JP6603412B2 - Mounting device - Google Patents

Description

The present invention relates to a mounting apparatus .

  As an example of the mounting apparatus, Japanese Patent No. 5507775 (Patent Document 1) describes a bonding apparatus.

Japanese Patent No. 5507775

  Some mounting apparatuses use a system (pick and place) in which a component on a sheet pushed up by an eject pin at a pickup position is sucked by a suction collet and conveyed to the mounting position as it is (for example, Patent Document 1). A bonding apparatus as described in 1.). In such a transfer method, in order to improve the mounting efficiency (the number of mountings per unit time) due to productivity (production tact), the technique described in Patent Document 1 supports by increasing the number of suction collets. .

  However, even if the number of suction collets is increased, if the components cannot be stably suctioned (reliability is ensured), the mounting efficiency is impaired. Further, when a component is transported by the suction collet, if the moving distance from the pickup position to the mounting position becomes long, the mounting efficiency is impaired.

  An object of the present invention is to provide a technique capable of improving the mounting efficiency. One and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  The mounting method of one solving means in the present invention is as follows: (a) a substrate on which a component is mounted, a sheet having one surface and the other surface, the component being affixed to the one surface, a pin, A mounting head having a plunger into which the pin is inserted, and (b) a step of opening the space between the sheet and the substrate and holding the sheet with the one surface as the substrate side. And (c) the plunger pushing the component through the sheet from the other surface side to bend the sheet and bring the component into contact with the substrate, and (d) the mounting And a step of relatively projecting the pin from the plunger by moving the plunger toward the inner side of the head.

  In the step (d), it is more preferable that when the deflection of the sheet returns due to the movement of the plunger, the part is pressed by the pin penetrating the sheet and the part is peeled from the sheet. According to this, components can be easily peeled from the sheet.

  In the step (c), it is preferable that the plunger pushes the component from a direction perpendicular to the substrate. According to this, it is possible to mount a component while preventing positional displacement with respect to the substrate.

  In the step (c), it is more preferable that the plunger pushes the component while the tip of the plunger and the tip of the pin are in the same plane. According to this, the pin can be projected at the same time as the plunger starts to move to the inside of the mounting head. Alternatively, in the step (c), it is more preferable that the plunger pushes the component while the tip of the pin protrudes from the tip of the plunger below the thickness of the sheet. According to this, when the component is pushed by the plunger through the sheet, the pin is bitten into the sheet, and when the plunger is moved to the inside of the mounting head, the pin can be easily penetrated into the sheet. Can do.

  More preferably, after the step (d), the mounting head is separated from the substrate. According to this, the pin which has penetrated the sheet can be pulled out.

  More preferably, after the step (d), the plunger is moved to the substrate side. According to this, the pin can be moved relative to the plunger and retracted to the plunger.

  In the step (a), the sheet on which a plurality of the components are attached is prepared, and after the step (d), the mounting head is moved to the position of another component that is in contact with the substrate. More preferably, the sheet is relatively moved in the plane area of the sheet. According to this, when mounting a plurality of components, the mounting head only moves between the components, so that the mounting efficiency can be improved.

A mounting apparatus of the present invention is a mounting apparatus that has a head driving unit and a mounting head to be attached to the head driving unit, and mounts a component attached to a sheet on a substrate. The mounting head is a head movement and body, a plunger that reciprocates up and down are disposed in the head body, and lupine to penetrate the plunger is fixed to the head body in a reciprocating direction of said plunger, said plunger is fixed to the head body The plunger is a movable iron core , further reduced in diameter at the shaft portion, a flange provided on the tip side of the shaft portion, a tip portion tapered from the shaft portion, and a top portion of the tip portion. and a nipple portion, said shaft portion and said flange and said distal portion together is disposed inside the head body and said nipple portion protrudes from said head member, Serial solenoid is ready to the plunger is most protruding from the head body in the off, the pins from relative the plunger the plunger when the solenoid is turned on is moved in the direction of the head drive unit It is the structure which becomes a protruding state, It is characterized by the above-mentioned.
A spring disposed in the head body and energizing the plunger in a protruding direction; when the solenoid is off, the spring is in the most protruding state, and the plunger is in the most protruding state; It is preferable that the tip of the plunger and the tip of the pin are in the same plane. It is preferable that the pin has a pin shaft portion and a pin rear end portion having a diameter larger than that of the pin shaft portion, and the pin rear end portion is fixed to the head body. It is preferable that the pin has a pin tip portion that is pointed in a funnel shape from the pin shaft portion, and the pin tip portion penetrates the sheet.

