KR102031603B1 - Method and apparatus for transfferring light emitting diode chip - Google Patents

Abstract

The transfer apparatus for transferring a light emitting diode chip includes a stage on which a first substrate on which a plurality of light emitting diode chips is mounted is seated, a work table on which a second substrate on which the plurality of light emitting diode chips is to be transferred is seated, and the first substrate. And a push pin module for transferring the plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate in a state in which one surface of the second substrate and the second substrate face each other. The push pin module includes a plurality of push pin units each including a push pin for pushing the other surface of the first substrate. The push pin module temporarily transfers a plurality of light emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate.

Description

Transfer device and method for transferring a light emitting diode chip {METHOD AND APPARATUS FOR TRANSFFERRING LIGHT EMITTING DIODE CHIP}

The present invention relates to a transfer apparatus and method for transferring a light emitting diode chip.

In general, a light emitting diode chip is formed by forming a circuit of each chip on a wafer and then separating the chip into a plurality of individual chips. Such a light emitting diode chip is subjected to several transfer processes in a package and a module process.

According to the purpose, the transfer process is for the purpose of sorting according to the defect of the good quality of the chip, transferring the transfer tape or the substrate to adjust the chip spacing or the direction of the chip, or for the purpose of mounting. Transfer to the circuit board.

Conventional transfer devices (i.e. pick and place devices) transfer each LED chip to a substrate by picking each LED chip and placing it on a substrate. In this regard, Japanese Patent Laid-Open No. 2016-0008187 discloses a chip transfer device and a transfer method.

On the other hand, ultra-small light emitting diode chips (eg, micro LEDs) having chip sizes of about 5 μm to 300 μm have been spotlighted as next generation display devices. Such micro LED chips are applicable to optical applications requiring low power, miniaturization, and light weight, and research and development are being actively conducted.

The conventional pick-and-place transfer apparatus and method breaks the vacuum at the center so as to place the vacuum at the time of adsorbing the light emitting diode chip in the pick-up step and the light-emitting diode chip adsorbed at the place step. Use a collet with a hole through which air flows. However, when the diameter of the collet hole is several um, sufficient vacuum pressure to hold the light emitting diode chip and air pressure to break the vacuum cannot be secured.

As the size of the light emitting diode chip is reduced to several microns, it is difficult to transfer the light emitting diode chip using a conventional pick and place method.

The present invention has been devised to solve such a problem, and includes a surface of a first substrate (including a substrate such as a mounting tape and a wafer) on which a light emitting diode chip is mounted and a second substrate (transfer tape, a substrate, It is intended to provide a transfer device and a transfer method for transferring a light emitting diode chip to a transfer tape by pushing the other surface of the first substrate in a state where the circuit board) is disposed to face each other. However, the technical problem to be achieved by the present embodiment is not limited to the technical problems as described above, and other technical problems may exist.

As a technical means for achieving the above-described technical problem, an embodiment of the present invention, in the transfer device for transferring the light emitting diode chip, the stage on which the first substrate on which the plurality of light emitting diode chip is mounted is mounted, The plurality of light emitting diode chips may be moved by pushing the other surface of the first substrate while the work table on which the second substrate on which the plurality of light emitting diode chips are to be transferred is seated and the one surface of the first substrate and the second substrate are disposed to face each other. And a push pin module for transferring to the second substrate. The push pin module includes a plurality of push pin units each including a push pin for pushing the other surface of the first substrate. The push pin module temporarily transfers a plurality of light emitting diode chips corresponding to each push pin of the plurality of push pin units to the second substrate.

According to another embodiment of the present invention, in the method of transferring a light emitting diode chip, preparing a first substrate on which one surface of the plurality of light emitting diode chips is mounted, and preparing a second substrate on which the plurality of light emitting diode chips are to be transferred. And transferring the other surface of the first substrate to the second substrate by pushing the other surface of the first substrate while the one surface of the first substrate and the second substrate are disposed to face each other. The transferring of the plurality of light emitting diode chips to the second substrate includes transferring a plurality of light emitting diode chips corresponding to each of the plurality of pressing pins to the second substrate at one time using a plurality of push pins. do.

The above-mentioned means for solving the problems are merely exemplary, and should not be construed to limit the present invention. In addition to the exemplary embodiments described above, there may be additional embodiments described in the drawings and detailed description of the invention.

