TWI732284B - Transfer apparatus and transfer method for transferring light emitting diode chip - Google Patents

Abstract

A transfer apparatus for transferring a plurality of light emitting diode chips, comprising a stage on which a first substrate having the plurality of light emitting diode chips mounted on one surface is placed, a work table on which a second substrate to which the plurality of light emitting diode chips are to be transferred is placed, and a push pin module for transferring the plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate in a state that one surface of the first substrate and the second substrate are disposed to face each other, wherein the push pin module includes a plurality of push pin units each including a push pin for pushing the other surface of the first substrate, and the push pin module transfers the plurality of light emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate at a time.

Description

Conveying device and conveying method for conveying light-emitting diode chip

The invention relates to a conveying device and a conveying method for conveying light-emitting diode wafers.

Generally speaking, a light emitting diode chip is a circuit of each chip is processed on a wafer, and then separated into a plurality of individual chips by dicing. These light-emitting diode chips will receive transfer procedures and module procedures on several packages.

According to different purposes, in this transfer process, in order to divide the wafers into good or defective products, adjust the chip spacing, or control the direction of the wafer, the wafer will be transferred to the conveyor or substrate, or for the purpose of mounting the chip, the wafer will be Is transferred to the circuit board.

In the conventional transfer device (ie, picking and placing device), each light-emitting diode chip is picked and placed on a substrate, and each light-emitting diode chip is transferred to the substrate. Korean Patent Publication No. 2016-0008187 discloses related wafer transfer devices and wafer transfer methods.

At the same time, extremely small light emitting diode chips (eg, micro LEDs) with a chip size of about 5 to 300 μm have recently attracted attention and can become the next-generation display device. This extremely small-sized light-emitting diode chip can be used in light application fields that require low power consumption, small size, and light weight, and therefore, relevant research and development are actively carried out.

In the conventional picking and placing conveyor device and method, a collet with a hole can generate a vacuum to suck the light-emitting diode (LED) chip during the picking stage, and blow air in the center to break the vacuum. The sucked wafer is placed in the placement stage. However, when the hole of the collet has a size of several micrometers (μm), due to the channel resistance of the hole of the collet, it is impossible to ensure a vacuum sufficient to pick the light-emitting diode chips and a pressure sufficient to break the vacuum.

When the size of the light-emitting diode chip is reduced to a few microns, it is difficult to use the conventional picking and placement method to transfer the light-emitting diode chip.

The present invention has solved the above-mentioned problems by arranging a surface of a first substrate (including a substrate such as a mounting tape, a wafer or the like) and a second substrate (including a conveyor belt, a substrate, or a circuit board) to face each other Push the other surface of the first substrate in the right state, where the first substrate is mounted with a light-emitting diode chip, and the light-emitting diode chip will be transferred to the second substrate to transfer the light-emitting diode chip to the conveyor belt The transmission device and transmission method. At the same time, the technical problem to be solved by this embodiment is not limited to the above problem, and may also include other technical problems.

In order to solve the above-mentioned problems, an embodiment of the present invention provides a transfer device for transferring light-emitting diode chips, including a platform on which a first substrate is placed, and the first substrate has the light-emitting diode mounted on a surface. A diode chip; a worktable on which a second substrate is placed, and the light-emitting diode chip will be transferred to the second substrate; and a push pin module on the surface of the first substrate and the The second substrate is configured to face each other by pushing a portion corresponding to the light emitting diode chip from the other surface of the first substrate to transfer the light emitting diode chip to the second substrate, wherein The push pin module includes a pressure control unit to maintain the pressure between the light emitting diode chip and the second substrate at a predetermined pressure.

Another embodiment of the present invention provides a conveying device for conveying a plurality of light-emitting diode chips, including a platform on which a first substrate is placed, and the first substrate has the plurality of light-emitting diodes mounted on a surface A diode chip; a workbench on which a second substrate is placed, and the plurality of light-emitting diode chips will be transferred to the second substrate; and a push pin module on the surface of the first substrate The plurality of light-emitting diode chips are transferred to the second substrate by pushing the other surface of the first substrate in a state where they are arranged to face each other, wherein the pushing pin module includes a plurality of Push pin units, each push pin unit includes a push pin for pushing the other surface of the first substrate, and the push pin module will correspond to the plurality of light emitting pins of each push pin of the plurality of push pin units The diode chip is transferred to the second substrate at a time.

Another embodiment of the present invention provides a conveying device for conveying a plurality of light-emitting diode chips, comprising: a platform on which a first substrate is placed, and the first substrate has the light-emitting diodes mounted on a surface Diode chip; workbench, on which a second substrate is placed, the light emitting diode chips will be transferred to the second substrate; and push pin module, on the surface of the first substrate and The second substrate is configured to face each other by pushing the other surface of the first substrate to transfer the light-emitting diode chips to the second substrate, wherein the platform includes a main actuator to control The movement of the platform to the standby position and the auxiliary actuator control the movement of the platform between the light-emitting diode chips.