  More preferably, the mounting head further includes a solenoid having the plunger as a movable iron core. According to this, compared with the system which moves a plunger by air suction, it can be moved at high speed.

  More preferably, the mounting head further includes a spring that is provided inside the head body and presses the plunger in a direction in which the mounting head protrudes from the head body. According to this, the plunger can be protruded and held.

  More preferably, the pin is fixed to the head body while penetrating the plunger. According to this, the protruding pin can be stably held.

  In a state where the plunger protrudes most from the head body, it is more preferable that the tip of the plunger and the tip of the pin are in the same plane. According to this, the pin can be relatively protruded from the plunger at the same time as the plunger starts to move to the inside of the mounting head.

In the mounting apparatus of the present invention , as an example, the mounting head is attached to a slider of a vertical driving unit in the head driving unit .

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to one solution of the present invention, the mounting efficiency can be improved.

It is a schematic block diagram of the mounting apparatus which concerns on one Embodiment of this invention. It is a schematic front view of the mounting head which concerns on one Embodiment of this invention. 1 is a schematic side view of a mounting head according to an embodiment of the present invention. It is the schematic which saw through some heads for mounting concerning one embodiment of the present invention. It is the schematic which expanded a part of mounting head in FIG. It is a schematic sectional drawing of the mounting head which concerns on one Embodiment of this invention. It is a schematic explanatory drawing of the mounting method which concerns on one Embodiment of this invention. It is a schematic explanatory drawing of the mounting method following FIG. It is a schematic explanatory drawing of the mounting method following FIG. It is a schematic explanatory drawing of the mounting method following FIG.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

  In the present embodiment, the mounting technique according to the present invention is applied to a mounting process (bonding process) included in a method for manufacturing a semiconductor device (electronic device). For example, in a manufacturing method of a semiconductor device, after sticking an adhesive sheet (dicing sheet) to a semiconductor wafer (after transferring the semiconductor wafer to the adhesive sheet), the semiconductor wafer is diced (cut) together with the adhesive sheet, and a component ( For example, it is singulated as a semiconductor chip such as an IC chip or an LED chip (this is also simply referred to as a chip or a die). In the mounting process, components are mounted (for example, flip chip mounting) on a substrate such as a ceramic substrate, a printed substrate, or a lead frame by a mounting device.

  A mounting technique according to the present embodiment will be described with reference to FIGS. FIG. 1 is a schematic configuration diagram of the mounting apparatus 100. 2 and 3 are a schematic front view and a schematic side view of the mounting head 10, respectively, showing the mounting head 10 in a state of being attached as a main part of the mounting apparatus 100. FIG. 4 is a schematic view of a part of the mounting head 10 seen through. FIG. 5 is an enlarged schematic view of a part of the mounting head 10 in FIG. FIG. 6 is a schematic cross-sectional view of the mounting head 10 taken along line VI-VI shown in FIG. 7 to 10 are schematic explanatory diagrams of the mounting method.

(Mounting device)
As shown in FIG. 1, the mounting apparatus 100 includes a mounting head 10. The mounting head 10 can press (press) the component 21 against the substrate 20 when mounting the component 21 on the substrate 20. The mounting head 10 will be described in detail later.

  The mounting apparatus 100 includes a head driving unit 11. The head drive unit 11 can be used to move the mounting head 10. The head drive unit 11 includes a known drive mechanism such as a linear motor or a ball screw mechanism. The head driving unit 11 allows the mounting head 10 to move in the vertical direction (in the three-dimensional coordinate system, the Z direction is the vertical direction in the drawing) and in the horizontal direction (XY direction). The head drive unit 11 includes a vertical drive unit 23 for vertical movement (reciprocation), and the mounting head 10 is attached to a slider 23a of the vertical drive unit 23 (see FIGS. 2 and 3). ).

