TWI673817B - Component packaging device, component packaging method, and component package substrate manufacturing method - Google Patents

Abstract

The present invention provides a component packaging device and a component packaging method that can easily and more reliably pick components in multiple rows and columns and can be uniformly packaged to a substrate. The transfer unit 5 moves between the stage 3 on which the carrier C on which the storage element E is placed and the package stage 4 on which the substrate S is placed, and collectively picks up the elements E in a plurality of rows and columns from the carrier C to pick up The elements E of multiple rows and columns are uniformly handed over to the substrate S. The transfer unit 5 holds the adhesive sheet A that is the same as or slightly wider than the area including the elements E in a plurality of rows and columns. Then, the transfer unit 5 presses the adhesive sheet A to the carrier C and attaches the components E of the plurality of rows and columns to the adhesive sheet A, thereby collectively picking up the components E of the plurality of rows and columns from the carrier C.

Description

Component packaging device, component packaging method, and component packaging substrate manufacturing method

The invention relates to a component packaging device, a component packaging method and a component packaging substrate manufacturing method.

Device packaging devices that package components such as semiconductor elements, resistors, and capacitors on a substrate on which a circuit pattern is formed are spreading. The component packaging device includes a component transfer unit that reciprocates between a component supply body in which components are stored and a substrate on which the components are packaged. The transfer unit picks up the components one by one from the component supply body, holds and transports the components to the substrate, and releases the components onto the substrate. Anisotropic Conductive Film (ACF), Anisotropic Conductive Paste (ACP), Non Conductive Film (NCF), and Non Conductive Paste (NCP) are formed on the substrate. ) Or a conductive bonding material such as a homogeneous eutectic solder, the element is placed on the substrate, and then heated and pressurized to package the element on the substrate.

As a method for holding the component by the transfer unit, vacuum adsorption or electrostatic adsorption is often used. When vacuum suction is used, a suction hole is formed in the transfer section of the component packaging device. The suction hole is connected to an air pressure circuit having a compressor or an ejector, and a negative pressure is generated in the suction hole. The transfer unit sucks the component into the suction hole by negative pressure, thereby picking up the component from the component supply body and transporting the component to the substrate, and releases the component onto the substrate by releasing the negative pressure such as vacuum destruction or atmospheric release. When electrostatic adsorption is used, a plurality of mesa-shaped structures are formed on a base substrate, and electrodes and a dielectric layer are provided on the convex structures. The static electricity generating portion having the convex structure serves as a local adsorption point for the element, and the static electricity generated by the voltage application attracts the element to each static electricity generating portion.

In recent years, miniaturization of components is progressing at a very fast pace. Devices with a size of 200 μm or less such as 50 μm or 10 μm on one side have also been proposed. These elements are, for example, 50 μm or 10 μm light emitting diodes (LEDs) or micro LEDs, which are arranged in rows and columns as display elements for RGB pixels for display. The display substrate is arranged on a lighting substrate as a light emitter for backlight. [Prior Art Literature] [Patent Literature]

Patent Document 1: Japanese Patent Publication No. 2015-505736

[Problems to be Solved by the Invention] When a micro-component is sucked and held by a transfer unit, it is necessary to prepare a suction hole or a convex structure which is smaller than a mini-sized component, and it is difficult to attract the micro-component and these components. The parts are aligned with each other with good accuracy. For example, when a 10 μm component is suctioned by a 3 μm suction hole, as long as the component is 4 μm away from the suction hole, the component cannot block the suction hole, which causes the suction force to decrease, or the component Dropping into the suction hole and tilting it may cause pick-up failure, or the component may fall off during the transfer to the substrate.

When there is one suction part such as a component and a suction hole or a convex structure, the position of the suction part can be managed with high accuracy, or the position of the suction part and the component can be relatively moved to correct each other's position, so that It is also possible to match the positions of the miniaturized suction portion and the device to each other. However, from the viewpoint of production efficiency, it is sometimes urgent to uniformly pick up components in multiple rows and columns and uniformly package them on a substrate. For example, when an LED is mounted on a display substrate as a pixel, if the display substrate supports 4K, at least 8 million or more LEDs must be packaged into the display substrate for one color in RGB. From the viewpoint of production efficiency, it must be Pick up multiple rows and columns of LEDs and package them to the substrate.

When uniform processing is performed on the micro-elements in a plurality of rows and columns, all of the elements in the rows and columns and the adsorption portions in the rows and columns must all agree with each other with good accuracy. However, compared with a case where there are only one element and one suction section, it is difficult to manage the components with multiple rows and columns and the suction sections with multiple rows and columns all with high accuracy. In addition, it is almost impossible to individually correct the positions of all the components and the suction portion. Therefore, it is difficult to solve this problem if a part of the elements in a plurality of rows and columns deviates from the position of the suction portion.

As a result, a component is leaked from the component supply body, or the component is detached during transportation due to insufficient holding, which results in a substrate in a region where the component is not encapsulated. That is, the yield of the product is reduced, or the post-operation of using the components one by one to fill the unpackaged area is caused, which results in the reduction of production efficiency.

The present invention has been made in order to solve the problems described above, and an object thereof is to provide a component packaging device, a component packaging method, and a component packaging substrate that can easily and more surely uniformly pick up components in multiple rows and columns and can be uniformly packaged to a substrate. Production method. [Means for solving problems]

In order to achieve the object, the component packaging device of the present invention is characterized by including: a supply stage on which component supply bodies in which elements are arranged in an array are mounted; a packaging stage on which substrates on which the elements are arranged in an array are mounted; Part, moving back and forth between the supply station and the packaging station multiple times, whenever returning to the supply station, picking up the components from the component supply body in multiple rows and columns at a time, whenever it reaches the When the table is packaged, the picked up elements of the multiple rows and columns are transferred to the substrate, and the transfer section includes a holding section for holding an adhesive sheet, and the adhesive sheet is formed with the containing sheet. Sheets with the same or slightly wider area of the elements in multiple rows and columns, and the adhesion force is lost or decreased due to the prescribed temperature; and a heater, when the elements in the multiple rows and columns are brought into contact with the substrate Heating the holding portion to the predetermined temperature or more, pressing the adhesive sheet to the component supply body, and attaching the components of the multiple rows and columns to the adhesive sheet, thereby , Picking up the multiple from the component supplier at one time The elements in a plurality of rows are uniformly transferred to the substrate by heating the elements above the predetermined temperature to peel the picked-up elements from the adhesive sheet.

The adhesive sheet may be a thermally peelable sheet whose adhesive force is lost or decreased due to a predetermined temperature, and the transfer section may include a holding section that holds the adhesive sheet, and a heater that When the plurality of rows and columns of elements are in contact with the substrate, the holding portion is heated to the predetermined temperature or more.

The holding surface of the adhesive sheet of the holding portion may have a rectangular shape, and a length of one side is 120 mm or less.

The holding portion may include a raw material having a thermal expansion coefficient of 18 × 10 ^-6 / K or less.

Alternatively, the component supply body includes another adhesive sheet, and the adhesive force of the another adhesive sheet is lost or decreased at a temperature lower than that of the adhesive sheet of the holding portion, so that The elements are affixed to the other adhesive sheet in an array, and the heater heats the holding portion to a position higher than that held by the holding portion when the holding portion picks up the component. The temperature at which the adhesive force of the adhesive sheet is lost or decreased is low, and is a temperature equal to or higher than the temperature at which the adhesive force of the another adhesive sheet provided by the component supply is lost or decreased.

The heater may heat the holding portion and cause it to thermally expand until the arrangement position of the multiple rows and columns of elements held by the holding portion via the adhesive sheet is suitable. Up to the placement position of the substrate.

A conductive bonding material cured by ultraviolet rays may be formed on the substrate, the package base may have an ultraviolet irradiation portion for the substrate, and the heater may face the ultraviolet rays at the ultraviolet irradiation portion. The substrate is irradiated with ultraviolet rays, the substrate is bonded to the elements in the plurality of rows and columns using the conductive bonding material, and then the head is heated.

It may also include a sheet material supply section that moves the adhesive sheet in the shape of a band and supplies an area in which the adhesion force is not lost or decreased to the holding section.

The sheet supply unit may include a cutter, which cuts the adhesive sheet held by the holding portion in the middle of the running path of the band-shaped adhesive sheet. Perform die cutting.

