KR102139571B1 - Method and apparatus for transfferring light emitting diode chip - Google Patents

Abstract

The transfer device for transferring the light emitting diode chip includes a stage on which a first substrate on which the light emitting diode chip is mounted is mounted, a work table on which a second substrate on which the light emitting diode chip is to be transferred is seated, and one surface of the first substrate and the And a push pin module for transferring the light emitting diode chip to the second substrate by pushing a portion corresponding to the light emitting diode chip on the other surface of the first substrate while the second substrate is disposed facing each other. The push pin module includes a pressure adjusting unit for maintaining the pressure between the light emitting diode chip and the second substrate at a predetermined pressure.

Description

Transfer device and method for transferring a light emitting diode chip{METHOD AND APPARATUS FOR TRANSFFERRING LIGHT EMITTING DIODE CHIP}

The present invention relates to a transfer device and method for transferring a light emitting diode chip.

In general, a light emitting diode chip is formed by forming a circuit of each chip on a wafer, and then is separated into a plurality of individual chips. The light emitting diode chip undergoes several transfer processes in a package and module process.

This transfer process is for the purpose of classifying according to defects in the quality of chips, or transferring it to a transfer tape or substrate to adjust the chip spacing or the direction of the chip, or for mounting. Transfer to the circuit board.

Conventional transfer devices (i.e., Pick & Place devices) transfer each light emitting diode chip to the substrate by picking each light emitting diode chip (Pick) and placing it on the substrate (Place). In this regard, Patent Publication No. 2016-0008187 discloses a chip transfer device and a transfer method.

On the other hand, in recent years, ultra-small light-emitting diode chips (for example, micro LEDs) having a chip size of 5 to 300 um have been spotlighted as next-generation display devices. The ultra-small light-emitting diode chip can be applied to optical applications that require low power consumption, small size, and light weight, and research and development have been actively conducted.

Conventional pick-and-place transfer devices and methods destroy the vacuum at the time of adsorbing the light-emitting diode chip in the pick-up step and the vacuum at the center to place the light-emitting diode chip adsorbed in the place step. To do this, use a collet with a hole through which air flows. However, when the diameter of the collet hole is several um, it is impossible to secure sufficient vacuum pressure to hold the light emitting diode chip and air pressure to destroy the vacuum.

As the size of the light emitting diode chip has decreased to a few micrometers, there is a problem in that it is difficult to transfer the light emitting diode chip using a conventional pick and place method.

The present invention was designed to solve this problem, and one surface of a first substrate (including a substrate such as a mounting tape or a wafer) on which a light emitting diode chip is mounted and a second substrate to which a light emitting diode chip is transferred (transfer tape, substrate, It is intended to provide a transfer device and a transfer method for transferring a light emitting diode chip to a transfer tape by pushing the other surface of the first substrate while the circuit board (including the circuit board) is disposed facing each other. However, the technical problems to be achieved by the present embodiment are not limited to the technical problems as described above, and other technical problems may exist.

As a technical means for achieving the above-described technical problem, an embodiment of the present invention in a transfer device for transferring a light-emitting diode chip, a stage on which a first substrate on which the light-emitting diode chip is mounted is seated, the light-emitting diode The light emitting by pushing a portion corresponding to the light emitting diode chip on the work table on which the second substrate to which the chip is transferred is mounted, and one surface of the first substrate and the second substrate are disposed to face each other, on the other surface of the first substrate. And a push pin module for transferring the diode chip to the second substrate. The push pin module includes a pressure adjusting unit for maintaining the pressure between the light emitting diode chip and the second substrate at a predetermined pressure.

In another embodiment of the present invention, in a method of transferring a light-emitting diode chip, preparing a first substrate on which the light-emitting diode chip is mounted on one surface, preparing a second substrate on which the light-emitting diode chip is transferred, and the agent And transferring the light emitting diode chip to the second substrate by pushing a portion corresponding to the light emitting diode chip on the other surface of the first substrate while one surface of the first substrate and the second substrate are disposed to face each other. The step of transferring the light emitting diode chip to the second substrate includes maintaining the pressure between the light emitting diode chip and the second substrate at a predetermined pressure.

