WO2011132243A1 - Carrier tape, package and packaging method of electronic component using same, and method for mounting electronic component packaged using same - Google Patents

Carrier tape, package and packaging method of electronic component using same, and method for mounting electronic component packaged using same Download PDF

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Publication number
WO2011132243A1
WO2011132243A1 PCT/JP2010/006460 JP2010006460W WO2011132243A1 WO 2011132243 A1 WO2011132243 A1 WO 2011132243A1 JP 2010006460 W JP2010006460 W JP 2010006460W WO 2011132243 A1 WO2011132243 A1 WO 2011132243A1
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Prior art keywords
tape
carrier tape
electronic component
top cover
recesses
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PCT/JP2010/006460
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French (fr)
Japanese (ja)
Inventor
楢岡浩喜
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パナソニック株式会社
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Publication of WO2011132243A1 publication Critical patent/WO2011132243A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • B65D75/367—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming several compartments

Definitions

  • the present invention relates to a carrier tape, and more particularly, to a carrier tape that accommodates an electronic component such as a semiconductor device, a packaging and packaging method for an electronic component using the carrier tape, and a mounting method for an electronic component packaged using the carrier tape.
  • the embossed carrier tape 101 is provided with a plurality of concave portions 103 at predetermined intervals in the longitudinal direction of the tape by pressure forming, press forming, vacuum forming or the like. ing. At one end of the embossed carrier tape 101 in the tape width direction, a plurality of feed holes 106 for feeding the embossed carrier tape 101 in the longitudinal direction of the tape are provided at predetermined intervals in the longitudinal direction of the tape.
  • the semiconductor device 102 is accommodated in each concave portion 103, and then the top cover tape 104 so as to cover the concave portion 103 on the embossed carrier tape 101 by thermocompression bonding or the like.
  • Glue Note that reference numeral 105 in the figure denotes an adhesive portion between an embossed carrier tape 101 and a top cover tape 104, which will be described later.
  • thermocompression bonding process between the embossed carrier tape 101 and the top cover tape 104 will be described with reference to FIG.
  • the top cover tape 104 is placed on the embossed carrier tape 101, and then the both ends of the concave portion 103 in the tape width direction are pressed by the pressing portions 108 of the thermocompression bonding jig 107.
  • the adhesive part 105 is formed by thermocompression bonding in the vicinity of the part along the longitudinal direction of the tape.
  • the top cover tape 104 is wound on a transporting reel 109 and shipped in cardboard.
  • the embossed taping package when mounting the semiconductor device 102, the embossed taping package sends out the embossed carrier tape 101 from the transport reel 109 through the feed hole 106 and peels off the top cover tape 104, and then removes the semiconductor device 102. Mounted on a printed wiring board (Printed Wiring Board: PWB). For this reason, embossed taping packaging can speed up the mounting process more than tray packaging or magazine packaging, and has recently been widely used as a shipment form of semiconductor devices.
  • PWB Print Wiring Board
  • the peripheral portion of the recess formed in the embossed carrier tape is curved due to the method of forming the recess, the material of the embossed carrier tape, etc., and the flatness is impaired. .
  • the peripheral portion of the recess does not follow the pressing portion due to the above-mentioned curve, so the heat and pressure from the thermocompression bonding jig. Is not fully communicated.
  • the peripheral part of the recessed part and top cover tape in an embossed carrier tape are not adhere
  • the embossed carrier tape is fed from the transport reel through the feed hole and the top cover tape is peeled off, and when the semiconductor device is taken out, the variation in peel strength of the top cover tape is large and unstable. Therefore, there is a possibility that the semiconductor device jumps out and protrudes from the recess. For this reason, the problem that a semiconductor device cannot be taken out favorably by adsorption etc. by mounting equipment etc. arises.
  • the present invention has been made in view of the above problems, and an object of the present invention is to obtain a carrier tape capable of stably storing electronic components and stably mounting the stored electronic components. There is.
  • the present invention is configured such that the carrier tape is provided with a slit portion in the vicinity of the concave portion for accommodating the electronic component.
  • the carrier tape according to the present invention includes a tape body having a plurality of recesses that are provided at predetermined intervals in the longitudinal direction and each of which can accommodate an electronic component, and the tape body includes a plurality of recesses.
  • a slit portion is formed in the vicinity of the end portion in the width direction of the tape.
  • the carrier tape according to the present invention since the slit portion is provided in the vicinity of the width direction of the tape of the plurality of recesses, the curvature generated in the peripheral portion of the recess is suppressed, so that the electronic component is accommodated in a stable state. be able to.
  • At least one slit portion is provided in the vicinity of both end portions in the tape width direction of each concave portion in the tape body.
  • the slit portion is provided in the vicinity of either one of both end portions in the tape width direction of each concave portion in the tape body, and the slit portion provided in the vicinity of the adjacent concave portions is
  • the recesses may be provided alternately in the width direction of the different tapes.
  • the slit portion preferably extends in the longitudinal direction of the tape body.
  • the slit portion may extend in the width direction of the tape body.
  • An electronic component package according to the present invention includes a carrier tape according to the present invention in which an electronic component is accommodated in each recess of the tape body, and a top cover tape that is bonded on the tape body so as to cover each recess. And.
  • the electronic component packaging method includes a step (a) of housing the electronic component in each recess provided in the tape body of the carrier tape according to the present invention, and a step of the tape body after the step (a). There are provided a step (b) of adhering a top cover tape so as to cover each concave portion and a step (c) of winding the carrier tape around a transport reel after the step (b).
  • the electronic component mounting method includes a step of pulling out the carrier tape from a packaged state in which the electronic component package according to the present invention is wound around a transport reel, and after removing the top cover tape, from each recess. And sequentially taking out the electronic components.
  • the curvature generated in the peripheral portion of the concave portion of the carrier tape is suppressed.
  • the electronic components can be stored stably. In addition, this can prevent the electronic components from jumping out and protruding during mounting, so that the electronic components can be taken out sequentially in a favorable manner.
  • FIG. 1 (a) to FIG. 1 (d) show a configuration of embossed taping packaging using a carrier tape according to an embodiment of the present invention
  • FIG. 1 (a) is a plan view
  • FIG. 1A is a cross-sectional view taken along line Ib-Ib in FIG. 1A
  • FIG. 1C is a cross-sectional view taken along line Ic-Ic in FIG. 1A
  • FIG. It is sectional drawing in the Id-Id line.
  • 2 (a) and 2 (b) show a process of thermocompression bonding a top cover tape according to an embodiment of the present invention to a carrier tape
  • FIG. 2 (a) is a front view
  • FIG. 3 is a perspective view showing a transport reel of embossed taping packaging according to an embodiment of the present invention.
  • 4 (a) to 4 (d) show a configuration of embossed taping packaging using a carrier tape according to a first modification of one embodiment of the present invention
  • FIG. 4 (a) is a plan view.
  • 4 (b) is a sectional view taken along the line IVb-IVb in FIG. 4 (a)
  • FIG. 4 (c) is a sectional view taken along the line IVc-IVc in FIG. 4 (a)
  • FIG. FIG. 4A is a sectional view taken along line IVd-IVd in FIG.
  • FIG. 5 (a) to 5 (d) show a configuration of embossed taping packaging using a carrier tape according to a second modification of the embodiment of the present invention
  • FIG. 5 (a) is a plan view
  • 5 (b) is a cross-sectional view taken along line Vb-Vb in FIG. 5 (a)
  • FIG. 5 (c) is a cross-sectional view taken along line Vc-Vc in FIG. 5 (a)
  • FIG. 5A is a cross-sectional view taken along line Vd-Vd in FIG. 6 (a) to 6 (d) show a configuration of embossed taping packaging using a carrier tape according to a third modification of the embodiment of the present invention
  • FIG. 6 (a) is a plan view.
  • FIG. 6 (b) is a cross-sectional view taken along line VIb-VIb in FIG. 6 (a)
  • FIG. 6 (c) is a cross-sectional view taken along line VIc-VIc in FIG. 6 (a)
  • FIG. It is sectional drawing in the -VId line. 7 (a) to 7 (d) show a configuration of embossed taping packaging using a conventional carrier tape
  • FIG. 7 (a) is a plan view
  • FIG. 7 (b) is a plan view of FIG. 7 (a)
  • FIG. 7C is a sectional view taken along line VIIc-VIIc in FIG. 7A
  • FIG. 7D is a sectional view taken along line VIId-VIId in FIG. 7A.
