JPWO2020027209A1 - Base material for jigs for transporting electronic components - Google Patents

Abstract

A base material for an electronic parts transporting jig used for an electronic parts transporting jig, which is provided with a resin adsorbing portion for adsorbing an electronic part, and the base material for the electronic parts transporting jig is the resin adsorption. The oxidation-treated plating comprises a metal plate used to support the portion and an oxidation-treated plating film formed on the metal plate and containing at least one element selected from Ni, Sn and P. The state ratio of Ni2O3 as Ni in the oxidized state in all Ni elements on the outermost surface of the film, or the state ratio of SnO2 as Sn in the oxidized state in all Sn elements on the outermost surface of the oxidation-treated plating film. Provided is a base material for a jig for transporting electronic parts, which is 1% or more.

Description

The present invention relates to a base material for an electronic component transporting jig, which is used for an electronic component transporting jig and includes a resin adsorbing portion for adsorbing the electronic component.

Conventionally, a transfer jig has been used as a jig for lifting a semiconductor chip and transporting it to a predetermined position. In such a transfer jig, the tip portion is brought into contact with the vicinity of the central portion of the semiconductor chip and the suction hole is evacuated, so that the semiconductor chip can be transported while being sucked.

On the other hand, in recent years, in order to realize multi-functionality and high speed of semiconductor chips and high-density mounting accompanying them, chip-on-chip technology has been developed in which through electrodes are formed in the chip and flip-chip mounting is performed by bump connection. be. A semiconductor chip having such a through electrode is provided with a bump pad for connection on the chip surface, but protrudes higher than the connection pad of a conventional semiconductor chip in order to join with the bump pad of the semiconductor chips stacked one above the other. In many cases, it has a structure that is similar to that of a semiconductor.

Therefore, a transport jig that transports using a vacuum state may not be suitable for transporting a semiconductor chip having such a through electrode, and as an alternative transport jig, an adhesive substance such as resin is used. An adsorption method has been proposed (see, for example, Patent Document 1). However, in the technique of Patent Document 1, the strength and hardness of the base material for supporting the resin for adsorption, and the adhesion to the resin have not been studied.

Japanese Unexamined Patent Publication No. 2010-287679

An object of the present invention is to provide a base material for a jig for transporting electronic components, which has high strength and hardness and exhibits appropriate adhesion strength to a resin constituting a resin adsorption portion for adsorbing electronic components. ..

As a result of diligent studies to achieve the above object, the present inventors have conducted a metal plate and this metal plate as a base material for a jig for transporting electronic parts, which is provided with a resin adsorption portion for adsorbing electronic parts. As Ni formed above and provided with an oxidation-treated plating film containing at least one element selected from Ni, Sn and P, and in an oxidized state among all Ni elements on the outermost surface of the oxidation-treated plating film. state ratio of Ni ₂ O _3, or the state ratio of SnO ₂ as Sn in the oxidation state in all Sn element in the outermost surface of the oxidized plating film, by using what is controlled to 1% or more , The present invention has been completed by finding that the above object can be achieved.

That is, according to the present invention, it is a base material for an electronic component transporting jig used for an electronic component transporting jig, which is provided with a resin adsorbing portion for adsorbing the electronic component.
The base material for the jig for transporting electronic components is used to support the resin adsorption portion.
A metal plate and an oxidation-treated plating film formed on the metal plate and containing at least one element selected from Ni, Sn and P are provided.
_{As the state ratio of Ni 2} O ₃ as Ni in the oxidized state in all Ni elements on the outermost surface of the oxidation-treated plating film, or as Sn in the oxidized state in all Sn elements on the outermost surface of the oxidation-treated plating film. A base material for a jig for transporting electronic parts is provided, wherein the state ratio of SnO _{2 is 1% or more.
It should be noted that the state ratio of Ni 2} O ₃ as Ni in the oxidized state in all Ni elements on the outermost surface of the oxidation-treated plating film, or the oxidized state in all Sn elements on the outermost surface of the oxidation-treated plating film. The state ratio of SnO ₂ as Sn is preferably more than 5%.

In the base material for the jig for transporting electronic components of the present invention, it is more preferable that the abundance ratio of the oxygen element on the outermost surface of the oxidation-treated plating film is 40 atom% or more.
Preferably, the oxidation-treated plating film is an oxidation-treated plating film containing at least Ni, and _{the state ratio of NiO and Ni 2} O ₃ in Ni on the outermost surface of the oxidation-treated plating film is "NiO: Ni". _{The ratio of "2} O ₃ " is preferably 11.0: 1.0 to 1.0: 99.0, more preferably 7.0: 1.8 to 23.8: 76.2, and even more preferably. Is 7.0: 1.8 to 27.4: 72.6.
Preferably, the oxidation-treated plating film is an oxidation-treated plating film containing at least a Ni-P alloy.
Preferably, the state ratio of the oxide of P in the oxidized state in all P elements in the oxidation-treated plating film is 21% or more.
Preferably, the thickness of the oxidation-treated plating film is 1 to 40 μm.
Preferably, the metal plate is an aluminum plate.
It is preferable that the base material for the jig for transporting electronic parts of the present invention further includes a zinc-containing base layer on the metal plate, and the oxidation-treated plating film is formed on the base layer.

Further, according to the present invention, there is provided an electronic component transporting jig provided with a resin adsorption portion for adsorbing electronic components on the base material for the electronic component transporting jig.

According to the present invention, a base material for a jig for transporting electronic components, which has high strength and hardness and exhibits appropriate adhesion strength to a resin constituting a resin adsorption portion for adsorbing electronic components, and such a base material. It is possible to provide a jig for transporting electronic components obtained by using a base material for a jig for transporting electronic components.

