JP2002184803A - Attraction arrangement method and device of conductive ball - Google Patents

Abstract

PROBLEM TO BE SOLVED: To replenish a place where attraction cannot be made with a conductive ball even if attraction fail occurs while the conductive ball is attracted to an attraction head for arrangement. SOLUTION: In this attraction arrangement device of the conductive ball, a plurality of conductive balls 102 put into a container 101 are attracted by the attraction head 100, and are collectively arranged on a plurality of electrodes to be arranged. Also, the attraction arrangement device has a means 103 for detecting a place where the conductive ball 102 on the electrode is missing, a head 104 for replenishing the place where the conductive ball is missing with the conductive ball 102, and a means for moving the head for replenishment based on the position information on the place where the conductive ball is missing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for arranging conductive balls, and more particularly, to a method for holding a plurality of fine balls collectively on an array substrate having a plurality of ball suction holes formed therein. The present invention is suitable for use in a method and an apparatus for collectively arranging them on electrodes of electronic components such as a printed board and a semiconductor chip.

[0002]

2. Description of the Related Art In recent years, ball bumps using minute metal spheres have been used for electrical connection of semiconductor chips. By using the ball bump, various advantages such as miniaturization of the package and increase in the number of pins can be obtained. A bump forming technique using such a minute metal ball is described in, for example, Japanese Patent Application Laid-Open No. 7-153765.

In the bump forming method proposed in the above publication, a metal ball group for at least one semiconductor chip is sucked and held. Then, in order to hold a plurality of metal ball groups by suction, a ball array substrate having suction holes formed at all positions corresponding to the bump formation positions on the semiconductor chip is used. After sucking and holding, the ball array substrate is transported to a bonding stage and bonded to a portion to be bonded.

Therefore, in this case, the uniformly formed conductive balls can be collectively joined to the bump formation position, so that a uniform-shaped ball bump with little variation can be formed easily and efficiently. .

In recent years, semiconductor devices have been increasingly miniaturized, and the wiring pitch of electrodes has become extremely small. For this reason, metal balls used for forming ball bumps on electrodes have become extremely fine as the wiring pitch of the electrodes has become finer.

In such a situation, the semiconductor chip 1
Performing one array involves many repetitive operations, and is disadvantageous in terms of cost and time. Therefore, before cutting the wafer into individual chips, that is, before performing a dicing process, balls are arranged on all the electrodes corresponding to a plurality of chips on the wafer.

[0007]

However, if balls are to be collectively arranged on all the electrodes on a wafer on which a plurality of semiconductor chips are formed, the number of electrodes is about several hundred thousand, It is difficult to reliably arrange the balls on the electrodes described above, and there has been a problem that a suction arrangement failure occurs.

[0008] When a suction failure occurs, it is necessary to perform suction again. In the case of adsorbing the number of balls corresponding to the conventional single chip or several chips,
It is possible to adsorb all the balls by performing re-adsorption several times, but when adsorbing hundreds of thousands of balls to the wafer at once, the number of re-adsorption operations increases,
The process has become complicated, which has led to a decrease in yield and an increase in cost.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. Even when a suction failure occurs when a conductive ball is sucked and arranged on a suction head, a suction failure occurs. It is an object of the present invention to provide a conductive ball suction arrangement method and a suction arrangement device which can supplement a conductive ball at a location.

[0010]

According to the present invention, there is provided a method for arranging conductive balls by suction, wherein a plurality of conductive balls placed in a container are sucked by using a suction head, and the conductive balls are arranged on an object to be arrayed. A method of attracting and arranging conductive balls, which is arranged at a time on a plurality of electrodes, wherein after arranging the conductive balls on the electrodes, an arrangement defect of the conductive balls on the electrodes. The location is detected by image recognition, and information of the defective location is recorded, and the location where the placement defect is a missing mounting ball is regularly supplemented with the conductive ball. The method is characterized in that the conductive balls are regularly refilled after removing the placement defect including the surplus portion.

