CN108605427B

CN108605427B - Mounting device

Info

Publication number: CN108605427B
Application number: CN201680081435.0A
Authority: CN
Inventors: 立岩刚
Original assignee: Suzuki Co Ltd
Current assignee: Suzuki Co Ltd
Priority date: 2016-06-22
Filing date: 2016-06-22
Publication date: 2020-10-30
Anticipated expiration: 2036-06-22
Also published as: JP6603412B2; TW201801208A; JPWO2017221350A1; TWI706480B; CN108605427A; KR102130124B1; KR20190020641A; SG11201806151UA; WO2017221350A1

Abstract

The problem is to provide a technology capable of improving the mounting efficiency. The solution is to hold the sheet (22) to which the component (21) is attached so that the sheet (22) is spaced apart from the substrate (20). Then, the plunger (31) presses the member (21) via the sheet (22), thereby flexing the sheet (22) and bringing the member (21) into contact with the substrate (20). Then, the plunger (31) is moved toward the inside of the mounting head (10), whereby the pin (32) is relatively projected from the plunger (31).

Description

Mounting device

Technical Field

The present invention relates to mounting technology.

Background

As an example of the mounting device, japanese patent No. 5507775 (patent document 1) describes an adhesive device.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 5507775

Disclosure of Invention

Problems to be solved by the invention

The mounting device includes a device using the following method: and a device (for example, an adhesive device described in patent document 1) for sucking the component on the sheet pushed up by the ejector pin at the pickup position with a suction chuck and directly conveying the component to a mounting position (pick-and-place). In order to improve the mounting efficiency (the number of mounting operations per unit time) based on productivity (tact) in the transfer system, the technique described in patent document 1 deals with the increase in the number of suction chucks.

However, if the suction chuck is increased, the component cannot be stably sucked (reliability cannot be ensured), the mounting efficiency is deteriorated. Further, when the components are conveyed by the suction chuck, if the moving distance from the pickup position to the mounting position becomes long, the mounting efficiency is deteriorated.

An object of the present invention is to provide a technique capable of improving mounting efficiency. One object and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

Means for solving the problems

The outline of a representative one of the inventions disclosed in the present application will be briefly described below.

The mounting method according to one solution of the present invention includes the steps of: (a) preparing a substrate on which a component is to be mounted, a sheet having one surface and the other surface and having the component attached to the one surface, and a mounting head having a pin and a plunger into which the pin is inserted; (b) a step of holding the sheet so that the sheet is spaced apart from the substrate and the one surface is the substrate side; (c) a step of pressing the member from the other surface side with the plunger interposed therebetween to bend the sheet, thereby bringing the member into contact with the substrate; and (d) moving the plunger toward the inside of the mounting head to relatively project the pin from the plunger.

More preferably, in the step (d), when the sheet is deflected and restored by the movement of the plunger, the member is pressed by the pin penetrating the sheet and is peeled from the sheet. This makes it possible to peel the member from the sheet relatively easily.

Preferably, in the step (c), the plunger presses the member from a direction perpendicular to the substrate. Thus, the component can be mounted on the substrate while preventing positional deviation.

More preferably, in the step (c), the plunger presses the member in a state where a tip of the plunger and a tip of the pin are located in the same plane. Thus, when the plunger starts to move toward the inside of the mounting head, the pin can be simultaneously protruded. Alternatively, more preferably, in the step (c), the plunger presses the member in a state where the tip of the pin protrudes from the tip of the plunger by a thickness equal to or less than the thickness of the sheet. Thus, when the plunger is pressed against the member via the sheet, the pin is preliminarily sunk into the sheet, and when the plunger is moved toward the inside of the mounting head, the pin can easily penetrate the sheet.

More preferably, after the step (d), the mounting head is separated from the substrate. This allows the pin inserted through the sheet to be extracted.

More preferably, after the step (d), the plunger is moved toward the substrate. This allows the pin to move relative to the plunger and to retract into the plunger.

More preferably, in the step (a), the sheet to which the plurality of components are attached is prepared, and after the step (d), the mounting head is relatively moved in a planar region of the sheet while aligning a position of another component in contact with the substrate. Thus, when a plurality of components are mounted, the mounting head moves only between the components, and therefore, mounting efficiency can be improved.

An attachment head according to one solution of the present invention is characterized by comprising: a head body; a plunger protruding from the head body; and a pin inserted into the plunger in a reciprocating direction of the plunger, the pin relatively protruding from the plunger in a state where the plunger is moved to the head body side.

