TWI705888B - Base material for electronic parts transport rack - Google Patents

Abstract

The present invention provides a base material for a rack for conveying electronic parts, which is used in a base material for a rack for conveying electronic parts that is equipped with a resin adsorbing portion for adsorbing electronic parts. , The aforementioned base material for the electronic component conveying rack is used to support the aforementioned resin adsorption part, and includes: a metal plate, and a metal plate formed on the aforementioned metal plate and containing at least one element selected from Ni, Sn, and P Oxidation-treated plating film; the state ratio of Ni ₂ O ₃ in the oxidized state of Ni among all Ni elements on the outermost surface of the above-mentioned oxidation-treated plating film, or Sn among all Sn elements on the outermost surface of the above-mentioned oxidation-treated plating film The proportion of SnO ₂ in the oxidation state is 1% or more.

Description

Base material for electronic parts transport rack

The present invention relates to a base material for an electronic component transportation rack used in an electronic component transportation rack provided with a resin adsorption portion for sucking electronic components.

In the past, as a rack for lifting and transporting semiconductor wafers to a predetermined position, a transport rack was used. In this type of transport rack, the front end of the semiconductor wafer is brought into contact with the vicinity of the center of the semiconductor wafer, and the suction hole is in a vacuum state, so that the semiconductor wafer can be transported while suctioning.

On the other hand, in recent years, in order to realize the multi-function, high-speed and high-density mounting of semiconductor chips, the development of chip stacks in which through electrodes are formed in the chips and flip-chip mounting is performed by bump connection has been continued. technology. A semiconductor wafer with such a through-electrode is provided with a bump electrode wall for connection on the surface of the wafer; in order to bond with the bump electrode wall of the semiconductor wafer laminated on top and bottom, a structure that protrudes higher than the connection pad of the conventional semiconductor wafer is often used .

Therefore, a transfer rack that uses a vacuum state for transportation is sometimes not suitable for the transfer of semiconductor wafers with such through electrodes. As an alternative to the transfer rack, a suction method using adhesives such as resin has been proposed (for example, refer to Patent Document 1). However, in the technique of Patent Document 1, the strength or hardness of the base material of the resin for supporting adsorption, or even the adhesion with the resin, has not been studied. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2010-287679 A

[The problem to be solved by the invention]

The object of the present invention is to provide a base material for an electronic component transport frame that has high strength and hardness and exhibits an appropriate adhesion strength to the resin constituting the resin adsorption portion for adsorbing the electronic component. [Means to solve the problem]

The inventors of the present case have worked hard to achieve the above-mentioned object. As a result, they have discovered that as a base material for an electronic component transport frame equipped with a resin adsorption part for adsorbing electronic components, it is equipped with: a metal plate and formed thereon. An oxidation-treated plating film containing at least one element selected from Ni, Sn, and P on a metal plate, and the state of Ni ₂ O ₃ in the oxidation state of Ni among all the Ni elements on the outermost surface of the oxidation-treated plating film The ratio or the state ratio of SnO ₂ as the Sn oxidation state among all the Sn elements on the outermost surface of the oxidation-treated plating film is controlled to be 1% or more to achieve the above-mentioned object, and finally complete the present invention.

That is, according to the present invention, it is possible to provide a base material for an electronic component transport rack, which is used in an electronic component transport machine equipped with an electronic component transport rack equipped with a resin adsorption portion for adsorbing electronic components The base material of the rack, wherein the base material used for the electronic component transport rack is used to support the resin adsorption part, and is provided with: a metal plate, and a metal plate formed on the metal plate and containing selected from Ni, Sn and P The oxidation treatment plating film of at least one element; the ratio of the state of Ni ₂ O ₃ as the oxidation state of Ni among all the Ni elements on the uppermost surface of the oxidation treatment plating film, or the ratio of the state of the uppermost surface of the oxidation treatment plating film The proportion of SnO ₂ in the oxidation state of Sn among all Sn elements is 1% or more. In addition, the ratio of the state ratio of Ni ₂ O ₃ in the oxidized state of Ni among all Ni elements on the outermost surface of the oxidation-treated plating film, or SnO in the oxidized state of Sn among all the Sn elements on the outermost surface of the oxidation-treated plating film The state ratio of ₂ is preferably more than 5%.

In the base material used in the electronic component transport frame of the present invention, the oxygen element content on the outermost surface of the oxidation-treated plating film is more preferably 40 atom% or more. Preferably, the oxidation-treated plating film is an oxidation-treated plating film containing at least Ni, and the state ratio of NiO and Ni ₂ O ₃ on the outermost surface of the oxidation-treated plating film is expressed as "NiO: Ni ₂ The ratio of O ₃ "is preferably 11.0:1.0~1.0:99.0, more preferably 7.0:1.8~23.8:76.2, still more preferably 7.0:1.8~27.4:72.6. Preferably, the aforementioned oxidation-treated plating film is an oxidation-treated plating film containing at least a Ni-P alloy. Preferably, the state ratio of P oxide in an oxidized state among all P elements in the aforementioned oxidation-treated plating film is 21% or more. Preferably, the thickness of the aforementioned oxidation-treated plating film is 1-40 μm. Preferably, the aforementioned metal plate is an aluminum plate. The base material used for the electronic component transport frame of the present invention preferably further includes a base layer containing zinc on the metal plate, and the oxidation-treated plating film is preferably formed on the base layer.

Furthermore, according to the present invention, it is possible to provide a rack for transporting electronic components, which is provided with a resin adsorbing portion for sucking electronic components on the base material of the rack for transporting electronic components. [Effects of Invention]

According to the present invention, it is possible to provide a base material for electronic parts transport racks which is high in strength and hardness and exhibits appropriate adhesion strength to the resin constituting the resin adsorption portion for adsorbing electronic parts, and uses such a base material for electronic parts A frame for transferring electronic parts obtained from the base material of a frame for transferring parts.