Another embodiment of the present invention provides a method for transferring a light-emitting diode chip, including: preparing a first substrate having the light-emitting diode chip mounted on a surface; preparing a second substrate, the The light emitting diode chip will be transferred to the second substrate; and correspondingly by pushing from the other surface of the first substrate in a state where the surface of the first substrate and the second substrate are arranged to face each other To the part of the light-emitting diode chip to transfer the light-emitting diode chip to the second substrate, wherein the transfer of the light-emitting diode chip to the second substrate includes the light-emitting diode chip and the second substrate. The pressure between the substrates is maintained at a predetermined pressure.

Another embodiment of the present invention provides a method for transferring a plurality of light-emitting diode chips, including: preparing a first substrate having a plurality of light-emitting diode chips mounted on a surface; preparing a second substrate Substrate, the plurality of light-emitting diode chips will be transferred to the second substrate; and in a state where the surface of the first substrate and the second substrate are arranged to face each other by pushing the first substrate The other surface is used to transfer the plurality of light-emitting diode chips to the second substrate, wherein the transfer of the plurality of light-emitting diode chips to the second substrate includes a step corresponding to each push pin of the plurality of push pins A plurality of light-emitting diode chips are transferred to the second substrate at a time.

The above embodiments are only examples, and it should be understood that they should not be construed as limiting the present invention. In addition to the above-mentioned embodiments, additional embodiments are described in the specification.

Hereinafter, the embodiments of the present invention will be described in detail so that those with ordinary knowledge in the related fields of the present invention can easily implement it. However, the present invention can be modified in various ways and is not limited to the examples provided in this specification. Further, in the drawings, parts irrelevant to the description will be omitted to clearly describe the present invention, and throughout this specification, similar reference numerals will be used to describe similar parts.

Throughout this manual, the situation where any part is "connected" to other parts includes the situation where these parts are "directly connected" to each other and the situation where these parts are "electrically connected" with other components in between. Further, unless expressly stated otherwise, "comprises" any component implicitly includes other elements, rather than excluding any other elements, and should be understood as not excluding one or more other functions, quantities, steps, operations, components, components The existence or additional possibility of its combination.

In this manual, "components" include units implemented by hardware, units implemented by software, and units implemented by hardware and software. Further, one unit can be implemented by two or more hardware, and two or more units can be implemented by one hardware.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Fig. 1 is a schematic diagram of a conveying device according to an exemplary embodiment of the present invention. The transfer device will be described with reference to FIG. 1. The conveying device includes a platform 10.

A first substrate is placed on the platform, and a plurality of light-emitting diode chips are mounted on a surface. The "first substrate" is a substrate on which a light-emitting diode chip is mounted, and may include tape, wafer, substrate, and the like.

The platform 10 holds the first substrate by supporting the peripheral portion of the first substrate. In the present invention, the light-emitting diode chip is a semiconductor device with an extremely small size of 5 to 300 μm, and may refer to a product before packaging or a product after packaging. In addition, the light-emitting diode chip of the present invention can also be referred to as a light-emitting diode (LED).

The central part of the platform 10 is opened, and through the central part, the light-emitting diode chip mounted on the first substrate can be transferred to the second substrate located under the platform 10. The platform 10 can be moved between a preparation position (position in FIG. 1) and a transfer process position (position on the workbench) (see arrow).

The platform 10 moves along the X-axis and the Y-axis, so that the push pin module 30 can transfer each light-emitting diode chip to the same position on the second substrate during the transfer process.

The conveying device further includes a first substrate scanning unit 40, which is located below the preparation position.

When the platform 10 is in the standby mode and in the ready position, the first substrate scanning unit 40 scans the positions of a plurality of light emitting diode wafers mounted on the first substrate. For example, the first substrate scanning unit 40 may scan a spaced array between a plurality of light emitting diode chips mounted on the first substrate.

The conveying device further includes a workbench 20. The second substrate is placed on the table 20, and the plurality of light emitting diode wafers mounted on the first substrate will be transferred to the second substrate. Here, the "second substrate" is the substrate to which the light-emitting diode chip will be transferred, and includes tapes, substrates, circuit boards, and the like.

The working platform 20 is located below the platform 10 during the transfer process.

Fig. 2A is a schematic diagram of a workbench according to an embodiment of the present invention. Referring to FIG. 2A, the workbench 20 includes main actuators 11 and 12 and auxiliary actuators 13 and 14.

The auxiliary actuators 13 and 14 are arranged on the main actuators 11 and 12, and the main actuators 11 and 12 include an X-axis motor 11 and a Y-axis motor 12. The auxiliary actuators 13 and 14 also include an X-axis motor 13 and a Y-axis motor 14.

