JP2010287679A - Transfer tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer tool (adsorption collet) which causes less damage and adsorption error and can be achieved at low cost. <P>SOLUTION: In the adsorption collet 500 for adsorbing a semiconductor chip 52 and transporting it, an adhesive sheet 50 for adsorbing the semiconductor chip 52 is provided on the front end of the adsorbing collet 500. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a conveying jig for adsorbing and conveying an object to be conveyed, and particularly to a conveying jig suitable for adsorbing and conveying a semiconductor chip.

  In a conventional jig (suction collet) for lifting and transporting a semiconductor chip to a predetermined position, both the circuit forming surface side and the other surface side of the semiconductor chip having no through electrode have low unevenness due to the connection pads. Even if the surface of the surface is facing upward, the tip of the suction collet is brought into contact with the vicinity of the center of the semiconductor chip and the suction hole of the suction collet is made vacuum, so that the semiconductor chip can be easily sucked and transported. there were.

  On the other hand, in recent years, CoC (chip-on-chip) technology, in which through-electrodes are formed in a chip and flip chip stacking by bump connection is performed in order to realize multi-function / high speed of the semiconductor chip and high density mounting associated therewith, It is being developed.

  In a semiconductor chip having a through electrode, the through electrode is often arranged up to the vicinity of the center of the chip. Also, the connection bump pads on both ends of the through electrodes formed on the chip surface often have a structure that protrudes higher than the connection pads of the conventional semiconductor chip in order to join the bump pads of the semiconductor chips stacked above and below. .

  Hereinafter, a CoC semiconductor chip having a Cu bump pad structure with a high height on the circuit forming surface side will be described as an example.

  When the bump pad with high height is facing downward, there is only a low bump pad on the suction collet contact surface side, so there are few irregularities and it is possible to use the conventional vacuum suction collet, but the bump with high height When the pad is facing upward, the following problems occur and the conventional vacuum suction collet cannot be used.

  That is, even if the tip of the suction collet is brought into contact with the vicinity of the center of the chip for vacuum suction, the bump pad has a high height, so that the unevenness of the collet contact surface becomes large and air enters through the gap, so that the degree of vacuum is increased. Can not be absorbed.

  Further, if the air suction force is increased in order to increase the degree of vacuum, there is a problem in that a force for sucking even a semiconductor chip adjacent to the periphery of the suction collet works. Furthermore, if you try to make the suction collet in close contact with the area where there is no bump pad, the suction force deteriorates by narrowing the suction collet and suction hole, and the shape of the collet tip is individually prepared to correspond to the arrangement of the bump pad. This causes problems such as an increase in cost, a limit of processing accuracy, and an improvement in alignment accuracy of the suction collet.

  Therefore, when adsorbing and transporting a semiconductor chip with a bump pad having a high height facing the adsorbing collet side, it is necessary to devise measures such as strengthening the suction force by suppressing the back surface of the chip with a strong adhesive sheet.

  As an example of a bumped semiconductor chip pick-up collet, there is JP-A-5-190665 (Patent Document 1). It is considered that the problem cannot be solved.

  In addition, as an example of the adsorption system using an adhesive, JP 2001-144430 A (Patent Document 2), JP 2005-191532 A (Patent Document 3), JP 2006-172166 A (Patent Document 4). )

Japanese Patent Laid-Open No. 5-190665 JP 2001-144430 A JP 2005-191532 A JP 2006-172166 A

  Accordingly, the present invention has been made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a transport jig that can be realized at low cost with little damage and suction error.

  The present invention is a transport jig for sucking and transporting a transport object, and is characterized in that an adhesive means for sucking the transport object is provided at the tip of the jig.

  ADVANTAGE OF THE INVENTION According to this invention, the jig for conveyance which can be implement | achieved with few damages and adsorption mistakes and low cost can be provided.

