JP2017165427A - Carrier tape, packaging body and packaging method of electronic component using the same, and method for implementing electronic component packaged using carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape that can readily inspect for a deformation failure at high speed in an out lead in a vertical direction of a semiconductor device while being stored in a pocket.SOLUTION: Carrier tape 11 includes: tape stretched in a belt-shape; and a plurality of pockets 14 capable of individually mounting a semiconductor device 13 at one face of the tape. The plurality of pockets 14 is arranged in a longitudinal direction of the tape while having a prescribed intervals therebetween. Each of the plurality of pockets 14 is provided with an opening part 15 in part of a lateral face of the peripheral edge part thereof.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a carrier tape, and in particular, an embossed carrier tape for storing electronic components such as a semiconductor device, a resistor, and a capacitor, a packaging body and a packaging method for electronic components using the tape, and packaging using the same. The present invention relates to an electronic component mounting method.

  In recent years, development of automatic driving technology for driver assistance in the automobile industry and the like has been promoted. In the field of development of automatic operation technology, a quality requirement of a defect rate of 1 ppm or less is made for a semiconductor device, and the requirement is getting stronger year by year. Although it is possible to eliminate defective electrical characteristics in the semiconductor device manufacturing factory in the final electrical characteristics inspection process, care must be taken because defective appearance products after being stored in the package will be sent directly to the customer. Incidentally, QFP (Quad Flat Package) is the mainstream of semiconductor devices used in the automobile industry, and the outer shape is mainly rectangular, and terminals for solder bonding called out leads protrude from the four sides.

  On the other hand, in general, packaging of electronic parts such as semiconductor devices is frequently used in a packaging form using a carrier tape that is easy to handle and has good mounting efficiency of electronic parts, so-called carrier taping packaging. In particular, embossed carrier taping packaging using an embossed carrier tape in which concave pockets for housing semiconductor devices are arranged has become mainstream (see, for example, Patent Document 1).

  In the semiconductor device described in Patent Document 1, a semiconductor inserted into the pocket by forming a U-shaped cut in the bottom wall of the pocket that accommodates the semiconductor device, and bending and standing up the portion surrounded by the cut. Since the out lead (connecting terminal) of the device is exposed, the electrical characteristic inspection of the semiconductor device can be performed.

JP-A-9-169386

  However, in the conventional semiconductor device described above, when the semiconductor device is stored in the pocket, it is possible to easily and quickly inspect the vertical outlead deformation defect of the semiconductor device, which is a major problem in the embossed carrier taping device. It was difficult to do.

  In view of the above problems, the present invention provides a carrier tape capable of easily and quickly inspecting a vertical outlead deformation defect of a semiconductor device in a state of being accommodated in a pocket, and packaging of an electronic component using the carrier tape It is an object of the present invention to provide an inspection method and a mounting method for an electronic component packed using a body, a packing method, and a carrier tape.

  In order to solve the above problems, a carrier tape according to an aspect of the present invention includes a tape stretched in a strip shape, and a plurality of pockets capable of individually mounting electronic components on one surface of the tape, and the plurality of pockets Are arranged at predetermined intervals in the longitudinal direction of the tape, and each of the plurality of pockets is provided with an opening in a part of the side surface of the peripheral edge thereof.

  In addition, an electronic component package according to an aspect of the present invention includes a carrier tape having the above-described characteristics, and a top cover that is disposed on one surface of the tape in the carrier tape and covers the entire opening area of the plurality of pockets. A tape, and the top cover tape and one surface of the tape are bonded to each other to package the electronic component.

  The electronic component packaging device according to an aspect of the present invention includes a carrier tape loading unit that loads a carrier tape having a plurality of pockets capable of individually mounting electronic components on one surface of a tape extending in a strip shape, In each of the plurality of pockets, an opening forming portion that opens a part of the side surface of the peripheral portion thereof, and an electron in which a connection terminal protrudes from a side end surface of each of the plurality of pockets in which the opening is formed. On one surface of the tape in the carrier tape, an electronic component mounting portion for mounting components, a connection terminal inspection portion provided with an inspection means for detecting the presence or absence of a shape abnormality of the connection terminal from the outside of the opening, A top cover tape covering the entire opening area of the plurality of pockets; a top cover tape bonding portion for bonding one surface of the tape and the top cover tape; Winding the carrier tape which is adhered to the Puka bar tape transport reel and a carrier tape winding unit.

  The electronic component packaging method according to one aspect of the present invention includes a carrier tape loading step of loading a carrier tape having a plurality of pockets capable of individually mounting electronic components on one surface of a tape extending in a strip shape, In each of the plurality of pockets, an opening forming step of opening a part of the side surface of the peripheral portion, and an electronic component in which a connection terminal protrudes from a side end surface in each of the plurality of pockets in which the opening is formed. An electronic component mounting step to be mounted; a connection terminal inspection step for detecting presence / absence of a shape abnormality of the connection terminal from outside the opening; and an opening region of the plurality of pockets on one surface of the carrier tape. A top cover tape is disposed so as to cover the entire surface, and a top cover tape adhering step for adhering one surface of the tape and the top cover tape; Winding the carrier tape which is adhered to the TAPE mode transport reel and a carrier tape winding process.

  The electronic component mounting method according to one aspect of the present invention includes a step of pulling out a package of electronic components according to claim 3 wound on a transport reel from the wound state, and the pulled-out electronic components A step of peeling the top cover tape from the package to form a carrier tape, a step of sequentially taking out the electronic components from an opening area of a pocket of the carrier tape, and a step of mounting the taken out electronic components on a mounting substrate. including.

  According to the carrier tape, the electronic component packaging body, the packaging method, the packaging device, and the mounting method according to the present invention, the vertical out-lead deformation defect of the semiconductor device even when the electronic component is stored in the pocket of the carrier tape. Can be easily and rapidly inspected.