FIG. 1 is a cross-sectional view of a base material for a jig for transporting electronic components according to the present embodiment. FIG. 2 is a diagram showing a method of manufacturing a jig for transporting electronic components according to the present embodiment. FIG. 3 is a diagram showing a method of transporting electronic components using the jig for transporting electronic components according to the present embodiment.

FIG. 1 is a cross-sectional view showing the configuration of a base material 10 for a jig for transporting electronic components according to the present embodiment. As shown in FIG. 1, the base material 10 for the jig for transporting electronic components of the present embodiment has an oxidation-treated plating film 12 formed as the outermost layer on the metal plate 11. The oxidation-treated plating film 12 contains at least one element selected from Ni, Sn, and P, and has a _{state ratio of Ni 2} O ₃ as Ni in an oxidized state among all Ni elements on the outermost surface, or the outermost surface. _{The state ratio of SnO 2} as Sn in the oxidized state in all Sn elements in the above is 1% or more.

<Manufacturing method of jigs for transporting electronic parts>
First, before the base material 10 for the electronic component transporting jig 10 of the present embodiment is described in detail, the manufacture of the electronic component transporting jig obtained by using the base material 10 for the electronic component transporting jig 10 of the present embodiment. The method will be described with reference to FIG.

First, as shown in FIG. 2A, the base material 10 for the jig for transporting electronic components of the present embodiment (hereinafter, appropriately referred to as “base material 10”) is prepared. Next, as shown in FIG. 2B, a resin layer 20 made of an adsorption resin is formed. The resin layer 20 is formed on the surface side of the base material 10 on which the oxidation-treated plating film 12 (see FIG. 1) is formed.

Next, as shown in FIG. 2C, the shaping mold 30 having the plurality of cavities 31 is pressed against the resin layer 20 formed on the base material 10 and heated while applying pressure to the resin. The adsorption resin constituting the layer 20 is formed into a shape corresponding to the cavity 31, and as a result, as shown in FIG. 2D, a plurality of resin adsorption portions 21 made of the adsorption resin are formed on the base material 10. The formed electronic component transporting jig 40 is manufactured.

Regarding the electronic component transporting jig 40 thus obtained, from the viewpoint of further improving the transporting performance of the electronic component, the periphery of the region where the plurality of resin adsorption portions 21 are formed (that is, near the central portion). It is preferable to remove the unnecessary adsorption resin remaining in the above by peeling it from the base material 10 or the like.

Then, as shown in FIG. 3A, the electronic component transporting jig 40 manufactured in this manner is pressed against the plurality of electronic components 60 placed on the stocker 50 to form a plurality of resins. A plurality of electronic components 60 are attracted by the suction unit 21, and as shown in FIG. 3B, the plurality of electronic components 60 are conveyed onto a circuit board 70 for mounting the electronic components 60, and then the circuit board 70 is mounted. By being pressed onto, a plurality of electronic components 60 are used to mount on the circuit board 70.

The adsorption resin for forming the resin layer 20 is not particularly limited, but is polydimethylsiloxane (from the viewpoint of having appropriate adhesiveness, which makes it possible to more preferably transport electronic components. A silicone-based resin such as PDMS) can be used. In addition to polydimethylsiloxane, the silicone-based resin has a siloxane bond as the main skeleton and any one of a hydroxy group, an amine group, a methyl group, a carboxy group, and a ketone group as a functional group. Those containing can be preferably used.

Alternatively, a non-silicone resin may be used instead of the silicone resin, and examples of the non-silicon resin include a polyether resin and a polyester resin. Among these, the polyether resin is used. Suitable. The polyether resin preferably has an ether bond as a main skeleton and contains any one of a hydroxy group, an amine group, a methyl group, a carboxy group, and a ketone group as a functional group. Further, as the polyester-based resin, one having an ester bond as a main skeleton and containing any one of a hydroxy group, an amine group, a methyl group, a carboxy group, and a ketone group as a functional group is preferable. Is. Further, as the non-silicone resin, a urethane resin, a polylactic acid resin, or a fluororesin can also be used. The urethane-based resin, polylactic acid-based resin, and fluorine-based resin include, for example, any one of a urethane bond, an ester bond, an ether bond, and an amide bond as a main skeleton, and a hydroxy group as a functional group. , Amine group, methyl group, carboxy group, and ketone group are preferably used.

These adsorption resins may be either a curable resin (thermosetting resin or ultraviolet curable resin) or a thermoplastic resin. For example, when a thermosetting resin is used as the adsorption resin, in the step shown in FIG. 2C, a molding die 30 having a plurality of cavities 31 is formed on the base material 10. When it is pressed against the layer 20 and heated while applying pressure, it can be molded into a shape corresponding to the resin adsorption portion 21 and cured.

<Base material 10 for jigs for transporting electronic components>
As described above, the base material 10 for the electronic component transporting jig 10 of the present embodiment is used to obtain the electronic component transporting jig 40 as shown in FIGS. 2 (A) to 2 (D). Is. Specifically, the base material 10 for the jig for transporting electronic components of the present embodiment is used as a support base material for supporting the resin adsorption portion 21.

As shown in FIG. 1, the base material 10 for the jig for transporting electronic components of the present embodiment has an oxidation-treated plating film 12 formed as the outermost layer on the metal plate 11.

The metal plate 11 is not particularly limited, and examples thereof include a steel plate, a stainless steel plate, a copper plate, an aluminum plate, an aluminum alloy plate, and a nickel plate. Among these, a steel plate, an aluminum plate, or an aluminum alloy plate is preferable because of its low price. Further, an aluminum plate or an aluminum alloy plate is preferable from the viewpoint that the weight of the jig 40 for transporting electronic components can be reduced, and thus the energy required for transporting electronic components can be reduced. The thickness of the metal plate 11 is not particularly limited, but is preferably 0.3 to 2 mm, more preferably 0.5 to 0.8 mm from the viewpoint of handleability when transporting electronic components.

