JP4918437B2 - Printed wiring board - Google Patents

Description

  The present invention relates to a printed wiring board used for an electronic apparatus, and more particularly to a technique capable of reducing dead space.

  As one method for mounting electronic components used in electronic devices, a method is known in which electronic components are placed on a printed wiring board and mounted by soldering. In such a mounting method, the electronic component is arranged from the component surface on which the component is arranged in the component mounting hole provided in the printed wiring board. After placing the electronic parts, supply solder to the lands provided on the solder surface of the printed wiring board, and use this solder for partial heating methods such as a soldering iron and hot air, and overall heating methods such as infrared heating and hot air heating. Is used for soldering. In some cases, electronic components are arranged not only on the component surface but also on the solder surface.

  As a method of mounting an electronic component on a printed wiring board using such a mounting method, a method of mounting the electronic component on a component surface on which the component of the printed wiring board is to be placed, and bending the electronic component and placing it on the solder surface Is known (see, for example, Patent Document 1). By using such a mounting method, electronic components can be soldered in the same process.

  Further, when mounting a printed wiring board using a mounting apparatus or the like, the printed wiring board may be transported when transporting to the next process or mounting while transporting the printed wiring board. For such conveyance, there are known ones in which the peripheral edge of the printed wiring board is moved on a conveyance rail, and a claw-type conveyor that grips the peripheral edge of the printed wiring board with a guide claw.

  However, the nail type conveyor has a limitation on the thickness of the printed wiring board. For example, in a nail for a printed wiring board having a thickness t = 1.6 mm of the substrate body of the printed wiring board, the printed wiring board having t = 3.2 mm. Cannot be gripped and transported. In such a case, it is necessary to replace the nail with a nail capable of gripping a printed wiring board with t = 3.2 mm. However, when the printed wiring boards having different thicknesses such as t = 1.6 mm and t = 3.2 mm are mounted alternately, it takes time to replace the nails, and there is a possibility that the working efficiency may be lowered. .

For this reason, for example, the thickness t of the printed wiring board with t = 3.2 mm is set to t = 1.6 mm, and the printed wiring boards with different thicknesses can be conveyed using the same nail part without replacing the nail part. A printed wiring board is known (for example, see Patent Document 2).
Utility Model Registration No. 3078115 Japanese Patent Laid-Open No. 08-032182

  The printed wiring board described above has the following problems. In other words, electronic components that are arranged on the solder surface side and are soldered on the component surface are limited in the arrangement of the electronic components due to the restriction of the mounting position of the heat sink or the like provided in the product casing or the heat generating component.

  Due to this limitation, there is a possibility that a dead space for component placement of the printed wiring board may occur. In addition, when soldering the component surface, it is necessary to avoid contact with the electronic component and the soldering iron, and in order to improve the soldering workability, It is necessary to secure a distance from the electronic components arranged around the soldering portion. In addition, since soldering is performed on the component surface, there is a possibility that the surrounding electronic components may be affected by heat due to the temperature rise of the soldering portion.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a printed wiring board that is soldered on the component surface, and that can reduce the dead space and reduce the thermal effect.

  In order to solve the problems and achieve the object, the printed wiring board of the present invention is configured as follows.

A component surface on which a component is arranged on one main surface, a substrate having a solder surface for soldering the arranged component on the other main surface, and a substrate having a holding region for a conveyance rail at the time of soldering; A plurality of first component mounting holes are provided outside the holding area of the substrate, and the parts are arranged on the component surface side. A plurality of parts are provided in the holding area of the peripheral edge, and the components are mounted in the first component holes. Then , a component is arranged on the solder surface side and soldered, a second component mounting hole, and a first land provided on the solder surface and around the first component mounting hole, respectively. And a second land provided on the component surface and around each of the second component mounting holes.

  According to the present invention, it is possible to provide a printed wiring board that performs soldering on the component surface, and that can reduce the dead space and reduce the thermal influence.

  FIG. 1 is a side view showing a configuration of a printed wiring board 1 according to a first embodiment of the present invention.

  As shown in FIG. 1, a printed wiring board 1 includes a board main body (board) 10, a component surface 11 on which components are arranged on one main surface of the board main body 10, and solder on the other main surface. And a solder surface 12 to which 100 is soldered. The printed wiring board 1 includes printed wirings 13 provided on the solder surface 12 on the inner side of the circumferential portion of the substrate body 10 and on the component surface 11 and the peripheral portion of the substrate body 10, respectively.

