JP2023156385A - Element mounting device and method for adjusting element mounting device - Google Patents

Abstract

To provide an element mounting device, a mounting method for the element mounting device, and an element mounting method with which it is possible to easily and more reliably pick up elements in multiple rows and multiple columns.SOLUTION: An element mounting device 1 comprises a carrier base 3, a mounting table 4, a transfer unit 5, and tilt mechanisms 33, 58a, 58b. The carrier base 3 is a supply base on which a carrier C carrying elements in a row is placed. The mounting table is where a substrate S is placed, on which elements are arranged. The transfer unit moves between the carrier base and the mounting table, collectively picking up elements in multiple rows and multiple columns from the carrier C and collectively transferring the picked elements in multiple rows and multiple columns to the substrate. The tilt mechanisms 33, 58a, 58b are capable of tilting at least one of the placement face of the carrier base, the holding face of the transfer unit, and the placement face of the mounting table, as the object to tilt, and adjusting the placement face of the carrier base, the holding face of the transfer unit, and the placement face of the mounting table in parallel.SELECTED DRAWING: Figure 4

Description

The present invention relates to an element mounting apparatus, an adjustment method for an element mounting apparatus, and an element mounting method.

2. Description of the Related Art Element mounting apparatuses that mount elements such as semiconductor elements, resistors, and capacitors onto a substrate on which a circuit pattern is formed have become widespread. The element mounting apparatus has an element transfer section that reciprocates between an element supply body stocked with elements and a substrate on which the elements are mounted. The transfer section picks up the elements one by one from the element supply body, holds and transports the elements to the substrate, and removes the elements onto the substrate. A conductive bonding material such as ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), NCP (Non Conductive Paste) or homogeneous eutectic solder is formed on the substrate. The element is mounted on the substrate by placing the element and applying heat and pressure.

In recent years, miniaturization of elements has progressed at an extremely rapid pace. Elements with a side size of 200 μm or less, such as 50 μm or 10 μm, have also been proposed. These elements are, for example, mini LEDs or micro LEDs with a diameter of 50 μm or 10 μm, and are arranged in multiple rows and multiple columns as RGB pixels on a display substrate for a display, and are also arranged on a lighting substrate as a light emitting body for a backlight. When mounting LEDs as pixels on a display board, if the display board supports 4K, it is necessary to mount at least 8 million LEDs in one color of RGB on the display board, and each element is mounted one by one. There was a problem with production efficiency.

Therefore, a plan has been proposed to improve production efficiency by picking up multiple elements at once and mounting them on a board at once. That is, an element mounting apparatus has been proposed that includes a transfer section having a holding surface that includes multiple rows and multiple columns of devices, and that picks up multiple rows and multiple columns of devices at once using this holding surface.

For example, suction such as vacuum suction or electrostatic suction is often used as a method for holding an element by a transfer section. When vacuum suction is employed, a large number of suction holes are formed on the holding surface of the transfer unit. Each suction hole is connected to a pneumatic circuit having a compressor and an ejector, and negative pressure is generated in each suction hole. The transfer unit picks up the elements from the element supply body in bulk by sucking the elements into the suction hole using negative pressure, transports them to the substrate, and removes the elements on the substrate by releasing the negative pressure by breaking the vacuum or opening to the atmosphere. Let go. When electrostatic adsorption is employed, a number of mesa-shaped structures are formed on the base substrate, and electrodes and dielectric layers are provided on the mesa-shaped structures. The electrostatic force generating section having this mesa-shaped structure serves as a local attraction point for the elements, and the elements are collectively attracted to each electrostatic force generating section by the electrostatic force caused by the application of voltage.

Special table 2015-505736 publication

When handling multiple rows and multiple columns of elements at once, it is necessary to maintain parallelism between the holding surface of the transfer section and the element supply body, and between the holding surface of the transfer section and the substrate with high precision. There is a risk of dropping the elements from the element feeder, there is a risk of applying an excessive load to some elements during pickup, there is a risk of poor bonding of the elements to the board, and there is a risk of applying an excessive load to some elements during mounting. This is to eliminate it.

The present invention was proposed in order to solve the above-mentioned problems, and provides an element that can easily and more reliably pick up multiple rows and multiple columns of elements at once and mount them on a board at once. The present invention aims to provide a mounting apparatus, a method for adjusting the device mounting apparatus, and a method for mounting the device.

In order to achieve the above object, an element mounting apparatus according to the present invention includes a supply table on which an element feeder on which elements are arranged in an array is placed, and a substrate on which the elements are arranged in an array. and a holding surface that holds the elements arranged in multiple rows and multiple columns, and which moves between the supply table and the mounting table and holds the elements arranged in multiple rows and multiple columns from the element supply body. a transfer section that picks up the multi-row, multi-column elements from the holding surface to the substrate at once on a surface; a mounting surface of the supply table; and a holding surface of the transfer section; At least one of the mounting surfaces of the mounting table is tilted as a tilting target, and the mounting surface of the supply table and the holding surface of the transfer section, and the holding surface of the transfer section and the mounting surface of the mounting table. and a tilt mechanism that can adjust the angles so that they are parallel to each other.

The tilt mechanism may be a manual tilt mechanism that tilts the object to be tilted by manual operation of a knob, an electric tilt mechanism that uses a motor as a power source to tilt the object to be tilted, or both of these.

The tilt mechanism may be provided in the transfer unit and provided in one or both of the supply table or the mounting table, and the tilt mechanism provided in the transfer unit may be the manual tilt mechanism. good.

The tilt mechanism provided on one or both of the supply table and the mounting table may be the electric tilt mechanism.

The electric tilt mechanism is provided on each of the supply table and the mounting table, and includes a displacement sensor for detecting the inclination of the holding surface of the transfer section, the mounting surface of the supply table, and the mounting surface of the mounting table. It may be further provided.

The tilt mechanism is provided in the transfer section and the supply table, and the tilt mechanism of the transfer section adjusts the holding surface of the transfer section to be parallel to the mounting surface of the mounting table, The tilt mechanism of the supply table may adjust the mounting surface of the supply table to be parallel to the holding surface of the transfer section.

The manual tilt mechanism may tilt the tilting object by 0.0003° or more and 0.15° or less when the knob rotates once.

The electric tilt mechanism includes a cam follower that supports a tilting object, and an inclined part that moves the cam follower in an ascending and descending direction of an inclined surface, and the inclined part rises by a height of 1 mm or less when horizontally moved by 10 mm. It may also have an inclination.

In addition, in order to achieve the above object, the method for adjusting an element mounting apparatus according to the present invention includes a supply table on which an element feeder in which elements are arranged in an array is placed, and a supply table in which the elements are arranged in an array. It has a mounting table on which a substrate is placed, and a holding surface that holds a multi-row, multi-column element, and the device is moved between the supply table and the mounting table, and the multi-row, multi-column device is moved from the element supply body to the mounting table. A method for adjusting an element mounting apparatus, comprising: a transfer section that picks up the elements in a batch on the holding surface and transfers the picked up multi-row, multi-column elements from the holding surface to the substrate in a batch; , at least one of the mounting surface of the supply table, the holding surface of the transfer section, and the mounting surface of the mounting table is tilted as a tilting object, and the mounting surface of the supply table and the holding surface of the transfer section are tilted. and adjusting in advance so that the holding surface of the transfer section and the mounting surface of the mounting table are parallel to each other.

a tilt mechanism that uses a motor as a drive source to tilt the mounting surface of the supply table and the mounting surface of the mounting table; the holding surface of the transfer section; the placement surface of the supply table; and the placement surface of the mounting table; A displacement sensor for detecting the inclination of the element mounting apparatus. Detecting the inclination of the mounting surface, and using the tilt mechanism, the mounting surface of the supply table and the holding surface of the transfer section, and the holding surface of the transfer section and the mounting surface of the mounting table are made parallel in advance. It may be adjusted as follows.

Further, in order to achieve the above object, the device mounting method according to the present invention includes picking up multiple rows and multiple columns of devices by attaching them to a holding surface from an device feeding body in which devices are arranged in an array, and picking up the devices by attaching them to a holding surface. A device mounting method in which the picked up multi-row, multi-column devices are collectively transferred from the holding surface to the substrate with a surface facing the substrate, the device mounting method comprising: the element feeder and the holding surface; and the holding surface and the The present invention is characterized by including an adjustment step of making the substrate parallel to the substrate in advance.

According to the present invention, it is possible to pick up all the elements at once without dropping any elements from the element supply body and without applying an excessive load to some of the elements. Further, the held elements can be accurately joined to the substrate and removed all at once without applying an excessive load to some of the elements.

FIG. 1 is a perspective view showing a schematic configuration of an element mounting apparatus. It is a perspective view which shows typically the adhesive sheet with which the transfer part was mounted|worn. FIG. 2 is a cross-sectional view of a pressure-sensitive adhesive sheet made of a thermally releasable sheet, in which (a) shows the state before heating, and (b) shows the state after locally heating. FIG. 2 is a front view showing the detailed configuration of the element mounting apparatus. FIG. 2 is a side view showing the detailed configuration of the element mounting apparatus. It is a block diagram of a carrier stand and a tilt mechanism, (a) is a top view, (b) is a side view. FIG. 3 is a diagram showing a detailed configuration of a transfer section. It is a figure showing the detailed structure of the tilt mechanism of a transfer part seen from the direction perpendicular to the XZ plane. FIG. 6 is a diagram showing the detailed configuration of the tilt mechanism of the transfer unit as seen from a direction perpendicular to the YZ plane. 3 is a flowchart showing the operation of the element mounting apparatus according to the embodiment. FIG. 2 is a configuration diagram of an element mounting apparatus according to a second embodiment. It is a flowchart which shows the operation|movement which detects and adjusts the inclination of a holding surface. FIG. 3 is a schematic diagram showing the state of the device when detecting the inclination of the holding surface. FIG. 3 is a schematic diagram showing irradiation of a holding surface with a laser beam. It is a flowchart which shows the operation|movement which detects and adjusts the inclination of the mounting surface of a mounting stand. FIG. 3 is a schematic diagram showing the state of the equipment when detecting the inclination of the mounting surface of the mounting table. FIG. 3 is a schematic diagram showing laser light irradiation onto the mounting surface of the mounting table. It is a block diagram which shows another example of installation of a laser measuring device.

Embodiments of an element mounting apparatus and a mounting method according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
(Schematic configuration)
An element mounting apparatus according to a first embodiment will be described. FIG. 1 is a schematic diagram showing a schematic configuration of an element mounting apparatus. As shown in FIG. 1, a carrier C and a substrate S are carried into the element mounting apparatus 1. As shown in FIG. The carrier C is an element supply body in which elements E are stocked in an array. An array is a state in which the elements E are arranged in multiple rows and columns according to a predetermined pattern, and the spacing in the row and column directions is the same or different, such as a checkerboard arrangement, a honeycomb pattern, etc. This is a staggered arrangement like this. Element E is a component used in electronic circuits, and includes chips such as MEMS, semiconductor elements, resistors, and capacitors. Semiconductor elements include discrete semiconductors such as transistors, diodes, LEDs, and thyristors, as well as ICs, LSIs, etc. includes integrated circuits. LEDs include so-called mini LEDs and micro LEDs. In particular, the element E includes a so-called microcomponent having a side of 200 μm or less. The substrate S has a circuit pattern formed thereon, and is, for example, an illumination substrate for a backlight on which mini-LEDs are arranged, or a display substrate on which RGB micro-LEDs are arranged as pixels.