Here, the main actuators 11 and 12 may include a first motor, for example, a linear motor, a servo motor, a stepping motor, or the like. The first motor is a motor used in various technical fields and is produced for the purpose of being able to be used in a relatively wide range of work areas. At the same time, the first motor can cover a relatively wide working area, but its response time is slow and it is difficult to accurately control its operation.

At the same time, the secondary actuators 13, 14 may include a second motor, for example, a voice coil motor (VCM), a piezoelectric motor, an ultrasonic motor, or the like. The second motor has a high response speed and can accurately operate and control, but has a relatively short maximum movable distance, thus limiting the working area.

When only the first motor is used as the actuator of the worktable 20, there will be a problem that the productivity and accuracy of the work will decrease due to the decrease of the response speed and the difficulty of controlling the micro-operation.

Further, when only the second motor is used as the actuator of the table 20, high-speed or fine operation control is possible, but the working area is limited.

In order to solve the above-mentioned problems, the present invention includes and selectively uses the main actuators 11 and 12 and the auxiliary actuators 13 and 14 as the actuators of the worktable 20. That is, when the workbench 20 has to move a long distance between work areas during the conveying process, the main actuators 11 and 12 are used to control the workbench 20. When the worktable 20 needs to be controlled at high speed or precision, the auxiliary actuators 13 and 14 are used.

By selectively using the main actuators 11, 12 and the auxiliary actuators 13, 14 as described above, the accuracy of operation can be enhanced and the productivity can be increased at the same time.

At the same time, the platform 10, similar to the workbench 20, may include a primary actuator and a secondary actuator. That is, the secondary actuator is provided on the main actuator of the platform 10, and the primary actuator and the secondary actuator of the platform 10 can be respectively configured to be the same as the primary actuators 11, 12 and the secondary actuators of the table 20. 13 and 14 are the same.

Fig. 2B is a diagram showing the first substrate. Referring to FIG. 2B, the first substrate has a plurality of regions. For example, the first substrate may include a first area 16, a second area 17 and a third area 18. The plurality of regions of the first substrate can be determined based on the positions of the plurality of light-emitting diode chips scanned by the first substrate scanning unit 40.

When the platform 10 moves, for example, to the standby position of the first zone 16 (the position where the operation starts in the first zone), the platform 10 is controlled by the main actuator of the platform 10. At the same time, when the platform 10 performs the movement between the distances between the light-emitting diode chips, the platform 10 is controlled by the auxiliary actuator of the platform 10. Here, the movement of the distance between the light-emitting diode chips refers to the movement of the platform 10 along the distance between the light-emitting diode chips. Specifically, when the push pin module 30 is located on the first light emitting diode chip and the platform 10 performs the movement between the light emitting diode chips, the push pin module 30 is located adjacent to the first light emitting diode chip. On the second light emitting diode chip of the bulk chip.

Considering the use of the main actuator and auxiliary actuators of the platform 10 to control the process of the platform 10, the platform 10 is moved by the main actuator of the platform 10, so that the push pin module 30 is located in the first zone 16 starting point 16-1. Here, the auxiliary actuator of the platform 10 is not operated.

Then, the platform 10 executes the movement between the distances between the light-emitting diode wafers. That is, the transfer process of the plurality of light-emitting diode chips in the first zone 16 is sequentially executed by the sub-actuator of the platform 10. When the transfer process of the first zone 16 is executed, the main actuator of the platform 10 is not operated. By executing the sub-actuator of the platform 10, the productivity and accuracy in the transmission process can be increased.

After the light-emitting diode chip corresponding to the end point 16-2 of the first zone 16 is transferred, the main actuator of the platform 10 moves the platform 10 so that the push pin module 30 is located at the start point 17-1 of the second zone 17. Subsequently, the transfer process of the plurality of light-emitting diode chips in the second area 17 is sequentially executed by the sub-actuator of the platform 10.

By selectively using the main actuator and the auxiliary actuator of the platform 10 as described above, the operation accuracy can be enhanced and the production capacity can be increased at the same time.

Referring again to FIG. 1, the conveying device may further include a second substrate scanning unit 50. The second substrate scanning unit 50 is located on the worktable 20 and scans the position where the circuit traces on the second substrate are arranged.

The conveying device further includes a push pin module 30. The push pin module 30 selectively transfers one or more light-emitting diode chips to the second substrate at the transfer process position.

In the present invention, the transfer can refer to the transmission of the light-emitting diode chip and the wire bonding of the light-emitting diode chip.

The push pin module 30 uses push pins to push the other surface of the first substrate in a state where one surface of the first substrate and the second substrate are arranged to face each other, thereby transferring a plurality of light-emitting diode chips to The second substrate.

The conveying device further includes a push pin scanning unit 60. The push pin scanning unit 60 periodically scans whether the push pin is located at the correct position (the center of the push pin housing described later). For example, the push pin scanning unit 60 may scan whether the push pin is in the correct position after the push pin is replaced.

