JPS63248673A - Packaging structure of electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a packaging structure for electronic components that sequentially packages a large number of electronic components.

[Prior Art] For example, when transporting an electronic component such as a push button switch formed in a continuous hoop shape, a spacer 2 is placed over the electronic component 1 as shown in FIG. In the past, the packaging was carried out by being supported by a cardboard box 3 and wrapped around a roll 4.

FIG. 4 shows the details, in which electronic components 1 stacked in multiple stages are wound around a reel 4 with their surfaces covered by spacers 2.

Further, as a conventional method, the one shown in FIGS. 5 and 6 has also been adopted.

That is, a cardboard 5' or the like is used as a base, an electronic component 1' is placed on top of it, a film coated with an adhesive on the underside (hereinafter referred to as SkinTight) is placed over it, and then the SkinTight 7' is heated. By adding this, the electronic components are covered and air is removed from the bottom of the cardboard 5' to package the electronic components in a sealed state.

[Problems to be Solved by the Invention] By the way, in the case of the conventional packaging structure shown in FIGS. 3 and 4, a reel is used, so there is a need to recover the reel after transportation, and the manufacturing cost of the reel itself, etc. Therefore, cost increases are unavoidable.

Also, the reel size is relatively large (for example, 60mm diameter
1) The packaging structure becomes bulky.

Furthermore, since dust prevention measures are insufficient, there are disadvantages such as paper dust from the cardboard boxes adhering to the surface of the electronic component during transportation, and the surface of the electronic component being easily oxidized and sulfided when exposed to the outside air.

In addition, in the case of Figures 5 and 6, the electronic components are placed directly on the cardboard, so paper dust from the cardboard gets inside the electronic components due to friction between the bottom surface of the electronic components and the cardboard during transportation. Dust protection was not necessarily good. Furthermore, since the top surface of the cardboard is flat, some air may remain when removing air.
This method also had the same problem of oxidation and sulfurization of electronic components.The present invention was made in response to the above problems.
The object of the present invention is to provide a packaging structure for electronic components that can be easily sealed.

[Means for Solving the Problems] In order to achieve the above object, the present invention includes a method in which a first sheet is attached to a substrate having an uneven surface, and electronic components are arranged on the first sheet. , the electronic component is covered and sealed with a second sheet.

[Function] With the electronic components placed on the board, the first sheet and the second sheet
By placing it between the sheets, it can be easily sealed, and air can be effectively vented from the corrugated (wavy) side surfaces of the cardboard.

[Embodiment of the Invention] FIGS. 1 and 2 are schematic diagrams and enlarged views showing a packaging structure for electronic components according to an embodiment of the present invention. A skin tight 6 coated with adhesive is provided on the board.

After placing the electronic component 1 on this skin tight 6, the second
The electronic component 1 is covered with skintight 7 and heated to bring it into close contact, and at the same time air is vented in the side direction of the cardboard 5, that is, through the wavy gaps 8.

As a result, the electronic component 1 is completely sealed between the skin tight 6 and the second skin tight 7.

As described above, according to the present invention, it is possible to provide a good packaging structure that does not cause any problems when transporting electronic components.

In this embodiment, a switch element of a push button switch is taken as an example, but the present invention is not limited to this and can be applied to any electronic component formed continuously in a hoop shape.

[Effects of the Invention] According to the packaging structure of the present invention, the following effects can be obtained.

(1) Since an inexpensive substrate such as cardboard is used as the base material, there is no need to collect it, so the cost does not increase.

(2) Since the base material is originally a flat and thin substrate, the packaging structure is not bulky.

(3) Since the electronic components are kept in a completely sealed structure by venting air, there is no possibility of paper dust etc. adhering to them, and there is no risk of oxidation or sulfidation.

[Brief explanation of the drawing]

1 and 2 are schematic diagrams and enlarged views showing a packaging structure for electronic components according to an embodiment of the present invention, FIGS. 3 and 4 are perspective views and sectional views showing a conventional example, and FIGS. 5 and 6 The figures are schematic diagrams and enlarged views showing other conventional examples. 1...Electronic parts, 5...Cardboard, 6.7...Skintight. Figure 1 Figure 2 Figure 3 Figure 4

Claims (1)

[Claims] An electronic component characterized in that a first sheet is attached to a substrate having an uneven surface, an electronic component is placed on the first sheet, and the electronic component is covered and sealed with a second sheet. packaging structure.