FIG. 1 is a cross-sectional view showing the structure of a base material 10 used in an electronic component transport frame of the present embodiment. As shown in FIG. 1, the base material 10 used for the electronic component conveyance frame of this embodiment is formed by forming the oxidation treatment plating film 12 as the outermost layer on the metal plate 11. The oxidation-treated plating film 12 contains at least one element selected from the group consisting of Ni, Sn, and P. The proportion of Ni ₂ O ₃ in the oxidation state of Ni among all Ni elements on the outermost surface, or the proportion of all Sn elements on the outermost surface as The proportion of SnO ₂ in the oxidation state of Sn is 1% or more.

＜Manufacturing method of rack for conveying electronic parts＞ First, before describing in detail the base material 10 used in the electronic component transport frame of this embodiment, the electronic components obtained by using the base material 10 used in the electronic component transport frame of this embodiment will be described with reference to FIG. A manufacturing method of a rack for parts transport.

First, as shown in FIG. 2(A), the base material 10 (hereinafter referred to as the "base material 10" for convenience) for the electronic component transport frame of the present embodiment is prepared. Next, as shown in FIG. 2(B), a resin layer 20 made of resin for adsorption is formed. The resin layer 20 is formed on the side of the substrate 10 on which the oxidation-treated plating film 12 (refer to FIG. 1) is formed.

Next, as shown in FIG. 2(C), a molding die 30 having a plurality of cavities 31 is pressed against the resin layer 20 formed on the substrate 10 and heated while applying pressure to form the resin layer 20 The adsorption resin is formed into a shape corresponding to the mold cavity 31; thereby, as shown in Figure 2(D), a substrate 10 is formed with a plurality of resin adsorption parts 21 composed of adsorption resin Rack 40 for conveying electronic parts.

In addition, the thus-obtained electronic component conveying rack 40 has a view of further improving the conveying performance of electronic components, and the excess remaining in the periphery of the area (that is, near the center portion) where the plurality of resin adsorption portions 21 are formed The resin for adsorption is preferably removed by peeling from the base material 10 or the like.

Then, the electronic component transport frame 40 manufactured in this way is shown in FIG. 3(A). By pressing the plurality of electronic components 60 placed in the storage area 50, the plurality of resin adsorption parts 21 suck A plurality of electronic components 60, and as shown in FIG. 3(B), the plurality of electronic components 60 are transported to the circuit board 70 for mounting the electronic components, and then, by pressing on the circuit board 70, the Each electronic component 60 is mounted on the circuit board 70 and used.

The resin for adsorption for forming the resin layer 20 is not particularly limited. Based on the viewpoint that it has suitable adhesiveness and can more conveniently transport electronic parts, a polydimethylsiloxane (PDMS) or the like can be used. Silicone-based resin. As the polysiloxane-based resin, in addition to polydimethylsiloxane, it is also preferable to use one having a siloxane bond as the main skeleton and containing any of a hydroxyl group, an amino group, a methyl group, a carboxyl group, and a ketone group. Functional group.

Alternatively, non-silicone resins can be used instead of polysilicone resins. Examples of non-silicone resins include polyether resins or polyester resins. Among these, polyether resins are preferred. Resin. The polyether resin preferably has an ether bond as the main skeleton and contains any one of a hydroxyl group, an amino group, a methyl group, a carboxyl group, and a ketone group as a functional group; and, the polyester resin preferably has an ester A bond is a main skeleton, and any one of a hydroxyl group, an amino group, a methyl group, a carboxyl group, and a ketone group is included as a functional group. In addition, as non-polysiloxane resins, urethane resins, polylactic acid resins, and fluorine resins may also be used. As the urethane-based resin, polylactic acid-based resin, and fluorine-based resin, it is suitable to use, for example, any one of a urethane bond, an ester bond, an ether bond, and an amide bond as the main skeleton, and a hydroxyl group, Any one of an amino group, a methyl group, a carboxyl group, and a ketone group is a functional group.

The resin for adsorption may be either curable resin (thermosetting resin or ultraviolet curable resin) or thermoplastic resin. For example, when a thermosetting resin is used as the resin for adsorption, in the step shown in FIG. 2(C), a molding die 30 having a plurality of cavities 31 is pressed against the resin layer 20 formed on the substrate 10 and When heating while applying pressure, it can be formed into a shape corresponding to the resin adsorption portion 21 and hardened.

＜Base material 10 for electronic parts conveyance frame＞ As described above, the base material 10 used for the electronic component transport frame of this embodiment is shown in FIGS. 2(A) to 2(D) to obtain the electronic component transport frame 40. Specifically, the base material 10 used in the electronic component transport frame of the present embodiment is used as a support base material for supporting the resin adsorption portion 21.

As shown in FIG. 1, the base material 10 used in the electronic component transport frame of the present embodiment is formed by forming an oxidation treatment plating film 12 as the outermost layer on a metal plate 11.

The metal plate 11 is not particularly limited, and examples include steel plates, stainless steel plates, copper plates, aluminum plates, aluminum alloy plates, and nickel plates. Among these, in terms of low price, steel plate, aluminum plate, or aluminum alloy plate is preferable. Furthermore, from the viewpoint that the weight of the frame 40 for conveying electronic parts can be reduced, thereby reducing the energy required for conveying electronic parts, an aluminum plate or an aluminum alloy plate is preferable. The thickness of the metal plate 11 is not particularly limited, but it is preferably 0.3 to 2 mm, more preferably 0.5 to 0.8 mm from the viewpoint of handling and handling when electronic components are transported.