The above-described problem solving means are merely exemplary and should not be construed as limiting the present invention. In addition to the exemplary embodiments described above, there may be additional embodiments described in the drawings and detailed description of the invention.

According to any one of the above-described problem solving means of the present invention, it is possible to transfer the ultra-small light-emitting diode chip with high precision.

In addition, it is possible to improve productivity by temporarily transferring the light emitting diode chip using the plurality of push pin units.

1 is a schematic diagram of a transfer apparatus according to an embodiment of the present invention.
2A is a schematic diagram of a stage according to an embodiment of the present invention.
2B is a schematic diagram of a first substrate according to an embodiment of the present invention.
3 is a schematic diagram of a push pin module according to an embodiment of the present invention.
4 and 5a and 5b are views for explaining the transfer method according to an embodiment of the present invention.
6A to 6C are diagrams for describing a transfer method according to another embodiment of the present invention.
7A and 7B are diagrams for explaining characteristics of a pressure regulating unit according to an embodiment of the present invention.
8 is a flowchart illustrating a method of transferring a light emitting diode chip according to an embodiment of the present invention.
9 is a flowchart illustrating a method of transferring a light emitting diode chip according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present invention pertains may easily practice. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. In addition, in order to clearly describe the present invention in the drawings, parts irrelevant to the description are omitted, and like reference numerals are assigned to similar parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element in between. . Also, when a part is said to “include” a certain component, it means that the component may further include other components, not exclude other components, unless specifically stated otherwise. However, it should be understood that the existence or addition possibilities of numbers, steps, actions, components, parts or combinations thereof are not excluded in advance.

In the present specification, the term “unit” includes a unit realized by hardware, a unit realized by software, and a unit realized by using both. Further, one unit may be realized by using two or more hardware, and two or more units may be realized by one hardware.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram of a transfer apparatus according to an embodiment of the present invention. The transfer device will be described with reference to FIG. 1. The transfer device includes a stage 10.

The stage 10 is provided with a first substrate on which a plurality of light emitting diode chips are mounted. The'first substrate' is a substrate on which a light emitting diode chip is mounted, and may include a tape, a wafer, a substrate, and the like.

The stage 10 holds the first substrate by supporting the periphery of the first substrate. In the present invention, the light emitting diode chip is an ultra-compact semiconductor device having a size of 5um to 300um, and may mean a product before packaging and a packaged product. Further, in the present invention, the light emitting diode chip may mean a micro LED (light emitting diode).

The central portion of the stage 10 is open, and the light emitting diode chip mounted on the first substrate is transferred to the second substrate located below the stage 10. The stage 10 can move between the ready position (the position in Fig. 1) and the transfer process position (the position on the work table) (see arrow).

The stage 10 moves along the X and Y axes so that the push pin module 30 can transfer each light emitting diode chip to the second substrate at the same position during the transfer process.

The transfer device further includes a first substrate scanning unit 40 located below the preparation position.

The first substrate scanning unit 40 scans the positions of the plurality of light emitting diode chips mounted on the first substrate when the stage 10 is waiting at the ready position. For example, the first substrate scanning unit 40 may scan an arrangement interval between a plurality of light emitting diode chips mounted on the first substrate.

The transfer device further includes a work table 20. A second substrate on which the plurality of light emitting diode chips mounted on the first substrate is to be transferred is mounted on the work table 20. Here, the'second substrate' is a substrate to which the light emitting diode chip is transferred, and includes a tape, a substrate, a circuit board, and the like.

The work table 20 is located below the stage 10 in the transfer process position.

2A is a schematic diagram of a stage according to an embodiment of the present invention. Referring to FIG. 2A, the stage 10 includes main actuators 11 and 12 and sub-actuators 13 and 14.

Sub-actuators 13 and 14 are disposed on the main actuators 11 and 12, and the main actuators 11 and 12 include an X-axis motor 11 and a Y-axis motor 12. The sub-actuators 13 and 14 also include an X-axis motor 13 and a Y-axis motor 14.

