CN113113336B - Anodic bonding equipment - Google Patents
Anodic bonding equipment Download PDFInfo
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- CN113113336B CN113113336B CN202110429052.0A CN202110429052A CN113113336B CN 113113336 B CN113113336 B CN 113113336B CN 202110429052 A CN202110429052 A CN 202110429052A CN 113113336 B CN113113336 B CN 113113336B
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- 239000000428 dust Substances 0.000 claims abstract description 30
- 238000004140 cleaning Methods 0.000 claims abstract description 6
- 238000010438 heat treatment Methods 0.000 claims description 57
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 33
- 238000001816 cooling Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 4
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 49
- 239000011521 glass Substances 0.000 abstract description 49
- 229910052710 silicon Inorganic materials 0.000 abstract description 49
- 239000010703 silicon Substances 0.000 abstract description 49
- 230000000694 effects Effects 0.000 abstract description 12
- 230000001846 repelling effect Effects 0.000 abstract description 3
- 238000001125 extrusion Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000004744 fabric Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 238000004804 winding Methods 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 230000005389 magnetism Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
The invention discloses anodic bonding equipment, which belongs to the technical field of anodic bonding and comprises a base, a support and side plates, wherein the side plates and the support are fixedly connected to the upper side surface and the lower side surface of the base respectively, a bonding mechanism is arranged on the front surface of each side plate, a clamping mechanism and a dust cleaning mechanism are arranged on the front side and the rear side of each bonding mechanism respectively, and mounting plates are fixedly connected to the lower surfaces of the clamping mechanism and the dust cleaning mechanism respectively. According to the invention, by arranging the clamping mechanism, the silicon wafer and the glass sheet can be respectively placed in the through holes, and the electromagnet plate can generate a repelling effect on the magnetic supporting plate when being electrified, so that the two supporting plates are far away from the inner wall matched with the first fixed block to effectively position the silicon wafer and the glass sheet, meanwhile, the first connecting plate drives the first connecting plate to move through the connecting rod, the arc plate generates an extrusion effect on the silicon wafer or the glass sheet, the silicon wafer and the glass sheet are extruded out, the silicon wafer and the glass sheet are attached together, and the effect of rapid assembly is achieved.
Description
Technical Field
The invention belongs to the technical field of anodic bonding, and particularly relates to anodic bonding equipment.
Background
Anodic bonding is a method of wafer bonding, widely used in the microelectronics industry, which utilizes a combination of heat and electrostatic fields to seal two surfaces together. This bonding technique is most commonly used to seal a glass layer to a silicon wafer.
When bonding equipment bonds a silicon wafer and a glass sheet, fine particle impurities such as dust and the like possibly exist on the surfaces of the silicon wafer and the glass sheet, the impurities can affect the bonding effect of the silicon wafer and the glass sheet, the sealing surface is not tightly bonded, the normal use of the silicon wafer and the glass sheet is affected, meanwhile, a heating mechanism is generally required to be used during bonding, but the heating mechanism is in a high-temperature state during long-time use, the burden of the heating mechanism can be increased, the service life of the heating mechanism is shortened, the bonding efficiency of the silicon wafer and the glass sheet can be reduced if the heating mechanism is waited for cooling, and the yield is low.
Disclosure of Invention
The invention aims to: the anodic bonding equipment aims to solve the problems that fine particle impurities such as dust and the like possibly exist on the surfaces of a silicon wafer and a glass sheet, the impurities can affect the bonding effect of the silicon wafer and the glass sheet, the bonding of a sealing surface is not compact, the normal use of the silicon wafer and the glass sheet is affected, meanwhile, a heating mechanism is generally required to be used during bonding, but the heating mechanism is in a high-temperature state during long-time use, the burden of the heating mechanism is increased, the service life of the heating mechanism is shortened, the bonding efficiency of the silicon wafer and the glass sheet is reduced if the heating mechanism is waited to be cooled, and the yield is low.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an anodic bonding equipment, includes base, support and curb plate, the upper and lower both sides face difference fixedly connected with curb plate and the support of base, the front of curb plate is provided with the bonding mechanism, both sides are provided with fixture and dust removal mechanism respectively around the bonding mechanism, the equal fixedly connected with mounting panel of lower surface of fixture and dust removal mechanism, the lower fixed surface of mounting panel is connected with the second slider, and second slider sliding connection is in the second spout that the base upper surface was seted up, the left surface of two mounting panels and adjustment mechanism's right flank fixed connection, and adjustment mechanism fixed mounting is at the upper surface of base, the cavity has been seted up to the base is inside, is provided with heating mechanism in the cavity, and the back of curb plate is provided with cooling body.