It is the top view (a) and side view (b) which were seen from the top side which shows an example of the carrier tape concerning a 1st embodiment of the present invention. It is a perspective view which shows an example of the carrier tape package which concerns on 1st Embodiment of this invention. It is a figure which shows the packing apparatus and packing method of the semiconductor device using the carrier tape which concern on 1st Embodiment of this invention. It is the top view (a) and side view (b) which were seen from the top side which shows an example of the good quality detection state in the out-lead inspection of the electronic component in the carrier tape concerning a 1st embodiment of the present invention. It is the top view (a) and side view (b) which were seen from the top side which shows an example of the defective article detection state in the out-lead inspection of the electronic component in the carrier tape which concerns on 1st Embodiment of this invention. It is the top view (a) and side view (b) which were seen from the top side which shows an example of the good quality detection state in the out-lead inspection of the electronic component in the carrier tape concerning a 2nd embodiment of the present invention. It is the top view (a) and side view (b) which were seen from the top side which shows an example of the inferior goods detection state in the out-lead inspection of the electronic component in the carrier tape which concerns on 2nd Embodiment of this invention. It is the top view (a) and side view (b) which were seen from the top side which shows an example of the good quality detection state in the out-lead inspection of the electronic component in the carrier tape which concerns on 3rd Embodiment of this invention. It is the top view (a) and side view (b) which were seen from the top side which shows an example of the defective article detection state in the out-lead inspection of the electronic component in the carrier tape which concerns on 3rd Embodiment of this invention. It is the top view (a) and side view (b) which were seen from the top side which shows an example of the carrier tape concerning a prior art. It is a perspective view which shows an example of the carrier tape package which concerns on a prior art. It is a figure which shows the packing apparatus and packing method of a semiconductor device using the carrier tape concerning a prior art. It is a perspective view of the pocket of the embossed carrier tape concerning a prior art.

(Knowledge that became the basis of the present invention)
First, an embossed carrier tape and an embossed carrier taping package that are the basis of the present invention will be described with reference to the drawings. FIG. 10A is a plan view seen from the top surface side of a conventional embossed carrier tape, and FIG. 10B is a side view. 11 is a perspective view of an embossed carrier taping package, and FIG. 12 is an embossed carrier taping device of a semiconductor device for realizing FIG.

  As shown in FIG. 10A, a plurality of feed holes 112 are provided at one end in the width direction of the embossed carrier tape 111 at a predetermined interval, and a semiconductor device 113 is formed at the center in the width direction. A plurality of pockets 114 are arranged in the longitudinal direction at predetermined intervals.

  Further, as shown in FIG. 11, after the semiconductor device 113 is stored in the pocket 114, a top cover tape 118 covering the pocket 114 is attached by thermocompression bonding or the like to facilitate storage, transportation and transportation. The embossed carrier taping package 119 is completed by being wound around the transport reel 116a in the take-up portion 116.

  Thereafter, the embossed carrier taping package 119 is shipped in a transporting and transporting case such as cardboard.

  Further, in the embossed carrier taping device shown in FIG. 12, after the semiconductor device 113 is stored in the pocket 114, the storage state such as rotation of the semiconductor device in the pocket or popping out of the pocket or the out lead 117 is deformed in the horizontal direction. After confirming the horizontal gap abnormality of the out leads 117 called lead pitch or foreign matter adhesion with a camera with an image inspection function from the top surface of the embossed carrier tape, the top cover tape 118 covering the pocket 114 is bonded by thermocompression bonding or the like. It is mounted and wound on a transport reel 116a for easy storage and transportation.

  Further, when the semiconductor device 113 is mounted on a printed wiring board (Printed Wiring Board: PWB) or the like, the embossed carrier taping package, which is a package, is transferred from the transport reel 116a to the embossed carrier tape 111 via the feed hole 112. The top cover tape 118 is peeled off while feeding out the semiconductor device, and then the semiconductor device 113 is taken out and mounted on a printed wiring board or the like.

  As a result, embossed carrier taping packaging can realize a higher speed in the mounting process than tray packaging or magazine packaging, and has recently been frequently used as a shipping form of the semiconductor device 113.

  However, in the case of the conventional pocket shape, when the semiconductor device 113 is housed in the pocket of the embossed carrier tape 111, the outlead 117 is in a closed environment. There is a problem in that an electrical characteristic inspection for confirming the presence or absence of damage to the semiconductor device 113 cannot be performed when a static discharge (ESD) occurs.

  As means for solving this problem, Patent Document 1 discloses a pocket-shaped embossed carrier tape shown in a perspective view in FIG. In the embossed carrier tape shown in FIG. 13, a U-shaped cut is formed in the bottom wall of the pocket that accommodates the semiconductor device, and the portion surrounded by the cut is bent and raised to be inserted into the pocket. The out lead of the semiconductor device is exposed. Thereby, an electrical property test can be performed.

  However, in the above-described conventional semiconductor device, when the semiconductor device is stored in the pocket, the semiconductor device is inspected easily and at high speed for defective vertical outlead deformation, which is a major problem in the embossed carrier taping device. That was difficult. Specifically, the vertical deformation of the out lead due to abnormal insertion of the semiconductor device, the gap between the bottom of the semiconductor device called the so-called stand-off and the leading end of the out lead, and the standard where the out lead called coplanarity should be arranged It was not possible to inspect the deviation of each out-lead terminal from the plane.

  In particular, when the out lead is bent in the vertical direction or the out lead floats (that is, the non-uniformity of the bottom surface of the out lead), it leads to poor solder connection when the semiconductor device is mounted on the PWB.