In order to achieve the object, the component packaging method of the present invention is to pick up multiple rows and columns of components at a time from a component supplier in which the components are arranged in an array, and unify the picked up components of the multiple rows and columns. The component packaging method is transferred to a substrate. The component packaging method includes a pick-up step of pressing an adhesive sheet that is the same as or slightly wider than an area containing the components in the plurality of rows and columns to the component supply body to press the component supply body. The multiple rows and columns of components are attached to the adhesive sheet; and a packaging step, when the multiple rows and columns of components are brought into contact with the substrate, the adhesive sheets are heated to the adhesive The adhesive force of the bonding sheet is lost or decreased above a predetermined temperature, so that the multiple rows and columns of components are peeled from the adhesive sheet, and the pickup step and the packaging step are repeated multiple times from the component. The supply body sequentially picks up the components in multiple rows and columns, and sequentially transfers the components to the substrate.

Further, in order to achieve the above-mentioned object, the method for manufacturing a component package substrate of the present invention is to pick up multiple rows and columns of components at a time from a component supplier in which the components are arranged in an array, and pick up the picked up components of the multiple rows and columns. The device package substrate is uniformly packaged to the substrate, thereby manufacturing the component package substrate in which the components are packaged in an array. The method for manufacturing the component package substrate includes a picking step, which will be the same as an area including the components in the multiple rows and columns. Or a slightly wider adhesive sheet is pressed to the component supply body to attach the components in the multiple rows and columns to the adhesive sheet; in the packaging step, the components in the multiple rows and columns are brought into contact When it reaches the substrate, the adhesive sheet is heated to a temperature above a predetermined temperature at which the adhesive force of the adhesive sheet is lost or decreased, so that the elements of the multiple rows and columns are peeled from the adhesive sheet. ; And iterative steps, repeating the picking step and the packaging step multiple times, picking up the components from the component supplier one by one in multiple rows and columns, and transferring the components one by one in multiple rows and columns. Substrate, borrow It was fabricated on the substrate in an array shape of the encapsulated element package substrate element. [Effect of the invention]

According to the present invention, the method of holding the components by the transfer unit is to attach the components by means of an adhesive sheet. Therefore, even if the components of a plurality of rows and columns are not aligned to the pin points, it is simple and convenient. Pick up multiple rows and columns of components more reliably and package them to the substrate uniformly.

Embodiments of the device packaging device and the packaging method of the present invention will be described in detail with reference to the drawings.

First Embodiment (Schematic Structure) FIG. 1 is a schematic diagram showing a schematic structure of a component packaging device. As shown in FIG. 1, the carrier C and the substrate S are carried into the component packaging device 1. The carrier C is a component supplier in which the components E are stored in an array. The array refers to a state in which the elements E are arranged in a plurality of rows and columns according to a predetermined pattern. The interval between the row direction and the column direction is the same or different. For example, it is a checkerboard arrangement, a honeycomb pattern, or the like . Element E is a component used in electronic circuits, including micro electro mechanical system (MEMS) and semiconductor elements, chips such as resistors and capacitors. Semiconductor elements include transistors, diodes, and diodes. ), Discrete semiconductors such as LEDs and thyristors, and integrated circuits such as integrated circuits (ICs) or large scale integrated circuits (LSIs). LEDs include so-called mini LEDs and micro LEDs. In particular, the element E includes so-called micro-components having a side of 200 μm or less. The substrate S is formed by forming a circuit pattern, and is, for example, a lighting substrate for a backlight in which mini-LEDs are arranged, and a display substrate in which micro-LEDs of RGB are arranged as pixels.

This component packaging device 1 is a device for packaging a component E on a carrier C on a substrate S. The component packaging device 1 picks up components E of a plurality of rows and columns from the carrier C at a time, and collectively transfers the picked components E of the plurality of rows and columns to the substrate S. In addition, the component packaging device 1 manufactures a component packaging substrate in which elements E are arranged in an array by repeating a plurality of picking steps and packaging steps. The picking step refers to picking up components from the carrier C one by one in multiple rows and columns. E, and the elements E are sequentially transferred to the substrate S in rows and columns. The component packaging device 1 electrically and mechanically bonds the transferred component E to the substrate S. Such a device package device 1 is also referred to as a die bonding device or a chip bonding device.

The component packaging device 1 includes a stage 3, a packaging stage 4, and a transfer unit 5. The stage 3 is a supply stage of the carrier C having a mounting surface on which the carrier C is placed, and is stopped at a pickup position 21. That is, the stage 3 stops the plurality of rows and columns of the component E group among the components E stored on the carrier C in an array arrangement so that the center position thereof is located at the pickup position 21. The package table 4 is a supply table for the substrate S having a mounting surface on which the substrate S is mounted, and is stopped at the package position 22. That is, the packaging stage 4 stops the circuit pattern on the circuit pattern S on the substrate S that encapsulates the elements E group in a plurality of rows and columns by the transfer unit 5 so that its center position is located at the packaging position 22.

The transfer unit 5 transfers the component E from the carrier C to the substrate S. This transfer section 5 is reciprocated between the pickup position 21 and the packaging position 22 a plurality of times. In addition, each time the transfer unit 5 returns to the carrier C, it faces the carrier C placed on the stage 3 at the pick-up position 21 and collectively picks up the elements E of the rows and columns from the carrier C. When the transfer unit 5 reaches the packaging stage 4, the transfer unit 5 opposes the substrate S placed on the packaging stage 4 at the packaging position 22, and transfers the elements E held in the multiple rows and columns to the substrate S in a unified manner. In addition, a series of operations for collectively picking up multiple rows and columns of components E at the picking position 21 is referred to as a picking step S1, and a series of operations for collectively handing over multiple rows and columns of components E to the substrate S at a packaging position is called Packaging step S2.

The pick-up method of the component E by the transfer part 5 is attaching. An adhesive sheet A is attached to the transfer section 5. As shown in FIG. 2, the adhesive sheet A includes, on one side, an adhesive region A1 that is the same as or slightly wider than the region where the elements E are arranged in multiple rows and columns. All of the adhesion areas A1 have adhesion force. In other words, there is no need to align the components E of multiple rows and columns to the pin points, as long as each component E contacts any area of the adhesive sheet A, the adhesive sheet A exerts the adhesive force to attach each component. E. The slightly wider bonding area A1 refers to the space between the element E group to be picked up and the element E adjacent to the outside of the element E group, but not to the extent of the adjacent element E.

The transfer section 5 mounts the adhesive sheet A in such a manner that the adhesive region A1 faces the component E at the pickup position 21 and the adhesive region A1 faces the substrate S at the packaging position 22. The transfer section 5 presses the adhesive sheet A to the component E on the carrier C, thereby transferring the component E from the carrier C to the adhesive sheet A. Furthermore, after the transfer unit 5 contacts the element E to the substrate S, the adhesion force of the adhesive sheet A is lost or decreased, so that the element E is detached from the adhesive sheet A to the substrate S. As an example, such an adhesive sheet A is a thermal peeling sheet whose adhesive force is lost or decreased by heat at a predetermined temperature.

3 (a) and 3 (b) show an example of a thermal peeling sheet. As shown in FIGS. 3 (a) and 3 (b), the adhesive sheet A has a two-layer structure of a substrate A2 and an adhesive layer A3. The adhesive layer A3 includes an adhesive and a foamer filler A4. The foaming filler A4 is filled with a substance that expands due to heat and gasification in a shell having elasticity. In the adhesive sheet A, the volume of the foamed filler A4 is expanded by heat, and the adhesion area with the element E is reduced, whereby the adhesion force to the element E is lost or decreased. That is, after the component E contacts the substrate S, the transfer unit 5 heats the adhesive sheet A, thereby peeling the component E from the adhesive sheet A and transferring the component E to the substrate S. In addition, as an example of the thermal peeling sheet, a phase transition from a solid state to a liquid state may be generated in the adhesive layer, as long as the adhesion force can be controlled by heat.

As the form of the carrier C holding element E, this heat-peelable adhesive sheet A can also be used. Hereinafter, when both the adhesive sheet A included in the transfer section 5 and the adhesive sheet A included in the carrier C are referred to, the adhesive sheet A is referred to as the adhesive sheet A included in the transfer section 5. This is called a support sheet Ah, and the adhesive sheet A of the carrier C is called a carrier sheet Ac.

