TW202015908A - Base material for electronic parts transport jig - Google Patents

Abstract

Provided is a base material for an electronic parts transport jig, the base material being for use in an electronic parts transport jig and comprising a resin suction portion for suctioning an electronic part, wherein: the base material for the electronic parts transport jig comprises a metal plate and an oxidation plating film that is formed on the metal plate and includes at least one element selected from Ni, Sn, and P, the metal plate and oxidation plating film being used to support the resin suction portion; and the state ratio of Ni2O3 as Ni in an oxidized state among all Ni elements in the outermost surface of the oxidation plating film, or the state ratio of SnO2 as Sn in an oxidized state among all Sn elements in the outermost surface of the oxidation plating film, is 1% or higher.

Description

Base material for rack for conveying electronic parts

The present invention relates to a base material for a rack for conveying electronic parts used in a rack for conveying electronic parts provided with a resin suction part for sucking electronic parts.

Conventionally, as a rack for lifting up and transporting semiconductor wafers to a predetermined position, a rack for transport has been used. In such a conveyance rack, by bringing the front end portion into contact with the vicinity of the central portion of the semiconductor wafer and making the suction hole in a vacuum state, the semiconductor wafer can be conveyed while being suctioned.

On the other hand, in recent years, in order to realize the multi-function and high speed of semiconductor wafers and the accompanying high-density mounting, there has been continuous development of chip stacked wafers in which through electrodes are formed in the wafer and flip chip mounting is performed by bump connection technology. A semiconductor wafer having such a through electrode is provided with a bump electrode wall for connection on the surface of the wafer; in order to be bonded to the bump electrode wall of a semiconductor wafer laminated on top and bottom, a structure protruding higher than the connection pad of a conventional semiconductor wafer is often adopted .

Therefore, the transport rack for transporting in a vacuum state is sometimes not suitable for the transport of semiconductor wafers having such through electrodes. As an alternative to the transport rack, it has been proposed to use an adsorption method such as resin (for example, refer to Patent Literature 1). However, the technique of this Patent Document 1 does not study the strength or hardness of the base material of the resin supporting the adsorption, or even the adhesion with the resin. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2010-287679

[Problems to be solved by the invention]

An object of the present invention is to provide a base material for a rack for transporting electronic parts that has high strength and hardness and exhibits an appropriate adhesion strength to the resin constituting the resin suction portion for sucking electronic parts. [Means to solve the problem]

The inventors of the present case have made intensive studies to achieve the above-mentioned object and found that as a base material for an electronic parts conveying rack provided with a resin adsorption part for adsorbing electronic parts, by using: a metal plate, and formed here The state of Ni ₂ O ₃ on the metal plate and containing at least one element selected from Ni, Sn, and P by an oxidation treatment plating film, and all the Ni elements on the outermost surface of the oxidation treatment plating film as Ni oxidation state The ratio, or the state ratio of SnO ₂ as the Sn oxidation state among all the Sn elements on the outermost surface of the oxidation-plated coating film is controlled to 1% or more, the above-mentioned object can be achieved, and finally the present invention is completed.

That is, according to the present invention, it is possible to provide a base material for a rack for transporting electronic parts, which is a machine for transporting electronic parts used in a rack for transporting electronic parts provided with a resin suction part for sucking electronic parts The base material of the rack, wherein the base material for the electronic component conveying rack is used to support the resin adsorption portion, and is provided with: a metal plate formed on the metal plate and containing Ni, Sn and P The oxidation treatment plating film of at least one element; the proportion of the state of Ni ₂ O ₃ as the Ni oxidation state among all the Ni elements on the outermost surface of the oxidation treatment plating film, or the outermost surface of the oxidation treatment plating film The proportion of SnO ₂ in the Sn oxidation state among all Sn elements is 1% or more. In addition, the state ratio of Ni ₂ O ₃ as the Ni oxidation state among all the Ni elements on the outermost surface of the oxidation-treated plating film, or SnO as the Sn oxidation state among all the Sn elements on the outermost surface of the oxidation-treated plating film The state ratio of ₂ is preferably more than 5%.

In the base material for the rack for conveying electronic parts of the present invention, the presence ratio of the oxygen element on the outermost surface of the oxidation treatment plating film is more preferably 40 atom% or more. Preferably, the oxidation-treated plating film is an oxidation-treated plating film containing at least Ni, and the state ratio of NiO and Ni ₂ O ₃ on the outermost surface of the oxidation-treated plating film is "NiO:Ni ₂ The ratio of "O ₃ "is preferably 11.0:1.0~1.0:99.0, more preferably 7.0:1.8~23.8:76.2, and even more preferably 7.0:1.8~27.4:72.6. Preferably, the oxidation-treated plating film is an oxidation-treated plating film containing at least a Ni-P alloy. Preferably, the state ratio of oxides of P in an oxidized state among all the P elements in the oxidation-treated plating film is 21% or more. Preferably, the thickness of the aforementioned oxidation-treated plating film is 1 to 40 μm. Preferably, the aforementioned metal plate is an aluminum plate. It is preferable that the base material for the rack for conveying electronic parts of the present invention further includes a base layer containing zinc on the metal plate, and the oxidation treatment plating film is formed on the base layer.

In addition, according to the present invention, it is possible to provide a rack for conveying electronic parts, which is provided with a resin suction part for sucking electronic parts on the base material of the rack for conveying electronic parts described above. [Effect of invention]

According to the present invention, it is possible to provide a base material for a rack for transporting electronic parts, which has high strength and hardness, and exhibits an appropriate adhesion strength to the resin constituting the resin suction portion for sucking electronic parts, and uses such A rack for transferring electronic parts obtained from the base material of the rack for transferring parts.