  The printed wiring board 1 is a part of the printed wiring 13 provided on the component surface 11, and includes a first component mounting hole 14 that penetrates the component surface 11 and the solder surface 12, and a first component mounting hole 14. And a first land 15 that is provided on the solder surface 12 and to which the solder 110 is welded during soldering. Also, a part of the printed wiring 13 provided on the solder surface 12, a second component mounting hole 16 that penetrates the component surface 11 and the solder surface 12, and a part around the second component mounting hole 16. A second land 17 provided on the surface 11 to which the solder 110 is welded during soldering.

  The board body 10 has a holding area 18 for a transfer rail at the time of soldering at the peripheral edge of the board body 10. The board body 10 is a board body 10, outside the holding area 18, on the solder surface 12 and on the first land 15. The 1st component attachment hole 14 which has will be provided. In addition, a second component mounting hole 16 having a second land 17 on the component surface 11 is provided in the peripheral portion of the substrate body 10 including the holding region 18.

In the printed wiring board 1 configured as described above, the electronic component 100 is inserted into the board body 10 by inserting the support member 101 of the electronic component 100 formed of, for example, a conductive material into the component mounting holes 14 and 16. Be placed. The electronic component 100 is disposed from the solder surface 12 in the second component mounting hole 16 having the second land 17.

  Solder 110 is provided around the support member 101 protruding from the solder surface 12 and on the first land 15, and heat is applied by a soldering iron or infrared heating to perform soldering. Thus, the electronic component 100 provided on the component surface 11 of the board body 10 is soldered and mounted. At this time, soldering may be performed by a flow soldering method. It should be noted that these series of mountings may use either a mounting device or no mounting device.

  In addition, the support member 101 of the electronic component 100 is inserted from the solder surface 12 into the second component mounting hole 16 having the second land 17 provided on the component surface 11, and the electronic component 100 is disposed. Further, solder 110 is provided around the support member 101 protruding from the component surface 11 and on the second land 17, and soldering is performed using a partial heating method with a soldering iron or a mounting device. In this way, the electronic component 100 provided on the solder surface 12 is soldered. Thus, the electronic component 100 arranged on the component surface 11 and the solder surface 12 is mounted.

  According to the printed wiring board 1 configured as described above, the second component mounting hole 16 having the second land 17 on the component surface 11 is provided on the peripheral portion of the board body 10, and thus is disposed on the solder surface 12. The electronic component 100 thus mounted is mounted on the peripheral edge of the board body 10. For this reason, the electronic component 100 disposed on the solder surface 12 adjacent to the electronic component 100 disposed on the component surface 11 is provided only on the peripheral portion of the board body 10 and is soldered on the component surface 11. However, it is possible to reduce the number of electronic components 100 that have a thermal effect as much as possible.

  As described above, the electronic components 100 arranged on the adjacent solder surface 12 and the component surface 11 are reduced, and a necessary space between the electronic components 100 arranged on the solder surface 12 and the component surface 11 respectively. Reduction. That is, the dead space can be reduced. Thereby, the electronic component 100 which can be provided in the component surface 11 increases, and a component arrangement area will be expanded. By enlarging the component arrangement area, it is possible to reduce the required area of the printed wiring board 1 and to reduce the size of the printed wiring board 1.

  As described above, according to the printed wiring board 1 according to the present embodiment, it is possible to reduce the dead space by providing the electronic component 100 provided on the solder surface 12 on the peripheral edge of the board body 10. Become. Further, by reducing the dead space, it is possible to reduce the size of the printed wiring board 1 and increase the number of electronic components 100 that can be arranged.

  Next, a printed wiring board 1A according to a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a plan view showing a printed wiring board 1 </ b> A according to the second embodiment of the present invention from the component surface 11. 2 that are the same as those in FIG. 1 are assigned the same reference numerals, and detailed descriptions thereof are omitted.

  As shown in FIG. 2, the printed wiring board 1 </ b> A includes a plurality of second component mounting holes 16 into which the support member 101 of the electronic component 100 disposed on the solder surface 12 is inserted into the holding region 18 of the component surface 11. And a second land 17 provided around each of the second component mounting holes 16.

  The second component mounting hole 16 is formed such that the shortest distance b between the inner peripheral surface of the second component mounting hole 16 and the end surface of the substrate body 10 is greater than or equal to the thickness t of the substrate body 10. For example, when the thickness t of the substrate body 10 is 1.6 mm, the shortest distance b from the end surface of the substrate body 10 to the inner peripheral surface of the second component mounting hole 16 is 1.6 mm or more.

  According to the printed wiring board 1A configured as described above, in the manufacturing process of the printed wiring board 1A, it is possible to prevent a crack when the second component mounting hole 16 is formed by, for example, machining. That is, the required strength around the second component mounting hole 16 can be obtained.

  In addition, it is possible to prevent cracks around the second component mounting hole 16 due to temperature changes, chemical effects, and the like during soldering and the cleaning process of the printed wiring board 1A.