  • FIG. 8A and 8B show a process of thermocompression bonding a conventional top cover tape to a carrier tape
  • FIG. 8A is a front view
  • FIG. 8B is a side view
  • FIG. 9 is a perspective view showing a conventional transport reel for embossed taping packaging.
  • the embossed carrier tape 11 has a plurality of recesses 13 at predetermined intervals in the longitudinal direction of the tape by pressure forming, press forming, vacuum forming or the like. Is provided. At one end of the embossed carrier tape 11 in the width direction of the tape, a plurality of feed holes 16 for feeding the embossed carrier tape 11 in the longitudinal direction of the tape are provided at predetermined intervals in the longitudinal direction of the tape. Two slit portions 20 each extending in the longitudinal direction of the tape are formed in the vicinity of both end portions in the width direction of the tape in each recess 13 of the embossed carrier tape 11.
  • each recessed portion 13 is formed on the embossed carrier tape 11 by thermocompression bonding or the like.
  • the top cover tape 14 is bonded so as to cover it.
  • reference numeral 15 in the figure denotes an adhesive portion between the embossed carrier tape 11 and the top cover tape 14 described later.
  • the two slit portions 20 provided at both end portions of each concave portion 13 in the width direction of the tape are formed so as to sandwich the adhesive portion 15.
  • thermocompression bonding process between the embossed carrier tape 11 and the top cover tape 14 will be described with reference to FIG.
  • a top cover tape 14 is placed on the embossed carrier tape 11, and thereafter both ends of the recess 13 in the width direction of the tape are pressed by the pressing portions 18 of the thermocompression bonding jig 17.
  • the adhesive portions 15 are formed by thermocompression of the vicinity of the portions along the longitudinal direction of the tape.
  • the two slit portions 20 are formed in the vicinity of both end portions of the recess 13 in the width direction of the tape, the region sandwiched between the slit portions 20 is curved in the embossed carrier tape 11. It is cut off from the part and becomes flat.
  • the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded, the flat region sandwiched between the two slit portions 20 is formed by the pressing portion 18 of the thermocompression bonding jig 17 in the longitudinal direction of the tape. , The heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15.
  • the adhesive part 15 formed in this way is continuous without interruption.
  • a packaging body in which a top cover tape 14 is bonded onto an embossed carrier tape 11 in which a semiconductor device 12 is accommodated in each recess 13 is wound around a transport reel 19, and in this state, a cardboard To be housed and shipped.
  • the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like using a mounting facility or the like, and mounted on a printed wiring board (PWB) or the like.
  • PWB printed wiring board
  • an embossed carrier tape is used as an example, but a punch carrier type such as plastic and paper may be used.
  • a punch carrier type such as plastic and paper
  • the semiconductor device is exemplified as the electronic component, a chip component other than the semiconductor device may be used.
  • the curvature generated in the peripheral portion of the concave portion of the carrier tape Since it can suppress, an electronic component can be accommodated stably. Moreover, since the connection part of a carrier tape and a top cover tape becomes continuous, the dispersion
  • a plurality of recesses 13 provided in the embossed carrier tape 11 are in the vicinity of both ends in the width direction of the tape and between the adhesive portion 15 and the recesses 13.
  • Each of the slit portions 20 extending in the longitudinal direction of the tape is formed.
  • the embossed carrier tape 11 and the top cover tape 14 containing the semiconductor device 12 are thermocompression bonded by a thermocompression bonding process, and then wound on the transport reel 19. In this state, it is housed in cardboard or the like and shipped.
  • the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like and mounted on a PWB or the like.
  • the region in the vicinity of each slit portion 20 is flat. Further, when the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded by the thermocompression bonding jig 17, the flat area in the vicinity of each slit portion 20 extends to the pressing portion 18 along the longitudinal direction of the tape. By being pushed, the heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15.
  • the adhesive part 15 formed in this way is continuous without interruption.
  • the slit portion 20 is given as an example in which the slit portion 20 in the embossed carrier tape 11 is formed in the vicinity of both ends in the width direction of the tape and between the adhesive portion 15 and the concave portion 13. 15 and the end of the embossed carrier tape 11 may be formed.
  • the embossed carrier tape is taken as an example, but a punch carrier type such as plastic and paper may be used.
  • a punch carrier type such as plastic and paper
  • the semiconductor device is exemplified as the electronic component, a chip component other than the semiconductor device may be used.
  • the carrier tape according to the first modification of the embodiment of the present invention the electronic component packaging body and packaging method using the carrier tape, and the mounting method of the electronic component packaged using the carrier tape, the periphery of the recess of the carrier tape Since the curvature generated in the portion can be suppressed, the electronic component can be stably accommodated. Moreover, since the connection part of a carrier tape and a top cover tape becomes continuous, the dispersion
  • the length of the tape Two slit portions 20 extending in the direction are formed.
  • the two slit portions 20 provided at both ends of each recess 13 in the width direction of the tape are formed so as to sandwich the adhesive portion 15 as in the embodiment.
  • the slit portions 20 formed in the vicinity of the adjacent recesses 13 are formed in the tape width direction in which the recesses 13 are different. That is, each slit portion 20 is provided alternately at one end and the other end of the recess 13.
  • the two slit parts 20 are formed in the vicinity of each recessed part 13, one may be sufficient.
  • the embossed carrier tape 11 and the top cover tape 14 containing the semiconductor device 12 are thermocompression bonded by a thermocompression bonding process, and then wound on the transport reel 19. In this state, it is housed in cardboard or the like and shipped.
  • the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like and mounted on a PWB or the like.
  • the slit portions 20 are alternately formed in the vicinity of the end portion of the concave portion 13 in the width direction of the tape, the region in the vicinity of each slit portion 20 becomes flat. Further, when the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded by the thermocompression bonding jig 17, the flat area in the vicinity of each slit portion 20 extends to the pressing portion 18 along the longitudinal direction of the tape. By being pushed, heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15. In the adhesive portion 15 formed in this way, the interrupted portion is reduced and the continuous portion is increased.
  • the embossed carrier tape is taken as an example, but a punch carrier type such as plastic and paper may be used.
  • a punch carrier type such as plastic and paper
  • the semiconductor device is exemplified as the electronic component, a chip component other than the semiconductor device may be used.
  • the carrier tape according to the second modification of the embodiment of the present invention the electronic component packaging body and packaging method using the carrier tape, and the mounting method for the electronic component packaged using the carrier tape, the periphery of the concave portion of the carrier tape Since the curvature generated in the portion can be suppressed, the electronic component can be stably accommodated. Moreover, since the part where the connection part of a carrier tape and a top cover tape becomes continuous increases, the dispersion
  • one slit extending in the width direction of the tape in the vicinity of both end portions in the width direction of the plurality of recesses 13 provided in the embossed carrier tape 11 Each part 20 is formed.
  • One slit portion 20 is formed at each end of the concave portion 13 in the width direction of the tape, but a plurality of slit portions 20 may be formed.
  • the recess 13 may be formed in the vicinity of either one of both end portions of the tape in the width direction. In this case, in the vicinity of the adjacent recesses 13.
  • the slit portions 20 formed in each are formed in the width direction of the tape with the different recesses 13.
  • the embossed carrier tape 11 and the top cover tape 14 containing the semiconductor device 12 are thermocompression bonded by a thermocompression bonding process, and then wound on the transport reel 19. In this state, it is housed in cardboard or the like and shipped.
  • the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like and mounted on a PWB or the like.
  • the region in the vicinity of each slit portion 20 is flat. Further, when the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded by the thermocompression bonding jig 17, the flat area in the vicinity of each slit portion 20 extends to the pressing portion 18 along the longitudinal direction of the tape. By being pushed, the heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15. In the adhesive portion 15 formed in this way, the interrupted portion is reduced and the continuous portion is increased.
  • the embossed carrier tape is given as an example.
