TW202111842A - Transfer apparatus and transfer method for transferring light emitting diode chip - Google Patents
Transfer apparatus and transfer method for transferring light emitting diode chip Download PDFInfo
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本發明關於一種傳送發光二極體晶片的傳送裝置及傳送方法。The invention relates to a conveying device and a conveying method for conveying light-emitting diode wafers.
一般而言,發光二極體晶片係在晶圓上製程每一晶片的電路,再藉由切割分離成複數個各別晶片。這些發光二極體晶片會接受數個封裝上的傳送程序及模組程序。Generally speaking, a light emitting diode chip is a circuit of each chip on a wafer, and then separated into a plurality of individual chips by dicing. These light-emitting diode chips will receive transfer procedures and module procedures on several packages.
依不同目的,在此傳送程序中,為了將晶片分為良品或瑕疵品、調整晶片間隔,或控制晶片方向之目的,晶片會被傳送至傳送帶或基板,或是為了安裝晶片之目的,晶片會被被傳送至電路板。According to different purposes, in this transfer process, in order to divide the wafers into good or defective products, adjust the chip spacing, or control the direction of the wafer, the wafer will be transferred to the conveyor or substrate, or for the purpose of mounting the chip, the wafer will be It is transmitted to the circuit board.
在習知的傳送裝置(即挑揀及置放裝置)中,每一發光二極體晶片被挑揀並置放在一基板上,並傳送每一發光二極體晶片至該基板。韓國專利公開號2016-0008187即揭示了相關的晶片傳送裝置及晶片傳送方法。In the conventional transfer device (ie, picking and placing device), each light emitting diode chip is picked and placed on a substrate, and each light emitting diode chip is transferred to the substrate. Korean Patent Publication No. 2016-0008187 discloses related wafer transfer devices and wafer transfer methods.
同時,具有約5至300μm晶片尺寸之極小尺寸的發光二極體晶片(例如,微LED)最近受到矚目能成為下一代顯示器裝置。此極小尺寸的發光二極體晶片可用於需求低耗電、小尺寸,及輕量的光應用領域,且因此積極地展開相關的研究及開發。At the same time, extremely small light emitting diode chips (eg, micro LEDs) having a chip size of about 5 to 300 μm have recently attracted attention and can become the next-generation display device. This extremely small-sized light-emitting diode chip can be used in light applications that require low power consumption, small size, and light weight, and therefore, related research and development are actively carried out.
在習知的挑揀及置放傳送裝置與方法中,具有洞的筒夾可產生真空用以在挑揀階段吸住發光二極體(LED)晶片,並在中心打入空氣而破壞真空,用以在置放階段置放被吸住得晶片。然而,當筒夾的洞具有數微米(μm)之尺寸時,由於筒夾的洞之通道阻抗,故不可能確保足以挑揀發光二極體晶片的真空,及足以破壞真空的氣壓。In the conventional picking and placing conveyor device and method, a collet with a hole can generate a vacuum to suck the light-emitting diode (LED) chip during the picking stage, and blow air in the center to break the vacuum. The sucked wafer is placed in the placement stage. However, when the hole of the collet has a size of several micrometers (μm), due to the channel resistance of the hole of the collet, it is impossible to ensure a vacuum sufficient to pick the light-emitting diode chips and a pressure sufficient to break the vacuum.
當發光二極體晶片尺寸縮小至數微米時,便產生難以使用習知的挑揀及置放方法來傳送發光二極體晶片的問題。When the size of the light-emitting diode chip is reduced to a few microns, it is difficult to use the conventional picking and placement method to transfer the light-emitting diode chip.
本發明已解決上述問題,藉由在第一基板(包括如安裝帶、晶圓或其類似者之基板)之一表面與第二基板(包括如傳送帶、基板或電路板)被配置為互相面對的狀態下推進第一基板之另一表面,其中第一基板其上安裝有發光二極體晶片,而發光二極體晶片將被傳送至第二基板,來傳送發光二極體晶片至傳送帶之傳送裝置及傳送方法。同時,本實施例欲解決的技術問題不限於上述問題,亦可包含其他技術問題。The present invention has solved the above-mentioned problems by arranging a surface of a first substrate (including a substrate such as a mounting tape, a wafer or the like) and a second substrate (including a conveyor belt, a substrate, or a circuit board) to face each other Push the other surface of the first substrate in the right state, where the first substrate is mounted with a light-emitting diode chip, and the light-emitting diode chip will be transferred to the second substrate to transfer the light-emitting diode chip to the conveyor belt The transmission device and transmission method. At the same time, the technical problem to be solved by this embodiment is not limited to the above problem, and may also include other technical problems.
為了解決上述問題,本發明之一實施例提供一種傳送發光二極體晶片之傳送裝置,包含平台,該平台上置放了第一基板,該第一基板具有被安裝在一表面上的該發光二極體晶片;工作台,該工作台上置放了第二基板,該發光二極體晶片將被傳送至該第二基板;以及推進銷模組,在該第一基板之該表面與該第二基板被配置為互相面對的狀態下藉由從該第一基板之另一表面推進對應至該發光二極體晶片之部分來將該發光二極體晶片傳送至該第二基板,其中該推進銷模組包含壓力控制單元,將該發光二極體晶片與該第二基板間的壓力維持在預定壓力。In order to solve the above-mentioned problems, an embodiment of the present invention provides a transfer device for transferring light-emitting diode chips, including a platform on which a first substrate is placed, and the first substrate has the light-emitting diode mounted on a surface. A diode chip; a worktable on which a second substrate is placed, and the light-emitting diode chip will be transferred to the second substrate; and a push pin module on the surface of the first substrate and the The second substrate is configured to face each other by pushing a portion corresponding to the light emitting diode chip from the other surface of the first substrate to transfer the light emitting diode chip to the second substrate, wherein The push pin module includes a pressure control unit to maintain the pressure between the light emitting diode chip and the second substrate at a predetermined pressure.