This device mounting apparatus 1 picks up multiple rows and multiple columns of devices E from a carrier C at once, and transfers the multiple rows and multiple columns picked up devices E to a substrate S at once. Then, this element mounting apparatus 1 manufactures an element mounting board in which the elements E are arranged in an array by transferring the elements E arranged in multiple rows and multiple columns to the substrate S multiple times. Further, this element mounting apparatus 1 electrically and mechanically joins the transferred element E to the substrate S. Such an element mounting apparatus 1 is also called a die bonding apparatus or a chip bonding apparatus.

The element mounting apparatus 1 includes a carrier table 3, a mounting table 4, and a transfer section 5. The carrier table 3 is a supply table for the carrier C, which has a placement surface on which the carrier C is placed, and stops at a pickup position 21 . That is, the carrier stand 3 stops a group of elements E in multiple rows and multiple columns to be picked up among the elements E stocked in an array arrangement on the carrier C so that the center position thereof is located at the pickup position 21. let The mounting table 4 is a supply table for the substrate S having a mounting surface on which the substrate S is placed, and stops at the mounting position 22 . That is, the mounting table 4 stops the circuit pattern on the substrate S, on which the multi-row, multi-column group of elements E is mounted by the transfer section 5, so that the center position thereof is located at the mounting position 22.

The transfer unit 5 transfers the element E from the carrier C to the substrate S. This transfer section 5 moves between a pickup position 21 and a mounting position 22. Then, the transfer unit 5 faces the carrier C placed on the carrier stand 3 at the pick-up position 21, and picks up multiple rows and multiple columns of elements E from the carrier C all at once. Further, the transfer section 5 faces the substrate S placed on the mounting table 4 at the mounting position 22, and transfers the held multi-row, multi-column elements E to the substrate S all at once.

The method of picking up the element E by the transfer section 5 is, for example, pasting. The transfer section 5 is provided with a flat holding surface 51a, and the adhesive sheet A is attached to this holding surface 51a. As shown in FIG. 2, the adhesive sheet A has an adhesive area A1 on one side that is the same as or slightly wider than the area where the elements E are arranged in multiple rows and multiple columns. The inside of the adhesive area A1 has adhesive force throughout. In other words, it is not necessary to pinpoint all of the elements E in multiple rows and multiple columns, and the adhesive sheet A exerts adhesive force when each element E contacts any area of the adhesive sheet A. Then, each element E is attached. The slightly wider adhesive area A1 extends to the space between a group of elements E scheduled to be picked up and an element E adjacent to the outside of the group of elements E, but does not reach the adjacent element E. Within a certain range.

The transfer unit 5 attaches this adhesive sheet A to the holding surface 51a so that the adhesive area A1 faces the element E at the pickup position 21 and the adhesive area A1 faces the substrate S at the mounting position 22. The transfer unit 5 transfers all the elements E in the adhesive area A1 from the carrier C to the adhesive sheet A at once by pressing the adhesive sheet A against the elements E on the carrier C. Further, the transfer unit 5 brings all the held elements E into contact with the substrate S at once, loses or lowers the adhesive force of the adhesive sheet A, and transfers all the elements E from the adhesive sheet A to the substrate S at once. and let them leave. A conductive bonding material is formed on the substrate S in advance. The conductive bonding material electrically and mechanically connects the substrate S and the element E by alloy bonding, conductive particle pressure bonding, bump pressure bonding, etc., and is hardened by heating. For example, ACF, ACP, NCF, NCP or homogeneous eutectic solder is formed on the substrate S as a conductive bonding material.

Note that the carrier table 3 on which the carrier C is placed is capable of adjusting the inclination of its placement surface, and is set in advance to be parallel to the holding surface 51a of the transfer section 5. Further, the transfer section 5 that holds the element E can be tilt-adjusted, and the mounting surface of the mounting table 4 on which the substrate S is mounted and the holding surface 51a are aligned in advance in parallel. Therefore, all the elements E that fit within the adhesive area A1 can be picked up at once from the carrier C without being missed or without applying an excessive load to some of the elements E. In addition, all the elements E held can be joined to the substrate S with high precision, and can be removed at once without applying an excessive load to some of the elements E.

An example of adhesive sheet A will be shown below. The adhesive sheet A is, for example, a thermally releasable sheet whose adhesive strength is lost or reduced by heat at a specified temperature. As shown in FIG. 3, the adhesive sheet A has a two-layer structure of a base material A2 and an adhesive layer A3. Adhesive layer A3 includes an adhesive and foam filler A4. The foam filler A4 is formed by filling an elastic shell with a substance that gasifies and expands when heated. In this adhesive sheet A, the volume of the foam filler A4 expands due to heat, and the adhesion area with the element E decreases, so that the adhesive force to the element E is lost or reduced. That is, the transfer unit 5 brings the element E into contact with the substrate S and then heats the adhesive sheet A to peel the element E from the adhesive sheet A and transfer it to the substrate S. Examples of thermally releasable sheets include those in which a phase transition from solid to liquid occurs within the adhesive layer, as long as the adhesive force can be controlled by heat.

(Detailed configuration)
The above element mounting apparatus 1 will be explained in more detail. FIG. 4 is a front view showing the detailed configuration of the element mounting apparatus 1, and FIG. 5 is a side view showing the detailed configuration of the element mounting apparatus 1.

As shown in FIGS. 4 and 5, the element mounting apparatus 1 includes a pedestal 6. As shown in FIGS. The pedestal 6 is a table with a flat top surface, and the carrier pedestal 3, the mounting pedestal 4, the transfer part 5, and the elevating part 9 are installed. Inside the pedestal 6, a control means 11 such as a computer or microcomputer having a CPU, ROM, RAM, and a signal transmission circuit for controlling each part of the element mounting apparatus 1 is housed. Further, the transfer unit 5 holds the adhesive sheet A by suction, and the pedestal 6 accommodates a pneumatic circuit 12 that supplies negative pressure to the transfer unit 5 as a suction force. A signal transmission circuit is provided that controls the solenoid valve to switch between negative pressure generation and negative pressure release.

Hereinafter, the uniaxial direction parallel to the top surface of the pedestal 6 will be referred to as the X-axis direction. The Y-axis direction is parallel to the top surface of the pedestal 6 and perpendicular to the X-axis, the Z-axis direction is a height direction perpendicular to the X-axis and Y-axis directions, and θ rotation refers to rotation around the Z-axis. refers to Further, the direction from the top surface of the pedestal 6 to the outside of the pedestal 6 along the Z-axis direction is referred to as upward, and the direction from the top surface of pedestal 6 to the inside of pedestal 6 along the Z-axis direction is referred to as downward.

The carrier stand 3 has a mounting surface that extends two-dimensionally in the X-axis and Y-axis directions. This carrier stand 3 includes an X-axis drive mechanism 31, a Y-axis drive mechanism 32, and a tilt mechanism 33, is movable in the X-axis direction and the Y-axis direction, and is also capable of changing the inclination of the mounting surface. The movable range in the X-axis direction includes the pickup position 21 and a loading/unloading position for loading and unloading the carrier C with respect to the carrier table 3. This X-axis drive mechanism 31 is used to align the carrier C and the transfer section 5 in the X-axis direction. Further, the Y-axis drive mechanism 32 is used to align the carrier C and the transfer section 5 in the Y-axis direction. Further, the tilt mechanism 33 is used to adjust the parallelism with the transfer unit 5, and tilts the mounting surface of the carrier table 3.

As the X-axis drive mechanism 31 and the Y-axis drive mechanism 32, for example, a ball screw mechanism can be adopted. The rail and the ball screw extend along their respective movable directions. A ball screw is composed of a rotary motor, a screw shaft, and a slider.The slider is screwed onto the screw shaft, and the screw shaft is rotated by the rotary motor. The X-axis drive mechanism 31 is fixed to the slider of the Y-axis drive mechanism 32 and placed on the rail of the Y-axis drive mechanism 32. The carrier stand 3 is fixed to the slider of the X-axis drive mechanism 31 and placed on the rail of the X-axis drive mechanism 31.

The tilt mechanism 33 is an electric tilt mechanism that combines a ball screw mechanism and a cam follower mechanism, and uses a motor as a power source to tilt an object to be tilted. FIG. 6 shows a detailed configuration of this tilt mechanism 33. FIG. 6A is a top view of the carrier stand 3, and portions of the tilt mechanism 33 that are hidden behind the carrier stand 3 are indicated by broken lines. FIG. 6(b) is a side view of the carrier stand 6.

As shown in FIG. 6, the tilt mechanism 33 includes a rotary motor 331, a screw shaft 332, a cam 333, and a cam follower 334. The screw shaft 332 is rotated by a rotation motor 331 such as a stepping motor. The screw shaft 332 is restricted from moving in the axial direction by a bearing 337. The cam 333 is a cylindrical body that is long along the threaded shaft 332, has a threaded groove formed on the inner peripheral surface of the cylinder, and is screwed into the threaded shaft 332. This cam 333 includes an inclined portion 335. The inclined portion 335 rises from the outer circumferential surface of the cam 333, has a generally right triangular shape, and has an inclined surface 336 that increases continuously in the axial direction. The cam follower 334 is movable in the Z-axis direction. The cam follower 334 is pressed against the inclined surface 336 of the cam 333 by, for example, a tension spring, and follows the inclined surface 336 of the cam 333.

In this tilt mechanism 33, when the rotation motor 331 is driven, the screw shaft 332 rotates. When the screw shaft 332 rotates, the cam 333 moves in the direction in which the screw shaft 332 extends. When the cam 333 moves, the cam follower 334 climbs the slope 336 and is pushed up in a direction perpendicular to the screw shaft 332, or is lowered down the slope 336 in a direction perpendicular to the screw shaft 332. The sloped surface 336 of the sloped portion 335 preferably has a slope whose height increases by 1 mm or less with respect to a movement of 10 mm in the horizontal direction, in order to improve the precision of parallelism adjustment and achieve high rigidity.

The carrier stand 3 includes three sets of the tilt mechanisms 33 and is supported by three cam followers 334. That is, the tilt mechanism 33 is arranged between the arrangement of the X-axis drive mechanism 31 and the Y-axis drive mechanism 32 and the carrier table 3. Three cam followers 334 are arranged at corner positions of an equilateral triangle to support the carrier table 3 as a tilting object. With this configuration, the tilt mechanism 33 can adjust the mounting surface of the carrier stand 3 to be parallel to the holding surface 51a of the transfer section 5. Note that the arrangement of the three cam followers 334 is not limited to an equilateral triangular arrangement, but may be an isosceles triangular arrangement. For example, in FIG. 6A, the position of the central cam follower 334 on the near side may be set as the apex angle of an isosceles triangle, and the remaining two cam followers 334 may be arranged at the positions of both base angles of the isosceles triangle. In the case of an isosceles triangle arrangement, it is desirable that the base of the isosceles triangle be located closer to the opposite edge than the edge of the carrier platform 3 on which the cam follower 334 at the apex is arranged.