The oxidation-treated plating film 12 is a plating film formed on the metal plate 11, at least the surface of which is oxidation-treated, and constitutes the outermost layer of the base material 10. In the present embodiment, the oxidation-treated plating film 12 contains at least one element selected from Ni, Sn and P (preferably containing at least one element selected from Ni and Sn), and the most. _{State ratio of Ni 2} O ₃ as Ni in the oxidized state in all Ni elements on the surface (that is, an oxide in an oxidized state other than _{Ni 2} O ₃ such as Ni alone or Ni O, and an oxide other than Ni oxide _{The state ratio of Ni 2} O _{3 in} terms of Ni element to the total of Ni compound and Ni ₂ O _{3 ), or the state ratio of Sn O 2} as Sn in the oxidized state in all Sn elements on the outermost surface ( That is, the state ratio _{of SnO 2} in terms of Sn element to the total of _{Sn alone, an oxide in an oxidized state other than SnO 2} such as SnO, a Sn compound other than Sn oxide, and SnO _2). It is 1% or more.

According to the present embodiment, the oxidation-treated plating film 12 is formed on the metal plate 11 as the outermost layer, and the oxidation-treated plating film 12 has such a configuration, whereby the base material 10 for a jig for transporting electronic parts 10 is formed. Is high in strength and hardness, and can exhibit an appropriate adhesion strength to the adsorption resin constituting the resin adsorption portion 21. In particular, when manufacturing the electronic component transporting jig 40, the shaping mold 30 is placed on the base material 10 for the electronic component transporting jig 10 at a predetermined pressure as in the step shown in FIG. 2 (C). Therefore, it is required that the base material 10 for the jig for transporting electronic parts is effectively suppressed from being deformed, damaged, or damaged by pressing the shaping die 30. In addition, since the base material 10 for the jig for transporting electronic components supports the resin adsorption portion 21, it is excellent in adhesion to the adsorption resin constituting the resin adsorption portion 21, on the other hand. The unnecessary adsorption resin remaining in the portion other than the resin adsorption portion 21 (for example, the adsorption resin remaining around the region where the plurality of resin adsorption portions 21 are formed (that is, near the central portion)) Since it may be removed by peeling or the like, it is required that the adhesiveness is such that these can be appropriately removed (that is, the adhesive force is not too high). Further, if scratches occur in the process, there is a problem that the smoothness deteriorates and the transport performance deteriorates.

On the other hand, according to the present embodiment, the base material 10 for the jig for transporting electronic parts has the above-mentioned structure, so that the adsorbing resin has high strength and hardness and constitutes the resin adsorbing portion 21. On the other hand, it is possible to show an appropriate adhesion strength, thereby appropriately solving such a problem according to the present embodiment.

The oxidation-treated plating film 12 contains at least one element selected from Ni, Sn and P, and has a _{state ratio of Ni 2} O ₃ as Ni in an oxidized state among all Ni elements on the outermost surface, or the outermost surface. _{The state ratio of SnO 2} as Sn in the oxidized state in all Sn elements in the above may be 1% or more, but a silicone-based resin is used as the adsorption resin for forming the resin adsorption portion 21. When used, the state ratio of _{Ni 2} O _{3 or the state ratio of Sn O 2} is more preferably in the range of 1.75 to 72.6%, in the range of more than 5% and 72.6% or less. It is even more preferably in the range of 7.5 to 49.4%. When a polyether resin, a polyester resin, a fluorine resin, a urethane resin, or a polylactic acid resin is used as the adsorption resin for forming the resin adsorption portion 21, all Ni on the outermost surface is used. state ratio of _Ni 2 _{O 3} as Ni in an oxidized state during elements, or state ratio of SnO ₂ as Sn in the oxidation state in all Sn element in the outermost surface in the range of 7.5 to 100% It is more preferably in the range of 7.97 to 72.6%, further preferably in the range of 7.97 to 30%. _{If the state ratio of Ni 2} O ₃ as Ni in the oxidized state in all Ni elements on the _{outermost surface or the state ratio of SnO 2} as Sn in the oxidized state in all Sn elements on the outermost surface is too low, it is adsorbed. Adhesion to the resin is insufficient.

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Ni, it is oxidized from the viewpoint that it can exhibit more appropriate adhesion strength to the adsorption resin constituting the resin adsorption portion 21. in Ni of the outermost surface of the treated plated film, and NiO, state ratio of _Ni 2 _{O 3} is: a ratio of "NiO _Ni 2 _{O 3",} 11.0: 1.0 to 1.0: 99.0 It is preferably 7.0: 1.8 to 23.8: 76.2, more preferably 7.0: 1.8 to 27.4: 72.6. The state ratio of NiO and Ni ₂ O ₃ is determined by performing X-ray photoelectron spectroscopy (XPS) measurement on the surface of the oxidation-treated plating film 12, and determining the integrated value of the peak of Ni alone, the integrated value of the peak of NiO, and the integrated value of the peak of NiO. obtains an integration value of the peak of Ni ₂ O _3, from these, determining and calculating the state ratio of NiO and _Ni 2 _{O 3} in the total Ni element in the outermost surface, and NiO, the state ratio of _Ni 2 _{O 3} Can be done.