As a further description of the above technical solution:
the bonding mechanism comprises first electric push rods clamped on the left side and the right side of the upper surface of the top plate, the top plate is fixedly connected to the front side of the side plate, and the bottom end of each first electric push rod and the upper surface of the base are fixedly connected with electrode plates.
As a further description of the above technical solution:
fixture includes first fixed block, and two longitudinal symmetry's through hole has been seted up in the front of first fixed block, and the middle part of first fixed block is provided with the electromagnetism iron plate, all is provided with the backup pad in two through holes, and two backup pads are laminated respectively at the opposite face of two through hole inner walls, and the backup pad is the magnetism material.
As a further description of the above technical solution:
one side of the supporting plate is fixedly connected with a first connecting plate through two connecting rods, the first connecting plate is located in a groove formed in the inner wall of the through hole, one side of the first connecting plate is fixedly connected with an arc, one side, away from the first connecting plate, of the arc is an arc surface, the left side and the right side of the supporting plate are fixedly connected with first sliding blocks, the first sliding blocks are connected in first sliding grooves formed in the inner wall of the through hole in a sliding mode, and one side of each first sliding block is fixedly connected with the inner wall of each first sliding groove through a first spring.
As a further description of the above technical solution:
dust removal mechanism includes the second fixed block, and the groove of accomodating has all been seted up to the upper and lower both sides face of second fixed block, accomodates the inslot and is provided with the rectangular plate, and the equal joint of the left and right sides face of rectangular plate inner wall has the second bearing, and the second bearing endotheca is equipped with the second pivot, the right-hand member fixedly connected with runner of second pivot.
As a further description of the above technical solution:
the constant head tank has all been seted up to the position that both sides face corresponds the second pivot about the second fixed block, and the second pivot is located the constant head tank, a plurality of separation blades of the outer fixed surface of runner, the separation blade is the elastic plastic material, and a plurality of separation blades are the annular and arrange and set up for the slope, the rear side of runner is provided with the V-arrangement board, and V-arrangement board fixed connection is in a side of second fixed block.
As a further description of the above technical solution:
adjustment mechanism includes the first bearing of fixed connection both sides around the base upper surface, and the first bearing endotheca is equipped with first pivot, and the positive one end fixedly connected with of the first pivot of front side changes the piece, the equal fixedly connected with screw thread post in looks remote site of two first pivots, the mutual fixed connection in looks remote site of two screw thread posts, and the screw thread direction of two screw thread posts is mutually opposite, and the surface threaded connection of screw thread post has screw cap, the right flank fixedly connected with mounting panel of screw cap.
As a further description of the above technical solution:
the heating mechanism includes the third bearing of joint at cavity inner wall lower surface, and the third bearing endotheca is equipped with the third pivot, and the surface joint of third pivot has the gear, the top fixedly connected with revolving stage of third pivot, the spacing groove has all been seted up to both sides around the revolving stage upper surface, and the spacing inslot is provided with the heating furnace, and the lower fixed surface that second spring and spacing inslot wall are all passed through to the left and right sides of heating furnace lower surface is connected, the equal fixedly connected with electromagnetism iron plate of the left and right sides face of heating furnace, the upside of electromagnetism iron plate are provided with the magnetism and inhale the piece, and magnetism inhales piece fixed connection at the lower surface of cavity inner wall.
As a further description of the above technical solution:
the right side of gear is provided with the rack, and the front of rack is through the first piece that draws of slide bar fixedly connected with, and the outside cover of slide bar is equipped with the sliding sleeve, and the sliding sleeve joint is in the front of base, the card hole has all been seted up to both sides around the slide bar right flank, the positive fixedly connected with stationary blade of base, stationary blade are located the right side of slide bar, the right flank joint of stationary blade has the plug bush, is provided with the inserted bar in the plug bush, and the right-hand member fixedly connected with second of inserted bar draws the piece, and the outside cover of inserted bar is equipped with the third spring, and the opposite face fixed connection that the piece was drawn with sliding sleeve and second respectively at the both ends of third spring.
