JP3486679B2 - Chip capacitors - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called surface mount (SMD) type chip capacitor mounted on a substrate such as a printed wiring board.

[0002]

2. Description of the Related Art As the chip capacitor, there is a conventional one as shown in FIG. 6, for example. As shown in FIG. 3A, this chip capacitor has a solid tantalum capacitor element 101. This capacitor element 101
Is composed of a substantially rectangular parallelepiped element body 102 having a cathode layer formed on its surface, and a substantially round bar-shaped anode lead 103 made of tantalum wire protruding from one side surface of the element body 102. Then, one end of a substantially strip-shaped anode terminal 104 is welded to the tip portion of the anode lead 103, for example. On the other hand, on the side surface and the upper surface (the right side surface and the upper side surface in FIG. 9A) of the cathode layer (element body surface) opposite to the side where the anode lead 103 projects, One end of a substantially strip-shaped cathode terminal 105 formed in a crank shape along the surface is adhered by a conductive adhesive 106, for example.

Further, the capacitor element 101 is molded into a substantially rectangular parallelepiped shape by an exterior material 107 made of a hard resin such as epoxy resin in a state in which the other end sides of the terminals 104 and 105 are respectively drawn outward. Have been molded). The terminals 104 and 105 are arranged substantially symmetrically along side surfaces (each side surface on the left and right in the drawing) 108 and 109 and a bottom surface (a surface on the lower side in the drawing) 110 of the exterior material 107 which face each other. , It is bent in a roughly U shape. As a result, as shown in FIG. 7B, the exterior material 107 is provided on each of the other ends of the terminals 104 and 105.
104a, 105a are formed along the bottom surface 110 of the. Each of these surfaces 104a and 105a becomes a soldering surface to a land provided on a printed wiring board (not shown).

[0004]

However, according to the above-described conventional chip capacitor, the soldering surfaces 104a and 105a of the terminals 104 and 105, respectively, have a single-sided structure. 104a, 10
When soldering 5a onto the land, the solder is biased,
There is a problem that the chip capacitor after the soldering may tilt. This problem becomes more remarkable as the amount of solder increases, and in some cases, soldering failure may occur.

Therefore, an object of the present invention is to provide a chip capacitor which can prevent soldering in a tilted state and soldering failure.
It is also an object of the present invention to realize a chip capacitor smaller than the above-mentioned conventional chip capacitor while achieving this object.

[0006]

In order to achieve the above object, a chip capacitor according to the present invention comprises a capacitor element having a cathode part and an anode part, which are located in substantially the same plane with a space therebetween. A plurality of cathode terminals electrically connected to the cathode portion, and a second plane located substantially in the same plane as each of the first planes with a space therebetween. A plurality of anode terminals electrically connected to the anode part, and a capacitor element, cathode terminals and anodes with at least a part of each of the first plane and the second plane exposed. And an exterior material that covers the terminal.

According to the present invention, each first plane of the plurality of cathode terminals and each second plane of the plurality of anode terminals are provided in the same plane.
And the plane of are located at intervals. Then, a part or the whole of each of these planes is exposed to the outside of the exterior material, and these exposed parts become soldering surfaces. Since each soldering surface of each terminal is in a divided state in this manner, when soldering the chip capacitor according to the present invention to a land or the like provided on a substrate, for example, a printed wiring board, soldering is performed. Are dispersed on the soldering surfaces (first planes and second planes).
Therefore, it is possible to suppress the deviation of the solder, which is a problem in the above-mentioned conventional technique, and to prevent the chip capacitor from being soldered in an inclined state.

In the present invention, as the capacitor element, the cathode portion has at least one flat surface portion forming the surface of the capacitor element body, and the anode portion is
A capacitor having a portion protruding outward from a predetermined portion of the surface of the capacitor element body excluding the flat portion may be used. In this case, each cathode terminal is formed of a flat conductor having a third flat surface facing the first flat surface. Then, the third planes are positioned below the plane section of the cathode section substantially in parallel with the plane section, and the third plane and the plane section of the cathode section are electrically connected. Also, each anode terminal is
Each of them is composed of a flat conductor having a fourth flat surface facing the second flat surface. Then, these fourth planes are positioned substantially in the same plane as each of the third planes, and the fourth planes are electrically connected to the protruding portions of the anode part.