  Further, the mounting apparatus 100 includes a substrate stage 12. The substrate stage 12 can set (arrange) the substrate 20 when the component 21 is mounted. The substrate stage 12 has a surface 12a so that the substrate 20 is set parallel to the horizontal plane. For this reason, the mounting head 10 is provided to move along the vertical direction (vertical direction) with respect to the substrate stage 12 (surface 12a). Further, the substrate stage 12 may be provided with an adsorption mechanism (not shown). According to this, the substrate 20 can be adsorbed to the substrate stage 12 and can be stably (fixed) and held.

  The mounting apparatus 100 includes a stage driving unit 13. The stage drive unit 13 can be used for moving the substrate stage 12. The stage drive unit 13 includes a known drive mechanism such as a linear motor or a ball screw mechanism. The stage driving unit 13 enables the substrate stage 12 to move in the horizontal direction (XY direction).

  Further, the mounting apparatus 100 includes a sheet holding unit 14. The sheet holding unit 14 can hold the sheet 22 to which the component 21 is attached. The sheet holding unit 14 holds the sheet 22 in a stretched state. As the sheet holding portion 14, a ring such as a grip ring (a structure in which the sheet 22 is sandwiched between an inner ring and an outer ring) that holds the sheet 22 in a stretched state can be used.

  Moreover, as the sheet | seat 22, a transparent (semi-transparent) adhesive sheet which has elasticity, such as a dicing sheet, can be used, for example. The sheet 22 (see FIG. 7) has one surface 22a and the other surface 22b, and one or a plurality of components 21 (a plurality in the present embodiment) are attached to the one surface 22a. Such a sheet holding portion 14 is provided so that the sheet 22 is held between the mounting head 10 and the substrate stage 12.

  The mounting apparatus 100 includes a control unit 15. The control unit 15 can control each unit and operate the mounting apparatus 100. The control unit 15 includes an arithmetic processing unit (CPU) and a storage unit (ROM, RAM). The control unit 15 reads out and executes various control programs recorded in the storage unit, and controls the operation of each unit (the head driving unit 11 and the stage driving unit 13) constituting the mounting apparatus 100. . For example, the control unit 15 performs alignment when mounting the component 21 on the substrate 20.

  The mounting apparatus 100 includes a camera 16 and a light 17 that are controlled by the control unit 15. The camera 16 is provided in the vicinity of the mounting head 10 and can detect the position of the component 21 attached to the sheet 22. The light 17 is provided around the substrate 20 (substrate stage 12), and can irradiate the component 21 attached to the sheet 22 with light. In the present embodiment, since the sheet 22 is transparent or translucent, the position can be detected by the camera 16 on the assumption that the part 21 is located at a location where the light from the light 17 does not transmit. Detection data from the camera 16 is subjected to image processing by the control unit 15 and can be used as control data when the component 21 is mounted on the substrate 20.

(Head for mounting)
As shown in FIGS. 4 to 6, the mounting head 10 includes a head body 30, a plunger 31, and a pin 32. The head body 30, the plunger 31, and the pin 32 are provided along the vertical direction (up and down direction) with their respective central axes coinciding with each other. Here, the plunger 31 is provided so as to protrude from the head body 30. Further, the pin 32 is provided by being inserted into the plunger 31 (through hole 31e formed therein) in the reciprocating direction of the plunger 31 (vertical direction in the figure).

Here, the mounting head 10 and a relatively plunger 31 so that the pin 32 protrudes (see FIG. 5). Thereby, it can mount on the board | substrate 20 so that the components 21 may be pressed. For this reason, mounting efficiency can be improved while ensuring reliability with a simplified configuration (a configuration that does not require suction and has the shortest moving distance) compared to the conventional pick-and-place method.

  A more specific configuration of the mounting head 10 will be described. The head body 30 is configured by assembling a plurality of members (a tip portion 30a, a midway portion 30b, and a rear end portion 30c). In the head body 30, the midway part 30b is formed in a substantially cylindrical shape so as to have a hollow. A front end portion 30a is assembled on one side and a rear end portion 30c is assembled on the other side so as to block the hollow of the midway portion 30b. The mounting head 10 is attached to the slider 23a of the head driving unit 11 at the rear end 30c of the head body 30 (see FIGS. 2 and 3).

