TW202015908A - Base material for electronic parts transport jig - Google Patents
Base material for electronic parts transport jig Download PDFInfo
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- TW202015908A TW202015908A TW108127377A TW108127377A TW202015908A TW 202015908 A TW202015908 A TW 202015908A TW 108127377 A TW108127377 A TW 108127377A TW 108127377 A TW108127377 A TW 108127377A TW 202015908 A TW202015908 A TW 202015908A
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/68—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous solutions with pH between 6 and 8
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/28—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases more than one element being applied in one step
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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Abstract
Description
本發明係有關於一種使用於具備供吸附電子零件之樹脂吸附部之電子零件搬送用機架的用於電子零件搬送用機架的基材。The present invention relates to a base material for a rack for conveying electronic parts used in a rack for conveying electronic parts provided with a resin suction part for sucking electronic parts.
以往作為用於將半導體晶片往上抬並搬送至既定位置之機架,係使用搬送用機架。在此種搬送用機架中,藉由使其前端部接觸半導體晶片中央部附近,並使吸附孔呈真空狀態,可一邊吸附半導體晶片一邊予以搬送。Conventionally, as a rack for lifting up and transporting semiconductor wafers to a predetermined position, a rack for transport has been used. In such a conveyance rack, by bringing the front end portion into contact with the vicinity of the central portion of the semiconductor wafer and making the suction hole in a vacuum state, the semiconductor wafer can be conveyed while being suctioned.
另一方面,近年來為了實現半導體晶片的多機能・高速化及隨之而生的高密度安裝化,而持續開發在晶片內形成貫通電極並藉由凸塊連接進行覆晶安裝的晶片疊晶片技術。具有此種貫通電極的半導體晶片係於晶片表面具備連接用隆起電極壁;為了與上下層合之半導體晶片的隆起電極壁接合,而經常採用比習知半導體晶片之連接墊片更高地突出之構造。On the other hand, in recent years, in order to realize the multi-function and high speed of semiconductor wafers and the accompanying high-density mounting, there has been continuous development of chip stacked wafers in which through electrodes are formed in the wafer and flip chip mounting is performed by bump connection technology. A semiconductor wafer having such a through electrode is provided with a bump electrode wall for connection on the surface of the wafer; in order to be bonded to the bump electrode wall of a semiconductor wafer laminated on top and bottom, a structure protruding higher than the connection pad of a conventional semiconductor wafer is often adopted .
因此,利用真空狀態來進行搬送的搬送用機架有時非適用於具有此種貫通電極之半導體晶片的搬送,作為替代其之搬送機架,有人提出利用樹脂等黏著物之吸附方式(例如參照專利文獻1)。然而,此專利文獻1之技術中,並未針對供支持吸附用之樹脂之基材的強度或硬度,甚而與樹脂的密接性加以研究。 [先前技術文獻] [專利文獻]Therefore, the transport rack for transporting in a vacuum state is sometimes not suitable for the transport of semiconductor wafers having such through electrodes. As an alternative to the transport rack, it has been proposed to use an adsorption method such as resin (for example, refer to Patent Literature 1). However, the technique of this Patent Document 1 does not study the strength or hardness of the base material of the resin supporting the adsorption, or even the adhesion with the resin. [Prior Technical Literature] [Patent Literature]
[專利文獻1] 日本特開2010-287679號公報[Patent Document 1] Japanese Patent Application Publication No. 2010-287679
[發明所欲解決之課題][Problems to be solved by the invention]
本發明目的在於提供一種強度及硬度高,且對於構成供吸附電子零件之樹脂吸附部的樹脂顯示適當的密接強度之用於電子零件搬送用機架的基材。 [解決課題之手段]An object of the present invention is to provide a base material for a rack for transporting electronic parts that has high strength and hardness and exhibits an appropriate adhesion strength to the resin constituting the resin suction portion for sucking electronic parts. [Means to solve the problem]
本案發明人等為達成上述目的而致力進行研究的結果發現,作為用於具備供吸附電子零件之樹脂吸附部之電子零件搬送用機架的基材,透過使用具備:金屬板,及形成於此金屬板上且包含選自Ni、Sn及P之至少1種元素的氧化處理鍍敷皮膜,並將氧化處理鍍敷皮膜的最表面之全部Ni元素中作為Ni氧化狀態之Ni2 O3 的狀態比例,或前述氧化處理鍍敷皮膜的最表面之全部Sn元素中作為Sn氧化狀態之SnO2 的狀態比例控制成1%以上者,可達成上述目的,終至完成本發明。The inventors of the present case have made intensive studies to achieve the above-mentioned object and found that as a base material for an electronic parts conveying rack provided with a resin adsorption part for adsorbing electronic parts, by using: a metal plate, and formed here The state of Ni 2 O 3 on the metal plate and containing at least one element selected from Ni, Sn, and P by an oxidation treatment plating film, and all the Ni elements on the outermost surface of the oxidation treatment plating film as Ni oxidation state The ratio, or the state ratio of SnO 2 as the Sn oxidation state among all the Sn elements on the outermost surface of the oxidation-plated coating film is controlled to 1% or more, the above-mentioned object can be achieved, and finally the present invention is completed.
亦即,根據本發明,可提供一種用於電子零件搬送用機架的基材,其係使用於具備供吸附電子零件之樹脂吸附部之電子零件搬送用機架的用於電子零件搬送用機架的基材,其中, 前述用於電子零件搬送用機架的基材係用以支持前述樹脂吸附部, 且具備:金屬板,及形成於前述金屬板上且包含選自Ni、Sn及P之至少1種元素的氧化處理鍍敷皮膜; 前述氧化處理鍍敷皮膜的最表面之全部Ni元素中作為Ni氧化狀態之Ni2 O3 的狀態比例,或前述氧化處理鍍敷皮膜的最表面之全部Sn元素中作為Sn氧化狀態之SnO2 的狀態比例為1%以上。 此外,前述氧化處理鍍敷皮膜的最表面之全部Ni元素中作為Ni氧化狀態之Ni2 O3 的狀態比例,或前述氧化處理鍍敷皮膜的最表面之全部Sn元素中作為Sn氧化狀態之SnO2 的狀態比例較佳為超過5%。That is, according to the present invention, it is possible to provide a base material for a rack for transporting electronic parts, which is a machine for transporting electronic parts used in a rack for transporting electronic parts provided with a resin suction part for sucking electronic parts The base material of the rack, wherein the base material for the electronic component conveying rack is used to support the resin adsorption portion, and is provided with: a metal plate formed on the metal plate and containing Ni, Sn and P The oxidation treatment plating film of at least one element; the proportion of the state of Ni 2 O 3 as the Ni oxidation state among all the Ni elements on the outermost surface of the oxidation treatment plating film, or the outermost surface of the oxidation treatment plating film The proportion of SnO 2 in the Sn oxidation state among all Sn elements is 1% or more. In addition, the state ratio of Ni 2 O 3 as the Ni oxidation state among all the Ni elements on the outermost surface of the oxidation-treated plating film, or SnO as the Sn oxidation state among all the Sn elements on the outermost surface of the oxidation-treated plating film The state ratio of 2 is preferably more than 5%.