FIG. 1 is a cross-sectional view showing the structure of a base material 10 used in a rack for conveying electronic components according to this embodiment. As shown in FIG. 1, the base material 10 used in the rack for conveying electronic parts of this embodiment is formed by forming an oxidation treatment plating film 12 as the outermost layer on a metal plate 11. The oxidation-treated plating film 12 contains at least one element selected from Ni, Sn, and P, the state ratio of Ni ₂ O ₃ as the Ni oxidation state among all Ni elements on the outermost surface, or as The state ratio of SnO ₂ in the state of Sn oxidation is 1% or more.

<Manufacturing method of rack for conveying electronic parts> First, before describing in detail the base material 10 for the rack for electronic component transportation of this embodiment, the electronic materials obtained by using the base material 10 for the rack for electronic component transportation of this embodiment will be described with reference to FIG. 2. Manufacturing method of rack for parts transportation.

First, as shown in FIG. 2(A), the base material 10 (hereinafter referred to as the "base material 10" for convenience) of the rack for electronic component conveyance of this embodiment is prepared. Next, as shown in FIG. 2(B), a resin layer 20 made of a resin for adsorption is formed. The resin layer 20 is formed on the side of the base material 10 on which the oxidation-treated plating film 12 (see FIG. 1) is formed.

Next, as shown in FIG. 2(C), the resin layer 20 is formed by pressing the molding die 30 having a plurality of cavities 31 against the resin layer 20 formed on the base material 10 and applying pressure while heating. The resin for adsorption is shaped to correspond to the shape of the cavity 31; thereby, as shown in FIG. 2(D), a plurality of resin adsorption portions 21 formed of resin for adsorption are formed on the base material 10 Rack for conveying electronic parts 40.

In addition, from the viewpoint of further improving the transport performance of the electronic parts, the rack 40 for transporting electronic parts thus obtained is unnecessary to remain around the area where the resin adsorption portions 21 are formed (that is, near the center). The resin for adsorption is preferably removed by being peeled off from the substrate 10 or the like.

Then, as shown in FIG. 3(A), the rack 40 for conveying electronic parts manufactured in this way is pressed by the plurality of electronic parts 60 placed in the storage area 50 and sucked by the plurality of resin suction parts 21 A plurality of electronic parts 60, and as shown in FIG. 3(B), the plurality of electronic parts 60 are transferred to the circuit board 70 for mounting the electronic parts, and then, by being pressed on the circuit board 70, The electronic components 60 are mounted on the circuit board 70 and used.

The adsorption resin for forming the resin layer 20 is not particularly limited, and from the viewpoint of having appropriate adhesiveness, the electronic parts can be transported more suitably. Polydimethylsiloxane (PDMS) and other polymers can be used. Silicone resin. As the polysiloxane-based resin, in addition to polydimethylsiloxane, any one having a siloxane bond as a main skeleton and including any one of a hydroxyl group, an amine group, a methyl group, a carboxyl group, and a ketone group can be preferably used Functional groups.

Alternatively, a non-polysiloxane-based resin may be used instead of the polysiloxane-based resin. As the non-polysiloxane-based resin, polyether-based resins or polyester-based resins may be cited. Among these, polyether-based resins are preferred Resin. As the polyether-based resin, those having an ether bond as the main skeleton and containing any one of a hydroxyl group, an amine group, a methyl group, a carboxyl group, and a ketone group as a functional group are preferred; and as a polyester-based resin, it is preferable to have an ester The bond serves as a main skeleton and includes any one of a hydroxyl group, an amine group, a methyl group, a carboxyl group, and a ketone group as a functional group. Furthermore, as the non-polysiloxane-based resin, urethane-based resin, polylactic acid-based resin, or fluorine-based resin can also be used. As the urethane-based resin, polylactic acid-based resin, and fluorine-based resin, for example, any one including a urethane bond, an ester bond, an ether bond, and an amide bond is preferably used as the main skeleton, and includes a hydroxyl group, Any one of an amine group, a methyl group, a carboxyl group, and a ketone group serves as a functional group.

These adsorption resins may be either curable resin (thermosetting resin or ultraviolet curable resin) or thermoplastic resin. For example, when a thermosetting resin is used as the adsorption resin, in the step shown in FIG. 2(C), the molding die 30 having a plurality of cavity 31 is pressed against the resin layer 20 formed on the base material 10 and When heating while applying pressure, it can be shaped to correspond to the shape of the resin adsorption portion 21 and hardened.

<Base material 10 for racks used for conveying electronic parts> As described above, the base material 10 used in the rack for conveying electronic parts of this embodiment is as shown in FIGS. 2(A) to 2(D) to obtain the rack 40 for conveying electronic parts. Specifically, the base material 10 used in the rack for conveying electronic parts of the present embodiment is used as a support base material for supporting the resin adsorption portion 21.

As shown in FIG. 1, the base material 10 used in the rack for conveying electronic parts of the present embodiment is formed on the metal plate 11 by an oxidation treatment plating film 12 as the outermost layer.

The metal plate 11 is not particularly limited, and examples thereof include steel plates, stainless steel plates, copper plates, aluminum plates, aluminum alloy plates, and nickel plates. Among these, steel plates, aluminum plates, and aluminum alloy plates are preferred because of their low price. In addition, from the viewpoint that the weight of the rack 40 for conveying electronic parts can be reduced, thereby reducing the energy required for conveying the electronic parts, it is preferably an aluminum plate or an aluminum alloy plate. The thickness of the metal plate 11 is not particularly limited, and is preferably 0.3 to 2 mm, and more preferably 0.5 to 0.8 mm from the viewpoint of handling operability when conveying electronic parts.