  The plunger 31 has a tip portion 31a and a shaft portion 31b. The tip portion 31a is formed in a shape (for example, a truncated cone shape) tapered from the shaft portion 31b. As will be described later in the mounting method, the component 21 is pushed by the plunger 31 (tip portion 31a) via the sheet 22, but when the component 21 is small because the tip portion 31a has a tapered shape. Can also be supported. In the present embodiment, a nipple portion 31c having a further reduced diameter is provided at the top of the tip portion 31a of the plunger 31 (see FIG. 5). Thereby, the area of the front end surface 31 d of the plunger 31 becomes smaller, and the component 21 can be pushed so that the plunger 31 (nipple portion 31 c) bites into the sheet 22. In the case of the mounting method described with reference to FIGS. 7 to 10, it is assumed that the nipple portion 31c is not provided for the sake of clarity.

  The pin 32 has a front end portion 32a, a shaft portion 32b, and a rear end portion 32c. The pin 32 is fixed to the head body 30 while penetrating the plunger 31. Specifically, the pin 32 is prevented from being detached from the head body 30 at the rear end portion 32c having a diameter larger than that of the shaft portion 32b, and is fixed by the fixing member 40 (see FIG. 4). When the plunger 31 moves, the pin 32 is relatively protruded from the plunger 31, but the pin 32 can be stably held by fixing the pin 32.

  Further, the tip 32a of the pin 32 is formed in a pointed shape (for example, a needle shape) in a funnel shape from the shaft portion 32b. As will be described later in the mounting method, the pin 32 (tip portion 32a) penetrates (breaks through) the sheet 22 and presses (holds) the component 21, but the tip portion 32a has a sharp shape. Thus, the sheet 22 can be easily penetrated.

  In the present embodiment, in the state where the plunger 31 protrudes most from the head body 30, the tip (tip surface 31d) of the plunger 31 and the tip (tip surface 32d) of the pin 32 are in the same plane (being flush). (See FIG. 7). Since the tip of the plunger 31 and the tip of the pin 32 are in the same plane, the pin 31 can be relatively projected from the plunger 31 at the same time as the plunger 31 starts to move to the inside of the mounting head 10.

  The mounting head 10 includes a solenoid 34 that moves the plunger 31. The solenoid 34 includes a plunger 31 as a movable iron core and a coil 33 provided around the plunger 31. The main body of the solenoid 34 (containing the coil 33) is fixed (screwed) inside the head body 30 (midway portion 30b). The on / off operation of the solenoid 34 is controlled by the control unit 15 (see FIG. 1).

  A pull solenoid can be used as the solenoid 34. For this reason, when the solenoid 34 is in an ON state (a state in which a current is passed through the coil 33), the plunger 31 is moved (attracted upward) to the inside of the mounting head 10 (head body 30) (upward in the figure). And is regulated by the plunger stopper 35. When the solenoid 34 (pull solenoid) is turned off, the upward movement of the plunger 31 is released, and the plunger 31 enters a free state (a state in which the plunger 31 moves downward due to its own weight).

  In addition, in moving the plunger 31 upward, for example, air suction can be used. In this regard, according to the solenoid 34, the plunger 31 can be moved at high speed and stably compared to the method in which the plunger 31 is moved by air suction.

  Further, the mounting head 10 includes a spring 37 so that the plunger 31 moves downward. The spring 37 is a return spring that is provided inside the head body 30 and presses (biases) the plunger 31 in a direction in which the plunger 31 protrudes from the head body 30. The spring 37 is provided between the flange 36 provided on the distal end side (inside the head body 30) of the plunger 31 and the main body (coil 33) of the solenoid 34 and around the plunger 31. For this reason, the spring 37 can press the plunger 31 through the flange 36.

  Therefore, when the solenoid 34 is in the OFF state, the flange 36 contacts inside the head body 30 (see FIGS. 4 and 6), and the plunger 31 can be protruded from the head body 30 and held. On the other hand, when the solenoid 34 is in the on state, the plunger 31 that is a movable iron core moves so as to be attracted to the inside of the mounting head 10 (head body 30), the spring 37 is compressed, and the flange 36 is 30 (see FIG. 5).