  • a punch carrier type such as plastic and paper may be used
  • a semiconductor device is exemplified as an electronic component.
  • a chip component or the like may be used.
  • the carrier tape according to the third modification of the embodiment of the present invention the electronic component packaging body and packaging method using the carrier tape, and the mounting method of the electronic component packaged using the carrier tape, the periphery of the concave portion of the carrier tape Since the curvature generated in the portion can be suppressed, the electronic component can be stably accommodated. Moreover, since the part where the connection part of a carrier tape and a top cover tape becomes continuous increases, the dispersion
  • a carrier tape according to the present invention, a packaging body and packaging method for an electronic component using the carrier tape, and a mounting method for an electronic component packaged using the carrier tape can stably accommodate the electronic component, and
  • a carrier tape that can accommodate electronic components such as semiconductor devices, a packaging body and packaging method for electronic components using the same, and a mounting method for electronic components packaged using the same can be prevented. Etc. are useful.

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Abstract

The disclosed carrier tape is provided with a tape body having a plurality of concavities (13) that are provided leaving a predetermined spacing in the lengthwise direction and that can each house an electronic component. Slit sections (20) are formed to the tape body at the vicinity of the edges of the plurality of concavities (13) in the widthwise direction of the tape.

Description

キャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法Carrier tape, electronic component packaging body and packaging method using the same, and electronic component packaging method packaged using the same
　本発明は、キャリアテープに関し、特に、半導体装置等の電子部品を収容するキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法に関する。 The present invention relates to a carrier tape, and more particularly, to a carrier tape that accommodates an electronic component such as a semiconductor device, a packaging and packaging method for an electronic component using the carrier tape, and a mounting method for an electronic component packaged using the carrier tape.
　一般に、半導体装置等の電子部品の包装には、取り扱いが容易で且つ電子部品の実装効率が良好なキャリアテープを用いたテーピング包装が多く用いられている。なかでも、特に、半導体装置を収容するための凹部が列けられたエンボスキャリアテープを用いたエンボステーピング包装が主流である（例えば、特許文献１等を参照。）。 Generally, for packaging electronic components such as semiconductor devices, taping packaging using a carrier tape that is easy to handle and has good mounting efficiency of electronic components is often used. In particular, embossed taping packaging using an embossed carrier tape in which recesses for housing semiconductor devices are arranged is mainly used (see, for example, Patent Document 1).
　従来のエンボスキャリアテープ及びエンボステーピング包装について図７を参照しながら説明する。 A conventional embossed carrier tape and embossed tape packaging will be described with reference to FIG.
　図７（ａ）～（ｄ）に示すように、エンボスキャリアテープ１０１には、圧空成形、プレス成形又は真空成形等により、テープの長手方向に所定の間隔をおいて複数の凹部１０３が設けられている。エンボスキャリアテープ１０１におけるテープの幅方向の一端部には、エンボスキャリアテープ１０１をテープの長手方向に送るための複数の送り穴１０６がテープの長手方向に所定の間隔をおいて設けられている。エンボスキャリアテープ１０１を用いて半導体装置１０２を包装する場合、各凹部１０３に半導体装置１０２を収容し、その後、熱圧着等によりエンボスキャリアテープ１０１の上に各凹部１０３を覆うようにトップカバーテープ１０４を接着する。なお、図中の符号１０５は、後に説明するエンボスキャリアテープ１０１とトップカバーテープ１０４との接着部である。 As shown in FIGS. 7A to 7D, the embossed carrier tape 101 is provided with a plurality of concave portions 103 at predetermined intervals in the longitudinal direction of the tape by pressure forming, press forming, vacuum forming or the like. ing. At one end of the embossed carrier tape 101 in the tape width direction, a plurality of feed holes 106 for feeding the embossed carrier tape 101 in the longitudinal direction of the tape are provided at predetermined intervals in the longitudinal direction of the tape. When packaging the semiconductor device 102 using the embossed carrier tape 101, the semiconductor device 102 is accommodated in each concave portion 103, and then the top cover tape 104 so as to cover the concave portion 103 on the embossed carrier tape 101 by thermocompression bonding or the like. Glue. Note that reference numeral 105 in the figure denotes an adhesive portion between an embossed carrier tape 101 and a top cover tape 104, which will be described later.
　次に、エンボスキャリアテープ１０１とトップカバーテープ１０４との熱圧着工程について図８を参照しながら説明する。 Next, the thermocompression bonding process between the embossed carrier tape 101 and the top cover tape 104 will be described with reference to FIG.
　図８（ａ）及び（ｂ）に示すように、エンボスキャリアテープ１０１の上にトップカバーテープ１０４を載せ、その後、熱圧着治具１０７の押圧部１０８により、凹部１０３のテープの幅方向の両端部の近傍をテープの長手方向に沿って熱圧着して接着部１０５を形成する。 As shown in FIGS. 8A and 8B, the top cover tape 104 is placed on the embossed carrier tape 101, and then the both ends of the concave portion 103 in the tape width direction are pressed by the pressing portions 108 of the thermocompression bonding jig 107. The adhesive part 105 is formed by thermocompression bonding in the vicinity of the part along the longitudinal direction of the tape.
　次に、エンボステーピング包装した後の梱包方法について図９を参照しながら説明する。 Next, the packaging method after embossed taping packaging will be described with reference to FIG.
　図９に示すように、通常、エンボスキャリアテープ１０１の上にトップカバーテープ１０４を接着した後に、これを輸送用リール１０９に巻き取った形態でダンボール等に入れて出荷する。 As shown in FIG. 9, usually, after the top cover tape 104 is bonded onto the embossed carrier tape 101, the top cover tape 104 is wound on a transporting reel 109 and shipped in cardboard.
　また、半導体装置１０２を実装する際に、エンボステーピング包装は、送り穴１０６を介して、輸送用リール１０９からエンボスキャリアテープ１０１を送り出すと共にトップカバーテープ１０４を剥がした後、半導体装置１０２を取り出し、プリント配線基板（Printed Wiring Board：ＰＷＢ）等に実装する。このため、エンボステーピング包装は、トレイ包装又はマガジン包装よりも実装工程を高速化することができるので、近年、半導体装置の出荷形態として多く用いられている。 Further, when mounting the semiconductor device 102, the embossed taping package sends out the embossed carrier tape 101 from the transport reel 109 through the feed hole 106 and peels off the top cover tape 104, and then removes the semiconductor device 102. Mounted on a printed wiring board (Printed Wiring Board: PWB). For this reason, embossed taping packaging can speed up the mounting process more than tray packaging or magazine packaging, and has recently been widely used as a shipment form of semiconductor devices.
特開平１０－１５７７６７号公報Japanese Patent Laid-Open No. 10-157767
　しかしながら、従来のエンボステーピング包装において、エンボスキャリアテープに形成された凹部の周辺部分は、凹部の成形方法及びエンボスキャリアテープの材料等に起因して、湾曲しているため平坦性が損なわれている。このような状態において、熱圧着治具によりエンボスキャリアテープとトップカバーテープとを熱圧着する場合、前記の湾曲によって凹部の周辺部分が押圧部に沿わないため、熱圧着治具からの熱及び圧力が十分に伝わらない。このため、エンボスキャリアテープにおける凹部の周辺部分とトップカバーテープとが接着されず、接着部が途切れて不連続となる。 However, in the conventional embossed tape packaging, the peripheral portion of the recess formed in the embossed carrier tape is curved due to the method of forming the recess, the material of the embossed carrier tape, etc., and the flatness is impaired. . In such a state, when the embossed carrier tape and the top cover tape are thermocompression bonded by the thermocompression bonding jig, the peripheral portion of the recess does not follow the pressing portion due to the above-mentioned curve, so the heat and pressure from the thermocompression bonding jig. Is not fully communicated. For this reason, the peripheral part of the recessed part and top cover tape in an embossed carrier tape are not adhere | attached, but an adhesion part interrupts and becomes discontinuous.