  According to the carrier tape and the packaging and packaging method for electronic components using the carrier tape and the inspection method and mounting method for the electronic components packed using the carrier tape shown below, the vertical of the semiconductor device in the state of being stored in the pocket It is possible to easily and quickly inspect the direction of the lead out deformation.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol may be attached | subjected with respect to substantially the same structure, and description may be abbreviate | omitted. Each of the embodiments described below shows one specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

  In the following description, for convenience of explanation, a semiconductor device may be treated as a transparent body in some drawings. In addition, the semiconductor device placed in the pocket of the embossed carrier tape takes a QFP package product as an example, but is not limited to this, and other types of package products also fall within the scope of the present invention. is there.

  Further, the semiconductor device will be described as a packaged product placed in the pocket of the embossed carrier tape. However, the present invention is not limited to this, and other electronic components that can be placed in the pocket of the embossed carrier tape are also included in the present invention. It falls into the category of

(First embodiment)
The first embodiment of the present invention will be described below.

[1. Carrier tape and carrier tape package]
FIG. 1 is a diagram showing an example of a carrier tape according to the first embodiment of the present invention.

  1A is a plan view seen from the top surface side of the carrier tape 11 according to this embodiment, and FIG. 1B is a side view of the pocket 14 of the carrier tape 11.

  The carrier tape 11 according to this embodiment is a so-called embossed carrier tape in which concave pockets are arranged. As shown in FIG. 1A, the carrier tape 11 is a tape that is stretched in a band shape, and includes a plurality of pockets 14 in which semiconductor devices 13 that are electronic components can be individually mounted on one surface of the tape. ing. The tape body is a portion of the carrier tape 11 excluding the plurality of pockets 14. The carrier tape 11 is provided with a plurality of feed holes 12 in the longitudinal direction at predetermined intervals at one or both ends (not shown) in the width direction. The feed hole 12 penetrates in the thickness direction. The feed hole 12 is for guiding and transporting the carrier tape 11 in the longitudinal direction, and is formed at a position where it can engage with a feed pin (not shown) of the transport device.

  In addition, a plurality of concave pockets 14 for housing the semiconductor device 13 are installed in the longitudinal direction at predetermined intervals in the center of the carrier tape 11 in the width direction. The pocket 14 is recessed in the direction opposite to the top surface side in the thickness direction.

  The pockets 14 are formed to have a margin in the width direction, the length direction, and the thickness direction as compared with the semiconductor device 13 accommodated therein.

  Here, the gap between the semiconductor device 13 to be placed and the pocket 14 is desirably set in consideration of the movable accuracy of the device used for insertion and removal and the processing accuracy of the molding manufacturer of the carrier tape 11. Specifically, the clearance between the side wall of the pocket 14 and the tip of the out lead 17 of the QFP package, which is a semiconductor device, is preferably about 0.1 mm to 0.5 mm.

  In the present embodiment, a plurality of openings 15 are formed on the side surface of the peripheral edge of the pocket 14. As shown in FIG. 1B, the openings 15 are formed on both sides of the side wall surface of the pocket 14 in the width direction of the carrier tape 11. The opening 15 is formed so that the vicinity of the tip end of the QFP outlead 17 accommodated is exposed in the region of the opening 15. That is, the opening 15 is arranged at a position where the semiconductor device 13 can be seen from the outside of the side surface of the peripheral edge of the pocket 14 in a state where the semiconductor device 13 is mounted in the pocket 14.

  The opening 15 may be formed by the same method as the method for forming the carrier tape 11 when the carrier tape 11 is formed or before and after the pocket 14 is formed. Further, in the taping device of the semiconductor device 13 using the carrier tape 11, it may be formed by using laser irradiation, drilling with a drill, or punching.

[2. Carrier tape package]
FIG. 2 is a perspective view showing an example of the carrier taping package 19 according to the present embodiment.

  As shown in FIG. 2, the package body in which the top cover tape 18 is bonded on the carrier tape 11 is usually stored in cardboard or the like in a state of being wound around the transport reel 16a in a plurality of turns.

  The shape of the carrier tape 11 shown in the present embodiment may be properly used as necessary while taking into consideration the difficulty of manufacturing the pocket 14, the manufacturing cost, the package outer shape, the gap position, and the like. Further, the installation position of the opening 15 is not limited to the illustrated location, and the opening 15 may be provided in a size that prevents the stored semiconductor device 13 from jumping out of the pocket 14.

  In addition, as a raw material of the carrier tape 11, resin, such as a polystyrene, A-PET (polyethylene terephthalate), a polycarbonate, a polypropylene, is used in many cases, and it uses properly according to a use. For example, a resin material that requires transparency is used for appearance inspection after taping packaging. In order to prevent an electrical failure of an ESD device sensitive to static electricity, a resin material in which a conductive material such as carbon powder is kneaded is used. For the purpose of preventing electrical failure, a resin material in which a conductive material is applied to the surface of the carrier tape 11 is used.

  Further, the thickness of the carrier tape 11 is, for example, approximately 0.2 mm to 0.4 mm, for example, in view of manufacturing difficulty and material cost.

  The pocket 14 is generally formed by a method of alternately feeding and molding the heated raw material resin sheet. In addition, various production methods such as a vacuum forming method for forming with vacuum pressure, a pressure forming method for forming with compressed air, and a press forming method for forming with a punch die and a die die are used.

  Although the molding method as described above is given as an example due to problems of material costs and manufacturing advantages, in this embodiment, the present invention is not limited to this manufacturing method, and after forming with different materials and different manufacturing methods, coalescence formation It doesn't matter.

  For items not described in the present embodiment, widely and generally standardized standards may be used. For example, there are IEC 60286-3 issued by the International Electrotechnical Commission and JIS C 0806-3 issued by the Japanese Standards Association for the width dimension of the carrier tape 11, the feed hole 12 and the pocket 14 and the like. There is no problem even if something is used.