The oxidation-treated plating film 12 is a plating film formed on the metal plate 11, and at least the surface thereof is oxidized to form the outermost layer of the base 10. In this embodiment, the oxidation-treated plating film 12 contains at least one element selected from Ni, Sn, and P (preferably contains at least one element selected from Ni and Sn), and all Ni elements on the outermost surface as the state of Ni ₂ O ₃ ratio of the oxidation state of Ni (i.e., in terms of Ni element in Ni ₂ O ₃ with respect to the oxidation state of Ni ₂ O ₃ other than the simple substance of Ni or NiO and other oxides, Ni oxides other than the Ni The total state ratio of the compound and Ni ₂ O ₃ ), or the state ratio of SnO ₂ as the oxidation state of Sn among all the Sn elements on the outermost surface (that is, the ratio of SnO ₂ calculated as Sn element to Sn element or SnO ₂ The ratio of the total state of the Sn compound and SnO ₂ other than the oxide in the oxidation state and the Sn oxide is 1% or more.

According to this embodiment, by forming the oxidation-treated plating film 12 as the outermost layer on the metal plate 11 and making the oxidation-treated plating film 12 into such a configuration, it can be used for the base material 10 of the electronic component transport rack. The strength and hardness are higher, and the resin for adsorption constituting the resin adsorption portion 21 exhibits an appropriate adhesion strength. In particular, when manufacturing the electronic component transport frame 40, it is necessary to press the molding die 30 with a predetermined pressure on the base material 10 for the electronic component transport frame as shown in the steps shown in FIG. 2(C). Therefore, it is required that the base material 10 used for the electronic component conveyance frame can effectively suppress the deformation, damage or scratches caused by the pressing of the molding die 30. Furthermore, since the base material 10 used for the electronic component transport frame is used to support the resin adsorption part 21, it is required to have excellent adhesion with the adsorption resin constituting the resin adsorption part 21; Excess resin for adsorption in parts other than the resin adsorption part 21 (for example, adsorption resin that remains around the area where a plurality of resin adsorption parts 21 are formed (that is, near the center)) may be peeled off, etc. It is removed, and shows the degree of adhesion (that is, the adhesion is too high) that can be appropriately removed. Furthermore, if scratches occur in the step, the smoothness will deteriorate, and there will also be a problem of deterioration in transport performance.

In contrast, according to the present embodiment, by having the above-mentioned structure of the base material 10 used in the electronic component transport frame, the strength and hardness are high, and the resin for adsorption that constitutes the resin adsorption portion 21 can exhibit an appropriate adhesion strength; Therefore, according to this embodiment, such a problem can be appropriately solved.

The oxidation treatment plating film 12 contains at least one element selected from Ni, Sn, and P, and the ratio of the state of Ni ₂ O ₃ as the oxidation state of Ni among all the Ni elements on the outermost surface, or all the Sn elements on the outermost surface The proportion of the state of SnO ₂ as the oxidation state of Sn is only 1% or more; as the adsorption resin for forming the resin adsorbing part 21, when a silicone resin is used, the proportion of the state of Ni ₂ O ₃ , or SnO ₂ The ratio of the state of is preferably in the range of 1.75 to 72.6%, more preferably in the range of more than 5% and 72.6% or less, and still more preferably in the range of 7.5 to 49.4%. In addition, when polyether resin, polyester resin, fluorine resin, urethane resin, or polylactic acid resin is used as the adsorption resin for forming the resin adsorbing portion 21, all Ni elements on the outermost surface The ratio of the state of Ni ₂ O ₃ as the oxidation state of Ni, or the ratio of the state of SnO ₂ as the oxidation state of Sn among all the Sn elements on the outermost surface is more preferably in the range of 7.5 to 100%, and still more preferably 7.97 to 72.6% The range is more preferably 7.97 ~ 30%. If the ratio of Ni ₂ O ₃ as the oxidation state of Ni among all the Ni elements on the outermost surface, or the ratio of the state of SnO ₂ as the oxidation state of Sn among all the Sn elements on the outermost surface is too low, the adhesion to the resin for adsorption insufficient.

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Ni, the Ni on the outermost surface of the oxidation-treated plating film is based on the viewpoint that it can exhibit more appropriate adhesion strength to the resin for adsorption constituting the resin adsorbing part 21 The state ratio of NiO to Ni ₂ O ₃ is preferably 11.0:1.0~1.0:99.0 in terms of the ratio of "NiO:Ni ₂ O ₃ ", more preferably 7.0:1.8~23.8:76.2, and even more preferably 7.0: 1.8~27.4: 72.6. The state ratio of NiO and Ni ₂ O ₃ can be measured by X-ray photoelectron spectroscopy (XPS) on the surface of the oxidation-treated plating film 12 to obtain the integral value of the peak of Ni element, the integral value of the peak of NiO, and Ni ₂ O the peak integration value _3, and then calculates all NiO under these outermost surface state of the Ni element and the ratio of Ni ₂ O _3, and obtains status Ni ₂ O ₃ and NiO ratio.

In addition, for the oxidation-treated plating film 12, the state ratio of Ni ₂ O ₃ as the oxidation state of Ni among all the Ni elements on the outermost surface, or the state ratio of SnO ₂ as the oxidation state of Sn among all the Sn elements on the outermost surface is the above The range is sufficient; the ratio of the oxygen element on the outermost surface is preferably 40.0 atom% or more, more preferably 40.6 atom% or more, and still more preferably 43.0 atom% or more. The upper limit of the proportion of oxygen on the outermost surface is not particularly limited, but it is preferably 53 atom% or less, and more preferably 45 atom% or less. By setting the ratio of the oxygen element on the outermost surface within the above range, the adhesion to the resin for adsorption can be further improved. In this embodiment, the proportion of oxygen elements on the outermost surface of the oxidation-treated plating film 12 can be determined by measuring the surface of the oxidation-treated plating film 12 by X-ray photoelectron spectroscopy (XPS). The peak integral value of each oxide of the film 12 is calculated by calculating the oxygen element existing ratio (atom%) from the obtained peak integral value.