For example, the carrier C has a glass plate as a substrate. A carrier sheet Ac is adhered to the surface of this glass plate. The carrier sheet Ac is adhered using an adhesive or the like so that the substrate A2 faces the surface of the glass plate. The element E is attached to the adhesive surface of the carrier sheet Ac. As shown in FIG. 4, the carrier-side peeling temperature T1 at which the adhesive strength of the carrier sheet Ac is lost or decreased is lower than the support-side peeling temperature T2 at which the adhesive strength of the support sheet Ah is lost or decreased. For example, by adjusting the gasification temperature based on the filling rate of the foamed filler A4, the size of the foamed filler A4, and the selection of the substance in the foamed filler A4, and by selecting the type of the shell of the foamed filler A4 The elasticity of the shell can be adjusted to set a predetermined temperature at which the carrier sheet Ac and the support sheet Ah lose adhesion.

In the picking step S1, the transfer unit 5 presses the support sheet Ah onto the element E on the carrier sheet Ac, and causes the carrier sheet Ac to generate heat at a temperature Te above the carrier-side peeling temperature T1 and lower than the support-side peeling temperature T2. Thereby, the transfer portion 5 maintains the adhesive force of the support sheet Ah and loses or decreases the adhesive force of the carrier sheet Ac, thereby transferring the element E from the carrier sheet Ac to the support sheet Ah.

In order to bond the element E to the substrate S, a conductive bonding material is formed on the substrate S in advance. The conductive bonding material electrically and mechanically connects the substrate S and the element E by alloy bonding, conductive particle compression bonding, bump compression bonding, and the like, and is cured by heating. For example, as the conductive bonding material, ACF, ACP, NCF, NCP, or a homogeneous eutectic solder is formed on the substrate S.

The process temperature T3 given to the conductive bonding material is set to be higher than the support-side peeling temperature T2 that causes the adhesive strength of the support sheet Ah to be lost or decreased. Therefore, in the packaging step S2, the transfer unit 5 press-bonds the element E to the substrate S and heats it to a process temperature T3 that is higher than the support-side peeling temperature T2, thereby depriving the adhesive force of the support sheet Ah or The element E is peeled off by falling, and the element E is electrically and mechanically connected to the substrate S by a conductive bonding material.

(Detailed Structure) The above component packaging device 1 will be described in more detail. FIG. 5 is a front view showing a detailed structure of the component packaging device 1, and FIG. 6 is a side view showing a detailed structure of the component packaging device 1.

As shown in FIGS. 5 and 6, the component packaging device 1 includes a base 6, a sheet supply section 7, a sheet discharge section 8, and a lifting section 9 in addition to the stage 3, the packaging table 4, and the transfer section 5. Hereinafter, the one-axis direction parallel to the upper surface of the base 6 is referred to as the X-axis direction. The Y-axis direction is a direction parallel to the upper surface of the base 6 and orthogonal to the X-axis, the Z-axis direction is a height direction orthogonal to the X-axis and Y-axis directions, and θ rotation refers to rotation around the Z-axis. The direction from the upper surface of the base 6 to the outside of the base 6 along the Z-axis direction is referred to as upward, and the direction from the upper surface of the base 6 to the inner direction of the base 6 along the Z-axis direction. Called below.

The base 6 is a table having a flat upper surface, and is provided with a stage 3, a packaging stage 4, a transfer section 5, a sheet supply section 7, a sheet discharge section 8, and a lifting section 9. Inside the base 6 is housed a Central Processing Unit (CPU), a Read Only Memory (ROM), and a Random Access Memory (Random Access Memory) which control each part of the component packaging device 1 Memory, RAM) and computer or micro computer control components 11 of the signal transmission circuit. In addition, the transfer unit 5 holds the support sheet Ah by suction. The base 6 houses an air pressure circuit 12 that supplies a negative pressure that becomes a suction force to the transfer unit 5. The control unit 11 is provided with a signal transmission circuit. The signal transmitting circuit controls a solenoid valve in the air pressure circuit 12 to switch the generation of the negative pressure and the release of the negative pressure.

The stage 3 has a mounting surface that is developed in a two-dimensional manner along the X-axis and Y-axis directions. The stage 3 includes an X-axis driving mechanism 31 and a Y-axis driving mechanism 32 and is movable in the X-axis direction and the Y-axis direction. The movable range in the X-axis direction includes a pickup position 21 and a loading / unloading position for loading and unloading the carrier C with respect to the stage 3. This X-axis driving mechanism 31 is used for the alignment of the carrier C and the X-axis direction of the transfer unit 5. The Y-axis driving mechanism 32 is used to align the carrier C with the Y-axis direction of the transfer unit 5.

As the X-axis driving mechanism 31 and the Y-axis driving mechanism 32, for example, a ball screw mechanism can be adopted. That is, a rail and a ball screw are extended in each movable direction. The ball screw includes a rotary motor (motor), a screw, and a slider. The slider is screwed to the screw, and the screw shaft is rotated by the rotary motor. The X-axis drive mechanism 31 is a slider fixed to the Y-axis drive mechanism 32 and is mounted on a guide rail of the Y-axis drive mechanism 32. The stage 3 is a slider fixed to the X-axis drive mechanism 31 and is mounted on a guide rail of the X-axis drive mechanism 31.

The packaging stage 4 has a mounting surface that is developed in a two-dimensional manner along the X-axis and Y-axis directions. The package table 4 is also movable in the X-axis direction and the Y-axis direction, and includes an X-axis drive mechanism 41 and a Y-axis drive mechanism 42 including a ball screw mechanism. The Y-axis driving mechanism 42 is mainly used for carrying in and discharging the substrate S placed on the packaging stage 4, and is also used for positioning the substrate S and the Y-axis direction of the transfer unit 5. The X-axis drive mechanism 41 is used for positioning the transfer unit 5 and the substrate S in the X-axis direction.

The pickup position 21 and the package position 22 are provided at intervals in the X-axis direction. On the base 6, a booster stage 61 is provided, which is one step higher than the upper surface of the base 6 and extends along the arrangement of the pickup position 21 and the packaging position 22. The transfer unit 5 is provided on the elevated stage 61 and travels along a straight line connecting the pickup position 21 and the packaging position 22. The transfer unit 5 can move along the Z axis toward the stage 3 and the packaging stage 4 located at the pickup position 21 and the packaging position 22. Direction down.

That is, a guide rail 63 is laid on the elevation table 61 along the X-axis direction. The guide rail 63 is a guide of the transfer unit 5 that moves between the pickup position 21 and the packaging position 22. The guide rail 63 has a length to reach the stage 3 located at the pickup position 21 and the packaging stage 4 located at the packaging position 22. The guide rail 63 is held by the support portion 64. The support portion 64 is a block body that supports the transfer portion 5 and is further driven by a ball screw 65 including a rotary motor and a screw that is rotated by the rotary motor.

The support portion 64 extends in the Y-axis direction toward a straight line connecting the pickup position 21 and the packaging position 22. The transfer unit 5 is attached to the extended front end surface 67 of the support 64. A guide rail 66 extending in the Z-axis direction is laid on the extended front end surface 67. The transfer unit 5 is mounted on the support 64 by grasping the guide rail 66 and is slidable in the Z-axis direction.

The lifting section 9 lowers the transfer section 5 that can slide in the Z-axis direction, thereby lowering the transfer section 5 at the pickup position 21 toward the stage 3 and lowering the transfer section 5 at the packaging position 22 toward the packaging table 4 . First, a support pillar 62 is erected on the base 6. The support pillar 62 is located behind the raising platform 61 and extends higher than the transfer unit 5. The upper end of the pillar 62 is bent in the Y-axis direction, and is advanced until the movement trajectory of the transfer unit 5 is just above. The lifting portion 9 is provided on the extended front end surface 69 of the pillar 62.

That is, a guide rail 91 extending in the Z-axis direction is laid on the extended front end surface 69 of the pillar 62. Further, on the extended front end surface 69 of the pillar 62, a screw 93 which is pivoted by a rotation motor 92 is provided in parallel with the guide rail 91. Further, the guide rail 91 is grasped and screwed to the screw 93, and a contact block 94 is attached. The abutment block 94 is lowered toward the transfer unit 5 by driving of the rotary motor 92, and abuts against the upper end of the transfer unit 5, and further moves the transfer unit 5 downward. The transfer unit 5 is biased upward by a biasing member such as a spring (not shown) as an example, and the contact block 94 overcomes the biasing member and pushes the transporting unit 5 downward. When the contact block 94 leaves the transfer unit 5 and the pressing force of the contact block 94 is released, the transfer unit 5 will return to the raised position shown in FIGS. 5 and 6 by the urging member.