According to this structure, each cathode terminal and each anode terminal are located only below the flat portion of the cathode portion (capacitor element body), and each is flat. Further, the cathode terminal is directly connected to the cathode portion at an extremely short distance. Therefore, as compared with the conventional chip capacitor in which the terminals 104 and 105 are formed in a substantially U-shape, the ratio of the volume occupied by each terminal to the entire chip capacitor can be reduced, and the chip capacitor can be downsized accordingly. .

Further, each of the cathode terminals may be provided with a cathode terminal coupling means for coupling them to each other inside the exterior material. By doing so, each cathode terminal can be handled as one component, and the manufacturing (assembly work) and component management of the chip capacitor according to the present invention are facilitated. Further, similarly, for each anode terminal, anode terminal coupling means for coupling these to each other inside the exterior material may be provided. By doing so, each anode terminal can be handled as one component, and the manufacture and component management of the chip capacitor according to the present invention are facilitated.

The portion composed of each cathode terminal and the cathode terminal coupling means may be integrally formed by molding one flat metal plate, for example, by punching or bending. This makes it easier to manufacture and manage the portion itself including the cathode terminals and the cathode terminal coupling means. Further, similarly, the portion composed of each anode terminal and the anode terminal coupling means may be integrally formed by molding one sheet of flat metal. By doing so, the manufacturing and management of the part itself composed of the respective anode terminals and the anode terminal coupling means becomes easier.

Further, among the respective first planes of the respective cathode terminals,
Recesses (so-called steps) may be provided for some or all of them. By doing so, the solder also enters the recess, and the bias of the solder can be further suppressed in each cathode terminal (each first plane). In addition, since the area of the entire soldering surface is increased by providing the recess, the coupling force between each cathode terminal and the land is increased. Similarly, recesses may be provided in each of the second planes of the anode terminals and in some or all of them. By doing so, the solder also intrudes into the recess, and the bias of the solder on each anode terminal (each second plane) can be further suppressed by that amount, and the coupling force between each anode terminal and the land is also increased. , Increase.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment in which the present invention is applied to, for example, a tantalum chip capacitor,
This will be described with reference to FIG. As shown in FIGS. 1A to 1C, the chip capacitor according to the first embodiment has a solid tantalum capacitor element 1 inside. The capacitor element 1 is manufactured by a known method, for example, the same as the above-described conventional capacitor element 101, and has a substantially rectangular parallelepiped element body 2 on which a cathode layer is formed over substantially the entire surface, and the element body. 2 is composed of an anode lead 3 made of tantalum wire, which is a substantially round bar and which linearly protrudes outward from a portion of the one side surface 21 slightly closer to the bottom surface 22 side.

Incidentally, the element body 2 has one of its outer surfaces.
As long as at least one surface, for example, the bottom surface 22 is formed to be a flat surface, another shape, for example, a polygonal column such as a pentagonal prism or a structure like a semi-cylindrical shape may be used. Also, the anode lead 3
Is for drawing out an anode part (not shown) formed inside the element body 2 to the outside of the element body 2, and the anode lead 3 and the above-mentioned cathode layer formed on the surface of the element body 2 are formed in this drawn-out portion. Anode lead 3 so as not to contact
A disk-shaped insulating cap 4 is provided around the drawn-out portion, as shown in FIG. Here, the anode lead 3 has the above-described roughly round bar-shaped tantalum wire configuration, but the present invention is not limited to this, and a plate-shaped or band-shaped one may be used.

A corner portion which is a joint portion between the surface 23 and the bottom surface 22 on the side opposite to the side where the anode lead 3 is projected of the element body 2 has a substantially L shape along these surfaces 22 and 23. The formed cathode terminal body 5 is arranged. As shown in FIG. 7E, the cathode terminal body 5 includes a plurality of, for example, two, substantially rectangular cathode terminal portions 51 and 51, and respective one end edges of these terminal portions 51 and 51, which are connected to each other. And an approximately U-shaped cathode terminal coupling portion 52.

