JP2003347389A - Moving apparatus for semiconductor chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a moving apparatus for a semiconductor chip in which a load that the semiconductor chip receives in the case of pickup is easily adjusted wherein a wafer stuck on the upper surface of a wafer sheet is cut into a large number of semiconductor chips for releasing and moving the semiconductor chips to a chip storage tray one after another. <P>SOLUTION: In a shaft member 30 which has an adsorption head 1 for adsorbing a semiconductor chip 9 on its lower end, a shaft is vertically guided to a bearing 52 on a movable stand 50 of a head holder 2, its downward movement is limited by a block 33 projected on the shaft, and further, the shaft member is energized by screwing a bolt 55 which passes through the block 33 and a compression coil spring 61 into the movable stand 50 vertically, and supported while being imparted with the dead weight of the shaft member 30 and the elastic force of the compression coil spring 61 as a downward load. The load is variably adjusted by rotating the bolt 55. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip transfer device for transferring semiconductor chips cut from a wafer to a chip storage tray for transfer.

[0002]

2. Description of the Related Art Generally, a semiconductor component manufacturing process includes a pre-process for forming an IC circuit on a disc-shaped wafer such as silicon and a post-process for finishing a desired individual semiconductor component based on the wafer. It is roughly divided. Of these, in the later process, first, the wafer is made of a metal ring (hereinafter, referred to as a metal ring).
Non-woven fabric stretched inside the "wafer ring" (hereinafter sometimes referred to as "wafer sheet"), and is generally made of a resin film such as polyimide resin, and has excellent flame retardancy , A thin, durable material with good expandability) is attached to the upper surface of the central part with an adhesive, and cut directly along the scrub line with a dicing saw to produce a large number of semiconductor chips. Be divided. After these semiconductor chips are separated from the wafer sheet and subjected to a plasma cleaning step (these may be separated from the wafer sheet after the plasma cleaning), a bonding step for making an electrical connection with other components or Through a resin sealing step of sealing the connection portion with a resin, the semiconductor component is finished.

At this time, the semiconductor chips separated from the wafer sheet are actually transferred to a dedicated chip storage tray having a large number of storage recesses formed on the upper surface, and the chip storage tray and a subsequent plasma cleaning step are performed. Or the bonding process.

Here, a conventional transfer device for transferring a semiconductor chip to a chip storage tray will be described with reference to FIGS. 10 is a schematic front view of a main part of a conventional transfer device, FIG. 11 is a schematic plan view of the transfer device,
FIG. 12 is a side view of a main part of the transfer device, FIG. 13 is a cross-sectional view taken along line D-D of FIG. 11, and FIG. 14 is a cross-sectional view of the main part explaining a pickup operation of a semiconductor chip by a suction head.

[0005] In these drawings, reference numeral 1 denotes a nozzle-shaped suction head for sucking the semiconductor chips 9 one by one, separating them from the wafer sheet 8 and picking them up. The hollow shaft member 30 vertically supported by the head holder 2 is provided. It is connected to the lower end. A plug 31 is provided at the upper end of the shaft member 30.
The plug 31 is connected to a vacuum suction device (not shown) via a hose 32 (see FIG. 12).

The head holder 2 is moved in the X-axis direction (FIGS.
1 and a base 40 that moves in the left-right direction).
To the Z-axis direction via the linear (up-down direction in FIG. 10,
In FIG. 11, the movable table 50 is connected so as to be movable in a direction perpendicular to the plane of the drawing. And the shaft member 30
The shaft is guided by a bearing 52 that is inserted into a vertical through hole 51 formed in the movable base 50 and protrudes from the upper and lower surfaces of the movable base 50, and a block body protruding from the shaft is provided. The downward movement is restricted by the contact of the upper surface of the bearing 52 with the bearing 33, and the projecting shaft portion 53 projecting above the movable table 50 is guided through the block body 33 to guide the extension coil spring 60. Is the block body 33 and the movable base 50
It is urged and supported by hooking. Therefore, the shaft member 30 has a constant force in which the resultant force of the own weight of the shaft member 30 including the suction head 1, the plug 31, the hose 32, and the block body 33 and the restoring force corresponding to the length L of the extension coil spring 60 is directed downward. Is held while being given as a load, and can be moved only upward against the load.

