JP6839143B2 - Element mounting device, element mounting method and element mounting board manufacturing method - Google Patents

Description

The present invention relates to a device mounting device, a device mounting method, and a device mounting substrate manufacturing method.

Element mounting devices for mounting elements such as semiconductor elements, resistors, and capacitors on a substrate on which a circuit pattern is formed have become widespread. The element mounting device has an element transfer unit that reciprocates between an element feeder in which the element is stocked and a substrate on which the element is mounted. The transfer unit picks up the elements one by one from the element feeder, holds and transports the elements to the substrate, and separates the elements on the substrate. ACF (Anisotropic Conductive Film) and ACP (Anisotropic) are used on the substrate.
Conductive bonding materials such as Conductive Paste), NCF (Non Conductive Film), NCP (Non Conductive Paste), or homogeneous eutectic solder are formed. It is mounted on the board.

As a method of holding the element by the transfer unit, adsorption such as vacuum adsorption or electrostatic adsorption is often used. When vacuum suction is adopted, a suction hole is formed in the transfer portion of the element mounting device. The suction hole is connected to a pneumatic circuit having a compressor and an ejector, and a negative pressure is generated in the suction hole. The transfer unit picks up the element from the element feeder by sucking the element into the suction hole by negative pressure, transports the element to the substrate, and releases the element by releasing the negative pressure by vacuum destruction, opening to the atmosphere, or the like. When electrostatic adsorption is adopted, a large number of mesa-shaped structures are formed on the base substrate, and electrodes and a dielectric layer are provided on the mesa-shaped structures. The electrostatic force generating portion having this mesa-shaped structure serves as a local suction point for the element, and the element is attracted to each electrostatic force generating portion by the electrostatic force due to the application of the voltage.

In recent years, device miniaturization has progressed at a very fast pace. Devices with a side size of 200 μm or less, such as 50 μm or 10 μm, have also been proposed. These elements are, for example, mini LEDs or micro LEDs of 50 μm or 10 μm, and are arranged in multiple rows and multiple columns as RGB pixels on a display substrate for a display, and are arranged on an illumination substrate as a light emitter of a backlight.

Special Table 2015-505736

When sucking and holding a minute element by the transfer part, it is necessary to prepare a suction hole or a mesa-shaped structure that is smaller than the miniaturized element, and the elements that have become minute and these suction parts are accurately aligned with each other. It is becoming difficult to do. For example, when a 10 μm element is attracted by a 3 μm suction hole, the suction hole cannot be closed by the element and the suction force is reduced, or the element is inserted into the suction hole. Will fall and tilt, failing to pick up, or the element will fall off during transfer to the board.

When there is one suction part such as an element and a suction hole or a mesa-shaped structure, the position of the suction part can be managed with high accuracy, or the suction part and the element can be moved relatively to make their positions highly accurate. By correcting, it is possible to match the positions of the miniaturized suction portion and the element with each other. However, from the viewpoint of production efficiency, it may be necessary to collectively pick up multi-row, multi-column elements and mount them on a substrate all at once. For example, when LEDs are mounted as pixels on a display board, if the display board supports 4K, it is necessary to mount at least 8 million LEDs in one color of RGB on the display board, and from the viewpoint of production efficiency. , It is necessary to pick up the multi-row, multi-column LEDs in a batch and mount them on the board in a batch.

When handling minute elements with multiple rows and multiple columns at once, all of the elements with multiple rows and multiple columns and the suction parts with multiple rows and multiple columns must match each other with high accuracy. However, it is an order of magnitude more difficult to manage the multi-row, multi-column element and the multi-row, multi-column suction part so that they can be aligned with high accuracy, even when the element and the suction part are each one. .. Moreover, it is almost impossible to individually correct the positions of all the elements and the suction part, so it is difficult to solve this if some of the elements with multiple rows and columns are misaligned with the suction part. ..

Then, the element may be left behind from the element feeder, or the element may fall off during transportation due to insufficient adsorption and holding, resulting in a substrate in which an unmounted region exists. .. That is, the yield of the product is lowered, or the production efficiency is lowered because the work is required after filling the unmounted area with the elements one by one.

The present invention has been proposed to solve the above-mentioned problems, and can easily and more reliably pick up multi-row, multi-column elements in a batch and mount them on a substrate in a batch. It is an object of the present invention to provide a mounting device, a device mounting method, and a device mounting board manufacturing method.

In order to achieve the above object, in the element mounting apparatus according to the present invention, a supply table on which an element feeder in which elements are arranged in an array is placed and a substrate on which the elements are arranged in an array are placed. The element is reciprocated a plurality of times between the mounting table and the supply table and the mounting table, and each time the device returns to the supply table, the element is picked up from the element feeder by multiple rows and columns at a time. Each time it reaches the mounting table, it is provided with a transfer unit for transferring the element to the substrate by the multi-row and multi-column picked up.
The transfer unit, the the same or slightly wider sheet and multi-row multi-column region encompassing element, a holding portion for holding at the holding surface an adhesive sheet the adhesive strength is lost or reduced by the predetermined temperature, the predetermined temperature The pressure-sensitive adhesive sheet held on the holding surface is pressed against the elements arranged in an array of the element feeders, and the multi-row, multi-column elements are pressed against the pressure-sensitive adhesive sheet. When the multi-row multi-column element is picked up from the element feeder at a time and the picked-up multi-row multi-column element is brought into contact with the substrate, the heater raises the specified temperature or higher. It is characterized in that the picked-up element is peeled off from the pressure-sensitive adhesive sheet and collectively transferred to the substrate by heating to.

The holding portion may have a rectangular shape on the holding surface of the adhesive sheet and may have a side length of 120 mm or less.

The holding portion may be made of a material having a coefficient of thermal expansion of 18 × 10 ^{-6 / K or less.}

The element feeder includes another pressure-sensitive adhesive sheet whose adhesive strength is lost or reduced at a temperature lower than that of the pressure-sensitive adhesive sheet of the holding portion, and the elements are attached to the other pressure-sensitive adhesive sheet in an array. In the heater, when the holding portion picks up the element, the temperature at which the adhesive sheet held by the holding portion loses or decreases the adhesive strength is lower than the temperature at which the other adhesive sheet provided in the element feeder has the adhesive strength. The holding portion may be heated to a temperature equal to or higher than the temperature at which the temperature is lost or lowered.

The heater heats and thermally expands the holding portion until the arrangement position of the multi-row, multi-column element held by the holding portion via the adhesive sheet matches the arrangement position on the substrate. You may do so.

A conductive bonding material that is cured by ultraviolet rays is formed on the substrate, the mounting table has an ultraviolet irradiation portion for the substrate, and the heater has the ultraviolet irradiation portion irradiating the substrate with ultraviolet rays. The head may be heated after the substrate and the multi-row, multi-row elements are bonded with a conductive bonding material.

The band-shaped adhesive sheet may be run and provided with a sheet supply unit that supplies a region in which the adhesive strength is not lost or reduced to the holding unit.

The sheet supply unit may be provided with a cutter for punching the adhesive sheet held by the holding unit in the middle of the traveling path of the strip-shaped adhesive sheet.

Further, in order to achieve the above object, the element mounting method according to the present invention picks up a multi-row, multi-column element at a time from an element feeder in which the elements are arranged in an array, and picks up the multi-row, multi-row element. This is an element mounting method in which multi-row elements are collectively transferred to a substrate, and the element feeder holds an adhesive sheet that is the same as or slightly wider than the area including the multi-row multi-column element on the holding surface of the holding portion. When the pick-up step of pressing the multi-row multi-column elements against the elements arranged in an array of the above to attach the multi-row multi-column elements to the adhesive sheet and when the multi-row multi-column elements are brought into contact with the substrate, the holding portion of the holding portion The pickup step includes a mounting step of heating the pressure-sensitive adhesive sheet to a temperature equal to or higher than a specified temperature at which the pressure-sensitive adhesive force of the pressure-sensitive adhesive sheet is lost or lowered by a heater to peel off the multi-row, multi-column elements from the pressure-sensitive adhesive sheet. The mounting step is repeated a plurality of times, the element is picked up from the element feeder in multiple rows and multiple columns, and the element is transferred to the substrate in multiple rows and multiple columns.
It is characterized by.

