JP5789681B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for picking up an electronic component such as a chip and transferring and mounting it.

  2. Description of the Related Art In recent years, as an electronic component transfer device, a device that picks up an electronic component divided by dicing and arranged in a wafer shape and arranges it at a transfer destination for each rank is known. In this type of electronic component transfer device, the electronic components are picked up from the upper side by the suction nozzle connected to the vacuum pump and picked up one by one by the operation of pushing up from the lower side and transferred. At this time, the electronic component transfer device is arranged only in the same rank in a certain space so that it can be easily used for mounting on a substrate in a subsequent process.

  Since electronic components arranged in a wafer form are composed of a large number of electronic components, an electronic component transfer device that transfers electronic components is required to transfer many electronic components in a short time. For this reason, in order to shorten the tact time of a transfer process, invention like patent document 1 which can transfer several electronic components simultaneously is made | formed.

  Patent Document 1 discloses a configuration in which a plurality of suction nozzles arranged in a row absorbs semiconductor products (electronic parts) for each row and transfers them to a transfer destination. In this configuration, when adsorbing a semiconductor product, an appropriate rank of the semiconductor product is pushed up from the lower side by a push-up pin, thereby assisting pickup and ranking the semiconductor products to be picked up.

  Patent Document 2 describes a configuration in which only chips belonging to the same rank are die-bonded from chip characteristic data and position data when die-bonding a wafer-like chip (electronic component).

Japanese Patent No. 3712695 JP-A-4-262543

  In recent years, the precision of inspection for electronic components has been improved, and the setting of rank has also become detailed. In addition, there are a plurality of ranks from the highest rank to a rank acceptable for use, and some products do not necessarily require only the highest rank. In addition, since multiple electronic components are required for one product or board, the efficient use of limited resources and cost reduction are achieved by using the electronic components manufactured in the previous process as efficiently as possible. Is required.

  However, as described above, the conventional electronic component transfer device has a configuration in which the same rank is transferred and arranged so that die bonding can be easily performed in a subsequent mounting process. Further, although there is a configuration in which a wafer-like chip is directly die-bonded from the wafer, only a chip belonging to the same rank is die-bonded.

  In other words, in the conventional technology, it is possible to arrange for each rank, or to bond electronic components of the same rank to one product or substrate, but a plurality of ranks are mixed for one product or substrate. Could not be manufactured.

  The present invention has been made in view of the above problems, and an example of the object thereof is to provide an electronic component mounting apparatus and an electronic component mounting method capable of mounting a plurality of ranks mixedly.

In order to solve the above problems, an electronic component mounting apparatus according to the present invention includes an electronic component holding table that holds a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape, and the electronic component holding table. An electronic component information storage unit for storing electronic component information including position information of the electronic component on the wafer sheet and rank information of the electronic component, and one or a plurality of the electronic components are taken out from the wafer sheet and transferred to the substrate An electronic component transfer mounting unit to be mounted, an array information storage unit for storing array information of the electronic component on the substrate, and the electronic component to a predetermined position on the substrate based on the electronic component information and the array information a control unit for controlling the electronic component transfer mounting portion so as to implement a state where a plurality of ranks are mixed, mounting odor to the substrate , Comprising an inspection means for inspecting the implementation has been the electronic component, wherein the control unit controls the electronic component transfer mounting portion so as to implement the electronic component for each one rank among the plurality of ranks, said The inspection means inspects the electronic component of the rank after the completion of the mounting of the one rank .

Furthermore, in order to solve the above-described problem, the electronic component mounting method of the present invention includes a wafer sheet holding step of holding a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape on an electronic component holding table; An electronic component information storing step for storing electronic component information including position information of the electronic component on the wafer sheet in the electronic component holding table and rank information of the electronic component in an electronic component information storage unit; and the electronic component on a substrate An array information storage step for storing the array information in the array information storage unit, and taking out one or a plurality of the electronic components on the wafer sheet based on the electronic component information and the array information, to the position, and a control step of controlling to transport mounted in a state where a plurality of ranks are mixed, in the implementation of the said substrate, the real In the a inspection step of inspecting the electronic component, the control process is, the control to implement the electronic component for each one rank among the plurality of ranks, in the inspection step, the rank of the one After completion of mounting, the electronic components of the rank are inspected .

It is a block diagram which shows the structure of the electronic component mounting apparatus and electronic component mounting method of this embodiment. It is a figure which shows the positional relationship and operation | movement direction of each part of an electronic component mounting apparatus. It is a figure which shows the aspect of the pick-up of the electronic component by an electronic component mounting apparatus. It is a flowchart which shows the flow of operation | movement of the electronic component mounting apparatus and electronic component mounting method of this embodiment. It is a flowchart which shows the flow of the pick-up operation | movement of this embodiment. It is a flowchart which shows the flow of the mounting operation | movement of this embodiment. It is an example which showed the light emitting diode element on the wafer sheet, and the light emitting diode module mounted in the board | substrate. It is an example which showed the light emitting diode element mounted on the several board | substrate arrange | positioned on the mounting board | substrate holding stand and the light emitting diode element on a wafer sheet | seat. It is an example which showed the light emitting diode element mounted on the several board | substrate arrange | positioned on the mounting board | substrate holding stand and the light emitting diode element on a wafer sheet | seat.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a block diagram illustrating a configuration of an electronic component mounting apparatus and an electronic component mounting method according to the present embodiment.

  A configuration of an electronic component mounting apparatus 1 as an embodiment of the electronic component mounting apparatus of the present invention will be described with reference to FIG. In the pickup unit 10 and the mounting unit 20 in FIG. 1, the following description will be made assuming that the left-right direction is the X direction, the direction from the near side to the back side is the Y direction, the up and down direction is the Z direction, and the angle on the XY plane is θ. Do.

  As shown in FIG. 1, an electronic component mounting apparatus 1 includes a pickup unit 10, a mounting unit 20, a transfer head 30 that is an electronic component transfer mounting unit, a control unit 40, an electronic component information storage unit 41, and an array information storage unit. 42 is comprised. The pickup unit 10 and the mounting unit 20 are arranged to be separated from each other in the X direction. In the present invention, the electronic component transfer mounting section is composed of a transfer head provided with a suction nozzle and a head actuator that operates the transfer head.

  The pickup unit 10 is a unit that picks up the electronic component 100 from the wafer sheet 200 on which the electronic component 100 is arranged in the electronic component mounting apparatus 1. The pickup unit 10 includes an electronic component holding table 11, an electronic component holding table actuator 12, a pickup hammer 13, an upper disk cam 14, a pickup motor 15, a push-up needle 16, a lower disk cam 17, a push-up motor 18 and a camera 19. Configured.