[3. Electronic Parts Packaging and Packaging Method]
Next, a packaging body and a packaging method when packaging the semiconductor device 13 in the pocket 14 of the carrier tape 11 will be described.

  In the pocket 14 of the carrier tape 11, the semiconductor device 13 is placed in a predetermined direction (in many cases, the out lead 17 is directed downward in consideration of the mounting direction of the printed circuit board). After housing the semiconductor device 13 in the pocket 14, the top cover tape 18 is placed on the top surface side of the carrier tape 11 so as to cover the opening region above the pocket 14. Further, the carrier tape packaging body 19 is completed by continuously thermocompression bonding to both ends of the carrier tape 11 by a thermocompression bonding apparatus (not shown).

  The top cover tape 18 is generally formed narrower than the width of the carrier tape 11. Its main purpose is to prevent the semiconductor device 13 housed in the pocket 14 from falling off or being contaminated by the outside air.

  The material of the top cover tape 18 is preferably a resin material that can be easily heat-pressed with the carrier tape 11, and a material mainly made of polyethylene terephthalate (PET) is used. The thickness of the top cover tape 18 is preferably about 50 μm. In addition, the top cover tape 18 is desirably transparent so that the semiconductor device 13 can be transparently identified in order to facilitate visual inspection on the package. The joining of the carrier tape 11 and the top cover tape 18 is not limited to thermocompression bonding, and any other material such as an adhesive may be used.

  Further, the carrier taping package 19 is generally wound in a roll shape on a transport reel 16a in order to facilitate storage and transportation. The carrier taping package 19 is packed in an aluminum laminate bag (not shown) or a vacuum with a dehumidifying desiccant (not shown) such as silica gel in order to shield the semiconductor device 13 from outside air as necessary. May be vacuum-packed.

  Thereafter, the carrier taping package 19 is transported to the destination in a state of being enclosed and packed in a transporting and transporting case (not shown) such as a cardboard box or a plastic case. During shipping and transportation, in the process of transporting the package to the delivery destination, various vibration stresses and impact stresses are applied to the package. These sizes include transportation to the transportation destination, transport distance, handling method, packing materials such as cardboard boxes, proof and shock resistance of various materials such as carrier tape, and resistance specs against impact damage of semiconductor devices and lead terminals, etc. It is greatly influenced by.

[4. Semiconductor device packing apparatus and packing method]
FIG. 3 is a diagram showing a packing apparatus and packing method for a semiconductor device using the carrier tape 11 according to the present embodiment.

  As shown in FIG. 3, as a method for packing the carrier taping package 19 and the configuration of the packing device, first, the carrier tape 11 is loaded in a carrier tape loading unit (not shown). After the openings 15 are formed in the side walls of the peripheral portions of the plurality of pockets 14 of the carrier tape 11 in the laser drilling portion (opening forming portion) 22, the pockets are formed in the semiconductor device insertion portion (electronic component mounting portion) 23. 14 are mounted with electronic components individually.

  Next, in the transmission type sensor (connection terminal inspection part) 24, the opening 15 is used to perform a bending inspection for detecting the shape abnormality in the vertical direction of the out lead 17 of the semiconductor device, in particular, the presence or absence of terminal bending. The transmissive sensor 24 irradiates the transmissive sensor light 28, which is laser light, so as to penetrate the opening 15 on the other side wall from the outside of the opening 15 on the one side wall of the peripheral portion of the pocket 14, This is a sensor for detecting the presence or absence of a shape abnormality (terminal bending) in the vertical direction of the out lead 17 as a connection terminal depending on the intensity of light. When the transmissive sensor light 28 incident on the opening 15 on one side wall of the peripheral edge of the pocket 14 is blocked by the out lead 17 and cannot pass through the opening 15 on the other side wall, the transmissive sensor 24 is It is determined that the outlead 17 is bent in the vertical direction.

  The laser drilling portion 22, the semiconductor device insertion portion 23, and the transmission sensor 24 correspond to the opening forming portion, the electronic component mounting portion, and the connection terminal inspection portion in the present invention.

  Next, the camera 25 with an image inspection function is used to check the storage state such as horizontal rotation and popping out of the pocket 14 and whether or not the outlead 17 is deformed in the horizontal direction.

  Here, in the unlikely event that a defective product is detected in the above two inspection processes, the equipment is stopped.

  Next, the top cover tape 18 is overlaid on one surface of the carrier tape 11 so as to cover the opening regions on the plurality of pockets 14, and bonded by a thermocompression bonding portion (top cover tape bonding portion) 26, and then wrapped with the carrier tape. The take-up unit 16 winds the carrier tape 11 around the transport reel 16a. The thermocompression bonding part 26 corresponds to the top cover tape bonding part in the present invention.

  FIG. 4 is a diagram illustrating an example of a non-defective product detection state in the inspection of the out lead 17 of the semiconductor device 13 in the carrier tape 11 according to the present embodiment. Here, FIG. 4A is a plan view seen from the top surface side, and FIG. 4B is a side view.

  As shown in FIGS. 4 (a) and 4 (b), in the step of performing a bending inspection in which the opening 15 is used in the transmissive sensor 24 to check the presence / absence of an abnormal shape of the out lead 17 of the semiconductor device. In the openings 15 formed in the side walls of the peripheral portions of the plurality of pockets 14 of the carrier tape 11, the out leads 17 on the two sides in the short side direction of the carrier tape 11 of the semiconductor device are exposed. In addition, a transmissive sensor 24 is arranged in accordance with the shape of the out lead 17. The transmissive sensor 24 is disposed at a position where the transmissive sensor light 28 output from the transmissive sensor 24 does not hit the outlead 17 when the shape of the outlead 17 is normal. As a result, the transmission sensor light 28 that has entered the opening 15 on the side wall on one side of the peripheral edge of the pocket 14 from the transmission type sensor 24 can be detected depending on whether it can be detected outside the opening 15 on the other side wall. The lead 17 is inspected for bending in the vertical direction. In the case of FIG. 4, since the shape of the out lead 17 is normal, the transmitted sensor light 28 output from the transmissive sensor 24 and incident on the opening 15 on the side wall on one side of the pocket 14 is directly used as the side wall on the other side. Permeate outwardly of the opening 15 of the. In this case, it is determined that the outlead 17 is not bent in the vertical direction.