Further, in order to achieve the above object, the element mounting substrate manufacturing method according to the present invention picks up elements having multiple rows and columns at a time from an element feeder in which the elements are arranged in an array. This is an element mounting substrate manufacturing method for manufacturing an element mounting substrate in which multi-row multi-column elements are collectively mounted on a substrate and the elements are mounted in an array, and is a region including the multi-row multi-column elements. A pickup step in which the same or slightly wider adhesive sheet is held on the holding surface of the holding portion and pressed against the elements arranged in an array of the element feeder, and the multi-row, multi-column elements are attached to the adhesive sheet. When the multi-row multi-row elements are brought into contact with the substrate, the pressure-sensitive adhesive sheet is heated to a temperature equal to or higher than a specified temperature at which the adhesive force of the pressure-sensitive adhesive sheet is lost or lowered by the heater of the holding portion, and the multi-row multi-row elements are heated. The mounting step of peeling the row elements from the adhesive sheet, the pickup step, and the mounting step are repeated a plurality of times, the elements are picked up from the element feeder in multiple rows and multiple columns, and the elements are picked up in multiple rows and multiple columns on the substrate. It is characterized by including a repetitive step of manufacturing an element mounting substrate in which the elements are mounted in an array on the substrate by moving the elements one by one.

According to the present invention, since the method of holding the element by the transfer portion is affixed with an adhesive sheet, it is easy and more reliable to have multiple rows and multiple rows without having to align all the elements in multiple rows and multiple columns to pinpoints. The elements in the row can be picked up and mounted on the board at once.

It is a perspective view which shows the schematic structure of the element mounting apparatus which concerns on 1st Embodiment. It is a perspective view which shows typically the adhesive sheet attached to the transfer part. It is sectional drawing of the pressure-sensitive adhesive sheet made of a heat release sheet, (a) shows before heating, (b) shows after heating locally. It is a graph which shows the relationship between temperature and adhesive force, and the temperature displacement of a head. It is a front view which shows the detailed structure of the element mounting apparatus which concerns on 1st Embodiment. It is a side view which shows the detailed structure of the element mounting apparatus which concerns on 1st Embodiment. It is a figure which shows the detailed structure of the transfer part. It is a figure which shows the detailed structure of the sheet supply part. It is a flowchart which shows the operation of the element mounting apparatus which concerns on 1st Embodiment. It is a schematic diagram which shows the state of pressure welding to the element on a carrier by a holder sheet in the pick-up step of an element. It is a schematic diagram which shows the state of peeling of the element on a carrier in the pick-up step of an element. It is a schematic diagram which shows the state of pressure welding and heating of an element to a substrate in the element mounting step. It is a schematic diagram which shows the state of peeling of an element from a holder sheet, and the state of mounting on a substrate in the element mounting step. It is a figure which shows the transfer part which has a tilt mechanism. It is a figure which shows the transfer part which has a sheet supply part. It is a graph which shows the thermal expansion and the positional deviation of an element concerning the element mounting apparatus which concerns on 2nd Embodiment. It is a schematic diagram which shows the process of correcting the positional deviation of an element by thermal expansion. It is a figure which shows the structure of the carrier stand which concerns on the element mounting apparatus which concerns on 3rd Embodiment. It is a flowchart which shows the operation of the mounting process of the 3rd element mounting apparatus.

Embodiments of the element mounting apparatus and the mounting method according to the present invention will be described in detail with reference to the drawings.

(First Embodiment)
(Outline configuration)
FIG. 1 is a schematic view showing a schematic configuration of an element mounting device. As shown in FIG. 1, the carrier C and the substrate S are carried into the element mounting device 1. The carrier C is an element feeder in which the elements E are stocked in an array. The array shape means a state in which the elements E are arranged in a plurality of rows and columns according to a determined pattern, and the intervals in the row direction and the column direction are the same or different. It is a staggered arrangement such as. The element E is a component used in an electronic circuit, and includes a MEMS and a chip such as a semiconductor element, a resistor and a capacitor. The semiconductor element includes a discrete semiconductor such as a transistor, a diode, an LED and a thyristor, and an IC or an LSI. Etc. are included. LEDs include so-called mini LEDs and micro LEDs. In particular, the element E includes so-called minute parts having a side of 200 μm or less. The substrate S is formed by forming a circuit pattern, for example, a lighting substrate for a backlight in which mini LEDs are arranged, and a display substrate in which each of RGB micro LEDs is arranged as pixels.

The element mounting device 1 is a device for mounting the element E on the carrier C on the substrate S. The element mounting device 1 picks up the multi-row multi-column element E from the carrier C at a time, and collectively transfers the picked-up multi-row multi-column element E to the substrate S. Then, the element mounting device 1 picks up the element E from the carrier C in multiple rows and multiple columns, and repeats the pickup step and the mounting step of moving the element E to the substrate S in multiple rows and multiple columns a plurality of times, so that the element E becomes the element E. Manufacture element mounting substrates arranged in an array. Further, the element mounting device 1 electrically and mechanically joins the transferred element E to the substrate S. Such an element mounting device 1 is also called a die bonding device or a chip bonding device.

The element mounting device 1 includes a carrier base 3, a mounting base 4, and a transfer unit 5. The carrier stand 3 is a supply stand of the carrier C having a mounting surface on which the carrier C is mounted, and stops at the pickup position 21. That is, the carrier stand 3 stops the multi-row, multi-column element E group to be picked up among the elements E stocked in an array on the carrier C so that the center position thereof is located at the pickup position 21. Let me. The mounting base 4 is a supply base of the board S having a mounting surface on which the board S is mounted, and stops at the mounting position 22. That is, in the circuit pattern on the substrate S, the mounting base 4 stops the circuit pattern in which the multi-row, multi-column element E group is mounted by the transfer unit 5 so that the center position thereof is located at the mounting position 22.

The transfer unit 5 transfers the element E from the carrier C to the substrate S. The transfer unit 5 reciprocates between the pickup position 21 and the mounting position 22 a plurality of times. Then, each time the transfer unit 5 returns to the carrier C, the transfer unit 5 faces the carrier C mounted on the carrier stand 3 at the pickup position 21, and collectively picks up the multi-row, multi-column elements E from the carrier C. Further, each time the transfer unit 5 reaches the mounting table 4, the transfer unit 5 faces the board S mounted on the mounting table 4 at the mounting position 22, and collectively holds the multi-row, multi-column elements E held by the board S. Pass to. A series of operations for collectively picking up the multi-row and multi-column elements E at the pickup position 21 is called a pickup step S1, and a series of operations for collectively passing the multi-row and multi-column elements E to the substrate S at the mounting position. Is called the mounting step S2.

The method of picking up the element E by the transfer unit 5 is sticking. An adhesive sheet A is attached to the transfer unit 5. As shown in FIG. 2, the adhesive sheet A includes an adhesive region A1 on one side, which is the same as or slightly wider than the region where the multi-row, multi-column elements E are arranged. The inside of the adhesive region A1 has adhesive strength without any difficulty. In other words, it is not necessary to pinpoint all of the multi-row, multi-column elements E, and the adhesive sheet A exhibits adhesive strength when each element E comes into contact with any region of the adhesive sheet A. Then, each element E is attached. The slightly wide adhesive region A1 extends to the space between the element E group to be picked up and the element E adjacent to the outside of the element E group, but has not reached the adjacent element E. It is a certain range.

The transfer unit 5 mounts the adhesive sheet A so that the adhesive region A1 faces the element E at the pickup position 21 and the adhesive region A1 faces the substrate S at the mounting position 22. The transfer unit 5 transfers the element E from the carrier C to the adhesive sheet A by pressing the adhesive sheet A against the element E on the carrier C. Further, the transfer unit 5 loses or reduces the adhesive force of the pressure-sensitive adhesive sheet A after bringing the element E into contact with the substrate S, and causes the element E to separate from the pressure-sensitive adhesive sheet A to the substrate S. As an example, such an adhesive sheet A is a heat release sheet whose adhesive strength is lost or reduced by heat at a specified temperature.