Here, the main actuators 11 and 12 may be configured as a first motor, for example, a linear motor, a servo motor, or a step motor. The first motor is a motor used in various technical fields and is manufactured to be used in a relatively wide working area. However, the first motor may cover a relatively wide working area, but the response time is slow and precise motion control is difficult.

Meanwhile, the sub-actuators 13 and 14 may be configured as a second motor, for example, a voice coil motor (VCM), a piezo motor, or an ultrasonic motor. The second motor has a fast response speed and precise motion control, but the maximum travel distance is relatively short, thereby narrowing the work area.

When only the first motor is used as the actuator of the stage 10, there is a problem that the response speed is low and the fine motion control is difficult, resulting in poor productivity and accuracy of work.

In addition, when only the second motor is used as the actuator of the stage 10, high speed or fine motion control is possible, but there is a problem that the working area is limited.

In the present invention, the main actuators 11 and 12 and the sub actuators 13 and 14 are selectively used as actuators of the stage 10 to solve the above-described problems. That is, when the stage 10 needs to move a long section between work areas during the transfer process, the main actuators 11 and 12 are used to control the stage 10, and the stage 10 is controlled at high speed or precision. When necessary, the sub-actuators 13 and 14 are used.

2B is a view showing the first substrate. Referring to FIG. 2B, the first substrate has a plurality of regions. For example, the first substrate may include a first region 16, a second region 17 and a third region 18. The plurality of regions of the first substrate may be determined based on the positions of the plurality of light emitting diode chips scanned by the first substrate scanning unit 40.

When the stage 10 moves, for example, to the standby position in the first region 16 (the point for starting work in the first region), the stage 10 is controlled by the main actuators 11 and 12. On the other hand, when the stage 10 moves between the LED chip pitch, the stage 10 is controlled by the sub-actuators 13 and 14. Here, the movement between the light emitting diode chip pitches means that the stage 10 moves as much as the pitch of the light emitting diode chips. Specifically, when the push pin module 30 is located on the first light emitting diode chip, when the stage 10 moves between the light emitting diode chip pitches, the push pin module 30 is adjacent to the first light emitting diode chip. It is located on the second light emitting diode chip.

Looking at the process in which the stage 10 is controlled by using the main actuators 11 and 12 and the sub-actuators 13 and 14, the push pin module 30 is moved to the first area 16 by the main actuators 11 and 12. ), the stage 10 is moved to be positioned on the starting point 16-1. Here, the sub-actuators 13 and 14 do not operate.

Thereafter, the stage 10 moves between the LED chip pitch. That is, the transfer process for the plurality of light emitting diode chips included in the first region 16 is sequentially performed by the sub actuators 13 and 14. When the transfer process for the first region 16 is performed, the main actuators 11 and 12 do not operate. By performing the transfer process by the sub actuators 13 and 14, productivity and precision in the transfer process can be increased.

After the light emitting diode chip corresponding to the end point 16-2 of the first area 16 is transferred, the push pin module 30 is started by the main actuators 11 and 12 to start the second area 17. The stage 10 is moved so as to be positioned on (17-1). Subsequently, the transfer process for the plurality of light emitting diode chips included in the second region 17 is sequentially performed by the sub-actuators 13 and 14.

In this way, by selectively using the main actuators 11 and 12 and the sub-actuators 13 and 14, productivity can be improved and work accuracy can be improved.

Meanwhile, the work table 20 may also include a main actuator and a sub-actuator, like the stage 10. That is, the sub-actuator is disposed on the main actuator, and the main actuator and the sub-actuator may be configured to be the same as the main actuators 11 and 12 and the sub-actuators 13 and 14 of the stage 10, respectively.

Referring back to FIG. 1, the transfer device may further include a second substrate scanning unit 50. The second substrate scanning unit 50 is located on the work table 20 and scans the location of the circuit traces disposed on the second substrate.

The transfer device further includes a push pin module 30. The push pin module 30 selectively transfers one or a plurality of light emitting diode chips to a second substrate at a transfer process position.

In the present invention, the transfer may mean transfer of the light emitting diode chip and adhesion (bonding) of the light emitting diode chip.

