JP2021057487A - Film capacitor - Google Patents

Abstract

To provide a film capacitor with a structure that can improve the seismic performance compared to a general resin dip type by improving the contact state between a bottom surface of a main body and a substrate and improving the bearing capacity while eliminating a case and making it compact and lightweight.SOLUTION: A film capacitor includes a capacitor element 2 having an electrode surface 2a on which a metallized film is wound and electrodes are formed on both end surfaces, a lead terminal 5 connected to each of the electrode surfaces 2a, and an edge forming member 7 arranged on one of or both a side surface 2b or an electrode surface 2a adjacent to the electrode surface 2a. The edge forming member 7 is arranged along the capacitor element 2, and the capacitor element 2 in the state where the edge forming member 7 is arranged is covered with an exterior resin to form the main body.SELECTED DRAWING: Figure 2

Description

The present invention relates to a resin dip type film capacitor.

Of the film capacitors, the resin dip type has a main body in which the capacitor element is covered with an exterior resin. Compared to the case type in which the capacitor element is housed in a case and filled with resin, the resin dip type is smaller and lighter and easier to reduce costs.

Conventionally, a structure has been proposed in which the vicinity of the center of the bottom surface of the main body is projected toward the substrate (Patent Document 1: Jikkenhei 6-070225).

Jikkenhei 6-070225

However, since the structure described in Patent Document 1 is not in contact with the board mounting surface except near the center of the bottom surface of the main body, the bearing capacity in the board mounting state becomes insufficient, and the main body tends to tilt from the state of being erected on the board. .. When the main body is tilted, stress is concentrated on the lead terminal due to vibration or impact, and it is easily damaged.

The present invention has been made in view of the above circumstances, and while eliminating the case to make it compact and lightweight, it improves the contact state between the bottom surface of the main body and the substrate to improve the bearing capacity, thereby improving the seismic performance as compared with the general resin dip type. It is an object of the present invention to provide a film capacitor having a structure capable of increasing the temperature.

As an embodiment, the problem is solved by a solution means as disclosed below.

The film capacitor of the present invention has a capacitor element having an electrode surface on which a metallized film is wound and electrodes are formed on both end surfaces, a lead terminal connected to each of the electrode surfaces, and a side surface adjacent to the electrode surface or One of the electrode surfaces is provided with an edge forming member arranged on both sides, the edge forming member is arranged along the capacitor element, and the edge forming member is arranged. The capacitor element is covered with an exterior resin to form a main body, and the bottom surface portion of the main body is flat, or the four corners of the bottom surface portion of the main body project uniformly toward the tip of the lead terminal. It is characterized by having a structure.

According to this configuration, the four corners on the bottom surface of the main body and the board mounting surface are in contact with each other when mounted, so that the bearing capacity is improved and the seismic performance can be improved as compared with the general resin dip type.

According to the present invention, a resin dip type film capacitor that is compact and lightweight and has excellent seismic performance can be realized.

1A and 1B are schematic perspective views showing a film capacitor according to an embodiment of the present invention. FIG. 2A is a schematic perspective view of a stage before covering the film capacitor of FIG. 1A with an exterior resin, and FIG. 2B is a schematic perspective view of a stage before covering the film capacitor of FIG. 1B with an exterior resin. FIG. 3A is a schematic configuration diagram showing a substrate mounting state of the film capacitor of FIG. 1A, and FIG. 3B is a schematic configuration diagram showing a substrate mounting state of the film capacitor of FIG. 1B. 4A is a schematic perspective view showing another example of FIG. 2A, and FIG. 4B is a schematic perspective view showing another example of FIG. 2B.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The film capacitor 1 shown in FIGS. 1A and 1B includes a capacitor element 2 having electrode surfaces 2a on which a metallized film is wound and electrodes formed on both end surfaces thereof, and lead terminals 5 connected to the electrode surfaces 2a, respectively. Either the side surface 2b adjacent to the electrode surface 2a or the electrode surface 2a is provided with an edge forming member 7 arranged on both sides, and the edge forming member 7 is arranged along the capacitor element 2 and has an edge. The capacitor element 2 in which the forming member 7 is arranged is covered with the exterior resin 8 to form the main body 3.

Here, in order to make it easier to explain the positional relationship of each part of the film capacitor 1, the directions are indicated by the arrows X, Y, and Z in the drawing. When the film capacitor 1 is actually used, it is not limited to these directions, and there is no problem in using it in any direction. In all the drawings for explaining the embodiment, members having the same function may be designated by the same reference numerals, and the repeated description thereof may be omitted.

As an example, as shown in FIG. 1A, the bottom surface portion 3c of the main body 3 is flattened by aligning the edge forming member 7 along the capacitor element 2. Further, as an example, as shown in FIG. 1B, the four corners of the bottom surface portion 3c of the main body 3 are uniformly projected toward the tip of the lead terminal 5 by aligning the edge forming member 7 along the capacitor element 2. As a result, the bottom surface portion 3c of the main body 3 is formed with the four corners 7c at the same height position (predetermined positions in the Z direction in the drawing). Each vertex of the four corners 7c surrounded by a broken line in the drawing is on the same plane as the plane 70 surrounded by the alternate long and short dash line in the drawing so as to correspond to the substrate mounting surface.