FIG. 3 shows an example of the heat release sheet. As shown in FIG. 3, the pressure-sensitive adhesive sheet A has a two-layer structure of a base material A2 and a pressure-sensitive adhesive layer A3. The adhesive layer A3 contains an adhesive and a foam filler A4. The foam filler A4 is formed by filling an elastic shell with a substance that is gasified and expanded by heat. In this adhesive sheet A, the volume of the foam filler A4 expands due to heat, and the adhesive area with the element E decreases, so that the adhesive force to the element E is lost or reduced. That is, the transfer unit 5 separates the element E from the pressure-sensitive adhesive sheet A by heating the pressure-sensitive adhesive sheet A after bringing the element E into contact with the substrate S, and passes the element E to the substrate S. Further, as an example of the heat release sheet, a phase transition from a solid to a liquid may occur in the adhesive layer, and the adhesive force may be controlled by heat.

The heat-removable pressure-sensitive adhesive sheet A can also be used as a mode in which the carrier C holds the element E. Hereinafter, when both the adhesive sheet A possessed by the transfer unit 5 and the adhesive sheet A possessed by the carrier C are referred to, the adhesive sheet A is referred to, and the adhesive sheet A possessed by the transfer unit 5 is referred to as a holder sheet Ah, and the carrier C is referred to. The adhesive sheet A possessed by the carrier sheet A is referred to as a carrier sheet Ac.

For example, the carrier C is based on a glass plate. A carrier sheet Ac is adhered to the surface of this glass plate. The carrier sheet Ac is adhered using an adhesive or the like so that the base material A2 faces the surface of the glass plate. The element E is attached to the adhesive surface of the carrier sheet Ac. As shown in FIG. 4, the carrier-side peeling temperature T1 at which the adhesive strength of the carrier sheet Ac is lost or decreased is lower than the holder-side peeling temperature T2 at which the adhesive strength of the holder sheet Ah is lost or decreased. For example, by adjusting the filling rate of the foam filler A4, the size of the foam filler A4, the gasification temperature by selecting the substance in the foam filler A4, and the elasticity of the shell by selecting the shell type of the foam filler A4. The specified temperature at which the carrier sheet Ac and the holder sheet Ah lose their adhesive strength can be set respectively.

In the pickup step S1, the transfer unit 5 presses the holder sheet Ah against the element E on the carrier sheet Ac, and generates heat at the carrier sheet Ac at a temperature Te of the carrier side peeling temperature T1 or more and lower than the holder side peeling temperature T2. As a result, the transfer unit 5 loses or reduces the adhesive force of the carrier sheet Ac while maintaining the adhesive force of the holder sheet Ah, and transfers the element E from the carrier sheet Ac to the holder sheet Ah.

Further, in order to bond the element E to the substrate S, a conductive bonding material is formed in advance on the substrate S. The conductive bonding material electrically and mechanically connects the substrate S and the element E by alloy bonding, pressure bonding of conductive particles, bump pressure welding, etc., and is cured by heating. For example, ACF, ACP, NCF, NCP or homogeneous eutectic solder is formed on the substrate S as the conductive bonding material.

The process temperature T3 applied to the conductive bonding material is set higher than the holder-side peeling temperature T2 that loses or reduces the adhesive force of the holder sheet Ah. Therefore, in the mounting step S2, the transfer unit 5 loses the adhesive force of the holder sheet Ah by pressing the element E onto the substrate S and heating it to the process temperature T3 higher than the holder side peeling temperature T2. The element E is electrically and mechanically connected to the substrate S by the conductive bonding material while being lowered to peel off the element E.

(Detailed configuration)
The above-mentioned element mounting device 1 will be described in more detail. FIG. 5 is a front view showing a detailed configuration of the element mounting device 1, and FIG. 6 is a side view showing a detailed configuration of the element mounting device 1.

As shown in FIGS. 5 and 6, in addition to the carrier base 3, the mounting base 4, and the transfer unit 5, the element mounting device 1 includes a frame 6, a seat supply unit 7, a seat discharge unit 8, and an elevating unit 9. .. Hereinafter, the uniaxial direction parallel to the upper surface of the gantry 6 is referred to as an X-axis direction. The Y-axis direction is a direction parallel to the upper surface of the gantry 6 and orthogonal to the X-axis, the Z-axis direction is a height direction orthogonal to the X-axis and the Y-axis direction, and θ rotation is rotation around the Z-axis. Point to. Further, the direction away from the upper surface of the gantry 6 to the outside of the gantry 6 along the Z-axis direction is referred to as upward, and the direction from the upper surface of the gantry 6 toward the inside of the gantry 6 along the Z-axis direction is referred to as downward.

The gantry 6 is a table having a flat upper surface, and a carrier pedestal 3, a mounting pedestal 4, a transfer unit 5, a seat supply unit 7, a seat discharge unit 8, and an elevating unit 9 are installed. Inside the gantry 6, a control means 11 such as a computer or a microcomputer having a CPU, ROM, RAM, and a signal transmission circuit that controls each part of the element mounting device 1 is housed. Further, the transfer unit 5 holds the holder sheet Ah by suction, and the gantry 6 accommodates an pneumatic circuit 12 that supplies a negative pressure serving as a suction force to the transfer unit 5, and the control means 11 is inside the pneumatic circuit 12. A signal transmission circuit that controls the solenoid valve to switch between the generation of negative pressure and the release of negative pressure is provided.

The carrier base 3 has a mounting surface that extends two-dimensionally in the X-axis and Y-axis directions. The carrier base 3 includes an X-axis drive mechanism 31 and a Y-axis drive mechanism 32, and is movable in the X-axis direction and the Y-axis direction. The movable range in the X-axis direction includes the pickup position 21 and the carry-in / discharge position in which the carrier C is carried in and out of the carrier base 3. The X-axis drive mechanism 31 is used for aligning the carrier C and the transfer unit 5 in the X-axis direction. Further, the Y-axis drive mechanism 32 is used for aligning the carrier C and the transfer unit 5 in the Y-axis direction.

As the X-axis drive mechanism 31 and the Y-axis drive mechanism 32, for example, a ball screw mechanism can be adopted. That is, the rail and the ball screw are extended along each movable direction. The ball screw is composed of a rotary motor, a screw shaft and a slider, the slider is screwed onto the screw shaft, and the screw shaft is rotated by the rotary motor. The X-axis drive mechanism 31 is fixed to the slider of the Y-axis drive mechanism 32 and placed on the rail of the Y-axis drive mechanism 32. The carrier base 3 is fixed to the slider of the X-axis drive mechanism 31 and placed on the rail of the X-axis drive mechanism 31.

The mounting base 4 has a mounting surface that extends two-dimensionally in the X-axis and Y-axis directions. The mounting base 4 is also movable in the X-axis direction and the Y-axis direction, and includes an X-axis drive mechanism 41 and a Y-axis drive mechanism 42 having a ball screw mechanism. The Y-axis drive mechanism 42 is mainly used for loading and unloading the substrate S mounted on the mounting base 4, and is also used for aligning the substrate S and the transfer unit 5 in the Y-axis direction. Further, the X-axis drive mechanism 41 is used for aligning the transfer unit 5 and the substrate S in the X-axis direction.

The pickup position 21 and the mounting position 22 are provided at intervals in the X-axis direction. The gantry 6 is provided with a raising pedestal 61 that is one step higher than the upper surface of the gantry 6 and extends along the pickup position 21 and the mounting position 22. The transfer unit 5 is installed on the raising base 61, runs on its own along a straight line connecting the pickup position 21 and the mounting position 22, and is directed toward the carrier base 3 and the mounting base 4 located at the pickup position 21 and the mounting position 22. It is possible to descend in the Z-axis direction.

That is, a rail 63 is laid on the raising table 61 along the X-axis direction. The rail 63 is a guide for the transfer unit 5 that moves between the pickup position 21 and the mounting position 22. The rail 63 has a length that reaches the carrier base 3 located at the pickup position 21 and the mounting base 4 located at the mounting position 22. The rail 63 is gripped by the support portion 64. The support portion 64 is a block body that supports the transfer portion 5, and is further driven by a ball screw 65 composed of a rotary motor and a screw shaft whose shaft is rotated by the rotary motor.