The push pin module 30 transfers a plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate using the push pin in a state where one surface of the first substrate and the second substrate are disposed to face each other.

The transfer device further includes a push pin scan unit 60. The push pin scan unit 60 periodically scans whether the push pin is located in the correct position (the center of the push pin housing to be described later). For example, the push pin scan unit 60 may scan whether the push pin is in the correct position after the push pin is replaced.

The transfer device may further include a control unit (not shown) having a memory. The control unit controls each component of the transfer device so that the transfer device operates. Hereinafter, although each configuration of the transfer apparatus is described to directly perform an operation, such description includes that the control unit controls each configuration so that each configuration performs the corresponding operation.

3 is a schematic diagram of a push pin module according to an embodiment of the present invention.

Referring to FIG. 3, the push pin module 30 includes a plurality of push pin units 31, 32 and 33.

Each of the plurality of push pin units 31, 32 and 33 includes a push pin 34 and a push pin housing 35. Here, the pressing pin housing 35 protects the pressing pin 34 and contacts the first substrate.

The push pin 34 moves the vertical direction to push the other surface of the first substrate to transfer the light emitting diode chip corresponding to the portion to the second substrate.

Each of the plurality of push pin units 31, 32, and 33 is a vacuum unit that allows the first substrate to be separated from the light emitting diode chip after the light emitting diode chip is transferred to the second substrate by the push pin 34. 36).

Next, with reference to FIGS. 4 and 5A, a method of transferring a light emitting diode chip according to an embodiment of the present invention will be described. Referring to FIG. 4, a first substrate 300 on which a target light emitting diode chip 320 is mounted and a second substrate 310 having a circuit trace 330 are prepared (a). Here, the first substrate 300 may be, for example, tape, and the second substrate 310 may be, for example, a substrate or a circuit board.

Subsequently, the push pin module 30 contacts the corresponding position of the target LED chip 320 on the other surface of the first substrate 300 based on the scan information of the first substrate 300 (b).

Thereafter, the push pin 34 protrudes toward the other surface of the first substrate 300, and accordingly, the target light emitting diode chip 320 is transferred to the second substrate 310 (c). Here, a part of the first substrate 300 may be pierced by the pressing pin 34 (d).

At this time, the pressure between the target light emitting diode chip 320 and the second substrate 310 is maintained at a predetermined pressure through the pressure adjusting unit 37 described later.

Subsequently, the push pin 34 returns to the push pin housing 35 again (e). Here, a part of the first substrate 300 may be stretched due to the protrusion of the push pin 34 or a portion of the first substrate 300 may still be attached to the target light emitting diode chip 320. In this case, the first substrate 300 may be returned to its original position by pressing the first substrate 300 using the vacuum unit 36.

Thereafter, after the first substrate stage 10 and the work table 20 are moved such that the push pin module 30 is positioned on another target light emitting diode chip, another target light emitting diode chip is transferred to the second substrate 310. do.

All the light emitting diode chips mounted on the first substrate 300 are transferred to the second substrate 310 while repeating the above-described process.

5B illustrates a transfer process according to another embodiment of the present invention. According to another embodiment of the present invention, the first substrate 400 may be, for example, a tape on which a plurality of light emitting diode chips are mounted. Further, the second substrate 410 may be a transfer tape to which the light emitting diode chip is to be transferred.

Referring back to FIG. 3, in the present invention, a plurality of light emitting diode chips can be transferred to a second substrate at a time by performing a transfer process using a plurality of push pin units 31, 32 and 33. By using the plurality of push pin units 31, 32 and 33, the light emitting diode chip can be quickly transferred to the second substrate.

Referring to FIG. 6 for a moment, a method of transferring a light emitting diode chip using a plurality of push pin units according to an embodiment of the present invention will be described.

Referring to FIG. 6A, a plurality of light emitting diode chips are attached to one surface of the first substrate, and one surface of the first substrate and the second substrate are disposed to face each other. At this time, the push pin module 30 contacts the other surface of the first substrate.