　このため、実装の際に送り穴を介して、輸送用リールからエンボスキャリアテープを送り出すと共にトップカバーテープを剥がし、半導体装置を取り出す際に、トップカバーテープの剥離強度のばらつきが大きくて不安定となるので、凹部からの半導体装置の飛び出し及びはみ出し等が起こるおそれがある。このため、実装設備等による吸着等によって半導体装置を良好に取り出すことができないという問題が生じる。 For this reason, when mounting, the embossed carrier tape is fed from the transport reel through the feed hole and the top cover tape is peeled off, and when the semiconductor device is taken out, the variation in peel strength of the top cover tape is large and unstable. Therefore, there is a possibility that the semiconductor device jumps out and protrudes from the recess. For this reason, the problem that a semiconductor device cannot be taken out favorably by adsorption etc. by mounting equipment etc. arises.
　また、凹部の周辺部分が湾曲しているため、エンボスキャリアテープの上にトップカバーテープを載せ、熱圧着治具の押圧部により熱圧着する際に振動が発生して、熱圧着工程の際に、凹部に収容した半導体装置が飛び出したり、はみ出したりするという問題も生じる。 Moreover, since the peripheral part of the concave portion is curved, vibration is generated when the top cover tape is placed on the embossed carrier tape and thermocompression bonded by the pressing part of the thermocompression bonding jig. Further, there arises a problem that the semiconductor device accommodated in the recess protrudes or protrudes.
　本発明は、前記の問題に鑑み、その目的は、電子部品を安定した状態で収容することができ、収容された電子部品の実装を安定して行うことができるキャリアテープを得られるようにすることにある。 The present invention has been made in view of the above problems, and an object of the present invention is to obtain a carrier tape capable of stably storing electronic components and stably mounting the stored electronic components. There is.
　前記の目的を達成するために、本発明はキャリアテープを、電子部品を収容する凹部の近傍にスリット部を設ける構成とする。 In order to achieve the above object, the present invention is configured such that the carrier tape is provided with a slit portion in the vicinity of the concave portion for accommodating the electronic component.
　具体的に、本発明に係るキャリアテープは、長手方向に所定の間隔をおいて設けられ、それぞれに電子部品を収容可能な複数の凹部を有するテープ本体を備え、テープ本体には、複数の凹部におけるテープの幅方向の端部の近傍にスリット部が形成されている。 Specifically, the carrier tape according to the present invention includes a tape body having a plurality of recesses that are provided at predetermined intervals in the longitudinal direction and each of which can accommodate an electronic component, and the tape body includes a plurality of recesses. A slit portion is formed in the vicinity of the end portion in the width direction of the tape.
　本発明に係るキャリアテープによると、複数の凹部のテープの幅方向の近傍にスリット部を備えているため、凹部の周辺部分に生じる湾曲が抑制されるので、電子部品を安定した状態で収容することができる。 According to the carrier tape according to the present invention, since the slit portion is provided in the vicinity of the width direction of the tape of the plurality of recesses, the curvature generated in the peripheral portion of the recess is suppressed, so that the electronic component is accommodated in a stable state. be able to.
　本発明に係るキャリアテープにおいて、スリット部は、テープ本体における各凹部のテープの幅方向の両端部のいずれの近傍にも少なくとも１つ設けられていることが好ましい。 In the carrier tape according to the present invention, it is preferable that at least one slit portion is provided in the vicinity of both end portions in the tape width direction of each concave portion in the tape body.
　本発明に係るキャリアテープにおいて、スリット部は、テープ本体における各凹部のテープの幅方向の両端部のうちのいずれか一方の近傍に設けられ、隣り合う凹部同士の近傍に設けられたスリット部は、凹部の互いに異なるテープの幅方向に交互に設けられていてもよい。 In the carrier tape according to the present invention, the slit portion is provided in the vicinity of either one of both end portions in the tape width direction of each concave portion in the tape body, and the slit portion provided in the vicinity of the adjacent concave portions is The recesses may be provided alternately in the width direction of the different tapes.
　本発明に係るキャリアテープにおいて、スリット部は、テープ本体の長手方向に延びていることが好ましい。 In the carrier tape according to the present invention, the slit portion preferably extends in the longitudinal direction of the tape body.
　本発明に係るキャリアテープにおいて、スリット部は、テープ本体の幅方向に延びていてもよい。 In the carrier tape according to the present invention, the slit portion may extend in the width direction of the tape body.
　本発明に係る電子部品の梱包体は、テープ本体の各凹部に電子部品がそれぞれ収容された、本発明に係るキャリアテープと、テープ本体の上に各凹部を覆うように接着されたトップカバーテープとを備えている。 An electronic component package according to the present invention includes a carrier tape according to the present invention in which an electronic component is accommodated in each recess of the tape body, and a top cover tape that is bonded on the tape body so as to cover each recess. And.
　本発明に係る電子部品の梱包方法は、本発明に係るキャリアテープにおけるテープ本体に設けられた各凹部に電子部品をそれぞれ収容する工程（ａ）と、工程（ａ）よりも後に、テープ本体の上に各凹部を覆うようにトップカバーテープを接着する工程（ｂ）と、工程（ｂ）よりも後に、キャリアテープを輸送用リールに巻き取る工程（ｃ）とを備えている。 The electronic component packaging method according to the present invention includes a step (a) of housing the electronic component in each recess provided in the tape body of the carrier tape according to the present invention, and a step of the tape body after the step (a). There are provided a step (b) of adhering a top cover tape so as to cover each concave portion and a step (c) of winding the carrier tape around a transport reel after the step (b).
　本発明に係る電子部品の実装方法は、本発明に係る電子部品の梱包体が輸送用リールに巻き取られた梱包状態からキャリアテープを引き出す工程と、トップカバーテープを剥がした後に、各凹部から電子部品を順次取り出す工程とを備えている。 The electronic component mounting method according to the present invention includes a step of pulling out the carrier tape from a packaged state in which the electronic component package according to the present invention is wound around a transport reel, and after removing the top cover tape, from each recess. And sequentially taking out the electronic components.
　本発明に係るキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法によると、キャリアテープの凹部の周辺部分に生じる湾曲が抑制されるため、電子部品を安定して収容できる。また、これにより、実装の際の電子部品の飛び出し及びはみ出し等を防止できるので、電子部品を良好に順次取り出すことができる。 According to the carrier tape, the electronic component packaging body and packaging method using the carrier tape according to the present invention, and the mounting method of the electronic component packaged using the same, the curvature generated in the peripheral portion of the concave portion of the carrier tape is suppressed. The electronic components can be stored stably. In addition, this can prevent the electronic components from jumping out and protruding during mounting, so that the electronic components can be taken out sequentially in a favorable manner.
