JP2000062841A - Semiconductor device housing tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To render a cover tape to be separable partially, and enabling it to be rejoined and reused to an embossed carrier tape by providing projections on a cover tape and making holes into which the projections are fitted in a semiconductor device housing tape formed on an embossed carrier tape and a cover tape. SOLUTION: An embossed carrier tape 1 is provided with a recessed housing area into which a semiconductor device is to be housed. In order to permit the semiconductor device not to come out of the recessed area, a cover tape 3 is set thereon as a lid. In this instance, while projection structure 4 is formed on the cover tape 3, a hole structure 5 is made on the embossed carrier tape 1 so as to allow the projection structure 4 to be fitted therein. Regarding the projection structure 4, it is formed not to come off easily when fitted in the hole structure 5, and formed to come off readily when the cover tape 3 is pulled up with a constant force or more.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage container and a storage tape which is composed of an embossed carrier tape and a cover tape and which stores a semiconductor device in the tape.

[0002]

2. Description of the Related Art A conventional semiconductor device housing tape has a structure in which a cover tape is bonded and fixed to an embossed carrier tape on the side where a semiconductor device is housed by pressure bonding or welding with heat, ultrasonic waves, or the like. .

FIG. 4 is a top view of a conventional semiconductor device accommodating tape, and FIG. 5 is a sectional view of a conventional semiconductor device accommodating tape.

[0004]

However, in the above-mentioned prior art, when the semiconductor device is housed in the embossed carrier tape, the cover tape is joined, and then a particular semiconductor device is taken out, the cover tape is widely spread. , In some cases I had to strip everything.

Further, it was difficult to re-bond the stripped cover tape to the embossed carrier tape again because the alignment was difficult and the bonding conditions were different.
For this reason, the cover tape was hardly reused and was discarded.

The position of the embossed carrier tape and that of the cover tape are generally aligned at the beginning of the joining process, and if a position shift occurs during the subsequent joining process, the cover tape is adjusted by fine adjustment. It was

[0007]

In the tape for accommodating a semiconductor device according to the present invention, the cover tape is provided with a protrusion for joining, and the embossed carrier tape side is provided with a hole for fitting the protrusion. It is characterized by being

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIGS. 1, 2 and 3.

FIG. 1 is a sectional view of a tape for housing a semiconductor device,
2 and 3 are top views of the semiconductor device housing tape.

In FIG. 1, an embossed carrier tape 1
There is a concave storage area. The semiconductor device 2 is put in this recess. Further, in order to prevent the semiconductor device 2 from coming out of the concave portion, the cover tape 3 covers the semiconductor device 2. At this time, the protrusion structure 4 is provided on the cover tape 3 on the surface to be joined to the embossed carrier tape, and the embossed carrier tape 1 is provided with the hole structure 5 for fitting the protrusion structure 4 therein. The hole structure 5 is shown in FIGS.
As shown in FIG. 3, the tape is provided at both ends of the tape width so as to avoid the storage area where the semiconductor device 2 is stored and the sprocket holes 6. In FIG. 2, the number of the hole structures is symmetrical with respect to the tape width, but the tape alignment direction can be regulated by arranging the hole structures asymmetrically as shown in FIG. The matching of the tapes depends on the combination of the projection and the hole structure. Therefore, when the tapes are matched with each other, the embossed carrier tape and the cover tape are structurally unbonded.

The projection structure has a structure so that it does not come off immediately when it is fitted into the hole structure. Further, when the cover tape is pulled with a certain force or more, the cover tape is easily removed. The protrusion structure that has once come out of the hole structure can be fitted into the hole structure again. With such a structure,
The shape can be arbitrary. As a result, only the cover tape of a specific portion can be peeled off from the embossed carrier tape or re-bonded.

Further, since the projection structure has a one-to-one correspondence with the hole structure, the embossed carrier tape and the cover tape are joined together without being displaced by sequentially fitting them.

The projection and the hole structure may have a hole structure in the cover tape and a projection structure in the embossed carrier tape contrary to the above description.

[0014]

Since the present invention is configured as described above, it has the following effects.

By providing the embossed carrier tape and the cover tape with the hole structure and the protrusion structure, the joining method becomes a fitting method, and the cover tape can be partially peeled off.

Since the cover tape which has been peeled off is not damaged, it can be re-bonded to the embossed carrier tape again.

Further, since the projection structure and the hole structure have a one-to-one correspondence, the positioning at the time of joining becomes easy and the joining conditions become simple.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a semiconductor device housing tape showing an embodiment of the present invention.

FIG. 2 is a top view of a tape for housing a semiconductor device showing an embodiment of the present invention.

FIG. 3 is a top view of the semiconductor device housing tape according to the embodiment of the present invention.

FIG. 4 is a top view of a conventional semiconductor device housing tape.

FIG. 5 is a cross-sectional view of a conventional semiconductor device housing tape.

[Explanation of symbols]

1. ． ． ． Embossed carrier tape 2. ． ． ． Semiconductor device 3. ． ． ． Cover tape 4. ． ． ． Protrusion structure 5. ． ． ． Hole structure 6. ． ． ． Sprocket hall

Claims (5)

[Claims] 1. A semiconductor device housing tape for housing a semiconductor device, wherein the cover tape is provided with a protrusion for joining with an embossed carrier tape. 2. A tape for accommodating a semiconductor device, wherein the hole structure for fitting the protrusion shape according to claim 1 is provided in an embossed carrier tape and is joined and fixed to a cover tape. 3. The tape for storing a semiconductor device according to claim 1 or 2, wherein the protruding structure and the hole structure of the storing tape have a protruding structure on the embossed carrier tape side and a hole structure on the cover tape side. . 4. The tape for storing a semiconductor device according to claim 1, wherein the protrusion structure and the hole structure are symmetrically provided at both ends of the tape width. 5. The tape for storing a semiconductor device according to claim 1, wherein the protrusion structure and the hole structure are provided asymmetrically at both ends of the tape width.