本發明之另一實施例提供一種傳送複數個發光二極體晶片之傳送裝置,包含平台,該平台上置放了第一基板,該第一基板具有被安裝在一表面上的該複數個發光二極體晶片;工作台,該工作台上置放了第二基板,該複數個發光二極體晶片將被傳送至該第二基板;以及推進銷模組,在該第一基板之該表面與該第二基板被配置為互相面對的狀態下藉由推進該第一基板之另一表面來將該複數個發光二極體晶片傳送至該第二基板,其中該推進銷模組包含複數個推進銷單元,每一推進銷單元包含推進該第一基板之該另一表面的推進銷,以及該推進銷模組將對應至該複數個推進銷單元之每一推進銷的該複數個發光二極體晶片一次傳送至該第二基板。Another embodiment of the present invention provides a conveying device for conveying a plurality of light-emitting diode chips, including a platform on which a first substrate is placed, and the first substrate has the plurality of light-emitting diodes mounted on a surface A diode chip; a workbench on which a second substrate is placed, and the plurality of light-emitting diode chips will be transferred to the second substrate; and a push pin module on the surface of the first substrate The plurality of light-emitting diode chips are transferred to the second substrate by pushing the other surface of the first substrate in a state where they are arranged to face each other, wherein the pushing pin module includes a plurality of Push pin units, each push pin unit includes a push pin for pushing the other surface of the first substrate, and the push pin module will correspond to the plurality of light emitting pins of each push pin of the plurality of push pin units The diode chip is transferred to the second substrate at a time.
本發明之另一實施例提供一種傳送複數個發光二極體晶片之傳送裝置,包含:平台,該平台上置放了第一基板,該第一基板具有被安裝在一表面上的該等發光二極體晶片;工作台,該工作台上置放了第二基板,該等發光二極體晶片將被傳送至該第二基板;以及推進銷模組,在該第一基板之該表面與該第二基板被配置為互相面對的狀態下藉由推進該第一基板之另一表面來將該等發光二極體晶片傳送至該第二基板,其中該平台包含主致動器,控制該平台至待機位置的運動,以及副致動器,控制該平台在該等發光二極體晶片之間距間的運動。Another embodiment of the present invention provides a conveying device for conveying a plurality of light-emitting diode chips, comprising: a platform on which a first substrate is placed, and the first substrate has the light-emitting diodes mounted on a surface Diode chip; workbench, on which a second substrate is placed, the light emitting diode chips will be transferred to the second substrate; and push pin module, on the surface of the first substrate and The second substrate is configured to face each other by pushing the other surface of the first substrate to transfer the light-emitting diode chips to the second substrate, wherein the platform includes a main actuator to control The movement of the platform to the standby position and the auxiliary actuator control the movement of the platform between the light-emitting diode chips.
本發明之另一實施例提供一種傳送發光二極體晶片之方法,包含:準備第一基板,該第一基板具有被安裝在一表面上的該發光二極體晶片;準備第二基板,該發光二極體晶片將被傳送至該第二基板;以及在該第一基板之該表面與該第二基板被配置為互相面對的狀態下藉由從該第一基板之另一表面推進對應至該發光二極體晶片之部分來將該發光二極體晶片傳送至該第二基板,其中將該發光二極體晶片傳送至該第二基板包括將該發光二極體晶片與該第二基板間的壓力維持在預定壓力。Another embodiment of the present invention provides a method for transferring a light-emitting diode chip, including: preparing a first substrate having the light-emitting diode chip mounted on a surface; preparing a second substrate, the The light-emitting diode chip will be transferred to the second substrate; and in a state where the surface of the first substrate and the second substrate are arranged to face each other by pushing from the other surface of the first substrate to correspond To the part of the light-emitting diode chip to transfer the light-emitting diode chip to the second substrate, wherein the transfer of the light-emitting diode chip to the second substrate includes the light-emitting diode chip and the second substrate. The pressure between the substrates is maintained at a predetermined pressure.
本發明之另一實施例提供一種傳送複數個發光二極體晶片之方法,包含:準備第一基板,該第一基板具有被安裝在一表面上的複數個發光二極體晶片;準備第二基板,該複數個發光二極體晶片將被傳送至該第二基板;以及在該第一基板之該表面與該第二基板被配置為互相面對的狀態下藉由推進該第一基板之另一表面來將該複數個發光二極體晶片傳送至該第二基板,其中將該複數個發光二極體晶片傳送至該第二基板包含將對應至複數個推進銷之每一推進銷的複數個發光二極體晶片一次傳送至該第二基板。Another embodiment of the present invention provides a method for transferring a plurality of light-emitting diode chips, including: preparing a first substrate having a plurality of light-emitting diode chips mounted on a surface; preparing a second substrate Substrate, the plurality of light-emitting diode chips will be transferred to the second substrate; and in a state where the surface of the first substrate and the second substrate are arranged to face each other by pushing the first substrate The other surface is used to transfer the plurality of light-emitting diode chips to the second substrate, wherein the transfer of the plurality of light-emitting diode chips to the second substrate includes a step corresponding to each push pin of the plurality of push pins A plurality of light-emitting diode chips are transferred to the second substrate at a time.