In addition, the oxidation-treated plating film 12 may further contain Zn in addition to at least one element selected from Ni, Sn, and P. When the oxidation-treated plating film 12 is an oxidation-treated plating film that further contains Zn, based on the viewpoint that more appropriate adhesion strength can be exhibited to the resin for adsorption constituting the resin adsorbing portion 21, all the Zn elements on the outermost surface are in an oxidized state The state ratio of ZnO as Zn is preferably 19% or more. In addition, the proportion of ZnO ₂ as Zn in the oxidized state among all the Zn elements on the outermost surface is preferably 1% or more, and more preferably 69% or more. The state ratio of ZnO and ZnO ₂ can be measured by X-ray photoelectron spectroscopy (XPS) and X-ray photoelectron spectroscopy (XPS) on the surface of the oxidation-treated coating film 12, and the integral value of the peak of Zn element and the value of ZnO can be obtained. integral value of the integral value of the peak and the peak of ZnO ₂ and the like thereby calculates the entire uppermost surface of the ZnO of Zn and the ratio of ZnO state _2, the state is obtained of ZnO and ZnO ₂ ratio.

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Sn, based on the viewpoint that it can exhibit a more appropriate adhesion strength to the resin for adsorption constituting the resin adsorbing portion 21, one of the outermost surfaces of the oxidation-treated plating film 12 The proportion of SnO as the oxidation state of Sn among all Sn elements is preferably 19% or more. In addition, the state ratio of SnO ₂ as the Sn oxidation state among all the Sn elements on the outermost surface of the oxidation-treated plating film 12 is preferably 1% or more, and more preferably 69% or more. The state ratio of SnO and SnO ₂ can be measured by X-ray photoelectron spectroscopy (XPS) on the surface of the oxidation-treated plating film 12, and the integral value of the peak of Sn element, the integral value of the peak of SnO and the peak of SnO ₂ Integral value, and then calculate the state ratio of SnO and SnO ₂ of all Sn elements on the outermost surface, and obtain the state ratio of SnO and SnO ₂ .

When the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least P, based on the viewpoint that it can exhibit more appropriate adhesion strength to the resin for adsorption constituting the resin adsorbing portion 21, one of the outermost surfaces of the oxidation-treated plating film 12 The proportion of the oxide of P in an oxidized state among all P elements is 21% or more, more preferably 24% or more. The upper limit of the state ratio of the oxide of P in an oxidized state among all P elements is not particularly limited, but is preferably 97% or less, and more preferably 60% or less. The state ratio of P oxide can be determined by X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above.

Furthermore, the oxidation-treated plating film 12 can achieve a higher balance of strength, hardness, and adhesion to the adsorption resin constituting the resin adsorbing portion 21, and further improve the flatness of the surface of the oxidation-treated plating film 12 In view of this, it is possible to transport finer electronic parts with high accuracy. It is more preferable to contain at least an oxidation-treated plating film of Ni-P alloy; at this time, the oxidation-treated plating film 12 has NiO and Ni on the outermost surface state ₂ O ₃ ratio, in order: specific "NiO Ni ₂ O _3" the count of 11.0: 1.0 to 1.0: 99.0. More preferably, it is 7.0:1.8~23.8:76.2, and even more preferably is 7.0:1.8~27.4:72.6. The state ratio of NiO and Ni ₂ O ₃ can be calculated from the results of X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above. In addition, the content of P in the Ni-P alloy is preferably 1-13% by weight, more preferably 5-13% by weight, and still more preferably 8-13% by weight. The content ratio of P in the Ni-P alloy can be determined by X-ray photoelectron spectroscopy (XPS) measurement in the same manner as described above.

The thickness of the oxidation-treated plating film 12 is not particularly limited. Based on the viewpoint that the strength and hardness of the base material 10 used in the electronic component transport frame are more sufficient, it is preferably 1-40 μm, more preferably 1-20 μm, and still more It is preferably 1 to 10 μm, and more preferably 5 to 10 μm.

The method of forming the oxidation-treated plating film 12 on the metal plate 11 is not particularly limited. For example, when the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Ni, the metal plate 11 is plated. Nickel, and then oxidize the formed nickel plating film. The method of oxidation treatment is not particularly limited. Examples include a method of heat-treating the formed nickel plating film, and a method of immersing in a liquid such as hydrogen peroxide (H ₂ O ₂ ), hypochlorite, etc. , Methods of steam treatment, etc. Moreover, these can also be combined. The conditions for the heat treatment are not particularly limited. The heat treatment temperature is preferably 130 to 300°C, and the heat treatment time is preferably 10 to 30 minutes. In addition, the conditions in the treatment of immersion in hydrogen peroxide water are not particularly limited. The concentration of the hydrogen peroxide water is preferably 1 to 35% by weight, more preferably 15 to 35% by weight, and the immersion temperature (hydrogen peroxide water The temperature) is preferably 25 to 90°C, more preferably 25 to 70°C, and the immersion time is preferably 20 seconds to 120 minutes, more preferably 20 seconds to 60 minutes. Furthermore, the conditions in the water vapor treatment are not particularly limited, but are preferably 40 to 100% RH, more preferably 65 to 100% RH, and the water vapor temperature is preferably 40 to 120°C, more preferably 65 to 85 ℃, the treatment time is preferably 1 minute to 72 hours, more preferably 12 to 24 hours. In addition, when the oxidation-treated plating film 12 contains Ni and P (that is, when Ni-P alloy is included), Ni-P plating is performed to form a Ni-P alloy plating film, and the Ni-P alloy A method of heat-treating the plating film, a method of immersing it in a liquid such as hydrogen peroxide (H ₂ O ₂ ), hypochlorite, or a method of steaming. At this time, the conditions in the heat treatment, the treatment in hydrogen peroxide water, and the steam treatment can be the same as those described above.