In addition, the transfer unit 5 can be moved along the guide rail 63 to a position directly above the pickup position 21 and the packaging position 22. Therefore, the abutment block 94 is longer in the X-axis direction so that both the picking position 21 and the packaging position 22 are within the range, and the abutting block 94 can abut the conveying section 5 regardless of the position of the conveying section 5. Push down. Further, the transfer unit 5 may be connected to the contact block 94 in a state of being moved in the X-axis direction.

FIG. 7 is a block diagram showing a detailed configuration of the transfer unit 5. The transfer unit 5 starts from the direction close to the stage 3 or the packaging stage 4 and moves the head 51, the cylinder 52, the θ rotation portion 53, and the abutment block support portion 54 in the Z-axis direction in the Z-axis direction. They are connected together. The transfer unit 5 includes a camera 55 next to the row of the head 51 and the cylinder 52.

The head portion 51 is a holding portion that holds the supporting sheet Ah, and heats the conductive bonding material formed on the carrier sheet Ac, the supporting sheet Ah, and the substrate S by generating heat. The cylinder 52 is, for example, a pressure source such as an air cylinder. By applying a load to the head 51, the support sheet Ah is pressed to the component E via the head 51 at the pickup position 21, and at the packaging position 22 The component E is pressed onto the substrate S via the head 51. The θ rotation unit 53 rotates the head 51 about the Z axis, and aligns the element E on the carrier C with the circuit pattern on the substrate S. The abutment block support portion 54 is a member that comes into contact with the abutment block 94. The camera 55 detects the relative positional deviation between the transfer unit 5 and the carrier C, and the transfer unit 5 and the substrate S.

The head 51 faces the holding surface 51 a of the support sheet Ah toward the stage 3 and the packaging stage 4. The holding surface 51 a is a rectangular shape that is developed in parallel with the stage 3 and the package stage 4 and is flat. The head 51 has a porous structure, or has an adsorption hole 51b, or has both a porous structure and an adsorption hole 51b. For example, the head 51 is a ceramic using aluminum nitride or silicon nitride having a porous structure as a main material. In addition, the head 51 may be made of stainless, for example. In the case of the stainless steel head 51, the suction hole 51b is necessary. The suction hole 51b avoids the front and back surfaces of the element E, and is provided, for example, in an edge region of the support sheet Ah or a space between the element E and the element E.

A negative pressure is applied to the head 51, and the head 51 absorbs and holds the support sheet Ah by the holding surface 51a by the negative pressure. That is, the inside of the porous structure of the head portion 51 or the adsorption hole 51 b is connected to the air pressure circuit 12. A negative pressure is generated on the holding surface 51 a through the porous structure of the head portion 51 and through the through-hole 51 b provided in the head portion 51. The support sheet Ah is held by adsorption. On the other hand, when the air pressure circuit 12 is closed and the negative pressure applied to the head 51 disappears, the head 51 loses the holding force of the support sheet Ah, and the support sheet Ah is detached. The control member 11 causes the negative pressure to disappear only when the transfer section 5 is positioned in the sheet discharge section 8. Thereby, the support sheet Ah is discharged toward the sheet discharge portion 8.

Further, a heater 56 and a blower 57 are provided in the head portion 51. The heater 56 is, for example, a heating source such as a pulse wave heater, etc., and heats the head 51, and the blower 57 air-cools the head 51 by ejecting air. The heater 56 is controlled by the control unit 11. Under the control of the control unit 11, the heater 56 heats the head 51 to the process temperature T3 while exceeding the support-side peeling temperature T2 while the element E contacts the substrate S. In addition, the heater 56 interrupts or weakens the heating except when the element E contacts the substrate S, and the blower 57 cools the head 51 to a temperature exceeding the carrier-side peeling temperature T1 and the support side peeling except when the element E contacts the substrate S. Up to the temperature section of temperature T2.

Here, the head portion 51 expands in accordance with a thermal expansion coefficient corresponding to the material. The expansion of the head 51 shifts the positions of the elements E that are held in a plurality of rows and columns, respectively. As a result, the electrode of the element E and the electrode of the substrate S are misaligned, and the element E and the substrate S may have poor contact. Therefore, it is desirable that the head 51 has a size of the element E of 10 μm or more and 200 μm or less, and the temperature change of the head 51 from the holding of the element E to the packaging to the substrate S is 100 ° C. or more and 300 ° C. or less. When a material having a thermal expansion coefficient of 18 × 10 ^-6 / K or less is included, one side of the holding surface 51 a is 50 mm or less. The thermal expansion coefficient of SUS304 is 17.3 × 10 ^-6 / K, the thermal expansion coefficient of SUS430 is 10.4 × 10 ^-6 / K, and the thermal expansion coefficient of ceramics is 2.6 ～ 10.5 × 10 ^-6 / K, so these materials are preferred.

However, even within the above-mentioned condition range, it is possible to keep the temperature of the head 51 and the thermal expansion coefficient of the head 51 according to the required package accuracy, the temperature change of the head 51 from the holding element E to the package S, and the like. The size of one side of the surface 51a is set to be larger than 50 mm. That is, the lower the package accuracy, the smaller the temperature change of the head portion 51, and the smaller the thermal expansion coefficient, the larger the size of the holding surface 51a can be set. For example, when the temperature change of the head portion 51 from the holding element E to the package S to the substrate S is 100 ° C. and the thermal expansion coefficient is 5 × 10 ^-6 / K or less, the device has a size of 10 μm or more and 200 μm or less. E, one side of the holding surface 51a can be set to 120 mm. In other words, when the size of the element E is greater than or equal to 10 μm and less than or equal to 200 μm, and the temperature change of the head 51 from the holding of the element E to the package S is 100 ° C. or lower, and the head 51 includes a thermal expansion coefficient of 5 × For raw materials of 10 ^-6 / K or less, it is preferable to set one side of the holding surface 51a to 120 mm.

As shown in FIG. 8, the sheet supply unit 7 prepares a support sheet Ah. The sheet discharge portion 8 is a container for discarding the used support sheet Ah that has lost or decreased its adhesion. The sheet supply section 7 and the sheet discharge section 8 are provided between the pickup position 21 and the packaging position 22.

The sheet supply unit 7 includes a cutter housing 71, a cutter 72, a supply reel 73, and a storage reel 74, and supplies the support sheet Ah to the head 51 of the transfer unit 5. A rectangular groove is formed in the upper surface of the cutter housing 71. The cutter 72 has a frame shape and is accommodated in the groove. The supply reel 73 and the storage reel 74 are disposed separately on both sides of the cutter storage body 71. A belt-shaped support sheet Ah is wound on the supply reel 73. The support sheet Ah travels between the supply reel 73 and the storage reel 74 through the cutter accommodating body 71 in the middle of the travel path. That is, the support sheet Ah is pulled out from the supply reel 73, is hung on the upper surface of the cutter housing 71, and is wound around the storage reel 74. The shape and size of the frame-shaped cutter 72 are the same as those of the holding surface 51 a of the head portion 51 provided in the transfer unit 5, that is, the area in which the elements E arranged in a plurality of rows and columns are uniformly picked up.

The sheet supply unit 7 moves the belt-shaped support sheet Ah, and aligns the area where the adhesive force is not lost or decreased toward the cutter housing 71. In addition, the cutter accommodating body 71 causes the cutter 72 to emerge from the groove, and punches out a support sheet Ah having a size and shape corresponding to the head 51 from the belt-shaped support sheet Ah. The transfer unit 5 is lowered toward the sheet supply unit 7 and, by supplying negative pressure to the head portion 51, the punched support sheet Ah is sucked and held.

(Detailed Operation) The operation of such a component packaging device 1 will be described. FIG. 9 is a flowchart showing the operation of the component packaging device 1. First, a support sheet Ah is attached to the head 51 of the transfer unit 5 (step S01). The sheet supply unit 7 causes the cutter 72 to emerge from the cutter housing 71. The cutter 72 punches out a support sheet Ah attached to the transfer unit 5 from a belt of the support sheet Ah hung on the cutter housing 71. Following the die-cutting, the transfer section 5 moves directly above the sheet supply section 7. The lifting portion 9 lowers the transfer portion 5 toward the punched support sheet Ah. A negative pressure is generated in the head 51 of the transfer unit 5. The transfer unit 5 sucks the substrate A2 of the support sheet Ah to hold the support sheet Ah. The adhesive layer A3 of the support sheet Ah is exposed on the lower surface.

