JP2001106287A - Article housing member, and discriminating method for article housing member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an article housing member and a discriminating method for the article housing member wherewith workability can be improved with a simple structure and mixing of trays for different kinds of articles or turning round of the trays can be discriminated. SOLUTION: A tray 10 comprises a housing part 11 with a plurality of housing pockets 11 formed respectively in a specified dimension arranged therein, an outer frame part 12 formed at the outer circumference of the housing part 11 for determining positions for piling up of the trays, and an engaging part 4 composed of a protuberance 14a and a dent 14b and formed in a specified shape at a specified position on the outer frame part 12 in accordance with the kind of semiconductor devices 20 to be housed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an article storage member and an article storage member discriminating method, and more particularly to an article storage member and an article storage member which individually store semiconductor devices and are packed one over another. Regarding the determination method.

[0002]

2. Description of the Related Art Conventionally, semiconductor integrated circuit (hereinafter abbreviated as IC) chips are mounted in packages of various shapes according to the number of input / output pins and the like, and are mounted on electronic devices and the like as semiconductor devices. . As an example of a typical package of a semiconductor device, as shown in FIG. 7A, gull-wing leads 2 are formed on both sides of a package 21A.
SOP (Small Out-line Packa) with 2A arranged at equal intervals
ge) As shown in FIG.
A QFP (Quad Flat Package) 20B in which leads 22B are arranged at equal intervals from four sides of 1B is known.

[0003] These semiconductor devices have electrical characteristics such as whether the IC chip operates reliably as designed and whether defects such as lead disconnection have occurred prior to mounting on electronic equipment or the like. Measured and inspected. Then, the semiconductor device determined to be non-defective in such a measurement and inspection process is stored and packed in a predetermined transport tray, and is shipped and transported to an assembly line of electronic devices and the like. here,
The above-mentioned semiconductor devices differ in the shape and external dimensions of the package, the number of lead pins, the pitch between lead pins, etc., depending on the type of IC to be mounted. To prevent
Special trays are used depending on the type of semiconductor device.

[0004]

As described above, conventional trays used for storing semiconductor devices use dedicated ones for each type of semiconductor device. However, tray manufacturing costs are reduced and handling is reduced. Due to the above simplicity and the like, there are cases in which only the dimensions of storage pockets for individually storing semiconductor devices are different and trays having the same outer dimensions are used. Specifically, as shown in FIG.
The outer dimensions of the first and second 202 are, for example, 220 mm × 140
mm, while having the same dimensions as the storage pockets 211, 21.
8 is set to □ 9.4 mm in the tray 201 shown in FIG. 8A, while the tray 202 shown in FIG. It is formed to have a square of 12.4 mm.

However, the use of trays having the same outer dimensions has the following problems. (1) As shown in FIGS. 9A and 9B, trays 201 having different dimensions of storage pockets 211, 212, and 213,
Even if they are 202 and 203, they overlap,
Even if a tray 202 for storing different types of semiconductor devices (hereinafter referred to as a different kind of tray) is mixed, there is a problem that it is apparently difficult to determine it.

(2) Since the leads of the semiconductor device are assigned different roles, it is necessary to pay attention to the mounting direction when mounting the semiconductor device on an electronic device or the like. However, in the tray having the above-described shape, as shown in FIG. 10, a tray (hereinafter, referred to as a tray of the same type) 2 for storing the same type of semiconductor device.
01, 202, and 203, 180
When they are mounted in an inverted state (tray 202 in FIG. 10), they are likely to be defective when mounting to electronic equipment or the like by an automatic machine.

(3) In the case where the above-described electrical characteristics measurement / inspection step and the steps of storing in a tray and packing are performed by using an automatic machine, it is difficult to determine whether a different kind of tray has been mixed or the tray has been inverted, and the Was causing the outbreak. Accordingly, the present invention has been made in view of the above-described problems, and an article storage member and an article storage apparatus which can determine mixing of different kinds of trays, reversal of trays, and the like with a simple configuration to improve workability. An object of the present invention is to provide a method for determining a member.

[0008]

The article storage member according to the present invention is provided with an engaging portion comprising a pair of convex portions and concave portions at predetermined positions of an outer frame formed on the outer periphery of the article storing portion. It is characterized by being. For this reason, the article storage member according to the present invention is an article storage member having the same external dimensions because the engagement portions are provided asymmetrically at predetermined different positions for each type of the stored articles. Also,
Depending on the type of the article and the direction of the article storage member, a difference occurs in the position of the engaging portion and the overlapping state of the article storage members.