上述實施例只是範例,應可理解他們不應被解釋為限制本發明。除了上述實施例,說明書中還描述了額外的實施例。The above embodiments are just examples, and it should be understood that they should not be construed as limiting the present invention. In addition to the above-mentioned embodiments, additional embodiments are described in the specification.
此後,將詳細描述本發明之實施例使本發明相關領域中具有通常知識者能夠輕易實施。然而,本發明得以各種方式來修改,且不限於本說明書所提供的範例。進一步地,在附圖中,將省略與描述無關的部分以明確描述本發明,且本說明書通篇中,將使用類似元件符號來描述類似部分。Hereinafter, the embodiments of the present invention will be described in detail so that those with ordinary knowledge in the related fields of the present invention can easily implement it. However, the present invention can be modified in various ways and is not limited to the examples provided in this specification. Further, in the drawings, parts irrelevant to the description will be omitted to clearly describe the present invention, and throughout this specification, similar reference numerals will be used to describe similar parts.
本說明書通篇中,任何部分〝連接〞至其他部分之情形包含該等部分彼此〝直接連接〞之情形及該等部分〝電性連接〞而其間介有其他元件之情形。進一步地,除非另有明確表示,否則〝包含〞任何組件隱含包含其他元件,而非排除任何其他元件,且應理解為未排除一或更多其他功能、數量,步驟、操作、組件、部件或其組合的存在或附加可能性。Throughout this manual, the situation where any part is "connected" to other parts includes the situation where these parts are "directly connected" to each other and the situation where these parts are "electrically connected" with other components in between. Further, unless expressly stated otherwise, "comprises" any component implicitly includes other elements, rather than excluding any other elements, and should be understood as not excluding one or more other functions, quantities, steps, operations, components, components Or the existence or additional possibility of a combination thereof.
在本說明書中,〝部件〞包含由硬體實施的單元、由軟體實施的單元,及使用硬體及軟體來實施的單元。進一步地,一個單元可使用兩個或更多硬體來實施,兩個或更多單元可由一個硬體來實施。In this manual, "components" include units implemented by hardware, units implemented by software, and units implemented by hardware and software. Further, one unit can be implemented by two or more hardware, and two or more units can be implemented by one hardware.
此後,將參照附圖來詳細描述本發明之實施例。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
圖1係根據本發明之一例示實施例的傳送裝置的示意圖。將參照圖1來描述該傳送裝置。該傳送裝置包含平台10。Fig. 1 is a schematic diagram of a conveying device according to an exemplary embodiment of the present invention. The transfer device will be described with reference to FIG. 1. The conveying device includes a
該平台上置放了第一基板,其上安裝有複數個發光二極體晶片在一表面上。〝第一基板〞是安裝有發光二極體晶片的基板,且可包含帶、晶圓、基板及其類似者。A first substrate is placed on the platform, and a plurality of light-emitting diode chips are mounted on a surface. The "first substrate" is a substrate on which a light-emitting diode chip is mounted, and may include tape, wafer, substrate, and the like.
平台10藉由支撐第一基板的周邊部分來保持第一基板。本發明中,發光二極體晶片是具有5至300μm之極小尺寸的半導體裝置,且可指封裝前產品或封裝後產品。此外,本發明之發光二極體晶片亦可指發光二極體(LED)。The
平台10之中心部分是打開的,且藉由中心部分,安裝在第一基板上的發光二極體晶片可被傳送至位於平台10下方的第二基板。平台10可在準備位置(圖1位置)及傳送過程位置(工作台上位置)(參見箭頭)間移動。The central part of the
平台10沿著X軸及Y軸移動,使得推進銷模組30能夠在傳送過程中將每一發光二極體晶片傳送至第二基板的相同位置上。The
傳送裝置更包含第一基板掃描單元40,其位於準備位置的下方。The conveying device further includes a first
當平台10在待機模式、在準備位置時,第一基板掃描單元40掃描被安裝在第一基板上的複數個發光二極體晶片的位置。例如,第一基板掃描單元40可掃描被安裝在第一基板上的複數個發光二極體晶片間的間隔陣列。When the
傳送裝置更包含工作台20。第二基板被放置在工作台20上,而被安裝在第一基板上的複數個發光二極體晶片將被傳送至第二基板。於此,〝第二基板〞是發光二極體晶片將被傳送至的基板,且包含帶、基板、電路板,及其類似者。The conveying device further includes a
工作台20於傳送過程位置是位於平台10下方。The working
圖2A係根據本發明之一實施例的工作台的示意圖。參照圖2A,工作台20包含主致動器11、12及副致動器13、14。Fig. 2A is a schematic diagram of a workbench according to an embodiment of the present invention. Referring to FIG. 2A, the