本發明之用於電子零件搬送用機架的基材中,前述氧化處理鍍敷皮膜的最表面之氧元素的存在比例更佳為40atom%以上。 較佳的是,前述氧化處理鍍敷皮膜為至少含有Ni的氧化處理鍍敷皮膜,前述氧化處理鍍敷皮膜的最表面之Ni的NiO與Ni2 O3 的狀態比,以「NiO:Ni2 O3 」之比計較佳為11.0:1.0~1.0:99.0,更佳為7.0:1.8~23.8:76.2,再更佳為7.0:1.8~27.4:72.6。 較佳的是,前述氧化處理鍍敷皮膜為至少含有Ni-P合金的氧化處理鍍敷皮膜。 較佳的是,前述氧化處理鍍敷皮膜中之全部P元素中處於氧化狀態之P的氧化物的狀態比例為21%以上。 較佳的是,前述氧化處理鍍敷皮膜的厚度為1~40μm。 較佳的是,前述金屬板為鋁板。 本發明之用於電子零件搬送用機架的基材係以在前述金屬板上進一步具備含有鋅的基底層,且前述氧化處理鍍敷皮膜係形成於前述基底層上為佳。In the base material for the rack for conveying electronic parts of the present invention, the presence ratio of the oxygen element on the outermost surface of the oxidation treatment plating film is more preferably 40 atom% or more. Preferably, the oxidation-treated plating film is an oxidation-treated plating film containing at least Ni, and the state ratio of NiO and Ni 2 O 3 on the outermost surface of the oxidation-treated plating film is "NiO:Ni 2 The ratio of "O 3 "is preferably 11.0:1.0~1.0:99.0, more preferably 7.0:1.8~23.8:76.2, and even more preferably 7.0:1.8~27.4:72.6. Preferably, the oxidation-treated plating film is an oxidation-treated plating film containing at least a Ni-P alloy. Preferably, the state ratio of oxides of P in an oxidized state among all the P elements in the oxidation-treated plating film is 21% or more. Preferably, the thickness of the aforementioned oxidation-treated plating film is 1 to 40 μm. Preferably, the aforementioned metal plate is an aluminum plate. It is preferable that the base material for the rack for conveying electronic parts of the present invention further includes a base layer containing zinc on the metal plate, and the oxidation treatment plating film is formed on the base layer.
又,根據本發明,可提供一種電子零件搬送用機架,其係在上述之用於電子零件搬送用機架的基材上具備供吸附電子零件的樹脂吸附部。 [發明之效果]In addition, according to the present invention, it is possible to provide a rack for conveying electronic parts, which is provided with a resin suction part for sucking electronic parts on the base material of the rack for conveying electronic parts described above. [Effect of invention]
根據本發明,可提供一種強度及硬度高,且對於構成供吸附電子零件之樹脂吸附部的樹脂顯示適當的密接強度之用於電子零件搬送用機架的基材,以及使用此種用於電子零件搬送用機架的基材所得之電子零件搬送用機架。According to the present invention, it is possible to provide a base material for a rack for transporting electronic parts, which has high strength and hardness, and exhibits an appropriate adhesion strength to the resin constituting the resin suction portion for sucking electronic parts, and uses such A rack for transferring electronic parts obtained from the base material of the rack for transferring parts.
圖1為表示本實施形態之用於電子零件搬送用機架的基材10的構造的剖面圖。如圖1所示,本實施形態之用於電子零件搬送用機架的基材10係於金屬板11上形成有作為最表層之氧化處理鍍敷皮膜12而成。氧化處理鍍敷皮膜12係包含選自Ni、Sn及P之至少1種元素,最表面之全部Ni元素中作為Ni氧化狀態之Ni2
O3
的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2
的狀態比例為1%以上。FIG. 1 is a cross-sectional view showing the structure of a
<電子零件搬送用機架的製造方法>
首先,在對本實施形態之用於電子零件搬送用機架的基材10詳細加以說明前,茲參照圖2來說明使用本實施形態之用於電子零件搬送用機架的基材10所得之電子零件搬送用機架的製造方法。<Manufacturing method of rack for conveying electronic parts>
First, before describing in detail the
首先,如圖2(A)所示,準備本實施形態之用於電子零件搬送用機架的基材10(以下方便上稱為「基材10」)。其次,如圖2(B)所示,形成由吸附用樹脂所構成的樹脂層20。樹脂層20係形成於基材10之形成有氧化處理鍍敷皮膜12(參照圖1)的一面側。First, as shown in FIG. 2(A), the base material 10 (hereinafter referred to as the "
其次,如圖2(C)所示,藉由將具有多個模穴31的成形用模具30按壓於形成於基材10上的樹脂層20並一邊施加壓力一邊加熱,而將構成樹脂層20之吸附用樹脂成形為對應模穴31之形狀;藉此,便如圖2(D)所示製成在基材10上形成有多個由吸附用樹脂所構成之樹脂吸附部21而成的電子零件搬送用機架40。Next, as shown in FIG. 2(C), the
此外,就如此所得之電子零件搬送用機架40,基於進一步提高電子零件的搬送性能之觀點,對於殘留於形成有多個樹脂吸附部21之區域(亦即中央部附近)的周圍之多餘的吸附用樹脂,係以予以從基材10剝離等而去除為宜。In addition, from the viewpoint of further improving the transport performance of the electronic parts, the
然後,如此製造之電子零件搬送用機架40係如圖3(A)所示,藉由對載置於貯存區50的多個電子零件60予以按壓,而藉由多個樹脂吸附部21吸附多個電子零件60,並如圖3(B)所示,將多個電子零件60搬送至用來安裝該電子零件的電路基板70上,接著,透過予以按壓於電路基板70上,而將多個電子零件60安裝於電路基板70上而使用。Then, as shown in FIG. 3(A), the
作為供形成樹脂層20之吸附用樹脂,不特別限定,基於具有適當的黏著性,由此可更合宜地進行電子零件的搬送之觀點,可使用聚二甲基矽氧烷(PDMS)等聚矽氧系樹脂。作為聚矽氧系樹脂,除聚二甲基矽氧烷以外,亦可較佳使用具有矽氧烷鍵作為主骨架,且包含羥基、胺基、甲基、羧基及酮基之任一者作為官能基者。The adsorption resin for forming the
或者,亦可使用非聚矽氧系樹脂來替代聚矽氧系樹脂,作為非聚矽氧系樹脂,可舉出聚醚系樹脂或聚酯系樹脂等;此等當中,宜為聚醚系樹脂。作為聚醚系樹脂,宜為具有醚鍵作為主骨架,且包含羥基、胺基、甲基、羧基及酮基之任一者作為官能基者;又,作為聚酯系樹脂,宜為具有酯鍵作為主骨架,且包含羥基、胺基、甲基、羧基及酮基之任一者作為官能基者。再者,作為非聚矽氧系樹脂,亦可使用胺基甲酸酯系樹脂或聚乳酸系樹脂、氟系樹脂。作為胺基甲酸酯系樹脂、聚乳酸系樹脂及氟系樹脂,宜使用例如包含胺基甲酸酯鍵、酯鍵、醚鍵及醯胺鍵之任一者作為主骨架,且包含羥基、胺基、甲基、羧基及酮基之任一者作為官能基者。Alternatively, a non-polysiloxane-based resin may be used instead of the polysiloxane-based resin. As the non-polysiloxane-based resin, polyether-based resins or polyester-based resins may be cited. Among these, polyether-based resins are preferred Resin. As the polyether-based resin, those having an ether bond as the main skeleton and containing any one of a hydroxyl group, an amine group, a methyl group, a carboxyl group, and a ketone group as a functional group are preferred; and as a polyester-based resin, it is preferable to have an ester The bond serves as a main skeleton and includes any one of a hydroxyl group, an amine group, a methyl group, a carboxyl group, and a ketone group as a functional group. Furthermore, as the non-polysiloxane-based resin, urethane-based resin, polylactic acid-based resin, or fluorine-based resin can also be used. As the urethane-based resin, polylactic acid-based resin, and fluorine-based resin, for example, any one including a urethane bond, an ester bond, an ether bond, and an amide bond is preferably used as the main skeleton, and includes a hydroxyl group, Any one of an amine group, a methyl group, a carboxyl group, and a ketone group serves as a functional group.