Each of the cathode terminal portions 51, 51 is made of a flat plate metal having two planes 53, 54 which are parallel to each other. The respective long edges of the cathode terminal portions 51, 51 are spaced apart from each other with their both edges aligned. They are positioned parallel to each other and are on one plane (for example, the lower surface in FIG. 7E, which is hereinafter referred to as the bottom surface) 53, 53 and the other plane (upper surface in FIG. (Hereinafter, this surface is referred to as the upper surface.) 54 and 54 are located on the same plane. The cathode terminal coupling portion 52 is also made of a flat plate metal, and the cathode terminal coupling portion 52 is located on the upper surface 54, 54 side of each of the cathode terminals 51, 51 and the upper surface 54, 54 and one surface of the coupling portion 52. 55 and 55 are provided at a right angle and adjacent to each other.
Then, the respective end edges of the cathode terminal coupling portion 52 located on the side of the opening having the substantially U-shape are respectively connected to the cathode terminal portions 51, 5 and 5.
1 is connected to each edge. With this configuration, each cathode terminal portion 51, 51 has at least each bottom surface 5.
At a position above 3, 53, the cathode terminal connecting portion 5
The two make them electrically and mechanically coupled to each other.

The cathode terminal body 5 is electrically and mechanically connected to the cathode layer formed on the surface of the element body 2 by a conductive adhesive 6. Specifically, each of the cathode terminal portions 51, 51 is a width direction of the bottom surface 22 of the cathode layer (element body) 2 (a direction that crosses the protruding direction of the anode lead 3 and is, for example, a left-right direction in FIG. ), The upper surfaces 54, 54 of the respective cathode terminal portions 51, 51 are connected to the bottom surface 22 of the cathode layer 2.
The surface 55 of the cathode terminal coupling portion 52 adjacent to the upper surfaces 54, 54 is connected to the side surface 23 of the cathode layer 2.

On the other hand, on the side below the bottom surface 22 of the element body 2 where the anode lead 3 projects, an anode terminal body 7 similar to the cathode terminal body 5 is arranged. That is, the anode terminal body 7 has the same shape and size as the cathode terminal body 5, as shown in FIG. Similar to the two anode terminal portions 71, 71 and the cathode terminal coupling portion 52,
A generally U-shaped cathode terminal coupling portion 72 for electrically and mechanically coupling the respective one end edges of the respective anode terminal portions 71, 71 to each other.
And consists of. Then, in the anode terminal body 7, the other end edges of the respective anode terminal portions 71, 71 are made to face the other end edges of the respective cathode terminal portions 51, 51 of the cathode terminal body 5, and the respective anode terminal portions 71 are also formed. , 71, bottom surfaces 73, 73 and top surfaces 74,
74 are arranged in line symmetry with the cathode terminal body 7 with the bottom surfaces 53, 53 and the top surfaces 54, 54 of the cathode terminal portions 51, 51 located on the same plane. It should be noted that one end edge of each of the anode terminal portions 71, 71 (outer surface of the anode terminal coupling portion 72) is generally aligned with the tip position of the anode lead 3. On the other end edge side of each anode terminal portion 71, 71, in order to prevent the anode terminal portions 71, 71 and the cathode layer 2 from directly contacting each other, each anode terminal portion 71, 71 An insulator 61 such as an insulating tape is provided on a portion of the upper surfaces 74, 74 located below the cathode layer 2.
Is provided.

A columnar connecting tool 8, for example, is provided between the upper surfaces 74, 74 of the respective anode terminal portions 71, 71 and the lower side of the anode lead 3. This connection tool 8
Is made of tantalum wire, for example.
In the state of bridging between Nos. 1 and 71, the anode lead 3 extends in a direction transverse to the protruding direction along the horizontal direction. And
The outer side surface of the connector 8 is in contact with the respective upper surfaces 74, 74 of the respective anode terminal portions 71, 71, the inner side surface 75 of the anode terminal coupling portion 72 and the lower side surface of the anode lead 3, and these contact surfaces are in contact with each other. For example, welding is performed on the part. As a result, the anode terminal body 7 and the anode lead 3 are electrically and mechanically connected to each other via the connection tool 8.

The cathode terminal body 5 composed of the cathode terminal portions 51, 51 and the anode terminal coupling portion 52 can be integrally formed, for example, by processing a sheet of rectangular flat plate metal. Specifically, first, the rectangular flat plate metal is punched into a substantially U-shape. The integral cathode terminal body 5 can be formed by bending the two strip-shaped portions, which are formed by the punching process and are parallel to each other, at a right angle. Each anode terminal portion 71, 7
The same applies to the anode terminal body 7 including 1 and the cathode terminal coupling portion 72.