More preferably, the mounting head further includes a solenoid having the plunger as a movable iron core. This enables the plunger to move at a higher speed than a method of moving the plunger by air suction.

More preferably, the mounting head further includes a spring provided inside the head body and pressing the plunger in a direction protruding from the head body. This makes it possible to hold the plunger so as to protrude.

More preferably, the pin is fixed to the head body in a state of penetrating the plunger. This enables the protruding pin to be stably held.

More preferably, the plunger has a tip end located in the same plane as the tip end of the pin in a state where the plunger projects most from the head body. Thus, when the plunger starts to move toward the inside of the mounting head, the pin can be relatively projected from the plunger at the same time.

The mounting device according to one solution of the present invention is characterized in that the mounting device has the mounting head.

Effects of the invention

Effects obtained by representative inventions among the inventions disclosed in the present application will be briefly described below. According to a solution of the present invention, the mounting efficiency can be improved.

Drawings

Fig. 1 is a schematic configuration diagram of a mounting device according to an embodiment of the present invention.

Fig. 2 is a schematic front view of a mounting head according to an embodiment of the present invention.

Fig. 3 is a schematic side view of a mounting head according to an embodiment of the present invention.

Fig. 4 is a schematic view of a mounting head according to an embodiment of the present invention, as viewed through a part thereof.

Fig. 5 is an enlarged schematic view of a part of the mounting head in fig. 4.

Fig. 6 is a schematic sectional view of a mounting head according to an embodiment of the present invention.

Fig. 7 is a schematic explanatory view of a mounting method according to an embodiment of the present invention.

Fig. 8 is a schematic explanatory view of the mounting method following fig. 7.

Fig. 9 is a schematic explanatory view of the mounting method following fig. 8.

Fig. 10 is a schematic explanatory view of the mounting method following fig. 9.

Detailed Description

In the following embodiments of the present invention, the description is made by dividing the embodiments into a plurality of parts as necessary, but they are not mutually related in principle, and belong to a relationship such as a part or all of the modifications in which one is the other, or details in which one is the other. Therefore, in the entire drawings, the same reference numerals are given to members having the same functions, and redundant description thereof is omitted. The number of the constituent elements (including the number, numerical value, amount, range, and the like) is not limited to a specific number, and may be equal to or larger than or smaller than the specific number, unless it is explicitly stated or clearly limited to the specific number in principle. In addition, when a shape of a component or the like is referred to, a case where the shape is substantially similar or analogous to the shape or the like is also included unless it is specifically explicitly stated or it is considered that it is not necessarily the case in principle.

In this embodiment, the mounting technique of the present invention is applied to a mounting step (bonding step) included in a method for manufacturing a semiconductor device (electronic device). For example, in a method for manufacturing a semiconductor device, after an adhesive sheet (dicing sheet) is bonded to a semiconductor wafer (after the semiconductor wafer is transferred onto the adhesive sheet), the semiconductor wafer is cut (cut) together with the adhesive sheet, and singulated (also referred to simply as a chip or a die) into components (for example, semiconductor chips such as IC chips and LED chips). In the mounting step, a component is mounted (for example, flip-chip mounted) on a substrate such as a ceramic substrate, a printed circuit board, or a lead frame using a mounting apparatus.

The mounting technique of the present embodiment will be described with reference to fig. 1 to 10. Fig. 1 is a schematic configuration diagram of a mounting apparatus 100. Fig. 2 and 3 are a schematic front view and a schematic side view of the mounting head 10, respectively, and show the mounting head 10 in a state of being mounted as a main part of the mounting device 100. Fig. 4 is a schematic view when viewed through a part of the mounting head 10. Fig. 5 is an enlarged schematic view of a part of the mounting head 10 in fig. 4. Fig. 6 is a schematic sectional view of the mounting head 10 at the VI-VI line shown in fig. 3. Fig. 7 to 10 are schematic explanatory views of the mounting method.

(mounting device)

As shown in fig. 1, the mounting apparatus 100 includes a mounting head 10. The mounting head 10 can press (press) the component 21 toward the substrate 20 when mounting the component 21 on the substrate 20. The mounting head 10 will be described in detail later.