(Mounting method)
The mounting method (the operation method of the mounting head 10 and the mounting apparatus 100 including the mounting head) will be described. As shown in FIG. 7, as described above, as a preparation process, the substrate 20 on which the component 21 is mounted, the sheet 22 on which one or a plurality (in the present embodiment, a plurality of) components 21 are attached, A mounting head 10 (mounting apparatus 100) is prepared.

  Here, the board | substrate 20 has the pattern 41 in which the component 21 is mounted and electrically connected. For connecting the component 21 and the pattern 41, a bonding material such as solder or conductive paste is used. For this reason, for example, a bonding material is applied to the connection terminals of the component 21. The sheet 22 has one surface 22a and the other surface 22b, and a plurality of components 21 are attached to the one surface 22a. The mounting head 10 has a pin 32 and a plunger 31 into which the pin 32 is inserted. The mounting head 10 is in a state (normal state) in which the tip end (tip surface 31d) of the plunger 31 and the tip end (tip surface 32d) of the pin 32 are in the same plane.

  Subsequently, as shown in FIG. 7, the sheet 22 is held between the sheet 22 and the substrate 20 with the one surface 22 a as the substrate 20 side. Specifically, the substrate 20 is set on the substrate stage 12. Further, the sheet holding unit 14 (see FIG. 1) opens the substrate 20 and holds the sheet 22 in a stretched state. Position alignment between the predetermined pattern 41 of the substrate 20 and the component 21 mounted thereon is performed by the stage drive unit 13 (see FIG. 1). Further, the mounting head 10 is held by opening the sheet 22 and the mounting head 10. Positioning of the component 21 to be mounted and the mounting head 10 is performed by the head driving unit 11 (see FIG. 1).

  Subsequently, as shown in FIG. 8, the plunger 31 pushes (presses) the component 21 through the sheet 22 from the other surface 22 b side, thereby bending the sheet 22 and bringing the component 21 into contact with the substrate 20 ( Bonding). Specifically, the mounting head 10 is moved downward by the vertical drive unit 23 (see FIGS. 2 and 3) of the head drive unit 11. At this time, the plunger 31 pushes the component 21 from the direction perpendicular to the substrate 20. According to this, it is possible to mount the component 21 while preventing the positional deviation with respect to the substrate 20. In addition, the plunger 31 pushes the component 21 in a state where the tip of the plunger 31 and the tip of the pin 32 are in the same plane.

  Subsequently, as shown in FIG. 9, the pin 32 is relatively protruded from the plunger 31 by moving the plunger 31 toward the inside of the mounting head 10. Specifically, the solenoid 34 is operated, and the plunger 31 (movable iron core) is drawn into the head body 30. Since the pin 32 inserted into the plunger 31 is fixed to the head body 30, the pin 32 protrudes relatively from the plunger 31. Further, by moving the plunger 31 from a state where the tip of the plunger 31 and the tip of the pin 32 are in the same plane, the pin 31 protrudes at the same time as the plunger 31 starts to move to the inside of the mounting head 10. Can do.

  Further, when the deflection of the sheet 22 is returned by the movement of the plunger 31, the component 21 is pressed (held) by the pin 32 penetrating the sheet 22, and the component 21 is separated from the sheet 22. At this time, as described above, the substrate 20 and the component 21 are in contact (bonding).

  In this way, among the plurality of components 21 attached to the sheet 22, the pattern 41 that is the target of the substrate pattern to be mounted is disposed immediately below the component 21 to be peeled, and the component 21 is moved directly below the sheet 22. Can be changed. Further, the component 21 can be easily peeled from the sheet 22. Since the component 21 can be mounted so as to be transferred from the sheet 22 to the substrate 20, it is excellent in reliability.

  Subsequently, as shown in FIG. 10, the mounting head 10 is separated from the substrate 20. Specifically, the mounting head 10 is moved upward by the vertical drive unit 23 (see FIGS. 2 and 3) of the head drive unit 11 and returned to the position shown in FIG. According to this, the pin 32 penetrating the sheet 22 can be pulled out.

  Further, as shown in FIG. 10, the plunger 31 is moved toward the substrate 20 side. Specifically, the operation of the solenoid 34 is stopped, and the plunger 31 is moved by the spring 37 in the direction in which the plunger 31 protrudes from the head body 30 (the outside of the head body 30). Eventually, the plunger 31 protrudes most from the head body 30. According to this, the pin 32 can be moved relative to the plunger 31 and retracted to the plunger 31. Further, the pin 32 penetrating the sheet 22 can be removed.