此等吸附用樹脂可為硬化性樹脂(熱硬化性樹脂或紫外線硬化性樹脂)或者熱塑性樹脂任一種。例如,使用熱硬化性樹脂作為吸附用樹脂時,於圖2(C)所示步驟中,在將具有多個模穴31的成形用模具30按壓於形成於基材10上的樹脂層20並一邊施加壓力一邊加熱時,可成形為對應樹脂吸附部21之形狀並使其硬化。These adsorption resins may be either curable resin (thermosetting resin or ultraviolet curable resin) or thermoplastic resin. For example, when a thermosetting resin is used as the adsorption resin, in the step shown in FIG. 2(C), the
<用於電子零件搬送用機架的基材10>
諸如上述,本實施形態之用於電子零件搬送用機架的基材10係如圖2(A)~圖2(D)所示,用以獲得電子零件搬送用機架40者。具體而言,本實施形態之用於電子零件搬送用機架的基材10係作為供支持樹脂吸附部21的支持基材使用。<
本實施形態之用於電子零件搬送用機架的基材10係如圖1所示,在金屬板11上形成作為最表層之氧化處理鍍敷皮膜12而成。As shown in FIG. 1, the
作為金屬板11,不特別限定,可舉出鋼板、不鏽鋼板、銅板、鋁板、鋁合金板或鎳板等。此等當中,由價格低廉而言,較佳為鋼板或鋁板、鋁合金板。再者,基於可達電子零件搬送用機架40之輕量化,由此可減少搬送電子零件所需之能量之觀點,較佳為鋁板,或鋁合金板。金屬板11的厚度不特別限定,基於搬送電子零件時的操作處理性觀點,較佳為0.3~2mm,更佳為0.5~0.8mm。The
氧化處理鍍敷皮膜12係形成於金屬板11上的鍍敷被膜,至少其表面係經氧化處理,構成基材10的最表層。本實施形態中,氧化處理鍍敷皮膜12係包含選自Ni、Sn及P之至少1種元素(較佳為包含選自Ni及Sn之至少1種元素),且最表面之全部Ni元素中作為Ni氧化狀態之Ni2
O3
的狀態比例(亦即以Ni元素換算之Ni2
O3
相對於Ni單質或NiO等Ni2
O3
以外之氧化狀態的氧化物、Ni的氧化物以外之Ni化合物與Ni2
O3
之合計的狀態比例),或最表面之全部Sn元素中作為Sn氧化狀態之SnO2
的狀態比例(亦即以Sn元素換算之SnO2
相對於Sn單質或SnO等SnO2
以外之氧化狀態的氧化物、Sn的氧化物以外之Sn化合物與SnO2
之合計的狀態比例)為1%以上。The oxidation treatment plating
根據本實施形態,藉由在金屬板11上形成作為最表層之氧化處理鍍敷皮膜12,並使氧化處理鍍敷皮膜12成為此種構成,可使用於電子零件搬送用機架的基材10其強度及硬度更高,且對於構成樹脂吸附部21之吸附用樹脂顯示適當的密接強度。尤其是在製造電子零件搬送用機架40時,需如圖2(C)所示步驟般,將成形用模具30以既定的壓力按壓於用於電子零件搬送用機架的基材10上,因此,用於電子零件搬送用機架的基材10係要求可有效抑制由成形用模具30之按壓所造成的變形、破損或劃傷。再者,由於用於電子零件搬送用機架的基材10係用來支持樹脂吸附部21者,而要求:與構成樹脂吸附部21之吸附用樹脂的密接性優良;另一方面,對於殘留於樹脂吸附部21以外的部分之多餘的吸附用樹脂(例如殘留於形成有多個樹脂吸附部21之區域(亦即中央部附近)的周圍之吸附用樹脂),有時可藉由剝離等而去除,而顯示可將此等適當地去除之程度的密接性(亦即密接力過高)。再者,若於步驟內發生劃傷,則平滑度會惡化,亦有搬送性能變差的課題。According to the present embodiment, by forming the oxidation treatment plating
相對於此,根據本實施形態,藉由使用於電子零件搬送用機架的基材10具有上述構成,則強度及硬度高,對於構成樹脂吸附部21之吸附用樹脂可顯示適當的密接強度;藉此,根據本實施形態,可適當地解決此種問題。On the other hand, according to this embodiment, the
氧化處理鍍敷皮膜12只要是包含選自Ni、Sn及P之至少1種元素,且最表面之全部Ni元素中作為Ni氧化狀態之Ni2
O3
的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2
的狀態比例為1%以上者即可;作為供形成樹脂吸附部21之吸附用樹脂,使用聚矽氧系樹脂時, Ni2
O3
的狀態比例,或SnO2
的狀態比例較佳為1.75~72.6%的範圍,更佳為超過5%且為72.6%以下的範圍,再更佳為7.5~49.4%的範圍。又,作為供形成樹脂吸附部21之吸附用樹脂,使用聚醚系樹脂、聚酯系樹脂、氟系樹脂、胺基甲酸酯系樹脂或者聚乳酸系樹脂時,最表面之全部Ni元素中作為Ni氧化狀態之Ni2
O3
的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2
的狀態比例更佳為7.5~ 100%的範圍,再更佳為7.97~72.6%的範圍,再更佳為7.97 ~30%的範圍。最表面之全部Ni元素中作為Ni氧化狀態之Ni2
O3
的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2
的狀態比例過低的話,則對吸附用樹脂之密接性不足。The oxidation-treated plated
當氧化處理鍍敷皮膜12為至少含有Ni的氧化處理鍍敷皮膜時,基於可對構成樹脂吸附部21之吸附用樹脂顯示更適當的密接強度之觀點,氧化處理鍍敷皮膜的最表面之Ni的NiO與Ni2
O3
的狀態比,以「NiO:Ni2
O3
」之比計較佳為11.0:1.0~1.0:99.0,更佳為7.0:1.8~23.8:76.2,再更佳為7.0:1.8~27.4:72.6。NiO與Ni2
O3
的狀態比,可對氧化處理鍍敷皮膜12的表面進行X光光電子光譜(XPS)測定,求出Ni單質之波峰的積分值、NiO之波峰的積分值與Ni2
O3
之波峰的積分值,再根據此等算出最表面之全部Ni元素之NiO及Ni2
O3
的狀態比例,而求出NiO與Ni2
O3
的狀態比。When the oxidation-treated plated
又,氧化處理鍍敷皮膜12,只要最表面之全部Ni元素中作為Ni氧化狀態之Ni2
O3
的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2
的狀態比例為上述範圍即可;最表面之氧元素的存在比例較佳為40.0atom%以上,更佳為40.6atom%以上,再更佳為43.0atom%以上。最表面之氧元素的存在比例的上限不特別限定,較佳為53atom%以下,更佳為45atom%以下。藉由使最表面之氧元素的存在比例為上述範圍,可進一步提高對吸附用樹脂之密接性。本實施形態中,氧化處理鍍敷皮膜12之最表面之氧元素的存在比例,可藉由對氧化處理鍍敷皮膜12的表面進行X光光電子光譜(XPS)測定,求出構成氧化處理鍍敷皮膜12之各氧化物的波峰積分值,再由求得之波峰積分值算出氧元素的存在比例(atom%)而求得。In addition, the oxidation-processed
此外,氧化處理鍍敷皮膜12除選自Ni、Sn及P之至少1種元素外,亦可進一步含有Zn。當氧化處理鍍敷皮膜12為進一步含有Zn的氧化處理鍍敷皮膜時,基於可對構成樹脂吸附部21之吸附用樹脂顯示更適當的密接強度之觀點,最表面之全部Zn元素中處於氧化狀態之作為Zn之ZnO的狀態比例較佳為19%以上。又,最表面之全部Zn元素中處於氧化狀態之作為Zn之ZnO2
