WO2007026497A1

WO2007026497A1 - Device and method for picking up semiconductor chip

Info

Publication number: WO2007026497A1
Application number: PCT/JP2006/315167
Authority: WO
Inventors: Makoto Ohta; Noriaki Konishi; Yasuo Iwaki; Koichi Shiga
Original assignee: Shibaura Mechatronics Corporation
Priority date: 2005-08-31
Filing date: 2006-07-31
Publication date: 2007-03-08
Also published as: JP5201990B2; TWI396241B; JPWO2007026497A1; TW200715426A; CN101253613A; KR100990418B1; KR20080039444A; CN100565831C

Abstract

A device for picking up a semiconductor chip stuck on a tacky adhesive sheet. The device comprises a backup body (1) having an upper surface formed on the sucking surface of the tacky adhesive sheet (2) holdingly sucking the peripheral portion of the semiconductor chip (3) to be picked up, a push-up shaft (23) vertically drivingly installed in the backup body and having a lower suction nozzle body (27) pressing the portion of the tacky adhesive sheet where the semiconductor chip to be picked up is stuck to push up the semiconductor chip from the upper surface of the backup body, and a suction nozzle body (4) suckingly holding the upper surface of the semiconductor chip to be picked up to pick up the semiconductor chip pushed up by the push-up shaft from the tacky adhesive sheet.

Description

Specification

Semiconductor chip pickup device and pickup method

Technical field

The present invention relates to a pickup device and a pickup method for picking up a semiconductor chip attached to an adhesive sheet.

Background art

[0002] A semiconductor chip formed by cutting a semiconductor wafer into a square shape is affixed to an adhesive sheet. When the semiconductor chip is bonded to a substrate, the adhesive sheet is formed by a suction nozzle. Pick up one by one.

[0003] When a semiconductor chip is picked up from an adhesive sheet, conventionally, as disclosed in Patent Document 1, the peripheral portion of the semiconductor chip of the adhesive sheet to which the semiconductor chip picked up by the suction nozzle is attached is a backup body. When the semiconductor chip is picked up by the suction nozzle while being separated from the pressure-sensitive adhesive sheet by pushing up the semiconductor chip with a push-up pin having a sharp tip on the lower surface side force. That was done.

Patent Document 1: Japanese Patent Laid-Open No. 2002-100644

Disclosure of the invention

[0004] By the way, recently, the thickness of a semiconductor chip may be as thin as 50 m or less. When such a thin semiconductor chip is pushed up and pushed up by the sharp tip of the pin, stress is concentrated at the point where the tip hits. For this reason, the semiconductor chip may be damaged by the stress that receives the push-up pin force.

[0005] In order to prevent damage to the semiconductor chip due to stress concentration, it is conceivable to slow down the semiconductor chip push-up speed by the push-up pin. However, if the push-up speed of the push-up pin is slowed down, the pick-up speed also increases. In some cases, it slows down and decreases productivity, and even if the push-up speed is slowed down, if the semiconductor chip is thin, it is difficult to reliably prevent damage.

[0006] The present invention reliably peels from the adhesive sheet without damaging the semiconductor chip. It is an object of the present invention to provide a pickup device and a pickup method that can be used.

[0007] That is, the present invention is a semiconductor chip pick-up device for picking up a semiconductor chip attached to an adhesive sheet,

A back-up body formed on an adsorption surface, the upper surface of which adsorbs and holds a portion corresponding to the peripheral portion of the semiconductor chip picked up by the adhesive sheet;

Push-up means that is provided in the backup body so as to be driven in the vertical direction and presses the lower surface of the portion to which the semiconductor chip to be picked up of the adhesive sheet is stuck to push the semiconductor chip up to the upper surface force of the backup body. ,

Pick-up means for picking up the semiconductor chip picked up by the push-up means from the adhesive sheet by sucking and holding the upper surface of the semiconductor chip to be picked up;

A semiconductor chip pick-up device comprising:

Brief Description of Drawings

FIG. 1 is a schematic configuration diagram of a pickup device showing a first embodiment of the present invention.

FIG. 2A is a longitudinal sectional view of the backup body.

FIG. 2B is an exploded perspective view showing the upper part of the push-up shaft and the lower suction nozzle body.

FIG. 3 is a plan view showing the suction surface of the backup body.

FIG. 4A is an explanatory diagram of a state where the suction nozzle body is lowered.

FIG. 4B is an explanatory view showing a state in which the lower suction nozzle body is raised.

[FIG. 4C] FIG. 4C is an explanatory view showing a state in which the semiconductor chip is pushed up by the lower suction nozzle body.

[FIG. 4D] FIG. 4D is an explanatory diagram of a state in which the semiconductor chip pushed up by the lower suction nozzle body is picked up by the suction nozzle.

FIG. 5 is an enlarged cross-sectional view showing a state where a semiconductor chip to be picked up is pushed up by a lower suction nozzle body.

FIG. 6A is a cross-sectional view of the upper portion of the backup body showing the second embodiment of the present invention. FIG. 6B is a perspective view of the upper portion of the backup body.

[FIG. 6C] FIG. 6C is a plan view of the board provided at the upper end of the push-up shaft.

FIG. 7 is a longitudinal sectional view of the upper part of a backup body showing a third embodiment of the present invention.

FIG. 8 is a longitudinal sectional view of the upper part of a backup body showing a fourth embodiment of the present invention.

FIG. 9 is a perspective view of a push-up shaft and a lower push-up body showing a fifth embodiment of the present invention.

FIG. 10 is a longitudinal sectional view of the upper part of a backup body showing a sixth embodiment of the present invention.

FIG. 11 is a plan view of a block provided at the upper end of the push-up shaft.

FIG. 12 is a plan view showing the upper surface of the backup body.

FIG. 13 is a plan view showing the upper surface of a backup body showing a seventh embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 to 5 show a first embodiment of the present invention. The pickup device shown in FIG. The backup unit 10 is provided opposite to the lower surface side of the adhesive sheet 2 stretched on the wafer ring (not shown), and the upper surface of the backup body 1 is placed in the Z direction by a Z drive source (not shown) as described later. It is driven between a position in contact with the sheet and a position away from the adhesive sheet 2.