The external dimensions of the cathode terminal body 5 and the anode terminal body 7 are as follows. That is, as is apparent from FIG. 1B, the length dimensions of the terminal bodies 5 and 7 (terminal portions 51 and 71) in the direction along the protruding direction of the anode lead 3 are the same as those of the capacitor element 1 in the same direction. It is smaller than 1/2 of the entire length dimension (the distance from the tip of the anode lead 3 to the side surface 23 of the element body 2), for example, 1/4 to 2 / of the entire length dimension of the capacitor element 1. The size is about 5. Then, as is clear from FIGS. 1A and 1C, the terminal bodies 5 and 7 in the direction crossing the protruding direction of the anode lead 3 along the horizontal direction.
The so-called respective width dimensions are approximately the same as the width dimension of the entire capacitor element 1 in the same direction (width dimension of the element body 2). Then, each terminal body 5, 7 (each coupling portion 52,
57), the height dimension, more specifically, the dimension from the upper surface 54, 74 of each terminal portion 51, 71 to the upper end edge of each coupling portion 52, 72 is from the bottom surface 22 of the element body 2 to the anode lead 3. It is slightly smaller than the distance to the lower side surface (more strictly, the value obtained by adding the thickness dimension of the insulating tape 61 to this distance). The length dimension of the connector 8 (dimension in the direction transverse to the protruding direction of the anode lead 3 along the horizontal direction) is as shown in FIG.
It is slightly smaller than the width dimension of 7 (width dimension of the element body 2).

The capacitor element 1, the cathode terminal 5, the anode terminal 7 and the connector 8 are covered with an outer casing 9 made of a hard resin such as an epoxy resin in a substantially rectangular parallelepiped shape. However, the exterior material 9 includes the bottom surfaces 53, 53 of the cathode terminal portions 51, 51 and the bottom surfaces 7 of the anode terminal portions 71, 71.
Only 3 and 73 are exposed to the outside, and the other parts are covered so as to be buried inside. The outer surface 91 of the exterior material 9 on the side exposing the bottom surfaces 53, 53 and 73, 73 is formed to be flush with the bottom surfaces 53, 53, 73, 73. . This same plane serves as a bottom surface of the chip capacitor according to the first embodiment, that is, a contact surface with a substrate such as a printed wiring board (not shown). Then, the above-mentioned terminal portions 51, 51 and 71, 7
Each bottom surface 53, 53 and 73, 73 of 1 serves as a soldering surface to a land provided on the printed wiring board.

As described above, according to the first embodiment, the soldering surfaces 53 and 53 of the terminals (terminal bodies) 5 and 7, respectively.
And 73, 73 are plural (two) at intervals.
Since the chip capacitor according to the present embodiment is soldered onto the land, the solder is dispersed on the soldering surfaces 53, 53 and 73, 73. Therefore, it is possible to suppress the unevenness of the solder, which is a problem in the above-described related art, and it is possible to prevent the chip capacitor from being soldered in an inclined state or causing a soldering failure.

Further, in the first embodiment, each terminal portion 5 having the above-mentioned soldering surfaces 53, 53 and 73, 73.
Reference numerals 1, 51 and 71, 71 are located only below the element body 2, and each is flat.
Further, each cathode terminal portion 51, 51 has an upper surface 5
By closely contacting the cathode layers 4 and 54 with the cathode layer (element body) 2, they are directly connected to the cathode layer 2 at an extremely short distance. Further, although the cathode terminals 51, 51 are joined at one end edge by the cathode terminal coupling portion 52, the cathode terminal coupling portion 52 also has its one surface 55 closely attached to the side surface 23 of the cathode layer 2. ing. On the other hand, each of the anode terminal portions 71, 71 has its one end edge aligned with the tip of the anode lead 3 and has its other end edge facing the other end edge of each of the cathode terminal parts 51, 51. There is. The anode terminal coupling portion 72 that couples the respective anode terminal portions 71, 71 and the connecting tool 8 that connects these to the anode lead 3 are such that the entire surface of the anode lead 3 and the element body 2 is the element body 2
Is placed in a space sandwiched between the entire surface 21 and the anode lead 3. Therefore, each terminal 104, 10
Compared with the conventional chip capacitor in which 5 is formed in a generally U-shape, the volume ratio of each terminal body 5, 7 to the entire chip capacitor can be reduced, and the chip capacitor can be downsized accordingly.