The oxidation treatment plating film 12 is a plating film formed on the metal plate 11, and at least the surface thereof is subjected to oxidation treatment to constitute the outermost layer of the base material 10. In this embodiment, the oxidation-treated plating film 12 contains at least one element selected from Ni, Sn, and P (preferably contains at least one element selected from Ni and Sn), and all of the Ni elements on the outermost surface as the state of Ni ₂ O ₃ ratio of the oxidation state of Ni (i.e., in terms of Ni element in Ni ₂ O ₃ with respect to the oxidation state of Ni ₂ O ₃ other than the simple substance of Ni or NiO and other oxides, Ni oxides other than the Ni The ratio of the total state of the compound and Ni ₂ O ₃ ), or the state ratio of SnO ₂ as the Sn oxidation state among all Sn elements on the outermost surface (that is, SnO ₂ converted to Sn element relative to Sn elemental or SnO ₂ such as Sn element The state ratio of the total amount of Sn compounds other than oxides in an oxidized state and Sn oxides and SnO ₂ ) is 1% or more.

According to the present embodiment, by forming the oxidation treatment plating film 12 as the outermost layer on the metal plate 11 and making the oxidation treatment plating film 12 such a structure, the base material 10 used in the rack for conveying electronic parts can be used The strength and hardness are higher, and the adhesive resin constituting the resin adsorption portion 21 exhibits an appropriate adhesion strength. In particular, when manufacturing the rack 40 for conveying electronic parts, it is necessary to press the molding die 30 against the base material 10 for the rack for conveying electronic parts as shown in FIG. 2(C) with a predetermined pressure. Therefore, the base material 10 used in the rack for conveying electronic parts is required to effectively suppress the deformation, damage, or scratches caused by the pressing of the molding die 30. In addition, since the base material 10 used in the rack for conveying electronic parts is used to support the resin adsorption portion 21, it is required that the adhesiveness with the adsorption resin constituting the resin adsorption portion 21 is excellent; Excess adsorption resin (e.g., adsorption resin remaining around the area where a plurality of resin adsorption portions 21 are formed (that is, near the center portion)) other than the resin adsorption portion 21 may be removed by peeling, etc. Removal shows the degree of adhesion that can be appropriately removed (ie, the adhesion is too high). In addition, if scratches occur in the step, the smoothness will deteriorate and there will be a problem that the transport performance will be deteriorated.

On the other hand, according to this embodiment, the base material 10 used in the rack for conveying electronic parts has the above-mentioned structure, the strength and the hardness are high, and the adhesive resin constituting the resin adsorption portion 21 can exhibit an appropriate adhesion strength; Therefore, according to the present embodiment, such a problem can be appropriately solved.

The oxidation-treated plated coating film 12 should be at least one element selected from Ni, Sn, and P, and the state ratio of Ni ₂ O ₃ as the Ni oxidation state among all Ni elements on the outermost surface, or all Sn elements on the outermost surface The state ratio of SnO ₂ in the Sn-oxidized state may be 1% or more; when the polysiloxane resin is used as the adsorption resin for forming the resin adsorption part 21, the state ratio of Ni ₂ O ₃ or SnO ₂ The state ratio is preferably in the range of 1.75 to 72.6%, more preferably in the range of more than 5% and 72.6% or less, and still more preferably in the range of 7.5 to 49.4%. In addition, when polyether resin, polyester resin, fluorine resin, urethane resin or polylactic acid resin is used as the adsorption resin for forming the resin adsorption portion 21, all the Ni elements on the outermost surface The state ratio of Ni ₂ O ₃ as the Ni oxidation state, or the state ratio of SnO ₂ as the Sn oxidation state among all Sn elements on the outermost surface is more preferably in the range of 7.5 to 100%, and even more preferably 7.97 to 72.6% The range is even better in the range of 7.97 ~ 30%. If the proportion of Ni ₂ O ₃ in the Ni-oxidized state of all Ni elements on the outermost surface, or the SnO ₂ in the Sn-oxidized state of all Sn elements on the outermost surface is too low, the adhesion to the resin for adsorption insufficient.

When the oxidation-treated plated coating film 12 is an oxidation-treated plated coating film containing at least Ni, the outermost surface of the oxidation-treated plated coating film is Ni from the viewpoint that the adsorption resin constituting the resin adsorption portion 21 can exhibit more appropriate adhesion strength. The state ratio of NiO to Ni ₂ O ₃ is preferably 11.0: 1.0 to 1.0: 99.0 in terms of the ratio of "NiO: Ni ₂ O ₃ ", more preferably 7.0: 1.8 to 23.8: 76.2, and even more preferably 7.0: 1.8~27.4: 72.6. The ratio of the state of NiO to Ni ₂ O ₃ can be measured by X-ray photoelectron spectroscopy (XPS) on the surface of the oxidation-treated plating film 12 to obtain the integral value of the peak of Ni element, the integral value of the peak of NiO and Ni ₂ O The integrated value of the peak of ₃ , and then calculating the state ratio of NiO and Ni ₂ O ₃ of all the Ni elements on the outermost surface based on these, and obtaining the state ratio of NiO and Ni ₂ O ₃ .

In addition, the oxidation-processed plating film 12 is provided as long as the state ratio of Ni ₂ O ₃ as the Ni oxidation state among all Ni elements on the outermost surface, or the state ratio of SnO ₂ as Sn oxidation state among all Sn elements on the outermost surface is the above The range is sufficient; the existence ratio of the oxygen element on the outermost surface is preferably 40.0 atom% or more, more preferably 40.6 atom% or more, and even more preferably 43.0 atom% or more. The upper limit of the existence ratio of the oxygen element on the outermost surface is not particularly limited, but is preferably 53 atom% or less, and more preferably 45 atom% or less. By making the ratio of the oxygen element on the outermost surface within the above range, the adhesion to the resin for adsorption can be further improved. In this embodiment, the existence ratio of the oxygen element on the outermost surface of the oxidation-treated plating film 12 can be determined by X-ray photoelectron spectroscopy (XPS) measurement on the surface of the oxidation-treated plating film 12 The peak integrated value of each oxide of the coating film 12 is further calculated from the calculated peak integrated value to calculate the existence ratio (atom%) of oxygen element.