The transfer unit 5 holding the support sheet Ah moves to the pickup position 21 (step S02). At the pick-up position 21, the stage 3 carries the carrier C and stands by. That is, among the components E stored in an array on the carrier C, the center position of the multiple component E group (hereinafter referred to as the "pickup component E group") picked up by the transfer unit 5 at this time is positioned at the picking position. Standby at position 21. When the transfer unit 5 reaches the pick-up position 21, the transfer unit 5 is aligned with the carrier C, that is, the group E of pick-up scheduled components (step S03).

In step S03, the camera 55 captures an image of the group E of pick-up plans. When the image of the camera 55 is analyzed by the control unit 11, when the position deviation of the transfer unit 5 and the pickup group E group in the X-axis direction and the Y-axis direction and the deviation around the Z-axis direction are detected, the transfer unit 5 and The stage 3 moves relatively to eliminate these deviations. During the deviation in the X-axis direction, both the transfer unit 5 and the stage 3 can be moved in the X-axis direction, and therefore one or both of them are operated.

The detection of the deviation is performed by the operation of detecting the positions of two elements E located on one diagonal among the element E group reflected in the image by image processing. In image processing, binarization or contour enhancement may be performed to make the diagonals of the element E group clear. Then, the diagonal midpoint is calculated to obtain the difference between the calculation result and the reference point in the image. The difference is that the positions of the transfer unit 5 and the pickup group E group deviate in the X-axis direction and the Y-axis direction. The deviation in the direction around the Z axis is eliminated by operating the θ rotation unit 53 so that one diagonal of the element E group reflected in the image coincides with the reference line.

When the alignment of the transfer unit 5 and the group of pick-up scheduled components E is completed, the transfer unit 5 picks up and picks up the scheduled component E group from the carrier C (step S04). As shown in FIG. 10, the elevating unit 9 lowers the transfer unit 5 toward the carrier C of the stage 3, and presses the mounted support sheet Ah to the group E of picking-up elements. All the adhesive regions A1 of the support sheet Ah have adhesive force. Therefore, all of the elements E converged in the projection area of the support sheet Ah, that is, all of the group E of pick-up scheduled elements are attached to the support sheet Ah. Here, the steps S02 to S04 correspond to the picking step S1.

As shown in FIG. 11, the head 51 is heated to a temperature higher than the peeling temperature T1 of the carrier sheet Ac and lower than the peeling temperature T2 of the support sheet Ah by temperature adjustment based on heating by the heater 56 and cooling by the blower 57. Temperature Te. The heat of the head 51 is transmitted to the carrier sheet Ac via the carrier sheet Ac and the element E, or reaches the carrier sheet Ac as radiant heat from the head 51. Thereby, the projection area of the head part 51 in the carrier sheet Ac is heated to the peeling temperature T1 or more. The adhesive force of the projection region of the carrier sheet Ac is lost or decreased, and the element E group attached to the support sheet Ah is peeled from the carrier C side. That is, the element E group attached to the support sheet Ah does not remain on the carrier sheet Ac and is transferred from the carrier sheet Ac to the support sheet Ah. Hereinafter, the group E of the pick-up scheduled components after being attached to the support sheet Ah is simply referred to as a “component E group”.

When the component E group is transferred to the supporting sheet Ah, the transfer unit 5 moves from the pickup position 21 to the packaging position 22 (step S05). At this time, the packaging stage 4 carries the substrate S and stands by at the packaging position 22. That is, in the circuit pattern formed on the substrate S, the center position of the region (hereinafter, referred to as the “pre-packaged region”) where the components E group in which rows and columns are to be packaged by the transfer unit 5 is positioned to the package position 22 Standby. When the transfer unit 5 reaches the packaging position 22, the transfer unit 5 is aligned with the package-scheduled area on the substrate S (step S06). The camera 55 captures a circuit pattern in a predetermined area. In addition, the control unit 11 detects the positional deviation of the transfer unit 5 from the planned packaging area in the X-axis direction and the Y-axis direction and the deviation around the Z-axis direction, and moves the transfer unit 5 and the packaging stage 4 relatively to eliminate the Some deviations. In the deviation detection, for example, it is only necessary to calculate the position deviation and the direction deviation based on the electrode pads on the circuit pattern located at the diagonal corners of the predetermined region of the package.

When the alignment of the transfer unit 5 and the substrate S is completed, the component E group is packaged on the substrate S by the transfer unit 5 (step S07). As shown in FIG. 12, the lifting unit 9 lowers the transfer unit 5, and the transfer unit 5 collectively presses the component E group to the substrate S. That is, the rotation motor 92 is operated, and the abutment block 94 is lowered toward the transfer unit 5. The abutment block 94 abuts the abutment block support portion 54 of the transfer unit 5, pushes the entire transfer unit 5 down toward the substrate S, and abuts the component E group on the substrate S. At this time, since the pressure required for pressing is supplied to the cylinder 52, the element E group is pressed to the substrate S at a predetermined pressure.

As shown in FIG. 12, when the element E group is in contact with the substrate S, the heater 56 heats the head 51 to a temperature higher than the peeling temperature T2 of the support sheet Ah, and is used to bond the element E group with a conductive bonding material. Until the process temperature T3 of the substrate S. It is also possible to start heating before the element E group contacts the substrate S. Immediately after the element E group contacts the substrate S, the temperature of the head 51 passes the peeling temperature T2. The heat of the head portion 51 is conducted to the support sheet Ah, and is further conducted from the support sheet Ah to the conductive bonding material through the element E group. Therefore, as shown in FIG. 13, the adhesive force of the supporting sheet Ah is lost or decreased, and the element E group is separated from the supporting sheet Ah, so that the element E group is placed on the substrate S side. That is, the element E group attached to the support sheet Ah does not remain on the support sheet Ah, and all of the elements E are transferred from the support sheet Ah to the substrate S.

Furthermore, the head 51 reaches the process temperature T3, whereby the element E group is bonded to the substrate S using a conductive bonding material. At this time, the temperature of the head portion 51 rises from the peeling temperature T1 when the element E group is picked up to the process temperature T3, and thermal expansion occurs as the temperature rises. Among them, the size of the head 51 is 50 mm or less, or the head 51 includes a material having a thermal expansion coefficient of 18 × 10 ^-6 / K or less such as ceramics or stainless steel. Therefore, with the thermal expansion of the head portion 51, the position deviation of each element E converges within an allowable range, and each element E is electrically connected to the substrate S. Here, the steps S06 to S07 correspond to the packaging step S2.

When the packaging of the element E to the substrate S side is completed, the transfer unit 5 discards the used support sheet Ah (step S08). The transfer unit 5 moves to the sheet discharge unit 8, and the negative pressure supplied to the head 51 is released. When the negative pressure to the head portion 51 is released, the support sheet Ah attached to the transfer portion 5 falls off from the head portion 51 and falls to the sheet discharge portion 8.

It is assumed that the support sheet Ah held by the transfer unit 5 has a size and a shape including the elements E of m rows and n columns. Assume that the component C having a × m rows and b × n columns is stored on the carrier C. Furthermore, it is assumed that there is room for packaging the element E of c × m rows and d × n columns on the substrate S. a, b, c and d are positive real numbers, ideally natural numbers. At this time, the transfer unit 5 reciprocates between the picking position 21 and the packaging position 22, and repeatedly performs the packaging of the supporting sheet Ah, the pickup of the component E, the packaging of the component E, and the discarding of the supporting sheet Ah until all components are picked up from the carrier C E, or until all components E are arranged on the package margin of the substrate S. That is, steps S02 to S08 shown in FIG. 9 are repeatedly executed. Furthermore, if it is considered that the transfer unit 5 completely removes the component E from the carrier C and completely packages the component E to the circuit pattern of the substrate S, then a, b, c, and d are preferably set to natural numbers. .

While the transfer unit 5 is repeatedly picking up and packaging, in the sheet supply unit 7, the supply reel 73 and the storage reel 74 run, and the belt supporting the sheet Ah intermittently walks. The punched area is moved to the storage reel 74 side, and the uncut area is hung on the upper surface of the cutter housing 71. The cutter 72 emerges from the cutter accommodating body 71, and punches the support sheet Ah again. The transfer unit 5 mounts the new supporting sheet Ah on the head 51 again, and repeatedly picks up the new m rows and n columns of elements E at the picking position 21 and the newly picked m rows and n columns of elements E at the packaging position 22 Package. Thereby, the component packaging device 1 sequentially picks up the component E group in the a × m rows and b × n columns on the carrier C, and packages the component E on the substrate S.