The transmission device further includes a control unit (not shown), which has a memory. The control unit controls each component of the conveying device so that the conveying device can operate. Hereafter, it will be described that each component of the conveying device directly performs a certain operation, but this description also includes that the control unit controls each component so that each component performs a corresponding operation.

Fig. 3 is a schematic diagram of a push pin module according to an embodiment of the present invention.

Referring to FIG. 3, the push pin module 30 includes a plurality of push pin units 31, 32 and 33.

Each of the plurality of push pin units 31, 32, and 33 includes a push pin 34 and a push pin housing 35. Here, the push pin housing 35 protects the push pin 34 and is in contact with the first substrate.

The push pin 34 moves vertically to push the other surface of the first substrate, so the light emitting diode chip corresponding to the corresponding part is transferred to the second substrate.

Each of the push pin units 31, 32, and 33 of the plurality of push pin units further includes a vacuum unit 36, which can separate the first substrate and the light emitting diode chip after the light emitting diode chip is transferred to the second substrate by the push pin 34. Separate.

Next, referring to FIGS. 4 and 5A, a method of transferring a light-emitting diode chip according to an embodiment of the present invention will be described. 4, prepare a first substrate 300 and a second substrate 310, the target light-emitting diode chip is mounted on a surface of the first substrate 300, and the second substrate 310 has circuit traces (see Figure 4 (a) ). Here, the first substrate 300 may be, for example, a tape, and the second substrate 310 may be, for example, a substrate or a circuit board.

Then, the push pin module 30 contacts the corresponding part of the target LED chip 320 on the other surface of the first substrate 300 based on the scanning information of the first substrate 300 (see FIG. 4(b)).

Then, the push pin 34 protrudes toward the other surface of the first substrate 300, so the target LED chip 320 is transferred to the second substrate (see FIG. 4(c)). Here, a part of the first substrate can be perforated by the push pin 34 (see (d) of FIG. 4).

Here, the pressure between the target LED chip 320 and the second substrate 310 is maintained at a predetermined pressure through the pressure control unit 37 which will be described later.

Then, the push pin 34 returns to the push pin housing 35 (see (e) of FIG. 4). Here, due to the protrusion of the push pin 34, a part of the first substrate 300 is elongated, or a part of the first substrate 300 is still attached to the target light-emitting diode chip 320. Here, by using the vacuum unit 36 to press the first substrate 300, the first substrate 300 can return to the original position.

Then, the platform 10 and the workbench 20 are moved so that the push pin module 30 is located on another target light-emitting diode chip, and then the target light-emitting diode chip is transferred to the second substrate 310.

By repeating the above process, all the light-emitting diode chips mounted on the first substrate 300 are transferred to the second substrate 310.

Fig. 5B shows a transmission process according to another embodiment of the present invention. According to another embodiment of the present invention, the first substrate 400 may be, for example, a tape having a plurality of light-emitting diode chips mounted on one surface thereof. Further, the second substrate 410 may be a conveyor belt through which the light-emitting diode wafers will be transferred.

3 again, in the present invention, a plurality of light-emitting diode chips can be transferred to the second substrate at a time by using a plurality of push pin units 31, 32, and 33 to perform a transfer process. By using a plurality of push pin units 31, 32, and 33, the light emitting diode chip can be quickly transferred to the second substrate.

Referring to FIG. 6, a method of transferring light-emitting diode chips using a plurality of push pin units according to another embodiment of the present invention will be described.

Referring to FIG. 6A, a plurality of light-emitting diode chips are attached to a surface of the first substrate, and one surface of the first substrate is configured to face each other with the second substrate. Here, the push pin module 30 is in contact with the other surface of the first substrate.

Then, a plurality of push pin units 31, 32, and 33 push the respective push pins 34-1, 34-2, and 34-3 toward the other surface of the first substrate, so that a plurality of corresponding light-emitting diode chips ( FIG. 6 illustrates that three light-emitting diode chips) are transferred to the second substrate at a time.

Next, referring to FIG. 6B, when the platform 10 and the table 20 have moved within a predetermined range, the respective push pins 34-1, 34-2, and 34-3 are placed next to be transported from the upper part of the first substrate. Corresponding to the position of a plurality of light-emitting diodes.

In this state, a plurality of push pin units 31, 32, and 33 push the respective push pins 34-1, 34-2, and 34-3 toward the other surface of the first substrate, so a plurality of corresponding light-emitting diodes The bulk wafer is transferred to the second substrate at a time.

Repeating the above process, most of the light emitting diode chip mounted on the first substrate is transferred to the second substrate. However, the LED chip mounted on the outer peripheral part of the first substrate or the LED chip located on the area where the arrangement interval (or arrangement position) between the LED chips is not uniform cannot use the push pin unit 31, 32, and 33 are transferred to the second substrate. The light emitting diode chips that cannot be transferred to the second substrate using the push pin units 31, 32 and 33 will not be detected through the scanning process of the first substrate scanning unit 40.