Further, the mounting device 100 has a head driving section 11. The head driving unit 11 can be used to move the mounting head 10. The head driving unit 11 is configured by a known driving mechanism such as a linear motor or a ball screw mechanism. The mounting head 10 is movable in a vertical direction (in the case of a three-dimensional coordinate system, the Z direction, and the up-down direction in the drawing) and a horizontal direction (XY direction) by the head driving unit 11. The head drive unit 11 has a vertical drive unit 23 and moves (reciprocates) in the vertical direction, and the mounting head 10 is mounted on a slider 23a of the vertical drive unit 23 (see fig. 2 and 3).

The mounting apparatus 100 further includes a substrate stage 12. The substrate stage 12 can mount (arrange) the substrate 20 when the component 21 is mounted. The substrate stage 12 has a surface 12a so that the substrate 20 is disposed parallel to a horizontal plane. Therefore, the mounting head 10 is provided to move in the vertical direction (vertical direction) with respect to the substrate stage 12 (surface 12 a). Further, a suction mechanism (not shown) may be provided on the substrate table 12, whereby the substrate 20 can be stably (fixedly) held on the substrate table 12 by suction.

Further, the mounting device 100 has a table driving section 13. The table driving unit 13 can be used to move the substrate table 12. The table driving unit 13 is configured by a known driving mechanism such as a linear motor or a ball screw mechanism. The substrate stage 12 is movable in the horizontal direction (XY direction) by the stage driving unit 13.

Further, the mounting device 100 has a sheet holding portion 14. The sheet holding portion 14 can hold the sheet 22 to which the component 21 is attached. The sheet 22 is held in tension by the sheet holding portion 14. As the sheet holding portion 14, a ring such as a lock ring (a structure in which the sheet 22 is sandwiched by an inner ring and an outer ring) that holds the sheet 22 in a tensioned state can be used.

As the sheet 22, for example, a transparent (translucent) adhesive sheet having elasticity such as a dicing sheet can be used. The sheet 22 (see fig. 7) has one surface 22a and the other surface 22b, and 1 or more (a plurality in the present embodiment) of the members 21 are bonded to the one surface 22 a. The sheet holding portion 14 is provided to hold the sheet 22 between the mounting head 10 and the substrate table 12.

Further, the mounting device 100 has a control section 15. The control unit 15 can control each unit to operate the mounting device 100. The control unit 15 includes an arithmetic processing unit (CPU) and a storage unit (ROM, RAM). The control unit 15 controls the operations of the respective components (the head drive unit 11, the table drive unit 13, and the like) constituting the mounting apparatus 100 by reading various control programs recorded in the storage unit by the arithmetic processing unit and executing the programs. For example, the controller 15 performs alignment when mounting the component 21 on the substrate 20.

Further, the mounting device 100 has a camera 16 and a lamp 17 controlled by the control section 15. The camera 16 is provided in the vicinity of the mounting head 10 and can detect the position of the member 21 attached to the sheet 22. The lamp 17 is provided around the substrate 20 (substrate stage 12), and can irradiate light to the member 21 attached to the sheet 22. In the present embodiment, since the sheet 22 is a transparent or translucent sheet, the position can be detected by the camera 16, and the component 21 can be detected as being in a portion through which light from the lamp 17 is not transmitted. The detection data from the camera 16 can be used as control data when the control unit 15 performs image processing and the component 21 is mounted on the substrate 20.

(mounting head)

As shown in fig. 4 to 6, the mounting head 10 includes a head body 30, a plunger 31, and a pin 32. The head body 30, the plunger 31, and the pin 32 are provided along the vertical direction (vertical direction) so that the central axes thereof coincide with each other. Here, the plunger 31 is provided to protrude from the head body 30. Further, the pin 32 is provided to be inserted into the plunger 31 (a through-hole 31e formed in the plunger 31) in the reciprocating direction (in the figure, the up-down direction) of the plunger 31.

Here, the mounting head 10 is configured such that the pin 32 protrudes from the plunger 31 in a state where the plunger 31 moves to the head body 30 side (see fig. 5). This allows the component 21 to be mounted on the substrate 20 by pressing. Therefore, the mounting efficiency can be improved while ensuring reliability by a configuration simplified compared to the conventional pick-and-place system (a configuration in which suction is not required and the moving distance is the shortest).

A more specific structure of the mounting head 10 will be described. The head body 30 is assembled from a plurality of members (a front end portion 30a, a middle portion 30b, and a rear end portion 30 c). The head body 30 is formed in a substantially cylindrical shape so that the middle portion 30b has a hollow portion. A front end portion 30a is assembled to one side and a rear end portion 30c is assembled to the other side so as to close the hollow portion of the middle portion 30 b. The mounting head 10 is mounted on the slider 23a of the head driving unit 11 at the rear end 30c of the head body 30 (see fig. 2 and 3).