  FIG. 5 is a diagram illustrating an example of a defective product detection state in the outlead 17 inspection of the semiconductor device 13 in the carrier tape 11 according to the present embodiment. Here, FIG. 5A is a plan view seen from the top surface side, and FIG. 5B is a side view.

  As shown in FIGS. 5A and 5B, in the step of performing a bending inspection for detecting the presence / absence of a shape abnormality in the vertical direction of the out lead 17 of the semiconductor device 13 using the opening 15 in the transmission type sensor 24. In addition, when there is an outlead 17a (bounce) that is bent in the vertical direction in a part of the outlead 17 arranged on one side of the semiconductor device 13, the transmission sensor light 28 emitted from the transmission type sensor 24 is in the vertical direction. It hits the bent outlead 17a and is irregularly reflected. Accordingly, the transmitted sensor light 28 does not normally transmit outside the opening 15 on the other side wall of the peripheral portion of the pocket 14, and the semiconductor device 13 is detected as a defective product.

  The sensor used here may be a reflective sensor instead of the transmissive sensor 24. The reflective sensor irradiates a laser beam so as to penetrate the opening 15 from the outside of the opening 15 on the one side wall of the peripheral edge of the pocket 14 toward the other side wall, and reflects the laser beam on the other side wall. In this case, the sensor detects the presence / absence of a shape abnormality of the connection terminal based on the intensity of the reflected light output from the opening 15 again. When the laser light incident on the opening 15 on the side wall on one side of the peripheral edge of the pocket 14 is blocked by the out lead 17 and the reflected light reflected on the other side wall cannot be detected, the reflective sensor detects the out lead. It is determined that 17 is bent in the vertical direction.

[5. Method for mounting semiconductor device]
Next, although not particularly illustrated, a process of sequentially taking out the semiconductor device 13 from the pocket 14 and mounting and mounting it on a printed wiring board or the like, a so-called mounting method will be described.

  First, in the step of opening the carrier tape 11, the carrier tape 11 is usually fed out from the transport reel 16 a through the feed hole 12. Then, while peeling the top cover tape 18 from the carrier tape 11 in one direction, the semiconductor device 13 is taken out from the pocket 14 and mounted and mounted on a printed wiring board (PWB) or the like in the process immediately after that.

  In high-density mounting where a large number of parts are mounted in a limited space, it is necessary to supply a large number of parts in a dense manner, so that carrier taping packaging has a higher mounting process efficiency than tray packaging and magazine tube packaging. High speed can be realized.

  In the present embodiment, the carrier tape 11 has been described as an example, but the present invention is not limited to this example, and can be widely applied to other examples having the same basic concept of the present invention. Instead of the carrier tape, a punch carrier type such as plastic and paper may be used. In addition, a semiconductor device is cited as an example of a component to be accommodated. However, the present invention is not limited to this, and it may be applied to components other than semiconductor devices, small components such as resistors and capacitors, and other small items. I do not care.

  Moreover, although the carrier tape 11 illustrated in the present embodiment is a continuous tape due to manufacturing advantages, it is not always necessary to continue, and individual tapes formed by different materials or different manufacturing methods can be used in a later step. It does not matter if it is prepared by forming a coalescence.

  Furthermore, the carrier tape 11 and its packing body and packing method and mounting method thereof according to the present embodiment include an outer shape and volume of the electronic component to be stored, a transportation and transport distance to the transport destination, and a mounting mounter device that takes out the electronic component. Depending on the conditions such as the evolutionary generation, it may be used as needed.

  Further, although the bending of the outlead 17 in the vertical direction is detected by the transmissive sensor 24, the carrier tape 11 is pulled out from the state wound around the transporting reel 16a, and a visual inspection is performed from the opening 15 using a magnifying glass or the like. Thus, it is possible to perform an inspection for detecting the presence / absence of the shape abnormality (bending) of the outlead 17. Similarly, in the mounting process, the carrier tape 11 is fed from the transport reel 16a through the feed hole 12, and the top cover tape 18 is peeled from the carrier tape 11 in one direction, and the semiconductor device 13 is pocketed in the process immediately thereafter. When the semiconductor device 13 is mounted and mounted on a PWB or the like after being taken out from 14, it is not possible to carry out an inspection to confirm the presence or absence of an abnormal shape of the outlead 17 from the opening 15 with the transmission sensor 24 or the like immediately before taking out the semiconductor device 13 from the pocket 14. It is also possible to discharge good products.

[6. Effect]
As described above, the carrier tape according to one embodiment of the present invention includes a tape stretched in a strip shape, and a plurality of pockets in which electronic components can be individually mounted on one surface of the tape, and the plurality of pockets are longitudinal directions of the tape. Each of the plurality of pockets is provided with an opening in a part of the side surface of the peripheral edge thereof.

  Thereby, even in a state where the electronic component is stored in the pocket of the carrier tape, it is possible to easily and quickly inspect the deformation failure of the connection terminal of the electronic component. Therefore, a highly accurate inspection can be performed, and the inspection time can be shortened.