The article storage member determining method according to the present invention is characterized in that, when the article storage members are overlapped with each other, based on the state of engagement between the engagement portions provided at predetermined positions on the outer frame portion. It is characterized in that the type of the article storage member and the direction in which the article storage members overlap each other are determined. Therefore, the method for determining an article storage member according to the present invention is such that the same outer dimensions are obtained by superimposing the article storage members provided with the engagement portions at predetermined different positions for each type of the stored articles. Even if the article storage members have different shapes, the overlapping state of the article storage members differs depending on the type of the article and the direction of the article storage member, and the difference between the type of the stored article and the storage direction is visually recognized. Be recognized.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the article storage member according to the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic configuration diagram showing one embodiment of an article storage member according to the present invention. Here, the conventional technology (FIGS. 8 and 9)
The same reference numerals are given to the same components as those of the first embodiment. As shown in FIGS. 1A and 1B, a tray (article storage member) 10 according to the present embodiment includes a storage section 11, an outer frame section 12, and an engagement section 14. I have. In addition,
A cutout 13 for indicating the direction of the tray 10 is formed at one corner of the outer frame 12.

In the storage section 11, a plurality of storage pockets 11a having predetermined dimensions are arranged in a matrix. The size of the storage pocket 11a is set to a size corresponding to the type and shape of the semiconductor device (article) 20 to be stored. The outer frame 12 is provided with the storage 11
And the storage portion 11 is formed in a shape protruding from the outer frame portion 12. With such a configuration,
An overlapping position with another tray (not shown) is determined. The engaging portion 14 is provided on the outer frame 12 depending on the type of the semiconductor device 20 to be stored.
Are provided in a predetermined shape at a predetermined position, and as described later, a pair of protrusions 14a
And a concave portion 14b.

For example, as shown in FIG. 1, the engaging portion 14 is formed in a substantially triangular shape having an acute-angle convex portion 14a on the upper surface side of the tray 10 and an acute-angle concave portion 14b on the lower surface side. It is provided only at a specific position on a specific side of the frame portion 12. The height of the engaging portion 14 is equal to or lower than the uppermost surface UP of the tray 10. A notch 13 for displaying the direction of the tray 10 is formed at one corner of the outer frame 12.

Here, the specific structure and operation of the engaging portion applied to the tray according to the present embodiment will be described with reference to the drawings. Note that the same components as those in the above-described embodiment will be described with the same reference numerals. FIG. 2 is a schematic diagram showing an installation position of an engaging portion applied to the tray according to the embodiment, and FIG. 3 is a schematic diagram showing a first overlapping state of the trays according to the embodiment. Yes, FIG. 4
FIG. 5 is a schematic diagram illustrating a second state of overlapping trays according to the present embodiment, and FIG. 5 is a schematic diagram illustrating a third state of overlapping trays according to the present embodiment.

As described above, the engaging portion 14 is provided at a specific position on the outer frame portion 12 in accordance with the type and shape and size of the semiconductor device 20 to be stored. For example, as shown in FIG. 2A, in a tray 10A for storing a first type of semiconductor device, an engaging portion 14A is provided on the outer frame portion 12 on the right side in the drawing, and FIG. As shown in FIG. 2, in the tray 10B for storing the second type of semiconductor device, an engaging portion 14B is provided near the center of the outer frame 12 in the drawing, and as shown in FIG.
In the tray 10C for storing the semiconductor devices of the type (1), an engaging portion (14C) is provided on the outer frame portion (12) on the left side in the drawing.

As described above, by providing a configuration in which the installation positions of the engaging portions are changed in accordance with the type of the semiconductor device to be stored, a tray for storing the same type of semiconductor device can be used as shown in FIG. As shown in a) and (b), the engaging portions 14 of the trays 101, 102, 103 are mutually engaged.
The positions of 1, 142 and 143 match, and tray 101,
In the recesses of the engaging portions 141 and 142 of the
The convex portions of the engaging portions 142 and 143 of the second and the third 103 are sequentially engaged with each other so that they closely contact each other without forming a gap.

On the other hand, in a tray for storing different types of semiconductor devices, as shown in FIGS. 4A and 4B, engagement portions 141 and 142 between the trays 101 and 102 are formed.
And the projections 142a of the engaging portions 142 of the tray 102 abut on the lower surface of the outer frame portion 12 where the engaging portions (recesses) of the tray 101 are not formed, and a gap is generated. , 102 do not overlap. Further, even in the case of a tray for storing the same type of semiconductor device, when the direction of superposition is reversed by 180 °, as shown in FIGS.
The position of the engaging portions 141 and 142 between the first and second 102 is 180
The projections 142a of the engaging portions 142 of the tray 102 abut against the lower surface of the outer frame portion 12 on which the engaging portions (recesses) of the tray 101 are not formed because they do not coincide with each other. 101 and 102 do not overlap each other.

Therefore, in the article storage member according to the present embodiment, after the predetermined semiconductor devices are stored in the storage section, the trays are superimposed on each other, and the superimposed state (engaged state) is visually observed or mechanically. In this way, it is possible to judge instantly whether different types of trays are mixed, or even if the same type of trays are inverted and superimposed, the packaging and shipping of semiconductor devices Can be performed with good workability.
The height of the engaging portion is equal to or lower than the uppermost surface of the tray, so that when the trays are stacked and packed and shipped, the uppermost tray engaging portion is formed. It can be prevented from protruding and hindering the packing and shipping operations.