副致動器13、14設置於主致動器11、12上,且主致動器11、12包含X軸馬達11及Y軸馬達12。副致動器13、14亦包含X軸馬達13及Y軸馬達14。The
於此,主致動器11、12可包含第一馬達,例如,線性馬達、伺服馬達、步進馬達,或其類似者。第一馬達是一種用於各種技術領域的馬達,且以能夠用在相對廣泛的工作區域之目的而被生產。同時,第一馬達可涵蓋相對廣泛的工作區域,惟反應時間慢且難以精確地控制其操作。Here, the
同時,副致動器13、14可包含第二馬達,例如,音圈馬達(VCM)、壓電馬達、超音波馬達,或其類似者。第二馬達具有高反應速度且能夠準確地操作控制,惟具有相對短的最大可移動距離,因而限制了工作區域。At the same time, the
當僅使用第一馬達來當作工作台20之致動器時,會有因反應速度下降且難以控制微操作,而造成工作的產能及準確性下降的問題。When only the first motor is used as the actuator of the
進一步地,當僅使用第二馬達來當作工作台20之致動器時,可高速或精細操作控制,但工作區域受限。Further, when only the second motor is used as the actuator of the
為了解決上述問題,本發明包含且選擇性地使用主致動器11、12及副致動器13、14來當作工作台20之致動器。即,當工作台20於傳送過程中須在工作區域間移動長距離,使用主致動器11、12來控制工作台20。當工作台20須以高速或精準來控制,則使用副致動器13、14。In order to solve the above-mentioned problems, the present invention includes and selectively uses the
藉由如上述般選擇性使用主致動器11、12及副致動器13、14,可強化操作準確性且同時增加產能。By selectively using the
同時,平台10,類似工作台20,可包含主致動器與副致動器。即,副致動器設置於平台10之主致動器上,平台10之主致動器及副致動器可分別構成為與工作台20之主致動器11、12及副致動器13、14相同。At the same time, the
圖2B係顯示第一基板之示圖。參照圖2B,第一基板具有複數個區。例如,第一基板可包含第一區16、第二區17及第三區18。第一基板之複數個區可基於由第一基板掃描單元40所掃描的複數個發光二極體晶片之位置來決定。FIG. 2B is a diagram showing the first substrate. Referring to FIG. 2B, the first substrate has a plurality of regions. For example, the first substrate may include a
當平台10移動,例如,至第一區16之待機位置(在第一區開始操作的位置)時,平台10是由平台10之主致動器控制。同時,當平台10執行發光二極體晶片之間距間的移動時,平台10是由平台10之副致動器控制。於此,發光二極體晶片之間距間的移動是指平台10沿發光二極體晶片之間距移動。具體而言,當推進銷模組30位於第一發光二極體晶片上且平台10執行發光二極體晶片之間距間的移動時,推進銷模組30係位於相鄰於第一發光二極體晶片之第二發光二極體晶片上。When the
在考量使用平台10之主致動器及副致動器來控制平台10之過程的情形下,平台10係由平台10之主致動器來移動,使得推進銷模組30係位於第一區16之起點16-1。於此,未操作平台10之副致動器。Considering the use of the main actuator and auxiliary actuators of the
然後,平台10執行發光二極體晶片之間距間的移動。即,第一區16所有的複數個發光二極體晶片之傳送過程係依序地由平台10的副致動器來執行。當執行第一區16之傳送過程時,未操作平台10之主致動器。藉由執行平台10之副致動器,可增加傳送過程中的產能及準確性。Then, the
在對應至第一區16之終點16-2的發光二極體晶片被傳送後,平台10之主致動器移動平台10,使得推進銷模組30位於第二區17之起點17-1。隨後,第二區17所有的複數個發光二極體晶片之傳送過程係依序地由平台10的副致動器來執行。After the light emitting diode chip corresponding to the end point 16-2 of the
藉由如上述般選擇性使用平台10之主致動器及副致動器,可強化操作準確性且同時增加產能。By selectively using the main actuator and the sub-actuator of the
再次參照圖1,傳送裝置可更包含第二基板掃描單元50。第二基板掃描單元50位於工作台20上,且掃描被配置該第二基板上之電路走線的位置。Referring again to FIG. 1, the conveying device may further include a second
傳送裝置更包含推進銷模組30。推進銷模組30於傳送過程位置選擇性地傳送一或複數個發光二極體晶片至第二基板。The conveying device further includes a
本發明中,傳送可指發光二極體晶片之傳輸及發光二極體晶片之打線。In the present invention, the transfer can refer to the transmission of the light-emitting diode chip and the wire bonding of the light-emitting diode chip.
推進銷模組30在第一基板之一表面與第二基板被配置為互相面對的狀態下使用推進銷來推進第一基板之另一表面,藉此將複數個發光二極體晶片傳送至該第二基板。The
傳送裝置更包含推進銷掃描單元60。推進銷掃描單元60週期性地掃描推進銷是否位於正確位置(將於之後描述的推進銷外殼之中央)。例如,推進銷掃描單元60可在推進銷被置換後掃描推進銷是否位於正確位置。The conveying device further includes a push
傳送裝置更包含控制單元(未顯示),其具有記憶體。控制單元控制傳送裝置之每個構件,使得傳送裝置能夠運作。此後,將描述為傳送裝置之每個構件係直接執行某操作,惟此描述亦包含控制單元控制每個構件,使得每個構件執行對應的操作。The transmission device further includes a control unit (not shown), which has a memory. The control unit controls each component of the conveying device so that the conveying device can operate. Hereafter, it will be described that each component of the conveying device directly performs a certain operation, but this description also includes the control unit controlling each component so that each component performs the corresponding operation.
圖3係根據本發明之一實施例的推進銷模組的示意圖。Fig. 3 is a schematic diagram of a push pin module according to an embodiment of the present invention.