It is a figure which shows the structure of the existing adsorption collet. It is structure explanatory drawing of the semiconductor chip without a penetration electrode, (a) is a perspective view, (b) is A-A 'sectional drawing of (a). It is structure explanatory drawing of the semiconductor chip which has a high Cu bump pad structure downward, (a) is a perspective view, (b) is B-B 'sectional drawing of (a). It is structure explanatory drawing of the semiconductor chip which has Cu bump pad structure which is high upward, (a) is a perspective view, (b) is C-C 'sectional drawing of (a). It is a figure which shows the adsorption collet for semiconductor chips which concerns on the 1st Embodiment of this invention, (a) is a perspective view, (b) is a top view of an adhesive sheet. It is sectional drawing of the D-D 'part of the front-end | tip of Fig.5 (a). It is a figure which shows the adsorption collet for semiconductor chips which concerns on the 2nd Embodiment of this invention, (a) is a perspective view, (b) is a top view of an adhesive sheet. It is a figure which shows the adsorption collet for semiconductor chips which concerns on the 3rd Embodiment of this invention, (a) is a perspective view, (b) is a top view of an adhesive sheet.

(Existing technology)
First, the existing technology will be described with reference to FIGS. 1 to 4 so that the features of the present invention become clearer.

  An existing jig (suction collet) for lifting and transporting a semiconductor chip to a predetermined position has a structure as shown in FIG. As shown in FIG. 1, the suction collet 100 is formed with a suction hole 11 through which the suction air 10 passes. Under such a configuration, the semiconductor chip 12 is sucked by making the suction hole 11 of the suction collet 100 vacuum.

  2A and 2B are explanatory views of the structure of a semiconductor chip having no through electrode. FIG. 2A is a perspective view, and FIG. 2B is a cross-sectional view taken along line A-A ′ in FIG.

The semiconductor chip 200 having no through electrode has a low unevenness due to the connection pad 22 on both the circuit forming surface 20 side and the other surface 21 side, and the suction collet 100 (see FIG. 1) regardless of which surface faces upward. ) Is brought into contact with the vicinity of the central portion of the semiconductor chip 200 and the suction hole 11 of the suction collet 100 is evacuated, whereby the semiconductor chip 200 can be easily sucked and transported.

  On the other hand, in recent years, CoC (chip-on-chip) technology, in which through-electrodes are formed in a chip and flip chip stacking by bump connection is performed in order to realize multi-function / high speed of the semiconductor chip and high density mounting associated therewith, It is being developed. Semiconductor chips with through-electrodes are often arranged to the vicinity of the center of the chip, and the bump pads for connection at both ends of the through-electrodes formed on the chip surface are bumps of the semiconductor chip stacked up and down. In many cases, a structure protruding higher than a connection pad of an existing semiconductor chip is used for bonding with the pad. Hereinafter, a CoC semiconductor chip having a Cu bump pad structure with a high height on the circuit forming surface side will be described as an example.

  3A and 3B are explanatory views of the structure of the semiconductor chip 300 having a downwardly high Cu bump pad structure. FIG. 3A is a perspective view, and FIG. 3B is a cross-sectional view along B-B ′ in FIG.

  4A and 4B are explanatory views of the structure of the semiconductor chip 400 having an upwardly high Cu bump pad structure. FIG. 4A is a perspective view, and FIG. 4B is a cross-sectional view taken along the line C-C ′ in FIG.

  As shown in FIG. 3, a bump pad region 30 is provided around the center of the semiconductor chip 300. A Cu bump pad 32 having a high height is formed on the circuit forming surface 31 of the semiconductor chip 300. On the other hand, a Cu bump pad 34 having a low height is formed on the other surface 33 of the semiconductor chip 300.

  As described above, when the bump pad 32 having a high height is directed downward, there is only a small bump pad 34 on the suction collet contact surface side, so that there is little unevenness and the existing vacuum suction collet 100 (see FIG. 1) is used. Is possible.

  However, as shown in FIG. 4, the bump pad 40 with a high height formed on the circuit formation surface 44 (eg, bump pad height H1 = 30 μm) is upward, and the bump pad 43 with a low height is downward. In this case, the following problems occur and the existing vacuum suction collet 100 cannot be used.

  That is, even if the tip of the suction collet 100 is brought into contact with the vicinity of the center of the chip for vacuum suction, the bump pad 40 having a high height makes the collet contact surface uneven and air enters through the gap to cause a vacuum. Degradation is not possible. Further, if the air suction force is increased in order to increase the degree of vacuum, there is a problem that a force for sucking even a semiconductor chip adjacent to the peripheral portion of the suction collet 100 works.