Therefore, as shown in FIG. 6C, the light-emitting diode chip that does not pass through the transfer process of the plurality of push pin units 31, 32, and 33 uses one of the plurality of push pin units 31, 32, and 33 sequentially ( FIG. 6C illustrates the push pin unit 32) being transferred to the second substrate.

Referring again to FIG. 3, the push pin module 30 further includes a pressure control unit 37. When the push pin 34 pushes the other surface of the first substrate, the light emitting diode chip and the second substrate are in contact with each other. Here, the pressure control unit 37 maintains the pressure between the light emitting diode chip and the second substrate at a predetermined pressure.

Preferably, the pressure control unit 37 maintains the pressure between the light emitting diode chip and the second substrate at the same pressure.

The pressure control unit 37 may include, for example, a spring or a voice coil motor.

Here, as shown in Figure 7A, the spring has a pressure that linearly rises to a specific displacement (a) and after reaching the corresponding displacement (a), even if the displacement increases again, it will remain at a constant pressure (b) Characteristics, and by maintaining a specific displacement or higher, the pressure between the push pin 34 and the second substrate can be maintained at a constant pressure (b).

In addition, a voice coil motor is a linear motor, which includes a permanent magnet and a coil, and performs a linear motion by flowing current through the coil.

As shown in FIG. 7B, this voice coil motor has a characteristic that the pressure is proportional to the current (or voltage) applied to the voice coil motor.

Therefore, by applying a specific current (or voltage) (a) to the voice coil motor, the pressure between the push pin 34 and the second substrate can be maintained at a constant pressure (b).

When the push pin 34 pushes the other surface of the first substrate to transfer the LED chip to the second substrate, when the same pressure is not applied, the height of the LED chip transferred to the second substrate may be different from each other . In addition, when a large pressure is applied, the light-emitting diode chip may be damaged.

In the present invention, by using the pressure control unit 37 to maintain the pressure between each light-emitting diode chip and the second substrate to be the same as each other, it is possible to prevent each light-emitting diode chip from being damaged during the transfer process.

Furthermore, with the pressure control unit 37, each light-emitting diode chip can be transferred to the second substrate at a uniform height.

The pushing pin module 30 further includes a width changing unit 38. The width changing unit 38 adjusts the width between the plurality of push pin units 31, 32 and 33 based on the arrangement interval between the light emitting diode wafers scanned by the first substrate scanning unit 40.

The arrangement intervals between the plurality of light emitting diode chips mounted on the first substrate may be different from each other. When a plurality of push pin units 31, 32, and 33 are used to perform the transfer process regardless of the arrangement interval between the light-emitting diode chips, the light-emitting diode chips cannot be properly transferred to the second substrate.

For example, when the arrangement interval between light-emitting diode chips in a specific area is wider or narrower than the width of the plurality of push pin units 31, 32, and 33 (preferably, the width of each push pin 34), the push pin 34 is pressed The non-central part of the light-emitting diode chip (or the part where the light-emitting diode chip is not placed correctly in some cases), so that the corresponding light-emitting diode chip cannot be properly transferred to the second substrate.

In the present invention, the width changing unit 38 can adjust the width of the plurality of push pin units 31, 32, and 33 in real time based on the arrangement interval of the light-emitting diode chips during the transfer process to solve the above-mentioned problem.

Hereinafter, the transmission method performed by the transmission device will be described. FIG. 8 shows a flowchart of a method for transferring a light-emitting diode chip to a second substrate according to an embodiment of the present invention.

Referring to FIG. 8, in order to determine which light-emitting diode chip will be transferred to the second substrate and where the light-emitting diode chip will be placed on the second substrate, the control unit may receive information about the first light-emitting diode chip containing the light-emitting diode chip. Input of the recognition of the substrate and the recognition of the second substrate (S801).

The control unit may retrieve the related data of the first substrate and the related data of the second substrate from the memory based on the input about the identification of the first substrate and the identification of the second substrate (S802).

The relevant information of the second substrate includes the pattern (including position) of the circuit traces on the second substrate, the number of light-emitting diode chips to be transferred to the circuit traces and the relative positions of the light-emitting diode chips, and the required light emission Number of diodes.

In addition, the relevant information of the first substrate includes the relative position of the light-emitting diode chip and its map.

Then, the control unit can determine the initial directions of the first substrate and the second substrate to transfer the light-emitting diode chip (S803).

During the transfer process, once the initial directions of the first substrate and the second substrate are determined, the control unit controls the platform 10 and the worktable 20 so that the first substrate and the second substrate are oriented at the adjusted position (S804).

In step S804, the control unit determines the position of the light-emitting diode chip to be transferred to the circuit trace and the position of the light-emitting diode chip to be transferred in the first substrate.