図１（ａ）～図１（ｄ）は本発明の一実施形態に係るキャリアテープを用いたエンボステーピング包装の構成を示し、図１（ａ）は平面図であり、図１（ｂ）は図１（ａ）のIｂ－Iｂ線における断面図であり、図１（ｃ）は図１（ａ）のIｃ－Iｃ線における断面図であり、図１（ｄ）は図１（ａ）のIｄ－Iｄ線における断面図である。FIG. 1 (a) to FIG. 1 (d) show a configuration of embossed taping packaging using a carrier tape according to an embodiment of the present invention, FIG. 1 (a) is a plan view, and FIG. 1A is a cross-sectional view taken along line Ib-Ib in FIG. 1A, FIG. 1C is a cross-sectional view taken along line Ic-Ic in FIG. 1A, and FIG. It is sectional drawing in the Id-Id line. 図２（ａ）及び図２（ｂ）は本発明の一実施形態に係るトップカバーテープをキャリアテープに熱圧着する工程を示し、図２（ａ）は正面図であり、図２（ｂ）は側面図である。2 (a) and 2 (b) show a process of thermocompression bonding a top cover tape according to an embodiment of the present invention to a carrier tape, FIG. 2 (a) is a front view, and FIG. Is a side view. 図３は本発明の一実施形態に係るエンボステーピング包装の輸送用リールを示す斜視図である。FIG. 3 is a perspective view showing a transport reel of embossed taping packaging according to an embodiment of the present invention. 図４（ａ）～図４（ｄ）は本発明の一実施形態の第１変形例に係るキャリアテープを用いたエンボステーピング包装の構成を示し、図４（ａ）は平面図であり、図４（ｂ）は図４（ａ）のIVｂ－IVｂ線における断面図であり、図４（ｃ）は図４（ａ）のIVｃ－IVｃ線における断面図であり、図４（ｄ）は図４（ａ）のIVｄ－IVｄ線における断面図である。4 (a) to 4 (d) show a configuration of embossed taping packaging using a carrier tape according to a first modification of one embodiment of the present invention, and FIG. 4 (a) is a plan view. 4 (b) is a sectional view taken along the line IVb-IVb in FIG. 4 (a), FIG. 4 (c) is a sectional view taken along the line IVc-IVc in FIG. 4 (a), and FIG. FIG. 4A is a sectional view taken along line IVd-IVd in FIG. 図５（ａ）～図５（ｄ）は本発明の一実施形態の第２変形例に係るキャリアテープを用いたエンボステーピング包装の構成を示し、図５（ａ）は平面図であり、図５（ｂ）は図５（ａ）のVｂ－Vｂ線における断面図であり、図５（ｃ）は図５（ａ）のVｃ－Vｃ線における断面図であり、図５（ｄ）は図５（ａ）のVｄ－Vｄ線における断面図である。5 (a) to 5 (d) show a configuration of embossed taping packaging using a carrier tape according to a second modification of the embodiment of the present invention, and FIG. 5 (a) is a plan view. 5 (b) is a cross-sectional view taken along line Vb-Vb in FIG. 5 (a), FIG. 5 (c) is a cross-sectional view taken along line Vc-Vc in FIG. 5 (a), and FIG. 5A is a cross-sectional view taken along line Vd-Vd in FIG. 図６（ａ）～図６（ｄ）は本発明の一実施形態の第３変形例に係るキャリアテープを用いたエンボステーピング包装の構成を示し、図６（ａ）は平面図であり、図６（ｂ）は図６（ａ）のVIｂ－VIｂ線における断面図であり、図６（ｃ）は図６（ａ）のVIｃ－VIｃ線における断面図であり、図６（ｄ）はVIｄ－VIｄ線における断面図である。6 (a) to 6 (d) show a configuration of embossed taping packaging using a carrier tape according to a third modification of the embodiment of the present invention, and FIG. 6 (a) is a plan view. 6 (b) is a cross-sectional view taken along line VIb-VIb in FIG. 6 (a), FIG. 6 (c) is a cross-sectional view taken along line VIc-VIc in FIG. 6 (a), and FIG. It is sectional drawing in the -VId line. 図７（ａ）～図７（ｄ）は従来のキャリアテープを用いたエンボステーピング包装の構成を示し、図７（ａ）は平面図であり、図７（ｂ）は図７（ａ）のVIIｂ－VIIｂ線の断面図であり、図７（ｃ）は図７（ａ）のVIIｃ－VIIｃ線における断面図であり、図７（ｄ）は図７（ａ）のVIIｄ－VIIｄ線における断面図である。7 (a) to 7 (d) show a configuration of embossed taping packaging using a conventional carrier tape, FIG. 7 (a) is a plan view, and FIG. 7 (b) is a plan view of FIG. 7 (a). FIG. 7C is a sectional view taken along line VIIc-VIIc in FIG. 7A, and FIG. 7D is a sectional view taken along line VIId-VIId in FIG. 7A. FIG. 図８（ａ）及び図８（ｂ）は従来のトップカバーテープをキャリアテープに熱圧着する工程を示し、図８（ａ）は正面図であり、図８（ｂ）は側面図である。8A and 8B show a process of thermocompression bonding a conventional top cover tape to a carrier tape, FIG. 8A is a front view, and FIG. 8B is a side view. 図９は従来のエンボステーピング包装の輸送用リールを示す斜視図である。FIG. 9 is a perspective view showing a conventional transport reel for embossed taping packaging.
　（一実施形態）
　本発明の一実施形態に係るキャリアテープ及び電子部品の梱包体について図１を参照しながら説明する。 (One embodiment)
A carrier tape and electronic component packaging according to an embodiment of the present invention will be described with reference to FIG.
　図１（ａ）～図１（ｄ）に示すように、エンボスキャリアテープ１１には、圧空成形、プレス成形又は真空成形等により、テープの長手方向に所定の間隔をおいて複数の凹部１３が設けられている。エンボスキャリアテープ１１のテープの幅方向における一端部には、エンボスキャリアテープ１１をテープの長手方向に送るための複数の送り穴１６がテープの長手方向に所定の間隔をおいて設けられている。エンボスキャリアテープ１１の各凹部１３におけるテープの幅方向の両端部の近傍には、それぞれテープの長手方向に延びるスリット部２０が２本ずつ形成されている。エンボスキャリアテープ１１を用いて、例えば半導体装置１２のような電子部品を包装する場合、各凹部１３に半導体装置１２を収容し、その後、熱圧着等によりエンボスキャリアテープ１１の上に各凹部１３を覆うようにトップカバーテープ１４を接着する。なお、図中の符号１５は、後に説明するエンボスキャリアテープ１１とトップカバーテープ１４との接着部である。ここで、各凹部１３のテープの幅方向の両端部に設けられた２本のスリット部２０は、接着部１５を挟むように形成されている。 As shown in FIGS. 1 (a) to 1 (d), the embossed carrier tape 11 has a plurality of recesses 13 at predetermined intervals in the longitudinal direction of the tape by pressure forming, press forming, vacuum forming or the like. Is provided. At one end of the embossed carrier tape 11 in the width direction of the tape, a plurality of feed holes 16 for feeding the embossed carrier tape 11 in the longitudinal direction of the tape are provided at predetermined intervals in the longitudinal direction of the tape. Two slit portions 20 each extending in the longitudinal direction of the tape are formed in the vicinity of both end portions in the width direction of the tape in each recess 13 of the embossed carrier tape 11. For example, when packaging an electronic component such as the semiconductor device 12 using the embossed carrier tape 11, the semiconductor device 12 is accommodated in each recessed portion 13, and then each recessed portion 13 is formed on the embossed carrier tape 11 by thermocompression bonding or the like. The top cover tape 14 is bonded so as to cover it. Note that reference numeral 15 in the figure denotes an adhesive portion between the embossed carrier tape 11 and the top cover tape 14 described later. Here, the two slit portions 20 provided at both end portions of each concave portion 13 in the width direction of the tape are formed so as to sandwich the adhesive portion 15.
　次に、エンボスキャリアテープ１１とトップカバーテープ１４との熱圧着工程について図２を参照しながら説明する。 Next, the thermocompression bonding process between the embossed carrier tape 11 and the top cover tape 14 will be described with reference to FIG.
　図２（ａ）及び（ｂ）に示すように、エンボスキャリアテープ１１の上にトップカバーテープ１４を載せ、その後、熱圧着治具１７の押圧部１８により、凹部１３のテープの幅方向の両端部の近傍をテープの長手方向に沿って熱圧着して接着部１５をそれぞれ形成する。 As shown in FIGS. 2A and 2B, a top cover tape 14 is placed on the embossed carrier tape 11, and thereafter both ends of the recess 13 in the width direction of the tape are pressed by the pressing portions 18 of the thermocompression bonding jig 17. The adhesive portions 15 are formed by thermocompression of the vicinity of the portions along the longitudinal direction of the tape.
　これらの構成によると、凹部１３のテープの幅方向の両端部の近傍にそれぞれ２本のスリット部２０が形成されているため、スリット部２０同士に挟まれた領域は、エンボスキャリアテープ１１の湾曲部から切り離されて平坦となる。また、エンボスキャリアテープ１１とトップカバーテープ１４とを熱圧着する際に、２本のスリット部２０同士に挟まれて平坦となった領域が熱圧着治具１７の押圧部１８によってテープの長手方向に沿って押されることにより、熱圧着治具１７からの熱及び圧力が十分に伝わって接着部１５が形成される。このように形成された接着部１５は、途切れることなく連続となる。 According to these configurations, since the two slit portions 20 are formed in the vicinity of both end portions of the recess 13 in the width direction of the tape, the region sandwiched between the slit portions 20 is curved in the embossed carrier tape 11. It is cut off from the part and becomes flat. In addition, when the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded, the flat region sandwiched between the two slit portions 20 is formed by the pressing portion 18 of the thermocompression bonding jig 17 in the longitudinal direction of the tape. , The heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15. The adhesive part 15 formed in this way is continuous without interruption.