_{Further, the oxidation-treated plating film 12 has a state ratio of Ni 2} O ₃ as Ni in an oxidized state in all Ni elements on the _{outermost surface, or SnO 2} as Sn in an oxidized state in all Sn elements on the outermost surface. The state ratio may be in the above range, but the abundance ratio of the oxygen element on the outermost surface is preferably 40.0 atom% or more, more preferably 40.6 atom% or more, and further preferably 43.0 atom. % Or more. The upper limit of the abundance ratio of the oxygen element on the outermost surface is not particularly limited, but is preferably 53 atom% or less, more preferably 45 atom% or less. By setting the abundance ratio of the oxygen element on the outermost surface within the above range, the adhesion to the adsorption resin can be further enhanced. In the present embodiment, the abundance ratio of oxygen elements on the outermost surface of the oxidation-treated plating film 12 is determined by performing X-ray photoelectron spectroscopy (XPS) measurement on the surface of the oxidation-treated plating film 12 to form the oxidation-treated plating film 12. It can be obtained by obtaining the peak integrated value of each oxide and calculating the abundance ratio (atom%) of the oxygen element from the obtained peak integrated value.

Further, the oxidation-treated plating film 12 may further contain Zn in addition to at least one element selected from Ni, Sn and P. When the oxidation-treated plating film 12 is an oxidation-treated plating film further containing Zn, it is most suitable from the viewpoint that it can exhibit more appropriate adhesion strength to the adsorption resin constituting the resin adsorption portion 21. The state ratio of ZnO as Zn in the oxidized state in all Zn elements on the surface is preferably 19% or more. _{Further, the state ratio of ZnO 2} as Zn in the oxidized state in all Zn elements on the outermost surface is preferably 1% or more, more preferably 69% or more. The state ratio of ZnO to ZnO ₂ is the integrated value of the peak of Zn alone after X-ray photoelectron spectroscopy (XPS) measurement and X-ray photoelectron spectroscopy (XPS) measurement are performed on the surface of the oxidation-treated plating film 12. , the integral value of the peak of ZnO, and the integral value of the peak of ZnO ₂ determined, the state ratio of from calculates a state ratio of ZnO and ZnO ₂ in total Zn elements in the outermost surface, and ZnO, and ZnO ₂ Can be obtained.

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Sn, it is oxidized from the viewpoint that it can exhibit more appropriate adhesion strength to the adsorption resin constituting the resin adsorption portion 21. On the outermost surface of the treated plating film 12, the state ratio of SnO as Sn in the oxidized state in all Sn elements is preferably 19% or more. _{Further, the state ratio of SnO 2} as Sn in the oxidized state in all Sn elements on the outermost surface of the oxidation-treated plating film 12 is preferably 1% or more, more preferably 69% or more. And SnO, state ratio of SnO _2, for surface oxidation treatment plating film 12, subjected to X-ray photoelectron spectroscopy (XPS) measurements, and the integral value of the Sn single peak, and the integral value of SnO peak, SnO _{2 From these, the state ratios of SnO and SnO 2} in all Sn elements on the outermost surface can be calculated, and the state ratio of _{SnO and SnO 2 can be obtained.}

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least P, it is oxidized from the viewpoint that it can exhibit more appropriate adhesion strength to the adsorption resin constituting the resin adsorption portion 21. On the outermost surface of the treated plating film 12, the state ratio of the oxide of P in the oxidized state in all P elements is 21% or more, more preferably 24% or more. The upper limit of the state ratio of the oxide of P in the oxidized state in all P elements is not particularly limited, but is preferably 97% or less, and more preferably 60% or less. The state ratio of the oxide of P can be determined by X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above.

Further, the oxidation-treated plating film 12 can have a higher balance of strength, hardness, and adhesion to the adsorption resin constituting the resin adsorption portion 21, and moreover, the flatness of the surface of the oxidation-treated plating film 12 is further improved. It is more preferable that the oxidation-treated plating film contains at least a Ni-P alloy from the viewpoint that it can be enhanced and thereby transports finer electronic parts with high accuracy. In this case, oxidation _{The state ratio of NiO and Ni 2} O _{3 on} the outermost surface of the treated plating film 12 is the ratio of "NiO: Ni ₂ O ₃ ", which is 11.0: 1.0 to 1.0: 99.0. be. It is more preferably 7.0: 1.8 to 23.8: 76.2, and even more preferably 7.0: 1.8 to 27.4: 72.6. The state ratio of Ni O and Ni _{2 O 3} can be calculated from the result of X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above. The P content in the Ni-P alloy is preferably 1 to 13% by weight, more preferably 5 to 13% by weight, and even more preferably 8 to 13% by weight. The content ratio of P in the Ni-P alloy can be determined by X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above.

The thickness of the oxidation-treated plating film 12 is not particularly limited, but is preferably 1 to 40 μm, more preferably 1 to 1 from the viewpoint of making the strength and hardness of the base material 10 for the jig for transporting electronic components more sufficient. It is 20 μm, more preferably 1 to 10 μm, and even more preferably 5 to 10 μm.

The method for forming the oxidation-treated plating film 12 on the metal plate 11 is not particularly limited. For example, when the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Ni, it is on the metal plate 11. In addition, a method of performing an oxidation treatment on the Ni-plated film formed by performing Ni-plating can be mentioned. The method of oxidation treatment is not particularly limited, but a method of heat-treating the formed Ni plating film or a treatment of immersing the formed Ni plating film in _{a liquid such as hydrogen peroxide solution (H 2} O ₂ ) or hypochlorite is performed. Examples thereof include a method of performing steam treatment and a method of performing steam treatment. Moreover, these may be combined. The conditions for performing the heat treatment are not particularly limited, but the heat treatment temperature is preferably 130 to 300 ° C., and the heat treatment time is preferably 10 to 30 minutes. The conditions for the treatment of immersing in the hydrogen peroxide solution are not particularly limited, but the concentration of the hydrogen peroxide solution is preferably 1 to 35% by weight, more preferably 15 to 35% by weight, and the immersion temperature (peroxidation). The temperature of hydrogen peroxide) is preferably 25 to 90 ° C., more preferably 25 to 70 ° C., and the immersion time is preferably 20 seconds to 120 minutes, more preferably 20 seconds to 60 minutes. Further, the conditions in the steam treatment are not particularly limited, but are preferably 40 to 100% RH, more preferably 65 to 100% RH, and the steam temperature is preferably 40 to 120 ° C., more preferably 65 to 85. The temperature and treatment time are preferably 1 minute to 72 hours, more preferably 12 to 24 hours. When the oxidation-treated plating film 12 contains Ni and P (that is, when it contains a Ni-P alloy), Ni-P plating is performed to obtain a Ni-P alloy plating film. A method of heat-treating the Ni-P alloy plating film, a method of immersing the Ni-P alloy plating film in _{a liquid such as hydrogen peroxide solution (H 2} O ₂ ) or hypochlorite, and a steam treatment. The method of doing this can be mentioned. In this case, the conditions for the heat treatment, the treatment of immersing in hydrogen peroxide solution, and the steam treatment can be the same as described above.