的狀態比例較佳為1%以上,更佳為69%以上。ZnO與ZnO2
的狀態比,可對氧化處理鍍敷皮膜12的表面進行X光光電子光譜(XPS)測定,進行X光光電子光譜(XPS)測定,求出Zn單質之波峰的積分值、ZnO之波峰的積分值與ZnO2
之波峰的積分值,並由此等算出最表面之全部Zn元素之ZnO及ZnO2
的狀態比例,而求得ZnO與ZnO2
的狀態比。In addition, the oxidation
當氧化處理鍍敷皮膜12為至少含有Sn的氧化處理鍍敷皮膜時,基於可對構成樹脂吸附部21之吸附用樹脂顯示更適當的密接強度之觀點,氧化處理鍍敷皮膜12的最表面之全部Sn元素中作為Sn氧化狀態之SnO的狀態比例較佳為19%以上。又,氧化處理鍍敷皮膜12的最表面之全部Sn元素中作為Sn氧化狀態之SnO2
的狀態比例較佳為1%以上,更佳為69%以上。SnO與SnO2
的狀態比,可對氧化處理鍍敷皮膜12的表面進行X光光電子光譜(XPS)測定,求出Sn單質之波峰的積分值、SnO之波峰的積分值與SnO2
之波峰的積分值,再由此等算出最表面之全部Sn元素之SnO及SnO2
的狀態比例,而求得SnO與SnO2
的狀態比。When the oxidation-treated
當氧化處理鍍敷皮膜12為至少含有P的氧化處理鍍敷皮膜時,基於可對構成樹脂吸附部21之吸附用樹脂顯示更適當的密接強度之觀點,氧化處理鍍敷皮膜12的最表面之全部P元素中處於氧化狀態之P的氧化物的狀態比例為21%以上,更佳為24%以上。全部P元素中處於氧化狀態之P的氧化物的狀態比例之上限不特別限定,較佳為97%以下,更佳為60%以下。P的氧化物的狀態比例可與上述同樣地藉由X光光電子光譜(XPS)測定來求得。When the oxidation-treated
再者,就氧化處理鍍敷皮膜12,基於可使強度、硬度及對構成樹脂吸附部21之吸附用樹脂的密接性更高度地達到平衡,而且可進一步提高氧化處理鍍敷皮膜12表面的平坦性,由此可高精確度地搬送更微細的電子零件之觀點,更佳為至少含有Ni-P合金的氧化處理鍍敷皮膜;此時之氧化處理鍍敷皮膜12的最表面之NiO與Ni2
O3
的狀態比,以「NiO:Ni2
O3
」之比計為11.0:1.0~1.0:99.0。更佳為7.0:1.8~23.8:76.2,再更佳為7.0:1.8~27.4:72.6。NiO與Ni2
O3
的狀態比可與上述同樣地藉由X光光電子光譜(XPS)測定的結果來算出。又,Ni-P合金中之P的含量較佳為1~13重量%,更佳為5~13重量%,再更佳為8~13重量%。Ni‐P合金中之P的含有比例可與上述同樣地藉由X光光電子光譜(XPS)測定來求得。In addition, the oxidation-treated
氧化處理鍍敷皮膜12的厚度不特別限定,基於使用於電子零件搬送用機架的基材10的強度及硬度更充足之觀點,較佳為1~40μm,更佳為1~20μm,再更佳為1~10μm,再更佳為5~10μm。The thickness of the oxidation-treated
作為在金屬板11上形成氧化處理鍍敷皮膜12之方法不特別限定,可舉出例如,在氧化處理鍍敷皮膜12採用至少含有Ni的氧化處理鍍敷皮膜時,於金屬板11上實施鍍鎳,再對形成之鍍鎳膜進行氧化處理的方法等。作為氧化處理之方法,不特別限定,可舉出對形成之鍍鎳膜進行熱處理的方法、進行予以浸漬於過氧化氫水(H2
O2
)、次氯酸鹽等液體中之處理的方法、進行水蒸氣處理的方法等。又,此等亦可加以組合。作為進行熱處理時之條件,不特別限定,熱處理溫度較佳為130~300℃,熱處理時間較佳為10~30分鐘。又,作為浸漬於過氧化氫水中之處理中的條件,不特別限定,過氧化氫水的濃度較佳為1~35重量%,更佳為15~35重量%,浸漬溫度(過氧化氫水的溫度)較佳為25~90℃,更佳為25~70℃,浸漬時間較佳為20秒~120分鐘,更佳為20秒~60分鐘。再者,作為水蒸氣處理中的條件,不特別限定,較佳為40~100%RH,更佳為65~100%RH,水蒸氣溫度較佳為40~120℃,更佳為65~85℃,處理時間較佳為1分鐘~72小時,更佳為12~24小時。又,使氧化處理鍍敷皮膜12含有Ni及P時(亦即含有Ni-P合金時),可舉出進行Ni-P鍍敷而形成Ni-P合金鍍敷膜後,對Ni-P合金鍍敷膜進行熱處理的方法、進行予以浸漬於過氧化氫水(H2
O2
)、次氯酸鹽等液體中之處理的方法,或進行水蒸氣處理的方法等。此時,熱處理、浸漬於過氧化氫水中之處理及水蒸氣處理中的條件可採用與上述相同者。The method of forming the oxidation-treated
此外,氧化處理鍍敷皮膜12採用至少含有Zn的氧化處理鍍敷皮膜時,或者採用至少含有Sn的氧化處理鍍敷皮膜時,可舉出在金屬板11上實施鍍鋅或鍍錫,並對形成之鍍鋅膜、鍍錫膜進行氧化處理的方法等。作為氧化處理之方法,不特別限定,可舉出對形成之鍍鋅膜、鍍錫膜進行熱處理的方法、進行予以浸漬於過氧化氫水等液體中之處理的方法,或進行水蒸氣處理的方法等。又,此等亦可加以組合。熱處理、浸漬於過氧化氫水中之處理及水蒸氣處理中的條件可採用與上述相同者。In addition, when the oxidation
又,氧化處理鍍敷皮膜12採用至少含有P的氧化處理鍍敷皮膜時,可舉出在金屬板11上視需求實施鍍鋅或鍍錫後,使用磷酸鹽進行磷酸鹽處理的方法等。In addition, when the oxidation
此外,於本實施形態中,亦可採用如在金屬板11上直接設置氧化處理鍍敷皮膜12之構成,而基於良好地形成氧化處理鍍敷皮膜12之觀點,係以預先在金屬板11上形成作為基底層之含有鋅的基底層後,在含有該鋅的基底層上形成氧化處理鍍敷皮膜12為佳。In addition, in this embodiment, for example, a structure in which an oxidation-treated
作為形成含有鋅的基底層之方法,不特別限定,可舉出對金屬板11進行脫脂處理,接著視需求實施蝕刻或酸洗後,進行鋅的置換鍍敷的方法。鋅的置換鍍敷可藉由實施經過第一鋅置換處理(1st鋅酸鹽處理)、硝酸鋅剝離處理(去鋅酸鹽處理)、第二鋅置換處理(2nd鋅酸鹽)之各步驟的雙重鋅酸鹽處理來進行。此時,於各步驟之處理後系實施水洗處理。The method of forming the base layer containing zinc is not particularly limited, and a method of performing degreasing treatment on the
根據如以上之本實施形態之用於電子零件搬送用機架的基材10,由於強度及硬度較高,且對構成樹脂吸附部21之吸附用樹脂顯示適當的密接強度,而能夠適用於作為構成供搬送各種電子零件之電子零件搬送用機架用的支持基材,尤其可適用於供搬送微LED、電容器、半導體元件等微細的電子零件之電子零件搬送用機架用途。
[實施例]According to the
以下舉出實施例,對本發明更具體地加以說明,惟本發明非限定於此等實施例。 此外,各特性之評定方法如下。The following examples are given to explain the present invention more specifically, but the present invention is not limited to these examples. In addition, the evaluation method of each characteristic is as follows.