As a further description of the above technical solution:
cooling body is provided with the water storage shell including seting up the dead slot at the curb plate back in the dead slot, and the water storage shell is the metal material, and the lower surface of water storage shell runs through to the cavity inside, water bag fixedly connected with second connecting plate is passed through at the back of water storage shell, and water storage shell and water bag communicate each other, and the positive left and right sides of second connecting plate all is in the front of curb plate through second electric putter fixed connection.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. in the invention, by arranging the clamping mechanism, the silicon chip and the glass sheet can be respectively placed in the through holes, the electromagnet plate can generate repulsion effect on the magnetic support plate when being electrified, so that the two support plates are far away from the inner wall matched with the first fixed block to effectively position the silicon chip and the glass sheet, and by arranging the first sliding block and the first sliding chute, the support plates can stably move up and down along the track under the action of the first sliding block and the first sliding chute to achieve the effect of effectively clamping the silicon chip and the glass sheet, when the electromagnet plate is not electrified any more, the first sliding block can push the first sliding block to move to the initial position through the self elastic extension, the first sliding block drives the first connecting plate to move to not clamp the silicon chip and the glass sheet any more, meanwhile, the first connecting plate drives the first connecting plate to move through the connecting rod, and the arc plate generates extrusion effect on the silicon chip or the glass sheet, the silicon chip and the glass sheet are extruded out, and the silicon chip and the glass sheet are attached together, so that the effect of rapid assembly is achieved.
2. According to the invention, by arranging the dust cleaning mechanism, the second fixing block can drive the two pieces of adhesive cloth to move forwards when moving forwards, the two pieces of adhesive cloth can respectively adhere dust adhered to the opposite surfaces of the silicon wafer and the glass sheet, the adhered adhesive cloth can be wound by the winding roller on the rear side in the moving process, meanwhile, when the second fixing block moves backwards, the two winding rollers can rotate reversely under the action of the adhesive cloth, the baffle plate on the rotating wheel can be blocked by the V-shaped plate, so that the rotating wheel can not rotate reversely, the adhesive cloth can not drive the winding roller to rotate reversely, and when the second fixing block moves backwards to the initial position, the adhesive cloth adhered with the dust can not rotate at the initial position, so that the dust on the next silicon wafer and the glass sheet can be effectively adhered.
3. In the invention, by arranging the heating mechanism, two heating furnaces are arranged in the heating mechanism and can be used alternately to achieve the effect of heating electrode plates so that silicon wafers and glass sheets can achieve the bonding effect, by arranging the magnet sheets, the electromagnet blocks and the second spring, when the electromagnet blocks are electrified, the magnet sheets can be adsorbed, the electromagnet blocks drive the heating furnaces to move upwards at the moment so that the heating furnaces are attached to the electrode plates, the electrode plates can be heated when the heating furnaces work, if the heating furnaces need to be replaced after being used for a long time, the gear can be driven to rotate by controlling the movement of the rack through arranging the gear and the rack, the gear drives the rotary table to rotate through the third rotating shaft, so that the two heating furnaces can be replaced and used, the rear heating furnace is moved to the front side to heat the electrode plates, the front heating furnace is moved to the rear side to stop working and cool, and the heating furnaces can be effectively protected, the service life is prevented from being rapidly reduced.
Drawings
Fig. 1 is a schematic three-dimensional structure diagram of an anodic bonding apparatus according to the present invention;
FIG. 2 is a schematic three-dimensional exploded view of a clamping mechanism in an anodic bonding apparatus according to the present invention;
FIG. 3 is a schematic three-dimensional exploded view of a dust removing mechanism in the anodic bonding apparatus according to the present invention;
FIG. 4 is a schematic perspective view of an adjusting mechanism in an anodic bonding apparatus according to the present invention;
FIG. 5 is a schematic exploded view of a heating mechanism in an anodic bonding apparatus according to the present invention;
fig. 6 is a schematic three-dimensional exploded structural diagram of a cooling mechanism in the anodic bonding apparatus according to the present invention.