Further, when the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Zn, or when it is an oxidation-treated plating film containing at least Sn, Zn plating or Sn is applied on the metal plate 11. Examples thereof include a method of performing an oxidation treatment on the Zn plating film and Sn plating film formed by plating. The method of oxidation treatment is not particularly limited, but is a method of heat-treating the formed Zn plating film and Sn plating film, a method of immersing in a liquid such as hydrogen peroxide solution, and a method of performing steam treatment. And so on. Moreover, these may be combined. The conditions for the heat treatment, the treatment of immersing in hydrogen peroxide solution, and the steam treatment can be the same as described above.

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least P, the metal plate 11 is subjected to Zn plating or Sn plating as necessary, and then phosphate is used. Then, a method of performing phosphate treatment and the like can be mentioned.

Further, in the present embodiment, the oxidation-treated plating film 12 may be provided directly on the metal plate 11, but from the viewpoint of forming the oxidation-treated plating film 12 well, the metal plate 11 may be formed in advance. After forming a base layer containing zinc as a base layer, it is preferable to form an oxidation-treated plating film 12 on the base layer containing zinc.

The method for forming the base layer containing zinc is not particularly limited, and examples thereof include a method in which the metal plate 11 is subjected to a degreasing treatment, and then etched or pickled as necessary and then subjected to zinc replacement plating. Be done. Zinc replacement plating is performed by performing a double zincate treatment through each step of a first zinc substitution treatment (1st zincate treatment), a zinc nitrate stripping treatment (dezincating treatment), and a second zinc substitution treatment (2nd zincate). .. In this case, a washing treatment is carried out after each step.

According to the base material 10 for the electronic component transporting jig of the present embodiment as described above, the strength and hardness are high, and the adhesive strength is appropriate for the adsorption resin constituting the resin adsorption portion 21. Therefore, it can be suitably used as a support base material for constructing a jig for transporting electronic components for transporting various electronic components, and in particular, it transports fine electronic components such as micro LEDs, capacitors, and semiconductor elements. It can be suitably used for a jig for transporting electronic parts.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.
The evaluation method of each characteristic is as follows.

<XPS measurement>
Oxidation-treated plating plates obtained in Examples and Comparative Examples (in Comparative Example 1, a plating plate not subjected to oxidation treatment, in Comparative Examples 3 and 4, an alumite-treated plate, each measurement and evaluation will be described below. The surface of the oxidation-treated plating film (in Comparative Examples 3 and 4, the alumite-treated surface, the same applies hereinafter in the description of each measurement and evaluation) formed on the surface of the X-ray photoelectron spectrometer (Albac). The peaks of Ni2p3 / 2, Sn3d5 / 2, P2p, and O1s were measured using Phi's model number: VersaProbeII).
The abundance ratio of oxygen element in all elements was measured after etching at 2 nm by argon sputtering, and calculated from the ratio of the O1s peak area to the total peak area of Ni2p3 / 2, Sn3d5 / 2, P2p, and O1s (total). The measurement results of the abundance ratio of the oxygen element in the element were carried out for Examples 7 and 8, Comparative Example 2 and Examples 9, 10, 16 to 18).
The ratio of the oxide of P was calculated from the ratio of the peak area of the oxide of P to the peak area of P2p by separating the peak of P2p into waveforms corresponding to each chemical state.
State ratio of NiO, and the state ratio of _Ni 2 _{O 3} is separated into a waveform corresponding peaks Ni2p3 / 2 to each chemical state, peak area corresponding to NiO occupying the peak area of Ni2p3 / 2, or, It was calculated from the ratio of the peak area corresponding to _{Ni 2} O _3.
The state ratio of SnO and the state ratio of SnO ₂ separate the peak of Sn3d5 / 2 into waveforms corresponding to each chemical state, and the peak area corresponding to SnO in the peak area of Sn3d5 / 2 or SnO ₂ It was calculated from the ratio of the peak area corresponding to.

<3-point bending test>
The oxidation-treated plating plates obtained in Examples and Comparative Examples are cut into a size of 50 mm × 50 mm, and two opposite sides of a sample having a size of 50 mm × 50 mm are formed by a pair of support members (support terminal diameter 2 mm, support width). It is placed in a state where it is supported by 40 mm) and floated above the reference surface. A three-point bending test was performed by applying a load of 60 N under the condition of 2 mm / min with the indenter of. Then, for the oxidation-treated plating plate before and after the three-point bending test, the change of the interference fringes is measured by using an optical interference fringe meter (product name "flatness tester (FT-M100P)", manufactured by Mizojiri Optical Co., Ltd.). It was observed and evaluated according to the following criteria. If no change in the interference fringes is observed before and after the three-point bending test, it can be judged that the bending strength is excellent, while if a change in the interference fringes is observed, it can be judged that the bending strength is inferior.
〇: No change in interference fringes is observed before and after the 3-point bending test.
X: Changes in interference fringes were observed before and after the 3-point bending test.