In addition, when the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least Zn, or when an oxidation-treated plating film containing at least Sn is used, the metal plate 11 may be galvanized or tin-plated, and The zinc-plated film and tin-plated film formed are oxidized. The method of oxidation treatment is not particularly limited. Examples include a method of heat-treating the formed zinc-plated film and tin-plated film, a method of immersing in a liquid such as hydrogen peroxide water, or a method of steam treatment. Methods etc. Moreover, these can also be combined. The conditions for the heat treatment, the treatment by immersion in hydrogen peroxide water, and the steam treatment can be the same as those described above.

In addition, when the oxidation-treated plating film 12 is an oxidation-treated plating film containing at least P, a method of performing galvanization or tin plating on the metal plate 11 as necessary, followed by a phosphate treatment with phosphate, and the like can be mentioned.

In addition, in this embodiment, it is also possible to adopt a structure in which an oxidation-treated plating film 12 is directly provided on the metal plate 11. Based on the viewpoint that the oxidation-treated plating film 12 is formed well, the metal plate 11 is preliminarily formed After forming the base layer containing zinc as the base layer, it is preferable to form the oxidation-treated plating film 12 on the base layer containing the zinc.

The method of forming a zinc-containing underlayer is not particularly limited, and a method of degreasing the metal plate 11, followed by etching or pickling as necessary, followed by displacement plating of zinc is mentioned. Zinc displacement plating can be carried out through the first zinc displacement treatment (1st zincate treatment), zinc nitrate stripping treatment (dezincate treatment), and second zinc displacement treatment (2nd zincate). Double zincate treatment is performed. At this time, water washing treatment is implemented after the treatment of each step.

According to the base material 10 used for the electronic component transport frame of the present embodiment as described above, since it has high strength and hardness, and exhibits appropriate adhesion strength to the resin for adsorption constituting the resin adsorption portion 21, it can be suitably used as It constitutes a support base material for electronic parts transport racks for transporting various electronic parts, and is especially suitable for electronic parts transport racks for transporting micro LEDs, capacitors, semiconductor components and other fine electronic parts. [Example]

Examples are given below to illustrate the present invention in more detail, but the present invention is not limited to these examples. In addition, the evaluation method of each characteristic is as follows.

<XPS measurement> For the oxidation-treated plated plates formed in the examples and comparative examples (for the plated plates not subjected to oxidation treatment in Comparative Example 1, and the anodized aluminum treated plates in Comparative Examples 3 and 4, the following measures and evaluations The description is the same) surface oxidation treatment plating film (for the anodized aluminum treatment surface in Comparative Examples 3 and 4, the following descriptions for each measurement and evaluation are the same) surface, using X-ray photoelectron spectroscopy (ULVAC-PHI) Manufactured by the company, model: VersaProbeII) Measure the peaks of Ni2p3/2, Sn3d5/2, P2p, and O1s respectively. The proportion of oxygen in all elements is measured by argon sputter etching after 2nm, and calculated from the proportion of the peak area of O1s to the sum of the peak areas of Ni2p3/2, Sn3d5/2, P2p, and O1s (in total The measurement results of the oxygen content ratio are performed for Examples 7, 8, Comparative Example 2, Examples 9, 10, 16-18). The ratio of P oxides is calculated by separating the above-mentioned P2p peaks into waveforms corresponding to each chemical state, and is calculated from the ratio of the peak area of P oxides to the peak area of P2p. The state ratio of NiO and the state ratio of Ni ₂ O ₃ separate the peak of Ni2p3/2 into waveforms corresponding to each chemical state. The peak area of NiO or the peak area of Ni ₂ O ₃ accounts for the peak area of Ni2p3/2. To calculate the ratio. State ratio of SnO and status proportion of SnO ₂ tie separated peaks Sn3d5 / 2 is to correspond to each of the chemical state of the waveform, corresponding to SnO peak area or a corresponding SnO peak area ₂ of representing the peak area Sn3d5 / 2 of the ratio calculated.

＜Three-point bending test＞ The oxidation-treated plated plates obtained in the Examples and Comparative Examples were cut into a size of 50mm×50mm, and the two opposite sides of the sample with a size of 50mm×50mm were placed on a pair of support members (support terminal diameter 2mm, support width 40mm) supported, placed in a floating state from the reference surface, and in this state, near the center of the two opposing sides of the oxidation-treated plated sheet on which the oxidation-treated plating film is formed, borrow A three-point bending test was performed by an indenter with a radius of 5 mm and a width of 50 mm, and a load of 60 N was applied at 2 mm/min. Then, for the oxidation-treated plated plates before and after the three-point bending test, an optical interference fringe meter (product name "Flatness Checker (FT-M100P)", manufactured by Mizojiri Optical Industry Co., Ltd.) was used to observe the interference fringe changes. The following benchmarks are used for evaluation. Before and after the three-point bending test, if no change in interference fringes is observed, it can be judged that the bending strength is good; on the other hand, if the change in interference fringes is observed, it can be judged that the bending strength is bad. ○: No change in interference fringes was observed before and after the three-point bending test. ×: Changes in interference fringes were observed before and after the three-point bending test.