Illustration of the drawings:
1. a base; 2. a support; 3. a side plate; 4. a bonding mechanism; 41. a top plate; 42. a first electric push rod; 43. an electrode sheet; 5. a clamping mechanism; 51. a first fixed block; 52. an arc-shaped plate; 53. a first connecting plate; 54. a support plate; 55. a first spring; 56. a connecting rod; 57. a first slider; 58. an electromagnet plate; 59. a groove; 6. an adjustment mechanism; 61. rotating the block; 62. a threaded post; 63. a first rotating shaft; 7. a dust removal mechanism; 71. gluing cloth; 72. a wind-up roll; 73. a second rotating shaft; 74. a baffle plate; 75. a rectangular plate; 76. a second fixed block; 77. a V-shaped plate; 78. a rotating wheel; 8. a heating mechanism; 81. an electromagnet block; 82. heating furnace; 83. a second spring; 84. a turntable; 85. a limiting groove; 86. a third rotating shaft; 87. a gear; 88. a rack; 89. a slide bar; 810. a clamping hole; 811. a third spring; 812. a fixing sheet; 813. inserting a rod; 9. a cooling mechanism; 91. an empty groove; 92. a water storage shell; 93. a second electric push rod; 94. a water bladder; 95. a second connecting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides an anodic bonding equipment, includes base 1, support 2 and curb plate 3, the upper and lower both sides face difference fixedly connected with curb plate 3 and support 2 of base 1, the front of curb plate 3 is provided with bonding mechanism 4, both sides are provided with fixture 5 and dust removal mechanism 7 respectively around bonding mechanism 4, the equal fixedly connected with mounting panel of lower surface of fixture 5 and dust removal mechanism 7, the lower fixed surface of mounting panel is connected with the second slider, second slider sliding connection is in the second spout that the base 1 upper surface was seted up, the left surface of two mounting panels and adjustment mechanism 6's right flank fixed connection, adjustment mechanism 6 fixed mounting is at the upper surface of base 1, the cavity has been seted up to base 1 inside, is provided with heating mechanism 8 in the cavity, and the back of curb plate 3 is provided with cooling body 9.
The implementation mode is specifically as follows: through setting up fixture 5 and dust removal mechanism 7, utilize fixture 5 to fix silicon chip and glass piece, then utilize dust removal mechanism 7 effectively to be stained with the dust that attaches silicon chip and glass piece bonding face, avoid the bonding operation to receive the influence, utilize adjustment mechanism 6 control fixture 5 and dust removal mechanism 7 supplementary cooperation in the use, 4 work of control bonding mechanism carries out the bonding processing to glass piece and silicon chip after the clearance is accomplished, simultaneously through the supplementary bonding operation of 8 work of control heating mechanism, and can utilize cooling body 9 to cool off heating body 8, avoid heating body 8 to work overheated impaired for a long time.
As shown in fig. 1, the bonding mechanism 4 includes first electric push rods 42 clamped on the left and right sides of the upper surface of a top plate 41, the top plate 41 is fixedly connected to the front surface of a side plate 3, and electrode plates 43 are fixedly connected to the bottom end of the first electric push rod 42 and the upper surface of the base 1;
the implementation mode is specifically as follows: the first electric push rod 42 is controlled to work to drive the electrode plates 43 to move, the two electrode plates 43 approach to each other to clamp the silicon wafer and the glass sheet, and the silicon wafer and the glass sheet can be bonded when the electrode plates 43 are electrified.
As shown in the figure, the clamping mechanism 5 comprises a first fixing block 51, two through holes are formed in the front surface of the first fixing block 51, the through holes are vertically symmetrical, an electromagnet plate 58 is arranged in the middle of the first fixing block 51, support plates 54 are arranged in the two through holes, the two support plates 54 are respectively attached to the opposite surfaces of the inner walls of the two through holes, the support plates 54 are made of magnetic materials, one side surface of the supporting plate 54 is fixedly connected with a first connecting plate 53 through two connecting rods 56, the first connecting plate 53 is positioned in a groove 59 formed in the inner wall of the through hole, one side surface of the first connecting plate 53 is fixedly connected with an arc-shaped plate 52, one side surface of the arc-shaped plate 52 far away from the first connecting plate 53 is an arc surface, the left side surface and the right side surface of the supporting plate 54 are fixedly connected with first sliding blocks 57, the first sliding blocks 57 are connected in first sliding grooves formed in the inner walls of the through holes in a sliding mode, and one side surface of each first sliding block 57 is fixedly connected with the inner wall of each first sliding groove through a first spring 55;
the implementation mode is specifically as follows: the silicon chip and the glass sheet which need to be bonded are respectively inserted into the two through holes, then the electromagnet plate 58 is controlled to be electrified, the electromagnet plate 58 forms a repelling effect on the two support plates 54, the two support plates 54 are respectively far away from each other and simultaneously fix the silicon chip and the glass sheet, so that the silicon chip and the glass sheet can be effectively cleaned, the support plates 54 drive the sliding blocks to move in the sliding grooves when moving, so that the support plates 54 can stably move up and down, when the silicon chip and the glass sheet do not need to be clamped, the electromagnet plate 58 is not electrified any more, so that the silicon chip and the glass sheet cannot be repelled to the support plates 54, the first spring 55 pushes the sliding blocks to move through the self elastic extension, the support plates 54 drive the first connecting plates 53 to move through the connecting rods 56, so that the two arc plates 52 can approach each other, the arc plates 52 extrude the silicon chip and the glass sheet, so that the silicon chip and the glass sheet are separated from the through holes and fall onto the electrode plates 43, and the silicon chip is attached to the glass sheet, and then the silicon chip and the glass sheet are bonded.