  Further, in the carrier tape of the present invention, the electronic component includes a connection terminal protruding from a side end surface of the electronic component, and the opening has a peripheral edge of the pocket in a state where the electronic component is mounted in the pocket. You may arrange | position in the position which can see the said connection terminal from the outer side of the part.

  Thereby, even when the electronic component is stored in the pocket of the carrier tape, it is possible to easily inspect the deformation failure of the connection terminal of the electronic component from the outside of the pocket.

  In addition, an electronic component package according to an aspect of the present invention includes a carrier tape having the above-described characteristics, and a top cover that is disposed on one surface of the tape in the carrier tape and covers the entire opening area of the plurality of pockets. A tape, and the top cover tape and one surface of the tape are bonded to each other to package the electronic component.

  Thereby, even in a state where the electronic component is stored in the pocket of the carrier tape in the package of the electronic component, it is possible to easily and rapidly inspect the deformation failure of the connection terminal of the electronic component.

  The electronic component packaging device according to an aspect of the present invention includes a carrier tape loading unit that loads a carrier tape having a plurality of pockets capable of individually mounting electronic components on one surface of a tape extending in a strip shape, In each of the plurality of pockets, an opening forming portion that opens a part of the side surface of the peripheral portion thereof, and an electron in which a connection terminal protrudes from a side end surface of each of the plurality of pockets in which the opening is formed. On one surface of the tape in the carrier tape, an electronic component mounting portion for mounting components, a connection terminal inspection portion provided with an inspection means for detecting the presence or absence of a shape abnormality of the connection terminal from the outside of the opening, A top cover tape covering the entire opening area of the plurality of pockets; a top cover tape bonding portion for bonding one surface of the tape and the top cover tape; Winding the carrier tape which is adhered to the Puka bar tape transport reel and a carrier tape winding unit.

  As a result, in the electronic component packaging apparatus, even when the electronic component is stored in the pocket of the carrier tape, it is possible to easily and quickly inspect the deformation failure of the connection terminal of the electronic component.

  In the electronic component packaging device of the present invention, the connection terminal inspection unit may detect the presence or absence of terminal bending of the connection terminal.

  Thereby, especially the presence or absence of the bending of the connecting terminal in the vertical direction can be inspected easily and at high speed.

  In the electronic device packaging apparatus according to the present invention, the connection terminal inspection unit irradiates the connection terminal with laser light from the outside of the opening, and the shape of the connection terminal is abnormal due to the intensity of the transmitted light. The inspection means having a transmissive sensor for detecting the presence or absence of a laser beam is irradiated from the outside of the opening toward the connection terminal, and the presence or absence of a shape abnormality of the connection terminal is determined by the intensity of the reflected light. The inspection means having a reflective sensor for detection may be provided.

  Thereby, the deformation | transformation defect of the connecting terminal of an electronic component can be test | inspected easily and at high speed by a transmissive | pervious sensor or a reflective sensor.

  The electronic component packaging method according to one aspect of the present invention includes a carrier tape loading step of loading a carrier tape having a plurality of pockets capable of individually mounting electronic components on one surface of a tape extending in a strip shape, In each of the plurality of pockets, an opening forming step of opening a part of the side surface of the peripheral portion, and an electronic component in which a connection terminal protrudes from a side end surface in each of the plurality of pockets in which the opening is formed. An electronic component mounting step to be mounted; a connection terminal inspection step for detecting presence / absence of a shape abnormality of the connection terminal from outside the opening; and an opening region of the plurality of pockets on one surface of the carrier tape. A top cover tape is disposed so as to cover the entire surface, and a top cover tape adhering step for adhering one surface of the tape and the top cover tape; Winding the carrier tape which is adhered to the TAPE mode transport reel and a carrier tape winding process.

  Thereby, even when the electronic component is packed, even when the electronic component is stored in the pocket of the carrier tape, it is possible to easily and quickly inspect the deformation failure of the connection terminal of the electronic component.

  In the electronic component packaging method of the present invention, in the connection terminal inspection step, the presence or absence of terminal bending of the connection terminal may be detected.

  This makes it possible to easily and at high speed inspect whether or not the connection terminals are bent in the vertical direction, especially when packaging electronic components.

  Further, in the electronic component packaging method of the present invention, in the connection terminal inspection step, a laser beam is irradiated from the outside of the opening toward the connection terminal using a transmission sensor, and the irradiated laser beam is irradiated. The presence or absence of an abnormality in the shape of the connection terminal is detected based on the intensity of transmitted light, or a laser beam is emitted from the outside of the opening toward the connection terminal using a reflective sensor. The presence or absence of a shape abnormality of the connection terminal may be detected based on the intensity of the reflected light.

  As a result, when the electronic component is packaged, it is possible to easily and quickly inspect the deformation defect of the connection terminal of the electronic component by the transmission type sensor or the reflection type sensor.

  The electronic component mounting method according to one aspect of the present invention includes a step of pulling out a package of electronic components according to claim 3 wound on a transport reel from the wound state, and the pulled-out electronic components A step of peeling the top cover tape from the package to form a carrier tape, a step of sequentially taking out the electronic components from an opening area of a pocket of the carrier tape, and a step of mounting the taken out electronic components on a mounting substrate. including.

  As a result, an electronic component free from deformation defects of the connection terminal can be mounted on the mounting board.

(Second Embodiment)
In the description of the present embodiment, components having substantially the same functions as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and repeated description is omitted.

  Further, the electronic component packaging body using the carrier tape, the packaging method, the electronic component mounting method using the same, and other application examples are substantially the same as those in the first embodiment. Omitted.

  FIG. 6 is a diagram illustrating an example of a non-defective product detection state in the outlead 17 inspection of the semiconductor device 13 in the carrier tape 11 according to the present embodiment. Here, FIG. 6A is a plan view seen from the top surface side, and FIG. 6B is a side view.