The plunger 31 is configured to have a tip portion 31a and a shaft portion 31 b. The distal end portion 31a is formed in a shape tapered from the shaft portion 31b (for example, a circular truncated cone shape). As will be described later in the mounting method, the member 21 is pressed by the plunger 31 (the distal end portion 31a) through the sheet 22, but the distal end portion 31a has a tapered shape, and thus, the member 21 can be made small. In the present embodiment, a nozzle portion 31c (see fig. 5) having a further reduced diameter is provided at the top of the distal end portion 31a of the plunger 31. Thereby, the area of the distal end surface 31d of the plunger 31 becomes smaller, and the plunger 31 (the nozzle portion 31c) can press the member 21 so as to sink into the sheet 22. In the description of the mounting method with reference to fig. 7 to 10, the description will be made assuming that the nozzle unit 31c is not provided for clarity of the description.

The pin 32 is configured to have a front end portion 32a, a shaft portion 32b, and a rear end portion 32 c. The pin 32 is fixed to the head body 30 in a state of penetrating the plunger 31. Specifically, the pin 32 is prevented from coming off the head body 30 by the rear end portion 32c having a larger diameter than the shaft portion 32b, and is fixed by the fixing member 40 (see fig. 4). The pin 32 protrudes from the plunger 31 relatively by the movement of the plunger 31, but the pin 32 can be stably held by the fixing pin 32.

The tip portion 32a of the pin 32 is formed in a shape (for example, a needle shape) that is tapered in a funnel shape from the shaft portion 32 b. As described in the mounting method described later, the pin 32 (tip portion 32a) penetrates (pierces) the sheet 22 to press (hold) the member 21, and the tip portion 32a has a tapered shape, so that the sheet 22 can be penetrated relatively easily.

In the present embodiment, the tip (tip surface 31d) of the plunger 31 and the tip (tip surface 32d) of the pin 32 are disposed in the same plane (flush with each other) in a state where the plunger 31 protrudes most from the head 30 (see fig. 7). Since the tip of the plunger 31 and the tip of the pin 32 are located in the same plane, the pin 32 can be simultaneously projected from the plunger 31 when the plunger 31 starts moving toward the inside of the mounting head 10.

The mounting head 10 also has a solenoid 34 for moving the plunger 31. The solenoid 34 has a plunger 31 as a movable iron core, and a coil 33 provided around the plunger 31. The main body (including the coil 33) of the solenoid 34 is fixed (screwed) to the inside of the head body 30 (the middle portion 30 b). The on/off operation of the solenoid 34 is controlled by the control unit 15 (see fig. 1).

As the solenoid 34, a pull solenoid (pull solenoid) can be used. Therefore, when the solenoid 34 is turned on (a state in which a current flows through the coil 33), the plunger 31 moves (pulls) toward the inside (upper side in the drawing) of the mounting head 10 (head body 30), and is restricted by the plunger stopper 35. When the solenoid 34 (pull-type solenoid) is in the off state, the upward movement of the plunger 31 is released, and the plunger 31 is in a free state (a state of moving downward by its own weight).

Further, when the plunger 31 is moved upward, for example, air suction can be used. In this regard, the solenoid 34 can move the plunger 31 at a higher speed and more stably than the method of moving the plunger 31 by air suction.

The mounting head 10 further includes a spring 37 for moving the plunger 31 downward. The spring 37 is a return spring that is provided inside the head body 30 and presses (biases) the plunger 31 in a direction protruding from the head body 30. The spring 37 is provided between the flange 36 and the main body (coil 33) of the solenoid 34 and around the plunger 31, and the flange 36 is provided on the tip side of the plunger 31 (inside the head body 30). Therefore, the spring 37 can press the plunger 31 via the flange 36.

Therefore, when the solenoid 34 is in the off state, the flange 36 is in contact with the inside of the head body 30 (see fig. 4 and 6), and the plunger 31 can be held while the plunger 31 is protruding from the head body 30. On the other hand, when the solenoid 34 is in the on state, the plunger 31 as the movable iron core is moved so as to be pulled toward the inside of the mounting head 10 (head body 30), the spring 37 is compressed, and the flange 36 is separated from the head body 30 (see fig. 5).