  In the pickup unit 10, one pickup position Pu for picking up the electronic component 100 arranged on the wafer sheet 200 by the transfer head 30 is set. The pickup position Pu indicates a predetermined position in the X direction and the Y direction in the pickup unit 10.

  The electronic component holding table 11 is a member having a flat surface capable of holding the wafer sheet 200 on which the electronic component 100 is arranged. The electronic component holding table 11 holds the peripheral portion of the wafer sheet 200 and extends the stretchable adhesive sheet, thereby separating the electronic components 100 arranged on the wafer sheet 200 from each other by a predetermined distance.

  The electronic component holding table actuator 12 moves the electronic component holding table 11 in the plane where the electronic component 100 is arranged (in other words, in the XY plane), and rotates the electronic component holding table 11 in the θ direction within this plane. It consists of an actuator to be made. The electronic component holding table actuator 12 moves the electronic component holding table 11 in accordance with a control signal supplied from the control unit 40, thereby moving the desired electronic component 100 arranged on the wafer sheet 200 to the pickup position Pu. Set.

  The pickup hammer 13 is configured to have a bearing-like end portion disposed above the wafer sheet 200 at the pickup position Pu. The bearing-like end of the pickup hammer 13 is connected to the upper disc cam 14 via an arm.

  The upper disk cam 14 is a disk-shaped cam that can rotate according to the rotation of the pickup motor 15. The pickup motor 15 rotates according to a control signal supplied from the control unit 40 and rotates the upper disk cam 14. The pick-up hammer 13 reciprocates in the Z direction when the arm moves in accordance with the rotation of the upper disc cam 14 and the bearing-shaped end portion reciprocates in the Z direction.

  The push-up needle 16 has a needle-like configuration disposed below the wafer sheet 200 at the pickup position Pu. The push-up needle 16 is connected to the lower disk cam 17 via an arm, and moves in the Z direction as the lower disk cam 17 rotates.

  As the push-up needle 16 moves upward in the Z direction by the rotation of the lower disk cam 17, the upper end of the push-up needle 16 contacts the wafer sheet 200. The push-up needle 16 penetrates the wafer sheet 200 at the upper end of the movement range, contacts the electronic component 100, and pushes up the electronic component 100.

  The push-up needle 16 is arranged in a manner that can push up the electronic component 100 whose needle-like upper end is arranged at the pickup position Pu. The push-up motor 18 rotates the lower disk cam 17 in accordance with a control signal supplied from the control unit 40.

  The camera 19 is configured and arranged so that the electronic component 100 arranged at the pickup position Pu on the wafer sheet 200 and the electronic component 100 arranged around the electronic component 100 can be accommodated in the imaging range. An image of the electronic component 100 captured by the camera 19 is transmitted to the control unit 40.

  The mounting unit 20 is a unit that mounts the electronic component 100 sucked by the suction nozzle 31 on the mounting substrate 300 in the pickup unit 10. The mounting unit 20 includes a mounting substrate holding table 21, a mounting substrate holding table actuator 22, a mounting hammer 23, and a circle. A plate cam 24, a mounting motor 25, and a camera 26 are provided.

  In the mounting unit 20, one mounting position Pl for mounting the electronic component 100 sucked by the suction nozzle 31 on the mounting substrate 300 is set.

  The mounting position Pl indicates a predetermined position in the X direction and the Y direction in the mounting unit 20. The mounting position Pl is set at a position that is separated from the pickup position Pu by a predetermined distance in the X direction.

  The mounting board holding base 21 is a member having a flat surface capable of holding the mounting board 300 on which the electronic component 100 is mounted. The mounting substrate 300 is a substrate such as a ceramic substrate, a glass substrate, or a printed substrate.

  The mounting board holding base actuator 22 is an actuator having a movable shaft that can move the mounting board holding base 21 in the surface direction (in other words, the X direction, the Y direction, and the θ direction) on which the electronic component 100 is mounted.

  A plurality of electronic components 100 sucked by the suction nozzle 31 of the transfer head 30 are mounted on the mounting board 300 held on the mounting board holder 21 with a predetermined margin. Hereinafter, a position where each electronic component 100 on the mounting substrate 300 is to be mounted will be referred to as an electronic component mounting position. The electronic component mounting positions are set, for example, in a matrix shape having a plurality of columns and rows on the mounting substrate 300.

  The mounting hammer 23 has a bearing-like end connected to an arm, and is connected to the disc cam 24 via the arm. The disc cam 24 is configured to be rotatable according to the driving of the mounting motor 25.

  As the disk cam 24 rotates, the arm moves so that the bearing-like end of the mounting hammer 23 reciprocates in the Z direction. The mounting motor 25 rotates the disc cam 24 according to a control signal supplied from the control unit 40.

  The camera 26 is configured and arranged so that the electronic component 100 mounted at the mounting position Pl on the mounting substrate 300 and the periphery can be accommodated in the imaging range. An image of the mounting substrate 300 captured by the camera 26 is transmitted to the control unit 40.

  The transfer head 30 holds a plurality of cylindrical suction nozzles 31 and moves between the pickup unit 10 and the mounting unit 20 under the operation of the head actuator 32 to perform the pickup operation and the mounting operation of the electronic component 100. . The transfer head 30 is disposed above the electronic component holding table 11 of the pickup unit 10 and the mounting board base 21 of the mounting unit 20 in the Z direction.

  The suction nozzle 31 is connected to a decompression device (not shown) such as a vacuum pump via an intake passage (not shown) provided in the transfer head 30, and a control signal supplied from the control unit 40. Accordingly, the electronic component 100 in contact with the electronic component 100 is sucked and released.

  The head actuator 32 is a uniaxial actuator that can move the transfer head 30 in the X direction in accordance with a control signal supplied from the control unit 40. The head actuator 32 moves the transfer head 30 between the pickup unit 10 and the mounting unit 20 along a straight line connecting the pickup position Pu and the mounting position Pl as indicated by an arrow in FIG.

  The transfer head 30 is a spring that holds the lower end of the suction nozzle 31 so as to be separated from the upper end of the electronic component 100 by a predetermined distance in the Z direction, and further biases the suction nozzle 31 upward in the Z direction so that the suction nozzle 31 is stably fixed at the holding position. It has a mechanism.

  A control unit 40 that sends control signals to the mounting substrate holding table actuator 22, the electronic component holding table actuator 12, and the head actuator 32 and controls them is connected to the electronic component information storage unit 41 and the array information storage unit 42.

  The electronic component information storage unit 41 acquires and stores electronic component information including position information and rank information of the electronic component 100 on the wafer sheet 200 from a previous process or a probe inspection machine.