The support portion 64 extends in the Y-axis direction toward a straight line connecting the pickup position 21 and the mounting position 22. The transfer portion 5 is attached to the extending tip surface 67 of the support 64. A rail 66 extending in the Z-axis direction is laid on the extending tip surface 67. The transfer portion 5 is attached to the support 64 by gripping the rail 66, and is slidable in the Z-axis direction.

By pushing down the transfer unit 5 that is slidable in the Z-axis direction, the elevating unit 9 lowers the transfer unit 5 located at the pickup position 21 toward the carrier base 3 and is also located at the mounting position 22. The transfer unit 5 is lowered toward the mounting table 4. First, the gantry 6 is provided with a support column 62 which is located behind the raising pedestal 61 and extends higher than the transfer portion 5. The upper end of the support column 62 is bent in the Y-axis direction, and the support column 62 protrudes directly above the movement locus of the transfer portion 5. The elevating part 9 is installed on the extending tip surface 69 of the support column 62.

That is, a rail 91 extending in the Z-axis direction is laid on the extending tip surface 69 of the support column 62. Further, on the extending tip surface 69 of the support column 62, a screw shaft 93 that is rotated by a rotary motor 92 is installed in parallel with the rail 91. Further, the abutment block 94 is attached by grasping the rail 91 and screwing it onto the screw shaft 93. The contact block 94 is driven by the rotary motor 92 to descend toward the transfer unit 5, abuts on the upper end of the transfer unit 5, and further pushes down the transfer unit 5. The transfer unit 5 is urged upward by an urging means such as a spring (not shown), and the contact block 94 pushes down the transfer unit 5 against the urging means. When the pressing force by the contact block 94 is released by separating the contact block 94 from the transfer unit 5, the transfer unit 5 is returned to the ascending position shown in FIGS. 5 and 6 by the urging means. Become.

The transfer unit 5 can move along the rail 63 to directly above the pickup position 21 and the mounting position 22. Therefore, the contact block 94 is long in the X-axis direction so as to keep at least both the pickup position 21 and the mounting position 22 within the range, and is in contact with the transfer unit 5 regardless of the position of the transfer unit 5. It can be pushed down. Further, the transfer unit 5 may be connected to the contact block 94 in a state of being movable in the X-axis direction.

FIG. 7 is a block diagram showing a detailed configuration of the transfer unit 5. The transfer unit 5 is configured by connecting the head 51, the cylinder 52, the θ rotating unit 53, and the contact block receiver 54 in the Z-axis direction from a direction close to the carrier table 3 and the mounting table 4. Further, the transfer unit 5 is provided with a camera 55 on the side of the row of the head 51 and the cylinder 52.

The head 51 is a holding portion for holding the holder sheet Ah, and heats the carrier sheet Ac, the holder sheet Ah, and the conductive bonding material formed on the substrate S by generating heat. The cylinder 52 is a pressurizing source such as an air cylinder, and by applying a load to the head 51, the holder sheet Ah is pressed against the element E via the head 51 at the pickup position 21, and the head 51 is pressed at the mounting position 22. The element E is pressed against the substrate S via the substrate S. The θ rotation unit 53 rotates the head 51 around the Z axis to align the element E on the carrier C with the circuit pattern on the substrate S. The contact block receiver 54 is a member that comes into contact with the contact block 94. The camera 55 detects the relative positional deviation between the transfer unit 5 and the carrier C, and between the transfer unit 5 and the substrate S.

The head 51 directs the holding surface 51a of the holder sheet Ah toward the carrier base 3 and the mounting base 4. The holding surface 51a is a rectangle that extends in parallel with the carrier base 3 and the mounting base 4, and is flat. The head 51 has a porous structure or has a suction hole 51b, or has both a porous structure and a suction hole 51b. For example, the head 51 is a ceramic having a porous structure and mainly made of aluminum nitride or silicon nitride. In addition, the head 51 may be made of stainless steel, for example. In the case of the stainless steel head 51, the suction hole 51b is indispensable. The suction hole 51b is formed so as to avoid directly behind the element E, for example, in the edge region of the holder sheet Ah or in the space between the element E and the element E.

A negative pressure is applied to the head 51, and the head 51 sucks and holds the holder sheet Ah on the holding surface 51a by the negative pressure. That is, the inside of the porous structure of the head 51 or the suction hole 51b is connected to the pneumatic circuit 12, and negative pressure is applied to the holding surface 51a through the porous structure of the head 51 and through the through hole 51b provided in the head 51. Is generated, and the holder sheet Ah is adsorbed and held. On the other hand, when the pneumatic circuit 12 is closed to eliminate the negative pressure applied to the head 51, the head 51 loses the holding force of the holder sheet Ah and the holder sheet Ah is separated. The control means 11 eliminates the negative pressure only when the transfer unit 5 is present in the sheet discharge unit 8. As a result, the holder sheet Ah is discharged toward the sheet discharging unit 8.

Further, a heater 56 and a blower 57 are installed in the head 51. The heater 56 is a heating source such as a pulse heater, and heats the head 51, and the blower 57 air-cools the head 51 by ejecting air. The heater 56 is controlled by the control means 11. Under the control of the control means 11, the heater 56 heats the head 51 to a process temperature T3 that exceeds the holder-side peeling temperature T2 while the element E is in contact with the substrate S. Further, the heater 56 interrupts or weakens the heating except when the element E is in contact with the substrate S, and the blower 57 sets the carrier side peeling temperature T1 except when the element E is in contact with the substrate S. The head 51 is cooled until the temperature zone exceeds the peeling temperature T2 on the holder side.

Here, the head 51 expands according to the coefficient of thermal expansion according to the material thereof. The expansion of the head 51 displaces the positions of the elements E of the multi-row and multi-columns that are collectively held. Then, the electrodes of the element E and the electrodes of the substrate S may not match, and the element E and the substrate S may have poor contact. Therefore, the head 51 has a thermal expansion coefficient of 18 × when the size of the element E is 10 μm or more and 200 μm or less, and the temperature change of the head 51 from holding the element E to mounting on the substrate S is 100 ° C. or more and 300 ° C. or less. When ^{composed of a material of 10-6} / K or less, it is desirable that one side of the holding surface 51a is 50 mm or less. SUS304 has a coefficient of thermal expansion of 17.3 × ^10-6 / K, SUS430 has a coefficient of thermal expansion of 10.4 × ^10-6 / K, and ceramic has a coefficient of thermal expansion of 2.6 to 10.5 ×. Such a material is preferred as it is ^{10-6 / K.}

However, even within the above-mentioned conditions, the required mounting accuracy, the magnitude of the temperature change of the head 51 from holding the element E to mounting on the substrate S, and the magnitude of the coefficient of thermal expansion of the head 51. Depending on the situation, the size of one side of the holding surface 51a can be set to be larger than 50 mm. That is, the smaller the mounting accuracy, the smaller the temperature change of the head 51, and the smaller the coefficient of thermal expansion, the larger the size of the holding surface 51a can be set. For example, when the temperature change of the head 51 from holding the element E to mounting on the substrate S is 100 ° C. and the coefficient of thermal expansion is 5 × 10 ^-6 / K or less, the device having a size of 10 μm or more and 200 μm or less. It is possible to set one side of the holding surface 51a to 120 mm with respect to E. In other words, the size of the element E is 10 μm or more and 200 μm or less, the temperature change of the head 51 from holding the element E to mounting on the substrate S is 100 ° C. or less, and the coefficient of thermal expansion of the head 51 is 5 ×. When ^{the material is composed of 10-6} / K or less, it is preferable that one side of the holding surface 51a is 120 mm.

As shown in FIG. 8, the sheet supply unit 7 prepares the holder sheet Ah. The sheet discharge unit 8 is a container, and the used holder sheet Ah having lost or reduced adhesive strength is discarded. The seat supply unit 7 and the seat discharge unit 8 are arranged side by side between the pickup position 21 and the mounting position 22.