In the first embodiment, the cathode terminal portion 51 (the soldering surface 5
Although the number of 3) is two, it may be three or more. Similarly,
Also for the anode terminal body 7, the anode terminal portion 7 constituting this
The number of 1 (soldering surface 73) may be 3 or more. The number of the cathode terminal portions 51 and the number of the anode terminal portions 71 do not necessarily have to be the same, and the numbers of these two may be different. In this way, each terminal portion 51,
The polarity of the chip capacitor itself can be recognized by the difference in the number of 71 (soldering surfaces 53, 73).

Further, the soldering surfaces 53, 53 and 7 described above
Although the cathode terminal body 5 and the anode terminal body portion 7 formed by molding a flat plate metal are used to form the electrodes 3 and 73, the present invention is not limited to this. That is, the soldering surfaces 53, 53 are arranged on the same plane.
And 73, 73, the respective soldering surfaces may be formed by other structures as long as the same surfaces can be formed.

In the first embodiment, the capacitor element 1 has a structure including the element body 2 and the anode lead 3 protruding from the element body 2, but
A structure other than this may be used. Also, the exterior material 9
Thus, the chip capacitor as a whole is formed into a substantially rectangular parallelepiped shape, but other shapes may be used.

Further, although each of the terminal bodies 5 and 7 was formed by sheet metal processing of one sheet of flat metal, each of the terminal bodies 5 and 7 was formed by a method other than this.
May be formed. Further, although the shapes and dimensions of the respective terminal bodies 5 and 7 are the same, the shapes and dimensions of the two are not the same as long as the same operation and effect as the first embodiment can be obtained. Good. However, it is convenient in terms of manufacturing and management that the shapes and dimensions of these terminal bodies 5 and 7 are the same.

FIG. 2 shows a second embodiment of the present invention. As shown in the figure, in the second embodiment, the height dimension of the anode terminal coupling portion 72 that constitutes the anode terminal body 7 is made higher than that of the first embodiment, and The upper end edge of the anode terminal coupling portion 72 itself is directly connected to the anode lead 3
It is the one that is in contact with the lower surface of the. Then, by welding the contact portion, the anode terminal body 7 including the anode terminal coupling portion 72 and the anode lead 3 are electrically and mechanically connected. Since the configuration other than this is the same as that of the first embodiment shown in FIG. 1, the same parts are designated by the same reference numerals as those in FIG. 1 and their detailed description is omitted.

As is apparent from the figure, according to the second embodiment, the connecting tool 8 for connecting the anode lead 3 and the anode terminal body 5 in the first embodiment is unnecessary. Become. Therefore, the manufacturing cost can be reduced accordingly, and the chip capacitor according to the present invention can be provided at a low price.

In the second embodiment, the height dimension of the cathode terminal coupling portion 52 constituting the cathode terminal body 5 is the same as that of the cathode terminal coupling portion 72 in the first embodiment. Are higher than. That is, the shape and size of the cathode terminal body 5 are the same as the shape and size of the anode terminal body 7. Of course, it is not necessary to make the shape and size of the both the same, as described above.

FIG. 3 shows a third embodiment of the present invention. As shown in the figure, in the third embodiment, the height dimension of the anode terminal coupling portion 72 is made higher than that in the second embodiment, and the center portion thereof is roughly U-shaped.
A letter-shaped recess 76 is provided, and the anode lead 3 is fitted into the recess 76. By this fitting, the portion of the outer side surface of the anode lead 3 that extends over substantially the lower half of the outer surface is brought into contact with the edge of the recess 76, so that the anode lead 3 and the anode terminal coupling portion 72 (anode terminal body 7). The contact area with is increased. Since the configuration other than this is the same as that of the first embodiment shown in FIG. 1, the same parts are designated by the same reference numerals as those in FIG. 1 and their detailed description is omitted.

Thus, the anode lead 3 and the anode terminal body 7 are
By increasing the contact area with the both, the electrical and mechanical connection between them can be made stronger. Also,
The equivalent series resistance (ESR) between these two is
Can be reduced much more than that of the embodiment of the present invention, so-called low E
An SR type chip capacitor can be realized.