  This electronic component information is acquired by a method such as via a server via a LAN or a method such as an electronic storage medium such as a CD or a memory. The position information includes an index on the wafer sheet 200, and the rank information includes information such as a light amount, a wavelength, a resistance value, a processing speed, a high voltage resistance, and a current amplification factor. The rank information may be divided into predetermined ranks based on information such as the light amount, wavelength, resistance value, processing speed, high voltage resistance, and current amplification factor.

  The arrangement information storage unit 42 stores arrangement information of the electronic components 100 on the mounting board 300 arranged on the mounting board holding base 21. The array information includes at least the mounting position of each electronic component in the mounting substrate and the rank information of each electronic component 100 at the mounting position.

  Further, the rank, number and position of electronic components (for example, light-emitting diode elements) set based on the information on the number of electronic components 100 to be mounted on the mounting substrate and the desired luminous intensity (lux) in the finished product. A plurality of array pattern information such as information on the rank, the information on the rank, the number, and the position of the electronic parts designed in advance as a pattern are also included.

  FIG. 2 is a diagram illustrating the positional relationship and operation direction of each part of the electronic component mounting apparatus.

  With reference to FIG. 2, the positional relationship of each part of the electronic component mounting apparatus 1 is further demonstrated. 2 shows the arrangement and operation directions of the electronic component holding table 11 of the pickup unit 10, the mounting board holding table 21 of the mounting unit 20, and the transfer head 30 when the electronic component mounting apparatus 1 of FIG. 1 is viewed from above in the Z direction. FIG.

  As shown in FIG. 2, the transfer head 30 has a plurality of suction nozzles 31 separated from each other by a predetermined margin on a straight line connecting the pickup position Pu of the pickup unit 10 and the mounting position Pl of the mounting unit 20. Hold in a row.

  Accordingly, in the pickup unit 10, when the transfer head 30 is moved in the X direction by the operation of the head actuator 32, the suction nozzles 31 held by the transfer head 30 are transferred to the pickup position Pu one by one. The On the other hand, in the mounting unit 20, the transfer head 30 is moved in the X direction by the operation of the head actuator 32, so that the suction nozzles 31 held by the transfer head 30 are transferred to the mounting position Pl one by one. Is done.

  The control unit 40 is a control CPU that controls the operation of each unit of the pickup unit 10, the mounting unit 20, and the transfer head 30. The control unit 40 is connected to each related unit and controls the operation by supplying a control signal. Do.

  The control unit 40 sets a position coordinate for each electronic component 100 by analyzing an image of the electronic component 100 on the wafer sheet 200 transmitted from the camera 19, for example. The control unit 40 adjusts the position of the electronic component holding table 11 so that the electronic component 100 comes to the pickup position Pu by operating the electronic component holding table actuator 12 according to the position coordinates of the desired electronic component 100.

  Further, the control unit 40 sets the position coordinates on the mounting board 300 and operates the mounting board holding base actuator 22 so that the mounting position of the electronic component comes to the mounting position Pl with the desired coordinates as the electronic component mounting position. The position of the mounting board holder 21 is adjusted.

  Further, the control unit 40 performs quality inspection, position information acquisition, and the like of the electronic component 100 arranged on the mounting substrate 300 based on the image analysis result transmitted from the camera 26.

  In addition, the control unit 40 refers to images captured by the camera 19 and the camera 26, and when the electronic component 100 is arranged shifted in the θ direction on the XY plane, the electronic component holding table actuator 13 and the mounting substrate A control signal is transmitted to the holding table actuator 22, and the electronic component holding table 11 and the mounting board holding table 21 are each moved in the θ direction to perform correction. Thereby, the pick-up and mounting of an electronic component are performed more reliably.

  The control unit 40 performs the above operation according to information from the electronic component information storage unit 41 and the array information storage unit 42. For example, how to mount the electronic component 100 on the wafer sheet 200 on the mounting substrate 300 based on the rank information of the electronic component information storage unit 41 and the number and rank information necessary for the mounting substrate 300 of the array information storage unit 42. Then, the control unit 40 calculates whether it can be mounted efficiently and transmits a control signal. Here, the arrangement information includes at least the mounting position of each electronic component in the mounting substrate and the rank information of each electronic component 100 at the mounting position.

  In addition, from the information on the desired performance set in the array information storage unit 42 and the rank information in the electronic component information storage unit 41, the control unit 40 calculates and transmits a control signal.

  Further, the electronic component 100 on the mounting board 300 is received so that desired performance can be obtained from the required mounting number and position information on the mounting board 300 of the array information storage unit 42 from the outside by receiving information on the desired performance when the module is completed. There may be provided means for calculating the mounting position and rank, and control may be performed according to the calculation result.

  FIG. 3 is a diagram illustrating an aspect of picking up an electronic component by the electronic component mounting apparatus.

  Next, with reference to FIG. 3, an operation in which the suction nozzle 31 of the transfer head 30 picks up the electronic component 100 on the wafer sheet 200 by suction will be described. In FIG. 3, the positional relationship of each part is described separately from state 1 to state 4. The operation of each unit described below is performed under the control of the control unit 40.

  In the pickup operation of the electronic component 100, first, the electronic component holding table actuator 12 moves the electronic component holding table 11, and moves the desired electronic component 100 to the pickup position Pu (on the axis indicated by the one-dot broken line).

  At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the desired suction nozzle 31 to the pickup position Pu (state 1). The positions in the Z direction of the pickup hammer 13, the push-up needle and the suction nozzle 31 in this state are the initial positions in the Z direction.

  Subsequently, the pickup motor 15 rotates the upper disk cam 14 and moves the pickup hammer 13 downward. As the pickup hammer 13 moves, it contacts the upper end of the suction nozzle 31 and then pushes down the suction nozzle 31 against the biasing force of the spring mechanism that biases the suction nozzle 31 upward.

  The suction nozzle 31 pushed down contacts the electronic component 100 at the position where the pickup hammer 13 reaches the lower end of the moving range, and the controller 40 operates the suction of the suction nozzle 31 in order to suck the electronic component 100 in advance. The electronic component 100 is adsorbed. Further, the push-up motor 18 rotates the lower disk cam 17 and moves the push-up needle 16 toward the electronic component 100 (state 2).

  Subsequently, the pickup motor 15 rotates the upper disk cam 14 and moves the pickup hammer 13 upward to release the suction nozzle 31 from being pushed down. The suction nozzle 31 released from being pushed down moves upward while the electronic component 100 is sucked by the biasing force of the spring mechanism. At the same time, the upper end of the push-up needle 16 penetrates the wafer sheet 200 and pushes the electronic component 100 upward, and the lower end of the electronic component 100 is moved in the direction of peeling from the wafer sheet 200 (state 3).