In addition, the oxidation treatment plating film 12 may further contain Zn in addition to at least one element selected from Ni, Sn, and P. When the oxidation-treated plated film 12 is an oxidation-treated plated film further containing Zn, from the viewpoint that the adsorption resin constituting the resin adsorption portion 21 can exhibit more appropriate adhesion strength, all the Zn elements on the outermost surface are in an oxidized state The state ratio of ZnO as Zn is preferably 19% or more. Further, the proportion of ZnO ₂ as Zn in the oxidized state among all Zn elements on the outermost surface is preferably 1% or more, and more preferably 69% or more. The state ratio of ZnO to ZnO ₂ can be measured by X-ray photoelectron spectroscopy (XPS) on the surface of the oxidation-treated plated film 12 and by X-ray photoelectron spectroscopy (XPS) to obtain the integral value of the peak of the Zn element and the ZnO integral value of the integral value of the peak and the peak of ZnO ₂ and the like thereby calculates the entire uppermost surface of the ZnO of Zn and the ratio of ZnO state _2, the state is obtained of ZnO and ZnO ₂ ratio.

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Sn, the outermost surface of the oxidation-treated plating film 12 is based on the viewpoint that the adsorption resin constituting the resin adsorption portion 21 can exhibit more appropriate adhesion strength. The state ratio of SnO in the Sn oxidation state among all Sn elements is preferably 19% or more. The state ratio of SnO ₂ in the Sn oxidation state among all Sn elements on the outermost surface of the oxidation-treated plating film 12 is preferably 1% or more, and more preferably 69% or more. The state ratio of SnO to SnO ₂ can be measured by X-ray photoelectron spectroscopy (XPS) on the surface of the oxidation-treated plating film 12 to obtain the integral value of the peak of Sn elementary substance, the integral value of the peak of SnO and the peak value of the peak of SnO ₂ The integral value is then used to calculate the state ratio of SnO and SnO ₂ of all Sn elements on the outermost surface to obtain the state ratio of SnO and SnO ₂ .

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least P, the outermost surface of the oxidation-treated plating film 12 is based on the viewpoint that the adsorption resin constituting the resin adsorption portion 21 can exhibit more appropriate adhesion strength. The proportion of oxides of P in all P elements in an oxidized state is 21% or more, more preferably 24% or more. The upper limit of the state ratio of the oxide of P in all P elements is not particularly limited, but is preferably 97% or less, and more preferably 60% or less. The state ratio of the oxide of P can be obtained by X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above.

In addition, the oxidation-treated plating film 12 can be more balanced in terms of strength, hardness, and adhesion to the adsorption resin constituting the resin adsorption portion 21, and can further improve the flatness of the surface of the oxidation-treated plating film 12 In view of the fact that the finer electronic parts can be transported with high accuracy, it is more preferable to use an oxidation-treated plating film containing at least Ni-P alloy; at this time, the outermost surface of the oxidation-treated plating film 12 is NiO and Ni state ₂ O ₃ ratio, in order: specific "NiO Ni ₂ O _3" the count of 11.0: 1.0 to 1.0: 99.0. More preferably, it is 7.0:1.8~23.8:76.2, and even better is 7.0:1.8~27.4:72.6. The state ratio of NiO and Ni ₂ O ₃ can be calculated from the results of X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above. In addition, the content of P in the Ni-P alloy is preferably 1 to 13% by weight, more preferably 5 to 13% by weight, and even more preferably 8 to 13% by weight. The content ratio of P in the Ni-P alloy can be determined by X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above.

The thickness of the oxidation-treated plating film 12 is not particularly limited. From the viewpoint that the strength and hardness of the base material 10 used in the rack for conveying electronic parts are more sufficient, it is preferably 1 to 40 μm, more preferably 1 to 20 μm, and more It is preferably 1-10 μm, and even more preferably 5-10 μm.

The method of forming the oxidation-treated plating film 12 on the metal plate 11 is not particularly limited, and for example, when the oxidation-treated plating film 12 uses an oxidation-treated plating film containing at least Ni, plating is performed on the metal plate 11 Nickel, and then oxidize the formed nickel-plated film, etc. The method of the oxidation treatment is not particularly limited, and examples include a method of heat-treating the formed nickel-plated film, and a method of immersing it in a liquid such as hydrogen peroxide water (H ₂ O ₂ ) or hypochlorite. 3. Method of steam treatment. Moreover, these can also be combined. The conditions at the time of heat treatment are not particularly limited. The heat treatment temperature is preferably 130 to 300° C., and the heat treatment time is preferably 10 to 30 minutes. In addition, the conditions for the treatment of immersion in hydrogen peroxide water are not particularly limited, and the concentration of hydrogen peroxide water is preferably 1 to 35% by weight, more preferably 15 to 35% by weight, and the immersion temperature (hydrogen peroxide water Temperature) is preferably 25 to 90°C, more preferably 25 to 70°C, and the dipping time is preferably 20 seconds to 120 minutes, more preferably 20 seconds to 60 minutes. In addition, the conditions in the steam treatment are not particularly limited, preferably 40 to 100% RH, more preferably 65 to 100% RH, and the steam temperature is preferably 40 to 120°C, more preferably 65 to 85 At ℃, the treatment time is preferably 1 minute to 72 hours, more preferably 12 to 24 hours. In addition, when the oxidation treatment plating film 12 contains Ni and P (that is, when Ni-P alloy is contained), Ni-P plating is performed to form a Ni-P alloy plating film, and then the Ni-P alloy A method of heat treatment of the plating film, a method of immersing in liquid such as hydrogen peroxide water (H ₂ O ₂ ), hypochlorite, or a method of steam treatment. In this case, the same conditions as described above can be adopted for the conditions of heat treatment, immersion in hydrogen peroxide water, and steam treatment.