The conductive ball suction arrangement device of the present invention suctions a plurality of conductive balls contained in a container by using a suction head, and transfers the conductive balls to a plurality of objects to be arranged. What is claimed is: 1. A suction ball arrangement device for conductive balls, wherein said conductive balls are arranged on an electrode at a time. The means for detecting by means of, the means for recording the information of the surplus arrangement place, the place where the placement defect is a missing of the mounting ball, means for regularly replenishing the conductive ball, ,
Means for properly replenishing the conductive balls after removing the surplus portion of the balls.

Further, in the method of arranging conductive balls according to the present invention, a plurality of conductive balls placed in a container are sucked by using a suction head, and the conductive balls are arranged in a plurality of objects to be arranged. What is claimed is: 1. A method of arranging conductive balls, wherein said conductive balls are arranged collectively on an electrode. The location is detected by image recognition, the information of the defective location is recorded, and the mounting failure location of the conductive ball on the corresponding electrode is specified based on the information. It is characterized by regularly refilling sex balls.

Further, in the apparatus for arranging conductive balls according to the present invention, a plurality of conductive balls placed in a container are sucked by using a suction head, and the plurality of conductive balls are a plurality of objects to be arranged. What is claimed is: 1. An apparatus for arranging conductive balls which is arranged so as to be collectively arranged on an electrode, comprising detecting a defective suction position of said conductive ball on an arrangement surface of said suction head, and detecting positional information of said defective suction part. A defective suction location detecting means for obtaining; a defective mounting location specifying means for specifying a defective mounting location of the conductive ball on the electrode based on the information of the defective suction location; And a moving means for moving the replenishing means to the defective mounting position based on the position information.

In the method of arranging conductive balls according to the present invention, a plurality of conductive balls placed in a container are suctioned by using a suction head, and the plurality of conductive balls are arranged in a plurality of objects to be arranged. A method of arranging conductive balls, wherein the conductive balls are arranged on the electrodes at a time, and after arranging the conductive balls on the electrodes, an image of the remaining conductive balls on the arrangement surface of the suction head is formed. Detecting by recognition, recording information of the remaining portion, identifying a missing portion of the conductive ball on the corresponding electrode based on the information, and replenishing the conductive ball only in the missing portion. It is characterized by.

Further, the apparatus for arranging conductive balls according to the present invention suctions a plurality of conductive balls contained in a container using a suction head, and divides the conductive balls into a plurality of objects to be arrayed. An apparatus for arranging conductive balls that is arranged so as to be collectively arranged on an electrode, and detects a remaining portion of the conductive balls on an arrangement surface of the suction head,
A remaining portion detecting means for obtaining position information of the remaining portion, a missing portion specifying means for identifying a missing portion of the conductive ball on the electrode based on the information of the remaining portion, and It is characterized by comprising replenishing means for replenishing the conductive ball, and moving means for moving the replenishing means to the missing portion based on the position information.

In the method of arranging conductive balls according to the present invention, a plurality of conductive balls placed in a container are suctioned by using a suction head, and the plurality of conductive balls are arranged as a plurality of objects to be arranged. What is claimed is: 1. A method of arranging conductive balls, wherein said conductive balls are arranged collectively on an electrode. The location is detected by image recognition, the information of the defective location is recorded, and the mounting failure location of the conductive ball on the corresponding electrode is specified based on the information. Step of regularly replenishing the conductive ball, and after arranging the conductive ball on the electrode, detecting the conductive ball remaining portion on the arrangement surface of the suction head by image recognition, Recording the information of the remaining portion, identifying a missing portion of the conductive ball on the electrode based on the information, and refilling the conductive ball only in the missing portion. And

Further, in the apparatus for arranging conductive balls according to the present invention, a plurality of conductive balls placed in a container are suctioned by using a suction head, and the conductive balls are arranged in a plurality of objects to be arrayed. What is claimed is: 1. A device for arranging suction of conductive balls, wherein said device is arranged so as to be collectively arranged on an electrode, wherein said device detects a suction failure portion of said conductive ball on an arrangement surface of said suction head, and corresponds to said suction failure portion. A first defective mounting portion identifying means for identifying a defective mounting position of the conductive ball on the electrode based on the information of the poor absorbing position; A remaining portion detecting means for detecting a remaining portion of the conductive ball on the arrangement surface of the suction head and obtaining second position information corresponding to the remaining portion; and a pair based on the information of the remaining portion. A second mounting failure location specifying means for specifying a mounting failure location of the conductive ball on the electrode, and a mounting failure location detected from at least one of the first and second mounting failure location detecting means. Replenishing means for regularly replenishing the conductive ball, and moving means for moving the replenishing means to the mounting failure location based on at least one of the first and second position information. Features.

Further, in the method of arranging conductive balls according to the present invention, in a place where the suction failure is excessive, the conductive ball is refilled properly after removing the excess ball. And In addition, in the conductive ball suction arrangement device of the present invention, the replenishing unit may refill the conductive ball regularly after removing the excess portion of the ball in a portion where the suction failure is excessive. It is characterized by.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a conductive ball suction arrangement apparatus and a suction arrangement method according to the present invention will be described with reference to the drawings. FIG. 1 shows an example of a suction arrangement device in which a vacuum chamber 3 is provided in a suction head 100 and a pressure reducing / pressurizing system 4 and a leak adjusting valve 5 are provided in the vacuum chamber 3. FIG. 1A shows a process of adsorbing the ball 102 to the suction head 100, and FIG.
Are arranged on the wafer 105.

As shown in FIG. 1A, the ball suction arrangement device of the present embodiment includes a suction head 100 and a container 101. A plurality of balls 102 are placed in the container 101, and the balls 102 in the container 101 are collectively adsorbed to the array substrate 1 held under the suction head 100 by suctioning using the suction head 100. I do. The array substrate 1 is held on the head main body 2 of the suction head 100 by being vacuum-suctioned by a suction system different from the system for sucking the balls 102. The periphery of the array substrate 1 may be fixed to the head main body by a holding jig, or may be integrally formed with the head main body 2 by a method such as bonding. When the arrangement substrate 1 is formed of a thin plate or the like and may be deformed, an opening between the head body 2 of the suction head 100 and the arrangement substrate 1 is provided such that the suction holes 1a of the arrangement substrate 1 are not completely blocked. Providing a porous body 7 having a portion,
It is desirable to support the array substrate 1 using the rigidity of the porous body 7.

Next, the balls 10 adsorbed on the array substrate 1
It is checked whether 2 is adsorbed normally. As shown in FIG. 2, the ball arrangement state is inspected by an arrangement inspection camera (image capturing camera) 11. The array inspection camera 11 captures an image while moving along the movement guide 14. The suction head 100 moves in a direction orthogonal to the moving direction of the array inspection camera 11. Thereby, the array inspection camera 11 can inspect the entire ball array area.

Each of the suction head 100 and the moving guide 14 is provided with an encoder for detecting a position.
Position (coordinates) of array inspection camera 11 with respect to array substrate 1
Can be detected. The image captured by the array inspection camera 11 is subjected to image processing by the image processing means 12. Then, by displaying the processed image on a monitor (not shown) or the like, image recognition becomes possible.

When a defective suction portion is detected in the inspection after ball suction, if the defective portion is a surplus ball, it is removed, and if the ball is insufficient, the ball is re-adsorbed according to a predetermined standard.
It is determined whether the ball 102 is mounted on the wafer 105 as it is. This criterion can be set individually according to the number and ratio of the missing balls. For example, the criteria for missing balls is 10
In the case of individual pieces, the inspection after ball suction shows that
If the number is zero, re-adsorption is performed. After the re-adsorption, the ball is inspected again. When the ball 102 is mounted on the wafer 105 without being re-adsorbed, the position information of the defective suction spot on the array substrate 1 is detected by an encoder for detecting the position of the array inspection camera 11, and the detected position information is stored in a position recording unit. 13 is stored. The positional information can be reflected on a ball correcting device that corrects a defective ball mounting position on the wafer 105.
As the position information of the defective portion, the defective portion may be determined based on the image processed by the image processing means 12, and the corrected position coordinates may be returned to the ball correcting device from the coordinates of the processed image.

After the inspection of the ball suction state on the array substrate 1,
The process moves to a step of mounting the ball 102 on the wafer 105.
A vacuum chamber 3 is formed in the head main body 2. The pressure reducing / pressurizing system 4 and the leak adjusting valve 5 are provided for the head main body 2, and by operating these, the pressure of the vacuum chamber 3 can be set to a predetermined pressure.

After the balls 102 are sucked into the suction holes 1a of the array substrate 1, the suction head 100 is moved as shown in FIG.
Is moved onto the wafer 105, and the electrodes 10 on the wafer 105 are moved.
5a and the position of the suction hole 1a of the array substrate 1 are made to correspond. Then, the reduced pressure state of the vacuum chamber 3 is released by operating the leak adjustment valve 5. Thus, the balls 102 sucked by the array substrate 1 are arrayed on the electrodes 105a of the wafer 105.

After the balls 102 are mounted, the remaining balls on the array substrate 1 are inspected again by the array inspection camera 11 as shown in FIG. The presence or absence of the ball 102 remaining on the array substrate 1 without being mounted on the electrode 105a of the wafer 105 by, for example, biting into the suction hole 1a is inspected here. Since the portion where the remaining ball 102 exists is a portion where the ball is not mounted on the wafer 105, the inspection result is sent to the ball replenishing device 104 and the ball 10 is transferred to the electrode 105a.
2. Refill 2.

Next, the configuration of the ball inspection device 103 and the ball replenishing device 104 for replenishing the ball 102 when a defective ball mounting portion occurs will be described with reference to FIG. The ball inspection device 103 and the ball replenishment device 104 are included in the configuration of the suction arrangement device shown in FIG. 1, and perform the arrangement, inspection, and replenishment of the balls 102 in a series of steps.

FIG. 4A shows a ball replenishing apparatus 1 for replenishing a ball 102 at a defective mounting position on a wafer 105.
04 is shown. The ball replenishing device 104
The suction unit 21 is configured to include a suction unit 21 that suctions a predetermined number of 02 and a suction unit moving guide 22 that is a guide that moves the suction unit 21. The suction means 21 can move along the suction means moving guide 22. Also,
The suction means moving guide 22 is movable parallel to the wafer 105 in a direction perpendicular to the longitudinal direction. Therefore, the suction means 21 can be moved to the whole area on the wafer 105. In the example shown in FIG.
Is configured to adsorb only one ball bump 102.

An encoder for detecting the amount of movement is also provided between the suction means 21 and the suction means moving guide 22. Further, an encoder is provided for detecting the amount of movement of the suction means moving guide 22. Various position detection mechanisms using an optical sensor, a magnetic sensor, or the like can be used as the encoder. This allows
The position (coordinates) of the suction means 21 on the wafer 105 can be detected. Then, based on the position information of the suction failure location stored in the position information storage means 13, the suction means 21 is moved to the suction failure location while detecting the position of the suction means 21. The movement is performed by moving means including a motor and a driving mechanism connected to the suction means 21 and the suction means moving guide 22.

As described above, the suction means 21 sucks and holds one ball 102. After the suction means 21 is moved to the position where the suction is poor, the suction is released, whereby the ball 102 is mounted on the electrode 105a at the position where the suction is poor.

It should be noted that the suction means 21 is provided with a plurality of balls 10
2 may be adsorbable, and in this case, a plurality of balls 102
Can be replenished at once.

FIG. 4B shows a ball correcting device 103a for correcting a surplus mounting portion, which is a mounting defective portion on the wafer 105. The ball correction device 103a
Removing means 31 for removing a predetermined number of balls 102;
It has a removing means moving guide 32 which is a guide for moving the removing means 31. The removing means 31 can move along the removing means moving guide 32. Further, the removing means moving guide 32 is movable in parallel to the wafer 105 in a direction perpendicular to the longitudinal direction. Therefore, the removing means 31 can be moved to the whole area on the wafer 105. In the example shown in FIG. 4B, the removing means 31 includes the surplus conductive balls 102 'and the balls 10'.
It is configured to remove both the normally mounted conductive ball 102 adjacent to 2 ′.

An encoder is also provided between the removing means 31 and the removing means moving guide 32 for detecting the amount of movement. In addition, an encoder is provided for detecting the amount of movement of the removing means moving guide 32. Various position detection mechanisms using an optical sensor, a magnetic sensor, or the like can be used as the encoder. This allows
The position (coordinates) of the removing unit 31 on the wafer 105 can be detected. Then, based on the position information of the suction failure location or the mounting failure location stored in the position information storage means 13, the removal means 31 is moved to the mounting failure location while detecting the position of the removal means 31. The movement is performed by means including a motor and a driving mechanism connected to the removing means 31 and the removing means moving guide 32.

The removing means 31 may be any method as long as it can remove a small area, for example, may be a method of mechanically sandwiching, a method of piercing with a projection, or a method of removing by suction.

The removing means 31 may remove the surplus balls one by one, or may simultaneously remove a plurality of balls including adjacent regular balls. When the ball mounted at the regular position is also removed, the ball is further corrected by the replenishing means 21 described above.

Also, in this embodiment, 300 m
Since the balls 102 are arranged on a large-diameter wafer such as an m-wafer, the number of the balls 102 corresponding to one semiconductor chip is suctioned by the suction means 21 and the wafer 1
The ball 102 may be re-mounted on a defective suction position corresponding to one semiconductor chip on the semiconductor device 05. In this case, the ball 102 for one semiconductor chip including the defective suction portion is removed in advance by a method such as suction, and the suction means 21 that has suctioned the ball 102 for one semiconductor chip is used to suck the ball 102 for one semiconductor chip. The ball 102 is refilled.

As described above, according to the present embodiment,
In particular, when the ball 102 is collectively arranged on a large-area object such as a 300 mm wafer, even if a suction failure occurs, the defective portion on the wafer 105 is replenished by the suction unit 21 by using the suction means 21. All electrodes 10
The balls 102 can be arranged on 5a. Therefore, the ball 102 is placed on the electrode 105a of the wafer 105.
Can improve the reliability of the array.

[0038]

According to the present invention, it is possible to replenish conductive balls at defective suction locations when suction failure occurs when the conductive balls are sucked and arranged on the suction head. Becomes Therefore, it is possible to provide a method and an apparatus for arranging and attracting conductive balls with improved arrangement reliability. Further, according to the present invention, the operation can be shifted to the mounting operation even if the ball is not sucked in all the suction holes of the suction head, so that the number of times of re-suction can be reduced or eliminated, thereby improving the production efficiency. .

[Brief description of the drawings]

FIG. 1 is a schematic view showing a method of arranging balls on a wafer by a suction arrangement apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a state where a ball arrangement state is inspected by an arrangement inspection camera.

FIG. 3 is a schematic view showing a state of inspecting a remaining ball remaining on an array substrate.

FIG. 4 is a schematic diagram showing a ball refilling device and a ball correcting device according to one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Array board 1a Suction hole 2 Head main body 3 Vacuum chamber 4 Decompression / pressurization system 5 Leak adjusting valve 6 Vibration applying means 7 Porous body 11 Image capture camera 12 Image processing means 13 Position recording means 14 Camera movement guide 21 Suction means 22 Suction means moving guide 31 Removing means 32 Removing means moving guide 100 Suction head 101 Container 102 Ball 103a Ball correcting device 104 Ball replenishing device 105 Wafer 105a Electrode

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hideji Hashino 20-1 Shintomi, Futtsu City Nippon Steel Corporation Technology Development Headquarters (72) Inventor Kazuo Niizuma 58-58 Soyoda Honmachi Kou, Kanazawa-shi, Ishikawa Shibuya F-term (reference) 5E319 AA03 AB05 AC01 AC16 BB04 CC22 CD04 CD26 GG15

Claims (10)

[Claims] 1. A conductive device in which a plurality of conductive balls placed in a container are suctioned using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes which are objects to be arranged. A method of arranging conductive balls, wherein after arranging the conductive balls on the electrodes, an arrangement defect of the conductive balls on the electrodes is detected by image recognition, and information on the defect is recorded. Then, in the place where the placement defect is a lack of the mounting ball, the conductive ball is regularly replenished, and in the place where there is a surplus, the placement defect including the surplus part is removed, and then the form defect is removed. A method for arranging conductive balls by replenishing conductive balls. 2. A conductive device, wherein a plurality of conductive balls placed in a container are sucked using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes to be arranged. A device for arranging the conductive balls on the electrodes, detecting a surplus arrangement position of the conductive balls on the electrodes by image recognition, and information on the surplus arrangement positions. Means for recording, and a means for regularly replenishing the conductive ball in a place where the placement defect is a missing mounting ball, and a method for removing the surplus part of the ball in a surplus part, Means for replenishing the conductive balls. 3. A conductive device in which a plurality of conductive balls placed in a container are suctioned using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes which are objects to be arranged. A method for arranging conductive balls, comprising: holding the conductive balls by suction on the suction head;
A defective suction position of the conductive ball on the arrangement surface of the suction head is detected by image recognition, information of the defective position is recorded, and a mounting failure of the conductive ball on the electrode corresponding to the defective information is recorded based on the information. A method for arranging conductive balls, wherein a position is specified, and the conductive balls are regularly replenished only in the mounting failure position. 4. A conductive type in which a plurality of conductive balls placed in a container are suctioned using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes which are objects to be arranged. A suction ball arranging device, comprising: a suction deficient portion detecting means for detecting a suction deficient portion of the conductive ball on an array surface of the suction head and obtaining positional information of the suction deficient portion; A mounting failure location specifying means for specifying a mounting failure location of the conductive ball on the electrode based on the information of the failure location; and a replenishing means for regularly replenishing the conductive ball to the mounting failure location. And a moving means for moving the replenishing means to the mounting failure portion based on the position information. 5. A conductive material in which a plurality of conductive balls placed in a container are sucked using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes to be arranged. A method for arranging conductive balls, wherein after arranging the conductive balls on the electrodes, the conductive ball remaining portions on the arrangement surface of the suction head are detected by image recognition, and information on the remaining portions is detected. Record
A method for arranging conductive balls, the method comprising: identifying a missing portion of the conductive ball on the electrode based on the information; and replenishing the conductive ball only in the missing portion. 6. A conductive material in which a plurality of conductive balls placed in a container are sucked using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes to be arranged. And a remaining portion detecting means for detecting a remaining portion of the conductive ball on an arrangement surface of the suction head and obtaining positional information of the remaining portion, and information of the remaining portion. A missing portion identifying means for identifying a missing portion of the conductive ball on the electrode based on the following; a replenishing device for replenishing the conductive ball in the missing portion; and the replenishing based on the position information. And a moving means for moving the means to the missing portion. 7. A conductive member in which a plurality of conductive balls placed in a container are sucked using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes to be arranged. A method for arranging conductive balls, comprising: holding the conductive balls by suction on the suction head;
A defective suction position of the conductive ball on the arrangement surface of the suction head is detected by image recognition, information of the defective position is recorded, and a mounting failure of the conductive ball on the electrode corresponding to the defective information is recorded based on the information. Specifying a location and regularly refilling the conductive ball only in the mounting failure location; and, after arranging the conductive ball on the electrode, the conductive ball remaining location on the arrangement surface of the suction head. Is detected by image recognition, and information of the remaining portion is recorded,
Identifying a missing portion of the conductive ball on the electrode based on the information, and refilling the conductive ball only in the missing portion. . 8. A conductive material in which a plurality of conductive balls placed in a container are suctioned using a suction head, and the conductive balls are collectively arranged on a plurality of electrodes to be arranged. A suction ball arranging device for detecting the position of a suction failure of the conductive ball on the arrangement surface of the suction head, and detecting a position of the suction failure to obtain first position information corresponding to the position of the suction failure. Means, a first mounting failure location specifying means for specifying a mounting failure location of the conductive ball on the electrode based on the information of the suction failure location, and the conductive ball on an arrangement surface of the suction head Remaining position detecting means for detecting a remaining position of the remaining portion and obtaining second position information corresponding to the remaining portion, and the conductive ball on the electrode corresponding to the information of the remaining portion A second mounting failure location specifying means for specifying a mounting failure location; and a conductive ball is regularly replenished to the mounting failure location detected from at least one of the first and second mounting failure location detecting means. And a moving means for moving the refilling means to the mounting failure location based on at least one of the first and second position information. . 9. The method according to claim 3, wherein the portion where the poor suction is excessive is removed by removing the excess ball, and then the conductive ball is regularly refilled. Method of arranging conductive balls to be drawn. 10. The apparatus according to claim 4, wherein the replenishing means includes a portion where the suction failure is excessive.
The conductive ball suction arrangement device, wherein the conductive ball is regularly refilled after removing the surplus portion of the ball.