  The pick-up hammer 13 and the push-up needle 16 return to their initial positions, and the suction nozzle 31 that sucks the electronic component 100 to the lower end also returns to the initial position in the Z direction. Thereafter, the electronic component holding table actuator 12 moves the electronic component holding table 11 so that the next electronic component 100 comes to the next pickup position Pu. At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the next suction nozzle 31 to the pickup position Pu (state 4).

  As described above, the electronic component 100 is attracted to the suction nozzle 31 of the transfer head 30 by the operation described above. By repeating the above-described operation a plurality of times, the electronic component 100 is attracted to each of the plurality of suction nozzles 31 held by the transfer head 30.

  The mounting operation in the mounting unit 20 is performed in the same procedure. A specific procedure will be described below. In the mounting operation of the electronic component 100, first, the mounting board holding base actuator 22 moves the mounting board holding base 21 to move a desired electronic component mounting position on the mounting board 300 to the mounting position Pl. At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the suction nozzle 31 that sucks the electronic component 100 to the mounting position Pl. At this time, the mounting hammer 23 is at an initial position in the Z direction.

  Subsequently, the mounting motor 25 rotates the disc cam 24 and moves the mounting hammer 23 downward. As the mounting hammer 23 moves, it contacts the upper end of the suction nozzle 31 and then pushes down the suction nozzle 31 against the biasing force of the spring mechanism that biases the suction nozzle 31 upward. The electronic component 100 sucked by the sucked suction nozzle 31 comes into contact with the mounting board 300 at a position where the mounting hammer 23 reaches the lower end of the moving range.

  At this time, the control unit 40 releases the suction of the suction nozzle 31 that sucks the electronic component 100, so that the electronic component 100 is disposed at the electronic component mounting position on the mounting substrate 300. Since the mounting substrate 300 has adhesiveness, the electronic component 100 adheres to the mounting substrate 300 at the electronic component mounting position.

  Subsequently, the mounting motor 25 rotates the disc cam 24 and moves the mounting hammer 23 upward to release the suction nozzle 31 from being pushed down. The suction nozzle 31 released from being pushed down is moved upward in a state where the electronic component 100 is not sucked by the biasing force of the spring mechanism.

  After the mounting hammer 23 returns to the initial position and the suction nozzle 31 that has finished the arrangement of the electronic component 100 also returns to the initial position in the Z direction, the mounting board holding base actuator 22 moves the mounting board holding base 21 and the mounting position Pl Move the next mounting position.

  At the same time or before and after, the head actuator 32 moves the transfer head 30 and moves the suction nozzle 31 that sucks the next electronic component 100 to the mounting position Pl.

  As described above, the electronic component 100 transferred by the transfer head 30 is mounted on the mounting substrate 300 by the operation described above. By repeating the above-described operation a plurality of times, the electronic components 100 respectively sucked by the plurality of suction nozzles 31 provided in the transfer head 30 are mounted on the mounting substrate 300.

  FIG. 4 is a flowchart showing an operation flow of the electronic component mounting apparatus and the electronic component mounting method of the present embodiment. Next, the operation of the electronic component mounting apparatus 1 will be described with reference to FIG. 4 which is a flowchart showing the overall operation flow including the pickup operation and the mounting operation by the electronic component mounting apparatus 1.

  In the electronic component mounting apparatus 1, at the start of a series of operations, the wafer sheet 200 on which the electronic component 100 is held is placed on the electronic component holding table 11 of the pickup unit 10 (step S1). On the wafer sheet 200, a plurality of electronic components 100 having different ranks are arranged in a wafer shape.

  At the same time or before and after, the mounting substrate 300 on which the electronic component 100 is mounted is placed on the mounting substrate holding base 21 of the mounting unit 20 (step S2).

  Next, the camera 19 of the pickup unit 10 captures images of all the electronic components 100 arranged on the wafer sheet 200 and transmits image information to the control unit 40. Based on the transmitted image information, the control unit 40 collates the index on the wafer sheet 200 with the index included in the electronic component information (including rank information and position information) acquired from the electronic component information storage unit 41. To do.

  The control unit 40 sets the coordinates for each electronic component 100 based on the position information of the electronic component information (including rank information and position information) whose collation is matched and the image information captured by the camera 19, and is generated. Link the location information. Thereby, the control unit 40 can recognize the position and rank of the electronic component 100 arranged on the wafer sheet 200. The electronic component information storage unit 41 acquires electronic component information from the storage unit of the probe inspection apparatus in the previous process or the storage unit on the server (step S3).

  Subsequently, the control unit 40 acquires array information (including rank information and position information) of the electronic component 100 mounted on the mounting board 300 from the array information storage unit 42 (step S4).

  The control unit 40 generates a control signal from the electronic component information and the arrangement information and transmits it to each actuator (step S5).

  Next, the control unit 40 moves the transfer head 30 to the pickup unit 10 (step S6) and executes a pickup operation (step S7).

  By such a pickup operation, the electronic component 100 arranged on the wafer sheet 200 is sucked by each of the plurality of suction nozzles 31 of the transfer head 30. The pickup operation will be described later.

  Subsequently, the control unit 40 moves the transfer head 30 to the mounting unit 20 (step S8), and executes a mounting operation (step S9).

  With this mounting operation, the electronic component 100 sucked by each of the plurality of suction nozzles 31 in the transfer head 30 is mounted on the mounting substrate 300. The mounting operation will be described later.

  The control unit 40 repeats a series of operations from step S6 to step S9 until all the electronic components 100 to be moved on the wafer sheet 200 are mounted on the mounting substrate 300 (step S10: Yes), End the operation. Through the above steps, an electronic module mounted in a state where a plurality of ranks are mixed is obtained.

  A wafer sheet holding process for holding a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape on the electronic component holding table corresponds to step S1.

  The electronic component information storage step of storing electronic component information including position information of electronic components on the wafer sheet in the electronic component holding table and rank information of electronic components in the electronic component information storage unit corresponds to step S3.

  The sequence information storage step of storing the sequence information of the electronic components on the board in the sequence information storage unit corresponds to step S4.

  Based on the electronic component information and the arrangement information, one or more electronic components on the wafer sheet are taken out, and the control process for controlling the mounting so that a plurality of ranks are mixed and transferred to a predetermined position on the substrate, This corresponds to step S5-9.

  FIG. 5 is a flowchart showing the flow of the pickup operation of this embodiment. Next, the pickup operation (step 7 in FIG. 4) of the electronic component 100 by the pickup unit 10 of the electronic component mounting apparatus 1 will be described with reference to the flowchart in FIG.

  First, the control unit 40 sets the electronic component 100 to be picked up first as a reference electronic component. The camera 19 captures an image of the reference electronic component and transmits image information to the control unit 40. Based on the transmitted image information, the control unit 40 sets coordinates again for the reference electronic component, and generates position information (step S101).