  As a result, it is possible to prevent cracks and the like that occur between the second component mounting hole 16 and the peripheral portion of the substrate body 10, and to prevent solder defects such as bridges and insufficient solder during soldering due to cracks and the like. It becomes possible.

  As described above, according to the printed wiring board 1A according to the present embodiment, the shortest distance b between the end surface of the board body 10 and the inner peripheral surface of the second component mounting hole 16 is set to the thickness t of the board body 10. By setting b ≧ t, the required strength around the second component mounting hole 16 can be secured. As a result, it is possible to prevent defects around the second component mounting holes 16 and to prevent solder defects during soldering.

  Next, a printed wiring board 1B according to a third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a plan view showing a printed wiring board 1 </ b> B according to the third embodiment of the present invention from the component surface 11. 3, the same functional parts as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof is omitted. In FIG. 3, F indicates the conveyance direction of the printed wiring board 1B.

  As shown in FIG. 3, the printed wiring board 1 </ b> B has the second lands 17 on the component surface 11 of the board body 10, and a part or all of these second lands 17 is above the transport rail 121 of the transport device 120. It is arranged to be located in.

  In the printed wiring board 1 </ b> B configured as described above, when the electronic component 100 is mounted, the electronic component 100 is transported in the transport direction F by the transport rail 121 of the transport device 120, and, for example, the electronic component 100 provided on the component surface 11. Implement the implementation. After mounting the electronic component 100 provided on the component surface 11, the electronic component 100 is placed on the solder surface 12 and soldered with a soldering iron or the like.

  According to the printed wiring board 1 </ b> B configured as described above, the second land 17 and the second component mounting hole 16 are located in a portion (holding region 18) located on the conveyance rail 121 of the component surface 11 of the board body 10. It will be. For this reason, it becomes possible to arrange the supporting member 101 of the electronic component 100 also on the board body 10 positioned on the transport rail 121. Conventionally, in order to convey the printed wiring board 1 by the conveyance rail 121, a holding area 18 for conveyance is provided on the conveyance rail 121 without providing component mounting holes and lands. Was a dead space.

  However, after the solder surface 12 is soldered, the component surface 11 is soldered. Therefore, the second land 17 of the electronic component 100 to be disposed on the solder surface 12 is provided on the transport rail 121, thereby forming a conventional dead space. The electronic component 100 can be provided in the holding region 18 that has been provided. For this reason, it is possible to reduce the dead space, and it is possible to reduce the size of the printed wiring board 1 and increase the number of electronic components 100 that can be arranged.

  As described above, according to the printed wiring board 1B according to the present embodiment, the second land 17 of the electronic component 100 provided on the solder surface 12 is provided on the transport rail 121, thereby reducing the dead space and the printed wiring. It is possible to reduce the size of the plate 1 and increase the number of electronic components 100 that can be arranged.

  Next, a printed wiring board 1C according to a fourth embodiment of the present invention will be described with reference to FIGS. 4 is a plan view showing a printed wiring board 1C according to a fourth embodiment of the present invention from the component surface 11, and FIG. 5 is a side view showing the printed wiring board 1C. 4 and 5, the same functional parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted. In FIG. 4, L indicates a reference line, and M indicates masking.

  As shown in FIG. 4, the printed wiring board 1 </ b> C has an arbitrary reference line on the transport rail 121 such that the second land 17 is located at the peripheral edge of the printed wiring board 1 </ b> C and on the upper surface of the transport rail 121. It is provided in a substantially straight line along L. These second lands 17 do not have to be the upper surface of the transport rail 121.

  Further, as shown in FIG. 5, the support member 101 (second component attachment hole) of the electronic component 100 in which the support member 101 (first component attachment hole 14) of the electronic component 100 arranged on the component surface 11 is arranged on the solder surface 12. The electronic components 100 are arranged so as to be separated from the holes 16) 101.

  In the printed wiring board 1 </ b> C configured as described above, when the electronic component 100 is mounted on the component surface 11, the second component mounting hole 16 into which the support member 101 of the electronic component 100 to be disposed on the solder surface 12 is inserted. , Masking M is performed. At this time, since the second lands 17 are provided substantially in a straight line along the reference line L, it is easy to align the masking M and attach a masking tape or the like. This also improves the workability of the masking M.

  Further, after mounting the electronic component 100 on the component surface 11 side, the electronic component 100 is mounted on the solder surface 12 by soldering with the soldering iron 122 or soldering on the component surface 11 side with a soldering device or the like. At this time, since the second lands 17 are provided on the component surface 11 in a substantially straight line, the soldering is facilitated and the soldering workability is improved.