The structure of the engaging portion applied to the article storage member according to the present invention is not limited to the above-described embodiment. In short, the structure has a convex surface on the upper surface side of the tray.
Any other configuration having a concave surface on the lower surface side as long as the protruding portion and the concave portion of the engaging portion are engaged between the trays of the same type and the trays are closely adhered and overlapped Needless to say, it may have the following. less than,
Another configuration example of the engaging portion applied to the article storage member according to the present invention will be described. FIG. 6 is a main part configuration diagram showing another embodiment of the engaging portion applied to the article storage member according to the present invention. Here, the same components as those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted.

As shown in FIG. 6A, the engaging portion applied to the tray according to the present embodiment has a convex portion 14a having a curved surface on the upper surface side of the tray 10, and also has a curved surface on the lower surface side. As shown in FIG. 6B, a configuration having a concave portion 14b
A configuration having a trapezoidal convex portion 14a on the upper surface side of the tray 10 and a trapezoidal concave portion 14b on the lower surface side, or an acute angle on the upper surface side of the tray 10 as shown in FIG. A configuration in which a plurality of (two in FIG. 6) convex portions 14a are continuous and a plurality of concave portions 14b having an acute angle on the lower surface side can be provided. Also, in any of the configurations of the engaging portions shown in FIGS. 1 and 6, as shown in FIG.
A configuration in which the ridge portion of the convex portion 14a is inclined with respect to the upper surface of the tray 10 may be adopted.

[0020]

According to the first or fourth aspect of the present invention, the engaging portion is provided at a predetermined different position for each type of article stored in the article storing member. Even in the case of an article storage member having the same, a difference occurs in the position of the engaging portion and the overlapping state of the article storage members depending on the type of the article and the direction of the article storage member. Therefore, based on the superimposed state of the article storage members, it is possible to instantaneously determine whether different kinds of trays are mixed or whether the same kind of trays are inverted and stacked. In addition, semiconductor device packing and shipping operations can be performed with good workability.

According to the second aspect of the present invention, since the storage section of the article storage member has a plurality of storage spaces formed in a matrix, the plurality of storage spaces are electrically connected to each other. The semiconductor device for which the characteristic measurement inspection has been completed can be housed, and can be favorably applied to ordinary semiconductor device packaging and shipping operations. According to the third aspect of the present invention, the engagement portion provided on the article storage member has a configuration provided at a predetermined position on the outer frame portion according to the type of the article to be stored. Only in the article storage members that store the same type of articles, the engaging portions are engaged with each other and can be closely adhered and overlapped, and different types of trays are mixed based on the overlapping state of the article storage members. Or the same type of tray,
It is possible to determine whether or not they are overlaid and inverted, and it is possible to suppress the occurrence of defects.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram illustrating an embodiment of an article storage member according to the present invention.

FIG. 2 is a schematic view showing an installation position of an engagement portion applied to the tray according to the embodiment.

FIG. 3 is a schematic view showing a first overlapping state of the trays according to the embodiment.

FIG. 4 is a schematic diagram showing a second state of overlapping trays according to the embodiment;

FIG. 5 is a schematic diagram showing a third state of overlapping trays according to the embodiment;

FIG. 6 is a main part configuration diagram showing another embodiment of the engaging portion applied to the article storage member according to the present invention.

FIG. 7 is a schematic view showing an example of a typical semiconductor device package.

FIG. 8 is a schematic view showing a general configuration of a tray used for storing a conventional semiconductor device.

FIG. 9 is a schematic view showing an example of an overlapping state in a conventional tray.

FIG. 10 is a schematic view showing another example of an overlapping state in a conventional tray.

[Explanation of symbols]

10, 101 to 103: tray (article storage member), 1
1 ... storage part, 11a ... storage pocket, 12 ... outer frame part, 13 ... cutout part, 14, 141-143 ... engagement part, 14a ... convex part, 14b ... concave part, 20 ... Semiconductor devices (articles)

Claims (4)

[Claims] 1. An article storage member having a storage section for storing individual articles and an outer frame formed on an outer periphery of the storage section, wherein a pair of protrusions are provided at predetermined positions of the outer frame. An article storage member provided with an engaging portion comprising a recess and a concave portion. 2. The article according to claim 1, wherein the storage section includes a plurality of storage spaces formed in a matrix, and a plurality of semiconductor devices are individually stored in the plurality of storage spaces. Storage member. 3. The engaging portion is provided at a predetermined position on the outer frame portion in accordance with the type of the article, and the engaging portion is configured to store the same type of the articles. The article storage member according to claim 1, wherein the portions are provided so as to engage with each other. 4. A method for distinguishing an article storage member having a storage section in which individual articles are stored and an outer frame formed on the outer periphery of the storage section, wherein the article storage members are overlapped with each other. The type of the article storage member and the superposition of the article storage members based on an engagement state between the engagement portions formed of a pair of protrusions and recesses provided at predetermined positions on the outer frame portion. A method for determining an article storage member, comprising determining a direction.