(mounting method)

A mounting method (a method of operating the mounting head 10 and the mounting apparatus 100 having the mounting head 10) will be described. As a preparation step, as shown in fig. 7, the substrate 20 on which the component 21 is mounted, the sheet 22 to which 1 or a plurality (a plurality in the present embodiment) of the components 21 are bonded, and the mounting head 10 (mounting apparatus 100) are prepared as described above.

Here, the substrate 20 has a pattern 41 for mounting the component 21 and electrically connected to the component 21. The member 21 and the pattern 41 are connected by a bonding material such as solder or conductive paste. Therefore, for example, a bonding material is coated on the connection terminal of the component 21 in advance. The sheet 22 has one surface 22a and the other surface 22b, and the plurality of members 21 are bonded to the one surface 22 a. The mounting head 10 includes a pin 32 and a plunger 31 into which the pin 32 is inserted. The mounting head 10 is in a state (normal state) in which the tip (tip surface 31d) of the plunger 31 and the tip (tip surface 32d) of the pin 32 are positioned in the same plane.

Next, as shown in fig. 7, the sheet 22 is held so that the sheet 22 is spaced apart from the substrate 20 and one surface 22a is the substrate 20 side. Specifically, the substrate 20 is disposed on the substrate stage 12. The sheet 22 is held in a tensioned state parallel to the substrate 20 with a gap from the substrate 20 by the sheet holding portion 14 (see fig. 1). The predetermined pattern 41 of the substrate 20 and the component 21 mounted on the predetermined pattern 41 of the substrate 20 are aligned by the stage driving unit 13 (see fig. 1). The mounting head 10 is held so that the sheet 22 is spaced apart from the mounting head 10. The alignment of the component 21 to be mounted and the mounting head 10 is performed by the head driving unit 11 (see fig. 1).

Next, as shown in fig. 8, the plunger 31 presses (pushes) the member 21 from the other surface 22b side via the sheet 22, thereby flexing the sheet 22 and bringing (joining) the member 21 and the substrate 20 into contact. Specifically, the mounting head 10 is moved downward by the vertical drive unit 23 (see fig. 2 and 3) of the head drive unit 11. At this time, the plunger 31 presses the member 21 from the direction perpendicular to the substrate 20. This allows the component 21 to be mounted on the substrate 20 while preventing positional deviation. The plunger 31 presses the member 21 in a state where the tip of the plunger 31 and the tip of the pin 32 are located in the same plane.

Next, as shown in fig. 9, the plunger 31 is moved toward the inside of the mounting head 10, whereby the pin 32 is relatively projected from the plunger 31. Specifically, the solenoid 34 is operated to pull the plunger 31 (movable core) toward the inside of the head 30. Since the pin 32 inserted into the plunger 31 is fixed to the head body 30, the pin 32 relatively protrudes from the plunger 31. Further, by moving the plunger 31 from a state in which the tip of the plunger 31 and the tip of the pin 32 are located in the same plane, the pin 32 can be simultaneously protruded when the plunger 31 starts to move toward the inside of the mounting head 10.

When the sheet 22 is deflected and restored by the movement of the plunger 31, the member 21 is peeled from the sheet 22 while the member 21 is pressed (held) by the pin 32 penetrating the sheet 22. At this time, as described above, the substrate 20 and the member 21 are in a state of contact (bonding).

In this way, the component 21 can be moved from the sheet 22 to the right below by arranging the pattern 41 to be patterned as the substrate to be mounted directly below the component 21 to be peeled out of the plurality of components 21 attached to the sheet 22. Further, the member 21 can be peeled from the sheet 22 relatively easily. Since the component 21 can be mounted by transferring it from the sheet 22 to the substrate 20, it is also excellent in reliability.

Next, as shown in fig. 10, the mounting head 10 is separated from the substrate 20. Specifically, the mounting head 10 is moved upward by the vertical driving unit 23 (see fig. 2 and 3) of the head driving unit 11 to return to the position shown in fig. 7. This allows the pin 32 inserted into the sheet 22 to be pulled out.

As shown in fig. 10, the plunger 31 is moved toward the substrate 20. Specifically, the solenoid 34 is stopped, and the plunger 31 is moved by the spring 37 in a direction protruding from the head body 30 (toward the outside of the head body 30). Eventually, the plunger 31 protrudes most from the head 30. This allows the pin 32 to move relative to the plunger 31 and to retract into the plunger 31. The pin 32 penetrating the sheet 22 can also be pulled out.