In addition, when the oxidation treatment plating film 12 contains an oxidation treatment plating film containing at least Zn or the oxidation treatment plating film contains at least Sn, the metal plate 11 may be galvanized or tin-plated. The method of oxidizing the formed zinc plating film and tin plating film, etc. The method of oxidation treatment is not particularly limited, and examples include a method of heat-treating the formed zinc-plated film and tin-plated film, a method of immersing in liquid such as hydrogen peroxide water, or a method of performing steam treatment Methods, etc. Moreover, these can also be combined. The conditions for the heat treatment, the treatment of immersion in hydrogen peroxide water, and the steam treatment can be the same as described above.

In addition, when the oxidation treatment plating film 12 containing at least P is used for the oxidation treatment plating film 12, a method of performing phosphate treatment using phosphate after the zinc plating or tin plating is performed on the metal plate 11 as necessary may be mentioned.

In addition, in this embodiment, for example, a structure in which an oxidation-treated plating film 12 is directly provided on the metal plate 11 may be adopted. From the viewpoint of forming the oxidation-treated plating film 12 well, the metal plate 11 may be preliminarily formed. After forming the base layer containing zinc as the base layer, it is preferable to form the oxidation-treated plating film 12 on the base layer containing zinc.

The method of forming the base layer containing zinc is not particularly limited, and a method of performing degreasing treatment on the metal plate 11 and then performing etching or pickling as required, and then performing zinc replacement plating. The zinc replacement plating can be carried out by performing the steps of the first zinc replacement treatment (1st zincate treatment), zinc nitrate stripping treatment (dezincate treatment), and the second zinc replacement treatment (2nd zincate treatment) Double zincate treatment is carried out. In this case, water washing treatment is performed after the treatment in each step.

According to the base material 10 for the rack for conveying electronic parts of the present embodiment as described above, since the strength and hardness are high, and the adsorption resin constituting the resin adsorption portion 21 exhibits an appropriate adhesion strength, it can be suitably used as The supporting base material constituting the rack for transporting electronic parts for transporting various electronic parts is particularly suitable for use in racks for transporting electronic parts such as micro LEDs, capacitors, semiconductor elements and other fine electronic parts. [Example]

The following examples are given to explain the present invention more specifically, but the present invention is not limited to these examples. In addition, the evaluation method of each characteristic is as follows.

<XPS measurement> For the oxidation-treated plated plates formed in the examples and comparative examples (for the plated plates not subjected to the oxidation treatment in Comparative Example 1, the alumite-treated plates in Comparative Examples 3 and 4, each measurement and evaluation is as follows The description is the same) The surface of the surface of the oxidation treatment plating film (for the alumite-treated surface in Comparative Examples 3 and 4 and the following description for each measurement and evaluation is the same), using X-ray photoelectron spectroscopy device (ULVAC-PHI Company-made, model: VersaProbeII) The peaks of Ni2p3/2, Sn3d5/2, P2p, and O1s were measured respectively. The proportion of oxygen present in all elements is measured by argon sputtering etching 2nm, and calculated from the ratio of the peak area of O1s to the sum of the peak areas of Ni2p3/2, Sn3d5/2, P2p, and O1s (total elements The measurement results of the existence ratio of the oxygen element were carried out for Examples 7, 8, Comparative Example 2, and Examples 9, 10, 16 to 18). The ratio of P oxides is calculated by dividing the peak of P2p into waveforms corresponding to each chemical state, and calculating the ratio of the peak area of P oxides to the peak area of P2p. The state ratio of NiO and the state ratio of Ni ₂ O ₃ separate the peaks of Ni2p3/2 into waveforms corresponding to each chemical state. The peak area corresponding to NiO or the peak area corresponding to Ni ₂ O ₃ accounts for the peak area of Ni2p3/2 To calculate the ratio. The SnO state ratio and SnO ₂ state ratio are calculated by separating the peaks of Sn3d5/2 into waveforms corresponding to each chemical state, and calculating the ratio of the peak area corresponding to SnO or the peak area corresponding to SnO _{2 to} the peak area of Sn3d5/2.

<Three-point bending test> The oxidation-treated plated plates obtained in Examples and Comparative Examples were cut into a size of 50 mm × 50 mm, and a pair of supporting members (support terminal diameter 2 mm, support width) 40mm) In the supported state, it is placed in a state of floating from the reference surface, and in this state, near the center of the opposite two sides of the surface of the oxidation-treated plating plate on which the oxidation-treated plating film is formed, by A three-point bending test was carried out by applying a load of 60 N at a pressure of 5 mm and a width of 50 mm under a condition of 2 mm/min. Then, for the oxidation-treated plated plate before and after the three-point bending test, observe the change in interference fringes using an optical interference fringe meter (product name "Flatness Checker (FT-M100P)", manufactured by Takajiri Optical Industry Co., Ltd.). The following benchmarks are used for evaluation. Before and after the three-point bending test, if no change in interference fringes is observed, it can be judged that the bending strength is excellent; on the other hand, when a change in interference fringes is observed, it can be judged that the bending strength is poor. ○: No change in interference fringe was observed before and after the three-point bending test. ×: Changes in interference fringes were observed before and after the three-point bending test.