[0010] A plurality of semiconductor chips 3 obtained by dividing a semiconductor wafer into dice-like shapes are attached to the upper surface of the pressure-sensitive adhesive sheet 2. The wafer ring is driven in the horizontal direction by an X and Y drive source (not shown).

Accordingly, the semiconductor chip 3 attached to the adhesive sheet 2 can be positioned in the X and Y directions with respect to the backup unit 10. Instead of the knock-up unit 10, the wafer ring may be driven in the Z direction. In short, the wafer ring and the backup unit 10 are relatively driven in the X, Y, and Z directions. ! / An upper suction nozzle mechanism 4 constituting pickup means is provided on the upper surface side of the pressure-sensitive adhesive sheet 2 and above the backup unit 10. The upper suction nozzle mechanism 4 has a pickup shaft 5 that is driven in the X, Y, and Z directions by an X, Y, and Z drive source (not shown). A convex portion 6 is provided on the lower end surface of the pickup shaft 5.

[0013] The pickup shaft 5 is formed with a suction hole 7 whose tip is opened at the end face of the convex portion 6 along the axial direction. The suction hole 7 is connected to a suction pump (not shown). An upper suction nozzle body 8 formed of an elastic material such as rubber or soft synthetic resin is detachably attached to the convex portion 6. The upper suction nozzle body 8 is formed with a nozzle hole 9 having one end communicating with the suction hole 7 and the other end opened to the tip surface, and further having a lower surface formed on the flat surface 8a.

[0014] It should be noted that it is preferable to use a voice coil motor or the like as the Z drive source for driving the pickup shaft 5 in the Z direction so that the pressing load by the upper suction nozzle mechanism 4 can be controlled to be constant.

[0015] As shown in Figs. 2A and 3, the backup body 1 has a cylindrical shape in which a lower end surface is opened and a rectangular opening 12 is formed in an upper surface. The opening 12 is formed in a rectangular shape slightly smaller than the rectangular semiconductor chip 3 to be picked up, which is indicated by a chain line in FIG. That is, the opening 12 is formed in a similar shape to the semiconductor chip 3.

[0016] On the upper surface of the backup body 1, three annular grooves 14a to 14c surrounding the opening 12 are formed concentrically as shown in FIG. The three annular grooves 14a to 14c are communicated with each other by two communication grooves 15 formed along the radial direction of the backup body 1. The communication groove 15 is formed so as to be parallel to and opposed to the two opposite sides (ends) of the semiconductor chip 3 to be picked up.

Although not shown, a communication groove 15 may be further formed on the upper surface of the backup body 1 so as to be parallel to the other two opposite sides of the semiconductor chip 3 and outside the side. .

[0018] In the annular groove 14a located on the innermost side, four suction holes 16a are formed through the upper wall of the backup body 1 in the thickness direction at intervals of 90 degrees in the circumferential direction. Further, the diameter of the annular groove 14a is set larger than the diagonal length of the semiconductor chip 3 to be picked up. [0019] Two suction holes 16b are formed in the second annular groove 14b at intervals of 180 degrees in the circumferential direction. A suction force acts on each of the annular grooves 14a to 14c and the communication groove 15 through the suction holes 16a and 16b as described later. The annular grooves 14a to 14c and the suction holes 16a and 16b are shown only in FIG. 3, and are omitted in other drawings.

As shown in FIG. 2A, a columnar closing member 21 is provided at the lower end opening of the backup body 1 with one end part being airtightly fitted. A through hole 22 penetrating in the axial direction is formed in the central portion of the closing member 21. A push-up shaft 23 constituting a push-up means is slidably held in the through-hole 22 and is airtightly held by an O-ring 24 provided at the lower end of the through-hole 22.

As shown in FIG. 2B, a rectangular board 25 is provided at the upper end of the push-up shaft 23 that protrudes from the upper end surface of the closing member 21. A columnar convex portion 26 is provided at the center of the upper surface of the plate body 25. A lower suction nozzle body 27 made of an elastic material such as rubber or soft synthetic resin is detachably attached to the convex portion 26.

[0022] A suction hole 28 is formed in the push-up shaft 23 along the axial direction. The upper end of the suction hole 28 is opened on the upper surface of the convex portion 26 provided on the board body 25, and the lower end is opened on the side surface of the push-up shaft 23. The lower suction nozzle body 27 is formed with a nozzle hole 29 penetrating in the vertical direction. The lower end of the nozzle hole 29 communicates with the suction hole 28 of the convex portion 26 when the lower suction nozzle body 27 is attached to the convex portion 26.

[0023] The lower suction nozzle body 27 has a flat upper surface 27a, and the planar shape is formed in a circular shape slightly smaller in diameter than the short side of the semiconductor chip 3 indicated by a chain line in FIG. That is, as shown in FIG. 2B, the lower suction nozzle body 27 is formed in a substantially truncated cone shape.

As shown in FIG. 2A, a suction hole 31 is formed in the closing member 21 that closes the lower opening of the backup body 1. One end of the suction hole 31 is opened to the upper end surface of the closing member 21, that is, the inner space of the backup body 1, and the other end is opened to the outer peripheral surface of the closing member 21.

As shown in FIG. 1, the suction hole 31 formed in the closing member 21 and the push-up shaft 23 The suction hole 28 formed in is connected to a suction pump 32 via a pipe 33. When the suction pump 32 is operated, suction force is generated in the annular grooves 14a to 14c through the suction holes 16a and 16b and the communication groove 15 opened on the upper surface of the backup body 1, and the suction formed on the push-up shaft 23 is generated. A suction force is also generated in the nozzle hole 29 of the lower suction nozzle body 27 through the hole 28.

[0026] When the suction force of the suction pump 32 acts on the annular grooves 14a to 14c, the upper surface of the knock-up body 1 becomes an adsorption surface that adsorbs and holds the lower surface of the adhesive sheet 2 to which the semiconductor chip 3 is adhered. In other words, the upper surface of the backup body 1 is the portion located around the semiconductor chip 3 to be picked up by the adhesive sheet 2, and the portion located around the opening 12 of the adhesive sheet 2 is sucked and held. To do.