Next, the mounting head 10 is relatively moved in the planar area of the sheet 22 while being aligned with the position of the other member 21 (for example, the adjacent other member 21a) which is in contact with the substrate 20. Specifically, the head drive unit 11 moves the mounting head 10 in parallel with the sheet 22 so that the plunger 31 and the pin 32 of the mounting head 10 are positioned above the member 21 a. Further, the substrate 20 is moved in parallel with respect to the sheet 22 by the stage driving section 13 so that the corresponding pattern 41 of the substrate 20 is positioned below the member 21 a. Then, the component 21a is mounted on the substrate 20 by the steps described with reference to fig. 7 to 10.

When the plurality of members 21 are mounted in this manner, the mounting head 10 is sequentially moved between the members 21. At this time, the mounting head 10 moves in the plane area of the sheet 22 to which the plurality of members 21 are attached. In contrast, in the conventional pick-and-place system, the component is sucked by the suction chuck at the pick-up position on the sheet, and is moved to the mounting position away from the planar region of the sheet. According to the present embodiment, even when all of the plurality of components 21 are mounted, the moving distance is shorter than that of the conventional method, and therefore, the mounting efficiency can be improved.

The present invention has been specifically described above based on the embodiments, but the present invention is not limited to the above embodiments, and it is obvious that various modifications can be made within the scope not departing from the gist thereof.

In the above embodiment, a case where the semiconductor chip is applied as a component is described. However, the present invention is not limited thereto, and can be applied to electronic components such as semiconductor chips, chip resistors, chip capacitors, and chip inductors as long as the components are bonded to a sheet.

In the above-described embodiment, a case where the tip of the plunger and the tip of the pin are located in the same plane in a state where the plunger is most protruded from the head body has been described. Without being limited to this, the tip of the pin may protrude from the tip of the plunger by the following thickness in a state where the plunger is most protruded from the head body: not exceeding the thickness of the sheet (below the thickness). Thus, when the plunger is pressed against the member via the sheet, the pin is preliminarily sunk into the sheet, and when the plunger is moved toward the inside of the mounting head, the pin can easily penetrate the sheet. Further, the tip of the pin may be retracted into the plunger in a state where the plunger is most protruded from the head body. Thus, the pin is projected (exposed) only when the plunger is moved toward the inside of the mounting head, and therefore, the pin can be protected.

In the above-described embodiments, a case where the mounting head and the substrate (substrate stage) are moved relative to the fixed sheet (sheet holding portion) has been described. The mounting head may be fixed and the sheet and the substrate may be moved, or the mounting head and the sheet may be fixed and moved. That is, any structure may be used as long as the mounting head, the substrate, and the sheet are moved relative to each other.

Claims

1. A mounting device having a head driving section and a mounting head mounted on the head driving section, the mounting device mounting a member to be attached to a sheet on a substrate,

the mounting head includes:

a head body;

a plunger disposed on the head body and reciprocating in an up-down direction;

a pin fixed to the head body and penetrating the plunger in a reciprocating direction of the plunger; and

a solenoid fixed to the head body and moving the plunger,

the plunger is a movable iron core, and the plunger is configured to have: a shaft portion; a flange provided on a distal end side of the shaft portion; a tip portion having a shape tapered from the shaft portion; and a mouth portion further constricted at a top portion of the tip portion, the shaft portion and the flange being disposed inside the head body and the tip portion and the mouth portion protruding from the head body,

the mounting head is configured to be in a state in which the plunger projects most from the head body when the solenoid is turned off,

when the solenoid is turned on, the plunger moves in the direction of the head driving unit, and the pin is in a state of relatively protruding from the plunger.

2. The mounting device of claim 1,

the mounting device includes a spring disposed on the head body and biasing the plunger in a direction in which the plunger projects,

when the solenoid is turned off, the plunger is in the most protruding state by the spring, and the tip of the plunger and the tip of the pin are located in the same plane in the most protruding state of the plunger.

3. The mounting device according to claim 1 or 2,

the pin has a pin shaft portion and a pin rear end portion that is larger in diameter than the pin shaft portion, and the pin rear end portion is fixed to the head body.

4. The mounting device of claim 3,

the pin has a pin tip portion that is tapered in a funnel shape from the pin shaft portion, and the pin tip portion penetrates the tab.

5. The mounting device according to claim 1 or 2,

the mounting head is mounted on a slider of a vertical drive section among the head drive sections.