＜Scratch test＞ For the oxidation-treated plated sheets obtained in the Examples and Comparative Examples, the surface on which the oxidation-treated plating film was formed was placed with a cemented carbide needle in the vertical direction, and a scratch test was carried out under a load of 50g/kgf. A radio microscope (manufactured by OLYMPUS, "LEXT (OLS3500)") was used to measure the depth of the scar. The shallower the depth of the scar, the higher the hardness. ○: The depth of the scar is 1μm or less ×: The scar depth exceeds 1μm

＜Adhesion of resin for adsorption＞ SiCCAROL (manufactured by Asahi Group Foods Co., Ltd.) was coated on the adsorption resin layer of the oxidation-treated plated plate with the adsorption resin layer obtained in the Examples and Comparative Examples, and the adsorption resin layer was cut into a width of 20 mm with a cutter , Peel off from the end with a length of 20mm. Adhesive tape ("Super Cloth Tape No.757 Super", manufactured by Nitto Denko CS Systems Co., Ltd.) on both sides of the peeling part, using Tensilon Universal Material Testing Machine RTC-1350A (manufactured by ORIENTEC Co., Ltd.) to 180 The measurement of the peeling strength (peeling load) of the above-mentioned adsorption resin layer was performed at a speed of 50 mm/min in the ° direction. The higher the peel strength value, the higher the adhesion between the oxidation-treated plated plate and the resin layer for adsorption. In addition, from the viewpoint of adhesion to the resin layer for adsorption, the peel strength value should preferably be 0.35N/20mm or more; and, as mentioned above, in the manufacturing steps of the electronic component transport frame, it is sometimes necessary to peel off excess adsorption. Resin is used, and from the viewpoint of peelability when peeling off such excess resin for adsorption, the peel strength value is preferably 2N/20mm or less.

"Example 1" An aluminum plate (Al#5000) having a thickness of 0.68 mm was prepared. Then, the prepared aluminum plate is degreased, followed by etching, decontamination, 1st zincate, dezincate, and 2nd zincate pretreatments. After washing in each step, use Ni-P plating Plating bath (the well-known malic acid-succinic acid electroless Ni-P plating bath), a Ni-P alloy plating layer with a thickness of 10μm is formed on the substrate by electroless plating (P content: 12.0~12.5 weight %). Next, the aluminum plate on which the Ni-P alloy plating layer is formed is immersed in a 30% by weight H ₂ O ₂ aqueous solution under the conditions of an immersion temperature of 25° C. and an immersion time of 30 minutes to perform oxidation treatment. Above, an oxidation-treated plated sheet formed by forming an oxidation-treated plating film with a thickness of 10 μm via a base layer containing zinc. Then, for the obtained oxidation-treated plated board, following the above method, the proportion of oxygen in all elements, the proportion of P oxide, the proportion of NiO, and the proportion of Ni ₂ O ₃ are calculated from the results of XPS measurement. And carry out three-point bending test and scratch test. The results are shown in Table 1.

Next, a layer composed of a non-polysiloxane resin (polyether resin) as an adsorption resin was formed on the surface of the oxidation-treated plated plate obtained above on which the oxidation-treated plating layer was formed, and heated at 110°C. , Heat for 10 minutes to harden the non-silicone resin, and form a 100μm thick non-silicone resin layer (resin layer for adsorption) on the oxidation-treated plating plate. Then, the peeling strength of the oxidation-treated plated board provided with the non-silicone-based resin layer was measured according to the above method. The results are shown in Table 1.

"Examples 2 to 7" Except that the conditions of the oxidation treatment using the H ₂ O ₂ aqueous solution were changed to the conditions shown in Table 1, the oxidation treatment plated plate and the non-polysiloxane were produced in the same manner as in Example 1. It is the oxidation-treated plated board of the resin layer and evaluated in the same way. The results are shown in Table 1.

"Example 8" A steel sheet obtained by annealing a cold rolled sheet (thickness 0.25 mm) of low carbon aluminum killed steel was prepared. Then, after degreasing, washing, pickling, and washing the prepared steel sheet, use the following tin plating bath to obtain a steel sheet with a tin-plated layer under the following plating conditions, and set the immersion temperature to 70°C and the immersion time to 20 It is immersed in an aqueous solution of sodium hypochlorite (NaClO) adjusted to pH 13 with sodium hydroxide (NaOH) to be 6% by weight for oxidation treatment to obtain an oxidation-treated plating film with a thickness of 1.0 μm on the steel sheet. The oxidation treatment of the plated board. Then, the obtained oxidation-treated plated board was evaluated in the same manner as in Example 1, and the obtained oxidation-treated plated board was used to produce an oxidation-treated plated board provided with a non-polysiloxane-based resin layer and evaluated in the same manner. The results are shown in Table 1. <Tin plating bath and tin plating conditions> Tin sulfate 80g/L Phenolic sulfonic acid 60g/L Bath temperature 40℃ Current density 10A/dm ²

"Comparative Example 1" Except that the oxidation treatment using the H ₂ O ₂ aqueous solution was not performed, a plated plate and a plated plate provided with a non-polysiloxane-based resin layer were produced in the same manner as in Example 1, and evaluated in the same manner. The results are shown in Table 1.

"Comparative Example 2" Except for the alkali treatment using an aqueous sodium hydroxide solution instead of the oxidation treatment using an aqueous H ₂ O ₂ solution, an alkali-treated plated plate and non-polysiloxane resin were produced in the same manner as in Example 1. The alkali-treated plated board of the layer was evaluated in the same way. In addition, the alkali treatment using an aqueous sodium hydroxide solution uses an aqueous sodium hydroxide solution of pH=12, and is performed under conditions of 95°C and 30 minutes. The results are shown in Table 1.