According to any one of the problem solving means of the present invention described above, it is possible to transfer the ultra-small light emitting diode chip with high accuracy.

In addition, productivity can be improved by temporarily transferring the light emitting diode chips using the plurality of push pin units.

1 is a schematic diagram of a transfer apparatus according to an embodiment of the present invention.
2A is a schematic diagram of a stage in accordance with one embodiment of the present invention.
2B is a schematic diagram of the first substrate according to an embodiment of the present invention.
3 is a schematic diagram of a push pin module according to an embodiment of the present invention.
4 and 5A and 5B are views for explaining a transfer method according to an embodiment of the present invention.
6A to 6C are diagrams for describing a transfer method according to another exemplary embodiment of the present invention.
7A and 7B are views for explaining characteristics of the pressure regulating unit according to the exemplary embodiment of the present invention.
8 is a flowchart illustrating a method of transferring a light emitting diode chip according to an embodiment of the present invention.
9 is a flowchart illustrating a method of transferring a light emitting diode chip according to another embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another element in between. . In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components, unless specifically stated otherwise, one or more other features It is to be understood that the present disclosure does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

In the present specification, the term 'unit' includes a unit realized by hardware, a unit realized by software, and a unit realized by both. In addition, one unit may be realized using two or more pieces of hardware, and two or more units may be realized by one piece of hardware.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic diagram of a transfer apparatus according to an embodiment of the present invention. A transfer device will be described with reference to FIG. 1. The transfer apparatus includes a stage 10.

In the stage 10, a first substrate on which a plurality of light emitting diode chips are mounted is mounted. The first substrate is a substrate on which a light emitting diode chip is mounted, and may include a tape, a wafer, a substrate, and the like.

The stage 10 holds the first substrate by supporting the periphery of the first substrate. In the present invention, the light emitting diode chip is a micro semiconductor device having a size of 5um to 300um, and may refer to a product before packaging and a packaged product. In addition, in the present invention, the light emitting diode chip may mean a micro LED (Light Emitting Diode).

The central portion of the stage 10 is open, through which the light emitting diode chip mounted on the first substrate is transferred to the second substrate located below the stage 10. The stage 10 can move between the ready position (position in FIG. 1) and the transfer process position (position on the work table) (see arrow).

The stage 10 moves along the X and Y axes so that the push pin module 30 can transfer each light emitting diode chip to the second substrate at the same position during the transfer process.

The transfer apparatus further includes a first substrate scanning unit 40 located below the preparation position.

The first substrate scanning unit 40 scans the positions of the plurality of light emitting diode chips mounted on the first substrate when the stage 10 is waiting at the ready position. For example, the first substrate scanning unit 40 may scan an array interval between a plurality of light emitting diode chips mounted on the first substrate.

The transfer apparatus further includes a work table 20. On the work table 20, a second substrate on which the plurality of light emitting diode chips mounted on the first substrate is to be transferred is mounted. Here, the second substrate is a substrate on which the LED chip is to be transferred, and includes a tape, a substrate, a circuit board, and the like.

The work table 20 is located below the stage 10 at the transfer process position.

2A is a schematic diagram of a stage in accordance with one embodiment of the present invention. Referring to FIG. 2A, the stage 10 includes a main actuator 11, 12 and a sub actuator 13, 14.

Sub-actuators 13 and 14 are disposed on the main actuators 11 and 12, and the main actuators 11 and 12 include an X-axis motor 11 and a Y-axis motor 12. The sub actuators 13 and 14 also include an X axis motor 13 and a Y axis motor 14.

Here, the main actuators 11 and 12 may be configured as a first motor, for example, a linear motor, a servo motor, a step motor, or the like. Such a first motor is a motor used in various technical fields, and is manufactured to be used in a relatively large work area. However, although the first motor may cover a relatively large work area, the response time is slow and accurate motion control is difficult.

Meanwhile, the sub actuators 13 and 14 may be configured of a second motor, for example, a voice coil motor (VCM), a piezo motor, an ultrasonic motor, and the like. The second motor has a fast response speed and accurate motion control, but the maximum movement distance is relatively short, thereby narrowing the work area.

When only the first motor is used as the actuator of the stage 10, there is a problem that the response speed is lowered and the fine motion control is difficult, resulting in a decrease in productivity and accuracy of the work.