Subsequently, the control unit controls the push pin module 30 so that the light-emitting diode chip is transferred to the second substrate (S805).

After the corresponding light-emitting diode chip is transferred to the second substrate, the control unit determines whether there is a light-emitting diode chip to be transferred next (S806).

When there are still LED chips to be transferred, the control unit returns to step S804 to perform the transfer process. When no LED chips are to be transferred, the transfer process is terminated.

FIG. 9 is a flowchart of a method for transferring a light-emitting diode chip to a second substrate according to an embodiment of the present invention.

9, the initial substrate is placed on the platform 10 in the standby mode and ready position, and the initial substrate has a plurality of light-emitting diode chips mounted on one surface thereof (S900).

Here, the arrangement interval between the plurality of light-emitting diode chips mounted on the initial substrate is not uniform. When the initial substrate is used to perform the transfer process, since the arrangement interval between the plurality of light-emitting diode chips is not uniform, it is necessary to pass through each push pin unit (for example, 32) based on the scan information after scanning the initial substrate. Transfer each LED chip.

In other words, in the process of transferring the plurality of light-emitting diode chips mounted on the initial substrate, the plurality of push pin units 31, 32, and 33 cannot be used.

In the present invention, in order to be able to use a plurality of push pin units 31, 32, and 33 to perform the transfer process, the rearrangement process is performed.

At the same time, in step S900, the first substrate is placed on the worktable 20, and a plurality of light-emitting diode wafers will be transferred to the first substrate.

Then, the first substrate scanning unit 40 scans the plurality of light emitting diode wafers mounted on the initial substrate. Here, the first substrate scanning unit 40 scans the positions of a plurality of light emitting diode wafers mounted on the initial substrate.

Then, the platform 10 moves to the transfer process position and executes the transfer process (S910).

In this rearrangement process, a plurality of light-emitting diode chips are transferred to the first substrate, so that the arrangement interval between the circuit traces on the second substrate is adjusted together, and the second substrate is the light-emitting diode chip finally The place where it was teleported.

That is, through the rearrangement process, the arrangement interval between the plurality of light-emitting diode chips mounted on one surface of the first substrate and the arrangement interval between the circuit traces arranged on the second substrate are preset Adjustment.

As mentioned above, since the arrangement intervals between the plurality of light-emitting diode chips mounted on the initial substrate are not uniform, a plurality of push pin units 31, 32, and 31 are used based on the scanning information of the first substrate scanning unit 40. One of 33 (for example, 32) is used to transfer each light-emitting diode chip to the first substrate.

After the rearrangement process is completed, the first substrate with a plurality of light-emitting diode chips mounted on one surface is placed on the platform 10 in a standby mode and a ready position. In addition, the second substrate to which the plurality of light-emitting diode wafers will be transferred is placed on the work table 20 (S920).

Then, the first substrate scanning unit 40 scans the positions of the plurality of light emitting diode wafers mounted on the first substrate. Here, the first substrate scanning unit 40 scans the arrangement interval of a plurality of light emitting diode chips mounted on the first substrate. Here, the scanning information scanned by the first substrate scanning unit 40 is stored in the memory. The scanning information includes the arrangement interval between each light-emitting diode chip.

This scanning information is used by the width changing unit 38 to change the width between the plurality of push pin units 31, 32, and 33. In addition, the scanning information can be used to detect light-emitting diode chips that have not been transported by a plurality of push pin units 31, 32, and 33 (for example, when the light-emitting diode chip is located on the outer periphery of the first substrate or when aligned The interval exceeds the predetermined range, that is, when it is difficult to correct by the width changing unit 38).

Further, the second substrate scanning unit 50 scans the positions of the circuit traces arranged on the second substrate.

After that, the platform 10 moves to the transfer process position and executes the transfer process (S930).

Here, through the above-mentioned rearrangement process, the arrangement intervals of the plurality of light-emitting diode chips mounted on the first substrate are relatively uniform, so the plurality of light-emitting diode chips can be provided by the plurality of push pin units 31, 32 and 33 are transferred to the second substrate at once.

During the transfer process, the width changing unit 38 changes the width between the plurality of push pin units 31, 32, and 33 based on the scanning information, so the plurality of light-emitting diode chips can be properly transferred to the second substrate.

Further, based on the scanning information, the push pin module 30 classifies the chip into the first light-emitting diode chip to be transferred using a plurality of push pin units 31, 32, and 33, and a plurality of push pin units 31, One of 32 and 33 pushes the pin unit 32 to transfer the second light emitting diode chip.

Based on the classification result, the push pin module 30 uses a plurality of push pin units 31, 32, and 33 to transfer the first light emitting diode chip to the second substrate at a time. Then, the push pin module 30 then uses the push pin unit 32 of one of the plurality of push pin units 31, 32, and 33 to transfer the second light emitting diode chip to the second substrate.