[0027] When a suction force acts on the nozzle hole 29 of the lower suction nozzle body 27, the flat surface 27a of the lower suction nozzle body 27 opened by the nozzle hole 29 is formed on the back-up body 1 of the adhesive sheet 2. The lower surface of the portion facing the opening 12 is sucked and held. In other words, the adhesive sheet 2 is sucked and held by the part corresponding to the lower surface of the semiconductor chip 3 to be picked up and the part located around the opening 12! / Speak.

As shown in FIG. 1, a cam follower 35 is rotatably provided at a lower end portion of the push-up shaft 23 from which the lower end surface force of the closing member 21 protrudes. The cam follower 35 is in contact with the outer peripheral surface of a cam 36 that is driven to rotate in the direction of the arrow by a drive source (not shown). Therefore, when the cam 36 is driven to rotate, the push-up shaft 23 is driven in the vertical direction, so that the lower suction nozzle body 27 is interlocked with the movement in the vertical direction.

[0029] When the cam follower 35 hits the bottom dead center of the cam 36 and the push-up shaft 23 is in the lowered position, the lower suction nozzle body 27 has a flat surface 27a slightly above the suction surface of the upper surface of the backup body 1. Position it below.

[0030] When the cam 36 rotates and the cam follower 35 hits the top dead center and the push-up shaft 23 is in the raised position, the flat surface 27a of the lower suction nozzle body 27 is separated from the suction surface of the backup body 1. It is set to project a certain dimension upward, for example 1. Omm. Note that the drive control of the upper suction nozzle mechanism 4 and the knock-up unit 10 is controlled by a control device (not shown) as described later. Next, the operation of the pickup device having the above configuration will be described with reference to FIGS. 4A to 4D.

As shown in FIG. 1, when the backup body 1 is raised to a position where the upper surface of the backup body 1 contacts the lower surface of the adhesive sheet 2, the adhesive sheet 2 is driven in the X and Y directions by the unillustrated weno and ring to pick up The semiconductor chip 3 to be mounted is positioned above the opening 12 of the backup body 1. That is, positioning is performed so that the center of the semiconductor chip 3 coincides with the center of the opening 12.

When the semiconductor chip 3 to be picked up is positioned, the upper suction nozzle mechanism 4 is lowered as shown in FIG. 4A, and the lower suction surface 8a of the upper suction nozzle body 8 provided at the lower end thereof is used. The upper surface of the semiconductor chip 3 to be picked up is sucked. At this time, the upper suction nozzle body 8 presses the semiconductor chip 3 with a predetermined load. The upper surface of the lower suction nozzle body 27 is located slightly below the lower surface of the adhesive sheet 2.

[0033] If the upper suction nozzle body 8 is lowered and the upper surface of the semiconductor chip 3 is sucked and held, the flat surface 27a of the lower suction nozzle body 27 becomes the suction surface (upper surface) of the backup body 1 as shown in FIG. 4B. After raising the push-up shaft 23 to the same height, the suction pump 32 is operated.

Accordingly, the lower surface of the semiconductor chip 3 to be picked up is sucked and held via the adhesive sheet 2 by the flat surface 27 a of the lower suction nozzle body 27 to which the suction force of the suction pump 32 acts. That is, the upper and lower surfaces of the semiconductor chip 3 to be picked up are sandwiched between the upper suction nozzle body 8 and the lower suction nozzle body 27 formed of an elastic material.

[0035] When the suction pump 32 is operated, the internal space of the backup body 1 is depressurized, and suction force is generated in the annular grooves 14a to 14c and the communication groove 15 on the upper surface thereof. A portion located around the semiconductor chip 3 to be picked up is sucked and held on the suction surface of the backup body 1.

At this time, a suction force is also generated in the opening 12 of the knock-up body 1, and the semiconductor chip 3 positioned facing the opening 12 is sucked into the backup body 1 through the adhesive sheet 2.

However, the semiconductor chip 3 has a rectangular shape slightly larger than the opening 12. Therefore, before the lower surface of the semiconductor chip 3 is sucked and held by the lower suction nozzle body 27, Even if a suction force is generated in the opening 12 of the backup body 1, the peripheral portion of the semiconductor chip 3 facing the opening 12 is held by being engaged with the peripheral portion of the opening 12 on the upper surface of the backup body 1. The Therefore, the semiconductor chip 3 is prevented from being bent and deformed by being sucked into the opening 12 together with the adhesive sheet 2 by the suction force generated in the knock-up body 1.

[0038] If the upper and lower surfaces of the semiconductor chip 3 to be picked up are sandwiched between the upper suction nozzle body 8 and the lower suction nozzle body 27, the push-up shaft 23 is placed on the lower suction nozzle body 27 as shown in FIG. 4C. The end surface is raised from the same height as the suction surface of the backup body 1 to a height that protrudes, for example, 0.5 mm. This rise is the first rise process.

Note that the timing at which the suction pump 32 is activated may be the time when the first ascending step is completed.

When the push-up shaft 23 is raised, the pressure-sensitive adhesive sheet 2 is stretched, and the pressure-sensitive adhesive sheet 2 starts to be peeled off from the four corners of the lower surface of the semiconductor chip 3 by the suction force acting on the portion facing the opening 12 of the pressure-sensitive adhesive sheet 2. .

[0040] When the adhesive sheet 2 begins to peel from the four corners of the lower surface of the semiconductor chip 3, the lower suction nozzle body 27 is further raised by 0.5 mm. This rise is the second rise process. That is, by controlling the rotation of the cam 36, the lower suction nozzle body 27 is raised in two steps of 0.5 mm, and as a result, the flat surface 27a of the lower suction nozzle body 27 is adsorbed to the backup body 1. Raise lmm from the surface.