(Effect) As described above, the component packaging device 1 includes the stage 3, the packaging stage 4, and the transfer unit 5. The stage 3 mounts the carriers C on which the elements E are arranged in an array. The package stage 4 mounts the substrates S on which the elements E are arranged in an array. The transfer unit 5 moves between the stage 3 and the packaging stage 4, and collectively picks up the components E in a plurality of rows and columns from the carrier C, and transfers the picked-up components E in the plurality of rows and columns to the substrate S in a unified manner. The transfer unit 5 holds a support sheet Ah that is the same as or slightly wider than the region including the elements E in a plurality of rows and columns. Then, the transfer unit 5 presses the support sheet Ah on the carrier C and attaches the elements E of the plurality of rows and columns to the support sheet Ah, thereby picking up the elements E of the plurality of rows and columns from the carrier C in a unified manner.

The supporting sheet Ah is provided with a bonding area A1 having the same size or shape as that of the element E including a plurality of rows and columns on one side, or having a slightly wider bonding area. All of the bonding areas A1 have a bonding force. Therefore, even if all the elements E in multiple rows and columns are not aligned to the pin points, as long as each element E contacts any area of the support sheet Ah, the support sheet Ah can exert an adhesive force to attach each element E.

Therefore, even if the opening positions of all the suction holes are not managed with high accuracy, such as a vacuum chuck, the elements E in multiple rows and columns can be picked up simply and more reliably, and the elements E can be suppressed from remaining on the carrier C. , Or component E comes off during the transfer. In addition, even if the arrangement of the components E arranged on the carrier C is changed, there is no need to replace the head 51 or the supporting sheet Ah. For example, even when the components E are packaged in a variety of small lots, a component packaging device can be used. 1 Continuous operation without having to suspend it, thereby increasing production efficiency.

In particular, the element packaging device 1 is suitable for a case where elements E having a size of about 10 μm or more and about 200 μm or less are arranged in a plurality of rows and columns to be uniformly packaged to the substrate S. For example, the component packaging device 1 encapsulates a mini LED or a micro LED on a display substrate as a backlight or a pixel constituting a display screen. In the case of such a small-sized element E, for example, when vacuum adsorption or electrostatic adsorption is used, as long as the suction portion such as a suction hole or a convex structure is slightly larger, the position of the element E becomes unstable, or as long as the adsorption is performed The formation position of the part is slightly deviated, and a part of the element E cannot be held. Although it is possible to align one element E with one suction hole, it is very difficult to manage them in such a way that all of the m rows and n columns of the element E and m rows and n columns of the suction section can be accurately aligned. Correct the positions of all components E and the suction section.

However, in this component packaging device 1, even if the components E of multiple rows and columns are not all aligned to the pin points, as long as each component E contacts the bonding area A1 of the supporting sheet Ah, the supporting sheet Ah can exhibit adhesiveness. Each element E is attached by a relay. Therefore, it is particularly suitable when the elements E having a size of about 10 μm or more and about 200 μm or less are arranged in a plurality of rows and columns to be uniformly packaged to the substrate S. Of course, even if the element E exceeds 200 μm, it can be uniformly transferred to the substrate S by the element packaging device 1.

In addition, the support sheet Ah is a thermally peelable sheet whose adhesive force is lost or decreased according to a predetermined temperature. The transfer unit 5 includes a holding unit and a heater 56 exemplified as the head 51. The head 51 holds the adhesive sheet A, and the heater 56 heats the head 51 to a predetermined temperature or higher when the elements E of a plurality of rows and columns are brought into contact with the substrate S.

That is, the method for packaging the components E on the substrate S in a plurality of rows and columns includes a picking step S1, and pressing a support sheet Ah, which is the same as or slightly wider than the area containing the components E in the plurality of rows and columns, onto the component supplier ( Carrier C) to attach the elements E of multiple rows and columns to the support sheet Ah; and the packaging step S2, when the elements E of the multiple rows and columns are brought into contact with the substrate S, the support sheet Ah is heated to the temperature of the support sheet Ah. The adhesive force is lost or decreased at a predetermined temperature or more so that the elements E in a plurality of rows and columns are separated from the support sheet Ah. Furthermore, as a method of manufacturing a component package substrate in which the components E are packaged in an array on the substrate S, the pick-up step S1 and the packaging step S2 are repeated several times.

Thus, even if the components E of multiple rows and columns are not all aligned to the pin points, as long as each component E contacts the bonding area A1 of the support sheet Ah, the support sheet Ah can exert the adhesive force to attach each component. E, and the element E can be more reliably detached from the substrate S. Therefore, when the element E is transferred to the substrate S, the element E can be prevented from remaining on the support sheet Ah side. Therefore, the yield of the substrate S of the package element E is improved. In addition, the possibility that post-package post-packing operation occurs due to the use of the element E to fill the unpackaged portion is reduced, and the production efficiency of the product is improved.

Furthermore, the heated head portion 51 expands in accordance with the thermal expansion coefficient corresponding to the material, thereby displacing the elements E of a plurality of rows and columns that are uniformly held. However, in this embodiment, the holding surface 51a of the support sheet Ah of the head 51 is made into a rectangular shape, and the length of one side is 50 mm or less. Alternatively, the head portion 51 is made of a material having a thermal expansion coefficient of 18 × 10 ^-6 / K or less. Thereby, the positional deviation of the element E can be avoided to the extent that the electrode of the element E and the electrode of the substrate S are misaligned, and the poor contact between the element E and the substrate S can be suppressed. Therefore, even if the head 51 is heated, the yield of the substrate S in which the element E is packaged can be improved. Furthermore, in this embodiment, the holding surface 51a of the support sheet Ah of the head 51 has a rectangular shape, the length of one side is 120 mm or less, and the head 51 includes a material having a thermal expansion coefficient of 5 × 10 ^-6 / K or less . Thereby, as described above, the positional deviation of the element E can be avoided to the extent that the electrode of the element E and the electrode of the substrate S are misaligned, and the contact failure between the element E and the substrate S can be suppressed.

Further, the carrier C is provided with another adhesive sheet A, which is a carrier sheet Ac, whose adhesive force is lost or decreased at a lower temperature than the support sheet Ah of the head 51. This carrier C is obtained by attaching elements E in an array on a carrier sheet Ac. When the heater 56 picks up the element E, the heater 56 heats the head 51 to a temperature lower than the temperature at which the adhesive force of the support sheet Ah held by the head 51 is lost or decreased, and is lower than the carrier sheet provided in the carrier C. The temperature at which the adhesion of Ac is lost or dropped is high.

Thereby, when the support sheet Ah is attached to the component E, the component C is easily separated on the carrier C side. Therefore, when the component E is transferred to the support sheet Ah, the component E can be prevented from remaining on the carrier C side. Therefore, the yield of the substrate S in which the element E is packaged is improved. In addition, the possibility that post-package post-packing operation occurs due to the use of the element E to fill the unpackaged portion is reduced, and the production efficiency of the product is improved. Furthermore, the timing at which the carrier C separates the element E can be controlled, so that the position of the element E does not deviate when the carrier 3 transfers the carrier C, and contact defects during packaging can be prevented more reliably.

In this embodiment, the carrier sheet Ac is also described as an example of a thermally peelable sheet. However, as long as it is a sheet that can lose or lower the holding force of the element E when the element E is picked up, It is not limited to this. For example, as the carrier sheet Ac, an adhesive sheet having a lower holding force with respect to the normal direction of the adhesive surface than the support sheet Ah may be used. After the component E is attached with the support sheet Ah, the transfer part 5 is lifted to leave the carrier C, and the component E is peeled from the carrier sheet Ac due to the difference in the holding force between the carrier sheet Ac and the support sheet Ah. The element E is transferred to a support sheet Ah.

Further, as shown in FIG. 14, the transfer unit 5 may include a tilting mechanism 58 that tilts the rows of the head 51 and the cylinder 52 along a YZ plane formed by dividing the Y axis and the Z axis. The tilt mechanism 58 includes, for example, a rotation shaft extending in the X-axis direction, and a rotation motor that rotates the rotation shaft. A bracket to which the cylinder body 52 and the head 51 are attached is fixed to the rotation shaft. When the rotary motor is driven, the head 51 and the cylinder block 52 change directions along the YZ plane.