  Further, as shown in FIG. 4, when the suction collet 100 is brought into close contact with the area 41 (eg, area width = d2) having no bump pad, the suction collet 100 and the suction hole 11 are narrowed (eg, collet). Deterioration of suction force due to outer diameter d1 <d2), increase in cost for preparing the collet tip shape individually corresponding to the arrangement of bump pad 40, limit of processing accuracy, and improvement of alignment accuracy of suction collet 100 Problems occur.

  Therefore, when the semiconductor chip 400 (having the through electrode 42) with the bump pad 40 having a high height directed toward the suction collet 100 as shown in FIG. 4 is sucked and transported, the back surface of the chip is suppressed with a strong adhesive sheet. It is necessary to implement measures such as strengthening the suction force.

  Note that, as an example of a pick-up collet for a semiconductor chip with bumps, there is the above-mentioned patent document 1, but it is not assumed that the gap is widened by a bump pad 40 having a high height, and the above-described problem of air ingress cannot be solved. It is done.

  Therefore, in the present invention, by creating a suction collet, even if it is a CoC semiconductor chip with unevenness due to a bump pad having a high height, there is little chip damage or suction mistake regardless of which chip surface is facing upward. The adsorption collet can be realized at low cost, and the mounting of the CoC type semiconductor device in which the orientation of the chip surface is often specified by the manufacturing conditions and functions is easily realized.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  In the embodiment of the present invention, a sticky material is disposed at the tip of the suction collet, brought into close contact with the surface of a semiconductor chip having large irregularities, and sucked and transported by an adhesive force. As the adhesive material, a material having heat resistance such as an adhesive sheet (for example, a magic resin sheet manufactured by Daisho Electronics Co., Ltd.) and capable of regenerating the adhesive force by washing is used.

  In the embodiment of the present invention, the semiconductor chip is adsorbed by the adhesive force of the collet tip, so that it is not necessary to closely contact the outer periphery of the collet tip with the semiconductor chip without a gap or to increase the suction force unlike vacuum suction. In addition, since the adhesive material can flexibly handle uneven structures, it can be a collet with a general shape without being affected by the placement, quantity, and height of bump pads with a high height. Cost can be reduced.

  As described above, according to the embodiments of the present invention, even a semiconductor chip having a large number of bump pads having a high height on one side can be attracted with less equipment stoppage due to chip damage or suction mistake, regardless of which side the bump pad faces. An adsorption collet for semiconductor chips can be realized at low cost.

  As described above, there are Patent Documents 2 to 4 as examples of an adsorption method using an adhesive, but Patent Documents 2 to 4 describe the feature of the present invention “adhesive material is arranged at the tip portion. “Adsorption collet” is not disclosed.

(First embodiment)
Next, with reference to FIGS. 5 and 6, the semiconductor chip adsorption collet according to the first embodiment of the present invention will be described.

  5A and 5B are diagrams showing the semiconductor chip adsorption collet according to the first embodiment of the present invention, in which FIG. 5A is a perspective view and FIG. 5B is a plan view of an adhesive sheet. FIG. 6 is a cross-sectional view of the D-D ′ portion at the tip of FIG.

  In the suction collet 500, a square-shaped adhesive sheet 50 (for example, a magic resin sheet made by Taisho Electronics) as shown in FIG. 5B is installed at the tip of the collet (60 in FIG. 6). Further, the suction collet 500 and the adhesive sheet 50 are installed through the ejector pin 51 in the vicinity of the central portion, and a semiconductor chip (having the through electrode 61 in FIG. 6) 52 sucked by pushing down the ejector pin 51. Is removed from the adhesive sheet 50 and placed at a predetermined position. It does not have an air suction mechanism for vacuum suction. On one surface of the semiconductor chip 52, a plurality of Cu bump pads 53 having a high height are provided.

  The adhesive sheet 50 is an adhesive multilayer sheet in which an adhesive resin resin is arranged on the surface layer, and a heat-resistant glass epoxy layer and an adhesive layer are constructed as lower layers, and has heat resistance to withstand reflow, and the sheet surface Even if it becomes dirty, the stickiness is restored by washing with neutral detergent or ethanol.