When the lower suction nozzle body 27 is raised in this way, the pressure-sensitive adhesive sheet 2 advances from the pressure-sensitive adhesive sheet 2 with respect to the semiconductor chip 2 with the lower-surface four corner forces also being directed toward the center. In other words, as the lower suction nozzle body 27 rises, as shown in an enlarged view in FIG. 5, the portion of the adhesive sheet 2 that is detached from the flat surface 27a of the lower suction nozzle body 27 is stretched into a mountain shape.

That is, the lower suction nozzle body 27 pushes up the semiconductor chip 3 with the suction surface force of the backup body 1 while deforming the adhesive sheet 2 into a trapezoidal mountain shape. At this time, the upper suction nozzle mechanism 4 rises in conjunction with the raising of the push-up shaft 23.

[0043] When the semiconductor chip 3 is pushed up, the adhesive sheet 2 is stretched while being deformed into a mountain shape. Is done. When the pressure-sensitive adhesive sheet 2 is stretched, the area of the pressure-sensitive adhesive sheet 2 increases, so that the adhesive force per unit area decreases as the area increases. Therefore, the semiconductor chip 3 is easily peeled off from the adhesive sheet 2.

[0044] Further, the adhesive sheet 2 is pushed up by the lower suction nozzle body 27 and deformed into a mountain shape, so that the central force of the flat surface 27a of the lower suction nozzle body 27 is also the most distant part. The adhesive sheet 2 peels from the four corners of 3. In FIG. 5, the part where the adhesive sheet 2 is peeled off from the four corners of the semiconductor chip 3 is indicated by R.

The semiconductor chip 3 is pushed up by the flat surface 27a of the lower suction nozzle body 27 formed of an elastic material. For this reason, local stress is not applied to the semiconductor chip 3 when it is pushed up, and the semiconductor chip 3 can be pushed up without being damaged.

[0046] The flat surface 27a of the lower suction nozzle body 27 has a circular planar shape. Therefore, since the flat surface 27a has no corners (edges), it can be pushed up without applying local stress to the semiconductor chip 3.

[0047] Since the flat surface 27a of the lower suction nozzle body 27 has a circular shape, the four corners of the semiconductor chip 3 can also have a large distance to the flat surface 27a. Therefore, when the semiconductor chip 3 is pushed up by the lower suction nozzle body 27, the curvature radius of the curvature of the semiconductor chip 3 can be increased even if the semiconductor chip 3 is deformed. Stress can be prevented from being applied.

Furthermore, the semiconductor chip 3 is pushed up by the flat surface 27a of the lower suction nozzle body 27, and the upper surface is held by the flat surface 8a on the lower surface of the upper suction nozzle body 8 that is also formed of an elastic material. . For this reason, even if the pressure-sensitive adhesive sheet 2 is deformed into a mountain shape when pushed up, the pair of suction nozzle bodies 8 and 27 suppress the deformation of the semiconductor chip 3 with the pressure-sensitive adhesive sheet 2 into a mountain shape. This also prevents the pushed-up semiconductor chip 3 from being damaged.

[0049] Since the semiconductor chip 3 is naturally sandwiched by a pair of upper and lower suction nozzle bodies 27, 8 formed of an elastic material, the stress applied to the pushed-up semiconductor chip 3 is relaxed, and the semiconductor chip 3 Chip 3 is prevented from being damaged.

[0050] The semiconductor chip 3 is moved upward from the upper surface of the backup body 1 by the lower suction nozzle body 27. When pushed up, the upper suction nozzle body 8 is raised as shown in FIG. 4D. At this time, the lower suction nozzle body 27 sucks and holds the portion corresponding to the lower surface of the semiconductor chip 3 to be picked up by the adhesive sheet 2 by the suction force acting on the nozzle hole 29.

[0051] For this reason, the suction force of the upper suction nozzle body 8 that rises and the suction force of the lower suction nozzle body 27 are picked up respectively, and the adhesive sheet 2 attached to the lower surface of the semiconductor chip 3 is attached. It will act as a peeling force.

[0052] Therefore, the semiconductor chip 3 is adhered to the semiconductor chip 3 with about twice as much force as the suction force from above and below, compared to the case where the semiconductor chip 3 is simply picked up by the upper suction nozzle body 8 as in the prior art. Since the semiconductor chip 3 can be peeled off from the sheet 2, it is possible to pick up the semiconductor chip 3 easily and reliably.

That is, the upper suction nozzle body 8 lifts the semiconductor chip 3 upward, and the lower suction nozzle body 27 pulls the adhesive sheet 2 downward. Therefore, the peeling of the pressure-sensitive adhesive sheet 2 proceeds toward the center from the peeled portion of the corner portion of the semiconductor chip 3 generated at the time of pushing up. Therefore, the semiconductor chip 3 is removed from the pressure-sensitive adhesive sheet 2 by the upper suction nozzle body 8. Pick up quickly and reliably.

Further, the upper suction nozzle body 8 of the upper suction nozzle mechanism 4 and the lower suction nozzle body 27 of the push-up shaft 23 are detachable. Therefore, since each suction nozzle body 8, 27 can be replaced with one having a different diameter, even if the size of the semiconductor chip 3 is changed, it is possible to use the suction nozzles 8, 27 of the corresponding size. It is possible to respond.

[0055] FIGS. 6A to 6C show a second embodiment of the present invention. In this embodiment, a plurality of plate bodies 25 provided at the upper end of the push-up shaft 23 are provided, and in this embodiment, four convex portions 26 are provided at the four corners of the plate body 25. A lower suction nozzle body 27 formed of an elastic material is detachably attached to each of the four convex portions 26.

The suction hole 28 formed in the push-up shaft 23 communicates with a recess 41 formed open at the upper end surface of the push-up shaft 23. The board body 25 and the convex part 26 are formed with communication holes 42 communicating with the nozzle holes 29 formed in the lower suction nozzle body 27 via the concave parts 41. Therefore, the suction pump 32 shown in FIG. If the three suction holes 28 act, a suction force is generated in the nozzle hole 29 of the lower suction nozzle body 27.