  Subsequently, the mounting head 10 is relatively moved within the plane region of the sheet 22 in accordance with the position of another component 21 (for example, another adjacent component 21 a) that is in contact with the substrate 20. Specifically, the mounting head 10 is translated relative to the sheet 22 by the head driving unit 11 so that the plunger 31 and the pin 32 of the mounting head 10 are positioned above the component 21a. Further, the stage drive unit 13 moves the substrate 20 in parallel with respect to the sheet 22 so that the pattern 41 of the substrate 20 corresponding to the lower part of the component 21 a is positioned. Thereafter, the component 21a is mounted on the substrate 20 by the process described with reference to FIGS.

  As described above, when mounting a plurality of components 21, the mounting head 10 sequentially moves between the components 21. At this time, the mounting head 10 moves within the plane area of the sheet 22 to which the plurality of components 21 are attached. On the other hand, in the conventional pick-and-place method, a part is sucked by a suction collet at a pickup position on the sheet, and moved to a mounting position outside the plane area of the sheet. According to the present embodiment, even when all of the plurality of components 21 are mounted, the moving distance is shorter than that of the conventional method, so that the mounting efficiency can be improved.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the embodiment, the case where the semiconductor chip is applied as a component has been described. However, the present invention is not limited to this, and any component that can be affixed to a sheet as a component can be used.

  In the above embodiment, the case where the tip of the plunger and the tip of the pin are in the same plane in the state where the plunger protrudes most from the head body has been described. Not only this but in the state where the plunger protrudes most from the head body, the tip of the pin may protrude from the tip of the plunger without exceeding the thickness of the sheet (below the thickness). According to this, when the component is pushed by the plunger through the sheet, the pin is bitten into the sheet, and when the plunger is moved to the inside of the mounting head, the pin can be easily penetrated into the sheet. Can do. Further, the tip of the pin may be retracted into the plunger in a state where the plunger protrudes most from the head body. According to this, since the pin protrudes (exposes) only when the plunger is moved to the inside of the mounting head, the pin can be protected.

  In the embodiment, the case where the mounting head and the substrate (substrate stage) are moved with respect to the fixed sheet (sheet holding unit) has been described. Not limited to this, the mounting head may be fixed and the sheet and the substrate may be moved, or the mounting head and the sheet may be moved while the substrate is fixed. That is, it is sufficient if the mounting head, the substrate, and the sheet move relatively.

Claims (5)

A mounting device that has a head driving unit and a mounting head to be attached to the head driving unit, and mounts a component attached to a sheet on a substrate,
The mounting head includes a head body, a plunger that reciprocates up and down are disposed in the head body, and lupine to penetrate the plunger is fixed to the head body in a reciprocating direction of said plunger, said head body A solenoid that is fixed and moves the plunger ;
The plunger is a movable iron core, and has a shaft portion, a flange provided on the tip end side of the shaft portion, a tip portion tapered from the shaft portion, and a nipple portion having a further reduced diameter at the top portion of the tip portion. and, together with the said shaft flange is disposed inside the head body and the tip and the nipple portion protrudes from said head member,
When the solenoid is off, the plunger protrudes most from the head body,
Mounting apparatus wherein the solenoid is in the plunger is in a state where the pin from relative the plunger moves in the direction of the head drive portion is protruded configuration when on. Comprising a spring for urging in a direction to protrude the plunger disposed in said head body,
Claims wherein the solenoid is in a state in which the plunger is the most prominent by the spring in the off, in a state in which the plunger is the most prominent and the tip of the plunger and the tip of the pin lies in the same plane Item 1. The mounting apparatus according to Item 1 . It said pins, and a pin rear portion as a diameter larger than the pin shank and the pin shaft portion, claim 1 wherein the pin rear end is characterized in that it is fixed to the head body or 2. The mounting apparatus according to 2 . The pin has a pin tip portion that is pointed in a funnel shape from the pin shaft portion, and the pin tip portion is configured to penetrate the sheet.
The mounting apparatus according to claim 3. The mounting head is attached to a slider of a vertical driving unit in the head driving unit.
The mounting apparatus as described in any one of Claims 1-4 characterized by these.

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