Thereafter, the plurality of push pin units 31, 32, and 33 protrude each of the push pins 34-1, 34-2, and 34-3 toward the other surface of the first substrate, thereby corresponding to a plurality of light emitting diode chips (FIG. In 6, 3) are transferred to the second substrate at a time.

Subsequently, referring to FIG. 6B, the stage 10 and the work table 20 move by a predetermined range so that each push pin 34-1, 34-2, 34-3 is transferred from the top of the first substrate to the next. It is arranged at a position corresponding to a plurality of light emitting diode chips to be.

In this state, the plurality of push pin units 31, 32, and 33 protrude each of the push pins 34-1, 34-2, and 34-3 toward the other surface of the first substrate, thereby providing a corresponding plurality of light emitting diode chips. It is transferred to the second substrate at a time.

While repeating the above-described process, most of the light emitting diode chips mounted on the first substrate are transferred to the second substrate. However, the light emitting diode chip mounted on the outer periphery of the first substrate or the light emitting diode chip located in a region where the arrangement interval (or arrangement position) between the light emitting diode chips is uneven may be performed using a plurality of push pin units 31, 32, 33. It cannot be transferred to the second substrate. A light emitting diode chip that cannot be transferred using a plurality of push pin units 31, 32, and 33 can be detected through a scan process through the first substrate scan unit 40.

Accordingly, as shown in FIG. 6C, a light emitting diode chip that has not been transferred by the plurality of push pin units 31, 32, and 33 is one of the plurality of push pin units 31, 32, and 33 (32 in FIG. 6C). Is sequentially transferred to the second substrate.

Referring back to FIG. 3, the push pin module 30 further includes a pressure regulating unit 37. In the pressure adjusting unit 37, when the pressing pin 34 pushes the other surface of the first substrate, the light emitting diode chip and the second substrate come into contact with each other. At this time, the pressure between the light emitting diode chip and the second substrate is maintained at a predetermined pressure. Order.

Preferably, the pressure regulating unit 37 maintains the same pressure between each light emitting diode chip and the second substrate.

The pressure regulating unit 37 may include, for example, a spring or voice coil motor.

At this time, the spring has a characteristic that maintains a constant pressure (b) even if the amount of displacement increases even after the displacement amount (a), the pressure increases linearly up to a certain displacement amount (a), as shown in Figure 7a, the specific displacement amount (a) or more By holding, the pressure between the pressing pin 34 and the second substrate can be maintained at a constant pressure b.

In addition, the voice coil motor is a linear motor including a permanent magnet and a coil, and moves in a straight line through a current flowing through the voice coil.

The voice coil motor has a characteristic in which pressure is proportional to the current (or voltage) applied to the voice coil motor as shown in FIG. 7B.

Therefore, by applying a specific current (or voltage) (a) to the voice coil motor, the pressure between the push pin 34 and the second substrate can be maintained at a constant pressure (b).

When the push pin 34 pushes the other surface of the first substrate to transfer the light emitting diode chip to the second substrate, if the same pressure is not applied, the heights of the light emitting diode chips transferred to the second substrate may be different from each other. In addition, when a large pressure is applied, the light emitting diode chip may be damaged.

In the present invention, by using the pressure control unit 37 to maintain the same pressure between each light-emitting diode chip and the second substrate, it is possible to prevent damage to each light-emitting diode chip in the transfer process.

Further, each light emitting diode chip can be transferred to the second substrate at a uniform height by the pressure adjusting unit 37.

The push pin module 30 further includes a variable width unit 38. The variable width unit 38 adjusts the width between the plurality of push pin units 31, 32 and 33 based on the arrangement interval between the light emitting diode chips scanned by the first base material scan unit 40.

The spacing between the plurality of light emitting diode chips mounted on the first substrate may be different from each other, and the transfer process is performed using the plurality of push pin units 31, 32 and 33 without considering the spacing between the light emitting diode chips. In some cases, the light emitting diode chip may not be properly transferred to the second substrate.

For example, when the spacing between the light emitting diode chips in a specific area is narrow or wide compared to the width (preferably the width of each push pin 34) of the plurality of push pin units 31, 32, 33, push The pin 34 presses a portion other than the center of the light emitting diode chip (in some cases, a portion where the light emitting diode chip is not located), and accordingly, the light emitting diode chip cannot be properly transferred to the second substrate.