As described above, if the four lower suction nozzle bodies 27 are provided in the board body 25, when the semiconductor chip 3 is pushed up by raising the push-up shaft 23, the lower surface of the semiconductor chip 3 is placed on the four sides of the board body 25. The four lower suction nozzle bodies 27 provided at the corners can be pushed up while being sucked and held.

[0058] Therefore, compared with the case where the semiconductor chip 3 is pushed up by one lower suction nozzle body 27, the dimension from the outer periphery of the lower suction nozzle body 27 to the edge of the board body 25 shown by Z in FIG. 6C, that is, the semiconductor chip 3 Therefore, when the semiconductor chip 3 is pushed up according to the dimension Z, the amount of deflection generated at the corner of the semiconductor chip 3 is reduced, and the corner It can be prevented from being damaged.

[0059] The four lower suction nozzle bodies 27 are arranged so as to reduce the amount of deflection when they are pushed up with respect to the force that can be increased or decreased in the diagonal direction, for example, the rectangular semiconductor chip 3. be able to. As a result, local stress can be prevented from being generated at the corners of the semiconductor chip 3 when pushed up.

FIG. 7 shows a third embodiment of the present invention. In this embodiment, the lower suction nozzle body 27 formed of an elastic material has a cylindrical shape made of an elastic material softer than the lower suction nozzle body 27 with respect to the convex portion 26 provided on the plate body 25 of the push-up shaft 23. It is detachably held via an elastic support member 44 formed in the above.

According to such a configuration, when the semiconductor chip 3 is pushed up by the lower suction nozzle body 27, the lower suction nozzle body 27 holds the pressure-sensitive adhesive sheet 2 while being elastically displaced by the soft elasticity of the elastic support member 44. When the semiconductor chip 3 is pushed up and the elastic support member 44 finishes compressive deformation, the lower suction nozzle body 27 is elastically deformed.

That is, the elasticity when the semiconductor chip 3 is pushed up by the lower suction nozzle body 27 gradually becomes stronger as the lower suction nozzle body 27 hits the semiconductor chip 3 as it is pushed up softest. That is, the impact when the lower suction nozzle body 27 comes into contact with the semiconductor chip 3 is minimized to prevent damage, and when the lower suction nozzle body 27 presses the semiconductor chip 3 through the adhesive sheet 2 when pushed up, Impact on semiconductor chip 3 Can be prevented from being damaged.

In this third embodiment, the elastic support member 44 is harder than the lower suction nozzle body 27.

V may be made of a coasting material.

FIG. 8 shows a fourth embodiment of the present invention. In this embodiment, the lower suction nozzle body 2

A plate body 25 having a convex portion 26 to which 7 is attached is separated from the push-up shaft 23. That is, a support shaft 45 is provided on the lower surface of the panel body 25, and the support shaft 4 is provided on the push-up shaft 23.

A support hole 46 for slidably supporting 5 is formed.

A coil spring 47 as an elastic support member is provided between the board body 25 and the push-up shaft 23. This coil spring 47 has a softer elasticity than the inertia material forming the lower suction nozzle body 27.

A retaining pin 48 is provided in the middle of the support shaft 45. This retaining pin 4

8 is engaged with the upper end of the long hole 49 formed in the middle of the push-up shaft 23 by the support shaft 45 being urged in the upward direction by the urging force of the coil spring 47.

[0066] Accordingly, the support shaft 45 is supported by the retaining pin 48 in the raised position by the retaining pin 48.

The coil spring 47 is prevented from being pulled out from the position 6, and the coil spring 47 is compressed and deformed from its raised position so that it can be displaced in the descending direction.

Note that the support shaft 45 has a communication hole 5 communicating with a suction hole 28 formed in the push-up shaft 23.

0 is formed along the axial direction. The suction hole 28 communicates with a nozzle hole 29 formed in the lower suction nozzle body 27 through the communication hole 50.

According to such a configuration, when the lower suction nozzle body 27 contacts the semiconductor chip 3, only the weights of the lower suction nozzle body 27 and the panel body 25 are added to the chip 3, and the coil spring 47 Since the upward force of the push-up shaft 23 is not directly applied due to elastic deformation, the impact applied to the semiconductor chip 3 can be reduced and the chip 3 can be prevented from being damaged.

[0069] When the lower suction nozzle body 27 comes into contact with the semiconductor chip 3 and pushes up the force, the coil spring 47 softer than the lower suction nozzle body 27 is compressed and deformed, and then the lower suction nozzle body 27 is elastically deformed. To do.

Therefore, as in the third embodiment shown in FIG. 7, the elasticity when the semiconductor chip 3 is pushed up by the lower suction nozzle body 27 is such that the lower suction nozzle body 27 contacts the semiconductor chip 3. Since the softest semiconductor chip 3 becomes stronger as it is pushed up, the semiconductor chip 3 can be prevented from being damaged by impact when pushed up. In this fourth embodiment, the coil spring 47 The lower suction nozzle body 27 may be harder and more resilient than the lower suction nozzle body 27.

Further, in the third and fourth embodiments, the lower suction nozzle body 27 has been described as an example, but a plurality of lower suction nozzle bodies 27 are provided as in the second embodiment. But ヽ

[0072] When a plurality of lower suction nozzle bodies 27 are provided, the panel constant of the elastic support member 44 or the coil spring 47 that elastically supports each lower suction nozzle body 27, that is, the amount of compressive deformation with respect to the load is the same. It can be different.

[0073] When a plurality of elastic support members 44 or coil springs 47 having different panel constants are used, the lower suction nozzle body 27 supported by the elastic support member 44 or the coil spring 47 having a low elastic force has a high elastic force! Compared to the lower suction nozzle body 27 supported by the inertia support member 44 or the coil spring 47, the frictional force with the adhesive sheet 2 is reduced. As a result, the upper surface of the lower suction nozzle body 27 rises while sliding with respect to the pressure-sensitive adhesive sheet 2, so that the pressure-sensitive adhesive sheet is easily peeled from the semiconductor chip 3 by the sliding contact.

FIG. 9 shows a fifth embodiment of the present invention. This embodiment shows a modified example of the push-up means, and includes a lower push-up body 51 formed of a coasting material instead of the lower suction nozzle body 27 shown in the above-described embodiments.