  Further, by separating the supporting members 101 of the electronic component 100 provided on the component surface 11 and the solder surface 12, respectively, the thermal influence during soldering is reduced, and the soldering iron 122 interferes with other electronic components 100. Therefore, the soldering workability is improved.

  As described above, according to the printed wiring board 1C according to the present embodiment, the second land of the electronic component 100 disposed on the solder surface 12 in a substantially straight line along the reference line L at the peripheral portion of the printed wiring board 1C. By providing 17, it becomes possible to improve the workability of masking M and soldering. Further, by separating the support member 101 of the electronic component 100 provided on the component surface 11 and the solder surface 12, it is possible to improve the soldering workability.

  Next, a printed wiring board 1D according to a fifth embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a plan view showing a printed wiring board 1D according to the fifth embodiment of the present invention from the component surface 11, and FIG. 7 is a side view showing the printed wiring board 1D. 6 and 7, the same functional parts as those in FIGS. 1 to 5 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 6 and 7, the printed wiring board 1 </ b> D includes a second component mounting hole 16 in which the heat generating component 102 having a high heat generation amount can be disposed on the solder surface 12, and a second land 17 in which the heat generating component 102 is provided. And is disposed so as to be positioned above the transport rail 121 of the transport device 120.

  Further, when the support member 103 of the heat generating component 102 is inserted into the second component mounting hole 16 in the second component mounting hole 16, the heat generating component 102 and the heat sink 104 provided in the heat generating component 102 are placed outside the substrate body 10. It is formed so that arrangement | positioning is possible. That is, the second component mounting hole 16 is provided so that the heat generating component 102 can be arranged at each position on the solder surface 12 side depending on the shape of the support member 103.

  According to the printed wiring board 1 </ b> D configured as described above, the second component attachment hole 16 is provided so that the heat generating component 102 and the electronic component 100 are separated from each other. It becomes possible to reduce the thermal effect. Further, the heat generating component 102 and the heat sink 104 can be arranged on the solder surface 12 on the solder surface 12 side in the shape of the support member 103, and the flexibility of mounting the heat sink 104 can be improved. It becomes possible.

  The present invention is not limited to the above embodiment. For example, in the above-described example, the printed wiring boards 1B to 1D are transported by the transport rail 121. However, this can be applied using a claw conveyor or another transport method.

  In the above-described example, the thickness t of the substrate body 10 is set to 1.6 mm. However, this may be t = 3.2 mm or other thicknesses. Moreover, it is good also as a structure which combines the printed wiring boards 1-1D mentioned above suitably, respectively. In addition, various modifications can be made without departing from the scope of the present invention.

The side view which shows the structure of the printed wiring board which concerns on the 1st Embodiment of this invention. The top view which shows the printed wiring board which concerns on the 2nd Embodiment of this invention from a component surface. The top view which shows the printed wiring board which concerns on the 3rd Embodiment of this invention from a component surface. The top view which shows the printed wiring board which concerns on the 4th Embodiment of this invention from a component surface. The side view which shows the printed wiring board. The top view which shows the printed wiring board which concerns on the 5th Embodiment of this invention from a component surface. The side view which shows the printed wiring board.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1,1A-1D ... Printed wiring board, 10 ... Board | substrate main body, 11 ... Component surface, 12 ... Solder surface, 13 ... Printed wiring, 14 ... 1st component attachment hole, 15 ... 1st land, 16 ... 2nd component attachment Hole 17 17 Second land 100 Electronic component 101 Support member 102 Heat generating component 103 Support member 104 Heat sink 110 Solder 120 Transport device 121 Transport rail b Shortest distance , F: transport direction, L: reference line, M: masking.

Claims (4)

A component surface on which a component is disposed on one main surface, a solder surface on which the component disposed on the other main surface is soldered, and a substrate having a holding region of a conveyance rail at the time of soldering on its peripheral portion;
A plurality of first component mounting holes provided outside the holding region of the substrate, in which components are arranged on the component surface side;
A second component mounting hole that is provided in a plurality in the holding region of the peripheral portion, and after the component is mounted in the first component hole, the component is disposed on the solder surface side and soldered ;
A first land provided on the solder surface and around each of the first component mounting holes;
A printed wiring board comprising: a second land provided on the component surface and around each of the second component mounting holes.   The said 2nd component attachment hole is provided in the position which the distance from the holding | maintenance area | region of the said peripheral part to the said 2nd component attachment hole internal peripheral surface has more than the board thickness of the said board | substrate. Printed wiring board.   2. The printed wiring board according to claim 1, wherein at least a part of the second land is provided in the holding region and arranged linearly. 3. 2. The printed wiring board according to claim 1, wherein a main body of a component disposed from the solder surface side is disposed outside the substrate in a second component mounting hole provided in a holding region of the peripheral portion. .

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