  The control unit 40 first compares the position information of all the electronic components 100 acquired from the image captured by the camera 19 (step S3 in FIG. 4) with the position information of the reference electronic component newly acquired, and determines the reference It detects how much the position of the electronic component is deviated from the initial position (that is, detected in step S3), and calculates a position correction amount for correcting the deviation (step S102).

  The control unit 40 updates the position information of the stored reference electronic component by applying the newly acquired position information of the reference electronic component (step S103).

  Next, the control unit 40 operates the electronic component holding table actuator 12 based on the updated position information of the reference electronic component, and moves the electronic component holding table 11 so that the reference electronic component is moved to the pickup position Pu. (Step S104).

  At the same time or before and after, the control unit 40 operates the head actuator 32 to move the transfer head 30 so that the suction nozzle 31 that is not sucking the electronic component 100 is moved to the pickup position Pu (step). S105).

  Subsequently, the control unit 40 causes the suction nozzle 31 to suck the reference electronic component and picks up the electronic component 100 (step S106).

  Specifically, the control unit 40 drives the pickup motor 15 to cause the pickup hammer 13 to push down the suction nozzle 31. At the same time, the control unit 40 drives the push-up motor 18 to push the electronic component 100 up by the push-up needle 16.

  The electronic component 100 is adsorbed by contact with the suction nozzle 31 pushed down by the pickup hammer 13, and further, the suction nozzle 31 moves upward and is pushed up by the push-up needle 16, so that the electronic component 100 is peeled off from the wafer sheet 200. Picked up.

  Next, when there is an electronic component 100 that can be picked up (step S107: Yes) and there is a suction nozzle 31 that can suck the electronic component 100 (step S108: Yes), the next electronic component 100 pickups are made.

  The control unit 40 reads the position information stored for the next electronic component 100, and compares the coordinates of the electronic component 100 with the coordinates of the reference electronic component before update (that is, the coordinates detected in step S3). Then, it is determined whether or not the position of the electronic component 100 is within the correction amount application area.

  The correction amount application area indicates a predetermined range starting from the position coordinates of the reference electronic component. Within the correction amount application area, for each electronic component 100, from the detection of the first electronic component 100 position (ie, step S3 in FIG. 4) to the re-detection of the position of the reference electronic component (ie, step S101 in FIG. 5). It can be considered that the positional deviation generated between and is the same.

  The displacement of the position of the electronic component 100 is a major factor due to the expansion and contraction of the wafer sheet 200 to be stretched, and it is considered that the displacement of the position is the same for the electronic component 100 within a certain range.

  If the electronic component to be picked up is present in the correction amount application area after the reference electronic component is picked up, the position shift of the electronic component is considered to be the same as the position shift of the reference electronic component. It is done. For this reason, by detecting the coordinates of the electronic component and acquiring the position information again, the position information after the deviation of the electronic component to be picked up can be obtained by applying the correction amount of the reference electronic component. It can be calculated.

  The predetermined range centering on the reference electronic component that defines the correction amount application area may be changed as appropriate, for example, depending on the stretchability of the wafer sheet 200 that causes the positional shift of the electronic component 100. May be changed as appropriate.

  When the position of the next electronic component 100 is within the correction amount application area with reference to the reference electronic component (step S109: Yes), the control unit 40 uses the position correction amount of the reference electronic component to use the electronic component 100. Is corrected (step S110).

  Specifically, the corrected position information is obtained by applying the position correction amount of the reference electronic component to the stored position information of the electronic component 100.

  The control unit 40 operates the electronic component holding table actuator 12 based on the corrected position information of the next electronic component 100 and moves the electronic component holding table 11 so that the electronic component 100 is moved to the pickup position Pu. Move (step S111).

  Subsequently, the next suction nozzle 31 that is not sucking the electronic component 100 is moved to the pickup position Pu (step S105), and the next electronic component 100 is picked up.

  On the other hand, when the position of the next electronic component 100 is outside the correction amount application area based on the reference electronic component (step S109: No), the control unit 40 sets the electronic component 100 as a new reference electronic component. .

  For the new reference electronic component, the control unit 40 acquires position information by capturing an image (step S101), calculates a position correction amount (step S102), and updates the position information (step S103). Execute pickup operation.

  As described above, according to the configuration described above, the suction operation of the electronic components 100 arranged on the wafer sheet 200 can be continuously performed for the plurality of suction nozzles 31 held by the transfer head 30. For this reason, a plurality of electronic components 100 can be collectively transferred to the mounting unit 20 by a single movement of the transfer head 30.

  In the electronic component mounting apparatus 1, a pickup position Pu that is a position where the electronic component 100 is taken out is determined, and the suction nozzle 31 and the electronic component 100 are transferred to the pickup position Pu one by one in order. For this reason, positioning can be performed in a relatively short time, and the tact time can be shortened.

  In addition, the tact time can be further shortened by transferring the electronic component 100 and the suction nozzle 31 in parallel. Moreover, the electronic components 100 can be sorted by appropriately selecting the electronic components 100 to be sucked according to the state, shape, and rank of the electronic components 100.

  FIG. 6 is a flowchart showing the flow of the mounting operation of this embodiment. Next, the mounting operation (step 9 in FIG. 4) of the electronic component 100 by the mounting unit 20 of the electronic component mounting apparatus 1 will be described with reference to the flowchart in FIG.

  The control unit 40 transmits a control signal for operating the mounting board holding base actuator 22 based on coordinates or the like set in advance on the mounting board holding base 21 according to the arrangement information, and a desired electronic component on the mounting board 300 The mounting board holder 21 is moved so that the mounting position is moved to the mounting position Pl (step S201).

  At the same time or before and after, the control unit 40 operates the head actuator 32 to move the transfer head 30 so that the suction nozzle 31 that sucks the electronic component 100 is moved to the mounting position Pl (step). S202).

  Subsequently, the control unit 40 releases the suction so that the electronic component 100 sucked by the suction nozzle 31 is mounted at the electronic component mounting position on the mounting board 300 (step S203).

  Specifically, the control unit 40 drives the mounting motor 25 to cause the mounting hammer 23 to push down the suction nozzle 31. After the electronic component 100 attracted by the pushed-down suction nozzle 31 comes into contact with the mounting substrate 300, the control unit 40 releases the suction of the suction nozzle 31 and places the electronic component 100 on the mounting substrate 300. To implement.

  Next, the control unit 40 repeats a series of operations from step S201 to step S203 until there is no electronic component sucked by the suction nozzle 31 provided in the transfer head 30 (step S204: Yes). Make it.

  Whether or not an electronic component is present in the suction nozzle 31 is determined by the control unit 40 when the number to be transferred matches the number transferred on the image captured by the camera 26. It can be assumed that no electronic component is present in the nozzle 31.