The lower push-up body 51 is formed in a rectangular shape whose planar shape is smaller than that of the semiconductor chip 3, and a plurality of ridges 52 and grooves 53 along the width direction intersect the width direction on the upper surface. The corrugations are alternately formed in the longitudinal direction.

[0076] The lower pusher 51 is detachably attached to the convex portion 26 of the board 25 provided at the upper end of the pushup shaft 23. The opening 12 formed in the knock-up body 1 has a rectangular shape that is larger than the lower push-up body 51 and smaller than the semiconductor chip 3.

[0077] In this embodiment, the lower push-up body 51 is provided below the above embodiments. The nozzle hole 29 is formed like the partial suction nozzle body 27, but a suction hole may be formed that opens on the upper surface of the protrusion 52 of the lower push-up body 51.

If the lower push-up body 51 having the above-described configuration is used, the lower push-up body 51 has a rectangular shape smaller than the semiconductor chip 3, so that the suction force that acts on the opening 12 when the semiconductor chip 3 is pushed up is used. This suppresses the semiconductor chip 3 from being greatly bent and deformed downward. Accordingly, even when the semiconductor chip 3 is as thin as 20 to 30 / ζ πι, it is prevented from being greatly bent and damaged by the suction force.

[0079] Since the plurality of concave grooves 53 are formed in the lower push-up body 51, the portion corresponding to the concave groove 53 among the parts pushed up by the lower push-up body 51 of the adhesive sheet 2 is an opening. The suction force generated in 12 acts. As a result, the semiconductor chip 3 is easily peeled off from the adhesive sheet 2, so that the semiconductor chip 3 can be reliably picked up by the upper suction nozzle body 8.

FIGS. 10 to 12 show a sixth embodiment of the present invention. This embodiment shows a modification of the push-up means, and at the upper end of the push-up shaft 23, as shown in FIG. 10, a block 25Α corresponding to the board body 25 of each of the above embodiments is provided. This block 25Α has a plurality of lower push-up bodies formed in a truncated cone shape with a flat upper surface made of a hydrophilic material. In this embodiment, as shown in FIG. 11, the first to fifth five lower push-up bodies 55a ~ 55e are provided.

Note that the shape of each of the lower push-up bodies 55a to 55e is not limited to the truncated cone shape, and may be a columnar shape, a prismatic shape, or the like.

[0082] Of the five lower push-up bodies 55a to 55e, for example, the first lower push-up body 55a located at a corner of one end of the block 25A in a predetermined direction is a disk provided at the upper end of the movable shaft 56. Removably attached to 57. The second to fourth lower push-up bodies 55b to 55e are detachably provided on the upper surface of the block 25A.

[0083] A concave stepped portion 54 is formed at a corner of one end of the block 25A in a predetermined direction. The step portion 54 is formed with a support hole 58 having a large diameter portion 58a opened on the upper surface thereof. The movable shaft 56 is supported in the support hole 58 by a coil spring 59 provided in the large-diameter portion 58a so as to be capable of inertial displacement. [0084] Then, in the state where the coil spring 59 is not compressed, the first lower push-up body 55a has an upper surface protruding above the upper surfaces of the other push-up bodies 55a by a dimension indicated by h in FIG. , Its height is set. The dimension h is about lmm.

As shown in FIG. 10, the block 25 A is formed with a suction distributor 61 that communicates with the suction hole 28 formed in the push-up shaft 23. One end of five suction branch paths 62 (only three are shown in FIG. 10) is connected to the suction distributor 61. The other ends of these branch paths 62 communicate with the support holes 58 and the suction holes 29 formed in the second to fifth lower push-up bodies 55b to 55e.

[0086] The movable shaft 56 supported by the support hole 58 has a suction branch 62 communicating with the support hole 58 and a suction formed on the first lower push-up body 55a provided on the movable shaft 56. A communication path 63 communicating with the hole 29 is formed.

Accordingly, the suction force of the suction pump 32 shown in FIG. 1 acts on the flat upper surfaces of the first to fifth lower push-up bodies 55a to 55e via the suction holes 28 of the push-up shaft 23. It is like this.

As shown in FIG. 12, when the push-up shaft 23 is driven in the upward direction, the first to fifth lower push-up bodies 55a to 55e are placed on the suction surface on the upper surface of the backup body 1. The opening 12A corresponding to the shape that can project, that is, the shape obtained by combining the planar shapes (circular shapes) of the five lower push-up bodies 55a to 55e is formed.

The shape of the opening 12A may be a rectangular shape slightly smaller than the semiconductor chip 3.

[0089] On the upper surface of the backup body 1, a rectangular groove 64 is formed around the opening 12A. The rectangular groove 64 is formed such that the outer circumference is slightly smaller than the outer shape of the semiconductor chip 3 indicated by a chain line in FIG. 12 and the outer circumference is slightly larger than the outer peripheral edge of the semiconductor chip 3. As a result, the outer peripheral edge of the semiconductor chip 3 that is positioned and held on the upper surface of the knock-up body 1 via the adhesive sheet 2 is positioned above the middle part in the width direction of the rectangular groove 64. become.

[0090] As shown in FIG. 12, a plurality of annular grooves 65 and four radial grooves 66 that communicate with the annular grooves 65 and the rectangular grooves 64 are formed on the upper surface of the backup body 1. This radiation groove A through hole 67 is formed in 66 so as to communicate the inside and the upper surface of the backup body 1. As a result, the suction force of the suction pump 32 acts on the rectangular groove 64 and the annular groove 65 from the internal space of the backup body 1 and the through hole 67 via the radiation groove 66.

[0091] The number of the annular grooves 65 and the radiation grooves 66 is not limited. For example, the number of the radiation grooves 66 is not limited to four, and may be six or more! /.

FIG. 10 shows only the rectangular groove 64 among the rectangular groove 64, the annular groove 65 and the radiation groove 66 formed on the suction surface of the backup body 1.