參照圖3,推進銷模組30包含複數個推進銷單元31、32及33。Referring to FIG. 3, the
複數個推進銷單元31、32及33之每個推進銷單元包含推進銷34及推進銷外殼35。於此,推進銷外殼35保護推進銷34且與第一基板接觸。Each of the plurality of
推進銷34係垂直地移動來推進第一基板之另一表面,因此對應至對應部分的發光二極體晶片被傳送至第二基板。The
複數個推進銷單元之每個推進銷單元31、32及33更包含真空單元36,能夠在發光二極體晶片被推進銷34傳送至第二基板後將第一基板與發光二極體晶片分隔開。Each of the
接者,參照圖4及5A,將描述根據本發明之一實施例的傳送發光二極體晶片之方法。參照圖4,準備第一基板300及第二基板310,目標發光二極體晶片被安裝在第一基板300的一表面上,而第二基板310具有電路走線(參見圖4之(a))。於此,第一基板300可為,例如,帶,且第二基板310可為,例如,基板或電路板。Next, referring to FIGS. 4 and 5A, a method of transferring a light-emitting diode chip according to an embodiment of the present invention will be described. 4, prepare a
然後,推進銷模組30基於第一基板300之掃描資訊,在第一基板300之另一表面上與目標發光二極體晶片320之對應部分接觸(參見圖4之(b))。Then, the
接者,推進銷34朝第一基板300之另一表面突出,因此目標發光二極體晶片320被傳送至第二基板(參見圖4之(c))。於此,一部分的第一基板可被推進銷34穿孔(參見圖4之(d))。Next, the
於此,透過將於之後描述的壓力控制單元37將目標發光二極體晶片320與第二基板310間之壓力維持在預定壓力。Here, the pressure between the
然後,推進銷34返回至推進銷外殼35(參見圖4之(e))。於此,由於推進銷34之突出,一部分的第一基板300因而拉長,或者一部分的第一基板300仍貼在目標發光二極體晶片320上。於此,藉由使用真空單元36按壓第一基板300,第一基板300便可返回原始位置。Then, the
接著,移動平台10及工作台20,使得推進銷模組30位於另一目標發光二極體晶片上,然後將目標發光二極體晶片傳送至第二基板310。Next, the
重複上述過程,安裝在第一基板300上的發光二極體晶片被全部傳送至第二基板310。By repeating the above process, all the light-emitting diode chips mounted on the
圖5B顯示根據本發明之另一實施例之傳送過程。根據本發明之另一實施例,第一基板400可為,例如,具有複數個發光二極體晶片被安裝在其一表面上的帶。進一步地,第二基板410可為發光二極體晶片將被傳送過去的傳送帶。Fig. 5B shows a transmission process according to another embodiment of the present invention. According to another embodiment of the present invention, the
再次參照圖3,本發明中,複數個發光二極體晶片可藉由使用複數個推進銷單元31、32及33來執行傳送過程而一次被傳送至第二基板。藉由使用複數個推進銷單元31、32及33,發光二極體晶片可快速地被傳送至第二基板。3 again, in the present invention, a plurality of light-emitting diode chips can be transferred to the second substrate at a time by using a plurality of
參照圖6,將描述根據本發明之另一實施例,其使用複數個推進銷單元來傳送發光二極體晶片的方法。Referring to FIG. 6, a method for transferring light-emitting diode chips using a plurality of push pin units according to another embodiment of the present invention will be described.
參照圖6A,複數個發光二極體晶片係貼在第一基板之一表面上,且第一基板之一表面係被配置為與第二基板互相面對。於此,推進銷模組30係與第一基板之另一表面接觸。Referring to FIG. 6A, a plurality of light-emitting diode chips are attached to a surface of the first substrate, and one surface of the first substrate is configured to face each other with the second substrate. Here, the
然後,複數個推進銷單元31、32及33將各別的推進銷34-1、34-2及34-3朝第一基板之另一表面推進,因此複數個對應的發光二極體晶片(圖6繪示了三個發光二極體晶片)被一次傳送至第二基板。Then, a plurality of
接著,參照圖6B,當平台10與工作台20移動了預定範圍時,各別的推進銷34-1、34-2及34-3置放於下次將從第一基板之上部被傳送之對應的複數個發光二極體的位置上。Next, referring to FIG. 6B, when the
在此狀態下,複數個推進銷單元31、32及33將各別的推進銷34-1、34-2及34-3朝第一基板之另一表面推進,因此複數個對應的發光二極體晶片被一次傳送至第二基板。In this state, a plurality of
重複上述過程,大部分被安裝在第一基板上的發光二極體晶片被傳送至第二基板。然而,被安裝在第一基板外週部分的發光二極體晶片或位於發光二極體晶片間的排列間隔(或排列位置)未統一之區域上的發光二極體晶片係無法使用推進銷單元31、32及33而被傳送至第二基板。無法使用推進銷單元31、32及33而被傳送至第二基板的發光二極體晶片不會經由第一基板掃描單元40之掃描過程被偵測出來。Repeating the above process, most of the light emitting diode chip mounted on the first substrate is transferred to the second substrate. However, the LED chip mounted on the outer peripheral part of the first substrate or the LED chip located on the area where the arrangement interval (or arrangement position) between the LED chips is not uniform cannot use the
因此,如圖6C所示,不會經由複數個推進銷單元31、32及33的傳送過程之發光二極體晶片係依序地使用複數個推進銷單元31、32及33之其中之一(圖6C繪示為推進銷單元32)而被傳送至第二基板。Therefore, as shown in FIG. 6C, the light-emitting diode chip that does not pass through the transfer process of the plurality of
再次參照圖3,推進銷模組30更包含壓力控制單元37。當推進銷34推進第一基板之另一表面時,發光二極體晶片與第二基板係彼此接觸。於此,壓力控制單元37將發光二極體晶片與第二基板間之壓力維持在預定壓力。Referring again to FIG. 3, the
較佳地,壓力控制單元37將發光二極體晶片與第二基板間之壓力維持在相同壓力。Preferably, the
壓力控制單元37可包含,例如,彈簧或音圈馬達。The
於此,如圖7A所示,彈簧具有壓力會線性上升至特定位移量(a)且在達到對應的位移量(a)後,即使位移量再增加,也會維持在恆定壓力(b)的特性,且藉由維持特定位移量或更高,推進銷34與第二基板間之壓力可維持在恆定壓力(b)。Here, as shown in Figure 7A, the spring has a pressure that linearly rises to a specific displacement (a) and after reaching the corresponding displacement (a), even if the displacement increases again, it will remain at a constant pressure (b) Characteristics, and by maintaining a specific displacement or higher, the pressure between the
此外,音圈馬達是線性馬達,包含永久磁鐵及線圈,且藉由電流流過線圈來執行線性動作。In addition, a voice coil motor is a linear motor, which includes a permanent magnet and a coil, and performs a linear motion by flowing current through the coil.