Returning to FIGS. 4 and 5, the mounting table 4 has a mounting surface that extends two-dimensionally in the X-axis and Y-axis directions. This mounting table 4 is also movable in the X-axis direction and the Y-axis direction, and is provided with an X-axis drive mechanism 41 and a Y-axis drive mechanism 42 that are formed by a ball screw mechanism. The Y-axis drive mechanism 42 is mainly used for loading and unloading the substrate S placed on the mounting table 4, and is also used for positioning the substrate S and the transfer unit 5 in the Y-axis direction. Further, the X-axis drive mechanism 41 is used to align the transfer section 5 and the substrate S in the X-axis direction.

The transfer unit 5 is installed on a raised table 61, and moves by itself along a straight line connecting the pickup position 21 and the mounting position 22, which are spaced apart in the X-axis direction, and also moves between the pickup position 21 and the mounting position 22. It is possible to descend in the Z-axis direction toward the carrier stand 3 and mounting stand 4 located therein.

Here, the raised stand 61 is one step higher than the upper surface of the pedestal 6 and extends along the pickup position 21 and the mounting position 22. A rail 63 is laid on the raising table 61 along the X-axis direction. The rail 63 is a guide for the transfer unit 5 that moves between the pickup position 21 and the mounting position 22. The rail 63 has a length that can reach the carrier table 3 located at the pickup position 21 and the mounting table 4 located at the mounting position 22. The rail 63 is held by a support part 64. The support section 64 is a block body that supports the transfer section 5, and is further driven by a ball screw 65 constituted by a rotary motor and a threaded shaft that is rotated by the rotary motor.

The support portion 64 extends in the Y-axis direction on a straight line connecting the pickup position 21 and the mounting position 22. The transfer section 5 is attached to the extending end surface 67 of the support section 64 . A rail 66 extending in the Z-axis direction is laid on this extended end surface 67. The transfer section 5 is attached to the support section 64 by gripping the rail 66 with a slider 591, and is slidable in the Z-axis direction.

The lifting section 9 lowers the transfer section 5 located at the pick-up position 21 toward the carrier table 3 by pushing down the transfer section 5 that is slidable in the Z-axis direction, and lowers the transfer section 5 located at the pickup position 21 toward the carrier table 3 and moves the transfer section 5 located at the mounting position 22. The transfer section 5 is lowered toward the mounting table 4. First, a column 62 is provided on the pedestal 6 and is located behind the raising table 61 and extends higher than the transfer section 5 . The upper end of the support column 62 is bent in the Y-axis direction and protrudes directly above the movement trajectory of the transfer section 5. The elevating section 9 is installed on the extending end surface 69 of this support column 62.

That is, a rail 91 extending in the Z-axis direction is laid on the extending end surface 69 of the support column 62 . Further, a screw shaft 93 that is rotated by a rotary motor 92 is installed parallel to the rail 91 on the extending end surface 69 of the support column 62 . Furthermore, an abutment block 94 is attached by gripping the rail 91 and being screwed onto the screw shaft 93. The abutting block 94 is moved downward toward the transfer section 5 by the rotation motor 92, comes into contact with the upper end of the transfer section 5, and further pushes down the transfer section 5. The transfer section 5 is urged upward by a biasing means such as a spring (not shown), and the contact block 94 pushes down the transfer section 5 against this biasing means. When the contact block 94 separates from the transfer section 5 and the pressing force by the contact block 94 is released, the transfer section 5 is returned to the raised position shown in FIGS. 4 and 5 by the biasing means. Become.

Note that the transfer section 5 is movable along the rail 63 to just above the pickup position 21 and the mounting position 22. Therefore, the contact block 94 is long in the X-axis direction so as to fit at least both the pickup position 21 and the mounting position 22 within its range, and is in contact with the transfer section 5 no matter where the transfer section 5 is located. It can be pushed down. Further, the transfer section 5 may be connected to the contact block 94 in a movable state in the X-axis direction.

FIG. 7 is a schematic diagram showing the detailed configuration of the transfer section 5. As shown in FIG. The transfer section 5 includes various parts mounted on a bracket 59. The bracket 59 has a slider 591 that grips the rail 66, and an abutment block receiver 54 is mounted on the bracket 59. The abutment block receiver 54 is a member that comes into contact with the abutment block 94. When the abutment block receiver 54 is pressed by the abutment block 94, the transfer section 5 moves up and down along the rail 66.

A head 51 is provided at the tip of the transfer section 5 in the downward direction, and a cylinder 52 is connected to the head 51 . The head 51 is a holding part that holds the adhesive sheet A on a holding surface 51a, and heats the conductive bonding material formed on the adhesive sheet A and the substrate S by generating heat. The holding surface 51a is rectangular and flat, extending parallel to the carrier base 3 and the mounting base 4. Negative pressure is applied to the head 51, and the head 51 uses the negative pressure to attract and hold the adhesive sheet A on the holding surface 51a. The cylinder 52 is a pressure source such as an air cylinder, for example, and presses the adhesive sheet A against the element E through the head 51 by applying a load to the head 51, and also presses the adhesive sheet A onto the element E through the head 51 at the mounting position 22. is pressed onto the substrate S.

Here, the head 51 has a porous structure, has suction holes 51b, or has both a porous structure and suction holes 51b. For example, the head 51 is made of ceramic whose main material is aluminum nitride or silicon nitride and has a porous structure. Alternatively, the head 51 may be made of stainless steel, for example. The inside of the porous structure of the head 51 or the suction hole 51b is connected to the pneumatic circuit 12, and negative pressure is generated on the holding surface 51a through the porous structure of the head 51 and through the through hole 51b provided in the head 51. Then, the adhesive sheet A is held by suction.

Furthermore, a heater 56 and a blower 57 are installed inside the head 51. The heater 56 is a heat source such as a pulse heater, and heats the head 51, and the blower 57 cools the head 51 by jetting air. This heater 56 is controlled by the control means 11. The heater 56 heats the head 51 under the control of the control means 11 while the element E is in contact with the substrate S. Further, the heater 56 interrupts or weakens the heating except when the element E is in contact with the substrate S, and the blower 57 cools the head 51 except when the element E is in contact with the substrate S. .

The transfer unit 5 includes a camera 55 that detects the positional deviation of the head 51 and corrects the rotation of the head 51, and a θ rotation unit 53, and a tilt mechanism that changes the orientation of the holding surface 51a of the adhesive sheet A of the head 51. 58a and 58b. The camera 55 is installed beside the row of heads 51 and cylinders 52, and detects relative positional deviations between the transfer section 5 and the carrier C, and between the transfer section 5 and the substrate S. The θ rotation unit 53 rotates the head 51 around the Z axis to align the element E on the carrier C and the circuit pattern on the substrate S.

The tilt mechanisms 58a and 58b are manual tilt mechanisms that are connected between the cylinder 52 and the θ rotation unit 53, and that tilt an object to be tilted by manual operation, and change the direction of the head 51. The tilt mechanism 58a and the tilt mechanism 58b will be explained in more detail with reference to FIGS. 8 and 9. FIG. 8 is a diagram illustrating the detailed configuration of the tilt mechanism of the transfer unit viewed from a direction orthogonal to the XZ plane, and FIG. 9 is a diagram illustrating the detailed configuration of the tilt mechanism of the transfer unit viewed from a direction orthogonal to the YZ plane. be. Note that FIG. 8 shows only the detailed structure of the tilt mechanism 58a, and FIG. 9 shows only the detailed structure of the tilt mechanism 58b. Note that the tilting object of the tilt mechanism 58a and the tilt mechanism 58b is the holding surface 51a of the head 51.

As shown in FIGS. 8 and 9, each of the tilt mechanisms 58a and 58b includes a base 581 having a concave curved surface 582 and a sliding portion 583 having a convex curved surface 584. The sliding part 583 of the tilt mechanism 58a for tilting the XZ plane is fixed to the cylinder 52, the base 581 of the tilt mechanism 58a for tilting the XZ plane and the sliding part 583 of the tilt mechanism 58b for tilting the YZ plane are fixed, and the sliding part 583 of the tilt mechanism 58b for tilting the YZ plane is fixed. A base 581 of a tilt mechanism 58b for plane tilting is fixed to the rotation axis of the θ rotation section 53.

The base 581 and sliding portion 583 of each tilt mechanism 58a and 58b have a concave curved surface 582 and a convex curved surface 584 having the same curvature, and the concave curved surface 582 and the convex curved surface 584 rub against each other. The circular centers of the concave curved surface 582 and the convex curved surface 584 are located at the center of the holding surface 51a. The sliding portion 583 rotates around the holding surface 51a of the head 51 while the convex curved surface 584 slides on the concave curved surface 582, thereby changing the direction of the head 51.

In the tilt mechanism 58a for tilting in the XZ plane, the base 581 and the sliding part 583 are positioned so that the concave curved surface 582 and the convex curved surface 584 extend in the X-axis direction in an arc. The shape of the concave curved surface 582 and the convex curved surface 584 in the cross section along the XZ plane is chevron-shaped, and the shape of the concave curved surface 582 and the convex curved surface 584 in the cross section along the YZ plane is flat. Therefore, the head 51 swings along the XZ plane by the tilt mechanism 58a.

Further, in the tilt mechanism 58b for tilting in the YZ plane, the base 581 and the sliding portion 583 are positioned so that the concave curved surface 582 and the convex curved surface 584 extend in the Y-axis direction while drawing a circular arc. The shape of the concave curved surface 582 and the convex curved surface 584 in the cross section along the YZ plane is chevron-shaped, and the shape of the concave curved surface 582 and the convex curved surface 584 in the cross section along the XZ plane is flat. Therefore, the head 51 swings along the YZ plane by the tilt mechanism 58b. In this way, the tilt mechanisms 58a and 58b allow the holding surface 51a to be adjusted parallel to the mounting surface of the mounting table 4 by moving the head 51 along the XZ plane and the YZ plane.

These tilt mechanisms 58a and 58b further include an adjustment section 585. The adjustment unit 585 has the same structure as, for example, a micrometer, and includes a knob 586, a frame 587, and a spindle 588. The knob 586 corresponds to the thimble of a micrometer, and has a scale on its circumference. When the knob 586 is manually turned in units of one scale, the spindle 588 moves forward and backward from the frame 587 in units of one scale, and the amount of protrusion changes with the frame 587 as the base end. For example, rotating knob 586 clockwise causes spindle 588 to extend. Rotating knob 586 counterclockwise causes spindle 588 to retract. The frame 587 is urged toward the base 581 by a tension spring 589, and the tip of the spindle 588 is always pressed against the side surface of the base 581.