As an example, a metallized film in which a vapor-deposited metal is formed on a dielectric film is wound, and electrodes are formed on both end surfaces by metal spraying to form an electrode surface 2a, which becomes a capacitor element 2. As an example, known engineering plastics such as polyethylene terephthalate (PET), polypropylene (PP), polyphenylene sulfide (PPS), and polyethylene naphthalate (PEN) can be applied to the dielectric film.

The edge forming member 7 shown in FIGS. 2A and 2B has a tape shape, a sheet shape, a film shape, or a strip shape, and an insulating paper or an insulating polymer compound can be applied. That is, the edge forming member 7 is made of a material and shape that can be deformed along the outer circumference of the capacitor element 2, and is aligned with the capacitor element 2. As an example, the edge forming member 7 is attached to the outer periphery of the capacitor element 2 near the tip of the lead terminal 5. According to this, the existing manufacturing equipment can be applied and the number of parts is minimized.

As an example, the tape-shaped edge forming member 7 is wound around the outer circumference of the capacitor element 2 in which the lead terminal 5 is connected to the electrode surface 2a and attached to the carrier tape, and is attached to the side surface 2b and the electrode surface 2a. To do. Then, the capacitor element 2 in which the edge forming member 7 is arranged is exteriorized by a known manufacturing method such as a dip method, and is thermoset. The exterior resin 8 is a powder, and as an example, a known heat-resistant insulating resin such as an epoxy resin, a phenol resin, or a polyurethane resin can be applied.

The edge forming member 7 is preferably arranged so as to surround the lead terminal 5. According to this configuration, the distance between the four corners 7c can be increased, so that the mounting state is more stable and the seismic performance can be expected to be further improved.

3A and 3B are schematic configuration diagrams showing a mounting state in which the lead terminal 5 is inserted into the through hole 20c of the substrate 20. In the mounted state, the four corners 7c of the bottom surface portion 3c of the main body 3 are in contact with the mounting surface of the substrate 20. According to this configuration, the main body 3 can be arranged perpendicularly (including substantially perpendicular) to the mounting surface of the substrate 20 at the time of mounting, so that a sufficient space with other adjacent electronic components is sufficiently secured. Then, the lead terminal 5 is soldered to the land of the substrate 20. The lead terminal 5 is not limited to a straight shape, and a known forming shape can be applied.

4A is a schematic perspective view showing another example of FIG. 2A, and FIG. 4B is a schematic perspective view showing another example of FIG. 2B. The edge forming member 7 has a plurality of tape-like, sheet-like, or strip-like shapes, is attached to two side surfaces 2b adjacent to the electrode surfaces 2a at both ends of the capacitor element 2, and extends to the electrode surface 2a to lead. It is bent and attached within a range that does not reach the terminal 5. In the case of the sheet-shaped or plate-shaped edge forming member 7, it can be attached to the capacitor element 2 after having a desired shape in advance.

The arrangement position of the edge forming member 7 in the capacitor element 2 is not limited to the above configuration, and as an example, the edge forming member 7 may be arranged only on the side surface 2b, and only on the electrode surface 2a. In some cases, the edge forming member 7 is arranged.

As an example, a paper tape having a thickness of 200 [μm] was used as the edge forming member 7, and the edge forming member 7 was attached to the capacitor element 2 as shown in FIG. 2B. The exterior resin 8 is an epoxy resin, and the film capacitor 1 shown in FIG. 1B was prototyped and confirmed to be normal.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the present invention.

1 Film capacitor 2 Capacitor element 2a Electrode surface 2b Side surface 3 Main body 3c Bottom part 5 Lead terminal 7 Edge forming member 7c Four corners 8 Exterior resin

Claims (4)

There is only one of a capacitor element having an electrode surface on which a metallized film is wound and electrodes are formed on both end surfaces, a lead terminal connected to each of the electrode surfaces, and a side surface adjacent to the electrode surface or the electrode surface. Is provided with edge forming members arranged on both sides, the edge forming member is arranged along the capacitor element, and the capacitor element in a state where the edge forming member is arranged is used as an exterior resin. It is covered and constitutes the main body,
A film capacitor characterized in that the bottom surface portion of the main body is flat, or the four corners of the bottom surface portion of the main body project uniformly toward the tip of the lead terminal. The film capacitor according to claim 1, wherein the edge forming member has a tape shape, a sheet shape, a film shape, a strip shape, or a plate shape. The edge forming member is arranged only on the side surface of the capacitor element, is arranged on the side surface and the electrode surface of the capacitor element, or is arranged so as to surround the outer periphery of the capacitor element. The film capacitor according to claim 1 or 2, wherein the film capacitor has any of the above-mentioned configurations. The invention according to any one of claims 1 to 3, wherein the four corners of the bottom surface of the main body are in contact with the mounting surface of the board in a mounted state in which the lead terminal is inserted into the through hole of the board. Film capacitor.

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