In the present invention, the above-described problem can be solved by adjusting the width between the plurality of push pin units 31, 32 and 33 in real time based on the arrangement interval between the light emitting diode chips during the transfer process.

Hereinafter, a transfer method performed by the transfer apparatus will be described. 8 is a flowchart illustrating a method of transferring a light emitting diode chip to a second substrate according to an embodiment of the present invention.

Referring to FIG. 8, in order to determine which light emitting diode chips are to be transferred to the second substrate and where to place the light emitting diode chips on the second substrate, the control unit identifies the first substrate including the light emitting diode chips And an input regarding identification of the second description (S801).

The control unit may extract the first description related data and the second description related data from the memory based on the input related to the identification of the first description and the identification of the second description (S802 ).

The second substrate related data includes a pattern of circuit traces on the second substrate (including position), the number of light emitting diode chips to be transferred to the circuit trace and the relative position of the light emitting diode chip, and the quality requirements of the light emitting diode chip.

In addition, the data related to the first substrate include a relative position of the light emitting diode chip and a map therefor.

Thereafter, the control unit may determine initial orientations of the first substrate and the second substrate for the transfer of the light emitting diode chip (S803).

Once the initial orientation of the first substrate and the second substrate is determined, the control unit controls the stage 10 and the work table 20 so that the first substrate and the second substrate are oriented to the position of tuning in the transfer process. (S804).

In step S804, the control unit determines the position of the circuit trace to which the light emitting diode chip is to be transferred and the light emitting diode chip to be transferred in the first substrate.

Subsequently, the control unit controls the push pin module 30 so that the light emitting diode chip is transferred to the second substrate (S805).

The control unit determines whether the light emitting diode chip to be transferred next exists after the light emitting diode chip is transferred to the second substrate (S806).

If the light emitting diode chip to be transferred remains, the control unit returns to step S804 to perform the transfer process. If there is no light emitting diode chip to be transferred, the transfer process ends.

9 is a flowchart illustrating a method of transferring a light emitting diode chip to a second substrate according to another embodiment of the present invention.

Referring to FIG. 9, first, a preliminary base material having a plurality of light emitting diode chips mounted on one surface is seated on the stage 10 waiting in a ready position (S900 ).

Here, the arrangement interval between the plurality of light emitting diode chips mounted on the preliminary substrate is uneven. When the transfer process is performed using such a preliminary substrate, since the arrangement interval between the plurality of light emitting diode chips is not uniform, after scanning the preliminary substrate, light emission is performed by one push pin unit (for example, 32) based on the scan information It is necessary to transfer each of the diode chips.

That is, the plurality of push pin units 31, 32, and 33 cannot be used in the transfer process of the plurality of light emitting diode chips mounted on the preliminary substrate.

In the present invention, a rearrangement process is performed to perform a transfer process using one or a plurality of push pin units 31, 32 and 33.

Meanwhile, in step S900, a first substrate on which a plurality of light emitting diode chips are to be transferred is seated on the work table 20.

Thereafter, the first substrate scanning unit 40 scans a plurality of light emitting diode chips mounted on the preliminary substrate. At this time, the first substrate scanning unit 40 scans the positions of the plurality of light emitting diode chips mounted on the preliminary substrate.

Subsequently, the stage 10 is moved to the transfer process position, and the transfer process is performed (S910).

In this rearrangement process, a plurality of light emitting diode chips are transferred to the first substrate such that the light emitting diode chips are synchronized with the spacing between the circuit traces disposed on the second substrate to be finally transferred.

That is, through the rearrangement process, the spacing between the plurality of light emitting diode chips mounted on one surface of the first substrate and the spacing between the circuit traces disposed on the second substrate are previously tuned.

As described above, since the arrangement interval between the plurality of light emitting diode chips mounted on the preliminary substrate is not uniform, among the plurality of push pin units 31, 32, 33 based on the scan information of the first substrate scanning unit 40 Each of the light emitting diode chips is transferred to the first substrate using one (for example, 32).