In addition, when only the second motor is used as the actuator of the stage 10, there is a problem that high speed or fine motion control is possible but the working area is limited.

In the present invention, the main actuators 11 and 12 and the sub actuators 13 and 14 are selectively used as the actuators of the stage 10 in order to solve the above problems. That is, when the stage 10 needs to move a long section between the work areas during the transfer process, the main actuators 11 and 12 are used to control the stage 10 and the stage 10 is controlled at high speed or precisely. If necessary, the sub-actuators 13 and 14 are used.

2B is a view showing the first substrate. Referring to FIG. 2B, the first substrate has a plurality of regions. For example, the first substrate may include a first region 16, a second region 17, and a third region 18. Such a plurality of regions of the first substrate may be determined based on the positions of the plurality of light emitting diode chips scanned by the first substrate scanning unit 40.

When the stage 10 moves to, for example, the standby position of the first region 16 (a point for starting work in the first region), the stage 10 is controlled by the main actuators 11 and 12. On the other hand, when the stage 10 moves between the light emitting diode chip pitches, the stage 10 is controlled by the sub actuators 13 and 14. Here, the movement between the LED chip pitch means that the stage 10 moves by the pitch of the LED chip. Specifically, when the push pin module 30 is positioned on the first light emitting diode chip, when the stage 10 performs the movement between the light emitting diode chip pitch, the push pin module 30 is adjacent to the first light emitting diode chip. The second light emitting diode chip is positioned on the chip.

Referring to a process in which the stage 10 is controlled using the main actuators 11 and 12 and the sub actuators 13 and 14, the push pin module 30 is driven by the main actuators 11 and 12 to form the first area 16. The stage 10 is moved to be on the starting point 16-1 of. Here, the sub actuators 13 and 14 do not operate.

Thereafter, the stage 10 performs the movement between the light emitting diode chip pitch. That is, the transfer process for the plurality of light emitting diode chips included in the first region 16 is sequentially performed by the sub actuators 13 and 14. When the transfer process for the first region 16 is performed, the main actuators 11 and 12 do not operate. By performing the transfer process by the sub actuators 13 and 14, productivity and precision in the transfer process can be improved.

After the light emitting diode chip corresponding to the end point 16-2 of the first area 16 is transferred, the push pin module 30 is started by the main actuators 11 and 12 to start the second area 17. The stage 10 is moved to be positioned on the 17-1. Subsequently, the transfer process for the plurality of light emitting diode chips included in the second region 17 is sequentially performed by the sub actuators 13 and 14.

Thus, by selectively using the main actuators 11 and 12 and the sub actuators 13 and 14, it is possible to improve the productivity and to increase the accuracy of the work.

Meanwhile, the work table 20 may also include a main actuator and a sub actuator, similarly to the stage 10. That is, the sub actuator is disposed on the main actuator, and the main actuator and the sub actuator may be configured in the same manner as the main actuators 11 and 12 and the sub actuators 13 and 14 of the stage 10, respectively.

Referring back to FIG. 1, the transfer apparatus may further include a second substrate scanning unit 50. The second substrate scanning unit 50 is located on the work table 20 and scans the position of the circuit trace disposed on the second substrate.

The transfer device further includes a push pin module 30. The push pin module 30 selectively transfers one or more light emitting diode chips to the second substrate at the transfer process position.

In the present invention, the transfer may mean the transfer of the light emitting diode chip and the adhesion (bonding) of the light emitting diode chip.

The push pin module 30 transfers the plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate using the push pin while the one surface of the first substrate and the second substrate are disposed to face each other.

The transfer device further includes a push pin scan unit 60. The push pin scan unit 60 periodically scans whether the push pin is located at the correct position (center of the push pin housing to be described later). For example, the push pin scan unit 60 may scan whether the push pin is located in the correct position after the push pin is replaced.

The transfer device may further comprise a control unit (not shown) having a memory. The control unit controls each component of the transfer apparatus so that the transfer apparatus operates. In the following, each component of the transfer apparatus is described to directly perform an operation, but this description also includes a control unit controlling each component so that each component performs the corresponding operation.

3 is a schematic diagram of a push pin module according to an embodiment of the present invention.

Referring to FIG. 3, the push pin module 30 includes a plurality of push pin units 31, 32, and 33.