Reference numerals 3 and 4 denote tray support tables for supporting and fixing a plurality of chip storage trays 5 in a state of being aligned in the Y-axis direction (the direction perpendicular to the plane of FIG. 10; the vertical direction in FIG. 11). They move in the Y-axis direction independently of each other. On the upper surface of the chip storage tray 5, a large number of storage recesses 5a for storing the semiconductor chips 9 are formed in a grid pattern.

Reference numeral 6 denotes a ring support table that supports and fixes the wafer ring 7 on the upper surface, and moves in the X-axis direction and the Y-axis direction. A wafer sheet 8 is stretched inside the wafer ring 7, and a wafer 90 is adhered to the upper surface of the wafer sheet 8 with an adhesive. The wafer 90 is divided into individual semiconductor chips 9 in a dicing process. Have been. The wafer ring 7 is
A magnet (not shown) embedded on the upper surface of the ring support table 6
Is fixed by the magnetic force.

The ring support table 6 has a circular hole 6a having a diameter slightly larger than the wafer 90 and concentric with the wafer 90 (see FIG. 13). A push-up unit 103 which is provided below the support table 6 and pushes up the semiconductor chips 9 on the wafer sheet 8 when picking up the semiconductor chips 9 is inserted and removed (FIG. 14).
reference). The push-up unit 103 includes, on the lower surface of the wafer sheet 8, a suction portion 103a that sucks the vicinity of the semiconductor chip 9 to be pushed up, and a push-up needle 103b that pushes up the semiconductor chip 9.

Further, on the upper surface of the ring support table 6,
A lower surface of the wafer sheet 8 outside the wafer 90;
That is, the annular projection 6b that pushes up and supports the lower surface of the wafer sheet 8, on which the semiconductor chip 9 does not exist directly above, is integrally formed concentrically with the wafer 90 (see FIG. 13). Therefore, the wafer sheet 8 of the wafer ring 7 fixed on the upper surface of the ring support table 6 is pushed up and extended by the annular projection 6b, and thereby, the semiconductor chips 9 separated on the wafer sheet 8 are separated from each other. Is performed, that is, the so-called expanding process is performed.

A camera 10 is fixed on the housing 12 so as to be located vertically above the push-up needle 103b.
The semiconductor chip 9 to be picked up is imaged. Reference numeral 11 denotes a computer which controls the suction head 1, the head holder 2, the tray support tables 3, 4, the ring support table 6, the camera 10, the push-up unit 103, and the like, based on a command input from the input unit 11a.

Next, a series of transfer operations in the transfer device having such a configuration will be described below. First, the wafer ring 7 is fixed to the ring support table 6, and the wafer sheet 8 is expanded. In this state, the ring support table 6 moves and the wafer sheet 8
One of the semiconductor chips 9 divided above is positioned vertically above the push-up needle 103b of the push-up unit 103, that is, at the push-up position.

Next, an image of the semiconductor chip 9 is taken by a camera 10 and a computer 11 is used based on the contour information.
Calculates the amount of misalignment with respect to the thrust-up position, and the ring support table 6 moves again slightly to correct the amount of misalignment. Thereafter, the push-up unit 103 is raised, and the wafer sheet 8 is sucked and fixed by the suction unit 103a. At the same time, the base 40 of the head holder 2 is moved to position the suction head 1 vertically above the push-up position. (See FIG. 14A).