  In the first embodiment, the pressure-sensitive adhesive sheet 50 is cut into the shape shown in FIG. 5 (b) and attached to the suction collet tip 60 to be used regularly for cleaning or replacement of the tip sheet. Perform maintenance work.

  Next, the semiconductor chip suction collet 500 according to the first embodiment is incorporated in a die bonding semiconductor manufacturing apparatus (not shown), picks up a semiconductor chip from a semiconductor wafer, carries it, and installs it on a BGA substrate. explain.

  First, the suction collet 500 shown in FIG. 5 moves to the upper part of the semiconductor chip 52 on which the bump pad 53 having a high height is arranged upward, and the adhesive sheet 50 at the tip is sufficiently adhered to the bump pad 53. The suction collet 500 is pressed down and pressed. At this time, the ejector pin 51 is raised.

  As shown in FIG. 6, the adhesive sheet 50 adheres and holds the upper and upper peripheral portions of the top of the bump pad 53 while being deformed to wrap around the top of the bump pad 53. If the number of bump pads 53 is small or the pad arrangement is deflected to a specific location, the suction collet 500 is pushed down until a part or all of the adhesive sheet 50 is in direct contact with the semiconductor chip surface, and the semiconductor chip 52 is adhered. May be.

  Next, when the suction collet 500 is lifted, the semiconductor chip 52 having the through electrode 61 is lifted while being adhered, and is transported laterally to a predetermined position of a BGA substrate (not shown). After transporting to a predetermined position, the suction collet 500 is lowered and placed in close contact with the BGA substrate, and finally, the ejector pin 51 is pushed down to peel the semiconductor chip 52 from the suction collet 500, whereby the semiconductor chip 52 in the die bonding semiconductor manufacturing apparatus. Is completed.

(Second Embodiment)
Next, with reference to FIG. 7, an adsorption collet for a semiconductor chip according to a second embodiment of the present invention will be described.

  7A and 7B are views showing a semiconductor chip adsorption collet according to the second embodiment of the present invention, in which FIG. 7A is a perspective view and FIG. 7B is a plan view of an adhesive sheet.

  The structure shown in FIG. 7 as the second embodiment is a structure in which a plurality of ejector pins 70 are provided so that the adsorbed semiconductor chip 71 can be easily peeled off. There are five through holes 73 at the tip of the suction collet 700 and the adhesive sheet 72, and the pressure applied to one ejector pin 70 when the ejector pin 70 is peeled off from the suction collet 700 by pushing out the ejector pin 70 from five places. Weaken, reduce damage to the semiconductor chip 71 and improve stability.

  The arrangement of the ejector pins 70 is not limited to five and may be any number, and the ejector pins 70 may have a flat shape such as a rod shape instead of a rod shape. Alternatively, the ejector pin 70 may be peeled off by protruding from the inside of the adhesive sheet 72 in a conical shape or the like without protruding from the surface of the adhesive sheet 72. According to this structure, it is possible to prevent the surface of the semiconductor chip 71 from being damaged by the ejector pins 70.

(Third embodiment)
Next, with reference to FIG. 8, an adsorption collet for a semiconductor chip according to a third embodiment of the present invention will be described.

  FIGS. 8A and 8B are views showing an adsorption collet for a semiconductor chip according to the third embodiment of the present invention, where FIG. 8A is a perspective view and FIG. 8B is a plan view of an adhesive sheet.

  The structure shown in FIG. 8 as the third embodiment is a structure in which air is blown off by air blow instead of the ejector pin.

  The suction collet 800 has a rectangular adhesive sheet 80 as shown in FIG. Further, the suction collet 800 is provided with a through hole 81 near the center. The adhesive sheet 80 is provided with an air blow hole 82 near the center.

  Under such a configuration, the through holes 81 and the air blow holes 82 are blown out by air blow, whereby the adsorbed semiconductor chip 83 is peeled off from the adhesive sheet 80 and placed at a predetermined position.