Each of the plurality of push pin units 31, 32, 33 includes a push pin 34 and a push pin housing 35. Here, the push pin housing 35 protects the push pin 34 and contacts the first substrate.

The push pin 34 moves in the vertical direction to push the other surface of the first substrate to transfer the light emitting diode chip corresponding to the portion to the second substrate.

Each of the plurality of push pin units 31, 32, 33 is a vacuum unit for allowing the first substrate to be separated from the corresponding light emitting diode chip after the light emitting diode chip is transferred to the second substrate by the push pin 34 ( 36) further.

Next, referring to FIGS. 4 and 5A, a method of transferring a light emitting diode chip according to an exemplary embodiment of the present invention will be described. Referring to FIG. 4, a second substrate 310 having a first substrate 300 on which one surface of the target LED chip 320 is mounted and a circuit trace 330 is prepared (a). Here, the first substrate 300 may be, for example, a tape, and the second substrate 310 may be, for example, a substrate or a circuit board.

Next, the push pin module 30 contacts the corresponding position of the target LED chip 320 on the other surface of the first substrate 300 based on the scan information of the first substrate 300 (b).

Thereafter, the push pin 34 protrudes toward the other surface of the first substrate 300, and thus the target LED chip 320 is transferred to the second substrate 310 (c). Here, a part of the first substrate 300 may be drilled by the push pin 34 (d).

At this time, the pressure between the target light emitting diode chip 320 and the second substrate 310 is maintained at a predetermined pressure through the pressure adjusting unit 37 to be described later.

The push pin 34 then returns back into the push pin housing 35 (e). Here, due to the protrusion of the push pin 34, a portion of the first substrate 300 may be extended or a portion of the first substrate 300 may still be attached to the target LED chip 320. At this time, the first base material 300 may be compressed using the vacuum unit 36 to return the first base material 300 to its original position.

Thereafter, after the first substrate stage 10 and the work table 20 are moved so that the push pin module 30 is positioned on the other target LED chip, the other target LED chip is transferred to the second substrate 310. do.

While repeating the above-described process, all the light emitting diode chips mounted on the first base material 300 are transferred to the second base material 310.

5B shows a transfer process according to another embodiment of the present invention. According to another embodiment of the present invention, the first substrate 400 may be, for example, a tape on which a plurality of light emitting diode chips are mounted. In addition, the second substrate 410 may be a transfer tape to which the LED chip is transferred.

Referring back to FIG. 3, in the present invention, the plurality of light emitting diode chips may be transferred to the second substrate at a time by performing a transfer process using the plurality of push pin units 31, 32, and 33. By using the plurality of push pin units 31, 32, and 33, the light emitting diode chip can be quickly transferred to the second substrate.

Referring to FIG. 6, a method of transferring a light emitting diode chip using a plurality of push pin units according to an embodiment of the present invention will be described.

Referring to FIG. 6A, a plurality of light emitting diode chips are attached to one surface of the first substrate, and one surface of the first substrate and the second substrate are disposed to face each other. At this time, the push pin module 30 contacts the other surface of the first substrate.

Thereafter, the plurality of push pin units 31, 32, and 33 protrude the push pins 34-1, 34-2, and 34-3 toward the other surface of the first substrate so that the corresponding plurality of light emitting diode chips (FIG. 3 in 6) is transferred to the second substrate at a time.

6B, the stage 10 and the work table 20 move by a predetermined range so that each push pin 34-1, 34-2, 34-3 is transferred from the top of the first substrate to the next. It is disposed at a position corresponding to the plurality of light emitting diode chips to be.

In this state, the plurality of push pin units 31, 32, and 33 protrude the push pins 34-1, 34-2, and 34-3 toward the other surface of the first substrate so that the corresponding plurality of light emitting diode chips are formed. Transfer to the second substrate at a time.

While repeating the above process, most of the light emitting diode chips mounted on the first substrate are transferred to the second substrate. However, the light emitting diode chip mounted on the outer periphery of the first base material or the light emitting diode chip located in an uneven area of the arrangement between the light emitting diode chips (or the arrangement position) may be formed by using the plurality of push pin units 31, 32, and 33. It cannot be transferred to the second substrate. The light emitting diode chip that cannot be transferred using the plurality of push pin units 31, 32, and 33 may be detected through a scanning process through the first substrate scanning unit 40.