As shown in the figure, the dust removing mechanism 7 includes a second fixed block 76, both upper and lower side surfaces of the second fixed block 76 are provided with accommodating grooves, a rectangular plate 75 is arranged in the accommodating grooves, both left and right side surfaces of an inner wall of the rectangular plate 75 are respectively clamped with a second bearing, a second rotating shaft 73 is sleeved in the second bearing, a rotating wheel 78 is fixedly connected to a right end of the second rotating shaft 73, both upper and lower side surfaces of the second fixed block 76 are provided with positioning grooves corresponding to positions of the second rotating shaft 73, the second rotating shaft 73 is located in the positioning grooves, an outer surface of the rotating wheel 78 is fixedly connected with a plurality of blocking pieces 74, the blocking pieces 74 are made of elastic plastic materials, the blocking pieces 74 are annularly arranged and are obliquely arranged, a V-shaped plate 77 is arranged on a rear side surface of the rotating wheel 78, and the V-shaped plate 77 is fixedly connected to one side surface of the second fixed block 76;
the implementation mode is specifically as follows: the second fixing block 76 is controlled to move forwards to drive the two adhesive cloths 71 to move forwards, the two adhesive cloths 71 respectively adhere dust adhered to opposite surfaces of the silicon wafer and the glass sheet, the adhered adhesive cloths 71 are wound by the winding roller 72 on the rear side in the moving process, meanwhile, when the second fixing block 76 moves backwards, the two winding rollers 72 are reversed under the action of the adhesive cloths 71, the blocking piece 74 on the rotating wheel 78 is blocked by the V-shaped plate 77, so that the rotating wheel 78 cannot be reversed, the adhesive cloths 71 cannot drive the winding rollers 72 to be reversed, when the second fixing block 76 moves backwards to the initial position, the adhesive cloths 71 adhered with the dust cannot be reversed at the initial position, the dust on the next silicon wafer and the next glass sheet can be effectively adhered, the rectangular plate 75 is arranged, the rectangular plate 75 is taken out of the second fixing block 76, the cloth 71 can be quickly taken out, and the used cloth 71 can be conveniently replaced, the rectangular plate 75 and the second fixing block 76 are made of magnetic materials, and the rectangular plate 75 cannot be separated randomly when being located in the second fixing block 76.
As shown in the figure, the adjusting mechanism 6 comprises first bearings fixedly connected to the front and rear sides of the upper surface of the base 1, a first rotating shaft 63 is sleeved in each first bearing, a rotating block 61 is fixedly connected to one end of the front side of the first rotating shaft 63, threaded columns 62 are fixedly connected to the opposite ends of the two first rotating shafts 63, the opposite ends of the two threaded columns 62 are fixedly connected to each other, the thread directions of the two threaded columns 62 are opposite to each other, a threaded cap is connected to the outer surface of each threaded column 62 through a thread, and a mounting plate is fixedly connected to the right side surface of each threaded cap;
the implementation mode is specifically as follows: twisting and moving the piece of twisting and can control first pivot 63 and drive the rotation of screw thread post 62 to make the screw cap can remove, two screw caps drive two mounting panels respectively and are close to each other or keep away from, thereby make fixture 5 and dust removal mechanism 7 be close to or keep away from, reach the binding dust effect.