  In this structure, since the ejector pins do not contact the semiconductor chip 83, the surface of the semiconductor chip 83 can be prevented from being damaged. Also, if the through-hole 81 is used not only for blowing out by air blow but also for the function of adsorbing, it becomes possible to reliably carry out the conveying function even if the adsorbing power is small due to both the adhesive and vacuum adsorbing functions, Chip damage can be prevented.

  According to the embodiment of the present invention, even if a CoC semiconductor chip is uneven due to a bump pad with a high height, an adsorption collet with less chip damage and adsorption mistakes can be reduced regardless of which chip surface faces upward. This can be realized at a low cost, and the mounting of a CoC type semiconductor device in which the orientation of the chip surface is often specified by the manufacturing conditions and functions can be easily realized.

  As mentioned above, although the invention made | formed by this inventor was demonstrated based on embodiment, it cannot be overemphasized that this invention is not limited to the said embodiment, and can be variously changed in the range which does not deviate from the summary. .

  In the present embodiment, the suction collet for a semiconductor chip having unevenness due to a bump pad having a high height has been described, but it may be used for a normal semiconductor chip having no unevenness.

  In the present embodiment, the suction collet that sucks and transports the semiconductor chip has been described. However, the transport target is not limited to the semiconductor chip, and may be a small printed board or a small electronic component with unevenness.

  Further, in the present embodiment, a magic resin sheet made by Daisho Electronics is used as the adhesive sheet, but an adhesive material made by another company may be used as long as the material has equivalent adhesiveness and flexibility.

DESCRIPTION OF SYMBOLS 10 Adsorption air 11 Adsorption hole 12 Semiconductor chip 20 Circuit formation surface 21 Other surface 22 Connection pad 30 Bump pad area 31 Circuit formation surface 32 Bump pad 33 Other surface 34 Bump pad 40 Bump pad 41 No bump pad area 42 Through electrode 43 Bump Pad 44 Circuit forming surface 51 Ejector pin 52 Semiconductor chip 53 Bump pad 60 Collet tip 61 Through electrode 70 Ejector pin 71 Semiconductor chip 72 Adhesive sheet 73 Through hole 80 Adhesive sheet 81 Through hole 82 Air blow hole 83 Semiconductor chip 100 Adsorption collet 200 Semiconductor chip 300 Semiconductor chip 500 Adsorption collet 700 Adsorption collet 800 Adsorption collet

Claims (11)

A transport jig for sucking and transporting a transport object,
A conveying jig, characterized in that an adhesive means for adsorbing the object to be conveyed is provided at the tip of the jig.   The transporting jig according to claim 1, wherein the adhesive unit is in close contact with a surface of the transport target object and sucks the transport target object with an adhesive force.   The transporting jig according to claim 2, wherein the adhesive means is made of a material having heat resistance and capable of regenerating the adhesive force by washing.   The said jig is provided with the removal means for removing the said conveyance target adsorbed by the said adhesion means from the said jig, The conveyance object of any one of Claim 1 to 3 characterized by the above-mentioned. Jigs.   The said removal means is an ejector pin which penetrates the said jig, The jig for conveyance of Claim 4 which removes the said attracted conveyance target object from the said jig by pushing down the said ejector pin.   The conveying jig according to claim 5, wherein a plurality of the ejector pins are provided. The detaching means is air blowing means for blowing out air,
The transporting jig according to claim 4, wherein the sucked transport target is removed from the jig by spraying the air on the sucked transport target.   The transport jig according to claim 7, wherein the jig is provided with a through hole, and the air is blown onto the transport object through the through hole.   A protrusion is provided on a surface of the transport object, and the adhesive means adsorbs the transport object by deforming so as to wrap at least a part of the protrusion. The transport jig according to any one of 8. The transport object is a semiconductor chip provided with a through electrode,
The transport jig according to claim 1, wherein a plurality of bump pads connected to the through electrode are provided on one surface of the semiconductor chip. The adhesive means is an adhesive sheet,
The pressure-sensitive adhesive sheet is a pressure-sensitive adhesive multilayer sheet configured by disposing an adhesive resin resin in a surface layer and disposing a heat-resistant glass epoxy layer or an adhesive layer in a lower layer. Item 11. The transport jig according to any one of Items 1 to 10.

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