The sheet supply unit 7 is composed of a cutter accommodating body 71, a cutter 72, a supply reel 73, and an accommodating reel 74, and supplies the holder sheet Ah to the head 51 of the transfer unit 5. A rectangular groove is formed on the upper surface of the cutter accommodating body 71. The cutter 72 has a frame shape and is housed in this groove. The supply reel 73 and the accommodating reel 74 are separately arranged on both sides of the cutter accommodating body 71. A strip-shaped holder sheet Ah is wound around the supply reel 73. The holder sheet Ah travels between the supply reel 73 and the accommodating reel 74 through the cutter accommodating body 71 in the middle of the traveling path. That is, the holder sheet Ah is pulled out from the supply reel 73, hung on the upper surface of the cutter accommodating body 71, and wound around the accommodating reel 74. The shape and size of the frame-shaped cutter 72 coincide with the holding surface 51a of the head 51 included in the transfer unit 5, that is, the region where the multi-row, multi-column elements E to be collectively picked up are arranged.

The sheet supply unit 7 runs the band-shaped holder sheet Ah and aligns the region where the adhesive strength is not lost or reduced with the cutter accommodating body 71. Then, the cutter accommodating body 71 makes the cutter 72 appear from the groove and punches out the holder sheet Ah having a size and shape suitable for the head 51 from the band-shaped holder sheet Ah. The transfer unit 5 descends toward the sheet supply unit 7 and supplies a negative pressure to the head 51 to suck and hold the punched holder sheet Ah.

(Detailed operation)
The operation of such an element mounting device 1 will be described. FIG. 9 is a flowchart showing the operation of the element mounting device 1. First, the holder sheet Ah is attached to the head 51 of the transfer unit 5 (step S01). The sheet supply unit 7 causes the cutter 72 to appear from the cutter accommodating body 71. The cutter 72 punches out the holder sheet Ah to be attached to the transfer portion 5 from the band of the holder sheet Ah hanging on the cutter accommodating body 71. Before and after punching, the transfer unit 5 moves directly above the sheet supply unit 7. The elevating part 9 lowers the transfer part 5 toward the punched holder sheet Ah. Negative pressure is generated in the head 51 of the transfer unit 5. The transfer unit 5 sucks the base material A2 of the holder sheet Ah and holds the holder sheet Ah. The adhesive layer A3 of the holder sheet Ah is exposed on the lower surface.

The transfer unit 5 holding the holder sheet Ah moves to the pickup position 21 (step S02). At the pickup position 21, the carrier stand 3 carries the carrier C and stands by. That is, among the elements E stocked in an array on the carrier C, the central position of the multi-row, multi-column element E group (hereinafter referred to as “element E group to be picked up”) picked up by the transfer unit 5 this time is located. It stands by while being positioned at the pickup position 21. When the transfer unit 5 reaches the pickup position 21, the transfer unit 5 and the carrier C, that is, the element E group scheduled to be picked up are aligned (step S03).

In step S03, the camera 55 photographs the element E group to be picked up. When the image of the camera 55 is analyzed by the control means 11 and the positional deviation between the transfer unit 5 and the element E group to be picked up in the X-axis direction and the Y-axis direction and the deviation in the direction around the Z-axis are detected, the transfer is performed. The unit 5 and the carrier stand 3 move relatively so as to eliminate the deviation. In the deviation in the X-axis direction, since both the transfer unit 5 and the carrier base 3 can move in the X-axis direction, one or both of them operate.

The deviation is detected by detecting the positions of two elements E located diagonally in one of the elements E group captured in the image by image processing. In the image processing, binarization and contour enhancement may be performed to clarify the diagonal of the element E group. Then, the midpoint of the diagonal is calculated, and the difference between the calculation result and the reference point in the image is taken. This difference is the positional deviation between the transfer unit 5 and the element E group to be picked up in the X-axis direction and the Y-axis direction. Further, the deviation in the direction around the Z axis is eliminated by operating the θ rotating portion 53 so that the diagonal of one of the elements E group captured in the image and the reference line coincide with each other.

When the alignment between the transfer unit 5 and the element E group scheduled to be picked up is completed, the transfer unit 5 picks up the element E group scheduled to be picked up from the carrier C (step S04). As shown in FIG. 10, the elevating unit 9 lowers the transfer unit 5 toward the carrier C of the carrier base 3, and presses the mounted holder sheet Ah against the element E group to be picked up. In the holder sheet Ah, the adhesive region A1 has adhesive strength without any unevenness. Therefore, all the elements E that fit in the projection area of the holder sheet Ah, that is, all the elements E group to be picked up are attached to the holder sheet Ah. Here, the above-mentioned steps S02 to S04 correspond to the pickup step S1.

Further, as shown in FIG. 11, the head 51 is heated to a temperature Te of the carrier sheet Ac peeling temperature T1 or more and the holder sheet Ah peeling temperature T2 or less by adjusting the temperature by heating the heater 56 and cooling the blower 57. Has been done. The heat of the head 51 is transferred to the carrier sheet Ac via the carrier sheet Ac and the element E, or reaches the carrier sheet Ac as radiant heat from the head 51. As a result, the inside of the projection region of the head 51 of the carrier sheet Ac is heated to the peeling temperature T1 or higher. The adhesive strength of this projected region of the carrier sheet Ac is lost or reduced, and the element E group attached to the holder sheet Ah is peeled off from the carrier C side. That is, the element E group attached to the holder sheet Ah is transferred from the carrier sheet Ac to the holder sheet Ah without remaining on the carrier sheet Ac. Hereinafter, the element E group to be picked up after being attached to the holder sheet Ah is simply referred to as "element E group".

When the element E group moves to the holder sheet Ah, the transfer unit 5 moves from the pickup position 21 to the mounting position 22 (step S05). At this time, the mounting base 4 mounts the board S and stands by at the mounting position 22. That is, among the circuit patterns formed on the substrate S, the central position of the region where the multi-row, multi-column element E group is mounted in the transfer unit 5 this time (hereinafter, referred to as “planned mounting region”) is the mounting position 22. It is waiting in the state of being positioned in. When the transfer unit 5 reaches the mounting position 22, the transfer unit 5 and the planned mounting area on the substrate S are aligned (step S06). The camera 55 captures the circuit pattern of the planned mounting area. Then, the control means 11 detects the positional deviation in the X-axis direction and the Y-axis direction and the deviation in the direction around the Z-axis between the transfer unit 5 and the planned mounting area, and eliminates the deviation with the transfer unit 5. The mounting base 4 is relatively moved. In the deviation detection, for example, the positional deviation and the orientation deviation may be calculated with reference to the electrode pads on the circuit pattern existing diagonally to the planned mounting area.

When the alignment between the transfer unit 5 and the substrate S is completed, the transfer unit 5 mounts the element E group on the substrate S (step S07). As shown in FIG. 12, the elevating unit 9 lowers the transfer unit 5, and the transfer unit 5 collectively presses the element E group against the substrate S. That is, the rotary motor 92 operates, and the contact block 94 descends toward the transfer unit 5. The contact block 94 comes into contact with the contact block receiver 54 of the transfer unit 5, pushes down the entire transfer unit 5 toward the substrate S, and brings the element E group into contact with the substrate S. At this time, since the pressure required for pressing is supplied to the cylinder 52, the element E group is pressed against the substrate S at a predetermined pressure.

As shown in FIG. 12, when the element E group comes into contact with the substrate S, the heater 56 joins the head 51 to the substrate S with a conductive bonding material having a temperature higher than the peeling temperature T2 of the holder sheet Ah. To heat up to the process temperature T3. Heating may be started before the element E group comes into contact with the substrate S, and the temperature of the head 51 may pass through the peeling temperature T2 immediately after the element E group comes into contact with the substrate S. The heat of the head 51 is transferred to the holder sheet Ah, and further transferred from the holder sheet Ah to the conductive bonding material via the element E group. Therefore, as shown in FIG. 13, the adhesive strength of the holder sheet Ah is lost or reduced, the element E group is peeled from the holder sheet Ah, and the element E group is placed on the substrate S side. That is, all the elements E group attached to the holder sheet Ah are transferred from the holder sheet Ah to the substrate S without remaining on the holder sheet Ah.