<XPS測定> 針對形成於實施例及比較例中所得之氧化處理鍍敷板(就比較例1中未進行氧化處理之鍍敷板、比較例3,4中耐酸鋁處理板,以下就各測定、評定之說明係相同)的表面之氧化處理鍍敷皮膜(就比較例3,4中耐酸鋁處理面,以下就各測定、評定之說明係相同)的表面,使用X光光電子光譜裝置(ULVAC-PHI公司製,型號:VersaProbeII)分別測定Ni2p3/2、Sn3d5/2、P2p、O1s的波峰。 全元素中之氧元素的存在比例係藉由氬濺鍍蝕刻2nm後進行測定,由O1s峰面積佔Ni2p3/2、Sn3d5/2、P2p、O1s的峰面積之總和的比例來算出(總元素中之氧元素的存在比例的測定結果係針對實施例7,8、比較例2、實施例9,10,16~18進行)。 P的氧化物的比例係將上述P2p的波峰分離成對應各化學狀態的波形,由P的氧化物之峰面積佔P2p之峰面積的比例來算出。 NiO的狀態比例及Ni2 O3 的狀態比例係將Ni2p3/2的波峰分離成對應各化學狀態的波形,由對應NiO之峰面積或對應Ni2 O3 之峰面積佔Ni2p3/2之峰面積的比例來算出。 SnO的狀態比例及SnO2 的狀態比例係將Sn3d5/2的波峰分離成對應各化學狀態的波形,對應SnO之峰面積或對應SnO2 之峰面積佔Sn3d5/2之峰面積的比例來算出。<XPS measurement> For the oxidation-treated plated plates formed in the examples and comparative examples (for the plated plates not subjected to the oxidation treatment in Comparative Example 1, the alumite-treated plates in Comparative Examples 3 and 4, each measurement and evaluation is as follows The description is the same) The surface of the surface of the oxidation treatment plating film (for the alumite-treated surface in Comparative Examples 3 and 4 and the following description for each measurement and evaluation is the same), using X-ray photoelectron spectroscopy device (ULVAC-PHI Company-made, model: VersaProbeII) The peaks of Ni2p3/2, Sn3d5/2, P2p, and O1s were measured respectively. The proportion of oxygen present in all elements is measured by argon sputtering etching 2nm, and calculated from the ratio of the peak area of O1s to the sum of the peak areas of Ni2p3/2, Sn3d5/2, P2p, and O1s (total elements The measurement results of the existence ratio of the oxygen element were carried out for Examples 7, 8, Comparative Example 2, and Examples 9, 10, 16 to 18). The ratio of P oxides is calculated by dividing the peak of P2p into waveforms corresponding to each chemical state, and calculating the ratio of the peak area of P oxides to the peak area of P2p. The state ratio of NiO and the state ratio of Ni 2 O 3 separate the peaks of Ni2p3/2 into waveforms corresponding to each chemical state. The peak area corresponding to NiO or the peak area corresponding to Ni 2 O 3 accounts for the peak area of Ni2p3/2 To calculate the ratio. The SnO state ratio and SnO 2 state ratio are calculated by separating the peaks of Sn3d5/2 into waveforms corresponding to each chemical state, and calculating the ratio of the peak area corresponding to SnO or the peak area corresponding to SnO 2 to the peak area of Sn3d5/2.
<三點彎曲試驗> 將實施例及比較例中所得之氧化處理鍍敷板切成50mm×50mm的大小,將50mm×50mm的大小之試料之相對向的2邊,在以一對支持構件(支持端子徑2mm、支持寬度40mm)支持的狀態下,以自基準面浮起的狀態載置,並於此狀態下,對氧化處理鍍敷板之形成有氧化處理鍍敷皮膜的面之相對向的2邊之中央附近,藉由半徑5mm、寬度50mm的壓頭,以2mm/分之條件施加60N的負載,來進行三點彎曲試驗。然後,針對三點彎曲試驗前後之氧化處理鍍敷板,使用光學干涉條紋計(製品名「平面度檢查器(FT‐M100P)」,溝尻光學工業所股份有限公司製)觀測干涉條紋的變化,依以下基準進行評定。於三點彎曲試驗前後,若未觀測到干涉條紋的變化,可判斷為彎曲強度優良;另一方面,觀測到干涉條紋的變化時,則可判斷為彎曲強度不良。 〇:於三點彎曲試驗前後,未觀測到干涉條紋的變化。 ×:於三點彎曲試驗前後,觀測到干涉條紋的變化。<Three-point bending test> The oxidation-treated plated plates obtained in Examples and Comparative Examples were cut into a size of 50 mm × 50 mm, and a pair of supporting members (support terminal diameter 2 mm, support width) 40mm) In the supported state, it is placed in a state of floating from the reference surface, and in this state, near the center of the opposite two sides of the surface of the oxidation-treated plating plate on which the oxidation-treated plating film is formed, by A three-point bending test was carried out by applying a load of 60 N at a pressure of 5 mm and a width of 50 mm under a condition of 2 mm/min. Then, for the oxidation-treated plated plate before and after the three-point bending test, observe the change in interference fringes using an optical interference fringe meter (product name "Flatness Checker (FT-M100P)", manufactured by Takajiri Optical Industry Co., Ltd.). The following benchmarks are used for evaluation. Before and after the three-point bending test, if no change in interference fringes is observed, it can be judged that the bending strength is excellent; on the other hand, when a change in interference fringes is observed, it can be judged that the bending strength is poor. ○: No change in interference fringe was observed before and after the three-point bending test. ×: Changes in interference fringes were observed before and after the three-point bending test.
<劃傷試驗> 對實施例及比較例中所得之氧化處理鍍敷板之形成有氧化處理鍍敷皮膜的面,朝鉛直方向載置硬質合金針,在施加50g/kgf負載的狀態下進行刮擦試驗,並以雷射顯微鏡(OLYMPUS公司製,「LEXT(OLS3500)」)進行傷痕深度的測定。傷痕深度愈淺,則可判斷為硬度愈高。 〇:傷痕深度為1μm以下 ×:傷痕深度超過1μm<Scratch test> On the surface of the oxidation-treated plated plate obtained in Examples and Comparative Examples, on which the oxidation-treated plated film was formed, a cemented carbide needle was placed in the vertical direction, and a scratch test was carried out with a load of 50 g/kgf applied. The depth of the scar was measured with a laser microscope (manufactured by OLYMPUS, "LEXT (OLS3500)"). The shallower the scar depth, the higher the hardness. 〇: Scar depth is less than 1μm ×: The depth of the scar exceeds 1 μm
<吸附用樹脂的密接性> 對實施例及比較例中所得之具備吸附用樹脂層的氧化處理鍍敷板的吸附用樹脂層塗佈SiCCAROL(Asahi Group Foods股份有限公司製),將前述吸附用樹脂層以切割器切成寬20mm,自端部以20mm的長度剝離。對剝離部將膠紙帶(日東電工CS系統股份有限公司製,「Super Cloth Tape No.757 Super」)黏貼於其兩面,使用Tensilon萬能材料試驗機RTC-1350A(ORIENTEC股份有限公司製)朝180°方向以50mm/分的速度進行上述吸附樹脂層之剝離強度(剝離負載)的測定。剝離強度值愈高,表示氧化處理鍍敷板與吸附用樹脂層的密接性愈高。此外,基於與吸附用樹脂層之密接性之觀點,剝離強度值宜為0.35N/20mm以上;又,如上述,在電子零件搬送用機架之製造步驟中,由於有時需剝離多餘的吸附用樹脂,而基於剝離此種多餘的吸附用樹脂時的剝離性之觀點,剝離強度值宜為2N/20mm以下。<Adhesion of resin for adsorption> SiCCAROL (manufactured by Asahi Group Foods Co., Ltd.) was applied to the adsorption resin layer of the oxidation-treated plated plate provided with the adsorption resin layer obtained in Examples and Comparative Examples, and the adsorption resin layer was cut into a width of 20 mm with a cutter , Peeled off from the end with a length of 20 mm. Adhesive tape ("Super Cloth Tape No. 757 Super" manufactured by Nitto Denko CS Systems Co., Ltd.) was affixed to both sides of the peeling section, using Tensilon universal material testing machine RTC-1350A (made by ORIENTEC Co., Ltd.) toward 180 The peel strength (peel load) of the adsorption resin layer was measured at a speed of 50 mm/min in the ° direction. The higher the peel strength value, the higher the adhesion between the oxidation-treated plate and the adsorption resin layer. In addition, from the viewpoint of adhesion with the resin layer for adsorption, the peel strength value is preferably 0.35 N/20 mm or more; and, as described above, in the manufacturing step of the rack for conveying electronic parts, due to the need to peel off excess adsorption With a resin, the peel strength value is preferably 2 N/20 mm or less from the viewpoint of peelability when peeling such excess adsorption resin.