  In the carrier tape 11 according to the present embodiment, as shown in the first embodiment, out leads 17 on two sides parallel to the short side direction of the carrier tape 11 are exposed out of the four sides of the semiconductor device 13, in addition, Of the four sides of the semiconductor device 13, the two side out leads 17 parallel to the long side direction of the carrier tape 11 are also exposed.

  As shown in FIGS. 6A and 6B, in the step of performing a bending inspection for detecting the presence or absence of the shape abnormality in the vertical direction of the outlead 17 of the semiconductor device using the opening 15 in the transmissive sensor 24. In the opening 15 formed in the side wall of the peripheral portion of the plurality of pockets 14 of the carrier tape 11, the out leads 17 on the four sides around the carrier tape 11 of the semiconductor device 13 are exposed. In addition, transmission type sensors 24 are arranged in both the long and short directions of the carrier tape 11 in accordance with the shape of the out lead 17, and the transmission type sensor 24 inspects the presence or absence of lead bending. In the case of the carrier tape 11 shown in FIG. 6, since the shape of the out lead 17 is normal, the opening 15 on the side wall on one side of the peripheral edge of the pocket 14 is output from the transmission sensor 24 in both the long and short directions of the carrier tape 11. The transmitted sensor light 28 incident on the light passes through the opening 15 on the other side wall as it is. In this case, it is determined that the outlead 17 is not bent in the vertical direction.

  FIG. 7 is a diagram illustrating an example of a defective product detection state in the outlead 17 inspection of the semiconductor device 13 in the carrier tape 11 according to the present embodiment. Here, FIG. 7A is a plan view seen from the top surface side, and FIG. 7B is a side view.

  As shown in FIGS. 7A and 7B, in the step of performing a bending inspection for detecting the presence or absence of a shape abnormality in the vertical direction of the outlead 17 of the semiconductor device using the opening 15 in the transmission type sensor 24. When a part of the out lead 17 arranged on one side of the long side of the out lead 17 of the semiconductor device 13 has an out lead 17a (bounce) bent in the vertical direction, the transmission sensor coming out of the transmission type sensor 24 The light 28 strikes the outlead 17a bent in the vertical direction and is irregularly reflected. Accordingly, the transmitted sensor light 28 does not normally transmit outside the opening 15 on the other side wall of the peripheral portion of the pocket 14, and the semiconductor device 13 is detected as a defective product.

  The sensor used here may be a reflective sensor instead of the transmissive sensor 24.

(Third embodiment)
In the description of the carrier tape 11 according to the present embodiment, components having substantially the same functions as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and repeated description is omitted.

  Further, the electronic component packaging body using the carrier tape 11, the packaging method, the electronic component mounting method using the same, and other application examples are substantially the same as those in the first embodiment. Is omitted.

  FIG. 8 is a diagram illustrating an example of a non-defective product detection state in the outlead 17 inspection of the semiconductor device 13 in the carrier tape 11 according to the present embodiment. Here, FIG. 8A is a plan view seen from the top surface side, and FIG. 8B is a side view.

  In the carrier tape 11 according to the present embodiment, in addition to the structure in which the out leads 17 on two sides parallel to the short side direction of the carrier tape 11 among the four sides of the semiconductor device 13 shown in the first embodiment are exposed, the pocket 14 The semiconductor device 13 is mounted on the inner pedestal 20, and the semiconductor device 13 is fixed and the vertical inclination is corrected by the holding jig 21. Further, the transmission type sensor 24 has a structure in which two tiers of upper and lower sides are arranged at the positions of the left and right sides of the four sides of the semiconductor device 13 in accordance with the shape of the out lead 17.

  As shown in FIGS. 8A and 8B, in the step of performing a bending inspection in which the opening 15 is used in the transmissive sensor 24 to detect the presence or absence of the shape abnormality of the out lead 17 of the semiconductor device 13 in the vertical direction. Further, in the openings 15 formed in the side walls of the peripheral portions of the plurality of pockets 14 of the carrier tape 11, the out leads 17 on the two sides of the carrier tape 11 in the short side of the semiconductor device 13 are exposed, and the shape of the out leads 17 is A transmissive sensor 24 is arranged in accordance with the above, and the transmissive sensor 24 inspects for the presence of bent leads. In the case of FIG. 8, since the shape of the out lead 17 is normal, the transmitted sensor light 28 emitted from the transmissive sensor 24 arranged in two stages on the left and right is transmitted as it is.

  Here, in the present embodiment, the transmissive sensor 24 has a structure in which the transmissive sensor 24 is arranged in two upper and lower stages at the positions of the left and right sides of the four sides of the semiconductor device 13 according to the shape of the out lead 17. It is possible to inspect the vertical jumping and bouncing down of the outlead 17 with higher accuracy.

  FIG. 9 is a diagram illustrating an example of a defective product detection state in the outlead 17 inspection of the semiconductor device 13 in the carrier tape 11 according to the present embodiment. Here, (a) of FIG. 9 is a plan view seen from the top surface side, and (b) of FIG. 9 is a side view.

  As shown in FIGS. 9A and 9B, in the step of performing a bending inspection to detect the presence or absence of the shape abnormality in the vertical direction of the out lead 17 of the semiconductor device 13 using the opening 15 in the transmissive sensor 24. In addition, when there is an outlead 17a (bounce-up or bounce-down) bent in the vertical direction in a part of the outlead 17 arranged on one side of the semiconductor device 13, the transmissive sensor light 28 emitted from the transmissive sensor 24 is Since the light is irregularly reflected by hitting the out lead 17a bent in the vertical direction, it is not normally transmitted and is detected as a defective product.