<Scratch test> On the surface of the oxidation-treated plated plate obtained in Examples and Comparative Examples, on which the oxidation-treated plated film was formed, a cemented carbide needle was placed in the vertical direction, and a scratch test was carried out with a load of 50 g/kgf applied. The depth of the scar was measured with a laser microscope (manufactured by OLYMPUS, "LEXT (OLS3500)"). The shallower the scar depth, the higher the hardness. 〇: Scar depth is less than 1μm ×: The depth of the scar exceeds 1 μm

<Adhesion of resin for adsorption> SiCCAROL (manufactured by Asahi Group Foods Co., Ltd.) was applied to the adsorption resin layer of the oxidation-treated plated plate provided with the adsorption resin layer obtained in Examples and Comparative Examples, and the adsorption resin layer was cut into a width of 20 mm with a cutter , Peeled off from the end with a length of 20 mm. Adhesive tape ("Super Cloth Tape No. 757 Super" manufactured by Nitto Denko CS Systems Co., Ltd.) was affixed to both sides of the peeling section, using Tensilon universal material testing machine RTC-1350A (made by ORIENTEC Co., Ltd.) toward 180 The peel strength (peel load) of the adsorption resin layer was measured at a speed of 50 mm/min in the ° direction. The higher the peel strength value, the higher the adhesion between the oxidation-treated plate and the adsorption resin layer. In addition, from the viewpoint of adhesion with the resin layer for adsorption, the peel strength value is preferably 0.35 N/20 mm or more; and, as described above, in the manufacturing step of the rack for conveying electronic parts, due to the need to peel off excess adsorption With a resin, the peel strength value is preferably 2 N/20 mm or less from the viewpoint of peelability when peeling such excess adsorption resin.

<<Example 1>> An aluminum plate (Al#5000) with a thickness of 0.68 mm was prepared. Then, degrease the prepared aluminum plate, and sequentially perform the pretreatments of etching, decontamination, 1st zincate, dezincate, and 2nd zincate, and after washing with water between each step, use Ni-P plating A coating bath (a well-known malic acid-succinic acid electroless Ni-P plating bath) is formed on the substrate by electroless plating to form a Ni-P alloy plating layer with a thickness of 10 μm (P content: 12.0 to 12.5 weight %). Next, the aluminum plate on which the Ni-P alloy plating layer was formed was immersed in a 30% by weight H ₂ O ₂ aqueous solution at a immersion temperature of 25° C. and a immersion time of 30 minutes to obtain aluminum On the upper side, an oxidation-treated plated plate formed by an oxidation-treated plated film with a thickness of 10 μm is formed via a base layer containing zinc. Then, with respect to the obtained oxidation-treated plated plate, in accordance with the above-mentioned method, from the results of XPS measurement, the ratio of the presence of oxygen in all the elements, the proportion of the state of the oxide of P, the proportion of the state of NiO, and the proportion of the state of Ni ₂ O ₃ were calculated. And conduct three-point bending test and scratch test. The results are shown in Table 1.

Next, a layer composed of a non-polysiloxane-based resin (polyether-based resin) as a resin for adsorption was formed on the surface of the oxidation-treated plated plate obtained above where the oxidation-treated plating layer was formed, and the temperature was set at 110°C. And heating for 10 minutes to harden the non-silicone-based resin, and form a non-silicone-based resin layer (adsorption resin layer) with a thickness of 100 μm on the oxidation-treated plated plate. Then, the oxidation-treated plated plate provided with the non-polysiloxane-based resin layer was subjected to the measurement of the peel strength in accordance with the above method. The results are shown in Table 1.

"Examples 2-7" Except that the conditions for the oxidation treatment using the H ₂ O ₂ aqueous solution were changed to the conditions shown in Table 1, respectively, an oxidation-treated plated plate and a non-silicon oxide were prepared in the same manner as in Example 1. The resin-plated oxidized plating plate was evaluated in the same manner. The results are shown in Table 1.

"Example 8" A steel sheet obtained by annealing a low-carbon aluminum killed steel cold rolled sheet (thickness 0.25 mm) was prepared. Then, after degreasing, washing, pickling, and washing the prepared steel plate, the following tin plating bath was used to obtain the steel plate with the tin plating layer formed according to the following plating conditions, and the immersion temperature was 70° C. and the immersion time was 20 The conditions were immersed in 6% by weight sodium hypochlorite (NaClO) aqueous solution adjusted to pH 13 with sodium hydroxide (NaOH) for oxidation treatment to obtain an oxidation treatment plating film with a thickness of 1.0 μm formed on the steel plate Oxidation treatment of plated plates. Then, using the obtained oxidation-treated plated plate, evaluation was carried out in the same manner as in Example 1, and the obtained oxidation-treated plated plate was used to produce an oxidation-treated plated plate provided with a non-polysiloxane-based resin layer and evaluated in the same manner. The results are shown in Table 1. <Tin plating bath and tin plating conditions> Tin sulfate 80g/L phenolsulfonic acid 60g/L bath temperature 40℃ current density 10A/dm ²

<<Comparative Example 1>> A plated plate and a plated plate provided with a non-polysiloxane-based resin layer were produced in the same manner as in Example 1 except that the oxidation treatment using the H ₂ O ₂ aqueous solution was not performed, and the same evaluation was performed. The results are shown in Table 1.

<<Comparative Example 2>> An alkali-treated plated plate and a non-silicone-based resin were produced in the same manner as in Example 1, except that alkali treatment using an aqueous solution of sodium hydroxide was performed instead of oxidation treatment using an aqueous solution of H ₂ O ₂ . The alkali-treated plated layer is evaluated in the same way. In addition, the alkali treatment with an aqueous solution of sodium hydroxide was performed using an aqueous solution of sodium hydroxide with a pH of 12 at 95° C. for 30 minutes. The results are shown in Table 1.