Also in the cathode terminal body 5, the height dimension of the cathode terminal coupling portion 52 is set to be approximately the same as the height dimension of the anode terminal coupling portion 73. By doing so, the contact area between the cathode terminal coupling portion 52 (cathode terminal body 5) and the cathode layer 2 also increases, and the ESR can be further reduced. However, since it is not necessary to make a cutout such as the concave portion 73 in the cathode terminal coupling portion 52, the cathode terminal coupling portion 52 is simply flat.

FIG. 4 shows a fourth embodiment of the present invention. As shown in the figure, in the fourth embodiment, the cathode terminal coupling portion 52 which constitutes the cathode terminal body 5 and the anode terminal coupling portion 72 which constitutes the anode terminal body 7 in the first embodiment are arranged. , The cathode terminals 51 and 5 are removed from the components.
1 and each of the anode terminal portions 71, 71 have an independent flat plate metal structure. Since the configuration other than this is the same as that of the first embodiment shown in FIG. 1, the same parts are designated by the same reference numerals as those in FIG. 1 and their detailed description is omitted.

In this way, the above-mentioned connecting parts 52 and 7 are formed.
The metal part can be reduced by the amount of 2, and the material cost of each terminal body 5, 7 can be reduced. However, in consideration of the convenience of manufacturing (assembling work) of chip capacitors and component management, as in the first embodiment, the respective cathode terminal portions 51, 51 are arranged.
It is more effective to integrally couple the anode terminal portions 71, 71 with the cathode terminal coupling portion 52 and the anode terminal coupling portion 72, respectively. In addition, since each coupling portion 52, 72 is buried inside the exterior material 9, for example, each terminal body 5, 7 becomes difficult to be separated from the exterior material 9, and the durability of each terminal body 5, 7 against a mechanical external force. The property is improved.

As shown in FIG. 4, only one of the cathode terminal portions 51, 51 and the anode terminal portions 71, 71 has an independent flat plate metal structure, and the other has the same structure as in the first embodiment. It may be configured to be integrally coupled by the coupling portion 52 or 72.

When the capacitor element 1 and the like are covered with the exterior material 9, for example, as shown by alternate long and short dash lines 92 and 92 in FIGS. 2B and 2D, the terminal portions 51,
51, 71, 71, and the outer end surfaces 57, 57, and 7 of 71
7, 77 may also be exposed to cover. By doing so, each of the end faces 57, 57 and 77, 77 also functions as a soldering surface, and more stable soldering can be realized.

FIG. 5 shows a fifth embodiment of the present invention. As shown in the figure, in the fifth embodiment, the soldering surfaces (bottom surfaces) 53, 53 and 73 of the terminal bodies 5 and 7,
Recesses (steps) 58, 58 and 78, 78 are provided on the outer side of 73, respectively. These recesses 58, 5
8 and 78, 78 can be formed, for example, by half-etching each terminal body 5, 7 in advance when each terminal body 5, 7 is in a single state (that is, before assembling this chip capacitor). Since the configuration other than this is the same as that of the first embodiment shown in FIG. 1, the same parts are designated by the same reference numerals as those in FIG. 1 and their detailed description is omitted.

According to the fifth embodiment, when the chip capacitor is soldered on the land, each of the recesses 5
It is possible to further suppress the deviation of the solder by intruding the solder into 8, 58 and 78, 78. Further, by providing these recesses 58, 58 and 78, 78, each soldering surface 53,
Since the area of 53, 73, and 73 as a whole increases,
The bonding force between these soldering surfaces 53, 53 and 73, 73 and the land is increased.

In the fifth embodiment, the recesses 58, 58 and 78, 78 are provided on the outer side of the soldering surfaces (bottom surfaces) 53, 53 and 73, 73, respectively. It is not limited to this. For example, each soldering surface 53, 53 and 73,
The recesses 58, 58 and 78, 78 may be provided in the central portion or the inner portion of 73. Further, a plurality of the recesses 58, 58 and 78, 78 may be provided for the individual soldering surfaces 53, 53 and 73, 73, respectively. Furthermore,
Rather than providing the recesses 58, 58 and 78, 78 on all the soldering surfaces 53, 53 and 73, 73, any one of the soldering surfaces 53, 53 and 73, 73, eg cathode terminal body The recesses 58, 58 and 78, 78 may be provided only on the soldering surfaces 53, 53 on the No. 5 side or only the soldering surfaces 73, 73 on the anode terminal body 7 side.