Further, when the head 51 reaches the process temperature T3, the element E group is bonded to the substrate S with the conductive bonding material. At this time, the temperature of the head 51 rises from the peeling temperature T1 when the element E group is picked up to the process temperature T3, and the head 51 thermally expands with this temperature rise. However, the size of the head 51 is 50 mm or less, or the head 51 is made ^{of a material such as ceramic or stainless steel having a coefficient of thermal expansion of 18 × 10-6} / K or less. Therefore, the positional deviation of each element E due to the thermal expansion of the head 51 is within an allowable range, and each element E and the substrate S are electrically connected. Here, the above-mentioned steps S06 to S07 correspond to the mounting step S2.

When the mounting of the element E on the substrate S side is completed, the transfer unit 5 discards the used holder sheet Ah (step S08). The transfer unit 5 moves to the seat discharge unit 8, and the negative pressure supplied to the head 51 is released. When the negative pressure on the head 51 is released, the holder sheet Ah attached to the transfer section 5 falls off from the head 51 and falls to the sheet discharging section 8.

The holder sheet Ah held by the transfer unit 5 shall have a size and shape including the element E having m rows and n columns. It is assumed that the carrier C is stocked with the elements E having a × m rows and b × n columns. Further, it is assumed that the substrate S has room for mounting the element E having c × m rows and d × n columns. a, b, c and d are positive real numbers, preferably natural numbers. In this case, the transfer unit 5 reciprocates between the pickup position 21 and the mounting position 22 until all the elements E have been picked up from the carrier C or all the elements E have been arranged in the mounting room of the substrate S. Then, the mounting of the holder sheet Ah, the pickup of the element E, the mounting of the element E, and the disposal of the holder sheet Ah are repeated. That is, steps S02 to S08 shown in FIG. 9 are repeatedly executed. Considering that the transfer unit 5 completely cuts off the element E from the carrier C and completely mounts the element E on the circuit pattern of the substrate S, a, b, c and d should be natural numbers. Is preferable.

While the transfer unit 5 repeats picking up and mounting, the seat supply unit 7 operates the supply reel 73 and the accommodating reel 74, and the band of the holder seat Ah travels intermittently. The already punched area moves to the accommodating reel 74 side, and the unpunched area hangs on the upper surface of the cutter accommodating body 71. The cutter 72 emerges from the cutter housing 71 and punches the holder sheet Ah again. The transfer unit 5 reattaches the new holder sheet Ah to the head 51, picks up the new m-row n-column element E at the pickup position 21, and newly picks up the m-row n-column element at the mounting position 22. Repeat the implementation of E. As a result, the element mounting device 1 sequentially picks up the element E group of a × m rows b × n columns on the carrier C and mounts it on the substrate S.

(effect)
As described above, the element mounting device 1 is provided with the carrier base 3, the mounting base 4, and the transfer unit 5. The carrier C on which the elements E are arranged in an array is placed on the carrier base 3. On the mounting base 4, a substrate S on which the elements E are arranged in an array is placed. The transfer unit 5 moves between the carrier base 3 and the mounting base 4, picks up the multi-row multi-column element E collectively from the carrier C, and picks up the picked-up multi-row multi-column element E as the substrate S. Transfer to all at once. The transfer unit 5 holds the holder sheet Ah which is the same as or slightly wider than the area including the multi-row, multi-column element E. Then, the transfer unit 5 presses the holder sheet Ah against the carrier C and attaches the multi-row multi-column element E to the holder sheet Ah, thereby collectively picking up the multi-row multi-column element E from the carrier C.

The holder sheet Ah has an adhesive region A1 on one side that is the same size or slightly wider than the size and shape including the multi-row, multi-column element E, and has adhesive strength in the adhesive region A1. Therefore, even if all of the multi-row, multi-column elements E are not pinpointed, the holder sheet Ah exerts its adhesive strength when each element E comes into contact with any region of the holder sheet Ah. Each element E can be attached.

Therefore, even if the opening positions of all the suction holes are not controlled with high accuracy as in the case of a vacuum chuck, the multi-row, multi-column element E can be picked up easily and more reliably, and the element E is left in the carrier C. , It is possible to prevent the element E from falling off during transportation. Further, even if the arrangement of the elements E arranged in the carrier C is changed, it is not necessary to replace the head 51 and the holder sheet Ah. For example, when mounting the element E in a wide variety of small lots, the element mounting device 1 is once mounted. Continuous operation can be performed without stopping, and production efficiency is improved.

In particular, this element mounting device 1 is suitable for mounting elements E having a side of about 10 μm or more and 200 μm or less on the substrate S in a multi-row, multi-column manner. For example, the element mounting device 1 mounts a mini LED or a micro LED on a display board for a backlight or for pixels constituting a display screen. With such a minute-sized element E, for example, when vacuum suction or electrostatic suction is used, the position of the element E becomes unstable even if the suction part such as the suction hole or the mesa-shaped structure becomes slightly larger. , A part of the element E cannot be held even if the forming position of the suction portion is slightly displaced. It is possible to align one element E and one suction hole, but it is not possible to manage so that all of the element E in m rows and n columns and the suction part in m rows and n columns can be aligned accurately. It is very difficult, and the positions of all the elements E and the suction part cannot be corrected individually.

However, in this element mounting device 1, even if each element E does not come into contact with the adhesive region A1 of the holder sheet Ah, the holder sheet Ah does not have to pinpoint all of the elements E having multiple rows and columns. For example, since each element E can be attached by exerting adhesive force, when elements E having a side of about 10 μm or more and 200 μm or less are arranged in multiple rows and multiple columns and mounted on the substrate S at once. It is particularly suitable. Of course, even an element E having a thickness of more than 200 μm can be collectively transferred to the substrate S by the element mounting device 1.

Further, the holder sheet Ah is a heat release sheet whose adhesive strength is lost or lowered from the specified temperature. The transfer unit 5 includes a holding unit and a heater 56 exemplified as the head 51. The head 51 holds the adhesive sheet A, and the heater 56 heats the head 51 to a specified temperature or higher when the multi-row, multi-column element E is brought into contact with the substrate S.

That is, as a method of mounting the multi-row multi-column element E on the substrate S, a holder sheet Ah that is the same as or slightly wider than the region including the multi-row multi-column element E is pressed against the element feeder (carrier C). When the pickup step S1 for attaching the multi-row multi-column element E to the holder sheet Ah and the multi-row multi-column element E are brought into contact with the substrate S, the adhesive strength of the holder sheet Ah is lost or lowered at a specified temperature or higher. The holder sheet Ah is heated to include a mounting step S2 for peeling the multi-row, multi-column element E from the holder sheet Ah. Further, as a method of manufacturing an element mounting substrate in which the elements E are mounted in an array on the substrate S, the pickup step S1 and the mounting step S2 are repeated a plurality of times.

As a result, the holder sheet Ah exhibits adhesive strength as long as each element E comes into contact with the adhesive region A1 of the holder sheet Ah, even if all of the elements E having multiple rows and multiple columns are not aligned pinpointly. Since each element E can be attached to the substrate S and the element E can be more reliably detached from the substrate S, the element E remains on the holder sheet Ah side when the element E is transferred to the substrate S. It can be prevented from being stowed. Therefore, the yield of the substrate S on which the element E is mounted is improved. In addition, it is less likely that post-mounting work will occur after mounting the parts that could not be mounted with the element E, and the production efficiency of the product will be improved.

Further, the heated head 51 expands according to the coefficient of thermal expansion according to the material thereof, and displaces the multi-row, multi-column elements E that are collectively held. However, in the present embodiment, the head 51 has a rectangular shape on the holding surface 51a of the holder sheet Ah, and the length of one side is 50 mm or less. Alternatively, the head 51 is made of a material having a coefficient of thermal expansion of 18 × 10 ^{-6 / K or less.} As a result, the misalignment of the element E so that the electrodes of the element E and the electrodes of the substrate S do not match is avoided, and poor contact between the element E and the substrate S is suppressed. Therefore, even if the head 51 is heated, the yield of the substrate S on which the element E is mounted is improved. Further, in the present embodiment, the head 51 is made of a material in which the holding surface 51a of the holder sheet Ah has a rectangular shape, the length of one side is 120 mm or less, and the coefficient of thermal expansion is 5 × 10 ^{-6 / K or less.} I tried to be done. Also by this, similarly to the above, the misalignment of the element E to the extent that the electrode of the element E and the electrode of the substrate S do not match is avoided, and the poor contact between the element E and the substrate S is suppressed.