如圖7B所示,此音圈馬達具有壓力正比於施予音圈馬達之電流(或電壓)的特性。As shown in FIG. 7B, this voice coil motor has a characteristic that the pressure is proportional to the current (or voltage) applied to the voice coil motor.
因此,藉由施予特定電流(或電壓)(a)至音圈馬達,推進銷34與第二基板間之壓力可維持在恆定壓力(b)。Therefore, by applying a specific current (or voltage) (a) to the voice coil motor, the pressure between the
當推進銷34推進第一基板之另一表面將發光二極體晶片傳送至第二基板時,當不施予相同壓力時,被傳送至第二基板的發光二極體晶片之高度可能彼此不同。此外,當施予大壓力時,發光二極體晶片可能損壞。When the
本發明中,藉由使用壓力控制單元37將每一發光二極體晶片與第二基板間之壓力維持彼此相同,便可防止每一發光二極體晶片在傳送過程中損壞。In the present invention, by using the
進一步地,藉由壓力控制單元37,每一發光二極體晶片可在統一高度下被傳送至第二基板。Furthermore, with the
推進銷模組30更包含寬度改變單元38。寬度改變單元38基於第一基板掃描單元40所掃描的發光二極體晶片間的排列間隔來調整複數個推進銷單元31、32及33間的寬度。The pushing
被安裝在第一基板上的複數個發光二極體晶片間的排列間隔可彼此不同。當使用複數個推進銷單元31、32及33來執行傳送過程而不考慮發光二極體晶片間的排列間隔時,發光二極體晶片不能被妥適地傳送至第二基板。The arrangement intervals between the plurality of light emitting diode chips mounted on the first substrate may be different from each other. When a plurality of
例如,當特定區域中發光二極體晶片間的排列間隔比複數個推進銷單元31、32及33之寬度(較佳地,每一推進銷34之寬度)要寬或窄,推進銷34按壓發光二極體晶片之非中心部分(或在某些情形中發光二極體晶片未正確置放的部分),因而使得對應的發光二極體晶片不能妥適地被傳送至第二基板。For example, when the arrangement interval between light-emitting diode chips in a specific area is wider or narrower than the width of the plurality of
本發明中,可藉由在傳送過程中,寬度改變單元38基於發光二極體晶片件之排列間隔來即時調整複數個推進銷單元31、32及33之寬度進而解決上述問題。In the present invention, the
此後,將描述傳輸裝置所執行的傳輸方法。圖8係繪示根據本發明之一實施例的用以傳送發光二極體晶片至第二基板之方法的流程圖。Hereinafter, the transmission method performed by the transmission device will be described. FIG. 8 is a flowchart of a method for transferring a light-emitting diode chip to a second substrate according to an embodiment of the present invention.
參照圖8,為了決定哪個發光二極體晶片將被傳送至第二基板以及發光二極體晶片將被置放在第二基板的哪裡,控制單元可接收關於含有發光二極體晶片之第一基板的識別及第二基板的識別之輸入(S801)。Referring to FIG. 8, in order to determine which light-emitting diode chip will be transferred to the second substrate and where the light-emitting diode chip will be placed on the second substrate, the control unit may receive information about the first light-emitting diode chip containing the light-emitting diode chip. Input of the recognition of the substrate and the recognition of the second substrate (S801).
控制單元可基於關於第一基板的識別及第二基板的識別之輸入而從記憶體中擷取第一基板的相關資料及第二基板的相關資料(S802)。The control unit may retrieve the related data of the first substrate and the related data of the second substrate from the memory based on the input of the identification of the first substrate and the identification of the second substrate (S802).
第二基板的相關資料包含第二基板上電路走線之圖案(包含位置),將被傳送至電路走線的發光二極體晶片數量及發光二極體晶片之相對位置,以及所需的發光二極體數量。The relevant information of the second substrate includes the pattern (including position) of the circuit traces on the second substrate, the number of light-emitting diode chips to be transferred to the circuit traces and the relative positions of the light-emitting diode chips, and the required light emission Number of diodes.