The scope of the present invention should be interpreted as defined by the following claims, rather than the above detailed description, and all adjustments or substitutions derived from the meaning, scope and equality of the claims should be included in the scope of the present invention .

According to any embodiment of the present invention, extremely small-sized light-emitting diode chips can be transferred with high position accuracy.

In addition, by using a plurality of push pin units to transfer the light-emitting diode chip at a time, the productivity can be improved.

10: Platform 20: Workbench 30: Push pin module 31: Push pin unit 32: Push pin unit 33: Push pin unit 34: Push pin 35: Push pin housing 36: Vacuum unit 37: Pressure control unit 38: width change unit 40: The first substrate scanning unit 50: Second substrate scanning unit 60: advance pin scanning unit

Fig. 1 is a schematic diagram of a conveying device according to an embodiment of the present invention.

Fig. 2A is a schematic diagram of a platform according to an embodiment of the present invention.

FIG. 2B is a schematic diagram of the first substrate according to an embodiment of the present invention.

Fig. 3 is a schematic diagram of a push pin module according to an embodiment of the present invention.

4, 5A, and 5B are diagrams for explaining a transmission method according to an embodiment of the present invention.

6A, 6B, and 6C are diagrams for explaining a transmission method according to another embodiment of the present invention.

7A and 7B are diagrams for explaining the characteristics of the pressure control unit according to an embodiment of the present invention.

FIG. 8 is a flowchart of a method for transferring light-emitting diode chips according to an embodiment of the present invention.

FIG. 9 is a flowchart of a method for transferring light-emitting diode chips according to another embodiment of the present invention.

10: Platform

20: Workbench

30: Push pin module

40: The first substrate scanning unit

50: Second substrate scanning unit

60: advance pin scanning unit

Claims (31)