《實施例1》 準備厚度0.68mm的鋁板(Al#5000)。然後,對準備之鋁板進行脫脂,依序進行蝕刻、去污、1st鋅酸鹽、脫鋅酸鹽、2nd鋅酸鹽之各前處理,並於各步驟間實施水洗後,使用Ni-P鍍敷浴(周知之蘋果酸‐琥珀酸系無電解Ni-P鍍敷浴),藉由無電解電鍍於基材上形成厚度10μm的Ni-P合金鍍敷層(P的含量:12.0~12.5重量%)。其次,藉由將形成有Ni-P合金鍍敷層的鋁板,以浸漬溫度25℃、浸漬時間30分鐘之條件浸漬於30重量%的H2 O2 水溶液中來進行氧化處理,而得到在鋁上,隔著含有鋅的基底層形成有厚度10μm之氧化處理鍍敷皮膜而成的氧化處理鍍敷板。然後,針對所得氧化處理鍍敷板,依循上述方法,由XPS測定的結果算出全部元素中之氧元素的存在比例、P的氧化物的狀態比例、NiO的狀態比例及Ni2 O3 的狀態比例,並進行三點彎曲試驗及劃傷試驗。將結果示於表1。<<Example 1>> An aluminum plate (Al#5000) with a thickness of 0.68 mm was prepared. Then, degrease the prepared aluminum plate, and sequentially perform the pretreatments of etching, decontamination, 1st zincate, dezincate, and 2nd zincate, and after washing with water between each step, use Ni-P plating A coating bath (a well-known malic acid-succinic acid electroless Ni-P plating bath) is formed on the substrate by electroless plating to form a Ni-P alloy plating layer with a thickness of 10 μm (P content: 12.0 to 12.5 weight %). Next, the aluminum plate on which the Ni-P alloy plating layer was formed was immersed in a 30% by weight H 2 O 2 aqueous solution at a immersion temperature of 25° C. and a immersion time of 30 minutes to obtain aluminum On the upper side, an oxidation-treated plated plate formed by an oxidation-treated plated film with a thickness of 10 μm is formed via a base layer containing zinc. Then, with respect to the obtained oxidation-treated plated plate, in accordance with the above-mentioned method, from the results of XPS measurement, the ratio of the presence of oxygen in all the elements, the proportion of the state of the oxide of P, the proportion of the state of NiO, and the proportion of the state of Ni 2 O 3 were calculated. And conduct three-point bending test and scratch test. The results are shown in Table 1.
其次,藉由在上述所得之氧化處理鍍敷板之形成有氧化處理鍍敷層的面形成由作為吸附用樹脂之非聚矽氧系樹脂(聚醚系樹脂)所構成的層,並以110℃、10分鐘之條件加熱,使非聚矽氧系樹脂硬化,而於氧化處理鍍敷板上形成厚度100μm的非聚矽氧系樹脂層(吸附用樹脂層)。然後,對具備非聚矽氧系樹脂層之氧化處理鍍敷板,依循上述方法進行剝離強度的測定。將結果示於表1。Next, a layer composed of a non-polysiloxane-based resin (polyether-based resin) as a resin for adsorption was formed on the surface of the oxidation-treated plated plate obtained above where the oxidation-treated plating layer was formed, and the temperature was set at 110°C. And heating for 10 minutes to harden the non-silicone-based resin, and form a non-silicone-based resin layer (adsorption resin layer) with a thickness of 100 μm on the oxidation-treated plated plate. Then, the oxidation-treated plated plate provided with the non-polysiloxane-based resin layer was subjected to the measurement of the peel strength in accordance with the above method. The results are shown in Table 1.
《實施例2~7》 除將使用H2 O2 水溶液之氧化處理的條件分別變更為表1所示條件以外,係以與實施例1同樣的方式製造氧化處理鍍敷板及具備非聚矽氧系樹脂層之氧化處理鍍敷板,並同樣地進行評定。將結果示於表1。"Examples 2-7" Except that the conditions for the oxidation treatment using the H 2 O 2 aqueous solution were changed to the conditions shown in Table 1, respectively, an oxidation-treated plated plate and a non-silicon oxide were prepared in the same manner as in Example 1. The resin-plated oxidized plating plate was evaluated in the same manner. The results are shown in Table 1.
《實施例8》
準備對低碳鋁鎮靜鋼之冷軋板(厚度0.25mm)實施退火而得的鋼板。然後,對準備之鋼板進行脫脂、水洗、酸洗、水洗後,使用下述之鍍錫浴,依下述鍍敷條件得到形成有鍍錫層的鋼板,並以浸漬溫度70℃、浸漬時間20分之條件予以浸漬於用氫氧化鈉(NaOH)調整成pH13之6重量%的次氯酸鈉(NaClO)水溶液中來進行氧化處理,而得到在鋼板上形成有厚度1.0μm之氧化處理鍍敷皮膜而成的氧化處理鍍敷板。然後,使用所得氧化處理鍍敷板,與實施例1同樣地進行評定,並使用所得氧化處理鍍敷板製造具備非聚矽氧系樹脂層之氧化處理鍍敷板,並同樣地進行評定。將結果示於表1。
<鍍錫浴及鍍錫條件>
硫酸錫 80g/L
酚磺酸 60g/L
浴溫 40℃
電流密度 10A/dm2 "Example 8" A steel sheet obtained by annealing a low-carbon aluminum killed steel cold rolled sheet (thickness 0.25 mm) was prepared. Then, after degreasing, washing, pickling, and washing the prepared steel plate, the following tin plating bath was used to obtain the steel plate with the tin plating layer formed according to the following plating conditions, and the immersion temperature was 70° C. and the immersion time was 20 The conditions were immersed in 6% by weight sodium hypochlorite (NaClO) aqueous solution adjusted to pH 13 with sodium hydroxide (NaOH) for oxidation treatment to obtain an oxidation treatment plating film with a thickness of 1.0 μm formed on the steel plate Oxidation treatment of plated plates. Then, using the obtained oxidation-treated plated plate, evaluation was carried out in the same manner as in Example 1, and the obtained oxidation-treated plated plate was used to produce an oxidation-treated plated plate provided with a non-polysiloxane-based resin layer and evaluated in the same manner. The results are shown in Table 1. <Tin plating bath and tin plating conditions> Tin sulfate 80g/L phenolsulfonic acid 60g/
《比較例1》 除未進行使用H2 O2 水溶液之氧化處理以外,係以與實施例1同樣的方式製造鍍敷板及具備非聚矽氧系樹脂層之鍍敷板,並同樣地進行評定。將結果示於表1。<<Comparative Example 1>> A plated plate and a plated plate provided with a non-polysiloxane-based resin layer were produced in the same manner as in Example 1 except that the oxidation treatment using the H 2 O 2 aqueous solution was not performed, and the same evaluation was performed. The results are shown in Table 1.