Therefore, when the spindle 588 is extended, the frame 587 is pushed away from the base 581. Also, when the spindle 588 retracts, the frame 587 approaches the base 581. The frame 587 is directly or indirectly fixed to the sliding portion 583. Therefore, when the spindle 588 expands and contracts and the frame 587 approaches or moves away from the base 581, the sliding part 583 is dragged by the frame 587 according to the positional displacement and displacement direction of the frame 587, and the convex curved surface 584 becomes the concave curved surface. Move while sliding 582 and change direction. In this way, the tilt mechanisms 58a and 58b tilt the tilting object, that is, the holding surface 51a, by manual operation of the knob 586.

In the tilt mechanisms 58a and 58b, it is desirable that when the knob 586 rotates once, the orientation of the sliding portion 583, in other words, the orientation of the holding surface 51a, is displaced by 0.0003° or more and 0.15° or less. That is, when the length of one side of the holding surface 51a is, for example, 20 mm, it is desirable that when the knob 586 is rotated once, the height difference between the opposite sides of the holding surface 51a is displaced by 0.1 μm or more and 50 μm or less. If it falls below this range, the efficiency of adjusting the inclination of the holding surface 51a will be impaired, and if it exceeds this range, the holding surface 51a will change greatly in response to the operation of the knob 586, making it difficult to adjust the holding surface 51a to the desired inclination. becomes difficult.

The range of 0.0003° or more and 0.15° or less is due to the following reason. First, as a result of intensive research, we have found that by suppressing the difference between the minimum distance and the maximum distance of the holding surface 51a, each side of which is 20 mm, to the mounting surface of the carrier stand 3 to 2 μm or less, the element E that fits within the adhesive area A1 can be It was found that 98% or more of the elements E could be picked up. Specifically, 251 of the 256 elements E (16 rows x 16 columns) that fit in the adhesive area A1 were picked up. Therefore, if the difference between the minimum distance and the maximum distance of the holding surface 51a with respect to the mounting surface of the carrier table 3 is 1 μm, all of the elements E will be picked up more reliably.

Therefore, when the holding surface 51a has a width of 20 mm on one side, it is most efficient to be able to change the difference between the minimum distance and the maximum distance in units of 1 μm or less. In other words, it is most efficient that the angle formed by one side of the holding surface 51a and the mounting surface of the carrier stand 3 can be changed in units of 0.003°. There are 50 scales around the knob 586, so in order to be able to change 0.003 degrees per scale, the knob 586 must be changed by a maximum of 0.15 degrees per rotation. I wish I could.

Moreover, if the rotational operation of the knob 586 is kept within about 10 rotations in order to change by 1 μm, it can withstand practical use from the viewpoint of adjustment efficiency. In other words, a change of 0.1 μm per turn of the knob 586 is acceptable for practical use. In other words, if the knob 586 is rotated once, the angle can be changed by at least 0.0003°.

Also, in the electric tilt mechanism 33 driven by the rotary motor 331, from the viewpoint of tilt adjustment efficiency, the mounting surface of the carrier stand 3 is adjusted at 0.0003° or more by 0.15 degrees per rotation of the rotary shaft of the rotary motor 331. It is sufficient if the displacement can be less than °.

(motion)
(Adjustment operation)
The operation of such an element mounting apparatus 1 will be explained. First, prior to the mounting process of the element E, the parallelism between the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 is adjusted, and the parallelism between the holding surface 51a of the transfer section 5 and the mounting surface of the carrier table 3 is adjusted. Perform parallelism adjustment.

For example, pressure-sensitive paper is placed on the mounting surface of the mounting table 4 so that the pressure distribution can be detected. After the pressure-sensitive paper is placed on the mounting surface of the mounting table 4, the transfer section 5 is lowered toward the mounting table 4, and the holding surface 51a of the transfer section 5 is pressed against the pressure-sensitive paper. After raising the transfer section 5, the pressure sensitive paper is taken out and the pressure distribution is observed. If the external traces of the holding surface 51a remain uniformly on the pressure-sensitive paper, the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 are kept parallel.

On the other hand, if a part of the external trace of the holding surface 51a is missing, the missing area is an area where the holding surface 51a and the mounting surface of the mounting table 4 are not in contact with each other, and the holding surface 51a of the transfer section 5 is , is largely inclined with respect to the mounting surface of the mounting table 4 so that the chipped area is separated from the mounting surface of the mounting table 4. The area where the marks are thin is the area where the holding surface 51a and the mounting surface of the mounting table 4 are in contact, but the load is too small. It is still inclined with respect to the mounting surface of the mounting table 4 so as to be away from the mounting surface of the mounting table 4. In the area where the marks are dark, the holding surface 51a and the mounting surface of the mounting table 4 are in excessive contact with each other, and an excessive load is applied. It is inclined with respect to the mounting surface of the mounting table 4 so that it approaches from the mounting surface of the mounting table 4 .

While referring to the impressions on the pressure-sensitive paper, the operator turns the knob 586 of the adjustment section 585 to tilt the head 51 along the XZ plane or the YZ plane. This impression display and tilt adjustment are repeated until the outline impression of the holding surface 51a remains uniformly on the pressure-sensitive paper. Thereby, the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 are kept parallel to each other with high precision. Here, "parallel" includes not only perfect parallelism but also misalignment within a range that allows multiple rows and multiple columns of elements E to be mounted all at once. Note that as long as the pressure distribution can be detected, the pressure distribution meter is not limited to pressure-sensitive paper, and a pressure distribution meter having an array of strain sensors or a touch panel capable of simultaneous multi-point detection may be mounted.

Next, after the parallelism adjustment between the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 is completed, pressure-sensitive paper is placed on the mounting surface of the carrier table 3 so that the pressure distribution can be detected. After the pressure-sensitive paper is placed on the mounting surface of the carrier table 3, the transfer section 5 is lowered toward the carrier table 3, and the holding surface 51a of the transfer section 5 is pressed against the pressure-sensitive paper. After raising the transfer section 5, the pressure sensitive paper is taken out and the pressure distribution is observed. The operator performs a tilting operation of the carrier table 3 while referring to the impressions on the pressure-sensitive paper.

For example, the tilt mechanism 33 of the carrier base 3 raises or lowers the cam follower according to an operation signal input from the outside. For example, an operating means such as a teaching pendant is connected to the control means 11, and the user can control the tilting mechanism 33 by pressing buttons for tilting the XZ plane and tilting the YZ plane, and depending on the number of presses and the pressing time. Enter instructions. For example, the direction of tilting is determined depending on which button is pressed, and the amount of tilting is determined depending on the number of times the button is pressed and the amount of time the button is pressed. The control means 11 calculates the amount of operation of the three sets of tilt mechanisms 33 according to the pressed button, the number of presses, and the press time, and outputs a control signal instructing each tilt mechanism 33 to drive.

Thereby, the holding surface 51a of the transfer section 5 and the mounting surface of the carrier stand 3 are kept parallel with high precision. Here, "parallel" includes not only perfect parallelism but also deviation within a range that allows the elements E in multiple rows and multiple columns to be picked up all at once. Although an example has been described in which the tilting mechanism 33 is tilted in response to an operator's operation, the tilting mechanism 33 may be automatically tilted without depending on the operator's operation. For example, an indentation on the pressure-sensitive paper is detected by a camera 55 provided in the transfer unit 5, or a displacement sensor is installed in the transfer unit 5 to enable multi-point measurement, and a displacement sensor is installed at various locations on the holding surface 51a of the transfer unit 5 and the carrier table 3. It is also possible to detect each distance to each location on the mounting surface.

When detecting an indentation using the camera 55, the control means 11 refers to the image output from the camera 55 and determines the presence or absence of an indentation and the density of the indentation based on the brightness value of each pixel. The brightness value indicates the presence or absence of contact and the contact load, and the control means 11 moves the area with a relatively small brightness value closer to the transfer unit 5 side according to the value, and moves the area with a relatively large brightness value closer to the transfer unit 5 side. A control signal is generated to move away from the transfer section 5 according to the value, and is output to the tilt mechanism 33. In the case of using a displacement sensor, the control means 11 moves a relatively far location closer to the transfer unit 5 according to the distance value, and moves a relatively close location closer to the transfer unit 5 according to the distance value. A control signal for moving the camera away from the camera is generated and output to the tilt mechanism 33. In the tilt mechanism 33, the three rotary motors rotate in the direction according to the control signal by the rotation angle according to the control signal, and each cam follower 334 moves up and down.

Furthermore, when operating the tilt mechanisms 58a and 58b of the transfer section 5, the camera 55 or a laser measuring device may be used. A monitor such as an organic EL display or a liquid crystal display capable of displaying at least a character string is connected to the control means 11. The control means 11 converts the results obtained by the camera 55 or the displacement sensor into the direction and amount of rotation of the knob 586, and displays the results on the monitor. The operator may operate each knob 586 of the tilt mechanisms 58a and 58b by referring to the information on the rotation direction and amount of rotation of the knob 586.

(Implementation operation)
Next, the mounting operation of the element mounting apparatus 1 will be explained. FIG. 10 is a flowchart showing the operation of the element mounting apparatus 1. First, the adhesive sheet A is attached to the head 51 of the transfer section 5 (step S01). The transfer unit 5 holding the adhesive sheet A moves to the pickup position 21 (step S02). At a pickup position 21, a carrier stand 3 is waiting with a carrier C placed thereon. That is, among the elements E stocked in an array on the carrier C, the center position of the multi-row, multi-column element E group (hereinafter referred to as "element E group to be picked up") to be picked up by the transfer section 5 this time is It is positioned at the pickup position 21 and is on standby.

When the transfer unit 5 reaches the pickup position 21, the transfer unit 5 and the carrier C, that is, the group of elements E to be picked up are aligned (step S03). In step S03, the camera 55 photographs the element group E to be picked up. When the image of the camera 55 is analyzed by the control means 11 and positional deviations in the X-axis and Y-axis directions and deviations in the direction around the Z-axis between the transfer unit 5 and the group of elements E to be picked up are detected, the transfer is performed. The portion 5 and the carrier stand 3 move relative to each other so as to eliminate the misalignment. In the case of deviation in the X-axis direction, since both the transfer section 5 and the carrier platform 3 are movable in the X-axis direction, one or both of them are operated.

The displacement is detected by image processing to detect the positions of two elements E located diagonally on one of the elements E group photographed in the image. In image processing, binarization or edge enhancement may be performed to clarify the diagonals of the element group E. Then, the midpoint of the diagonal is calculated, and the difference between the calculation result and the reference point in the image is calculated. This difference becomes a positional shift between the transfer section 5 and the group of elements E to be picked up in the X-axis direction and the Y-axis direction. Furthermore, the misalignment around the Z-axis is resolved by operating the θ rotation unit 53 so that the diagonal of one of the elements E group shown in the image coincides with the reference line.

When the alignment between the transfer unit 5 and the group of elements E to be picked up is completed, the group of elements E to be picked up is picked up from the carrier C by the transfer unit 5 (step S04). In this step S04, the elevating unit 9 lowers the transfer unit 5 toward the carrier C of the carrier stand 3, and presses the mounted adhesive sheet A against the group of elements E scheduled to be picked up. The adhesive sheet A has adhesive strength throughout the adhesive area A1. Therefore, all of the elements E that fit within the projection area of the adhesive sheet A, that is, all the groups of elements E scheduled to be picked up, stick to the adhesive sheet A.

Here, by the tilt mechanism 33 that tilts the carrier table 3, the holding surface 51a of the transfer section 5 and the mounting surface of the carrier table 3 are kept parallel with high precision as described above. Therefore, all the elements E of the element E group to be picked up can be reliably pressed against the adhesive sheet A. Therefore, all the elements E that fit within the adhesive area A1 from the carrier C will not be missed, and some elements E will not be damaged due to excessive load, and all the elements E can be picked up at once with high accuracy. be done.

When the element group E is transferred to the adhesive sheet A, the transfer unit 5 moves from the pickup position 21 to the mounting position 22 (step S05). At this time, the mounting table 4 is waiting at the mounting position 22 with the substrate S placed thereon. That is, the mounting position 22 is located at the center of the area (hereinafter referred to as the "planned mounting area") where the multi-row, multi-column group of elements E is mounted in the transfer section 5 in the circuit pattern formed on the substrate S. Waiting in position. When the transfer unit 5 reaches the mounting position 22, the transfer unit 5 and the mounting area on the substrate S are aligned (step S06). The camera 55 photographs the circuit pattern in the area to be mounted. Then, the control means 11 detects the positional deviation between the transfer unit 5 and the mounting area in the X-axis direction and the Y-axis direction, and the deviation in the direction around the Z-axis, and controls the transfer unit 5 and the mounting area so as to eliminate the deviations. The mounting table 4 is moved relatively. In misalignment detection, for example, positional misalignment and orientation misalignment may be calculated based on the electrode pads on the circuit pattern that are diagonal to the mounting area.

When the alignment between the transfer section 5 and the substrate S is completed, the transfer section 5 mounts the element group E onto the substrate S (step S07).

In step S07, the elevating section 9 lowers the transfer section 5, and the transfer section 5 presses the group of elements E against the substrate S all at once. That is, the rotary motor 92 is activated and the contact block 94 is lowered toward the transfer section 5 . The abutment block 94 abuts the abutment block receiver 54 of the transfer section 5, pushes down the entire transfer section 5 toward the substrate S, and brings the element group E into abutment against the substrate S. At this time, since the pressure necessary for pressing is supplied to the cylinder 52, the element group E is pressed against the substrate S with a predetermined pressure.

Further, in step S07, when the element E group comes into contact with the substrate S, the heater 56 connects the head 51 to the element E group to the substrate S using a conductive bonding material higher than the peeling temperature T1 of the adhesive sheet A. heating to the process temperature T2. Heating may be started before the element E group contacts the substrate S, and the temperature of the head 51 may pass through the peeling temperature T1 immediately after the element E group contacts the substrate S. The heat of the head 51 is transferred to the adhesive sheet A, and further from the adhesive sheet A to the conductive bonding material via the element group E. Therefore, the adhesive force of the adhesive sheet A is lost or reduced, and the elements E group are peeled off from the adhesive sheet A, and the elements E group are placed on the substrate S side. That is, the elements E group stuck to the adhesive sheet A are all transferred from the adhesive sheet A to the substrate S without remaining on the adhesive sheet A. Further, when the head 51 reaches the process temperature T2, the element group E is bonded to the substrate S using the conductive bonding material.

Furthermore, the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 are kept parallel with high accuracy by the tilt mechanisms 58a and 58b that tilt the head 51 of the transfer section 5, as described above. Therefore, all the elements E held on the adhesive sheet A can be reliably pressed against the substrate S. Therefore, all the elements E held are bonded to the substrate S with high accuracy, and no excessive load is applied to some elements E and they are damaged, and all the elements E are detached to the substrate S at once with high accuracy. do.

It is assumed that the adhesive sheet A held by the transfer section 5 has a size and shape that includes elements E in m rows and n columns. It is assumed that the carrier C is stocked with elements E arranged in a×m rows and b×n columns. Further, it is assumed that the substrate S has room for mounting elements E in c×m rows and d×n columns. a, b, c and d are positive real numbers, preferably natural numbers. In this case, the transfer unit 5 reciprocates between the pickup position 21 and the mounting position 22 until it finishes picking up all the elements E from the carrier C or until it finishes placing all the elements E in the mounting space of the board S. Then, the mounting of element E is repeated. The adhesive sheet A is replaced every time a series of processes for picking up and mounting an element E is completed. Note that a, b, c, and d should be natural numbers, considering that the transfer unit 5 removes all the elements E from the carrier C and completely mounts the elements E on the circuit pattern of the board S. is preferred.

(effect)
As described above, this element mounting apparatus 1 includes the carrier table 3, the mounting table 4, the transfer section 5, and the tilt mechanisms 33, 58a, and 58b. The carrier table 3 is a supply table on which a carrier C on which the elements E are arranged in an array is placed. On the mounting table 4, a substrate S on which elements E are arranged in an array is placed. The transfer unit 5 moves between the carrier table 3 and the mounting table 4, picks up the multi-row, multi-column elements E from the carrier C at once, and transfers the picked-up multi-row, multi-column elements E to the substrate S. Move all at once to . The tilt mechanisms 33, 58a, and 58b can be adjusted so that the mounting surface of the carrier table 3, the holding surface 51a of the transfer section 5, and the mounting surface of the mounting table 4 are parallel to each other.

Thereby, all the elements E can be picked up at once from the carrier C without being missed or without applying an excessive load to some of the elements E. In addition, all the elements E held can be joined to the substrate S with high precision, and can be removed at once without applying an excessive load to some of the elements E.

Further, the transfer unit 5 is provided with tilt mechanisms 58a and 58b which are manual tilt mechanisms. Since the tilt mechanisms 58a and 58b do not include a power source such as a rotary motor, the transfer unit 5 can be made smaller and lighter. Thereby, the transfer unit 5 can be moved at high speed, and the mounting speed of the elements E is improved. Furthermore, the inertial force when stopping the transfer section 5 on the carrier table 3 and the mounting table 4 can be reduced, and the transfer section 5 can be stopped at the pick-up position 21 and the mounting position 22 with high precision. Therefore, pick-up errors and mounting errors of the element E are reduced, and the yield is improved.

Further, the tilting mechanisms 58a and 58b tilt the holding surface 51a by 0.0003° or more and 0.15° or less when the knob is rotated once. Thereby, it is possible to achieve both a reduction in parallelism adjustment time and an improvement in the moving speed of the transfer section 5, thereby improving production efficiency. Moreover, the improvement in parallelism adjustment accuracy and the reduction in pick-up errors and mounting errors of the element E are highly compatible, and the yield is further improved.

Further, the carrier table 3 is equipped with a tilt mechanism 33 which is an electric tilt mechanism. Thereby, the holding surface 51a of the transfer section 5 and the mounting surface of the carrier stand 3 can be adjusted to be parallel to each other with high precision, and the possibility of picking up the elements E can be reduced. Furthermore, since the parallelism adjustment can be completed in a short time, the mounting process can be started quickly, improving production efficiency.

Further, this tilt mechanism 33 tilts the mounting surface of the carrier table 3 within a range of 0.0003° or more and 0.15° or less when the rotary motor 331 rotates once. As a result, it is possible to achieve both a reduction in parallelism adjustment time and an improvement in precision, and a reduction in pick-up mistakes and mounting mistakes of the element E can be achieved to a high degree, and the yield is improved. Further, the sloped surface 336 of the sloped portion 335 is configured to have a slope that rises at a height of 1 mm or less with respect to movement of 10 mm in the horizontal direction. This achieves both improved precision in parallelism adjustment and high rigidity.

In addition, if the mounting surface of the carrier stand 3, the holding surface 51a of the transfer section 5, and the mounting surface of the mounting table 4 can be adjusted to be parallel, a manual tilt mechanism can be used for the transfer section 5 and the carrier stand 3. Either the tilt mechanisms 58a and 58b or the tilt mechanism 33 which is an electric tilt mechanism may be installed. Further, one of the tilt mechanisms 58a and 58b, which are manual tilt mechanisms, and the tilt mechanism 33, which is an electric tilt mechanism, may be mounted on the mounting table 4.

For example, the mounting table 4 may include the tilt mechanism 33 mounted on the carrier table 3. In this case, the parallelism between the mounting surface of the carrier table 3 and the holding surface 51a of the transfer section 5 is adjusted by the tilt mechanisms 58a and 58b of the transfer section 5. Further, the parallelism between the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 is adjusted by the tilt mechanism 33 of the mounting table 4.

Furthermore, the transfer unit 5 may be equipped with a tilt mechanism 33 that is an electric tilt mechanism instead of the tilt mechanisms 58a and 58b that are manual tilt mechanisms. That is, the control means 11 stores the inclination information of the holding surface 51a when the transfer section 5 is located at the pickup position 21. Then, when the transfer section 5 is located at the pickup position 21, the tilt mechanism 33 is operated according to the inclination information of the holding section 51a, so that the holding surface 51a of the transfer section 5 and the mounting surface of the carrier table 3 are made parallel. Further, the control means 11 stores information on the inclination of the holding surface 51a when the transfer section 5 is located at the mounting position 22. Then, when the transfer section 5 is located at the mounting position 22, the tilt mechanism 33 is operated according to the inclination information of the holding section 51a, so that the holding surface 51a of the transfer section 5 and the mounting surface of the mounting table 4 are made parallel.

In this case, the mechanism for tilting the carrier stand 3 and the mounting stand 4 can be eliminated, resulting in a cost reduction of the element mounting apparatus. Further, it is also conceivable that a carrier C with warp or undulation or a substrate S with warp or undulation is carried into this element mounting apparatus. Even in this case, if a tilt mechanism 33, which is an electric tilt mechanism, is installed in the transfer section 5, information on the warpage and waviness of the carrier C can be acquired and stored in advance, and the element E can be adjusted. The holding surface 51a can be tilted depending on the degree of warping or waviness of the carrier C occurring in the area scheduled to be picked up. Furthermore, if the transfer unit 5 is equipped with a tilt mechanism 33 that is an electric tilt mechanism, information on warpage and waviness of the substrate S can be acquired and stored in advance to improve the area on which the element E is planned to be mounted. The holding surface 51a can be tilted depending on the degree of warping or waviness of the substrate S that has occurred.

The degree of warpage or waviness of the carrier C or the degree of warpage or waviness of the substrate S may be detected by an image taken by the camera 55 or a displacement sensor installed in the transfer unit 5 that measures position using a laser beam for multi-point measurement. As a method for detecting the degree of warpage based on an image, for example, a light may be installed, the carrier C and the substrate S may be illuminated, and the direction and length of the shadow formed may be detected. In addition to the carrier C and the substrate S, similar measures can also be taken when the mounting surface of the carrier stand 3 or the mounting surface of the mounting table 4 is warped or undulated.

Furthermore, the mounting table 4 may be provided with a tilt mechanism similar to the tilt mechanism 33 mounted on the carrier table 3, and the tilt mechanisms 58a and 58b of the transfer unit 5 may be eliminated. In this case, each tilt mechanism 33 is adjusted so that the mounting surface of the carrier stand 3 and the mounting surface of the mounting stand 4 are parallel to the holding surface 51a of the transfer section 5. With this configuration, the weight of the transfer section 5 that moves between the carrier table 3 and the mounting table 4 can be reduced by the amount of the tilt mechanisms 58a and 58b, thereby stabilizing the transfer operation and achieving high precision. You can aim for

When the mounting table 4 is provided with the tilt mechanism 33, it is particularly important from the viewpoint of mounting accuracy of the element E that the inclined surface 336 of the inclined portion 335 has an inclination that increases when the height is 1 mm or less for a movement of 10 mm in the horizontal direction. Become useful. First, when the element E is mounted on the mounting table 4, a load of several hundred newtons is applied by the transfer section 5. This load generates a force that causes the inclined portion 335 and the cam follower 334 to move relative to each other in the horizontal direction. However, since the inclined portion 335 is configured to move by the rotation of the screw shaft 332, it is difficult to move in the horizontal direction even if it receives an external force. Therefore, the force for horizontal movement acts on the cam follower 334 and the mounting surface of the mounting table 4 to which the cam follower 34 is attached. When mounting the element E, if the mounting surface is displaced in the horizontal direction due to this horizontal movement force, it will cause a decrease in mounting accuracy. The force for moving this horizontally increases as the slope of the inclined surface 336 increases. However, as a result of intensive research, the inventors have experimentally found that the inclined surface 336 of the inclined portion 335 is inclined so that the height increases by 1 mm or less with respect to a movement of 10 mm in the horizontal direction. As a result, it was confirmed that the displacement of the mounting surface caused by the load applied during the mounting of the element E can be suppressed to such an extent that it does not affect the mounting accuracy of the element E.

Furthermore, although the tilt mechanism 33 has been described as an electric tilt mechanism, the tilt mechanisms 58a and 58b equipped with a rotary motor connected to the knob 586 rotate the knob 586 electrically, and are included in the electric tilt mechanism. .

Further, although an example has been described in which the adhesive sheet A is used as a holding method for the holding surface 51a, the present invention is not limited to this, and methods such as vacuum adsorption or electrostatic adsorption may be adopted. When vacuum suction is employed, suction holes arranged in multiple rows and columns are formed on the holding surface 51a of the transfer section 5. The suction hole is connected to a pneumatic circuit 12 having a compressor and an ejector, and negative pressure is generated in the suction hole. The transfer section 5 picks up the element E by attracting the element to the suction hole using negative pressure, and releases the element E on the substrate S by releasing the negative pressure by breaking the vacuum or opening to the atmosphere. When electrostatic adsorption is employed, a multi-row, multi-column mesa-shaped structure is formed on the holding surface 51a. The mesa-shaped structure is provided with electrodes and a dielectric layer. The electrostatic force generating portion having this mesa-shaped structure serves as a local attraction point for the element E.

(Second embodiment)
FIG. 11 is a schematic configuration diagram of an element mounting apparatus 1 according to the second embodiment. In FIG. 11, the same configurations and functions as those in the first embodiment are denoted by the same reference numerals, and the dimensions, shapes, etc. of characteristic parts in the second embodiment are drawn with more emphasis than they actually are. be.

This element mounting apparatus 1 also includes a mounting table 4 with a tilt mechanism 33 mounted on the carrier table 3. Further, each of the tilt mechanisms 58a and 58b of the transfer section 5 is an electric tilt mechanism. That is, the tilt mechanisms 58a and 58b include a rotary motor connected to the knob 558, and rotate the knob 586 electrically. Furthermore, the element mounting apparatus 1 includes a laser measuring device 7 as an example of a displacement sensor. The laser measuring device 7 is provided on the carrier table 3, the mounting table 4, and the transfer section 5. The laser measuring device 7 emits a laser beam toward an object to be measured, and receives reflected light from the object to be measured. Then, the laser measuring device 7 calculates the distance to the distance measurement target from, for example, the time required for light reception, or calculates the distance to the distance measurement target from the phase difference between the incoming and outgoing light. The displacement sensor is not limited to this, and may be a sensor that uses ultrasonic waves, for example, as long as it can measure the distance to an object that is spaced apart from the sensor.

These laser measuring instruments 7 are used to measure the inclination of the holding surface 51a of the transfer unit 5, the inclination of the mounting surface of the carrier stand 3, and the inclination of the mounting surface of the mounting stand 4 at the pick-up position 21 and the mounting position 22. used for. Then, in the element mounting apparatus 1, the parallelism between the holding surface 51a and the mounting surface of the carrier stand 3 is adjusted based on the measurement results, and the parallelism between the holding surface 51a and the mounting surface of the mounting table 4 is adjusted. be adjusted.

First, the laser measuring device 7 of the transfer unit 5 measures various locations on the mounting surface of the carrier base 3 at the pickup position 21, and also positions various locations on the mounting surface within the mounting base 4 at the mounting position 22. The positioning result is input to the control means 11 and becomes a parameter for calculating the inclination of the mounting surface of the carrier table 3 and the mounting surface of the mounting table 4. That is, the laser measuring device 7 of the transfer section 5 is installed on a line segment connecting the pickup position 21 and the mounting position 22, and can reach the pickup position 21 and the mounting position 22 by moving the transfer section 5 in the X-axis direction. It becomes. The laser measuring device 7 is fixed to a bracket 59 (see FIG. 7) so as to emit laser light downward along the Z-axis. The laser measuring device 7 fixed to the bracket 59 is not affected by rotation and tilt changes by the θ rotation section 53 and tilt mechanisms 58a and 58b. The laser measuring device 7 is located beside the head 51 so as not to interfere with the pickup and mounting of the element E, and its lowermost end is located higher than the holding surface 51a.

The laser measuring device 7 of the carrier table 3 and the mounting table 4 is installed on a horizontal plate 34 provided on the carrier table 3 and the mounting table 4, respectively. The horizontal plate 34 of the carrier stand 3 extends horizontally along the XY plane, and moves in parallel along the XY plane together with the carrier stand 3 by the X-axis drive mechanism 31 and the Y-axis drive mechanism 32. Further, the horizontal plate 34 of the mounting table 4 also extends horizontally along the XY plane, and moves in parallel along the XY plane together with the mounting table 4 by the X-axis drive mechanism 41 and the Y-axis drive mechanism 42.

The laser measuring device 7 on the carrier stand 3 measures various places on the holding surface 51a at the pickup position 21, and the laser measuring device 7 on the mounting table 4 measures various places on the holding surface 51a on the mounting position 22. . The positioning results are input to the control means 11 and serve as parameters for calculating the inclination of the holding surface 51a at the pickup position 21 and the mounting position 22. That is, the laser measuring device 7 on the carrier table 3 is fixed at a position where it can reach the pickup position 21 by driving the X-axis drive mechanism 31 and the Y-axis driving mechanism 32, and the laser measuring device 7 on the mounting table 4 is By driving the axis drive mechanism 41 and the Y-axis drive mechanism 42, it is fixed at a position where the mounting position 22 can be reached. Further, these laser measuring instruments 7 are fixed to the horizontal plate 34 so as to emit laser light upward along the Z-axis direction.

The control means 11 calculates each inclination from the positioning results of the laser measuring device 7. Then, the control means 11 controls the tilt mechanisms 58a and 58b based on the inclination angle of the holding surface 51a to adjust the inclination of the holding surface 51a, and also adjusts the inclination angle of the mounting surface of the carrier table 3 and the mounting table 4. Each tilt mechanism 33 is controlled based on this to adjust the inclination of each mounting surface. Note that the control means 11 can include a display section 11a. The display unit 11a is a liquid crystal display, an organic EL display, or the like, and displays information visually.

FIG. 12 is a flowchart showing the operation of detecting and adjusting the inclination of the holding surface 51a by the control means 11 at the mounting position 22. The operation of detecting and adjusting the inclination of the holding surface 51a at the pickup position 21 is the same except that the position is the pickup position 21 and the laser measuring device 7 of the carrier stand 3 is used, and the explanation will be omitted. .

First, as shown in FIG. 13, the control means 11 controls the ball screw 65 to position the holding surface 51a of the transfer section 5 at the mounting position 22 (step S11). Furthermore, the control means 11 controls the X-axis drive mechanism 41 and the Y-axis drive mechanism 42 to make the laser measuring device 7 of the mounting table 4 directly face the holding surface 51a located at the mounting position 22 (step S12). ). Next, the control means 11 moves the mounting table 4 in the X-axis direction (step S13) and applies laser light to multiple points within the holding surface 51a using the laser measuring device 7 of the mounting table 4 (step S13). Step S14). Then, the control means 11 measures the distances of a plurality of points (step S15).

In steps S13 and S14, for example, as shown in FIG. 14(a), three laser beam irradiation points Lp are set on both edge areas extending in the X-axis direction among the edge areas of the holding surface 51a. . It is desirable that the three laser beam irradiation points Lp be as far apart as possible, and may be set at both corners of the edge and at the center of the side.

That is, in step S12, first, the mounting table 4 is moved so that one corner of the holding surface 51a and the laser measuring device 7 directly face each other. The control means 11 stores in advance the moving distance in the X-axis direction and the moving distance in the Y-axis direction necessary for one corner of the holding surface 51a and the laser measuring device 7 to directly face each other. The control means 11 converts the moving distance in the X-axis direction and the moving distance in the Y-axis direction into an analog or pulse current or voltage signal and outputs it to the X-axis drive mechanism 41 and the Y-axis drive mechanism 42. For example, the moving distance in the X-axis direction and the moving distance in the Y-axis direction starting from the origin position of the mounting table 4 are stored. In this case, the mounting table 4 may be returned to the original position first, and then controlled according to the moving distance in the X-axis direction and the moving distance in the Y-axis direction. Alternatively, if the current position of the mounting table 4 is stored, the difference between the X-axis movement distance, the Y-axis movement distance, and the current position may be calculated, and the control may be performed according to the difference.

The control means 11 also stores in advance the distance between the three laser beam irradiation points Lp arranged in the X-axis direction. One of the corners of the holding surface 51a and the laser measuring device 7 are directly facing each other, and after emitting the laser beam for the first time, the laser beam is irradiated by a pre-stored distance in the X-axis direction toward the next laser beam irradiation point Lp. The laser measuring device 7 on the mounting table 4 is moved. Then, the control means 11 causes the laser measuring device 7 of the mounting table 4 to emit a laser beam toward the next laser beam irradiation point Lp. Furthermore, after irradiating the laser beam to the laser beam irradiation point Lp at the center of the side, the control means 11 moves the mounting point Lp toward the next laser beam irradiation point Lp at the opposite corner by a pre-stored distance in the X-axis direction. Move the laser measuring device 7 on the stand 4. Then, the control means 11 causes the laser measuring device 7 of the mounting table 4 to emit a laser beam.

After changing the laser beam irradiation point Lp along one side, three more laser beam irradiation points Lp are set along the opposite side. The control means 11 stores in advance the distance between the opposing sides in the Y-axis direction. The control means 11 controls the laser beam emission by moving the laser measuring device 7 of the mounting table 4 by this distance in the Y-axis direction, and irradiates the laser beam to the three laser beam irradiation points Lp on the opposite sides. go.

After positioning the plurality of points irradiated with the laser beam (step S15), the control means 11 calculates the inclination of the holding surface 51a with respect to the X axis from the positioning results (step S16). The inclination calculation may be based on the difference in the positioning results between the distance in the X-axis direction moved to irradiate the three laser beam irradiation points Lp with laser light and the three laser beam irradiation points LP. Incidentally, since the arrangement of the laser beam irradiation points Lp is obtained for two lines, for example, each inclination angle may be obtained and averaged using each line. Furthermore, in order to obtain more angle information and improve accuracy, steps S13 to S15 may be repeated a predetermined number of times and the average of a plurality of angles may be taken. Depending on the inclination with respect to the Y-axis, measurement results for one line may not be obtained, so positioning the laser beam irradiation point Lp for two lines can also provide the advantage of redundancy.

When the calculation of the inclination of the holding surface 51a in the X-axis direction is completed, the control means 11 changes the mounting table 4 along the Y-axis direction (step S17) and uses the laser measuring device 7 of the mounting table 4 to measure the holding surface. A plurality of points within 51a are irradiated with laser light (step S18). Then, the control means 11 positions each distance of the plurality of points (step S19). After positioning the distances of each of the plurality of points, the control means 11 calculates the inclination of the holding surface 51a with respect to the Y axis from the positioning results (step S20).

In steps S17 and S18, for example, as shown in FIG. 14(b), three laser beam irradiation points Lp are set on both edge areas extending in the Y-axis direction among the edge areas of the holding surface 51a. . It is desirable that the three laser beam irradiation points Lp be as far apart as possible, and may be set at both corners of the edge and at the center of the side. The control means 11 starts from the final irradiation point of a total of six laser beam irradiation points Lp on both edge regions extending in the X-axis direction, and controls the distance between three laser beam irradiation points Lp lined up in the Y-axis direction. The laser measuring device 7 of the mounting table 4 may be moved accordingly, and the laser measuring device 7 of the mounting table 4 may be moved to the second line according to the distance in the Y-axis direction of the opposing sides.

After calculating the respective inclination angles of the holding surface 51a with respect to the X-axis and the Y-axis, the control means 11 displays each inclination angle with respect to the X-axis and the Y-axis on the display unit 11a (step S21). If the inclination of the holding surface 51a with respect to the horizontal plate 34 is large, that is, if it exceeds the allowable inclination (step S22, Yes), the control means 11 controls the tilt mechanisms 58a and 58b according to the calculation result, The tilt angle is changed (step S23) and the process starts over from step S12. If the inclination of the holding surface 51a is small, that is, within the allowable inclination range (step S22, No), the inclination angle of the holding surface 51a is memorized (step S24), and the inclination detection and adjustment of the holding surface 51a is performed. finish.

Note that the inclination angle of the holding surface 51a does not need to be strictly corrected. What is necessary to adjust the parallelism is the relationship between the holding surface 51a and the mounting surface of the mounting table 4, and also the relationship between the holding surface 51a and the mounting surface of the carrier table 3. It is only necessary that the inclinations of the mounting surface of the table 4 and the mounting surface of the carrier table 3 fall within the limits.

Once the holding surface 51a is adjusted to be parallel to the horizontal plate 34, the parallelism between the mounting surface of the mounting table 4 and the holding surface 51a is then adjusted. FIG. 15 is a flowchart showing the operation of detecting and adjusting the inclination of the mounting surface of the mounting table 4 by the control means 11 at the mounting position 22. Note that the operation of detecting and adjusting the inclination of the mounting surface of the carrier stand 3 at the pickup position 21 is the same except that the position is the pickup position 21, so a description thereof will be omitted.

First, as shown in FIG. 16, the control means 11 controls the ball screw 65 to align the laser measuring device 7 of the transfer section 5 to the mounting position 22 (step S31). Furthermore, the control means 11 controls the X-axis drive mechanism 41 and the Y-axis drive mechanism 42 to cause the mounting surface of the mounting table 4 to directly face the laser measuring device 7 of the transfer section 5 (step S32). Next, while moving the mounting table 4 in the X-axis direction (step S33), the control means 11 uses the laser measuring device 7 of the transfer section 5 to direct the laser beam at multiple points within the mounting surface of the mounting table 4. Apply light (step S34). Then, the control means 11 measures the distances of multiple points (step S35).

In steps S33 and S34, for example, as shown in FIG. 17(a), three laser beam irradiation points are placed on both edge areas extending in the Set Lp. It is desirable that the three laser beam irradiation points Lp be as far apart as possible, and may be set at both corners of the edge and at the center of the side. First, the mounting table 4 is moved so that one corner of the mounting surface of the mounting table 4 and the laser measuring device 7 directly face each other. The control means 11 stores in advance the moving distance in the X-axis direction and the moving distance in the Y-axis direction necessary for one corner of the mounting surface of the mounting table 4 to directly face the laser measuring device 7. The control means 11 also stores in advance the distance between the three laser beam irradiation points Lp arranged in the X-axis direction.

After positioning a plurality of points irradiated with laser light (step S35), the control means 11 calculates the inclination of the mounting surface of the mounting table 4 with respect to the X axis from the positioning results (step S36). The inclination calculation may be based on the difference between the distance in the X-axis direction moved to irradiate the three laser beam irradiation points Lp with the laser beam and the positioning results of the three laser beam irradiation points Lp.

When the calculation of the inclination with respect to the X-axis is completed, the control means 11 changes the mounting surface of the mounting table 4 using the laser measuring device 7 of the transfer section 5 while changing the mounting table 4 along the Y-axis direction (step S37). Laser light is applied to multiple points within (step S38). Then, the control means 11 positions each distance of the plurality of points (step S39). After positioning the distances of each of the plurality of points, the control means 11 calculates the inclination of the mounting surface of the mounting table 4 in the Y-axis direction from the positioning results (step S40).

In steps S37 and S38, as shown in FIG. 17(b), for example, three laser beam irradiation points are placed on both edge areas extending in the Y-axis direction of each edge area of the mounting surface of the mounting table 4. Set Lp. It is desirable that the three laser beam irradiation points Lp be as far apart as possible, and may be set at both corners of the edge and at the center of the side. Note that steps S32 to S40 may be repeated multiple times to improve the accuracy of detecting the tilt angle, and the final tilt angle may be calculated using a statistical method such as an average.

After calculating the inclination angle of the mounting surface of the mounting table 4 with respect to the X-axis and Y-axis, the inclination angle of the holding surface 51a with respect to the X-axis and Y-axis is read (step S41), and the inclination angle that the mounting surface of the mounting table 4 has The inclination angle of the holding surface 51a is subtracted from (step S42). Then, the control means 11 drives the tilt mechanism 33 provided on the mounting table 4 to tilt the mounting table 4 to eliminate the difference (step S43). That is, the control means 11 calculates the operating direction and operating amount of each tilt mechanism 33 from the difference in the X-axis direction and the difference in the Y-axis direction, converts the calculation result into an analog or pulse current or voltage signal, and converts the calculation result into an analog or pulse current or voltage signal. It is output to the tilt mechanism 33.

As described above, the inclination angles of the holding surface 51a of the transfer unit 5 and the mounting surface of the mounting table 4 are detected with respect to the horizontal, and the inclinations are adjusted by the tilt mechanism 33 so as to eliminate the difference between the two inclination angles. Therefore, the inclination of the mounting surface of the mounting table 4 follows the holding surface 51a, and the two become parallel. Similarly, the inclination of the holding surface 51a at the pickup position 21 is detected using the laser measuring device 7 of the carrier stand 3, and the inclination of the mounting surface of the carrier stand 3 is detected using the laser measuring device 7 of the transfer unit 5. By eliminating the difference between the two, the mounting surface of the carrier stand 3 follows the inclination of the holding surface 51a at the pickup position 21.

Here, if the difference in the inclination angle of the holding surface 51a between the pick-up position 21 and the mounting position 22 is negligible, after detecting the inclination of the holding surface 51a at either the pick-up position 21 or the mounting position 22, The inclination angle may be used when calculating the difference in . A negligible degree refers to a case where even if the accuracy of one of the parallelisms decreases due to the use of the tilt angle, there is no problem in picking up or mounting the element E. In this case, the number of steps required to detect the inclination angle is reduced, so that the operating efficiency of the element mounting apparatus 1 is improved.

Furthermore, if the inclination angle of the holding surface 51a at one position can be used to estimate the inclination angle of the holding surface 51a at the other position, that is, from the inclination angle of the holding surface 51a at one position, the inclination angle of the holding surface 51a at the other position can be estimated. If there is a calculation formula for calculating the inclination angle of the holding surface 51a, the inclination angle of the holding surface 51a at one position may be used in the same way.

The laser measuring device 7 of the transfer section 5 may be fixed to the head 51. When the laser measuring device 7 is fixed to the head 51, the holding surface 51a and the laser beam always maintain an orthogonal relationship without being affected by the driving of the θ rotation section 53 and the tilt mechanisms 58a and 58b. Therefore, the inclination angle of both mounting surfaces detected using the laser measuring device 7 of the transfer section 5 is based on the holding surface 51a. In this case, it is sufficient to drive the tilt mechanism 33 by the amount of the inclination angle of both mounting surfaces without comparing the inclination with the holding surface 51a. Moreover, if the inclination of the holding surface 51a is within the allowable range of angle change by the tilt mechanism 33, there is no need to detect the inclination of the holding surface 51a, and the laser measuring device 7 of the carrier stand 3 and mounting stand 4 can be eliminated. Can be done.

However, by providing the laser measuring device 7 on the bracket 59 of the transfer section 5, it is possible to reduce the weight of the heavy objects used for θ rotation, X-axis direction angle change, and Y-axis direction angle change. This is desirable because it can further improve accuracy.

Moreover, in this embodiment, in order to use the horizontal as a reference for inclination, the laser measuring devices 7 of the transfer unit 5, carrier stand 3, and mounting stand 5 are installed so that they can emit laser beams along the Z axis. However, it is sufficient that the laser light emitted by the laser measuring device 7 of the transfer section 5 and the laser light emitted by the laser measuring devices 7 of the carrier table 3 and the mounting table 5 are parallel, and there is no need to use the horizontal as a reference. Further, if the inclination of the holding surface 51a of the transfer unit 5 is uniform on the line segment including the pickup position 21 and the mounting position 22, or if the variation is negligible, the carrier stand 3 and the mounting stand 5 The laser measuring device 7 mounted on the carrier 3 can also be commonly placed, for example, on the upper surface of the pedestal 6, between the carrier pedestal 3 and the mounting pedestal 5.

In order to improve the accuracy of the positioning results of the laser measuring device 7, the transfer section 5 is lowered by the lifting section 9 during positioning, and the distance between the laser measuring device 7 of the transfer section 5 and each mounting surface and the distance of the carrier table 3 are adjusted. It is desirable to bring the distance between the laser measuring device 7 and the holding surface 51a closer. If the laser measuring device 7 of the transfer section 5 cannot be brought close to the mounting surface until the positioning accuracy is improved, as shown in FIG. For example, it may be installed above the pickup position 21.

That is, the laser measuring device 7 is installed on the pedestal 6 and is supported by an inverted L-shaped support 81 . The inverted L-shaped support 81 rises from the upper surface of the pedestal 6 and extends in a bent manner toward the pickup position 22 halfway. An elevating portion 82 is provided at the end surface of the inverted L-shaped support 81 . The elevating part 82 is, for example, a rail and a ball screw extending in the Z-axis direction. The laser measuring device 7 is supported by an inverted L-shaped support 81 via an elevating section 82. The laser measuring device 7 irradiates a laser beam downward along the Z-axis passing through the pickup position 21.

When the mounting surface of the carrier table 3 is irradiated with laser light, the laser measuring device 7 permanently installed above the pickup position 21 is lowered instead of the transfer section 5. The transfer section 5 is evacuated from the pickup position 21. On the other hand, when detecting the inclination of the holding surface 51a at the pickup position 21, the laser measuring device 7 of the inverted L-shaped support 81 is retracted upward. If the transfer section 5 cannot be brought sufficiently close to the mounting position 22, an inverted L-shaped support 81, an elevating section 82, and a laser measuring device 7 are permanently installed on the mounting position 22 side.

In the device mounting apparatus 1 described above, the mounting surface of the carrier stand 3 and the mounting surface of the mounting table 4 are mainly adjusted so as to be parallel to the holding surface 51a. The present invention is not limited to this, and for example, the parallelism between each area of the carrier C placed on the carrier stand 3 and the substrate S placed on the mounting stand 4 and the holding surface 51a may be adjusted.

In this case, the distances of a plurality of points are measured for each area between the carrier C and the substrate S using the laser measuring device 7, and the inclination angle is calculated for each area. Each time an element E in a region is picked up, the parallelism is adjusted using the tilt angle of the region, and each time an element E is mounted in the region, the parallelism is adjusted from the tilt angle of the region. The tilt mechanism 33 may be used for adjustment. Thereby, it is possible to better pick up and mount the element while taking into consideration warpage, thickness variations, etc. of the carrier C and the substrate S.

(Other embodiments)
The embodiments of the present invention and modifications of each part have been described above, but these embodiments and modifications of each part are presented as examples, and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included within the scope and gist of the invention, and are also included in the invention described in the claims.

For example, a ball screw mechanism has been described as a specific example of a drive mechanism provided in the element mounting apparatus 1, such as the X-axis drive mechanisms 31 and 41, the Y-axis drive mechanisms 32 and 42, and the tilt mechanism 33. The present invention is not limited to this, and other known drive mechanisms such as a linear motor mechanism or a belt drive mechanism can be used.

1 Element mounting apparatus 11 Control means 11a Display section 12 Pneumatic circuit 21 Pick-up position 22 Mounting position 3 Carrier stand 31 Surface 337 Bearing 34 Horizontal plate 4 Mounting table 41 X-axis drive mechanism 42 Y-axis drive mechanism 5 Transfer section 51 Head 51a Holding surface 52 Cylinder 53 θ rotation section 54 Contact block receiver 55 Camera 56 Heater 57 Blower 58a Tilt mechanism 58b Tilt mechanism 581 Base 582 Concave curved surface 583 Sliding section 584 Convex curved surface 585 Adjustment section 586 Knob 587 Frame 588 Spindle 589 Tension spring 59 Bracket 591 Slider 6 Frame 61 Elevating table 62 Support column 7 Laser measuring device 81 Inverted L-shaped column 82 Elevating section 9 Lifting section Part C Carrier E Element S Substrate A Adhesive sheet

The present invention relates to an element mounting apparatus and a method for adjusting the element mounting apparatus.

In order to achieve the above object, an element mounting apparatus according to the present invention includes a supply table on which an element feeder on which elements are arranged in an array is placed, and a substrate on which the elements are arranged in an array. and a holding surface that holds the elements arranged in multiple rows and multiple columns, and which moves between the supply table and the mounting table and holds the elements arranged in multiple rows and multiple columns from the element supply body. a transfer unit that picks up the multi-row and multi-column elements from the holding surface and transfers them all at once from the holding surface to the substrate ; a tilting mechanism capable of adjusting the mounting surface of the supply table and the holding surface of the transfer section, and the holding surface of the transfer section and the mounting surface of the mounting table so that they are parallel to each other; and a displacement sensor for detecting inclinations of the holding surface of the transfer section, the mounting surface of the supply table, and the mounting surface of the mounting table.

The tilt mechanism provided on each of the supply table and the mounting table may be the electric tilt mechanism.

In addition, in order to achieve the above object, the method for adjusting an element mounting apparatus according to the present invention includes a supply table on which an element feeder in which elements are arranged in an array is placed, and a supply table in which the elements are arranged in an array. It has a mounting table on which a substrate is placed, and a holding surface that holds a multi-row, multi-column element, and the device is moved between the supply table and the mounting table, and the multi-row, multi-column device is moved from the element supply body to the mounting table. a transfer unit that picks up the devices in a batch on the holding surface and transfers the picked up multi-row, multi-column devices from the holding surface to the substrate in a batch; a mounting surface of the supply table; and a mounting table; a tilting mechanism that tilts the mounting surface of the transfer unit, a displacement sensor that detects the inclination of the holding surface of the transfer unit, the mounting surface of the supply table, and the mounting surface of the mounting table. A method for adjusting an element mounting apparatus, wherein the displacement sensor detects the inclination of the holding surface of the transfer section, the mounting surface of the supply table, and the mounting surface of the mounting table, and based on the detection results, The tilt mechanism adjusts in advance so that the mounting surface of the supply table and the holding surface of the transfer section, and the holding surface of the transfer section and the mounting surface of the mounting table are parallel to each other. shall be.

Claims (11)

a supply stand on which an element supply body in which elements are arranged in an array is placed;
a mounting table on which a substrate on which the elements are arranged in an array is placed;
The device has a holding surface that holds multiple rows and multiple rows of devices, and moves between the supply table and the mounting table, and simultaneously picks up multiple rows and multiple columns of devices from the device supply body using the holding surface. a transfer unit that transfers the picked up multi-row, multi-column elements from the holding surface to the substrate all at once;
At least one of the mounting surface of the supply table, the holding surface of the transfer section, and the mounting surface of the mounting table is tilted as a tilting object, the mounting surface of the supply table and the holding surface of the transfer section, and a tilt mechanism that can adjust the holding surface of the transfer section and the mounting surface of the mounting table to be parallel to each other;
to have
An element mounting apparatus characterized by: The tilt mechanism includes:
A manual tilt mechanism that tilts the tilting object by manual operation of a knob, an electric tilt mechanism that uses a motor as a power source to tilt the tilting object, or both of these;
The device mounting apparatus according to claim 1, characterized in that: The tilt mechanism is provided in the transfer section and provided in one or both of the supply table or the mounting table,
the tilt mechanism provided in the transfer section is the manual tilt mechanism;
The device mounting apparatus according to claim 2, characterized in that: the tilt mechanism provided on one or both of the supply table or the mounting table is the electric tilt mechanism;
The device mounting apparatus according to claim 3, characterized in that: The electric tilt mechanism is provided on each of the supply table and the mounting table,
further comprising a displacement sensor for detecting inclinations of the holding surface of the transfer unit, the mounting surface of the supply table, and the mounting surface of the mounting table;
The device mounting apparatus according to claim 4, characterized in that: The tilt mechanism is provided in the transfer section and the supply table,
The tilt mechanism of the transfer section adjusts the holding surface of the transfer section to be parallel to the mounting surface of the mounting table,
The tilt mechanism of the supply table adjusts the placement surface of the supply table to be parallel to the holding surface of the transfer unit;
The device mounting apparatus according to any one of claims 1 to 5, characterized in that: The manual tilt mechanism tilts the tilting object by 0.0003° or more and 0.15° or less when the knob rotates once;
The device mounting apparatus according to any one of claims 2 to 5, characterized in that: The electric tilt mechanism includes:
a cam follower that supports a tilting object;
an inclined part that causes the cam follower to follow the direction of ascending and descending of the inclined surface;
Equipped with
The slope portion has a slope that increases in height by 1 mm or less when horizontally moved by 10 mm;
The device mounting apparatus according to any one of claims 2 to 5, characterized in that: a supply stand on which an element supply body in which elements are arranged in an array is placed;
a mounting table on which a substrate on which the elements are arranged in an array is placed;
The device has a holding surface that holds multiple rows and multiple rows of devices, and moves between the supply table and the mounting table, and simultaneously picks up multiple rows and multiple columns of devices from the device supply body using the holding surface. a transfer unit that transfers the picked up multi-row, multi-column elements from the holding surface to the substrate all at once;
A method for adjusting an element mounting apparatus comprising:
At least one of the mounting surface of the supply table, the holding surface of the transfer section, and the mounting surface of the mounting table is tilted as a tilting object, the mounting surface of the supply table and the holding surface of the transfer section, and adjusting in advance so that the holding surface of the transfer section and the mounting surface of the mounting table are parallel to each other;
A method for adjusting an element mounting apparatus characterized by: a tilt mechanism that uses a motor as a drive source to tilt a mounting surface of the supply table and a mounting surface of the mounting table;
a displacement sensor for detecting the inclination of the holding surface of the transfer unit, the mounting surface of the supply table, and the mounting surface of the mounting table;
The method for adjusting the element mounting apparatus further comprising:
The displacement sensor detects the inclination of the holding surface of the transfer section, the mounting surface of the supply table, and the mounting surface of the mounting table, and the tilt mechanism detects the tilt of the holding surface of the transfer section, the mounting surface of the supply table, and the mounting surface of the mounting table. adjusting in advance the holding surface of the transfer unit and the mounting surface of the mounting table so that they are parallel to each other;
The adjustment method according to claim 9, characterized in that: Pick up elements in multiple rows and multiple columns from an element supply body in which elements are arranged in an array by attaching them to a holding surface, make the holding surface face the substrate, and place the picked up elements in multiple rows and multiple columns on the holding surface. A method for mounting elements in which the elements are transferred from the substrate to the substrate in one go,
comprising an adjusting step of making the element supply body and the holding surface parallel to each other, and the holding surface and the substrate parallel to each other;
An element mounting method characterized by:

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