JPH03289457A - Semiconductor part packaging tape - Google Patents

Abstract

PURPOSE:To protect the lead of a semiconductor part from external force by making up a structure consisting of a cover tape having boxes to cover semiconductor parts arranged on a tape at predetermined intervals for protection from external force and a retaining tape to adhesively retain the semiconductor parts. CONSTITUTION:A retaining tape 1 is provided with feed holes 2 formed lengthwise at predetermined intervals, adhesive parts 3 coated with an adhesive agent to adhesively retain packaged semiconductor parts and push holes 4 through which the adhesively retained semiconductor part is pushed from the opposite side of the tape to remove the part therefrom. A cover tape 5 is provided with feed holes 6 matching in the position of those in the retaining tape 1 and embossed boxed 7 located in the position corresponding to the adhesive parts 3. The surface part of a flat pack type semiconductor part 10 opposite from the side of the lead terminal which has previously been bent is adhesively retained to the adhesive part 3 of the retaining tape 1 and the box 7 of the cover tape 5 is then covered from the back side of the semiconductor part 10 to bond together the retaining tape 1 and the cover tape 5 to form a package.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tape for packaging semiconductor components, and more particularly to a tape for packaging semiconductor components for surface mounting.

[Conventional technology]

Conventionally, tapes for packaging semiconductor components are classified into two types: adhesive taping type and embossed carrier type. That is, FIGS. 5(a) to 5(c) are a plan view, a vertical cross-sectional view, and a cross-sectional view, respectively, of a conventional embossed carrier type semiconductor component packaging tape.

In FIGS. 5(a) to 5(C), a tape 2 having a tape feed hole 26 and a box 23 for storing a semiconductor component IO is shown.
1 and a lid tape 24. The tape packaging the semiconductor component 10 in this way is wound around a reel 29 and transported and stored, as shown in the perspective view of FIG. Also, the 6th
Figures (a) to (c) are a plan view, a vertical cross-sectional view, and a cross-sectional view, respectively, of an adhesive taping type semiconductor component packaging tape.
A packaging tape is composed of a main body tape 25 having an adhesive portion 27 and a holding tape 28 coated with an adhesive.

The embossed carrier type semiconductor component packaging tape has a structure in which the semiconductor component 10 is placed in a box 23 and a lid tape 24 is applied, whereas the adhesive taping type semiconductor component packaging tape has adhesive parts placed at certain intervals on the main body tape 25. The semiconductor component 10 is placed on that part and held by adhesive.

[Problem to be solved by the invention]

Among the conventional semiconductor component packaging tapes mentioned above, the embossed carrier type semiconductor component packaging tape simply places the semiconductor component inside the embossed box and closes the lid.
Since the semiconductor components move inside the box during transportation, products with weak lead strength have the disadvantage that the leads may become deformed.

In addition, adhesive taping-type semiconductor component packaging tapes hold semiconductor components by pasting them on the tape, but they have the disadvantage that external force is applied to the leads of semiconductor components when they are wound around a tape reel, causing the leads to easily deform. be.

[Means to solve the problem]

The tape for packaging semiconductor components of the present invention is composed of a cover tape having boxes that cover and protect semiconductor components arranged at regular intervals on the tape from external forces, and a holding tape that adhesively holds the semiconductor components.

〔Example〕

Next, the present invention will be explained by examples.

FIG. 1 is a back view of the holding tape according to the present invention. 1st
In the figure, a holding tape 1 has perforations 2 arranged at regular intervals in the length direction, an adhesive part 3 coated with an adhesive for adhering and holding packaged semiconductor components, and furthermore, a holding tape 1 that has sprocket holes 2 arranged at regular intervals in the length direction, and an adhesive part 3 coated with an adhesive for adhering and holding packaged semiconductor components. , has a punch hole 4 for punching down from the opposite side. FIG. 2(a) shows an embodiment of the present invention,
A plan view showing a packaged state of the flat-pack type semiconductor component, FIG. 2B is a longitudinal sectional view, and FIG.

In these figures, ■ is the holding tape shown in Fig. 1, 5 is the cover tape, with a spout hole 6 at the same position as the holding tape 1, and an embossed box 7 at the position corresponding to the adhesive part 3 in Fig. 1.
has. The flat-pack type semiconductor component 10 has its surface opposite to where the lead terminal is bent in advance adhered and held by the adhesive part 3 of the holding tape l, and then the cover tape 5
The box 7 is placed over the semiconductor component 10 from the back side, and the holding tape 1 and the cover tape 5 are bonded together to perform packaging.

FIG. 3 is a back view of the holding tape according to the second embodiment of the present invention, and compared to the holding tape of the first embodiment shown in FIG. It has an adhesive part 13 to which an adhesive is applied in a band shape along the width direction.

FIG. 4 is a longitudinal sectional view of a packaged semiconductor component according to a second embodiment of the present invention. In FIG. 4, the semiconductor component 10 is adhesively held on the holding tape 11 of FIG. 3, and the box 17 of the cover tape 15 bonded thereto has a size that covers and protects the two semiconductor components together.

In the first practical example shown in FIG. 2, when the arrangement pitch is small for small parts, positional accuracy of the adhesive part 3 is required, and it becomes troublesome to cover each holding part with a box of cover tape. Therefore, in the second embodiment, since the adhesive part 13 is formed in a band shape, the positional accuracy becomes irrelevant, and since a plurality of semiconductor components can be protected together in one box 17, packaging is better than in the first embodiment. This has the advantage of making work easier.

〔Effect of the invention〕

As explained above, in the present invention, in the adhesive taping type semiconductor component packaging tape, the taped semiconductor component is covered with a cover tape provided with an embossed box, so that external force is not applied to the lead of the component. This makes it possible to protect the packaged semiconductor parts, which has a great effect on maintaining the quality of the packaged semiconductor parts.

[Brief explanation of drawings]

FIG. 1 is a back view of the holding tape according to the first embodiment of the present invention, FIG. 2(a) is a plan view showing the first embodiment of the present invention and the packaged semiconductor components, and FIG. Longitudinal cross-sectional view, same figure (c
) is a cross-sectional view, FIG. 3 is a back view of the holding tape according to the second embodiment of the present invention, FIG. 4 is a longitudinal cross-sectional view of the second embodiment of the present invention, and FIG. 5(a) is a conventional A plan view of a semiconductor component packaged with an example of packaging tape, and (b) is a longitudinal cross-sectional view.
6(c) is a cross-sectional view, FIG. 6(a) is a plan view showing a semiconductor component packaged with another conventional packaging tape, and FIG. 6(b) is a longitudinal sectional view. (c) is a cross-sectional view, the seventh
The figure is a perspective view of packaging tape wound on a reel. 1, 11... Holding tape, 2, 6... River/feed hole, 3.13... Adhesive part, 4... Pierce hole, 5, 15... ...Cover tape, 7.17...
...Box, 10...Semiconductor parts, 21
...Tape, 23 ...Box, 24
・・・・・・Lid tape, 25・・・・・・Body tape,
29...Reel.

Claims (1)

[Claims] Adhesive taping-type semiconductor component packaging tape that adheres and holds semiconductor components at regular intervals includes a retaining tape that is continuously coated with adhesive at regular intervals or in a band shape, and a box that covers and protects the individual or multiple semiconductor components being held. A tape for packaging semiconductor parts, comprising a cover tape having: