JP2011077493A - Substrate manufacturing apparatus, substrate manufacturing method, spherical body-mounted substrate, and electronic component-mounted substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To securely prevent excess mounting of a fine spherical body on a substrate. <P>SOLUTION: A substrate manufacturing apparatus is configured such that it can manufacture a solder ball 300-mounted substrate and has a spherical body mounting apparatus having a solder ball vacuum chucking apparatus 51 including a vacuum chucking head 511 that carries out a vacuum chucking process to vacuum-chuck solder balls 300 at edges of inlets formed in a vacuum chucking surface 512c and that mounts the solder balls 300 vacuum-chucked by the vacuum chucking head 511 on the substrate. The solder ball vacuum chucking apparatus 51 includes a hold vessel 514 that has an opening 514b and holds the solder balls 300, and a vacuum chucking/holding unit 515 that vacuum-chucks and holds the solder balls 300 held in the holding vessel 514 on a front end 515a thereof, and carries out a supplying process that brings the vacuum chucking/holding unit 515 holding the solder balls 300 on the front end 515a and a vacuum chucking surface 512c of the vacuum chucking head 511 relatively close to supply the balls 300 to the vacuum chucking head 511 in a state allowing air to be drawn through the inlets. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate manufacturing apparatus and a substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting a spherical body on a substrate, a spherical body mounted substrate manufactured by the substrate manufacturing apparatus or the substrate manufacturing method, and the spherical body The present invention relates to an electronic component mounted substrate in which an electronic component is mounted on the mounted substrate.

  A solder ball mounting device disclosed in Japanese Patent Laid-Open No. 2003-1000078 is known as a spherical body mounting device for mounting a spherical body on a substrate when manufacturing this type of spherical body mounted substrate. . This solder ball mounting device includes an alignment mask having a plurality of suction holes formed on the suction surface, and a moving unit that moves the alignment mask, so that the solder balls sucked by the alignment mask can be mounted on the connection terminals of the package. Has been. In addition, the solder ball mounting device includes a detachment plate in which a plurality of through holes larger than the solder balls are formed in the same arrangement as the suction holes of the alignment mask and are movable relative to the alignment mask. When mounting solder balls on the connection terminals of the package using this solder ball mounting device, the release plate is brought into contact with the suction surface of the alignment mask, and the solder mask accommodates a larger amount of the alignment mask and release plate in that state. A solder ball is supplied by being fitted in a solder ball container. At this time, one solder ball is adsorbed to the suction hole of the alignment mask through the through hole of the release plate, and surplus other than the solder ball is caused by the air current sucked from the gap between the solder ball and the suction hole. Solder balls are adsorbed. Next, the release plate is moved downward to be separated from the suction surface of the alignment mask. At this time, the excessive solder balls described above are pulled away from the alignment mask with the movement of the release plate and fall into the solder ball container. For this reason, in this solder ball mounting apparatus, it is possible to prevent mounting of excessive solder balls on the connection terminals.

Japanese Unexamined Patent Publication No. 2003-1000078 (page 3-4, FIG. 1-6)

  However, the above-described conventional solder ball mounting apparatus has the following problems. That is, in this solder ball mounting apparatus, the solder ball is supplied by fitting the alignment mask and the release plate into a solder ball container in which a large number of solder balls are accommodated. Further, in this solder ball mounting apparatus, excess solder balls are dropped from the alignment mask and removed by moving the release plate downward and away from the adsorption surface of the alignment mask. On the other hand, with the recent increase in the density of packages, solder balls have been miniaturized. In this case, the smaller the solder balls are, the larger the force with which the solder balls are attracted to each other due to static electricity between the solder balls or intermolecular force, relative to the weight of the solder balls. For this reason, as shown in FIGS. 59 to 61, when the solder balls are supplied by the above-described method, a large amount of excessive solder balls are attached due to the pulling force of the solder balls, and the release plate 702 is moved downward. In some cases, it is not possible to remove all of the excess solder balls from the alignment mask 701 by simply making them. Therefore, in the above solder ball mounting device, when the solder balls are very small, it is difficult to prevent mounting of excessive solder balls on the connection terminals (that is, excessive mounting of solder balls on the connection terminals). There is a problem. As a result, when a solder ball is mounted on a board by this solder ball mounting apparatus and a spherical body mounted board is manufactured using this, there is a problem that a defect due to excessive mounting of the solder ball may occur. Exists.

  The present invention has been made in view of such problems, and is manufactured by a substrate manufacturing apparatus and a substrate manufacturing method that can surely prevent an excessive mounting of a minute spherical body on the substrate, and the substrate manufacturing apparatus or the substrate manufacturing method. It is a main object to provide a spherical body mounted substrate and an electronic component mounted substrate in which electronic components are mounted on the spherical body mounted substrate.

  In order to achieve the above object, a substrate manufacturing apparatus according to claim 1, further comprising a spherical body suction device having a suction head for performing a suction process for sucking the spherical body at the edge of the suction port formed on the suction surface. A substrate manufacturing apparatus that includes a spherical body mounting device that mounts the spherical body sucked by the suction head on a substrate and manufactures a spherical body mounted substrate, the spherical body suction device having an opening. A storage container for storing the spherical body; and an adsorption holding section for adsorbing and holding the spherical body stored in the storage container at the distal end portion thereof, and holding the spherical body at the distal end portion. Supply processing for supplying the spherical body to the suction head in a state where the suction holding portion and the suction surface of the suction head are relatively close to each other and sucked from the suction port is executed.

  According to a second aspect of the present invention, there is provided a substrate manufacturing apparatus including a spherical body suction device having a suction head for performing a suction process for sucking a spherical body at an edge of an intake port formed on the suction surface. A substrate manufacturing apparatus that manufactures a spherical body mounted substrate by including a spherical body mounting device for mounting the spherical body on a substrate, wherein the spherical body adsorption device has an opening to A storage container for storing, a suction holding section for sucking and holding the spherical body stored in the storage container at its tip, and a suction section capable of sucking the spherical body; Supply that supplies the spherical body to the suction head in a state where the suction holding portion holding the spherical body and the suction surface of the suction head are relatively close to each other and sucked from the suction port Execute the process and A suction process is performed in which the suction part and the suction surface of the suction head are relatively brought close to each other to suck and remove the excess spherical body excluding the spherical body that is sucked to the edge of the intake port. .

  According to a third aspect of the present invention, there is provided a substrate manufacturing apparatus comprising a spherical body suction device having a suction head for performing a suction process for sucking a spherical body at an edge of an air inlet formed on the suction surface, and suctioned by the suction head A substrate manufacturing apparatus that includes a spherical body mounting device for mounting the spherical body on a substrate to manufacture a spherical body mounted substrate, wherein the spherical body adsorption device has an opening and the spherical body is mounted on the substrate. A storage container for storing, a suction holding section for sucking and holding the spherical body stored in the storage container at its tip, and a suction section capable of sucking the spherical body; Supplying the spherical body to the suction head in a state where the suction holding portion holding the spherical body and the suction surface of the suction head are relatively close to each other and sucking from the suction port Execute the process and A suction process is performed in which a suction part and the suction surface of the suction head are relatively close to each other to suck and remove excess spherical body except the spherical body that is sucked to the edge of the suction port. The spherical body mounting device is sucked by the suction head and a first detection unit that executes a first detection process for detecting excess or deficiency of the spherical body in the suction head after the suction process is performed. A first removal unit that executes a first removal process for removing the spherical body from the suction head; and a control unit, wherein the control unit detects an excess of the spherical body in the first detection process. The suction process and the supply process are re-executed after the first removal process is executed, and the suction process and the supply process are re-executed when the shortage of the spherical body is detected in the first detection process. .

  According to a fourth aspect of the present invention, there is provided a substrate manufacturing apparatus comprising: a flux coating apparatus that performs a coating process for coating a substrate with a flux; and an adsorption process for adsorbing a spherical body at an edge of an intake port formed on the adsorption surface. A spherical body mounted substrate having a spherical body suction device having a suction head to perform and mounting the spherical body sucked by the suction head on the substrate after execution of the coating process The flux coating apparatus includes a squeegee unit having a squeegee that spreads the supplied flux on the coating surface of the substrate, and an opening that exposes the flux coating region on the coating surface. At least one of the substrate and the squeegee unit with the mask provided with the substrate pressed against the application surface, The squeegee unit is moved in a first direction in which the squeegee units approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux in the application area by moving in a second direction, and the squeegee unit includes a first base part, a second base part, and the second base part with respect to the first base part. A connecting mechanism that connects the first base portion and the second base portion to each other while allowing relative movement along the first direction, and the first base portion and the second base portion to each other. An urging member that urges the squeegee in a separating direction, and the squeegee is connected to the second base via a rotation shaft disposed so that an axial length thereof is along the second direction. The spherical body adsorbing device is configured to be attached to a storage portion, and has an opening portion for storing the spherical body and the spherical body stored in the storage container. A suction holding portion that holds the spherical body, and the suction holding portion that holds the spherical body at the tip portion and the suction surface of the suction head relatively A supply process for supplying the spherical body to the suction head in a state of being sucked and sucked from the intake port is performed, and the suction portion and the suction surface of the suction head are relatively brought closer to each other. Then, a suction process is performed to suck and remove excess spherical bodies excluding the spherical bodies adsorbed on the edge of the intake port.

  According to a fifth aspect of the present invention, there is provided a substrate manufacturing apparatus comprising: a flux coating apparatus that performs a coating process for coating a substrate with a flux; and an adsorption process for adsorbing a spherical body at an edge of an air inlet formed on the adsorption surface. A spherical body mounted substrate having a spherical body suction device having a suction head to perform and mounting the spherical body sucked by the suction head on the substrate after execution of the coating process The flux coating apparatus includes a squeegee unit having a squeegee that spreads the supplied flux on the coating surface of the substrate, and an opening that exposes the flux coating region on the coating surface. At least one of the substrate and the squeegee unit that is pressed against the coating surface is attached to the substrate and the scan plate. The squeegee unit is moved in a first direction in which the squeegee units approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux in the application area by moving in a second direction, and the squeegee unit includes a first base part, a second base part, and the second base part with respect to the first base part. A connecting mechanism that connects the first base portion and the second base portion to each other while allowing relative movement along the first direction, and the first base portion and the second base portion to each other. An urging member that urges the squeegee in a separating direction, and the squeegee is connected to the second base via a rotation shaft disposed so that an axial length thereof is along the second direction. The spherical body adsorbing device is configured to be attached to a storage portion, and has an opening portion for storing the spherical body and the spherical body stored in the storage container. A suction holding portion that holds the spherical body, and the suction holding portion that holds the spherical body at the tip portion and the suction surface of the suction head relatively A supply process for supplying the spherical body to the suction head in a state of being sucked and sucked from the intake port is performed, and the suction portion and the suction surface of the suction head are relatively brought closer to each other. The suction process for sucking and removing the excess spherical body excluding the spherical body adsorbed on the edge of the intake port is performed, and the spherical body mounting device performs the suction process after the suction process is performed. Excess or deficiency of the spherical body in the head A first detection unit that executes a first detection process to be detected; a first removal unit that executes a first removal process that removes the spherical body adsorbed by the suction head from the suction head; and a control unit. And the control unit re-executes the adsorption process and the supply process after the first removal process is executed when an excess of the spherical body is detected in the first detection process, and the first detection process is performed. When the shortage of the spherical body is detected in the process, the adsorption process and the supply process are re-executed.

  According to a sixth aspect of the present invention, there is provided a substrate manufacturing apparatus including a spherical body suction device having a suction head for performing a suction process for sucking a spherical body at an edge portion of an air inlet formed on the suction surface, and suctioned by the suction head. A substrate manufacturing apparatus that includes a spherical body mounting device for mounting the spherical body on a substrate to manufacture a spherical body mounted substrate, wherein the spherical body adsorption device has an opening and the spherical body is mounted on the substrate. The suction holding part that includes a holding container for holding and a suction holding part that sucks and holds the spherical body contained in the receiving container at its tip part, and holds the spherical body at the tip part A supply process for supplying the spherical body to the suction head in a state where the suction head is sucked from the suction port with the suction surface of the suction head relatively close to each other. , After execution of the adsorption process A first detection unit that executes a first detection process for detecting excess or deficiency of the spherical body in the suction head and a first removal process for removing the spherical body that is sucked by the suction head from the suction head are executed. A first removal unit that performs the first removal process when an excess of the spherical body is detected in the first detection process. The supply process is re-executed, and when the shortage of the spherical body is detected in the first detection process, the adsorption process and the supply process are re-executed.

  According to a seventh aspect of the present invention, there is provided a substrate manufacturing method comprising: a flux applying device that performs a coating process for applying a flux to a substrate; and an adsorption process for adsorbing a spherical body on an edge of an intake port formed on the adsorption surface. A spherical body mounted substrate having a spherical body suction device having a suction head to perform and mounting the spherical body sucked by the suction head on the substrate after execution of the coating process The flux coating apparatus includes a squeegee unit having a squeegee that spreads the supplied flux on the coating surface of the substrate, and an opening that exposes the flux coating region on the coating surface. At least one of the substrate and the squeegee unit that is pressed against the coating surface is attached to the substrate and the scan plate. The squeegee unit is moved in a first direction in which the squeegee units approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux in the application area by moving in a second direction, and the squeegee unit includes a first base part, a second base part, and the second base part with respect to the first base part. A connecting mechanism that connects the first base portion and the second base portion to each other while allowing relative movement along the first direction, and the first base portion and the second base portion to each other. An urging member that urges the squeegee in a separating direction, and the squeegee is connected to the second base via a rotation shaft disposed so that an axial length thereof is along the second direction. The spherical body adsorbing device is configured to be attached to a storage portion, and has an opening portion for storing the spherical body and the spherical body stored in the storage container. A suction holding portion that holds the spherical body at the tip portion and sucks the suction surface of the suction head relatively close to each other from the suction port. A supply process for supplying the spherical body to the suction head in a state, and the spherical body mounting device detects a first or second shortage of the spherical body in the suction head after the suction process is performed. A first detection unit that executes a process; a first removal unit that executes a first removal process that removes the spherical body that is sucked by the suction head from the suction head; and a control unit. In the first detection process When the excess of the spherical body is detected, the adsorption process and the supply process are re-executed after the first removal process is performed, and the lack of the spherical body is detected in the first detection process. Sometimes the adsorption process and the supply process are re-executed.

  The substrate manufacturing apparatus according to claim 8 includes a flux coating apparatus that performs a coating process for coating a substrate with a flux, and an adsorption process for adsorbing a spherical body at an edge of an air inlet formed on the adsorption surface. A spherical body mounted substrate having a spherical body suction device having a suction head to perform and mounting the spherical body sucked by the suction head on the substrate after execution of the coating process The flux coating apparatus includes a squeegee unit having a squeegee that spreads the supplied flux on the coating surface of the substrate, and an opening that exposes the flux coating region on the coating surface. At least one of the substrate and the squeegee unit that is pressed against the coating surface is attached to the substrate and the scan plate. The squeegee unit is moved in a first direction in which the squeegee units approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux in the application area by moving in a second direction, and the squeegee unit includes a first base part, a second base part, and the second base part with respect to the first base part. A connecting mechanism that connects the first base portion and the second base portion to each other while allowing relative movement along the first direction, and the first base portion and the second base portion to each other. An urging member that urges the squeegee in a separating direction, and the squeegee is connected to the second base via a rotation shaft disposed so that an axial length thereof is along the second direction. The spherical body adsorbing device is configured to be attached to a storage portion, and has an opening portion for accommodating the spherical body and the spherical body accommodated in the accommodating container at its distal end portion. A suction holding part that holds the spherical body at the tip part and sucks the suction surface of the suction head relatively close to each other from the suction port. Supply processing for supplying the spherical body to the suction head in the state is executed.

  The substrate manufacturing apparatus according to claim 9 is the substrate manufacturing apparatus according to any one of claims 1 to 8, wherein the spherical body adsorption device includes a moving mechanism, and the moving mechanism is configured to perform the supply process. The suction holding portion relatively moves along the suction surface in a state where the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relatively close to each other. In this manner, at least one of the suction head and the suction holding unit is moved.

  The substrate manufacturing apparatus according to claim 10 is the substrate manufacturing apparatus according to any one of claims 1 to 9, wherein the spherical body mounting device includes a plurality of the suction heads, and the suction head and the substrate. A mounting portion is provided that mounts the spherical body held by the suction head on the substrate by performing a movement process for moving either one toward the other, and each suction head includes a suction port Each of the suction heads is configured to have a different diameter corresponding to the diameter of the spherical body, and the mounting portion executes the moving process for each of the suction heads to perform the suction ports of the suction heads. A plurality of types of the spherical bodies having different diameters corresponding to the apertures are mounted on one substrate.

  The substrate manufacturing apparatus according to claim 11 is the substrate manufacturing apparatus according to any one of claims 1 to 10, wherein the spherical body mounting apparatus performs a replenishment process for replenishing the spherical body to the storage container. A spherical replenishing device that performs the replenishment container in which the spherical body replenishing device accommodates the spherical body and has a discharge port for discharging the spherical body stored therein, and the discharge port facing downward. The replenishing container in a state of being placed, and a placement portion formed with a housing portion communicating with the discharge port and capable of accommodating the spherical body in the placement state, and a change in an inclination angle of the placement portion A rotating mechanism that rotates the mounting portion so that the storage portion stores the spherical body discharged from the discharge port of the replenishing container, and an edge of the mounting portion. The spherical body is formed from the mounting portion A replenishing port to be lowered and a moving flow path connecting the storage unit, and the rotating mechanism is placed in a first posture in a standby state in which the storage unit is located below the replenishing port. And the above-described placement portion is rotated so that the replenishing port is in a second posture located below the storage portion during the replenishment process.

  A substrate manufacturing apparatus according to claim 12 is a substrate manufacturing apparatus according to any one of claims 1 to 11, wherein the substrate manufacturing apparatus cuts a multi-sided substrate having a plurality of substrates mounted thereon and divides the substrate into the substrates. A cutting device that performs processing, and an inspection device that performs electrical inspection on each of the divided substrates, and the spherical body mounting device is configured such that the spherical body is provided only on the substrate that is determined to be non-defective in the electrical inspection. Is installed.

  In this case, in the substrate manufacturing apparatus, the spherical body suction device of the spherical body mounting device includes a rotation mechanism that rotates the suction holding portion, and the suction holding portion is the opening portion of the storage container. Arranged on the side and configured to be rotatable by the rotation mechanism around the base end portion with the spherical body held by the distal end portion. Further, it is possible to adopt a configuration in which the suction holding part is rotated so that the tip part holding the spherical body faces the suction surface.

  In the substrate manufacturing apparatus described above, the container and the suction holding unit in the spherical body suction device of the spherical body mounting device can be configured integrally.

  In the substrate manufacturing apparatus, the container, the suction holding unit, and the suction unit in the spherical body suction device of the spherical body mounting device can be integrally configured.

  Further, in the substrate manufacturing apparatus, the spherical body suction device of the spherical body mounting device is configured to be detachable from the suction head and is mounted so that one surface thereof is in contact with the suction surface. In the state where the alignment plate is mounted on the suction head, and the supply process and the suction process are performed. An implementation configuration can be employed.

  Further, in the substrate manufacturing apparatus, the spherical body mounting device executes a second detection process for detecting the presence or absence of adhered matter on the suction head after the spherical body is mounted on the substrate. And a second removal unit that executes a second removal process for removing the deposit from the suction head, and when the control unit detects the flux as the deposit in the second detection process. A configuration for executing the second removal process may be employed.

  Further, in the substrate manufacturing apparatus, the spherical body mounting device executes a second detection process for detecting the presence or absence of adhered matter on the suction head after the spherical body is mounted on the substrate. And a second removal unit that executes a second removal process for removing the deposit from the suction head, and the control unit does not detect the flux as the deposit in the second detection process. A configuration in which the first removal process is performed when a spherical body is detected as the attached substance can be employed.

  In the substrate manufacturing apparatus, a configuration in which a concave portion or a notch for avoiding contact with the spherical body already mounted on the substrate is formed in the suction head of the spherical body mounting device is adopted. Can do.

  Further, in the substrate manufacturing apparatus, the mounting unit of the spherical body mounting apparatus includes the same number of moving mechanisms as the moving process for performing the process of moving the suction head toward the substrate as the moving process. It is possible to adopt a configuration in which each moving mechanism moves each suction head individually.

  In the substrate manufacturing apparatus, the mounting unit of the spherical body mounting device adopts a configuration in which the moving process for the suction head having the small diameter is performed prior to the moving process for the suction head having the large diameter. can do.

  Further, in the substrate manufacturing apparatus, the storage portion of the spherical body replenishing device in the spherical body mounting apparatus is formed in a U shape in a plan view or a side view, and the moving flow path is a straight line in a plan view or a side view. The structure formed in a shape can be employed.

  Further, in the substrate manufacturing apparatus described above, it is possible to employ a configuration including an antioxidant gas supply unit that supplies an antioxidant gas into the supply container of the spherical body replenishing device in the spherical body mounting apparatus.

  Further, in the above substrate manufacturing apparatus, it is possible to adopt a configuration in which the spherical body replenishing device executes the replenishing process when a predetermined condition is satisfied.

  Further, in the above substrate manufacturing apparatus, the flux applying device includes a third base configured such that the squeegee is attached to the second base portion via the squeegee main body and the rotation shaft, and the squeegee main body is removable. The structure provided with a part can be adopted.

  In the substrate manufacturing apparatus described above, a configuration in which the inspection apparatus performs the electrical inspection on the substrate divided by the cutting apparatus can be employed.

  Further, in the substrate manufacturing method according to the thirteenth aspect, the suction head is caused to perform suction processing for sucking the spherical body to the edge of the suction port formed on the suction surface of the suction head, and the suction head is sucked. A substrate manufacturing method for manufacturing a spherical body-mounted substrate by mounting the spherical body on a substrate, wherein the spherical body accommodated in an accommodation container having an opening is sucked and held when the suction process is performed. The suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are sucked from the intake port relatively close to each other. Supply processing for supplying the spherical body to the suction head in the state is executed.

  Further, in the substrate manufacturing method according to claim 14, the suction head is caused to perform suction processing for sucking a spherical body to the edge of the suction port formed on the suction surface of the suction head, and is sucked by the suction head. A substrate manufacturing method of manufacturing a spherical body mounted substrate by mounting the spherical body on a substrate, wherein the spherical body accommodated in an accommodation container having an opening is sucked and held at the time of performing the suction process The suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are sucked from the intake port relatively close to each other. A supply process for supplying the spherical body to the suction head in a state, and the suction portion capable of sucking the spherical body and the suction surface of the suction head are relatively close to each other to Adsorbed to the edge And it is sucked excess the spherical body except the spherical body executes a suction process for removal.

  Further, in the substrate manufacturing method according to claim 15, the suction head is caused to perform suction processing for sucking a spherical body to the edge of the suction port formed on the suction surface of the suction head, and is sucked by the suction head. A substrate manufacturing method of manufacturing a spherical body mounted substrate by mounting the spherical body on a substrate, wherein the spherical body accommodated in an accommodation container having an opening is sucked and held at the time of performing the suction process The suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are sucked from the intake port relatively close to each other. A supply process for supplying the spherical body to the suction head in a state, and the suction portion capable of sucking the spherical body and the suction surface of the suction head are relatively close to each other to Adsorbed to the edge A suction process for sucking and removing excess spherical bodies excluding the spherical bodies that are present, and a first detection process for detecting excess or deficiency of the spherical bodies in the suction head after execution of the suction process Then, after performing the first removal process for removing the spherical body adsorbed by the adsorption head when the excess of the spherical body is detected in the first detection process, the adsorption process and the supply The process is re-executed, and when the shortage of the spherical body is detected in the first detection process, the adsorption process and the supply process are re-executed.

  Further, the substrate manufacturing method according to claim 16 executes an application process for applying a flux to the substrate, and performs an adsorption process for adsorbing a spherical body on an edge of an intake port formed on an adsorption surface of the adsorption head. A substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting the spherical body that is suctioned by the suction head on the substrate after the execution of the coating process, and supplying the supplied flux A squeegee unit having a squeegee that spreads on the application surface of the substrate, and at least one of the substrates pressed against the application surface by a mask provided with an opening that exposes the application region of the flux on the application surface, The substrate and the squeegee unit are moved in the first direction approaching each other, and the tip of the squeegee that is linear in plan view is pushed onto the surface of the mask. In this state, the coating process of spreading at least one of the substrate and the squeegee unit in the second direction along the coating surface to spread the flux on the coating area is performed by the first base portion and the second base. A coupling mechanism that couples the first base portion and the second base portion to each other while allowing relative movement along the first direction of the second base portion with respect to the first base portion, An urging member that urges the first base portion and the second base portion in a direction to separate each other, and a shaft length is arranged via a rotating shaft disposed along the second direction. The squeegee is executed by using the squeegee unit configured to be attached to the second base portion, and is accommodated in an accommodation container having an opening when the adsorption process is executed. The spherical body is sucked and held at the tip portion of the suction holding portion, and the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relatively brought close to each other. A supply process for supplying the spherical body to the suction head sucked from the suction port is executed, and the suction portion capable of sucking the spherical body and the suction surface of the suction head are relatively A suction process is performed for sucking and removing excess spherical bodies except the spherical bodies adsorbed to the edge of the intake port in proximity to each other.

  According to a 17th aspect of the present invention, there is provided a substrate manufacturing method comprising: performing an application process of applying a flux to a substrate; and performing an adsorption process of adsorbing a spherical body on an edge of an air inlet formed on an adsorption surface of the adsorption head. A substrate manufacturing method for manufacturing a spherical body-mounted substrate by mounting the spherical body that is suctioned by the suction head on the substrate after execution of the coating process, and supplying the supplied flux A squeegee unit having a squeegee that spreads on the application surface of the substrate, and at least one of the substrates pressed against the application surface by a mask provided with an opening that exposes the application region of the flux on the application surface, The substrate and the squeegee unit are moved in the first direction approaching each other, and the tip of the squeegee that is linear in plan view is pushed onto the surface of the mask. In this state, the coating process of spreading at least one of the substrate and the squeegee unit in the second direction along the coating surface to spread the flux on the coating area is performed by the first base portion and the second base. A coupling mechanism that couples the first base portion and the second base portion to each other while allowing relative movement along the first direction of the second base portion with respect to the first base portion, An urging member that urges the first base portion and the second base portion in a direction to separate each other, and a shaft length is arranged via a rotating shaft disposed along the second direction. The squeegee is executed by using the squeegee unit configured to be attached to the second base portion, and is accommodated in an accommodation container having an opening when the adsorption process is executed. The spherical body is sucked and held at the tip portion of the suction holding portion, and the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relatively brought close to each other. A supply process for supplying the spherical body to the suction head sucked from the suction port is executed, and the suction portion capable of sucking the spherical body and the suction surface of the suction head are relatively A suction process is performed to suck and remove excess spherical bodies excluding the spherical bodies that are adsorbed to the edge of the air inlet, and after the suction process, the spherical bodies in the suction head A first detection process is performed to detect excess or deficiency of the particles, and when the excess of the spherical bodies is detected in the first detection process, the spherical bodies adsorbed by the adsorption head are removed from the adsorption head. After performing the removal process, the adsorption process and the supply process are re-executed, and when the shortage of the spherical body is detected in the first detection process, the adsorption process and the supply process are re-executed.

  Further, in the substrate manufacturing method according to claim 18, the suction head is caused to perform suction processing for sucking a spherical body to the edge of the suction port formed on the suction surface of the suction head, and is sucked by the suction head. A substrate manufacturing method for manufacturing a spherical body-mounted substrate by mounting the spherical body on a substrate, wherein the spherical body accommodated in an accommodation container having an opening is sucked and held when the suction process is performed. The suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are sucked from the intake port relatively close to each other. A supply process for supplying the spherical body to the suction head in a state, a first detection process for detecting excess or deficiency of the spherical body in the suction head after the execution of the suction process, 1 inspection Re-execution of the adsorption process and the supply process after performing a first removal process for removing the spherical bodies adsorbed by the adsorption head from the adsorption head when an excess of the spherical bodies is detected in the process, When the shortage of the spherical body is detected in the first detection process, the adsorption process and the supply process are re-executed.

  Further, the substrate manufacturing method according to claim 19 executes an application process for applying a flux to the substrate, and performs an adsorption process for adsorbing a spherical body on an edge of an intake port formed on an adsorption surface of the adsorption head. A substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting the spherical body that is suctioned by the suction head on the substrate after the execution of the coating process, and supplying the supplied flux A squeegee unit having a squeegee that spreads on the application surface of the substrate, and at least one of the substrates pressed against the application surface by a mask provided with an opening that exposes the application region of the flux on the application surface, The substrate and the squeegee unit are moved in the first direction in which they approach each other, and the straight tip of the squeegee in plan view is pushed onto the surface of the mask. In this state, the coating process of spreading at least one of the substrate and the squeegee unit in the second direction along the coating surface to spread the flux on the coating area is performed by the first base portion and the second base. A coupling mechanism that couples the first base portion and the second base portion to each other while allowing relative movement along the first direction of the second base portion with respect to the first base portion, An urging member that urges the first base portion and the second base portion in a direction to separate each other, and a shaft length is arranged via a rotating shaft disposed along the second direction. The squeegee is executed by using the squeegee unit configured to be attached to the second base portion, and is accommodated in an accommodation container having an opening when the adsorption process is executed. The spherical body is adsorbed and held at the tip of the suction holding unit, and the suction holding unit holding the spherical body at the tip is relatively close to the suction surface of the suction head. First detection for executing supply processing for supplying the spherical body to the suction head that is sucked from the suction port, and detecting excess or deficiency of the spherical body in the suction head after execution of the suction processing The suction process is performed after executing a first removal process for removing the spherical body sucked by the suction head when an excess of the spherical body is detected in the first detection process. The supply process is re-executed, and when the shortage of the spherical body is detected in the first detection process, the adsorption process and the supply process are re-executed.

  Further, the substrate manufacturing method according to claim 20 executes an application process for applying a flux to the substrate, and performs an adsorption process for adsorbing a spherical body on an edge of an intake port formed on an adsorption surface of the adsorption head. A substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting the spherical body that is suctioned by the suction head on the substrate after the execution of the coating process, and supplying the supplied flux A squeegee unit having a squeegee that spreads on the application surface of the substrate, and at least one of the substrates pressed against the application surface by a mask provided with an opening that exposes the application region of the flux on the application surface, The substrate and the squeegee unit are moved in the first direction approaching each other, and the tip of the squeegee that is linear in plan view is pushed onto the surface of the mask. In this state, the coating process of spreading at least one of the substrate and the squeegee unit in the second direction along the coating surface to spread the flux on the coating area is performed by the first base portion and the second base. A coupling mechanism that couples the first base portion and the second base portion to each other while allowing relative movement along the first direction of the second base portion with respect to the first base portion, An urging member that urges the first base portion and the second base portion in a direction to separate each other, and a shaft length is arranged via a rotating shaft disposed along the second direction. The squeegee is executed by using the squeegee unit configured to be attached to the second base portion, and is accommodated in an accommodation container having an opening when the adsorption process is executed. The spherical body is adsorbed and held at the tip of the suction holding unit, and the suction holding unit holding the spherical body at the tip is relatively close to the suction surface of the suction head. Supply processing for supplying the spherical body to the suction head in a state of being sucked from the intake port is executed.

  The substrate manufacturing method according to claim 21 is the substrate manufacturing method according to any one of claims 13 to 20, wherein in the supply process, the suction holding portion holding the spherical body at the tip portion; At least one of the suction head and the suction holding portion is moved so that the suction holding portion moves relatively along the suction surface in a state in which the suction surface of the suction head is relatively close to each other.

  A substrate manufacturing method according to a twenty-second aspect is the substrate manufacturing method according to any one of the thirteenth to twenty-first aspects, wherein the moving process of moving either the suction head or the substrate toward the other is performed. When the spherical body held by the suction head is executed and mounted on the substrate, the moving process is performed for each of the plurality of suction heads having different inlet diameters corresponding to the diameter of the spherical body. As a result, a plurality of types of spherical bodies having different diameters corresponding to the diameters of the respective intake ports are mounted on one substrate.

  A substrate manufacturing method according to a twenty-third aspect is the substrate manufacturing method according to any one of the thirteenth to twenty-second embodiments, wherein the spherical shape is produced when a replenishing process for replenishing the spherical body to the containing container is executed. A replenishing container having a discharge port for discharging the spherical body stored therein and the refilling container is placed, and the replenishing container with the discharge port facing downward is placed and the discharge container is placed in the placed state. A placement portion formed with a housing portion communicating with the outlet and capable of housing the spherical body, and a rotation mechanism for rotating the placement portion so that the inclination angle of the placement portion can be changed, The storage unit stores the spherical body discharged from the discharge port of the supply container, and a supply port that is formed at an edge of the mounting unit and drops the spherical body from the mounting unit. And a moving flow path connecting the storage portions. The rotation mechanism maintains the placement unit in a first posture in which the storage unit is positioned below the supply port in a standby state, and the supply port is configured to store the storage unit during the supply process. A spherical body replenishing device that rotates the placement portion so as to be in the second posture located below the lower side is used.

  A substrate manufacturing method according to claim 24 is the substrate manufacturing method according to any one of claims 13 to 23, wherein the substrate is cut into a plurality of substrates by dividing the substrate into a plurality of substrates. Processing and electrical inspection are performed on each of the divided substrates, and the spherical body is mounted only on the substrate that is determined to be non-defective in the electrical inspection.

  In this case, in each of the substrate manufacturing methods described above, when the adsorption process is performed, the substrate is rotated around the base end portion with the spherical body held by the distal end portion while being disposed on the opening portion side of the container. The spherical body is held at the tip portion of the movable suction holding portion, and the suction holding is performed so that the tip portion holding the spherical body faces the suction surface when the supply process is executed. A method of rotating the part can be employed.

  Further, in each of the substrate manufacturing methods described above, it is possible to employ a method of executing the supply process using the storage container and the suction holding unit that are integrally configured when the suction process is performed.

  Further, in each of the substrate manufacturing methods described above, a method of performing the supply process and the suction process using the container, the suction holding unit, and the suction unit that are integrally configured when the suction process is performed is employed. can do.

  Further, in each of the substrate manufacturing methods described above, when the suction process is performed, the suction port is configured so as to be detachable from the suction head, and is attached to the suction port so that one surface thereof is in contact with the suction surface. It is possible to employ a method in which an alignment plate having a through-hole through which the spherical particles can pass is attached to the suction head, and the supply process and the suction process are executed in that state.

  Further, in each of the substrate manufacturing methods described above, after the spherical body is mounted on the substrate, a second detection process is performed to detect the presence or absence of deposits on the suction head, and the flux is used in the second detection process. A method of executing a second removal process for removing the deposit from the suction head when it is detected as a deposit can be employed.

  Further, in each of the above substrate manufacturing methods, after the spherical body is mounted on the substrate, a second detection process for detecting the presence or absence of deposits on the suction head is performed, and the flux is used in the second detection process. A method of executing the first removal process when the spherical body is detected as the attached substance without being detected as an attached substance can be employed.

  In each of the above substrate manufacturing methods, a method using the suction head formed with a recess or a notch for avoiding contact with the spherical body already mounted on the substrate can be employed.

  Further, in each of the substrate manufacturing methods described above, the process of moving the suction head as the moving process toward the substrate is performed individually for each suction head using the same number of moving mechanisms as the number of the suction heads. The method to do can be adopted.

  Further, in each of the substrate manufacturing methods described above, it is possible to employ a method in which the moving process for the suction head having the small diameter is performed prior to the moving process for the suction head having the large diameter.

  Further, in each of the substrate manufacturing methods described above, the storage unit is formed in a U shape in a plan view or a side view, and has a storage unit in which the moving channel is formed in a linear shape in a plan view or a side view. A method using the spherical body replenishing device provided with a placement unit can be employed.

  In each of the above substrate manufacturing methods, a method of supplying an antioxidant gas into the supply container of the spherical body supply device can be employed.

  In each of the above substrate manufacturing methods, a method of executing the replenishment process when a predetermined condition is satisfied can be employed.

  In each of the above substrate manufacturing methods, the squeegee including a squeegee main body and a third base portion that is attached to the second base portion via the rotation shaft and configured to be removable from the squeegee main body. It is possible to employ a method for performing the coating process by using.

  In each of the above substrate manufacturing methods, a method of performing the electrical inspection after performing the cutting process can be employed.

  A spherical body mounted substrate according to claim 25 is manufactured by the substrate manufacturing apparatus according to any one of claims 1 to 12.

  A spherical body mounted substrate according to a twenty-sixth aspect is manufactured by the substrate manufacturing method according to any one of the thirteenth to twenty-fourth aspects.

  An electronic component-mounted board according to claim 27 is mounted on the spherical-body-mounted board, with the electronic component connected via the spherical body fixed to the spherical-body-mounted board according to claim 25 or 26. Has been.

  In the substrate manufacturing apparatus according to claim 1, and the substrate manufacturing method according to claim 13, the suction holding unit holding the spherical body by adsorbing and holding the spherical body at the tip of the suction holding unit, and Supply processing for supplying a spherical body to the suction head in a state of being sucked from the suction port with the suction surface of the suction head relatively close to each other is executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented.

  Further, in the substrate manufacturing apparatus according to claim 2 and the substrate manufacturing method according to claim 14, the spherical body is sucked and held at the tip portion of the suction holding portion, and the suction body holding the spherical body at the tip portion. Supply processing for supplying the spherical body to the suction head in a state where the suction head is sucked from the suction port with the suction portion and the suction surface of the suction head relatively close to each other. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, a surplus portion excluding the spherical body that is adsorbed to the edge of the intake port by bringing the suction portion capable of sucking the spherical body and the suction surface of the suction head relatively close to each other. A suction process for sucking and removing the spherical body is executed. For this reason, according to the substrate manufacturing apparatus and the substrate manufacturing method, even if the spherical body to be mounted and the excessive spherical body are strongly attracted to each other due to static electricity or intermolecular force, the excessive spherical body is attracted by suction by the suction portion. All of the above can be forcibly pulled away from the spherical body to be mounted and reliably removed from the suction head. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be more reliably held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body with respect to the substrate is Excessive loading can be prevented more reliably.

  Further, in the substrate manufacturing apparatus according to claim 3 and the substrate manufacturing method according to claim 15, the suction and holding in which the spherical body is sucked and held at the tip portion of the suction holding portion and the spherical body is held at the tip portion. Supply processing for supplying the spherical body to the suction head in a state where the suction head is sucked from the suction port with the suction portion and the suction surface of the suction head relatively close to each other. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, a surplus portion excluding the spherical body that is adsorbed to the edge of the intake port by bringing the suction portion capable of sucking the spherical body and the suction surface of the suction head relatively close to each other. A suction process for sucking and removing the spherical body is executed. For this reason, according to the substrate manufacturing apparatus and the substrate manufacturing method, even if the spherical body to be mounted and the excessive spherical body are strongly attracted to each other due to static electricity or intermolecular force, the excessive spherical body is attracted by suction by the suction portion. All of the above can be forcibly separated from the spherical body to be mounted and reliably removed from the suction head. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be more reliably held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body with respect to the substrate is Excessive loading can be prevented more reliably. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, after the suction process is performed, the first detection process for detecting the excess or deficiency of the spherical body in the suction head is executed, and the first detection process is performed based on the result of the first detection process. The removal process is executed, the adsorption process is executed again, and the supply process is executed again. For this reason, even if the spheres are excessively adsorbed in the adsorption process, the adsorption process and the supply process are performed again after the adsorbed spheres are removed, and there is a shortage of the spheres adsorbed in the adsorption process. Even so, the adsorption process and the supply process are re-executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body can be mounted on the substrate by the suction head that sucks the spherical body without excess or deficiency. can do.

  Further, in the substrate manufacturing apparatus according to claim 4 and the substrate manufacturing method according to claim 16, the first base portion and the second base portion, and relative to the first base portion along the first direction of the second base portion. And a biasing member that biases the first base portion and the second base portion in a direction to separate them from each other. At the same time, a coating process is performed in which the flux is spread using a squeegee unit in which a squeegee is attached to the second base portion via a rotating shaft disposed so that the axial length is along the second direction. . Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, when the squeegee is mounted in an inclined state, when the mask or the substrate that presses the squeegee during the application of the flux is inclined, or when the tip of the squeegee is polished. In any case where the squeegee is in an oblique state, when the tip of the squeegee body is brought into contact with the surface of the mask by moving at least one of the squeegee unit and the substrate, the squeegee rotates the rotation axis. As a result of rotating with respect to the second base portion as the center, the entire width direction of the tip portion of the squeegee can be brought into contact with the mask. Further, as a result of further moving at least one of the squeegee unit and the substrate, the urging member presses the second base portion (squeegee) in the separating direction against the first base portion, and as a result, is attached to the second base portion. The tip of the squeegee can be pressed against the surface of the mask with a sufficient pressing force. Thereby, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, the complicated operation | work which finely adjusts the fixed position of the squeegee unit with respect to a moving mechanism etc. so that inclination of a squeegee does not arise becomes a result. The squeegee unit can be easily attached, and in the various states described above, the flux can be spread in a state where the entire width in the tip is pressed against the mask surface with a uniform pressing force. Therefore, the flux can be uniformly applied to the application region of the substrate without causing uneven application. In the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body is adsorbed and held at the tip portion of the suction holding portion, and the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relative to each other. The supply process for supplying the spherical body to the suction head in the state of being close to each other and sucking from the intake port is executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, a surplus portion excluding the spherical body that is adsorbed to the edge of the intake port by bringing the suction portion capable of sucking the spherical body and the suction surface of the suction head relatively close to each other. A suction process for sucking and removing the spherical body is executed. For this reason, according to the substrate manufacturing apparatus and the substrate manufacturing method, even if the spherical body to be mounted and the excessive spherical body are strongly attracted to each other due to static electricity or intermolecular force, the excessive spherical body is attracted by suction by the suction portion. All of the above can be forcibly separated from the spherical body to be mounted and reliably removed from the suction head. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be more reliably held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body with respect to the substrate is Excessive loading can be prevented more reliably.

  In the substrate manufacturing apparatus according to claim 5 and the substrate manufacturing method according to claim 17, the first base portion and the second base portion, and relative to the first base portion in the first direction of the second base portion. And a biasing member that biases the first base portion and the second base portion in a direction separating them from each other. At the same time, a coating process is performed in which the flux is spread using a squeegee unit in which a squeegee is attached to the second base portion via a rotating shaft disposed so that the axial length is along the second direction. . Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, when the squeegee is mounted in an inclined state, when the mask or the substrate that presses the squeegee during the application of the flux is inclined, or when the tip of the squeegee is polished. In any case where the squeegee is in an oblique state, when the tip of the squeegee body is brought into contact with the surface of the mask by moving at least one of the squeegee unit and the substrate, the squeegee rotates the rotation axis. As a result of rotating with respect to the second base portion as the center, the entire width direction of the tip portion of the squeegee can be brought into contact with the mask. Further, as a result of further moving at least one of the squeegee unit and the substrate, the urging member presses the second base portion (squeegee) in the separating direction against the first base portion, and as a result, is attached to the second base portion. The tip of the squeegee can be pressed against the surface of the mask with a sufficient pressing force. Thereby, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, the complicated operation | work which finely adjusts the fixed position of the squeegee unit with respect to a moving mechanism etc. so that inclination of a squeegee does not arise becomes a result. The squeegee unit can be easily attached, and in the various states described above, the flux can be spread in a state where the entire width in the tip is pressed against the mask surface with a uniform pressing force. Therefore, the flux can be uniformly applied to the application region of the substrate without causing uneven application. In the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body is adsorbed and held at the tip portion of the suction holding portion, and the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relative to each other. The supply process for supplying the spherical body to the suction head in the state of being close to each other and sucking from the intake port is executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, a surplus portion excluding the spherical body that is adsorbed to the edge of the intake port by bringing the suction portion capable of sucking the spherical body and the suction surface of the suction head relatively close to each other. A suction process for sucking and removing the spherical body is executed. For this reason, according to the substrate manufacturing apparatus and the substrate manufacturing method, even if the spherical body to be mounted and the excessive spherical body are strongly attracted to each other due to static electricity or intermolecular force, the excessive spherical body is attracted by suction by the suction portion. All of the above can be forcibly separated from the spherical body to be mounted and reliably removed from the suction head. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be more reliably held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body with respect to the substrate is Excessive loading can be prevented more reliably. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, after the suction process is performed, the first detection process for detecting the excess or deficiency of the spherical body in the suction head is executed, and the first detection process is performed based on the result of the first detection process. The removal process is executed, the adsorption process is executed again, and the supply process is executed again. For this reason, even if the spheres are excessively adsorbed in the adsorption process, the adsorption process and the supply process are performed again after the adsorbed spheres are removed, and there is a shortage of the spheres adsorbed in the adsorption process. Even so, the adsorption process and the supply process are re-executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body can be mounted on the substrate by the suction head that sucks the spherical body without excess or deficiency. can do.

  Further, in the substrate manufacturing apparatus according to claim 6 and the substrate manufacturing method according to claim 18, the spherical body is sucked and held at the tip portion of the suction holding portion, and the suction body holding the spherical body at the tip portion. Supply processing for supplying the spherical body to the suction head in a state where the suction head is sucked from the suction port with the suction portion and the suction surface of the suction head relatively close to each other. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, after the suction process is performed, the first detection process for detecting the excess or deficiency of the spherical body in the suction head is executed, and the first detection process is performed based on the result of the first detection process. The removal process is executed, the adsorption process is executed again, and the supply process is executed again. For this reason, even if the spheres are excessively adsorbed in the adsorption process, the adsorption process and the supply process are performed again after the adsorbed spheres are removed, and there is a shortage of the spheres adsorbed in the adsorption process. Even so, the adsorption process and the supply process are re-executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body can be mounted on the substrate by the suction head that sucks the spherical body without excess or deficiency. can do.

  In the substrate manufacturing apparatus according to claim 7 and the substrate manufacturing method according to claim 19, the first base portion, the second base portion, and the relative relationship along the first direction of the second base portion with respect to the first base portion. And a biasing member that biases the first base portion and the second base portion in a direction to separate them from each other. At the same time, a coating process is performed to spread the flux using a squeegee unit in which a squeegee is attached to the second base portion via a rotating shaft arranged so that its axial length is along the second direction. . Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, when the squeegee is mounted in an inclined state, when the mask or the substrate that presses the squeegee during the application of the flux is inclined, or when the tip of the squeegee is polished. In any case where the squeegee is in an oblique state, when the tip of the squeegee body is brought into contact with the surface of the mask by moving at least one of the squeegee unit and the substrate, the squeegee rotates the rotation axis. As a result of rotating with respect to the second base portion as the center, the entire width direction of the tip portion of the squeegee can be brought into contact with the mask. Further, as a result of further moving at least one of the squeegee unit and the substrate, the urging member presses the second base portion (squeegee) in the separating direction against the first base portion, and as a result, is attached to the second base portion. The tip of the squeegee can be pressed against the surface of the mask with a sufficient pressing force. Thereby, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, the complicated operation | work which finely adjusts the fixed position of the squeegee unit with respect to a moving mechanism etc. so that inclination of a squeegee does not arise becomes a result. The squeegee unit can be easily attached, and in the various states described above, the flux can be spread in a state where the entire width in the tip is pressed against the mask surface with a uniform pressing force. Therefore, the flux can be uniformly applied to the application region of the substrate without causing uneven application. In the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body is adsorbed and held at the tip portion of the suction holding portion, and the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relative to each other. The supply process for supplying the spherical body to the suction head in the state of being close to each other and sucking from the intake port is executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented. Further, in the substrate manufacturing apparatus and the substrate manufacturing method, after the suction process is performed, the first detection process for detecting the excess or deficiency of the spherical body in the suction head is executed, and the first detection process is performed based on the result of the first detection process. The removal process is executed, the adsorption process is executed again, and the supply process is executed again. For this reason, even if the spheres are excessively adsorbed in the adsorption process, the adsorption process and the supply process are performed again after the adsorbed spheres are removed, and there is a shortage of the spheres adsorbed in the adsorption process. Even so, the adsorption process and the supply process are re-executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body can be mounted on the substrate by the suction head that sucks the spherical body without excess or deficiency. can do.

  Moreover, in the board | substrate manufacturing apparatus of Claim 8, and the board | substrate manufacturing method of Claim 20, relative to the 1st base part and the 2nd base part, and the 1st direction of the 2nd base part with respect to the 1st base part And a biasing member that biases the first base portion and the second base portion in a direction separating them from each other. At the same time, a coating process is performed in which the flux is spread using a squeegee unit in which a squeegee is attached to the second base portion via a rotating shaft disposed so that the axial length is along the second direction. . Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, when the squeegee is mounted in an inclined state, when the mask or the substrate that presses the squeegee during the application of the flux is inclined, or when the tip of the squeegee is polished. In any case where the squeegee is in an oblique state, when the tip of the squeegee body is brought into contact with the surface of the mask by moving at least one of the squeegee unit and the substrate, the squeegee rotates the rotation axis. As a result of rotating with respect to the second base portion as the center, the entire width direction of the tip portion of the squeegee can be brought into contact with the mask. Further, as a result of further moving at least one of the squeegee unit and the substrate, the urging member presses the second base portion (squeegee) in the separating direction against the first base portion, and as a result, is attached to the second base portion. The tip of the squeegee can be pressed against the surface of the mask with a sufficient pressing force. Thereby, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, the complicated operation | work which finely adjusts the fixed position of the squeegee unit with respect to a moving mechanism etc. so that inclination of a squeegee does not arise becomes a result. The squeegee unit can be easily attached, and in the various states described above, the flux can be spread in a state where the entire width in the tip is pressed against the mask surface with a uniform pressing force. Therefore, the flux can be uniformly applied to the application region of the substrate without causing uneven application. In the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body is adsorbed and held at the tip portion of the suction holding portion, and the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relative to each other. The supply process for supplying the spherical body to the suction head in the state of being close to each other and sucking from the intake port is executed. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, an appropriate amount of the spherical body can be supplied to the suction head by holding the appropriate amount of the spherical body at the tip portion. As a result, it is possible to suppress the adhesion of excessive spherical bodies. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, only the spherical body to be mounted can be held by the suction head, so that the excessive spherical body is mounted on the substrate, that is, the spherical body is excessively mounted on the substrate. Can be reliably prevented.

  In the substrate manufacturing apparatus according to claim 9 and the substrate manufacturing method according to claim 21, in the supply process, the suction holding portion holding the spherical body at the tip portion and the suction surface of the suction head are relatively moved. At least one of the suction head and the suction holding unit is moved so that the suction holding unit relatively moves along the suction surface in a state of being close to each other. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, the spherical body held at the tip of the suction holding unit can be gradually supplied while being dispersed with the movement of the suction holding unit. As a result, it is possible to more reliably prevent the excessive supply of the sphere, and as a result, it is possible to suppress the adhesion of the excessive spherical body. Therefore, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, the mounting of the excessive spherical body to the board | substrate, ie, the excessive mounting of the spherical body with respect to a board | substrate, can be prevented more reliably.

  Further, in the substrate manufacturing apparatus according to claim 10 and the substrate manufacturing method according to claim 22, each of the plurality of suction heads, each of which has a suction port diameter corresponding to the diameter of the spherical body, executes a moving process. A plurality of types of spherical bodies having different diameters corresponding to the diameter of the intake port are mounted on one substrate. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, for example, for a substrate having a complicated configuration in which the distance between adjacent terminals differs depending on the region, or the thickness of the lead wire to be connected varies depending on the region. Thus, a plurality of types of spherical bodies having different diameters (sizes) can be reliably mounted.

  Further, in the substrate manufacturing apparatus according to claim 11 and the substrate manufacturing method according to claim 23, an accommodation portion configured by a storage portion that stores a spherical body and a moving flow path that connects the storage portion and the supply port is mounted. A rotation mechanism is formed in the mounting portion to maintain the mounting portion in a first posture in which the storage portion is located below the supply port in the standby state, and the supply port is positioned below the storage portion in the supply process. The replenishment process which replenishes a spherical body with respect to a storage container is performed using the spherical body replenishment apparatus which rotates a mounting part so that it may become a 2nd attitude | position located. For this reason, according to the substrate manufacturing apparatus and the substrate manufacturing method, it is possible to store a predetermined amount of spherical bodies in the storage unit of the storage unit in the standby state without using a precisely manufactured supply container. In addition, in the replenishment process, the proper amount of spherical body is reliably replenished to the storage container while having a simple configuration in which the placement portion is rotated to change the posture of the placement portion from the first posture to the second posture. can do. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, it is possible to use a replenishing container and a rotating mechanism with a simple configuration, and thus the manufacturing cost of the spherical body replenishing device, the spherical body mounting device, and the substrate manufacturing device is sufficiently increased. Can be reduced.

  Furthermore, in the substrate manufacturing apparatus according to claim 12 and the substrate manufacturing method according to claim 24, a cutting process for cutting a multi-sided substrate having a plurality of substrates and dividing the substrate into each substrate, and an electrical inspection for each substrate Are executed in a predetermined order, and the spherical body is mounted only on the substrate determined to be non-defective in the electrical inspection. For this reason, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, mounting of the spherical body with respect to an electrically defective board | substrate can be avoided reliably, and this can suppress the wasteful consumption of a spherical body reliably. As a result, the manufacturing cost can be sufficiently reduced.

  Further, according to the substrate manufacturing apparatus and the substrate manufacturing method, the tip of the suction holding unit disposed on the opening side of the container is opposed to the bottom of the container, and the spherical body is sucked by the tip. A simple configuration that simply rotates the suction holding unit by adopting a configuration and method for holding and rotating the suction holding unit so that the tip part faces the suction surface of the suction head during the supply process. However, an appropriate amount of spherical bodies can be reliably supplied to the suction head.

  Moreover, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, by adopting the structure and method which perform supply processing using the container and the adsorption | suction holding part comprised integrally, the container comprised separately As a result of being able to move these at once with one moving mechanism as compared to the configuration and method of individually moving them using a plurality of moving mechanisms using the adsorption holding unit, The spherical body mounting apparatus and the substrate manufacturing apparatus can be simply configured and the processing efficiency can be improved.

  In addition, according to the substrate manufacturing apparatus and the substrate manufacturing method, by adopting a configuration and a method for executing supply processing and suction processing using an integrally configured storage container, suction holding unit, and suction unit, separate units are provided. Compared to the configuration and method in which the storage container, the suction holding unit, and the suction unit configured in the above are used to individually move them using a plurality of moving mechanisms, these can be moved at once by one moving mechanism. As a result, the spherical body adsorption device, the spherical body mounting device, and the substrate manufacturing apparatus can be easily configured and the processing efficiency can be improved.

  Further, according to the substrate manufacturing apparatus and the substrate manufacturing method, the supply process and the suction process are performed in a state where the alignment plate having a through-hole that communicates with the air inlet and through which the spherical body can pass is mounted on the suction head. By adopting the configuration and method to be performed, one spherical body can be reliably supplied to each intake port of the suction head during the supply process.

  Moreover, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, after mounting a spherical body on a board | substrate, a 2nd detection process is performed, The structure and method of performing a 2nd removal process based on the result of a 2nd detection process By adopting the flux, even if the flux applied to the substrate adheres to the suction head when the spherical body is mounted on the substrate, or the spherical body adheres to the suction head as the flux is attached, the flux And the spherical body (adherent matter) can be reliably removed from the suction head, so that it is possible to reliably prevent the occurrence of the next processing by the adhering matter attached to the suction head. .

  Moreover, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, the structure and method of performing a 2nd detection process after mounting a spherical body on a board | substrate, and performing a 1st removal process based on the result of a 2nd detection process. By adopting, for example, when the spherical body is mounted on the substrate, when the spherical body is not attached but only the spherical body is attached to the suction head, the first removal is faster than the second removal process for removing the flux. Since the spherical body (attachment) can be removed by the treatment, the treatment time can be shortened.

  Further, according to the substrate manufacturing apparatus and the substrate manufacturing method, by adopting a configuration and method using a suction head formed with a recess or notch for avoiding contact with a spherical body already mounted on the substrate. For example, when the mounting unit performs the moving process for the suction head having a large inlet diameter before the moving process for the suction head having a small inlet diameter, the spherical body already mounted on the substrate and the suction head As a result, it is possible to reliably prevent the mounted spherical body from falling off due to the contact.

  Further, according to the substrate manufacturing apparatus and the substrate manufacturing method, the process of moving the suction heads as the movement process toward the substrate is performed individually for each suction head using the same number of moving mechanisms as the number of suction heads. By adopting the configuration and method, the time required for replacement can be shortened compared to the configuration and method in which a plurality of suction heads are replaced and moved by a single moving mechanism, so that the processing efficiency is sufficiently improved. Can do.

  Further, according to the substrate manufacturing apparatus and the substrate manufacturing method, by adopting a configuration and a method for performing the moving process for the suction head having a small inlet diameter before the moving process for the suction head having a large inlet diameter, For example, when the spherical body mounted by the previous movement process is sufficiently larger than the spherical body mounted by the subsequent movement process, the mounted spherical body and the subsequent movement process are provided without providing a recess or notch. Contact with the moved suction head can be reliably avoided. For this reason, according to the substrate manufacturing apparatus and the substrate manufacturing method, it is possible to reliably prevent the mounted spherical body from falling off due to contact with the suction head by using the suction head having a simple configuration not provided with a recess or notch. can do.

  Moreover, according to this board | substrate manufacturing apparatus and board | substrate manufacturing method, the storage part was formed in planar view U-shape or side view U-shape, and the movement flow path was formed in planar view linear form or side view linear form. In addition, by adopting the method using the spherical body replenishing device having this configuration, when the mounting portion is in the first posture, the U-shaped convex portion of the storage portion is located on the lower side, so that the replenishment container can be discharged. By allowing the outlet to communicate with the end of the storage portion, an appropriate amount of the spherical body can be reliably stored in a region extending from the end to the U-shaped convex portion. In addition, when the mounting portion is in the second posture, the stored spherical body can be reliably moved toward the replenishing port by sliding down to the moving flow path. Furthermore, when the mounting portion is in the second posture, the end portion of the storage portion communicating with the discharge port of the supply container is positioned below the U-shaped convex portion, so that the discharge portion is discharged from the supply container. As a result, the spherical body other than the spherical body stored in the storage part of the storage part is transmitted through the surface of the mounting part and falls from other than the supply port. Can be prevented.

  Further, according to the substrate manufacturing apparatus and the substrate manufacturing method, the configuration including the antioxidant gas supply unit that supplies the antioxidant gas into the supply container of the spherical body supply device and the spherical body supply device of this configuration are used. By adopting the method, it is possible to reliably prevent the spherical bodies contained in the replenishing container from being oxidized, so that it is possible to reliably prevent the spherical bodies from sticking together and becoming difficult to replenish. Can be prevented.

  Further, according to the substrate manufacturing apparatus and the substrate manufacturing method, by adopting a configuration and a method for executing the replenishment process when a predetermined condition is satisfied, for example, when the predetermined condition is satisfied, a spherical shape is obtained. By executing the replenishment process when the process of mounting the body on the substrate is performed a prescribed number of times, it is possible to reliably prevent a situation where the number of spherical bodies to be mounted on the substrate is insufficient.

  In addition, according to the substrate manufacturing apparatus and the substrate manufacturing method, the squeegee including the squeegee body and the third base portion that is attached to the second base portion via the rotation shaft and configured to be removable from the squeegee body. By adopting the configuration and the method for performing the coating process by using the squeegee main body, it is possible to work by removing only the squeegee main body from the third base portion without removing the entire squeegee unit at the time of polishing the main body. In addition, when the squeegee body becomes shorter due to multiple polishing, the first base part, the second base part, the third base part, etc. can be used continuously by replacing only the squeegee body with new parts. Therefore, the running cost of the flux coating device can be sufficiently reduced.

  In addition, according to the substrate manufacturing apparatus and the substrate manufacturing method, by adopting a configuration and a method for performing an electrical inspection after performing a cutting process, for example, due to vibration during the cutting process, the substrate Even if the conductor pattern, the terminal, the through hole, or the like is disconnected or short-circuited, the substrate can be reliably determined as a defective product. Therefore, according to the substrate manufacturing apparatus and the substrate manufacturing method, it is possible to suppress the wasteful consumption of the spherical body due to the mounting of the spherical body on the defective substrate that occurs during the manufacture of the multi-sided substrate, in addition to the cutting The wasteful consumption of the spherical body due to the mounting of the spherical body on the defective substrate caused by the processing can be surely suppressed, so that the manufacturing cost can be further reduced.

  The spherical body mounted substrate according to claims 25 and 26 is manufactured by the above-described substrate manufacturing apparatus or substrate manufacturing method. For this reason, in the spherical body mounted substrate, excessive mounting of the spherical body to the substrate is surely prevented. Accordingly, the situation of being connected to each other is avoided. Therefore, according to this spherical body mounted substrate, it is possible to reliably prevent the occurrence of a defect in which the terminals of the electronic component are short-circuited via the connected spherical body (solder) when the electronic component is mounted. .

  In the electronic component mounted substrate according to claim 27, the electronic component connected through the spherical body fixed to the spherical body mounted substrate is mounted on the spherical body mounted substrate. For this reason, in this electronic component mounted substrate, a situation where excessively mounted spherical bodies are connected to each other with melting is avoided, so that when the electronic components are mounted, the connected spherical bodies (solder ), The occurrence of a defect in which the terminals of the electronic component are short-circuited is reliably prevented. Therefore, according to this electronic component mounted substrate, it is possible to reliably prevent the occurrence of defects in products using this electronic component mounted substrate.

It is a block diagram which shows the structure of the board | substrate manufacturing apparatus 1 with a solder mounted. 2 is a configuration diagram showing a configuration of a cutting device 2. FIG. 2 is a configuration diagram showing a configuration of an inspection apparatus 3. FIG. 5 is a plan view showing a configuration of a substrate 400. FIG. 2 is a plan view of a multi-sided substrate 500. FIG. It is a top view which shows the state which cut | disconnected the multi-sided board | substrate 500 and divided | segmented into the board | substrate 400. FIG. It is a block diagram which shows the structure of the flux application | coating apparatus 4. FIG. It is a front view of the squeegee unit 421 (421a, 421b). It is sectional drawing of the squeegee unit 421 (421a, 421b) of the state attached to the attaching part 441. FIG. It is explanatory drawing explaining the structure of the squeegee unit 421 (421a, 421b). It is a top view of the board | substrate 400, the metal mask 41, and the application | coating unit 42 (squeegee unit 421a, 421b). 4 is a cross-sectional view of a state in which squeegee units 421a and 421b are in contact with a metal mask 41. FIG. It is sectional drawing of the state which has moved the squeegee units 421a and 421b and applied the flux F. It is sectional drawing of the state in which application | coating of the flux F with respect to the application | coating area | region Pa of the board | substrate 400 was completed. It is a front view of the squeegee main body 427 in a state in which chipping or wear has occurred in the tip portion 427x. It is a front view of the squeegee main body 427 in a state where the polishing of the tip end portion 427x is completed. It is a front view of the squeegee unit 421 (421a, 421b) in a state where the squeegee main body 427 in which the front end portion 427x has been polished is attached. 2 is a configuration diagram showing a configuration of a solder ball mounting device 5. FIG. It is a block diagram which shows the structure of the solder ball adsorption | suction apparatus 51a. It is a block diagram which shows the structure of the solder ball adsorption | suction apparatus 51b. It is sectional drawing which shows the structure of the suction head 511a. It is sectional drawing which shows the structure of the bottom wall 512b of the adsorption | suction head 511a, and the plate 519a for alignment. It is sectional drawing which shows the structure of the suction head 511b. It is sectional drawing which shows the structure of the bottom wall 512b of the adsorption head 511b, and the plate 519b for alignment. FIG. 6 is a perspective view of a main body unit 50 including a storage container 514, an adsorption holding unit 515, and a suction unit 516. 2 is a cross-sectional view showing a configuration of a solder ball adsorption device 51. FIG. FIG. 6 is an exploded perspective view of a main body unit 50 including a storage container 514, an adsorption holding unit 515, and a suction unit 516. It is explanatory drawing explaining arrangement | positioning of the flux application apparatus 4, the solder ball mounting apparatus 5, and the conveying apparatus 6. FIG. It is sectional drawing which shows the structure of the 1st removal parts 53a and 53b. It is sectional drawing which shows the structure of 2nd removal part 54a, 54b. It is a block diagram which shows the structure of the solder ball supply apparatus 55a, 55b. It is a perspective view which shows the structure of the solder ball supply apparatus 55a, 55b. 5 is a cross-sectional view of a supply container 551 and a placement unit 554. FIG. 5 is a flowchart of a first mounting process 200. FIG. 6 is a first explanatory view for explaining operations of the solder ball mounting device 5 and the conveying device 6. It is the 2nd explanatory view explaining operation of solder ball mounting device 5 and conveyance device 6. FIG. 10 is a third explanatory view for explaining the operation of the solder ball mounting device 5 and the conveying device 6. FIG. 10 is a fourth explanatory view for explaining operations of the solder ball mounting device 5 and the transport device 6. FIG. 6 is a first explanatory view illustrating the operation of the solder ball suction device 51. It is the 2nd explanatory view explaining operation of solder ball adsorption device 51. FIG. 10 is a third explanatory diagram for explaining the operation of the solder ball suction device 51. It is the 4th explanatory view explaining operation of solder ball adsorption device 51. FIG. 10 is a fifth explanatory diagram for explaining the operation of the solder ball suction device 51. FIG. 10 is a sixth explanatory diagram illustrating the operation of the solder ball suction device 51. FIG. 10 is a seventh explanatory diagram illustrating the operation of the solder ball suction device 51. FIG. 10 is an eighth explanatory view for explaining the operation of the solder ball suction device 51. FIG. 10 is a ninth explanatory diagram illustrating the operation of the solder ball suction device 51. It is a 10th explanatory view explaining operation of solder ball adsorption device 51. It is the 11th explanatory view explaining operation of solder ball adsorption device 51. FIG. 20 is a twelfth explanatory diagram illustrating the operation of the solder ball suction device 51. It is sectional drawing which shows the structure of the board | substrate 600 with solder mounted. It is the 1st explanatory view explaining operation of solder ball supply equipment 55a and 55b. It is the 2nd explanatory view explaining operation of solder ball supply equipment 55a and 55b. It is the 3rd explanatory view explaining operation of solder ball supply devices 55a and 55b. It is the 4th explanatory view explaining operation of solder ball supply equipment 55a and 55b. It is the 5th explanatory view explaining operation of solder ball supply devices 55a and 55b. 5 is a cross-sectional view showing a configuration of a mounting portion 558. FIG. It is sectional drawing which shows the structure of the board | substrate 800 with an electronic component mounted. It is the 1st explanatory view explaining operation of the conventional solder ball mounting device. It is the 2nd explanatory view explaining operation of the conventional solder ball mounting device. It is the 3rd explanatory view explaining operation of the conventional solder ball mounting device.

  Hereinafter, embodiments of a substrate manufacturing apparatus, a substrate manufacturing method, a spherical body mounted substrate, and an electronic component mounted substrate will be described with reference to the accompanying drawings.

  First, the configuration of the solder-mounted board manufacturing apparatus 1 (hereinafter also simply referred to as “manufacturing apparatus 1”) shown in FIG. 1 will be described. The manufacturing apparatus 1 is an example of a board manufacturing apparatus (spherical body mounted board manufacturing apparatus), and according to the board manufacturing method (spherical body mounted board manufacturing method), a solder mounted board (spherical body mounted board) 600 (FIG. 51) can be manufactured. Specifically, the manufacturing apparatus 1 has two types of solder balls (microballs) 300a and 300b (see FIGS. 22 and 24), which are minute spherical particles as an example of a spherical body. 300 ”) is mounted (placed) on a terminal 401 (see FIG. 4) of a substrate 400 as a mounting object, and the solder ball 300 is melted (reflowed) and fixed to the substrate 400.

  The solder ball 300a is formed in a spherical shape having a diameter L1a (see FIG. 22) of about 70 μm, and the solder ball 300b is also referred to as “diameter L1” when the diameter L1b (see FIG. Is configured in a spherical shape of about 50 μm. In addition, as an example, the substrate 400 includes a plurality of terminals 401 having a large diameter connected to a thick lead wire in the first region 400a (see FIG. 4) in the center, and the second region 400b ( A plurality of terminals 401 having a diameter smaller than that of the terminals 401 in the first region 400a are formed at short intervals. For this reason, in this substrate 400, in order to securely connect a thick lead wire, a large (long diameter) solder ball 300a is mounted on the terminal 401 formed in the first region 400a, and the terminals 401 are short-circuited. In order to prevent this, a small (short diameter) solder ball 300b is mounted on the terminal 401 formed in the second region 400b. The solder balls 300a and 300b are mounted on the substrate 400 by a solder ball mounting device 5 described later and then heated and melted (reflow treatment) by a melting device 7 described later, whereby a ball grid array ( BGA). 5 and 6, the substrate 400 is divided by cutting a multi-sided substrate 500 in which a plurality of substrates 400 (pieces) are imposed (arranged).

  On the other hand, as shown in FIG. 1, the manufacturing apparatus 1 includes a cutting device 2, an inspection device 3, a flux application device 4, a solder ball mounting device 5 (spherical body mounting device), a transport device 6, a melting device 7, and a control device ( (Control part) 8 is comprised.

  As shown in FIG. 2, the cutting device 2 includes a holding base 21 and a cutting mechanism 22, and performs a cutting process of cutting the multi-sided substrate 500 and dividing it into a plurality of substrates 400. In this case, the holding base 21 is configured to be able to support the multi-sided substrate 500 supplied (placed) by a substrate supply device (not shown). The cutting mechanism 22 cuts the multi-sided substrate 500 by bringing the cutting blade (dicing blade) into contact with the multi-sided substrate 500 placed on the holding table 21 while rotating it.

  As shown in FIG. 3, the inspection apparatus 3 includes a power supply unit 31, a voltage detection unit 32, a current detection unit 33, a plurality of probes 34, and an inspection unit 35, and performs an electrical inspection on the substrate 400. The quality of the substrate 400 (specifically, the presence or absence of a disconnection or short circuit of a conductor pattern outside the figure formed on the substrate 400) is determined. In this case, the power supply unit 31 outputs an inspection current I (for example, a direct current). The voltage detector 32 detects the voltage value of the voltage V generated between the terminals 401 when the inspection current I is supplied to the terminal 401 to be inspected via the probe 34, and the current detector 33 is supplied. The current value of the inspection current I is detected. The inspection unit 35 measures the resistance value between the terminals 401 based on the voltage value of the voltage V detected by the voltage detection unit 32 and the current value of the inspection current I detected by the current detection unit 33, and the measurement. Based on the value, it is determined whether or not the conductor pattern is disconnected or short-circuited, that is, whether the substrate 400 is good or bad.

  As shown in FIG. 28, the flux coating apparatus 4 is disposed at a coating position P4 between a supply position P3 to which the substrate 400 determined to be good by the inspection apparatus 3 is supplied and a second mounting position P2b described later. Thus, the coating process of applying the flux F (see FIG. 12) to the surface of the substrate 400 is configured to be executable. Specifically, as shown in FIG. 7, the flux coating apparatus 4 includes a metal mask 41, a coating unit 42, a flux supply unit 43, a coating mechanism 44, and a substrate transport mechanism 45.

  The metal mask 41 defines a wide region including a portion (hereinafter also referred to as “BGA forming portion”) where the ball grid array is formed on the substrate 400 as a coating region Pa (see FIG. 11), and applies the flux F. The area is limited and the flux F is applied only to the application area Pa. Specifically, as shown in FIGS. 11 to 14, the metal mask 41 is formed in a thin plate shape with a metal material such as stainless steel, for example, and is pressed against the surface (application surface) of the substrate 400 as described later. In the applied state, an opening 411 having a rectangular shape in plan view is formed so as to expose the application region Pa where the flux F is to be applied (that is, a wide region including the BGA forming portion). Further, the thickness of the metal mask 41 is defined according to the application thickness of the flux F to be applied to the application region Pa (the amount of the flux F to be applied). In addition, the mask used at the time of the application | coating process of the flux F is not limited to said metal mask 41, A resin mask (resin mask) can also be used.

  As shown in FIG. 7, the coating unit 42 includes, as an example, a pair of squeegee units 421 a and 421 b and a nozzle 431 for discharging the flux F supplied from the flux supply unit 43. The squeegee units 421a and 421b (hereinafter also referred to as “squeegee unit 421” when not distinguished) are mechanisms for spreading the flux F supplied from the flux supply unit 43 and discharged from the nozzle 431 to the application region Pa of the substrate 400. 8 and 9, as shown in FIGS. 8 and 9, base portions 422a and 422b, linear motion guide mechanism 423, springs 424 and 424, base portion 425, rotating shaft 426, squeegee body 427 and mounting plates 428 and 428. It has.

  The base portions 422a and 422b correspond to a first base portion and a second base portion, and are connected to each other by a linear motion guide mechanism 423. Further, the linear motion guide mechanism 423 is an example of a coupling mechanism, and the vertical direction of the base portion 422b with respect to the base portion 422a (the direction of arrow A shown in FIG. The base portions 422a and 422b are connected to each other while allowing relative movement along the direction (the direction along the “first direction”). As shown in FIGS. 8 and 9, the linear motion guide mechanism 423 is arranged at the shaft 423a disposed at the center in the width direction of the base portions 422a and 422b and at both ends in the width direction of the base portions 422a and 422b. A pair of shafts 423b and 423b are provided. Further, around the shafts 423b and 423b, springs 424 (coil springs: an example of an “urging member”) for biasing the base portions 422a and 422b in directions away from each other are respectively attached.

  The base portion 425, together with the squeegee body 427, constitutes a “squeegee”. The base portion 425 corresponds to a third base portion, and is attached to the base portion 422b via a rotation shaft 426. In this case, the rotation shaft 426 moves in the direction in which the application mechanism 44 moves the squeegee unit 421 during the application of the flux F by the flux application device 4 (the direction of the arrow C shown in FIGS. 12 and 13 and the arrow shown in FIG. 14). The direction of D: an example of “second direction”) is arranged so that its axial length is along, and connects the base portions 422a and 422b to each other. Thus, as shown in FIG. 10, in this squeegee unit 421, the base portion 425 and the squeegee body 427 (squeegee) can swing in the directions of arrows B1 and B2 with respect to the base portions 422a and 422b and the like. Yes. As a result, in this squeegee unit 421, each part in the width direction at the front end portion 427 x of the squeegee body 427 is pressed against the surface of the metal mask 41 with a uniform pressing force.

  Further, the squeegee main body 427 is formed separately from the base portion 425 and is detachably attached to the base portion 425 so as to be sandwiched between a pair of mounting plates 428 as shown in FIG. Yes. Further, as an example, the squeegee main body 427 is configured by integrating a plate-like portion 427a formed in a flat plate shape with a resin material (polyurethane or the like) and a holder 427b that holds the plate-like portion 427a. Further, the squeegee main body 427 has a tip 427x of the plate-like portion 427a that is linear in a plan view, and the tip 427x is pointed so as to be in linear contact with the metal mask 41 and the substrate 400. . Instead of the resin plate-like portion 427a, the plate-like portion formed of various materials such as metal or ceramic can be held by the holder 427b to constitute the squeegee main body 427, or the resin material, metal and ceramic The squeegee main body 427 can also be configured by integrally forming the plate-like portion and the holder with various materials such as the above.

  As shown in FIG. 7, the nozzle 431 is connected to the flux supply unit 43 and disposed between the squeegee units 421a and 421b, and the flux F supplied from the flux supply unit 43 is supplied to the squeegee units 421a and 421b. Discharge (supply) in between. The flux supply unit 43 presses a prescribed amount of flux F toward the coating unit 42 under the control of the control device 8, thereby applying the coating surface of the substrate 400 (the surface of the metal mask 41 pressed against the coating surface: FIG. 12). Flux F is supplied from the nozzle 431.

  As shown in FIG. 9, the coating mechanism 44 includes a mounting portion 441 for mounting the coating unit 42 (squeegee units 421 a and 421 b and the nozzle 431), and is applied to the metal mask 41 and the substrate 400 according to the control of the control device 8. The coating unit 42 is moved. Specifically, the coating mechanism 44 lowers the coating unit 42 (squeegee unit 421) toward the substrate 400 that has been transported to the flux F coating processing position by the substrate transport mechanism 45, as will be described later. The tip 427x of the squeegee main body 427 is pressed against the surface of the metal mask 41 (an example in which “the squeegee unit 421 (application unit 42) is at least one of the substrate against which the mask is pressed” and the squeegee). In the coating mechanism 44, the direction of the squeegee unit 421 in a state where the tip 427x of the squeegee main body 427 is pressed against the surface of the metal mask 41 in the direction of the arrow C shown in FIGS. 11 to 13 or the arrow D shown in FIGS. And the flux F is applied to the application area Pa of the substrate 400.

  The substrate transport mechanism 45 transports the substrate 400 to which the flux F is to be applied to the coating processing position according to the control of the control device 8 and unloads the substrate 400 on which the flux F has been applied from the coating processing position. Further, the flux application device 4 is comprehensively controlled by the control device 8. Specifically, the control device 8 outputs a control signal to the substrate transport mechanism 45 to transport the substrate 400 to the coating processing position. In this case, in the flux coating apparatus 4, as an example, the metal mask 41 is fixed at the coating processing position, and the substrate transport mechanism 45 presses the coating surface against the back surface of the metal mask 41 to bring the substrate 400 into the coating processing position. A configuration for positioning is adopted. Further, the control device 8 outputs a control signal to the coating mechanism 44 to move the coating unit 42 onto the substrate 400 (on the metal mask 41) and also outputs a control signal to the flux supply unit 43. Flux F is supplied. Furthermore, the control device 8 controls the coating mechanism 44 to move the coating unit 42 to execute a coating process for coating (spreading) the flux F onto the coating surface of the substrate 400.

  The solder ball mounting device 5 is configured to be able to execute a mounting process (a first mounting process and a second mounting process described later) for mounting the solder balls 300a and 300b on the terminals 401 of the substrate 400. Specifically, as shown in FIG. 18, the solder ball mounting device 5 includes solder ball adsorbing devices (spherical adsorbing devices) 51a and 51b (hereinafter also referred to as “solder ball adsorbing device 51” when not distinguished), detection. Sections 52a and 52b (hereinafter also referred to as “detection section 52” when not distinguished), first removal sections 53a and 53b (hereinafter also referred to as “first removal section 53” when not distinguished), and second removal sections 54a and 54b. (Hereinafter also referred to as “second removal portion 54” when not distinguished) and solder ball replenishing devices 55a and 55b (hereinafter also referred to as “solder ball replenishing device 55” when not distinguished).

  As shown in FIG. 19, the solder ball suction device 51a includes a suction head 511a, a supply unit 513a, a suction device 518a, an alignment plate 519a, and a moving mechanism 520a, and performs supply processing and suction processing described later. Then, the solder balls 300a are adsorbed. As shown in FIG. 20, the solder ball suction device 51b includes a suction head 511b (hereinafter also referred to as “suction head 511” when the suction heads 511a and 511b are not distinguished from each other), a supply unit 513b (hereinafter referred to as a supply unit 513a, When not distinguishing 513b, it is also referred to as “supply section 513”, and when the intake device 518b (hereinafter also referred to as “intake device 518” when not distinguished), the alignment plate 519b (hereinafter referred to as alignment plate 519a, 519b is also referred to as “alignment plate 519” and moving mechanism 520b (hereinafter also referred to as “moving mechanism 520” when not distinguishing between moving mechanisms 520a and 520b). To adsorb the solder ball 300b. In this case, a mounting part is comprised by supply part 513a, 513b, plate 519a, 519b for alignment, and moving mechanism 520a, 520b.

  The suction heads 511a and 511b perform suction processing (holding processing) to suck and hold the plurality of solder balls 300. Specifically, as shown in FIGS. 21 and 23, the suction heads 511a and 511b are configured in a box shape in which a gap 512a is formed as an example. As shown in FIGS. 22 and 24, the bottom wall 512b of the suction heads 511a and 511b is formed on the outer surface of the bottom wall 512b (a surface that functions as a suction surface, hereinafter also referred to as “suction surface 512c”). A plurality of intake holes 512d that open and communicate with the gap 512a are formed along the thickness direction of the bottom wall 512b (only one of them is shown in both figures). Note that the opening of the suction hole 512d in the suction surface 512c corresponds to the suction port (hereinafter also referred to as “suction port 512e”). Also, as shown in FIG. 23, the suction head 511b is formed with a recess 512g for avoiding contact with the solder ball 300a already mounted on the substrate 400 when the second mounting process is executed.

  In this case, as shown in FIG. 22, the diameter of the intake hole 512d in the suction head 511a (that is, the diameter of the intake port 512e) L2a is defined in correspondence with the diameter L1a of the solder ball 300a. Specifically, the diameter L2a is defined to be about 40 μm, which is shorter than the diameter L1a (70 μm in this example). As shown in FIG. 24, the diameter L2b of the intake hole 512d in the suction head 511b is defined in correspondence with the diameter L1b of the solder ball 300b. Specifically, the diameter L2b is defined to be about 30 μm, which is shorter than the diameter L1b (in this example, 50 μm). As shown in FIGS. 21 and 23, the suction heads 511a and 511b are formed with exhaust holes 512f for exhausting the air in the gap 512a. In the suction heads 511a and 511b, the inside of the air gap 512a is brought into a negative pressure state by the exhaust of the air in the air gap 512a, and the air suction from the air inlet 512e is performed accordingly. It is possible to adsorb and hold the solder ball 300 (see FIGS. 22 and 24).

  As shown in FIGS. 19 and 20, the supply units 513 a and 513 b are each configured to include a storage container 514, a suction holding unit 515, a suction unit 516, and a drive mechanism 517. Further, the supply unit 513 controls the tip 515a of the suction holding unit 515 that holds the solder ball 300 according to the control of the control device 8 to align the tip 515a with the alignment plate 519 (the suction surface 512c of the suction head 511 on which the alignment plate 519 is mounted). Supply processing for supplying the solder balls 300 to the suction head 511 by moving the suction holding unit 515 and the suction unit 516 along the alignment plate 519 (suction surface 512c), A solder ball 300 (hereinafter, this solder ball 300 is referred to as “surplus”) excluding the solder ball 300 (hereinafter, this solder ball 300 is also referred to as “mounting target solder ball 300”) adsorbed on the edge of the air inlet 512e on the surface 512c. (Also referred to as a “solder ball 300”) is performed.

  As shown in FIGS. 26 and 27, the container 514 has a container body 514c whose inner surface is curved in a semicircular cross section, and two side walls 514f and 514g arranged on both sides of the container body 514c (FIG. 27). The solder ball 300 can be accommodated in an accommodating portion 514a (see FIG. 26) formed by the container main body 514c and the side walls 514f and 514g. A wiper 514d having both ends supported by side walls 514f and 514g is disposed on the side of the opening 514b (see the same figure) of the container 514. Further, bearings 514e (see FIG. 27) for rotatably supporting the suction holding portion 515 are disposed on the side walls 514f and 514g. In this case, the storage container 514 is disposed such that the opening 514b faces the suction surface 512c of the suction head 511 when the supply process is performed (see FIG. 26).

  As shown in FIG. 27, the suction holding portion 515 is formed in a rectangular parallelepiped shape as a whole, and as shown in FIG. 26, an intake passage 515c extending from the base end portion 515b side to the tip end portion 515a is formed inside. The solder ball 300 housed in the housing portion 514a of the housing container 514 is configured to be able to be sucked and held by the tip portion 515a. In addition, a breathable sheet 515e is attached to the tip portion 515a of the suction holding portion 515. Further, the suction holding portion 515 is rotatably supported by a shaft 515f and an intake pipe 515d disposed on the base end portion 515b side by bearings 514e disposed on the side walls 514f and 514g of the storage container 514. The container 514 is disposed on the opening 514b side so as to be rotatable about the base end 515b.

  In this case, as shown in FIG. 26, the suction holding portion 515 is accommodated in the accommodating portion 514a of the accommodating container 514 when the tip end portion 515a faces the bottom side of the container main body 514c of the accommodating container 514. The solder ball 300 is attracted and held by the tip 515a. Further, as shown in FIG. 40, the suction holding unit 515 is driven by the drive mechanism 517 so that the tip 515a holding the solder ball 300 faces the suction surface 512c of the suction head 511, as shown in FIG. It can be rotated.

  As shown in FIGS. 26 and 27, the suction part 516 includes two partition walls 516b and 516c, and is formed by the two side walls 514f and 514g and the partition walls 516b and 516c in the storage container 514. The solder ball 300 can be sucked through the suction path 516a (see FIG. 26). In this case, in the solder ball mounting device 5, the storage container 514, the suction holding unit 515, and the suction unit 516 are configured as described above so that they are integrated (see FIG. 25: The container 514, the suction holding unit 515, and the suction unit 516 as a whole are also referred to as “main body unit 50”).

  The drive mechanism 517 functions as a moving mechanism, and moves the main body 50 (the storage container 514, the suction holding unit 515, and the suction unit 516) according to the control of the control device 8. The drive mechanism 517 functions as a rotation mechanism, and rotates the suction holding unit 515 according to the control of the control device 8.

  The intake devices 518a and 518b are each provided with an intake pump and an electromagnetic valve (both not shown). Further, as shown in FIGS. 19 and 20, the suction devices 518a and 518b are connected to suction heads 511a and 511b (exhaust holes 512f of the suction heads 511a and 511b) and suction holding portions 515 (each suction suction unit 515) via an intake pipe 518c. The suction pipe 515d) communicates with the intake path 515c of the holding section 515 and the suction section 516 (the suction path 516a of each suction section 516). In this case, the intake devices 518a and 518b are operated according to the control of the control device 8, and intake air from the intake port 512e and intake air in the adsorption holding unit 515 are generated by setting the inside of the gap 512a of the adsorption heads 511a and 511b to a negative pressure state. Intake from the path 515c and intake (suction) from the suction path 516a in the suction unit 516 are performed.

  The alignment plates 519a and 519b are configured to be detachable from the suction head 511, and are mounted so that the upper surface 519c contacts the suction surface 512c of the suction head 511 as shown in FIGS. In the state, an insertion hole 519e communicating with the suction port 512e of the suction head 511 is formed. In this case, as shown in FIG. 22, the thickness L3a of the alignment plate 519a is defined to be about 80 μm so that the solder ball 300a adsorbed to the edge of the air inlet 512e does not protrude from the lower surface 519d. The diameter L4a of the insertion hole 519e in the alignment plate 519a is defined to be about 90 μm through which the solder ball 300 can pass. Further, as shown in FIG. 24, the thickness L3b of the alignment plate 519b is defined to be about 60 μm so that the solder ball 300b adsorbed to the edge of the air inlet 512e does not protrude from the lower surface 519d. The diameter L4b of the insertion hole 519e in the alignment plate 519b is defined to be about 70 μm through which the solder ball 300b can pass. In addition, as shown in FIG. 26, the alignment plate 519 is disposed at a position above the position where the main body 50 is disposed.

  The moving mechanisms 520 a and 520 b execute a moving process for moving the suction heads 511 a and 511 b toward the substrate 400 according to the control of the control device 8. In this case, as shown in FIG. 28, the moving mechanism 520a is attached to the substrate 400 with an adsorption position P1a (arrangement position of the alignment plate 519a) where the adsorption process (holding process) for adsorbing and holding the solder balls 300a is performed. The suction head 511a is moved between the first mounting position P2a where the first mounting process for mounting the solder ball 300a is performed. Further, as shown in the figure, the moving mechanism 520b has a suction position P1b (positioning position of the alignment plate 519b) where the suction process (holding process) for sucking and holding the solder ball 300b is performed and the solder ball on the substrate 400. The suction head 511b is moved between the second mounting position P2b where the second mounting process for mounting 300b is performed. As described above, the solder ball mounting device 5 includes the same number (two in this example) of moving mechanisms 520 as the number of the suction heads 511, and the solder ball mounting device 5 is configured. However, the process of individually moving one suction head 511 toward the substrate 400 is executed as a movement process (that is, the solder ball mounting device 5 executes a movement process for each suction head 511).

  As shown in FIG. 28, the detection unit 52a is disposed between the suction position P1a and the first mounting position P2a, and the detection unit 52b is disposed between the suction position P1b and the first mounting position P2b. . The detection unit 52a includes a camera (not shown) that images the suction surface 512c side of the suction head 511a, and the detection unit 52b is a camera (not shown) that images the suction surface 512c side of the suction head 511b. Z)). In this case, the detection units 52a and 52b function as first detection units, respectively, and by analyzing the image captured by the camera, the excess and deficiency of the solder balls 300a and 300b in the suction heads 511a and 511b after the suction process is performed. A first detection process is performed to detect. The detection units 52a and 52b also function as a second detection unit, and by analyzing the image captured by the camera, the flux F in the suction heads 511a and 511b after the mounting process is performed, the solder balls 300a and 300b, and the like. The 2nd detection process which detects the presence or absence of adhesion of this deposit is performed.

  As shown in FIG. 29, the first removal portions 53a and 53b are each configured in a plate shape. In addition, a suction path 531b that opens to the upper surface 531a is formed at the center of the first removal portion 53. In this case, as shown in FIG. 28, the first removal unit 53a is disposed between the suction position P1a and the first mounting position P2a, and is soldered by the suction head 511a after the suction process is performed. The first removal process of removing the solder balls 300a from the suction head 511a is performed by sucking the solder balls 300a attached to the suction head 511a after the execution of the mounting process 300a and the suction path 531b. Further, as shown in the figure, the first removal unit 53b is disposed between the suction position P1b and the first mounting position P2b, and is soldered by the suction head 511b after the suction process is performed. Then, after the mounting process is performed, the first removal process for removing the solder ball 300b from the suction head 511b is performed by sucking the solder ball 300b attached to the suction head 511b through the suction path 531b.

  As shown in FIG. 30, the second removal sections 54 a and 54 b include a storage tank 542 that stores a removal liquid (for example, a solvent) 541 that can melt and remove the flux F, and a material having liquid absorbency (for example, cloth and Sponge) is attached to the tip, and is configured to include a removal member 543 disposed inside the storage tank 542 so as to be movable up and down, and a moving mechanism (not shown) for moving the removal member 543 up and down. . In this case, as shown in FIG. 28, the second removal unit 54a is disposed between the suction position P1a and the first mounting position P2a, and is attached to the suction head 511a after the mounting process is performed. And a second removal process for removing the solder balls 300a adhering to the suction head 511a as the flux F adheres. Further, as shown in the figure, the second removal unit 54b is disposed between the suction position P1b and the first mounting position P2b, and the flux F attached to the suction head 511b after the mounting process is performed, And the 2nd removal process which removes solder ball 300b adhering to adsorption head 511b with adhesion of flux F is performed.

  The solder ball replenishing devices 55a and 55b are examples of a spherical body replenishing device, and each includes a replenishing container 551, a placing portion 554, a rotating mechanism 556, and a nitrogen gas supplying portion 557 as shown in FIG. Has been. The solder ball replenishing devices 55a and 55b execute replenishment processing for replenishing the solder balls 300a and 300b to the storage containers 514 of the supply units 513a and 513b, respectively. In this case, each solder ball replenishing device 55a, 55b replenishes an appropriate amount of solder balls 300a, 300b defined in advance in one replenishment process. Each solder ball replenishing device 55a, 55b executes a replenishing process according to an execution instruction issued from the control device 8 when a predetermined condition is satisfied. Further, as shown in FIG. 28, each of the solder ball replenishing devices 55a and 55b has a replenishing port 554f (see FIG. 52) formed in the edge portion 554b of the mounting portion 554 in the standby state (initial state). The container 514 (main body part 50) of each supply part 513a, 513b is arrange | positioned so that it may be located above the position which waits.

  As shown in FIG. 33, the replenishing container 551 includes, for example, a main body portion 551a and a lid portion 552 that are each formed of a light-transmitting resin, and is configured to accommodate the solder balls 300. . The main body 551a has a lower outer shape that is smaller in diameter than an upper outer shape. In addition, an opening 551b into which the solder ball 300 is inserted is formed in the upper part of the main body 551a, and a discharge port 551c in which the solder ball 300 is discharged is formed in the lower part of the main body 551a. In addition, an inlet 551d for allowing the nitrogen gas supplied from the nitrogen gas supply unit 557 to flow into the main body 551a is formed on the side surface of the main body 551a. As shown in the figure, the lid portion 552 is configured to be fitted to the upper portion of the main body portion 551a, and closes the opening 551b of the main body portion 551a in the fitted state.

  As shown in FIGS. 52 to 55, the mounting portion 554 is formed in a rectangular plate shape with resin, for example, and the supply container 551 in a state where the discharge port 551 c faces downward faces the upper surface 554 a side through the spacer 553. (See FIG. 32). 52 to 55 illustrate a state where the supply container 551 and the spacer 553 are removed. Further, a groove 555 serving as a storage portion is formed on the upper surface 554a of the placement portion 554. In this case, the groove 555 is closed on the opening side by the spacer 553, so that the solder ball 300 can be accommodated without overflowing. Further, as shown in FIGS. 52 and 53, the groove 555 is configured to include a storage portion 555a and a movement channel 555b, and is formed in a J shape in plan view as a whole.

  The storage unit 555a is formed in a U shape in plan view and has a function of storing the appropriate amount of solder balls 300 (that is, measuring the appropriate amount of solder balls 300). Further, the movement channel 555b is formed in a straight line in plan view, and connects one end portion of the storage portion 555a and the supply port 554f formed in the edge portion 554b of the placement portion 554, During the replenishment process, the solder ball 300 stored in the storage unit 555a has a function of moving (sliding down) toward the supply port 554f. The other end of the reservoir 555a communicates with a discharge port 551c of the main body 551a in the supply container 551 through a discharge hole 553a formed in the spacer 553 (see FIGS. 33 and 56). Further, the width and depth of the storage portion 555a are defined so as to have a volume capable of storing an appropriate amount of solder balls 300.

  As shown in FIGS. 52 to 55, the rotation mechanism 556 includes a support plate 556a, a rotary actuator 556b, and connecting portions 556c and 556d. The support plate 556a is erected along the vertical direction to support the rotary actuator 556b. The rotary actuator 556b operates by supplying air to the couplers 557a and 557b, and rotates the rotation shaft 557c (see FIGS. 54 and 55). As shown in FIGS. 52 and 54, the connecting portion 556c is formed in a plate shape with a notch formed in the upper portion. The connecting portion 556c is attached to the rotation shaft 557c, and is rotated along with the rotation of the rotation shaft 557c.

  As shown in FIGS. 52 and 55, the connecting portion 556d is formed in a wide plate shape at the upper portion, and the lower end portion is connected to the connecting portion 556c so that the upper portion can rotate in a direction to come in contact with and separate from the support plate 556a. Has been. In addition, a placing portion 554 is fixed to the upper end portion of the connecting portion 556d. In this solder ball replenishing device 55, as shown in FIGS. 52 and 53, the rotary actuator 556b of the rotating mechanism 556 rotates the rotating shaft 557c, whereby the connecting portion 556c rotates, and the connecting portion 556c is moved. The mounting portion 554 fixed to the upper end portion of the connected connecting portion 556d is rotated, and the inclination angle of the mounting portion 554 is changed with the rotation of the connecting portion 556c.

  In this case, in this solder ball replenishing device 55, as shown in FIG. 54, in the standby state (the non-operating state of the rotary actuator 556b), the connecting portion 556c as a whole inclines to the left side in the figure with respect to the vertical direction. The connecting portion 556c is fixed to the rotating shaft 557c of the rotary actuator 556b. For this reason, the mounting portion 554 fixed to the upper end portion of the connecting portion 556d connected to the connecting portion 556c has a storage portion 555a (on the edge portion 554b) of the groove 555 formed on the upper surface 554a of the mounting portion 554. A posture that is inclined, for example, about 5 ° with respect to the horizontal direction (hereinafter, this posture is referred to as a “first” so that the opposite edge portion 554c side) is positioned below the supply port 554f formed in the edge portion 554b. (Also called “posture”).

  In the solder ball replenishing device 55, as shown in FIG. 55, the upper portion of the connecting portion 556d is separated from the support plate 556a, and the connecting portion 556d is fixed in a state inclined with respect to the vertical direction. . For this reason, the mounting portion 554 fixed to the upper end portion of the connecting portion 556d is lower than the edge portion 554e where the edge portion 554d located on the side away from the support plate 556a is located on the side close to the support plate 556a. Located on the side. In the solder ball replenishing device 55, as shown in FIG. 52, in the replenishment process, the rotary actuator 556b of the rotation mechanism 556 rotates the rotation shaft 557c, so that the replenishment port 554f (edge 554b) is a groove. The upper surface 554a is positioned below the storage portion 555a (edge 554c side) of 555 and the upper surface 554a is inclined by about 15 ° with respect to the horizontal direction (hereinafter, this posture is also referred to as “second posture”). The mounting portion 554 is rotated as described above.

  The nitrogen gas supply unit 557 includes a nitrogen gas cylinder (not shown) filled with nitrogen gas as an example of an antioxidant gas. The nitrogen gas supply unit 557 is connected to an inlet 551d of the main body 551a in the replenishing container 551 via a supply pipe (not shown), and supplies nitrogen gas into the main body 551a.

  The transport device 6 transports the substrate 400 after dividing the multi-sided substrate 500 by the cutting process by the cutting device 2 to the inspection device 3 under the control of the control device 8. Further, the transport device 6 transports the substrate 400 determined to be good by the inspection device 3 to the supply position P3. Further, as shown in FIG. 28, the transport device 6 transports the substrate 400 along a transport path R that connects the supply position P3 and the second mounting position P2b. In this case, as shown in the figure, the transport device 6 includes a first transport mechanism 61, a second transport mechanism 62, a third transport mechanism 63, and a detection unit 64, and includes a plurality of transport paths R (for example, Each of the transport mechanisms 61 to 63 transports the substrate 400 along each of the three divided paths (for example, a first path R1, a second path R2, and a third path R3 described later).

  As shown in FIG. 28, the first transport mechanism 61 performs a first transport process for transporting the substrate 400 along a first path R1 (a part of the transport path R) connecting the supply position P3 and the delivery position P5. To do. Specifically, the first transport mechanism 61 includes a stage 611, a rail 612, a suction table 613, and a moving mechanism 614. The stage 611 is moved by the moving mechanism 614 on the rail 612 disposed along the first path R1. The suction table 613 is fixed on the stage 611 and sucks and holds the substrate 400 as a suction target body placed (supplied).

  As shown in FIG. 28, the second transport mechanism 62 performs a second transport process for transporting the substrate 400 along the second path R2 (a part of the transport path R) connecting the transfer position P5 and the transfer position P6. To do. Specifically, the second transport mechanism 62 includes an adsorption unit 621 and a moving mechanism 622 as shown in FIG. The suction unit 621 holds the substrate 400. The moving mechanism 622 moves the suction part 621 up and down and moves the suction part 621 along the second path R2.

  As shown in FIG. 28, the third transport mechanism 63 transports the substrate 400 along a third path R3 (a part of the transport path R) connecting the delivery position P6 and the second mounting position P2b. Execute. Specifically, the third transport mechanism 63 includes a stage 631, a rail 632, a suction table 633, a moving mechanism 634, and a correction mechanism 635. The stage 631 is moved by the moving mechanism 634 on the rail 632 disposed along the third path R3. The suction table 633 is configured in the same manner as the suction table 613 of the first transport mechanism 61 described above, and sucks and holds the substrate 400 placed on the upper surface. The correction mechanism 635 is disposed below the suction table 633, and rotates the suction table 633 around a central axis that penetrates the suction table 633 in the vertical direction. Based on the above, a correction process for correcting the positional deviation of the substrate 400 held by the suction table 633 is executed.

  The detection unit 64 includes a camera (not shown) that captures an image of the surface of the substrate 400 held on the suction platform 633 of the third transport mechanism 63. As shown in FIG. It is disposed at a predetermined position (detection position P7 shown in the figure) between the mounting position P2a. In this case, the detection unit 64 performs a detection process of detecting a positional deviation in the rotation direction of the substrate 400 around the central axis penetrating the substrate 400 in the vertical direction by analyzing the captured image of the substrate 400. .

  The melting device 7 performs a reflow process (melting process) on the substrate 400 on which the solder balls 300 are mounted by the solder ball mounting device 5, and melts the solder balls 300 to form the substrate 400 as shown in FIG. The terminal 401 is fixed.

  The control device 8 controls the cutting device 2, the inspection device 3, the flux application device 4, the solder ball mounting device 5, the transport device 6 and the melting device 7, and each component constituting these devices.

  Next, a method for manufacturing the solder-mounted substrate 600 (substrate manufacturing method) using the manufacturing apparatus 1 and the operation of the manufacturing apparatus 1 at that time will be described with reference to the drawings.

  First, prior to operating the manufacturing apparatus 1, the solder balls 300 a and the solder balls 300 b are accommodated in the accommodating portions 514 a of the accommodating containers 514 in the supply portions 513 a and 513 b of the solder ball mounting device 5, respectively. In addition, the solder balls 300a and 300b are stored in the main body portions 551a of the supply containers 551 in the solder ball supply devices 55a and 55b of the solder ball mounting device 5, respectively. In this case, in this solder ball replenishing device 55, in the standby state (initial state), the storage portion 555a of the groove 555 formed in the upper surface 554a of the mounting portion 554 is from the replenishment port 554f formed in the edge portion 554b. Also, the mounting portion 554 is maintained in the first posture inclined with respect to the horizontal direction so as to be positioned on the lower side (see FIG. 54), and the edge portion 554d of the mounting portion 554 is located below the edge portion 554e. Located (see FIG. 55). Therefore, as shown in FIG. 33, the solder balls 300 housed in the main body 551a of the replenishing container 551 are discharged from the discharge port 551c by their own weight, and an appropriate amount passes through the discharge hole 553a of the spacer 553 to form the groove 555. Is housed in.

  At this time, as shown in FIG. 53, since the U-shaped convex portion of the storage portion 555a is located on the lower side, the accommodated solder ball 300 is connected to the discharge port 551c. Is stored in a region extending from the end of the ridge to a U-shaped convex portion (region shaded in the figure). In this case, an area in which the solder ball 300 is stored (the amount of the solder ball 300 to be stored) due to the inclination angle of the mounting portion 554 in the first posture and the height difference (height difference) between the edges 554d and 554e. ) Is determined. For this reason, the amount of the solder balls 300 stored in the storage portion 555a can be regulated to a desired amount by adjusting the inclination angle and the height difference. That is, in this solder ball replenishing device 55, it is possible to accurately measure an appropriate amount of the solder ball 300 by the storage portion 555a by adjusting the inclination angle of the mounting portion 554 and the height difference between the edge portions 554d and 554e. It has become.

  Next, nitrogen gas is supplied from the nitrogen gas supply unit 557 of the solder ball supply device 55. At this time, nitrogen gas flows into the main body 551a from the inlet 551d of the replenishing container 551, thereby preventing the solder balls 300 stored in the main body 551a from being oxidized, and the solder balls 300 are mutually connected. The situation of being stuck and becoming solid is surely prevented.

  Subsequently, the manufacturing device 1 is operated by operating an operation unit (not shown). At this time, the control device 8 instructs the cutting device 2, the inspection device 3, the flux application device 4, the solder ball mounting device 5, the transport device 6, and the melting device 7 to execute each process. In response to this, the cutting device 2 executes a cutting process. In this cutting process, the holding table 21 of the cutting device 2 holds the multi-sided substrate 500 (see FIG. 5) supplied by a substrate supply device (not shown). Next, the cutting mechanism 22 of the cutting device 2 cuts the multi-sided substrate 500 by contacting the multi-sided substrate 500 while rotating the cutting blade. Thereby, as shown in FIG. 6, each board | substrate 400 is isolate | separated.

  Subsequently, the transport device 6 transports each substrate 400 separated by the cutting processing by the cutting device 2 to the inspection device 3 in accordance with the processing execution instruction from the control device 8. Next, the inspection device 3 performs an electrical inspection in accordance with instructions from the control device 8. In this electrical inspection, the inspection device 3 supplies the inspection current I output from the power supply unit 31 to the terminal 401 to be inspected via the probe 34 as shown in FIG. Subsequently, the voltage detection unit 32 of the inspection apparatus 3 detects the voltage value of the voltage V generated between the terminals 401 by the supply of the inspection current I, and the current detection unit 33 of the inspection apparatus 3 determines the current value of the inspection current I. To detect. Next, the inspection unit 35 of the inspection device 3 measures the resistance value between the terminals 401 based on the voltage value of the voltage V and the current value of the inspection current I, and based on the measured value, the conductor pattern not shown in the figure. Determine if there is a break or short circuit. In this case, the inspection unit 35 determines that the substrate 400 is non-defective when there is no disconnection or short circuit, and determines that the substrate 400 is defective when there is a disconnection or short circuit.

  In this case, in the manufacturing apparatus 1, as described above, an electrical inspection is performed on the substrate 400 after the cutting process is performed. For this reason, in this manufacturing apparatus 1, in addition to being able to select the substrate 400 in which the conductor pattern is disconnected or short-circuited as a defective product during the manufacture of the multi-sided substrate 500, for example, this is caused by vibration during the cutting process. Thus, the substrate 400 in which the conductor pattern is disconnected or short-circuited can be selected as a defective product.

  Subsequently, the carrying device 6 carries out a carrying process to carry only the substrate 400 determined as a non-defective product in the electrical inspection to the supply position P3 shown in FIG. It is placed (supplied) on the suction table 613 of the mechanism 61. In addition, the transport device 6 transports the substrate 400 that has been determined to be defective in the electrical inspection to a predetermined storage location. In this state (initial state), as shown in the figure, the stage 611 of the first transport mechanism 61 in the transport device 6 is located at the supply position P3, and the stage 631 of the third transport mechanism 63 in the transport device 6 is It is assumed that it is located at the delivery position P6.

  Next, the transport device 6 performs a first transport process. In the first transport process, the suction table 613 of the first transport mechanism 61 holds the supplied (mounted) substrate 400. Subsequently, as shown in FIG. 35, the moving mechanism 614 moves the stage 611 on the rail 612 disposed along the first path R1. Next, the moving mechanism 614 stops the movement when the stage 611 is positioned at the application position P4.

  Subsequently, the flux application device 4 performs an application process. In this coating process, the control device 8 controls the substrate transport mechanism 45 to transport (move) the substrate 400 placed on the stage 611 located at the coating position P4 to the coating processing position. At this time, the substrate transport mechanism 45 raises the substrate 400 so that the coating surface of the substrate 400 is pressed against the back surface of the metal mask 41. Next, the control device 8 controls the coating mechanism 44 to move the coating unit 42 to the outside of the opening 411 in the metal mask 41 (for example, a position indicated by a solid line in FIG. 11). Subsequently, the control device 8 controls the coating mechanism 44 to lower the coating unit 42 toward the surface of the metal mask 41 (the coating surface of the substrate 400) as shown in FIG. The tip 427 x of the squeegee body 427 is pressed against the surface of the metal mask 41.

  At this time, for example, when the squeegee main body 427 in the squeegee unit 421a is inclined as shown by a one-dot chain line in FIG. (In this example, the left end in the figure) contacts the surface of the metal mask 41. Next, when the application unit 42 is further lowered by the application mechanism 44, the base portion 425 of the squeegee unit 421a rotates about the rotation shaft 426 in the direction of the arrow B1 with respect to the base portion 422b, and the tip portion The entire width direction of 427x contacts the surface of the metal mask 41. Thereby, as shown with a broken line in the figure, the inclination of the squeegee main body 427 in the squeegee unit 421a is corrected.

  Further, as shown by a two-dot chain line in FIG. 10, when the squeegee main body 427 in the squeegee unit 421b is inclined, first, one end portion in the width direction of the tip end portion 427x (this example) Then, the right end portion in the figure is in contact with the surface of the metal mask 41. Subsequently, when the coating unit 42 is further lowered by the coating mechanism 44, the base portion 425 of the squeegee unit 421b rotates about the rotation shaft 426 in the direction of the arrow B2 with respect to the base portion 422b. The entire width direction of the portion 427 x comes into contact with the surface of the metal mask 41. Thereby, as shown with a broken line in the figure, the inclination of the squeegee main body 427 in the squeegee unit 421b is corrected.

  Further, when the metal mask 41 pressing the squeegee unit 421 or the substrate 400 is inclined (not shown), first, one end portion in the width direction of the tip end portion 427x is the first end portion 427x of the metal mask 41. Contact the surface. Next, when the coating unit 42 is further lowered by the coating mechanism 44, the base portion 425 of the squeegee unit 421 rotates about the rotation shaft 426 in the direction of the arrow B1 or the direction of the arrow B2 with respect to the base portion 422b. As a result, the squeegee main body 427 has a similar inclination according to the inclination generated in the metal mask 41 and the substrate 400. As a result, the entire width direction of the front end portion 427 x comes into contact with the surface of the metal mask 41.

  Subsequently, when the coating unit 42 is further lowered by the coating mechanism 44, the base portions 422 a of both squeegee units 421 move linearly with respect to the base portion 422 b in the direction of arrow A according to the guidance of the linear motion guide mechanism 423. Do (descent). At this time, as the base portion 422a is lowered, both springs 424 are elastically deformed so as to be compressed, and the base portion 422b is biased toward the metal mask 41 (substrate 400). Thereby, in both squeegee units 421a and 421b, the tip 427x of the squeegee main body 427 connected to the base 422b via the base 425 is pressed against the surface of the metal mask 41 with a desired pressing force.

  Next, the control device 8 controls the flux supply unit 43 to pump the flux F toward the nozzle 431. At this time, as shown in FIG. 12, the flux F is supplied from the nozzle 431 between the squeegee units 421a and 421b. Subsequently, the control device 8 controls the coating mechanism 44 to move the coating unit 42 in the direction of arrow C along the coating surface of the substrate 400 (the surface of the metal mask 41). At this time, as shown in FIG. 13, the flux F supplied from the nozzle 431 is moved in the direction of the arrow C by the squeegee unit 421 a as the application unit 42 moves, and the edge of the opening 411 , The metal mask 41 is moved to the coating surface of the substrate 400. At this time, when the squeegee unit 421a is positioned above the opening 411, the tip 427x is maintained at substantially the same height as the surface of the metal mask 41 as shown in FIG. The surface). As a result, the flux F moved onto the application surface along with the movement of the squeegee unit 421a is uniformly flattened so as to remain on the application surface by the thickness of the metal mask 41.

  Next, the coating unit 42 is further moved in the direction of arrow C toward the position indicated by the alternate long and short dash line in FIG. At this time, as shown in FIG. 14, excess flux F that has not been applied to the application region Pa among the flux F that has been moved on the application surface in accordance with the movement of the squeegee unit 421a. It is moved on the metal mask 41. Thereby, the application process of the flux F to the application region Pa on the application surface of the first substrate 400 is completed. Thereafter, the control device 8 controls the substrate transport mechanism 45 to carry out (move) the substrate 400 on which the coating process has been completed from the coating processing position to the stage 611 of the first transport mechanism 61 positioned at the coating position P4. Let Further, when the stage 611 on which the substrate 400 on which the flux F is to be applied next is positioned at the application position P4, the control device 8 controls the flux supply unit 43 to connect the nozzle 431 to the squeegee units 421a and 421b. Then, the application mechanism 44 is controlled to move the application unit 42 in the direction of the arrow D. Thereby, instead of the squeegee unit 421a in the above example in which the application unit 42 is moved in the direction of the arrow C, the flux F is applied to the application region Pa of the substrate 400 by the squeegee unit 421b. Thereby, the application process of the flux F with respect to the 2nd board | substrate 400 is completed.

  On the other hand, when the application process of the flux F to the plurality of substrates 400 is repeatedly performed, the tip 427x of the squeegee main body 427 of both squeegee units 421 is chipped (scratched) or worn as shown in FIG. There is. In the squeegee main body 427 in which chipping or wear has occurred in this way, it becomes difficult to uniformly apply the flux F to the entire area of the application area Pa of the substrate 400, and the area where the application thickness of the flux F is thicker than the prescribed thickness. Is formed in a streak shape along the moving direction of the coating unit 42 by the coating mechanism 44 (a streaky coating unevenness occurs). Therefore, in this flux application device 4, when the tip portion 427x is chipped or worn, the squeegee body 427 formed separately from the base portion 425 is removed, and the tip portion 427x is moved to the position indicated by the broken line in FIG. It is comprised so that it can grind | polish. In the figure, the chipping and wear generated at the tip portion 427x are exaggerated and greatly illustrated.

  In this case, when the squeegee main body 427 is polished, it is preferable to polish the tip portion 427x of the plate-like portion 427a so that the tip end portion 427x is parallel to the base end portion (the portion held by the holder 427b). As shown in FIG. 4, the tip portion 427x may be polished so as to be inclined with respect to the base end portion. In the figure, the degree to which the tip portion 427x is inclined during polishing is exaggerated. In the squeegee unit 421 to which the squeegee body 427 polished in such a state is attached, when the coating unit 42 is lowered by the coating mechanism 44 during the coating process of the flux F, first, the width at the tip end portion 427x after the polishing is performed. One end portion in the direction (in this example, the left end portion in FIG. 16) contacts the surface of the metal mask 41. Subsequently, when the coating unit 42 is further lowered by the coating mechanism 44, as shown in FIG. 17, the base portion 425 rotates about the rotation shaft 426 in the direction of the arrow B1 with respect to the base portion 422b. Thus, the entire width direction of the front end portion 427 x comes into contact with the surface of the metal mask 41. As a result, as shown in the figure, the entire width direction of the tip portion 427x in an inclined state by polishing is almost uniformly pressed against the surface of the metal mask 41, resulting in uneven application of the flux F. Is avoided.

  Next, the moving mechanism 614 of the first transport mechanism 61 moves the stage 611 toward the delivery position P5, and stops the movement when the stage 611 is located at the delivery position P5. Thus, the substrate 400 is transported by the first transport mechanism 61 along the first path R1 connecting the supply position P3 and the delivery position P5.

  Subsequently, the control device 8 causes the second transport mechanism 62 of the transport device 6 to execute the second transport process. In the second transport process, the moving mechanism 622 of the second transport mechanism 62 moves the suction portion 621 above the delivery position P5 as shown in FIG. Next, the moving mechanism 622 lowers the suction unit 621 to bring the suction unit 621 closer to the substrate 400 held by the suction table 613 of the first transport mechanism 61. Subsequently, the control device 8 releases the suction of the substrate 400 by the suction table 613. As a result, the substrate 400 is adsorbed by the adsorption unit 621, and the substrate 400 is transferred from the first conveyance mechanism 61 to the second conveyance mechanism 62. Next, the moving mechanism 622 moves the suction portion 621 along the second path R2 after raising the suction portion 621, and positions the suction portion 621 above the delivery position P6. Subsequently, the moving mechanism 622 lowers the suction unit 621 to place the substrate 400 on the upper surface of the suction table 633 of the third transport mechanism 63 in the transport device 6. As a result, the substrate 400 is transported by the second transport mechanism 62 along the second path R2 connecting the delivery position P5 and the delivery position P6.

  The moving mechanism 614 of the first transport mechanism 61 moves the stage 611 from the delivery position P5 to the supply position as shown in FIG. 37 when the substrate 400 is delivered from the first transport mechanism 61 to the second transport mechanism 62. Move to P3 (return to initial position).

  Next, the control device 8 causes the third transport mechanism 63 of the transport device 6 to execute the third transport process. In the third transport process, the suction table 633 of the third transport mechanism 63 sucks and holds the substrate 400 placed by the second transport mechanism 62, and the moving mechanism 634 moves the stage as shown in FIG. 631 is moved on the rail 632 disposed along the third route R3. Subsequently, as shown in the figure, the moving mechanism 634 stops the movement when the stage 631 is located at the detection position P7.

  Next, the control device 8 causes the detection unit 64 to execute detection processing. In this detection processing, the detection unit 64 captures the substrate 400 held by the suction table 633 of the third transport mechanism 63 from above the suction table 633, and analyzes the captured image to analyze the substrate 400. A positional shift of the substrate 400 in the rotation direction about the central axis penetrating in the vertical direction is detected.

  Subsequently, the control device 8 causes the correction mechanism 635 of the third transport mechanism 63 to perform correction processing. In this correction processing, the correction mechanism 635 is held by the suction table 633 by rotating the suction table 633 around the central axis that penetrates the suction table 633 in the vertical direction based on the detection processing result of the detection unit 64. The positional deviation of the substrate 400 is corrected.

  Next, as shown in FIG. 38, the moving mechanism 634 of the third transport mechanism 63 moves the stage 631 toward the first mounting position P2a, and the movement is performed when the stage 631 is positioned at the first mounting position P2a. Stop. Thus, the substrate 400 is transported by the third transport mechanism 63 along the third path R3 connecting the delivery position P6 and the first mounting position P2a. In addition, when a predetermined time has elapsed from the start of the third transport process, the control device 8 moves the suction unit 621 to a position near the delivery position P5 with respect to the second transport mechanism 62 as shown in the figure ( Return to the initial position).

  On the other hand, for example, the control device 8 starts the first mounting process 200 shown in FIG. 34 when a predetermined time has elapsed since the start of the first transport process. In the initial state, as shown in FIG. 26, the tip portion 515a of the suction holding portion 515 in the solder ball suction device 51 of the solder ball mounting device 5 faces the bottom side of the container body 514c in the storage container 514. (The tip 515a is facing downward). In the first mounting step 200, the control device 8 controls the moving mechanism 520a of the solder ball suction device 51a in the solder ball mounting device 5, and the suction head is placed at the arrangement position of the alignment plate 519a as shown in FIG. 511a is conveyed. At this time, as shown in FIG. 22, the suction surface 512c of the bottom wall 512b of the suction head 511a and the upper surface 519c of the alignment plate 519a come into contact with each other.

  Subsequently, the control device 8 causes the suction head 511a of the solder ball suction device 51a to perform suction processing and causes the supply unit 513a to perform supply processing and suction processing (step 201). Specifically, the control device 8 operates the intake device 518a of the solder ball suction device 51a. Thereby, the space 512a of the suction head 511a is in a negative pressure state, and intake from the intake port 512e is started. Further, intake from the intake path 515c in the suction holding unit 515 of the supply unit 513a and intake from the suction path 516a in the suction unit 516 of the supply unit 513a are started.

  Next, with the suction from the suction path 515 c in the suction holding unit 515, the solder ball 300 a housed in the housing container 514 of the supply unit 513 a is sucked and held by the tip portion 515 a of the suction holding unit 515. Subsequently, the control device 8 controls the drive mechanism 517 to rotate the intake pipe 515d attached to the proximal end portion 515b of the suction holding portion 515, thereby, as shown in FIG. 39, the proximal end portion 515b. The suction holding portion 515 is rotated around the center. At this time, the solder ball 300a held by the tip 515a is moved to the opening 514b side of the container 514 as the suction holding unit 515 rotates. Further, a part of the solder ball 300a moved to the opening 514b side is wiped off by the wiper 514d disposed on the opening 514b side. For this reason, the amount (number) of the solder balls 300a supplied to the suction head 511a is limited to an appropriate amount.

  Next, as shown in FIG. 40, the control device 8 is driven when the tip end portion 515a of the suction holding portion 515 faces the suction surface 512c of the suction head 511a (when the suction holding portion 515 rotates 180 °). The mechanism 517 is controlled to stop the rotation of the intake pipe 515d. Subsequently, the control device 8 controls the drive mechanism 517 so as to face the suction surface 512c (alignment plate 519a) of the suction head 511a (upward in the figure) as shown in FIG. 50 is moved to bring the tip 515a closer to one end of the alignment plate 519a (suction surface 512c). At this time, the solder ball 300a located on the alignment plate 519a side (upper part) of the solder balls 300a held by the tip 515a brought close to the alignment plate 519a is sucked into the suction head 511a. The suction force accompanying the suction from the port 512e is attracted to the suction head 511a against the suction force of the suction holding portion 515, and is supplied to the suction head 511a. Further, a part of the supplied solder ball 300a is attracted to the intake port 512e and is adsorbed to the edge of the intake port 512e on the adsorption surface 512c of the adsorption head 511a through each insertion hole 519e of the alignment plate 519a. The

  Next, the control device 8 controls the drive mechanism 517 to bring the main body 50 into the alignment plate 519a (suction surface 512c) in a state where the tip 515a is brought close to the alignment plate 519a as shown in FIG. Are moved toward the other end side (the right side in the figure) of the alignment plate 519a (in the direction indicated by the arrow in the figure). At this time, as described above, the solder balls 300a located on the alignment plate 519a side among the solder balls 300a held by the tip 515a are moved by the suction force of the suction head 511a. The suction head 511a is attracted to the suction head 511a against the suction force and supplied to the suction head 511a. A part of the suction head 511a passes through the insertion holes 519e of the alignment plate 519a and the edge of the suction port 512e on the suction surface 512c of the suction head 511a. Adsorbed to the part. In this way, the solder ball 300a held by the tip end portion 515a of the suction holding portion 515 is supplied to the suction head 511a gradually (while being dispersed) as the suction holding portion 515 moves. A part of the solder ball 300a is sucked one by one at the edge of each suction port 512e in the suction surface 512c of the suction head 511a.

  Here, since the solder ball 300a is minute as described above, the force with which the solder balls 300a are attracted to each other due to static electricity or intermolecular force is relatively large with respect to the weight of the solder ball. For this reason, the other excessive solder ball 300a adheres to the mounting target solder ball 300a adsorbed to the edge of the air inlet 512e. In this case, in this solder ball mounting device 5, as described above, the thickness L3a of the alignment plate 519a is defined to be about 80 μm, which is slightly thicker than the diameter L1a of the solder ball 300a, and the diameter L4a of the insertion hole 519e is It is defined to be about 90 μm, which is slightly larger than the diameter L1a of 300a. For this reason, only the solder ball 300a to be mounted is accommodated in the insertion hole 519e, and the excess solder ball 300a is partially (volume part) or entirely outside the lower surface 519d of the insertion hole 519e (lower side). ) Sticks in a protruding state. Further, in the solder ball mounting device 5, as described above, the solder balls 300a held at the tip portion 515a are supplied while being dispersed, so that excessive supply of the solder balls 300a is prevented and excessive solder is supplied. The adhesion of the balls 300a is suppressed to a small extent.

  Subsequently, the control device 8 controls the drive mechanism 517 to further move the main body 50 along the alignment plate 519a (in the direction indicated by the arrow in FIG. 43) as shown in FIG. At this time, as shown in the figure, the suction part 516 is moved next to the suction holding part 515, and excess solder balls 300 a are sucked by suction from the suction path 516 a in the suction part 516. For this reason, even if the solder balls 300a to be mounted and the excessive solder balls 300a attract each other strongly, all of the excessive solder balls 300a are forcibly separated from the solder balls 300a to be mounted and the suction head 511a or It is surely removed from the alignment plate 519a.

  Subsequently, the control device 8 controls the moving mechanism 520a to move the suction head 511a in the direction of the arrow shown in FIG. 44 so that the suction head 511a is separated from the alignment plate 519a. Let Next, the control device 8 controls the moving mechanism 520a to convey the suction head 511a above the position where the detection unit 52a is disposed. Subsequently, the control device 8 causes the detection unit 52 to execute a first detection process (step 202 of the first mounting step 200). In this case, the detection unit 52a captures the suction surface 512c side of the suction head 511a with a camera (not shown) and analyzes the image captured by the camera, whereby the solder ball 300a in the suction head 511a after the suction processing is performed. Detect excess or deficiency.

  Next, the control device 8 detects that the solder balls 300a are excessive in the first detection process (a plurality of solder balls 300a are adsorbed on the edge of one air inlet 512e (a double ball is generated)). Whether or not (step 203). In this case, when it is determined that an excess of the solder balls 300a is detected, the control device 8 controls the moving mechanism 520a to transport the suction head 511a to the arrangement position of the first removal unit 53a. Subsequently, the control device 8 controls the moving mechanism 520a so that the suction surface 512c of the suction head 511a is brought close to the upper surface 531a of the first removal unit 53a as shown in FIG. 29 along the upper surface 531a. The suction head 511a is moved. At this time, as shown in the figure, the solder ball 300a sucked by the suction head 511a is sucked by the suction air from the suction path 531b. As a result, a first removal process for removing all the solder balls 300a sucked by the suction head 511a from the suction head 511a is executed (step 204). Next, after executing the first removal process, the control device 8 controls the moving mechanism 520a to transport the suction head 511a to the arrangement position of the alignment plate 519a, and performs the above-described suction process, supply process, and suction process. The process is re-executed (step 201), and then the above-described steps 202 to 203 are executed.

  Next, when the controller 8 determines that the excess of the solder balls 300a is not detected in the above-described step 203, the shortage of the solder balls 300a is detected in the first detection process (the solder balls 300a are adsorbed on the edges). It is determined whether or not there is a non-existing inlet 512e (step 205). In this case, when it is determined that the shortage of the solder balls 300a has been detected, the control device 8 controls the moving mechanism 520a to convey the suction head 511a to the arrangement position of the alignment plate 519a, thereby performing the suction process described above. The supply process and the suction process are re-executed (step 201), and then the above-described steps 202 to 203 are executed.

  On the other hand, when the controller 8 determines that the excess of the solder balls 300a is not detected in the above-described step 203 and determines that the lack of the solder balls 300a is not detected in the above-described step 205 (that is, the solder balls 300a are excessive). If it is adsorbed by the adsorbing head 511a), the solder ball mounting apparatus 5 is caused to execute a first mounting process (mounting process) (step 206). In the first mounting process, the control device 8 controls the moving mechanism 520a to convey the suction head 511a holding the solder ball 300a to the first mounting position P2a, and then, as shown in FIG. The suction head 511a is moved toward the substrate 400 (in the direction of the arrow shown in the figure) so that the solder ball 300a sucked by the suction head 511a contacts the flux F applied to the terminal 401 of the substrate 400. .

  Subsequently, the control device 8 controls the intake device 518a to stop intake air from the intake port 512e in the suction head 511a. At this time, as shown in FIG. 46, the suction by the suction head 511a is released, and the solder ball 300a is placed on the flux F applied to the terminal 401 of the substrate 400. Thus, the first mounting process for mounting the solder balls 300a on the terminals 401 formed in the first region 400a of the substrate 400 is completed. In this case, in this solder ball mounting device 5, by performing the above-described supply processing, excessive supply of the solder balls 300a is prevented, and by performing the above-described suction processing, the excessive solder balls 300a are surely attached. Has been removed. For this reason, in this solder ball mounting apparatus 5, mounting of excessive solder balls 300a on the substrate 400 (that is, excessive mounting of the solder balls 300a on the substrate 400) is reliably prevented.

  Next, the control device 8 controls the moving mechanism 520a to move the suction head 511a upward (in the direction of the arrow shown in FIG. 46), as shown in FIG. Transport above position. Subsequently, the control device 8 causes the detection unit 52a to execute a second detection process (step 207). In this case, the detection unit 52 captures the suction surface 512c of the suction head 511a with a camera (not shown), and performs image analysis on the captured image by the camera, thereby attaching the adhering matter on the suction head 511a after the mounting process ( Specifically, the presence / absence of adhesion of only the flux F, adhesion of the flux F and the solder ball 300a, and adhesion of only the solder ball 300a) is detected.

  Next, the control device 8 determines whether or not the attachment of the flux F as an attachment (attachment of only the flux F or attachment of the flux F and the solder ball 300a) is detected in step 207 (second detection process). (Step 208). In this case, when it is determined that the adhesion of the flux F is detected, the control device 8 controls the moving mechanism 520a to convey the suction head 511a to the arrangement position of the second removal unit 54a. Subsequently, the removal member 543 is moved upward with respect to the second removal portion 54a so that the tip of the removal member 543 protrudes above the liquid surface of the removal liquid 541. Next, the control device 8 controls the moving mechanism 520a to bring the suction surface 512c of the suction head 511a into contact with the tip of the removal member 543 in the second removal portion 54a, as shown in FIG. 30, and the suction head 511a. Move. At this time, the flux F is melted by the removal liquid 541 contained in the tip of the removal member 543, and the deposits (flux F and solder balls 300a) attached to the suction head 511a are the tip of the removal member 543. Is wiped off. Thereby, the 2nd removal processing which removes flux F and solder ball 300a from adsorption head 511a is performed (Step 209). Subsequently, the control device 8 executes steps 207 and 208 described above.

  When it is determined in step 208 that the adhesion of the flux F is not detected, the control device 8 determines whether or not the adhesion of only the solder ball 300a is detected (step 210). In this case, when it is determined that the attachment of only the solder ball 300a as an attachment is detected (that is, when the solder ball 300a is detected as an attachment without detecting the flux F as the attachment), the control device 8 controls the moving mechanism 520a to transport the suction head 511a to the arrangement position of the first removal unit 53a and execute the first removal process (removal of the solder ball 300a from the suction head 511a) ( Step 211). Next, the control device 8 executes the above-described steps 207, 208, and 210. In this case, when it is determined in step 210 that adhesion of only the solder ball 300a is not detected, the control device 8 controls the moving mechanism 520a to convey the suction head 511a to the initial position. Thus, the first mounting process 200 is completed.

  In this case, in this solder ball mounting apparatus 5 (manufacturing apparatus 1), even if the solder balls 300a are excessively adsorbed in the adsorption process, the fact is detected by the first detection process, and the adsorbing process is performed based on the detection result. After all the solder balls 300a are removed, the adsorption process and the supply process are performed again. For this reason, in this solder ball mounting apparatus 5, excessive mounting of the solder balls 300a on the terminals 401 of the substrate 400 is surely prevented by performing the mounting process by the suction head 511a with the solder balls 300a being excessively sucked. Has been. Further, in this solder ball mounting device 5, even if there is a shortage in the solder balls 300a adsorbed in the adsorption process, the fact is detected by the first detection process, and the adsorption process and the supply process are performed based on the detection result. Will be re-executed. For this reason, in this solder ball mounting apparatus 5, the missing of the solder balls 300a due to the mounting process being performed by the suction head 511a lacking the attracted solder balls 300a is reliably prevented.

  Subsequently, as shown in FIG. 47, the moving mechanism 634 of the third transport mechanism 63 in the transport apparatus 6 moves the stage 631 toward the second mounting position P2b, and the stage 631 is positioned at the second mounting position P2b. Stop moving at that point.

  On the other hand, the control device 8 starts the second mounting process similar to the first mounting process 200 at the start of the first mounting process 200 or when a predetermined time has elapsed from the start of the first mounting process 200. In this second mounting step, the control device 8 controls the moving mechanism 520b to transport the suction head 511b to the arrangement position of the alignment plate 519b, and aligns with the suction surface 512c of the bottom wall 512b of the suction head 511b. The upper surface 519c of the plate 519b is brought into contact. Next, the control device 8 causes the suction head 511b to perform suction processing and causes the supply unit 513b to perform supply processing and suction processing. Subsequently, the control device 8 causes the detection unit 52b to execute the first detection process, and executes or re-executes (or does not execute) the first removal process, the adsorption process, the supply process, and the suction process according to the detection result. Execute). Next, the control device 8 causes the solder ball mounting device 5 to execute the second mounting process.

  In this second mounting process, the control device 8 controls the moving mechanism 520b to transport the suction head 511b holding the solder ball 300b to the second mounting position P2b, and subsequently, as shown in FIG. Then, the suction head 511b is moved toward the substrate 400 (in the direction of the arrow shown in the figure) so that the solder ball 300b sucked by the suction head 511b contacts the flux F applied to the terminal 401 of the substrate 400. Let

  Here, in this solder ball mounting apparatus 5, after the solder ball mounting apparatus 5 executes the first mounting process and then executes the second mounting process to mount the large diameter solder ball 300a, the small diameter solder ball 300b is mounted. Mount. That is, the solder ball mounting device 5 performs the movement process for the suction head 511a having a large diameter of the suction port 512e prior to the movement process for the suction head 511b having a small diameter of the suction port 512e. In this case, as shown in FIG. 48, since the recess 512g is formed in the suction head 511b, when the solder ball mounting device 5 performs the movement process in the above order, the mounted solder ball 300a (large diameter A situation in which the solder ball 300) and the suction surface 512c of the suction head 511b come into contact with each other is reliably avoided.

  Next, the control device 8 controls the intake device 518b to stop intake air from the intake port 512e in the suction head 511b. At this time, as shown in FIG. 49, the suction by the suction head 511 b is released and the solder ball 300 b is placed on the flux F applied to the terminal 401 of the substrate 400.

  Thus, the second mounting process for mounting the solder balls 300b on the terminals 401 formed in the second region 400b of the substrate 400 is completed, and the mounting of the solder balls 300 on all the terminals 401 is completed.

  Subsequently, the control device 8 controls the moving mechanism 520b to convey the suction head 511b above the position where the detection unit 52b is arranged, and causes the detection unit 52b to execute the second detection process, and the detection result Accordingly, after the second removal process or the first removal process is executed (or not executed), the moving mechanism 520b is controlled to transport the suction head 511b to the initial position. Thus, the second mounting process is completed.

  In this case, in the manufacturing apparatus 1 (manufacturing method), as described above, the transfer apparatus 6 executes the transfer process according to the instruction of the control apparatus 8 and supplies only the substrate 400 that is determined as non-defective in the electrical inspection to the supply position P3. Therefore, the solder ball 300 is mounted only by the solder ball mounting device 5 on the substrate 400 determined to be non-defective. Therefore, in this manufacturing apparatus 1, mounting of the solder balls 300 on the electrically defective substrate 400 is surely avoided, and wasteful consumption of the solder balls 300 is suppressed, so that the manufacturing cost can be sufficiently reduced. It has become.

  Next, the control device 8 controls the transport device 6 to transport the substrate 400 on which mounting of the solder balls 300a and 300b is completed to the melting device 7, and move the stage 631 from the second mounting position P2b to the delivery position P6. (Return to the initial position). Subsequently, the melting device 7 performs a reflow process (melting process) on the substrate 400 on which the solder balls 300a and 300b are mounted. At this time, as shown in FIG. 51, the solder balls 300a and 300b are hemispherical (solder 301 shown in the figure) and fixed to each terminal 401 of the substrate 400. Further, a ball grid array (BGA) is formed on the substrate 400 by the solder 301 fixed thereto. Thereby, as shown in the figure, the solder mounted substrate 600 is completed. Next, the solder-mounted substrate 600 is transferred to an electronic component mounting device (not shown), and then the electronic component 801 is mounted on the solder-mounted substrate 600 by the electronic component mounting device. Next, the solder ball 300 (solder 301) fixed to the terminal 401 of the board 400 in the solder-mounted board 600 is melted by, for example, reflow processing, so that the terminals outside the figure in the mounted electronic component 801 are melted. The solder balls 300 (solder 301) are connected to the terminals 401 of the substrate 400. Thereby, as shown in FIG. 58, the electronic component mounted substrate 800 is manufactured.

  On the other hand, the control device 8 causes the first transport mechanism 61 to start the first transport process for the next substrate 400 while the first mounting process and the second mounting process described above are being performed. The flux coating device 4 is caused to perform the coating process for the above. That is, in the manufacturing apparatus 1, the coating process can be performed in parallel with the mounting process. Therefore, the next substrate 400 is placed on the suction table 633 without the suction table 633 (stage 631) of the third transport mechanism 63 being kept on standby for a long time at the transfer position P6. In addition, when a predetermined time has elapsed from the start of the first transport process for the next substrate 400, the control device 8 performs the first mounting process and the second mounting process (suction process, supply process, and suction process) for the next substrate 400. ) Is started by the solder ball mounting device 5. Therefore, in the manufacturing apparatus 1, the suction process, the supply process, and the suction process are completed (or almost completed) before the next substrate 400 is transferred to the first mounting position P2a and the second mounting position P2b. Therefore, it is possible to shorten the time that the suction stand 633 of the third transport mechanism 63 waits at the first mounting position P2a and the second mounting position P2b. Accordingly, in the manufacturing apparatus 1, the processing time per substrate 400 can be sufficiently shortened, and as a result, productivity can be sufficiently improved.

  On the other hand, the control device 8 instructs the solder ball replenishment device 55 to execute the replenishment process when the predetermined number of times of mounting process has been completed (an example of “when a predetermined condition is satisfied”). In accordance with this, the solder ball replenishing device 55 executes replenishment processing. In this supply processing, the rotary actuator 556b of the rotation mechanism 556 in the solder ball supply device 55 rotates the rotation shaft 557c in the direction of the arrow E1 shown in FIG. At this time, the connecting portion 556c attached to the rotation shaft 557c, the connecting portion 556d connected to the connecting portion 556c, and the mounting portion 554 fixed to the upper end portion of the connecting portion 556d are in the direction of the arrow E1. Is rotated.

  Subsequently, as shown in FIG. 56, the rotary actuator 556b has an upper surface in which the supply port 554f (the edge portion 554b of the mounting portion 554) is positioned below the storage portion 555a (the edge portion 554c side) of the groove 555. The rotation of the rotation shaft 557c is stopped when 554a becomes the second posture inclined about 15 ° with respect to the horizontal direction. At this time, along with the inclination of the mounting portion 554, the solder ball 300 stored in the storage portion 555a of the groove 555 slides down the movement channel 555b. Next, the solder ball 300 sliding down the moving flow path 555 b falls downward from the supply port 554 f and is supplied into the storage part 514 a of the storage container 514 in the solder ball mounting device 5.

  In this case, in this solder ball replenishing device 55, an appropriate amount of solder balls 300 defined in advance is stored in the storage portion 555 a of the groove 555 in the standby state. For this reason, in this solder ball replenishing device 55, an appropriate amount of solder balls 300 can be mounted on the solder ball mounting device simply by rotating the mounting portion 554 and changing the posture of the mounting portion 554 from the first posture to the second posture. 5 is surely replenished into the accommodating portion 514a of the accommodating container 514. Further, in this solder ball replenishing device 55, as shown in FIGS. 52 and 56, when the mounting portion 554 is in the second posture, the end of the storage portion 555a that communicates with the discharge port 551c of the replenishing container 551. Since the portion is located below the U-shaped convex portion, the solder ball 300 discharged from the supply container 551 is formed by the end portion of the storage portion 555a and the spacer 553 closing the opening portion side of the groove 555. I can be dammed up. For this reason, it is possible to reliably prevent a situation in which the solder ball 300 other than the solder ball 300 stored in the storage portion 555a of the groove 555 travels on the surface of the mounting portion 554 and falls from other than the supply port 554f. ing.

  Subsequently, the rotary actuator 556b rotates the rotation shaft 557c in the direction of the arrow E2 shown in FIG. At this time, the connecting portion 556c attached to the rotation shaft 557c, the connecting portion 556d connected to the connecting portion 556c, and the mounting portion 554 fixed to the upper end portion of the connecting portion 556d are in the direction of the arrow E2. Is rotated. Next, in the rotary actuator 556b, the storage portion 555a (the edge portion 554c side) of the groove 555 is positioned below the supply port 554f (the edge portion 554b), and the upper surface 554a is inclined about 5 ° with respect to the horizontal direction. When the posture becomes one, the rotation of the rotation shaft 557c is stopped. As a result, the solder ball supply device 55 returns to the standby state. At this time, the solder ball 300 in the supply container 551 discharged from the discharge port 551c is accommodated in the groove 555 through the discharge hole 553a of the spacer 553 by returning to the standby state. In addition, as described above, the accommodated solder ball 300 is in a region extending from the end of the storage portion 555a communicating with the discharge port 551c to the U-shaped convex portion (the hatched region in FIG. 53). Only an appropriate amount is stored. Thus, the replenishment process by the solder ball replenishing device 55 is completed. Thereafter, the control device 8 instructs the solder ball replenishment device 55 to execute the replenishment process every time the specified number of mounting processes are completed, and the solder ball replenishment device 55 executes the replenishment process accordingly.

  Hereinafter, the control device 8 causes each device (each component) constituting the manufacturing device 1 to perform the above-described processes, thereby continuously mounting the solder balls 300a and 300b on the substrate 400. Then, by executing the reflow process on the substrate 400 on which the solder balls 300a and 300b are mounted, the solder mounted substrate 600 is continuously manufactured.

  As described above, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the solder ball 300 is attracted and held by the tip portion 515a of the suction holding portion 515, and the suction ball 300 is held by the tip portion 515a. Supply processing for supplying the solder balls 300 to the suction head 511 in a state in which the holding unit 515 and the suction surface 512c of the suction head 511 are relatively close to each other and sucked from the suction port 512e is executed. For this reason, according to this board | substrate manufacturing apparatus 1 and board | substrate manufacturing method with a solder mounting, the suitable quantity solder ball 300 can be supplied to the adsorption head 511 by hold | maintaining the suitable quantity solder ball 300 to the front-end | tip part 515a. Therefore, as a result of reliably preventing excessive supply of the solder balls 300, adhesion of the excessive solder balls 300 can be reduced. Therefore, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, only the solder ball 300 to be mounted can be held by the suction head 511, so that the excess solder ball 300 is mounted on the substrate 400, that is, Excessive mounting of the solder balls 300 on the substrate 400 can be reliably prevented.

  Further, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the suction portion 516 capable of sucking the solder ball 300 and the suction surface 512c of the suction head 511 are relatively close to each other and sucked to the edge of the air inlet 512e. A suction process for sucking and removing excess solder balls 300 excluding the solder balls 300 that have been performed is executed. For this reason, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, even if the solder balls 300 to be mounted and the excessive solder balls 300 are attracted to each other strongly due to static electricity or intermolecular force, By suction, all of the excess solder balls 300 can be forcibly separated from the mounting target solder balls 300 and reliably removed from the suction head 511. Therefore, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, only the solder balls 300 to be mounted can be more reliably held by the suction head 511, and therefore, the surplus solder balls 300 are attached to the substrate 400. Mounting, that is, excessive mounting of the solder balls 300 on the substrate 400 can be prevented more reliably.

  In addition, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the first detection process is performed after the suction process is performed, and the first removal process by the first removal unit 53 is performed based on the result of the first detection process. , Re-execution of the suction process by the suction head 511, and re-execution of the supply process by the supply unit 513. For this reason, even if the solder balls 300 are excessively adsorbed in the adsorption process, the adsorption process and the supply process are performed again after the adsorbed solder balls 300 are removed, and the solder balls 300 adsorbed in the adsorption process are re-executed. Even if there is a shortage, the adsorption process and the supply process are re-executed. Therefore, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the mounting process can be performed by the suction head 511 that sucks the solder balls 300 without excess or deficiency. It can be reliably mounted on 401 without excess or deficiency.

  Further, in this solder mounted substrate manufacturing apparatus 1 and substrate manufacturing method, the base portions 422a and 422b and the relative direction along the first direction of the base portion 422b with respect to the base portion 422a (the direction of arrow A shown in FIG. 4). A linear motion guide mechanism 423 that connects the base portions 422a and 422b to each other while allowing movement, and springs 424 and 424 that bias the base portions 422a and 422b away from each other, and has an axial length of the substrate Base portion 422b via a rotation shaft 426 arranged along the moving direction with respect to 400 (the direction of arrow C shown in FIGS. 11 to 13 and the direction of arrow D shown in FIGS. 11 and 14: the second direction). The substrate 400 is coated using the squeegee units 421a and 421b to which the squeegee (in this example, the base 425 and the squeegee main body 427) are attached. Executing a coating process spreadable flux F to the surface.

  Therefore, according to the solder mounted board manufacturing apparatus 1 and the board manufacturing method, when the base portion 425 and the squeegee body 427 (squeegee) are attached in an inclined state, the metal that presses the squeegee body 427 when applying the flux F. The squeegee unit 421 (the coating unit 42) is lowered by the coating mechanism 44 in any case where the mask 41 or the substrate 400 is tilted or the tip portion 427x is inclined due to polishing. As a result of the base portion 425 and the squeegee main body 427 (squeegee) rotating with respect to the base portion 422b about the rotation shaft 426 when the tip portion 427x of the squeegee main body 427 is brought into contact with the surface of the metal mask 41, All the width direction of the tip portion 427x in the squeegee body 427 It can be brought into contact with the metal mask 41. Further, when the squeegee unit 421 (application unit 42) is further lowered by the application mechanism 44, the spring 424 contracts and the base part 422b (base part 425 and squeegee body 427) with respect to the base part 422a (application mechanism 44). As a result, the tip 427x of the squeegee main body 427 attached to the base portion 422b can be pressed against the surface of the metal mask 41 with sufficient pressing force. Thereby, according to this board | substrate manufacturing apparatus 1 and board | substrate manufacturing method with solder mounting, the fixed position of the squeegee unit 421 with respect to the application | coating mechanism 44 is finely adjusted so that inclination may not arise in the base part 425 and the squeegee main body 427 (squeegee). As a result of not requiring complicated work, not only can the squeegee unit 421 be easily attached to the coating mechanism 44, but also the entire width direction of the tip portion 427 x can be applied to the surface of the metal mask 41 in the above various states. On the other hand, since the flux F can be spread while being pressed with a uniform pressing force, the flux F can be uniformly applied to the application region Pa of the substrate 400 without causing uneven application.

  Further, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, in the supply process, the suction holding portion 515 holding the solder ball 300 on the tip portion 515a and the suction surface 512c of the suction head 511 are relatively close to each other. In this state, at least one of the suction head 511 and the suction holding unit 515 is moved so that the suction holding unit 515 relatively moves along the suction surface 512c. For this reason, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the solder balls 300 held at the tip portion 515a of the suction holding unit 515 are gradually supplied while being dispersed as the suction holding unit 515 moves. Therefore, the excessive supply of the solder balls 300 can be more reliably prevented, so that the excessive adhesion of the solder balls 300 can be suppressed to a smaller extent. Therefore, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, it is possible to more reliably prevent the excessive mounting of the solder balls 300 on the substrate 400, that is, the excessive mounting of the solder balls 300 on the substrate 400. .

  Further, in this solder-mounted board manufacturing apparatus 1 and board manufacturing method, a moving process is performed for each of the plurality of suction heads 511 configured so that the diameters of the air inlets 512e that hold the solder balls 300 are different from each other. A plurality of types of solder balls 300 having different diameters L1 corresponding to the diameters of the respective intake ports 512e in the head 511 are mounted on one substrate 400. For this reason, according to this board | substrate manufacturing apparatus 1 and board | substrate manufacturing method with a solder mounting, the space | interval of the adjacent terminals 401 differs by area | region, or the thickness of the lead wire connected differs by area | region. A plurality of types of solder balls 300 having different diameters L1 (sizes) can be reliably mounted on the substrate 400.

  In addition, in this solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the groove 555 constituted by the storage portion 555a for storing the solder ball 300 and the movement channel 555b connecting the storage portion 555a and the supply port 554f is placed. The rotation mechanism 556 is formed in the portion 554 and maintains the mounting portion 554 in the first posture in which the storage portion 555a is positioned below the supply port 554f in the standby state, and supplies more than the storage portion 555a in the supply process. The solder ball replenishing device 55 that rotates the mounting portion 554 so that the mouth 554f is in the second posture positioned below is used to solder the container 514 of the solder ball suction device 51 in the solder ball mounting device 5. A supply process for supplying the ball 300 is executed. For this reason, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, an appropriate amount of solder balls defined in advance in the storage portion 555a of the groove 555 in the standby state without using the elaborately manufactured supply container 551. 300 can be stored, and in the replenishment process, the mounting portion 554 is rotated to change the posture of the mounting portion 554 from the first posture to the second posture. The solder ball 300 can be reliably supplied into the storage portion 514a of the storage container 514. Therefore, according to the solder-mounted board manufacturing apparatus 1 and the board manufacturing method, since the replenishing container 551 and the rotation mechanism 556 having a simple configuration can be used, the manufacturing cost of the solder-mounted board manufacturing apparatus 1 is sufficiently increased. Can be reduced.

  Further, in this solder-mounted board manufacturing apparatus 1 and board manufacturing method, a cutting process for cutting a multi-sided board 500 having a plurality of boards 400 and dividing the board 400 into each board 400 and an electrical inspection for each board 400 are predetermined. In this order, the solder balls 300 are mounted only on the substrate 400 that is determined to be non-defective in the electrical inspection. For this reason, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, it is possible to reliably avoid mounting the solder balls 300 on the electrically defective substrate 400, thereby wasteful consumption of the solder balls 300. As a result, the manufacturing cost can be sufficiently reduced.

  Further, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the tip end portion 515a of the suction holding portion 515 disposed on the opening 514b side of the storage container 514 is opposed to the bottom side of the container main body 514c in the storage container 514. Then, the solder ball 300 is sucked and held by the tip portion 515a, and the suction holding portion 515 is rotated so that the tip portion 515a faces the suction surface 512c of the suction head 511 when the supply process is executed. For this reason, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, an appropriate amount of solder balls 300 is reliably supplied to the suction head 511 with a simple configuration that merely rotates the suction holding unit 515. be able to.

  Further, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the supply process is executed using the storage container 514 and the suction holding unit 515 that are integrally formed. For this reason, according to this board | substrate manufacturing apparatus 1 and board | substrate manufacturing method with a solder mounting, these are separately moved using the some drive mechanism using the container 514 and the adsorption holding part 515 which were comprised separately. Compared with the configuration and the method, the single drive mechanism 517 can move them at a time. As a result, the solder ball suction devices 51a and 51b, the solder ball mounting device 5 and the solder mounted substrate manufacturing apparatus 1 can be easily configured. And the processing efficiency can be improved.

  Further, in the solder mounted board manufacturing apparatus 1 and the board manufacturing method, the supply process and the suction process are executed using the main body unit 50 in which the container 514, the suction holding unit 515, and the suction unit 516 are integrally formed. For this reason, according to this solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the container 514, the suction holding unit 515, and the suction unit 516, which are configured separately, are used, and the plurality of driving mechanisms are used. Compared with the structure and method of moving individually, the single drive mechanism 517 can move them at a time. As a result, the solder ball suction devices 51a and 51b, the solder ball mounting device 5, and the solder mounted substrate manufacturing apparatus 1 Can be configured easily and the processing efficiency can be improved.

  In the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the alignment plate 519 formed with the through hole 519e that communicates with the air inlet 512e and through which the solder ball 300 can pass is mounted on the suction head 511. The supply process and the suction process are performed. For this reason, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, it is possible to reliably supply the solder balls 300 one by one to each intake port 512e of the suction head 511 during the supply process.

  Moreover, in this solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the detection unit 52 executes the second detection process after the execution of the mounting process, and the control device 8 performs the second removal unit based on the result of the second detection process. The execution of the second removal process by 54 is controlled. For this reason, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the flux applied to the terminal 401 of the substrate 400 adheres to the suction head 511 when the mounting process is performed, or accompanies the adhesion of the flux. Even if the solder ball 300 adheres to the suction head 511, the flux and the solder ball 300 (adherent matter including at least one of both) can be reliably removed. It is possible to reliably prevent a situation in which the next process is hindered by the kimono.

  Further, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the detection unit 52 executes the second detection process after the execution of the mounting process, and the control device 8 performs the first removal unit based on the result of the second detection process. The execution of the first removal processing by 53 is controlled. Therefore, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, for example, when the solder ball 300 is not attached to the suction head 511 without the flux being attached after the mounting process is performed, the flux is Since the solder ball 300 can be removed by the first removal process faster than the second removal process to be removed, the processing time can be sufficiently shortened.

  Further, in this solder ball mounting device 5, a recess 512g is formed in the suction head 511b, and the solder ball mounting device 5 performs a moving process for the suction head 511a having a large diameter of the intake port 512e. Prior to the movement processing for 511b. For this reason, according to this solder ball mounting apparatus 5, it is possible to reliably avoid contact between the solder ball 300a already mounted on the substrate 400 and the suction head 511b. It is possible to reliably prevent the dropout.

  Further, according to the solder ball mounting device 5, the same number of moving mechanisms 520 as the number of suction heads 511 are provided, and each moving mechanism 520 moves each suction head 511 individually. Compared with the configuration in which the replacement is performed by one moving mechanism 520, the time required for the replacement can be shortened, so that the processing efficiency can be sufficiently improved.

  Further, in the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the storage portion 555a is formed in a U shape in a plan view, and the moving flow path 555b is formed in a linear shape in a plan view. For this reason, in this solder-mounted board manufacturing apparatus 1 and board manufacturing method, when the mounting portion 554 is in the first posture, the U-shaped convex portion of the storage portion 555a is positioned on the lower side. By connecting the outlet 551c of 551 to the end portion of the storage portion 555a, an appropriate amount of solder balls 300 can be reliably stored in a region extending from the end portion to the U-shaped convex portion. Further, when the mounting portion 554 is set to the second posture, the stored solder ball 300 can be slid down to the moving flow path 555b and reliably moved toward the supply port 554f. Further, when the mounting portion 554 is in the second posture, the end of the storage portion 555a communicating with the discharge port 551c of the replenishing container 551 is positioned below the U-shaped convex portion. The solder ball 300 discharged from the container 551 is blocked by the end portion of the storage portion 555a and the spacer 553 closing the opening side of the groove 555. As a result, the solder ball stored in the storage portion 555a of the groove 555 It is possible to reliably prevent a situation in which the solder balls 300 other than 300 travel along the surface of the mounting portion 554 and fall from other than the replenishing port 554f.

  Further, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the solder ball 300 stored in the supply container 551 is provided by providing the nitrogen gas supply unit 557 for supplying nitrogen gas into the supply container 551. Therefore, it is possible to reliably prevent a situation in which the solder balls 300 are fixed to each other and hardened and the replenishment process becomes difficult.

  Further, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, the control device 8 causes the solder ball replenishing device 55 to execute a replenishment process when a predetermined condition is satisfied, thereby preliminarily defining. For example, by executing the replenishment process when the mounting process is performed a predetermined number of times as the satisfied condition is satisfied, a situation where the number of solder balls 300 to be mounted on the substrate 400 is insufficient can be reliably prevented.

  In addition, according to the solder mounted board manufacturing apparatus 1 and the board manufacturing method, the base 425 is configured to be attached to the base 422b via the squeegee main body 427 and the rotation shaft 426 and to be removable from the squeegee main body 427. By performing the coating process using a squeegee provided with the squeegee body 427 (plate-shaped portion 427a), only the squeegee body 427 is removed from the coating mechanism 44 without removing the entire squeegee unit 421 during the polishing operation. It can be removed from 425 and operated. Further, when the squeegee main body 427 (plate-like portion 427a) is shortened due to multiple polishing, the base portions 422a, 422b, 14 and the like are continuously used by replacing only the squeegee main body 427 with new parts. Therefore, the running cost of the solder mounted substrate manufacturing apparatus 1 can be sufficiently reduced.

  Moreover, in this solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, an electrical inspection is performed after the cutting process is performed. For this reason, in this solder-mounted board manufacturing apparatus 1 and board manufacturing method, for example, even if the conductor pattern is disconnected or short-circuited due to vibration during the cutting process, the board 400 is reliably regarded as a defective product. Can be determined. Therefore, according to the solder mounted substrate manufacturing apparatus 1 and the substrate manufacturing method, wasteful consumption of the solder balls 300 due to the mounting of the solder balls 300 on the defective substrate 400 occurring during the manufacture of the multi-sided substrate 500 can be suppressed. In addition, the wasteful consumption of the solder ball 300 due to the mounting of the solder ball 300 on the defective substrate 400 caused by the cutting process can be surely suppressed, so that the manufacturing cost can be further reduced. it can.

  The solder-mounted board 600 is manufactured by the solder-mounted board manufacturing apparatus 1 or the board manufacturing method. For this reason, in this solder-mounted substrate 600, excessive mounting of the solder balls 300 on the substrate 400 is surely prevented. As a result, when the solder balls 300 are melted and fixed to the terminals 401 of the substrate 400, they are excessively mounted. A situation in which the solder balls 300 are connected to each other as they melt is avoided. Therefore, according to this solder-mounted substrate 600, when an electronic component is mounted, it is possible to reliably prevent the occurrence of a defect in which the terminals of the electronic component are short-circuited via the connected solder ball 300 (solder 301). Can do.

  In the electronic component mounted substrate 800, the electronic component 801 connected via the solder ball 300 (solder 301) fixed to the solder mounted substrate 600 is mounted on the solder mounted substrate 600. For this reason, in this electronic component mounted substrate 800, the situation where the excessively mounted solder balls 300 are prevented from being connected to each other as they melt is avoided. As a result, when the electronic component 801 is mounted (mounted), The occurrence of defects in which the terminals of the electronic component 801 are short-circuited via the solder ball 300 (solder 301) is reliably prevented. Therefore, according to this electronic component mounted substrate 800, it is possible to reliably prevent the occurrence of defects in products using this electronic component mounted substrate 800.

  In addition, a board | substrate manufacturing apparatus and a board | substrate manufacturing method are not limited to said example. For example, the configuration and method using the main body 50 in which the storage container 514, the suction holding unit 515, and the suction unit 516 are integrally described have been described above. However, the separate storage container 514, suction holding unit 515, and suction unit 516 are used. Thus, it is possible to adopt a configuration and a method for individually driving these. In addition, the storage container 514 and the suction holding unit 515 are integrally configured, and the suction unit 516 is configured separately. The storage container 514 and the suction holding unit 515 configured integrally, and the suction unit 516 configured separately. It is also possible to adopt a configuration and a method for individually driving the devices. In addition, the configuration and the method for executing the supply process and the suction process by moving the main body 50 with respect to the stationary suction head 511 have been described above. It is also possible to adopt a configuration and a method in which both the head 511 and the alignment plate 519) are moved to perform supply processing and suction processing. In addition, a configuration and a method in which both the suction head 511 and the main body 50 are moved to perform the supply process and the suction process can be employed. Further, when the storage container 514, the suction holding unit 515, and the suction unit 516 are separated, one or both of the storage container 514 and the suction holding unit 515 (that is, one or more of them) are moved to move the suction holding unit 515. After holding the solder ball 300, one or both of the suction head 511 and the container 514 (that is, one or both of them) are moved to perform supply processing, and one or both of the suction head 511 and the suction unit 516 are performed. It is possible to employ a configuration and method in which suction processing is performed by moving (that is, one or more of both). In addition, when the storage container 514 and the suction holding unit 515 are integrally configured (hereinafter, a configuration body of both is referred to as an “integrated configuration body”), and the suction portion 516 is configured separately, the suction head 511 and the integrated configuration body One or both of them (that is, one or more of them) is moved to perform supply processing, and one or both of the suction head 511 and the suction unit 516 (that is, one or more of both) are moved to perform suction processing. Configurations and methods can be employed.

  Further, the configuration and method for performing the suction process for sucking and removing the excess solder ball 300 using the suction unit 516 have been described above, but the configuration and method for not performing the suction process without the suction unit 516 are employed. You can also. Further, instead of the suction unit 516, a squeegee mechanism is provided that moves the squeegee along the suction surface 512c of the suction head 511 (or the lower surface 519d of the alignment plate 519), and the excess solder balls 300 are attached using this squeegee mechanism. It is also possible to employ a configuration and method for scraping and removing.

  In the supply process, the suction holding unit 515 that holds the solder ball 300 is moved along the suction surface 512c of the suction head 511 to supply the solder ball 300 to the suction head 511. The solder ball 300 is held by the suction holding portion 515 having the tip portion 515a formed in the same size as the suction surface 512c of the suction head 511, and the tip portion 515a of the suction holding portion 515 is held by the suction surface 512c of the suction head 511. It is also possible to adopt a configuration and method for supplying the solder ball 300 to the suction head 511 without moving the suction holding portion 515 along the suction surface 512c.

  Further, although the configuration and method using the alignment plate 519 have been described above, a configuration and method that does not use the alignment plate 519 may be employed. Further, instead of the configuration in which the solder ball 300 is placed on the solder flux applied to the surface of the substrate 400, the tip of the solder ball 300 adsorbed by the adsorption head 511 is immersed in the solder flux accommodated in the tray. It is also possible to adopt a configuration in which the solder ball 300 is placed on the substrate 400 to which the solder flux is not applied after the solder flux is attached to the portion.

  In addition, the example in which the flux applying device 4 that applies the flux to the terminal 401 of the substrate 400 is described above. However, the configuration includes the application unit that applies the flux to the tip of the solder ball 300 adsorbed by the adsorption head 511. It can also be adopted. In addition, although the example including the supply unit 513 including the suction unit 516 has been described above, the configuration of the supply unit 513 is not limited thereto, and for example, a configuration that does not include the suction unit 516 can be employed.

  In addition, the example in which the detection unit 52 executes both the first detection process and the second detection process has been described above. However, two detection units (first detection unit and second detection unit) that individually execute each detection process are provided. It is also possible to adopt a configuration provided. In addition, although the example in which the second removing unit 54 is configured to wipe off the flux adhering to the suction head 511 using the removing liquid 541 has been described above, a configuration in which the adhering flux is removed by suction may be employed. Further, the configuration and method of causing the first removal unit 53 to remove the solder ball 300 when only the solder ball 300 is attached to the suction head 511 after performing the mounting process (execution of the first removal process) is described above. However, even when the deposit is only the solder ball 300, a configuration and method in which the deposit (solder ball 300) is removed by the second removal unit 54 (execution of the second removal process) can be employed. .

  In addition, a configuration and method for mounting the small-sized solder ball 300b after performing the second mounting process after performing the first mounting process and mounting the large-diameter solder ball 300a, that is, suction with a large diameter of the intake port 512e. The configuration and method for performing the moving process for the head 511a prior to the moving process for the suction head 511b having a small diameter of the intake port 512e have been described above. However, after the second mounting process is performed, the first mounting process is performed and the small diameter solder is performed. The configuration and method of mounting the large-diameter solder ball 300a after mounting the ball 300b, that is, the moving process for the suction head 511b having a small diameter of the intake port 512e precedes the moving process for the suction head 511a having a large diameter of the intake port 512e. The configuration and method to be performed can also be employed. According to this configuration, for example, when the solder ball 300a is sufficiently larger than the solder ball 300b, the suction head 511a is not provided with a recess or notch as shown in FIG. Contact between the mounted solder ball 300b and the suction head 511a can be reliably avoided. For this reason, according to this configuration, it is possible to reliably prevent the mounted solder ball 300b from falling off due to contact with the suction head 511a by using the suction head 511a having a simple configuration that is not provided with a recess or notch. it can.

  In addition, the configuration example in which the two moving mechanisms 520a and 520b are provided and the moving mechanisms 520a and 520b individually move the suction heads 511a and 511b has been described above. However, the suction heads 511a and 511b are replaced manually or automatically. Thus, it is possible to adopt a configuration in which the suction heads 511a and 511b are moved by one moving mechanism 520.

  In addition, although an example in which two types of solder balls 300a and 300b having different diameters L1 are mounted on one substrate 400 has been described above, three different diameters of the intake port 512e (diameter L1 of the solder ball 300 to be held) are different from each other. A configuration in which the above-described suction head 511 is provided and three or more kinds of solder balls 300 having different diameters L1 are mounted on one substrate 400 may be employed.

  In addition, a mounting method (spherical body mounting method) in which a plurality of types of solder balls 300 having different diameters L1 are mounted on the substrate 400 using a plurality of solder ball mounting devices may be employed. In this spherical body mounting method, for example, when mounting the solder balls 300a and 300b described above on one substrate 400 using two solder ball mounting apparatuses, the suction head 511a is attached to one solder ball mounting apparatus. The solder ball 300a is mounted on the substrate 400 by executing the moving process used, and the solder ball 300b is mounted on the substrate 400 by executing the moving process using the suction head 511b for another solder ball mounting device. (In other words, a movement process is executed for each suction head 511 using two solder ball mounting devices). Also in this spherical body mounting method, the same effect as the mounting process by the solder ball mounting apparatus 5 can be realized.

  Further, the example of executing the process of moving the suction head 511 toward the substrate 400 as the movement process has been described above. However, the process of moving the substrate 400 toward the suction head 511 holding the solder ball 300 is referred to as the movement process. A configuration to be executed can also be adopted. Further, the example in which the concave portion 512g for avoiding contact with the mounted solder ball 300 is formed in the suction head 511 is described above. However, instead of the concave portion 512g, a notch is formed in the suction head 511. Therefore, it is possible to adopt a configuration in which contact with the mounted solder ball 300 is avoided. In this case, the cutout includes a cutout of a part of the outer peripheral portion of the suction head 511 and a hole penetrating in the thickness direction, and these may be arbitrarily selected according to the formation position of the terminal 401 of the substrate 400 and the like. Can be combined.

  Further, as an example when the control device 8 satisfies a pre-defined condition, an example in which the replenishment process is executed by the solder ball replenishment device 55 when the pre-defined number of mounting processes has been completed is described above. However, the inspection unit for detecting the mounting state of the solder ball 300 on the substrate 400 is provided, and when the mounting unit detects that the solder ball 300 is insufficiently mounted, the solder ball 300 is assumed to satisfy a predetermined condition. A configuration in which the supply device 55 executes supply processing may be employed. In addition, when the amount (remaining amount) of the solder balls 300 stored in the storage container 514 is detected by, for example, an optical sensor, and the amount is equal to or less than a predetermined amount (when a predetermined condition is satisfied) The configuration for executing the replenishment process can also be adopted. In addition, it is possible to adopt a configuration in which the replenishment process is executed at an arbitrary timing by operating the rotation mechanism 556 by manual operation to rotate the mounting portion 554.

  Further, the example in which the accommodating portion is configured by the groove 555 formed on the upper surface 554a of the mounting portion 554 has been described above. However, as illustrated in FIG. 57, the accommodating portion is configured by the hole 559 formed in the mounting portion 558. You can also. In addition, about the element which has the same function as said solder ball replenishment apparatus 55, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted. In this case, as shown in the figure, the hole 559 includes a storage portion 559a formed in a U shape in a side view and a movement channel 559b formed in a straight shape in a side view. Even in the configuration provided with the hole 559, the same effect as the configuration provided with the groove 555 described above can be realized.

  In addition, the example in which the mounting portion 554 formed in a rectangular plate shape has been described above, but the shape of the mounting portion 554 is not limited to this, and the shape of a cube or a rectangular parallelepiped, as well as a circular shape in a plan view, a half in a side view, and the like. Various three-dimensional shapes such as a circle (U-shape) and a side view triangle can be employed. Moreover, the material which forms the supply container 551 and the mounting part 554 is not limited to an above-described material, Arbitrary materials can be used.

  Moreover, although the example using nitrogen gas as an example of the antioxidant gas has been described above, the antioxidant gas is not limited to the nitrogen gas G, and various gases that can prevent the solder ball 300 from being oxidized, such as argon gas. Can be used.

  Further, although the flux applying apparatus 4 having two squeegees 421a and 421b has been described as an example, the flux applying apparatus can be configured by including only one squeegee unit 421. Specifically, as an example, when the flux F is applied only when the application unit 42 is moved in the direction of the arrow C in the above example (the flux is applied only by the squeegee unit 421a), the application unit described above is used. The squeegee unit 421b in 42 can be dispensed with. In addition, the flux applying apparatus can be configured by including three or more squeegee units 421. Even when these configurations are adopted, the same effects as those of the flux applying apparatus 4 including the squeegee units 421a and 421b can be obtained.

  Further, the flux applying device 4 employs a configuration in which two squeegee units 421a and 421b are attached to the application mechanism 44 (attachment portion 441) and the squeegee units 421a and 421b are simultaneously moved in the same direction. Alternatively, a moving mechanism for moving the squeegee unit 421a and a moving mechanism for moving the squeegee unit 421b may be provided separately to move both squeegee units 421a and 421b independently. Further, the above-described flux coating apparatus 4 adopts a configuration in which the coating unit 42 moves the coating unit 42 in the second direction with respect to the metal mask 41 and the substrate 400 to spread the flux F. The flux mask F is applied to the coating unit 42 (squeegee unit 421) fixed at the position (for example, the frame of the flux coating device) by moving the metal mask 41 and the substrate 400 in the second direction by the substrate transport mechanism 45, for example. An expanding configuration can also be adopted. Further, it is possible to adopt a configuration in which the coating unit 42 is moved in the second direction by the coating mechanism 44 and the metal mask 41 and the substrate 400 are moved in the second direction by the substrate transport mechanism 45 or the like to spread the flux F. . Even in these configurations, the same effects as those of the flux applying apparatus 4 can be obtained.

  Further, the squeegee units 421a and 421b provided with the spring 424 formed of a coil spring as an urging member have been described as an example. However, instead of the coil spring, various springs such as a leaf spring and an air spring, and an elastic The urging member may be configured by resin or the like.

  In addition, the method and the configuration for performing the electrical inspection on the substrate 400 after performing the cutting process of cutting the multi-sided substrate 500 and dividing it into the respective substrates 400 have been described above, but mounting is performed after the electrical inspection on the substrate 400 is performed. It is also possible to adopt a method and configuration in which processing is executed and then cutting processing is executed. Specifically, in this method and configuration, the inspection apparatus 3 performs an electrical inspection on each substrate 400 in the state of the multi-sided substrate 500 (each substrate 400 in an uncut state). Next, the solder ball mounting device 5 mounts the solder balls 300 on the respective substrates 400 in the state of the multi-sided substrate 500. In this case, the solder ball mounting device 5 sorts out the substrates 400 that are determined as non-defective products in the electrical inspection from the substrates 400 in the multi-sided substrate 500 in accordance with the instructions of the flux application device 4, and the non-defective substrates 400. Only the solder ball 300 is mounted. Subsequently, the solder balls 300 perform a reflow process on the mounted multi-sided substrate 500. Next, the cutting device 2 cuts the multi-sided substrate 500 and divides it into the respective substrates 400. Also in this mounting method and configuration, since the solder ball 300 is mounted only on the substrate 400 that has been determined to be non-defective in the electrical inspection, mounting of the solder ball 300 on the electrically defective substrate 400 can be reliably avoided. As a result, wasteful consumption of the solder balls 300 can be reliably suppressed, and the manufacturing cost can be sufficiently reduced.

  In addition, a method and a configuration in which a cutting process is performed after an electrical inspection on the substrate 400 is performed and then a mounting process is performed can be employed. Specifically, in this method and configuration, the inspection apparatus 3 performs an electrical inspection on each substrate 400 in the state of the multi-sided substrate 500 (each substrate 400 in an uncut state). Subsequently, the cutting device 2 cuts the multi-sided substrate 500 and divides it into the respective substrates 400. Next, the substrates 400 determined as non-defective products in the electrical inspection are selected from the cut substrates 400. Subsequently, the solder ball mounting device 5 mounts the solder ball 300 only on the substrate 400 selected as a non-defective product. Also in this mounting method and configuration, since the solder ball 300 is mounted only on the substrate 400 that has been determined to be non-defective in the electrical inspection, mounting of the solder ball 300 on the electrically defective substrate 400 can be reliably avoided. As a result, wasteful consumption of the solder balls 300 can be reliably suppressed, and the manufacturing cost can be sufficiently reduced.

DESCRIPTION OF SYMBOLS 1 Solder mounted board | substrate manufacturing apparatus 2 Cutting apparatus 3 Inspection apparatus 4 Flux application apparatus 5 Solder ball mounting apparatus 7 Melting apparatus 8 Control apparatus 41 Metal mask 44 Application | coating mechanism 51a, 51b Adsorption apparatus 52a, 52b Detection part 54a, 54b 2nd removal Portions 55a and 55b Solder ball supply devices 300a and 300b Solder balls 301 Solder 400 Substrate 411 Openings 421a and 421b Squeegee units 422a and 422b Base portions 423 Direct motion guide mechanisms 424 Spring 426 Rotating shaft 427 Squeegee body 500 Multi-sided substrate 511a, 511b Suction head 512c Suction surface 512e Inlet 513a, 513b Supply unit 514 Storage container 514b Opening 515 Suction holding unit 515a Tip 516 Suction unit 519a, 519b Alignment plate 520 , 520b Movement mechanism 551 Supply container 551c Discharge port 554 Placement part 554f Supply port 555 Groove 555a Storage part 555b Movement channel 556 Rotation mechanism 559 Hole 559a Storage part 559b Movement channel 600 Solder mounted substrate 800 Electronic component mounted substrate 801 Electronic component F Flux L1a, L1b Diameter Pa Application area

Claims (27)

A sphere having a sphere adsorbing device having an adsorption head that performs an adsorption process for adsorbing a sphere on the edge of the suction port formed on the adsorption surface and mounting the sphere adsorbed by the adsorption head on a substrate A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate with a body mounting device,
The spherical body adsorption device includes an accommodation container that has an opening and accommodates the spherical body, and an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodation container at a tip end portion thereof. The suction holding portion holding the spherical body at the tip portion and the suction head of the suction head are relatively close to each other, and the suction head is sucked from the suction port. A substrate manufacturing apparatus that performs supply processing for supplying a spherical body. A sphere having a sphere adsorbing device having an adsorption head that performs an adsorption process for adsorbing a sphere on the edge of the suction port formed on the adsorption surface and mounting the sphere adsorbed by the adsorption head on a substrate A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate with a body mounting device,
The spherical body adsorbing device includes an accommodating container that has an opening and accommodates the spherical body, an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodating container at a tip portion thereof, A suction part capable of sucking the spherical body, and sucking from the suction port with the suction holding part holding the spherical body at the tip part and the suction surface of the suction head relatively close to each other. The supply process of supplying the spherical body to the suction head in a state of being in the suction state is performed, and the suction portion and the suction surface of the suction head are relatively close to each other and sucked to the edge of the suction port A substrate manufacturing apparatus that performs a suction process of sucking and removing excess spherical bodies excluding the spherical bodies. A sphere having a sphere adsorbing device having an adsorption head that performs an adsorption process for adsorbing a sphere on the edge of the suction port formed on the adsorption surface and mounting the sphere adsorbed by the adsorption head on a substrate A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate with a body mounting device,
The spherical body adsorbing device includes an accommodating container that has an opening and accommodates the spherical body, an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodating container at a tip portion thereof, A suction part capable of sucking the spherical body, and sucking from the suction port with the suction holding part holding the spherical body at the tip part and the suction surface of the suction head relatively close to each other. The supply process of supplying the spherical body to the suction head in a state of being in the suction state is performed, and the suction portion and the suction surface of the suction head are relatively close to each other and sucked to the edge of the suction port Performing a suction process of sucking and removing the excess spherical body excluding the spherical body that is,
The spherical body mounting device includes a first detection unit that performs a first detection process for detecting excess or deficiency of the spherical body in the suction head after the suction process is performed, and the spherical body that is sucked by the suction head. A first removal unit that executes a first removal process for removing the body from the suction head, and a control unit,
The controller re-executes the adsorption process and the supply process after executing the first removal process when an excess of the spherical body is detected in the first detection process, and in the first detection process, The substrate manufacturing apparatus which re-executes the said adsorption | suction process and the said supply process when the shortage of the said spherical body is detected. A flux applying device that performs a coating process for applying flux to a substrate, and a spherical body suction device that has a suction head that performs a suction process for sucking a spherical body at the edge of an air inlet formed on the suction surface. A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate, comprising a spherical body mounting device that mounts the spherical body sucked by the suction head on the substrate after execution of the coating process,
The flux application device includes a squeegee unit having a squeegee for spreading the supplied flux on the application surface of the substrate, and a mask provided with an opening for exposing the application region of the flux on the application surface. At least one of the pressed substrate and the squeegee unit is moved in a first direction in which the substrate and the squeegee unit approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux on the application region by moving at least one of the substrate and the squeegee unit in the second direction along the application surface in the state;
The squeegee unit includes a first base portion and a second base portion, and the first base portion and the second base portion while allowing relative movement of the second base portion with respect to the first base portion along the first direction. A coupling mechanism that couples the second base parts to each other; and a biasing member that biases the first base part and the second base part in a direction separating them from each other, and an axial length in the second direction. The squeegee is configured to be attached to the second base portion via a rotation shaft disposed along the axis,
The spherical body adsorbing device includes an accommodating container that has an opening and accommodates the spherical body, an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodating container at a tip portion thereof, A suction part capable of sucking the spherical body, and sucking from the suction port with the suction holding part holding the spherical body at the tip part and the suction surface of the suction head relatively close to each other. The supply process of supplying the spherical body to the suction head in a state of being in the suction state is performed, and the suction portion and the suction surface of the suction head are relatively close to each other and sucked to the edge of the suction port A substrate manufacturing apparatus that performs a suction process of sucking and removing excess spherical bodies excluding the spherical bodies. A flux applying device that performs a coating process for applying flux to a substrate, and a spherical body suction device that has a suction head that performs a suction process for sucking a spherical body at the edge of an air inlet formed on the suction surface. A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate, comprising a spherical body mounting device that mounts the spherical body sucked by the suction head on the substrate after execution of the coating process,
The flux application device includes a squeegee unit having a squeegee for spreading the supplied flux on the application surface of the substrate, and a mask provided with an opening for exposing the application region of the flux on the application surface. At least one of the pressed substrate and the squeegee unit is moved in a first direction in which the substrate and the squeegee unit approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux on the application region by moving at least one of the substrate and the squeegee unit in the second direction along the application surface in the state;
The squeegee unit includes a first base portion and a second base portion, and the first base portion and the second base portion while allowing relative movement of the second base portion with respect to the first base portion along the first direction. A coupling mechanism that couples the second base parts to each other; and a biasing member that biases the first base part and the second base part in a direction separating them from each other, and an axial length in the second direction. The squeegee is configured to be attached to the second base portion via a rotation shaft disposed along the axis,
The spherical body adsorbing device includes an accommodating container that has an opening and accommodates the spherical body, an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodating container at a tip portion thereof, A suction part capable of sucking the spherical body, and sucking from the suction port with the suction holding part holding the spherical body at the tip part and the suction surface of the suction head relatively close to each other. The supply process of supplying the spherical body to the suction head in a state of being in the suction state is performed, and the suction portion and the suction surface of the suction head are relatively close to each other and sucked to the edge of the suction port Performing a suction process of sucking and removing the excess spherical body excluding the spherical body that is,
The spherical body mounting device includes a first detection unit that performs a first detection process for detecting excess or deficiency of the spherical body in the suction head after the suction process is performed, and the spherical body that is sucked by the suction head. A first removal unit that executes a first removal process for removing the body from the suction head, and a control unit,
The controller re-executes the adsorption process and the supply process after executing the first removal process when an excess of the spherical body is detected in the first detection process, and in the first detection process, The substrate manufacturing apparatus which re-executes the said adsorption | suction process and the said supply process when the shortage of the said spherical body is detected. A sphere having a sphere adsorbing device having an adsorption head that performs an adsorption process for adsorbing a sphere on the edge of the suction port formed on the adsorption surface and mounting the sphere adsorbed by the adsorption head on a substrate A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate with a body mounting device,
The spherical body adsorption device includes an accommodation container that has an opening and accommodates the spherical body, and an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodation container at a tip end portion thereof. The suction holding portion holding the spherical body at the tip portion and the suction head of the suction head are relatively close to each other, and the suction head is sucked from the suction port. Execute the supply process to supply the spherical body,
The spherical body mounting device includes a first detection unit that performs a first detection process for detecting excess or deficiency of the spherical body in the suction head after the suction process is performed, and the spherical body that is sucked by the suction head. A first removal unit that executes a first removal process for removing the body from the suction head, and a control unit,
The controller re-executes the adsorption process and the supply process after executing the first removal process when an excess of the spherical body is detected in the first detection process, and in the first detection process, The substrate manufacturing apparatus which re-executes the said adsorption | suction process and the said supply process when the shortage of the said spherical body is detected. A flux applying device that performs a coating process for applying flux to a substrate, and a spherical body suction device that has a suction head that performs a suction process for sucking a spherical body at the edge of an air inlet formed on the suction surface. A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate, comprising a spherical body mounting device that mounts the spherical body sucked by the suction head on the substrate after execution of the coating process,
The flux application device includes a squeegee unit having a squeegee for spreading the supplied flux on the application surface of the substrate, and a mask provided with an opening for exposing the application region of the flux on the application surface. At least one of the pressed substrate and the squeegee unit is moved in a first direction in which the substrate and the squeegee unit approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux on the application region by moving at least one of the substrate and the squeegee unit in the second direction along the application surface in the state;
The squeegee unit includes a first base portion and a second base portion, and the first base portion and the second base portion while allowing relative movement of the second base portion with respect to the first base portion along the first direction. A coupling mechanism that couples the second base parts to each other; and a biasing member that biases the first base part and the second base part in a direction separating them from each other, and an axial length in the second direction. The squeegee is configured to be attached to the second base portion via a rotation shaft disposed along the axis,
The spherical body adsorption device includes an accommodation container that has an opening and accommodates the spherical body, and an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodation container at a tip end portion thereof. The suction holding portion holding the spherical body at the tip portion and the suction head of the suction head are relatively close to each other, and the suction head is sucked from the suction port. Execute the supply process to supply the spherical body,
The spherical body mounting device includes a first detection unit that performs a first detection process for detecting excess or deficiency of the spherical body in the suction head after the suction process is performed, and the spherical body that is sucked by the suction head. A first removal unit that executes a first removal process for removing the body from the suction head, and a control unit,
The controller re-executes the adsorption process and the supply process after executing the first removal process when an excess of the spherical body is detected in the first detection process, and in the first detection process, The substrate manufacturing apparatus which re-executes the said adsorption | suction process and the said supply process when the shortage of the said spherical body is detected. A flux applying device that performs a coating process for applying flux to a substrate, and a spherical body suction device that has a suction head that performs a suction process for sucking a spherical body at the edge of an air inlet formed on the suction surface. A substrate manufacturing apparatus for manufacturing a spherical body mounted substrate, comprising a spherical body mounting device that mounts the spherical body sucked by the suction head on the substrate after execution of the coating process,
The flux application device includes a squeegee unit having a squeegee for spreading the supplied flux on the application surface of the substrate, and a mask provided with an opening for exposing the application region of the flux on the application surface. At least one of the pressed substrate and the squeegee unit is moved in a first direction in which the substrate and the squeegee unit approach each other, and the front end of the squeegee that is linear in plan view is pressed against the surface of the mask. An application mechanism that spreads the flux on the application region by moving at least one of the substrate and the squeegee unit in the second direction along the application surface in the state;
The squeegee unit includes a first base portion and a second base portion, and the first base portion and the second base portion while allowing relative movement of the second base portion with respect to the first base portion along the first direction. A coupling mechanism that couples the second base parts to each other; and a biasing member that biases the first base part and the second base part in a direction separating them from each other, and an axial length in the second direction. The squeegee is configured to be attached to the second base portion via a rotation shaft disposed along the axis,
The spherical body adsorption device includes an accommodation container that has an opening and accommodates the spherical body, and an adsorption holding unit that adsorbs and holds the spherical body accommodated in the accommodation container at a tip end portion thereof. The suction holding portion holding the spherical body at the tip portion and the suction head of the suction head are relatively close to each other, and the suction head is sucked from the suction port. A substrate manufacturing apparatus that performs supply processing for supplying a spherical body. The spherical body adsorption device includes a moving mechanism,
In the supply process, the moving mechanism is configured so that the suction holding unit holds the spherical body at the tip and the suction surface of the suction head is relatively close to the suction holding unit. The substrate manufacturing apparatus according to claim 1, wherein at least one of the suction head and the suction holding unit is moved so as to relatively move along the suction surface. The spherical body mounting device includes a plurality of the suction heads, and performs a moving process for moving either the suction head or the substrate toward the other, and is held by the suction head. A mounting portion for mounting the body on the substrate;
Each of the suction heads is configured such that the diameter of the suction port corresponds to the diameter of the spherical body and is different from each other for each of the suction heads,
The mounting portion executes the movement process for each of the suction heads, so that the plurality of types of the spherical bodies having different diameters corresponding to the diameters of the suction ports of the suction heads are combined into one substrate. The board | substrate manufacturing apparatus in any one of Claim 1 to 9 mounted with respect to. The spherical body mounting device includes a spherical body replenishing device that performs a replenishment process for replenishing the spherical body to the storage container,
The spherical body replenishing device stores the spherical body and a replenishing container in which a discharge port for discharging the stored spherical body is formed, and the replenishing container in a state in which the discharge port faces downward. In addition, the mounting portion is formed so as to be capable of changing the inclination angle of the mounting portion, and a mounting portion formed with a receiving portion that can communicate with the discharge port and store the spherical body in the mounting state. A rotating mechanism to move,
The storage unit stores the spherical body discharged from the discharge port of the supply container, and a supply port that is formed at an edge of the mounting unit and drops the spherical body from the mounting unit. And a moving flow path connecting the storage portions,
The rotating mechanism maintains the placement unit in a first posture in which the storage unit is positioned below the supply port in a standby state, and the supply port is more than the storage unit during the supply process. The board | substrate manufacturing apparatus in any one of Claim 1 to 10 which rotates the said mounting part so that it may become a 2nd attitude | position located in a lower side. A cutting device that performs a cutting process of cutting a multi-sided substrate having a plurality of substrates mounted thereon and dividing the substrate into the substrates, and an inspection device that performs an electrical inspection on the divided substrates;
The said spherical body mounting apparatus is a board | substrate manufacturing apparatus in any one of Claim 1 to 11 which mounts the said spherical body only on the said board | substrate discriminate | determined by the said electrical test | inspection. Mounts the spherical body sucked by the suction head on the substrate by causing the suction head to perform a suction process for sucking the spherical body to the edge of the suction port formed on the suction surface of the suction head. A substrate manufacturing method for manufacturing a finished substrate,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A substrate manufacturing method for performing a supply process of supplying the spherical body to the suction head in a state of sucking from the suction port with a holding unit and the suction surface of the suction head relatively close to each other. Mounts the spherical body sucked by the suction head on the substrate by causing the suction head to perform a suction process for sucking the spherical body to the edge of the suction port formed on the suction surface of the suction head. A substrate manufacturing method for manufacturing a finished substrate,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A supply process for supplying the spherical body to the suction head in a state of sucking from the suction port with the holding unit and the suction surface of the suction head relatively close to each other is executed, and the spherical body Suction that removes the excess spherical body excluding the spherical body that is adsorbed to the edge of the intake port by relatively bringing the suction portion capable of sucking the suction head and the suction surface of the suction head relatively close to each other A substrate manufacturing method for performing processing. Mounts the spherical body sucked by the suction head on the substrate by causing the suction head to perform a suction process for sucking the spherical body to the edge of the suction port formed on the suction surface of the suction head. A substrate manufacturing method for manufacturing a finished substrate,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A supply process for supplying the spherical body to the suction head in a state of sucking from the suction port with the holding unit and the suction surface of the suction head relatively close to each other is executed, and the spherical body Suction that removes the excess spherical body excluding the spherical body that is adsorbed to the edge of the intake port by relatively bringing the suction portion capable of sucking the suction head and the suction surface of the suction head relatively close to each other Execute the process,
After the suction process is executed, a first detection process is performed to detect the excess or deficiency of the spherical bodies in the suction head, and when the excess of the spherical bodies is detected in the first detection process, the suction heads are attracted. The suction process and the supply process are re-executed after executing the first removal process for removing the spherical body from the suction head, and the suction is performed when the shortage of the spherical body is detected in the first detection process. A substrate manufacturing method for re-executing the process and the supply process. An application process for applying a flux to the substrate is executed, and an adsorption process for adsorbing a spherical body to the edge of the suction port formed on the adsorption surface of the adsorption head is executed by the adsorption head to be adsorbed by the adsorption head. A substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting the spherical body on the substrate after execution of the coating process,
The squeegee unit having a squeegee that spreads the supplied flux on the application surface of the substrate, and the substrate provided with a mask provided with an opening for exposing the application region of the flux on the application surface. Is moved in a first direction in which the substrate and the squeegee unit approach each other, and a straight tip portion of the squeegee in plan view is pressed against the surface of the mask, and the substrate and the squeegee unit are in that state. At least one of the first base portion and the second base portion, and the first base portion with respect to the first base portion. The first base portion and the second base portion while allowing relative movement of the two base portions along the first direction. A coupling mechanism that couples the two base parts to each other; and a biasing member that biases the first base part and the second base part in a direction that separates them from each other; Using the squeegee unit configured to be attached to the second base portion via a rotating shaft arranged in the manner described above,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A supply process for supplying the spherical body to the suction head in a state of sucking from the suction port with the holding unit and the suction surface of the suction head relatively close to each other is executed, and the spherical body Suction that removes the excess spherical body excluding the spherical body that is adsorbed to the edge of the intake port by relatively bringing the suction portion capable of sucking the suction head and the suction surface of the suction head relatively close to each other A substrate manufacturing method for performing processing. An application process for applying a flux to the substrate is executed, and an adsorption process for adsorbing a spherical body to the edge of the suction port formed on the adsorption surface of the adsorption head is executed by the adsorption head to be adsorbed by the adsorption head. A substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting the spherical body on the substrate after execution of the coating process,
The squeegee unit having a squeegee that spreads the supplied flux on the application surface of the substrate, and the substrate provided with a mask provided with an opening for exposing the application region of the flux on the application surface. Is moved in a first direction in which the substrate and the squeegee unit approach each other, and a straight tip portion of the squeegee in plan view is pressed against the surface of the mask, and the substrate and the squeegee unit are in that state. At least one of the first base portion and the second base portion, and the first base portion with respect to the first base portion. The first base portion and the second base portion while allowing relative movement of the two base portions along the first direction. A coupling mechanism that couples the two base parts to each other; and a biasing member that biases the first base part and the second base part in a direction that separates them from each other; Using the squeegee unit configured to be attached to the second base portion via a rotating shaft arranged in the manner described above,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A supply process for supplying the spherical body to the suction head in a state of sucking from the suction port with the holding unit and the suction surface of the suction head relatively close to each other is executed, and the spherical body Suction that removes the excess spherical body excluding the spherical body that is adsorbed to the edge of the intake port by relatively bringing the suction portion capable of sucking the suction head and the suction surface of the suction head relatively close to each other Execute the process,
After the suction process is executed, a first detection process is performed to detect the excess or deficiency of the spherical bodies in the suction head, and when the excess of the spherical bodies is detected in the first detection process, the suction heads are attracted. The suction process and the supply process are re-executed after executing the first removal process for removing the spherical body from the suction head, and the suction is performed when the shortage of the spherical body is detected in the first detection process. A substrate manufacturing method for re-executing the process and the supply process. Mounts the spherical body sucked by the suction head on the substrate by causing the suction head to perform a suction process for sucking the spherical body to the edge of the suction port formed on the suction surface of the suction head. A substrate manufacturing method for manufacturing a finished substrate,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A supply process for supplying the spherical body to the suction head in a state of sucking from the suction port with the holding unit and the suction surface of the suction head relatively close to each other;
After the suction process is executed, a first detection process is performed to detect the excess or deficiency of the spherical bodies in the suction head, and when the excess of the spherical bodies is detected in the first detection process, the suction heads are attracted. The suction process and the supply process are re-executed after executing the first removal process for removing the spherical body from the suction head, and the suction is performed when the shortage of the spherical body is detected in the first detection process. A substrate manufacturing method for re-executing the process and the supply process. An application process for applying a flux to the substrate is executed, and an adsorption process for adsorbing a spherical body to the edge of the suction port formed on the adsorption surface of the adsorption head is executed by the adsorption head to be adsorbed by the adsorption head. A substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting the spherical body on the substrate after execution of the coating process,
The squeegee unit having a squeegee that spreads the supplied flux on the application surface of the substrate, and the substrate provided with a mask provided with an opening for exposing the application region of the flux on the application surface. Is moved in a first direction in which the substrate and the squeegee unit approach each other, and a straight tip portion of the squeegee in plan view is pressed against the surface of the mask, and the substrate and the squeegee unit are in that state. At least one of the first base portion and the second base portion, and the first base portion with respect to the first base portion. The first base portion and the second base portion while allowing relative movement of the two base portions along the first direction. A coupling mechanism that couples the two base parts to each other; and a biasing member that biases the first base part and the second base part in a direction that separates them from each other; Using the squeegee unit configured to be attached to the second base portion via a rotating shaft arranged in the manner described above,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A supply process for supplying the spherical body to the suction head in a state of sucking from the suction port with the holding unit and the suction surface of the suction head relatively close to each other;
After the suction process is executed, a first detection process is performed to detect the excess or deficiency of the spherical bodies in the suction head, and when the excess of the spherical bodies is detected in the first detection process, the suction heads are attracted. The suction process and the supply process are re-executed after executing the first removal process for removing the spherical body from the suction head, and the suction is performed when the shortage of the spherical body is detected in the first detection process. A substrate manufacturing method for re-executing the process and the supply process. An application process for applying a flux to the substrate is executed, and an adsorption process for adsorbing a spherical body to the edge of the suction port formed on the adsorption surface of the adsorption head is executed by the adsorption head to be adsorbed by the adsorption head. A substrate manufacturing method for manufacturing a spherical body mounted substrate by mounting the spherical body on the substrate after execution of the coating process,
The squeegee unit having a squeegee that spreads the supplied flux on the application surface of the substrate, and the substrate provided with a mask provided with an opening for exposing the application region of the flux on the application surface. Is moved in a first direction in which the substrate and the squeegee unit approach each other, and a straight tip portion of the squeegee in plan view is pressed against the surface of the mask, and the substrate and the squeegee unit are in that state. At least one of the first base portion and the second base portion, and the first base portion with respect to the first base portion. The first base portion and the second base portion while allowing relative movement of the two base portions along the first direction. A coupling mechanism that couples the two base parts to each other; and a biasing member that biases the first base part and the second base part in a direction that separates them from each other; Using the squeegee unit configured to be attached to the second base portion via a rotating shaft arranged in the manner described above,
At the time of performing the adsorption process, the spherical body accommodated in a container having an opening is adsorbed and held at the tip portion of the suction holding portion, and the spherical body is held at the tip portion. A substrate manufacturing method for performing a supply process of supplying the spherical body to the suction head in a state of sucking from the suction port with a holding unit and the suction surface of the suction head relatively close to each other.   In the supply process, the suction holding unit is positioned along the suction surface in a state where the suction holding unit holding the spherical body at the tip and the suction surface of the suction head are relatively close to each other. 21. The substrate manufacturing method according to claim 13, wherein at least one of the suction head and the suction holding portion is moved so as to move relatively. When mounting the spherical body held by the suction head by performing a moving process for moving either the suction head or the substrate toward the other,
The moving process is performed for each of the plurality of suction heads having different diameters of the air inlets corresponding to the diameter of the spherical body, and a plurality of types of the different diameters corresponding to the diameters of the respective air intakes are used. The method for manufacturing a substrate according to claim 13, wherein a spherical body is mounted on one of the substrates. When performing a replenishment process for replenishing the spherical body to the storage container,
The replenishing container in which a discharge port for discharging the spherical body stored and the spherical body is formed, and the replenishment container in a state in which the discharge port is faced down are mounted and in the mounted state A mounting portion formed with a receiving portion communicating with the discharge port and capable of storing the spherical body, and a rotation mechanism for rotating the mounting portion so that the inclination angle of the mounting portion can be changed. And the storage portion is formed at a storage portion for storing the spherical body discharged from the discharge port of the replenishing container and an edge portion of the placement portion, and drops the spherical body from the placement portion. The revolving port is configured to include a replenishing port and a moving flow path that connects the reserving unit, and the rotating mechanism includes the mounting unit in a first posture in which the reserving unit is positioned below the replenishing port in a standby state. And maintaining the replenishment port during the replenishment process. Substrate manufacturing method according to any one of claims 13 22 using the spherical body supply device for rotating the placing part such that the second position is located below the engaging portion.   The substrate that has been determined to be non-defective in the electrical inspection by performing a cutting process for cutting the multi-sided substrate with a plurality of the substrates and dividing the substrate into the substrates, and performing an electrical inspection on the divided substrates. The substrate manufacturing method according to claim 13, wherein the spherical body is mounted only on the substrate.   A spherical body mounted substrate manufactured by the substrate manufacturing apparatus according to claim 1.   A spherical body mounted substrate manufactured by the substrate manufacturing method according to claim 13.   27. An electronic component mounted substrate, wherein an electronic component connected via the spherical body fixed to the spherical body mounted substrate according to claim 25 or 26 is mounted on the spherical body mounted substrate.

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