At this time, it is only necessary to use the captured image of the camera 55 to detect warpage at a predetermined package position on the substrate S. The tilt mechanism 58 tilts the head 51 and the rows of the cylinders 52 in accordance with the detected warpage so that the predetermined package position on the substrate S and the holding surface 51 a of the head 51 become parallel. Instead of the camera 55, a laser irradiation device may be provided to detect the warpage of the substrate S. The laser irradiation device includes a laser irradiation section and a laser light receiving section, and scans the substrate S using laser light, and detects warpage of the substrate S based on the light receiving timing of the laser light receiving section, that is, detects the laser irradiation section and laser scanning. The distance of the location.

Thereby, even if the large-sized substrate S is warped, the element E can be packaged with high accuracy. Moreover, even if the substrate S is warped, the air gap between the substrate S and the element E can be eliminated, and after all the elements E are brought into contact with the substrate S at the same time, the element E is peeled from the support sheet Ah. Therefore, the possibility that the element E is detached from the substrate S can be reduced, and the yield of the product can be improved. Furthermore, if further provided with a tilt mechanism 58 that tilts the rows of the head 51 and the cylinder 52 along the XZ plane, it is possible to cope with warpage in all directions.

In addition, a sheet supply unit 7 is provided which runs the belt-shaped support sheet Ah to supply a region in which the adhesive force is not lost or decreased. Thereby, even if the support sheet Ah is a thermally peelable sheet, the element E can be efficiently conveyed. The sheet supply unit 7 includes a cutter 72 that punches the support sheet Ah in the middle of the travel path of the belt-shaped support sheet Ah. Thereby, it is not necessary to supply the support sheet Ah one by one, and the support sheet Ah can be supplied simply and quickly.

Alternatively, as shown in FIG. 15, the sheet feeding unit 7 may be provided in the transfer unit 5. The transfer unit 5 includes a supply reel 73 and a storage reel 74 on both sides of the head 51. The tape of the support sheet Ah drawn from the supply reel 73 is hung on the holding surface 51 a of the head 51, and is wound around the storage reel 74. When the component E is attached to the area of the support sheet Ah that coincides with the holding surface 51a, and the component E is peeled off by heat, the supply reel 73 and the storage reel 74 are operated, and the used area is sent to the storage reel. On the 74 side, the new area is positioned on the holding surface 51a.

At this time, the size in the width direction (Y-axis direction) of the band of the support sheet Ah is formed to be the same as or slightly wider than the size in the width direction (Y-axis direction) of the region where the elements E in a plurality of rows and columns are arranged. The size in the feeding direction (X-axis direction) of the support sheet Ah in the holding surface 51a of the head 51, that is, the size in the X-axis direction of the portion where the support sheet Ah is flatly supported in FIG. The area in which the elements E in a plurality of rows and columns are arranged has the same or slightly wider width in the X-axis direction. Further, the bent portions of the supporting sheet Ah formed at both ends of the holding surface 51a may be set at an acute angle.

If the sheet supply section 7 is provided in the transfer section 5 in this way, the manufacturing process of the transfer section 5 through the sheet supply section 7 and the sheet discharge section 8 can be omitted. Therefore, from the installation of the new support sheet Ah to the head 51, the tack time after picking up the component E and packaging the component E until the replacement of the support sheet Ah is increased, and the production efficiency of the product is improved.

(Second Embodiment) Next, a component packaging device 1 according to a second embodiment will be described in detail with reference to the drawings. The same configurations and the same functions as those of the first embodiment are denoted by the same reference numerals and detailed descriptions are omitted.

As shown in FIG. 16, in the component packaging device 1, a heater 56 provided in the head portion 51 heats the head portion 51 to a suitable temperature range T4 where the placement position of each element E is suitable for the substrate S. That is, the heater 56 heats the head portion 51 and thermally expands it, thereby displacing the arrangement positions of the elements E in a plurality of rows and columns, so that each element E is located within an allowable range capable of being electrically bonded to the substrate S.

The suitable temperature section T4 is set to the support-side peeling temperature T2 including the loss or decrease of the adhesive force of the support sheet Ah. That is, as long as the interval between the elements E packaged on the substrate S is narrower, each element E is arranged on the carrier sheet Ac, and the linear expansion coefficient is adjusted according to the material and size of the head 51, and the support-side peeling temperature T2 is adjusted. Alternatively, these operations may be used in combination to set the appropriate temperature range T4 and the supporting peeling temperature T2.

In such a component packaging device 1, a predetermined component E group is picked up from the carrier C, and the picked-up component E group is brought into contact with the substrate S. At this time, as shown in FIG. 17, the heater 56 heats the head 51 to a suitable temperature range T4 including the support-side peeling temperature T2, and the thermal expansion of the head 51 makes the interval of the element E suitable for the circuit of the substrate S. The pattern is expanded, and the element E is peeled from the support sheet Ah to release the restraint from the head 51 side, and the element E group is transferred to the substrate S. Thereby, the positional accuracy of each element E converges well to the appropriate position P within the allowable range due to the thermal expansion of the head 51, and each element E is electrically connected to the substrate S. Therefore, the thermal expansion caused by the head 51 can be suppressed. Yield drops.

Furthermore, the heater 56 further heats the head portion 51 to a process temperature T3 for the conductive bonding material. When the peeled element E group continues to be displaced by the thermal expansion of the head 51 due to the friction coefficient of the supporting sheet Ah to expand the interval, the appropriate temperature range T4 and the process temperature T3 should be consistent.

Alternatively, when the temperature range T4 including the support-side peeling temperature T2 is adopted, that is, when the interval of the element E is adapted to the substrate S by the thermal expansion of the head 51, the head 51 temporarily releases the negative pressure to solve the problem. Untie the support sheet Ah from the head 51, and heat the head 51 to the process temperature T3. Even if the head 51 is thermally expanded, the expansion of the support sheet Ah that is not sucked by the head 51 is difficult to follow the thermal expansion of the head 51. For the element E group sandwiched by the support sheet Ah and the substrate S, It is also less likely that the interval will be further extended during the period when the segment T4 reaches the process temperature T3.

(Third Embodiment) Next, a component packaging device 1 according to a third embodiment will be described in detail with reference to the drawings. Structures and functions that are the same as those of the first embodiment or the second embodiment are denoted by the same reference numerals and detailed descriptions are omitted.

In this element packaging device 1, a conductive bonding material that is cured or temporarily cured by ultraviolet rays is formed on a substrate S. As shown in FIG. 18, the mounting surface of the packaging stage 4 is a doughnut type having an opening smaller than the substrate S, and an ultraviolet irradiation is arranged below the packaging stage 4 in a position opposite to the center of the packaging position. Device 59. The substrate S has a glass plate as a base, and the ultraviolet irradiation device 59 emits ultraviolet rays toward the substrate S, passes through the substrate S, and irradiates the conductive bonding material.

FIG. 19 is a flowchart showing the operation of the packaging process of the third component packaging device 1. The elevating unit 9 lowers the transfer unit 5 holding the elements E in a plurality of rows and columns toward the packaging stage 4, and the cylinder 52 presses the elements E in the plurality of rows and columns to the substrate S. When the element E is pressed onto the substrate S (step S11), the ultraviolet irradiation device 59 irradiates ultraviolet rays to the conductive bonding material to cure the conductive bonding material (step S12). Thereby, the element E is fixed to the substrate S. After the element E is bonded to the substrate S, the heater 56 heats the head 51 to the support-side peeling temperature T2 (step S13). The heat of the head 51 is conducted to the supporting sheet Ah, and the supporting sheet Ah loses or decreases the adhesive force, so that the element E bonded to the substrate S is peeled from the supporting sheet Ah.

When the heater 56 heats the head 51 to the support-side peeling temperature T2, the head 51 thermally expands. However, since the elements E of the multiple rows and columns attached to the support sheet Ah are already fixed to the substrate S, it is difficult to The displacement follows the thermal expansion of the head 51. Therefore, the position of each element E can be maintained within an allowable range, and a decrease in the yield due to the thermal expansion of the head portion 51 can be suppressed.

(Other Embodiments) Although the embodiment of the present invention and the modification examples of the respective parts have been described above, this embodiment or the modification examples of the respective parts is presented as an example, and is not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments or modifications thereof are included in the scope or gist of the invention, and are included in the invention described in the scope of patent application.