"Comparative Example 3" Prepare an aluminum plate (Al#5000) with a thickness of 0.5mm. Then, the prepared aluminum plate is degreased, washed with water, and then treated with anodized aluminum to obtain an anodized aluminum plate. Then, the obtained anodized aluminum treated board was evaluated in the same manner as in Example 1, and the obtained anodized aluminum treated board was used to produce an anodized aluminum treated board provided with a non-polysiloxane-based resin layer and evaluated in the same manner. The results are shown in Table 1.

此外，表1中，「各元素之鍍敷皮膜最表面的氧化狀態比例」係表示各元素中之氧化物的比例(就表2亦同)。亦即，若為例如「NiO」、「Ni₂ O₃ 」，係表示將最表面之全部Ni的化學狀態(Ni單質、Ni氧化物、Ni氧化物以外的Ni化合物)設為100%時之「NiO」之狀態的Ni，或「Ni₂ O₃ 」之狀態的Ni所佔的比例(例如，實施例1中，「NiO」之狀態及「Ni₂ O₃ 」之狀態以外的狀態的Ni係以80.20%的比例存在)。又，若為「P的氧化物」，係表示將最表面之全部P的化學狀態(P單質、P氧化物、P氧化物以外的P化合物)設為100%時之「P的氧化物」之狀態的P所佔的比例；若為「SnO」、「SnO₂ 」，則表示將最表面之全部Sn的化學狀態(Sn單質、Sn氧化物、Sn氧化物以外的Sn化合物)設為100%時之「SnO」之狀態的Sn，或「SnO₂ 」之狀態的Sn所佔的比例。

In addition, in Table 1, the "proportion of oxidation state of the uppermost surface of the plating film of each element" indicates the proportion of oxides in each element (the same applies to Table 2). That is, if it is, for example, "NiO" or "Ni ₂ O ₃ ", it means that the chemical state of all Ni on the outermost surface (Ni element, Ni oxide, Ni compound other than Ni oxide) is set to 100% The ratio of Ni in the state of "NiO" or Ni in the state of "Ni ₂ O ₃ "(for example, in Example 1, the state of Ni in the state other than the state of "NiO" and the state of "Ni ₂ O ₃ " Department exists in the proportion of 80.20%). Also, if it is "P oxide", it means "P oxide" when the chemical state of all P on the top surface (P element, P oxide, P compound other than P oxide) is set to 100% The proportion of P in the state; if it is "SnO", "SnO ₂ ", it means that the chemical state of all Sn on the top surface (Sn element, Sn oxide, Sn compound other than Sn oxide) is set to 100 % Sn in the state of "SnO" or the proportion of Sn in the state of "SnO ₂ ".

As shown in Table 1, there is an oxidation-treated plating film containing at least one element selected from Ni, Sn, and P, and all Ni elements on the outermost surface of the oxidation-treated plating film are Ni ₂ O in the oxidation state of Ni ₃ , or when the proportion of SnO ₂ as Sn oxidation state among all Sn elements on the outermost surface is 1% or more, the strength according to the three-point bending test and the hardness according to the scratch test are excellent, and the resin for adsorption The adhesiveness (peel strength) is also within an appropriate range, which is a good result (Examples 1 to 8). On the other hand, even when an oxidation-treated plating film containing at least one element selected from Ni, Sn, and P is provided, all Ni elements on the outermost surface of the oxidation-treated plating film are Ni ₂ O in the oxidation state of Ni ₃ , or when the proportion of SnO ₂ as the oxidation state of Sn in all the Sn elements on the outermost surface is less than 1%, the adhesion to the resin for adsorption is insufficient (Comparative Examples 1 and 2), and instead of containing When an oxidation-treated plating film of at least one element selected from Ni, Sn and P is applied to anodized aluminum treatment, the strength according to the three-point bending test and the hardness according to the scratch test are low, and it is even tightly bonded to the resin for adsorption The properties (peel strength) are too high (Comparative Example 3).

"Example 9" An aluminum plate (Al#5000) with a thickness of 0.68 mm was prepared. Then, the prepared aluminum plate is degreased, followed by etching, decontamination, 1st zincate, dezincate, and 2nd zincate pretreatments. After washing in each step, use Ni-P plating Plating bath (the well-known malic acid-succinic acid electroless Ni-P plating bath), a Ni-P alloy plating layer with a thickness of 10μm is formed on the substrate by electroless plating (P content: 12.0~12.5 weight %). Next, the aluminum plate on which the Ni-P alloy plating layer is formed is immersed in a 15% by weight H ₂ O ₂ aqueous solution under the conditions of an immersion temperature of 70°C and an immersion time of 10 minutes to perform oxidation treatment. Above, an oxidation-treated plated sheet formed by forming an oxidation-treated plating film with a thickness of 10 μm via a base layer containing zinc. Then, for the obtained oxidation-treated plated board, following the above method, the proportion of oxygen in all elements, the proportion of P oxide, the proportion of NiO, and the proportion of Ni ₂ O ₃ are calculated from the results of XPS measurement. And carry out three-point bending test and scratch test. The results are shown in Table 2.

Next, a layer composed of dimethylsiloxane (DMS) as an adsorption resin was formed on the surface of the oxidation-treated plated plate obtained above, on which the oxidation-treated plating layer was formed, and heated at 85°C for 10 minutes Under the conditions of heating, the layer composed of dimethylsiloxane (DMS) is hardened, and a polydimethylsiloxane (PDMS) layer (adsorption resin layer) with a thickness of 100μm is formed on the oxidation-treated plating plate. Then, for the oxidation-treated plated board with the PDMS layer, the peel strength was measured according to the above method. The results are shown in Table 2.