《比較例2》 除進行使用氫氧化鈉水溶液之鹼處理來替代使用H2 O2 水溶液之氧化處理以外,係以與實施例1同樣的方式製造鹼處理鍍敷板及具備非聚矽氧系樹脂層之鹼處理鍍敷板,並同樣地進行評定。此外,使用氫氧化鈉水溶液之鹼處理係使用pH=12的氫氧化鈉水溶液,並以95℃、30分之條件進行。將結果示於表1。<<Comparative Example 2>> An alkali-treated plated plate and a non-silicone-based resin were produced in the same manner as in Example 1, except that alkali treatment using an aqueous solution of sodium hydroxide was performed instead of oxidation treatment using an aqueous solution of H 2 O 2 . The alkali-treated plated layer is evaluated in the same way. In addition, the alkali treatment with an aqueous solution of sodium hydroxide was performed using an aqueous solution of sodium hydroxide with a pH of 12 at 95° C. for 30 minutes. The results are shown in Table 1.
《比較例3》 準備厚度0.5mm的鋁板(Al#5000)。然後,對準備之鋁板進行脫脂、水洗後,進行耐酸鋁處理,而得到耐酸鋁處理板。然後,使用所得耐酸鋁處理板,與實施例1同樣地進行評定,並使用所得耐酸鋁處理板製造具備非聚矽氧系樹脂層之耐酸鋁處理板,並同樣地進行評定。將結果示於表1。"Comparative Example 3" Prepare an aluminum plate (Al#5000) with a thickness of 0.5 mm. Then, the prepared aluminum plate is degreased and washed with water, and then subjected to alumite treatment to obtain an alumite treatment plate. Then, the obtained alumite-treated plate was evaluated in the same manner as in Example 1, and the obtained alumite-treated plate was used to produce an alumite-treated plate provided with a non-polysiloxane-based resin layer and evaluated in the same manner. The results are shown in Table 1.
此外,表1中,「各元素之鍍敷皮膜最表面的氧化狀態比例」係表示各元素中之氧化物的比例(就表2亦同)。亦即,若為例如「NiO」、「Ni2 O3 」,係表示將最表面之全部Ni的化學狀態(Ni單質、Ni氧化物、Ni氧化物以外的Ni化合物)設為100%時之「NiO」之狀態的Ni,或「Ni2 O3 」之狀態的Ni所佔的比例(例如,實施例1中,「NiO」之狀態及「Ni2 O3 」之狀態以外的狀態的Ni係以80.20%的比例存在)。又,若為「P的氧化物」,係表示將最表面之全部P的化學狀態(P單質、P氧化物、P氧化物以外的P化合物)設為100%時之「P的氧化物」之狀態的P所佔的比例;若為「SnO」、「SnO2 」,則表示將最表面之全部Sn的化學狀態(Sn單質、Sn氧化物、Sn氧化物以外的Sn化合物)設為100%時之「SnO」之狀態的Sn,或「SnO2 」之狀態的Sn所佔的比例。 In addition, in Table 1, "the ratio of the oxidation state on the outermost surface of the plating film of each element" means the ratio of oxides in each element (the same applies to Table 2). That is, if it is "NiO" or "Ni 2 O 3 ", it means that the chemical state of all Ni on the outermost surface (Ni element, Ni oxide, Ni compound other than Ni oxide) is set to 100% Ni in the state of "NiO", or the proportion of Ni in the state of "Ni 2 O 3 "(for example, in Example 1, Ni in a state other than the state of "NiO" and the state of "Ni 2 O 3 " It exists in the proportion of 80.20%). Also, if it is "P oxide", it means "P oxide" when the chemical state of all P on the outermost surface (P element, P oxide, P compound other than P oxide) is set to 100% The proportion of P in the state; if it is "SnO" or "SnO 2 ", it means that the chemical state of all Sn on the outermost surface (Sn simple substance, Sn oxide, Sn compound other than Sn oxide) is set to 100 The percentage of Sn in the state of "SnO" or Sn in the state of "SnO 2 "at %.
如表1所示,具備包含選自Ni、Sn及P之至少1種元素的氧化處理鍍敷皮膜,且該氧化處理鍍敷皮膜的最表面之全部Ni元素中作為Ni氧化狀態之Ni2 O3 的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2 的狀態比例為1%以上時,根據三點彎曲試驗之強度及根據劃傷試驗之硬度優良,且對吸附用樹脂之密接性(剝離強度)亦處於適當的範圍內,而為良好的結果(實施例1~8)。 另一方面,即使具備包含選自Ni、Sn及P之至少1種元素的氧化處理鍍敷皮膜時,但該氧化處理鍍敷皮膜的最表面之全部Ni元素中作為Ni氧化狀態之Ni2 O3 的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2 的狀態比例未達1%時,對吸附用樹脂之密接性不充分(比較例1,2),而且,替代包含選自Ni、Sn及P之至少1種元素的氧化處理鍍敷皮膜而進行耐酸鋁處理時,結果根據三點彎曲試驗之強度及根據劃傷試驗之硬度較低,甚而對吸附用樹脂之密接性(剝離強度)過高(比較例3)。As shown in Table 1, an oxidation-treated plated coating film containing at least one element selected from Ni, Sn, and P is provided, and Ni 2 O, which is an Ni-oxidized state, among all Ni elements on the outermost surface of the oxidation-treated plated coating film When the state ratio of 3 or the state ratio of SnO 2 in Sn oxidation state among all Sn elements on the outermost surface is 1% or more, the strength according to the three-point bending test and the hardness according to the scratch test are excellent, and the resin for adsorption The adhesion (peel strength) was also in an appropriate range, and it was a good result (Examples 1 to 8). On the other hand, even if an oxidation-treated plated coating film containing at least one element selected from Ni, Sn, and P is provided, Ni 2 O, which is an Ni-oxidized state, of all Ni elements on the outermost surface of the oxidation-treated plated coating film When the state ratio of 3 or the state ratio of SnO 2 in the Sn-oxidized state among all Sn elements on the outermost surface is less than 1%, the adhesion to the resin for adsorption is insufficient (Comparative Examples 1, 2), and the substitution includes When the oxidation-treated plating film of at least one element selected from Ni, Sn, and P is subjected to alumite treatment, as a result, the strength according to the three-point bending test and the hardness according to the scratch test are low, and even the adhesion of the adsorption resin The properties (peel strength) are too high (Comparative Example 3).
《實施例9》 準備厚度0.68mm的鋁板(Al#5000)。然後,對準備之鋁板進行脫脂,依序進行蝕刻、去污、1st鋅酸鹽、脫鋅酸鹽、2nd鋅酸鹽之各前處理,並於各步驟間實施水洗後,使用Ni-P鍍敷浴(周知之蘋果酸‐琥珀酸系無電解Ni-P鍍敷浴),藉由無電解電鍍於基材上形成厚度10μm的Ni-P合金鍍敷層(P的含量:12.0~12.5重量%)。其次,藉由將形成有Ni-P合金鍍敷層的鋁板,以浸漬溫度70℃、浸漬時間10分鐘之條件浸漬於15重量%的H2 O2 水溶液中來進行氧化處理,而得到在鋁上,隔著含有鋅的基底層形成有厚度10μm之氧化處理鍍敷皮膜而成的氧化處理鍍敷板。然後,針對所得氧化處理鍍敷板,依循上述方法,由XPS測定的結果算出全部元素中之氧元素的存在比例、P的氧化物的狀態比例、NiO的狀態比例及Ni2 O3 的狀態比例,並進行三點彎曲試驗及劃傷試驗。將結果示於表2。<<Example 9>> An aluminum plate (Al#5000) with a thickness of 0.68 mm was prepared. Then, degrease the prepared aluminum plate, and sequentially perform the pretreatments of etching, decontamination, 1st zincate, dezincate, and 2nd zincate, and after washing with water between each step, use Ni-P plating A coating bath (a well-known malic acid-succinic acid electroless Ni-P plating bath) is formed on the substrate by electroless plating to form a Ni-P alloy plating layer with a thickness of 10 μm (P content: 12.0 to 12.5 weight %). Next, the aluminum plate on which the Ni-P alloy plating layer was formed was immersed in a 15% by weight H 2 O 2 aqueous solution under the conditions of an immersion temperature of 70° C. and an immersion time of 10 minutes. On the upper side, an oxidation-treated plated plate formed by an oxidation-treated plated film with a thickness of 10 μm is formed via a base layer containing zinc. Then, with respect to the obtained oxidation-treated plated plate, in accordance with the above-mentioned method, from the results of XPS measurement, the ratio of the presence of oxygen in all the elements, the proportion of the state of the oxide of P, the proportion of the state of NiO, and the proportion of the state of Ni 2 O 3 were calculated. And conduct three-point bending test and scratch test. The results are shown in Table 2.
其次,藉由在上述所得之氧化處理鍍敷板之形成有氧化處理鍍敷層的面形成由作為吸附用樹脂之二甲基矽氧烷(DMS)所構成的層,並以85℃、10分鐘之條件加熱,使由二甲基矽氧烷(DMS)所構成的層硬化,而於氧化處理鍍敷板上形成厚度100μm的聚二甲基矽氧烷(PDMS)層(吸附用樹脂層)。然後,對具備PDMS層之氧化處理鍍敷板,依循上述方法進行剝離強度的測定。將結果示於表2。Next, by forming a layer made of dimethylsiloxane (DMS) as a resin for adsorption on the surface of the oxidation-treated plated plate obtained above, on which the oxidation-treated plated layer is formed, at 85° C. for 10 minutes Heating under the conditions to harden the layer composed of dimethylsiloxane (DMS), and form a polydimethylsiloxane (PDMS) layer (adsorption resin layer) with a thickness of 100 μm on the oxidation-treated plated plate. Then, the oxidation-treated plated plate provided with the PDMS layer was subjected to the measurement of the peel strength in accordance with the above method. The results are shown in Table 2.
《實施例10~17》 除將使用H2 O2 水溶液之氧化處理的條件分別變更為表2所示條件以外,係以與實施例9同樣的方式製造氧化處理鍍敷板及具備PDMS層之氧化處理鍍敷板,並同樣地進行評定。將結果示於表2。"Examples 10 to 17" An oxidation-treated plated plate and an oxidation including a PDMS layer were produced in the same manner as in Example 9 except that the conditions for the oxidation treatment using H 2 O 2 aqueous solution were changed to the conditions shown in Table 2, respectively. Treat the plated plate and evaluate it in the same way. The results are shown in Table 2.
《實施例18》
準備對低碳鋁鎮靜鋼之冷軋板(厚度0.25mm)實施退火而得的鋼板。然後,對準備之鋼板進行脫脂、水洗、酸洗、水洗後,使用下述之鍍錫浴,依下述鍍敷條件得到形成有鍍錫層的鋼板,並以浸漬溫度70℃、浸漬時間20分之條件予以浸漬於6重量%的次氯酸鈉水溶液(NaClO)中來進行氧化處理,而得到在鋼板上形成有厚度1.0μm之氧化處理鍍敷皮膜而成的氧化處理鍍敷板。然後,使用所得氧化處理鍍敷板,與實施例9同樣地進行評定,並使用所得氧化處理鍍敷板製造具備PDMS層之氧化處理鍍敷板,並同樣地進行評定。將結果示於表2。
<鍍錫浴及鍍錫條件>
硫酸錫 80g/L
酚磺酸 60g/L
浴溫 40℃
電流密度 10A/dm2 "Example 18" A steel sheet obtained by annealing a cold-rolled sheet (thickness 0.25 mm) of low-carbon aluminum killed steel was prepared. Then, after degreasing, washing, pickling, and washing the prepared steel plate, the following tin plating bath was used to obtain the steel plate with the tin plating layer formed according to the following plating conditions, and the immersion temperature was 70° C. and the immersion time was 20 The conditions were immersed in a 6% by weight sodium hypochlorite aqueous solution (NaClO) for oxidation treatment to obtain an oxidation treatment plating plate formed by forming an oxidation treatment plating film with a thickness of 1.0 μm on the steel plate. Then, using the obtained oxidation-treated plated plate, evaluation was performed in the same manner as in Example 9, and the obtained oxidation-treated plated plate was used to produce an oxidation-treated plated plate provided with a PDMS layer, and evaluated in the same manner. The results are shown in Table 2. <Tin plating bath and tin plating conditions> Tin sulfate 80g/L Phenol sulfonic acid 60g/
《比較例4》 準備厚度0.68mm的鋁板(Al#5000)。然後,對準備之鋁板進行脫脂、水洗後,進行耐酸鋁處理,而得到耐酸鋁處理板。然後,使用所得耐酸鋁處理板,與實施例10同樣地進行評定,並使用所得耐酸鋁處理板製造具備PDMS層之耐酸鋁處理板,並同樣地進行評定。將結果示於表2。"Comparative Example 4" Prepare an aluminum plate (Al#5000) with a thickness of 0.68 mm. Then, the prepared aluminum plate is degreased and washed with water, and then subjected to alumite treatment to obtain an alumite treatment plate. Then, the obtained alumite-treated plate was evaluated in the same manner as in Example 10, and the obtained alumite-treated plate was used to manufacture an alumite-treated plate provided with a PDMS layer and evaluated in the same manner. The results are shown in Table 2.
如表2所示,具備包含選自Ni、Sn及P之至少1種元素的氧化處理鍍敷皮膜,且該氧化處理鍍敷皮膜的最表面之全部Ni元素中作為Ni氧化狀態之Ni2 O3 的狀態比例,或最表面之全部Sn元素中作為Sn氧化狀態之SnO2 的狀態比例為1%以上時,根據三點彎曲試驗之強度及根據劃傷試驗之硬度優良,且對吸附用樹脂之密接性(剝離強度)亦處於適當的範圍內,而為良好的結果(實施例9~18)。 另一方面,替代包含選自Ni、Sn及P之至少1種元素的氧化處理鍍敷皮膜而進行耐酸鋁處理時,對吸附用樹脂之密接性(剝離強度)雖良好,但根據三點彎曲試驗之強度及根據劃傷試驗之硬度為較低之結果(比較例4)。As shown in Table 2, an oxidation-treated plated coating film containing at least one element selected from Ni, Sn, and P is provided, and Ni 2 O, which is an Ni-oxidized state, among all Ni elements on the outermost surface of the oxidation-treated plated coating film When the state ratio of 3 or the state ratio of SnO 2 in Sn oxidation state among all Sn elements on the outermost surface is 1% or more, the strength according to the three-point bending test and the hardness according to the scratch test are excellent, and the resin for adsorption The adhesion (peel strength) was also in an appropriate range, which was a good result (Examples 9 to 18). On the other hand, when performing an alumite treatment instead of an oxidation treatment plating film containing at least one element selected from Ni, Sn, and P, although the adhesion to the adsorption resin (peel strength) is good, it is bent according to three points The strength of the test and the hardness according to the scratch test are lower results (Comparative Example 4).
10:用於電子零件搬送用機架的基材 11:金屬板 12:氧化處理鍍敷皮膜 20:樹脂層 21:樹脂吸附部 30:成形用模具 31:模穴 40:電子零件搬送用機架 50:貯存區 60:電子零件 70:電路基板 10: Base material for racks for electronic parts transportation 11: Metal plate 12: Oxidized plating film 20: resin layer 21: Resin adsorption section 30: Mold for forming 31: mold cavity 40: Rack for transporting electronic parts 50: storage area 60: Electronic parts 70: circuit board
圖1為本實施形態之用於電子零件搬送用機架的基材的剖面圖。 圖2為表示本實施形態之電子零件搬送用機架的製造方法的圖。 圖3為表示使用本實施形態之電子零件搬送用機架之電子零件的搬送方法的圖。FIG. 1 is a cross-sectional view of a base material used in a rack for conveying electronic parts according to this embodiment. FIG. 2 is a diagram showing a manufacturing method of the rack for conveying electronic parts according to this embodiment. FIG. 3 is a diagram showing a method of transporting electronic components using the rack for transporting electronic components according to the present embodiment.
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