As shown in the figure, the heating mechanism 8 includes a third bearing clamped on the lower surface of the inner wall of the cavity, a third rotating shaft 86 is sleeved in the third bearing, a gear 87 is clamped on the outer surface of the third rotating shaft 86, a rotating table 84 is fixedly connected to the top end of the third rotating shaft 86, limiting grooves 85 are respectively formed in the front and the back of the upper surface of the rotating table 84, a heating furnace 82 is arranged in the limiting grooves 85, the left and the right sides of the lower surface of the heating furnace 82 are respectively and fixedly connected with the lower surface of the inner wall of the limiting groove 85 through a second spring 83, electromagnetic iron blocks 81 are fixedly connected to the left and the right sides of the heating furnace 82, a magnetic attraction sheet is arranged on the upper side of the electromagnetic iron blocks 81, the magnetic attraction sheet is fixedly connected to the lower surface of the inner wall of the cavity, a rack 88 is arranged on the right side of the gear 87, a first pull block is fixedly connected to the front of the rack 88 through a sliding rod 89, a sliding sleeve is sleeved on the outer side of the sliding rod 89, and is clamped on the front of the base 1, the front side and the rear side of the right side of the sliding rod 89 are both provided with clamping holes 810, the front side of the base 1 is fixedly connected with a fixing plate 812, the fixing plate 812 is positioned on the right side of the sliding rod 89, the right side of the fixing plate 812 is clamped with a plug bush, a plug rod 813 is arranged in the plug bush, the right end of the plug rod 813 is fixedly connected with a second pull block, a third spring 811 is sleeved on the outer side of the plug rod 813, and two ends of the third spring 811 are respectively and fixedly connected with the opposite surfaces of the sliding sleeve and the second pull block;
the implementation mode is specifically as follows: when the electromagnet block 81 is electrified, magnet pieces can be adsorbed, the electromagnet block 81 drives the heating furnace 82 to move upwards, the heating furnace 82 is attached to the electrode plate 43, the heating furnace 82 can heat the electrode plate 43 when in work, if the heating furnace 82 needs to be replaced after being used for a long time, the second pulling block is pulled to drive the insertion rod 813 to move away from the clamping hole 810, then the first pulling block drives the sliding rod 89 to move, the sliding rod 89 drives the rack 88 to move back and forth, meanwhile, the electromagnet block 81 is not electrified any more, the second spring 83 pulls the heating furnace 82 to move downwards to the initial position through self elastic force contraction, the rack 88 is controlled to move to drive the gear 87 to rotate, the gear 87 drives the rotary table 84 to rotate through the third rotating shaft 86, so that the two heating furnaces 82 can be replaced and used, after the heating furnace 82 is replaced, the second pulling block is released, and the third spring 811 pulls the second pulling block to drive the insertion rod 813 to move under the tensile force of the third spring 811, the inserted bar 813 is inserted into another clamping hole 810 again to fix the slide bar 89, so that the phenomenon that the heating furnace 82 moves to avoid affecting the bonding effect on the electrode plate 43 due to the fact that the slide bar 89 is touched by mistake in the working process is avoided.
As shown in the figure, the cooling mechanism 9 includes an empty groove 91 formed in the back of the side plate 3, a water storage shell 92 is arranged in the empty groove 91, the water storage shell 92 is made of metal, the lower surface of the water storage shell 92 penetrates into the cavity, the back of the water storage shell 92 is fixedly connected with a second connecting plate 95 through a water bag 94, the water storage shell 92 is communicated with the water bag 94, and the left side and the right side of the front of the second connecting plate 95 are fixedly connected to the front of the side plate 3 through a second electric push rod 93;
the implementation mode is specifically as follows: when the heating furnace 82 needs to be cooled, the second electric push rod 93 is controlled to contract to drive the second connecting plate 95 to move forwards, the second connecting plate 95 compresses the water bag 94, water in the water bag 94 enters the water storage shell 92, under the action of the water storage shell 92 made of metal materials, the water storage shell 92 is matched with condensed water to effectively absorb heat on the heating furnace 82, the heating furnace 82 is rapidly cooled, the connecting plate is controlled to move backwards after the cooling is completed, so that the water bag 94 is expanded, the heated condensed water enters the water bag 94, and the heat is rapidly dissipated by contacting with the outside to prepare for next cooling.