Therefore, as shown in FIG. 6C, the light emitting diode chip which is not transferred by the plurality of push pin units 31, 32, and 33 is one of the plurality of push pin units 31, 32, and 33 (32 in FIG. 6C). Are sequentially transferred to the second substrate.

Referring again to FIG. 3, the push pin module 30 further includes a pressure regulation unit 37. The pressure regulating unit 37 makes the light emitting diode chip and the second substrate contact each other when the push pin 34 pushes the other surface of the first substrate. At this time, the pressure between the light emitting diode chip and the second substrate is maintained at a predetermined pressure. Let's do it.

Preferably, the pressure regulating unit 37 keeps the pressure between each light emitting diode chip and the second substrate the same.

This pressure regulating unit 37 may comprise a spring or voice coil motor, for example.

At this time, the spring has a characteristic that the pressure increases linearly to the specific displacement amount (a) as shown in Figure 7a, and maintains a constant pressure (b) even after the displacement amount (a), even after the specific displacement amount (a), the specific displacement amount (a) or more By holding, the pressure between the push pin 34 and the second substrate can be maintained at a constant pressure b.

In addition, the voice coil motor is a linear motor including a permanent magnet and a coil, and moves straight through the current flowing through the voice coil.

Such a voice coil motor has a characteristic in which pressure is proportional to a current (or voltage) applied to the voice coil motor.

Therefore, by applying a specific current (or voltage) a to the voice coil motor, the pressure between the push pin 34 and the second substrate can be maintained at a constant pressure b.

When the push pin 34 pushes the other surface of the first substrate to transfer the light emitting diode chip to the second substrate, the heights of the light emitting diode chips transferred to the second substrate may be different from each other when the same pressure is not applied. In addition, when a large pressure is applied, the LED chip may be damaged.

In the present invention, by using the pressure adjusting unit 37 to maintain the same pressure between each LED chip and the second substrate, it is possible to prevent each LED chip from being damaged in the transfer process.

In addition, each light emitting diode chip can be transferred to the second substrate with a uniform height by the pressure adjusting unit 37.

The push pin module 30 further includes a variable width unit 38. The variable width unit 38 adjusts the width between the plurality of push pin units 31, 32, 33 based on the arrangement interval between the light emitting diode chips scanned by the first substrate scanning unit 40.

Arrangement intervals between the plurality of light emitting diode chips mounted on the first substrate may be different from each other, and the transfer process is performed using the plurality of push pin units 31, 32, and 33 without considering the arrangement interval between the light emitting diode chips. In some cases, the light emitting diode chip may not be properly transferred to the second substrate.

For example, when the spacing between the light emitting diode chips in a specific region is narrower or wider than the width of the plurality of push pin units 31, 32, and 33 (preferably, the width of each push pin 34), The pin 34 is pressed against a portion of the light emitting diode chip that is not the center (in some cases, the portion where the light emitting diode chip is not located), and thus the LED chip cannot be properly transferred to the second substrate.

In the present invention, the above-described problem can be solved by the variable width unit 38 adjusting the widths of the plurality of push pin units 31, 32, and 33 in real time based on the arrangement interval between the light emitting diode chips in the transfer process.

Hereinafter, the transfer method performed by the transfer apparatus will be described. 8 is a flowchart illustrating a method of transferring a light emitting diode chip to a second substrate according to an embodiment of the present invention.

Referring to FIG. 8, in order to determine which LED chips to transfer to the second substrate and where to place the LED chips on the second substrate, the control unit may identify the first substrate including the LED chips. And an input relating to the identification of the second description (S801).

The control unit may extract the first substrate related data and the second substrate related data from the memory based on the input regarding the identification of the first substrate and the identification of the second substrate (S802).

The second substrate related data includes the pattern (including position) of the circuit trace on the second substrate, the number of light emitting diode chips to be transferred to the circuit trace and the relative position of the light emitting diode chips, and the quality requirements of the light emitting diode chips.

The first substrate related data also includes a relative position of the light emitting diode chip and a map thereof.

Thereafter, the control unit may determine initial orientations of the first substrate and the second substrate for the transfer of the light emitting diode chip (S803).

Once the initial orientation of the first substrate and the second substrate is determined, the control unit controls the stage 10 and the work table 20 to orient the first substrate and the second substrate to the position of tuning in the transfer process. (S804).

