. 16 is connected to the terminal A of the flowchart of FIG. 17, and the terminal B of the flowchart of FIG. 17 is connected to the terminal B of the flowchart of FIG. Hereinafter, although the collet 22 of the pickup head 21 will be described, the collet 42 of the bonding head 41 is the same.

  Steps S1 to S5 are the same as in the embodiment of FIG.

  The control unit 8 collates the collet in order to grasp the degree of wear and the like of the collet 22. That is, the control unit 8 moves the collet 22 to the collet inspection unit 90 by the pickup head 21 and the bonding head 41 (step S5), and reads the height and shape of the collet 22 by the collet inspection unit 90 (step S6A).

  The control unit 8 determines whether the collet height or the variation in height of the holding unit 22c of the collet 22 exceeds a predetermined value (step S7A). In the case of NO, the process moves to step S7, and in the case of YES, the process moves to step S8.

  In step S7, the control unit 8 determines whether the shape of the holding portion 22c of the collet 22 is the shape registered in advance in the initialization of step S1. If YES, the process returns to step S2 and the mounting operation is performed. In the case of NO, the process moves to step S8.

  In step S8, the collet 22 is replaced. The collet 22 may be replaced manually by an operator, or may be replaced by an automatic collet replacement technique.

  Next, the control unit 8 causes the pickup head 21 to move the collet 22 onto the collet inspection unit 90 to bring it into contact (step S9), and the collet inspection unit 90 reads the height and shape of the holding unit 22c of the collet 22 (step S9) Step SAA).

  The control unit 8 determines whether the collet height or the variation in height of the holding unit 22c of the collet 22 exceeds a predetermined value (step SBA). If it is less than the first predetermined value, the process proceeds to step SB. If it exceeds the first predetermined value but is less than the second predetermined value, the process proceeds to step SD. If it exceeds the second predetermined value, the process returns to step S8. Reinstall 22.

  In step SD, the controller 8 moves the pickup head 21 to adjust the tilt of the collet 22 based on the variation in height.

  In step SB, the control unit 8 determines whether the shape of the collet 22 is a shape registered in advance in the initialization of step S1 (step SB). If YES, the process returns to step S2 and the mounting operation is performed. In the case of NO, the control unit 8 determines that the type of collet is wrong, and returns to step S8 to replace it with a correct collet.

  In the modification, a plurality of pressure sensors are incorporated under the fingerprint sensor 91, and the collet attachment state (the outer shape size, the vacuum suction holes and / or the layout of the vacuum suction holes and / or the vacuum suction grooves, wear, foreign matter adhesion) Check the tilt angle and height). Thereby, all the elements (attachment position, inclination, wear, adhesion of foreign matter, etc.) concerning the abnormality of the collet can be detected at one time. If the inclination angle is less than a predetermined value, the inclination of the collet is adjusted by the head, and if the inclination angle exceeds the predetermined value, the collet can be replaced and confirmed automatically by reattaching the collet. . By automatically grasping the degree of wear of the collet and by adding the automatic collet exchange function, all the series of operations become automatic, and it is possible to reduce labor cost and improve quality by human error reduction. It becomes.

  Although the invention made by the inventor has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above embodiments and can be variously modified.

  For example, in the embodiment, an example in which the collet 22 is configured by the elastic body 22a, the stainless steel 22b, and the holding portion 22c has been described, but is not limited thereto. It may be. Moreover, although the Example demonstrated the example which has a suction hole in a collet, it is not limited to this, For example, you may have a suction groove.

  In the embodiment, although an example using a fingerprint sensor as a shape detection sensor has been described, the present invention is not limited to this. For example, a plurality of sensors may be used to inspect a shape such as unevenness on the surface of a collet The sensor may be a panel-like or sheet-like sensor installed in a two-dimensional lattice or zigzag shape.

  Moreover, although the pressure sensor was used in the modification, a pressure-sensitive sheet or a displacement sensor may be used. Moreover, although the example which provided three pressure sensors was demonstrated in the modification, it is not limited to this, For example, four or more may be sufficient.

  In addition, the surface of the fingerprint sensor (plate) may be cleaned automatically.

  In addition, it may be a die bonder including a plurality of sets of mounting units including a pickup unit, an alignment unit, and a bonding unit, and a transfer lane, or a plurality of sets of mounting units including a pickup unit, an alignment unit, and a bonding unit. One may be provided.

  Moreover, although the example using a die attach film was demonstrated in the Example, it is not necessary to provide the preform part which apply | coats an adhesive agent to a board | substrate, and to use a die attach film.