After the rearrangement process is completed, a first substrate on which a plurality of light emitting diode chips are mounted on one surface is seated on the stage 10 waiting in a ready position. Then, a second substrate on which the plurality of light emitting diode chips are to be transferred is mounted on the work table 20 (S920).

Subsequently, the first substrate scanning unit 40 scans the positions of the plurality of light emitting diode chips mounted on the first substrate. Here, the first substrate scan unit 40 checks the arrangement interval of the plurality of light emitting diode chips mounted on the first substrate. At this time, the scan information scanned by the first substrate scanning unit 40 is stored in the memory. The scan information includes an arrangement interval between each light emitting diode chip.

This scan information is used by the variable width unit 39 to vary the width between the plurality of push pin units 31, 32, 33. In addition, the scan information is located on the outer peripheral portion of the light emitting diode chips that cannot be transferred by the plurality of push pin units 31, 32, 33 (for example, when the arrangement interval is out of a predetermined range (ie, It is used to detect) when it is difficult to correct through the variable width unit 39).

Further, the second substrate scanning unit 50 scans the position of the circuit trace disposed on the second substrate.

Thereafter, the stage 10 is moved to the transfer process position, and the transfer process is performed (S930).

At this time, since the arrangement interval between the plurality of light-emitting diode chips mounted on the first substrate is relatively uniform through the rearrangement process described above, the plurality of light-emitting diode chips are temporarily held through the plurality of push pin units 31, 32, 33. It can be transferred to the second substrate.

During the transfer process, a plurality of light emitting diode chips can be well transferred to the second substrate by varying the width between the plurality of push pin units 31, 32 and 33 based on the scan information.

In addition, the push pin module 30 uses the plurality of push pin units 31, 32, and 33 based on the scan information to transfer first processing light emitting diode chips and a plurality of push pin units 31, 32, 33. The second light emitting diode chips to be transferred are classified using one of the 32.

The push pin module 30 transfers the first light emitting diode chips to the second substrate at a time using a plurality of push pin units 31, 32 and 33 based on the classification result. Thereafter, the push pin module 30 sequentially transfers the second light emitting diode chips to the second substrate using one of the plurality of push pin units 31, 32, and 33.

The scope of the present invention is indicated by the following claims rather than the above detailed description, and it should be interpreted that all changes or modified forms derived from the meaning and scope of the claims and equivalent concepts thereof are included in the scope of the present invention. do.

10: Stage
20: work table
30: Push pin module
31: Push pin unit
32: Push pin unit
33: Push pin unit
34: Push pin
35: Push pin housing
36: vacuum unit
37: pressure regulating unit
38: variable width unit
40: first substrate scanning unit
50: second substrate scanning unit
60: push pin scan unit

Claims (8)

In the transfer device for transferring a light-emitting diode chip,
A stage on which a first substrate on which the light emitting diode chip is mounted is mounted;
A work table on which a second substrate to which the light emitting diode chip is transferred is seated; And
A push pin module for transferring the light emitting diode chip to the second substrate by pushing a portion corresponding to the light emitting diode chip on the other surface of the first substrate with one surface of the first substrate facing the second substrate
Including,
The push pin module includes a pressure adjusting unit for maintaining the pressure between the light emitting diode chip and the second substrate at a predetermined pressure,
The pressure regulating unit includes a voice coil motor (VCM),
The push pin module includes a plurality of push pin units, each of which includes a push pin for pushing the other surface of the first substrate,
The push pin module temporarily transfers a plurality of light emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate,
The push pin module further comprises a variable width unit for varying the width between the plurality of push pin units based on the spacing between the light emitting diode chips.
delete delete According to claim 1,
A second substrate scanning unit for scanning the position of the circuit trace disposed on the second substrate
It further comprises, a transfer device.
According to claim 1,
A first substrate scanning unit for scanning the position of the light emitting diode chip mounted on the first substrate
It further comprises, a transfer device.
delete According to claim 1,
The push pin module is a transfer device for transferring the light emitting diode chip out of a predetermined range between the light emitting diode chips to the second substrate using one of the plurality of push pin units.
delete

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