In step S804, the control unit determines the position of the circuit trace to which the LED chip is to be transferred and the LED chip to be transferred in the first substrate.

Subsequently, the control unit controls the push pin module 30 so that the light emitting diode chip is transferred to the second substrate (S805).

After the light emitting diode chip is transferred to the second substrate, the control unit determines whether there is a light emitting diode chip to be transferred next (S806).

If the light emitting diode chip to be transferred remains, the control unit returns to step S804 and performs a transfer process. If there is no light emitting diode chip to be transferred, the transfer process is terminated.

9 is a flowchart illustrating a method of transferring a light emitting diode chip to a second substrate according to another embodiment of the present invention.

Referring to FIG. 9, first, a preliminary substrate having a plurality of light emitting diode chips mounted on one surface thereof is seated on a stage 10 waiting at a ready position (S900).

Here, the arrangement interval between the plurality of light emitting diode chips mounted on the preliminary substrate is uneven. When the transfer process is performed using the preliminary substrate, since the arrangement intervals of the plurality of light emitting diode chips are uneven, the preliminary substrate is scanned and then emitted by one push pin unit (eg, 32) based on the scan information. It is necessary to transfer each of the diode chips.

That is, the plurality of push pin units 31, 32, 33 cannot be used in the transfer process of the plurality of light emitting diode chips mounted on the preliminary base material.

In the present invention, the rearrangement process is performed to perform the transfer process using one or a plurality of push pin units 31, 32, and 33.

In operation S900, a first substrate on which the plurality of light emitting diode chips are to be transferred is seated on the work table 20.

Thereafter, the first substrate scanning unit 40 scans the plurality of light emitting diode chips mounted on the preliminary substrate. At this time, the first substrate scanning unit 40 scans the positions of the plurality of light emitting diode chips mounted on the preliminary substrate.

Subsequently, the stage 10 moves to the transfer process position, and a transfer process is performed (S910).

In this rearrangement process, a plurality of light emitting diode chips are transferred to the first substrate such that the light emitting diode chips are synchronized with an arrangement interval between circuit traces disposed on the second substrate to be finally transferred.

That is, through the rearrangement process, the arrangement interval between the plurality of light emitting diode chips mounted on one surface of the first substrate and the arrangement interval between the circuit traces arranged on the second substrate are tuned in advance.

As described above, since the arrangement intervals between the plurality of light emitting diode chips mounted on the preliminary substrate are uneven, among the plurality of push pin units 31, 32, and 33 based on the scan information of the first substrate scanning unit 40. Each of the LED chips is transferred to the first substrate using one (eg, 32).

After the rearrangement process, the first base material on which a plurality of light emitting diode chips are mounted is mounted on the stage 10 waiting at the ready position. In operation S920, the second substrate on which the plurality of light emitting diode chips are to be transferred is seated on the work table 20.

Subsequently, the first substrate scanning unit 40 scans the positions of the plurality of light emitting diode chips mounted on the first substrate. Here, the first substrate scanning unit 40 confirms the arrangement interval of the plurality of light emitting diode chips mounted on the first substrate. At this time, scan information scanned by the first substrate scanning unit 40 is stored in the memory. The scan information includes an arrangement interval between each light emitting diode chip.

This scan information is used by the variable width unit 39 to vary the width between the plurality of push pin units 31, 32, 33. In addition, the scan information may be located in the light emitting diode chips (for example, located on the outer circumference of the first substrate or the arrangement interval is out of a predetermined range) (ie, not being transferred by the plurality of push pin units 31, 32, 33). Is difficult to correct through the variable width unit 39).

In addition, the second substrate scanning unit 50 scans the position of the circuit trace disposed on the second substrate.

Thereafter, the stage 10 moves to the transfer process position, and the transfer process is performed (S930).

In this case, since the arrangement intervals between the plurality of light emitting diode chips mounted on the first substrate are relatively even through the above-described rearrangement process, the plurality of light emitting diode chips may be temporarily moved through the plurality of push pin units 31, 32, and 33. The second substrate can be transferred.

In the transfer process, the width variable unit 39 varies the width between the plurality of push pin units 31, 32, and 33 based on the scan information, so that the plurality of light emitting diode chips can be transferred to the second substrate well.

In addition, the push pin module 30 may include the first light emitting diode chips and the plurality of push pin units 31, 32, and 33 to be transferred using the plurality of push pin units 31, 32, and 33 based on the scan information. Is used to classify the second LED chips to be transferred.