In the embodiment, the die bonder picks up the die from the die supply unit by the pick-up head and places it on the intermediate stage and bonds the die placed on the intermediate stage to the substrate by the bonding head. However, the present invention is applicable to a semiconductor manufacturing apparatus that picks up a die from a die supply unit.
For example, the present invention is also applicable to a die bonder in which the die of the die supply unit is bonded to a substrate by a bonding head without an intermediate stage and a pickup head.
Further, the present invention is applicable to a flip chip bonder which has no intermediate stage, picks up the die from the die supply unit, rotates the die pick up head and transfers the die to the bonding head and bonds it to the substrate with the bonding head.
Further, the present invention is applicable to a die sorter in which there is no intermediate stage and no bonding head, and a die picked up by a pickup head from a die supply unit is placed on a tray or the like.

DESCRIPTION OF SYMBOLS 10 ... Die bonder 1 ... Die supply part 2 ... Pickup part 21 ... Pickup head 22 ... Collet 25 ... Collet holder 3 ... Alignment part 31 ... Intermediate stage 4 ... Bonding part 41: bonding head 42: collet 5: conveyance part 51: substrate conveyance claw 8: control device 90: collet inspection part 91: fingerprint sensor 92: ... Support plate 93 ... detection circuit 94 ... cable D ... die S ... substrate P ... package area

Claims (13)

With a head that sucks and picks up the die with the collet,
A collet inspection unit for confirming and inspecting the collet;
A control device that controls the head and the collet inspection unit;
Equipped with
The collet inspection unit includes a shape detection sensor,
The control device reads the shape of the collet by the shape detection sensor. In claim 1,
The control device compares data stored by reading the shape of the collet at a predetermined position by the shape detection sensor in advance with data obtained by reading the shape of the collet by the shape detection sensor at the time of inspection, and the abnormality of the collet Semiconductor manufacturing equipment to detect In claim 2,
The semiconductor manufacturing apparatus in which the abnormality of the said collet is wear of a collet, foreign material adhesion, inclination, or a form error. In claim 3,
The semiconductor manufacturing apparatus which replaces | exchanges the said collet, when the said control apparatus detects the abnormality of the said collet. In claim 2,
The semiconductor manufacturing apparatus, wherein the collet inspection unit further includes at least three sensors for detecting height or variations in height of the collet under the shape detection sensor. In claim 5,
When the variation in height of the collet is equal to or less than a first predetermined value, the control device determines that the attachment of the collet is normal, and the variation in height of the collet is larger than the first predetermined value and the second The semiconductor manufacturing apparatus determines that it is necessary to adjust the inclination of the collet when it is equal to or less than a predetermined value, and determines that the attachment of the collet is abnormal when the variation in height of the collet is larger than the second predetermined value. In claim 6,
The semiconductor manufacturing apparatus, wherein the sensor is a pressure sensor, a pressure-sensitive sheet or a displacement sensor. In claim 1,
The semiconductor manufacturing apparatus, wherein the shape detection sensor is a fingerprint sensor. In claim 1, further,
A die supply unit having a wafer ring for holding a dicing tape to which a die is attached;
A pickup head for picking up a die attached to the dicing tape;
An intermediate stage on which a die picked up by the pickup head is placed;
A bonding head for bonding a die picked up from the intermediate stage onto a substrate or a die already bonded;
Equipped with
The semiconductor manufacturing apparatus, wherein the head is at least one of the pickup head and the bonding head. In claim 9,
The collet inspection unit is located within the movement range of both the pickup head and the bonding head.
The control device moves the pickup head and the bonding head to the collet inspection unit, and inspects a collet of the pickup head and a collet of the bonding head. (A) preparing a semiconductor manufacturing apparatus according to any one of claims 1 to 10;
(B) carrying in a wafer ring holding a dicing tape to which a die is attached;
(C) preparing and loading a substrate;
(D) picking up the die;
(E) bonding the picked up die onto the substrate or the already bonded die;
Equipped with
Semiconductor device manufacturing method. In claim 11,
In the step (d), a die attached to the dicing tape is picked up by a bonding head,
The step (e) bonds a die picked up by the bonding head onto the substrate or a die already bonded.
Semiconductor device manufacturing method. In claim 11,
In the step (d),
(D1) picking up the die attached to the dicing tape with a pick-up head;
(D2) placing a die picked up by the pickup head on an intermediate stage;
Have
In the step (e),
(E1) picking up a die placed on the intermediate stage with a bonding head;
(E2) placing a die picked up by the bonding head on the substrate;
Equipped with
Semiconductor device manufacturing method.

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