"Comparative Example 3" Prepare an aluminum plate (Al#5000) with a thickness of 0.5 mm. Then, the prepared aluminum plate is degreased and washed with water, and then subjected to alumite treatment to obtain an alumite treatment plate. Then, the obtained alumite-treated plate was evaluated in the same manner as in Example 1, and the obtained alumite-treated plate was used to produce an alumite-treated plate provided with a non-polysiloxane-based resin layer and evaluated in the same manner. The results are shown in Table 1.

此外，表1中，「各元素之鍍敷皮膜最表面的氧化狀態比例」係表示各元素中之氧化物的比例(就表2亦同)。亦即，若為例如「NiO」、「Ni₂ O₃ 」，係表示將最表面之全部Ni的化學狀態(Ni單質、Ni氧化物、Ni氧化物以外的Ni化合物)設為100%時之「NiO」之狀態的Ni，或「Ni₂ O₃ 」之狀態的Ni所佔的比例(例如，實施例1中，「NiO」之狀態及「Ni₂ O₃ 」之狀態以外的狀態的Ni係以80.20%的比例存在)。又，若為「P的氧化物」，係表示將最表面之全部P的化學狀態(P單質、P氧化物、P氧化物以外的P化合物)設為100%時之「P的氧化物」之狀態的P所佔的比例；若為「SnO」、「SnO₂ 」，則表示將最表面之全部Sn的化學狀態(Sn單質、Sn氧化物、Sn氧化物以外的Sn化合物)設為100%時之「SnO」之狀態的Sn，或「SnO₂ 」之狀態的Sn所佔的比例。

In addition, in Table 1, "the ratio of the oxidation state on the outermost surface of the plating film of each element" means the ratio of oxides in each element (the same applies to Table 2). That is, if it is "NiO" or "Ni ₂ O ₃ ", it means that the chemical state of all Ni on the outermost surface (Ni element, Ni oxide, Ni compound other than Ni oxide) is set to 100% Ni in the state of "NiO", or the proportion of Ni in the state of "Ni ₂ O ₃ "(for example, in Example 1, Ni in a state other than the state of "NiO" and the state of "Ni ₂ O ₃ " It exists in the proportion of 80.20%). Also, if it is "P oxide", it means "P oxide" when the chemical state of all P on the outermost surface (P element, P oxide, P compound other than P oxide) is set to 100% The proportion of P in the state; if it is "SnO" or "SnO ₂ ", it means that the chemical state of all Sn on the outermost surface (Sn simple substance, Sn oxide, Sn compound other than Sn oxide) is set to 100 The percentage of Sn in the state of "SnO" or Sn in the state of "SnO ₂ "at %.

As shown in Table 1, an oxidation-treated plated coating film containing at least one element selected from Ni, Sn, and P is provided, and Ni ₂ O, which is an Ni-oxidized state, among all Ni elements on the outermost surface of the oxidation-treated plated coating film _When the state ratio of _{3 or} the state ratio of SnO ₂ in Sn oxidation state among all Sn elements on the outermost surface is 1% or more, the strength according to the three-point bending test and the hardness according to the scratch test are excellent, and the resin for adsorption The adhesion (peel strength) was also in an appropriate range, and it was a good result (Examples 1 to 8). On the other hand, even if an oxidation-treated plated coating film containing at least one element selected from Ni, Sn, and P is provided, Ni ₂ O, which is an Ni-oxidized state, of all Ni elements on the outermost surface of the oxidation-treated plated coating film _When the state ratio of _{3 or} the state ratio of SnO ₂ in the Sn-oxidized state among all Sn elements on the outermost surface is less than 1%, the adhesion to the resin for adsorption is insufficient (Comparative Examples 1, 2), and the substitution includes When the oxidation-treated plating film of at least one element selected from Ni, Sn, and P is subjected to alumite treatment, as a result, the strength according to the three-point bending test and the hardness according to the scratch test are low, and even the adhesion of the adsorption resin The properties (peel strength) are too high (Comparative Example 3).

<<Example 9>> An aluminum plate (Al#5000) with a thickness of 0.68 mm was prepared. Then, degrease the prepared aluminum plate, and sequentially perform the pretreatments of etching, decontamination, 1st zincate, dezincate, and 2nd zincate, and after washing with water between each step, use Ni-P plating A coating bath (a well-known malic acid-succinic acid electroless Ni-P plating bath) is formed on the substrate by electroless plating to form a Ni-P alloy plating layer with a thickness of 10 μm (P content: 12.0 to 12.5 weight %). Next, the aluminum plate on which the Ni-P alloy plating layer was formed was immersed in a 15% by weight H ₂ O ₂ aqueous solution under the conditions of an immersion temperature of 70° C. and an immersion time of 10 minutes. On the upper side, an oxidation-treated plated plate formed by an oxidation-treated plated film with a thickness of 10 μm is formed via a base layer containing zinc. Then, with respect to the obtained oxidation-treated plated plate, in accordance with the above-mentioned method, from the results of XPS measurement, the ratio of the presence of oxygen in all the elements, the proportion of the state of the oxide of P, the proportion of the state of NiO, and the proportion of the state of Ni ₂ O ₃ were calculated. And conduct three-point bending test and scratch test. The results are shown in Table 2.

Next, by forming a layer made of dimethylsiloxane (DMS) as a resin for adsorption on the surface of the oxidation-treated plated plate obtained above, on which the oxidation-treated plated layer is formed, at 85° C. for 10 minutes Heating under the conditions to harden the layer composed of dimethylsiloxane (DMS), and form a polydimethylsiloxane (PDMS) layer (adsorption resin layer) with a thickness of 100 μm on the oxidation-treated plated plate. Then, the oxidation-treated plated plate provided with the PDMS layer was subjected to the measurement of the peel strength in accordance with the above method. The results are shown in Table 2.