The push pin module 30 transfers the first LED chips to the second substrate at one time using the plurality of push pin units 31, 32, and 33 based on the classification result. Then, the push pin module 30 sequentially transfers the second LED chips to the second substrate by using one of the plurality of push pin units 31, 32, and 33.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

10: stage
20: work table
30: push pin module
31: push pin unit
32: push pin unit
33: push pin unit
34: push pin
35: push pin housing
36: vacuum unit
37: pressure regulation unit
38: variable width unit
40: first substrate scanning unit
50: second substrate scanning unit
60: push pin scan unit

Claims (13)

In the transfer device for transferring a plurality of light emitting diode chips,
A stage on which a first substrate on which the plurality of light emitting diode chips are mounted is mounted;
A work table on which a second substrate on which the plurality of light emitting diode chips are to be transferred is seated; And
Push pin module for transferring the plurality of light emitting diode chips to the second substrate by pushing the other surface of the first substrate in a state in which one surface of the first substrate and the second substrate are disposed to face each other.
Including,
The push pin module includes a plurality of push pin units each including a push pin for pushing the other surface of the first substrate,
Arrangement intervals between the plurality of light emitting diode chips mounted on the one surface such that the push pin module may transfer a plurality of light emitting diode chips corresponding to each of the push pins of the plurality of push pin units to the second substrate at a time. Is previously synchronized with an arrangement interval between circuit traces arranged on the second substrate.
The method of claim 1,
And an arrangement interval between the plurality of light emitting diode chips mounted on the one surface is synchronized with an arrangement interval between circuit traces arranged on the second substrate by rearranging the plurality of light emitting diode chips.
The method of claim 1,
A second substrate scanning unit for scanning a position of a circuit trace disposed on the second substrate
To further include, the transfer device.
The method of claim 1,
A first substrate scanning unit for scanning positions of the plurality of light emitting diode chips mounted on the first substrate
To further include, the transfer device.
The method of claim 4, wherein
And the push pin module further comprises a width varying unit for varying a width between the plurality of push pin units based on an arrangement interval between the light emitting diode chips scanned by the first substrate scanning unit.
The method of claim 4, wherein
The push pin module transfers a light emitting diode chip whose arrangement position between the light emitting diode chips scanned by the first substrate scanning unit is out of a predetermined range to one of the plurality of push pin units to the second substrate. Which is a transfer device.
The method of claim 1,
And each of the plurality of push pin units includes a pressure regulating unit for maintaining a pressure between the light emitting diode chip and the second substrate at a predetermined pressure.
The method of claim 7, wherein
And the pressure regulating unit comprises at least one of a voice coil motor (VCM) and a spring.
In the method of transferring a plurality of light emitting diode chips,
Preparing a preliminary substrate on which one surface of the plurality of light emitting diode chips is mounted;
Preparing a first substrate;
Preparing a second substrate on which circuit traces on which the plurality of light emitting diode chips are to be transferred are arranged;
Transferring a plurality of light emitting diode chips of the preliminary substrate to the first substrate by pushing the other surface of the preliminary substrate with one surface of the preliminary substrate facing the first substrate; And
The plurality of light emitting diode chips of the first substrate may be pushed to the second substrate by pushing the other surface of the first substrate in a state in which one surface of the first substrate on which the plurality of light emitting diode chips is transferred and the second substrate are disposed to face each other. Transcription Step
Including,
In the step of transferring the plurality of light emitting diode chips of the first substrate to the second substrate, a plurality of light emitting diode chips corresponding to each of the plurality of push pins are temporarily transferred to the second substrate using a plurality of push pins. Transferring the plurality of light emitting diode chips of the preliminary substrate to the first substrate may include a circuit trace in which an arrangement interval between the plurality of light emitting diode chips transferred to the first substrate is arranged on the second substrate. And a plurality of light emitting diode chips mounted on the preliminary substrate to be transferred to the first substrate so as to be synchronized with an arrangement interval therebetween.
The method of claim 9,
Scanning positions of the plurality of light emitting diode chips mounted on the preliminary substrate;
Scanning the plurality of light emitting diode chips mounted on the first substrate; And
Scanning the location of the circuit trace disposed on the second substrate
It further comprises. delete delete delete

Images