　次に、熱圧着工程の後に行う電子部品の梱包方法及び電子部品の実装方法について図３を参照しながら説明する。 Next, an electronic component packaging method and an electronic component mounting method performed after the thermocompression bonding step will be described with reference to FIG.
　図３に示すように、各凹部１３に半導体装置１２がそれぞれ収容されたエンボスキャリアテープ１１の上にトップカバーテープ１４が接着している梱包体を輸送用リール１９に巻き取り、この状態でダンボール等に収容して出荷する。 As shown in FIG. 3, a packaging body in which a top cover tape 14 is bonded onto an embossed carrier tape 11 in which a semiconductor device 12 is accommodated in each recess 13 is wound around a transport reel 19, and in this state, a cardboard To be housed and shipped.
　その後、半導体装置１２を実装する際に、送り穴１６を介して、輸送用リール１９からエンボスキャリアテープ１１を送り出すと共にトップカバーテープ１４を剥がす。続いて、凹部１３から半導体装置１２を実装設備等による吸着等によって順次取り出し、プリント配線基板（ＰＷＢ）等に実装する。 Thereafter, when the semiconductor device 12 is mounted, the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like using a mounting facility or the like, and mounted on a printed wiring board (PWB) or the like.
　一実施形態においては、エンボスキャリアテープを一例として挙げたが、プラスチック及び紙等のパンチキャリアタイプ等でもよい。また、電子部品として半導体装置を例に挙げたが、半導体装置以外のチップ部品等でもよい。 In one embodiment, an embossed carrier tape is used as an example, but a punch carrier type such as plastic and paper may be used. Further, although the semiconductor device is exemplified as the electronic component, a chip component other than the semiconductor device may be used.
　本発明の一実施形態に係るキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法によると、キャリアテープの凹部の周辺部分に生じる湾曲を抑制できるため、電子部品を安定して収容できる。また、キャリアテープとトップカバーテープとの接続部が連続となるため、トップカバーテープの剥離強度のばらつきを防ぐことができる。このため、実装の際の電子部品の飛び出し及びはみ出し等を防止できるので、電子部品を良好に順次取り出すことができる。 According to the carrier tape, the electronic component packaging body and the packaging method using the carrier tape, and the packaging method for the electronic component packaged using the carrier tape according to the embodiment of the present invention, the curvature generated in the peripheral portion of the concave portion of the carrier tape Since it can suppress, an electronic component can be accommodated stably. Moreover, since the connection part of a carrier tape and a top cover tape becomes continuous, the dispersion | variation in the peeling strength of a top cover tape can be prevented. For this reason, it is possible to prevent the electronic components from popping out and sticking out during mounting, so that the electronic components can be taken out sequentially in a favorable manner.
　（一実施形態の第１変形例）
　以下、本発明の一実施形態の第１変形例に係るキャリアテープ及び電子部品の梱包体について図４を参照しながら説明する。本変形例において、一実施形態と異なる部分について説明し、同一の部分については説明を省略する。 (First Modification of One Embodiment)
Hereinafter, a carrier tape and a packaging body for electronic components according to a first modification of one embodiment of the present invention will be described with reference to FIG. In this modification, a different part from 1 embodiment is demonstrated, and description is abbreviate | omitted about the same part.
　図４（ａ）～図４（ｄ）に示すように、エンボスキャリアテープ１１に設けられた複数の凹部１３のテープの幅方向の両端部の近傍で且つ接着部１５と凹部１３との間に、テープの長手方向に延びる１本のスリット部２０がそれぞれ形成されている。 As shown in FIGS. 4A to 4D, a plurality of recesses 13 provided in the embossed carrier tape 11 are in the vicinity of both ends in the width direction of the tape and between the adhesive portion 15 and the recesses 13. Each of the slit portions 20 extending in the longitudinal direction of the tape is formed.
　本変形例においても、一実施形態と同様に、熱圧着工程により、半導体装置１２を収容したエンボスキャリアテープ１１とトップカバーテープ１４とを熱圧着し、その後、これを輸送用リール１９に巻き取り、この状態でダンボール等に収容して出荷する。また、半導体装置１２を実装する際に、送り穴１６を介して、輸送用リール１９からエンボスキャリアテープ１１を送り出すと共にトップカバーテープ１４を剥がす。続いて、凹部１３から半導体装置１２を吸着等によって順次取り出し、ＰＷＢ等に実装する。 Also in this modification, as in the embodiment, the embossed carrier tape 11 and the top cover tape 14 containing the semiconductor device 12 are thermocompression bonded by a thermocompression bonding process, and then wound on the transport reel 19. In this state, it is housed in cardboard or the like and shipped. When the semiconductor device 12 is mounted, the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like and mounted on a PWB or the like.
　これらの構成によると、凹部１３のテープの幅方向の両端部の近傍に１本のスリット部２０が形成されているため、各スリット部２０の近傍の領域は平坦となる。また、熱圧着治具１７により、エンボスキャリアテープ１１とトップカバーテープ１４とを熱圧着する際に、各スリット部２０の近傍の平坦となった領域が押圧部１８にテープの長手方向に沿って押されることによって、熱圧着治具１７からの熱及び圧力が十分に伝わって接着部１５が形成される。このように形成された接着部１５は、途切れることなく連続となる。 According to these configurations, since one slit portion 20 is formed in the vicinity of both end portions of the concave portion 13 in the tape width direction, the region in the vicinity of each slit portion 20 is flat. Further, when the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded by the thermocompression bonding jig 17, the flat area in the vicinity of each slit portion 20 extends to the pressing portion 18 along the longitudinal direction of the tape. By being pushed, the heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15. The adhesive part 15 formed in this way is continuous without interruption.
　第１変形例においては、スリット部２０をエンボスキャリアテープ１１における凹部１３のテープの幅方向の両端部の近傍で且つ接着部１５と凹部１３との間に形成した一例として挙げたが、接着部１５とエンボスキャリアテープ１１の端部との間に形成してもよい。 In the first modification, the slit portion 20 is given as an example in which the slit portion 20 in the embossed carrier tape 11 is formed in the vicinity of both ends in the width direction of the tape and between the adhesive portion 15 and the concave portion 13. 15 and the end of the embossed carrier tape 11 may be formed.
　一実施形態の第１変形例では、エンボスキャリアテープを一例として挙げたが、プラスチック及び紙等のパンチキャリアタイプ等でもよい。また、電子部品として半導体装置を例に挙げたが、半導体装置以外のチップ部品等でもよい。 In the first modification of the embodiment, the embossed carrier tape is taken as an example, but a punch carrier type such as plastic and paper may be used. Further, although the semiconductor device is exemplified as the electronic component, a chip component other than the semiconductor device may be used.
　本発明の一実施形態の第１変形例に係るキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法によると、キャリアテープの凹部の周辺部分に生じる湾曲を抑制できるため、電子部品を安定して収容できる。また、キャリアテープとトップカバーテープとの接続部が連続となるため、トップカバーテープの剥離強度のばらつきを防ぐことができる。このため、実装の際の電子部品の飛び出し及びはみ出し等を防止できるので、電子部品を良好に順次取り出すことができる。 According to the carrier tape according to the first modification of the embodiment of the present invention, the electronic component packaging body and packaging method using the carrier tape, and the mounting method of the electronic component packaged using the carrier tape, the periphery of the recess of the carrier tape Since the curvature generated in the portion can be suppressed, the electronic component can be stably accommodated. Moreover, since the connection part of a carrier tape and a top cover tape becomes continuous, the dispersion | variation in the peeling strength of a top cover tape can be prevented. For this reason, it is possible to prevent the electronic components from popping out and sticking out during mounting, so that the electronic components can be taken out sequentially in a favorable manner.
　（一実施形態の第２変形例）
　以下、本発明の一実施形態の第２変形例に係るキャリアテープ及び電子部品の梱包体について図５を参照しながら説明する。本変形例において、一実施形態と異なる部分について説明し、同一の部分については説明を省略する。 (Second Modification of One Embodiment)
Hereinafter, a carrier tape and a package of electronic components according to a second modification of the embodiment of the present invention will be described with reference to FIG. In this modification, a different part from 1 embodiment is demonstrated, and description is abbreviate | omitted about the same part.