1‧‧‧component packaging device

3‧‧‧ carrier

4‧‧‧Packing station

5‧‧‧Transfer Department

6‧‧‧ base

7‧‧‧ Sheet Supply Department

8‧‧‧ Sheet discharge section

9‧‧‧ Lifting Department

11‧‧‧Control Unit

12‧‧‧air pressure circuit

21‧‧‧Pick up position

22‧‧‧Package location

31, 41‧‧‧ X-axis drive mechanism

32, 42‧‧‧Y-axis drive mechanism

51‧‧‧Head

51a‧‧‧ keep face

51b‧‧‧ adsorption hole

52‧‧‧cylinder block

53‧‧‧θ rotation section

54‧‧‧ abutment block support

55‧‧‧Camera

56‧‧‧heater

57‧‧‧blower

58‧‧‧Tilt mechanism

59‧‧‧ultraviolet irradiation device

61‧‧‧increased platform

62‧‧‧ Pillar

63, 66, 91‧‧‧ rails

64‧‧‧ Support Department

65‧‧‧ball screw

67, 69‧‧‧ extended front surface

71‧‧‧knife container

72‧‧‧ Cutter

73‧‧‧Supply Scroll

74‧‧‧ Containment Scroll

92‧‧‧Rotary motor

93‧‧‧Screw

94‧‧‧ abutment block

A‧‧‧Adhesive sheet

A1‧‧‧ Adhesive area

A2‧‧‧ substrate

A3‧‧‧Adhesive layer

A4‧‧‧Foaming filler

Ac‧‧‧ carrier sheet

Ah‧‧‧ support movie

C‧‧‧ carrier

E‧‧‧Element

S‧‧‧ substrate

S01 ～ S08, S11 ～ S13‧‧‧step

S1‧‧‧Pickup steps

S2‧‧‧Packaging steps

T1‧‧‧ Carrier side peeling temperature

Te‧‧‧Temperature

T2‧‧‧Support side peeling temperature

T3‧‧‧Processing temperature

T4‧‧‧suitable for temperature

FIG. 1 is a perspective view showing a schematic configuration of a component packaging device according to a first embodiment. FIG. 2 is a perspective view schematically showing an adhesive sheet attached to a transfer section. 3 (a) and 3 (b) are cross-sectional views of an adhesive sheet including a thermally peelable sheet. FIG. 3 (a) shows before heating and FIG. 3 (b) shows after partial heating. FIG. 4 is a graph showing the relationship between the temperature and the adhesive force and the temperature displacement of the head. FIG. 5 is a front view showing a detailed configuration of the component packaging device according to the first embodiment. FIG. 6 is a side view showing a detailed configuration of the component packaging device according to the first embodiment. FIG. 7 is a diagram showing a detailed configuration of a transfer unit. FIG. 8 is a diagram showing a detailed configuration of a sheet supply unit. FIG. 9 is a flowchart showing the operation of the component packaging device according to the first embodiment. FIG. 10 is a schematic diagram showing a state in which a holder sheet presses a component on a carrier in a component picking step. FIG. 11 is a schematic diagram showing a peeling state of a component on a carrier in a component picking step. FIG. 12 is a schematic diagram showing a state in which a component is pressed to a substrate and heated in a component packaging step. FIG. 13 is a schematic diagram showing a state in which a component is peeled from a support sheet and a package state to a substrate in a component packaging step. FIG. 14 is a diagram showing a transfer unit having a tilt mechanism. FIG. 15 is a diagram showing a transfer unit including a sheet supply unit. FIG. 16 is a graph showing a component packaging device according to a second embodiment, showing thermal expansion and deviation of component positions. FIG. 17 is a schematic diagram showing a process of correcting a positional deviation of a device by thermal expansion. FIG. 18 is a view showing a component packaging device according to a third embodiment and showing a configuration of a stage. FIG. 19 is a flowchart showing the operation of the packaging process of the third component packaging device.

Claims (10)

A component packaging device is characterized by comprising: a supply table on which a component supply body in which components are arranged in an array is placed; a packaging table on which a substrate in which the components are arranged in an array is placed; and a transfer section where the supply The table and the packaging table are moved back and forth multiple times. Whenever they return to the supply table, the components are picked up from the component supply body in multiple rows and columns at a time. The picked-up elements of the plurality of rows and columns are transferred to the substrate, and the transfer section includes: a holding portion that holds an adhesive sheet, and the adhesion sheet is a component including the plurality of rows and columns Sheets with the same or slightly wider area, and the adhesive force is lost or decreased due to the specified temperature; and a heater, when the elements of the rows and columns are brought into contact with the substrate, the holding portion is heated to When the predetermined temperature is higher than the predetermined temperature, the adhesive sheet is pressed against the component supply body to attach the multiple rows and columns of components to the adhesive sheet, thereby picking up from the component supply body at a time The elements in the plurality of rows and columns are collectively transferred to the substrate by peeling the picked-up elements from the adhesive sheet by heating to the predetermined temperature or higher. The element packaging device according to item 1 of the patent application range, wherein the holding portion contains a raw material having a thermal expansion coefficient of 18×10 ⁻⁶ /K or less. The component packaging device according to claim 1 or claim 2, wherein the holding surface of the adhesive sheet of the holding portion has a rectangular shape, and the length of one side is 120 mm or less. The component packaging device according to item 1 or 2 of the patent application range, wherein the component supply body includes another adhesive sheet when the temperature of the adhesive sheet of the holding portion is lower than Next, the adhesive force of the other adhesive sheet is lost or decreased, the elements are attached to the other adhesive sheet in an array, and the heater heats the holding portion to a specific temperature The specific temperature is lower than the temperature at which the adhesive force of the adhesive sheet held by the holding portion is lost or decreased when the component is picked up by the holding portion, and is lower than the temperature at which the component supply body is made The temperature at which the adhesive strength of the other adhesive sheet is lost or decreased is high. The component packaging device according to item 1 of the patent application range, wherein the heater heats the holding portion to thermally expand it until the holding portion holds the holding portion via the adhesive sheet The arrangement positions of the elements in rows and columns are suitable up to the arrangement positions on the substrate. The component packaging device according to item 1 of the patent application range, wherein a conductive bonding material cured by ultraviolet rays is formed on the substrate, and the packaging table has an ultraviolet irradiation part of the substrate, the The heater irradiates the substrate with ultraviolet rays at the ultraviolet irradiation section, joins the substrate to the elements of the plurality of rows and columns with the conductive bonding material, and heats the head. The component packaging device according to item 1 or 2 of the scope of the patent application, which includes a sheet supplying section that runs the adhesive sheet in the form of a strip and supplies an area where the adhesive force is not lost or decreased to all Described holding part. The component packaging device according to item 7 of the patent application range, wherein the sheet supplying section includes a cutter, which cuts the holding section in the middle of the travel path of the tape-shaped adhesive sheet The held adhesive sheet is die cut. A component packaging method is characterized by picking up multiple rows and multiple columns of components from a component supply body in which components are arranged in an array at a time, and collectively transferring the picked up multiple rows and multiple columns of components to a substrate, including : Picking step, pressing an adhesive sheet that is the same as or slightly wider than the area containing the elements in the multiple rows and columns to the element supply body to attach the multiple rows and columns to the adhesive A bonding sheet; and a packaging step, when the elements of the rows and columns are brought into contact with the substrate, the bonding sheet is heated to a predetermined temperature that causes the bonding force of the bonding sheet to be lost or decreased In the above, in order to peel off the components in the plurality of rows and columns from the adhesive sheet, the picking step and the packaging step are repeated multiple times, and the components are picked up from the component supply body in multiple rows and columns , And transfer the elements to the substrate in multiple rows and multiple columns at a time. A method for manufacturing a component packaging substrate is characterized by picking up multiple rows and columns of components at a time from a component supply body in which components are arranged in an array, and packaging the picked up components in multiple rows and multiple columns to a substrate in a unified manner. Thus, manufacturing an element package substrate in which the elements are packaged in an array includes: a picking step, pressing an adhesive sheet that is the same as or slightly wider than the area containing the elements in the rows and columns to the element supplier To attach the multiple rows and multiple columns of components to the adhesive sheet; in the packaging step, when the multiple rows and multiple columns of components are brought into contact with the substrate, the adhesive sheet is heated to The predetermined temperature above which the adhesive force of the adhesive sheet is lost or decreased, so that the elements of the rows and columns are peeled off from the adhesive sheet; and an iterative step, repeating the picking step and the In the packaging step, the components are picked up from the component supply body in multiple rows and columns, and the components are transferred to the substrate in multiple rows and columns, thereby manufacturing an array on the substrate An element packaging substrate on which the elements are encapsulated.