<Scratch test>
A hard alloy needle was placed vertically on the oxidation-treated plating film-forming surface of the oxidation-treated plating plates obtained in Examples and Comparative Examples, and a scratch test was performed with a load of 50 g / kgf applied to the laser. The scratch depth was measured with a microscope (“LEXT (OLS3500)” manufactured by Olympus Corporation). It can be judged that the shallower the scratch depth, the higher the hardness.
〇: Scratch depth is 1 μm or less ×: Scratch depth is over 1 μm

<Adsorption of adsorption resin>
Siccarol (manufactured by Asahi Group Foods Co., Ltd.) is applied to the adsorption resin layer of the oxidation-treated plating plate provided with the adsorption resin layer obtained in Examples and Comparative Examples, and the adsorption resin layer is 20 mm wide with a cutter. It was cut out and peeled off at a length of 20 mm from the end. Gum tape (manufactured by Nitto Denko CS System Co., Ltd., "Super Cloth Tape No. 757 Super") is attached to both sides of the peeled part, and 180 ° direction is used using the Tencilon universal material testing machine RTC-1350A (manufactured by Orientec Co., Ltd.). In addition, the peel strength (peeling load) of the adsorption resin layer was measured at a speed of 50 mm / min. The higher the peel strength value, the higher the adhesion between the oxidation-treated plating plate and the adsorption resin layer. From the viewpoint of adhesion to the adsorption resin layer, it is desirable that the peel strength value is 0.35 N / 20 mm or more, and as described above, it is unnecessary in the manufacturing process of the electronic component transporting jig. Since the adsorption resin may be peeled off, it is desirable that the peel strength value is 2N / 20 mm or less from the viewpoint of peelability when peeling off such an unnecessary adsorption resin.

<< Example 1 >>
An aluminum plate (Al # 5000) having a thickness of 0.68 mm was prepared. Then, the prepared aluminum plate is degreased, and each pretreatment of etching, de-smut, 1st ginkate, dejinkate, and 2nd ginkate is performed in this order, and after washing with water between each step, a Ni-P plating bath (known). A 10 μm-thick Ni-P alloy plating layer (P content: 12.0-12. 5% by weight) was formed. Next, the aluminum plate on which the Ni-P alloy plating layer was formed _{was oxidized by immersing it in a 30% by weight H 2} O ₂ aqueous solution under the conditions of a dipping temperature of 25 ° C. and a dipping time of 30 minutes. An oxidation-treated plating plate having a thickness of 10 μm formed through the base layer containing zinc was obtained. Then, with respect to the obtained oxidation-treated plating plate, according to the above method, from the results of XPS measurement, the abundance ratio of oxygen element in all elements, the state ratio of P oxide, the state ratio of NiO, and Ni ₂ O ₃ In addition to calculating the state ratio of, a three-point bending test and a scratching test were performed. The results are shown in Table 1.

Next, a layer made of a non-silicone resin (polyether resin) was formed as an adsorption resin on the surface of the oxidation-treated plating plate obtained above on which the oxidation-treated plating layer was formed, and the temperature was 110 ° C. A non-silicone resin layer (adsorption resin layer) having a thickness of 100 μm was formed on the oxidation-treated plating plate by curing the non-silicone resin by heating under the condition of 10 minutes. Then, the peel strength of the oxidation-treated plating plate provided with the non-silicone resin layer was measured according to the above method. The results are shown in Table 1.

<< Examples 2 to 7 >>
Oxidation-treated plating plate provided with an oxidation-treated plating plate and a non-silicone-based resin layer in the same manner as in Example 1 except that the conditions for oxidation treatment using the H ₂ O _{2 aqueous solution were changed to the conditions shown in Table 1.} Was manufactured and evaluated in the same manner. The results are shown in Table 1.

<< Example 8 >>
A steel plate obtained by annealing a cold-rolled plate (thickness 0.25 mm) of low-carbon aluminum killed steel was prepared. Then, the prepared steel sheet is degreased, washed with water, pickled, and washed with water, and then a steel sheet having a tin-plated layer formed is obtained under the following plating conditions using the following tin plating bath, and sodium hydroxide (sodium hydroxide) ( It was oxidized by immersing it in a 6 wt% sodium hypochlorite (NaClO) aqueous solution adjusted to pH 13 with NaOH) under the conditions of an immersion temperature of 70 ° C. and an immersion time of 20 minutes. An oxidation-treated plating plate having a 0.0 μm oxidation-treated plating film formed was obtained. Then, the obtained oxidation-treated plating plate was evaluated in the same manner as in Example 1, and the obtained oxidation-treated plating plate was used to manufacture an oxidation-treated plating plate provided with a non-silicone resin layer. Was evaluated. The results are shown in Table 1.
<Tin plating bath and tin plating conditions>
Stannous sulfate 80g / L
Phenolic sulfonic acid 60g / L
Bath temperature 40 ℃
Current density 10A / dm ²

<< Comparative Example 1 >>
A plated plate and a plated plate provided with a non-silicone resin layer were produced in the same manner as in Example 1 except that the oxidation treatment using the _{H 2} O _{2 aqueous solution was not performed, and the evaluation was performed in the same manner.} The results are shown in Table 1.

<< Comparative Example 2 >>
A base-treated plating plate and a non-silicone-based resin layer are provided in the same manner as in Example 1 except that the base treatment using an aqueous sodium hydroxide solution is performed instead of the oxidation treatment using the aqueous _{H 2} O _{2 solution.} A base-treated plating plate was manufactured and evaluated in the same manner. The base treatment using the sodium hydroxide aqueous solution was carried out under the conditions of 95 ° C. and 30 minutes using a sodium hydroxide aqueous solution having a pH of 12. The results are shown in Table 1.