　図５（ａ）～図５（ｄ）に示すように、エンボスキャリアテープ１１に設けられた複数の凹部１３のテープの幅方向の両端部のうちのいずれか一方の近傍に、それぞれテープの長手方向に延びるスリット部２０が２本ずつ形成されている。ここで、各凹部１３のテープの幅方向の両端部に設けられた２本のスリット部２０は、一実施形態と同様に、接着部１５を挟むように形成されている。また、隣り合う凹部１３同士の近傍にそれぞれ形成されたスリット部２０同士は、凹部１３の異なるテープの幅方向に形成されている。すなわち、各スリット部２０は、凹部１３の一方の端部と他方の端部とに交互に設けられている。なお、各凹部１３の近傍には２本のスリット部２０が形成されているが、１本でもよい。 As shown in FIG. 5 (a) to FIG. 5 (d), in the vicinity of one of both end portions in the tape width direction of the plurality of recesses 13 provided in the embossed carrier tape 11, the length of the tape Two slit portions 20 extending in the direction are formed. Here, the two slit portions 20 provided at both ends of each recess 13 in the width direction of the tape are formed so as to sandwich the adhesive portion 15 as in the embodiment. In addition, the slit portions 20 formed in the vicinity of the adjacent recesses 13 are formed in the tape width direction in which the recesses 13 are different. That is, each slit portion 20 is provided alternately at one end and the other end of the recess 13. In addition, although the two slit parts 20 are formed in the vicinity of each recessed part 13, one may be sufficient.
　本変形例においても、一実施形態と同様に、熱圧着工程により、半導体装置１２を収容したエンボスキャリアテープ１１とトップカバーテープ１４とを熱圧着し、その後、これを輸送用リール１９に巻き取り、この状態でダンボール等に収容して出荷する。また、半導体装置１２を実装する際に、送り穴１６を介して、輸送用リール１９からエンボスキャリアテープ１１を送り出すと共にトップカバーテープ１４を剥がす。続いて、凹部１３から半導体装置１２を吸着等によって順次取り出し、ＰＷＢ等に実装する。 Also in this modification, as in the embodiment, the embossed carrier tape 11 and the top cover tape 14 containing the semiconductor device 12 are thermocompression bonded by a thermocompression bonding process, and then wound on the transport reel 19. In this state, it is housed in cardboard or the like and shipped. When the semiconductor device 12 is mounted, the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like and mounted on a PWB or the like.
　これらの構成によると、凹部１３のテープの幅方向の端部の近傍にスリット部２０が交互に形成されているため、各スリット部２０の近傍の領域は平坦となる。また、熱圧着治具１７により、エンボスキャリアテープ１１とトップカバーテープ１４とを熱圧着する際に、各スリット部２０の近傍の平坦となった領域が押圧部１８にテープの長手方向に沿って押されることによって、熱圧着治具１７からの熱及び圧力が十分に伝って接着部１５が形成される。このように形成された接着部１５は、途切れる部分が減少し、連続となる部分が増大する。 According to these configurations, since the slit portions 20 are alternately formed in the vicinity of the end portion of the concave portion 13 in the width direction of the tape, the region in the vicinity of each slit portion 20 becomes flat. Further, when the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded by the thermocompression bonding jig 17, the flat area in the vicinity of each slit portion 20 extends to the pressing portion 18 along the longitudinal direction of the tape. By being pushed, heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15. In the adhesive portion 15 formed in this way, the interrupted portion is reduced and the continuous portion is increased.
　一実施形態の第２変形例では、エンボスキャリアテープを一例として挙げたが、プラスチック及び紙等のパンチキャリアタイプ等でもよい。また、電子部品として半導体装置を例に挙げたが、半導体装置以外のチップ部品等でもよい。 In the second modification of the embodiment, the embossed carrier tape is taken as an example, but a punch carrier type such as plastic and paper may be used. Further, although the semiconductor device is exemplified as the electronic component, a chip component other than the semiconductor device may be used.
　本発明の一実施形態の第２変形例に係るキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法によると、キャリアテープの凹部の周辺部分に生じる湾曲を抑制できるため、電子部品を安定して収容できる。また、キャリアテープとトップカバーテープとの接続部が連続となる部分が増大するため、トップカバーテープの剥離強度のばらつきを防ぐことができる。このため、実装の際の電子部品の飛び出し及びはみ出し等を防止できるので、電子部品を良好に順次取り出すことができる。 According to the carrier tape according to the second modification of the embodiment of the present invention, the electronic component packaging body and packaging method using the carrier tape, and the mounting method for the electronic component packaged using the carrier tape, the periphery of the concave portion of the carrier tape Since the curvature generated in the portion can be suppressed, the electronic component can be stably accommodated. Moreover, since the part where the connection part of a carrier tape and a top cover tape becomes continuous increases, the dispersion | variation in the peeling strength of a top cover tape can be prevented. For this reason, it is possible to prevent the electronic components from popping out and sticking out during mounting, so that the electronic components can be taken out sequentially in a favorable manner.
　（一実施形態の第３変形例）
　以下、本発明の一実施形態の第３変形例に係るキャリアテープ及び電子部品の梱包体について図６を参照しながら説明する。本変形例において、一実施形態と異なる部分について説明し、同一の部分については説明を省略する。 (Third Modification of One Embodiment)
Hereinafter, a carrier tape and a package of electronic components according to a third modification of the embodiment of the present invention will be described with reference to FIG. In this modification, a different part from 1 embodiment is demonstrated, and description is abbreviate | omitted about the same part.
　図６（ａ）～図６（ｄ）に示すように、エンボスキャリアテープ１１に設けられた複数の凹部１３のテープの幅方向の両端部の近傍に、テープの幅方向に延びる１本のスリット部２０がそれぞれ形成されている。スリット部２０は、それぞれの凹部１３のテープの幅方向の端部に１本ずつ形成されているが、複数本形成されていてもよい。また、一実施形態の第２変形例と同様に、凹部１３のテープの幅方向の両端部のうちのいずれか一方の近傍に形成されていてもよく、この場合、隣り合う凹部１３同士の近傍にそれぞれ形成されたスリット部２０同士は、凹部１３の異なるテープの幅方向に形成される。 As shown in FIGS. 6 (a) to 6 (d), one slit extending in the width direction of the tape in the vicinity of both end portions in the width direction of the plurality of recesses 13 provided in the embossed carrier tape 11 Each part 20 is formed. One slit portion 20 is formed at each end of the concave portion 13 in the width direction of the tape, but a plurality of slit portions 20 may be formed. Further, similarly to the second modification of the embodiment, the recess 13 may be formed in the vicinity of either one of both end portions of the tape in the width direction. In this case, in the vicinity of the adjacent recesses 13. The slit portions 20 formed in each are formed in the width direction of the tape with the different recesses 13.
　本変形例においても、一実施形態と同様に、熱圧着工程により、半導体装置１２を収容したエンボスキャリアテープ１１とトップカバーテープ１４とを熱圧着し、その後、これを輸送用リール１９に巻き取り、この状態でダンボール等に収容して出荷する。また、半導体装置１２を実装する際に、送り穴１６を介して、輸送用リール１９からエンボスキャリアテープ１１を送り出すと共にトップカバーテープ１４を剥がす。続いて、凹部１３から半導体装置１２を吸着等によって順次取り出し、ＰＷＢ等に実装する。 Also in this modification, as in the embodiment, the embossed carrier tape 11 and the top cover tape 14 containing the semiconductor device 12 are thermocompression bonded by a thermocompression bonding process, and then wound on the transport reel 19. In this state, it is housed in cardboard or the like and shipped. When the semiconductor device 12 is mounted, the embossed carrier tape 11 is sent out from the transport reel 19 through the feed hole 16 and the top cover tape 14 is peeled off. Subsequently, the semiconductor device 12 is sequentially taken out from the recess 13 by suction or the like and mounted on a PWB or the like.