此外,第一基板的相關資料包含發光二極體晶片之相對位置及其地圖。In addition, the related information of the first substrate includes the relative position of the light-emitting diode chip and its map.
然後,控制單元可決定第一基板及第二基板之初始方向,以傳送發光二極體晶片(S803)。Then, the control unit can determine the initial directions of the first substrate and the second substrate to transfer the light-emitting diode chip (S803).
在傳送過程中,一旦決定了第一基板及第二基板之初始方向,控制單元控制平台10及工作台20,使得第一基板及第二基板係定向在調整位置(S804)。During the transfer process, once the initial directions of the first substrate and the second substrate are determined, the control unit controls the
在步驟S804中,控制單元決定發光二極體晶片將被傳送至電路走線的位置,以及第一基板中要被傳送的發光二極體晶片的位置。In step S804, the control unit determines the position of the light-emitting diode chip to be transferred to the circuit trace and the position of the light-emitting diode chip to be transferred in the first substrate.
隨後,控制單元控制推進銷模組30,使得發光二極體晶片被傳送至第二基板(S805)。Subsequently, the control unit controls the
在對應的發光二極體晶片被傳送至第二基板後,控制單元決定是否有要下次傳送的發光二極體晶片(S806)。After the corresponding light-emitting diode chip is transferred to the second substrate, the control unit determines whether there is a light-emitting diode chip to be transferred next (S806).
當仍有發光二極體晶片要被傳送,控制單元回到步驟S804以執行傳送過程。當無LED晶片要被傳送時,傳送過程終止。When there are still LED chips to be transferred, the control unit returns to step S804 to perform the transfer process. When no LED chips are to be transferred, the transfer process is terminated.
圖9係繪示根據本發明之一實施例的用以傳送發光二極體晶片至第二基板之方法的流程圖。FIG. 9 is a flowchart of a method for transferring a light-emitting diode chip to a second substrate according to an embodiment of the present invention.
參照圖9,將初始基板置放在平台10上而處於待機模式、準備位置,初始基板具有安裝在其一表面的複數個發光二極體晶片(S900)。9, the initial substrate is placed on the
於此,被安裝在初始基板上的複數個發光二極體晶片間的排列間隔並未統一。當使用初始基板來執行傳送過程時,因複數個發光二極體晶片間的排列間隔並未統一,故必須基於掃描初始基板後的掃瞄資訊而經由每一推進銷單元(例如,32)來傳送每一發光二極體晶片。Here, the arrangement interval between the plurality of light-emitting diode chips mounted on the initial substrate is not uniform. When the initial substrate is used to perform the transfer process, since the arrangement interval between the plurality of light-emitting diode chips is not uniform, it is necessary to pass through each push pin unit (for example, 32) based on the scan information after scanning the initial substrate. Transfer each LED chip.
換句話說,在被安裝在初始基板上的複數個發光二極體晶片之傳送過程中,不能使用複數個推進銷單元31、32及33。In other words, in the process of transferring the plurality of light-emitting diode chips mounted on the initial substrate, the plurality of
本發明中,為了能夠使用複數個推進銷單元31、32及33來執行傳送過程,便執行了重排列過程。In the present invention, in order to be able to use a plurality of
同時,在步驟S900,第一基板被置放在工作台20上,複數個發光二極體晶片將被傳送至第一基板。At the same time, in step S900, the first substrate is placed on the
然後,第一基板掃描單元40掃描被安裝在初始基板上的複數個發光二極體晶片。於此,第一基板掃描單元40掃描被安裝在初始基板上的複數個發光二極體晶片的位置。Then, the first
然後,平台10移動至傳送過程位置,並執行傳送過程(S910)。Then, the
在此重排列過程中,複數個發光二極體晶片被傳送至第一基板,使得位於第二基板的電路走線間之排列間隔一起被調整,而第二基板係發光二極體晶片最後將被傳送過去的地方。In this rearrangement process, a plurality of light-emitting diode chips are transferred to the first substrate, so that the arrangement interval between the circuit traces on the second substrate is adjusted together, and the second substrate is the light-emitting diode chip finally The place where it was teleported.
亦即,藉由重排列過程,被安裝在第一基板之一表面上的複數個發光二極體晶片間的排列間隔及被配置在第二基板上的電路走線間的排列間隔係被事先調整。That is, through the rearrangement process, the arrangement interval between the plurality of light-emitting diode chips mounted on one surface of the first substrate and the arrangement interval between the circuit traces arranged on the second substrate are preset Adjustment.