A conveying device for conveying a plurality of light-emitting diode chips, including: A stage, on which a first substrate is placed, and the first substrate has the plurality of light-emitting diode chips mounted on a surface; A work table on which a second substrate is placed, and the plurality of light-emitting diode chips will be transferred to the second substrate; and Push pin module, in a state where the surface of the first substrate and the second substrate are arranged to face each other, the plurality of light emitting diodes are pushed by pushing the other surface of the first substrate The bulk wafer is transferred to the second substrate, The push pin module includes a plurality of push pin units, and each push pin unit includes a push pin for pushing the other surface of the first substrate, and The push pin module transfers the plurality of light-emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate at a time. The conveying device according to claim 1, wherein the arrangement interval between the plurality of light-emitting diode chips mounted on the surface and the arrangement interval of the circuit traces arranged on the second substrate are adjusted in advance. The transmission device described in claim 1, further comprising: The second substrate scanning unit scans the positions of the circuit traces arranged on the second substrate. The transmission device described in claim 1, further comprising: The first substrate scanning unit scans the positions between the plurality of light emitting diode chips mounted on the first substrate. The conveying device according to claim 4, wherein the push pin module further includes a width changing unit that changes the plurality of push pins based on the arrangement interval between the light-emitting diode chips scanned by the first substrate scanning unit The width between the units. The transfer device according to claim 4, wherein the push pin module uses one of the plurality of push pin units to transfer the light-emitting diode chip to the second substrate, wherein the first substrate scanning unit The scanned arrangement position between the light-emitting diode chips exceeds a predetermined range. The conveying device according to claim 1, wherein each of the plurality of push pin units includes a pressure control unit to maintain the pressure between the light-emitting diode chip and the second substrate at a predetermined pressure. The transmission device according to claim 7, wherein the pressure control unit includes at least one voice coil motor (VCM) and a spring. A method for transferring a plurality of light-emitting diode chips, including: Preparing a first substrate, the first substrate having a plurality of light emitting diode chips mounted on a surface; Preparing a second substrate, the plurality of light-emitting diode chips will be transferred to the second substrate; and In a state where the surface of the first substrate and the second substrate are arranged to face each other, the plurality of light-emitting diode chips are transferred to the second substrate by pushing the other surface of the first substrate, Wherein, transferring the plurality of LED chips to the second substrate includes transferring the plurality of LED chips corresponding to each of the plurality of push pins to the second substrate at a time. The method according to claim 9, wherein preparing the first substrate, the first substrate having the plurality of light-emitting diode chips mounted on the surface comprises: Preparing an initial substrate, the initial substrate having a plurality of light-emitting diode chips mounted on a surface; Preparing the first substrate; and In a state where the surface of the initial substrate and the first substrate are arranged to face each other, the plurality of light-emitting diode chips are transferred to the second substrate by pushing the other surface of the initial substrate. The method according to claim 10, further comprising, after preparing the first substrate, scanning the positions of the plurality of light-emitting diode chips mounted on the initial substrate. The method according to claim 11, wherein transferring the plurality of light-emitting diode chips to the first substrate comprises transferring the plurality of light-emitting diode chips to the first substrate, so that the plurality of light-emitting diodes The arrangement intervals between the wafers match each other. The method described in claim 9 further includes: Scanning the plurality of light emitting diode chips mounted on the first substrate; and Scan the position of the circuit traces arranged on the second substrate. A conveying device for conveying light-emitting diode chips, including: A platform on which a first substrate is placed, and the first substrate has the light-emitting diode chip mounted on a surface; A worktable on which a second substrate is placed, and the light-emitting diode wafer will be transferred to the second substrate; and Push pin module, in a state where the surface of the first substrate and the second substrate are arranged to face each other by pushing a portion corresponding to the light-emitting diode chip from the other surface of the first substrate Transferring the light-emitting diode chip to the second substrate, The push pin module includes a pressure control unit to maintain the pressure between the light emitting diode chip and the second substrate at a predetermined pressure. The transmission device according to claim 14, wherein the pressure control unit includes at least one voice coil motor (VCM) and a spring. The conveying device according to claim 14, wherein the push pin module includes a plurality of push pin units, and each push pin unit includes a push pin for pushing the other surface of the first substrate, and The push pin module transmits a plurality of light emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate at a time. The transmission device described in claim 14, further comprising: The second substrate scanning unit scans the positions of the circuit traces arranged on the second substrate. The transmission device described in claim 14, further comprising: The first substrate scanning unit scans the position of the light emitting diode chip mounted on the first substrate. The conveying device according to claim 16, wherein the push pin module further includes a width changing unit that changes the width between the plurality of push pin units based on the arrangement interval between the light-emitting diode chips. The transfer device according to claim 19, wherein the push pin module uses one of the plurality of push pin units to transfer the light-emitting diode chips to the second substrate, wherein the light-emitting diodes The arrangement position between the wafers is out of the predetermined range. A method for transferring light-emitting diode chips includes: Preparing a first substrate, the first substrate having the light emitting diode chip mounted on a surface; Preparing a second substrate, the light emitting diode chip will be transferred to the second substrate; and In a state where the surface of the first substrate and the second substrate are arranged to face each other, the light emitting diode is pushed by pushing a portion corresponding to the light emitting diode chip from the other surface of the first substrate The bulk wafer is transferred to the second substrate, Wherein, transferring the light-emitting diode chip to the second substrate includes maintaining a pressure between the light-emitting diode chip and the second substrate at a predetermined pressure. A conveying device for conveying a plurality of light-emitting diode chips, including: A platform on which a first substrate is placed, and the first substrate has the light-emitting diode chips mounted on a surface; A worktable on which a second substrate is placed, and the light-emitting diode wafers will be transferred to the second substrate; and The push pin module, in a state where the surface of the first substrate and the second substrate are arranged to face each other, by pushing the other surface of the first substrate to transfer the light-emitting diode chips to the The second substrate, The platform includes a main actuator, which controls the movement of the platform to the standby position, and a sub-actuator, which controls the movement of the platform between the light-emitting diode chips. The transmission device according to claim 22, wherein the main actuator includes any one of a linear motor, a servo motor, and a stepping motor. The transmission device according to claim 22, wherein the auxiliary actuator includes any one of a voice coil motor (VCM), a piezoelectric motor, and an ultrasonic motor. The conveying device according to claim 22, wherein the first substrate includes a first area and a second area, Each of the first zone and the second zone has a starting point as the start of the movement between the light-emitting diodes, The main actuator controls the platform so that the push pin module is located at the starting point of the first zone, The auxiliary actuator controls the platform so that the platform executes the movement between the light emitting diodes in the first zone. The transmission device according to claim 22, wherein the workbench includes the main actuator and the auxiliary actuator. The conveying device according to claim 22, wherein the push pin module includes a plurality of push pin units, and each push pin unit includes a push pin for pushing the other surface of the first substrate. The conveying device according to claim 27, wherein the push pin module further includes a width changing unit that changes the width between the plurality of push pin units based on the arrangement interval between the light-emitting diode chips. The transfer device according to claim 22, wherein the push pin module includes a pressure control unit to maintain the pressure between the light emitting diode chip and the second substrate at a predetermined pressure. The transmission device according to claim 29, wherein the pressure control unit includes at least one voice coil motor (VCM) and a spring. A method for manufacturing micro LEDs by transferring light-emitting diode chips, including: Preparing a first substrate, the first substrate having the light emitting diode chip mounted on a surface; Preparing a second substrate, the light emitting diode chip will be transferred to the second substrate; and In a state where the surface of the first substrate and the second substrate are arranged to face each other, the light emitting diode is pushed by pushing a portion corresponding to the light emitting diode chip from the other surface of the first substrate The bulk wafer is transferred to the second substrate, Wherein, transferring the light-emitting diode chip to the second substrate includes maintaining a pressure between the light-emitting diode chip and the second substrate at a predetermined pressure.

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