According to such a configuration, after the semiconductor chip 3 to be picked up is positioned with respect to the knock-up body 1 and the upper suction nozzle mechanism 4 is lowered to hold the upper surface of the semiconductor chip 3 by suction, the suction pump Actuate 32 to generate suction force on the suction surface of backup body 1. As a result, the semiconductor chip 3 positioned on the suction surface of the backup body 1 is sucked and held via the adhesive sheet 2.

[0093] A rectangular groove 64 is formed on the suction surface of the backup body 1, and the semiconductor chip 3 is positioned so that the outer peripheral edge of the semiconductor chip 3 is located in the middle of the rectangular groove 64 in the width direction. . Therefore, the portion of the adhesive sheet 2 corresponding to the outer peripheral edge of the semiconductor chip 3 is strongly sucked by the suction force generated in the rectangular groove 64.

[0094] Next, the push-up shaft 23 is driven in the upward direction. Accordingly, among the five lower push-up bodies 55a to 55e, the first push-up body 55a whose upper surface is higher than the second to fifth four lower push-up bodies 55b to 55e is provided via the adhesive sheet 2. Thus, the lower surface of the portion corresponding to one of the four corners of the semiconductor chip 3 is attracted and pressed elastically.

[0095] When only the portion corresponding to one corner of the semiconductor chip 3 is pushed up, the adhesive sheet 2 at that corner is greatly stretched compared to the other portion. Therefore, the adhesive sheet 2 starts to peel from a portion corresponding to the corner portion pushed up by the first lower push-up body 55a of the semiconductor chip 3.

[0096] At this time, since the portion corresponding to the outer peripheral edge of the semiconductor chip 3 is strongly sucked by the rectangular groove 64 in the adhesive sheet 2, the corner of the semiconductor chip 3 pushed up by the first lower push-up body 55a The peeling of the part corresponding to the outer edge of the part proceeds smoothly. [0097] Since the semiconductor chip 3 is tilted by being partially pushed up only by the first push-up body 55a, the corner force located at the upper end in the tilt direction is also easily peeled off from the adhesive sheet 2. Become.

[0098] After the first lower push-up body 55a pushes up the lower surface of the semiconductor chip 3, when the push-up shaft 23 is further raised and the pressing force applied to the first lower push-up body 55a increases, the coil spring Since 59 is compressed and deformed, the first lower pusher 55a is displaced downward relative to the pushup shaft 23.

[0099] When the first lower pusher 55a has the same height as the other four lower pushers 55b to 55e, the lower surface of the semiconductor chip 3 becomes the first to fourth lower pushers 55a to 55d. As a result, the four corners are pushed up, and the center part is pushed up by the fifth lower pusher 55e.

[0100] In the pressure-sensitive adhesive sheet 2, a portion corresponding to one corner of the semiconductor chip 3 pushed up by the first lower push-up body 55a is peeled off in advance. Further, the portion corresponding to the outer peripheral edge of the semiconductor chip 3 is strongly sucked by the suction force generated in the rectangular groove 64.

Therefore, when the four corners of the semiconductor chip 3 are pushed up by the flat upper surfaces of the first to fourth lower push-up bodies 55a to 55d and the adhesive sheet 2 is stretched, the first lower push-up body 55a preliminarily Starting from one peeled corner, the other parts can be peeled off smoothly.

That is, when a part of the semiconductor chip 3 is pushed up only by the first lower pusher 55a first, the adhesive sheet 2 at that part is easily peeled off. Next, when the other corners of the semiconductor chip 3 are pushed up by the second to fourth lower push-up bodies 55b to 55d, the other parts are also relatively smooth starting from the part peeled off by the first lower push-up body 55a. To be peeled off.

[0103] The portion of the adhesive sheet 2 corresponding to the outer peripheral edge of the semiconductor chip 3 is also strongly sucked by the suction force generated in the rectangular groove 64. Peeling will proceed smoothly.

The central portion of the lower surface of the semiconductor chip 3 is supported by the fifth lower pusher 55e. Therefore, the semiconductor chip 3 has an opening 12 formed on the suction surface of the backup body 1. The suction force generated in A prevents the wire from being bent and deformed by being sucked into the opening 12A.

In this way, the adhesive sheet 2 is also peeled off from the lower surface force of the semiconductor chip 3, so that the semiconductor chip 3 can be reliably picked up by the upper suction nozzle mechanism 4. At the time of pickup, the adhesive sheet 2 is sucked downward by the suction force generated on the upper surfaces of the first to fifth lower push-up bodies 55a to 55e. For this reason, the suction force acts as a force for peeling the adhesive sheet 2 from the lower surface force of the semiconductor chip 3, so that the semiconductor chip 3 can be picked up smoothly.

[0106] In the sixth embodiment, the number of lower push-up bodies provided in the block 25A is not limited to five, and may be two to four or six or more, for example, two in the case of six. Provided in three rows each, one row of the two lower elastic bodies located at one end in the predetermined direction is inertially displaced downward by the coil spring so as to be positioned above the other four lower elastic bodies Try to keep it possible.

With such a configuration, when the push-up shaft is raised during pickup, the semiconductor chip is first pushed up at one end in a predetermined direction via the adhesive sheet. One end force in a predetermined direction of the chip is peeled off sequentially by applying force to the other part.

Further, in the sixth embodiment, a force that forms a nozzle hole in the first to fifth lower push-up bodies and generates a suction force on the upper surface thereof. The hole is not formed.

FIG. 13 shows a seventh embodiment of the present invention, and this embodiment is a modification of the sixth embodiment shown in FIGS. 10 to 12. That is, in the sixth embodiment, the rectangular grooves 64 are formed on the suction surface of the knock-up body 1, but instead of the rectangular grooves 64, the suction holes 68 are formed at positions corresponding to the four corners of the semiconductor chip 3. To form. The suction hole 68 is set to a size communicating with the innermost annular groove 65.

[0110] According to such a configuration, the suction force acting on the suction hole 68 causes a strong suction force to act on the adhesive sheet 2 at the portions corresponding to the four corners of the semiconductor chip 3. When chip 3 is pushed up by the lower push-up body 55a to 55e, In the case 2, the portions corresponding to the four corners of the semiconductor chip 3 are smoothly peeled off.