The working principle is as follows: when the silicon chip and the glass sheet which need to be bonded are respectively inserted into the two through holes, then the electromagnet plate 58 is controlled to be electrified, the electromagnet plate 58 forms a repelling effect on the two supporting plates 54, the two supporting plates 54 are respectively far away from each other and simultaneously fix the silicon chip and the glass sheet, the screwing block can be screwed to control the first rotating shaft 63 to drive the threaded column 62 to rotate, so that the threaded cap can move, the two threaded caps respectively drive the two mounting plates to approach each other, the two pieces of adhesive cloth 71 can be driven to move forwards when the second fixing block 76 moves forwards, the two pieces of adhesive cloth 71 respectively stick to dust stuck to the opposite surfaces of the silicon chip and the glass sheet, after the dust is removed, the electromagnet plate 58 is not electrified any more so as not to repel the supporting plates 54, the first spring 55 pushes the sliding block to move through self elastic extension, the supporting plate 54 drives the first connecting plate 53 to move through the connecting rod 56, thereby make two arcs 52 can be close to each other, arc 52 extrudees silicon chip and glass piece, let silicon chip and glass piece break away from the through hole and drop to the electrode slice 43 on, and the silicon chip is in the same place with the glass piece laminating, adsorb the magnet piece for electromagnet 81 circular telegrams, electromagnet 81 drives heating furnace 82 and shifts up this moment, let heating furnace 82 laminate on electrode slice 43, heating furnace 82 during operation can heat electrode slice 43, control first electric putter 42 work and can drive electrode slice 43 and remove, two electrode slices 43 are close to each other and carry silicon chip and glass piece, can be to silicon chip and glass piece bonding when electrode slice 43 circular telegrams.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (5)
1. An anodic bonding device comprises a base (1), a support (2) and side plates (3), and is characterized in that the upper side surface and the lower side surface of the base (1) are fixedly connected with the side plates (3) and the support (2) respectively, the front surface of each side plate (3) is provided with a bonding mechanism (4), the front side and the rear side of each bonding mechanism (4) are provided with a clamping mechanism (5) and a dust cleaning mechanism (7) respectively, the lower surfaces of the clamping mechanism (5) and the dust cleaning mechanism (7) are fixedly connected with mounting plates, each clamping mechanism (5) comprises a first fixing block (51), the front surface of each first fixing block (51) is provided with two through holes which are vertically symmetrical, the middle part of each first fixing block (51) is provided with an electromagnet plate (58), the two through holes are internally provided with support plates (54), and the two support plates (54) are respectively attached to opposite surfaces of the inner walls of the two through holes, the supporting plate (54) is made of magnetic materials, one side face of the supporting plate (54) is fixedly connected with a first connecting plate (53) through two connecting rods (56), the first connecting plate (53) is located in a groove (59) formed in the inner wall of the through hole, one side face of the first connecting plate (53) is fixedly connected with an arc-shaped plate (52), one side face, away from the first connecting plate (53), of the arc-shaped plate (52) is an arc face, the left side face and the right side face of the supporting plate (54) are both fixedly connected with first sliding blocks (57), the first sliding blocks (57) are slidably connected in first sliding grooves formed in the inner wall of the through hole, and one side face of each first sliding block (57) is fixedly connected with the inner wall of each first sliding groove through a first spring (55);
the dust cleaning mechanism (7) comprises a second fixed block (76), the upper side surface and the lower side surface of the second fixed block (76) are respectively provided with a containing groove, a rectangular plate (75) is arranged in the containing groove, the left side surface and the right side surface of the inner wall of the rectangular plate (75) are respectively clamped with a second bearing, a second rotating shaft (73) is sleeved in the second bearing, the right end of the second rotating shaft (73) is fixedly connected with a rotating wheel (78), the positions of the upper side surface and the lower side surface of the second fixed block (76) corresponding to the second rotating shaft (73) are respectively provided with a positioning groove, the second rotating shaft (73) is positioned in the positioning grooves, the outer surface of the rotating wheel (78) is fixedly connected with a plurality of baffle plates (74), the baffle plates (74) are made of elastic plastic materials, the baffle plates (74) are annularly arranged and are obliquely arranged, a V-shaped plate (77) is arranged on the rear side of the rotating wheel (78), and the V-shaped plate (77) is fixedly connected to one side face of the second fixing block (76);
the lower surfaces of the mounting plates are fixedly connected with second sliding blocks which are connected in a second sliding groove arranged on the upper surface of the base (1) in a sliding way, the left side surfaces of the two mounting plates are fixedly connected with the right side surface of the adjusting mechanism (6), the adjusting mechanism (6) is fixedly arranged on the upper surface of the base (1), the adjusting mechanism (6) comprises first bearings fixedly connected to the front side and the rear side of the upper surface of the base (1), a first rotating shaft (63) is sleeved in each first bearing, a rotating block (61) is fixedly connected to one positive end of the first rotating shaft (63) on the front side, threaded columns (62) are fixedly connected to opposite ends of the two first rotating shafts (63), opposite ends of the two threaded columns (62) are fixedly connected to each other, the thread directions of the two threaded columns (62) are opposite to each other, a threaded cap is connected to the outer surface of each threaded column (62) in a threaded manner, and a mounting plate is fixedly connected to the right side surface of each threaded cap;
a cavity is formed in the base (1), a heating mechanism (8) is arranged in the cavity, and a cooling mechanism (9) is arranged on the back face of the side plate (3).