<< Comparative Example 3 >>
An aluminum plate (Al # 5000) having a thickness of 0.5 mm was prepared. Then, the prepared aluminum plate was degreased, washed with water, and then anodized to obtain an alumite-treated plate. Then, the obtained alumite-treated plate was used for evaluation in the same manner as in Example 1, and the obtained alumite-treated plate was used to manufacture an alumite-treated plate having a non-silicone resin layer, and similarly. Evaluation was performed. The results are shown in Table 1.

なお、表１中において、「各元素のめっき皮膜最表面の酸化状態割合」は、各元素中における、酸化物の割合を示す（表２においても同様。）。すなわち、たとえば、「ＮｉＯ」、「Ｎｉ_２Ｏ_３」であれば、最表面における全Ｎｉの化学状態（Ｎｉ単体、Ｎｉ酸化物、Ｎｉ酸化物以外のＮｉ化合物）を１００％とした場合における、「ＮｉＯ」の状態のＮｉ、または、「Ｎｉ_２Ｏ_３」の状態のＮｉの占める割合を示す（たとえば、実施例１では、「ＮｉＯ」の状態、および「Ｎｉ_２Ｏ_３」の状態以外の状態のＮｉが、８０．２０％の割合で存在していることとなる。）。また、「Ｐの酸化物」であれば、最表面における全Ｐの化学状態（Ｐ単体、Ｐ酸化物、Ｐ酸化物以外のＰ化合物）を１００％とした場合における、「Ｐの酸化物」の状態のＰの占める割合を示し、「ＳｎＯ」、「ＳｎＯ_２」であれば、最表面における全Ｓｎの化学状態（Ｓｎ単体、Ｓｎ酸化物、Ｓｎ酸化物以外のＳｎ化合物）を１００％とした場合における、「ＳｎＯ」の状態のＳｎ、または、「ＳｎＯ_２」の状態のＳｎの占める割合を示す。

In Table 1, "ratio of oxidation state on the outermost surface of the plating film of each element" indicates the ratio of oxides in each element (the same applies to Table 2). That is, for example, in the case of "Ni O _{" and "Ni 2 O 3} ", when the chemical state of all Ni on the outermost surface (Ni simple substance, Ni oxide, Ni compound other than Ni oxide) is 100%, Ni in the state of "NiO", or shows a ratio of Ni in the state of _"Ni 2 _{O 3"} (e.g., in example 1, the state of "NiO", and other than the state of _"Ni 2 _{O 3"} Ni in the state is present at a rate of 80.20%). Further, in the case of "P oxide", "P oxide" when the chemical state of all P on the outermost surface (P simple substance, P oxide, P compound other than P oxide) is 100%. Indicates the proportion of P in the state of _{, and if it is "SnO" or "SnO 2} ", the chemical state of all Sn on the outermost surface (Sn alone, Sn oxide, Sn compound other than Sn oxide) is 100%. In this case, the ratio of Sn in the "SnO" state or Sn in the "SnO ₂ " state is shown.

As shown in Table 1, it has an oxidation-treated plating film containing at least one element selected from Ni, Sn and P, and is in an oxidized state in all Ni elements on the outermost surface of the oxidation-treated plating film. state ratio of Ni ₂ O ₃ as Ni, or when the state ratio of SnO ₂ as Sn in the oxidation state in all Sn element in the outermost surface is more than 1%, strength by three-point bending test, and The hardness of the scratch test was excellent, and the adhesion (peel strength) to the adsorption resin was also within an appropriate range, which was a good result (Examples 1 to 8).
On the other hand, even when an oxidation-treated plating film containing at least one element selected from Ni, Sn and P is provided, Ni _{2 as Ni in an oxidized state among all Ni elements on the outermost surface of the oxidation-treated plating film.} When _{the state ratio of O 3 or the state ratio of Sn O 2} as Sn in the oxidized state in all Sn elements on the outermost surface is less than 1%, the adhesion to the adsorption resin is insufficient (comparison). Examples 1 and 2), and when alumite treatment is performed instead of the oxidation-treated plating film containing at least one element selected from Ni, Sn and P, the strength and scratches obtained by the three-point bending test. The result was that the hardness by the attachment test was low, and the adhesion (peel strength) to the adsorption resin was too high (Comparative Example 3).

<< Example 9 >>
An aluminum plate (Al # 5000) having a thickness of 0.68 mm was prepared. Then, the prepared aluminum plate is degreased, and each pretreatment of etching, de-smut, 1st ginkate, dejinkate, and 2nd ginkate is performed in this order, and after washing with water between each step, a Ni-P plating bath (known). A 10 μm-thick Ni-P alloy plating layer (P content: 12.0 to 12.5) on a substrate by electroless plating using an electroless Ni-P plating bath based on malic acid-succinic acid. By weight%) was formed. Then, the aluminum plate to form a Ni-P alloy plating layer, a 15 wt% aqueous H ₂ O ₂ solution, the immersion temperature 70 ° C., subjected to oxidation treatment by immersing in the conditions of immersion time 10 minutes, on aluminum An oxidation-treated plating plate having a thickness of 10 μm formed through the base layer containing zinc was obtained. Then, with respect to the obtained oxidation-treated plating plate, according to the above method, from the results of XPS measurement, the abundance ratio of oxygen element in all elements, the state ratio of P oxide, the state ratio of NiO, and Ni ₂ O ₃ In addition to calculating the state ratio of, a three-point bending test and a scratching test were performed. The results are shown in Table 2.

Next, a layer made of dimethylsiloxane (DMS) was formed as an adsorption resin on the surface of the oxidation-treated plating plate obtained above on which the oxidation-treated plating layer was formed, and the temperature was 85 ° C. for 10 minutes. By curing the layer made of dimethylsiloxane (DMS) by heating, a 100 μm-thick polydimethylsiloxane (PDMS) layer (adsorption resin layer) was formed on the oxidation-treated plating plate. Then, the peel strength of the oxidation-treated plating plate provided with the PDMS layer was measured according to the above method. The results are shown in Table 2.

<< Examples 10 to 17 >>
An oxidation-treated plating plate and an oxidation-treated plating plate provided with a PDMS layer were produced in the same manner as in Example 9 except that the conditions for the oxidation treatment using the H ₂ O _{2 aqueous solution were changed to the conditions shown in Table 2.} , The same evaluation was performed. The results are shown in Table 2.

<< Example 18 >>
A steel plate obtained by annealing a cold-rolled plate (thickness 0.25 mm) of low-carbon aluminum killed steel was prepared. Then, the prepared steel sheet is degreased, washed with water, pickled, and washed with water, and then a steel sheet having a tin-plated layer formed under the following plating conditions is obtained using the following tin plating bath, and 6% by weight is obtained. Oxidation treatment is performed by immersing in an aqueous sodium hypochlorite solution (NaClO) under the conditions of an immersion temperature of 70 ° C. and an immersion time of 20 minutes, and an oxidation-treated plating film having a thickness of 1.0 μm is formed on the steel sheet. An oxidation-treated plating plate was obtained. Then, the obtained oxidation-treated plating plate is used for evaluation in the same manner as in Example 9, and the obtained oxidation-treated plating plate is used to manufacture an oxidation-treated plating plate provided with a PDMS layer, and the same evaluation is performed. went. The results are shown in Table 2.
<Tin plating bath and tin plating conditions>
Stannous sulfate 80g / L
Phenolic sulfonic acid 60g / L
Bath temperature 40 ℃
Current density 10A / dm ²

<< Comparative Example 4 >>
An aluminum plate (Al # 5000) having a thickness of 0.68 mm was prepared. Then, the prepared aluminum plate was degreased, washed with water, and then anodized to obtain an alumite-treated plate. Then, the obtained alumite-treated plate is used for evaluation in the same manner as in Example 10, and the obtained alumite-treated plate is used to manufacture an alumite-treated plate having a PDMS layer and evaluated in the same manner. rice field. The results are shown in Table 2.

As shown in Table 2, it has an oxidation-treated plating film containing at least one element selected from Ni, Sn and P, and is in an oxidized state in all Ni elements on the outermost surface of the oxidation-treated plating film. state ratio of Ni ₂ O ₃ as Ni, or when the state ratio of SnO ₂ as Sn in the oxidation state in all Sn element in the outermost surface is more than 1%, strength by three-point bending test, and The hardness of the scratch test was excellent, and the adhesion (peel strength) to the adsorption resin was also within an appropriate range, which was a good result (Examples 9 to 18).
On the other hand, when an alumite treatment was performed instead of the oxidation-treated plating film containing at least one element selected from Ni, Sn and P, the adhesion (peel strength) to the adsorption resin was good. However, the results of the three-point bending test and the hardness of the scratch test were low (Comparative Example 4).

10 ... Base material for jigs for transporting electronic components 11 ... Metal plate 12 ... Oxidation-treated plating film 20 ... Resin layer 21 ... Resin adsorption part 30 ... Molding mold 31 ... Cavity 40 ... Jig for transporting electronic components 50 ... Stocker 60 ... Electronic components 70 ... Circuit board

Claims (9)

A base material for an electronic component transporting jig, which is used for an electronic component transporting jig and has a resin adsorption part for adsorbing electronic components.
The base material for the jig for transporting electronic components is used to support the resin adsorption portion.
A metal plate and an oxidation-treated plating film formed on the metal plate and containing at least one element selected from Ni, Sn and P are provided.
_{As the state ratio of Ni 2} O ₃ as Ni in the oxidized state in all Ni elements on the outermost surface of the oxidation-treated plating film, or as Sn in the oxidized state in all Sn elements on the outermost surface of the oxidation-treated plating film. A base material for a jig for transporting electronic parts, wherein the state ratio of SnO _{2 is 1% or more.} The base material for a jig for transporting electronic components according to claim 1, wherein the presence ratio of an oxygen element on the outermost surface of the oxidation-treated plating film is 40 atom% or more. The oxidation-treated plating film is an oxidation-treated plating film containing at least Ni, and _{the state ratio of NiO and Ni 2} O ₃ in Ni on the outermost surface of the oxidation-treated plating film is "NiO: Ni ₂ O _3". The base material for a jig for transporting electronic parts according to claim 1 or 2, wherein the ratio is 11.0: 1.0 to 1.0: 99.0. The base material for a jig for transporting electronic components according to any one of claims 1 to 3, wherein the oxidation-treated plating film is an oxidation-treated plating film containing at least a Ni-P alloy. The base material for a jig for transporting electronic parts according to any one of claims 1 to 4, wherein the state ratio of the oxide of P in the oxidized state in all P elements in the oxidation-treated plating film is 21% or more. .. The base material for a jig for transporting electronic components according to any one of claims 1 to 5, wherein the thickness of the oxidation-treated plating film is 1 to 40 μm. The base material for a jig for transporting electronic components according to any one of claims 1 to 6, wherein the metal plate is an aluminum plate. A zinc-containing base layer is further provided on the metal plate, and the metal plate is further provided with a zinc-containing base layer.
The base material for a jig for transporting electronic components according to any one of claims 1 to 7, wherein the oxidation-treated plating film is formed on the base layer. A jig for transporting electronic components, which comprises a resin suction portion for adsorbing electronic components on a base material for the jig for transporting electronic components according to any one of claims 1 to 8.

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