如上述,因被安裝在初始基板上的複數個發光二極體晶片間的排列間隔並未統一,故要基於第一基板掃描單元40之掃瞄資訊而使用複數個推進銷單元31、32及33之其中之一(例如,32)來將每一發光二極體晶片傳送至第一基板。As mentioned above, since the arrangement intervals between the plurality of light-emitting diode chips mounted on the initial substrate are not uniform, a plurality of
在重排列過程結束後,在一表面上安裝有複數個發光二極體晶片的第一基板被置放在平台10上而處於待機模式、準備位置。此外,複數個發光二極體晶片將被傳送過去的第二基板被置放在工作台20上(S920)。After the rearrangement process is completed, the first substrate with a plurality of light-emitting diode chips mounted on one surface is placed on the
然後,第一基板掃描單元40掃描被安裝在第一基板上的複數個發光二極體晶片的位置。於此,第一基板掃描單元40掃描被安裝在第一基板上的複數個發光二極體晶片的排列間隔。於此,第一基板掃描單元40所掃描的掃描資訊被儲存在記憶體中。掃描資訊包括每一發光二極體晶片間的排列間隔。Then, the first
此掃描資訊被寬度改變單元38用來改變複數個推進銷單元31、32及33間之寬度。此外,掃描資訊可用來偵測未能被複數個推進銷單元31、32及33所傳送的發光二極體晶片(例如,當發光二極體晶片位於第一基板之外週部分或當對準間隔超過預定範圍,即當難以藉由寬度改變單元38來校正時)。This scanning information is used by the
進一步地,第二基板掃描單元50掃描被配置於第二基板之電路走線的位置。Further, the second
之後,平台10移動至傳送過程位置,並執行傳送過程(S930)。After that, the
於此,藉由上述再排列過程,被安裝在第一基板上的複數個發光二極體晶片之排列間隔係相對統一,因此複數個發光二極體晶片可藉由複數個推進銷單元31、32及33被一次傳送至第二基板。Here, through the above-mentioned rearrangement process, the arrangement intervals of the plurality of light-emitting diode chips mounted on the first substrate are relatively uniform, so the plurality of light-emitting diode chips can be provided by the plurality of
在傳送過程中,寬度改變單元38基於掃描資訊改變複數個推進銷單元31、32及33間的寬度,因此複數個發光二極體晶片能被妥善地傳送至第二基板。During the transfer process, the
進一步地,基於掃描資訊,推進銷模組30將晶片分類為要使用複數個推進銷單元31、32及33來加以傳送的第一發光二極體晶片,以及要使用複數個推進銷單元31、32及33之其中之一的推進銷單元32來加以傳送的第二發光二極體晶片。Further, based on the scanning information, the
基於分類結果,推進銷模組30使用複數個推進銷單元31、32及33將第一發光二極體晶片一次傳送至第二基板。然後,推進銷模組30隨後使用複數個推進銷單元31、32及33之其中之一的推進銷單元32將第二發光二極體晶片傳送至第二基板。Based on the classification result, the
應將本發明之發明範圍解釋為由以下的請求項所界定,而非以上的詳細說明,且由請求項之意義、範圍及均等所衍生的所有調整或置換應包含在本發明之發明範圍中。The scope of the present invention should be interpreted as defined by the following claims, rather than the above detailed description, and all adjustments or substitutions derived from the meaning, scope and equality of the claims should be included in the scope of the present invention .
根據本發明之任一實施例,能以高位置準確性來傳送極小尺寸的發光二極體晶片。According to any embodiment of the present invention, extremely small-sized light-emitting diode chips can be transferred with high position accuracy.
此外,藉由使用複數個推進銷單元來一次傳送發光二極體晶片,可提高產能。In addition, by using a plurality of push pin units to transfer light-emitting diode chips at a time, the productivity can be improved.
10:平台 20:工作台 30:推進銷模組 31:推進銷單元 32:推進銷單元 33:推進銷單元 34:推進銷 35:推進銷外殼 36:真空單元 37:壓力控制單元 38:寬度改變單元 40:第一基板掃描單元 50:第二基板掃描單元 60:推進銷掃描單元10: Platform 20: workbench 30: Push pin module 31: Push pin unit 32: Push pin unit 33: Push pin unit 34: Push pin 35: Push pin housing 36: Vacuum unit 37: Pressure control unit 38: width change unit 40: The first substrate scanning unit 50: Second substrate scanning unit 60: advance pin scanning unit
圖1係根據本發明之一實施例的傳送裝置的示意圖。Fig. 1 is a schematic diagram of a conveying device according to an embodiment of the present invention.
圖2A係根據本發明之一實施例的平台的示意圖。Fig. 2A is a schematic diagram of a platform according to an embodiment of the present invention.
圖2B係根據本發明之一實施例的第一基板的示意圖。FIG. 2B is a schematic diagram of the first substrate according to an embodiment of the present invention.
圖3係根據本發明之一實施例的推進銷模組的示意圖。Fig. 3 is a schematic diagram of a push pin module according to an embodiment of the present invention.
圖4、5A及5B係用以解釋根據本發明之一實施例的傳送方法的圖。4, 5A, and 5B are diagrams for explaining the transmission method according to an embodiment of the present invention.
圖6A、6B及6C係用以解釋根據本發明之另一實施例的傳送方法的圖。6A, 6B, and 6C are diagrams for explaining a transmission method according to another embodiment of the present invention.
圖7A及7B係用以解釋根據本發明之一實施例的壓力控制單元之特性的圖。7A and 7B are diagrams for explaining the characteristics of the pressure control unit according to an embodiment of the present invention.
圖8係繪示根據本發明之一實施例的用以傳送發光二極體晶片之方法的流程圖。FIG. 8 shows a flowchart of a method for transferring light-emitting diode chips according to an embodiment of the present invention.
圖9係繪示根據本發明之另一實施例的用以傳送發光二極體晶片之方法的流程圖。FIG. 9 is a flowchart of a method for transferring light-emitting diode chips according to another embodiment of the present invention.
10:平台10: Platform
20:工作台20: workbench
30:推進銷模組30: Push pin module
40:第一基板掃描單元40: The first substrate scanning unit
50:第二基板掃描單元50: Second substrate scanning unit
60:推進銷掃描單元60: advance pin scanning unit
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