[0111] If the pressure-sensitive adhesive sheet 2 is peeled off from the four corners of the semiconductor chip 3, the peeling easily propagates from the four corners to other parts. It becomes possible to carry out reliably without generating.

In each of the above embodiments, other drive sources such as a force cylinder that uses a cam to move the push-up shaft up and down may be used. Further, the planar shape of the upper suction nozzle body and the lower suction nozzle body is not limited to a circular shape, but may be a rectangle or the like.

[0113] Further, a suction nozzle formed of an elastic material is detachably attached to the lower end of the pickup shaft of the pickup means and the upper end of the push-up shaft of the push-up means. It is not necessary to provide a suction nozzle made of an elastic material. In other words, if the pick-up means can suck and hold the upper surface of the semiconductor chip to be picked up, the push-up means should suck and hold the part of the adhesive sheet attached to the lower surface of the semiconductor chip!

[0114] Also, the opening of the backup body has a rectangular shape slightly smaller than the semiconductor chip.

There is no limitation on the size of the semiconductor chip.

[0115] In the sixth embodiment, the rectangular groove is formed on the suction surface of the backup body. However, the rectangular groove is formed on the suction surface of the backup body used in the first to fifth embodiments. Also good. Similarly, a configuration in which suction holes are formed in portions corresponding to the four corners of the semiconductor chip may be applied to the first to fifth embodiments.

Industrial applicability

[0116] According to the present invention, when the semiconductor chip is picked up from the adhesive sheet, the portion of the adhesive sheet located in the periphery of the semiconductor chip is sucked and held to push up the semiconductor chip.

[0117] Therefore, if it is possible to prevent local stress from being applied to the semiconductor chip and damage it, the pressure-sensitive adhesive sheet corresponding to the pushed-up portion of the semiconductor chip will increase in elongation. However, the semiconductor chip force is easily peeled off.

Claims

The scope of the claims

[1] A semiconductor chip pick-up device for picking up a semiconductor chip attached to an adhesive sheet,

A pickup device for a semiconductor chip, comprising:

2. The semiconductor chip pick-up device according to claim 1, wherein the push-up means has at least an upper end portion for pushing up the semiconductor chip to be picked up by an elastic material.

[3] The semiconductor chip pick-up device according to claim 1 or 2, wherein the push-up means sucks a lower surface of a portion of the adhesive sheet to which the semiconductor chip to be picked up is attached. .

4. The semiconductor chip pick-up device according to claim 1, wherein the push-up means has a plurality of lower suction nozzle body forces that are detachably provided.

[5] The semiconductor chip pickup according to claim 1 or 2, wherein the push-up means has a flat surface for pushing up a portion of the adhesive sheet to which the semiconductor chip to be picked up is attached. apparatus.

6. The semiconductor chip pick-up device according to claim 5, wherein the flat surface has an area smaller than a planar shape of the semiconductor chip.

7. The pick-up device for a semiconductor chip according to claim 1, wherein at least a lower end portion for adsorbing the picked-up semiconductor chip is formed of an elastic material.

[8] The suction surface of the backup body is formed with an opening having a smaller shape than the semiconductor chip so that the push-up means can be lifted to push up the semiconductor chip picked up via the adhesive sheet. The semiconductor chip pick-up device according to claim 1, wherein:

[9] The push-up means has a push-up shaft driven in the vertical direction, and a lower suction nozzle body made of an elastic material elastically supports the lower suction nozzle body at the upper end of the push-up shaft. 2. The semiconductor chip pick-up device according to claim 1, wherein the pick-up device is provided via an elastic support member having elasticity different from that of the lower suction nozzle body.

[10] The push-up means has a push-up shaft driven in the vertical direction and a lower suction nozzle body provided at an upper end of the push-up shaft. The lower suction nozzle body has the push-up shaft driven in the lift direction. The semiconductor chip is supported by the push-up shaft so as to be elastically displaceable in the vertical direction so that only the weight of the lower suction nozzle body is applied to the semiconductor chip when contacting the semiconductor chip. The semiconductor chip pick-up device described.

[11] The push-up means has a push-up shaft driven in the vertical direction, and a wave-shaped lower push-up body in which ridges and grooves are alternately formed on the upper surface by an elastic material at the upper end of the push-up shaft. 2. The semiconductor chip pick-up device according to claim 1, wherein the pick-up device is provided.

[12] The push-up means has a push-up shaft driven in the vertical direction, and a plurality of lower push-up bodies are provided at the upper end of the push-up shaft, and at least one of the plurality of push-up bodies is another push-up body. 2. The semiconductor chip pick-up device according to claim 1, wherein the semiconductor chip pick-up device is held so that it can be lowered downward so that the upper surface is at a higher position.

[13] A rectangular groove for generating a suction force is formed on the upper surface of the backup body, and the outer periphery of the semiconductor chip adsorbed and held on the upper surface of the backup body via the adhesive sheet is formed on the rectangular groove. 2. The pick-up device for a semiconductor chip according to claim 1, wherein the pick-up device is set to a size located in the middle of the rectangular groove in the width direction.

[14] The backup body absorbs the upper surface of the backup body through the adhesive sheet. 2. The semiconductor chip pick-up device according to claim 1, wherein suction holes are provided at positions corresponding to the four corners of the semiconductor chip to be attached and held.

A semiconductor chip pick-up method for picking up a semiconductor chip attached to an adhesive sheet,

Adsorbing and holding a portion of the adhesive sheet located around the semiconductor chip to be picked up, supporting a portion corresponding to the lower surface of the semiconductor chip, adsorbing and holding the upper surface of the semiconductor chip;

A step of pushing up the semiconductor chip and elastically deforming the pressure-sensitive adhesive sheet into a mountain shape while adsorbing and holding the upper surface of the semiconductor chip and the peripheral portion of the semiconductor chip to be picked up of the pressure-sensitive adhesive sheet;

Adsorbing the upper surface of the semiconductor chip and picking up the semiconductor chip from the adhesive sheet;

A method of picking up a semiconductor chip, comprising: