JP2022038348A - Element transfer device - Google Patents

Abstract

To provide an element transfer device that can transfer a plurality of elements collectively for repair work.SOLUTION: An element transfer device includes a pair of pedestals on which supports (carrier C, substrate S) in which elements E are arranged in an array are placed, and a transfer unit that transfers the element E from one pedestal to the other pedestal. The transfer unit includes a transfer head 71 having a plurality of holding portions 72 for individually holding a plurality of elements E and collectively transferring the plurality of elements E, and an angle adjustment mechanism 73 that adjusts the relative angle between the holding unit 72 and the pedestal such that the individual contact angle is achieved in which one of the holding portions 72 sandwiches one element E with the support mounted on the pedestal, and the other holding portion 72 does not contact the other element E arranged on the support.SELECTED DRAWING: Figure 6

Description

The present invention relates to an element transfer device.

Element mounting devices for mounting elements such as semiconductor elements, resistors, and capacitors on a substrate on which a circuit pattern is formed have become widespread. The element mounting device includes an element transfer device that reciprocates between an element feeder in which an element is stocked and a substrate on which the element is mounted. The element transfer device picks up the elements one by one from the element feeder, holds and transports the elements to the substrate, and separates the elements on the substrate. A conductive bonding material such as ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), NCP (Non Conductive Paste) or homogeneous eutectic solder is formed on the substrate, and the substrate is formed with a conductive bonding material. The element is mounted on the substrate by arranging the element and then heating and pressurizing it.

In recent years, the miniaturization of devices has progressed at a very fast pace. Devices with a side size of 200 μm or less, such as 50 μm or 10 μm, have also been proposed. These elements are, for example, mini LEDs or micro LEDs of 50 μm or 10 μm, and are arranged in multiple rows and columns as RGB pixels on a display board for a display, and are arranged on a lighting board as a light emitter of a backlight.

In mounting such an element, from the viewpoint of production efficiency, the element transfer device collectively picks up the elements having multiple rows and columns and mounts them collectively on the substrate. For example, when LEDs are mounted as pixels on a display board, if the display board supports 4K, it is necessary to mount at least 8 million LEDs in one color of RGB on the display board, which is multi-row and multi-column. The LEDs are collectively picked up by the holding units arranged in multiple rows and multiple columns, and are collectively mounted on the board.

Japanese Patent Application Laid-Open No. 2003-332184

As described above, when mounting minute elements with multiple rows and columns on a substrate at once, some of the elements may be left behind from the element feeder, or the elements may fall off during transportation. There may be a mounting omission in which there is a region where the element is not mounted. Further, even if the element can be mounted on the substrate, there may be a mounting defect in which an unacceptable misalignment occurs or a damage that cannot function normally occurs.

It is necessary to remount the element in the place where there was a mounting omission. In addition, it is necessary to pick up and eliminate the defectively mounted element and mount the element again. The work of remounting the element in the place where the mounting is missing or defective is called repair. Since the mounting omissions and mounting defects are scattered on the board, it is not possible to remount a plurality of elements at once, and it is necessary to mount them one by one. Therefore, it becomes a factor that the production efficiency is remarkably lowered.

The present invention has been proposed to solve the above-mentioned problems, and an object of the present invention is to provide an element transfer device capable of collectively transferring a plurality of elements for repair.

In order to achieve the above object, the element transfer device according to the present invention has a pair of pedestals on which supports in which elements are arranged in an array are placed, and one pedestal to the other pedestal. The transfer unit has a transfer unit for transferring, the transfer unit has a plurality of holding units for individually holding a plurality of elements, and a transfer head for collectively transferring the plurality of elements, and any one of the above-mentioned holding units. The portion sandwiches one element with the support mounted on the table, and the other holding portion has an individual contact angle that makes non-contact with other elements arranged on the support. As described above, it has an angle adjusting mechanism for adjusting the relative angle between the transfer head and the table.

Further, in the element mounting device according to the present invention, one of the pair of pedestals is a supply pedestal on which the element feeder which is the support is mounted, and the other of the pair of pedestals is the support. It is a mounting table on which a substrate is mounted, and it moves between the supply table and the mounting table, and at the same time, the multi-row and multi-column elements are collectively picked up from the element feeder and picked up. A mounting head for collectively transferring the multi-row elements to the substrate is provided so as to be replaceable with the transfer head.

According to the present invention, a plurality of elements can be collectively transferred for repair.

It is a perspective view which shows the schematic structure of the element transfer apparatus which concerns on embodiment. It is a perspective view which shows typically the adhesive sheet attached to the mounting part and the transfer part. It is a front view which shows the detailed structure of the element transfer apparatus. It is a side view which shows the detailed structure of the element transfer apparatus which concerns on embodiment. It is a figure which shows the detailed structure of the mounting part. It is a figure which shows the detailed structure of the transfer part. It is a bottom view which shows the transfer head. It is a flowchart which shows the procedure of the mounting work. It is explanatory drawing which shows the mode of the angle change of a transfer head. It is a flowchart which shows the procedure of repair work. It is explanatory drawing which shows the position of the element picked up for repair. It is explanatory drawing which shows the part of mounting omission. It is a bottom view which shows the other aspect of a rectangular transfer head. It is explanatory drawing which shows the aspect of the angle change of another aspect of a rectangular transfer head. It is explanatory drawing which shows the aspect of the pickup and mounting of another aspect of a rectangular transfer head. It is a bottom view which shows the other aspect of the shape of a transfer head. It is a side view which shows the aspect which made the lower surface of a transfer head a curved surface. It is a bottom view which shows the example which used the mounting head as a transfer head.

An embodiment of the element transfer device according to the present invention will be described in detail with reference to the drawings. The dimensions, spacing, tilt angle, etc. of each part of the element transfer device in the drawings are exaggerated for easy understanding, and are different from the actual dimensions, spacing, tilt angle, etc.

[Rough configuration]
FIG. 1 is a schematic diagram showing a schematic configuration of an element transfer device 1. As shown in FIG. 1, the carrier C and the substrate S are carried into the element transfer device 1. The carrier C is a support in which the elements E are stocked in an array. The carrier C, which is this support, is called an element feeder. The array shape means a state in which the elements E are arranged in a plurality of rows and columns according to a determined pattern, and the intervals in the row direction and the column direction are the same or different. It is a staggered arrangement such as. An adhesive material A1 is attached to the surface on which the element E of the carrier C is arranged, and the element E is held by the carrier C by the adhesive material A1.

The element E is a component used in an electronic circuit, and includes a MEMS, a semiconductor element, a chip such as a resistor and a capacitor, and the semiconductor element includes a discrete semiconductor such as a transistor, a diode, an LED and a thyristor, and an IC or an LSI. Etc. are included. LEDs include so-called mini LEDs and micro LEDs. In particular, the element E includes so-called minute parts having a side of 200 μm or less.

The substrate S is a support on which the element E is mounted. The substrate S, which is the support, is called an element mount. The substrate S is a lighting substrate for a backlight in which a circuit pattern is formed, for example, a backlight in which mini LEDs are arranged, and a display substrate in which each of RGB micro LEDs is arranged as pixels. The adhesive material A2 is mounted on the surface of the substrate S on which the elements E are arranged, and the element E is mounted on the substrate S by pressing the element E through the adhesive material A2.

The element transfer device 1 collectively picks up the multi-row and multi-column elements E from the carrier C, and collectively transfers the picked up multi-row and multi-column elements E to the substrate S. Then, the element transfer device 1 manufactures an element mounting substrate in which the elements E are arranged in an array by transferring the elements E having multiple rows and columns to the substrate S a plurality of times. Further, the element transfer device 1 electrically and mechanically joins the transferred element E to the substrate S. Such an element transfer device 1 is also referred to as a die bonding device or a chip bonding device. That is, the element transfer device 1 of the present embodiment can be regarded as an element mounting device.

The element transfer device 1 includes a pair of pedestals on which a support on which the element E is placed is placed, and a mounting unit 5 and a transfer unit that collectively transfer a plurality of elements E from one pedestal to the other. 7 and. The pair of bases are a carrier base 3 and a mounting base 4, respectively. The carrier stand 3 is a supply stand of the carrier C having a mounting surface on which the carrier C is mounted, and stops at the pickup position 21. That is, the carrier stand 3 stops the multi-row, multi-column element E group to be picked up among the elements E stocked in an array on the carrier C so that the center position thereof is located at the pickup position 21. Let me.

The mounting table 4 is a supply table of the board S having a mounting surface on which the board S is mounted, and stops at the mounting position 22. That is, in the circuit pattern on the substrate S, the mounting base 4 stops the circuit pattern in which the multi-row, multi-column element E group is mounted by the mounting unit 5 so that the center position thereof is located at the mounting position 22.

The mounting unit 5 transfers the element E of the carrier C to the substrate S for mounting. As shown in FIG. 2A, the mounting unit 5 has a mounting head 51 that moves between the pickup position 21 and the mounting position 22. The mounting head 51 faces the carrier C mounted on the carrier table 3 at the pickup position 21, and collectively picks up the elements E having multiple rows and columns from the carrier C. Further, the mounting head 51 faces the board S mounted on the mounting table 4 at the mounting position 22, and mounts the multi-row, multi-column elements E held together on the board S.

The method of picking up the element E by the mounting head 51 is adhesive. That is, the adhesive sheet B1 is mounted on the mounting head 51. The pressure-sensitive adhesive sheet B1 has a pressure-sensitive adhesive region on one side that is the same as or slightly wider than the region in which the multi-row, multi-column elements E are arranged.

As shown in FIG. 1, the transfer unit 7 has a transfer head 71 that collectively transfers a plurality of elements E. As shown in FIG. 2B, the transfer head 71 has a plurality of holding portions 72 that individually hold a plurality of elements E. The transfer head 71 is provided interchangeably with the mounting head 51, and moves between the pickup position 21 and the mounting position 22 in the same manner as the mounting head 51. Then, the transfer head 71 faces the carrier C mounted on the carrier table 3 at the pickup position 21, and picks up the element E held by the holding portion 72 from the carrier C. Further, the transfer head 71 faces the substrate S mounted on the mounting table 4 at the mounting position 22, and the elements E held by the holding portion 72 are mounted on the substrate S one by one.

The method of holding the element E by the holding portion 72 is adhesive. That is, the adhesive sheet B2 is attached to the tip of the holding portion 72. The pressure-sensitive adhesive sheet B2 has the same or slightly wider size as the single element E. The adhesive strength of the adhesive material A1 of the carrier C, the adhesive material A2 of the substrate S, the adhesive sheet B1 of the mounting head 51, and the adhesive sheet B2 of the holding portion 72 is A1 <B1 = B2 <A2. This makes it possible to separate the element E from the carrier C for pickup by the mounting head 51 or the transfer head 71, and to separate the element E from the mounting head 51 or the transfer head 71 for mounting on the substrate S.

[Detailed configuration]
The above-mentioned element transfer device 1 will be described in more detail. FIG. 3 is a front view showing a detailed configuration of the element transfer device 1, and FIG. 4 is a side view showing a detailed configuration of the element transfer device 1. The pickup position 21 and the mounting position 22 are indicated by a two-dot chain line in the figure.

The element transfer device 1 includes a carrier base 3, a mounting base 4, a mounting unit 5, and a transfer unit 7 configured by exchanging the mounting head 51 of the mounting unit 5 with a transfer head 71, as well as a gantry 6, an exchange table 8, and an element transfer device 1. The elevating part 9 is provided. Hereinafter, the uniaxial direction parallel to the upper surface of the gantry 6 is referred to as an X-axis direction. The Y-axis direction is a direction parallel to the upper surface of the gantry 6 and orthogonal to the X-axis, the Z-axis direction is a height direction orthogonal to the X-axis and the Y-axis direction, and θ rotation is rotation around the Z-axis. Point to. Further, the direction away from the upper surface of the gantry 6 to the outside of the gantry 6 along the Z-axis direction is referred to as upward, and the direction from the upper surface of the gantry 6 toward the inside of the gantry 6 along the Z-axis direction is referred to as downward.

The gantry 6 is a table having a flat upper surface, and a carrier pedestal 3, a mounting pedestal 4, a mounting section 5, a transfer section 7, a switching pedestal 8, and an elevating section 9 are installed. Inside the gantry 6, a control device 11 including an arithmetic unit, a storage device, a signal transmission / reception device, an input / output device, and the like for controlling each part of the element transfer device 1 is housed.

The carrier base 3 has a mounting surface that extends two-dimensionally in the X-axis and Y-axis directions. The carrier base 3 includes an X-axis drive mechanism 31 and a Y-axis drive mechanism 32, and is movable in the X-axis direction and the Y-axis direction. The movable range in the X-axis direction includes the carry-in / discharge position in which the carrier C is carried in and out of the pickup position 21 and the carrier base 3. The X-axis drive mechanism 31 is used for aligning the carrier C with the mounting unit 5 or the transfer unit 7 in the X-axis direction. Further, the Y-axis drive mechanism 32 is used for positioning the carrier C and the mounting unit 5 or the transfer unit 7 in the Y-axis direction.

As the X-axis drive mechanism 31 and the Y-axis drive mechanism 32, for example, a ball screw mechanism can be adopted. That is, the rail and the ball screw are extended along each movable direction. The ball screw is composed of a rotary motor, a screw shaft and a slider, the slider is screwed onto the screw shaft, and the screw shaft is rotated by the rotary motor. The X-axis drive mechanism 31 is fixed to the slider of the Y-axis drive mechanism 32 and placed on the rail of the Y-axis drive mechanism 32. The carrier base 3 is fixed to the slider of the X-axis drive mechanism 31 and placed on the rail of the X-axis drive mechanism 31.

The mounting base 4 has a mounting surface that extends two-dimensionally in the X-axis and Y-axis directions. The mounting base 4 is also movable in the X-axis direction and the Y-axis direction, and includes an X-axis drive mechanism 41 and a Y-axis drive mechanism 42 having a ball screw mechanism. The Y-axis drive mechanism 42 is mainly used for loading and unloading the substrate S mounted on the mounting table 4, and is also used for aligning the substrate S with the mounting unit 5 or the transfer unit 7 in the Y-axis direction. Further, the X-axis drive mechanism 41 is used for aligning the mounting unit 5 or the transfer unit 7 with the substrate S in the X-axis direction.

The pickup position 21 and the mounting position 22 are provided at intervals in the X-axis direction. The gantry 6 is provided with a raising pedestal 61 that is one step higher than the upper surface of the gantry 6 and extends along the pickup position 21 and the mounting position 22. The mounting unit 5 or the transfer unit 7 is installed on the raising table 61, self-propells along a straight line connecting the pickup position 21 and the mounting position 22, and is mounted on the carrier table 3 located at the pickup position 21 and the mounting position 22. It is possible to descend toward the platform 4 in the Z-axis direction.

A rail 63 is laid on the raising table 61 along the X-axis direction. The rail 63 is a guide for the mounting unit 5 or the transfer unit 7 that moves between the pickup position 21 and the mounting position 22. The rail 63 has a length that reaches the carrier base 3 located at the pickup position 21 and the mounting base 4 located at the mounting position 22. The rail 63 is attached to the support portion 64. The support portion 64 is a block body that supports the mounting portion 5 or the transfer portion 7, and is further driven by a ball screw 65 composed of a rotary motor and a screw shaft that is rotated by a rotary motor to move on the rail 63. do.

The support portion 64 extends in the Y-axis direction toward a straight line connecting the pickup position 21 and the mounting position 22. The mounting portion 5 or the transfer portion 7 is attached to the extending tip surface 67 of the supporting portion 64. A rail 66 extending in the Z-axis direction is laid on the extending tip surface 67. The mounting portion 5 or the transfer portion 7 is attached to the support portion 64 via the rail 66, and is slidable in the Z-axis direction.

The elevating unit 9 pushes down the mounting unit 5 or the transfer unit 7 which is slidable in the Z-axis direction, so that the mounting unit 5 or the transfer unit 7 located at the pickup position 21 is lowered toward the carrier base 3. Further, the mounting unit 5 or the transfer unit 7 located at the mounting position 22 is lowered toward the mounting table 4. First, on the gantry 6, a support column 62 located behind the raising pedestal 61 and extending higher than the mounting portion 5 or the transfer portion 7 is erected. The upper end of the support column 62 is bent in the Y-axis direction and protrudes directly above the movement locus of the mounting portion 5 or the transfer portion 7. The elevating portion 9 is installed on the extended tip surface 69 of the support column 62.

That is, a rail 91 extending in the Z-axis direction is laid on the extending tip surface 69 of the support column 62. Further, on the extended tip surface 69 of the column 62, a screw shaft 93 that is rotated by a rotary motor 92 is installed in parallel with the rail 91. Further, the contact block 94 is attached via the rail 91 and screwed to the screw shaft 93. The contact block 94 descends toward the mounting unit 5 or the transfer unit 7 by driving the rotary motor 92, abuts on the upper end of the mounting unit 5 or the transfer unit 7, and further pushes down the mounting unit 5 or the transfer unit 7. The mounting unit 5 or the transfer unit 7 is urged upward by an urging means such as a spring (not shown), and the contact block 94 opposes the urging means to the mounting unit 5 or the transfer unit. Push down 7. When the pressing force by the contact block 94 is released by the contact block 94 being separated from the mounting unit 5 or the transfer unit 7, the mounting unit 5 or the transfer unit 7 is shown in FIGS. 3 and 4 by the urging means. Will be returned to the ascending position.

The mounting unit 5 or the transfer unit 7 can move along the rail 63 to directly above the pickup position 21 and the mounting position 22. Therefore, the contact block 94 is long in the X-axis direction so that at least both the pickup position 21 and the mounting position 22 are within the range, and the mounting unit 5 is located at any position of the mounting unit 5 or the transfer unit 7. Alternatively, it can be pushed down by coming into contact with the transfer unit 7. Further, the mounting unit 5 or the transfer unit 7 may be connected to the contact block 94 in a movable state in the X-axis direction.

FIG. 5 is a diagram showing a detailed configuration of the mounting unit 5. The mounting portion 5 is configured by connecting the mounting head 51, the cylinder 52, the θ rotating portion 53, and the contact block receiving 54 in the Z-axis direction from a direction close to the carrier base 3 and the mounting base 4 in the Z-axis direction. Further, the mounting unit 5 is provided with a camera 55 beside the row of the mounting head 51 and the cylinder 52.

The mounting head 51 is a rectangular parallelepiped block, and has a holding surface 51a on which the adhesive sheet B1 is arranged on the lower surface. The cylinder 52 is a pressurizing source such as an air cylinder, and by applying a load to the mounting head 51, the adhesive sheet B1 is pressed against the element E via the mounting head 51 at the pickup position 21 and mounted at the mounting position 22. The element E is pressed against the substrate S via the head 51. The mounting head 51 is detachably provided on the pressure rod extending from the cylinder 52 via the connector L. The θ rotation unit 53 rotates the mounting head 51 around the Z axis to align the element E on the carrier C with the circuit pattern on the substrate S. The contact block receiver 54 is a member that comes into contact with the contact block 94. The camera 55 detects the relative positional deviation between the mounting unit 5 and the carrier C, and between the mounting unit 5 and the substrate S.

6 and 7 are views showing the detailed configuration of the transfer unit 7. The holding portions 72 in FIG. 7 are numbered [1] to [4] for convenience of identification. The transfer unit 7 is configured by replacing the mounting head 51 of the mounting unit 5 with the transfer head 71. The transfer head 71 is a rectangular parallelepiped block, and has a holding portion 72 on the lower surface thereof. The holding portion 72 is a protrusion whose tip is brought into contact with and separated from the element E. The protrusion is a rectangular parallelepiped columnar member, and protrudes so as to stand upright from the surface of the transfer head 71 facing the carrier C or the substrate S, that is, from the lower surface. The holding portions 72 are provided at positions along the outer edge of the lower surface of the transfer head 71 at positions spaced apart from each other. More specifically, as shown in FIG. 7, holding portions 72 are provided at four locations in total, one at each of the four corners of the lower surface of the transfer head 71. The holding unit 72 holds the elements E one by one. In the present embodiment, the adhesive sheet B2 is attached to the tip of the holding portion 72, and the element E can be held by the adhesive force of the adhesive sheet B2.

Further, the transfer unit 7 has an angle adjusting mechanism 73. In the angle adjusting mechanism 73, one of the holding portions 72 sandwiches one element E with the carrier C or the substrate S, and the other holding portion 72 is placed on the carrier C or the other element E arranged on the substrate S. The angle of the transfer unit 7 is adjusted so that the individual contact angle is non-contact. The angle adjusting mechanism 73 makes the angle of the lower surface of the transfer head 71 parallel to or tilts the plane parallel to the carrier C or the substrate S, that is, the XY plane defined by the X-axis and the Y-axis. The angle adjusting mechanism 73 includes a rotation axis extending in the X-axis direction and a servomotor that rotates the rotation axis, and a servomotor that rotates the rotation axis extending in the Y-axis direction and the rotation axis. By driving each servomotor, the transfer head 71 and the holding portion 72 change the angle with respect to the XY plane.

The angle adjusting mechanism 73 to which the transfer head 71 is attached is detachably provided on the pressure rod extending from the cylinder 52 via the connector L. That is, by exchanging the transfer head 71 and the angle adjusting mechanism 73 with the mounting head 51, the transfer unit 7 that uses the cylinder 52, the θ rotating unit 53, the contact block receiving 54, and the camera 55 in common with the mounting unit 5 It is composed.

The camera 55 takes an image of the substrate S on which the element E is mounted. The control device 11 detects the position of the mounting omission or the mounting defect from the image captured by the camera 55. For example, the control device 11 performs image processing such as binarization and contour enhancement on the element E captured in the image captured by the camera 55 to extract the outer shape of the element E, and sets the center of gravity and the like and the reference position. The positional deviation is determined from the difference between. Further, the defect is determined from the difference between the outer shape of the extracted element E and the reference shape. Further, since the element E does not exist at the reference position, it is determined that the mounting is missing.

The switching table 8 is a table that accommodates the mounting head 51 and the transfer head 71. The switching table 8 is provided between the carrier table 3 and the mounting table 4 of the frame 6. The pressure rod of the cylinder 52 comes directly above the mounting head 51 or the transfer head 71 housed in the switching table 8, and descends to connect the connector L to the mounting head 51 or the transfer head 71 and the pressure rod. And are connected. Further, the pressure rod of the cylinder 52 to which the mounting head 51 or the transfer head 71 is connected comes to the switching table 8 and descends to detach the connector L so that the mounting head 51 or the transfer head 71 can be replaced by the switching table 8. Is housed in.

[Detailed operation]
[Implementation operation]
The mounting operation of the element E by such an element transfer device 1 will be described. FIG. 8 is a flowchart showing the mounting operation of the element transfer device 1. First, the mounting unit 5 moves to the pickup position 21 (step S01). At the pickup position 21, the carrier stand 3 carries the carrier C and stands by. That is, among the elements E stocked in an array on the carrier C, the central position of the multi-row, multi-column element E group (hereinafter referred to as “element E group to be picked up”) picked up by the mounting unit 5 this time is located. It is waiting in a state of being positioned at the pickup position 21. When the mounting unit 5 reaches the pickup position 21, the mounting unit 5 and the carrier C, that is, the element E group to be picked up are aligned (step S02).

In step S02, the camera 55 photographs the element E group to be picked up. When the image of the camera 55 is analyzed by the control device 11 and the positional deviation in the X-axis direction and the Y-axis direction and the deviation in the direction around the Z axis are detected between the mounting unit 5 and the element E group to be picked up, the mounting is performed. The unit 5 and the carrier table 3 move relatively so as to eliminate the deviation.

When the alignment between the mounting unit 5 and the element E group scheduled to be picked up is completed, the mounting unit 5 picks up the element E group scheduled to be picked up from the carrier C (step S03). The elevating unit 9 lowers the mounting unit 5 toward the carrier C of the carrier base 3 and presses it against the element E group to be picked up. As a result, all the elements E group to be picked up are attached to the adhesive sheet B1.

When the element E group moves to the adhesive sheet B1, the mounting unit 5 moves from the pickup position 21 to the mounting position 22 (step S04). At this time, the mounting table 4 mounts the substrate S and stands by at the mounting position 22. That is, among the circuit patterns formed on the substrate S, the central position of the region where the multi-row, multi-column element E group is mounted (hereinafter referred to as “planned mounting region”) in the mounting portion 5 this time is the mounting position 22. It is waiting in the state of being positioned in.

When the mounting unit 5 reaches the mounting position 22, the mounting unit 5 and the planned mounting area on the board S are aligned (step S05). The camera 55 captures the circuit pattern in the planned mounting area. Then, the control device 11 detects the positional deviation in the X-axis direction and the Y-axis direction and the deviation in the direction around the Z axis between the mounting unit 5 and the planned mounting area, and eliminates the deviation with the mounting unit 5. The mounting base 4 is relatively moved.

When the alignment between the mounting unit 5 and the substrate S is completed, the mounting unit 5 mounts the element E group on the substrate S (step S06). The elevating unit 9 lowers the mounting unit 5, and the mounting unit 5 collectively presses the element E group against the substrate S. That is, the rotary motor 92 operates, and the contact block 94 descends toward the mounting portion 5. The contact block 94 comes into contact with the contact block receiver 54 of the mounting portion 5, pushes down the entire mounting portion 5 toward the substrate S, and brings the element E group into contact with the substrate S. At this time, since the pressure required for pressing is supplied to the cylinder 52, the element E group is pressed against the substrate S at a predetermined pressure. The element E group attached to the adhesive sheet B1 is transferred to the substrate S.

When the mounting of the element E on the board S side is completed, the mounting unit 5 moves to the pickup position 21, picks up the new multi-row multi-column element E, and newly picks up the multi-row multi-column at the mounting position 22. The mounting of the element E of the above is repeated. As a result, the element transfer device 1 sequentially picks up the element E group on the carrier C and mounts the element E group on the substrate S. Each time the mounting is performed, the mounting area of multiple rows and multiple columns is imaged by the camera 55, and the control device 11 detects the position of the mounting omission or the mounting defect.

[Repair operation]
Next, the repair operation by the transfer unit 7 will be described.
(Batch contact angle and individual contact angle)
First, a mode in which the holding portion 72 of the transfer head 71 sandwiches the element E with the carrier C or the substrate S will be described with reference to FIG. FIG. 9A shows a state in which the angle adjusting mechanism 73 has a collective contact angle in which the plurality of holding portions 72 collectively contact the plurality of elements E. In the present embodiment, the lower surface of the transfer head 71 is parallel to the carrier C or the substrate S at the collective contact angle. In the mounting by the mounting head 51, the angle adjusting mechanism 73 has a contact angle at which the adhesive sheet B1 of the mounting head 51 contacts a plurality of elements E at once.

Further, FIG. 9 (B) shows a state in which the angle adjusting mechanism 73 has an individual contact angle in which one of the holding portions 72 sandwiches one element E and the other holding portion 72 does not contact the other element E. )-(E). In the present embodiment, at the individual contact angle, the lower surface of the transfer head 71 is tilted with respect to the carrier C or the substrate S. For example, the size of the element E is 40 μm square, the thickness is 10 μm, the arrangement pitch of the element E is 0.1 mm, the protrusion height of the holding portion 72 from the lower surface of the transfer head 71 is 30 μm, and the holding portion. When the cross section of the 72 is 40 μm square and the distance between the adjacent holding portions 72 is 18 mm, the individual contact angle can be realized if the inclination angle is 0.1 ° or more. In this case, the holding portion 72 adjacent to the holding portion 72 in contact with the element E has a gap of about 30 μm or more from the element E immediately below the holding portion 72. It should be noted that the value is not necessarily limited to this value, and when the position of the holding portion 72 is at the four corners of the transfer head 71 or the like, the position to be mounted by the holding portion 72 and the element E adjacent to the holding portion 72 are not in contact with each other. good.

(Batch pickup and individual mounting)
In such a case, an embodiment in which the element E is picked up at the collective contact angle and the element E is mounted at the individual contact angles will be described. FIG. 10 is a flowchart showing a repair operation of the element transfer device 1. The following repair operation is a process of replenishing the element E at a position where the element E is not mounted. First, in the switching table 8, the transfer unit 7 configured by exchanging the mounting head 51 with the transfer head 71 moves to the pickup position 21 (step S11). At the pickup position 21, the carrier stand 3 mounts the carrier C on which the element E for repair is mounted and stands by. As the carrier C, one equipped with the element E used for mounting may be used, or a carrier C equipped with the element E dedicated to repair may be used. When the transfer unit 7 reaches the pickup position 21, the transfer unit 7 and the carrier C, that is, the element E group scheduled to be picked up are aligned (step S12).

When the alignment with the element E group scheduled to be picked up by the transfer unit 7 is completed, the transfer unit 7 picks up the element E for repair from the carrier C (step S13). That is, as shown in FIG. 9A, the elevating unit 9 lowers the transfer head 71 toward the carrier C of the carrier base 3 in a state where the holding unit 72 has a collective contact angle, and the element E for repair. Press the tip of the holding portion 72 against. As a result, the four repair elements E shown in black in FIG. 11 are attached to the tips of the four holding portions 72.

When the element E moves to the tip of each holding portion 72, the transfer portion 7 moves from the pickup position 21 to the mounting position 22 (step S14). At this time, the mounting table 4 mounts the substrate S on which the element E is mounted and stands by at the mounting position 22. That is, in the region on which the element E group is mounted on the substrate S, the position where the mounting is missing is standing by in a state of being positioned at the mounting position 22. When the transfer unit 7 reaches the mounting position 22, the angle adjusting mechanism 73 of the transfer unit 7 sets the transfer head 71 to an individual contact angle (see FIG. 9B). For example, the holding portion 72 of [1] is tilted so as to project downward. Then, the holding portion 72 of [1] and the position where the mounting is missing on the substrate S are aligned (step S15). The position where the mounting is missing is shown by the hatched area in FIG. The mounting omission points are scattered in the mounting area. The control device 11 detects the positional deviation in the X-axis direction and the Y-axis direction and the deviation in the direction around the Z-axis between the transfer unit 7 and the position where the mounting is missing, and the transfer unit 7 so as to eliminate the deviation. And the mounting base 4 are relatively moved.

When the alignment between the transfer unit 7 and the substrate S is completed, the transfer unit 7 individually mounts the element E on the substrate S (step S16). That is, as shown in FIG. 9B, the elevating unit 9 lowers the transfer unit 7, and the holding unit 72 presses the element E against the substrate S. Since the transfer head 71 has an individual contact angle, the element E is also inclined with respect to the substrate S, but the element E is pressed against the hard substrate S via the adhesive material A2 to imitate the substrate S. Is crimped. In this way, the element E attached to the tip of the holding portion 72 is transferred to the substrate S.

After that, as shown in FIGS. 9C to 9E, the position where the other mounting omission was made was positioned at the mounting position 22, and the element E was held in the same manner as described above [2] to [4]. ], The operation of mounting the holding portion 72 as an individual contact angle is repeated until all the elements E held by the holding portion 72 are mounted (steps S16 and S17).

When the mounting of the element E held by the holding unit 72 on the substrate S is completed, the transfer unit 7 moves to the pickup position 21, and as shown in FIG. 9A, the transfer head 71 is used as a collective contact angle for repair. Pick up the element E of. At this time, the element E to be picked up is set to a position adjacent to the position of the previously picked up element E shown in black in FIG. Such picking up and mounting of the element E by the transfer unit 7 is repeated until the mounting of the element E to the place where the mounting is missing is completed.

(Individual pickup and individual mounting)
In the above aspect, the elements E are collectively picked up by the plurality of holding portions 72, but also in the pickup, the holding portions 72 may be set as individual contact angles and the elements E may be picked up one by one. ..

That is, in the same manner as described above, the transfer unit 7 and the carrier C, that is, the element E to be picked up are aligned. That is, the angle adjusting mechanism 73 of the transfer unit 7 sets one holding unit 72 that holds the element E into an individual contact angle. Then, the holding portion 72 and the position of the element E to be picked up first are aligned. For example, positioning is performed with respect to the element E in any corner. When the alignment between the transfer unit 7 and the carrier C is completed, the elevating unit 9 lowers the transfer unit 7, and the holding unit 72 presses the element E against the carrier C. When the elevating part 9 raises the transfer part 7, the element E attached to the tip of the holding part 72 is picked up.

Next, the position of the holding portion 72 that does not hold the element E and the position of the element E to be picked up next are aligned. For example, the element E attached to the tip of the holding portion 72 is picked up by aligning with the position of the element E next to the element E picked up last time. As described above, the holding unit 72 repeatedly picks up the element E, and all the holding units 72 hold the element E.

After that, in the same manner as described above, all the elements E held by the holding portion 72 are mounted at the positions where the mounting is missing. In this way, the transfer unit 7 repeats picking up and mounting the element E until the mounting of the element E to the place where the mounting is missing is completed.

For the element E with improper mounting, the transfer head 71, in which the adhesive force at the tip of the holding portion 72 is stronger than the adhesive force of the adhesive material A2 of the substrate S, is used to hold the element E at an individual contact angle as described above. The defective element E is brought into contact with the substrate S so as to be sandwiched by the portion 72, and is individually picked up. After that, the element E is individually mounted at the position where the element E is removed by being picked up in the same manner as described above.

The picked up plurality of defectively mounted elements E are adhesively disposed of in a separately prepared disposal stage. An adhesive sheet stronger than the adhesive force of the adhesive sheet B2 of the holding portion 72 is arranged on the disposal stage. By lowering the transfer head 71, the defectively mounted element E held by the holding portion 72 having a collective contact angle is pressed against the adhesive sheet on the disposal stage, and then the transfer head 71 is raised. Then, the defectively mounted element E is collectively transferred to the disposal stage side. By setting the transfer head 71 to the collective contact angle in this way, the element E with a mounting defect can be collectively discarded.

[effect]
(1) The element transfer device 1 of the present embodiment includes a pair of bases (carrier base 3, mounting base 4) on which a support (carrier C, substrate S) for arranging the elements E in an array is placed. The transfer unit 7 has a transfer unit 7 for transferring the element E from one table to the other table, and the transfer unit 7 has a plurality of holding units 72 for individually holding a plurality of elements E. One element E is sandwiched between the transfer head 71 that collectively transfers the elements E of the element E and a support mounted on one of the holding portions 72, and the other holding unit 72 is sandwiched between the transfer head 71 and the support. 72 has an angle adjusting mechanism 73 that adjusts the relative angle between the holding portion 72 and the table so that the contact angle is individual so as to be non-contact with other elements E arranged on the support.

Therefore, since the plurality of elements E for repair can be collectively held by the plurality of holding units 72 and transferred from one table to the other, the transfer is more efficient than the case of transferring one by one. It can reduce the time required for repair.

(2) The angle adjusting mechanism 73 sets the holding portion 72 as an individual contact angle, so that each holding portion 72 picks up the element E from the support one by one. Therefore, since the holding portion 72 has an individual contact angle, the repair element E can be picked up without omission, and waste of the element E can be prevented. Further, the scattered elements E with improper mounting can be individually picked up by the holding portion 72 having an individual contact angle.

(3) The angle adjusting mechanism 73 adjusts the relative angle between the transfer head 71 and the table so that the plurality of holding portions 72 have a collective contact angle in which the plurality of holding portions 72 collectively contact the plurality of elements E, and the collective contact is performed. The holding portion 72 of the transfer head 71 having an angle picks up a plurality of elements E from the carrier C at once. Therefore, since the repair element E can be picked up all at once, the time required for repair can be further shortened.

(4) In the angle adjusting mechanism 73, each holding portion 72 mounts one element E on the substrate S by setting the transfer head 71 as an individual contact angle. Therefore, since the holding portion 72 has an individual contact angle, the element E can be individually mounted on the scattered mounting omission points.

(5) The plurality of holding portions 72 are protrusions that are arranged on the transfer head 71 at intervals from each other and whose tips are individually brought into contact with and separated from the element E. Therefore, only one holding portion 72 is in contact with one element E, and the other holding portion 72 is likely to be in non-contact with the other element E. Therefore, the individual contact angle can be obtained with a small amount of angle change.

(6) One of the pair of pedestals is the carrier pedestal 3 on which the carrier C is mounted, and the other of the pair of pedestals is the mounting pedestal 4 on which the substrate S is mounted, and the carrier pedestal 3 and the mounting pedestal 4 are mounted. The mounting head 51, which moves between the carrier C and collectively picks up the multi-row and multi-column elements E from the carrier C and collectively transfers the picked up multi-row and multi-column elements E to the substrate S, is a transfer head. It is provided so that it can be exchanged with 71. Therefore, after mounting the element E, repair can be performed without moving the substrate S to another inspection device.

(Modification example)
A modified example of this embodiment will be described. First, as shown in FIG. 13A, holding portions 72 may be provided at four locations, one at the center of each of the four sides. Again, for convenience, the holding portions 72 are numbered [1] to [4], respectively. As a result, as shown in FIG. 14A, the four elements E can be collectively picked up from the carrier C by setting the transfer head 71 to the collective contact angle. Further, as shown in FIGS. 14 (B) to 14 (E), the transfer head 71 is set to an individual contact angle so that the holding portions 72 of [1] to [4] project downward in order. E can be individually mounted on the substrate S, or the element E can be individually picked up from the substrate S.

Further, as shown in FIGS. 13 (B) and 13 (C), one additional holding portion 72 may be provided on the lower surface of the transfer head 71 and inside the outer edge thereof. As a result, as shown in FIG. 15A, the number of elements E that can be picked up can be further increased by one by setting the transfer head 71 to the collective contact angle. The element E held by the inner holding portion 72 has the transfer head 71 at an individual contact angle, and after all the elements E of the surrounding holding portions 72 have been mounted, as shown in FIG. 15 (B). Finally, the transfer head 71 is mounted as a collective contact angle.

Further, as shown in FIG. 13D, the transfer head 71 may be provided at four corners on the lower surface, one at the center of each side, and one inside the outer edge, for a total of nine locations. As a result, the nine elements E can be collectively picked up with the transfer head 71 as the collective contact angle. Then, after mounting the four elements E at the four corners as the individual contact angles, the four elements E at the center of the four pieces can be mounted, and finally, the one inner element E can be mounted as the collective contact angle.

The shape of the transfer head 71 is not limited to a rectangle, and may be a triangular shape, a hexagonal shape, or any other polygonal shape as shown in FIGS. 16A and 16B. Further, as shown in FIG. 16C, it may be star-shaped or gear-shaped. Further, as shown in FIG. 16D, it may be circular, oval, track-shaped, or the like.

As shown in FIG. 2B, a protrusion protruding from the surface of the transfer head 71 may be used as the holding portion 72, or as shown in FIGS. 16A to 16C, a plane viewing angle portion may be used. The protrusion formed on the edge of the transfer head 71 as described above may be used as the holding portion 72. If the protrusions are formed in this way, it becomes difficult to make contact with the adjacent elements E, so that the individual contact angles can be reduced. Further, by reducing the individual contact angle at the time of mounting, it is possible to suppress the application of stress such as lateral displacement to the element E, and it is possible to suppress the damage of the element E. In the aspect of FIG. 2B, the holding portion 72 is a rectangular parallelepiped, but the shape is not limited to this. Any shape may be used as long as it is a protruding protrusion such as a polygonal prism, a cylinder, or a hemisphere, and it may be appropriately determined according to the shape and size of the element E to be held.

Further, the tip of the holding portion 72 may be a curved surface. For example, as shown in FIG. 17A, the tip of the holding portion 72 may have a shape such as a spherical surface with rounded corners. As a result, as shown in [a] to [e] of FIG. 17A, in the process of picking up and mounting the element E, as shown in [b] and [e], diagonally at individual contact angles. The lateral displacement stress generated by pressing the element E from the direction can be suppressed, and the damage of the element E can be suppressed. Further, the lower surface of the transfer head 71 may be a curved surface. For example, as shown in FIG. 17B, the shape may be such that the holding portion 72 is provided on the lower surface of the dome-shaped transfer head 71. In the case of a dome shape, the holding portion 72 can be used at any position that does not hit the adjacent element E. The center of the lowermost end does not necessarily have to be the holding portion 72.

Further, the holding portion 72 does not have to be a protrusion. That is, the adhesive surface provided on the lower surface of the transfer head 71 can be used as the holding portion 72. In this case, when the holding portion 72 comes into contact with one element E, it does not have to come into contact with the other element E. For example, the mounting head 51 and the transfer head 71 may be shared. As shown in FIG. 18A, the mounting head 51 can be used as the transfer head 71 by forming the vicinity of the unused outer edge of the mounting head 51 as the holding portion 72. As a result, the mounting head 51 can be repaired without the need for replacement. Further, as shown in FIGS. 18A to 18C, the lower surface edge of the transfer head 71 may be a curved surface instead of a protrusion, and this curved surface may be a holding portion 72. In this case, the flat portion of the lower surface may be used for normal mounting. That is, even in this case, the mounting head 51 and the transfer head 71 can be shared.

Further, a part of the plurality of holding portions 72 and a part of the holding place may be used for picking up the element E having a defective mounting. In this case, the adhesive strength is increased only in the holding portion 72 for the pickup or the holding place.

[Other embodiments]
Although the embodiment of the present invention and the modification of each part have been described above, the embodiment and the modification of each part are presented as an example, and the scope of the invention is not intended to be limited. These novel embodiments described above can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and variations thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims.

For example, the angle adjusting mechanism 73 realizes a collective contact angle and an individual contact angle by adjusting the angle of the transfer head 71. However, the collective contact angle and the individual contact angle may be realized by adjusting the relative angle between the transfer head and the table. For example, the table may be provided with an angle adjusting mechanism for adjusting the angle of the support. That is, the collective contact angle and the individual contact angle may be realized by providing an angle adjusting mechanism for adjusting the angles of the carrier base 3 and the mounting base 4 and adjusting the angles of the carrier C and the substrate S. Further, an angle adjusting mechanism may be provided on both the transfer unit 7 and the table to realize a collective contact angle and an individual contact angle.

Further, vacuum suction or electrostatic suction may be used to hold the element E by the holding portion 72. When vacuum suction is adopted, a suction hole is formed in the holding portion 72. The suction hole is connected to a pneumatic circuit having a compressor or an ejector, and a negative pressure is generated in the suction hole. The holding portion 72 picks up the element E by sucking the element E into the suction hole by negative pressure, and releases the element E by releasing the negative pressure by breaking the vacuum or opening to the atmosphere. When electrostatic adsorption is adopted, a large number of mesa-shaped structures are formed on the holding portion 72, and electrodes and a dielectric layer are provided on the mesa-shaped structures. The electrostatic force generating portion having this mesa-shaped structure serves as a local suction point for the element E, and the element E is attracted to each electrostatic force generating portion by the electrostatic force due to the application of the voltage, and the application of the voltage is stopped. Releases the element E.

1 Element transfer device 3 Carrier base 4 Mounting base 5 Mounting part 6 Stand 7 Transfer part 8 Switching table 9 Elevating part 11 Control device 21 Pickup position 22 Mounting position 31, 41 X-axis drive mechanism 32, 42 Y-axis drive mechanism 51 Mounting head 51a Holding surface 52 Cylinder 53 θ Rotating part 54 Abutment block receiver 55 Camera 61 Lifting base 62 Support 63 Rail 64 Support part 65 Ball screw 66 Rail 67 Tip surface 69 Tip surface 71 Transfer head 72 Holding part 73 Angle adjustment mechanism 91 Rail 92 Rotation Motor 93 Screw shaft 94 Abutment block A1, A2 Adhesive material B1, B2 Adhesive sheet C Carrier E Element L Connector S Substrate

Claims (8)

A pair of pedestals on which supports on which the elements are arranged in an array are placed,
A transfer unit that transfers an element from one of the above pedestals to the other of the above pedestals,
Have,
The transfer unit is
A transfer head that has a plurality of holding units for individually holding a plurality of elements and collectively transfers the plurality of elements, and a transfer head.
One of the holding portions sandwiches one element with the support mounted on the table, and the other holding portion does not contact the other element arranged on the support. An angle adjustment mechanism that adjusts the relative angle between the transfer head and the table so that the individual contact angle becomes
An element transfer device characterized by having. The element transfer device according to claim 1, wherein the angle adjusting mechanism sets the transfer head to the individual contact angle, so that each holding portion picks up the element one by one from the support. The angle adjusting mechanism adjusts the relative angle between the transfer head and the table so that the plurality of holding portions collectively contact the plurality of elements at a collective contact angle.
The holding portion of the transfer head having the collective contact angle collectively picks up a plurality of elements from the element feeder that is the support.
The element transfer device according to claim 1. 2. Item 3. The element transfer device according to item 3. The third aspect of the present invention, wherein the angle adjusting mechanism has the transfer head at the collective contact angle, so that each of the holding portions collectively mounts the element on a substrate which is the support. Element transfer device. The element transfer according to any one of claims 1 to 5, wherein the plurality of holding portions are arranged on the transfer head at intervals from each other, and the tips thereof are protrusions that individually contact and separate from the element. Device. The element transfer device according to any one of claims 1 to 6, wherein the holding portion has a curved surface in contact with the element. One of the pair of pedestals is a supply pedestal on which the element feeder which is the support is placed.
The other of the pair of bases is a mounting base on which the substrate which is the support is mounted.
While moving between the supply table and the mounting table, the multi-row and multi-column elements are collectively picked up from the element feeder, and the picked up multi-row and multi-column elements are collectively collected on the substrate. The element transfer device according to any one of claims 1 to 7, wherein the transfer mounting head is provided so as to be replaceable with the transfer head.

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