　これらの構成によると、凹部１３のテープの幅方向の端部の近傍に１本のスリット部２０が形成されているため、各スリット部２０の近傍の領域は平坦となる。また、熱圧着治具１７により、エンボスキャリアテープ１１とトップカバーテープ１４とを熱圧着する際に、各スリット部２０の近傍の平坦となった領域が押圧部１８にテープの長手方向に沿って押されることによって、熱圧着治具１７からの熱及び圧力が十分に伝わって接着部１５が形成される。このように形成された接着部１５は、途切れる部分が減少し、連続となる部分が増大する。 According to these configurations, since one slit portion 20 is formed in the vicinity of the end of the concave portion 13 in the width direction of the tape, the region in the vicinity of each slit portion 20 is flat. Further, when the embossed carrier tape 11 and the top cover tape 14 are thermocompression bonded by the thermocompression bonding jig 17, the flat area in the vicinity of each slit portion 20 extends to the pressing portion 18 along the longitudinal direction of the tape. By being pushed, the heat and pressure from the thermocompression bonding jig 17 are sufficiently transmitted to form the bonding portion 15. In the adhesive portion 15 formed in this way, the interrupted portion is reduced and the continuous portion is increased.
　一実施形態の第３変形例では、エンボスキャリアテープを一例として挙げたが、プラスチック及び紙等のパンチキャリアタイプ等でもよく、また、電子部品として半導体装置を例に挙げたが、半導体装置以外のチップ部品等でもよい。 In the third modification of the embodiment, the embossed carrier tape is given as an example. However, a punch carrier type such as plastic and paper may be used, and a semiconductor device is exemplified as an electronic component. A chip component or the like may be used.
　本発明の一実施形態の第３変形例に係るキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法によると、キャリアテープの凹部の周辺部分に生じる湾曲を抑制できるため、電子部品を安定して収容できる。また、キャリアテープとトップカバーテープとの接続部が連続となる部分が増大するため、トップカバーテープの剥離強度のばらつきを防ぐことができる。このため、実装の際の電子部品の飛び出し及びはみ出し等を防止できるので、電子部品を良好に順次取り出すことができる。 According to the carrier tape according to the third modification of the embodiment of the present invention, the electronic component packaging body and packaging method using the carrier tape, and the mounting method of the electronic component packaged using the carrier tape, the periphery of the concave portion of the carrier tape Since the curvature generated in the portion can be suppressed, the electronic component can be stably accommodated. Moreover, since the part where the connection part of a carrier tape and a top cover tape becomes continuous increases, the dispersion | variation in the peeling strength of a top cover tape can be prevented. For this reason, it is possible to prevent the electronic components from popping out and sticking out during mounting, so that the electronic components can be taken out sequentially in a favorable manner.
　本発明に係るキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法は、電子部品を安定して収容でき、実装の際の電子部品の飛び出し及びはみ出し等を防止することができ、特に、半導体装置等の電子部品を収容するキャリアテープ、それを用いた電子部品の梱包体及び梱包方法並びにそれを用いて梱包された電子部品の実装方法等に有用である。 A carrier tape according to the present invention, a packaging body and packaging method for an electronic component using the carrier tape, and a mounting method for an electronic component packaged using the carrier tape can stably accommodate the electronic component, and In particular, a carrier tape that can accommodate electronic components such as semiconductor devices, a packaging body and packaging method for electronic components using the same, and a mounting method for electronic components packaged using the same can be prevented. Etc. are useful.
１１　エンボスキャリアテープ
１２　半導体装置
１３　凹部
１４　トップカバーテープ
１５　接着部
１６　送り穴
１７　熱接着治具
１８　押圧部
１９　輸送用リール
２０　スリット部 DESCRIPTION OF SYMBOLS 11 Embossed carrier tape 12 Semiconductor device 13 Concave part 14 Top cover tape 15 Adhesion part 16 Feed hole 17 Thermal bonding jig 18 Press part 19 Transport reel 20 Slit part

Claims (8)

  1. 　長手方向に所定の間隔をおいて設けられ、それぞれに電子部品を収容可能な複数の凹部を有するテープ本体を備え、
    　前記テープ本体には、前記複数の凹部におけるテープの幅方向の端部の近傍にスリット部が形成されているキャリアテープ。     Provided with a predetermined interval in the longitudinal direction, each having a tape body having a plurality of recesses capable of accommodating electronic components,
    A carrier tape in which a slit portion is formed in the tape main body in the vicinity of ends in the width direction of the tape in the plurality of recesses.
  2. 　請求項１において、
    　前記スリット部は、前記テープ本体における前記各凹部のテープの幅方向の両端部のいずれの近傍にも少なくとも１つ設けられているキャリアテープ。     In claim 1,
    At least one slit portion is provided in the vicinity of both end portions in the tape width direction of the respective recesses in the tape body.
  3. 　請求項１において、
    　前記スリット部は、前記テープ本体における前記各凹部のテープの幅方向の両端部のうちのいずれか一方の近傍に設けられ、
    　隣り合う前記凹部同士の近傍に設けられた前記スリット部は、前記凹部の互いに異なるテープの幅方向に交互に設けられているキャリアテープ。     In claim 1,
    The slit portion is provided in the vicinity of either one of both end portions in the tape width direction of the concave portions of the tape body,
    The said slit part provided in the vicinity of the said adjacent recessed part is a carrier tape provided alternately in the width direction of the mutually different tape of the said recessed part.
  4. 　請求項１～３のうちのいずれか１項において、
    　前記スリット部は、前記テープ本体の長手方向に延びているキャリアテープ。     In any one of claims 1 to 3,
    The slit portion is a carrier tape extending in the longitudinal direction of the tape body.
  5. 　請求項１～３のうちのいずれか１項において、
    　前記スリット部は、前記テープ本体の幅方向に延びているキャリアテープ。     In any one of claims 1 to 3,
    The slit portion is a carrier tape extending in the width direction of the tape body.
  6. 　請求項１～５のうちのいずれか１項のキャリアテープと、
    　前記テープ本体の上に前記各凹部を覆うように接着されたトップカバーテープとを備え、
    　前記テープ本体の前記各凹部に電子部品がそれぞれ収容されている電子部品の梱包体。     A carrier tape according to any one of claims 1 to 5;
    A top cover tape adhered on the tape body so as to cover the recesses;
    A package of electronic components, in which the electronic components are housed in the respective recesses of the tape body.
  7. 　請求項１～５のうちのいずれか１項に記載のキャリアテープにおける前記テープ本体に設けられた前記各凹部に電子部品をそれぞれ収容する工程（ａ）と、
    　前記工程（ａ）よりも後に、前記テープ本体の上に前記各凹部を覆うようにトップカバーテープを接着する工程（ｂ）と、
    　前記工程（ｂ）よりも後に、前記キャリアテープを輸送用リールに巻き取る工程（ｃ）とを備えている電子部品の梱包方法。     A step (a) of accommodating electronic components in each of the recesses provided in the tape body of the carrier tape according to any one of claims 1 to 5;
    After the step (a), a step (b) of adhering a top cover tape so as to cover the recesses on the tape body;
    A method for packing an electronic component comprising: (c) a step of winding the carrier tape on a transport reel after the step (b).
  8. 　請求項６に記載の電子部品の梱包体が輸送用リールに巻き取られた梱包状態から前記キャリアテープを引き出す工程と、
    　前記トップカバーテープを剥がした後に、前記各凹部から前記電子部品を順次取り出す工程とを備えている電子部品の実装方法。     A step of pulling out the carrier tape from a packaged state in which the electronic component package according to claim 6 is wound around a transport reel;
    And a step of sequentially taking out the electronic components from the recesses after peeling off the top cover tape.
PCT/JP2010/006460 2010-04-19 2010-11-02 Carrier tape, package and packaging method of electronic component using same, and method for mounting electronic component packaged using same WO2011132243A1 (en)

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JP5358510B2 (en) * 2010-04-21 2013-12-04 信越ポリマー株式会社 Embossed carrier tape, method for manufacturing the same, and packaged part wound body
JP5417250B2 (en) * 2010-04-21 2014-02-12 信越ポリマー株式会社 Embossed carrier tape, method for manufacturing the same, and packaged part wound body
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