"Examples 10-17" Except that the conditions of the oxidation treatment using the H ₂ O ₂ aqueous solution were changed to the conditions shown in Table 2, the oxidation treatment plated board and the oxidation treatment with PDMS layer were produced in the same manner as in Example 9 Treat the plated board and evaluate it in the same way. The results are shown in Table 2.

"Example 18" A steel sheet obtained by annealing a cold rolled sheet (thickness 0.25 mm) of low carbon aluminum killed steel was prepared. Then, after degreasing, washing, pickling, and washing the prepared steel sheet, use the following tin plating bath to obtain a steel sheet with a tin-plated layer under the following plating conditions, and set the immersion temperature to 70°C and the immersion time to 20 It is immersed in a 6 wt% sodium hypochlorite aqueous solution (NaClO) to perform oxidation treatment according to the conditions, and an oxidation-treated plated plate having an oxidation-treated plating film with a thickness of 1.0 μm is formed on a steel sheet. Then, using the obtained oxidation-treated plated board, evaluation was performed in the same manner as in Example 9, and the obtained oxidation-treated plated board was used to produce an oxidation-treated plated board provided with a PDMS layer, and the evaluation was performed in the same manner. The results are shown in Table 2. <Tin plating bath and tin plating conditions> Tin sulfate 80g/L Phenolic sulfonic acid 60g/L Bath temperature 40℃ Current density 10A/dm ²

"Comparative Example 4" Prepare an aluminum plate (Al#5000) with a thickness of 0.68mm. Then, the prepared aluminum plate is degreased, washed with water, and then treated with anodized aluminum to obtain an anodized aluminum plate. Then, the obtained anodized aluminum treated board was evaluated in the same manner as in Example 10, and the obtained anodized aluminum treated board was used to produce a PDMS layer-equipped anodized aluminum treated board and evaluated in the same manner. The results are shown in Table 2.

As shown in Table 2, there is an oxidation-treated plating film containing at least one element selected from Ni, Sn, and P, and Ni ₂ O in the oxidation state of Ni among all the Ni elements on the outermost surface of the oxidation-treated plating film ₃ , or when the proportion of SnO ₂ as Sn oxidation state among all Sn elements on the outermost surface is 1% or more, the strength according to the three-point bending test and the hardness according to the scratch test are excellent, and the resin for adsorption The adhesiveness (peel strength) was also within an appropriate range, which was a good result (Examples 9-18). On the other hand, when anodized aluminum treatment is performed instead of an oxidation-treated plating film containing at least one element selected from Ni, Sn, and P, the adhesion (peel strength) to the resin for adsorption is good, but according to three-point bending The strength of the test and the hardness according to the scratch test are lower results (Comparative Example 4).

10: Base material for electronic parts transport rack 11: metal plate 12: Oxidation treatment plating film 20: Resin layer 21: Resin adsorption part 30: Mold for forming 31: Mould cavity 40: Rack for conveying electronic parts 50: storage area 60: Electronic parts 70: Circuit board

Fig. 1 is a cross-sectional view of a base material used in a frame for conveying electronic parts according to this embodiment. Fig. 2 is a diagram showing a method of manufacturing the electronic component transport rack of the present embodiment. Fig. 3 is a diagram showing a method of transporting electronic components using the electronic component transport rack of the present embodiment.

Claims (10)

A substrate for a rack for transporting electronic parts, which is used for a substrate for a rack for transporting electronic parts that is equipped with a resin adsorbing portion for adsorbing electronic parts. The base material of the electronic component transport frame is used to support the aforementioned resin adsorption part, and is provided with: a metal plate, and an oxidation treatment plating formed on the aforementioned metal plate and containing at least one element selected from Ni, Sn, and P Coating film; the ratio of the state ratio of Ni ₂ O ₃ as the oxidation state of Ni in all the Ni elements on the outermost surface of the aforementioned oxidation-treated plating film, or the ratio of all the Sn elements on the outermost surface of the aforementioned oxidation-treated plating film as the Sn oxidation state The state ratio of SnO ₂ is 1% or more and 72.6% or less. The base material for the electronic component conveyance rack of claim 1, wherein the oxygen element on the outermost surface of the oxidation treatment plating film is 40 atom% or more. According to claim 1 or 2, the base material for electronic parts transport racks, wherein the oxidation-treated plating film is an oxidation-treated plating film containing at least Ni, and the uppermost surface of the oxidation-treated plating film is NiO state ratio of Ni ₂ O _3, with "NiO: Ni ₂ O _3" in terms of the ratio of 11.0: 1.0 to 1.0: 99.0. According to claim 1 or 2, the base material for the electronic component conveyance rack, wherein the oxidation-treated plating film is an oxidation-treated plating film containing at least a Ni-P alloy. According to claim 1 or 2, the base material for the electronic component transport frame, wherein the state ratio of the oxide of P in the oxidized state among all the P elements in the oxidation-treated plating film is 21% or more. Such as claim 1 or 2 for the base material for the electronic parts conveyance frame, wherein the thickness of the aforementioned oxidation-treated plating film is 1-40 μm. Such as claim 1 or 2 for the base material for the electronic component conveying rack, wherein the aforementioned metal plate is an aluminum plate. According to claim 1 or 2, a base material for a rack for conveying electronic parts, wherein the metal plate further includes a base layer containing zinc, and the oxidation-treated plating film is formed on the base layer. According to claim 1 or 2, a base material for a rack for conveying electronic parts, wherein the peel strength value with respect to the resin layer for resin adsorption constituting the resin adsorption portion is 0.35N/20mm or more. A rack for conveying electronic parts, which is used as claim 1 or 2 The base material of the electronic component conveyance rack is provided with a resin suction part for suction of electronic components.

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