  Further, if the position of the transmissive sensor 24 is set in accordance with the dimensional standard value of the standoff or coplanarity of the semiconductor device 13, the out of the four sides around the carrier tape 11 of the semiconductor device 13 is the same as in the second embodiment. By inspecting the lead 17, it is also possible to inspect abnormalities in standoff and coplanarity.

  As mentioned above, although the carrier tape etc. concerning one or several aspects were demonstrated based on embodiment, this invention is not limited to this embodiment. Unless it deviates from the gist of the present invention, various modifications conceived by those skilled in the art have been made in this embodiment, and forms constructed by combining components in different embodiments are also within the scope of one or more aspects. May be included.

  INDUSTRIAL APPLICABILITY The present invention is useful in a carrier tape that stores electronic components such as semiconductor devices, resistors, and capacitors, a packaging body for electronic components using the carrier tape, a packaging method therefor, and a mounting method for electronic components packaged using the same. It is.

DESCRIPTION OF SYMBOLS 11 Carrier tape 12 Feed hole 13 Semiconductor device 14 Pocket 15 Opening part 16 Winding part 16a Reel for conveyance 17, 17a Out lead 18 Top cover tape 19 Carrier taping packaging body 20 Base 21 Holding jig 22 Laser drilling part (opening) Part forming part)
23 Semiconductor device insertion part (electronic component mounting part)
24 Transmission type sensor (connection terminal inspection part)
25 Image inspection device (camera)
26 Thermocompression bonding part (Top cover tape bonding part)
27 Guide roller 28 Transmission sensor light 111 Embossed carrier tape 112 Feed hole 113 Semiconductor device 114 Pocket 116 Reel for conveyance 117 Out lead 118 Top cover tape 119 Embossed carrier taping package 123 Semiconductor device insertion part 125 Image inspection device (camera)
126 thermocompression bonding part 127 guide roller

Claims (10)

A tape stretched in a strip shape;
A plurality of pockets capable of individually mounting electronic components on one side of the tape,
The plurality of pockets are arranged at predetermined intervals in the longitudinal direction of the tape,
In each of the plurality of pockets, an opening is provided in a part of the side surface of the peripheral edge thereof. The electronic component includes a connection terminal protruding from a side end surface of the electronic component,
The carrier tape according to claim 1, wherein the opening is disposed at a position where the connection terminal can be seen from the outside of the side surface of the peripheral edge of the pocket in a state where the electronic component is mounted in the pocket. The carrier tape according to claim 1 or 2,
A top cover tape disposed on one side of the tape in the carrier tape and covering the entire opening area of the plurality of pockets;
The top cover tape and one surface of the tape are bonded to each other to package the electronic component. A carrier tape loading section for loading a carrier tape having a plurality of pockets capable of individually mounting electronic components on one surface of a tape stretched in a strip shape;
In each of the plurality of pockets, an opening forming portion that opens a part of the side surface of the peripheral portion,
In each of the plurality of pockets in which the opening is formed, an electronic component mounting portion for mounting an electronic component in which a connection terminal protrudes from a side end surface;
A connection terminal inspection unit comprising inspection means for detecting the presence or absence of an abnormality in the shape of the connection terminal from the outside of the opening;
On one surface of the tape in the carrier tape, a top cover tape covering the entire opening area of the plurality of pockets;
A top cover tape bonding portion for bonding one surface of the tape and the top cover tape;
A packaging apparatus for electronic parts, comprising: a carrier tape winding unit that winds the carrier tape bonded to the top cover tape onto a transport reel. The electronic component packaging apparatus according to claim 4, wherein the connection terminal inspection unit detects presence or absence of terminal bending of the connection terminal. The connection terminal inspection unit is
The inspection means having a transmissive sensor that irradiates laser light toward the connection terminal from the outside of the opening, and detects the presence or absence of a shape abnormality of the connection terminal based on the intensity of the transmitted light;
Alternatively, the inspection unit includes a reflective sensor that irradiates laser light toward the connection terminal from the outside of the opening and detects the presence or absence of a shape abnormality of the connection terminal based on the intensity of the reflected light. The electronic device packaging apparatus according to claim 4 or 5. A carrier tape loading step of loading a carrier tape having a plurality of pockets capable of individually mounting electronic components on one surface of the tape stretched in a strip shape;
In each of the plurality of pockets, an opening forming step of opening a part of the side surface of the peripheral edge,
In each of the plurality of pockets in which the opening is formed, an electronic component mounting step for mounting an electronic component in which a connection terminal protrudes from a side end surface;
A connection terminal inspection step for detecting the presence or absence of a shape abnormality of the connection terminal from the outside of the opening;
A top cover tape is disposed on one surface of the carrier tape so as to cover the entire opening area of the plurality of pockets, and a top cover tape bonding step of bonding the one surface of the tape and the top cover tape;
A packaging method for an electronic component, comprising: a carrier tape winding step of winding the carrier tape bonded to the top cover tape on a transport reel. The electronic component packaging method according to claim 7, wherein in the connection terminal inspection step, presence or absence of terminal bending of the connection terminal is detected. In the connection terminal inspection step,
Using a transmission sensor, irradiate laser light from the outside of the opening toward the connection terminal, and detect the presence or absence of abnormal shape of the connection terminal by the intensity of transmitted light of the irradiated laser light,
Alternatively, a reflective sensor is used to irradiate the connection terminal with laser light from the outside of the opening, and the presence or absence of an abnormality in the shape of the connection terminal is detected based on the intensity of reflected light of the irradiated laser light. Item 9. A packaging method for electronic components according to Item 7 or 8. The step of pulling out the package of electronic components according to claim 3 wound up on a transport reel from a wound state;
A step of peeling the top cover tape from the drawn electronic component package to form a carrier tape;
Sequentially taking out the electronic components from the opening area of the pocket of the carrier tape;
Mounting the taken-out electronic component on a mounting board.

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