[0042]

As described above, according to the chip capacitor of the present invention, since each soldering surface of the cathode terminal and the anode terminal is divided into a plurality of parts, the chip capacitor can be mounted on a printed wiring board. When soldering to the land of
Solder (solder amount) is dispersed. Therefore, it is possible to suppress the unevenness of the solder, which is a problem in the above-described related art, and to prevent the chip capacitor from being soldered in a tilted state or causing a soldering failure.

Further, since each of the above terminals can be formed of a flat conductor such as a flat metal, the terminals 104 and 105 are formed.
As compared with the above-mentioned conventional technique in which the above is formed into a generally U-shape, the ratio of the volume occupied by each terminal in the entire chip capacitor can be reduced, and the entire chip capacitor can be downsized accordingly. This is extremely effective in applications where downsizing of devices is important, such as mobile communication devices represented by mobile phones and the like.

[Brief description of drawings]

1A and 1B are views showing a first embodiment of a chip capacitor according to the present invention, FIG. 1A is a view seen from the front with an exterior material removed, and FIG. 1B shows an exterior material removed. In the state viewed from the right side, (c) is a view seen from the rear with the exterior material removed, (d) is an external bottom view, (e) is
It is an expansion perspective view which shows only each terminal.

FIG. 2 is a diagram showing a second embodiment of a chip capacitor according to the present invention.

FIG. 3 is a diagram showing a third embodiment of a chip capacitor according to the present invention.

FIG. 4 is a diagram showing a fourth embodiment of a chip capacitor according to the present invention.

FIG. 5 is a diagram showing a fifth embodiment of a chip capacitor according to the present invention.

6A and 6B are diagrams showing a schematic configuration of a conventional chip capacitor, in which FIG. 6A is a diagram of the internal structure viewed from the right side, and FIG.
FIG.

[Explanation of symbols]

1 Capacitor element 2 cathode layer 3 Anode lead 5 Cathode terminal body 7 Anode terminal body 9 Exterior materials 51 Cathode terminal (cathode terminal) 52 Cathode terminal coupling part 53 Bottom surface (first plane) 54 upper surface (third plane) 71 Anode terminal part (anode terminal) 72 Anode terminal coupling part 73 Bottom surface (second plane) 74 Top surface (fourth plane)

─────────────────────────────────────────────────── ─── Continuation of front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) H01G 9/012

Claims (5)

(57) [Claims] 1. A plurality of capacitor elements each having a cathode portion and an anode portion, and a plurality of first planes which are spaced apart from each other and are located in substantially the same plane and which are electrically connected to the cathode portion. A cathode terminal, a plurality of anode terminals each having a second plane that is located in substantially the same plane as each of the first planes and are spaced apart from each other, and are electrically connected to the anode section; A chip capacitor, comprising: the above capacitor element, each cathode terminal, and an exterior material that covers each anode terminal, with at least a part of each of the first plane and each second plane exposed. 2. The cathode portion has at least one plane portion forming a surface of a capacitor element body, and the anode portion is outward from a predetermined portion of the surface of the capacitor element body except the plane portion. Each of the cathode terminals is made of a flat conductor having a third flat surface opposite to the first flat surface. Each of the third planes is located substantially parallel to the plane portion, the third planes are electrically connected to the plane portion of the cathode part, and each of the anode terminals is provided with the second plane. A flat conductor having a fourth flat surface facing each other, and these fourth flat surfaces are located in substantially the same plane as each of the third flat surfaces,
The chip capacitor according to claim 1, wherein the fourth plane and the protruding portion of the anode portion are electrically connected. 3. One or both of cathode terminal coupling means for coupling the cathode terminals to each other inside the exterior material and anode terminal coupling means for coupling the anode terminals to each other inside the exterior material. The chip capacitor according to claim 1, wherein the chip capacitor is provided. 4. One or both of a portion formed of each of the cathode terminals and the cathode terminal coupling means and a portion formed of each of the anode terminals and the anode terminal coupling means each include one sheet of flat metal. The chip capacitor according to claim 3, wherein the chip capacitor is integrally formed by molding. 5. The chip capacitor according to claim 1, wherein a recess is provided in one or both of some or all of the first planes and some or all of the second planes.