Next, the push-up needle 103b rises to push up the semiconductor chip 9, and in response to this, the suction head 1 moves down together with the movable table 50 of the head holder 2, and comes into contact with and suctions the upper surface of the semiconductor chip 9 ( FIG. 14 (b)). At this time, the tip of the suction head 1 is set so as to descend to a position slightly lower than the pushed-up semiconductor chip 9, but actually, the suction head 1 is connected to the resistance of the push-up needle 103 b via the semiconductor chip 9. As a result, the semiconductor chip 9 is slightly moved upward together with the shaft member 30 against a constant load caused by the own weight of the shaft member 30 and the restoring force of the extension coil spring 60.
The suction is performed in a state where the semiconductor chip 9 is pressed against the semiconductor chip 9, that is, in a state where the semiconductor chip 9 receives the load. The reason why the semiconductor chip 9 pushed up by the push-up needle 103b may be unstable in posture and tilted in such a manner that the semiconductor chip 9 is pushed up by the push-up needle 103b is corrected so as to be surely sucked in a stable posture.

Thereafter, the movable head 50 and the suction head 1
Rises to separate the semiconductor chip 9 from the wafer sheet 8 and pickup is performed (see FIG. 14C).
Then, the suction head 1 moves together with the base 40 of the head holder 2 toward one chip storage tray 5,
At the same time, the tray support table 4 moves, and the semiconductor chip 9 sucked by the suction head 1 is moved to one storage recess 5a.
Is positioned vertically above. Thereafter, the suction head 1 is lowered together with the movable table 50 to store the semiconductor chip 9 in the storage recess 5a, and the suction is released to complete the transfer.

[0016]

The recent semiconductor chip 9 (wafer 90) has a thickness of 0.15 m.
m or less, and those made of brittle materials such as gallium arsenide and ceramic tend to be applied. Therefore, since the strength and unit weight of the semiconductor chip 9 vary depending on the material and thickness of the semiconductor chip 9 to be applied, the load applied to the semiconductor chip 9 when the semiconductor chip 9 is picked up by the transfer device is appropriately adjusted. Coordination is required. This is because if a high load is set when a low-strength semiconductor chip 9 is applied, the semiconductor chip 9 cannot withstand the load and is damaged. This is because the chip 9 and the suction head 1 are not sufficiently pressed against each other and the suction state becomes unstable.

In response to this requirement, the conventional transfer device described above has a configuration in which the load received by the semiconductor chip 9, that is, the load due to the own weight of the shaft member 30 and the restoring force of the extension coil spring 60 is constant. In order to adjust the load, the tension member is replaced with a tension coil spring 60 having a different free length, or the block member 33 of the shaft member 30 and the block member 33 of the movable base 50 are adjusted to adjust the length L of the tension coil spring 60.
Between them, or a weight is loaded on the shaft member 30 in order to adjust the own weight of the shaft member 30.

However, in such a method, since it is necessary to keep some tension coil springs 60, spacers and weights, the management and adjustment work of the actual products are extremely complicated.

Accordingly, the present invention has been made in view of the above-mentioned problems, and a wafer sheet is stretched inside a wafer ring, and the wafer attached to the upper surface of the wafer sheet is cut into a large number of semiconductor chips. These semiconductor chips are separated from the non-woven fabric one by one and transferred to a large number of storage recesses formed on the upper surface of the chip storage tray, so that the load applied to the semiconductor chips during pickup can be easily adjusted. It is an object of the present invention to provide a semiconductor chip transfer device.

[0020]

In order to achieve the above object, a semiconductor chip transfer apparatus according to the present invention is a ring support table for fixing a ring, and a transfer object in the ring fixed to the ring support table. A push-up needle for pushing up the semiconductor chip together with the nonwoven fabric, a tray support table for fixing the chip storage tray, a shaft member having a suction head at a lower end for sucking the semiconductor chip, and a shaft member having a predetermined downward load. And a head holder movably supported and relatively moved with respect to the ring support table and the tray support table, and an adjusting means for variably adjusting the load is provided. This makes it possible to easily adjust the load received by the semiconductor chip from the suction head of the shaft member during pickup according to the material and thickness of the semiconductor chip.

For example, the shaft member is guided by a vertical bearing formed on the head holder, and its downward movement is restricted by a block protruding from the shaft member. Further, a bolt that penetrates the block body in the up and down direction while inserting a compression coil spring is biased and supported by being screwed into the head holder, and the adjusting unit is configured to adjust the height of the compression coil spring. It is preferable that the load is adjusted according to the number of rotations and the resilience corresponding to the height.

Further, from the viewpoint of facilitating the adjustment work,
In the reference state, the shaft member may be biased and supported by the compression coil spring set at a free height, and the number of rotations of the bolt may be selected based on the following equation. F = F ₀ + K × P × N where F: the load, F ₀ : own weight of the shaft member and the suction head, K: spring constant of the compression coil spring, P: pitch of the bolt, N: reference of the bolt The number of rotations from the state.

In addition, in consideration of variations in the material and thickness of the semiconductor chip, the load is set to 0. 0 from the viewpoint of preventing damage to the semiconductor chip and ensuring a sufficient pressure contact state between the semiconductor chip and the suction head. 147 to 1.47
It may be adjusted within the range of 2 [N].

[0024]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, a first embodiment of the present invention will be described. 1 is a front view of a main part of a semiconductor chip transfer device according to the present invention, FIG. 2 is a plan view of the transfer device, FIG. 3 is a perspective view of the main part of the transfer device, FIG. 4 is a side view of FIG. 3 is a front view of FIG. 3, FIG. 6 is a view taken in the direction of arrow A in FIG. 4, FIG. 7 is a cross-sectional view taken along line BB of FIG. 4, FIG. FIG. 3 is a diagram illustrating a pickup operation of a semiconductor chip in the transfer device. In the drawings, parts having the same names as those in FIGS. 10 to 14 are denoted by the same reference numerals, and redundant description will be omitted.

A feature of the present invention is that the movable base 50 of the head holder 2 for urging and supporting the shaft member 30 is improved. The shaft member 30 is fitted into a vertical through hole 51 formed in the movable base 50 and a bearing 5 protruding from the upper and lower surfaces of the movable base 50.
2 guides the shaft, and the block 33 protruding from the shaft contacts the upper surface of the bearing 52, thereby restricting the downward movement. Furthermore, the movable table 50
A bolt 55 screwed into a vertical bolt hole 54 screwed through the block body 33 vertically penetrates the block body 33 and guides the compression coil spring 61 through which the bolt 55 is inserted. The shaft member 30 is biased and supported by being disposed between the shaft member 30 and the shaft member 30.

Reference numeral 62 denotes a flat washer inserted between the head of the bolt 55 and the compression coil spring 61, which serves to stabilize the posture of the compression coil spring 61, and 63 denotes a movable table 50 and a block. A nut screwed to a bolt 55 between the movable base 50 and the body 33;
To stop (lock) the rotation of the bolt 55 and release the lock from the movable table 50 by rotation.

Accordingly, the shaft member 30 is composed of the self-weight of the shaft member 30 including the suction head 1, the plug 31, the hose 32, the block body 33, and the compression coil spring 61 (strictly, the flat washer 62), and the compression coil spring. The resultant force with the resilient force corresponding to the height H of 61 is held while being applied as a downward load, and can be moved only upward against the load.

Here, when the bolt 55 is rotated forward and tightened (transition from FIG. 8A to FIG. 8B), the bolt 55
The height H of the compression coil spring 61 decreases with the distance between the head and the block body 33 (H ′ in FIG. 8B), and the elastic force of the compression coil spring 61 increases by the decrease in the height displacement. . When the bolt 55 is rotated in the reverse direction (FIG. 8)
(Transition from (b) to FIG. 8 (a)), the height H of the compression coil spring 61 is increased together with the distance between the head of the bolt 55 and the block body 33 due to the elastic force of the compression coil spring 61, and the height displacement thereof The spring force of the compression coil spring 61 decreases by the amount of the increase. That is, by simply rotating the bolt 55, the elastic force of the compression coil spring 61 is adjusted, whereby the load applied to the shaft member 30 is adjusted at the same time, and the load applied to the semiconductor chip 9 at the time of pickup (this The situation will be described later).

More specifically, as the bolt 55, a screw having a nominal screw size of M3 and a pitch of 0.5 [mm] is used.
The compression coil spring 61 has a spring constant of 0.383 [N / m
m] (39 [gf / mm]), a free height of 10 [mm] and a compression lower limit height of 2.7 [mm] are applied, and the own weight of the shaft member 30 is 0.147 [N] (15 [gf / mm]). ]). Also, the distance between the head of the bolt 55 and the block body 33 in the reference state,
That is, the height H of the compression coil spring 61 is set to a free height. That is, in the reference state, the compression coil spring 61
Does not occur, and the shaft member 30 has its own weight of 0.147 [N].
Only the load is given.

Next, from such a reference state, the bolt 55
Is rotated to adjust the load. In that adjustment, a dynamic formula shown in the following equation is used.

F = F ₀ + K × P × N where F: load applied to the shaft member 30, F ₀ : own weight of the shaft member 30, K: spring constant of the compression coil spring 61, P:
Pitch of bolt 55, N: Number of rotations of bolt 55 from the reference state.

According to the above equation, the load F applied to the shaft member 30 is calculated based on the number of rotations N of the bolt 55 from the reference state.
Is calculated, and the load on the semiconductor chip 9 can be predicted. In other words, the number of rotations N of the bolt 55 can be calculated from the allowable load of the semiconductor chip 9, that is, the load F applied to the shaft member 30.

Thus, for example, if the allowable load of the semiconductor chip 9 is 1.472 [N] (150 [gf]), the number of rotations N of the bolt 55 is calculated to be about 7 times based on the above equation. By rotating the bolt 55 the number of times, the load applied to the shaft member 30 is easily adjusted to an appropriate load (allowable load) on the semiconductor chip 9 after all.

Here, considering the variation of the material and thickness of the semiconductor chip 9, the allowable load of the general semiconductor chip 9 is in the range of 0.147 to 1.472 [N]. But we can deal with it enough. Since the compression lower limit of the compression coil spring 61 is 2.7 [mm], the bolt 55 is not used until 14.5 times ({10 (free height) −2.7 (compression lower limit)} / 0.5 (pitch)). It is virtually possible to rotate.

Next, the driving mechanism of the head holder 2 will be described. The head holder 2 is roughly divided into a base 40 that moves in the X-axis direction (the left-right direction in FIGS. 1 and 2), and a Z-axis direction (vertical direction in FIG. 1; And the movable table 50 that moves in the direction in which the driving mechanism moves). These driving mechanisms will be described in detail below.

In the housing 12, an X-axis guide rail 70 extending in the X-axis direction, and the X-axis guide rail 7
A drive belt 73 suspended by a pair of pulleys 71 and 72 is disposed in parallel with 0. An X-axis drive motor 75 is connected to one pulley 71 via a timing belt 74. Here, the base 40 is an X-axis guide rail 70.
The linear guide 76 is fixed to the front surface of the linear guide 76 slidable above.
Some have been fixed. Here, the fixing of the base 40, that is, the linear guide 76 and the drive belt 73,
Although it may be directly fastened and fixed with bolts or the like, as in the present embodiment, a block member 77 for support is provided from the upper surface to the rear surface of the linear guide 76 in consideration of facilitation of replacement and adjustment work. Drive belt 7 with member 77
3 may be fixed to an arbitrary position of the drive belt 73 by being sandwiched.

With such a configuration, the X-axis drive motor 7
The drive belt 73 is driven by the forward / reverse rotation of 5, so that the base 40 moves in the X-axis direction along the X-axis guide rail 70. An infrared sensor 78 detects the passage of a plate 79 projecting from the base 40 and controls the reference position of the base 40 in order to control a drive pulse signal applied to the X-axis drive motor 75. Reference numeral 80 denotes an idler pulley, which serves to adjust the tension of the drive belt 73.

On the other hand, a Z-axis guide rail 82 extending in the Z-axis direction is provided on the front surface of the base 40,
Numeral 0 is connected to a linear guide 83 slidable on a Z-axis guide rail 82 via a connection block 81. A rack plate 84 having a rack in the Z-axis direction is fixed to the rear surface of the connection block 81, and the rack of the rack plate 84 penetrating the base 40 is fixed to the rear surface of the base 40. A Z-axis drive motor 86 having a gear 85 that meshes with the Z-axis drive motor 86 is fixed.

With such a configuration, the Z-axis drive motor 8
The gear rotates forward / reverse by the forward / reverse rotation of 6, so that the linear guide 83, the connection block 81, and the movable base 50 move integrally with the rack plate 84 in the Z-axis direction. An infrared sensor 87 has a function of detecting the passage of one end of the rack plate 84 and detecting the reference position of the movable base 50 in order to control a drive pulse signal applied to the Z-axis drive motor 86. Reference numeral 65 denotes a tension coil spring hooked on headed screws 88 and 89 projecting from the base 40 and the movable table 50, respectively.
, And serves to assist the return movement (upward movement) of the movable base 50.

Next, when picking up the semiconductor chip 9
The state of the load applied to the vehicle will be described with reference to FIG. The push-up needle 103b rises to push up the semiconductor chip 9 together with the wafer sheet 8, and in response thereto, the movable head 50 of the head holder 2 and the suction head 1 descend to contact the upper surface of the semiconductor chip 9 (FIG. 9 (a)). )), And the movable table 50 continues to slightly lower (see FIG. 9B). At this time, the suction head 1 is moved up by the push-up needle 103 through the semiconductor chip 9.
b, the downward movement thereof is regulated by the resistance of the shaft member 30, so that it slightly moves upward together with the shaft member 30 against the load caused by the self-weight of the shaft member 30 and the resilient force of the compression coil spring 61. 9, that is, the semiconductor chip 9 receives the load.

As described above, the semiconductor chip 9 receives a load from the suction head 1 during pickup.
Since the load can be adjusted variably by simply rotating the bolt 55, the load is adjusted in advance in accordance with the allowable load based on the material and thickness of the semiconductor chip 9 to be applied. Can be given an appropriate load. Therefore, the semiconductor chip 9 is not damaged, and the state of pressure contact between the semiconductor chip 9 and the suction head 1 is not insufficient.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, instead of the compression coil spring 61 for urging and supporting the shaft member 30, an elastic body such as rubber may be provided. Further, the shaft member 30 may be supported by the head holder 2 while receiving the pressure of compressed air or the like downward, and the pressure may be variably adjusted.

[0043]

As described above, according to the present invention, the nonwoven fabric is stretched inside the ring, and the wafer attached to the upper surface of the nonwoven fabric is cut into a large number of semiconductor chips. It is separated from the nonwoven fabric one by one and transferred to a large number of storage recesses formed on the upper surface of the chip storage tray. The ring support table for fixing the ring, and the transfer on the ring fixed to the ring support table A push-up needle for pushing up the target semiconductor chip together with the nonwoven fabric, a tray support table for fixing the chip storage tray, a shaft member having a suction head for sucking the semiconductor chip at a lower end, and moving the shaft member downward. Movably supported against a predetermined load, and moved relatively to the ring support table and the tray support table. In a semiconductor chip transfer device having a head holder, the adjusting means for variably adjusting the load is provided, so that no matter what kind of semiconductor chip is applied, the material and thickness of the semiconductor chip are reduced. Accordingly, the load received by the semiconductor chip from the suction head of the shaft member during pickup can be easily adjusted. Therefore, the semiconductor chip is not damaged, and the pressure contact state between the semiconductor chip and the suction head does not become insufficient.

For example, the shaft member is guided by a vertical bearing formed on the head holder, and its downward movement is restricted by a block protruding from the shaft member. Further, a bolt that penetrates the block body in the up and down direction while inserting a compression coil spring is biased and supported by being screwed into the head holder, and the adjusting unit is configured to adjust the height of the compression coil spring. If the load is adjusted in accordance with the number of rotations and the resilience corresponding to the height, the adjustment work is sufficient by simply rotating the bolt.

Further, in a reference state, the shaft member is biased and supported by the compression coil spring set at a free height,
The number of rotations of the bolt is expressed as F = F ₀ + K × P × N (where F: the load, F ₀ : the weight of the shaft member and the suction head, K: the spring constant of the compression coil spring, P: the If it is selected based on the pitch of the bolt, N: the number of rotations from the reference state of the bolt), the load can be predicted in advance, and the actual adjustment work becomes easy.

Further, when the load is 0.147 to 1.472.
When the adjustment is made within the range of [N], it is possible to prevent the semiconductor chip from being damaged and to ensure a sufficient pressure contact state between the semiconductor chip and the suction head.

[Brief description of the drawings]

FIG. 1 is a front view of a main part of a semiconductor chip transfer device of the present invention.

FIG. 2 is a plan view of the transfer device of the present invention.

FIG. 3 is a perspective view of a main part of the transfer device of the present invention.

FIG. 4 is a side view of FIG. 3;

FIG. 5 is a front view of FIG. 3;

FIG. 6 is a view taken in the direction of arrow A in FIG. 4;

FIG. 7 is a sectional view taken along the line BB of FIG. 4;

FIG. 8 is a diagram illustrating an operation of adjusting a load applied to a shaft member.

FIG. 9 is a diagram illustrating a semiconductor chip pickup operation in the transfer device of the present invention.

FIG. 10 is a schematic front view of a main part of a conventional transfer device.

FIG. 11 is a schematic plan view of a conventional transfer device.

FIG. 12 is a side view of a main part of a conventional moving device.

FIG. 13 is a sectional view taken along line DD of FIG. 11;

FIG. 14 is an essential part cross sectional view for explaining a pickup operation of a semiconductor chip;

[Explanation of symbols]

1 Suction head 2 Head holder 3, 4 tray support table 5 Chip storage tray 6 Ring support table 7 Wafer ring (ring) 8 Wafer sheet (non-woven fabric) 9 Semiconductor chip 10 Camera 11 Computer 30 Shaft member 31 plug 32 hose 33 block body 40 base 50 movable table 51 Through hole 52 Bearing 54 bolt holes 55 volts 61 Compression coil spring 62 flat washer 63 nut 90 wafer 103 Thrust unit

   ────────────────────────────────────────────────── ─── Continuation of front page    F term (reference) 5F031 CA13 DA05 FA05 FA14 FA19                       GA23 GA47 GA48 GA49 HA33                       JA10 JA47 MA35 MA39 MA40                       NA14

Claims (4)

[Claims] 1. A non-woven fabric is stretched inside a ring, and a wafer attached to an upper surface of the non-woven fabric is cut into a large number of semiconductor chips. These semiconductor chips are separated from the non-woven fabric one by one, and the chip is stored. A ring support table for fixing the ring, and the semiconductor chip to be transferred in the ring fixed to the ring support table together with the nonwoven fabric. A push-up needle, a tray support table for fixing the chip storage tray, a shaft member having a suction head for sucking the semiconductor chip at a lower end, and the shaft member can be moved against a predetermined downward load. And a head holder that is supported on the ring support table and moves relative to the ring support table and the tray support table. In the transfer apparatus-up, the transfer device of the semiconductor chip, characterized in that an adjusting means for adjusting the load variable freely. 2. The shaft member has a shaft portion guided by a vertical bearing formed on the head holder, and is restricted from moving downward by a block protruding from the shaft portion. Further, a bolt that penetrates the block body in the up and down direction while inserting a compression coil spring is biased and supported by being screwed into the head holder, and the adjusting unit is configured to adjust the height of the compression coil spring. 2. The semiconductor chip transfer device according to claim 1, wherein the load is adjusted according to a number of rotations and a resilience corresponding to the height. 3. The reference member, wherein the shaft member is biased and supported by the compression coil spring set at a free height, and the number of rotations of the bolt is selected based on the following equation. Item 3. A device for transferring semiconductor chips according to Item 2. F = F ₀ + K × P × N where F: the load, F ₀ : own weight of the shaft member and the suction head, K: spring constant of the compression coil spring, P: pitch of the bolt, N: reference of the bolt The number of rotations from the state. 4. The load is 0.147 to 1.472.
2. The adjustment is performed within the range of [N].
4. The device for transferring semiconductor chips according to any one of claims 1 to 3.