Further, the carrier C is provided with a carrier sheet Ac, which is another pressure-sensitive adhesive sheet A whose adhesive strength is lost or reduced at a temperature lower than that of the holder sheet Ah of the head 51. The carrier C is formed by attaching the elements E to the carrier sheet Ac in an array. When the head 51 picks up the element E, the heater 56 has a temperature lower than the temperature at which the holder sheet Ah held by the head 51 loses or lowers the adhesive force, and the carrier sheet Ac included in the carrier C loses the adhesive force or loses the adhesive force. The head 51 is heated to a temperature higher than the decreasing temperature.

As a result, when the holder sheet Ah attaches the element E, the carrier C side easily separates the element E, so that the element E remains on the carrier C side when the element E is transferred to the holder sheet Ah. Can be prevented. Therefore, the yield of the substrate S on which the element E is mounted is improved. In addition, it is less likely that post-mounting work will occur after mounting the parts that could not be mounted with the element E, and the production efficiency of the product will be improved. Further, since the timing at which the carrier C releases the element E can be controlled, the element E does not shift in position when the carrier C is transferred by the carrier base 3, and poor contact at the time of mounting can be more reliably prevented.

In the present embodiment, the mode in which the carrier sheet Ac is also a heat release sheet has been described as an example, but any sheet that can lose or reduce the holding force of the element E at the time of picking up the element E can be used. Not exclusively. For example, as the carrier sheet Ac, an adhesive sheet having a holding force in the normal direction with the adhesive surface lower than that of the holder sheet Ah may be used. After the element E is attached with the holder sheet Ah, when the transfer portion 5 is raised so as to be separated from the carrier C, the element E is peeled off from the carrier sheet Ac due to the difference in the holding force between the carrier sheet Ac and the holder sheet Ah, and the holder. The element E can be transferred to the sheet Ah.

Further, as shown in FIG. 14, the transfer unit 5 may be provided with a tilt mechanism 58 that tilts the rows of the head 51 and the cylinder 52 along the YZ plane defined by the Y-axis and the Z-axis. The tilt mechanism 58 includes, for example, a rotating shaft extending in the X-axis direction and a rotating motor that rotates the rotating shaft. The bracket to which the cylinder 52 and the head 51 are attached is fixed to the rotating shaft. When the rotary motor is driven, the head 51 and the cylinder 52 change their orientations along the YZ plane.

In this case, the warp of the planned mounting position on the substrate S may be detected by using the image captured by the camera 55. The tilt mechanism 58 tilts the row of the head 51 and the cylinder 52 so that the planned mounting position on the substrate S and the holding surface 51a of the head 51 are parallel to each other according to the detected warp. Instead of the camera 55, a laser irradiation device may be provided to detect the warp of the substrate S. The laser irradiation device includes a laser irradiation unit and a laser light receiving unit, scans the substrate S with a laser, and detects the warp of the substrate S, that is, the distance between the laser irradiation unit and the laser scanning position by the light receiving timing of the laser light receiving unit.

As a result, the element E can be mounted with high accuracy even if the large substrate S is warped. Further, even if the substrate S is warped, the air gap between the substrate S and the element E can be eliminated, all the elements E can be brought into contact with the substrate S at the same time, and then the element E can be peeled off from the holder sheet Ah. Therefore, the possibility that the element E is detached from the substrate S can be reduced, and the yield of the product can be improved. If a tilt mechanism 58 that tilts the rows of the head 51 and the cylinder 52 along the XZ plane is further provided, it is possible to deal with warpage in all directions.

Further, the band-shaped holder sheet Ah is run so as to include a sheet supply unit 7 that supplies a region in which the adhesive strength is not lost or reduced. As a result, even if the holder sheet Ah is used as a heat release sheet, the element E can be efficiently conveyed. Further, the sheet supply unit 7 is provided with a cutter 72 for punching the holder sheet Ah in the middle of the traveling path of the band-shaped holder sheet Ah. As a result, it is not necessary to supply the holder sheet Ah one by one, and the holder sheet Ah can be supplied easily and quickly.

As shown in FIG. 15, the sheet supply unit 7 may be provided in the transfer unit 5. The transfer unit 5 includes a supply reel 73 and a storage reel 74 on both sides of the head 51. The band of the holder sheet Ah drawn out from the supply reel 73 is hung on the holding surface 51a of the head 51 and wound around the accommodating reel 74. When the element E is attached to the region where the band of the holder sheet Ah matches the holding surface 51a and the element E is peeled off by heat, the supply reel 73 and the accommodating reel 74 are operated to occupy the used region with the accommodating reel 74. Feed to the side and position the new area on the holding surface 51a.

In this case, the width direction (Y-axis direction) of the band of the holder sheet Ah is formed to be the same as or slightly wider than the width direction (Y-axis direction) of the region in which the multi-row, multi-column element E is arranged. To do. The dimension in the feed direction (X-axis direction) of the holder sheet Ah on the holding surface 51a of the head 51, that is, the dimension in the X-axis direction of the portion where the holder sheet Ah is flatly supported in FIG. 15 is multi-row, multi-column. It is formed to have the same width as or slightly wider than the dimension in the X-axis direction of the region where the element E is arranged. Further, the bent portions of the holder sheet Ah formed at both ends of the holding surface 51a may have sharp corners.

When the transfer unit 5 is provided with the sheet supply unit 7 in this way, the process of the transfer unit 5 passing through the sheet supply unit 7 and the sheet discharge unit 8 can be omitted. Therefore, the tact time from mounting the new holder sheet Ah to the head 51, picking up the element E and mounting the element E, and replacing the holder sheet Ah is improved, and the production efficiency of the product is improved.

(Second Embodiment)
Next, the element mounting device 1 according to the second embodiment will be described in detail with reference to the drawings. The same configurations and the same functions as those of the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 16, in the element mounting device 1, the heater 56 provided in the head 51 heats the head 51 up to a suitable temperature zone T4 in which the arrangement position of each element E matches the substrate S. That is, the heater 56 heats the head 51 to thermally expand it, and displaces the arrangement position of each element E in multiple rows and columns so that each element E is located within an allowable range that can be electrically bonded to the substrate S. ..

The compatible temperature zone T4 is set to include the holder-side peeling temperature T2 at which the adhesive strength of the holder sheet Ah is lost or lowered. That is, each element E is arranged on the carrier sheet Ac so as to be narrower than the distance between the elements E mounted on the substrate S, the coefficient of linear expansion is adjusted according to the material and size of the head 51, and the holder side peeling temperature T2. Or by using these in combination, the compatible temperature zone T4 and the holder peeling temperature T2 may be set.

In such an element mounting device 1, the element E group to be picked up is picked up from the carrier C, and the picked up element E group is brought into contact with the substrate S. At this time, as shown in FIG. 17, the heater 56 heats the head 51 to the applicable temperature zone T4 including the holder-side peeling temperature T2, and the distance between the elements E is adjusted to the circuit pattern of the substrate S by the thermal expansion of the head 51. The element E is peeled off from the holder sheet Ah to release the binding with the head 51 side, and the element E group is passed to the substrate S. As a result, the position of each element E is accurately settled in the appropriate position P within the permissible range due to the thermal expansion of the head 51, and each element E and the substrate S are electrically connected. It is possible to suppress a decrease in yield due to thermal expansion of the head 51.

The heater 56 further heats the head 51 to the process temperature T3 for the conductive bonding material. When the detached element E group is dragged by the thermal expansion of the head 51 due to the friction coefficient of the holder sheet Ah and the position is displaced so as to widen the interval, the applicable temperature zone T4 should be adjusted to the process temperature T3. Just do it.

Alternatively, when the head 51 passes through the conforming temperature zone T4 including the holder-side peeling temperature T2, that is, when the distance between the elements E is expanded in conformity with the substrate S due to thermal expansion of the head 51, the head 51 temporarily releases the negative pressure. The head 51 is heated to the process temperature T3 while releasing the binding between the holder sheet Ah and the head 51. Even if the head 51 thermally expands, the expansion of the holder sheet Ah that is not attracted to the head 51 does not easily follow the thermal expansion of the head 51, and the element E group sandwiched between the holder sheet Ah and the substrate S also has a suitable temperature. The possibility of further increasing the interval in the process from the band T4 to the process temperature T3 is reduced.

(Third Embodiment)
Next, the element mounting device 1 according to the third embodiment will be described in detail with reference to the drawings. The same configurations and the same functions as those of the first or second embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

In the element mounting device 1, a conductive bonding material that is cured or temporarily cured by ultraviolet rays is formed on the substrate S. As shown in FIG. 18, the mounting surface of the mounting base 4 is a donut type having an opening slightly smaller than that of the substrate S, and the ultraviolet irradiation device is aligned with the center of the mounting position below the mounting base 4. 59 are arranged. The substrate S is based on a glass plate, and the ultraviolet irradiation device 59 emits ultraviolet rays toward the substrate S, passes through the substrate S, and irradiates the conductive bonding material.

FIG. 19 is a flowchart showing the operation of the mounting process of the third element mounting device 1. The elevating unit 9 lowers the transfer unit 5 holding the multi-row multi-column element E toward the mounting table 4, and the cylinder 52 presses the multi-row multi-column element E against the substrate S. When the element E is pressed against the substrate S (step S11), the ultraviolet irradiation device 59 irradiates the conductive bonding material with ultraviolet rays to cure the conductive bonding material (step S12). As a result, the element E is fixed to the substrate S. After the element E is bonded to the substrate S, the heater 56 heats the head 51 to the holder side peeling temperature T2 (step S13). The heat of the head 51 is transferred to the holder sheet Ah, and the holder sheet Ah loses or reduces the adhesive force to separate the element E bonded to the substrate S from the holder sheet Ah.

When the heater 56 heats the head 51 to the holder side peeling temperature T2, the head 51 thermally expands, but the multi-row, multi-column element E attached to the holder sheet Ah is fixed to the substrate S. It is difficult to displace the position following the thermal expansion of the head 51. Therefore, the position of each element E can be maintained within the permissible range, and the decrease in yield due to the thermal expansion of the head 51 can be suppressed.

(Other embodiments)
Although the embodiment of the present invention and the modification of each part have been described above, the embodiment and the modification of each part are presented as an example, and the scope of the invention is not intended to be limited. These novel embodiments described above can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

1 Element mounting device 11 Control means 12 Pneumatic circuit 21 Pickup position 22 Mounting position 3 Carrier stand 4 Mounting stand 5 Transfer section 51 Head 52 Cylinder 53 θ Rotating section 54 Contact block receiver 55 Camera 56 Heater 57 Blower 58 Tilt mechanism 59 Ultraviolet irradiation Device 6 Stand 61 Lifting stand 62 Support 7 Sheet supply part 8 Sheet discharge part 9 Elevating part C Carrier E Element S Board A Adhesive sheet Ah Holder sheet Ac Carrier sheet

Claims (10)

A supply table on which an element feeder in which elements are arranged in an array is placed, and
A mounting base on which a substrate on which the elements are arranged in an array is placed, and
It reciprocates between the supply table and the mounting table a plurality of times, and each time it returns to the supply table, the element is picked up from the element feeder by multiple rows and columns at a time to reach the mounting table. Each time, the transfer unit that transfers the element to the substrate by the multi-row and multi-column picked up
With
The transfer unit
A holding portion that holds the adhesive sheet on the holding surface, which is the same as or slightly wider than the area including the multi-row, multi-column elements and whose adhesive strength is lost or decreased depending on the specified temperature.
A heater that heats the holding portion above the specified temperature, and
Have,
By pressing the adhesive sheet held by the holding surface against the elements arranged in an array of the element feeders and attaching the multi-row multi-column elements to the adhesive sheet, the multi-row multi-row elements are attached to the adhesive sheet. The elements in the row are picked up at once, and when the picked up multi-row, multi-row elements are brought into contact with the substrate, the elements are heated to the specified temperature or higher by the heater, so that the picked up elements are removed from the adhesive sheet. Peeling and transferring to the substrate at once,
An element mounting device characterized by. The holding portion is made of a material having a coefficient of thermal expansion of 18 × ^{10-6 / K or less.}
The element mounting device according to claim 1. The holding portion has a rectangular shape on the holding surface of the adhesive sheet and has a side length of 120 mm or less.
The element mounting apparatus according to claim 1 or 2. The element feeder is
The holding portion comprises another adhesive sheet whose adhesive strength is lost or reduced at a temperature lower than that of the adhesive sheet.
The elements are attached to the other adhesive sheet in an array.
In the heater, when the holding portion picks up the element, the temperature at which the adhesive sheet held by the holding portion loses or decreases the adhesive force is lower than the temperature at which the other adhesive sheet provided in the element feeder adheres. To heat the holding part to a temperature higher than the temperature at which the force is lost or lowered,
The element mounting device according to any one of claims 1 to 3. The heater heats and thermally expands the holding portion until the arrangement position of the multi-row, multi-column element held by the holding portion via the adhesive sheet matches the arrangement position on the substrate. thing,
The element mounting device according to claim 1. A conductive bonding material that is cured by ultraviolet rays is formed on the substrate.
The mounting base has a portion for irradiating the substrate with ultraviolet rays.
The heater heats the holding portion after the ultraviolet irradiation unit irradiates the substrate with ultraviolet rays and the substrate and the multi-row, multi-column element are bonded by the conductive bonding material.
The element mounting device according to claim 1. Provided with a sheet supply unit for running the strip-shaped adhesive sheet and supplying a region in which the adhesive strength is not lost or reduced to the holding unit.
The element mounting device according to any one of claims 1 to 6. The sheet supply unit
A cutter for punching out the adhesive sheet held by the holding portion is provided in the middle of the traveling path of the strip-shaped adhesive sheet.
7. The element mounting device according to claim 7. This is an element mounting method in which elements are picked up at once from an element feeder in which elements are arranged in an array, and the picked up multi-row and multi-column elements are collectively transferred to a substrate.
The multi-row multi-column element is held by holding an adhesive sheet equal to or slightly wider than the area including the multi-row multi-column element on the holding surface of the holding portion and pressing the adhesive sheet against the array-arranged elements of the element feeder. With the pickup step of sticking to the adhesive sheet,
When the multi-row multi-row element is brought into contact with the substrate, the pressure-sensitive adhesive sheet is heated to a temperature equal to or higher than a specified temperature at which the adhesive force of the pressure-sensitive adhesive sheet is lost or lowered by the heater of the holding portion, and the multi-row multi-row element is heated. A mounting step of peeling the elements in the row from the adhesive sheet, and
Including
The pick-up step and the mounting step are repeated a plurality of times to pick up the element from the element feeder in multiple rows and multiple columns, and transfer the element to the substrate in multiple rows and multiple columns.
An element mounting method characterized by. Multi-row and multi-column elements are picked up at once from an element feeder in which the elements are arranged in an array, and the picked-up multi-row and multi-column elements are collectively mounted on a substrate, and the elements are mounted in an array. This is an element mounting board manufacturing method for manufacturing the element mounting board.
The multi-row multi-column element is held by holding an adhesive sheet equal to or slightly wider than the area including the multi-row multi-column element on the holding surface of the holding portion and pressing the adhesive sheet against the array-arranged elements of the element feeder. With the pickup step of sticking to the adhesive sheet,
When the multi-row multi-row element is brought into contact with the substrate, the pressure-sensitive adhesive sheet is heated to a temperature equal to or higher than a specified temperature at which the adhesive force of the pressure-sensitive adhesive sheet is lost or lowered by the heater of the holding portion, and the multi-row multi-row element is heated. A mounting step of peeling the elements in the row from the adhesive sheet, and
By repeating the pickup step and the mounting step a plurality of times, picking up the element from the element feeder in multiple rows and multiple columns, and transferring the element to the substrate in multiple rows and multiple columns, the element is placed on the substrate. With iterative steps to manufacture device mounting boards mounted in an array
Including,
A method for manufacturing an element mounting substrate, which comprises.

Images