  Note that the electronic component 100 may be mounted on the mounting substrate 300 up to the number of electronic components 100 mounted according to the array information or the number of mounted electronic components 100 for each rank, and the next inspection process may be performed. .

  After all the electronic components 100 to be sucked by the suction nozzle 31 are mounted on the mounting substrate 300 (step S204: Yes), the control unit 40 takes an image of the electronic component 100 mounted on the mounting substrate 300 by the camera 26. And receiving image information. Based on the input image information, whether or not the electronic component 100 is mounted is inspected for the accuracy of the arrangement of the electronic component 100 and the appearance of the electronic component 100 (step S205). After the electronic component 100 inspection, the control unit 40 ends the mounting operation.

  Next, with reference to FIGS. 7-9, the mounting from a wafer sheet to a board | substrate in the case of applying a light emitting diode element as an electronic component is demonstrated. In addition, about the transfer and mounting by the electronic component mounting apparatus 1, since the structure and operation | movement mentioned above are applicable as it is, description is abbreviate | omitted.

  FIG. 7 shows an example of a light emitting diode element on a wafer sheet and a light emitting diode module mounted on a substrate. Here, the electronic component 100 is a light emitting diode element, and the mounting substrate 300 is a substrate on which a light emitting diode element can be mounted as a substrate of a light emitting diode module, such as a ceramic substrate or a glass substrate.

  The light emitting diode elements on the wafer sheet 200 are received in a state where the quality varies due to the manufacturing conditions in the manufacturing process of the light emitting diode elements in the previous process. This variation in quality is an unavoidable variation in manufacturing caused by the atmosphere in the chamber at the time of manufacturing the light emitting diode element, the cleaning of the light emitting diode element, the variation in the film thickness of the light emitting diode element, and the like. If a product or a module is manufactured without taking this variation into consideration, variations will occur in the finished product, and the yield will eventually deteriorate.

  Therefore, each light emitting diode element is inspected by probe inspection or the like, and ranking is performed according to the inspection result. The wafer sheet in FIG. 7 schematically shows the inspection results, where ◯ indicates A rank, ● indicates B rank, and X indicates C rank. Actually, there are several tens of ranks, but in the description of the present embodiment, description will be made with three ranks. Even if the rank becomes several tens of ranks, the present invention can be applied.

  This inspection result and rank information are linked to the position information and stored in the storage unit of the inspection apparatus on the server or in the previous process together with the index number or code of the wafer sheet attached to each sheet. . Or you may make it store directly in the electronic component information storage part 41. FIG.

  The electronic component information storage unit 41 acquires electronic component information from the inspection device in the previous process or the storage unit. On the other hand, in the array information storage unit 42, array information that is information on the rank and position of the light emitting diode elements to be mounted on the substrate is input.

  The array information includes, for example, information necessary for ranking, such as the luminous intensity (lux), light quantity, and wavelength of the light-emitting diode elements, rank information that is previously ranked according to this information, and position information. .

  The rank information and position information in the light emitting diode module will be specifically described. A description will be given with reference to a state 3 in which a light emitting diode module is completed through the mounting process of each rank on the substrate in FIG.

  In the case of a light emitting diode module, it is not necessary that all light emitting diode elements used in the module have the highest rank. This is because the module is only required to be manufactured within an allowable range in terms of specifications because the amount of light and intensity of the module are less varied as a result.

  For this reason, light emitting diode elements of ranks other than the highest rank are mounted on the light emitting diode module. However, there is a restriction depending on the specification of the light emitting diode module, such that the end portion may be required to have a relatively high rank due to the contrast, and the center portion may have a low rank.

  In the light emitting diode module in the state 3 in FIG. 7, the A rank, which is the highest rank, is used at the end, and the lower rank is adopted as it goes to the center. In other words, it is mounted around the lower rank C rank, and is mounted so that it is surrounded by B rank and the periphery is surrounded by A rank, and it is mounted so as to secure the luminous intensity and light quantity of the whole module.

  As described above, a plurality of patterns are prepared from the idea that light emitting diode elements having a necessary rank are mounted at appropriate positions according to specifications required for the final product. Therefore, for example, when a plurality of substrates are held on the mounting substrate holding base 21 of the mounting unit 20, they can be mounted on the plurality of substrates with the same arrangement pattern or with different patterns. It becomes possible.

  The control unit 40 refers to the electronic component information according to the arrangement information, calculates which position on the wafer sheet 200 and which rank of the light emitting diode element is picked up and mounted on the substrate, and the electronic component Control signals are transmitted to the holding table actuator 12, the mounting board holding table actuator 22, and the transfer head 30.

  Thereby, the light emitting diode element is picked up from the wafer sheet 200 by the suction nozzle 31 of the transfer head 30 and mounted on the substrate.

  For example, in FIG. 7, the light emitting diode element with the highest rank A among the light emitting diode elements to be mounted is first mounted on the substrate on one substrate arranged on the mounting substrate holding base 21 ( State 1).

  Next, the B rank light emitting diode element is picked up from the wafer sheet 200 (state 2) and mounted. Finally, the C rank light emitting diode element is picked up from the wafer sheet 200 and mounted (state 3).

  It should be noted that the mounted electronic components may be inspected after mounting the light emitting diode elements of each rank at the time of mounting. By performing such inspection after mounting each rank, the tact time can be shortened, and when inspection is performed from many light emitting diode elements on the wafer sheet 200 such as A rank, inspection after mounting A rank When a problem is detected in the above, mounting on the board is stopped, and it is possible to prevent unnecessary use of B rank or C rank light emitting diode elements which are fewer electronic components.

  Further, the inspection may be performed for each substrate after completion of mounting on the substrate. The inspection is performed based on an image captured by the camera 26 of the mounting unit 20.

  In the image picked up by the camera 26, each light emitting diode element is present at a position where it should be, or is mounted at a certain distance from another light emitting diode element at a position where it should be, or obliquely or horizontally. Check whether it is not mounted.

  In the description of FIG. 7, it has been described that mounting is performed from the light emitting diode element of rank A that is mounted most on the board, but the mounting order is not limited to this, and the rank that is mounted on the board is the least. The light emitting diode elements may be mounted from the light emitting diode elements having the highest rank on the wafer sheet 200 or the light emitting diode elements having the smallest rank.

  FIG. 8 shows an example of a light emitting diode element mounted on a plurality of substrates arranged on a mounting substrate holder and a light emitting diode element on a wafer sheet. Next, with reference to FIG. 8, the mounting of the light emitting diode element when a plurality of substrates are arranged on the mounting substrate holder 21 will be described.

  The control unit 40 sends a control signal to each actuator to perform pickup and mounting. For example, for each of a plurality of substrates, first, an A rank light emitting diode element is mounted on the substrate 1, then an A rank light emitting diode element is mounted on the substrate 2, and then an A rank light emitting diode is mounted on the substrate 3. Like mounting elements, light emitting diode elements of the same rank are mounted on a plurality of substrates arranged on a mounting substrate holder.

  After the A rank light emitting diode elements can be mounted on the plurality of boards 1 to 3 on the mounting board holding base 21, the B rank light emitting diode elements are mounted on the boards 1 to 3 in the same manner. In this way, the light emitting diode elements are mounted on the plurality of substrates 1 to 3 for each rank, and finally the light emitting diode elements are mounted on all of the plurality of substrates 1 to 3 on the mounting substrate holding base 21. .

  At the time of mounting, after mounting the light emitting diode elements of each rank, the mounted light emitting diode elements may be inspected. In the image picked up by the camera 26, whether or not each light emitting diode element is present at a certain position, whether or not the light emitting diode element is mounted at a certain distance from another light emitting diode element, Inspect whether it is mounted lying down. By performing such an inspection after mounting each rank, the tact time can be shortened.

  FIG. 9 shows an example of a light emitting diode element on a wafer sheet and a light emitting diode module mounted on a plurality of substrates arranged on the mounting substrate holder 21. Next, with reference to FIG. 9, the mounting of the light emitting diode element when a plurality of substrates are arranged on the mounting substrate holder 21 will be described.

  The control unit 40 sends a control signal to each actuator to perform pickup and mounting. First, the A rank light emitting diode element is mounted on the substrate 1, then the B rank light emitting diode element is mounted, and then the C rank light emitting diode element is mounted. In the state where the light emitting diode elements of the rank are mixed, they are mounted on the substrate arranged on the mounting substrate holding base 21.

  When the A rank, B rank, and C rank light emitting diode elements can be mounted on the board 1 on the mounting board holding base 21, and the light emitting diode module is completed, the A rank, B rank, and C rank are then mounted on the board 2. Light-emitting diode elements will be mounted.

  Similarly, light emitting diode elements of A rank, B rank, and C rank are mounted on the substrate 3 as well. In this way, the light emitting diode elements are mounted on each of the plurality of substrates 1 to 3, and finally the light emitting diode elements are mounted on all of the plurality of substrates 1 to 3 on the mounting substrate holding base 21. .

  At the time of mounting, after mounting the light emitting diode elements on each substrate, the mounted light emitting diode elements on the substrate may be inspected. In the image picked up by the camera 26, each light emitting diode element is present at a position where it should be, or is mounted at a certain distance from another light emitting diode element at a position where it should be, or obliquely or horizontally. Check whether it is not mounted. By performing such an inspection after mounting each rank, the tact time can be shortened.

  The pick-up of the light-emitting diode elements on the wafer sheet 200 is not limited to a plurality, and one pickup nozzle 31 is formed on the transfer head 30 and may be picked up one by one. A single nozzle formed on the transfer head 30 is used to complete each substrate by mounting the light emitting diode elements one by one in rank order for each substrate, or to a plurality of substrates on the mounting substrate holder 21. Mounting on a plurality of substrates can be completed by mounting in rank order.

  In this mounting operation, it is possible to inspect based on an image captured by the camera 26 after mounting for each rank or after mounting for each substrate. For example, whether or not the A-rank electronic component 100 is precisely mounted on the substrate 1, the substrate 2, and the substrate 3 after the A-rank electronic component 100 is mounted on the substrate 1, the substrate 2, and the substrate 3. inspect.

  Further, A rank, B rank, and C rank light emitting diode elements are mounted on the substrate 1, and it is inspected whether or not the light emitting diode elements are precisely mounted on the substrate completed as a module.

  Next, handling of information regarding the electronic component in the present embodiment will be described. In the present embodiment, rank information of each electronic component 100 on the mounting board 300 to be finally manufactured is stored in the storage unit of the electronic component mounting apparatus by the control unit 40. The stored rank information is also linked to the electronic component information in the electronic component information storage unit 41, and it is possible to track which electronic component 100 on the wafer sheet 200 the electronic component 100 on the mounting substrate 300 corresponds to. A traceability system that can do this is built. This traceability system is performed by information stored in the electronic component information storage unit 41 and the storage unit of the electronic component mounting apparatus. Further, it may be linked with the inspection result information based on the image taken by the camera 26 after mounting.

  This traceability system can track which part on the wafer sheet 200 is the electronic component 100 with respect to rank information of the electronic component 100 mounted on a certain mounting substrate 300, for example. As a result, not only the information based on the rank, but also feedback that the electronic component 100 picked up from a certain part on the wafer sheet 200 is preferable for a certain product leads to improvement of the product.

<Configuration and Effect of Embodiment>
The electronic component mounting apparatus according to the present embodiment includes an electronic component holding table that holds a wafer sheet in which a plurality of light emitting diode elements having different ranks are arranged in a wafer shape, and light emitting diode elements on the wafer sheet in the electronic component holding table. An electronic component information storage unit for storing electronic component information including position information and rank information of the light emitting diode elements; an electronic component transfer mounting unit for extracting one or a plurality of light emitting diode elements from the wafer sheet and transferring and mounting them on a substrate; An array information storage unit for storing array information of light emitting diode elements on the substrate, and mounting the light emitting diode elements at predetermined positions on the substrate in a state where a plurality of ranks are mixed based on the electronic component information and the array information. And a control unit for controlling the electronic component transfer mounting unit.

  By configuring as described above, the wafer sheet can be directly mounted on the substrate, and the process of arranging for each rank, which has been performed by the conventional electronic component transfer apparatus, is unnecessary, and the tact time is greatly reduced. realizable.

  In addition, in the case where the light emitting diode elements are arranged for each rank, which has been performed in the conventional electronic component transfer device, in order to manufacture a product that allows a plurality of ranks of light emitting diode elements, such as a light emitting diode module, a separate process is required. It was necessary to provide. However, according to the present embodiment, since it is possible to directly mount on the substrate from the wafer sheet on which the plurality of light emitting diode elements having different ranks are arranged, the light emitting diode module including the light emitting diode elements of the plurality of ranks is separately provided. It can manufacture without providing a process.

  As a result, not only the tact time can be reduced, but also the efficient use of the light emitting diode elements on the wafer sheet and the minimization of the size of the apparatus itself can be realized.

  The array information includes at least the mounting position of each light emitting diode element mounted in the substrate and the rank information of each light emitting diode element at this mounting position. The array information includes information on which position of which light-emitting diode element is to be mounted in accordance with the product specifications, so the light-emitting diode module can be specified by specifying the position and rank as the array information. It is possible to meet various specifications.

  Further, the arrangement information is set based on the desired light intensity in the finished product. For this reason, the array information includes information such as what rank of light emitting diode elements, what positional relationship, how many, etc. are required according to the light intensity required when used as a light emitting diode module, and its specifications. It becomes possible to manufacture a light emitting diode module according to the above.

  It should be noted that it is also possible to calculate a desired light intensity using a control unit outside the electronic component mounting apparatus or inside the electronic component mounting apparatus and use it as arrangement information.

  The array information storage unit includes a plurality of array pattern information. For this reason, the light emitting diode element of the set rank can be reliably mounted at the set position. Further, by applying a plurality of array patterns for each substrate, it is possible to manufacture each of the plurality of substrates on the mounting substrate holding base as a light emitting diode module having a different array pattern.

  In mounting on a substrate, an inspection means for inspecting the mounted light emitting diode elements each time a set number of light emitting diode elements of a set rank are mounted is provided.

  Each time a set number of light emitting diode elements of a set rank are mounted, each light emitting diode element is present at a position where the light emitting diode element should be in the image taken by the camera 26 or another light emitting diode element is located at a position where it should be. It is inspected whether it is mounted with a distance of [1] or whether it is mounted diagonally or sideways. By performing such an inspection after mounting each rank, the tact time can be shortened.

  An inspection means for inspecting the mounted substrate (light emitting diode module) each time it is mounted on the substrate is provided.

  After mounting the light-emitting diode elements on each substrate, the mounted light-emitting diode elements on the completed light-emitting diode module should be present in the positions where the respective light-emitting diode elements should be in the image taken by the camera 26. It is inspected whether it is mounted at a predetermined distance from other light emitting diode elements or whether it is mounted obliquely or horizontally. By performing such an inspection after mounting each rank, the tact time can be shortened.

  The electronic component mounting method in the present embodiment includes a wafer sheet holding step for holding a wafer sheet in which a plurality of light emitting diode elements having different ranks are arranged in a wafer shape on the electronic component holding table, and the wafer sheet on the electronic component holding table. Electronic component information storing step for storing electronic component information comprising the position information of the light emitting diode elements and the rank information of the light emitting diode elements in the electronic component information storage section, and storing the array information of the light emitting diode elements on the substrate in the array information storage section Storage information storage step, and on the basis of the electronic component information and the array information, one or a plurality of light emitting diode elements are taken out and transferred to a predetermined position on the substrate in a mixed state with a plurality of ranks. And a control process for controlling to do so.

<Definition part>
In the present invention, a light emitting diode element is used as an example of an electronic component. However, for example, a semiconductor element, a resistance element, a transistor, or the like may be used, and any electronic component that can be divided into a plurality of ranks depending on its property. Any electronic component may be used.

  In the present invention, the substrate is, for example, a substrate such as a ceramic substrate, a glass substrate, or a printed substrate, and may be any substrate that can mount electronic components.

  In the present invention, the electronic component information is, for example, position information of each light emitting diode element including an index on a wafer sheet, and rank information including information such as a light amount and a wavelength. The rank information may be rank information that is divided into predetermined ranks based on information such as light quantity and wavelength. The electronic component information storage unit is connected to a storage device external to the electronic component mounting apparatus, for example, a storage unit of the probe inspection apparatus in the previous process, or the probe inspection apparatus, in addition to the storage unit of the electronic component mounting apparatus. It is a storage medium such as a server, CD, or memory, and any storage medium can be used as long as it can be stored.

  In the present invention, the array information is mounting position information of each light emitting diode element in the substrate and rank information of each light emitting diode element at the mounting position. In addition to the arrangement information storage unit in the storage unit of the electronic component mounting apparatus, a storage device external to the electronic component mounting apparatus, for example, a storage medium such as a computer, server, CD, or memory connected to the electronic component mounting apparatus As long as it can be memorized, it may be anything.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 10 Pickup part 11 Electronic component holding table 12 Electronic component holding table actuator 13 Pickup hammer 14 Upper disk cam 15 Pickup motor 16 Pushing needle 17 Lower disk cam 18 Pushing motor 19 Camera 20 Mounting part 21 Mounting board holding Table 22 Mounting substrate holding table actuator 23 Mounting hammer 24 Disk cam 25 Mounting motor 26 Camera 30 Transfer head 31 Suction nozzle 32 Head actuator 40 Control unit 41 Electronic component information storage unit 42 Array information storage unit 100 Electronic component 200 Wafer sheet 300 Mounting board Pu Pickup position Pl Mounting position

Claims (7)

An electronic component holding table for holding a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape;
An electronic component information storage unit that stores electronic component information including position information of the electronic component on the wafer sheet and rank information of the electronic component in the electronic component holding table;
An electronic component transfer mounting unit for taking out one or a plurality of the electronic components from the wafer sheet,
An array information storage unit for storing array information of the electronic components on the substrate;
A control unit that controls the electronic component transfer mounting unit to mount the electronic component on a predetermined position on the substrate in a state where a plurality of ranks are mixed based on the electronic component information and the arrangement information ;
In implementation of the said substrate, comprising an inspection means for inspecting the implementation has been the electronic component,
The control unit controls the electronic component transfer mounting unit to mount the electronic component for each rank of the plurality of ranks,
The electronic component mounting apparatus , wherein the inspection unit inspects the electronic component of the rank after the completion of the mounting of the one rank .   2. The electronic component mounting apparatus according to claim 1, wherein the array information includes at least a mounting position of each electronic component mounted in the substrate and rank information of each electronic component at the mounting position.   The electronic component mounting apparatus according to claim 2, wherein the arrangement information is set based on a desired light intensity in a finished product.   The electronic component mounting apparatus according to claim 1, wherein the array information storage unit includes a plurality of array pattern information.   The electronic component mounting apparatus according to claim 1, further comprising an inspection unit that inspects the mounted substrate every time the substrate is mounted on the substrate.   The electronic component mounting apparatus according to claim 1, wherein the electronic component is a light emitting diode element, and the substrate is a light emitting diode module. A wafer sheet holding step for holding a wafer sheet in which a plurality of electronic components having different ranks are arranged in a wafer shape on an electronic component holding table;
An electronic component information storage step of storing electronic component information including position information of the electronic component on the wafer sheet in the electronic component holding table and rank information of the electronic component in an electronic component information storage unit;
An array information storage step of storing array information of the electronic components on the substrate in an array information storage unit;
Based on the electronic component information and the arrangement information, the electronic components on the wafer sheet are taken out one or more at a time, and are controlled to be transported and mounted in a state where a plurality of ranks are mixed in a predetermined position on the substrate. A control process ,
The mounting to the substrate, and a test step of testing the implementation has been the electronic component,
In the control step, the electronic component is controlled to be mounted for each rank of the plurality of ranks,
In the inspection step, the electronic component mounting method is characterized by inspecting the electronic component of the rank after completion of the mounting of the one rank .

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