2. The anodic bonding equipment of claim 1, wherein the bonding mechanism (4) comprises first electric push rods (42) clamped on the left side and the right side of the upper surface of the top plate (41), the top plate (41) is fixedly connected to the front surface of the side plate (3), and electrode plates (43) are fixedly connected to the bottom end of the first electric push rod (42) and the upper surface of the base (1).
3. The anodic bonding apparatus according to claim 1, wherein the heating mechanism (8) includes a third bearing clamped on the lower surface of the inner wall of the cavity, a third rotating shaft (86) is sleeved in the third bearing, a gear (87) is clamped on the outer surface of the third rotating shaft (86), a turntable (84) is fixedly connected to the top end of the third rotating shaft (86), the front side and the rear side of the upper surface of the rotary table (84) are both provided with a limiting groove (85), a heating furnace (82) is arranged in the limiting groove (85), the left side and the right side of the lower surface of the heating furnace (82) are both fixedly connected with the lower surface of the inner wall of the limiting groove (85) through a second spring (83), the left side surface and the right side surface of the heating furnace (82) are fixedly connected with electromagnet blocks (81), the upper side of each electromagnet block (81) is provided with a magnetic attraction piece, and the magnetic attraction pieces are fixedly connected to the lower surface of the inner wall of the cavity.
4. The anodic bonding apparatus according to claim 3, wherein a rack (88) is provided on the right side of the gear (87), a first pull block is fixedly connected to the front of the rack (88) through a slide rod (89), a sliding sleeve is sleeved on the outer side of the slide rod (89), the sliding sleeve is clamped on the front of the base (1), the front side and the rear side of the right side of the sliding rod (89) are both provided with clamping holes (810), the front side of the base (1) is fixedly connected with a fixing piece (812), the fixing piece (812) is positioned at the right side of the sliding rod (89), the right flank joint of stationary blade (812) has the plug bush, is provided with inserted bar (813) in the plug bush, and the right-hand member fixedly connected with second of inserted bar (813) draws the piece, and the outside cover of inserted bar (813) is equipped with third spring (811), and the opposite face fixed connection of piece is drawn with sliding sleeve and second respectively in the both ends of third spring (811).
5. The anodic bonding equipment according to claim 1, wherein the cooling mechanism (9) comprises an empty groove (91) formed in the back surface of the side plate (3), a water storage shell (92) is arranged in the empty groove (91), the water storage shell (92) is made of metal, the lower surface of the water storage shell (92) penetrates into the cavity, a second connecting plate (95) is fixedly connected to the back surface of the water storage shell (92) through a water bag (94), the water storage shell (92) is communicated with the water bag (94), and the left side and the right side of the front surface of the second connecting plate (95) are fixedly connected to the front surface of the side plate (3) through second electric push rods (93).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110429052.0A CN113113336B (en) | 2021-04-21 | 2021-04-21 | Anodic bonding equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110429052.0A CN113113336B (en) | 2021-04-21 | 2021-04-21 | Anodic bonding equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN113113336A CN113113336A (en) | 2021-07-13 |
| CN113113336B true CN113113336B (en) | 2022-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110429052.0A Expired - Fee Related CN113113336B (en) | 2021-04-21 | 2021-04-21 | Anodic bonding equipment |
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Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204407316U (en) * | 2014-07-29 | 2015-06-17 | 上海微电子装备有限公司 | Bonding fixture and bonding machines |
| JP6391378B2 (en) * | 2014-09-10 | 2018-09-19 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
| CN107364828A (en) * | 2017-05-10 | 2017-11-21 | 莆田学院 | A kind of anode linkage equipment |
| CN210223961U (en) * | 2019-01-23 | 2020-03-31 | 爱莱私人有限公司 | Hardware configuration, module and system for eutectic bonding of wafers at room temperature |
| CN211678425U (en) * | 2019-12-04 | 2020-10-16 | 南昌市金升电子科技有限公司 | Full-automatic solid brilliant machine of station is sealed in convenient clearance |
| CN111048450A (en) * | 2019-12-17 | 2020-04-21 | 泉州圆创机械技术开发有限公司 | Wafer bonding machine |
| CN212461649U (en) * | 2020-06-19 | 2021-02-02 | 北京旭普科技有限公司 | Clamping device for chip bonding machine |
| CN112453217B (en) * | 2020-11-05 | 2023-11-28 | 合肥鼎鑫模具有限公司 | Automatic clearance mould convenient to material returns |
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