"Examples 10 to 17" An oxidation-treated plated plate and an oxidation including a PDMS layer were produced in the same manner as in Example 9 except that the conditions for the oxidation treatment using H ₂ O ₂ aqueous solution were changed to the conditions shown in Table 2, respectively. Treat the plated plate and evaluate it in the same way. The results are shown in Table 2.

"Example 18" A steel sheet obtained by annealing a cold-rolled sheet (thickness 0.25 mm) of low-carbon aluminum killed steel was prepared. Then, after degreasing, washing, pickling, and washing the prepared steel plate, the following tin plating bath was used to obtain the steel plate with the tin plating layer formed according to the following plating conditions, and the immersion temperature was 70° C. and the immersion time was 20 The conditions were immersed in a 6% by weight sodium hypochlorite aqueous solution (NaClO) for oxidation treatment to obtain an oxidation treatment plating plate formed by forming an oxidation treatment plating film with a thickness of 1.0 μm on the steel plate. Then, using the obtained oxidation-treated plated plate, evaluation was performed in the same manner as in Example 9, and the obtained oxidation-treated plated plate was used to produce an oxidation-treated plated plate provided with a PDMS layer, and evaluated in the same manner. The results are shown in Table 2. <Tin plating bath and tin plating conditions> Tin sulfate 80g/L Phenol sulfonic acid 60g/L Bath temperature 40℃ Current density 10A/dm ²

"Comparative Example 4" Prepare an aluminum plate (Al#5000) with a thickness of 0.68 mm. Then, the prepared aluminum plate is degreased and washed with water, and then subjected to alumite treatment to obtain an alumite treatment plate. Then, the obtained alumite-treated plate was evaluated in the same manner as in Example 10, and the obtained alumite-treated plate was used to manufacture an alumite-treated plate provided with a PDMS layer and evaluated in the same manner. The results are shown in Table 2.

As shown in Table 2, an oxidation-treated plated coating film containing at least one element selected from Ni, Sn, and P is provided, and Ni ₂ O, which is an Ni-oxidized state, among all Ni elements on the outermost surface of the oxidation-treated plated coating film _When the state ratio of _{3 or} the state ratio of SnO ₂ in Sn oxidation state among all Sn elements on the outermost surface is 1% or more, the strength according to the three-point bending test and the hardness according to the scratch test are excellent, and the resin for adsorption The adhesion (peel strength) was also in an appropriate range, which was a good result (Examples 9 to 18). On the other hand, when performing an alumite treatment instead of an oxidation treatment plating film containing at least one element selected from Ni, Sn, and P, although the adhesion to the adsorption resin (peel strength) is good, it is bent according to three points The strength of the test and the hardness according to the scratch test are lower results (Comparative Example 4).

10: Base material for racks for electronic parts transportation 11: Metal plate 12: Oxidized plating film 20: resin layer 21: Resin adsorption section 30: Mold for forming 31: mold cavity 40: Rack for transporting electronic parts 50: storage area 60: Electronic parts 70: circuit board

FIG. 1 is a cross-sectional view of a base material used in a rack for conveying electronic parts according to this embodiment. FIG. 2 is a diagram showing a manufacturing method of the rack for conveying electronic parts according to this embodiment. FIG. 3 is a diagram showing a method of transporting electronic components using the rack for transporting electronic components according to the present embodiment.

Claims (9)

A base material for a rack for transporting electronic parts, which is a base material for a rack for transporting electronic parts used in a rack for transporting electronic parts provided with a resin adsorption part for attracting electronic parts, wherein The base material in the rack for conveying electronic parts is used to support the resin adsorption part, and includes: a metal plate, and an oxidation treatment plating formed on the metal plate and containing at least one element selected from Ni, Sn, and P Coating film; the ratio of the state of Ni ₂ O ₃ as the Ni oxidation state among all the Ni elements on the outermost surface of the oxidation treatment plating film, or the Sn oxidation state as the Sn oxidation state on all the Sn elements on the outermost surface of the oxidation treatment plating film The state ratio of SnO ₂ is 1% or more. The base material used in the rack for conveying electronic parts according to claim 1, wherein the existence ratio of the oxygen element on the outermost surface of the oxidation treatment plating film is 40 atom% or more. The base material for a rack for conveying electronic parts according to claim 1 or 2, wherein the oxidation-treated plating film is an oxidation-treated plating film containing at least Ni, and NiO on the outermost surface of the oxidation-treated plating film state ratio of Ni ₂ O _3, with "NiO: Ni ₂ O _3" in terms of the ratio of 11.0: 1.0 to 1.0: 99.0. The base material for a rack for conveying electronic parts according to claim 1 or 2, wherein the oxidation treatment plating film is an oxidation treatment plating film containing at least a Ni-P alloy. The base material for a rack for transporting electronic parts according to claim 1 or 2, wherein the proportion of oxides of P in an oxidized state among all the P elements in the oxidation treatment plating film is 21% or more. The base material for a rack for conveying electronic parts according to claim 1 or 2, wherein the thickness of the foregoing oxidation-treated plating film is 1 to 40 μm. The base material for a rack for conveying electronic parts according to claim 1 or 2, wherein the metal plate is an aluminum plate. The base material used in the rack for conveying electronic parts according to claim 1 or 2, wherein, Further comprising a base layer containing zinc on the metal plate, The oxidation treatment plating film is formed on the base layer. A rack for conveying electronic parts, which includes a resin suction part for sucking electronic parts on a base material of the rack for conveying electronic parts as in claim 1 or 2.

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